Efficient Sensitivity-Based Capacitance Modeling for ... · ASP-DAC 2011, Yokohama, Japan 30...

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Challenge the future Delft University of Technology Efficient Sensitivity-Based Capacitance Modeling for Systematic and Random Geometric Variations 16 th Asia and South Pacific Design Automation Conference Nick van der Meijs CAS, Delft University of Technology, Netherlands January 26, 2011 – Yokohama, Japan

Transcript of Efficient Sensitivity-Based Capacitance Modeling for ... · ASP-DAC 2011, Yokohama, Japan 30...

Page 1: Efficient Sensitivity-Based Capacitance Modeling for ... · ASP-DAC 2011, Yokohama, Japan 30 Conclusion • Sensitivity based method for statistical property of capacitances due to

Challenge the future

DelftUniversity ofTechnology

Efficient Sensitivity-Based Capacitance Modeling for Systematic and Random Geometric Variations

16th Asia and South Pacific Design Automation Conference

Nick van der Meijs

CAS, Delft University of Technology, Netherlands

January 26, 2011 – Yokohama, Japan

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Outline• Introduction

• Systematic & random variations• Modeling method (panel sensitivity)

• Modeling for systematic variations • Modeling for random variations

• Panel sensitivity based statistical modeling method• Experiments and results• Case study: 8-bit binary-scaled charge-redistribution DAC

• Modeling for both variations• Diagram• Experiment and result

• Conclusion

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Process Variability

• Systematic Variation• Lithography, Etching, CMP• Layout dependent

• Random Variation

[Scheffer - 2006]

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Process Variability

• Systematic Variation• Lithography, Etching, CMP• Layout dependent

• Random Variation• Line-edge roughness• Spatial correlation

[Asenov - 2003]

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Process Variability

• Systematic Variation• Lithography, Etching, CMP• Layout dependent

• Random Variation• Line-edge roughness• Spatial correlation

Variabilities of R & C !? How to model BOTH variations?? How to model BOTH variations?

[Asenov - 2003]

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Modeling Method

• BEM-based capacitance extraction• Partial short-circuit capacitances• Nominal capacitance : sum of associated partial short-circuit

capacitances

C

C0C

baC ,

a

b

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Modeling Method

• Panel sensitivity

bk,Na Nb

ak,kk

ijijk, CC

εA1

ρC

Si j

∑∑∈ ∈

−=∂

∂=

- : a small displacement of a panel k- : material permittivity around panel k- Ak : the area of panel k- : an entry in the partial short-circuit capacitance matrix - : capacitance between a panel k and a node i

akC ,

∑∈ iNa

akC ,

εkρ

[Bi-CICC-2009]

have been produced in calculationof the nominal C0 using BEM

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Modeling Method

• Panel sensitivity

bk,Na Nb

ak,kk

ijijk, CC

εA1

ρC

Si j

∑∑∈ ∈

−=∂

∂=

[Bi-CICC-2009]

have been produced in calculationof the nominal C0 using BEM

• no extra costly computation• partial capacitances

(data for standard capacitance extraction)• BEM• FAST!

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Modeling for Systematic Variation

• Linear / sensitivity model

• sp : the set of panels incident to the geometric parameter p

∑ ⋅∂∂

+=i

ii

ΔppCCC 0 ∑

=∂

pskijk,

ij SpC

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Modeling for Systematic Variation

• Linear / sensitivity model

• sp : the set of panels incident to the geometric parameter p

• Variance of capacitance due to the dimensional variation:

• : standard deviation of parameter p

∑ ⋅∂∂

+=i

ii

ΔppCCC 0 ∑

=∂

pskijk,

ij SpC

2p

2

skijk,sysij σ)S()var(C

p

∑∈

=

pσ[Bi-CICC-2009]

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Modeling for Random Variations

• Modeling the effects of Line-Edge Roughness (LER) on capacitances

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Statistical Model of Capacitances

• Capacitance Modeling

i

L

1l

n

1iiρSΔC

l

∑ ∑= =

=

- : capacitance variation induced by the LER- : a sequence of random variables (panel displacements)- : panel sensitivity associated with panel displacement - : the number of deviation panels for rough line - : the number of rough lines

ΔC

iρiSlnL

l

ρ

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Statistical Model of Capacitances

• Capacitance Modeling

• Variance of

)ρSvar(σ i

L

1l

n

1ii

2ΔC

l

∑ ∑= =

=

Some s are NOT independent !!iρ

i

L

1l

n

1iiρSΔC

l

∑ ∑= =

=

ΔC

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Statistical Model of Capacitances

• Capacitance Modeling

• Variance of

)ρSvar(σ i

L

1l

n

1ii

2ΔC

l

∑ ∑= =

=

i

L

1l

n

1iiρSΔC

l

∑ ∑= =

=

ΔC

∑ ∑∑= <=

⎥⎦

⎤⎢⎣

⎡+=

L

l 1)ρ,cov(ρss2)var(ρsσ ji

ji:ji,jii

n

1i

2i

2ΔC

l

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Random Variation

∑ ∑∑= <=

⎥⎦

⎤⎢⎣

⎡+=

L

l 1)ρ,cov(ρss2)var(ρsσ ji

ji:ji,jii

n

1i

2i

2ΔC

l

2var LERi σ)(ρ =

σLER

x

y

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Random Variation

∑ ∑∑= <=

⎥⎦

⎤⎢⎣

⎡+=

L

l 1)ρ,cov(ρss2)var(ρsσ ji

ji:ji,jii

n

1i

2i

2ΔC

l

2var LERi σ)(ρ =

σLER

x

yηLER

|r|r(σ),ρ(ρ

LER

j,yi,yLERji 2

22 expcov

−−=

yir , is the y-coordinate of the position associated with iρ

LERη is the correlation length in y-direction

• Gaussian correlation function:

Any correlation function!

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Random Variation

∑ ∑∑= <=

⎥⎦

⎤⎢⎣

⎡+=

L

l 1)ρ,cov(ρss2)var(ρsσ ji

ji:ji,jii

n

1i

2i

2ΔC

l

2var LERi σ)(ρ =

σLER

x

yηLER

• Gaussian correlation function:

|r|r(σ),ρ(ρ

LER

j,yi,yLERji 2

22 expcov

−−=

yir , is the y-coordinate of the position associated with iρ

LERη is the correlation length in y-direction

Two characterization parameters

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Experiment - I

nmLER 5.3=σ

200nm

CCσ

nmLER 16=η

• Relative std. deviation:

• Monte-Carlo simulation• 1000 samples

- Measurement data from IMEC[Stucchi - 2007]

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Experiment - I

nmLER 5.3=σ

200nm

CCσ

nmLER 16=η

• Relative std. deviation:

• Monte-Carlo simulation• 1000 samples

- Measurement data from IMEC[Stucchi - 2007]

Error CPU Time

MC simulation 0.681% - 48653’’

Proposed model 0.603% 11.5% 50’’

CC /σ

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Experiment - II Using the proposed model, one can easily study:1. The relationship between and the conductor length;2. The impact of parameters and on .

CCσ

CCσ

LERσ LERη

• Same structure as Experiment-I • 5 examples of mismatches

• Combination of various and

• Application: • High accuracy vs. low power

consumption

LERσ LERη

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Experiment - II Using the proposed model, one can easily study:1. The relationship between and the conductor length;2. The impact of parameters and on .

CCσ

CCσ

LERσ LERη

• Two sweeping parameters• Proposed method: an hour

• MC approach: 43 days

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Experiment - II Using the proposed model, one can easily study:1. The relationship between and the conductor length;2. The impact of parameters and on .

CCσ

CCσ

LERσ LERη

The proposed modeling method provides a fast and practical tool for circuit designers to estimate mismatches and

optimize dimensions of critical structures accordingly.

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A Case Study• Novel passive devices with high-precision structures• 8-bit charge-redistribution DAC

• 255 identical unit capacitors• Min. value of a unit capacitor for high power efficiency (0.5fF)• Main consideration: mismatch of capacitors ( )

[Harpe-ESSCIRC-2010]

Unit cap.

0

0

CCσ

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A Case Study• Novel passive devices with high-precision structures• 8-bit charge-redistribution DAC

• 255 identical unit capacitors• Min. value of a unit capacitor for high power efficiency (0.5fF)• Main consideration: mismatch of capacitors ( )

• Design requirement: mismatch of the unit capacitor < 1%

0

0

CCσ

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A Case Study• Design requires:

• mismatch of the unit capacitor < 1%• Simulation shows:• The mismatch of the unit capacitor caused by the LER is around 0.25%;

• Measurement indicates:• A random mismatch of the unit capacitor being better than 0.6%;

• Simulation and measurement together conclude:• Simulation results are very reasonable;

• The structure can be used for more accurate designs: e.g. 10-bit DAC (designer’s plan!);

Design tool enables a new design, based on proper modeling but NOT guessing

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Sensitivity Based Modeling for BothSystematic and Random Variations

Design For Manufacturing

BEM-based LPE Tool

Sensitivity-based modeling

Systematic variability

Random variability

LayoutTech. file

Dimensional Parameters

sysσ

Rough lines,LERσ LERη

Nominal capacitances

Panel sensitivity

Systematic mismatch

Random mismatch

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Experiment - III • Two parallel conductors• width/space = 2μm/2μm; thickness = 2μm; length = 8μm• LER on four edges of two conductors:

• Systematic variation of the two conductors:

• Parameters are chosen based on pure assumption

mm LERLER μημσ 00.2,03.0 ==mm LERLER μημσ 88.2,04.0 ==

mm syssys μσμσ 04.0,03.0 ==

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Experiment - III • Two parallel conductors• width/space = 2μm/2μm; thickness = 2μm; length = 8μm• LER on four edges of two conductors:

• Systematic variation of the two conductors:

• Parameters are chosen based on pure assumption

• 3 Monte Carlo simulations with 1000 samples each• Systematic variation

• Random variation

• Superposition of the above two

mm LERLER μημσ 00.2,03.0 ==mm LERLER μημσ 88.2,04.0 ==

mm syssys μσμσ 04.0,03.0 ==

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Experiment - III

• The systematic variation is the dominant one• Some designs are sensitive to both variations and some (e.g. 8-bit

DAC) are only vulnerable to random variations• Being able to apply the appropriate modeling techniques is essential

MC simulation Proposed method

2.22% 2.05% (7.72% error)

0.21% 0.24% (14.23% error)

2.22% 2.06% (7.18% error)

CPU Time 38h52’ 58’’

CsysC /σ

CLERC /σ

CsNrC /σ

Extremely high efficiency + good enough accuracy = a fast and convenient tool for DFM !

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Conclusion• Sensitivity based method for statistical property of capacitances

due to both systematic and random variations

• Modeling method for the effect of LER on capacitance • Simulations & measurement on chips

• Good enough accuracy & high efficiency

• Useful and convenient tool for mismatch estimation & circuit optimization

• Overall picture of the sensitivity based method for both variations• Extension of BEM LPE tools

• Serving DFM!