Electrodeposition baths

1
coupled plasma sources for sput- ter deposition. ELECTROCOAT COMPOSITION U.S. Patent 6,190,523. Feb. 20, 2001 C.L. Tazzia, assignor to BASF Corp., Southfield, Mich. A method of coating a conductive substrate including electrocoating with a first layer of a first electro- coat coating composition contain- ing a conductive pigment; suffi- ciently drying or curing the first layer to provide a conductive first layer; electrocoating the substrate with a second layer from a second electrocoat coating composition; and fully curing the second layer Handbook for Critical Cleaning Edited by B. Kanegsberg 658 pages $105.00 With all the cleaning approaches available in the industry, how do you choose which one is best for your needs? The best approach is appli- cation specific and often location specific. This book provides the tools you need to select the best approach. The book is rigorous in its treatment of technical issues, broad in scope, and clearly written. Send Orders to: METAL FINISHING Centrifugal Disc /\ Tipton...Combining technology and tradition to meet tomorrow’s finishing standards. Tbpton Tofindoutmore, Call us today. W@ ‘I -800-344-0776 Tipton US Corp. 8411 Seward Rd., Hamilton, OH 45011 Website: www.tiptonus.com E-mail: [email protected] MaLie inthe Y.S.AL Circle 043 on reader card or go to www.thru.to/webconnect and, if necessary, the first layer, wherein at least one of said first electrocoat coating composition and said second electrocoat coat- ing composition comprises, in an aqueous medium, an anionic ad- dition polymer latex and a water- insoluble crosslinking resin dis- persed with an anionic dispersing resin. ELECTRODEPOSITABLE COATING COMPOSITION U.S. Patent 6,190,524. Feb. 20, 2001 R.O.Kollah et al., assignors to PPG Industries Ohio Inc., Cleveland A method of electrocoating an electroconductive substrate wherein the electrodepositable composition comprises an active hydrogen-containing, cationic salt group-containing resin electrode- positable on a cathode; a capped polyisocyanate curing agent; and a catalyst composition comprising a reaction product of a bismuth compound; and a heterocyclic compounding having mercapto functionality. ELECTRODEPOSITION BATHS U.S. Patent 6,190,525. Feb. 20, 2001 R.F. Karabin et al., assignors to PPG Zndustries Ohio Znc., Cleveland An aqueous electrocoating compo- sition comprising an active hydro- gen group-containing ionic elec- trodepositable resin and a curing agent wherein the improvement comprises an electrodeposition bath containing at least one solu- ble yttrium compound present in an amount of 10 to 10,000 parts per million. GOLD PLATING PROCESS U.S. Patent 6,190,529. Feb. 20, 2001 Y-S. Wu et al., assignors to Advanced Semiconductor Engineering Inc., Kaohsiung, Taiwan A method for plating gold to bond leads on a semiconductor sub- strate. 60 Metal Finishing

Transcript of Electrodeposition baths

coupled plasma sources for sput- ter deposition.

ELECTROCOAT COMPOSITION

U.S. Patent 6,190,523. Feb. 20, 2001 C.L. Tazzia, assignor to BASF Corp., Southfield, Mich.

A method of coating a conductive substrate including electrocoating

with a first layer of a first electro- coat coating composition contain- ing a conductive pigment; suffi- ciently drying or curing the first layer to provide a conductive first layer; electrocoating the substrate with a second layer from a second electrocoat coating composition; and fully curing the second layer

Handbook for Critical Cleaning Edited by B. Kanegsberg

658 pages $105.00

With all the cleaning approaches available in the industry, how do you

choose which one is best for your needs? The best approach is appli-

cation specific and often location specific. This book provides the

tools you need to select the best approach. The book is rigorous in its

treatment of technical issues, broad in scope, and clearly written.

Send Orders to:

METAL FINISHING

Centrifugal Disc

/\

Tipton...Combining technology and tradition to meet tomorrow’s finishing standards.

Tbpton Tofindoutmore, Call us today.

W@

‘I -800-344-0776 Tipton US Corp.

8411 Seward Rd., Hamilton, OH 45011 Website: www.tiptonus.com E-mail: [email protected]

MaLie in the Y.S.AL

Circle 043 on reader card or go to www.thru.to/webconnect

and, if necessary, the first layer, wherein at least one of said first electrocoat coating composition and said second electrocoat coat- ing composition comprises, in an aqueous medium, an anionic ad- dition polymer latex and a water- insoluble crosslinking resin dis- persed with an anionic dispersing resin.

ELECTRODEPOSITABLE COATING

COMPOSITION

U.S. Patent 6,190,524. Feb. 20, 2001 R.O.Kollah et al., assignors to PPG Industries Ohio Inc., Cleveland

A method of electrocoating an electroconductive substrate wherein the electrodepositable composition comprises an active hydrogen-containing, cationic salt group-containing resin electrode- positable on a cathode; a capped polyisocyanate curing agent; and a catalyst composition comprising a reaction product of a bismuth compound; and a heterocyclic compounding having mercapto functionality.

ELECTRODEPOSITION BATHS

U.S. Patent 6,190,525. Feb. 20, 2001 R.F. Karabin et al., assignors to PPG Zndustries Ohio Znc., Cleveland

An aqueous electrocoating compo- sition comprising an active hydro- gen group-containing ionic elec- trodepositable resin and a curing agent wherein the improvement comprises an electrodeposition bath containing at least one solu- ble yttrium compound present in an amount of 10 to 10,000 parts per million.

GOLD PLATING PROCESS

U.S. Patent 6,190,529. Feb. 20, 2001 Y-S. Wu et al., assignors to Advanced Semiconductor Engineering Inc., Kaohsiung, Taiwan

A method for plating gold to bond leads on a semiconductor sub- strate.

60 Metal Finishing