ECE 477 Final Presentation ECE 477 Final Presentation Team 6 Team 6 Spring 2010 Spring 2010

Digital Sound ProjectionDigital Sound Projection

OutlineOutline

• Project overviewProject overview

• DSP Algorithm overviewDSP Algorithm overview

• Block diagramBlock diagram

• Design challengesDesign challenges

• Individual contributionsIndividual contributions

• Project demonstrationProject demonstration

• Questions / discussionQuestions / discussion

Project Overview Project Overview

• A high quality wireless audio transceiver A high quality wireless audio transceiver system system – Battery powered transmitterBattery powered transmitter– Receiver base to process and output audioReceiver base to process and output audio

• Digital signal processing (DSP)Digital signal processing (DSP)– Digital EQDigital EQ– Digital Mute (Voice enhancement)Digital Mute (Voice enhancement)

DSP Algorithm OverviewDSP Algorithm Overview• Digital MuteDigital Mute

– Enhance the contrast of human voiceEnhance the contrast of human voice– Selectively adjust the amplitude of human Selectively adjust the amplitude of human

voice harmonicsvoice harmonics• Equalization EffectsEqualization Effects

– Adjust the amplitudes of 11 different Adjust the amplitudes of 11 different frequency bandsfrequency bands

System Level Block DiagramSystem Level Block Diagram

Transmitter Block DiagramTransmitter Block Diagram

Receiver Block DiagramReceiver Block Diagram

Design Challenges FacedDesign Challenges Faced

• Analog Circuitry for High Fidelity AudioAnalog Circuitry for High Fidelity Audio– Differential (balanced) signalingDifferential (balanced) signaling– Eliminating power supply noiseEliminating power supply noise

• Signal ProcessingSignal Processing– Real-time constraintsReal-time constraints– Memory size constraints and organizationMemory size constraints and organization– Mixed signal environmentMixed signal environment

Design Challenges FacedDesign Challenges Faced

• Heat Dissipation From Power CircuitryHeat Dissipation From Power Circuitry– High voltage drop with large current High voltage drop with large current

(1.5A+)(1.5A+)– ADSP-21262 core consumes around ADSP-21262 core consumes around

800mA.800mA.– Linear regulators generate too much heat.Linear regulators generate too much heat.

Design Challenges FacedDesign Challenges Faced

• PCB DesignPCB Design– Large number of integrated circuitsLarge number of integrated circuits– Area constraintsArea constraints– Power and ground trace routingPower and ground trace routing– Receiver required 4 layer designReceiver required 4 layer design

Individual ContributionsIndividual Contributions

• Team Leader – Mike GoldfarbTeam Leader – Mike Goldfarb• Team Member 2 – Steve AndersonTeam Member 2 – Steve Anderson• Team Member 3 – Shao-Fu ShihTeam Member 3 – Shao-Fu Shih• Team Member 4 – Josh SmithTeam Member 4 – Josh Smith

Team Leader – Mike GoldfarbTeam Leader – Mike Goldfarb

• Component SelectionComponent Selection– Provided guidance to team on interfacing Provided guidance to team on interfacing

requirementsrequirements– Microcontroller and DSP selectionMicrocontroller and DSP selection

• Software / Hardware InterfacingSoftware / Hardware Interfacing– DSP implementationDSP implementation– Device driversDevice drivers– Digital hardware prototyping Digital hardware prototyping

and debuggingand debugging

Member 2 – Steve AndersonMember 2 – Steve Anderson

• Receiver SchematicsReceiver Schematics– PCB decalsPCB decals

• Receiver PCB layoutReceiver PCB layout– 2 layer board 2 layer board 4 layer board 4 layer board

• Receiver Boards verificationReceiver Boards verification– Continuity testContinuity test– Component solderingComponent soldering

• Packaging DesignPackaging Design

Member 3 – Shao-Fu ShihMember 3 – Shao-Fu Shih• DSP Algorithm development and simulationDSP Algorithm development and simulation

– Overlap-save methodOverlap-save method– Frequency analysisFrequency analysis

• Analog circuitry designAnalog circuitry design– Power circuitry design and filteringPower circuitry design and filtering– Differential audio circuitry designDifferential audio circuitry design– Analog hardware prototyping and debuggingAnalog hardware prototyping and debugging

• IC solderingIC soldering• Packaging designPackaging design

Member 4 – Josh SmithMember 4 – Josh Smith

• Transmitter PCBTransmitter PCB– Custom component footprintsCustom component footprints– PCB SchematicPCB Schematic– PCB Layout/RoutingPCB Layout/Routing– Verification and continuity testingVerification and continuity testing– Component solderingComponent soldering

• Packaging designPackaging design

Project DemonstrationProject Demonstration1.1. An ability to display information to the user An ability to display information to the user

on an LCD about the status of the device.on an LCD about the status of the device.

2.2. An ability to wirelessly transmit and receive a An ability to wirelessly transmit and receive a digital audio signal.digital audio signal.

3.3. An ability to control output volume wirelessly An ability to control output volume wirelessly from the transmitter. from the transmitter.

4.4. An ability to allow the user to adjust EQ An ability to allow the user to adjust EQ effects applied to audio signals.effects applied to audio signals.

5.5. An ability to apply digital mute to An ability to apply digital mute to the audio signals based on a threshold.the audio signals based on a threshold.

Project DemonstrationProject Demonstration

Questions / DiscussionQuestions / Discussion