ELECTRO THERMAL SIMULATIONS OF THE SHUNTED 13KA LHC INTERCONNECTIONS Daniel Molnar, Arjan Verweij...
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Transcript of ELECTRO THERMAL SIMULATIONS OF THE SHUNTED 13KA LHC INTERCONNECTIONS Daniel Molnar, Arjan Verweij...
ELECTRO THERMAL SIMULATIONS OF THE SHUNTED 13KA LHC INTERCONNECTIONS
Daniel Molnar, Arjan Verweij and Erwin Bielert
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Contents
Daniel Molnar
Introduction Interconnections and their repair Physical description
Materials Modeling with Comsol 4.1 Comparisons to other codes, validations Shunted lines Design optimizations for the shunts
Shunt concepts Other investigations Conclusions Acknowledgements
3
The LHC interconnections
Daniel Molnar
In case of a quench they should ensure the safe operation i.e. carrying the current
In the main ring there are some 10.000(!) connection btw. the dipole and quadrupole magnets
If the protection systems detect a quench ,the circuit is opened and the current is decaying with a time constant Tau , 100 sec for dipoles and 30 sec for quadrupole
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Motivation
Daniel Molnar
The motivation is to insure the safe operation of the LHC machine at the nominal beam energy of 7TeV
The 2008 incident has shown that present splices mean a significant danger, and not capable to secure the long term operation at higher current levels Thus they need to be repaired and protected
A shunt will be added to all of them, which has to carry the current even in worst case (adiabatic) conditions
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The ideal\designed interconnects
Daniel Molnar
Different Cu stabilizer
pieces
Cross section of a well soldered
cable
Side view of a perfectly soldered joint
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And the reality…..
Daniel Molnar
A vast number of defects and lack of soldering
X-ray Schematics
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Physical description
The first and main physical phenomena which describes such a runaway is the Joule
heating , later other physical problems coupled with it (magneto-resistivity)
Daniel Molnar
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Boundary conditions and initial values
Daniel Molnar
Most of the following results with the assumption of adiabatic thermal boundaries(worst case)
Electrical boundary conditions: On one side J current density constraint, the other is V=0
Initial conditions: V(t=0)=0 and in most cases T(t=0)=10K, so we have already quenched the cable
Pessimism is the most important factor !
bus= 𝐼0𝐴∗exp൬−𝑡𝜏൰ −𝑛ሬԦ⋅ 𝐽Ԧ= 𝐽0 ∗exp൬−𝑡𝜏൰ V= 0
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Material properties
Daniel Molnar
-Magneto resistivity is included in the models, simply adding a constant to
the Copper’s electrical resistivity (Self Field Factor)
-The superconducting cable consists Nb-Ti and Copper,
with the ratio of1:1.95
-0 resistivity could not be implemented in numerical calculations (in Comsol), so instead 10^-14 Ohm*m is
used
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Modeling
Daniel Molnar
3D model of the problem Linear shape function for the finite elements, significant save
of time Mesh elements number: for shunted 12236, non shunted
11950 Mesh size: 0.3-0.5mm in the defects(and shunt), 10 mm for
the BUS Linear interpolation for the material properties i.e. between
two known points it uses constant value, not significant simplification
The non linear solver uses a Newtonian algorithm, relative tolerance is 0.02
CPU time is typically 2000 sec, but for instance the He cooling case and quench etc. took 12000 sec
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Modeling II.
Instead of the actual shape rectangular was used with same cross section , to be able to use rectangular mesh
Symmetries introduced when it’s possible to speed up calculations Time step: 1msec
Daniel Molnar
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Comparisons, validations
The simulations carried out with Comsol, have been compared to another code QP3
Good agreement between the two results (and between measurements), within a 4-5 % difference
The difference is intrinsic to the fact that QP3 is a 1D model, while in Comsol 3D was implemented
Again we have to point out , both measurements and codes (QP3 and Comsol) show that the runaway is very fast, and in some cases non-protectable !
Daniel Molnar
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Non shunted studies
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RQ/RB non shunted
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Non shunted run-away(cause of 2008 incident)
Daniel Molnar
A runaway of a joint, notice the sharp and very fast change in the temperature
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The shunted bus bars
The main shunt itself is the same for both quadrupole and dipole circuits
Dipole lines can have 4 shunts/ joints, for the quads just below ones
The solder is SnPb, avg. thickness 100 mm In the calculations the RRR is 200 (pessimistic)
Daniel Molnar
Main shunt dimensions, top/bottom and side
view
The main shunt soldered to the BUS
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Description of symmetric shunt defects
50 mm
15 mm
Holes Up shunt
Below shunt
BUSwedgeU-profile
BUS
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Non stabilized
cable
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Safe operating currents for Dipole lines
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Safe operating currents for the Quadrupole lines
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Shunt designs
Naturally questions come up: do we have bigger margin for longer shunt? Or could a smaller reservoir hole for solder mean higher safety?
There are other view points than electro-thermal, such as quality control, accessibility, mechanical studies and solder quality
Daniel Molnar
Length of Shunt[mm]
Curr
en
t densi
ty y
co
mponent[
A/m
^2]
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RB shunt with smaller holes
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RQ shunt with smaller holes
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Additional shunts for quadrupole bus bars(side shunts)
The quad buses have no possibilities for a top shunt(at least idem as below shunt )
There are two designs for side shunts
Again there are other view points than electro-thermal
Daniel Molnar
Type_a, “bridge”
Type_b
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RQ Side-shunt type_a, dimensions and results
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zl zm
zr
x
8mm
-Summary of different designs for the “bridge” side shunt-The original design is not safe
The depth is not varied
Daniel Molnar
Electrically redesigned versions
Courtesy of P. Fessia
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RQ sideshunt type_b dimensions and results
xz=zb+zj
y
zb
15
zj
x
-Summary of different designs for the “simple” side shunt-The original design is not safe
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Time constant of the circuit
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Magneto-resistivity
In all calculations shown before the magnetic effect is included, a constant is added to the resistivity of the Copper –Self Field Factor
One can ask what about the shunt? The current density is higher so is the magnetic field
Nice modeling problem, but practically not so significant
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Conclusions
The present shunt design could guarantee the safe long term operation of the LHC at 7TeV (13kA or more) for dipole and quadrupole lines as well
The side shunts for the quadrupoles do not mean full redundancy, although with major changes they could be safe
The safe current also strongly depends on the defect of the BUS
Also other calculations are ongoing, such as cooling to He, to investigate the margins in this case
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Acknowledgements
Many thanks to Arjan Verweij and to Erwin Bielert
Daniel Molnar
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Thanks
Daniel Molnar
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Backups
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Modeling in 1D and 3D
Qp3:1D
The green arrows are the current density vectors
Comsol 4.1:3D
In this case there’s a real redistribution
Daniel Molnar
defect defect
34RQ shunts summary
35
RB up shunt
-Note that the two reservoir holes are always considered to be AIR, with rectangular shape-The defect of SnPb solder is indicated by green lines, different lengths of it-also non perfect contact betweenwedge and U-profile
Top view for up-shunt 15
WedgeU-profile
36
RQ/RB below shunt
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Bottom view below shunt
-The shunt is the same as for the up one-The defect of SnPb solder is indicated by green lines, different lengths of it-Also the defect is symmetric with respect to the connection of Bus and U profile
37
QP3 Comsol difference; shunt RRR 150
For RQ shunted calculations(0=0.5)
For RB shunted calculations (0=0.5)
QP3 the shunt’s RRR=150
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QP3 and Comsol 4.1 example
Daniel Molnar
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Modeling considerations: geometry
RB (half)
RQ(full)
RQ(half)
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Extreme case: full length non stabilized cable
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Extreme case II) full length NSC,non symmetric SnPb defect
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And a more Extreme:No Cu in the defect for RQ below shunt
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The effect of the SnPb thickness
The “standard” is 100 mm but , also the effect of a thicker SnPb layer under (or above) the shunt has been investigated
For an RB below shunt with 8mm of GAP in the SnPb -100 mm thickness:16200 A
-300 mm thickness:15900 A
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Defect look-a-like
45
Magnetic models, mesh quality
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Different Time constants-same current
The safe current for Tau 30 sec:16kA(also a bd case)
47Modeled RQ side shunts
48
An example of usage beyond Comsol Resistance as a function of time; It could
carry14kA without reaching 300 K, shunted version, no void in SnPb