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ECE 361 HW 1

Konrad Nied

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Global Foundries

In partnership with ARM(Cortex-A12 processor), GlobalFoundries has been able to improve their 28nm-SLPHigh-K Metal Gate (HKMG) process technology.

Designers can achieve even higher performance bytrading off for lower power efficiency, depending on theirapplication needs.

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TSMC

TSMC uses advanced 193nm immersionphotolithography, performance-enhancing silicon straintechnology, and extreme low-k (ELK) inter-metaldielectric materials to support both the performance and

reliability required by today's advanced technologydesigns.

TSMC More-than-Moore technologies:

MR. ABCD

M-- MEMS (with mix signal and memory) and MCU(embedded Flash)R-- RF CMOSA-- Analog and

AutomotiveB-- BCDC-- CMOS image sensorD--High Voltage Driver

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UMC

In October 2008, UMC were the first foundry to deliverfully functional 28nm SRAM chips, and have proven incustomer silicon the High-k/metal gate solution used forthis technology node.

UMC's 28nm progress was also recognized by theindustry with the foundry being selected to present at the2009 IEDM on a hybrid High-k/metal gate approach.

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Cadence

Cadence Design Systems, Inc. has significantly reducedthe power consumption of its latest energy-friendly

ARM-based microcontroller unit (MCU) by 50 percentusing the complete Cadence mixed-signal low-power

design flow. According to Silicon Labs, the new EFM32Wonder Gecko, which incorporates an ARM Cortex-M4core, uses 50 percent less power than competitorsMCUs and extends battery life for applications running athigher temperatures. Targeting power-sensitive

applications such as smart energy and homeautomation, the microcontroller achieves low-poweroperation in both active and sleep modes.

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Synopsys

Was able to develop the first super speed

USB inter-chip interoperability

SSIC allows for low power while also

maintaining high performance of the usb 3.0

platform.

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Mentor Graphics Electrical Design

Software

Tesla motors was able to boost production

capabilities by using Mentors Capital

toolset for the design of their Electrical

control system and wire harnessmanufacturing.

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Intel

Intel has recently started leading the

development of Solid State devices to

speed computing power by remembering

what applications and data you mostcommonly use.

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AMD

Multi-core processing

State of the art technology allows for the

ability to put up to four cores on one single

chip

Hyper-transport Technology

Allows for faster communication between

circuits due to low latency times.

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www.arm.com

ARM products help power 95% of all

smartphones

ARM working to provide the most energy

efficient components for future use.

This is important as it will make products

more marketable while also being more

efficient.

http://www.arm.com/http://www.arm.com/

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www.nvidia.com

Nvidia working to use their chips to

emulate brain functions

Machine learning

Machine learning is about teaching machines

or computers to understand data, for

example, so they can recognize voices or

detect humans standing in front of a camera.

http://www.nvidia.com/http://www.nvidia.com/

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www.qualcomm.com

Snapdragon processors

On the cutting edge of processor technology

LTE Advanced

Can provide data rate wirelessly over 1GBPS

http://www.qualcomm.com/http://www.qualcomm.com/

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www.ti.com

Analog and embedded technologies

TI announced several large projects to increase its ability to deliver products whenand where customers need them. The first phases of RFAB in Richardson, Texas,introduced the industrys first 300-mm analog manufacturing facility. The acquisitionof a 200-mm wafer fab in Aizu-Wakamatsu, Japan, expanded TIs capacity in theregion. And TI opened its first manufacturing plant in China, a 200-mm fab inChengdu. Additionally, TI will benefit from National Semiconductors manufacturing

sites in Maine, Scotland and Malaysia. Each fab site has additional space availablefor expansion. These investments enable TI to deliver the lead times, performanceand volumes analog customers need to sustain their products five- to 20-year lifecycles.

http://www.ti.com/http://www.ti.com/

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Integrated circuit development

The current state of the art technological

advancements predict to have the width

down to the tens of nanometers by 2013.

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Future innovations

Over the course of the next 10 years, theindustry will continue to strive to push thebounds of fabrication possibilities to allow

for more and more width and transistoramounts on an individual chip. The advocation of nanotechnology and its use todrive the width amounts down to less than

20 nm proves this point. I envision futuretechnologies eventually driving this valuebelow 1 nm in the next 10-20 years.