Design for Additive Manufacturing of Wide Band Gap Power Electronics Components · 2016-07-01 ·...
Transcript of Design for Additive Manufacturing of Wide Band Gap Power Electronics Components · 2016-07-01 ·...
![Page 1: Design for Additive Manufacturing of Wide Band Gap Power Electronics Components · 2016-07-01 · Design for Additive Manufacturing of Wide Band-Gap Power Electronics Components ERCAN](https://reader033.fdocuments.net/reader033/viewer/2022042111/5e8bf6fca47cfe4305229b3b/html5/thumbnails/1.jpg)
Design for Additive Manufacturing of Wide Band-Gap Power Electronics ComponentsERCAN M. DEDE, MASANORI ISHIGAKI , SHAILESH N. JOSHI , & FENG ZHOU
TOYOTA RESEARCH INSTITUTE OF NORTH AMERICA
J U N E 1 3 , 2 0 1 6
I N T E R N AT I O N A L S Y M P O S I U M O N 3 D P O W E R E L E C T R O N I C S I N T E G R AT I O N A N D M A N U FA C T U R I N G ( 3 D - P E I M )
![Page 2: Design for Additive Manufacturing of Wide Band Gap Power Electronics Components · 2016-07-01 · Design for Additive Manufacturing of Wide Band-Gap Power Electronics Components ERCAN](https://reader033.fdocuments.net/reader033/viewer/2022042111/5e8bf6fca47cfe4305229b3b/html5/thumbnails/2.jpg)
Acknowledgementso National Renewable Energy Lab
o Mr. Kevin Benniono Dr. Gilbert Morenoo Dr. Sreekant Narumanchi
o Purdue University – CTRC o Professor Suresh V. Garimellao Dr. Matthew J. Rau
o Toyota Central R&D Labso Dr. Tsuyoshi Nomura
o Toyota Motor Corporationo Mr. Tomohiro Takenaga
o Toyota Technical Centero Dr. Yan Liu
o Wolfspeedo Dr. Kraig J. Olejniczako Dr. Brandon Passmore
2E.M. DEDE, ET AL. 2016 - DESIGN FOR ADDITIVE MANUFACTURING OF WIDE BAND-GAP POWER
ELECTRONICS COMPONENTS
![Page 3: Design for Additive Manufacturing of Wide Band Gap Power Electronics Components · 2016-07-01 · Design for Additive Manufacturing of Wide Band-Gap Power Electronics Components ERCAN](https://reader033.fdocuments.net/reader033/viewer/2022042111/5e8bf6fca47cfe4305229b3b/html5/thumbnails/3.jpg)
OutlineoOverview of Research Group
oMotivation for 3D Integration
oWhy Explore Additive Manufacturing?
oApplications for Additive Manufacturingo Circuit-Level Concepts
o System-Level Concepts
o Future Opportunities & Challenges
o Conclusions
oReferences
3E.M. DEDE, ET AL. 2016 - DESIGN FOR ADDITIVE MANUFACTURING OF WIDE BAND-GAP POWER
ELECTRONICS COMPONENTS
![Page 4: Design for Additive Manufacturing of Wide Band Gap Power Electronics Components · 2016-07-01 · Design for Additive Manufacturing of Wide Band-Gap Power Electronics Components ERCAN](https://reader033.fdocuments.net/reader033/viewer/2022042111/5e8bf6fca47cfe4305229b3b/html5/thumbnails/4.jpg)
Overview of Research Groupo Toyota Research Institute of North America
o Electronics Research Department
E.M. DEDE, ET AL. 2016 - DESIGN FOR ADDITIVE MANUFACTURING OF WIDE BAND-GAP POWER ELECTRONICS COMPONENTS
4
Research focused on environment, safety, and human interaction
Optimized Electro-Thermal Power Systems
Intelligent & WBG
Devices
(Lab E-1 & E-2)
High Temperature Packaging
(Lab E-2)
Advanced Circuit & Control
(Lab E-1 & E-2)
Thermal Energy
Management
(Lab E-2)
Development of Automotive Phased
Array Radar
Research on TLP for Advanced Packaging
Optimization for Air, Single, Two-Phase Cooling
Heat Flow Control for Electronics
Center-to-edge Flow
Inlet To outlet
Thermocouple holes
Figure 2: Zoomed cross section views of the diffusion
bonded multi-device cold plate including the inlet region
with a single cooling cell on the right and the middle
transition region with a second cooling cell on the left.
Note that the blue arrows indicate the coolant flow path
through the manifolds and local cooling cells.
Investigation of Next Gen. SiC, GaN Devices
Development of 14X Power Density SiCCharger Prototype
(a) Binary-Composite,
Ni-Sn
(b) Ternary-Composite,
Ni-(Ag-Al)-Sn
10 um
Ni Ni3Sn4
10 um
Al
![Page 5: Design for Additive Manufacturing of Wide Band Gap Power Electronics Components · 2016-07-01 · Design for Additive Manufacturing of Wide Band-Gap Power Electronics Components ERCAN](https://reader033.fdocuments.net/reader033/viewer/2022042111/5e8bf6fca47cfe4305229b3b/html5/thumbnails/5.jpg)
Motivation for 3D Integrationo Current Power Control Unit (PCU) architecture – compact, highly integrated packaging
E.M. DEDE, ET AL. 2016 - DESIGN FOR ADDITIVE MANUFACTURING OF WIDE BAND-GAP POWER ELECTRONICS COMPONENTS
5
4th Gen. PCU Power Card Structure with Interleaved Double-Side Cooling
DC-DC Converter with High Frequency Integrated Magnetics
Ref.: Shimadu, H., et al., EVTeC 2016
Ref.: Okamoto, K., et al., Denso Tech. Rev. 2011
![Page 6: Design for Additive Manufacturing of Wide Band Gap Power Electronics Components · 2016-07-01 · Design for Additive Manufacturing of Wide Band-Gap Power Electronics Components ERCAN](https://reader033.fdocuments.net/reader033/viewer/2022042111/5e8bf6fca47cfe4305229b3b/html5/thumbnails/6.jpg)
Why Explore Additive Manufacturing?o Core ideas behind Additive Manufacturing (AM)
o Expand design space →
Enhance integration & create new functiono “…multimaterial…”
o “…lightweight structures…”
o “…internal cooling passages…”
o “…unparalleled geometric complexity…”
o “…functionally grade material compositions…”
E.M. DEDE, ET AL. 2016 - DESIGN FOR ADDITIVE MANUFACTURING OF WIDE BAND-GAP POWER ELECTRONICS COMPONENTS
6
Ref.: Rosen, D.W., et al., J. Mech. Design 2015 (Guest Editorial, Special Issue: Design for Additive Manufacturing)
Above characteristics highly sought in future power-dense wide band-gap (WBG) electronics systems
![Page 7: Design for Additive Manufacturing of Wide Band Gap Power Electronics Components · 2016-07-01 · Design for Additive Manufacturing of Wide Band-Gap Power Electronics Components ERCAN](https://reader033.fdocuments.net/reader033/viewer/2022042111/5e8bf6fca47cfe4305229b3b/html5/thumbnails/7.jpg)
Applications for Additive ManufacturingCIRCUIT-LEVEL CONCEPT – CURRENT SENSOR
E.M. DEDE, ET AL. 2016 - DESIGN FOR ADDITIVE MANUFACTURING OF WIDE BAND-GAP POWER ELECTRONICS COMPONENTS
7
![Page 8: Design for Additive Manufacturing of Wide Band Gap Power Electronics Components · 2016-07-01 · Design for Additive Manufacturing of Wide Band-Gap Power Electronics Components ERCAN](https://reader033.fdocuments.net/reader033/viewer/2022042111/5e8bf6fca47cfe4305229b3b/html5/thumbnails/8.jpg)
Frequency (MHz)
Perm
eab
ility
High Frequency Passiveso High operational frequency expected with WBG devices → Paradigm shift in magnetics design
E.M. DEDE, ET AL. 2016 - DESIGN FOR ADDITIVE MANUFACTURING OF WIDE BAND-GAP POWER ELECTRONICS COMPONENTS
8
Ex: Rogowski-coil
Pros: Linear (air core)
- No frequency dependence- No saturation
Simple Low cost
Cons: Manufacturing
dependency
*Ref.: https://product.tdk.com/ja/products/emc/guidebook/jemc_basic_06.pdf
Higher frequency:
Air core device
![Page 9: Design for Additive Manufacturing of Wide Band Gap Power Electronics Components · 2016-07-01 · Design for Additive Manufacturing of Wide Band-Gap Power Electronics Components ERCAN](https://reader033.fdocuments.net/reader033/viewer/2022042111/5e8bf6fca47cfe4305229b3b/html5/thumbnails/9.jpg)
Sheet-Wound Coil Concept
E.M. DEDE, ET AL. 2016 - DESIGN FOR ADDITIVE MANUFACTURING OF WIDE BAND-GAP POWER ELECTRONICS COMPONENTS
9
o Re-conceptualize the traditional wire-based structure
Wire-Based Toroid Structure
Sheet-Wound Structure
Electromagnetic Shielding Effect
Noise (flux)
Eddy current
Counter flux(from eddy current)
Plate
[Cancel]
Less noise in/out Design inductance accurately
![Page 10: Design for Additive Manufacturing of Wide Band Gap Power Electronics Components · 2016-07-01 · Design for Additive Manufacturing of Wide Band-Gap Power Electronics Components ERCAN](https://reader033.fdocuments.net/reader033/viewer/2022042111/5e8bf6fca47cfe4305229b3b/html5/thumbnails/10.jpg)
Sheet-Wound Coil Fabrication
E.M. DEDE, ET AL. 2016 - DESIGN FOR ADDITIVE MANUFACTURING OF WIDE BAND-GAP POWER ELECTRONICS COMPONENTS
10
o Metal plating of 3D AM bobbin for structure realization
Bobbin Assembled Sensor Experimental Result & Final Custom Sensor Image
Fewer turns fabricated with greater precision enables high frequency, accuracy measurement in compact space
![Page 11: Design for Additive Manufacturing of Wide Band Gap Power Electronics Components · 2016-07-01 · Design for Additive Manufacturing of Wide Band-Gap Power Electronics Components ERCAN](https://reader033.fdocuments.net/reader033/viewer/2022042111/5e8bf6fca47cfe4305229b3b/html5/thumbnails/11.jpg)
Applications for Additive ManufacturingCIRCUIT-LEVEL CONCEPT – LC RESONANT TANK
E.M. DEDE, ET AL. 2016 - DESIGN FOR ADDITIVE MANUFACTURING OF WIDE BAND-GAP POWER ELECTRONICS COMPONENTS
11
![Page 12: Design for Additive Manufacturing of Wide Band Gap Power Electronics Components · 2016-07-01 · Design for Additive Manufacturing of Wide Band-Gap Power Electronics Components ERCAN](https://reader033.fdocuments.net/reader033/viewer/2022042111/5e8bf6fca47cfe4305229b3b/html5/thumbnails/12.jpg)
Extension to LC Resonant Tank
E.M. DEDE, ET AL. 2016 - DESIGN FOR ADDITIVE MANUFACTURING OF WIDE BAND-GAP POWER ELECTRONICS COMPONENTS
12
o Integrate resonant capacitance into structureo Magnetic flux “packed” inside due to shielding effect, while capacitance conserves magnetic flux
3D Isometric View & Equivalent Circuit Transparent & Sectioned Views
![Page 13: Design for Additive Manufacturing of Wide Band Gap Power Electronics Components · 2016-07-01 · Design for Additive Manufacturing of Wide Band-Gap Power Electronics Components ERCAN](https://reader033.fdocuments.net/reader033/viewer/2022042111/5e8bf6fca47cfe4305229b3b/html5/thumbnails/13.jpg)
Extension to LC Resonant Tank
E.M. DEDE, ET AL. 2016 - DESIGN FOR ADDITIVE MANUFACTURING OF WIDE BAND-GAP POWER ELECTRONICS COMPONENTS
13
o Application to air core transformero Improve power transfer from primary to secondary coil with air core (i.e. no traditional ferrite core)
Circuit Diagram(Wireless Power Transfer usingResonant Inductive Coupling)
Wire-Based Toroid Simulation Result*
Sheet-Wound LC Tank Simulation Result*
*Magnetic Flux Density Contours Shown
![Page 14: Design for Additive Manufacturing of Wide Band Gap Power Electronics Components · 2016-07-01 · Design for Additive Manufacturing of Wide Band-Gap Power Electronics Components ERCAN](https://reader033.fdocuments.net/reader033/viewer/2022042111/5e8bf6fca47cfe4305229b3b/html5/thumbnails/14.jpg)
LC Resonant Tank Fabrication
E.M. DEDE, ET AL. 2016 - DESIGN FOR ADDITIVE MANUFACTURING OF WIDE BAND-GAP POWER ELECTRONICS COMPONENTS
14
o Direct Metal Deposition (DMD) 3D printingo Fabricated using three components to properly construct air gap →
Multi-material (metal-plastic) 3D printer technology required for one-piece construction!
AM Manufacturing Strategy Experimental Results for 3D Resonant Tank
Sharp resonance with high quality factor
![Page 15: Design for Additive Manufacturing of Wide Band Gap Power Electronics Components · 2016-07-01 · Design for Additive Manufacturing of Wide Band-Gap Power Electronics Components ERCAN](https://reader033.fdocuments.net/reader033/viewer/2022042111/5e8bf6fca47cfe4305229b3b/html5/thumbnails/15.jpg)
Applications for Additive ManufacturingSYSTEM-LEVEL CONCEPT – AIR COOLING
E.M. DEDE, ET AL. 2016 - DESIGN FOR ADDITIVE MANUFACTURING OF WIDE BAND-GAP POWER ELECTRONICS COMPONENTS
15
![Page 16: Design for Additive Manufacturing of Wide Band Gap Power Electronics Components · 2016-07-01 · Design for Additive Manufacturing of Wide Band-Gap Power Electronics Components ERCAN](https://reader033.fdocuments.net/reader033/viewer/2022042111/5e8bf6fca47cfe4305229b3b/html5/thumbnails/16.jpg)
Air-Cooled Heat Sink Design
E.M. DEDE, ET AL. 2016 - DESIGN FOR ADDITIVE MANUFACTURING OF WIDE BAND-GAP POWER ELECTRONICS COMPONENTS
16
o Structural optimization plus AM applied to study performance limitso Optimization for steady-state heat conduction plus side-surface convection
Movie of Example 2-D Structural Optimization
Design EvolutionExtension to 3D Design
3D Topology Optimization Result
Quarter-Symmetry Point Cloud Data
Synthesized Solid Model CAD Geometry
AlSi12 Rapid Prototype
Variable geometry pin fin design obtained to maximize heat transfer
![Page 17: Design for Additive Manufacturing of Wide Band Gap Power Electronics Components · 2016-07-01 · Design for Additive Manufacturing of Wide Band-Gap Power Electronics Components ERCAN](https://reader033.fdocuments.net/reader033/viewer/2022042111/5e8bf6fca47cfe4305229b3b/html5/thumbnails/17.jpg)
Heat Sink Performance Evaluation
E.M. DEDE, ET AL. 2016 - DESIGN FOR ADDITIVE MANUFACTURING OF WIDE BAND-GAP POWER ELECTRONICS COMPONENTS
17
Case 1 experimental results for Al alloy heat sinks, HS 1–HS 5, with ∅38.1 mm orifice at 12.7
mm jet-to-target spacing(Re ~ 4,700-19,000)
Case 2 experimental results for pin-fin heat sinks, HS 1 & HS 5–HS 8, with ∅12.7 mm orifice at 12.7
mm jet-to-target spacing(Re ~ 14,000-43,000)
Case 1
Case 2
∗COP = 1/(𝑅th(cnv)∆𝑃 ሶ𝑉)
![Page 18: Design for Additive Manufacturing of Wide Band Gap Power Electronics Components · 2016-07-01 · Design for Additive Manufacturing of Wide Band-Gap Power Electronics Components ERCAN](https://reader033.fdocuments.net/reader033/viewer/2022042111/5e8bf6fca47cfe4305229b3b/html5/thumbnails/18.jpg)
Applications for Additive ManufacturingSYSTEM-LEVEL CONCEPT – LIQUID COOLING
E.M. DEDE, ET AL. 2016 - DESIGN FOR ADDITIVE MANUFACTURING OF WIDE BAND-GAP POWER ELECTRONICS COMPONENTS
18
![Page 19: Design for Additive Manufacturing of Wide Band Gap Power Electronics Components · 2016-07-01 · Design for Additive Manufacturing of Wide Band-Gap Power Electronics Components ERCAN](https://reader033.fdocuments.net/reader033/viewer/2022042111/5e8bf6fca47cfe4305229b3b/html5/thumbnails/19.jpg)
Modular Liquid Cooling for Power Electronics
E.M. DEDE, ET AL. 2016 - DESIGN FOR ADDITIVE MANUFACTURING OF WIDE BAND-GAP POWER ELECTRONICS COMPONENTS
19
o Manifold microchannel (MMC) system for high performance single-phase liquid cooling
Manifold Section plus Insert & Heat Sink Transparent Views with Flow Operation
MMC Detailed View
![Page 20: Design for Additive Manufacturing of Wide Band Gap Power Electronics Components · 2016-07-01 · Design for Additive Manufacturing of Wide Band-Gap Power Electronics Components ERCAN](https://reader033.fdocuments.net/reader033/viewer/2022042111/5e8bf6fca47cfe4305229b3b/html5/thumbnails/20.jpg)
Modular Liquid Cooling for Power Electronics
E.M. DEDE, ET AL. 2016 - DESIGN FOR ADDITIVE MANUFACTURING OF WIDE BAND-GAP POWER ELECTRONICS COMPONENTS
20
o Cold plate flow configurations considering three power modules
Exploded View of Cold Plate
![Page 21: Design for Additive Manufacturing of Wide Band Gap Power Electronics Components · 2016-07-01 · Design for Additive Manufacturing of Wide Band-Gap Power Electronics Components ERCAN](https://reader033.fdocuments.net/reader033/viewer/2022042111/5e8bf6fca47cfe4305229b3b/html5/thumbnails/21.jpg)
Modular Cold Plate AM Rapid Prototype
E.M. DEDE, ET AL. 2016 - DESIGN FOR ADDITIVE MANUFACTURING OF WIDE BAND-GAP POWER ELECTRONICS COMPONENTS
21
o Polymer prototype manifold system with snap-fit connections
Disassembled Cold Plate Showing Two AM Manifold Sections Insert on Top of Fin Structure
3D AM Optimized MMC Heat Sink Concept
![Page 22: Design for Additive Manufacturing of Wide Band Gap Power Electronics Components · 2016-07-01 · Design for Additive Manufacturing of Wide Band-Gap Power Electronics Components ERCAN](https://reader033.fdocuments.net/reader033/viewer/2022042111/5e8bf6fca47cfe4305229b3b/html5/thumbnails/22.jpg)
Liquid Cold Plate Design – Another Quick Note
E.M. DEDE, ET AL. 2016 - DESIGN FOR ADDITIVE MANUFACTURING OF WIDE BAND-GAP POWER ELECTRONICS COMPONENTS
22
o Precision machined & diffusion bonded, but why not 3D print?
Inlet To outlet
Thermocouple holes
Figure 2: Zoomed cross section views of the diffusion
bonded multi-device cold plate including the inlet region
with a single cooling cell on the right and the middle
transition region with a second cooling cell on the left.
Note that the blue arrows indicate the coolant flow path
through the manifolds and local cooling cells.
R&D 100 Award Winner (2013)
12-Piece Single-Phase Liquid Cold Plate
Multi-Pass Microchannel System
Cross-Section View
![Page 23: Design for Additive Manufacturing of Wide Band Gap Power Electronics Components · 2016-07-01 · Design for Additive Manufacturing of Wide Band-Gap Power Electronics Components ERCAN](https://reader033.fdocuments.net/reader033/viewer/2022042111/5e8bf6fca47cfe4305229b3b/html5/thumbnails/23.jpg)
Applications for Additive ManufacturingSYSTEM-LEVEL CONCEPT – TWO-PHASE COOLING
E.M. DEDE, ET AL. 2016 - DESIGN FOR ADDITIVE MANUFACTURING OF WIDE BAND-GAP POWER ELECTRONICS COMPONENTS
23
![Page 24: Design for Additive Manufacturing of Wide Band Gap Power Electronics Components · 2016-07-01 · Design for Additive Manufacturing of Wide Band-Gap Power Electronics Components ERCAN](https://reader033.fdocuments.net/reader033/viewer/2022042111/5e8bf6fca47cfe4305229b3b/html5/thumbnails/24.jpg)
Two-Phase Cooling for Enhance Performance
E.M. DEDE, ET AL. 2016 - DESIGN FOR ADDITIVE MANUFACTURING OF WIDE BAND-GAP POWER ELECTRONICS COMPONENTS
24
o High power density systems → single-phase liquid cooling reaching fundamental limito Design of high performance two-phase cooling technology
Copper heat
spreader
Jet orifice plate
Middle outlet
manifold
Upper outlet
manifold
Lower outlet
manifold
Coolant outlet
slot
Inlet Outlet
Gasket
PEEK
Cold Plate with Vapor Extraction Manifold
Operational Concept forTwo-Phase Jet Impingement Cooling
AM AlSi12 Heat Spreader
400 μm
Porous Structure Detail
![Page 25: Design for Additive Manufacturing of Wide Band Gap Power Electronics Components · 2016-07-01 · Design for Additive Manufacturing of Wide Band-Gap Power Electronics Components ERCAN](https://reader033.fdocuments.net/reader033/viewer/2022042111/5e8bf6fca47cfe4305229b3b/html5/thumbnails/25.jpg)
Performance Characteristics
E.M. DEDE, ET AL. 2016 - DESIGN FOR ADDITIVE MANUFACTURING OF WIDE BAND-GAP POWER ELECTRONICS COMPONENTS
25
o Flow visualization and understanding heat transfer and pressure drop comparison
Two-Phase Jet Impingement Movie – Approaching Critical Heat Flux (CHF)
Inherent porosity of AM surface extends CHF
![Page 26: Design for Additive Manufacturing of Wide Band Gap Power Electronics Components · 2016-07-01 · Design for Additive Manufacturing of Wide Band-Gap Power Electronics Components ERCAN](https://reader033.fdocuments.net/reader033/viewer/2022042111/5e8bf6fca47cfe4305229b3b/html5/thumbnails/26.jpg)
Compact Manifold Design
E.M. DEDE, ET AL. 2016 - DESIGN FOR ADDITIVE MANUFACTURING OF WIDE BAND-GAP POWER ELECTRONICS COMPONENTS
26
o Exploit optimization of single-phase inlet manifold for size reduction of cold plate
Fluid inlet
Fluid
distribution
manifold
* Dimensions in mm
Target plate with four 15
mm square heat sources
Fluid outlet via
100 jet orifices
via four 5 5
jet arrays
Jet orifice
plate
Fig. 1: Schematic of general jet impingement heat transfer
system with coolant fluid distribution structure. Manifold Layout for Four Power Devices
Design Evolution Movie Final Design
AM Rapid Prototype for Design VisualizationDesign Verification by Simulation
![Page 27: Design for Additive Manufacturing of Wide Band Gap Power Electronics Components · 2016-07-01 · Design for Additive Manufacturing of Wide Band-Gap Power Electronics Components ERCAN](https://reader033.fdocuments.net/reader033/viewer/2022042111/5e8bf6fca47cfe4305229b3b/html5/thumbnails/27.jpg)
Future Possibilities – Target Surface Design
E.M. DEDE, ET AL. 2016 - DESIGN FOR ADDITIVE MANUFACTURING OF WIDE BAND-GAP POWER ELECTRONICS COMPONENTS
27
o Opportunity for structural design optimization as two-phase conjugate simulation evolves
Variation in Local Heat Transfer Coefficient
(3 x 3 jet array)
Typical Jet Impingement
Scenario
Two-Phase Temperature Map
(3 x 3 jet array)
*Ref.: Rau, M.J. and Garimella, S.V., 2013. IJHMT *Ref.: Rau, M.J. and Garimella, S.V., 2013. IJHMTJet CL
Jet Nozzle
Impingement Region
(Location of high heat transfer in single-phase)
Target Surface
![Page 28: Design for Additive Manufacturing of Wide Band Gap Power Electronics Components · 2016-07-01 · Design for Additive Manufacturing of Wide Band-Gap Power Electronics Components ERCAN](https://reader033.fdocuments.net/reader033/viewer/2022042111/5e8bf6fca47cfe4305229b3b/html5/thumbnails/28.jpg)
Future Possibilities – Target Surface Design
E.M. DEDE, ET AL. 2016 - DESIGN FOR ADDITIVE MANUFACTURING OF WIDE BAND-GAP POWER ELECTRONICS COMPONENTS
28
o Example optimization study for heat conduction plus side-surface convection (following air cooling study)o Assume inverse spatial heat transfer coefficient distribution is known a priori
Impose Heat Transfer Coefficient Profile to Optimize Two-Phase Surface Regions
9X Jet impingement location
(at valleys)
Interspersed two-phase regions for surface
enhancement(at peaks)
Movie of Evolution of Surface Structure → AM Possibility?
![Page 29: Design for Additive Manufacturing of Wide Band Gap Power Electronics Components · 2016-07-01 · Design for Additive Manufacturing of Wide Band-Gap Power Electronics Components ERCAN](https://reader033.fdocuments.net/reader033/viewer/2022042111/5e8bf6fca47cfe4305229b3b/html5/thumbnails/29.jpg)
Challenges & Future Opportunities
E.M. DEDE, ET AL. 2016 - DESIGN FOR ADDITIVE MANUFACTURING OF WIDE BAND-GAP POWER ELECTRONICS COMPONENTS
29
o AM material related challenges – in context of present worko Multi-material printing combining metals and plastics for 3D circuitso Technologies now starting to emerge
o High thermal conductivity (e.g. copper) and high temperature materialso NASA demonstrated → need transition to wider commercial space
o Fully dense metal deposition (heat transfer) & plastic printing (flow)
o Comprehensive design methods that address AMo Re-think traditional design paradigms and re-phrase methods to remove
traditional manufacturing limitations
o Democratization of manufacturing → logical byproduct of AMo But, will low cost, high volume production become a reality?
![Page 30: Design for Additive Manufacturing of Wide Band Gap Power Electronics Components · 2016-07-01 · Design for Additive Manufacturing of Wide Band-Gap Power Electronics Components ERCAN](https://reader033.fdocuments.net/reader033/viewer/2022042111/5e8bf6fca47cfe4305229b3b/html5/thumbnails/30.jpg)
Conclusions
E.M. DEDE, ET AL. 2016 - DESIGN FOR ADDITIVE MANUFACTURING OF WIDE BAND-GAP POWER ELECTRONICS COMPONENTS
30
o AM supports exploration of future 3D power electronics integration and manufacturingo New compact, high performance electrical device and circuit concepts realizableo Benefits rapid investigation of unique thermal management technologies
o Synergy with advanced structural optimization methodso Complex topologies no longer limited by traditional fabrication
o How to realize full potential of AM for power-dense electronics systems?o Further research and development for multi-material printing technologies,
finished material quality, and new material compositions
o What is applicability for high volume manufacturing?
![Page 31: Design for Additive Manufacturing of Wide Band Gap Power Electronics Components · 2016-07-01 · Design for Additive Manufacturing of Wide Band-Gap Power Electronics Components ERCAN](https://reader033.fdocuments.net/reader033/viewer/2022042111/5e8bf6fca47cfe4305229b3b/html5/thumbnails/31.jpg)
References1. Zhou, F., Liu Y, Liu, Y., Joshi, S.N., and Dede, E.M., 2015. “Modular design for a single-phase manifold
mini/microchannel cold plate.” Journal of Thermal Science and Engineering Applications, 8: 021010 (13 pages).
2. Dede, E.M., Joshi, S.N., and Zhou F., 2015. “Topology optimization, additive layer manufacturing, and experimental testing of an air-cooled heat sink.” Journal of Mechanical Design, 137: 111403 (9 pages).
3. Joshi, S.N. and Dede, E.M., 2015. “Effect of sub-cooling on performance of a multi-jet two phase cooler with multi-scale porous surfaces.” International Journal of Thermal Sciences, 87: 110-120
4. Rau, M.J., Dede, E.M., and Garimella, S.V., 2014. “Local single- and two-phase heat transfer from an impinging cross-shaped jet.” International Journal of Heat and Mass Transfer, 79: 432-436.
5. Dede, E.M., Lee, J., and Nomura, T., 2014. Multiphysics simulation – electromechanical system applications and optimization. Springer, London.
6. Dede, E.M. and Nomura, T., 2014. “Topology optimization of a hybrid vehicle power electronics cold plate –application to the design of a fluid distribution structure.” EVTeC and APE 2014, Yokohama, Japan.
7. Rau, M.J. and Garimella, S.V., 2013. “Local two-phase heat transfer from arrays of confined and submerged impinging jets.” International Journal of Heat and Mass Transfer, 67: 487-498.
8. Ishigaki, M., et al., 2011. “Proposal of high accurate and tiny rogowski-coil current sensor.” IEEJ Annual meeting (Japanese), 4: 265.
E.M. DEDE, ET AL. 2016 - DESIGN FOR ADDITIVE MANUFACTURING OF WIDE BAND-GAP POWER ELECTRONICS COMPONENTS
31