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    ElectroFlo Providing Solutions for Electronics

    Heat Removal

    Provides a noninvasive viewinside the electronics boxes

    A critical tool to help electronic designers solve the heat problem

    Manydifferentiating andunique features

    Usedgloballywith customers in US, South America, Europe andAsia

    Easy to use andfull-featured

    The new release of the software is redesigned based on manyyears of experience in aircraft and automotive industries

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    ElectroFlo: Time Saving Benefits

    As the level of model complexity increases the power and efficiency of

    ElectroFlo becomes more apparent

    ModelManagement Center Using List/Tree View

    Display entire/part of model; sort by any attribute or use color-coding

    Select solids/boundary conditions by

    Mouse clicking/dragging on List-view

    Advanced search on name, power material or any other properties

    Make changes in many solids or faces of solids in a single step

    Multi-SystemModeling

    Combine existing models of components, boards and electronic boxes

    N

    ever need to build the same model more than once

    Automated Expert Reports

    Select report format prior to simulation.

    Color-coded charts using red, yellow and green system

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    Define Geometry

    Import solids directly from CADand other formats Automatically filter unwanted and irrelevant geometry

    Create the ThermalModel

    Mesh, define loads, boundary condition and ambient environment

    Wizard mode guides new users in a step-by-step approach

    Advanced GUI mode provides the most efficient modeling environment

    Hierarchy structure (models/assemblies/parts/solids) keeps models concise

    Check for Errors

    Automated error-checking tools ensures proper model set-up

    Flags the user when general guideline are not followed

    Perform Simulation

    Choose simulation type (transient/steady)

    Choose report/post-processing preferences

    ElectroFlo: Ease-of-Use Benefits

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    ElectroFlo: Advanced Solver

    ElectroFlos advanced solver provides the analyst all the tools and features

    necessary for accurate and efficient analysis

    Coupled Electrical Solver

    Automatically accounts for heat losses in electrical conductors

    Electrical resistivity updates as conductor temperature changes

    Integrated Thermal/Flow Network Solvers

    Define internal details without increasing the core model size

    Best approach for liquid cooling channels and compact heat-exchanger and cold-plates

    Thermal/Electrical Via and lead tools

    Thermal connection with specified conductor area and material

    Connect to desired board layers and optionally bypass other layers

    Patented Radiation Solver

    Automatically include radiation surfaces

    No user intervention necessary

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    Geometry

    Components, traces and other conductorsfrom sources in various formats.

    Heat Generation

    Two main contributors:

    Component losses Joulian dissipation due to current flow in

    traces and connectors

    Conjugate internal heat transfer Conduction

    Internal natural convection (using CFD)

    Internal thermal radiation

    Cooling to ambient Ambient natural convection and radiation

    Bussed Electrical Center (BEC)

    Example: Coupled Thermal/Electrical/CFD

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    A significant portion of the heat generated in the system is theJoulian heat due to electrical current flow in various traces andstamp metal conductors.

    Red : Main Circuit

    Gray: Secondary Circuits

    Electrical Conduction Regions

    116 amps in

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    Trace and conductor geometryimported and simplified from CAD to

    EFlo using an automated procedure.

    A preprocessing tool, examines allelements and, using element electrical

    resistivity and electrical links, identifiesindividual conduction regions (circuits).

    The circuits are then displayed indifferent colors.

    Extensive tools are available for the

    user to examine various circuits andcheck for continuity and properamperage.

    Electrical Conduction Regions

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    The following types of boundary conditions are used to tie the model toits environment:

    Convection and Radiation to ambient

    Electrical boundary conditions (voltage and current BCs for Battery and

    connectors)

    Cable heat sinking

    Walls: Convection and Radiation

    Battery Cable

    Voltage & Conduction BCs

    Cables: Current & Conduction BCs

    Boundary Conditions

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    Results Temperature Distribution

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    Results: Conductor Temperature