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Background Statement for SEMI Draft Document 5877Revision to SEMI M80-0514, Mechanical Specification for Front-Opening Shipping Box Used to Transport and Ship 450 mm Wafers with title change to: Specification for Front-Opening Shipping Box Used to Transport and Ship 450 mm Wafers

Note: This background statement is not part of the balloted item. It is provided solely to assist the recipient in reaching an informed decision based on the rationale of the activity that preceded the creation of this document.

Note: Recipients of this document are invited to submit, with their comments, notification of any relevant patented technology or copyrighted items of which they are aware and to provide supporting documentation. In this context, ‘patented technology’ is defined as technology for which a patent has issued or has been applied for. In the latter case, only publicly available information on the contents of the patent application is to be provided.

Note: The additions are underlined and deletions are strikeouts.

Background:The proposed change is to add non-mechanical specification to 450 mm FOSB (Front-Opening Shipping Box) in addition to M80-0514 which specified only mechanical design criteria since it is deemed necessary to add non-mechanical specifications for 450mm FOSB so that it can maintain wafer quality, facilitate easy detection of trouble such as wafer breakage when received.The proposed change also include information for reuse to promote environmental consideration

A Referenced Standard for wafers SEMI M74 will be replaced by SEMI M1 with this revision since 450mm Product (Prime) wafers specification has been defined in M1.

Summary of Changes

Change the title; delete the “MECHANICAL” Update the Section 4: Referenced Standards and Documents The re-numbering of the Requirement chapter Add the new Section “Materials consideration” in requirement chapter. Add the new appendix: WAFER SHIPPING BOX REUSE. A correction of "R" omission in figures; Figure 4, 23, 24 and 34. The correction of some sentences for proper understanding Replace “must” with “shall” in many requirements items.

Review and Adjudication InformationTask Force Review Committee Adjudication

Group: International 450 mm Shipping Box Task Force

JA Silicon Wafer Committee

Date: Friday, September 18, 2015 Friday, September 18, 2015Time & Timezone:

9:00AM – 11:00PM Japan Time

1:30PM – 5:30PM Japan Time

Location: SEMI Japan Ichigaya SEMI Japan IchigayaCity, State/Country:

Kudan-Minami, Chiyoda-ku, Tokyo, Japan

Kudan-Minami, Chiyoda-ku, Tokyo, Japan

Leader(s): Shoji Komatsu ([email protected])

Naoyuki Kawai ([email protected])Tetsuya Nakai ([email protected])

Standards Staff: Junko Collins ([email protected] )

Junko Collins ([email protected] )

Task Force Review meeting’s details are subject to change, and additional review sessions may be scheduled if necessary. Contact the task force leaders or Standards staff for confirmation.

Telephone and web information will be distributed to interested parties as the meeting date approaches. If you will not be able to attend these meetings in person but would like to participate by telephone/web, please contact Standards staff.

mailto:[email protected]

mailto:[email protected]

DRAFTDocument Number: 5877

Date: 5/5/23

SEMI Draft Document 5877Revision to SEMI M80-0514, Mechanical Specification for Front-Opening Shipping Box Used to Transport and Ship 450 mm Wafers with title change to: Mechanical Specification for Front-Opening Shipping Box Used to Transport and Ship 450 mm Wafers

Note: The additions are underlined and deletions are strikeout.

This Standard was technically approved by the Silicon Wafer Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on January 24, 2014. Available at www.semiviews.org and www.semi.org in May 2014; originally published November 2011; previously published August 2012.

1 Purpose1.1 This Standard specifies the front-opening shipping box (FOSB) used to ship 450 mm wafers from wafer suppliers to their customers (typically IC manufacturers), while maintaining wafer quality.

2 Scope2.1 This Standard is intended to set an appropriate level of specification that places minimal limits on innovation while ensuring interoperability at all mechanical interfaces.

[2.2 ] This Standard assumes that the 450 FOSB is used in loading raw silicon wafers to 450 FOSB after inspection in Si suppliers and also used in acceptance and inspection and , after which raw silicon wafer are transferred to another carrier at device makers. The 450 FOSB is not intended to be used in IC manufacturing processes. It is recommended that wafers be transferred from the 450 FOSB to a 450 FOUP using automated methods.

1: The carrier dimensions and door force have been developed based on the assumption for shipping system and drop height as called out in ISTA-2A (individual carton) and ISTA-3E (unitized). 0F

1

NOTICE: SEMI Standards and Safety Guidelines do not purport to address all safety issues associated with their use. It is the responsibility of the users of the Documents to establish appropriate safety and health practices, and determine the applicability of regulatory or other limitations prior to use.

3 Limitations3.1 The detailed methods and mechanisms inside a 450 FOSB door as to how a carrier door may be engaged to and disengaged from the carrier shell are not specified by this Document.

4 Referenced Standards and Documents4.1 SEMI Standards and Safety Guidelines

SEMI E144 — Specification for RF Air Interface Between RFID Tags in Carriers and RFID Reader in Semiconductor Production and Material Handling Equipment

SEMI E154 — Mechanical Interface Specification for 450 mm Load Port

[2:] Mechanical Interface Specification for 450 mm FOSB Load Port is under development.

SEMI E158 — Mechanical Specification for FAB Wafer Carrier Used to Transport and Store 450 mm Wafers (450 FOUP) and Kinematic Coupling

SEMI E162 — Mechanical Interface Specification for 450 mm Front-Opening Shipping Box Load Port1 International Safe Transit Association, 1400 Abbott Road, Suite 160, East Lansing, Michigan, 48823, USA. Telephone: 517.333.3437; Fax: 517.333.3813; http:www.ista.org

This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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Semiconductor Equipment and Materials International3081 Zanker RoadSan Jose, CA 95134-2127Phone: 408.943.6900, Fax: 408.943.7943

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SEMI M1 — Specification for Polished Single Crystal Silicon Wafers

SEMI M74 — Specification for 450 mm Diameter Mechanical Handling Polished Wafers

2:[3:] SEMI is developing a Standard for 450 mm Wafer Shipping System intended to be used in conjunction with this Document.

4.2 ISO Standards1F

2

ISO 4287 — Geometrical Product Specifications (GPS) – Surface Texture: Profile Method – Terms, Definitions and Surface Texture Parameters

ISO/IEC 16022 — Information Technology – International Symbology Specification – Data Matrix

4.3 Other Documents

SEMI AUX016 — List of Carrier Maker Identification Codes

NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.

5 Terminology5.1 Abbreviations and Acronyms

5.1.1 2D — two dimensional

5.1.2 BP — bilateral plane

5.1.3 CL — center line

5.1.4 EE — end effector

5.1.5 FOSB — front-opening shipping box

5.1.6 FP — facial plane

5.1.7 HP — horizontal plane

5.1.8 KC — kinematic coupling

5.1.9 KCP — kinematic coupling pin

5.1.10 OHT — overhead hoist transport

5.1.11 RFID — radio frequency identification

5.1.12 TIR — total indicator runout

5.2 Definitions

5.2.1 2D code — a code identifying elements such as maker, model, version and serial number of a 450 FOSB, by using a data matrix ECC200 symbol according to ISO/IEC 16022.

5.2.2 2D code placement area — an area on the door and another area on top of the shell, where a 2D code can be placed.

5.2.3 450 FOSB — used generally as a ‘term’ only within this document to identify the front opening shipping box.

3:[4:] Unless otherwise specified, the word ‘shipping box’ or ‘carrier’ used herein means 450 FOSB.

5.2.4 bilateral plane (BP) — a vertical plane, defining x=0 of a system with three orthogonal planes (HP, BP, FP), coincident with nominal location of the rear primary kinematic coupling pin (KCP), and midway between the nominal location of the front primary KCPs. [SEMI E154]

5.2.5 Carrier-Related Definitions

5.2.5.1 box — a protective portable container for a cassette and/or substrate(s). [SEMI E1.9]

2 International Organization for Standardization, ISO Central Secretariat, 1 rue de Varembé, Case postale 56, CH-1211 Geneva 20, Switzerland. Telephone: 41.22.749.01.11; Fax: 41.22.733.34.30; http://www.iso.ch


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5.2.5.2 carrier — any cassette, box, or pod that is used to transport and store substrates.

5.2.5.3 cassette — an open structure that holds one or more substrates. [SEMI E1.9]

5.2.5.4 pod — a box having a standardized mechanical interface. [SEMI E19]

5.2.5.5 secondary packaging — a protective portable container for carriers that is used to ship wafers in a carrier.

5.2.5.6 substrate — the basic unit of material, processed by semiconductor equipment, such as wafers, CDs, flat panels, or masks. [SEMI E30.1]

5.2.6 center line (CL) — a horizontal line centered vertically on the carrier door used as the reference for z dimensions of door features.

5.2.7 end effector (EE) — wafer transfer device for transferring wafers to or from the carrier.

5.2.8 facial plane (FP) — a vertical plane, defining y=0 of a system with three orthogonal planes (HP, BP, FP), y33=194 ± 0 mm in front of the nominal location of the rear primary KCP. [SEMI E154]

5.2.9 front (of shipping box) — the part of the shipping box closest to the door.

5.2.10 front-opening unified pod (FOUP) — a box with a nonremovable cassette and with a front-opening interface (that mates with a FIMS port that complies with SEMI E154).

5.2.11 horizontal plane (HP) — a horizontal plane, defining z=0 of a system with three orthogonal planes (HP, BP, FP), coincident with the nominal location of the uppermost points (tips) of the three KCPs. [SEMI E154]

5.2.12 human readable label area — an area on the door and another area on the rear surface of the shell, where a label can be placed for human interface.

5.2.13 nominal location — the value a dimension would have if its tolerance were reduced to zero.

5.2.14 nominal wafer seating plane — a horizontal plane that bisects the wafer pickup volume. [SEMI E1.9]

5.2.15 origin — the intersection of the BP and FP.

5.2.16 plane — a theoretical surface that has infinite width and length, zero thickness and zero curvature.

5.2.17 rear (of FOSB) — the part of the FOSB farthest from its door.

5.2.18 shipping box — a protective portable carrier that is used to ship wafers from the wafer suppliers to their customers.

5.2.19 wafer deflection — change in wafer shape (TIR) due to gravity while the wafer is resting in a horizontal position on the carrier wafer supports with the carrier door open.

5.2.20 wafer extraction volume — the open space for extracting a wafer from the FOSB.

5.2.21 wafer pick-up volume — the space that contains entire bottom of a wafer once the door is removed from the FOSB for wafer transfer.

5.2.22 wafer seating plane — the bottom surface of an ideally rigid flat disk that meets the diameter specification for 450 mm wafers, with negligible droop due to gravity, as it rests on the wafer supports.

5.2.23 wafer set-down volume — the open space for inserting and setting down a wafer in the shipping box.

5.2.24 wafer mapping exclusion volume — a space inside the carrier reserved for break-the-beam type wafer mapping.

6 Requirement6.1 Reference Planes [Horizontal Plane (HP), Facial Plane (FP), Bilateral Plane (BP)] Specification

6.1.1 The HP, FP, and BP as described in the terminology section are ideal planes, which are intended to be used to depict the position of certain features relatively to these planes. These planes are at position zero (x, y, z, defined as the origin) with no tolerance associated, since these ideal planes do not represent a physical feature. Only positive numbers are used to define coordinates within this system of three planes. No negative numbers are used in order to


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be as close as possible to standard mechanical drawing practices. Necessary clarification on the position of a feature usually will be achieved via figures.

6.1.2 FP and BP are defined as vertical planes parallel to gravity when resting on the KC interface (horizontal wafer orientation.). These planes are perpendicular.

4:[5:] The top surfaces of the KCPs are not the surfaces on which the carrier rests. Appendix 1 shows how test fixtures can be made to rest on the KCPs to duplicate the position of a carrier.

6.1.3 Reference Baselines — One center line is defined:

6.1.3.1 CL — Center line for the carrier door. It passes through the centers of the openings for the door pins. All the z-dimensions of door features are symmetric to the CL.

Figure 1Overall Views of 450 FOSB

6.2 Requirements for Carrier Envelope

6.2.1 The overall dimensions of the 450 FOSB, (x1), (y1), and (z1), are given as reference dimensions because they are derived from other dimensions. See Table 2. Overall views of 450 FOSB are shown in Figure 1.

(x1) ≤ x2 + x2


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(y1) ≤ y2 + y4max

(z1) ≤ z8max + z11

6.3 Requirements for Features for Automated Handling

6.3.1 Automation Flange — On top of the 450 FOSB is an automation flange for manipulating the carrier. See Figure 2 (top view) and Figures 3, 4 and 5 (sections).

6.3.1.1 The automation flange shall be centered in front of the FP. Its orientation and location are constrained by x4 and y12. See Figure 6.

6.3.1.2 The center of the flange is located x63 and y54 relative to its side and front respectively. The flange shall have a centering feature at its center. The centering feature shall have a depth of z2, diameter of d3 at the top surface, and (d2) at the bottom. The side of the centering feature shall have an angle of θ4.

6.3.1.3 The flange shall extend back from its front side by y3, and shall extend from its right side (as viewed from the front of the carrier) to the opposite side by x3. The neck below the flange shall extend x34 to each side of the BP, and shall extend y37 in front of the FP and y56 behind the FP.

6.3.1.4 The flange has a pattern of notches on all sides. Notches on the front and back have a depth of y31 and those on the sides shall have a depth of x56. The notches shall have an angle of θ5. The four corners shall have chamfers with size of x32 and y28. Notches are located at x30, x31, x63 on the front, and x33 on the back, and at y29 on the right side and at y54 on both the right and left side. The flange shall have a thickness of z13, and the carrier shall have no obstructions around the flange for a height of z9, except for the door frame as shown by y30 in Figure 4.

6.3.1.5 The presence sensing feature on the top surface of the automation flange consists of an area bounded by d3 and d8. The feature is designed to provide a flat surface for presence sensing and is located z8 above the HP.

Figure 2[Figure 1]Automation Flange – Top View


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Figure 3[Figure 2]Automation Flange Section at BP

Figure 4[Figure 3]

Carrier Section at BP

5:[6:] Door detail in Figure 4 is intended to illustrate the total volume available for the door including wafer retaining features.


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Figure 5[Figure 4]Carrier Section at FP

6.3.2 Center of Gravity Volume — The carrier’s center of gravity with the door closed shall exist within the volume, whose profile in the x-y plane is defined by either of the two regions described below:

a) The region in front of the FP and within a rectangle centered about the BP and bound by sides of length (r40 × 2) parallel to the FP and (y72–r40) parallel to the BP.

b) The region within a semicircle of radius r40 centered about the BP with side parallel to FP, located at (y72–r40) along the BP.

c) The center of gravity shall be within this volume whether the carrier is empty, partly filled with wafers, or fully occupied. See Figure 6.

6.3.2.1 Appendix 3 describes a method for measuring the location of the center of gravity.


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Figure 6[Figure 5]Automation Flange Location

6:[7:] Recessed diameter at center of automation flange omitted for clarity in Figure 6.

6.3.3 Forklift Feature — The 450 FOSB shall have features on the sides for handling by forklift, shown in Figure 7. The forklift feature includes a notched indentation for a pin to retain the carrier on the forklift.

6.3.3.1 On each side of the carrier, there shall be an opening to the rear extending vertically from z35 to z19, and forward to y45. The horizontal surface at z19 shall extend from y45 to y46. There shall be no obstruction at the top of the opening to the rear of y46. The surface at z19 shall extend from x17 to the surface at x66. There shall be notches at the FP with a height of z20, a depth of x35 and an angle of θ6.

6.3.3.2 There shall be a vertical surface extending a distance z20 above z19 at x66 from the BP, from y45 at the front and without any obstruction to the back of the carrier.

6.3.4 Front Clamp Features — The 450 FOSB shall have provision for being clamped at the front of the carrier on vertical surfaces located behind the door frame.

6.3.4.1 There shall be two front clamping features on the top of the carrier. Each is a rectangular depression with a depth of z5, and is bounded by x15 & x16, and by y43 & y44. See Figure 7.

6.3.4.2 There shall be two front clamping features on the bottom of the carrier. Each is a rectangular depression with a depth of z36 and be bounded by x57 & x58, and by y47 & y48. See Figure 7.

7:[8:] It is recommended that the front clamp features not be used for pulling the FOSB from the undocked position into the FIMS interface. Also, all of the dimensions of the 450 FOSB (such as the wafer location, etc.) are defined with reference to the KCPs, and will be in the proper location only when the 450 FOSB is held in place on the KCPs by gravity.


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Figure 7[Figure 6]Front Clamp and Forklift Features

[6.3.5 ] Conveyor Rails — See § 156.10.

6.4 Requirements for KCPs

[6.4.1 ] KCP Shape — The physical alignment interface on the bottom of the wafer carrier consists of features (specified in § 106.5) that mate with six pins underneath. As shown in Figure 8 and defined in Table 1, each pin is radially symmetric about its vertical center axis line and can be seen as the intersection of a cylinder of radius r1 and a sphere of radius r4 (which establishes the tip of the pin and might contact a flat plate). The radius r4 is centered on the axis of symmetry at a height z3 below the HP. An additional radius r3 establishes the contact with the angled mating groove surface on the carrier. The center of the radius r3 is defined by the intersection of a vertical plane through the axis of symmetry of the pin with the horizontal circle of radius r2 at the height z4 below the HP. A blend radius of r5 is applied at the intersection of r1 and r3, and at the intersection of r3 and r4. The minimum height of the pin is given by z4. Ra1 is the surface finish roughness, as defined by ISO 4287, of all features defined by r1, r3, r4, and r5. Dimensions r2, z3, and z4 have zero tolerance because they only define offsets and not physical features.

6.4.1 [6.4.2 ] KCP Locations — The KCPs are arranged in three sets with two pins in each set, as shown in Figure 11. The outer pins of each set are designated the primary pins for use on a load port or vehicle nest, and the inner pins are designated the secondary pins for use on a robotic arm used to pick up a carrier from the primary pins. The rear pins (farthest from the door) are located on the BP, at a distance from the FP of y18 for the secondary pin and y15 for the primary pin. The front primary pins are located at a distance of y16 from the FP, symmetric across the BP with distance x18 from the BP. The front secondary pins are located at a distance of y17 from the FP, symmetric across the BP with distance x19 from the BP. For reference only, the front KCPs are located symmetrically with respect to the BP at an angle of (θ2), and circumferentially equidistant on a circle about the origin with radius (r22) for the primary KCPs and radius (r26) for the secondary KCPs. For reference only, the rear


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primary kinematic pin is located on the BP and on a circle with radius (r27), and the secondary rear pin is located on the BP and on a circle with radius (r16). See Figure 11.

Figure 8[Figure 7]KCP

6.5 Requirements for KC Groove

6.5.1 In order to achieve the proper lead-in value of r15 and control contact pressures, certain characteristics of the kinematic groove surface on the bottom of the 450 FOSB are described in this section and shown in Figures 9 and 10.

6.5.2 KC Groove Locations — Grooves shall be provided to capture both primary and secondary pins locations. The centerlines of the grooves are located along radii passing through the kinematic pin locations from the origin. The rear groove has its centerline along the BP, while the two front grooves have their centerlines at the angle (θ2) with respect to the FP.

6.5.3 KC Groove Shape and Finish — When viewed along the axis of symmetry of the groove (parallel to the HP), the angle of each wall shall be θ1 to the vertical. The height of the groove at the opening shall be z11 beneath the HP. The shape and surface finish of the groove shall ensure that the carrier will seat fully onto the KCPs when there is an offset (lead-in error) of r15, allowing an empty, partially filled or full carrier to seat completely on the KCPs so long as it is placed on the load port within r15 from nominal. See Figure 10.

6.5.4 KC Groove Length — In order to ensure capture of either the primary or secondary KCP during a physical handoff with an offset (lead-in error) of r15, along the length of the groove, a minimum groove length is specified. The innermost end of the front KC grooves shall be no farther than r8 from the origin, and the outermost end of the grooves shall be no closer than r24 from the origin. The innermost end of the rear KC groove shall be no farther than r33 from the origin, and the outermost end of the groove shall be no less than r9 from the origin. The KC grooves shall not interfere with the edge of the conveyor rail or other exclusion features. See Figures 10 and 11.


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Figure 9[Figure 8]KC Groove

Figure 10[Figure 9]KC Offset


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Figure 11[Figure 10]Bottom View – KCP Locations

6.6 Requirements for Bottom Surface Features


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Figure 12[Figure 11]Bottom Features

6.6.1 Presence Sensor Feature

6.6.1.1 The presence sensing features on the bottom of the 450 FOSB are designed to provide three flat, opaque areas for sensing. The load port or other systems using KCPs can use the features to determine that a carrier is present, even if misplaced (see the discussion in the Related Information 4). The features consist of three flat, opaque areas centered along the FP of the carrier within the conveyor rails and extending y21 to the front and rear of the FP. The center area extends x22 to each side of the BP, and the outer areas extend from x20 to x9. The vertical location of the presence sense areas is z29 below the HP. See Figures 13 and 14.

6.6.2 Placement Sensor Features

6.6.2.1 Placement sensing features are intended to provide defined locations to confirm proper placement of the KC grooves onto the KCPs. These consist of a set of four elongated and three circular flat areas located. The elongated flat areas are located symmetrically to the front KCPs, with the outer center at approximately the same distance from the origin (at x21 and y22). The distance from the outer to inner centers is approximately the same as the distance between the primary and secondary KCPs. Two of the circular flat areas are located on either side of the rear secondary KCP, and the third is in front of the rear KCPs, for use with forklifts. The flat areas shall be at a height of z23. Because the KCPs are not symmetrical, this configuration allows fail-safe sensing of the carrier placement. See Figures 13 and 14.

6.6.3 Info Pads and Mechanical Lockout Features

6.6.3.1 The info pads and mechanical lockout features of the 450 FOSB are located symmetrically about the BP, with one row of three info pads and one mechanical lockout feature on each side. From the carrier side, there is no difference between the info pads and mechanical lockout features. On the load port side, the optional mechanical lockout pins would be separate from the sensing info pads. As with the placement sensing pads, the info pad features have a radius of r21 mm (flat or hole per customer option). The flat surface shall be at z50 below the HP, (with a more relaxed tolerance than z23). Hole “depth” shall be at z24. For the mechanical lockout feature, the flat must be capable of supporting a fully loaded FOSB.


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6.6.3.2 The info pads and mechanical lockout features are located y24 mm from the FP, and symmetrically about the BP at distances of x24, x25, x26, and x27 from the BP. The two features nearest the BP are reserved for mechanical lockout; the other six are reserved for info sensors only (no mechanical lockout pins). The lockout pads are numbered (1 and 2) and the Info Pads are lettered (A thru F) to highlight that the info pads and lockout pins are not intended to be interchangeable.

6.6.3.3 The info pads and lockout features are end user selectable. See Related Information 1, ¶ R1-3 for an example of how they may be specified.

Figure 13[Figure 12]Presence, Placement, Info-Pads and RFID Tag Placement


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Figure 14[Figure 13]Sensor Pad and Hole Cross-Section

6.7 Requirement for Radio Frequency Identification (RFID) Tag Placement Volume

6.7.1 The RFID tag placement volume specifies the volume where an RFID tag can be placed. The entire RFID tag, if present, must be placed within the volume defined by x29, y26, y27, z37 and z38 as shown in Figures 13 and 15.

8:[9:] SEMI E144 provides specifications for the required elements of RFID tags.

Figure 15[Figure 14]RFID Tag Placement Volume

6.8 Requirement for Carrier Hold-Down Features

6.8.1 The hold-down features are provided by a pair of structures located symmetrically about the BP and slightly closer to the FP than the front KCPs. Each feature consists of cylindrical volume centered at x28 and y38 with top and bottom surfaces at HP and z6 with radius r7. Each volume has an opening to the bottom of the carrier bounded by y34, y35 and r7. From the bottom of the opening, a vertical surface of height z7 joins (with a small but unspecified blend radius) a sloping plane of angle θ3 above the horizontal (and parallel to the intersection of FP and HP). This sloping plane meets the surface at z6. See Figures 16 and 17.

6.8.2 This configuration provides the load port with several options for holding the carrier in place not limited to the following:

A hook shape that presses against the slope and the shelf, or

A Tee shape that passes through the rectangular opening and rotates to press down on the shelf and/or the sloping plane with or without contacting the incline. See Figure 18.


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6.8.3 Either (each) hold-down feature shall be able to withstand a force in any direction of f001 without permanent damage or deformation.

6.8.4 Door opening and closing shall operate correctly with a force of f002 applied to either (each) hold-down feature. The carrier must withstand this force without impact on its intended function.

9:[10:] The force generated at the bottom hold down feature is related to the wafer retention forces and the door sealing forces that occur during the door insertion and removal operation. Carrier suppliers should consider the maximum force generated in their carrier design when designing the carrier’s hold down feature.

Figure 16[Figure 15]Hold-Down Feature Locations


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Figure 17[Figure 16]Hold-Down Section at x28=50 mm

Figure 18[Figure 17]Hold-Down Devices

6.9 Requirement for Carrier Door

6.9.1 The 450 FOSB is not intended to be opened with the wafers in a vertical orientation.

[6.9.2 ] The carrier door is on the front of the 450 FOSB. The door and its frame must shall be designed to mate with a load port that conforms to the Mechanical Interface Specification for 450 mm FOSB Load Port. The FOSB door and its frame must shall have surfaces that mate with seal areas, the FOSB door sensing area, and reserved spaces for vacuum application. See Figures 19, 21, and 23.


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10:[11:] Mechanical Interface Specification for 450 mm FOSB Load Port is under development.

6.9.2 [6.9.3 ] The areas for vacuum application include the four of the circles bounded by r28 and located at x49 and z31. The vacuum pad areas, door seal areas, frame seal areas and door sense areas shall be at a distance of y4 from the facial plane when the door is closed and latched. No surface on the FOSB may project further from the facial plane than these areas. The areas reserved for vacuum pads are meant to provide a continuous, smooth surface and shall be opaque for the purpose of presence sensing.

6.9.3 [6.9.4 ] Dimension y39 assures that there is clearance between the door and latch keys when the FOSB is pressed against the FIMS port and both latch keys on the port are inserted to their full length. See Figure 22.

6.9.3.1 [6.9.4.1 ] When the latch keys are turned more than 45° toward the position that unlocks the FOSB door from the FOSB, the latch key holes on the door shall be such that the door is not removable from the latch keys.

6.9.4 [6.9.5 ] To allow for unobstructed latch key rotation, the thickness of the outer panel of the carrier door in the area defined by r23 shall be y10. Clearance for latch keys shall be provided by y39 at (x44). Clearance for door pins shall be provided by y40 at (x43 and x45). The latchkeys and door pins shall be located on the center line (CL). See Figure 22.

6.9.5 [6.9.6 ] FOSB door features are symmetrical about the CL. Features other than the openings for Frame Pins and Door Pins are symmetrical about the BP.

6.9.6 [6.9.7 ] The opening for the door pin on the left side is circular with diameter (d4), and the opening on the right side is a slot. See Figure 23. The purpose of these openings is to assist with FOSB door recovery when the system experiences utility loss.

6.9.7 [6.9.8 ] The openings for the frame pins are open-ended slots on both the left and right sides. The slot features are located at x39, x40 and x41 from the BP and z39 from the CL of the door. The corners of the slot features have a radius of r19 and the depth of the features is y41. See Figures 22 and 23.

Figure 19[Figure 18]450 FOSB Door Features

6.9.8 [6.9.9 ] The frame seal area is bounded by x11 and x64 on the sides, by z27 and z34 on the top, and by z28 and z43on the bottom. There are blend radii r30and r36 at the inner and outer corners respectively.


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6.9.9 [6.9.10 ] The door seal area is bounded by x47 on the sides, and by z33 on the top and bottom. The width of the seal area is given by x48 and z32. There are blend radii of r31 and r32 at the outer and inner edges respectively. See Figure 21 and Related Information 1, ¶ R1-2.10.

Figure 20[Figure 19]Carrier Door Frame

Figure 21[Figure 20]Carrier Door


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Figure 22[Figure 21]Section at Door Center Line – Looking Down on the Right Side

Figure 23Frame Pin and Door Pin Area – Right Side

[6.9.11 ] Front Clamp Features — See ¶ 8.4. 6.3.4 Figure 7 shows the top front clamp features and Figure 27 shows the bottom front clamp features.

11:[12:] It is recommended that the front clamp features not be used for pulling the FOSB from the undocked position into the FIMS interface. Also, all of the dimensions of the 450 FOSB (such as the wafer location, etc.) are defined with reference to the KCPs, and will be in the proper location only when the 450 FOSB is held in place on the KCPs by gravity.

6.9.10 [6.9.12 ] Door Closing Force — The force required to push the carrier door into the carrier shell to its fully seated position is f234. The application of f234 to the door shall push the door fully closed, so that the outermost point of the outer surface of the door is less than or equal to y4 from the FP. With the door in this position, the latches shall operate without exceeding the torque limit f230 for the latch keys.

12:[13:] Carrier suppliers should design their products to keep this force required to close as small as possible to ensure no damage will occur to wafers upon opening and closing the door.

[6.9.13 ] Thickness of Door — y58. See § 86.3.


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6.9.11 [6.9.14 ] Latch Torque — The maximum torque required to turn each of the latch mechanisms (with which the latch keys of a load port will engage) on the carrier door is f230.

[6.9.15 ] Door Latching and Unlatching — The door of the 450 FOSB must shall be designed so that the door is completely latched or completely unlatched when the door latch keys are turned to the angular positions described in SEMI E154.

6.9.12 [6.9.16 ] Latch Pull Force — Load ports may pull in on the latches to hold the 450 FOSB door in place with a force f235 that is defined in the SEMI E154.

6.9.13 [6.9.17 ] See Related Information 1, ¶ R1-2.14 for more discussion.

6.10 Requirement for Conveyor Rails

6.10.1 This section specifies certain aspects of the 450 FOSB that define the conveyor rails, their exclusion areas, and relationships to other features.

6.10.2 Conveyor Rail Surface Dimensions — The conveying surface extends below the HP, as shown in Figures 25 and 26. The bottom view is given in Figure 24. The conveyor rail surfaces are meant to provide smooth, continuous surfaces symmetric to the origin. The inner edges of the conveying surfaces are bounded by x6 and y6, and the outer guiding edges of the conveying surfaces are defined by x5 and y5 on the left and rear sides. The front side is y13 from the rear side, and the right side is x59 from the left side. A blend radius r11 connects the inner boundaries, and the four outer corners are bounded by radius r10. The conveying surface forms a plane at a distance z12 below the HP.

6.10.3 Conveyor Rail Cylindrical Forklift Pin Holes — Holes are provided in the side conveyor rails, defining cylindrical volumes on the FP. The holes (cylinders) are of diameter d1. The left side hole is located x60 inside of the left conveyor guiding surface, and the right side hole is x37 from the left side hole. Both holes are centered on the FP. The depth of the holes is z46. See Figure 25.

6.10.4 Conveyor Guiding Surface — The external edges of the conveyor rails will provide a physical conveyor guiding surface consisting of a vertical edge with height of z10 above the conveying surface. No part of the FOSB may occupy the volume outside of the conveyor guiding surface below its top at z10. Note that r35 applies to the guiding surface while r10 applies to parts of the carrier that are above z10.

6.10.4.1 The (vertical) conveyor guiding surfaces shall be opaque for the purpose of presence sensing.


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Figure 24Conveyor Rail Locations

Figure 25[Figure 22]Conveyor Rail: Section at FP


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Figure 26[Figure 23]Conveyor Rail: Section at BP

6.11 Requirements for Port Exclusion Areas

6.11.1 The port area is here described only as an exclusion area. No details are assumed for the shape or other details for the port interface.

6.11.2 As shown in Figure 27 port exclusion areas of radius r14 are defined at the four points defined symmetrically at distance x7 left and right of the BP and distance y57 to the front and y7 to the rear of the FP.

Figure 27[Figure 24]Front Clamps and Port Locations

6.12 Requirements for Wafer Support Features


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6.12.1 Internal Horizontal Dimensions — Figure 28 shows a cross-section of the horizontal boundaries of the FOSB side domains (which contain the parts of the FOSB higher than z25 above the HP and lower than z15 above the top wafer).

6.12.2 Side and Rear Wafer Support Structure Volume — Wafer shipping requires perimeter contact only. The number and location of wafer contacts are carrier design specific based on end user requirements, that is, silicon manufacturer or integrated device manufacturer, and the defined wafer pickup volume. Wafer backside contact should be minimized when the wafer is within the wafer seating plane.

6.12.3 The wafer support areas are bounded by r38 towards the front and rear, by x13 on the inside and x50 on the outside. If the wafer supports are moved out from x13 the wafer deflection will increase. See Related Information 2 for discussion of wafer sag. At the rear of the carrier, an additional support area, bounded by x14, and between and y11 and y19, may be provided at the carrier supplier’s option for wafer support.

6.12.4 Appendix 2 describes a method for measuring the wafer seating planes.

13:[14:] If wafer being inserted into the carrier strikes a rear support it is likely to break.

6.12.5 The carrier shall have features to constrain the wafer along all axes so the wafer will be within the wafer pick-up volume after the door is opened. See Figures 31 and 32.

6.12.6 Wafer Orientation and Numbering — The wafers shall be horizontal when the FOSB is placed on the KCPs. The wafer slots shall be numbered in increasing order from bottom to top (so the bottom wafer is wafer number 1, the next wafer up is wafer number 2, etc.).

Figure 28[Figure 25]FOSB Section (Between Wafer Supports)


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Figure 29[Figure 26]Wafer Support Area

Figure 30[Figure 27]Wafer Slots


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Figure 31[Figure 28]Wafer Pick-Up Volume (Between Wafer Supports)

Figure 32[Figure 29]Wafer Pick-Up Side View


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Figure 33[Figure 30]Wafer Set-Down Volume (Between Wafer Supports)

Figure 34[Figure 31]Wafer Set-Down Side View


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Figure 35[Figure 32]Wafer Extraction Volume (Between Wafer Supports)

Figure 36[Figure 33]

Wafer Extraction Side View

6.12.7 Wafer Insertion and Extraction

6.12.7.1 Vertical Dimensions — Figures 4 and 5 show the vertical dimensions of the carrier. Note that z14 (the height of the bottom nominal wafer seating plane above the HP) and z17 (the distance between adjacent nominal wafer seating planes) are given as absolute distances with no tolerance. This means that the deviation of each wafer support from its nominal height shall be no more than z21. z15 specifies the space reserved for end effectors below the first wafer. The method for meeting these requirements is left up to the carrier supplier. See also Figure 30.

6.12.7.2 Wafer Set-Down Volume — The open space for the wafer set-down volume consists of a cylindrical section with radius r12 and a vertical axis y14 in front of the origin. The bottom of this cylindrical section is z49 above the nominal wafer seating plane and its height is z22. See Figures 33 and 34.


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[6.12.7.3 ] The implications of the tolerance on r12 for wafer positioning are as follows. The wafers shall be placed in the carrier within a circle of radius corresponding to the smaller bound on r12 to avoid touching the edge of the wafer to the side of the carrier. Once the wafer has been placed, the carrier shall not allow a wafer to move outside of a circle of radius corresponding to the larger bound on r12. See Figures 31 and 32. When the carrier door is closed and reopened, the wafer seating plane shall be within the wafer pick-up volume (see ¶ 6.12.7.7 6.12.7.7).

6.12.7.3 [6.12.7.4 ] Wafer Extraction Volume — The open space for the wafer extraction volume shall include a cylindrical section with radius r18 which has a vertical axis y14 in front of the origin. The vertical cross section at the FP is extended out to the door opening. The bottom of this cylindrical section is z22 above the nominal wafer seating plane and its height is z49. See Figures 35 and 36.

6.12.7.4 [6.12.7.5 ] The implications of wafer extraction for the definition of dimension r18 are as follows. The carrier shall provide an extra 1 mm of horizontal clearance once the wafer is picked up from wherever it ends up (within the bounds of r12) after transport in the carrier.

6.12.7.5 [6.12.7.6 ] If a wafer is placed in the wafer set-down volume and the carrier door is closed and subsequently opened (i.e., a normal transportation between load ports), the wafer seating plane shall be contained in the wafer pick-up volume.

14:[15:] If the wafer is not pushed toward the rear of the carrier, then the wafer may only be somewhere within the wafer extraction volume.

6.12.7.6 [6.12.7.7 ] Wafer Pick-Up Volume — The wafer pick-up volume shall be defined by a cylindrical section with radius r13 and a vertical axis at the origin. Its top and bottom are the upper and lower tolerance of z21 around the nominal wafer seating plane. See Figures 31 and 32.

6.12.7.7 [6.12.7.8 ] Wafer Insertion and Extraction — The extraction volume is the maximum space available for a wafer to be moved into or out of the carrier.

6.12.7.8 [6.12.7.9 ] Wafer Retaining Structure — The slot is usually designed that wafers are suspended in the slot without contacting the surface of the slot for preventing the damage during transportation when FOSB door is closed. It should be noted that wafer position when door is open may be different than when the door is closed due to the wafer retaining structure.

[6.12.7.10 ] Wafer Retaining — When the FOSB is closed, the wafers must shall be retained in the FOSB to prevent movement during subsequent handling, including shipping. It should be noted that wafers are required to be shipped in a vertical orientation and generally require shipping performance from secondary packaging.

6.13 Requirements for End Effector (EE) and Wafer Mapping Exclusion Volumes

[6.13.1 ] Carrier exclusion volume for EE access shall be EEs reaching into the carrier shall stay between the wafer support areas defined by r6, x12, x13, x14, y8, y9, y11 and y14. See Figure 37.

The maximum reach into the carrier is limited by r6, r38, x13, y11, and y19.

[6.13.2 ] Wafer Mapping — A volume shall be reserved for wafer mapping.

6.13.1.1 [6.13.2.1 ] It shall extend from z26 above the HP up to z25 above the top nominal wafer seating plane. See Figure 4.

6.13.1.2 [6.13.2.2 ] It shall extend from y55 to y9 and shall have a width of x12. See Figure 28.


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Figure 37[Figure 34]End Effector Exclusion

6.14 Requirement for Two Dimensional (2D) Code

[6.14.1 ] 2D Code Placement Area — Areas for 2D code placement are on the face of the door and on top of the FOSB shell. The 2D code on top of the FOSB shell must shall be within the lateral boundaries of an area defined by x70, x71, y70 and y71 as defined in Table 1 and shown in Figure 38. The 2D code on the front surface of FOSB door must be within the lateral boundaries defined by x72, x73, z70 and z71 as defined in Table 1 and shown in Figure 39.

6.14.1 [6.14.2 ] 2D Code — A square data matrix with a size of 8 ± 2 mm consisting of 18 rows and 18 columns employed on the surface of the 450 FOSB with laser marking. Each data matrix includes information designated as “primary upper case alphanumeric” per Data Matrix ECC200 Symbol of ISO/IEC 16022 with a capacity of 25 alphanumerical characters in total. These 25 characters shall contain the following six elements:

6.14.2 [6.14.3 ] Character 1–2 — 450 FOSB maker; see SEMI AUX016, List of carrier maker Identification Codes

6.14.3 [6.14.4 ] Character 3 — Door-type; Auto (A)

6.14.4 [6.14.5 ] Character 4 — Location; box shell (B) or door (D)

6.14.5 [6.14.6 ] Character 5–8 — Model code as defined by each 450 FOSB maker

6.14.6 [6.14.7 ] Character 9 — Mold revision number

6.14.7 [6.14.8 ] Character 10–25 — 450 FOSB serial number


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Figure 38[Figure 35]2D Code Placement Area on Shell

Figure 39[Figure 36]2D Code Placement Area on Door

6.15 Requirements for Human Readable Label Exclusion Area


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[6.15.1 ] Exclusion areas for optional human readable labels are shall be provided on the face of the door and on the rear surface of the FOSB shell. Label placement on the rear surface of the FOSB must shall be within the lateral boundaries as defined by x75, z74 and z75 and shown in Figure 40. The label placement on the door must shall be within the lateral boundaries as defined by x74, z72 and z73 and shown in Figure 41.

6.15.1 [6.15.2 ] This Standard only defines the dimensional areas for the use of human readable labels. The type of label and information contained within the labels are not defined by this Standard and will be determined by the users of the 450 FOSB.

Figure 40[Figure 37]Human Readable Label Exclusion Area on Rear

Figure 41[Figure 38]Human Readable Label Exclusion Area on Door


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6.16 Materials consideration6.16.1 The wafer shipping box shall be constructed so the wafers are visible when the wafer shipping box is closed. This visibility is to prevent the FOSB from mistakenly being set onto a lot sorter and opening while a broken or cross-slotted wafer is inside.

Table 1 Carrier and KC Dimensions

Symbol Used Figure Value Specified Datum Measured From Feature Measured To

θ1 9 45 ± 6 degrees Vertical (BP and FP) Angle from vertical of the planar surfaces of KC grooves

(θ2) 11 (34.0 degrees) BP Axis of symmetry of front pin-mating grooves

θ3 17 30 ± 2 degrees HP Incline of hold-down featureθ4 3, 5 45.0 ± 0.5 degrees Vertical (BP and FP) Edge of automation flange centering

featureθ5 2 45.0 ± 0.5 degrees Perpendicular to side surface of

automation flangeSide surfaces of automation flange notches

θ6 7 45.0 ± 0.5degrees FP Side of forklift retainer feature

d1 24 8.0 ± 0.5 x37, x60 and FP Diameter of forklift pin hole(d2) 3 (17) Automation flange centering

feature at x63, y54Diameter at bottom of depression

d3 2, 3, 5 51.0 ± 0.5 Automation flange centering feature at x63, y54

Diameter at top of depression

(d4) 21 (10.6) x45, CL Diameter of door pin opening(d7) 23 (10.6) (x43 and x42), CL Diameter of slot for door pind8 2 ≥71 Automation flange sensing feature

at x63, y54Outer edge of sensing area

f001 ¶ 13.2.16.8.2.1 ≥175 N Applied at any point, in any direction

Force that the any one hold down feature that the carrier must shall withstand

f002 ¶ 13.2.26.8.2.2 ≥100 N Force applied to hold down feature by the load port

Force that carrier must shall withstand during door opening and closing without a negative impact on the intended function of the carrier

f230 ¶ 14.146.9.14 ≤1.7 Nm Latch Key Torque required to operate latches (each latch key)

f234 ¶ 14.126.9.12 ≤390 N Door Force to close carrier door

r1 8 10.000 ± 0.025 Centerline of KCP Cylindrical (side) surface of KCPr2 8 14 Centerline of KCP Circle to define center of curvature of

KCP contact surfacer3 8 30.00 ± 0.05 Circle defined by r2 and z4 Contact surface of KCPr4 8 15.00 ± 0.05 Centerline of KCP and z3 Top surface of KCP (sphere)r5 8 2.0 ± 0.1 Blend radius Surface between KCP contact surface and

adjacent surfacesr6 28, 37 ≥245 Origin Rear boundary of EE exclusion arear7 16 ≥30 x28, y38 Space in hold-down featurer8 11 ≤136 Origin Innermost end of KC groove for front

KCPsr9 11 ≥218 Origin Outermost end of KC groove for rear

KCPr10 6, 24, 28 ≤314 Origin Outer limit of carrier and conveyor rails


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r11 24 ≥10 Blend Radius Blend radius of conveyor rail edgesr12 33, 34 227 +1/−0 x=0, y14 Radius of wafer set-down volumer13 31, 32 ≤226 Origin Radius of wafer pick-up volumer14 27 25 x7, y7 and x7, y57 Radius of exclusion area for portsr15 10 ≥15 N/A Lead in: correctable carrier misalignment

in any horizontal direction(r16) 11 (145) Origin Location of rear secondary KCPr18 35, 36 ≥r12 + 1.0 Origin Radius of wafer extraction volumer19 23 ≤3 Origin Radius of frame pin slot cornersr21 13 ≥10 Center of Info, placement and

Lock-Out padsExtent of pad area

(r22) 11 (206.5) Origin Location of front primary KCPsr23 21, 23 ≥14 Latch key Clearancer24 11 ≥231 Origin Outermost end of KC groove for front

KCPs(r25) 11 (225) Origin Radius of 450 mm diameter wafer(r26) 11 (160) Origin Location of front secondary KCPs(r27) 11 (194) Origin Location of rear primary KCPr28 21 ≥30 x38, z31 Area reserved for vacuum pads and

presence sensingr29 21 ≥20 x44, CL and x45, CL Boundary of door sense arear30 20 ≤23 Blend radius Corners of door openingr31 21 ≥21 Blend radius Corners of doorr32 21 ≥19 Blend radius Edge of door seal arear33 11 ≤121 Origin Innermost end of KC groove for rear

KCPsr35 24 313 ± 1 Origin Front and rear corners of conveyor

guiding surfacer36 20 ≤33 Blend radius Corners of frame seal arear38 28,34,36 ≥229 Origin Inner wall of carrierr40 2 ≤17 BP, FP Outer surface of zone containing the

center of gravity of the carrier

Ra1 ¶ 9.16.4.1 ≤0.30 µm N/A KCP surface finish roughness per ISO 4287

(x1) 1, 5, 11, 20, 28 (≤555) N/A Overall width of carrierx2 6, 7, 20, 28 ≤277.5 BP Outer edge of carrierx3 2 300.0 ± 0.5 Right side of automation flange Left side of automation flangex4 5,6 150 ± 1 BP Right edge of automation flange on

carrierx5 5, 24,25 234 ± 1 BP Outer edge of left side conveyor rail

surfacex6 24, 25 ≤220 BP Inner edge of side conveyor rail surfacex7 27 185 BP Center of port exclusion areax9 13 ≤220 BP Outer edge of presence sense areax10 13 193 ± 1 BP Outer center of placement sense area


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x11 20, 28 ≤259 BP Inner edge of frame seal areax12 28, 37 ≥243.5 BP Inner edge of EE exclusion areax13 28, 29, 37 ≥135 BP Inner extent of wafer support surfacex14 29, 37 ≤50 BP Extent of rear wafer support structurex15 7 ≥250 BP Outer side of top front clamping

featurex16 7 ≤210 BP Inner side of top front clamping

featurex17 7 ≤260 BP Inner side of forklift featurex18 11 171.20 ± 0.05 BP Location of front primary KCPx19 11 132.65 ± 0.05 BP Location of front secondary KCPx20 13 ≤160 BP Inner edge of side presence sense areax21 13 141 ± 1 BP Outer center of invalid placement sense

areax22 13 ≥30 BP Edge of central presence sense areax23 13 55 ± 1 BP Center of rear placement sense padx24 13 55 ± 1 BP Center of lock-out pad (1 left/2 right)x25 13 85 ± 1 BP Center of info pad (C left/D right)x26 13 115 ± 1 BP Center of Info Pad (B left/E right)x27 13 145 ± 1 BP Center of info Pad (A left/F right)x28 16 50.0 ± 0.5 BP Center of hold-down featurex29 13 25 ± 1 BP Side of RFID placement volumex30 2 50.0 ± 0.5 Right side of automation flange Automation flange notchx31 2 210.0 ± 0.5 Right side of automation flange Automation flange notchx32 2 12 ± 1 Edge of flange Automation flange chamferx33 2 250.0 ± 0.5 Right side of automation flange Automation flange notchx34 5 ≤132 BP Side of automation flange neckx35 7 14.0 ± 0.5 Outer edge of carrier Depth of the notch for forkliftx37 24 450 ± 1 Left forklift pin hole Right forklift pin holex38 21, 23 ≥10 Centered at x44, CL Width of latch key clearancex39 23 267.9 ± 0.5 BP Inside edge of frame pin slotsx40 23 (272) BP Centers of frame pin diameterx41 23 ≥274 BP Tangency of frame pin slots outer radiusx42 23 ≥3.0 Centered at x43 Length of slot for door pin(x43) 23 (220) BP Center of opening for right door pin, r22(x44) 21,23 (142) BP Center of latch key opening(x45) 21 (220) BP Center of left door pin openingx47 21 256 ± 1 BP Outer edge of door seal areax48 21 ≥2 Outer edge of door seal area Inner edge of door seal areax49 21 200 BP Space reserved for vacuum padsx50 5, 28, 29 ≥229 BP Inner wall of carrier and Outer extent of

wafer support structurex56 2 14.0 ± 0.5 edge of automation flange depth of notchesx57 27 ≥257 BP Outer side of bottom front clampx58 27 ≤217 BP Inner side of bottom front clamp


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x59 24 469 +0, −2 Left side of conveyor guiding surface

Opposite side of conveyor guiding surface

x60 24 9.0 ± 0.2 Left side of conveyor guiding surface

Left forklift hole

x61 13 154 ± 1 BP Inner center of placement sense padx62 13 102 ± 1 BP Inner center of placement sense padx63 2 150.0 ± 0.5 Right side of automation flange Front automation flange notch and center

of d3x64 20 ≥275.5 BP Outer side of frame seal areax66 7 276 ± 1 BP Outer surface of forklift featurex70 38 60 BP Edge of 2D code area on bodyx71 38 110 BP Edge of 2D code area on bodyx72 39 175 BP Edge of 2D code area on doorx73 39 225 BP Edge of 2D code area on doorx74 41 65 BP Edge of human readable label area on

doorx75 40 45 BP Edge of human readable label area on

rear

(y1) 1, 11, 28, 31 (≤486.75) N/A Overall depth of carriery2 4, 6, 24, 28 ≤240 FP Rear of carriery3 2 300.0 ± 0.5 Front side of automation flange Back side of automation flangey4 4, 6, 26, 28, 35 246.25 ± 0.50 FP Front surface of carrier at door and frame

seal areas, and reserved areas for vacuum application and door sensing

y5 24, 26 234 ± 1 FP Outer edge of front and rear conveyor rail surface

y6 24, 26 ≤220 FP Inner edge of front and rear conveyor rail surface

y7 27 174 FP Center of rear port exclusion areas

y8 28, 29, 37 ≤180 FP Inner extent of EE exclusion area between x12 and x13, and Inner extent of wafer support structure

y9 4, 28, 37 ≥211.25 FP Inner sealing surface to doory10 22 3.00 ± 0.25 Front surface of door (y4) Space for unobstructed rotation of latch

keysy11 28, 29, 37 ≥200 FP Extent of rear wafer support structurey12 4, 6 162 ± 1 FP Front edge of automation flangey13 24 469 +0, −2 Front conveyor guiding

surfaceRear conveyor guiding surface

y14 33 >0, ≤3.0 FP Center of r12y15 11 194.00 ± 0.05 FP Location of rear primary KCPy16 11 115.50 ± 0.05 FP Location of front primary KCPy17 11 89.47 ± 0.05 FP Location of front secondary KCPy18 11 145.00 ± 0.05 FP Location of rear secondary KCPy19 28, 29, 31, 33,

35, 37≥216 FP Inner extent of EE exclusion area near

rear wafer support structure


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y21 13 ≥30 FP Edges of side presence sense areay22 13 151 ± 1 FP Outer center of placement sense pady23 13 74 ± 1 FP Outer center of placement sense pady24 13 120 ± 1 FP Row of info and lock out padsy25 13 194 ± 1 FP Center of rear placement sense areasy26 4, 13, 15 ≥225 FP Front of RFID placement volumey27 4, 13, 15 ≤230 FP Rear of RFID placement volumey28 2 12 ± 1 Edge of automation flange Automation flange chamfery29 2 90.0 ± 0.5 Front of automation flange Automation flange notchy30 4 ≥195.75 FP Back of door flangey31 2 14.0 ± 0.5 Edge of automation flange Depth of notchesy33 ¶ 5.2.8 194 ± 0 FP Nominal location of rear primary

KCPy34 16, 17 90.0 ± 0.5 FP Front edge of hold-down openingy35 16, 17 60.0 ± 0.5 FP Rear edge of hold-down openingy37 3 ≤144 FP Front and rear of automation flange necky38 16, 17 75.0 ± 0.5 FP Center of hold-down featurey39 22 ≥12 Front surface of door Clearance for latch keysy40 22 ≥12 Front surface of door Clearance for door piny41 22 ≥12 Front surface of frame Clearance for frame piny43 7 3.5 ± 0.5 Front surface of FOSB frame Front side of front clamping featurey44 7 ≤222.75 FP Rear side of front clamping featurey45 7 ≥180 FP Front side of forklift featurey46 7 ≥120 FP Rear limit of surface for forklifty47 27 3.5 ± 0.5 Front surface of FOSB frame Front side of bottom front clampy48 27 ≤230 FP Rear side of bottom front clampy50 13 95 ± 1 FP Placement sense pad for forklifty52 13 125 ± 1 FP Inner center of placement sense pady53 13 48 ± 1 FP Inner center of placement sense pady54 2 150.0 ± 0.5 Front of automation flange Automation flange notchy55 4 ≤196.25 FP Rear of wafer mapping exclusion volumey56 3 ≤120 FP Rear side of automation flange necky57 27 179 FP Center of front port exclusions

areasy58 4,28 ≤52.25 Front surface of door Thickness of doory70 38 170 FP Edge of 2D code area on bodyy71 38 210 FP Edge of 2D code area on bodyy72 6 ≤39 FP Front limit of area containing center of

gravity

(z1) 1, 4, 5 (≤404) N/A Over all height of carrierz2 5 ≥17 Top of automation flange Bottom of centering depressionz3 8 15 HP Point on KCP centerline to define KCP

top surface, r1z4 8 25.543 HP Center of radius, r3


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z5 7 ≥12 Top of door frame Bottom of upper front clamp featurez6 17 11.0 ±0.5 HP Lower horizontal surface inside hold-

down featurez7 17 6.0 ± 0.2 Lower horizontal surface inside

hold-down featureLower edge of hold-own incline

z8 1, 4, 5 382 ± 1 HP Top of carrierz9 3, 4, 5 ≥21 Bottom surface of automation

flangeClearance for use of automation flange

z10 25, 26 ≥8 Conveyor running surface (z12) Top edge of conveyor guiding surfacez11 4, 5 9, 10, 14,

25, 26≤21 HP FOSB bottom surface areas not

otherwise specifiedz12 25, 26 20 ± 1 HP Conveyor surfacez13 3, 5 7.5± 0.5 Top surface of automation flange Bottom surface of automation flangez14 4 36 HP Bottom nominal wafer seating planez15 4 ≥12 Height of first wafer slot top Clearance below top of first wafer slotz16 30, 32 ≥8 Top surface of each nominal

wafer seating planeBottom surface of next higher wafer support

z17 30, 32 12 Each nominal wafer seating plane Adjacent nominal wafer seating planes (wafer pitch)

z18 4 ≥8 Top surface of top wafer slot Any point above top nominal wafer seating plane

z19 7 163 ± 1 HP Top of forklift featurez20 7 ≥10 Top of forklift feature Bottom of forklift retainer featurez21 30, 32 0.00 ± 0.50 Each nominal wafer seating plane Each actual nominal wafer seating planez22 34, 36 6.8 z49 above each nominal wafer

seating planeTop of wafer extraction and wafer set-down volumes

z23 14 20.0 ± 0.5 HP Surface of placement sense padsz24 14 ≤15 HP Top of space within lockout and info pads

when not activez25 4 ≥17 Top of wafer 25 nominal support Top of wafer mapping exclusion volumez26 4 ≤17 HP Bottom of wafer mapping exclusion

volumez27 20 ≥192 CL Top of frame seal areaz28 20 ≥188 CL Bottom of frame seal areaz29 14 20 +1, −5 HP Presence sense areaz30 20, 21 178 HP CL – Horizontal center line of the doorz31 21 129 CL Center of area reserved for vacuum padsz32 21 ≥2 Outer edge of door frame Inner edge of door seal areaz33 21 178 ± 1 CL Top and bottom edges of doorz34 20 ≤181 CL Inner edge of frame seal areaz35 7 ≤74 HP Bottom of forklift featurez36 7 ≥4 Bottom of door frame Top of lower front clamp featurez37 15 ≥5 HP Bottom of RFID placement volumez38 15 ≤10 HP Top of RFID placement volumez39 23 3.7 ± 0.5 CL Outer edge of frame pin slots(z42) 20 (≤13) HP Bottom of door flangez43 4, 7,20 376 ± 1 HP Top of door flange


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(z44) 4, 20 (≤362) N/A Height of door opening(z45) 20 (≤390) N/A Height of door flangez46 25 ≥9 Conveyor running surface Depth of opening for forklift pinz48 17 ≥11 Lower horizontal surface inside

hold-down featureUpper horizontal surface inside hold-down feature

z49 34, 36 0.7 Each nominal wafer seating plane Bottom of wafer extraction volume. (To center the extraction volume between slots.)

z50 14 20 ± 1 HP Height of info and lockout pads when active

z70 39 230 HP Edge of 2D code area on doorz71 39 270 HP Edge of 2D code area on doorz72 41 100 HP Edge of human readable label area on

doorz73 41 25 HP Edge of human readable label area on

doorz74 40 43 HP Edge of human readable label area on

rearz75 40 100 HP Edge of human readable label area on

rear#1 Regarding z21, the wafer plane tolerance of ±0.50 mm is selected as a starting point for FOSB manufactured prototypes. Future system capability data may result in actual wafer plane tolerance of ±0.75 mm. Users are notified of this possibility.#2 All linear dimensions are in mm, all angular dimensions are in degrees.#3 Unless otherwise noted, all dimensions are in mm. Reference dimensions are in parentheses and are not requirements.#4 Measured values for dimensions without specified tolerance should be rounded up or down to the last significant figure of the dimension in accordance with good engineering practice.#5 Measured values for dimensions with specified tolerances should be rounded up or down to the last significant figure of the tolerance in accordance with good engineering practice.

Table 2 Derivation of Reference Dimensions

Symbol Used Value Formula

(x1) (≤555) x2 + x2 (≤277.5 + ≤277.5)(y1) (≤486.75) y2 + y4max (≤240 + 246.75)(z1) (≤404) z8max + z11max (383 + ≤21)(z42) (≤13) z12max − z10 (21 − ≥8)(z44) (≤362) z34 + z34 (≤181 + ≤181)(z45) (≤390) z42 + z43max (≤13 + 377)

7 Related Documents7.1 SEMI Standards and Safety Guidelines

SEMI E158 ― Mechanical Specification for Fab Wafer Carrier Used to Transport and Store 450 mm Wafers (450 FOUP) and Kinematic Coupling

SEMI M76 ― Specification for Developmental 450 mm Diameter Polished Single Crystal Silicon Wafers

7.2 ISTA Packaging Performance Testing Standards

ISTA-2A ― Individual Packaged Products 68kg or Less

ISTA-3E ― Unitized Loads of the Same Product


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APPENDIX 1FIXTURES FOR MEASURING THE HORIZONTAL PLANENOTICE: The material in this Appendix is an official part of SEMI M80 and was approved by full letter ballot procedures on February 3, 2011.

A1-1 IntroductionA1-1.1 There are at least two ways to implement a jig/fixture, for establishing the HP, depending on the expected purpose and accuracy.

A1-2 Top Surface of KCPsA1-2.1 A simple fixture can establish the HP by setting a flat plate on top of the three KCPs. The lower surface would represent the HP with an accuracy limited by the tolerances of r15 and r3. Such a method will be suitable to determine the distance from the HP to the floor (e.g., for positioning equipment). See Figure A1-1.

Figure A1-1Flat Plate Precision Limited by Tolerance Stack-up

A1-3 Emulating KC GroovesA1-3.1 A more precise fixture would emulate the KC grooves, where the upper surface may be designed to be at a position to reflect the height of the first wafer. Any method using KC grooves would cause similar tolerance stack-ups as a real 450 FOSB, since it is resting on the same contact points of the KCPs.

A1-3.2 The tolerances of the radius on the upper points of the KCPs would not affect such a fixture. This type of fixture is needed for precise measurements and alignments.

A1-3.3 In the example in shown in Figure A1-2, the HP adjustment/alignment would be completely independent from the tolerance of the radius on top of the KCPs.


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Figure A1-1Precision is Independent of KCP Top Surface


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APPENDIX 2MEASUREMENT OF WAFER SEATING PLANESNOTICE: The material in this Appendix is an official part of SEMI M80 and was approved by full letter ballot procedures on February 3, 2011.

A2-1 Suggested Method for Measuring Wafer Seating PlanesA2-1.1 Although wafer seating plane measurement is not limited to any specific method, it is recommended that, for inspection purposes, the wafer seating plane can be measured at three points at the front of the 450 FOSB. One point is at the intersection of the front of the wafer and the BP and two points are at the intersection of the wafer and symmetric planes located 30 degrees from BP.

A2-1.2 Wafer height at each of the 25 slots is to be measured from HP, and single crystal wafers are to be used.

A2-1.3 Three front measurement points cannot characterize the entire wafer seating plane perfectly; therefore, this measurement method is recommended for the purpose of ongoing inspection during the manufacturing of 450 FOSB. For qualification purposes, the carrier supplier may choose to provide more detailed wafer seating plane measurement data to the end user.

Figure A2-1Wafer Plane Measurement


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APPENDIX 3METHOD FOR MEASURING CARRIER CENTER OF GRAVITYNOTICE: The material in this Appendix is an official part of SEMI M80 and was approved by full letter ballot procedures on February 3, 2011.

A3-1 Suggested Method Using Load CellsA3-1.1 The carrier’s center of gravity (COG) can be measured by using three load cells.

A3-1.2 Each of the load cells should provide a support point similar to the KCPs defined in this standard.

A3-1.3 The location of the pins should conform to SEMI E154 in order to provide a reference for the FP and BP.

A3-1.4 Variables

A3-1.4.1 F1, F2 and F3 — The downward force on each pin due to the weight of the carrier.

A3-1.4.2 Lx — The distance parallel to the FP between the front KCPs.

A3-1.4.3 Lx/2 — The distance from each front KCP to the BP.

A3-1.4.4 Ly — The distance parallel to the BP between the front KCPs and the rear KCP.

A3-1.4.5 Lx0 — The distance from the BP to the COG.

A3-1.4.6 Ly0 — The distance from the rear KCP to the COG.

A3-1.5 Derivation of Lx0 Calculation:

F1 × Lx0 + F3 × (Lx / 2 + Lx0) = F2 × (Lx / 2 − Lx0)

F1 × Lx0 + F3 × Lx / 2 + F3 × Lx0 = F2 × Lx / 2 − F2 × Lx0

(F1 + F2 + F3) × Lx0 = (F2 − F3) × Lx / 2

Lx0 = Lx / 2 × (F2 − F3) / (F1 + F2 + F3)

A3-1.6 Derivation of Ly0 Calculation:

F1 × Ly0 = F2 × (Ly − Ly0) + F3 × (Ly − Ly0)

F1 × Ly0 = F2 × Ly − F2 × Ly0 + F3 × Ly – F3 × Ly0

(F1 + F2 + F3) × Ly0 = (F2 + F3) × Ly

Ly0 = Ly × (F2 + F3) / (F1 + F2 + F3)

15:[16:] For the Primary KCPs Lx = 342.4 mm (x18 × 2) and Ly = 309.5 mm (y15 + y16). For the secondary KCPs Lx = 265.3 mm (x19 × 2) and Ly = 234.5 mm (y17 + y18).


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Figure A3-1Center of Gravity Measurement


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APPENDIX 4WAFER SHIPPING BOX REUSE

NOTICE: The material in this Appendix is an official part of SEMI [designation number] and was approved by full letter ballot procedures on [A&R approval date].

A4-1 Consideration for reuse of 450 FOSB A4-1.1 The 450 mm Wafer shipping box shall be reusable in view of the wafer manufacturing cost and environmental concerns.

A4-1.2 All main parts such as the body and door of the wafer shipping box shall be designed to allow for multiple reuse cycles without compromising wafer quality.


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RELATED INFORMATION 1 APPLICATION NOTESNOTICE: This Related Information is not an official part of SEMI M80 and was derived from the work of the global Silicon Wafer Technical Committee. This Related Information was approved for publication by full letter ballot procedures on February 3, 2011.

R1-1 Referenced Standards and DocumentsR1-1.1 SEMI Standards and Safety Guidelines


R1-1.2 Other Documents

SEMI AUX018 — 300 mm FOUP/Load Port Interoperability Report

R1-2 NotesR1-2.1 The automation handling features do not need to be molded into the plastic shell of the 450 FOSB, but can be attached as a framework around the shell.

R1-2.2 Skewness, warp, rock, and stiffness are implicitly defined in the geometric tolerances.

R1-2.3 Dimension y4 is given as a maximum based on the maximum distance to the port door specified in SEMI E154.

R1-2.4 The position tolerance of the door of the 450 FOSB is likely to be much larger than the position tolerance of the door pins. To make both manual and automated door opening easier, it is recommended that the holes for the door pins on the door of the 450 FOSB have openings with a lead-in capability.

16:[17:] If the bottom of the 450 FOSB does not extend below the bottom conveyor rail, the conveyor rail may become contaminated and may distribute particles.

R1-2.5 Although both of the retaining features on the bottom of the 450 FOSB must be able to withstand a force in any direction of f001, continuously applied stress may result in plastic deformation.

R1-2.6 In order to minimize particle generation when the 450 FOSB door is opened or closed, it is recommended that the tolerance between the 450 FOSB door and its frame be larger than the tolerance between the 450 FOSB door pin holes and FIMS door pins.

R1-2.7 One type of carrier presence sensor uses a beam of light with an optical detector that is triggered when the beam of light is attenuated as it passes through the 450 FOSB shell.

R1-2.8 The use of the door pins for 450 FOSB door lead-in to the load port door is not recommended. The door pins should be only used to limit the maximum displacement of the 450 FOSB door while on the load port door. Neither the FOUP nor 450 FOSB door positions should change as a result of engaging or disengaging the door pins. When the Load port experiences utility loss (such as EMO, vacuum loss, electrical failure, etc.), the door pins may be used to maintain the 450 FOSB door’s position, and to ensure that the 450 FOSB door does not fall off. The clearance between the Door Pins and the Door Pin Holes should be less than the clearance between the outer edge of the 450 FOSB Door and the inner edge of the 450 FOSB Door Frame. Balancing these tolerances is a 450 FOSB design issue related to the Seal Area specified in SEMI E154. The diameter of the Door Pin Holes should be designed to accommodate the Door Pin tolerances defined by x239, z238 and d231 in the relevant SEMI Mechanical Interface Specification for 450 mm Load Ports, and the Door Pin Hole location tolerance in 450 FOSB.

R1-2.9 It is recommended that the 450 FOSB have a capability to roughly position the 450 FOSB door in the 450 FOSB frame during the door close sequence (during either return of the 450 FOSB door or during latching of the 450 FOSB door). This positioning capability should keep the clearance between the 450 FOSB frame and the 450 FOSB door larger than sum of the 450 FOSB (self) tolerance and the door pin tolerance in SEMI E154 along with the 450 FOSB door’s circumference. Possible methods for accomplishing this may include positioning by latch motion and positioning by a slope between the 450 FOSB frame and the 450 FOSB door.


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R1-2.10 There is a gap between the load port door and door frame, which allows clean air from the EFEM minienvironment to displace the volume of the carrier door when it is opened. The size of the carrier door should be coordinated with the accuracy of its placement on the load port door, so this gap is kept clear on all sides when the carrier door is opened. The half-width of the load port door is x233 = 257 ± 0.25 mm, and the half-height is z233 = 179 ± 0.5, so the size of the carrier door plus its positioning error should be kept below these values. If the half-width plus placement error exceeds 257 mm a side gap may be partially covered. If the half width plus placement error exceeds 259 mm, a side gap may be completely covered. If the half-height plus placement error exceeds 179 mm the top and/or bottom air gap may be partially covered. If the half-height plus placement error exceeds 181 mm, the top and/or bottom air gap may be completely covered. Partial covering is shown in the yellow area of Figure R1-1, the red areas signifies complete covering. See Figure R1-1.

R1-2.11 It is recommended that the 450 FOSB have a lead-in mechanism on its latch key holes. This lead-in mechanism should compensate for the 450 FOSB’s latch key hole location error. See Figure R1-2.

R1-2.12 It is recommended that the latch key hole mechanisms have some flexibility in their position for compliance with the latch key positions. The purpose of this is to adjust for any discrepancy in rotation axis between the latch key and the latch key hole mechanism. As shown in Figure A4-2, if only one side of the latch key pushes on the inside of the latch key hole, the latch key cannot rotate more than half way.

R1-2.13 It is recommended that the torque required to rotate the 450 FOSB latch key holes be kept small enough that it will not produce movement of the 450 FOSB door in the x and z directions during latch key rotation.

R1-2.14 It may be possible for latches to fail to engage the carrier frame properly. See SEMI AUX018.

R1-2.15 It is recommended that the latch key holes be maintained in the position that unlocks the 450 FOSB door from the 450 FOSB (ψ = 0 ± 1° as defined in the SEMI E154 while the 450 FOSB is open and in the position that locks the 450 FOSB door to the 450 FOSB (ψ = 90 ± 1°) while the 450 FOSB is closed. One method to accomplish this is to have the 450 FOSB latch key hole mechanisms snap into both end points of their rotation (ψ = 0 ± 1° and ψ = 90 ± 1°) using a detent mechanism. The torque required to overcome such a detent mechanism should not exceed f230 (as defined in Table 1of this document).

R1-2.16 It is recommended that the space approximately 2 mm above z18 (above the top wafer support) be kept clear of vertical surfaces so that if a wafer is inserted above the extraction volume, it will be forced down rather than collide.


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Figure R1-1Coordinating Carrier Door Size and Placement Accuracy

Figure R1-2Displacement Enabled by Flexibility Around Latch Key Hole Block


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Latch key can rotate full 90°

Latch key rotation stops before 90°

Figure R1-3Need for Latch Key Hole Flexibility

R1-3 Carrier Options ChecklistR1-3.1 Table R1-1 can be used for communicating the compliance of 450 FOSB’s to this Standard and the options chosen:

Table R1-1

Section Optional Feature Choice

17.1 Rear wafer support yesor

no11.3 Info pad A height up (pad missing)

or down (pad present)

11.3 Info pad B height up (pad missing)or

down (pad present)11.3 Info pad C height up (pad missing)


11.3 Info pad D height up (pad missing)or

down (pad present)


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Section Optional Feature Choice

11.3 Info pad E height up (pad missing)or

down (pad present)11.3 Info pad F height up (pad missing)


11.3 Lockout Pad 1 up (pad missing)or

down (pad present)11.3 Lockout Pad 2 up (pad missing)



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RELATED INFORMATION 2 CONSIDERATIONS FOR DETERMINING DIMENSIONSNOTICE: This Related Information is not an official part of SEMI M80 and was derived from the work of the global Physical Interfaces & Carriers Committee. This Related Information was approved for publication by full letter ballot procedures on February 3, 2011.

R2-1 Referenced Standards and DocumentsR2-1.1 SEMI Standards and Safety Guidelines


SEMI M74 — Specification for 450 mm Diameter Mechanical Handling Polished Wafers

NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.

R2-2 DiscussionR2-2.1 The Physical Interfaces & Carriers Committee considered the specifications in SEMI M74, SEMI E154, and this Document to determine how much space between wafers and wafer supports is needed for safe handling of wafers. In addition, the following issues were considered:

R2-2.1.1 Wafer Deflection Under Gravity — The deflection caused by gravity of a wafer resting on the carrier supports directly above the EE pick-up points and at a 30 degree angle from the line of EE stroke. Once the wafer has been lifted by the EE, the deflection will be determined by the design of the EE and is not considered to add to the budget for the EE with wafer. The reason for measuring at 30 degrees is that the height of the EE pads allows for some droop between the pads without the wafer touching the EE structure. Based on the measurements made by ISMI and simulations done by task force participants, the committee has used the value of 0.50 mm.

R2-2.1.2 Process Induced Warp — 300 mm wafers have had process induced warp as great as 1 mm. When this is extrapolated to 450 mm wafer size, the warp would be 1.6 mm. With 300 mm wafers, the warp has produced wafers with a convex top surface and a concave top surface. When an EE is inserted between two wafers the clearance is reduced by 3.2 mm. Once a wafer has been picked up, the effect on clearance will be 1.6 mm since the EE has moved up away from the wafer below.

R2-2.1.3 Carrier Placement Error — The maximum misalignment of the carrier that is expected, based on prototype testing, is 0.2 mm. This error results in the carrier not fully seating on the KCPs, so it is always a positive error.

R2-2.2 After testing and discussion the committee has settled on a wafer pitch of 12 mm.

R2-3 Height of Wafer Extraction and Set-down VolumesR2-3.1 The height of extraction and set-down volumes dimensions is equal to the clearance between wafer supports minus to tolerance of the wafer planes and the carrier placement error. Since the carrier placement error serves to raise the wafer supports above their nominal position, it causes the volumes to be offset. So the volumes start 0.7 mm above nominal wafer seating plane and extend to within 0.5 mm of the next wafer support.

R2-4 KC SystemR2-4.1 The central approach in scaling the KC concept to the 450 FOSB was to try to make the current 300 mm style of pin the plan if possible. While mass of fully loaded 300 mm carriers was 7.6 kg, the mass of 450 mm carriers is estimated to be 24 kg. The increased weight load of the 450 FOSB meant that the existing 300 mm pin would have provided a contact pressure that could have exceeded safe deformation limits for the likely carrier materials.

R2-4.2 The key structure of the 450 FOSB bottom consists of a pedestal extending below the lowest 450 FOSB door surface. A number of advantages can be obtained from this approach:

More vertical space can be used to increase the “lead-in” or capture area during handoff (more discussion of this in the detailed discussion of the groove below).


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Provides separate heights for the conveying surfaces and the door features, so that both features can be better optimized for their intended purposes.

Conveyor rail can be moved inward from the edge, so that the conveying surface does not define the lateral envelope of the carrier (as both the conveyor rails and the forklift structures did in the 300 mm FOSB).

The pedestal base (interior of the conveyor rails) can be made slightly lower (farther from HP) than the conveying surfaces, providing areas separate from transport structures that can be defined (in later ballots) for sensing features (presence, placement, lockout, info pad, etc.).

Adding these features below the plane of the KCPs allows these advantages to be made without requiring additional height between the top of the KCPs and the plane of the first (bottom-most) wafer. This is important because it is that dimension which defines the height of the wafer planes above the floor.

R2-4.3 The KCPs themselves are similar in shape to those at 300 mm, but are scaled up to control the deformation created by the contact pressure between them and the carrier groove materials. Several different geometries were considered, geometry “B” was selected and is shown below, along with the geometry used for 300 mm systems.

R2-4.4 In all cases the materials analyzed were stainless steel for the KCPs and plastic for the grooves.

Table R2-1 Contact Stress at KCPs

Design 300 mm (Shape A) 450 mm (Shape B)

Description Current 300 mm KCP 20 mm pin with offset radius 4 mm transitionPin Diameter (mm) 12 20Radius Minor (mm) 7.127 11.585Radius Major (mm) 15 30

Math. Equiv. 5 8Applied angle 45 degrees 45 degrees

Carrier Mass (kg) 7.6 24Force (Newtons) 74.53 235.54

Force per pin 24.84 78.52Stress Ratio 0.92 0.92

Relative contact stress 53,071,124 53,783,837Result Used for 300 mm 1.34% higher stress


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Figure R2-2 Shapes from Table R2-2

R2-4.5 The goal is that even for the most heavily loaded 450 FOSB, the relative contact stress should not exceed that for 300 mm. To that end, the contact radius is increased from 15 mm to 30 mm and the pin diameter is increased from 12 mm to 20 mm. The resulting wear on the grooves mating to the 450 mm KCPs should thus be no worse than that of their 300 mm counterparts.

R2-4.6 One common issue for 300 mm FOUP was the occasional problem with the KC caused by improper lead-in or “stickiness” that prevented the pin from seating properly. The lead-in issue caused issues with AMHS handoffs, and caused a need for additional axes of motion to rotate the FOUP around a vertical axis to ensure proper capture by the pins for an arbitrarily placed tool and load port. The stickiness issue causes improper seating and can cause bad wafer handling.

R2-4.7 To help address both of these issues, the approach in the 450 mm standard has been to define key aspects of the groove surface of the carrier which mates with the KCPs. Doing so allows an increased height for improved range of lead-in, and specifying the groove angle at 45 ± 6 degrees (θ1) allows for a good balance (trade-off) between capture range and increased 450 FOSB height. This results in a taller KCP height for the load port or shelf. Conversely, the distance can be thought of as specifying an upper plane of an exclusion volume from which load port or shelf features (unrelated to sensing) shall not enter.

Increased “capture” or “lead-in” of up to 15 mm (r15) in all directions when the 450 FOSB is oriented properly in angle.

Rotations of the 450 FOSB around its z axis of a few degrees can still allow enough capture range so that 450 mm AMHS vehicles and systems may be able to have better speed and reliability for the factories.


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R2-4.8 To describe the capture, consider Figure R2-2:

Figure R2-1 KCP and Groove Detail

R2-4.9 Figure R2-2 shows how the specification ensures that even a 15 mm offset can be captured. Note that because of the shape of the pin and the fact that the contact point is at the 45-degree plane, not at the tip of the point, so that the opening of the groove is larger than 15 mm to guarantee a 15 mm offset can be corrected.

R2-4.10 An angular misalignment of the 450 FOSB during handoff is also possible. Ensuring a 15 mm lead-in for the case which is properly aligned angularly will allow a greater tolerance for angular misalignment than in the 300 mm case.

R2-4.11 Another issue at 300 mm was the fact that the wafer center was not the center of mass of the carrier. Thus AMHS or other systems that handled the 450 FOSB had to deal with gravitational torques that changed in magnitude depending on the number of wafers in the carrier. This limited transfer speeds and added complexity to handling.

R2-4.12 At 450 mm, the approach has been to align the center of mass of the carrier with the center of the automation flange, and allow this to be forward of the FP and the center of the wafers. Doing so has the advantage not only of simpler 450 FOSB handling (the critical handling feature will all be weight-balanced for any number of wafers in the 450 FOSB), but also eliminates the need for a counterweight. To compensate for the change in center of gravity, the front KCPs were moved forward to keep the loads on the pins approximately equal.

R2-4.12.1 The location of the KCPs was designed to allow a forklift to pass under the carrier from the front and from the side to transfer the carrier from primary to secondary pins.


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R2-4.13 In keeping with the philosophy of explicitly designating guiding and sensing surfaces in the 450 mm standards, the outside edges of the conveyor rails is called to be vertical surface at x5 and y5 with material (for guiding surface) extending at least 9 mm up. No blend radius has yet been defined for the junction of the conveying surface and the vertical guiding surface, but that corner is meant to be relatively sharp (blend radius is suggested to be less than 0.5 mm). To provide a volume for the conveyor edge rails and any corresponding sensing mechanics, the volume external to x5 and y5 from the BP and FP is defined as clear of 450 FOSB features up to the height of at least 8 mm. This is true not only for “pedestal” features but also for the bottom surface of any door flange of the shell.

R2-4.14 The conveyor rails have been defined as having a square footprint centered at the origin. This will allow conveyance of the 450 FOSB in any of the four orientations on the same conveyor unit, enabling possible new handling and loading approaches in the factory. Having the rails the same length and centered close to the carrier center of mass will avoid handling issues such as twisting or undulating, and should improve vibration performance during transport and handling.


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RELATED INFORMATION 3 CARRIER HOLD-DOWN FEATURENOTICE: This Related Information is not an official part of SEMI M80 and was derived from the work of the global Silicon Wafer Committee. This Related Information was approved for publication by full letter ballot procedures on February 3, 2011.

R3-1 The hold-down features on the bottom of the 450 FOSB are meant to interact with their counterparts on the load port and automatic material handling systems (AMHS) systems to provide multiple uses for hold-down and support, namely:

On load ports, force for frame-to-shell seal

On load ports, force to counter door-closing force during that action

On load ports and shelves, force to impede unauthorized removal

On AMHS transfer devices (robots, AGV, OHS, etc.), forces to avoid loss of 450 FOSB during rapid acceleration/deceleration/EMO

R3-1.1 Load Port Hold-Down Interactions — The load port is the primary user of the hold-down feature. In this Related Information, the Standards team felt it was important for prospective users of the Standard to understand what the hold-down function WAS and WAS NOT. The hold-down is NOT intended to be a work-around for an otherwise nonfunctional KC; that is, in the presence of only gravity, the carrier is always expected to slide down to the proper seated position without the need for other external forces. For example, following a small “upset” force (human push, cart bumping the load port, etc.) the 450 FOSB should return to its proper seating on the pins without the need for external forces beyond gravity. This statement is also expected to be true for the case where the carrier is docked with its door OPEN and the (optional?) seal between the load port frame and carrier shell is maintained; any “maintenance” downward force exerted by the load-port hold-down device onto the carrier hold-down feature is expected to be small. This force is meant to be kept relatively small so that neither the carrier shell nor the wafer support plane is altered by the hold-down.

R3-1.2 During door opening (and especially door closing) there may be substantial forces being applied to the 450 FOSB shell. At 300 mm, these were 9 N for FOUP and up to 110 N for FOSBs. At 450 mm the values are still not set, and may depend on the type of seal needed to hold environment inside the carrier. In fact, given some minimum “lead-in” for the 450 FOSB door into its shell, some slight horizontal motion may occur during the door closing process. Multiple designs could accomplish this, such as the various physical analogs of the force profile of one light spring (for the constant force) in parallel with a heavy spring with a non-elastic slack (so that a large force can be applied but only after some small motion). The direction of the resultant force would be downward and toward the door, to act against the tendency of the door-closing operation to push the front KC grooves up off their seated position on the pins.

R3-1.3 The final load-port hold-down functionality is to prevent unauthorized removal of the carrier during use. While automated systems should be able to avoid this through the (to-be-developed) next generation handoff protocol, there is still an opportunity for carriers to be removed in a “semi-automated” fashion (using a mechanically assisted lifting cart, for example). If these semi-automatic lifters had a force-actuated switch, it could trigger an alarm when attempting to operate against a hold-down. This functionality would imply that the switch force would have to be set at a force significantly above the maximum weight of a loaded 450 FOSB (say 130%?). Conversely, this sets a minimum “tear away” force on the hold-down feature on the carrier, which should be the maximum “alarm” force times a safety factor. One possible value would be 200% of the maximum carrier weight. This value is consistent with the “emergency stop” function described in the next paragraph.

R3-2 AMHS Hold-Down Interactions — AMHS systems (such as RGV, AGV, stocker crane end effectors, or other robotic lifters) may need to hold the 450 FOSB by the secondary KCPs. The Hold-down features are also designed to be used by the AMHS system to help prevent unwanted tipping or sliding of the carrier, perhaps during a robotic EMO event. The forces from these events may be in different directions, depending upon the direction of robotic motion at the time of the EMO. In the worst case of the fastest robot, this deceleration could be on the order of several “g” so that the holder would need to maintain multiple carrier weights (if it is to be the only feature used for retention during such an event).


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R3-2.1 Hold-Down Feature Shape to Support Different Hold-Down Elements — The shape and size of the 450 FOSB hold-down feature is designed to allow differing access methods for differing applications, in keeping with the 450 mm standards philosophy of using fewer features to do multiple functions to simply the standards and implementation. The front (door-side) feature, with its 30-degree slope and shelf, will support a “hook” style retainer facing toward the carrier door, in a way that supports downward and forward forces to be applied by the hooks. The “mirroring” of this feature to the rear would allow access by “V”-shaped keys which rotate about their vertical access, or for “T” shape keys, similar in shape to the E62 keys (but with different forces and motions, of course). The point of this related information of the standard is not to pick a design, but to allow multiple innovations to address the problem but understand the basic multiple requirements.


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RELATED INFORMATION 4 CARRIER PRESENCE AND PLACEMENT AREASNOTICE: This Related Information is not an official part of SEMI M80 and was derived from the work of the global Silicon Wafer Committee. This Related Information was approved for publication by full letter ballot procedures on February 3, 2011.

R4-1 One of the key “Lessons Learned” from the 300 mm Standards was that considerable problems were created by leaving sensing areas undefined in location and purpose, as load port and AMHS makers used locations and methods that did not always have a corresponding feature on the carrier side.

R4-1.1 This 450 mm Standard, defines specific locations and characteristics for sensing and information. One example of these is the presence and placement sensing areas on the carrier bottom.

R4-1.2 The purpose of Presence sensing is to alert the manipulating device (load port, robot, AMHS device) that a carrier (or something) is present, but may or may not be correctly placed and loaded yet for processing or handoff.

R4-1.3 In the case of a load port, the presence sensing is primarily to ensure that automated deliveries do not occur to an occupied location, even if the carrier occupying that location is misplaced. It must therefore still be functional even if the carrier were, say, sitting atop the pins but not seated in the grooves. Even though carriers will not be “hand-delivered” at 450 mm, they may be “semi-automatically” delivered (using human-steered lifting assistance). Thus the load port still needs to be able to detect when a 450 FOSB is misplaced. The approach taken in the 450 mm standard is to define a flat, opaque (at least to red and infrared, the most common LED sensor wavelengths) spot about the center of the wafer.

R4-1.4 Typical tests used are to move the carrier:

R4-1.4.1 Leftward or rightward a fixed distance from seated, and still be detectable. The area centered on the FP and BP allows a full 19 cm in either direction to be detected. An alternate proposal that limits the band to 5 cm either side of the BP would allow motion of 5 cm either left or right to be detected (more if sensors were angled).

R4-1.4.2 Forward a fixed distance. The band proposed in this ballot would extend 30 mm from the FP, so that a sensor at the 450 FOSB center could see a 3 cm forward movement and still be detectable (note under the current likely load port proposal the carrier would then be touching the load port door already).

R4-1.4.3 Backward a fixed distance. Again, the band would ensure detection up to a motion of 3 cm away from the door. Misplacement farther than that would require a larger dark spot/bottom plate, or an opaque substrate in or near the bottom slot of the carrier.

R4-1.4.4 Rotations about the carrier center (of a few degrees, or a right angle, or reversed). The band at the carrier center (and the corresponding sensor likewise on the load port) will allow the carrier to be detected with arbitrary angular orientation (although it should be noticed that on a load port only a few degrees of misalignment would be possible before the carrier would interfere with the load port door or the carrier on the adjacent load port.

R4-2 Placement Sensing False PositiveR4-2.1 A carrier placement false positive may occur due to offset placement of a carrier on the load port if the KCPs slip into open cavities in the carrier bottom.


Doc. 5877 SEMI



Date: 5/5/23

RELATED INFORMATION 5 CONSIDERATIONS FOR MANUAL HANDLINGNOTICE: This Related Information is not an official part of SEMI M80 and was derived from the work of the global Silicon Wafer Committee. This Related Information was approved for publication by full letter ballot procedures on February 3, 2011.

R5-1 Manual Handling — A fully-loaded 450 FOSB will have a mass of about 24 kg, which means it will be too heavy for manual handling during normal production or maintenance activities. It is anticipated that manual handling will only occur when recovering from an abnormal situation. Consequently, there is no provision for manual handles.

R5-1.1 If temporary manual handles are provided:

Features on the 450 FOSB for attaching temporary handles shall not increase the overall size of the carrier when the handles are not installed.

When the temporary handles are installed, automated handling of the carrier shall be blocked.

R5-2 External Packaging — Due to the fully-loaded mass of the 450FOSB, it is recommended that any external packaging used to ship the 450 FOSB be designed to allow for automated removal of the 450 FOSB.

NOTICE: SEMI makes no warranties or representations as to the suitability of the Standards and Safety Guidelines set forth herein for any particular application. The determination of the suitability of the Standard or Safety Guideline is solely the responsibility of the user. Users are cautioned to refer to manufacturer’s instructions, product labels, product data sheets, and other relevant literature, respecting any materials or equipment mentioned herein. Standards and Safety Guidelines are subject to change without notice.

The user’s attention is called to the possibility that compliance with this Standard or Safety Guideline may require use of copyrighted material or of an invention covered by patent rights. Entegris, Inc. has filed a statement with Semiconductor Equipment and Materials International (SEMI) asserting that licenses will be made available to applicants throughout the world for the purpose of implementing this Standard or Safety Guideline without unfair discrimination. Crossing Automation has filed a statement with Semiconductor Equipment and Materials International (SEMI) asserting that licenses will be made available to applicants throughout the world for the purpose of implementing this Standard or Safety Guideline without unfair discrimination. Attention is also drawn to the possibility that some elements of this Standard or Safety Guideline may be subject to patented technology or copyrighted items other than those identified above. SEMI shall not be held responsible for identifying any or all such patented technology or copyrighted items. By publication of this Standard or Safety Guideline, SEMI takes no position respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this Standard or Safety Guideline. Users of this Standard or Safety Guideline are expressly advised that determination of any such patent rights or copyrights and the risk of infringement of such rights are entirely their own responsibility.


Doc. 5877 SEMI


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