Efficient Testing Solutions - AIMCAL · 2019-05-27 · SURAGUS GmbH | Efficient Testing Solutions |...
Transcript of Efficient Testing Solutions - AIMCAL · 2019-05-27 · SURAGUS GmbH | Efficient Testing Solutions |...
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Efficient Testing SolutionsThin Film Characterization | Carbon Fiber Testing | Metal Testing
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Challenges in the inline chara-cterization of conductive thin films
May 28 - 30, Daejeon, South Korea
R2R Asia Conference
Roll to Roll Web Coating and Finishing
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Agenda
1. Company overview of SURAGUS and ELIM GLOBAL
2. Relevance, applications and materials used for conductive films
3. Challenges for conductive film manufacturing
4. Inline testing of conductive films
5. Non-contact eddy current technology
6. Challenges for metrology for conductive materials
7. Considerations for good measurement setups
8. Take home messages
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SURAGUS GmbH is a German Metrology Specialist
Eddy current-based testing solutions (SURAGUS)
SURface ArGUS = Surface guard (100 eyes on surfaces and thin films)
Integrator of other optical metrology (OEM)
R&D and manufacturing in Germany (Dresden)
EddyCus systems are present on six continents
World wide service and sales network
Quality assurance systems for thin-films
Technology
Location and Presence
Applications
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Conductive Coatings can be Found in Various Applications
Relevance of Electrical Properties
Direct electrical function
Touch panel sensor (TPS), display and flat monitors
Solar, semiconductor industry
LED/OLED lightning, batteries, medical sensors
Smart glass, deicing and heating applications
Indirect properties for other functions
Packaging foil (barrier)
Architectural glass industry (emissivity)
Mirrors (reflectance)
Medical (antibacterial)
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Conductive Coatings are Realized with Various Materials
Typical Materials
Transparent Films
TCO (ITO, FTO, AZO, ZnO, SnO2)
Metal nano-wires
CNT (carbon nanotubes)
Graphene films
Nano particle films
Metallic Films
Copper
Aluminum
Molybdenum
Zinc
Silver
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Conductive Coatings are Applied for Various Reasons
Often Many Characteristics Matter
Physical Characteristics
Electrical
Mechanical
Chemical
Optical
Geometrical /Surface
Soft characteristics
Stable over time
Financial Characteristics
Cost per performance
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Transparent Conductive Materials have Complex Requirements
Requirements/ trends
Low cost
Low sheet resistance
High transparency
Beneficial/ further characteristics
Ability for flexible substrates
Low aging effects
Homogeny characteristics
Costs
Transparent Conductive Materials
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Various Material Types Offer Different Potentials for Cost to Sheet Resistance Ratios
Trends for Cost Improvement
Cheaper materials / material combinations
Cheaper processes
Larger substrate sizes / gapless production/R2R
Higher throughput due to higher deposition/growth rate
Optimized material / target usage
CostsSheet
Resistance
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Transparency and Sheet Resistance are Competing Properties
Trends For Sheet Resistance Improvement
Material variation / combined layer stacks
Additional layer treatment
Doping
Annealing/ Tempering
Smart layout
Optical Transparency
Sheet Resistance
Source: SVC 2017, FEP
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Anisotropy Needs to be Considered For Anisotropic Films
Anisotropy of Wire-Based Films
Wire and mesh structures can have an anisotropic sheet resistance
Fast deposition processes tend to cause high anisotropy
Electrical anisotropy affects the function of the device
Anisotropy is mostly considered as a disadvantage as it is difficult to control
Anisotropy can be also used for achieving even better sheet resistance to anisotropy rations
Anisotropy can be optimized according to the layout of the contact pattern
Benchmarking Transparent Conductive Film Technologies
Source: IDTECHEX Berlin, 2018
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Smart Layouts For Wire-based Films can Boost Sheet Resistance to Transparency Ratio
Anisotropic Wire Film Isotropic Wire Film
Anisotropic Wire Film vs. Isotropic Wire Film
Anisotropy can be optimized according to the layout of the contact pattern
Anisotropy can save material and improve optical transparency
Anisotropy can be measured in non-contact mode by EddyCus TF inline anisotropy sensor
More of the conductive (and intransparent) material is required in order to sufficiently supply this structure with current
Enhanced sheet resistance
con
tact
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Various Metrology can be Applied on TCMs
Testing Technologies
Main quality parameters
Transparency (+ Haze)
Sheet resistance
Common methods in general
Optical (spectrometric) testing (reflectance, transmittance, haze)
4PP / Eddy Current, Van der Pauw / Hall effect
TEM and SEM, high magnification optical microscopes,
Raman, Ellipsometry and Others
Mostly relevant methods
Spectrometer
4PP or Eddy Current
Optical Transparency
Sheet Resistance
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Commonly Applied Electrical Metrology for TCMs are 4PP and EC
4-point-probe testing Non-contact eddy current testing by EddyCus®
Comparison of Electrical Testing Methods
Contact / Contact quality influences measurement
Single point and mapping solutions
Possible damage to sensitive layers
Single point sheet resistance testing only
Wearing of probe with time
No measurement of encapsulated films
Non-contact & real-time, no wearing
High accuracy without influence of contact resistance
No harm or artefacts to sensitive films
High resolution mapping, inline measurement for process control
Encapsulated films & multilayer systems
Best usage for touch-sensitive layers
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Non-contact Eddy Current Testing provides significant better repeatability
Comparison of Standard Deviation
Demonstration of metal films with optimal surface for 4PP (on PET)
Non-contact EC measurement results in better repeatability
High sampling rate of Eddy Current enables to average many measurements in same time
Results on wired forms or difficult to contact films are even more difficult for 4PP
Sample Number
4PP-measurement Eddy Current
Mean [ohm/sq]
Standard deviation [ohm/sq]
Min [ohm/sq]
Max [ohm/sq]
Mean [ohm/sq]
Standard deviation [ohm/sq]
Min [ohm/sq]
Max [ohm/sq]
1 0.496 0.052 0.467 0.64 0.485 0.0002 0.4842 0.4847
2 1.120 0.022 1.079 1.16 1.120 0.0001 1.1203 1.1206
3 1.759 0.032 1.720 1.81 1.772 0.0002 1.7715 1.7721
4 4.430 0.100 4.300 4.61 4.425 0.0006 4.4244 4.4263
5 11.840 0.200 11.350 12.09 11.622 0.0102 11.6055 11.6421
6 30.400 0.500 29.800 31.30 30.498 0.0241 30.4544 30.5360
7 82.500 0.700 81.500 83.40 81.359 0.1145 81.2294 81.4972
The correlation of the results is shown in the below image.
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SURAGUS Eddy Current Technology is Fast and Non-contact
How Eddy Current Works
A primary magnetic field is created when alternating current is injected into an induction coil
Eddy Currents are generated when the coil is placed over a conductive sample
The characteristics of the Eddy Currents are determined by material characteristics
The Eddy Currents generate a secondary magnetic field opposed towards the primary field
The impedance of the coil is affected by material differences that influence conductivity
This influence is measured by a pick up coil
+ High sample rate+ High sensitivity+ Non-contact solutions Limited to conductive
materials
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Non-contact Monitoring Along Several Processes in a Wide Measurement Ranges
Capabilities of eddy current monitoring
Metal layer thickness measurement from 2 nm – 2 mm
Sheet resistivity measurement from 0.1 mOhm/sq to 3,000 Ohm/sq
Imaging solution mapping
Defectoscopy
Process monitoring
Deposition (PVD, CVD, Printing... )
Doping
Annealing/tempering
Others (etching, drying polishing, etc.)
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Eddy Current Imaging Solutions Support Identifying Minor Variations and Defects
Area Analysis
Sheet resistance imaging [ohm/sq] on 300 x 300 mm
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Near Edge Characterization Methods Enable Higher Yields in
Metallization Thickness Measurement with Near Edge Characterization
8 Si-wafer with Al coating
Measurement pitch 250µm x 250 µm
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Sub-Nanometer Resolution Shows Minor Thickness Variations
Metallization Thickness Measurement with Near Edge Characterization
Focusing analysing scale provides layer thickness profile with sub nanometer resolution
Defect in 10 o'clock position becomes also visible
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Sheet Resistance Imaging Often Shows Otherwise Undetectable Defects
Sheet Resistance Imaging
Nanowires on PET with 100 x 100 mm [4 inch]
Measurement pitch 1 mm x 1mm
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Anisotropy Imaging Shows Electrical Performance in all Directions
Anisotropy Imaging
Nanowire film on 200 x 200 mm, measurement pitch 1 mm x 1mm
Possibly spraying process from upper right corner
Anisotropy strength (blue=low anisotropy, red=high) Line direction = Anisotropy direction
Line length = anisotropy strength
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Four Testing Setups are commonly applied for TCMs in R&D and Manufacturing
Portable Testing Single point measurement Imaging solutions Inline / Tool integrated
Metallization on wafer
2.35 1.73 1.84 1.89 1.79 2.01 3.48
1.68 1.13 1.20 1.23 1.17 1.19 1.95
1.62 1.14 1.21 1.25 1.15 1.16 1.94
1.65 1.17 1.26 1.35 1.20 1.21 1.94
1.71 1.14 1.21 1.24 1.16 1.19 1.99
1.76 1.14 1.19 1.20 1.15 1.22 2.14
4.20 2.01 2.13 2.00 1.96 2.34 4.24
General Testing Types For Metrology
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Inline Systems Monitor Vast Areas of Material During Lifetime
Benefits of Inline Testing
Documented product quality for internal and external stakeholders
Metrology provides input for process control allowing:
Higher quality
Faster known reaching of desired coating characterizes after process start
Optimized material usage
Balancing throughput along the desired coating specifications
Prevent scrap
Prevents adding further processes / costs if coating was out of spec
Incoming goods inspection for TMCs creates awareness by suppliers often leading to improved quality supply
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Customized Inline Sensor Configurations Deliver Process Information Across Layers
Travelling integrated sensor setup Fixed sensor inline stacking setup
General Setups for Inline Testing
Zigzack testing pattern, information focus on cross substrate direction
Reliable detection of line defects
Requires maintenance due to moving parts and safety measure
Information in machine direction and traverse direction
Scalable concept with high information density
Static sensors do not require maintenance effort for moving traverse
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Challenges for Inline Metrology are Minimized by a Considered Integration
Considerations for Successful Metrology Implementation
Substrate movement
Selecting a measurement system position within the machine with low substrate movement
Space
Fitting sensors and measurement bridge into the right areas, considering cord routing and available space
Speed
Matching position on material and measurement values
Measurement on useful position
Data and Interface
Data can be use for live view, for documentation and (automated) process control
Information depth can be different for live view, documentation and process control
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Selecting a Measurement System Position with Low Substrate Movement
Tension Variation, Splices and Fluttering in R2R applications
Installation of sensors in high tension zone is preferred
Installation in-between two nearby roller or alternatively close to one roller
Fluttering, tension variations during roll change and splices need to be considered with designing the gap (5 – 80 mm)
Sensor vibrations need to be avoided, web vibration can be tolerated but should be still minizied
Considerations for defining distance for top and bottom sensor elements (“gap”)
Larger gaps can tolerate larger variations in coating position
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Space – Measurement Bridge Design Suiting Machine Layout
Customized Measurement Bridges Enable Integration Into Small and Complex Areas
Connection of bridge to mounting points of the machine
Enabling in changing sensor position or during installation
Customized frame per available space and other requirements
Extruded Aluminum frames for flexible mounting vs steel frame and combined frames
A B C D
E
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Hardware – Sensor Description
Space – Sensor Layout for Effective Sensor Mounting and Wiring
Sensor selection (M and S)
Cord exit side selection (side or top)
Mounting type selection (direct or indirect)
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Considerations for Data Quantity and Interfaces
Data Quantity For Live View, Documentation and Process Control
Data Quantity
Reasonable information depth can be different for live view, documentation and process control
5 Vs of big data (for high number of tools, process and monitoring data) volume, velocity, variety, veracity, value
Data architecture
Storage system: DAQ, MES, metrology tool SQL, other tools, raid options
Storage procedure: how long, which data; statistics of roll versus entire data
Interfaces
Connection to machine creates highest benefit
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Merging Measurement Position and Measurement Value
Triggered Measurement Mode Automated Push Measurement Mode
Precise High Speed Measurement
System measures continuously and provides measurements in presence of a conductive film
System automatically takes a self-reference when no conductive material is present
Timestamps or merging with other event incoming data matrix code or other references
System measures on a trigger event
Take one measurement / Take measurements for a certain time / Take measurements from the past etc.
System automatically takes a self-reference when no conductive material is present
Typically, a triggered solution provides a better match between measurement position and measurement value. This is especially valuable for small and fast moving coatings.
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Application Side Metrology Side
Challenges for TCMs
Sheet resistance vs transparency vs costs
Long-term stability of properties
Materials
TCOs, metal films, Nanowire films, CNT, PDOT:PSS, etc.
Processes
Deposition, doping, annealing, aging
Electrical testing solution enable the measurement of
Sheet resistance, metal thickness, emissivity, defect monitoring, anisotropy
Advantages for Eddy Current Testing
Non-contact, large measurement range, high sample rates,
Challenges, Considerations and Solutions
Substrate movement, space, speed, data management
Take home messages
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Thank You!You are welcome to contact us for any questions.
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