Electrodeposition baths
Transcript of Electrodeposition baths
coupled plasma sources for sput- ter deposition.
ELECTROCOAT COMPOSITION
U.S. Patent 6,190,523. Feb. 20, 2001 C.L. Tazzia, assignor to BASF Corp., Southfield, Mich.
A method of coating a conductive substrate including electrocoating
with a first layer of a first electro- coat coating composition contain- ing a conductive pigment; suffi- ciently drying or curing the first layer to provide a conductive first layer; electrocoating the substrate with a second layer from a second electrocoat coating composition; and fully curing the second layer
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and, if necessary, the first layer, wherein at least one of said first electrocoat coating composition and said second electrocoat coat- ing composition comprises, in an aqueous medium, an anionic ad- dition polymer latex and a water- insoluble crosslinking resin dis- persed with an anionic dispersing resin.
ELECTRODEPOSITABLE COATING
COMPOSITION
U.S. Patent 6,190,524. Feb. 20, 2001 R.O.Kollah et al., assignors to PPG Industries Ohio Inc., Cleveland
A method of electrocoating an electroconductive substrate wherein the electrodepositable composition comprises an active hydrogen-containing, cationic salt group-containing resin electrode- positable on a cathode; a capped polyisocyanate curing agent; and a catalyst composition comprising a reaction product of a bismuth compound; and a heterocyclic compounding having mercapto functionality.
ELECTRODEPOSITION BATHS
U.S. Patent 6,190,525. Feb. 20, 2001 R.F. Karabin et al., assignors to PPG Zndustries Ohio Znc., Cleveland
An aqueous electrocoating compo- sition comprising an active hydro- gen group-containing ionic elec- trodepositable resin and a curing agent wherein the improvement comprises an electrodeposition bath containing at least one solu- ble yttrium compound present in an amount of 10 to 10,000 parts per million.
GOLD PLATING PROCESS
U.S. Patent 6,190,529. Feb. 20, 2001 Y-S. Wu et al., assignors to Advanced Semiconductor Engineering Inc., Kaohsiung, Taiwan
A method for plating gold to bond leads on a semiconductor sub- strate.
60 Metal Finishing