복합칩 (SIP, MCP, TSV)에서 의Test Challenge · 2009-06-30 · "복합칩(SIP, MCP, TSV)에서...
Transcript of 복합칩 (SIP, MCP, TSV)에서 의Test Challenge · 2009-06-30 · "복합칩(SIP, MCP, TSV)에서...
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"복합칩 (SIP, MCP, TSV)에서의 Test Challenge"
Prepared by MY Cha
Date : 24.June.2009.
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미래 사회는 ?어떤 사회 ?
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What’s the complex Chip(SoC) ?
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What’s the complex Package(SoP) ?
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What is SOC and SOP ?
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Why System on Package ?
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What kind of SIP ?
Stacked or
Side-by-Side
Wirebond or
FlipChip
Package-in-Packageor
Package-on-Package
withDiscreet Passives & TSV
or Integrated Passive Devices
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Focused on test solutions for Application complex's
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How we Can test for SIP ?
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• Increasing product complexity, integration & density challenges cost effective single tester platform capabilities– Mixed signal, RF, Mixed technology– Multi die (Logic,analog/digital/memory)– Higher frequency
• Cost reduction requirements dominate– Yield characterization / test time reduction– Test insertion elimination using advanced data collection
tools– Cheaper cost/unit ATE solution– Handler - multi-site (Mass parallel)
How we Can test for SIP ?
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Application Conversion Status
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Why we need the Challenge for SIP test ?
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Why we need the Challenge for SIP test ?
1. Cost 증가2. Coverage rate 감소3. Higher cost due to multi
process.
1. Equipment cost increase2. Need 2 more test process3. Test time increasing to
multi die test with conversion application
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Test process Flow
Fab Process
Wafer out
Optical Wafer inspection
Wafer Sort
Packing
To Assembly site
Ass’y
Logic test
Memory Test
E/L QA for Memory
Return to Ass’y
⊙ 100% testing
⊙ 100% Testing
⊙ Sample plan: AQL 0.1%, A/R=0/1
System Level Test ⊙ 100% Testing (Optional : Based on Customer requirement for Their SiP and SoP)
Package stacking
⊙ Return to assembly after Logic test & Memory test under each tester.⊙To stacking process between top and Bottom package.
To BackendProcess
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Back End Process Flow
The “Backend” - after test, other processsteps may be required:
Lead Scan
Baking
Dry Pack
Tape & Reel (Optional)
Pack, Label & Ship
Finished Goods
Semiconductors
FVI (Optional)
FVI L/A
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Thank you!