EE 296 Sophomore ProjectGroup Members:

Jeremy ChanJimyLeah Castro

Eric LeeSae Yoon

Project Overview

Te·lem·e·try n. (te'le-m&-trE)The science and technology of automatic measurement and transmission of data by wire, radio, or other means from remote sources, as from space vehicles, to receiving stations for recording and analysis.

Block Diagram

Circuit Design

• Block Diagram

Circuit Modules

• Power Supply (5V, 3.3V)

• Zilog 40 Pin 64KB Flash Microcontroller

• MAXStream9 RF Modems

• Parallax/Sensirion Temperature and Humidity Sensor

• Lassen IQ+ GPS

• MPX4115A Motorola Pressure Sensor

Power Supply, 5V, 3.3V

• Block Diagram

MPX4115A Motorola Pressure Sensor

MaxStream9 RF Modems

• Block Diagram

Parallax / Sensirion Temperature and Humidity

• Block Diagram

Zilog Z8F6421 Microcontroller

• Block Diagram

GPS Module

GPS Module: Trimble Lassen IQ+

• RS-232 Data Layer Protocol

• TTL-level Output (CMOS Compatible)

• 2 Serial Ports for NEMA or TSIP Output

GPS Module: TSIP

• Proprietary Protocol

• Byte protocol implementation required

• Provides product specific information

GPS Module: NEMA 0183

• Standardized GPS Message Formats

• ASCII Output

• Comma Delimited

• Time, Date, Position, Velocity

GPS Module: NEMA 0183Message Format

• $GPGGA,034932.00,2116.3469,N,15748.0176,W,1,03,2.38,00090,M,004,M,,*75

• $GPVTG,000.0,T,348.7,M,000.0,N,000.0,K,A*2B

GPS Module: NEMA 0183Message Translated

• Time/UTC of position fix: 03:49:33.00 GMT (5:49PM HST) Latitude: 21 16.3470 North Longitude: 157 48.0175 West Solution Quality: GPS Fix (3 Satellite)

GPS Module: AccuracyGPS Module: Accuracy

GPS Module: PrecisionGPS Module: Precision

Circuit Design Recap

• Block Diagram

Circuit Design Prototype

Design Status

Modules Purchased Built Tested

Power Supply – 3.3V, 5V

Zilog Z8 Encore! Flash Microcontroller

MAXStream9 RF Modem - OEM

Parallax/Sensirion SHT11 Temperature and Humidity Sensor

GPS Functional

MXP4115A Motorolla Pressure Sensor

Z8 Encore Development Kit

Sample Program

What Remains to be Done

• Circuit Construction

• Sensor Interface Testing

• Platform Construction

• PCB Design and Construction

• Data Gathering via Telemetry

• Documentation

Nice to Haves

PCB Design and Construction

Challenges Foreseen

• Defects

• Funding

• Shipment Delays

• Compatibility Issues

• Time

Project Schedule Update

Thank You