ECE5917 SoC Architecture: System -...
Transcript of ECE5917 SoC Architecture: System -...
ECE5917SoC Architecture: System
Tae Hee Han: [email protected]
Semiconductor Systems Engineering
Sungkyunkwan University
What is ‘System’? (from Wiki)
The term system has multiple meanings:1. A collection of organized things; as, a solar system.
2. A way of organizing or planning.
3. A whole composed of relationships among the members.
Most systems share the same common characteristics. These common characteristics include the following:
1. Systems have a structure that is defined by its parts and processes.
2. Systems are generalizations of reality.
3. Systems tend to function in the same way. This involves the inputs and outputs of material (energy and/or matter) that is then processed causing it to change in some way.
4. The various parts of a system have functional as well as structural relationships between each other.
The characteristics of systems have been studied in general systems theory.
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What is ‘System’?
n Electronic System Design Perspective n The concept of “system” has evolved over the twenty years in IT.
One can conclude upfront that there are perhaps as many definitions of an electronic system as there are engineers designing them. A famous quote states that a system is the level of abstraction just above what you are currently working on.
n One of the main challenges is that the phrase system level means different things to different people. For some, it stands for co-development of hardware and software; for others, it means heterogeneous integration of many IP components or complexity management.
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Typical System Development Flow
n Product Concept
n Market Analysis
n Determination of System Specification
n Cost Estimation à Price
n Development Schedule & Work Partition
n Component Supplying & Outsourcing Plan
n Risk Management (Contingency) Plan
n System Design
n Supplementary Workn Marketing, Sales, Mass Production Plan, After-service...
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IteratedFeedbackLoops
Semiconductor Demand Drivers in 2012
Data Processing34%
Wired Communications
6%
Wireless Communications
24%
Consumer18%
Automotive8%
Industrial10%
$ 300 B (USD)
Source: SIA (Semiconductor Industry Association)
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Smart Connected Devices Lead the Market Growth
n Tablet sales grew 78.4% YoY in 2012 — Expected to pass desktop sales in 2013, portable PCs in 2014n Global smartphone applications processor revenues showed a robust 60 %
YoY growth to reach $12.9 billion in 2012
n Global tablet processor market experienced an 83% year-on-year growth compared with 2012, reaching $2.7 billion
Product Category 2012 Unit Shipments 2012 Market Share 2017 Unit
Shipments* 2017 Market Share* 2012 - 2017 Growth*
Desktop PC 148.4 12.4% 141.0 6.0% -5.0%
Portable PC 202.0 16.8% 240.9 11.0% 19.3%
Tablet 128.3 10.7% 352.3 16% 174.5%
Smartphone 722.4 60.1% 1,516 67% 109.9%
Total 1,201.1 100.0% 2,250.3 100.0% 87.3%
(Units in million)
Source: IDC (2013)
Source: Strategic Analytics (2013)
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Smart Device Key Players in Market
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QuantaAsus
Pegatronetc…
AmazonGoogle
Microsoft
ODM
FoxconnPegatron Apple
SamsungHTC
OEM
OBM
System vendor with core chip
owner
Chip supplier
Service
System SW
System HW
Service SW
Package SW
Demand SW
Manufacturer Brand Owner
Peripherals
ø ODM: Original Design Manufacturerø OEM: Original Equipment Manufacturerø OBM: Original Brand Manufacturer
Apple Google Samsung Microsoft Amazon
Service iCloud Google+ Azure Cloud AWS Cloud
OS iOS Android, Chrome Bada à Tizen Windows Linux based
Tablet (PAD) iPad (Nexus series) Galaxy Note Surface Kindle Fire
Phone iPhone (Nexus series) Galaxy (Nokia)
PC iMac (Chrome NB) Notebook (HP, Dell, …)
Music Player iPod MP3/DC
Etc. iTV, iWatch Google TV, Google Glass Smart TV Xbox
Windows 8
Windows 8 RT
Windows Phone 8
Mobile Market Ecosystem: OS Perspective
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Evolution to Revolution
n Create a new class of lifestyle PCsn Device-like, desirable, affordable
n A full-power, full-fidelity digital companion
n Enable new scenarios for the PCn More mobile, more natural interaction for on-the-go use,
more natural fit into people’s lives and activities
n New software and peripheral opportunities
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Smartphone
Pocket PCNotebook PC
Tablet PC
Ultra-Mobile PC
Desktop
portable and watered down
Netbook w/ Atom CPU
Smartbook & Tabletw/ ARM CPU
Expanded and more powerful
Smartphone10
Mobile vs. PC Architecture
(Optional Graphics Card)ARM CPU core
GPU core
LPDDR3
High-end Discrete GPU
DDR3
GDDR5
MobilePC
AP
Memory Controller
CPU SoC
x86 CPU core
GPU core
Memory Controller
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• Intel Ivy Bridge• AMD Fusion
• Nvidia GeForce• AMD Radeon
• Apple A6• Samsung Exynos• Qualcomm Snapdragon• Nvidia Tegra
• Imagination PowerVR• ARM Mali• Qualcomm Adreno• Nvidia ULP GeForce
Cortex-A8 single
Cortex-A8 single Cortex-A9 DualCortex-A9 Dual Cortex-A9 Dual
@1.5GHzCortex-A9 Dual
@1.5GHz
Cortex-A9 Quad
Cortex-A9 Quad
Cortex-A15 Dual
Cortex-A15 Dual
Cortex-A15/A7 Quad/Octa(big.LITTLE)
Cortex-A15/A7 Quad/Octa(big.LITTLE)
40M Polys/sec40M Polys/sec 80M Polys/sec
80M Polys/sec 120M Polys/sec120M Polys/sec
256MB256MB 512MB512MB 1GB1GB 2GB LPDDR22GB LPDDR2
854×480854×480 960×540960×540 1,280×7201,280×720 1,920×1,0801,920×1,080
4”4” 4.2”4.2” 4.5”4.5” 5”5”
HSPSA/HSUPA(~7.2Mbps)
HSPSA/HSUPA(~7.2Mbps)
HSPSA/HSUPA(~14.4Mbps)
HSPSA/HSUPA(~14.4Mbps)
HSPA+(~21Mbps)
HSPA+(~21Mbps)
DC-HSPA(~42Mbps)DC-HSPA
(~42Mbps)
LTE(~75Mbps)
LTE(~75Mbps)
LTE-A(~150bps)
LTE-A(~150bps)
IEEE802.11b/g
IEEE802.11b/g
IEEE802.11a/b/g/n
IEEE802.11a/b/g/n
IEEE802.11a/b/g/n/ac/ad
IEEE802.11a/b/g/n/ac/ad
2010 2011 2012 2013 2014 2010 2011 2012 2013 2014
CPU
Technology Evolution driven by Mobile Device (1/2)
GPU
DRAM
Pixel
Display
Cellular
WiFi
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Cortex-A53/A57 Heterogeneous Multi-
core (big.LITTLE)
Cortex-A53/A57 Heterogeneous Multi-
core (big.LITTLE)
2GB LPDDR32GB LPDDR3 4GB LPDDR3 / DRAM stacking - Wide IO?
4GB LPDDR3 / DRAM stacking - Wide IO?
4.8”4.8”
266M Polys/sec266M Polys/sec
2010 Increase 2020
Cellular ~70 X
WiFi ~47 X
Display(Resolution) 17 X
Video(Resolution) 34 X
Battery 2.2 X
~7 Mbps ~500 Mbps
~150 Mbps ~7 Gbps
720p 4Kp
720P H.264 4Kp H.265
5.76Whr 13Whr
Technology Evolution driven by Mobile Device (2/2)
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Tick-Tock Strategy of Apple
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iPhone 3G iPhone 3GS iPhone 4 iPhone 4S iPhone 5
Display 3.5”, 165ppi 3.5”, 165ppi 3.5”, 330ppi 3.5”, 330ppi 3.5”, 330ppi
CPU ARM1176@620MHz Cortex-A8@600MHz Cortex-A8@1GHz (A4) Cortex-A8@800MHzDual (A5)
Swift(Cortex-A15)@1.2GHz Dual (A6)
GPU - PowerVR SGX535 PowerVR SGX535 PowerVR SGX543MP2 PowerVR SGX543MP3
RAM 128MB 256MB 512MB 512MB 1GB
Camera 2MP 3.15MP 5MP 8MP 8MP
Release TIme 2008. 6 2009. 6 2010. 6 2011. 10 2012. 9
Design Perspective
Performance Perspective
Smartphone Comparison
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SamsungGalaxy S4 HTC One Apple iPhone5 LG Optimus G Pro BlackBerry Z10
Release Date Apr, 2013 Apr, 2013 Sep, 2012 Apr, 2013 Jan, 2013
OS Android 4.2.2(Jelly Bean)
Android 4.1.2(Jelly Bean) iOS 6.1.4 Android 4.1.2
(Jelly Bean) BlackBerry 10
Technology 28nm 28nm 32nm 28nm 28nm
ApplicationProcessor
Exynos 5 Octa@ (1.6/1.2GHz) /
Octacore (Cortex-A7 Quad + Cortex-
A15 Quad) or Snapdragon
[email protected] / Quad
/ Krait(ARMv7) Quad
Apple [email protected]/ Swift(ARMv7)
Dual
/ Krait(ARMv7) Quad
Snapdragon S4 plus @1.5GHz/ Krait(ARMv7)
Dual
GPUTriple corePowerVR
SGX 544MP3Adreno 320
Triple corePowerVR
SGX 543MP3Adreno 320 Adreno 320
DRAM LPDDR3 2GB LPDDR2 2GB LPDDR2 1GB LPDDR2 2GB LPDDR2 2GB
Chipset Integration Trend (1/3)
n Mobile : AP/BB, PMIC based integration
n TV : AP/Graphics/Gesture Processor based integration
(Source : Gartner - modified)
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2012 2013 2014 2015 2016Application processor 32/28nm
Dual/Quad28/20nm
Quad/Octa 20/14nmOcta/Many 14nm
Many Core14/10nm
Many Core
Baseband processor WiFi
40nmDual CoreBT/FM
GPS NFC controller 65nm 40nm RF/Transceiver 40nm 28nm 20nm Audio/Video Codec
130nm 130nm
90nm 65nm 45nm
Power management IC Noise cancellation IC 180nm Touch-screen controller 90nm 90nm
Gesture recognition 90nm 65nm
DRAM 32nm 28nm 25nm 23nm 21nm NAND flash 19nm 15nm 13nm 10nm 7nm e-compass/e-gyroscope 180nm 180nm 180nm 180nm 180nm
2012 2013 2014 2015 2016Application processor
45nm Dual Core
28nmDual Core 28nm
Quad Core 22/20nmQuad Core 20/14nm
Many Core
Graphics & Video Processor
Connectivity(Ethernet & USB)
HDMI / MHL Input 90nm 65nmAudio/Video I/O 65nm Frame Rate Controller 65nm 40nm Timing Controller 65nm 40nm Gesture/Image Processor 90nm 65nm 40nm Touchpad Processor 90nm 65nm Voice Processor 90nm 65nm WiFi 65nm
65nm65nm 40nm Bluetooth 65nm
NFC 90nmLCD Driver 130nm 90nm 65nmAudio Codec 130nm 90nm 65nm
Chipset Integration Trend (2/3)
n Mobile : AP/BB, PMIC based integration
n TV : AP/Graphics/Gesture Processor based integration
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(Source : Gartner - modified)
Chipset Integration Trend (3/3)
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Smartphone Sensors
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More than Moore
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2013 2016?
PoP3D IC
Package size
PoP
3D IC
Power Consumption
PoP
3D IC
Bandwidth
x 8
50%35%
Design Objectives
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Performance
Cost
Quality
Thresholds
Better
Better
Improvingquality beyond
threshold isdesired
Improvingperformance
beyond thresholdIs a waste
Improvingcost is desired
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Project Management
ProjectRisk
Management
General Management
Scope Communication
Quality Human Resource
Cost
Schedule Contract/Supply
Life CycleEnvironment variable
Instruction, Information/Data sharing
Availability
Productivity
Service, Outcome
Target CostConstraint
Target ScheduleConstraint
Requirement
Standard
Expectation, Feasibility
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Cast Study:Mobile
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Start Symbol Search Receiving individual bits
Start Symbol Detection
Synchronization
Radio Samples
MAC Delay Transmitting encoded bits
Start Symbol Transmission
Bit Modulations
Transmission
ReceptionEncoded data received
Data Received
Encoded data to be Transmitted
Data to be Transmitted
Encode processing
Decode processing
Transmit command provides data and starts
MAC protocol.
Wireless Communication Phases
CPU
DSP
ABB
RF
PROTOCOLSTACK
L1 DBB HARDWARE
MMI (Man- Machine Interface)
ApplicationTasks
DATA I/OLCD,
Camera,Etc
L1 SW
Handset Top Level
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A Wireless System – Typical SoC Design
AD FSM
Control
RTOS
ARQ
MAC
Coders
FFT Filters
Hardwired Algorithms(word level)
digitalanalog
Logic (bit level)
Analog Basebandand RF Circuits
CommunicationAlgorithms
Protocols
HardwiredLogic
Analog
DSP Core mP CoreA wide mix of components –how do we optimize this???
Source : Prof. Bob Brodersen at UCB
The Design Goal: System on a Chip CMOS Radio
A / D
Analog RF
Timingrecovery
phonebook
Control
Java VM
ARQ
User Interface
FiltersAdaptive Antenna
Algorithms
Equalizers MUD
Accelerators(bit level)
digitalanalog
DSP cores
mP core(ARM)
Four Basic Components
Logic
Dedicated Logicand Memory
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The Design Environment
Analog RF, Passives, Mixed Signal
(Matlab)
Communications Engineering/DSP
Protocols/Control
(SDL,SMV)
Amplifiers, Filters, A/D, PA, Inductors
(SPICE, AVHDL,Schem.)
Dedicated Logic, Pleiades, VHDL, Schematics
Embedded mP, Programmable DSP
(C, Assembly)
Matlab,Simulink
Matlab,Simulink
Telelogic,Stateflow
HSPICE Synopsys, Unicad
ARMulator,ARM Compiler
Specification(UML)
Analog Component Libraries
(Layout, SKILL)
Func. Modules (RAM, ROM, Mult)Standard Cell
Place and Route
HP EESoft ASITIC
Cadence
Programmable Cores DSP, ARM, FPGA
(C, VHDL, Assembly
ARMFPGA
Express
Rational ROSE,Visual Modeler
UnicadCadence,
Power& TimeMill
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ø SDL: Specification and Description Languageø SMV: Symbolic Model Verification
Typical Mobile Phone: Chip Perspective
LNALNA
PAPA
RxSynth
Tx
RxSynth
Tx
RadioCODECRadioCODEC
DigitalBaseband
Logic
DigitalBaseband
Logic
MemoryMemory
UserInterface
UserInterface
PassivesPassives Power ManagementPower Management
Audio
Display
SiGe BiCMOS
Discrete Passive(SAW, etc)
High Voltage
Analog CMOS
DSM Digital
Flash EEPROM
High-Power (typically GaAs)
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The Direction of RF SoC Integration Local optimization of each sub-systemBaseband & mixed-signal / RF integration à 2.5G GSM New functions require redundant RF/Analog, digital processing, memory
BluetoothTM
GPS3G Radio2.5Radio
A/D Baseband
WLAN
Software/AppsDigital Camera
Memory
MP3
LCD controller
Leveraging of technology strengths for lowest cost systemBaseband / memory / processor integration 130nm à90nmà 65nm Analog / RF / power integration à Modular processes per application Packaging – flipped / stacked / passives à Overcome integration barriers
Power Amplifiers RF Subsystem Baseband
Power Amplifiers
RF Subsystem Baseband
BluetoothTM
GPS3G Radio2.5Radio
A/D Baseband
WLAN
Software/AppsDigital Camera
Memory
MP3
LCD controller
Source : Jazz Semiconductor
Ubiquitous Electronics
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0.0001
0.001
0.01
0.1
1
10
100
1000
1950 1960 1970 1980 1990 2000 2010 2020
Historical
LargeScale
Office/Middle
WS
PC
AmbientElectronics
UbiquitousComputing
Embedded
Vac. tube
Transistor
IC
LSI
VLSI
SoC
3D SiP
Ubiquitous device
Everybody
Everywhere
UnawareElectronics is part of environments enhancing convenience and security of daily life
People use electronics consciously.
ø Source: T. Kuroda in Keio Univ. (`07)
Ambient Intelligence
Position &ForceSensors
BloodComposition(e.g. lactate)
ECG,BloodPressure
MultipleHopBAN
WearableDigitalAssistant Wireless
Link to Coachand Med Team
WearableDigitalAssistant
ø Source: IMEC Electronics è Background, People è Foreground
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RF
BANBody Transducers
1m
C T
SoC-SiPWearable Assistant
End-User Equipment for Ambient Intelligence?
www
1000 m
GSM/GPRS/UMTSBasestations
C: base-bandRF: radio linkT: transducerIF: interface
• multimedia, games • QoS• global positioning• global connectivity• biometric input• health...
10…100 Gops 0.1-2W
IF
SeeHearFeel
SpeakShow
Stimulate
IF
RF
100mW - (k)bps
RF
>100/person aura
C T
WAN + WLANBasestations
<1W,10Gops > 100 Mbps
10mC RF
Satellite
10mAd-hocnetwork
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ø Source: IMEC
Ambient Intelligence Architecture
n Transducer nodes
n Ultra low energy (100Mops/mW)
n Low flexibility
n Ultra low cost (1€)
n 1..10 Mtr (small size)
n Low clock frequency
n Chip-package co-design
n Assistant nodes/basestations
n Low energy (10-50Mops/mW)
n High Flexibility
n Low cost (100 €)
n 10..100 Gops, >100 Mtr
n High (not GHz) frequency
n Dynamic task management
Need global system optimizationGHz RF and mixed signal everywhere
@100..1000 times Power efficiency of today’s mP...ø Source: IMEC
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Digital Contents + IPs : “Liquid” Contents
ANY DIGITAL CONTENT(Variety of “store & play” devices of
fully digitalized “liquid” content)
ANY PHYSICAL NETWORK
(Variety of wired/wireless access to fully IP networks)
WEB-BASED SERVICES
Full IPNetwork of Networks
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New Business Opportunities
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lensvideo chip and lamp
Micro-actuatorPower and data antenna
SoC
Microfluidics & drug delivery
New Killer Applications
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More than Moore – Optical Digital Camera
=+Sensor
+Optics
VSC DENC
DAC
DAC
EMI
JPEG
ST20-C1
COMMS
TransportServicesPLL
BlockMove
FMI DC-Core
DCU
SmartMedia
CCD i/f
Camerai/f
Image ProcessingInterfaces
Cache & RAM
Video subsystem
YC
JIF
RZY
R1 W1
R2
W2
Perip
h
RZC
LPY LPC
1394SSCPIOIIC
JPEG 3 x SSC2 x ASC
VSCDENCDACs
SmartMedia &
Compact Flash
Interface
32kHz
ST20-C1 CPU
CacheSubsystem
ImageProcessing
External SDRAM & Flash
Interface
SensorInterface
IP in red supplied by our partner
SystemTimers
8kSRAM
Diagnosticcontroller
Watchdog/LPC
Int.Cont.
IEEE1394Interface
CameraH/W
Interface
Processor
4.5 ´ 4.5 ´ 3.6mm
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More than Moore – Mechanical Gyro/Accelerometers
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+
More than Moore – Sensors and MEMS
Pressure
Gas
RF MEMS
Silicon Microphone
Cantilever
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Standalone DevicesStandalone Devices Feature Phone/Smart PhoneFeature Phone/Smart Phone Emerging DevicesEmerging Devices
ü Dedicated function devicesü E.g) traditional PDAü Platform concept is not
important (Linux is themainstream)
ü Dedicated function devicesü E.g) traditional PDAü Platform concept is not
important (Linux is themainstream)
ü Single Network Mobile Deviceü 2G or 3G mobile phoneü Wi-Fi is becoming more
importantü Platform concept is very
important
ü Single Network Mobile Deviceü 2G or 3G mobile phoneü Wi-Fi is becoming more
importantü Platform concept is very
important
ü Standalone device + Wi-Fi and/or 3G Network à Connected
ü Spreads to CE devicesü Powerful multimedia function is
becoming more importantü “Web Platform” concept
ü Standalone device + Wi-Fi and/or 3G Network à Connected
ü Spreads to CE devicesü Powerful multimedia function is
becoming more importantü “Web Platform” concept
Emerging Devices
n Standalone device + Networking
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Window Mobile AllianceWindow Mobile AllianceAndroid AllianceAndroid Alliance
• Platform expansion due to the spread of Android into emerging devices (eBook, CE)• Platform expansion due to the spread of Android into emerging devices (eBook, CE)
• Microsoft’s efforts on innovation of Window Mobile and CE Platform• Pink Project (PC-based Platform à Web-based Platform)
• Microsoft’s efforts on innovation of Window Mobile and CE Platform• Pink Project (PC-based Platform à Web-based Platform)
Symbian AllianceSymbian AllianceAppleApple
• iPad – new media devices• iPod and iPhone are becoming media devices• iPad – new media devices• iPod and iPhone are becoming media devices
• Nokia enters the netbook (Booklet 3G) market• Expanding Internet Tablet PC line-ups and Maemo Platform• CE Focus trend of Symbian Foundation OS
• Nokia enters the netbook (Booklet 3G) market• Expanding Internet Tablet PC line-ups and Maemo Platform• CE Focus trend of Symbian Foundation OS
Emerging Devices
Smart Phones
Strategy Change of Platform Enablers
n Smartphones are evolving to emerging devices
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ProjectorVideo Player Digital TV Game
Console Audio Player
Digital Signage
Car
Kiosk
MID/PMP
Digital Camcorder
Digital Camera
HandsetNotebook/ Netbook
Mobile Game
Earphone/ Headset
Desktop
Printer
Media Server
MP3P
WPAN/WLAN
Cognitive Radio
Network-oriented Emerging Devices
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