Diamond Wire Saw DW 291 - meyerburger.com · Diamond Wire Saw DW 291 Smart slicing technology for...
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Diamond Wire Saw DW 291 Smart slicing technology for mono- and multi-silicon Increased throughput 870 mm web length (+34%) 33 m/s wire speed (+10%) 10 m/s 2 acceleration (+25%) 2x 68 kW motor power (+95%) Thin wire capability Diamond Wire Management System (DWMS) High-end motion control technology 93% lower pulley and load cell inertia 40% shorter wire path – shortest in industry 40% higher wire tension accuracy Robustness and durability Compact mineral cast machine frame Lowest temperature and vibration dependency Rigid coupling of wire guide roll and bearing Automated central lubrication system Higher degree of automation and easy operation 75% less HMI interaction for machine operation Dialog based operation Best accessibility for operation and maintenance personnel Industry 4.0 capable All figures compared to DW 288 Series 3
Transcript of Diamond Wire Saw DW 291 - meyerburger.com · Diamond Wire Saw DW 291 Smart slicing technology for...
Diamond Wire Saw DW 291Smart slicing technology for mono- and multi-silicon
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Increased throughput
870 mm web length (+34%) 33 m/s wire speed (+10%) 10 m/s2 acceleration (+25%) 2x 68 kW motor power (+95%)
Thin wire capability
Diamond Wire Management System (DWMS) High-end motion control technology 93% lower pulley and load cell inertia 40% shorter wire path – shortest in industry 40% higher wire tension accuracy
Robustness and durability
Compact mineral cast machine frame Lowest temperature and vibration dependency Rigid coupling of wire guide roll and bearing Automated central lubrication system
Higher degree of automation and easy operation
75% less HMI interaction for machine operation Dialog based operation Best accessibility for operation and maintenance personnel Industry 4.0 capable
All figures compared to DW 288 Series 3
Conventional DWMS
Working area / Storage area
Highest throughput at lowest cost
Market-proven and award-winning DWMS including resharpening technology and extended winding feature
Patented in China (Patent No. CN 104411434B) Lowest wire consumption Enables faster cutting times Optimized for thinner wire Lowest wire breakage rate
Cropping Bricking Grinding Gluing Wafering De-gluing Separation Cleaning Inspection
M4 capableOptimized for M4 (161.7 mm) wafer format
HMINew HMI on 19" touch screenProduction assistantGlobal process recipesEasy to train, easy to use
High throughput33 m/s wire speed 10 m/s2 acceleration
Cleaner wafer 490 l cutting fluid tank
Thin wire capability
More wafers per kilogram of silicon
Thinner wire Less silicon kerf More wafers
60 µm80 µm 70 µm
60 µm core wire 50 µm core wire 40 µm core wire
Future
DWMS50 µm wire managementcapability
High capacity 870 mm web length
Shortest wire pathOnly < 1.9 m on one sideEasy wire set-up and constant tension
Diamond Wire Management System (DWMS)
Robust machineMineral castLow vibration, low noisePerfect alignment of all relevant machine parts
Slicing process expertise
Established slicing recipe for mono- and multi-Si Optimized consumables and wear parts to attain best wafer quality at lowest cost of ownership
Turn-key process solution– Latest developments of thin diamond wire – Blaser water-based cutting fluid – Beam and glue for thin wire and thin wafer capability
Dedicated wafering R&D line and laboratory Exclusive partnership from leading consumable suppliers
Cropping Bricking Grinding Gluing Wafering De-gluing Separation Cleaning Inspection
Human Machine Interface (HMI)
New HMI (MBVis) enables intuitive operation Highest automation degree for preparation, slicing and retraction
User friendly and fast dialog based production assistant
Configurable user levels Multilingual interface Integrated offline help menu
Shorter cutting time, higher throughput, excellent wafer surface and quality
– Wire speed 33 m/s – Wire acceleration 10 m/s2
Lower wire bow due to higher wire tension Suitable for 3 multi-Si brick load Multi-SiMono-Si
Higher average wire speed
Maximized uptime lowers costs
Efficient and proactive service Highly skilled local service engineers Optimized Total Cost of Ownership with long-lifetime parts
Condition monitoring and predictive maintenance to avoid downtime
Swift response time with local parts warehousing Local overhaul service for quick processing of wire guide roller (WGR) regrooving, recoating and bearing overhaul
Customized technical training and process support, HMI assisted
Technical data at a glance
Meyer Burger (Switzerland) AG, [email protected], www.meyerburger.com
Options & Dimensions
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Cropping Bricking Grinding Gluing Wafering De-gluing Separation Cleaning Inspection
Options
Wire speed, acceleration (33 m/s, 10 m/s2) Thin wire capability 50 µm Re-sharpening feature
Dimensions (mm)
unit DW 291 Features DW 291 Options
Web length [mm] 870
Max. workpiece dimensions [mm] 165 × 165
Wire speed [m/sec] 30 33
Wire acceleration [m/s2] 8 10
Min. wire diameter [µm] 60 50
Min. wafer thickness [µm] 100 (mono-Si), 140 (multi-Si)
Workpiece holders [mm] 860
Wire guide roller axis distance [mm] 390
Wire on working spool [m] max. 7000 (60 µm)
Cutting fluid tank [l] 490
Machine weight [kg] 7900
~ 2
500
~ 2
300
Side viewFront view
~ 1200 ~ 1600
~ 2000 ~ 3700
Extended winding Automatic Cutting Fluid Exchange Utility Consumption Measurement MES interface based on PV2 protocol
