(DRAFT) OSEM Preliminary Design Document & Test Report

LASER INTERFEROMETER GRAVITATIONAL WAVE OBSERVATORY

LIGO Laboratory / LIGO Scientific Collaboration

LIGO-T050111-00-K Advanced LIGO UK July 2005

(DRAFT) OSEM Preliminary Design Document & Test Report

S. M. Aston / D. M. Hoyland

Distribution of this document:

Inform aligo_sus

This is an internal working note of the Advanced LIGO Project, prepared by members of the UK team.

Institute for Gravitational Research

University of Glasgow Phone +44 (0) 141 330 5884 Fax +44 (0) 141 330 6833

E-mail [email protected]

School of Physics and Astronomy University of Birmingham Phone +44 (0) 121 414 6447 Fax +44 (0) 121 414 3722

E-mail [email protected] Engineering Department

CCLRC Rutherford Appleton Laboratory Phone +44 (0) 1235 445 297 Fax +44 (0) 1235 445 843


Department of Physics University of Strathclyde

Phone +44 (0) 1411 548 3360 Fax +44 (0) 141 552 2891


http://www.ligo.caltech.edu/

http://www.physics.gla.ac.uk/igr/sus/

http://www.sr.bham.ac.uk/research/gravity/rh,d,2.html

http://www.eng-external.rl.ac.uk/advligo/papers_public/ALUK_Homepage.htm

mailto:[email protected]




http://www.ligo.caltech.edu/

http://www.physics.gla.ac.uk/igr/sus/

http://www.sr.bham.ac.uk/research/gravity/rh,d,2.html

http://www.eng-external.rl.ac.uk/advligo/papers_public/ALUK_Homepage.htm

Advanced LIGO UK LIGO-T050111-00-K

1 Introduction and Scope 4

1.1 Document Organization 4

1.2 System Overview 4

1.3 Acronym List 5

1.4 References 6

2 OSEM Mechanical Overview 7

2.1 Optical Sensor 8 2.1.1 Optical Sensor Properties 8 2.1.2 Sensor Study 8 2.1.3 Sensor Assembly 9

2.2 Electromagnetic Actuator 11 2.2.1 Actuator Properties 11 2.2.2 Actuator Assembly 12

2.3 Magnet and Flag Assembly 13

2.4 Mounting and Adjustment Assemblies 13

3 OSEM Electrical Overview 15

3.1 Interconnect Design 15 3.1.1 OSEM Connector 15 3.1.2 Flexi-Circuit 16 3.1.3 PEEK Pin-Plate 16

3.2 OSEM Cable Harness (Pigtail) 17 3.2.1 OSEM Mating Connector 17 3.2.2 SEI Mating Connector 17 3.2.3 OSEM Cable Harness (Pigtail) Lengths 17

3.2.3.1 IMC Triple Suspensions 18 3.2.3.2 OMC Triple Suspensions 18 3.2.3.3 RM Triple Suspension 18 3.2.3.4 ITM Quad Suspension 19 3.2.3.5 FM Quad Suspension 19 3.2.3.6 BS Quad Suspension 20 3.2.3.7 ETM Quad Suspension 20

4 OSEM Design Philosophy 21

4.1 Magnetic Materials Restriction 21

4.2 Pitch Adjustment Magnet (PAM) Provision 22

4.3 Unwanted Eddy Current Damping 23

4.4 Burn-In Tests 23 4.4.1 Degradation of Emitter Output 23 4.4.2 Breakdown of Coil Winding 24

4.5 Thermal Considerations 24

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5 UHV Requirements 25

5.1 Material List and UHV Conformance 25

5.2 OSEM Cleaning Procedure 26

6 OSEM Support Equipment 27

6.1 Automatic Test Equipment 27

7 Test Results 28

7.1 Off-Axis Emission 28

7.2 Emitter MTBF Results 28

7.3 Prototype OSEM Fabrication 29

7.4 Prototype OSEM Performance 30 7.4.1 Operating Range 30 7.4.2 Sensitivity Performance 31 7.4.3 In-Vacuum Thermal Test Results 32

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1 Introduction and Scope This document, which should be read in conjunction with reference [1], forms the preliminary design for the prototype OSEM work undertaken for Advanced LIGO Suspensions. The final section also details the results of testing carried out on a prototype OSEM device (Modified Hybrid OSEM). The OSEM electronics design (sensor electronics, coil drivers, cabling etc) is discussed elsewhere, see reference [2]. To summarize, this document focuses on the in-vacuum OSEM deliverables.

1.1 Document Organization

The document is organized as follows:

• Section 2, details the fundamental subsystems incorporated within the OSEM. The following subsections then go on to discuss the key mechanical assemblies in more detail.

• Section 3, discusses the development of the electronic aspects of the OSEM including the interconnection assembly and OSEM harness (pigtail).

• Section 4, describes the design philosophy that has driven OSEM development, such as magnetic constraints and thermal considerations etc.

• Section 5, lists all the materials required for construction of the OSEM and pigtail assembly, as well as its vacuum qualification status. The OSEM cleaning procedure is also illustrated.

• Section 6, discusses the automated test equipment that will accompany delivery of the noise prototype OSEMs.

• Section 7, reports on the results of testing undertaken on an OSEM prototype and associated parts.

1.2 System Overview

It is the function of the OSEM to provide optical sensing and electromagnet actuation to enable active control at various stages of the Advanced LIGO multiple stage pendulum suspensions. OSEMs provide low frequency damping of resonance’s (local control) and also allow a means to maintain arm lengths of the interferometer (global control).

An investigation has previously been carried out to determine the optimal sensing and actuation approach e.g. geometric shadow sensors vs. interferometric sensors. It was concluded that a hybrid damping scheme utilizing OSEMs and ECD would provide the best solution. This approach is documented in reference [3] and [4], with the review outcome in reference [5].

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1.3 Acronym List

ALUK Advanced LIGO UK

BS Beam Splitter

DRD Design Requirement Document

ECD Eddy Current Damping

ETM End Test Mass

FM Fold Mirror

ID Inner Diameter

ICD Interface Control Document

IMC Input Mode Cleaner

IRLED Infrared Light Emitting Diode

ITM Input Test Mass

LIGO Laser Interferometer Gravitational Wave Observatory

MTBF Mean Time Between Failure

OMC Output Mode Cleaner

OSEM Optical Shadow sensor and Electro-Magnetic actuator

PAM Pitch Adjustment Magnet

PD Photodiode

PM Penultimate Mass

PTFE Polytetrafluorethylene (Du Pont)

RM Recycling Mirror

SEI Seismic

SUS Suspensions Working Group

TBC To Be Confirmed

TBD To Be Determined

TO Transistor Outline

UHV Ultra High Vacuum

UIM Upper Intermediate Mass

UK United Kingdom

US United States

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1.4 References

(1) D. Coyne et al, “(ICD) Suspension, UK Scope – Suspension, US Scope ”, E050160-01

(2) D. Hoyland, “Electronics Preliminary Design & Test Report”, T050110-00-K

(3) K. Strain, “Input to the OSEM selection review decision”, T040110-01-K

(4) K. Strain, “Response to OSEM review points 2-5”, G040280-00-K

(5) P. Fritschel, “Report on Advanced LIGO OSEM Follow-Up Review”, L040074-00-E

(6) P. Fritschel “Characterization and comparison of a potential new local sensor”, T990089-00

(7) N. Lockerbie, “Measurement of LIGO Hybrid OSEM Sensitivity”, T040106-01-K

(8) N. Lockerbie, “Measurement of shadow-sensor displacement sensitivities”, T040136-00-K

(9) M. Barton, “Analysis of the sweet spot for the coil”, Mathematica Notebook

(10) M. Zucker, “LIGO Interferometer Electronics EMC Requirements”, E020986-01-D

(11) K. Strain, “Eddy current damping in OSEM bodies…”, T050102-00-K

(12) D. Coyne, “LIGO Vacuum Compatible Materials List”, E960050-B-E

(13) D. Coyne, J. Romie “Universal Suspension Subsystem DRD”, T000053-02

(14) D. Coyne, “Generic Requirement & Standards for Detector Subsystems”, E010613-01-D

(15) N. Lockerbie, “Radiation patterns from OP232 infrared LEDs”, T040210-00-K

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2 OSEM Mechanical Overview The work undertaken here builds upon previous work carried out by Caltech and the University of Glasgow on the controls prototype design (Hybrid OSEM). We intend to further develop this design to facilitate production and integration of similar, but modified units (Modified Hybrid OSEM) into the noise prototype suspensions.

The OSEM comprises of the following key assemblies:-

• Optical Sensor (incorporating IRLED emitter and PD detector)

• Electromagnetic Actuator (coir former and coil winding)

• Magnet and Flag Assembly

• Mounting and Adjustment

• Electrical Interconnect (sensor components, coil winding and OSEM interface connector)

These key assemblies are highlighted in Figure 1.

Figure 1: OSEM Assembly Model (magnet and flag not shown)

Coil Former Clamp Sensor Devices Electrical Interconnect

Mounting Locations

(×4)

Coil Former (front-face) Adjustment Assembly

Rear Isometric View Front Isometric View

Each of these subassemblies is discussed in more detail in subsequent sections. For further details regarding the OSEM local coordinate system, envelope dimensions, and mass properties refer to reference [1].

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2.1 Optical Sensor

Both Initial LIGO OSEMs and Hybrid OSEM sensor assemblies have employed Honeywell surface mount emitter / photodiode devices bonded into place with Ceramabond. However, associated with this approach are concerns regarding the optical misalignment, than can result from the Ceramabond curing process. The bonding process can also be considered as a time consuming and complex production task. We intend to alleviate the risk associated with this approach by instead considering using a standard TO metal can package. This would enable alternative mounting schemes to be investigated.

2.1.1 Optical Sensor Properties

The optical sensor shall have the following properties:-

• Target Sensing Range = 0.7 mm (peak-peak)

• Worst Case Noise (1-10Hz) = 3×10-10 m/√Hz

• Worst Case Noise (10-20Hz) = 1×10-10 m/√Hz

(n.b. noise figures given are in conjunction with the sensor electronics, see reference [1])

The science requirements driving these figures are discussed in references [3], [4] and [5]. Also, note that, the requirements given above, agree with the performance as demonstrated by the Hybrid OSEM in tests carried out by P. Fritschel (reference [6]), and recently by N. Lockerbie (reference [7]).

2.1.2 Sensor Study

A collaborator at the University of Strathclyde, Nick Lockerbie, undertook an investigation to identify alternative sensor components. Candidate leaded devices were actively sought, so long as they could achieve a level of performance at least equivalent to the Honeywell devises. Alternative flag geometries were investigated as well various optical schemes, such as light pipes and lenses etc. Another outcome of this work was that the Honeywell emitter device was identified as a likely candidate of excess noise at 1Hz (see reference [8]).

The scheme selected utilized an addition mask and lens integral to the emitter assembly to enhance its performance, see Figure 2 (figures reproduced from an ALUK report by N. Lockerbie - 27 August 2004).

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Figure 2: Sensor Scheme Selected

Optical Layout Sensitivity Performance

The outcome of the investigation was to propose the devices shown in Figure 3 as direct replacements for the Honeywell components.

Figure 3: Leaded Sensor Devices

• TO-18 Package

• Hermetically Sealed

• Steel Package

(n.b. cathode-to-case)

• TO-46 Package

• Hermetically Sealed

• Kovar Package

(n.b. anode-to-case)

IRLED Emitter (OP232) PD Receiver (BPX65)

2.1.3 Sensor Assembly

An initial intention of the Modified Hybrid OSEM design was to minimize the use of Ceramabond during construction, ideally to eliminate it entirely from the OSEM assembly process. Instead, the intention is to machine parts to known tolerances, so as to ensure confidence in the sensors alignment, performance and ease of assembly.

Electrical isolation requirements (see reference [1]) state that the device package should be insulated from its aluminum carrier and hence the rest of the OSEM structure. To ensure this requirement is met, each device is isolated form the carrier by a MACOR sleeve, into which the

9


device is push-fit. A recess machined in this MACOR part accommodates the flange and tag located on the leaded device packages. A flat machined on the MACOR outer diameter, which corresponds to an aperture (pin-hole) on the carrier enables the orientation of the device to be fixed during assembly (this also ensures that the anode & cathode are correctly orientated). This technique is employed in both the emitter and receiver carrier assemblies. Figure 4 shows the populated emitter carrier assembly and a part explosion of the emitter assembly components. Figure 5 shows the equivalent scheme for the receiver carrier assembly. (Note that, the only feature not shown is the 1064ηm filter coating. Options for its application are currently under investigation, such as applying the coating directly to the PD window TBD).

Figure 4: OSEM Emitter Carrier Assembly

Pin-hole Locator

PTFE Retainer

Mask

(1.4×4.5 mm)

∅ 0.185” (∅ 4.7mm) OP232

MACOR Sleeve

Phosphor Bronze Clip

∅ 0.248” (∅ 6.3mm) Glass Lens

Section through Emitter Carrier Assembly Emitter Part Explosion

Figure 5: OSEM Receiver Carrier Assembly

Pin-hole Locator MACOR Sleeve

∅ 0.189” (∅ 4.8mm) BPX65

PTFE Retainer

Section through Receiver Carrier Assembly Receiver Part Explosion

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The complete sensor assembly, and relative separation of the emitter and receiver sub-assemblies is shown in section in Figure 6.

Figure 6: OSEM Sensor Assembly

Emitter Carrier

0.19” 8 mm

Receiver Carrier

4.

Section through Sensor Assembly

2.2 Electromagnetic Actuator

The electromagnetic actuator for the Modified Hybrid OSEM is fundamentally based upon the existing Hybrid OSEM design. The dimensions of the coil former slot feature remain unchanged. Ceramabond is used during the assembly process for the Hybrid OSEMs, to secure the coil wire to the coil former and act as a strain relief.

2.2.1 Actuator Properties

Following are the properties of the electromagnetic actuator:-

• Wire Type = 32QML, as supplied by MWS Industries

(32 gauge copper wire + coating of polyimide-ML)

• Coil Inner Diameter = 0.656 inch (16.66 mm)

• Coil Length = 0.16 inch (4.06 mm)

• Number of Turns on Coil = 400

• Nominal Winding Tension = TBD

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Further characteristics, such as electrical properties, of the actuator coil are available in reference [1]. Figure 7 shows the key dimensions for the coil former. Note that the dimensions shown are equivalent to those for the Hybrid OSEM design.

Figure 7: Coil Former

2.2.2 Actuator Assembly

The approach taken is to use a dedicated PEEK part, the pin-plate, which allows the coil to be wound onto the former and fixed in place, without requiring Ceramabond. Figure 8 shows the coil former, coil and pin-plate assembly.

Figure 8: Coil Former and Coil Assembly

Coil Winding

PEEK Pin-Plate

Coil Former

Wind-off Pins

Normal to Front Face of Coil Former Profile of Coil Former

0.16”

0.656”

1.50”

Rear Isometric View

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2.3 Magnet and Flag Assembly

The operating point or ‘sweet-spot’ of the magnet and actuator coil remains the same as calculated for the Hybrid OSEM (reference [9]). However, since the separation between the sensor and actuator has changed for the new design, new flag dimensions are required. The proposed magnet and flag assembly is shown in Figure 9.

Figure 9: Magnet Flag Assembly

Magnet (∅ 10 × 10 mm)

Spacer (∅ 10 mm)

Magnet Centre Line

0.33” .4 mm(8 ) TBC

1.17” (29.79 mm)

TBC

Flag (∅ 3 mm)

Isometric View of Flag Assembly Section through OSEM and Flag Assemblies

2.4 Mounting and Adjustment Assemblies

Four mounting locations are available to secure the OSEM to the suspension. These mounts also allow some adjustment to be made in the x and y axes to locate the OSEM. This is described in more detail in the reference [1].

Adjustment is also required axially. The existing Hybrid OSEM design incorporates a “push-pull” assembly to enable the positioning of the coil former along the z-axis. The scheme utilizes 4 screw fixings, two of which react off the coil former bracket, the other two serve to lock the mechanism against the reacting screws, effectively clamping the coil former in place.

This existing baseline design provides a satisfactory solution but could be developed further. It is possible to remove two of the four screws from the adjustment assembly, whilst still retaining its functionality. For example, a machined shoulder on the coil former back-plate can be machined to an interference fit about a modified PTFE ‘nut’ which is free to travel along a threaded shaft. Figure 10 highlights the key features of this modified assembly. The advantage of this approach is that it makes the OSEM adjustment more intuitive and time saving, since there are only two adjustments to be made.

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Figure 10: Adjustment Assembly

Shoulder (×2) PTFE Adjustment

Nut

Threaded Shaft (5/32-40 ME)

Coil Former

Back-Plate

Rear Isometric View

The full axial adjustment range (peak-peak) catered for by this arrangement is 0.44 inches (11.18 mm). This can clearly be seen in Figure 11, where the distance between the plane of the front face of the coil former and the front face of the coil former clamp are coincident on the left figure and displaced on the right figure.

Figure 11: OSEM Axial Adjustment

0.44” 0.00”

Profile View of OSEM - Nominal Adjustment Profile View of OSEM - Maximum Adjustment

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3 OSEM Electrical Overview

3.1 Interconnect Design

The “interconnect” encompasses all of the circuit routing and connections required to link together the various electrical components of the OSEM, as well as provide an external interface connection. Figure 12 shows the interconnect assembly as well as the individual parts to be connected. For completeness, the sensor devices also have there Anode and Cathode denoted by A and K respectively. The start (S) and end (E) pins of the coil winding are also indicated.

Figure 12: Interconnect Assembly

PEEK Pin-Plate

Coil Winding

Flexi-circuit

Emitter (OP232)

Receiver (BPX65)

9W micro-D PCB connector

Wind-off PinsE

S

A

K

A

K

Rear Isometric View

3.1.1 OSEM Connector

The connector located on the OSEM head can be specified as follows:-

• Description: Right angle PCB mounting 9 way male Micro D

• Part Number (GlenAir): MR7590-9P-1BSN-MC225

Modification Code (MC) 225 denotes no marking

The pin-outs of this connector can be found in reference [1]. A materials list for this part can be found in section 5.1 of this document.

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3.1.2 Flexi-Circuit

A flexible circuit solution has been developed to replace the discrete wiring harness of the initial LIGO and Hybrid OSEMs. This flexi-circuit forms the foundation of the interconnect assembly. A conventional dual layer flexi-rigid composite circuit is utilized. However, in this application no rigid sections are necessary. A diagram of the multiple layers is shown in figure 12. This double sided structure is approximately 210µm thick.

Figure 13: Flexi-Circuit Multi-Layer Structure

Kapton (25µm) Coverlay

(DuPont LF0110) Adhesive (25µm)

Copper (18µm)

Adhesive (25µm) Copper Clad Laminate

(DuPont LF8515) Kapton (25µm)

Adhesive (25µm)

Copper (18µm)

Coverlay Adhesive (25µm) (DuPont LF0110)

Kapton (25µm)

3.1.3 PEEK Pin-Plate

The PEEK pin-plate’s primary function is to retain the coil wind-off pins, whilst maintaining that they remain isolated from the aluminum coil former.

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3.2 OSEM Cable Harness (Pigtail)

3.2.1 OSEM Mating Connector

The connector mating to the OSEM head can be specified as follows:-

• Description: Straight solder cup 9 way female Micro D

• Part Number (GlenAir): DCDM9S-S-MC194-216-225-240

Modification Code (MC) 194 denotes low profile socket-head jackscrew

Modification Code (MC) 216 denotes part supplied without gasket

Modification Code (MC) 225 denotes no marking

Modification Code (MC) 240 denotes electroless nickel plated shell


3.2.2 SEI Mating Connector

The connector mating to the SEI Table can be specified as follows:-

• Description: Straight solder cup 25 way male Micro D TBC

• Part Number: VAC 25MICRO-25DSUB TBC


3.2.3 OSEM Cable Harness (Pigtail) Lengths

Cable harnessing shall comply with the requirements of reference [10] where appropriate. Each cable harness shall have the following properties:-

• Cable Type: CZ1104 Clear Teflon Coated Copper Wire TBC

• Outer braided shield: None due to stiffness requirement TBC

Cables are to be manufactured to suit the locations of OSEMs within the suspension stages of the 6 TBC different suspension designs. Details in the following sections are TBD pending completion of suspension designs and cable routing proposals. It is expected that there will be no more than TBD different cable lengths.

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Cable clamping details and locations are to be agreed with the SUS design team. Note that any cable lengths given below are the most direct route (no clamping) to the top of the suspension (SEI Table).

3.2.3.1 IMC Triple Suspensions

OSEM Location

Qty OSEM Type

Cable Length

Cable Drawing

Top Mass 6 Modified Hybrid

TBD TBD

Penultimate Mass 4 Initial LIGO TBD TBD

Bottom Mass 4 Initial LIGO TBD TBD

Table 3.2.3.1-1

3.2.3.2 OMC Triple Suspensions

OSEM Location

Qty OSEM Type

Cable Length

Cable Drawing


TBD TBD



Table 3.2.3.2-1

3.2.3.3 RM Triple Suspension

OSEM Location

Qty OSEM Type

Cable Length

Cable Drawing


TBD TBD



Table 3.2.3.3-1

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3.2.3.4 ITM Quad Suspension

OSEM Location

Qty OSEM Type

Cable Length

Cable Drawing


500 mm TBC TBD

Upper Intermediate Mass

4 Modified Hybrid

859 mm TBC TBD

Penultimate Mass 4 Initial LIGO 1214 mm TBC TBD

Table 3.2.3.4-1

Notes regarding ITM Quad suspension:-

• Cable length will be split by one in–line 25 way micro D connector to allow suspension to be assembled in 2 sections. The additional split being required for the UIM and PM

• If Initial LIGO OSEMs are to be utilized for the PM (see section 4.3), then a harness adapter is required to interface a 9 way micro D to their existing “pin-plate”. Alternative options can also be considered. TBC

• For noise prototypes, PM OSEMs capable of utilizing both sensor & actuator will be provided

3.2.3.5 FM Quad Suspension

OSEM Location

Qty OSEM Type

Cable Length

Cable Drawing


500mm TBC TBD

Intermediate Mass 4 Modified Hybrid

859mm TBC TBD

Table 3.2.3.5-1

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3.2.3.6 BS Quad Suspension

OSEM Location

Qty OSEM Type

Cable Length Cable Drawing


500mm TBC TBD

Intermediate Mass 4 Modified Hybrid

859mm TBC TBD

Table 3.2.3.6-1

3.2.3.7 ETM Quad Suspension

OSEM Location

Qty OSEM Type

Cable Length Cable Drawing


TBD TBD

Upper Intermediate Mass

4 Modified Hybrid

TBD TBD


Table 3.2.3.7-1

Notes regarding ETM Quad suspension:-

• Cable length will be split by one in–line 25 way micro D connector to allow suspension to be assembled in 2 sections. The additional split being required for the UIM and PM

• If Initial LIGO OSEMs are to be utilized for the PM (see section 4.3), then a harness adapter is required to interface a 9 way micro D to their existing “pin-plate”. Alternative options can also be considered. TBC

• For noise prototypes, PM OSEMs capable of utilizing both sensor & actuator will be provided

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4 OSEM Design Philosophy

4.1 Magnetic Materials Restriction

The use of magnetic materials in the construction of the OSEM shall be restricted to ensure that the residual actuation force (with actuator coil unbiased and actuator magnet positioned on the OSEM z-axis in line with the front face of the coil former) is less than 5mN.

Measurements taken of the magnetic coupling between the metallic packages of the sensor components and the front face of a ∅10 mm × 10 mm Nd-B-Fe Nickel plated magnet are shown in Figure 14.

Figure 14: Sensor and Actuator Magnetic Coupling

0.0

10.0

20.0

30.0

40.0

50.0

60.0

70.0

80.0

90.0

100.0

10 12 14 16 18 20 22 24Separation (mm)

Forc

e (m

N)

OP232OP232 & BPX65

Dimensions taken from the current Modified Hybrid OSEM design incorporate 1.126 inch (28.6 mm) separation between the front face of the coil former and the outer diameter of the sensor package, as shown in figure 15.

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Figure 15: Sensor and Actuator Separation

1.126” (28.6 mm)

Emitter Device

Section through Coil Former

4.2 Pitch Adjustment Magnet (PAM) Provision

The request has been made to include the provision to be able to retro-fit PAM screws to the Modified Hybrid OSEM if necessary. It is envisaged that the PAM screw assembly will mount on the rear of the coil former in a similar fashion to how they have been intended to attach to the Initial LIGO OSEMs.

However, even though the length of the new coil former is similar to that of the initial LIGO coil former, the separation between the sensor and actuator has now increased. Initial LIGO PAMs used small (approximately ∅3 mm) magnets, with an operating point approximately 10 mm away from the front face of the magnet / flag assembly. The proximity of the PAM magnet and magnet / flag assembly are restricted in our scheme by the sensor assembly. Hence, a larger aperture has been opened out at the rear of the Modified Hybrid OSEM design, in the coil former back-plate, as can be seen in Figure 16. This is to accommodate a large (∅10 mm) PAM magnet if necessary. Measurements suggest a bias force of approximately 100mN is achievable, at closest approach between two ∅10 mm × 10 mm magnets.

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Figure 16: PAM Screw Provision

Coil Former Back-Plate Emitter Carrier

0.41” (10.41 mm)

1.42” (36.7 mm)

ID 0.46” 11.7 mm

PAM Fixings (3 × 2-56 UNC)

Rear Isometric View Section through Coil Former and Back-Plate

4.3 Unwanted Eddy Current Damping

It has been documented by K. Strain (reference [11]), that at the penultimate stage, aluminum OSEM bodies provide an unwanted level of eddy current damping. Calculations show that an insulating coil former is required, i.e. similar to the Initial LIGO OSEM design. However, there is no concern about the amount of unwanted eddy current damping at any other stages.

The baselined approach is therefore to use Initial LIGO OSEMs at the penultimate stages of the ITM / ETM quad suspensions TBC. The alternative solution would be for the UK to provide a variant of the Modified Hybrid OSEM with a non-conducting coil former. For example, alternative materials could include MACOR or alumina. However, we foresee that the baselined scheme would provide the preferred ‘lowest-risk’ approach.

4.4 Burn-In Tests

4.4.1 Degradation of Emitter Output

Degradation of the sensor output can be attributed to the degradation of the emitter’s optical output power with time. MTBF testing has also indicated that there is a spread in ‘of-the-shelf’ device-to-device output power (see section 7.1).

The burn-in process ‘over-rates’ the devices by running them at their maximum specified forward current of 100mA i.e. above the nominal operating value of 35mA. The duration of the burn-in

23


process is TBD. This burn-in process minimizes the risk of premature OSEM failure by also providing a test for infant mortality of the devices. The format of this test is TBD.

4.4.2 Breakdown of Coil Winding

For previous OSEM design, concerns have been raised over the breakdown of the coil winding insulation. It is therefore required that ‘burn-in’ tests are carried out on the wound coil former to immediately identify any failures. The format of the burn-in test is that a high potential (approximately 1kV TBC) is applied across the coil for a duration of TBD.

However, on the fully assembled Modified Hybrid OSEM, the maximum potential that can be applied across the coil winding is limited by the breakdown voltage specified for the micro D connector, i.e. 300V. (Will this be sufficient? TBD)

4.5 Thermal Considerations

The OSEM shall function under the following environmental conditions:-

• Operational Temperature: 220C (nominal ambient) TBC

• Seasonal Variation: 20C (between sites) TBC

The Maximum dissipation from the OSEM shall be as follows:-

Item Maximum Dissipated Power Notes Coil 380mW At 150mA continuous forward current

IRLED 50mW At 35mA continuous forward current

Table 4.5-1

Note: The Detector diode dissipation is considered negligible

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5 UHV Requirements

5.1 Material List and UHV Conformance

Table 5.1-1 following, lists all materials used in the OSEM manufacture, including connectors, electronic components and cable harness (pigtail). Reference [12] provides a list of LIGO compatible materials and reference [13] gives details of the queue for acceptance testing.

Item Material Where Used

Vacuum Review Board Approval

Status 1 Beryllium Copper

(ASTM-B194) Male Connector

Approved

2 Phosphor Bronze (ASTM 139)

Female Connector and Sensor Lens Carrier

Approved

3 Gold

(ASTM-B488)

Connector pin/socket Plating

Approved

4 Aluminium (Alloy 6062)

Connector Body, Coil Former, Mounting Plates

Approved

5 Electroless Nickel

(ASTM B733-90,SC2,Type 1, Class J

(MIL-C-26074)

Connector Body Finish

Approved

6 LCP (MIL-M-24519) Connector Insulators and Inserts

Approved TBC

7 Hysol Epoxy #4215 (Black)

Connector Encapsulant

Approved TBC

8 Stainless Steel (300 per SAE-AMS-QQ-S-763)

Connector Jackscrews and Posts

Approved

9 Copper Wire (32QML) Coil Winding 32HML (iLIGO Approved) TBD

10 Copper Wire (CZ1104) Pigtail Approved (initial LIGO)

11 Kapton (LF0110)

Copper Clad (LF8515)

Flex Rigid PCB

TBD

12 PEEK 450G Winding Post Retainer

TBD

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13 Teflon PFA-440HP (DuPont)

Sensor Carrier Locking Ring

Approved (initial LIGO)

14 Titanium Adjustment Assembly and Sensor Carrier

Approved

15 Brass / Tin Actuator Coil wind-off Pin

TBD

16 OP232 IRLED Approved TBC

17 BPX65 PD Approved TBC

Table 5.1-1

5.2 OSEM Cleaning Procedure

The cleaning procedure proposed for the noise prototype OSEM is as follows:-

• Pre-clean all parts (ultrasonic bath)

• Kapton wire to be wiped with Isopropyl alcohol (IPA) during winding onto the coil former

• Wound coils (and coil former) are to be vacuum baked (approximately 200C) and RGA checked (this process could possibly be undertaken by LIGO TBD)

• LED emitter and PD receiver vacuum baked at a lower temperature

• Other metal parts baked at high temperature

• OSEMs assembled according to UHV handling procedures

• The completed assemblies are low temperature vacuum baked and RGA checked upon arrival at LIGO

(n.b. the above procedure is not consistent with the cleaning procedure as presented in references [13] and [14]. TBC).

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6 OSEM Support Equipment

6.1 Automatic Test Equipment

Due to the volume of devices to be manufactured, finished product setup and test will be assisted by a PC based automated test system. The system will measure and record the following parameters:-

• Actuator Winding Inductance

• Actuator Winding Self Capacitance

• Actuator Winding Resistance

• Actuator Winding isolation to OSEM body

• Sensor Current Transfer Ratio

• Sensor Emitter isolation to OSEM body

• Sensor Detector isolation to OSEM body

Test results will be provided with the finished product.

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7 Test Results

7.1 Off-Axis Emission

The potential issue of OP232 IRLEDs radiating with appreciable off-axis beam patterns has been raised and addressed in a report by N. Lockerbie (reference [15]). The outcome of this investigation was that the IRLEDs off-axis emission is not a concern.

7.2 Emitter MTBF Results

Ongoing work, undertaken by Nick Lockerbie at the University of Strathclyde, has involved MTBF testing of the IRLED (OP232) devices. The manufactures (Optek) commercially sensitive reliability data has been made available, but not to a wide audience TBC.

Figure 17 (figure reproduced from an ALUK report by N. Lockerbie - 27 August 2004) shows the apparatus currently in use to test the ensemble of 24 devices.

Figure 17: MTBF Testing Apparatus

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Figure 18: MTBF Test Results

Figure 18 (figure reproduced from an ALUK report by N. Lockerbie - 29 June 2005) shows the degradation of the induced mean photocurrent in the 24 x BPW34S’s over the first 7000 hours. At the present time, after over 7370 hours of running, the mean photocurrent induced in the photodiodes has now fallen to 70% of the 'day 1' value. Note that, none of the devices has failed to-date.

7.3 Prototype OSEM Fabrication

To enable a function and fit check of the Modified Hybrid OSEM design, a prototype device has been fabricated and assembled. This prototype device will enable us to assess the ‘new’ features of the design (e.g. the revised adjustment assembly) and also allow us to verify the sensitivity performance (and operating range) of the sensor.

Figure 19, shows the pictures of the fully assembled coil former and OSEM assemblies. It should be noted that the prototype construction did not use oversize taps in aluminum parts, as will be required for the noise prototype devices (reference [13]).

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Figure 19: OSEM Prototype Assembly

Fully Populated Coil Former

7.4 Prototype OSEM Performance

7.4.1 Operating Range

Fully Assembled OSEM

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Figure 20: Measured OSEM Detector Response

-15.00

-10.00

-5.00

0.00

5.00

10.00

15.00

0 200 400 600 800 1000 1200 1400

Displacement (um)

Diff

eren

tial o

/p V

olta

ge (V

)

0.7mm

Gradient in region of linear response = 23.320kV/m

TBC

7.4.2 Sensitivity Performance

0 2 4 6 8 10 12 14 16 18 20 22 24 26120

115

110

105

100

95

90

85Trace Plot

Frequency (Hz)

dBV

rms/

rtHz

A 1⟨ ⟩

A 0⟨ ⟩

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TBD

7.4.3 In-Vacuum Thermal Test Results

TBD

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(DRAFT) OSEM Preliminary Design Document & Test Report

Documents

Transcript of (DRAFT) OSEM Preliminary Design Document & Test Report