DDi Materials SMTA-HoustonChapter11 10€¦ · PCB Laminate Materials SMTA-Houston/GC Chapter...

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DDI Technology

PCB Laminate Materials

SMTA-Houston/GC Chapter9Nov2010

Mark [email protected]

(512) 828-3030

Use or disclosure of information contained on this page is subject to the restriction on page 2 of this document

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Notice

• Notification of Proprietary Information: This document contains proprietary information of DDi Corp. and its receipt or possession does not convey any rights to reproduce or disclose its contents, or to manufacture, use, or sell anything it may describe. Reproduction, dissemination, disclosure, or use, in whole or in part, without specific written authorization of DDi Corp. is strictly forbidden. All data contained within this document are subject to this restriction.


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Overview

What is FR-4 and how is it specified• Laminate construction• Basic electrical properties• Controlled material stack-up

Advanced Materials• Special purpose & low loss• Industry specifications• Relative cost

Hybrid Constructions

Printed Circuit Materials Overview


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PCB Material Properties

Material properties are playing an increasingly important role in advanced system designs as speed, power dissipation

and process temperatures increase

Electrical Design:Dielectric constant

Loss tangent

Thermal Mechanical:X,Y,Z CTE

Conduction cooling

Factors that influence material selection

Reliability:Lead free assembly

Long term life


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• Copper Foil

• Glass Fibers

• Woven Glass Fabrics

• Resin

A Stage = Liquid Form

B Stage = Partially Cured Resin

C Stage = Fully Cured ResinA

B

C

Glass Fabrics

Cu Foil

What Is “FR-4” , Laminate Composition

Laminate Components

Resin Stages


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• Tetrafunctional ResinTg =130° - 140° C εr = 4.4Tan δ = 0.024

• Multifunctional ResinTg = 140° to 160° Cεr = 4.3Tan δ = 0.022

• High Temperature Multifunctional ResinTg 170° - 175° CΕr = 4.1Tan δ = 0.019

• Enhanced Multifunctional Resin (Low loss)Tg 180° - 210° Cεr = 3.7Tan δ = 0.010

“FR-4” Standard Resin Systems

• Lead Free Solder Compatible ResinsTg = 170° - 185° Cεr = 4.1 – 4.4Tan δ = 0.015 0.02Td = > 350° CCTE (z) = 2.7% - 3.2%


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Material Tg CTE T260 T288 Td εr Tan δ UL 94 X-Y Z 1 Ghz 10 Ghz 1 Ghz 10 GhzPPM/C PPM/C

FR-4 and ModifiedIsola FR406 170 13 3.50% 10 300 3.95 3.92 0.016 0.017 V-0Isola IS410 180 11 3.50% 60 >15 350 3.90 3.87 0.018 0.23 V-0Isola IS415 200 13-14 2.80% 60 >20 370 3.83 3.8 0.012 0.012 V-0Isola FR408 HR 200 13-14 2.80% 60 30 360 3.69 3.65 0.009 0.0095 V-0

Nelco 4000-6 FC 175 12-15 4.10% 4-8 0 325 4.10 4.0 0.023 0.022 V-0Nelco 4000-11 175 12-14 3.20% 30 0 345 4.10 3.8 0.016 0.02 V-0Nelco 4000-29 185 15-17 3.00% 60 15 350 4.30 4.2 0.015 0.017 V-0Nelco 4000-13 EP 210 10-14 3.40% 30+ 10+ 350 3.70 3.6 0.009 0.008 V-0Nelco 4000-13 EP SI 210 9-13 3.40% 30+ 10+ 350 3.40 3.3 0.008 0.007 V-0Isola 370HR 180 13-14 2.80% 60 30 340 4.17 3.92 0.016 0.025 V-0


Standard and High Performance EpoxyStandard and High Performance Epoxy--Glass LaminatesGlass Laminates

• High Tg multifunctional epoxy• Lead Free compatible High Tg multifunctional epoxy (Design & Process limited)• Advanced Lead Free compatible High Tg multifunctional epoxy• Low Loss High Tg multifunctional epoxy


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Material Tg CTE T260 T288 Td ε ε ε εr Tan δ δ δ δ X-Y Z 1 Ghz 10 Ghz 1 Ghz 10 GhzPPM/C PPM/C

FR-4 Isola FR406 170 13 3.50% 10 300 3.95 3.92 0.016 0.017Isola IS410 180 11 3.50% 60 >15 350 3.90 3.87 0.018 0.023Isola IS415 200 13-14 2.80% 60 >20 370 3.83 3.8 0.012 0.012

Nelco 4000-6 FC 175 12-15 4.10% 4-8 0 325 4.10 4.0 0.023 0.02 2Nelco 4000-11 175 12-14 3.20% 30 0 345 4.10 3.8 0.016 0.02Nelco 4000-29 185 15-17 3.00% 60 15 350 4.30 4.2 0.015 0.017Isola 370 HR 180 13-14 2.80% 60 30 340 4.17 3.92 0.016 0.025ITEQ IT-180 180 15-17 3% >60 >20 350 4.1 3.8 0.016ITEQ IT-158 155 15-17 3.3% >60 >20 345 4.1 3.8 0.016Nanya NP 170TL 170 15-18 3.8 3.9 0.014Panasonic R1755V 170 15-17 2.80% 65 16 350 4.3 4.16 0.015 0.0 22


Standard and High Temperature FR4 EpoxyStandard and High Temperature FR4 Epoxy--Glass Laminates Glass Laminates


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High Performance FR4 EpoxyHigh Performance FR4 Epoxy--Glass LaminatesGlass Laminates

Megtron 6 - PPE Blend = PolyPhenylene Ether

Material Tg CTE T260 T288 Td ε ε ε εr Tan δ δ δ δ X-Y Z 1 Ghz 10 Ghz 1 Ghz 10 GhzPPM/C PPM/C

FR-4 DSCIsola FR408 HR 200 13-14 2.80% 60 30 360 3.69 3.65 0.009 0.0095Nelco 4000-13 EP 210 10-14 3.40% 30+ 10+ 350 3.70 3.6 0.009 0.008Nelco 4000-13 EP SI 210 9-13 3.40% 30+ 10+ 350 3.40 3.3 0.008 0.007

DMA 2 GHz 2 GHz

Panasonic Megtron 6 210 >60 3.60 3.4 0.002 0.004


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“Lead Free” Materials (RoHS Compatible)

(DSC) (1 GHz)

Material Resin Sys tem Tg Dk Df

Nelco N4000-29 Multifunctional 185°C 4.3 0.015

Isola 370 HR High Performance Epoxy 180 °C 4.17 0.016

Nelco N4000-11 Multifunctional 175°C 4.1 0.016

Nelco N4000-13EP Enhanced Epoxy 210°C 3.7 0.009

ITEQ IT-180 Multifunctional Epoxy 180°C 4.3 0.018

Panasonic 1755V Multifunctional Epoxy 170°C 4.3 0.015

Panasonic Megtron 6 PPE Blend 210°C 3.60 0.002

Preferred Materials Preferred Materials ““lead Freelead Free”” Solder CyclesSolder Cycles


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Offshore Laminate CompatibilityProto/Ramp Quantities Can Be Produced By DDi North America

• Range of FR4:Type Tg Td Dk Df

• IT158 155C 340C 4.1 0.016

• S1141 140C 310C 4.1 0.020

• IT180A 175C 340C 4.2 0.018

• S1000-2 180C 340C 4.0 0.020

Halogen-Free

• NPG-170TL 170C 4.5 0.013

• NPGN-150R 140C 4.2 0.013


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• Shengyi Sci.Tech.– S-1000-2

• Available for lead-free process, meet IPC-4101B/126 requirement .

• High Tg180℃(DSC) ,UV Blocking and AOI compatible.

• High thermal performance,Td≥340℃, T288=20min T300=7min .

• Low Z-axis CTE from ambient to 260℃.• Excellent chemical resistance & lower water

absorption.• Excellent CAF resistance.


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• ITEQ Corporation• IT-180

– · Multifunctional Epoxy Resin– · Tg ≥ 175℃ (DSC)– · Low Z-axis Coefficient of Thermal Expansion– · Excellent Dimensional Stability and Heat

Resistance– · Low Water Absorption– · Good Drilling Properties– · UL 94 V-0– · AOI and UV Blocking Characteristics


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Dielectric Properties of “FR-4” Laminate

• Signal frequency• Temperature• Moisture content• Glass composition • Ratio of epoxy resin to glass in the construction

Factors that influence dielectric constant and loss tangent:

Controlled dielectric constructions are becoming increasingly important as circuits push the limits of FR-4 through improved simulation

Epoxy ResinSystem

Glass FabricComposition

Resin/Glass Ratio


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Dielectric Constant of “FR-4” Laminate

• Standard “FR4” epoxy-glass laminates can maintain a dielectric constant tolerance of less than +/- 0.2 based on a specific laminateconstruction and resin content

• Standard tolerance on prepreg resin content is +/- 1.5% as supplied by vendors, +/- 1.0% can be attained for criticalapplications (special order)

• Resin content in prepreg varies for each style of prepreg

• Glass fabric style can have an impact on impedance control as trace geometries continue to shrink

• Selection of glass styles can impact board warping

• Heavy glass fabric can lead to directional impedance control issues

Design Considerations:


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Epoxy-Glass Laminate Construction

• Dielectric constant of the composite laminate is a function of the resin/glass ratio

• Composite laminates can have manydifferent resin/glass constructions

• Heavy glass fabric can have fiber bundles that are Larger than the actual copper trace

PWB Cross-Section

Copper Foil

Woven glass fabric

High dielectric constant (εr ~ 6)

Epoxy resin

Low dielectric constant (εr ~ 3.5)


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NOTE:

The plain weave yarn consists of yarns interlaced in an alternating fashion one over and one under every yarn.

Source: Isola


Glass Style: 106Plain Weave

Count: 56x56 (ends/in)Thickness: 0.0015”




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Source: Isola




Count: 44x32 (ends/in)Thickness: 0.0068 (in)


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Data Source: Isola

Dielectric properties based on construction & frequency

Epoxy Glass Laminate Properties IS370HR


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Dielectric ConstantThickness Tolerance Construction RC% 1MHz Tol. 1GHz Tol. 2.5 GHz Tol. 10 GHz Tol.

0.0020 0.0005 1x 106 68.3 3.43 0.14 3.33 0.14 3.24 0.14 3.21 0.140.0025 0.0005 1x 108 55.2 3.77 0.16 3.67 0.16 3.57 0.15 3.54 0.150.0030 0.0005 1x 2113 42.7 4.09 0.16 3.99 0.16 3.88 0.15 3.84 0.150.0030 0.0005 1x 1080 61.2 3.61 0.12 3.51 0.12 3.42 0.12 3.39 0.110.0035 0.0005 2x 106 64.6 3.52 0.10 3.42 0.10 3.33 0.09 3.30 0.090.0035 0.0005 1x 2113 48.8 3.93 0.13 3.83 0.13 3.73 0.12 3.69 0.120.0040 0.0005 1x 1080 1x 106 56.9 3.72 0.10 3.62 0.10 3.53 0.10 3.49 0.090.0040 0.0005 1x 2113 53.8 3.80 0.10 3.70 0.10 3.61 0.10 3.57 0.100.0042 0.0005 1x 1080 1x 106 58.6 3.68 0.09 3.58 0.09 3.49 0.09 3.45 0.090.0045 0.0005 2x 1080 51.4 3.86 0.10 3.76 0.10 3.66 0.09 3.63 0.090.0045 0.0005 1x 1080 1x 106 60.8 3.62 0.08 3.52 0.08 3.43 0.08 3.40 0.080.0047 0.0005 1x 1080 1x 1080 53.0 3.82 0.09 3.72 0.09 3.62 0.09 3.59 0.090.0050 0.00075 1x 1080 1x 1080 55.2 3.77 0.12 3.67 0.12 3.57 0.12 3.54 0.120.0050 0.00075 1x 2116 51.0 3.87 0.13 3.77 0.13 3.67 0.13 3.64 0.120.0050 0.00075 1x 2113 1x 106 52.0 3.85 0.13 3.75 0.13 3.65 0.12 3.62 0.120.0051 0.00075 1x 1080 1x 1080 55.9 3.75 0.12 3.65 0.12 3.55 0.11 3.52 0.110.0053 0.00075 2x 1080 57.2 3.72 0.11 3.61 0.11 3.52 0.11 3.49 0.110.0055 0.00075 2x 1080 58.4 3.68 0.10 3.58 0.10 3.49 0.10 3.46 0.100.0060 0.00075 2x 2113 42.7 4.09 0.12 3.99 0.12 3.88 0.12 3.84 0.120.0060 0.00075 1x 1652 47.5 3.96 0.11 3.86 0.11 3.76 0.11 3.72 0.110.0060 0.00075 1x 2116 1x 106 50.0 3.90 0.11 3.80 0.11 3.70 0.11 3.66 0.110.0060 0.00075 1x 1080 1x 2113 51.4 3.86 0.11 3.76 0.11 3.66 0.11 3.63 0.100.0060 0.00075 1x 106 1x 2116 50.0 3.90 0.11 3.80 0.11 3.70 0.11 3.66 0.110.0070 0.001 2x 2113 48.8 3.93 0.13 3.83 0.13 3.73 0.12 3.69 0.120.0075 0.001 1x 7628 41.0 4.13 0.13 4.03 0.13 3.93 0.13 3.89 0.130.0080 0.001 2x 2116 42.3 4.10 0.12 4.00 0.12 3.89 0.12 3.85 0.120.0080 0.001 1x 2116 1x 2113 47.8 3.96 0.11 3.86 0.11 3.75 0.11 3.72 0.110.0090 0.001 1x 2116 1x 2116 47.0 3.98 0.10 3.88 0.10 3.77 0.10 3.74 0.100.0095 0.001 1x 2116 1x 2116 49.1 3.92 0.10 3.82 0.10 3.72 0.09 3.69 0.090.0100 0.001 2x 2116 51.0 3.87 0.09 3.77 0.09 3.67 0.09 3.64 0.080.0100 0.001 1x 7628 1x 1080 44.3 4.05 0.10 3.95 0.10 3.84 0.09 3.80 0.09

Data Source: Park Nelco

Dielectric properties & frequency (N4000-13 EP)


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3.6

3.7

3.8

3.9

4

4.1

4.2

4.3

4.4

1 Mhz 1 Ghz 2.5 Ghz

N4000-6N4000-11FR406370HR

Dielectric constant with respect to frequency


Data based on available data for 50% resin contentData based on available data for 50% resin content

FrequencyFrequency

εεrr

Frequency dependant properties vary with different resin systems


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3.83.9

44.14.24.34.44.54.6

0.05 0.2 0.4 0.6 0.8 1 1.2

Frequency in GHz

Die

lect

ric

Co

nst

ant

0.05% MC

0.45% MC

0.75% MC


0.002

0.007

0.012

0.017

0.022

20C 40C 60C 80C

FR-4Df

Temperature

Dissipation Factor with respect to

temperature @ 1.0 GHz

Dielectric Constant with respect to moisture &

Frequency

FR-406 44.6 % epoxy resin


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“FR-4” Thickness vs Dielectric Constant

Based on N4000-6 at 1.0 Ghz

Glass fabric and resin content vary with different laminate constructionsas a result the dielectric constant is a variable that is construction dependant


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Controlled Material Stack-up

• By pre-engineering PCB stack-up’s in the design phase of a project material properties and line geometries can be confirmed

• On critical designs both prepreg plies and core constructions can be assigned

• Stack-ups should be saved as a control document


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Halogen Free (EU WEEE Directive)What is a Halogen? Bromine

What is Halogen Free Material?

Bromine-Free Flame Retardant

Is Halogen Free Material considered Green?

Yes

Lead Free (EU RoHS Directive)Does NOT contain Lead (also Cadmium, etc)

TBBA (Bromine) as Flame Retardant

Higher Assembly Temp/Dwell for Lead-Free Solders

Laminates need to be more Temperature “Robust”

>345deg C Td

Halogen Free/Lead Free Materials


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(TMA) (1 GHz)

Material Resin System Tg Dk Df

Hitachi MCL-BE-67G(H) Halogen-Free FR4 150°C 4.4 .010

NAN YA NPG-170TL Halogen-Free FR4 170°C (DSC) 4.5 .013(1 MHz)

NAN YA NPGN-150R Halogen-Free FR4 140°C (TMA) 4.2 .013

Surface Finish = OSP, Immersion Gold, or Immersion Silver

Solder Mask = Taiyo PSR4000 HFX Green (Halogen-Free ) Taiyo PSR4000 HFX Black (Halogen-Free) Taiyo PSR4000 HFX Blue (Halogen-Free) Taiyo PSR4000 HFX White (Halogen-Free) Taiyo PSR4000 HFX Clear (Halogen-Free) Taiyo PSR4000 HFX Red (Halogen-Free)

Legend = Taiyo PSR4100 WLHD (white)Enthone 10 Series (105 white)

Halogen Free & Lead Free SolutionsHalogen Free “FR-4” Solutions (“Green”)


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Overview






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Special Purpose Laminate Materials

Often times unique design requirements dictate the use of special purpose laminate:

Factors: • Coefficient of thermal expansion• Moisture absorption • Operating temperature• Dielectric constant• Loss tangent

Polyimide BTHydrocarbon

CeramicsPTFE

Isola P96Nelco N7000-1

Isola G200Nelco 5000

Rogers 4000 seriesRogers TMM series

Rogers 3000 seriesRogers 5000 series


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Polyimide Laminates

• Tg 260C• Td 382C• ZCTE 1.5%• T260 60 Min.• T-288 60 Min.• Dk @ 2.0GHz 3.85• Dk @ 10 GHz 3.83• Df @ 2.0 GHz 0.018• Df @ 10 GHz 0.024• Moisture Abs. 0.4%• Max temp 210C• UL Max temp 140C

• High temperature applications• IC Burn-in boards• Engine controls• Down hole instruments• Extreme chemical resistance• Severe assembly applications

ApplicationsPolyimide resin reinforced with woven E-glass, Typical properties


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Bismaleimide-Triazine (BT) Laminates

• Tg 180C• Td 325C• ZCTE 3.3%• T260 12 Min.• Dk @ 2.0GHz 3.70• Dk @ 10 GHz 3.65• Df @ 2.0 GHz 0.013• Df @ 10 GHz 0.015• Moisture Abs. 0.2%• Max temp 150C• UL Max temp 140C

• Multiple thermal excursions• Low moisture absorption • IC substrates• High voltage applications• Chemical and thermal resistance

ApplicationsBT resin reinforced with woven E-glass, Typical properties


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Hydrocarbon Ceramic Laminates

• RF Microstrip circuits• RF Multilayer Stripline• RF filters and power dividers

Applications

Rogers 4003 4350B: Hydrocarbon resinwith ceramic filler reinforced woven glass• Precise dielectric constant• Low loss tangent

Rogers TMM 3, 6, 10: Hydrocarbon resinwith ceramic filler• Precise dielectric constant • Homogeneous dielectric• Electrical properties stable over temperature• Low loss tangent

• Microwave Microstrip circuits• Microwave power circuits• Microwave filters & power dividers• Antenna applications

Applications


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PTFE Based Laminates

• Microwave Microstrip circuits• Microwave Multilayer Stripline• Microwave filters & power dividers• Antenna applications

ApplicationsRogers 3003, 3006, 3010: PTFEceramic filler• Precise dielectric constant• Low loss tangent• Homogeneous dielectric• Stable mechanical properties allowing mixed dielectric constants

Rogers 5880: PTFE with glass random glassmicrofiber reinforcement • Precise dielectric constant • Very low dielectric constant• Homogeneous dielectric• Electrical properties stable over temperature• Low loss tangent into the Ku band (12 to 18 GHz)

• Microwave Microstrip circuits• Microwave power circuits• Microwave filters & power dividers• Antenna applications

Applications


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Specifying Laminate Materials

There are three methods to specify laminate materials:

All laminates are not created equal !

Thermal-mechanical & electrical properties

•IPC 4101 Slash Sheet •number

Resin brand and construction

Issues: Difficult to interpret and trade-offs are almostalways encountered in engineering and planning

Dk Df Tg CTE /24 /29 /41Isola 370HRTwo ply 1080or equivalent

Issues: IPC slash numbersare generic categories and on critical designs, propertiesmay vary too much within a given slash sheet number

Issues: The best method to specify laminates however,when using multiple vendorsthey may not all support the specific materials


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IPC 4101 Slash Sheet Matrix: Isola Materials

Source: Isola


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Advanced Low Loss Dielectric Laminates

Source: Rogers

Relative Laminate Cost Per Square Foot vs Loss Tangent

Based on 0.020” Laminate


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Material Group/ Resin System Vendor Specific Estimated Cost Factor

170 Tg FR4 (Baseline sqft. Price) Nelco N4000-6FC 1

High Tg/Reliability-No Filler Nelco 4000-11 1

High Tg/Reliability-Filled Nelco 4000-29, Isola 370 HR 1.1

High Speed/Loss Nelco 4000-13 EP, Isola FR408 HR 1.8

High Speed/ Very Low Loss Nelco 4000-13 EP SI 2.6

Polyimide Nelco N7000-2, Isola P96, Arlon 35N 3.1

High Frequency Isola IS 680, Arlon 25N 4

Rogers 4350B, RO4003 8.5

Buried Resistance Assuming 170 Tg FR4 Resin 15

Microwave Laminates Rogers 3000 5000 6000 series 20-40

Note: Based on average square foot pricing normalized To 170 Tg FR4

Laminate Cost Factors Based on Resin System


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Overview






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Mixed Dielectric Substrates

Layer 1

Layer 2

Layer 3

Layer 4

Layer 5

Layer 6

FR-4 Prepreg

FR-4 Substrate(4 Layer)

Low loss Dielectric(4350, 3003 ect.)

Typical mixed dielectric construction with low loss cap layer

• Mixed dielectric constructions reduce cost by only using more expensive low loss materials where needed

• FR-4 Epoxy-Glass Sub-Cores provide structural support when using PTFE based laminates


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Mixed Dielectric Circuit Constructions

Mixed Dielectric: Rogers 4350/FR-4

Roger 4350 FR-4

Cross-Section


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.0045” Ref.

.004” Ref.

Layer 1 Solder Mask

Solder Mask

.0045” Ref.

.004” Ref.

.0045” Ref.

Layer 13

Layer 14

Layer 15

Layer 18

.0045” Ref.

.004” Ref.

.0045” Ref.

.004” Ref. .004” Ref.

.002” Ref. BC

Layer 2

Layer 3

Layer 4

Layer 5

Layer 6

Layer 7

Layer 8

Layer 9

Layer 10

Layer 11

Layer 12

Layer 16

.0045” Ref.

Layer 17

.0045” Ref.

.0045” Ref.

.004” Ref.

Stacked MicroViasLayer 1 – 2, 2-3 & 3-4 Layers 24-23, 22-21 & 21-20.012” pad .006” laser drillsolid copper plate

.0035” Ref. 370 HR

.0035” Ref. 370 HR

½ oz Signal

3/8 oz Gnd

3/8 oz Signal

.002” Ref. BC

½ oz Signal

Finish Thickness = .120” +/- .012”Material = N4000-13 EP & Isola 370 HR

.004” Ref.

.0045” Ref.

.004” Ref.

.0045” Ref.

Layer 19

Layer 20

Layer 21

Layer 22

½ oz Gnd

½ oz Gnd

½ oz Signal

½ oz Gnd

½ oz Gnd

½ oz Signal

½ oz Gnd

½ oz Signal

1 oz Vcc

1 oz Gnd

½ oz Signal

½ oz Signal

1 oz Gnd1 oz Vcc

½ oz Gnd

½ oz Signal

3/8 oz Signal

3/8 oz Vcc

.0035” Ref. 370 HR

Layer 23

Layer 24 .0035” Ref. 370 HR

3/8 oz Vcc

3/8 oz Gnd

Layer 3 - 22 = Buried Vias.020” pad & .010” drill

Layer 1 - 24 = Through Vias.024” pad & .012” drill

Hybrid HDI

IPC Class 2


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Summary

Laminate materials play an important role in PCB performance:

• Laminates consist of a resin system and reinforcement material, depending upon the laminate they are woven glass, ceramic or glass microfibers

• Dielectric properties are highly dependant on the ratio of resin to the reinforcing material

• Specialty laminates are often required when thermal-mechanical or high frequency requirements exceed the properties of standard multifunctional epoxy based laminates

• Care should be taken when specifying laminate materials so boards can be produced consistently from lot to lot

• Specialty or “exotic” laminates come at a significant cost premium and hybrid constructions can offer significant cost reduction

• Engage your FAE/DDi-Asia team when discussions include possible transfer to offshore partners…many Asian laminates are NOT “drop-in” replacements

[email protected]

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