ECE 300 Microprocessor

Project Using The

Texas Instruments MSP 430F449PZ Controller

Group members:Group members:William BohonWilliam Bohon

Steve BishopSteve Bishop

Ann TanAnn Tan

Marve MorrowMarve Morrow

Project OverviewProject Overview

1.1. Project AssignmentProject Assignment

2.2. Parts GatheringParts Gathering

3.3. First Group Meeting - Soldering First Group Meeting - Soldering PracticePractice

4.4. Board Construction:Board Construction: MSP430F449PZ ChipMSP430F449PZ Chip Capacitors and ResistorsCapacitors and Resistors

Project OverviewProject Overview JTAGJTAG More ComponentsMore Components LCD DisplayLCD Display StandoffsStandoffs Banana Jacks and WiresBanana Jacks and Wires

5.5. Programming the chipProgramming the chip6.6. TroubleshootingTroubleshooting7.7. Temperature SensorTemperature Sensor8.8. Completed BoardCompleted Board

Project AssignmentProject Assignment Students were assigned into groups and Students were assigned into groups and

group leaders were selected.group leaders were selected. The details of the project were explained The details of the project were explained

to group leaders after the lecture in which to group leaders after the lecture in which it was assigned.it was assigned.

Project equipment, including microscope Project equipment, including microscope and soldering equipment, were given to and soldering equipment, were given to each group for a limited amount of time.each group for a limited amount of time.

Group leaders contacted their team and Group leaders contacted their team and explained the project.explained the project.

Parts GatheringParts Gathering Parts were bought from the ECE parts Parts were bought from the ECE parts

store in Ferris Hall for $15.store in Ferris Hall for $15. MSP 430F449PZ samples were MSP 430F449PZ samples were

ordered online from Texas Instrument.ordered online from Texas Instrument. The most suitable sensor for the The most suitable sensor for the

project was researched.project was researched. Samples of sensors were ordered Samples of sensors were ordered

online through the website: online through the website: http://www.analog.com

Soldering PracticeSoldering Practice

Group members practiced soldering Group members practiced soldering on a provided practice board with the on a provided practice board with the extra MSP430 chip during the first extra MSP430 chip during the first group meeting.group meeting.

A couple of capacitors were also used A couple of capacitors were also used for practice.for practice.

Board Construction – Board Construction – MSP430 chipMSP430 chip

The MSP430F449PZ chip was soldered first The MSP430F449PZ chip was soldered first because it had the finest connections, and because it had the finest connections, and having other devices get in the way of its having other devices get in the way of its installation would have been difficult.installation would have been difficult.

Flux was applied to the pin connection Flux was applied to the pin connection points, and the chip was carefully aligned points, and the chip was carefully aligned with these pins using a microscope as aid.with these pins using a microscope as aid.

Pins were first soldered at the corners for Pins were first soldered at the corners for two reasons:two reasons: 1. To secure the aligned chip.1. To secure the aligned chip. 2. To stop excess heat from damaging the 2. To stop excess heat from damaging the

chip.chip.

Board Construction – Board Construction – Capacitors and ResistorsCapacitors and Resistors The 47k resistor was placed at R5.The 47k resistor was placed at R5. The non-polarized capacitors were The non-polarized capacitors were

installed to the following positions with the installed to the following positions with the following capacitance:following capacitance: C1 with 0.1 μFC1 with 0.1 μF C2 with 0.1 μFC2 with 0.1 μF C4 with 0.1 μFC4 with 0.1 μF C5 with 0.1 μFC5 with 0.1 μF C9 with 1.0 μFC9 with 1.0 μF C10 with 0.1 μFC10 with 0.1 μF

Board Construction – Board Construction – Capacitors and ResistorsCapacitors and Resistors

The polarized capacitors were placed The polarized capacitors were placed in C3 and C6, both having 10 μF in C3 and C6, both having 10 μF capacitance.capacitance. The Polarized capacitors were installed The Polarized capacitors were installed

after the JTAG connection was installed after the JTAG connection was installed because this allowed power to run because this allowed power to run through the board. With the power, through the board. With the power, polarity could be found with a voltmeter.polarity could be found with a voltmeter.

The positive end was connected to the The positive end was connected to the side of the capacitor with a dark stripe.side of the capacitor with a dark stripe.

Board Construction – Board Construction – JTAGJTAG

The JTAG was installed by soldering The JTAG was installed by soldering the pins on the back side of the the pins on the back side of the board. board.

A microscope was used to avoid A microscope was used to avoid soldering a connection between the soldering a connection between the pins and ground.pins and ground.

Board Construction –Board Construction – More Components More Components

Other components were soldered to Other components were soldered to the board:the board: Power switchPower switch Voltage RegulatorVoltage Regulator Five Volt Input PlusFive Volt Input Plus Slider SwitchSlider Switch Time CrystalTime Crystal

Board Construction – Board Construction – LCD DisplayLCD Display

Similar to the JTAG connector, this Similar to the JTAG connector, this was soldered on the back side of the was soldered on the back side of the board with care to avoid shorting board with care to avoid shorting pins with the ground.pins with the ground.

This was one of the last components This was one of the last components installed because the screen is installed because the screen is fragile.fragile.

Board Construction – Board Construction – StandoffsStandoffs

The standoffs were installed into The standoffs were installed into each corner.each corner.

This protects the back side of the This protects the back side of the board from being damaged by board from being damaged by keeping the board off its supporting keeping the board off its supporting surface.surface.

Board Construction – Board Construction – Banana JacksBanana Jacks

The banana jacks were drilled into The banana jacks were drilled into the top right part of the board.the top right part of the board. The red one was connected to Ja6, The red one was connected to Ja6,

which goes to an analog data pin of the which goes to an analog data pin of the MSP430 chip.MSP430 chip.

The black one was connected to ground The black one was connected to ground at Z3. Z3 was determined as ground by at Z3. Z3 was determined as ground by observing the lack of buffering between observing the lack of buffering between the port hole and the black ground on the port hole and the black ground on the back side of the board.the back side of the board.

Board Construction – Board Construction – WiringWiring

Wires were used to connect the Wires were used to connect the banana jacks to their portsbanana jacks to their ports

There was also a wire that grounded There was also a wire that grounded the resistors at C1, C2, and C3 to the the resistors at C1, C2, and C3 to the port hole Z5.port hole Z5.

Programming the ChipProgramming the Chip

The files The files lcd.c, lcd.h, delay.c, delay.h, demo.c, sensor.c. were copied to a computer directory from the ECE 300 website.

The 27–pin cable connector of the FET (Flash The 27–pin cable connector of the FET (Flash Emulation Kit) was connected to the parallel Emulation Kit) was connected to the parallel port of a computer, and the 14-pin connector port of a computer, and the 14-pin connector was connected to the JTAG port in order to was connected to the JTAG port in order to program the chip.program the chip.

Procedures shown in the manual were Procedures shown in the manual were followed.followed.

TroubleshootingTroubleshooting Our demo test message “888808888” revealed Our demo test message “888808888” revealed

that some of our LCD pixels were not showing up. that some of our LCD pixels were not showing up. The steps below were done for troubleshooting:The steps below were done for troubleshooting: Connections of the LCD on the board , and the Connections of the LCD on the board , and the

MSP430 on the board were checked.MSP430 on the board were checked. The cause was identified when the dead pixels The cause was identified when the dead pixels

lit up when pressure was applied to the pin lit up when pressure was applied to the pin connections on the right side of the MSP430 connections on the right side of the MSP430 chip.chip.

The problem was solved by re-soldering some The problem was solved by re-soldering some connections to these loose pin connections.connections to these loose pin connections.

Temperature SensorTemperature Sensor

The AD22103KT from Analog Devices.The AD22103KT from Analog Devices. This temperature sensor has three pins, as This temperature sensor has three pins, as

shown:shown:

Temperature SensorTemperature Sensor

The sensor was hooked up in the The sensor was hooked up in the following manner:following manner:

Vo to the red banana jack (port Ja6)Vo to the red banana jack (port Ja6) Vs to TP3 VCC (determined to be a 2.85 V Vs to TP3 VCC (determined to be a 2.85 V

source)source) GND to the black banana jack (Port Z3)GND to the black banana jack (Port Z3)

An additional wire was soldered to port An additional wire was soldered to port TP3 VCC for the Vs connection.TP3 VCC for the Vs connection.

Temperature SensorTemperature Sensor The formula for “sample” in sensor.c had to be The formula for “sample” in sensor.c had to be

modified in order to correctly output modified in order to correctly output temperature. temperature.

It initially output voltage.It initially output voltage. Using the formula below from the data sheet, Using the formula below from the data sheet,

the equation was found to be:the equation was found to be: TTAA = (41.35 * Vout – 8.929) degrees C = (41.35 * Vout – 8.929) degrees C

Where Vs is 2.85 V, and Vout was the Where Vs is 2.85 V, and Vout was the previous formula in sensor.c.previous formula in sensor.c.

Temperature SensorTemperature Sensor

TTAA = (41.35 * Vout – 8.929) degrees C = (41.35 * Vout – 8.929) degrees C

In the actual formula written to sensor.c, In the actual formula written to sensor.c, 8.929 is multiplied by 100 because the 8.929 is multiplied by 100 because the program shifts the decimal place to the program shifts the decimal place to the left by two. This was not needed in left by two. This was not needed in multiplying Vout because it was already multiplying Vout because it was already adjusted for the shifting.adjusted for the shifting.

The Completed BoardThe Completed Board