Efficient Testing Solutions - AIMCAL · 2019-05-27 · SURAGUS GmbH | Efficient Testing Solutions |...

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www.suragus.com 25.05.2 019 1 Efficient Testing Solutions Thin Film Characterization | Carbon Fiber Testing | Metal Testing

Transcript of Efficient Testing Solutions - AIMCAL · 2019-05-27 · SURAGUS GmbH | Efficient Testing Solutions |...

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Efficient Testing SolutionsThin Film Characterization | Carbon Fiber Testing | Metal Testing

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Challenges in the inline chara-cterization of conductive thin films

May 28 - 30, Daejeon, South Korea

R2R Asia Conference

Roll to Roll Web Coating and Finishing

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Agenda

1. Company overview of SURAGUS and ELIM GLOBAL

2. Relevance, applications and materials used for conductive films

3. Challenges for conductive film manufacturing

4. Inline testing of conductive films

5. Non-contact eddy current technology

6. Challenges for metrology for conductive materials

7. Considerations for good measurement setups

8. Take home messages

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SURAGUS GmbH is a German Metrology Specialist

Eddy current-based testing solutions (SURAGUS)

SURface ArGUS = Surface guard (100 eyes on surfaces and thin films)

Integrator of other optical metrology (OEM)

R&D and manufacturing in Germany (Dresden)

EddyCus systems are present on six continents

World wide service and sales network

Quality assurance systems for thin-films

Technology

Location and Presence

Applications

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Conductive Coatings can be Found in Various Applications

Relevance of Electrical Properties

Direct electrical function

Touch panel sensor (TPS), display and flat monitors

Solar, semiconductor industry

LED/OLED lightning, batteries, medical sensors

Smart glass, deicing and heating applications

Indirect properties for other functions

Packaging foil (barrier)

Architectural glass industry (emissivity)

Mirrors (reflectance)

Medical (antibacterial)

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Conductive Coatings are Realized with Various Materials

Typical Materials

Transparent Films

TCO (ITO, FTO, AZO, ZnO, SnO2)

Metal nano-wires

CNT (carbon nanotubes)

Graphene films

Nano particle films

Metallic Films

Copper

Aluminum

Molybdenum

Zinc

Silver

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Conductive Coatings are Applied for Various Reasons

Often Many Characteristics Matter

Physical Characteristics

Electrical

Mechanical

Chemical

Optical

Geometrical /Surface

Soft characteristics

Stable over time

Financial Characteristics

Cost per performance

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Transparent Conductive Materials have Complex Requirements

Requirements/ trends

Low cost

Low sheet resistance

High transparency

Beneficial/ further characteristics

Ability for flexible substrates

Low aging effects

Homogeny characteristics

Costs

Transparent Conductive Materials

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Various Material Types Offer Different Potentials for Cost to Sheet Resistance Ratios

Trends for Cost Improvement

Cheaper materials / material combinations

Cheaper processes

Larger substrate sizes / gapless production/R2R

Higher throughput due to higher deposition/growth rate

Optimized material / target usage

CostsSheet

Resistance

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Transparency and Sheet Resistance are Competing Properties

Trends For Sheet Resistance Improvement

Material variation / combined layer stacks

Additional layer treatment

Doping

Annealing/ Tempering

Smart layout

Optical Transparency

Sheet Resistance

Source: SVC 2017, FEP

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Anisotropy Needs to be Considered For Anisotropic Films

Anisotropy of Wire-Based Films

Wire and mesh structures can have an anisotropic sheet resistance

Fast deposition processes tend to cause high anisotropy

Electrical anisotropy affects the function of the device

Anisotropy is mostly considered as a disadvantage as it is difficult to control

Anisotropy can be also used for achieving even better sheet resistance to anisotropy rations

Anisotropy can be optimized according to the layout of the contact pattern

Benchmarking Transparent Conductive Film Technologies

Source: IDTECHEX Berlin, 2018

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Smart Layouts For Wire-based Films can Boost Sheet Resistance to Transparency Ratio

Anisotropic Wire Film Isotropic Wire Film

Anisotropic Wire Film vs. Isotropic Wire Film

Anisotropy can be optimized according to the layout of the contact pattern

Anisotropy can save material and improve optical transparency

Anisotropy can be measured in non-contact mode by EddyCus TF inline anisotropy sensor

More of the conductive (and intransparent) material is required in order to sufficiently supply this structure with current

Enhanced sheet resistance

con

tact

con

tact

con

tact

con

tact

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Various Metrology can be Applied on TCMs

Testing Technologies

Main quality parameters

Transparency (+ Haze)

Sheet resistance

Common methods in general

Optical (spectrometric) testing (reflectance, transmittance, haze)

4PP / Eddy Current, Van der Pauw / Hall effect

TEM and SEM, high magnification optical microscopes,

Raman, Ellipsometry and Others

Mostly relevant methods

Spectrometer

4PP or Eddy Current

Optical Transparency

Sheet Resistance

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Commonly Applied Electrical Metrology for TCMs are 4PP and EC

4-point-probe testing Non-contact eddy current testing by EddyCus®

Comparison of Electrical Testing Methods

Contact / Contact quality influences measurement

Single point and mapping solutions

Possible damage to sensitive layers

Single point sheet resistance testing only

Wearing of probe with time

No measurement of encapsulated films

Non-contact & real-time, no wearing

High accuracy without influence of contact resistance

No harm or artefacts to sensitive films

High resolution mapping, inline measurement for process control

Encapsulated films & multilayer systems

Best usage for touch-sensitive layers

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Non-contact Eddy Current Testing provides significant better repeatability

Comparison of Standard Deviation

Demonstration of metal films with optimal surface for 4PP (on PET)

Non-contact EC measurement results in better repeatability

High sampling rate of Eddy Current enables to average many measurements in same time

Results on wired forms or difficult to contact films are even more difficult for 4PP

Sample Number

4PP-measurement Eddy Current

Mean [ohm/sq]

Standard deviation [ohm/sq]

Min [ohm/sq]

Max [ohm/sq]

Mean [ohm/sq]

Standard deviation [ohm/sq]

Min [ohm/sq]

Max [ohm/sq]

1 0.496 0.052 0.467 0.64 0.485 0.0002 0.4842 0.4847

2 1.120 0.022 1.079 1.16 1.120 0.0001 1.1203 1.1206

3 1.759 0.032 1.720 1.81 1.772 0.0002 1.7715 1.7721

4 4.430 0.100 4.300 4.61 4.425 0.0006 4.4244 4.4263

5 11.840 0.200 11.350 12.09 11.622 0.0102 11.6055 11.6421

6 30.400 0.500 29.800 31.30 30.498 0.0241 30.4544 30.5360

7 82.500 0.700 81.500 83.40 81.359 0.1145 81.2294 81.4972

The correlation of the results is shown in the below image.

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SURAGUS Eddy Current Technology is Fast and Non-contact

How Eddy Current Works

A primary magnetic field is created when alternating current is injected into an induction coil

Eddy Currents are generated when the coil is placed over a conductive sample

The characteristics of the Eddy Currents are determined by material characteristics

The Eddy Currents generate a secondary magnetic field opposed towards the primary field

The impedance of the coil is affected by material differences that influence conductivity

This influence is measured by a pick up coil

+ High sample rate+ High sensitivity+ Non-contact solutions Limited to conductive

materials

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Non-contact Monitoring Along Several Processes in a Wide Measurement Ranges

Capabilities of eddy current monitoring

Metal layer thickness measurement from 2 nm – 2 mm

Sheet resistivity measurement from 0.1 mOhm/sq to 3,000 Ohm/sq

Imaging solution mapping

Defectoscopy

Process monitoring

Deposition (PVD, CVD, Printing... )

Doping

Annealing/tempering

Others (etching, drying polishing, etc.)

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Eddy Current Imaging Solutions Support Identifying Minor Variations and Defects

Area Analysis

Sheet resistance imaging [ohm/sq] on 300 x 300 mm

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Near Edge Characterization Methods Enable Higher Yields in

Metallization Thickness Measurement with Near Edge Characterization

8 Si-wafer with Al coating

Measurement pitch 250µm x 250 µm

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Sub-Nanometer Resolution Shows Minor Thickness Variations

Metallization Thickness Measurement with Near Edge Characterization

Focusing analysing scale provides layer thickness profile with sub nanometer resolution

Defect in 10 o'clock position becomes also visible

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Sheet Resistance Imaging Often Shows Otherwise Undetectable Defects

Sheet Resistance Imaging

Nanowires on PET with 100 x 100 mm [4 inch]

Measurement pitch 1 mm x 1mm

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Anisotropy Imaging Shows Electrical Performance in all Directions

Anisotropy Imaging

Nanowire film on 200 x 200 mm, measurement pitch 1 mm x 1mm

Possibly spraying process from upper right corner

Anisotropy strength (blue=low anisotropy, red=high) Line direction = Anisotropy direction

Line length = anisotropy strength

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Four Testing Setups are commonly applied for TCMs in R&D and Manufacturing

Portable Testing Single point measurement Imaging solutions Inline / Tool integrated

Metallization on wafer

2.35 1.73 1.84 1.89 1.79 2.01 3.48

1.68 1.13 1.20 1.23 1.17 1.19 1.95

1.62 1.14 1.21 1.25 1.15 1.16 1.94

1.65 1.17 1.26 1.35 1.20 1.21 1.94

1.71 1.14 1.21 1.24 1.16 1.19 1.99

1.76 1.14 1.19 1.20 1.15 1.22 2.14

4.20 2.01 2.13 2.00 1.96 2.34 4.24

General Testing Types For Metrology

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Inline Systems Monitor Vast Areas of Material During Lifetime

Benefits of Inline Testing

Documented product quality for internal and external stakeholders

Metrology provides input for process control allowing:

Higher quality

Faster known reaching of desired coating characterizes after process start

Optimized material usage

Balancing throughput along the desired coating specifications

Prevent scrap

Prevents adding further processes / costs if coating was out of spec

Incoming goods inspection for TMCs creates awareness by suppliers often leading to improved quality supply

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Customized Inline Sensor Configurations Deliver Process Information Across Layers

Travelling integrated sensor setup Fixed sensor inline stacking setup

General Setups for Inline Testing

Zigzack testing pattern, information focus on cross substrate direction

Reliable detection of line defects

Requires maintenance due to moving parts and safety measure

Information in machine direction and traverse direction

Scalable concept with high information density

Static sensors do not require maintenance effort for moving traverse

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Challenges for Inline Metrology are Minimized by a Considered Integration

Considerations for Successful Metrology Implementation

Substrate movement

Selecting a measurement system position within the machine with low substrate movement

Space

Fitting sensors and measurement bridge into the right areas, considering cord routing and available space

Speed

Matching position on material and measurement values

Measurement on useful position

Data and Interface

Data can be use for live view, for documentation and (automated) process control

Information depth can be different for live view, documentation and process control

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Selecting a Measurement System Position with Low Substrate Movement

Tension Variation, Splices and Fluttering in R2R applications

Installation of sensors in high tension zone is preferred

Installation in-between two nearby roller or alternatively close to one roller

Fluttering, tension variations during roll change and splices need to be considered with designing the gap (5 – 80 mm)

Sensor vibrations need to be avoided, web vibration can be tolerated but should be still minizied

Considerations for defining distance for top and bottom sensor elements (“gap”)

Larger gaps can tolerate larger variations in coating position

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Space – Measurement Bridge Design Suiting Machine Layout

Customized Measurement Bridges Enable Integration Into Small and Complex Areas

Connection of bridge to mounting points of the machine

Enabling in changing sensor position or during installation

Customized frame per available space and other requirements

Extruded Aluminum frames for flexible mounting vs steel frame and combined frames

A B C D

E

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Hardware – Sensor Description

Space – Sensor Layout for Effective Sensor Mounting and Wiring

Sensor selection (M and S)

Cord exit side selection (side or top)

Mounting type selection (direct or indirect)

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Considerations for Data Quantity and Interfaces

Data Quantity For Live View, Documentation and Process Control

Data Quantity

Reasonable information depth can be different for live view, documentation and process control

5 Vs of big data (for high number of tools, process and monitoring data) volume, velocity, variety, veracity, value

Data architecture

Storage system: DAQ, MES, metrology tool SQL, other tools, raid options

Storage procedure: how long, which data; statistics of roll versus entire data

Interfaces

Connection to machine creates highest benefit

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Merging Measurement Position and Measurement Value

Triggered Measurement Mode Automated Push Measurement Mode

Precise High Speed Measurement

System measures continuously and provides measurements in presence of a conductive film

System automatically takes a self-reference when no conductive material is present

Timestamps or merging with other event incoming data matrix code or other references

System measures on a trigger event

Take one measurement / Take measurements for a certain time / Take measurements from the past etc.

System automatically takes a self-reference when no conductive material is present

Typically, a triggered solution provides a better match between measurement position and measurement value. This is especially valuable for small and fast moving coatings.

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Application Side Metrology Side

Challenges for TCMs

Sheet resistance vs transparency vs costs

Long-term stability of properties

Materials

TCOs, metal films, Nanowire films, CNT, PDOT:PSS, etc.

Processes

Deposition, doping, annealing, aging

Electrical testing solution enable the measurement of

Sheet resistance, metal thickness, emissivity, defect monitoring, anisotropy

Advantages for Eddy Current Testing

Non-contact, large measurement range, high sample rates,

Challenges, Considerations and Solutions

Substrate movement, space, speed, data management

Take home messages

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Thank You!You are welcome to contact us for any questions.

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