eBEAM TECHNOLOGY 101 - Applied Materials€¦ · IMAGING TECHNOLOGY Employs electron collection,...

1
CORE eBEAM CAPABILITIES PRODUCTIVITY Defined by the throughput, a key criterion for volume production. IMAGING TECHNOLOGY Employs electron collection, contrast, wide range of landing energies, charge control, and multiple imaging modes. PERFORMANCE The product of resolution, sensitivity, accuracy, and precision. eBEAM TECHNOLOGY 101 WHY is eBeam needed? eBeam Optical 1xnm WHAT is eBeam used for in semiconductor manufacturing? Metrology Defect review and analysis Defect inspection HOW does eBeam work? Magnetic Lens Electrostatic Lens Electron source is shaped by lenses to a beam Beam scans the wafer Detector captures emitted electrons Image generated for application- specific processing Sub-nanometer resolution, imaging to expedite ramp, optimize yield New materials Greater process complexity Tighter process windows Anode Emitted Electrons Beam Direction Condenser Aperture Objective Wafer In-Column Detector eBeam Image of Line Cut Defect

Transcript of eBEAM TECHNOLOGY 101 - Applied Materials€¦ · IMAGING TECHNOLOGY Employs electron collection,...

Page 1: eBEAM TECHNOLOGY 101 - Applied Materials€¦ · IMAGING TECHNOLOGY Employs electron collection, contrast, wide range of landing energies, charge control, and multiple imaging modes.

CORE eBEAM CAPABILITIES

PRODUCTIVITYDefined by the throughput,

a key criterion for volume production.

IMAGING TECHNOLOGYEmploys electron collection, contrast, wide range of landing energies, charge control, and multiple imaging modes.

PERFORMANCEThe product of resolution, sensitivity, accuracy, and precision.

eBEAM TECHNOLOGY 101

WHY is eBeam needed?

eBeamOptical

1xnm

WHAT is eBeam used for in semiconductor manufacturing?

MetrologyDefect review and analysis Defect inspection

HOW does eBeam work?

Magnetic LensElectrostatic Lens

Electron source is shaped by lenses to a beam

Beam scans the wafer

Detector captures emitted electrons

Image generated for application- specific processing

Sub-nanometer resolution, imaging to expedite ramp, optimize yield

New materials

Greater process complexity

Tighter process windows

Anode

Emitted ElectronsBeam Direction

Condenser

Aperture

Objective

Wafer

In-ColumnDetector

eBeam Image of Line Cut Defect