Delayering Copper Devices with ULTRAPOL Advance

ULTRAPOLFLAT POLISHING MACHINE

Delayering of Copper IC devicesDelayering of Copper IC devices

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Flat Polishing Machine ULTRAPOLadvaadva

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Front Panel Access to All Parameters

ULTRAPOLadvaadvancence

System offers ULTRA TEC’s signature ‘Quick Release’ Sample holder Cam-lock design and precise two circle angular adjustment. Precise Pressure Control is shown

Fine Pressure Control

Coarse Pressure Control


Fast Amplitude Setting (Think ASAP-1 Analog system!)


Fluid can run to drain or be recirculated, dependent on the process. The drip tray is removable for fast,

effective clean-up.

Faucet (plumbed in) Recirculating Pump


A Choice of Polishing Pads and Films are available, in stock, to achieve Best Known

Techniques for all sample types

ULTRAPOLadvaadvancenceAngular Alignment with Angular Alignment with

ULTRACOLLIMATORULTRACOLLIMATOR

ULTRAPOLadvaadvancenceAngular

Alignment


Optically-enhanced Single Die ‘Stub’ holders (JEOL shown above) allow for convenient,

rapid transfer to a wide range of SEM’s, FIB’s

PROCESS CONDITIONS PROCESS CONDITIONS


Sample Type: Cu Technology Bare DieStage Oscillation: 1Head Rotation Speed: 1Sample Load: 100g

Polishing Pad Type: Fiberpad (black)Lap Rotation Speed: 50 rpm

Abrasive Media: Blue Colloidal Silica


Customer images taken by JEOL tungsten SEM (JEOL 6610LV). The images were taken on a single die sample

and show Cu metal structure after delayering

Mag= 500x


Customer images taken by JEOL tungsten SEM (JEOL 6610LV). The images were taken on a

single die sample and show Cu metal structure after delayering

Mag= 2000x


Further Close-up of Customer images showing Cu metal structure after delayering on ULTRAPOL

Advance

Mag= ~4000x


Each Advance System is shipped with a case containing weights, holders and useful

accessories


For less demanding, or lower specification requirements, ULTRAPOL Advance is also available

without the ULTRACOLLIMATOR. Supplied mechanical

gauges are used to calibrate the system.


ULTRA TEC offers the widest range of sample holders

for precision polishing


The Hot Plate Transfer Fixture provides a safe & convenient way to work with heated sample holders

ICisICis

Also Available for the Sample Preparation Lab Toolkit…

Materials Inspection SystemMaterials Inspection System

ULTRAPOL Advance ASAP-1® IPS

ICisICis Materials Inspection SystemMaterials Inspection System

ICis offers 3 imaging modes – NIR (for backside prep), Visible (for planar polish / x-sections) and UV (for maximum surface definition).

Full range of specialist objective lenses available.


Illumination SourcesIllumination Sources


Backside (NIR) Imaging

Integrated algorithms enables stage motion positioning and direct readout of remaining Silicon Thickness. Windows 7 Version

now shipping.

Si Thickness Here

ICis Software is powered by FA Instruments

ULTRASPEC-III

SUMMARYULTRAPOL Advance enables…

Improved Parallel Polish / De-processLive ULTRACOLLIMATOR ModeFast, convenient and /accurate angular adjustment TO THE DIEFloating Head Control for unsurpassed polishing qualityThe Widest Range of Sample Holders

SUMMARYULTRA TEC provides…

Global Sales & Product SupportIn-stock Consumable products Application Knowledge Base In-house Design, Manufacture & TestOn-site Installation & TrainingApplications Lab for Product & process developmentMarket-leading customer portfolio

We look forward to working with you!

ULTRAPOL forms part of ULTRA TEC’sULTRAPOL forms part of ULTRA TEC’s

More Information More Information at:at:

www.ultratecusa.comwww.ultratecusa.com

ULTRAPOLFLAT POLISHING MACHINE

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Delayering Copper Devices with ULTRAPOL Advance

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