ECE 477 Design Review Team 07 Fall 2009

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ECE 477 Design Review ECE 477 Design Review Team 07 Team 07 Fall 2009 Fall 2009 Steve Steve Andre Andre Eric Eric Glover Glover Russe Russe ll ll Willm Willm ot ot Shaun Shaun Greene Greene POV Machine

description

ECE 477 Design Review Team 07  Fall 2009. Eric Glover. Shaun Greene. Steve Andre. Russell Willmot. POV Machine. Outline. Project overview Project-specific success criteria Block diagram Component selection rationale Packaging design Schematic and theory of operation PCB layout - PowerPoint PPT Presentation

Transcript of ECE 477 Design Review Team 07 Fall 2009

Page 1: ECE 477 Design Review Team 07    Fall 2009

ECE 477 Design Review ECE 477 Design Review Team 07 Team 07 Fall 2009 Fall 2009

Steve AndreSteve Andre

Eric GloverEric Glover

Russell Russell WillmotWillmot

Shaun GreeneShaun Greene

POV Machine

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OutlineOutline• Project overview Project overview • Project-specific success criteriaProject-specific success criteria• Block diagramBlock diagram• Component selection rationaleComponent selection rationale• Packaging designPackaging design• Schematic and theory of operationSchematic and theory of operation• PCB layoutPCB layout• Software design/development statusSoftware design/development status• Project completion timelineProject completion timeline• Questions / discussionQuestions / discussion

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Project OverviewProject Overview• Persistence of Vision (POV) machine that will control a single Persistence of Vision (POV) machine that will control a single

column of rotating LEDs to project a pattern to the usercolumn of rotating LEDs to project a pattern to the user• 96x32 pixel 3-bit color output96x32 pixel 3-bit color output• Display in 360° with 10° resolutionDisplay in 360° with 10° resolution

• Track an RF beaconTrack an RF beacon• Example output patterns are a clock and Example output patterns are a clock and

thermometer, a small image, or other textthermometer, a small image, or other text

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Project-Specific Success CriteriaProject-Specific Success Criteria

• The ability to display a pattern with rotating LEDsThe ability to display a pattern with rotating LEDs• The ability to control the direction in which a pattern is The ability to control the direction in which a pattern is

projectedprojected• The ability to track the angle of arrival of an RF beaconThe ability to track the angle of arrival of an RF beacon• The ability to update a projected image while the The ability to update a projected image while the

machine is in operationmachine is in operation• The ability to accept user-generated input to change The ability to accept user-generated input to change

displaydisplay

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Block DiagramBlock Diagram

Lower Board

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Block DiagramBlock Diagram

Upper Board

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Component Selection RationaleComponent Selection Rationale• Assumed:Assumed:

– 1800 RPM speed1800 RPM speed

– 15 cm radius disc (center to LED post)15 cm radius disc (center to LED post)

– 180° display180° display

– 96x32 RGB pixel display96x32 RGB pixel display

– RF transceiver is 1Mbps (SPI)RF transceiver is 1Mbps (SPI)

– Minimum voltage difference of phase detector = 0.014 V for a 10° angle changeMinimum voltage difference of phase detector = 0.014 V for a 10° angle change

• ResultsResults

– 33 ms per revolution33 ms per revolution

– 174 174 μμs per column (96 bits per column)s per column (96 bits per column)

– Image data rate = 552 kbps (SPI)Image data rate = 552 kbps (SPI)

– 92.6 92.6 μμs = 1° of rotations = 1° of rotation

– Image = 9216 bitsImage = 9216 bits

– Time to transfer image = 10ms (ideal)Time to transfer image = 10ms (ideal)

– 3.3V ATD resolution min = 8 bit (0.013 V resolution)3.3V ATD resolution min = 8 bit (0.013 V resolution)

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Component Selection RationaleComponent Selection RationaleMicro #1Micro #1

• A/D (3 channels), at least 8 bitA/D (3 channels), at least 8 bit

• SPI (1 channel) 1 MbpsSPI (1 channel) 1 Mbps

• At least 21 I/O pinsAt least 21 I/O pins

• 36 KB of SRAM36 KB of SRAM

• 36 KB of Flash to store images36 KB of Flash to store images

• 3.3 V preferred3.3 V preferred

Micro #2Micro #2

• SPI (2 channel) 552 kbps & 1MbpsSPI (2 channel) 552 kbps & 1Mbps• 16 I/O16 I/O• External InterruptExternal Interrupt• TimerTimer• Pulse AccumulatorPulse Accumulator• 8 KB of Flash8 KB of Flash• 6 KB of SRAM6 KB of SRAM• 3.3 V preferred3.3 V preferred

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Component Selection RationaleComponent Selection RationaleARM Cortex M3 LM3S8962 MicrocontrollerARM Cortex M3 LM3S8962 Microcontroller• 50 MHz Clock w/PLL50 MHz Clock w/PLL• 32-bit Architecture32-bit Architecture• 4 A/D channels (10 bit)4 A/D channels (10 bit)• 24 MHz SPI24 MHz SPI• 37 I/O pins available37 I/O pins available• 256 KB of Flash256 KB of Flash• 64 KB of SRAM64 KB of SRAM• 3.3 Volt supply3.3 Volt supply• 100 pin LQFP100 pin LQFP

Extra Features:Extra Features:• Integrated support for graphic OLED screenIntegrated support for graphic OLED screen• Programmable with LabVIEW for ARMProgrammable with LabVIEW for ARM• Integrated Micro SD card drivers and hardwareIntegrated Micro SD card drivers and hardware• Direct connection to Ethernet portDirect connection to Ethernet port• Free!!!Free!!!

PIC24FJ32GA002 MicrocontrollerPIC24FJ32GA002 Microcontroller• 32 MHz Clock w/PLL32 MHz Clock w/PLL• 16-bit Architecture16-bit Architecture• 8 MHz SPI (2 channels)8 MHz SPI (2 channels)• 21 I/O pins available21 I/O pins available• 32 KB of Flash32 KB of Flash• 8 KB of SRAM8 KB of SRAM• 3.3 Volt supply3.3 Volt supply• 28 pin SOIC28 pin SOIC• C Compiler Optimized Instruction SetC Compiler Optimized Instruction Set

Extra Features:Extra Features:• Not a whole lotNot a whole lot

Micro #1Micro #1 Micro #2Micro #2

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Packaging DesignPackaging Design

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Packaging DesignPackaging Design

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Packaging DesignPackaging Design

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Packaging DesignPackaging Design

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Schematic/Theory of OperationSchematic/Theory of Operation

• Main Power SuppliesMain Power Supplies– Lower BoardLower Board

Rectifier & Filter

5V Buck converter

3.3V LDOTo Slip Ring

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Schematic/Theory of OperationSchematic/Theory of Operation

• Slip Ring – Power transfer from stationary Slip Ring – Power transfer from stationary PCB to rotating PCBPCB to rotating PCB– Uses carbon brushes against rotating brass rings to Uses carbon brushes against rotating brass rings to

transmit powertransmit power– 2.8 Vrms noise @ 30 Hz worst case2.8 Vrms noise @ 30 Hz worst case– 0.7 Vrms noise @ 30 Hz best case0.7 Vrms noise @ 30 Hz best case

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Schematic/Theory of OperationSchematic/Theory of Operation

• Main Power SuppliesMain Power Supplies– Upper BoardUpper Board

Power Input & Filter 5 V 3.0 Amp buck converter

3.3V LDO

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Schematic/Theory of OperationSchematic/Theory of Operation

• Upper Board Microcontroller (PIC24F)Upper Board Microcontroller (PIC24F)

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Schematic/Theory of OperationSchematic/Theory of Operation

• Infrared Red Emitter/DetectorInfrared Red Emitter/Detector

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Schematic/Theory of OperationSchematic/Theory of Operation

• LED Driver and LED connectionsLED Driver and LED connections

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Schematic/Theory of OperationSchematic/Theory of Operation

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Schematic/Theory of OperationSchematic/Theory of Operation

• RF Transceivers:RF Transceivers:– Wireless communicationWireless communication– 2.4 GHz band2.4 GHz band– SPI InterfaceSPI Interface– 1 Mbps data rate1 Mbps data rate

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Schematic/Theory of OperationSchematic/Theory of Operation• User Location Detection:User Location Detection:

1.2 GHz Oscillator

Amplifier

Handheld Transmitter

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Schematic/Theory of OperationSchematic/Theory of Operation• User Location Detection:User Location Detection:

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Schematic/Theory of OperationSchematic/Theory of Operation

• User Location Detection:User Location Detection:

RF Connector

1.2 GHz Bandpass Filter

Phase Detector/Comparator

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PCB LayoutPCB Layout

• Four PCB SegmentsFour PCB Segments– Lower Board (motor power circuitry, 1.2 Lower Board (motor power circuitry, 1.2

GHz RF circuit, power supply)GHz RF circuit, power supply)– Upper Board (power circuitry, PIC Upper Board (power circuitry, PIC

microcontroller)microcontroller)– LED Post (RGB LEDs and LED drivers)LED Post (RGB LEDs and LED drivers)– Transmitter (oscillator, antenna)Transmitter (oscillator, antenna)

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PCB LayoutPCB Layout

• Lower BoardLower Board

4.7”x4.7”4.7”x4.7”

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PCB LayoutPCB Layout

• Upper BoardUpper Board

3.7”x3.0”3.7”x3.0”

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PCB LayoutPCB Layout

• LED PostLED Post

5.3”x2.0”5.3”x2.0”

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PCB LayoutPCB Layout

• TransmitterTransmitter

2.0”x2.0”2.0”x2.0”

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Software Design/Development StatusSoftware Design/Development Status

• Stationary Micro Software FunctionsStationary Micro Software Functions– Control OLED screen and accept input Control OLED screen and accept input

from pushbuttonsfrom pushbuttons– Allow user to navigate a menu and select Allow user to navigate a menu and select

optionsoptions– Read analog phase detection and Read analog phase detection and

temperature datatemperature data– Generate new pixel mapsGenerate new pixel maps– Send pixel map data to upper microSend pixel map data to upper micro

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Software Design/Development StatusSoftware Design/Development Status

• Upper Micro Software FunctionsUpper Micro Software Functions– Use external interrupt to determine “0°”Use external interrupt to determine “0°”– Use IR pulses and timer to calculate Use IR pulses and timer to calculate

rotational speed and stabilityrotational speed and stability– Read and store data from RF transceiverRead and store data from RF transceiver– Shift data out to the LED drivers at precise Shift data out to the LED drivers at precise

timestimes

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Software Design/Development StatusSoftware Design/Development Status

• Lower MicrocontrollerLower Microcontroller– User interface started and minimally User interface started and minimally

workingworking– The rest is in progressThe rest is in progress

• Upper MicrocontrollerUpper Microcontroller– Have PIC24F development board and all Have PIC24F development board and all

software in progresssoftware in progress– No milestones yetNo milestones yet

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Project Completion TimelineProject Completion Timeline

• Week 9 – Finish final schematic PCB and proof of partsWeek 9 – Finish final schematic PCB and proof of parts• Week 10 – Finish software architecture and flowWeek 10 – Finish software architecture and flow• Week 11 – Test software, build packaging and start solderingWeek 11 – Test software, build packaging and start soldering• Week 12 – Continue soldering and testing PCBWeek 12 – Continue soldering and testing PCB• Week 13 – Complete software, start packaging & debuggingWeek 13 – Complete software, start packaging & debugging• Week 14 – Continue construction and debuggingWeek 14 – Continue construction and debugging• Week 15 - Finish debugging and add final tweaksWeek 15 - Finish debugging and add final tweaks• Week 16 – Demonstrate a complete working projectWeek 16 – Demonstrate a complete working project

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Questions / DiscussionQuestions / Discussion