Company Public – NXP, the NXP logo, and NXP secure connections for a smarter world are trademarks of NXP

B.V. All other product or service names are the property of their respective owners. © 2019 NXP B.V.

David Frerichs, Solutions Engineer Alexa Voice Services

Leo Azevedo, Senior Director NXP i.MX Product Marketing

Driving Video, Audio and Voice Solutions with the i.MX 8M Family of Multimedia Applications Processors

June 2019 | Session #AMF-SMH-T3515

COMPANY PUBLIC 1COMPANY PUBLIC 1

• Market Trends in IoT

• The i.MX 8 Series Roadmap

• The i.MX 8M Family Line-up

• Making It Easy for You

• Why You Should Choose NXP

Agenda

COMPANY PUBLIC 2

Market Trends in IoT

COMPANY PUBLIC 3

IoT Shifts to Consumer*

• As costs drop, consumer will dominate IoT

• Dependent on smart-home platforms:

− Smart speakers provide entry point for IoT

− Alexa going into alarms, appliances, door locks, lighting, thermostats and more

• In 2023, consumer totals 74% of market in connected appliances, smart home, wearables

Source: The Linley Group 2018

Smart

Home

Smart

Appliance

Wearables

Smart

Meters

Smart

Buildings

Other

Industrial

* Consumer IoT excludes traditional connected devices such as media players, smart TVs, smartphones, and PCs

IoT Market

COMPANY PUBLIC 4

Decora Voice™ Dimmer with Amazon Alexa Built-inPowered by i.MX 8M Mini

COMPANY PUBLIC 5

Six Most Popular Smart Home Devices*

• Networked cameras

• Video doorbells

− 25% of U.S. broadband households plan to buy a video doorbell in 2019

• Smart door locks

• Smart thermostat

• Smart lightbulbs

• Smart garage door opener

Owners of smart speakers with voice assistants (Amazon Echo, Google Home) are 3xmore likely to own a smart home device than consumers who do not

Multiple IoT devices in home is becoming common— among consumers who own a connected entertainment or smart home device, more than 60% have more than one

Source: Parks Associates 2019 Connected Home & Entertainment Trends * Found in 22% of U.S. broadband households

COMPANY PUBLIC 6

The i.MX 8 Series Roadmap

COMPANY PUBLIC 7

i.MX 8M Family of Applications Processors

M4

i.MX 7 Family

i.MX 8 Family

Safety Certifiable & Efficient Performance

Flexible Efficient Connectivity

ARM® v7-A

i.MX 8M family

i.MX 8X Family

Advanced Computing, Audio/Video & Voice

Advanced Graphics, Vision & Performance

i.MX 7ULP Family

Ultra Low Power with Graphics

ARM ® v8-A (32-bit/ 64-bit)

ARM® v7-A (32-bit)

i.MX 6QuadPlus

i.MX 6Dual

i.MX 6Solo

i.MX 6DualLite

i.MX 6SoloLite

i.MX 6SoloX

i.MX 6UltraLite

i.MX 6DualPlus

i.MX 6Quad

i.MX 6SLL

i.MX 6ULL

M4

A53

A72P

in-t

o-p

in C

om

pa

tib

le

So

ftw

are

Co

mp

atib

le

M4

A9

A9

A7

i.MX 8M

• 8M Quad

• 8M QuadLite

• 8M Dual

M4/M7

A53

A35

M4A7

So

ftw

are

Co

mp

atib

le

i.MX 6ULZ

ANNOUNCED

NOW

NOW

i.MX 8M Plus

In design

IN

DESIGN

i.MX 8M Mini

• 8M Mini Quad

• 8M Mini QuadLite

• 8M Mini Dual

• 8M Mini DualLite

• 8M Mini Solo

• 8M Mini SoloLite

i.MX 8M Nano

• 8M Nano Quad

• 8M Nano QuadLite

• 8M Nano Dual

• 8M Nano DualLite

• 8M Nano Solo

• 8M Nano SoloLite

i.MX 8M PicoIn design

CONCEPT

Pin

-to

-pin

Co

mp

atib

le

COMPANY PUBLIC 8

i.MX 8 Series: Target ApplicationsAdvanced graphics, video, image processing, vision, audio and voice

i.MX 8 Familyi.MX 8X Familyi.MX 8M Family M4

A53

GPU

Advanced Graphics,

Vision & Performance

Advanced Computing,

Audio/Video & VoiceSafety Certifiable &

Efficient Performance

M4A35

DSPGPU M4

A53A72

DSP

GPU

COMPANY PUBLIC 9

i.MX 8M Family: Expanding Performance, Efficiency,

Connectivity

9mW

Sleep Mode

2x CPU

Performance

14LPC FinFET: more performance, better efficiency

Applications <2-3W

75% less power in

deep sleep mode

60% less power

in run mode

Graphics

OpenGL ES 3.1, Vulkan

OpenCL 1.2

Quad Cortex-A53 up to 1.8MHz

plus Cortex-M4/M7 for task offload

and power optimizations

Video

4Kp60 decoder (HDR, Dolby Vision)

1080p60 encoder

Performance benchmark in Dhrystone with 6QP.

Support for new memory

types: LPDDR4 (12GB/s),

DDR4 plus DDR3L

New interfaces: USB 3.0, eDP, eARC

Immersive audio experience:

20+ channel high-fidelity

audio, multi-room music,

Dolby ATMOS certification

Quad-A53 plus Cortex-M4 and

Cortex-M7 for task offload and

power optimizations

Up to 2 TOPS ML acceleration

COMPANY PUBLIC 10

The i.MX 8M Family Line-up

COMPANY PUBLIC 11

i.MX 8M Family: Scalable Solutions for the Broad Market…Scalable series of three Arm V8 64-bit (/32-bit) based SoC Families in Production

(i.MX 8M Quad / i.MX 8M Mini) and Announced (i.MX 8M Nano)

Software Compatible (including GPU Tools)

i.MX 8M Nanoi.MX 8M Minii.MX 8M Quad

M4

A53

GPU

• Advanced Audio, Voice

• 4K Video, HDR

• 3D GPU with OpenCL

• Multi-Display and Camera

• USB 3.0, Multiple PCIe

• Advanced Audio, Voice

• 1080p Video Encode and Decode

• 3D GPU

• Single Display & Camera

• USB 2.0, PCIe

• Performance and Power-efficient

Pin Compatible

i.MX 8M Quad

i.MX 8M Dual

4Q’19

i.MX 8M

QuadLite

Pin Compatible 14x14 Package: Design Compatibility

i.MX 8M Mini

Quad/Dual/Solo

i.MX 8M Mini

QuadLite/DualLite/

SoloLite

M4

A53

GPU

High-end ($$$) => Mid-end ($$) => Low-end ($)

i.MX 8M Nano

Quad/Dual/Solo

M7

A53

GPU

• Low Cost Audio, Voice

• Video on Cortex-A53

• 3D GPU with OpenCL

• Single Display & Camera

• USB 2.0

• Performance and Power Efficient

NOW NOW

NANONANO

i.MX 8M Nano

QuadLite/DualLite/S

oloLite

COMPANY PUBLIC 12

W.I.N.N.E.R.S.! – The Championship Line Up

Winner 2019 Product of the year, Active Components NXP i.MX 8M

✓ Enriched User Experience

✓ Performance and Versatility

✓ High Speed Interfaces

More info: NXP Blog

COMPANY PUBLIC 13

Embedded World 2019: NXP Introduces i.MX 8M Nano Links to Coverage

NikkeiXTech: Low-power app processor with strong security,

NXP strong on audio

March 13, 2019

EETimes Japan: Conscious of edge inference, embedded

processor "i.MX 8M Nano”

March 8, 2019

EETimes, EETimes Asia: Edge Intelligence Grabs the

Spotlight at Embedded World

March 6, 2019

Lembarque: NXP completes i.MX 8M family of multimedia

processors with eco-efficient i.MX 8M Nano models

March 6, 2019

Forbes: NXP Proves That Smaller and More Secure Is

Better

March 5, 2019

ElectroniqueS: NXP Lowers the Consumption of its i.MX 8M

Processors

March 1, 2019

LinuxGizmos: NXP launches quad -A53 i.MX8M Nano SoC

with 600MHz Cortex-M7 MCU

February 28, 2019

ElectronicScienceKorea: NXP Launches i.MX 8M Family to

Accelerate Edge Computing Innovation

February 28, 2019

KoreaIndustryPost: You do not need to change processors

every time you develop new products

February 28, 2019

CNXSoftware.com: NXP i.MX 8M Nano is a Power-

optimized Arm Cortex-A53/M7 Processor

February 27, 2019

COMPANY PUBLIC 14

i.MX 8M Family Target ApplicationsConsumer &

Pro Audio Systems

• Portable audio devices

• Wireless or networked speakers

• Surround sound and sound bars

• Audio/video receiver

• Public address systems

• Smart Remote Controls

• Voice>Music>Video

Convergence

• Video doorbell

• Security and surveillance system

• Smart light control

• HVAC climate control

• IoT gateway

• Two-way video conferencing

• Smart appliances

• Control panel

• Digital sign

• Barcode or image scanner

• Industrial printer

• Ruggedized HMI

• Kiosk

• Machine visual inspection

• Image analytics

• Factory automation

• Test and measurement

• Two-way radio

• Mobility and logistics

• High-speed i/f conversion

• Smart appliance

• Service robot, e.g. vacuum,

mower, cleaner

• Camera and LCD

• Mobile patient care, e.g.

infusion pump, respirator

• Blood pressure monitor

• Activity/wellness monitor

• Exercise equipment

• IP phones

Consumer,

Healthcare, Other

Industrial HMI,

Vision and Automation

Home &

Building Automation

v

COMPANY PUBLIC 15

The i.MX 8M Quad Family is a Game Changer!• Industry-Leading Video and Audio

− Video quality with full 4K UltraHD resolution and HDR

▪ Dolby Vision, HDR10, and HLG

− Highest levels of pro audio fidelity, up to 20 channels

• Performance and Versatility− 1x-4x Cortex-A53 processors at speeds of up to 1.5

GHz per core, 1x Cortex-M for task offload

− Flexible memory options (speed, power, cost)

− Newest high-speed interfaces for flexible connectivity

− Configurations less than 2 to 3 Watts

• Basic to Advanced HMI Solutions− Industrial and consumer HMI

− Dual displays and camera inputs

− Immersive Audio and Video processing

− Voice Solutions (local and cloud connected)

− Interconnected Devices (smarter edge devices)

COMPANY PUBLIC 16

i.MX 8M Quad Key Features

• Scalable CPU Performance

− Dual, Quad Cortex-A53 up to 1.5 GHz

− Cortex-M4 up to 266 MHz

▪ Offload Tasks, Optimize Power, Increase Security

− HW based resource isolation & safe sharing

between Cortex-A and Cortex-M

− Enables concurrent execution of multiple software

environments to provide high performance with

real time responsiveness

• High Performance at Low power

- Scalable power using mobile power architecture

• Independent power gate on each core

• Multiple Power Islands / Flexible clock gating

• DVFS support

- Support Cortex-M4 running with A53 and high-

speed modules power gated

- DDR3L, DDR4 and LPDDR4 high performance /

lower power memories

• Best In Class Multimedia Performance

− Up to 4K video decoding in h.265, h.264, VP9

− High Dynamic Range (HDR) support

− High Performance 3D Graphics Acceleration

▪ 32 GFLOPS

▪ OpenGL ES 3.1, Vulkan, OpenCL 1.2, and Open VG

support

- 20+ audio channel inputs/outputs

- 32-bit @ 384KHz interfaces (up to 768 KHz)

• Multiple High-Speed Interfaces

- Enabling Vision: 2x MIPI-CSI (4-lanes)

▪ Support 1080p30, 720p60, VGA at 60 fps

- Display

• HDMI 2.0a (up 4K), MIPI-DSI (4 lanes) (720p60)

- Connectivity

• 1x Gb Ethernet (MAC): AVB & IEEE 1588 for sync, and EEE for low power

• 2x USB 3.0 Type C/dual role with PHY (works as USB 3.0 or USB 2.0), 5Gbps

• 2x PCIe 2.0 (1-lane) with L1 substates (low power, fast wakeup)

COMPANY PUBLIC 17

i.MX 8M Family – In Production NowApplications Processors for Consumer and Industrial Applications

Video

ARM CPU

Cortex-A53 | Cortex-M4U

p t

o 1

3,8

00 D

MIP

S

So

ftwa

re C

om

pa

tibility

Dis

cre

te P

acka

ge

Op

tion

Pin

Com

patib

ility

• Single core GPU

• 4 Vec4 Shader

• Up to 64 GFLOPS

• OpenGL ES 3.0

• OpenCL 1.2

• 267 MTri / sec

• 1.6 GPix / sec

Connectivity I/ODisplay / Camera

• 20-channels

• 32-bits @

384KHz

• DSD512, TDM

• SPDIF Tx& Rx

• HDMI ARC

Audio I/O

• 2x USB3.0

(Type C)

• 2x PCIe

• 2x SDIO

• 1x GbE

3D GPU

• Decode:

4Kp60

H.265,

VP9

H.264,

VP8

• MIPI-DSI 4-lane

• 2x MIPI-CSI 4-lane

Streaming Media Voice Assistants Industrial IoT Edge Compute Machine VisionAI, Machine Learning

i.MX 8M Quad4x A53

ARM CPU

Cortex-A53 | Cortex-M4

i.MX 8M Dual 2x A53

Up

to

6,9

00 D

MIP

S• HDMI

ARM CPU

Cortex-A53 | Cortex-M4

4x A53

Up

to

13,8

00 D

MIP

S

i.MX 8M QuadLite

Video Connectivity I/ODisplay / Camera

Audio I/O3D GPU

Video Connectivity I/ODisplay / Camera

Audio I/O3D GPU

SAME AS

8M Quad

SAME AS

8M Quad

SAME AS

8M Quad

SAME AS

8M Quad

SAME AS

8M Quad

SAME AS

8M Quad

SAME AS

8M Quad

SAME AS

8M Quad

SAME AS

8M QuadNo Video

acceleration

COMPANY PUBLIC 18

i.MX 8M Quad

Planned to be added in the 10-year longevity program

Quad ARM Cortex-A53 @ 1.5+ GHz (13,800 DMIPS)

• ARM v8 Fully 64-bit capable

ARM Cortex-M4 @ 266 MHz for Low Power, Security

Package: FCBGA 17x17mm, 0.65mm pitch

Operating System targets: Linux OS, Android OS, FreeRTOS

Qualification for Consumer and Industrial applications

Feature Highlights:

• Security: DRM support for RSA, AES, 3DES, DES

• GC7000Lite 3D Graphics GPU (OpenGL ES 1.0, 2.0, 3.0, 3.1, Vulkan, and OpenCL 1.2)

• 4Kp60 Main, Main10 H.265/HEVC and VP9, 4Kp30 H.264 decoder

• High Dynamic Range Support: HDR10, Dolby Vision, HLG

• 1080p60 MPEG-2, MPEG-4p2, VC-1, VP8, RV9, AVS/AVS+, MJPEG, H.263 decoder

• High quality image resizing and graphics overlay

• Audio: S/PDIF Rx & Tx, 6x I2S/SAI (up to 20ch 32bit @ 384Khz support)

• Display Interfaces: 1x MIPI DSI (4-lane); 1x HDMI 2.0a Output with HDCP 2.2

• Camera Interfaces: 2x MIPI CSI2 input (4-lane each) with PHY

Connectivity

• 2x USB 3.0 Type C/dual role with PHY (works as USB 3.0 or USB 2.0)

• 1x Gb Ethernet (MAC): AVB & IEEE 1588 for sync, and EEE for low power

• 2x PCIe 2.0 (1-lane) with L1 substates (low power, fast wakeup)

• 4x UART, 4x I2C, 3x SPI

Memory

• x16, x32 LPDDR4/DDR4/DDR3(L) (up to 3200 Mtps)

• 2x SDIO3.0 / eMMC5.0 / SD 4

• Raw NAND controller (BCH62)

• Quad-SPI for fast boot from SPI NOR; with Execute in Place (XIP)

COMPANY PUBLIC 19

Power Efficient and Scalable

• 14LPC FinFET: higher performance at lower power.

• Cortex-A53: 1x, 2x or 4x cores, up to 1.8 GHz, optional hardware video codecs.

• Cortex-M: heterogeneous processing for task offload and power optimizations.

• Pin-compatibility provides drop-in scalable product performance using the same hardware design and minimal software changes.

Cost-optimized System Design

• Full-featured packages with cost-effective PCB design references (6-8 layer board design and no microvias).

• LPDDR4 for highest performance and lowest power, or DDR3L and DDR4 for lowest system cost.

• Direct connection of PDM microphones (no CODEC).

• Linux/Android/FreeRTOS BSP and solutions software.

Machine Learning, Multi-Media

• Cost-effective machine-learning & inference using Cortex-A53 or GPU.

• Up to 1080p60 video decoding (H.265, H.264, VP8/9) and 1080p60 video encoding (H.264, VP8).

• Integrated GPUs for 1080p media UI.

• 20+ audio channels and audio HW enhancements on some devices (e.g. ASRC).

Industrial Reliability, Supply

• -40C to 105C (junction) and Industrial-tier qualification (10yrs, continuous ON).

• Minimum 10 year supply longevity on commercial and industrial devices.

• Gigabit Ethernet with IEEE1588 and AVB support.

• Fanless design for reduced cost in high temperature environments.

Extreme, Cost-Effective Scalability for Media and Industrial IoT

NANO

COMPANY PUBLIC 20

i.MX 8M Mini & 8M Nano Applications ProcessorsPower-optimized, scalable, multi-core applications processors built in advanced

14nm LPC FinFET process

Video

Arm ® CPU

Cortex-A53 | Cortex-M4

So

ftwa

re C

om

pa

tibility

14

x1

4 0

.5m

m

Pin

Co

mp

atib

ility

Connectivity I/ODisplay / Camera

Audio I/O2D + 3D GPU

• 1080p60

Decode: H.265,

VP9 H.264, VP8

• 1080p60

Encode: H.264,

VP8

• MIPI-DSI 4-

lane

• MIPI-CSI 4-

lane

Streaming Media Voice Assistants Industrial and IoT Edge ComputeAI, Machine Learning

Lite - No HW

video acceleration

• 12Tx + 16Rx

I2S

up to 768kHz

• DSD512, TDM

• SPDIF Tx &

Rx

• 8-ch PDM MIC

• 2x USB 2.0

• 1x PCIe

• 3x SDIO

• 1x GbE

• x32

LPDDR4,

x16 DDR4,

x16 DDR3L

NANO

i.MX 8M Nano Quad

i.MX 8M Nano

QuadLite

i.MX 8M Nano Dual

i.MX 8M Nano

DualLite

i.MX 8M NanoSolo

i.MX 8M Nano

SoloLite

Video

Arm® CPU

Cortex-A53 | Cortex-M7

Connectivity I/ODisplay / Camera

Audio I/O3D GPU

• MIPI-DSI 4-

lane

• MIPI-CSI 4-

lane

• 10Tx + 10Rx

I2S

up to 768kHz

• DSD512, TDM

• SPDIF Tx &

Rx

• 8-ch PDM MIC

• ASRC

• 1x USB 2.0

• 3x SDIO

• 1x GbE

• x16

LPDDR4,

DDR4,

DDR3L

• 2 Vec4 Shader

• OpenGL ES

2.0/3.0/3.1

• OpenVG 1.1

• OpenCL 1.2

• Vulkan

• 1 Vec4 Shader

• OpenGL ES 2.0

• OpenVG 1.1

i.MX 8M Mini Quad

i.MX 8M Mini Dual

i.MX 8M Mini Solo

i.MX 8M Mini

QuadLite

i.MX 8M Mini DualLite

i.MX 8M Mini SoloLite

• A53 up to

1.8GHz

• Quad – 4x

A53

• Dual – 2x A53

• Solo – 1x A53

• M4 up to

400MHz

• No HW video

acceleration• A53 up to

1.5GHz

• Quad – 4x

A53

• Dual – 2x A53

• Solo – 1x A53

• M7 up to

600MHzLite - No HW

GPU graphics

acceleration

COMPANY PUBLIC 21

i.MX 8M Mini

External MemoryMultimedia

i.MX 8M Mini

System Control

Security

Secure JTAG

XTAL

3D Graphics: GC NanoUltra

1 shader, OpenGL ES 2.0

Smart DMA x3

Random Number

TrustZone

Secure Clock

eFuse Key Storage

DRM Ciphers

Temperature Sensor

Connectivity & I/O

Dual-ch QuadSPI (XIP)

1x PCIe 2.0 – 1-lane

1Gb Ethernet

(IEEE 1588, EEE & AVB)

1080p60 VP8, VP9, H.264, H.265 decoder

Main CPU Platform

NEON

32KB D-cache

FPU

32KB I-cache

512KB L2 Cache

Quad/Dual Corte-A53

NEON

32KB D-cache

FPU

32KB I-cache

Quad/Dual ortex-A53

NEON

32KB D-cache

FPU

32KB I-cache

Quad Cortex-A53

NEON

32KB D-cache

FPU

32KB I-cache

2x USB2.0 OTG + PHY

1080p60 VP8, H.264 encoder

Low Power, Security CPU

Cortex-M4

16KB I-cache

256KB TCM (SRAM)

16KB D-cache

x16-x32 LPDDR4-3000

DDR4-2400, DDR3L-1600

3x SDIO3.0/eMMC5.1/SD3.0

S/PDIF Rx & Tx,

5x SAI (12Tx + 16Rx I2S lanes)

Up to 49.152MHz BCLK

TDM, DSD512

32KB Secure RAM

MIPI-CSI 4-lane with PHY

MIPI-DSI 4-lane with PHY

8ch PDM Input

NAND Controller (BCH62)

2D Graphics: GC328Timer x6

PWM x4

Watchdog x3

PLLs

Target Timeline: Production (14x14) 1Q’19

Package: FCBGA 14x14mm, 0.5mm pitch

Operating Systems: Linux OS, Android OS, FreeRTOS

Qualification: for consumer (0 to +95C) and industrial (-40C to +105C, 10yr 24/7) applications

Longevity: 10yr longevity program

On-Chip RAM (OCRAM)

256KB OCRAM

4x UART 5Mbps

4x I2C

3x SPI

Feature Highlights:• Arm Cortex-A53 MPCore platform:

− Quad/Dual/Solo 1.6-1.8GHz

− 32KB/32KB I/D cache, 512KB L2 cache with ECC

− Media Processing Engine (MPE) with NEON

− Floating Point Unit (FPU) supports VFPv4-D16 architecture

− 64-bit Armv8-A architecture

• Arm Cortex-M4 platform:

− Up to 400MHz

− 16KB/16KB I/D cache, 256KB TCM

• On-Chip RAM: 256KB OCRAM

• External Memory Interface:

− 32/16-bit DRAM interfaces (LPDDR4-3000, DDR4-2400, DDR3L-1600)

− 8-bit NAND Flash supports raw MLC/SLC (BCH62, ONFi3.2)

− eMMC 5.1 Flash, SPI NOR Flash, FlexSPI with support for XIP

• Multimedia:

− 1080p60 VP9 Profile 0,2 (10-bit) decoder, HEVC/H.265 decoder, AVC/H.264 Baseline,

Main High decoder, VP8 decoder

− 1080p60 AVC/H.264 encoder, VP8 encoder

− GC NanoUltra 3D GPU, 1x shader, OpenGL ES 2.0

− GC328 2D GPU

− LCDIF display controller supports up to 2 layers of overlay, 1080p60

− Display: 1x MIPI DSI (4-lane) with PHY

− Camera: 1x MIPI CSI (4-lane each) with PHY

− Audio: Supports over 20 channels of audio. 5x SAI (12Tx + 16Rx external I2S lanes);

4Tx + 4Rx support 49.152MHz BCLK for 768KHz audio, all others 24.576MHz BCLK

(32-bit, 2-ch 384KHz, up to 32-ch TDM); DSD512

• Security:

− DRM support for RSA, AES, 3DES, DES

• Connectivity:

− 1x Gb Ethernet (MAC): AVB & IEEE 1588 for sync, and EEE for low power

− 1x PCIe 2.0 (1-lane) with L1 substates (low power, fast wakeup)

− 2x USB 2.0 OTG with PHY

− 4x UART, 4x I2C, 3x SPI

− 3x SDIO3.0 / eMMC5.1 / SD3.0

COMPANY PUBLIC 22

Feature Highlights:• Arm Cortex-A53 MPCore platform:

− Quad/Dual/Solo 1.2-1.5GHz

− 32KB/32KB I/D cache, 512KB L2 cache with ECC

− Media Processing Engine (MPE) with NEON

− Floating Point Unit (FPU) supports VFPv4-D16 architecture

− 64-bit Armv8-A architecture

• Arm Cortex-M7 platform:

− 600+ MHz

− 32KB/32KB I/D cache, 256KB TCM

• On-Chip RAM: 512KB OCRAM

• External Memory Interface:

− 16-bit DRAM interfaces (LPDDR4-3200, DDR4-2400, DDR3L-1600)

− 8-bit NAND Flash supports raw MLC/SLC (BCH62, ONFi3.2)

− eMMC 5.0/5.1 Flash, SPI NOR Flash, FlexSPI with support for XIP

• Multimedia:

− GC 7000UL 3D Graphics GPU, 2 shader core, OpenGL ES 3.1, Vulkan, OpenCL 1.2

− LCDIF display controller supports up to 2 layers of overlay, 1080p60

− Display: 1x MIPI DSI (4-lane) with PHY

− Camera: 1x MIPI CSI (4-lane each) with PHY

− Audio: Supports over 20 channels of audio. 5x SAI (10Tx + 10Rx external I2S lanes);

up to 49.152MHz BCLK for 768KHz audio (32-bit, 2-ch 768KHz, up to 32-ch TDM);

DSD512

− ASRC: 32 channels of very high quality, asynchronous audio sample rate conversion

• Security:

− DRM support for RSA, AES, 3DES, DES

• Connectivity:

− 1x USB 2.0 OTG with PHY

− 1x Gb Ethernet (MAC): AVB & IEEE 1588 for sync, and EEE for low power

− 4x UART, 4x I2C, 3x SPI

− 3x SDIO3.0 / eMMC5.1 / SD3.0

i.MX 8M Nano

Target Timeline: Production target 4Q’19 (14x14)

Package: FCBGA 14x14mm, 0.5mm pitch de-pop array

Operating Systems: Linux OS, Android OS, FreeRTOS

Qualification: for consumer (0 to +85C) and industrial (-40C to +105C, 10yr 24/7) applications

Longevity: 10yr longevity program

External MemoryMultimedia

i.MX 8M Nano

System Control

Security

Secure JTAG

XTAL

3D Graphics: GC 7000UL

2 shaders

OpenGL ES 2.0/3.0/3.1

Vulkan

OpenCL 1.2

Smart DMA x3

Random Number

TrustZone

Secure Clock

eFuse Key Storage

DRM Ciphers

Temperature Sensor

Connectivity & I/O

4x UART 5Mbps

Dual-ch QuadSPI (XIP)

1Gb Ethernet

(IEEE 1588, EEE & AVB)

Main CPU Platform

NEON

32KB D-cache

FPU

32KB I-cache

512KB L2 Cache

Quad/Dual Corte-A53

NEON

32KB D-cache

FPU

32KB I-cache

Quad/Dual ortex-A53

NEON

32KB D-cache

FPU

32KB I-cache

Quad Cortex-A53

NEON

32KB D-cache

FPU

32KB I-cache

1x USB2.0 OTG + PHY

Low Power, Security CPU

Cortex-M7

32KB I-cache

256KB TCM (SRAM)

32KB D-cache

x16 LPDDR4-3200

DDR4-2400, DDR3L-1600

3x SDIO3.0/eMMC5.0/5.1/SD3.0

S/PDIF Rx & Tx,

4x SAI (6Tx + 6Rx I2S lanes)

Up to 49.152MHz BCLK

TDM, DSD512

32KB Secure RAM

MIPI-CSI 4-lane with PHY

MIPI-DSI 4-lane with PHY

8ch PDM Input

NAND Controller (BCH62)ASRC

Timer x6

PWM x4

Watchdog x3

PLLs

Differences to i.MX 8M Mini

On-Chip RAM (OCRAM)

512KB OCRAM

4x I2C

3x SPI

COMPANY PUBLIC 23

i.MX 8M Mini & 8M Nano

14x14 Package DesignOptimized for size and system cost

• 14 x 14 mm BGA, 0.5mm pin pitch, 486 pins

• Depopulated array for lower manufacturing cost

− Use low cost drilled vias; no high-cost laser microvias

− 3.2 mil trace and space escape

• Layout for 6 to 8 layer PCB

− Optimized for LPDDR4 routing

▪ LPDDR4 expects 10+ year product longevity to support wide adoption by automotive market

• Optimized power placement

− Accommodates decouple caps under the BGA

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27

A VSSDRAM_D

QS0_P

DRAM_D

Q06

DRAM_D

M0

DRAM_D

Q00

ECSPI2_

SS0

ECSPI1_

MISO

ECSPI2_

MISO

MIPI_DSI

_D0_N

MIPI_DSI

_D1_N

MIPI_DSI

_CLK_N

MIPI_DSI

_D2_N

MIPI_DSI

_D3_N

MIPI_CSI

_D0_N

MIPI_CSI

_D1_N

MIPI_CSI

_CLK_N

MIPI_CSI

_D2_N

MIPI_CSI

_D3_N

PCIE_RX

N_N

PCIE_TX

N_N

PCIE_CL

K_N

USB1_D

N

USB2_D

N

PMIC_O

N_REQONOFF

RTC_XT

ALIVSS A

BDRAM_D

Q05

DRAM_D

QS0_NVSS

DRAM_D

Q07

DRAM_D

Q01

ECSPI1_

SS0

ECSPI1_

MOSI

ECSPI2_

MOSI

MIPI_DSI

_D0_P

MIPI_DSI

_D1_P

MIPI_DSI

_CLK_P

MIPI_DSI

_D2_P

MIPI_DSI

_D3_P

MIPI_CSI

_D0_P

MIPI_CSI

_D1_P

MIPI_CSI

_CLK_P

MIPI_CSI

_D2_P

MIPI_CSI

_D3_P

PCIE_RX

N_P

PCIE_TX

N_P

PCIE_CL

K_P

USB1_D

P

USB2_D

PPOR_B

RTC_XT

ALOVSS

24M_XTA

LIB

CDRAM_D

Q04VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS

24M_XTA

LO

JTAG_TR

ST_BC

DDRAM_D

Q03

DRAM_D

Q02

DRAM_A

C11

ECSPI1_

SCLK

I2C2_SD

A

I2C2_SC

L

I2C4_SC

L

MIPI_VR

EG_CAP

UART3_T

XD

PCIE_RE

SREFUSB1_ID USB2_ID

TEST_M

ODE

JTAG_M

ODD

EDRAM_D

Q14

DRAM_D

Q15VSS

DRAM_A

C10

ECSPI2_

SCLK

I2C1_SC

L

I2C3_SC

L

I2C4_SD

A

UART1_

RXD

UART2_T

XD

UART3_

RXD

USB1_TX

RTUNE

USB2_TX

RTUNE

PMIC_ST

BY_REQVSS

JTAG_TD

O

JTAG_TD

IE

FDRAM_D

M1

DRAM_D

Q08VSS

DRAM_A

C00

DRAM_A

C01

DRAM_A

C06

I2C1_SD

A

I2C3_SD

A

UART1_T

XD

UART2_

RXD

UART4_T

XD

UART4_

RXD

USB1_VB

US

USB2_VB

US

RTC_RE

SET_BVSS

JTAG_TC

K

JTAG_T

MSF

GDRAM_D

QS1_P

DRAM_D

Q09VSS VSS VSS VSS

VDD_PCI_

1P8VSS VSS VSS VSS

BOOT_M

ODE0

BOOT_M

ODE1G

HDRAM_D

QS1_NVSS

NVCC_ECS

PI

VDD_MIPI

_1P8

VDD_USB_

1P8VSS

CLKOUT

1CLKIN1 H

JDRAM_D

Q10

DRAM_D

Q11VSS

DRAM_A

C03

DRAM_A

C07

DRAM_A

C08VSS

VDD_DRA

MNVCC_I2C

NVCC_UAR

T

PVCC2_1P

8

VDD_MIPI

_0P9

VDD_MIPI

_1P2

VDD_PCI_

0P8

VDD_USB_

0P8NC_J18 VSS

NVCC_SNV

S_1P8

TSENSO

R_TEST_

OUT

TSENSO

R_RES_

EXT

VSSCLKOUT

2CLKIN2 J

KDRAM_D

Q13

DRAM_D

Q12VSS

DRAM_A

C02

DRAM_A

C14

DRAM_A

C09VSS

NVCC_DRA

M

NVCC_DRA

MVDD_VPU VDD_VPU VDD_SOC VDD_SOC

VDD_USB_

3P3VSS VSS

VDD_SNVS

_0P8

NAND_D

ATA02

NAND_D

ATA01VSS

NAND_D

ATA06

NAND_C

LEK

LDRAM_A

C05

DRAM_A

C04

NVCC_DRA

M

VDD_DRA

MVDD_VPU VSS VDD_VPU VDD_SOC VSS

VDD_ANA

_0P8VDD_SOC

NVCC_JTA

G

NAND_D

ATA05

NAND_C

E3_BL

MDRAM_A

C16

DRAM_A

C17

NVCC_DRA

MVSS VDD_VPU VDD_VPU VDD_SOC VSS NVCC_CLK

NAND_D

ATA04

NAND_C

E2_BM

NDRAM_A

C26

DRAM_A

C19VSS

DRAM_A

C12

DRAM_A

C13

DRAM_A

C15VSS

NVCC_DRA

M

NVCC_DRA

M

VDD_DRA

MVDD_VPU VSS VDD_SOC VDD_SOC VSS

VDD_ANA

_0P8VDD_SOC

VDD_24M

_XTAL_1P8

VDD_ANA

1_1P8VSS

NAND_A

LE

NAND_D

ATA03

NAND_C

E0_BVSS

NAND_D

ATA07

NAND_R

E_BN

PDRAM_V

REF

DRAM_Z

NVSS

VDD_DRA

M_PLL_1P

8

NVCC_DRA

M

VDD_DRA

M_PLL_0P

8

VDD_GPU VSS VSSVDD_ARM

_PLL_0P8

VDD_ANA

1_1P8VSS

NAND_D

ATA00VSS

NAND_R

EADY_B

NAND_C

E1_BP

RDRAM_R

ESET_N

DRAM_A

LERT_NVSS

DRAM_A

C32

DRAM_A

C33

DRAM_A

C27VSS

NVCC_DRA

M

NVCC_DRA

M

VDD_DRA

MVDD_GPU VSS VDD_ARM VDD_ARM VSS VDD_SOC VDD_SOC

VDD_ARM

_PLL_1P8VSS VSS

NAND_D

QS

SD1_RE

SET_B

SD1_STR

OBEVSS

NAND_W

E_B

NAND_W

P_BR

TDRAM_A

C34

DRAM_A

C35

NVCC_DRA

MVSS VDD_ARM VDD_ARM VDD_ARM VSS

PVCC1_1P

8

SD1_DAT

A3

SD1_DAT

A2T

UDRAM_A

C25

DRAM_A

C24

NVCC_DRA

M

VDD_DRA

MVDD_GPU VSS VDD_ARM VDD_ARM VSS VDD_SOC VDD_SOC

NVCC_NA

ND

SD1_DAT

A5

SD1_DAT

A4U

VDRAM_D

Q21

DRAM_D

Q20VSS

DRAM_A

C23

DRAM_A

C36

DRAM_A

C29VSS

NVCC_DRA

M

NVCC_DRA

MVDD_GPU VDD_ARM VDD_ARM VDD_ARM

NVCC_SAI

2NVCC_SD1 VSS NVCC_SD2

SD2_DAT

A3

SD2_DAT

A2VSS SD1_CLK

SD1_CM

DV

WDRAM_D

Q18

DRAM_D

Q19VSS

DRAM_A

C22

DRAM_A

C37

DRAM_A

C28VSS

VDD_DRA

MVDD_GPU

NVCC_GPI

O1VDD_ARM VDD_ARM VDD_ARM VDD_ARM

NVCC_SAI

5

NVCC_SAI

1VSS

NVCC_ENE

TSD2_CLK

SD2_CM

DVSS

SD1_DAT

A7

SD1_DAT

A6W

YDRAM_D

QS2_NVSS

NVCC_SAI

3VSS

VDD_ANA

0_1P8VSS

SD1_DAT

A1

SD1_DAT

A0Y

AADRAM_D

QS2_P

DRAM_D

Q17VSS VSS VSS VSS

VDD_ANA

0_1P8VSS VSS VSS VSS

SD2_CD_

BSD2_WP AA

ABDRAM_D

M2

DRAM_D

Q16VSS

DRAM_A

C20

DRAM_A

C21

DRAM_A

C38

GPIO1_I

O15

GPIO1_I

O12

PVCC0_1P

8

SAI5_RX

FS

SAI1_MC

LK

SAI1_TX

FS

SAI2_RX

C

SD2_DAT

A0

SD2_DAT

A1VSS

SD2_RE

SET_B

ENET_M

DIOAB

ACDRAM_D

Q22

DRAM_D

Q23VSS

DRAM_A

C30

SAI3_TX

FS

GPIO1_I

O14

GPIO1_I

O11

SAI5_RX

D3

SAI5_RX

D1

SAI5_RX

C

SAI1_TX

C

SAI2_RX

FS

SAI2_TX

D0

SAI2_RX

D0VSS

ENET_R

D3

ENET_M

DCAC

ADDRAM_D

Q27

DRAM_D

Q26

DRAM_A

C31

SAI3_MC

LK

GPIO1_I

O13

GPIO1_I

O10

SAI5_RX

D2

SAI5_MC

LK

SAI5_RX

D0

SAI2_MC

LK

SAI2_TX

C

SAI2_TX

FS

ENET_R

D2

ENET_R

D1AD

AEDRAM_D

Q28VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS

ENET_R

XC

ENET_R

D0AE

AFDRAM_D

Q29

DRAM_D

QS3_NVSS

DRAM_D

Q31

DRAM_D

Q25

SAI3_TX

D

SAI3_RX

D

SPDIF_E

XT_CLK

SPDIF_T

X

GPIO1_I

O09

GPIO1_I

O07

GPIO1_I

O05

GPIO1_I

O03

GPIO1_I

O01

SAI1_RX

D1

SAI1_RX

C

SAI1_RX

D3

SAI1_RX

D5

SAI1_RX

D7

SAI1_TX

D1

SAI1_TX

D3

SAI1_TX

D5

SAI1_TX

D7

ENET_T

X_CTL

ENET_T

D3

ENET_T

D1

ENET_R

X_CTLAF

AG VSSDRAM_D

QS3_P

DRAM_D

Q30

DRAM_D

M3

DRAM_D

Q24

SAI3_TX

C

SAI3_RX

C

SAI3_RX

FS

SPDIF_R

X

GPIO1_I

O08

GPIO1_I

O06

GPIO1_I

O04

GPIO1_I

O02

GPIO1_I

O00

SAI1_RX

D0

SAI1_RX

FS

SAI1_RX

D2

SAI1_RX

D4

SAI1_RX

D6

SAI1_TX

D0

SAI1_TX

D2

SAI1_TX

D4

SAI1_TX

D6

ENET_T

XC

ENET_T

D2

ENET_T

D0VSS AG

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27

COMPANY PUBLIC 24

i.MX 8M Mini Preliminary Power Measurements

Assumptions

• Power consumption use cases

have been measured using 4.9

GA Linux kernel.

• Further power optimizations will

be made with 4.14 GA Linux

kernel.

• Measurements have been taken

on the EVK, but require re-work

if the customer wishes to

reproduce the results.

• All power measurements have

been taken on typical process

silicon at room temperature

26C.

• Details on the use cases can be

found in the preliminary

application note posted on the

i.MX 8M Mini Alpha SharePoint.

0

500

1000

1500

2000

2500

DSM(11mW)

Idle(152m

W)

AudioPlaybac

k(345m

W)

Audio +Video

Playback

(1W)

GPU(MM07)(1.4W)

Coremark

(1.6W)

Stream(1.8W)

4-coreDhryst +VPU +Taiji

(2.3W)

NVCC_DRAM 1.762 37.507 91.315 256.824 308.923 64.542 434.085 323.289

VDD_GPU_VPU_DRAM 1.729 28.805 104.242 468.149 509.219 353.581 445.473 565.835

VDD_SOC 8.116 84.863 106.263 220.244 224.722 173.547 199.951 241.588

VDD_ARM 0 1.376 43.899 101.801 410.681 1036.201 765.193 1204.187

ME

AS

UR

ED

PO

WE

R (

MW

)

i.MX 8M Mini Power Consumption (Preliminary)

COMPANY PUBLIC 25

i.MX 8M Family for Industrial and Media IoT

Family Namei.MX 8M Quad/QuadLite

i.MX 8M Dual

i.MX 8M Mini Quad/QuadLite

i.MX 8M Mini Dual/DualLite

i.MX 8M Mini Solo/SoloLite

i.MX 8M Nano Quad/QuadLite

i.MX 8M Nano Dual/DualLite

i.MX 8M Nano Solo/SoloLite

Sample / Production In Production – www.nxp.com/imx8m In Production – www.nxp.com/imx8mmini Announced – Sample Q2-19 / Production Q4-19

Main CPU 2x or 4x Cortex-A53 @ 1.5 GHz, 1MB L2 1x, 2x or 4x A53 @ 1.6-1.8 GHz, 512KB L2 1x, 2x or 4x A53 @ 1.2-1.5 GHz, 512KB L2

MCU Cortex-M4 266MHz, 256KB TCM Cortex-M4 400MHz, 256KB TCM Cortex-M7 600+MHz, 256KB TCM

DDR x16/x32 LPDDR4/DDR4/DDR3L x16/x32 LPDDR4/DDR4/DDR3L x16 LPDDR4/DDR4/DDR3L

GPUGC7000Lite (4 shaders)

OpenGL ES 2.0/3.0/3.1, Vulkan, OpenCL 1.2

GC NanoUltra 3D (1 shader) + GC320 2DOpenGL ES 2.0

GC7000UL (2 shaders) (*)OpenGL ES 2.0/3.0/3.1, Vulkan, OpenCL 1.2

Security CAAM, RDC, TrustZone CAAM, RDC, TrustZone CAAM, RDC, TrustZone

AI/ML OpenCL CPU: 32 GOPS A53 OpenCL CPU, GPU: 32 GOPS

SRAM 128KiB + 32KiB 256KiB + 32KiB 512KiB + 32KiB

Display Features 4K HDR, DCSS, LCDIF LCDIF LCDIF

Display Interfaces 1x MIPI-DSI, HDMI 2.0a Tx (ARC) + eDP 1x MIPI-DSI 1x MIPI-DSI

HDR HDR10, HLG, Dolby Vision - -

Camera Interface 2x MIPI-CSI (4-lanes each) 1x MIPI-CSI (4-lanes) 1x MIPI-CSI (4-lanes)

Video Decode 4Kp60 HEVC H.265, VP9, H.264 (*), legacy 1080p60 HEVC H.265, VP9, H.264, VP8 (*) -

Video Encode - 1080p60 H.264, VP8 (*) -

Connectivity

Audio Interface 20 I2S TDM (32b @ 384kHz), S/PDIF Tx+Rx20 I2S TDM (32b @ 384kHz), S/PDIF Tx+Rx, 8ch PDM

DMIC input

12 I2S TDM (32b @ 384kHz), S/PDIF Tx+Rx, 8ch

PDM DMIC input, ASRC

Expansion IO 2x USB3.0 Type C, 2x PCIe Gen2 2x USB 2.0, 1x PCIe Gen2 1x USB2.0

Network/Storage 1x GbE, 2x SDIO/eMMC, Raw NAND, QSPI 1x GbE, 3x SDIO/eMMC, Raw NAND, QSPI 1x GbE, 3x SDIO/eMMC, Raw NAND, QSPI

Process Techology TSMC 28HPC Samsung 14LPC FinFET Samsung 14LPC FinFET

Qualification Commercial, Industrial Commercial, Industrial Commercial, Industrial

Packages 17x17mm, 0.65p 14x14mm 0.5p (no microvias)*pin-compatible with i.MX 8M Nano

14x14mm 0.5p (no microvias)*pin-compatible with i.MX 8M Mini

Blue text = difference

* Not available on “Lite” version

4Q’19

Pin Compatible

External Module Options for Wi-Fi/BT

COMPANY PUBLIC 26

Smart IoT Home Blocks

High Speed Interfaces

Smart Performance

Peripheral InterfacesLPDDR4,

DDR4 or

DDR3L

Audio

DACs

S/PDIF

MIPI DSI

PCIe

or SDIO

RGMII

SDIO

USB

SD Card

Wi-Fi

BT Combo

GbE PHY

USB TypeC

USB 2.0

Analog Audio

Up to 3000MTS

x16 or x32

4xCortex-A53

@1.8GHz

VPU

+

GPU

+

Audio

Interface

s

+

Camera

High

Speed

Interfaces

MIPI CSI

i.MX 8M Mini

COMPANY PUBLIC 27

Making It Easy for You

COMPANY PUBLIC 28

i.MX 8M Mini & 8M Nano Evaluation KitIn Production

Kit Contents

- i.MX 8M Mini/Nano Board (two

board stack comprising a compute

module plus base board). Compute

module not orderable separately.

- MIPI-DSI to HDMI cable.

- USB 3.0 to Type C cable.

- USB Type C power supply.

Compute Module: Overview

• NXP i.MX 8M Mini/Nano Quad

• Murata Wi-Fi Type 1PJ (QCA9377)

or 1MW (CYW43455)

• PMIC Rohm BD71847AMWV

• 2GB LPDDR4 or DDR4

• 16GB eMMC 5.1 or NAND

• 64MB QSPI Flash

• 8-layer PCB, No HDI

• Size 2”x2”

OS Support

• Linux, Android and FreeRTOS

BSPs from NXP

• Others: 3rd parties

Base Board: Overview

• Display Connector: 1x mini-

SAS MIPI-DSI

• Camera connector:1x mini-

SAS MIPI-CSI

• Audio DAC (WM8524)

• Microphone/headphone jacks

• 1x full-size SD/MMC card slot

• 10/100/1000 Ethernet port

(AR8031 Gigabit PHY)

• 1x USB 3.0 Type C

• Connectivity expansion

connector:

• M.2 connector (PCIe)

• Audio expansion connector:

• FPC 0.5mm pitch 60pin ZIF

• UART, I2S

• General purpose expansion

connector (RPI-like):

• UART, I2S

• NXP PN7150RPI board

supported via this interface

• Size 4.2”x4.2”

OV5640 5Mpix MIPI CSI Board

miniSAS based

MINISASTOCSI

Optional Add-ons

Base Kit: Compute Module + Base Board

i.MX 8M Mini Board

Part Numbers:

1. Config 1: 8MMINILPD4-EVK LPDDR4 / eMMC / Type1PJ (QCA9377) $399 (Now)

2. Config 2: 8MMINID4-EVK DDR4 / NAND / Type1MW (CYW43455) $399 (Availability in Q219)

3. Config 3: 8MNANOD4-EVK DDR4 / eMMC / Type1MW (CYW43455) $399 (Availability in Q419)

MIPI-DSI to HDMI

Connectivity• Murata Type 1PJ (QCA9377)

• Dual band 2.4G/5G

• 802.11a/b/g/n/ac (1x1)

• BT/BLE 4.1

• Murata Type 1MW (CYW43455)

• Dual band 2.5G/5G

• 802.11a/b/g/n/ac (1x1)

• BT/BLE 5.0

2 FLAVORS

OLED MIPI DSI Board

miniSAS based

5.5”, 1920 x 1080

MX8-DSI-OLED1

COMPANY PUBLIC 29

Alexa Voice ServicesGoogle Voice Assist

NXP i.MX 7D

2-Mic Dev Kit for Amazon AVS

Voice Solutions for China

NXP i.MX 8M

Largest Voice Solution

provider for Mandarin

Enabling Audio & Voice Processing at the Edge 1,2,3

“Voice control front end to grow at 29% CAGR (‘17-’22) in the Smart Home”

1. Source: Google Android Things developer website2. Amazon AVS developer website 3. Source: ABI Research

NXP Enabled

Smart Speakers

COMPANY PUBLIC 30

Kit Hardware Software

SOM + Baseboard: Pico-Pi i.MX8M Yocto 4.14 Linux

Mic Array: 2 Mic Voice HAT Alexa Device SDK & Wake Word

Antennae, Speakers + cables Audio Front End: SW based

Kit focus1) Easy out of box hardware set up

2) Detailed User Guide

3) Software set up simplified by

scripts to automatically install

3rd party libraries at runtime

NXP i.MX8M Development Kit for Amazon Alexa Voice

Service

COMPANY PUBLIC 31

Alexa Multi-Room Music

COMPANY PUBLIC 32

What is Alexa Multi-Room Music? (MRM)

Alexa, play jazz

music everywhere!

COMPANY PUBLIC 33

Why is MRM Important?

Customers love whole-home music experiences – they may expect your product

to have MRM when they purchase it, and could experience frustration if it

doesn’t.

COMPANY PUBLIC 34

Alexa Multi-Room Music

Interoperate with Echo Family

of Devices and other MRM-

enabled Alexa Devices

Direct interaction

Cloud-Controlled Speakers

Proprietary Multi-Room Music

Connect your cloud to Alexa using

Connected Speaker API skill

Implicit and explicit targeting

For Speakers, Soundbars, AVRs and Home Theater Systems

Options for Multi-Room Music (MRM)

COMPANY PUBLIC 35

Typical Device Interaction

AVS Client

Alexa, play Despacito!

Media Player

MSP

COMPANY PUBLIC 36

Alexa Targeted Music Playback

Media Player

AVS ClientMSP

AVS Client

Alexa, play Dubstep in the living room

Speaker name defined as

“Living Room” in Alexa App

COMPANY PUBLIC 37

Alexa Multi-Room Music

Media Player

AVS Client

MRM (Receiver)

Media Player

AVS Client

MRM (Receiver)

Media Player

AVS Client

Encrypted, encoded unicast from sender to receiver

MSP

AVS Client

Alexa, play Trap

Music downstairs!

MRM (Sender)

MRM (Receiver)Media

Player

All speakers defined as part of group “Downstairs”

COMPANY PUBLIC 38

Cloud-connected Speakers

3rd Party Sync

ReceiverMedia Player

Your Client

Your Sync

MSP

Your Cloud

AVS Client

3rd Party Sync

Receiver

Alexa, play my EDM

playlist in the back yard!

Your speakers defined as group “Back Yard”

COMPANY PUBLIC 39

Linux OS

ARM v7+ Processor +450 DMIPS

+40 MB RAM and +30 MB Flash

DAC sync’d to host processor clock

Low drift oscillator

Platform Considerations for MRM

COMPANY PUBLIC 40

MRM KPI – Group 2 Fail

COMPANY PUBLIC 41

MRM KPI – Group 1 Pass Room Level

COMPANY PUBLIC 42

Polk Audio added MRM with an OTA update

and customers were delighted!

Spotlight – Polk Audio Command Bar

COMPANY PUBLIC 43

Next Steps – MRM Links and Resources

• Contact solution providers with MRM experience – alexa.design/SP

• Experiment with MRM qualified development kits – alexa.design/devkits

• Ask your Amazon Point of Content for access to MRM resources

• Learn more at alexa.design/speakers and alexa.design/MRM

• New to AVS? Build your first prototype at alexa.design/avstutorials

COMPANY PUBLIC 44

Google Coral Dev Kit TPU + i.MX 8M

• Object Recognition

• Facial Recognition

• Gamming & Learning

• Full System on Board: SOC + ML + Connectivity all on

the board, running a derivative of Debian Linus (Mendel), so

you can run your favorite Linux tools with it.

• Direct ML Model Support: TFLite models can be

compiled and run on the Coral Dev. Board.

• Scale from Prototype to Production: The SOM can

be removed from the baseboard, ordered in bulk and

integrated into production hardware.

NXP and the NXP logo are trademarks of NXP B.V. All other product or service names are the property of their respective owners. © 2019 NXP B.V.