CVP-360 Solder Paste€¦ · Process Benefit CVP-360 Property Performance Capability Fine Feature...
Transcript of CVP-360 Solder Paste€¦ · Process Benefit CVP-360 Property Performance Capability Fine Feature...
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
1
CVP-360 Solder Paste
ALPHA®
CVP-360 Solder Paste Product guide
A high performance low silver SACX® capable paste, designed to outperform SAC alloy paste in spread, wetting and in circuit pin test yield
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
2
CVP-360 Solder Paste
Welcome to theALPHA® CVP-360 Product Guide
CVP-360 Solder Paste
Introduction 3Performance Summary 4Print Performance 5-17Reflow Performance 18-40
In-Circuit Pin Testing 41-44
Reliability 45-58
Contents Page #
Summary 59-63
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
3
CVP-360 Solder Paste
Introduction
Introducing ALPHA® CVP-360, a SACX® capable solder paste with a best in class combination of solder paste print volume and volume repeatability, reduced print cycle time, solder spread and wetting on OSP pad finishes, with maximum in circuit test yield.
The result is a more first time right assemblies, that are easier to test, PLUS the inherent economy of SACX® low silver solder alloy, along with resistance to thermal cycling that you would expect from higher silver SAC alloys.
Cookson’s world class phase gate product development process began with a rigorous set of product specifications based on the voice of our customers. Exhaustive lab and field testing have resulted in a robust, high yield product that can solve one or more of your challenges associated with lead free, surface mount assemblies.
You can count on Cookson’s complete support with our global team of technical experts, whenever and however you need us. It’s the kind of support you would expect from a company that’s remained dedicated to serving the needs of the Global circuit assembly market for over 50 years.
CVP-360 Solder Paste
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
4
CVP-360 Solder Paste
Performance SummaryProcess Benefit CVP-360 Property Performance Capability
Fine Feature Print DefinitionExcellent print definition and consistant volumetric performance to 0.30mm(12 mil) circles and 0.4mm (16 mil) pitch rectangular QFP pads.
Tack Life >24 hours at 25%, 50% and 75% Relative Humidity
Temperature Window Capable of printing in temperatures from 20°C to 30°C (68°F to 86°F)
Print Consistancy Repeatable volume deposition and low volume variability on 0.30mm (12 mil) circles with 125 micron (5mil) thick stencil.
Print Speed Range25mm/second to 150mm/second (1 inch/second to 6 inches/second) down to 0.30mm (12 mil) circles and .4mm (16 mil) pitch QFP pads.
Peak Reflow Temperature 235º C to 245º C
Resistance to Voids
Meetss requirements of IPC 7095 Class lll using soak reflow profile. Class III with straight ramp profile and 1% Ag BGA alloy spheres.Class II with straight ramp profiles and high silver BGA sphere
Resistance to Hot and Cold Slump
Exceeds the requirements of IPC J-STD-005 for hot and cold slump.
Flux Residue Cosmetics Clear, colorless residue.SIR Meets/Exceeds JIS, IPC and Bellcore Requirements
Electromigration Resistance Meets/Exceeds IPC and Bellcore SIR and EM RequirementsJ-STD-004 Classification ROM0
Halide Content Halide Free
Inspection In Circuit Pin Testing 100% first pass yield virtually eliminating false negatives during in circuit pin testing.
Print Process Window
Reflow Yield
Electrical Reliability
CVP-360 Solder Paste
Performance Summary
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
5
CVP-360 Solder Paste
Printing: Smallest Printed Feature
CVP-360 Solder Paste
Print Performance
High Volume and Volume Repeatability with 12 mil (0.3mm) Diameter Circles Using 5 mil (125µ) Thick Stencil
CpK 2.76 @ 0.60 Area Ratio
630540450360270180900
LSL USL
LSL 225Target *USL 621.5Sample Mean 425.827Sample N 3600StDev(Within) 23.6507StDev(Overall) 31.0524
Process Data
Cp 2.79CPL 2.83CPU 2.76Cpk 2.76
Pp 2.13PPL 2.16PPU 2.10Ppk 2.10Cpm *
Overall Capability
Potential (Within) Capability
PPM < LSL 1666.67PPM > USL 0.00PPM Total 1666.67
Observed PerformancePPM < LSL 0.00PPM > USL 0.00PPM Total 0.00
Exp. Within PerformancePPM < LSL 0.00PPM > USL 0.00PPM Total 0.00
Exp. Overall Performance
WithinOverall
BGA225-12mil
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
6
CVP-360 Solder Paste
Printing: Print Speed Process Window
CVP-360 Solder Paste
Print Performance
SpeedBoard
6 in/sec4 in/sec2 in/sec1 in/sec4321432143214321
1000
800
600
400
200
0
Vol
ume
(cub
ic m
ils)
60% of Theoretical Volume (530 cubic mils)
1 in/sec
2 in/sec
4 in/sec
6 in/sec
Speed
CVP-360 Lot# 90203005M Print Volume Repeatability ChartBGA36 (15 mil circles)
Consistent print deposit volume at speeds from 1 inch (25mm)/second to 6 inches (150 mm)/second
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
7
CVP-360 Solder Paste
Printing: Response to pause
No knead stroke required after 2 hour pause in printing
CVP-360 Solder Paste
Print Performance
ConditionBoard
After 2 hr PauseAfter 100 KneadsOut of Jar432143214321
1200
1000
800
600
400
200
0
Vol
ume
(cub
ic m
ils)
60% of Theoretical Volume (530 cubic mils)
Out of Jar
After 100 Kneads
After 2 hr Pause
Condition
CVP-360 Lot# 90203005M Out of Jar/ Response to Pause Volume ChartBGA36 (15 mil circles)
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
8
CVP-360 Solder Paste
Print Performance
Using SIX Sigma DOE technique, with print volume and print volume variation as response variables, ranges for squeegee speed (25 to 150mm/sec.),
squeegee pressure (0.22 to 0.36 kg/cm) and stencil release speed (3 to 10 mm/sec.) have been established.
600000
400000
200000
0.100.060.02
2.01.40.8
600000
400000
200000
6.03.51.0
600000
400000
200000
Print Speed
Print Pressure
Stencil Release
1.0
3.56.0
Speed
1.0
3.56.0
Speed
0.81.4
2.0
Pressure
0.81.42.0
PressurePrint
0.02
0.060.10
Release
Stencil
0.020 06
Release
Stencil
Interaction Plot for Std. Deviation-12mil BGA225Data Means
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
9
CVP-360 Solder Paste
Printing – Resistance to Dog Ears
.05 in.(1.3mm)/sec
CVP-360 Solder Paste
Print Performance
Increasing Stencil Snap Off Speed Reduces Occurrence of “Dog Ears”
Recommended Window .12-.4 in. (3-10mm)/sec
Snap Off Speed.10 in.(2.6mm)/sec
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
10
CVP-360 Solder Paste
Wipe Frequency
Prints 16 (100%) 16 (90%) 20 (100%) 20 (90%)1 0 0 0 02 0 0 0 03 0 0 0 04 0 0 0 05 >10 0 0 06 7 0 0 07 4 0 0 08 >10 0 0 09 >10 0 1 010 4 0 0 0
CVP-360 #081202-P1QFP Pitch
Number of Bridges
Equal or better than Leading SAC305 Brand- Reducing Average Print Cycle Time
CVP-360 Solder Paste
Prints 16 (100%) 16 (90%) 20 (100%) 20 (90%)1 0 0 0 02 0 0 0 03 0 0 0 04 >10 0 0 05 7 0 0 06 0 0 0 07 10 0 1 08 >10 1 0 09 7 0 0 010 6 0 0 0
Leading SAC305 BrandNumber of Bridges
QFP Pitch
Print Performance
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
11
CVP-360 Solder Paste
Stencil Life – Volume Data
CVP-360 Solder Paste
Print Performance
T-8T-7T-6T-5T-4T-3T-2T-1T-0
1000
800
600
400
200
0
Time (hrs)
Vol
ume
(cub
ic m
ils)
Theoretical Volume (884 cubic mils)
60% of Theoretical Volume (530 cubic mils)
CVP-360 Lot# 90203005M Stencil Life DataBGA36 (15 mil circles)
The solder paste is printed continuously for 8 Hours. Volume measurements are taken every
hour to confirm paste’s stencil life.
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
12
CVP-360 Solder Paste
Stencil Life – Volume Data
Minimal volume change over 8 hours of continuous printing using 5 mil (125µ) thick stencil
CVP-360 Solder Paste
Print Performance
T-8T-7T-6T-5T-4T-3T-2T-1T-0
4000
3000
2000
1000
0
Time (hrs)
Vol
ume
(cub
ic m
ils)
Theoretical Volume (3150 cubic mils)
60% of Theoretical Volume (1890 cubic mils)
CVP-360 Lot# 90203005M Stencil Life DataQFP120-1 (16 mil pitch, 63x10x5 mils)
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
13
CVP-360 Solder Paste
Stencil Life: Malcom Viscosity Method
No increase in viscosity over 24 hours at 25ºC
Continuous viscosity: CVP-360
0
500
1000
1500
2000
0 5 10 15 20 25 30
Time(s)
Pois
e @
10
rpm
CVP-360 Solder Paste
Print Performance
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
14
CVP-360 Solder Paste
Stencil Life – 12 mil pitch QFP
CVP-360 Solder Paste
Reflowed after 8 hours of continuous printing
Reflowed after 4 hours of continuous printing
Reflowed after 0 hours of continuous printing
Print Performance
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
15
CVP-360 Solder Paste
Stencil Life – Rheology
Stable Rheology over 19 hours
1
10
100
1000
1 10Shear rate (1/s)
Log
Visc
osity
(pas
)
t=0 t=1 t=2 t=3t=4 t=5 t=6 t=7t=8 t=9 t=10 t=11t=12 t=13 t=14 t=15t=16 t=17 t=18 t=19
ALPHA CVP-360 SACX Lot90304020M
CVP-360 Solder Paste
Print Performance
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
16
CVP-360 Solder Paste
Acceptable viscosity after 2 weeks at 25 °C:10 days at 32 ºC.
0
500
1000
1500
2000
2500
0 5 10 15 20Time (# of days)
Visc
osity
(poi
se)
Room Temperature & 32oC Stability
CVP-360 @ 25oCCVP-360 @ 32oC
CVP-360 Solder Paste
Print Performance
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
17
CVP-360 Solder Paste
Tack / Tack Life
0.00.51.01.52.02.53.03.5
0 5 10 15 20Time (hours)
Tack
(g/m
m2)
Requirement:IPC – Measure and report up to 24 hours.
Requirement:JIS – Tack force > 100 g after 24 hours.
IPC
0
20
40
60
80
100
120
140
0 5 10 15 20Time (hours)
Tack
(gf)
JIS
CVP-360 Solder Paste
Print Performance
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
18
CVP-360 Solder Paste
Reflow Performance
Reflow Process Guidelines
CVP-360 Solder Paste
Parameter GuidelineAtmosphere Air Preferred
SnAgCu alloy melting ranges. Lower temperature=solidus;
higher temperature = liquidus
SACX® 0807: 217 – 225°CSACX® 0307: 217 – 228°C
Profile General Guideline Setting Zone Optimal Dwell Period40°C to 228°C 60 s – 260 s
Above 225°C 45 - 90 sec.
Peak temp. < 240°C for Entek Plus OSP finish
Joint cool down rate from 170°C > 3°C – 6°C
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
19
CVP-360 Solder Paste
Top Side Setting(ºC) 150 180 210 240 260 260Bottom Side Setting(ºC) 150 180 210 240 260 260
Conveyor Speed 60mm/sec
CVP-360 Solder Paste
Example Reflow Profile P1Reflow Performance
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
20
CVP-360 Solder Paste
Conveyor Speed 70cm / minuteTop Side Setting(ºC) 150 180 200 210 230 260Bottom Side Setting(ºC) 150 180 200 210 230 260
CVP-360 Solder Paste
Example Reflow Profile P2Reflow Performance
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
21
CVP-360 Solder Paste
Conveyor Speed 60cm / minuteTop Side Setting(ºC) 140 160 190 210 230 260Bottom Side Setting(ºC) 140 160 190 210 230 260
CVP-360 Solder Paste
Example Reflow Profile P3Reflow Performance
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
22
CVP-360 Solder Paste
Conveyor Speed 60cm / minuteTop Side Setting(ºC) 160 180 200 210 230 260Bottom Side Setting(ºC) 160 180 200 210 230 260
CVP-360 Solder Paste
Example Reflow Profile P4Reflow Performance
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
23
CVP-360 Solder PasteCVP-360 Solder Paste
Example Reflow Profile Summary
Profile
Average Time to Reach
130ºCmin:sec
Average Time to Reach
170ºCmin:sec
Average Time Above
220ºCmin:sec
Average Time to Reach
220ºCmin:sec
Average Time Above
225ºCmin:sec
Average Time to Reach
225ºCmin:sec
P1 01:09.5 01:37.5 01:31.0 02:27.5 01:14.5 02:38.0P2 01:11.0 01:45.0 01:36.0 02:37.0 01:20.5 02:46.0P3 01:23.5 02:05.0 01:25.5 03:25.0 01:10.5 03:32.5P4 01:09.0 01:50.5 01:34.0 03:19.0 01:20.0 03:26.0
Reflow Performance
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
24
CVP-360 Solder Paste
Reflow Performance
Cross Print Wetting Test
One of the spread/wetting test included on the CERF board involves printing pairs of solder paste stripes
over equally spaced traces on the board. The spacing between the solder paste stripes range from 0.3mm up to 1.0mm (increasing by 0.1mm increments) and the stripes are printed perpendicular to the traces on the
board as shown above.
Wetting test cross-print pattern, Prior to reflow.
Upon reflow, the solder melts and since it does not wet to the masked surface between the traces, it pulls back to the metal and spreads out along the
traces. If there is enough spread, the gap between the two adjacent solder spots is bridged. There are a
maximum number of 20 bridges possible for each gap size. The bridges are counted, percentages computed and plotted for each profile against the
gap size.
Wetting test cross-print pattern, post reflow.
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
25
CVP-360 Solder Paste
Profile: Straight ramp 1.5C/s 245ºC peak Better spread than Leading SAC305 Brand
0%
20%
40%
60%
80%
100%
0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Gap size (mm)
% o
f Gap
s B
ridg
ed
Cross Print Spread
CVP-360 Solder Paste
CVP-360 (lot# 81202P1) SACX0807
Leading SAC305 Brand
Reflow Performance
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
26
CVP-360 Solder Paste
Spread per JIS Z-3284
Better than Leading SAC305 Brand
Leading SAC 305
Brand
Oxidized Cu, Solder bath at alloy MP + 50 °C
CVP-360 SACX0807
86.7% 87.9%
Reflow Performance
CVP-360 Solder Paste
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
27
CVP-360 Solder PasteCVP-360 Solder Paste
Self Alignment During Reflow
Component Self Alignment = Fewer Reflow Defects
Reflow Performance
16 mil pitch QFP after placement, before reflow 16 mil pitch QFP after placement, after reflow
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
28
CVP-360 Solder Paste
CVP-360
DPAK
Reflow / Pad Wetting
LQFP120 16 mil pitch
Profile: 1.5C/sec soak 250 C peak (Air)Reflow better/equal to Leading SAC 305 Brand-
No de-wetting observed
Reflow Performance
CVP-360 Solder Paste
Leading SAC 305 Brand
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
29
CVP-360 Solder Paste
Reflow / Fillet Wetting
QFP120 (16 mil pitch)Profile: 1.5C/sec soak 250 C peak (Air)
CVP-360Leading SAC 305 Brand
CVP-360 Solder Paste
Reflow Performance
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
30
CVP-360 Solder Paste
IPC Cold & Hot Slump Test Results
Pad Size 00.63 x 2.03mm
0.33 x 2.03mm
0.63 x 2.03mm
0.33 x 2.03mm
Largest Gap Bridged No Bridges 0.1 0.33 0.2
IPC max gap 0.48 0.2 0.56 0.25bridge allowed Pass Pass Pass Pass
Cold Slump 25C / 50% / 75% RH
Hot Slump Oven 150C / 10mins
PASSES Hot/Cold Slump per IPC J-STD-005
CVP-360 Lot# 081202-P1, SACX0807 88.5%
CVP-360 Solder Paste
Reflow Performance
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
31
CVP-360 Solder Paste
DIN Slump
DIN Requirement: - Large/Small - No bridge ≥ 0.3/0.2 mm (PASS)
DIN - 1 hr @ RT + 20 min @ 80 C
Small: 0.2 mm OK
CVP-360 Solder Paste
Reflow Performance
Large: 0.3 mm OK
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
32
CVP-360 Solder Paste
JIS Slump Resistance
Both Pass
JIS 20 sec @ 150 C
CVP-360 Solder Paste
Reflow Performance
Large: 0.4 mm OK Small: 0.4 mm OK
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
33
CVP-360 Solder Paste
Paste In Hole Performance2.5 mm overprint 7.5 mm overprint
Before reflow
After reflow
Excellent Pin in Paste Performance
3.75 mm overprint
CVP-360 Solder Paste
Reflow Performance
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
34
CVP-360 Solder Paste
Paste In Hole Performance
3.75 mm overprint w / connector – bottom
side after reflow
RCA Jack – Bottom side after reflow
Complete wetting down barrel No dripping or excess solder on pins
on bottom side.
CVP-360 Solder Paste
Reflow Performance
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
35
CVP-360 Solder Paste
Residue Tackiness
Residue Tackiness Procedure:
Reflow paste in air, let cool. Sprinkle talc & store 24 hours.Brush with paintbrush.
Requirement: Talc removed by brush - PASS
CVP-360 Solder Paste
Reflow Performance
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
36
CVP-360 Solder Paste
Random Solder ball – Straight Ramp 1.5oC/sec, peak 245oC
Meets IPC visual criteria for solder balling
4 hours @ 50 % RHInitial
Equal / better than Leading SAC305 Brand on maskOM360SAC305 CVP- 360
CVP-360 CVP- 360
CVP-360 Solder Paste
Reflow Performance
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
37
CVP-360 Solder Paste
Random Solder ball – High Soak 160oC/60sec, 240oC peak
Meets IPC visual criteria for solder balling
4 hours @ 50 % RHInitial
OM360OM338PT PNC0808A
PNC0808A CVP-360CVP-360
CVP-360 Solder Paste
Reflow Performance
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
38
CVP-360 Solder Paste
Resistance to Voiding
OM338PT
CVP-360 Solder Paste
Reflow Performance
Soak profile reduces voiding versus straight ramp profile (20 mil circles, SAC 305 alloy BGA spheres)
Void Size DistributionBGA256 20 mil circles
0.00%
10.00%
20.00%
30.00%
40.00%
50.00%
60.00%
70.00%
80.00%
90.00%
100.00%
ZERO 0-4% 4-8% 8-12% 12-16% 16-20% >20%
% of Joint area
% o
f Joi
nts
CVP-360 Cerf 1.5c_s 245c Peak60s TAL_SACX
CVP-360 Cerf 160c_60s Soak240c Peak 60s TAL
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
39
CVP-360 Solder Paste
Resistance to Voiding
OM338PT
CVP-360 Solder Paste
Reflow Performance
10% Aperture reduction also reduces voiding
Void Size DistributionBGA256 90%
0.00%
10.00%
20.00%
30.00%
40.00%
50.00%
60.00%
70.00%
80.00%
90.00%
100.00%
ZERO 0-4% 4-8% 8-12% 12-16% 16-20% >20%
% of Joint area
% o
f Joi
nts
CVP-360 Cerf 1.5c_s 245cPeak 60s TAL_SACX
CVP-360 Cerf 160c_60s Soak240c Peak 60s TAL
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
40
CVP-360 Solder Paste
Resistance to Voiding4 hours @ 50 % RHInitial
OM338PT
CVP-360 Solder Paste
Reflow Performance
Void Size Distribution - SACX0807 CVP-360 Paste, SAC105 CBGA84 (12 mil spheres on 20 mil pitch)
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
ZERO 0-4% 4-8% 8-12% 12-16% 16-20% >20%
% of Joint area
% o
f Joi
nts
Ramp: 0.7 C/sec, 240 Peak,TAL - 85 s
Ramp: 1.5 C/sec, 245 Peak,TAL - 45 s
Best results with 1% Silver BGA spheres
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
41
CVP-360 Solder Paste
Pin Testability (Flying Probe Method)
Pad type: A B C D
A – 1.0 mm sq pads B – 1.0 mm sq pads with 0.33 mm vias C - 0.7 mm round pads D – 0.7 mm round pads with 0.33 mm vias
All pads coated with Cu-OSP (Entek Plus 106A)Data is average of 3 boards with 1000 pads of each type / board.
Reflow: 238 °C peak, sharp chisel, 6.5 oz. force
PNC0802A 12000 contacts
CVP-360 Solder Paste
Pin Testability
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
42
CVP-360 Solder Paste
Equal to or better than Leading, Pin Testable SAC305 Paste
Dramatically reduced level of residue from
CVP-360
CVP-360 Solder Paste
Pin Testability
Pin Testability (Flying Probe Method)
A B C DPaste
Leading SAC Paste 100% 91.60% 100% 72.40%CVP-360 100% 97.80% 99.40% 99.80%
Pad Type
Pin Test Yield %
Flying Probe Pin Test Yields
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
43
CVP-360 Solder Paste
Clamshell Fixture Pin Test
CVP-360 Solder Paste
Pin Testability
3 Pin Shapes
4 Pin Probe Pressures
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
44
CVP-360 Solder Paste
Similar or Better Resistance to ICT False Failures vs. Leading Pin Testable SAC Paste
% Open % Open
2 0 04 0 06 0 08 0 02 0 18.14 0.6 1.36 0 08 0 02 0 04 0 06 0 08 0 02 0 12.54 0 06 0 08 0 0
Crown
Spear
Crown
Pin Shape
Force (oz)
Blade
Leading SAC Paste
CVP-360
In Circuit Testing Results: Clam Shell
CVP-360 Solder Paste
Pin Testability
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
45
CVP-360 Solder Paste
IPC Compliance
Cu Mirror: Pass (flux & paste)
CVP-360 Solder Paste
Reliability
CVP-360
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
46
CVP-360 Solder Paste
IPC Compliance
Paste is halide free ROM0WER: 8.8 ×
104 Ω-cm
Halogen content: <700 ppm (flux)
Ag Chromate paper: Pass
CVP-360 Solder Paste
Reliability
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
47
CVP-360 Solder Paste
Bellcore SIR- PassReliability
CVP-360 Solder Paste
SIR TEST REPORT - BELLCORE Request: (per GR-78-CORE Issue 1, Sept 97)
Test #: 0806-44b Date: 12/5/2008 T/H/B:35/85/-48Tested by: K. Tellefsen Reported by:K. TellefP/F limit:1E11 Ohms_________________________________________________________________MATERIAL TESTED/ SIR SIR COMMENTSCONDITION (1 day) (4 days) -------- --------CVP-360 4.7E+12 2.8E+12 Visually OKReflowed Paste SACX0807 5.0E+12 3.7E+12uncleaned 2.7E+10 4.5E+10 5.3E+11 4.8E+11 9.0E+11 9.9E+11 6.2E+12 5.0E+12 1.4E+12 1.7E+12 1.0E+10 1.3E+10 2.4E+10 4.1E+10 2.9E+10 4.5E+10 4.0E+12 4.8E+11 3.7E+10 5.3E+10 ----- -----Geometric mean: 3.4E+11 3.2E+11_________________________________________________________________
Control boards 1.1E+14 1.1E+14 1.1E+14 1.1E+14 5.0E+13 5.0E+13 8.3E+12 7.6E+12 7.6E+12 1.1E+13 9.9E+13 9.9E+13 5.0E+13 3.3E+13 2.5E+13 2.2E+12 1.1E+14 7.1E+12 9.9E+12 5.0E+12 1.6E+12 5.7E+11 4.7E+12 7.6E+12 ----- -----Geometric mean: 2.4E+13 1.4E+13
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
48
CVP-360 Solder Paste
IPC SIR- PassReliability
CVP-360 Solder Paste
SIR TEST PER J-STD-004 Request: **********************Test #:0806-44i Date: 11/24/2008 T/H/B 85C/85%RH/-48VTested by: K. Tellefsen P/F limit:Reported by: K. Tellefsen 1.0E+08 ohms_____________________________________________________________________________MATERIAL TESTED/ Initial SIR(ohms) SIR SIR Final COMMENTSCONDITION ambient (1 day) (4 days)(7 days) ambientCVP-360 SACX0807 >1.0E12 6.4E+08 3.4E+09 4.6E+09 >1.0E12 passed electricalReflowed paste >1.0E12 8.8E+08 7.9E+09 8.5E+09 >1.0E12 and visualuncleaned >1.0E12 8.1E+08 7.4E+09 8.2E+09 >1.0E12 requirements >1.0E12 6.5E+08 4.8E+09 5.6E+09 >1.0E12 >1.0E12 1.7E+09 1.6E+09 2.3E+09 >1.0E12 >1.0E12 1.8E+09 5.4E+09 6.2E+09 >1.0E12 >1.0E12 1.7E+09 2.1E+09 3.5E+09 >1.0E12 >1.0E12 1.8E+09 2.2E+09 3.2E+09 >1.0E12 >1.0E12 1.5E+09 8.6E+08 1.0E+09 >1.0E12 >1.0E12 6.8E+08 3.3E+08 2.5E+08 >1.0E12 >1.0E12 4.9E+08 1.9E+08 1.5E+08 >1.0E12 >1.0E12 1.5E+09 8.8E+08 5.6E+08 >1.0E12 ------- ------- ------- ------- -------Arithmetic mean: >1.0E12 1.2E+09 3.1E+09 3.7E+09 >1.0E12_____________________________________________________________________________Control boards >1.0E12 8.4E+10 4.5E+10 5.0E+10 >1.0E12 >1.0E12 1.0E+11 4.9E+10 5.6E+10 >1.0E12 >1.0E12 2.0E+11 1.2E+11 1.0E+11 >1.0E12 >1.0E12 9.6E+10 4.8E+10 4.1E+10 >1.0E12 >1.0E12 1.5E+11 8.1E+10 7.5E+10 >1.0E12 >1.0E12 9.6E+10 5.6E+10 4.6E+10 >1.0E12 >1.0E12 9.2E+10 5.4E+10 4.3E+10 >1.0E12 >1.0E12 1.4E+11 7.2E+10 8.1E+10 >1.0E12 >1.0E12 5.8E+10 3.1E+10 3.3E+10 >1.0E12 >1.0E12 5.7E+10 2.9E+10 3.0E+10 >1.0E12 >1.0E12 7.6E+10 4.8E+10 4.5E+10 >1.0E12 >1.0E12 1.1E+11 5.7E+10 5.4E+10 >1.0E12 ------- ------- ------- ------- -------Arithmetic mean: >1.0E12 1.0E+11 5.8E+10 5.5E+10 >1.0E12
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
49
CVP-360 Solder Paste
IPC SIR- PassReliability
CVP-360 Solder Paste
IPC SIR CVP-360
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
50
CVP-360 Solder Paste
Bellcore EM- PassReliability
CVP-360 Solder Paste
Bellcore Electromigration (per GR-78-CORE Issue 1, September 1997) Request:Test #:0806-44e Start dat11/17/08bias = 10 V T/H: 65/85Tested by: K. Tellefsen Reported by: K. Tellefsen________________________________________________________MATERIAL TESTED/ SIR SIR COMMENTSCONDITION 96 hr. 500 hr. bias ------- -------CVP-360 SACX0807 2.3E+09 4.5E+10 passed visual andIPC-B-25 pattern B 2.6E+09 4.1E+10 electrical requirementsreflowed paste 2.0E+09 1.1E+10Uncleaned 2.1E+09 3.7E+10 2.0E+09 3.4E+10 1.1E+09 2.2E+10 2.2E+09 2.9E+10 1.9E+09 3.2E+10 3.2E+09 6.1E+10 3.6E+09 5.7E+10 3.6E+09 4.7E+10 3.0E+09 5.1E+10 Pass/Fail ----- ----- final >Geometric mean: 2.4E+09 3.6E+10 initial/10________________________________________________________Controls 4.7E+11 1.0E+12 7.2E+11 1.0E+12 4.0E+11 7.1E+11 5.7E+11 1.0E+12 3.2E+09 3.1E+11 2.7E+09 3.0E+11 2.5E+09 2.0E+11 2.5E+09 3.0E+11 3.4E+11 1.0E+12 6.4E+11 9.4E+11 4.7E+11 9.0E+11 7.6E+11 4.9E+10 Pass/Fail ----- ----- final >Geometric mean: 9.1E+10 4.8E+11 initial/10
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
51
CVP-360 Solder Paste
Bellcore EM- PassReliability
CVP-360 Solder Paste
Bellcore EM CVP-360
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
52
CVP-360 Solder Paste
Reliability
Thermal Cycling- CERF Board Test VehicleBGA 256 Package
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
53
CVP-360 Solder Paste
Joints from 2 ends and middle were cross-
sectioned
Thermal Cycling- CERF Board Test Vehicle
1,500 Cycles -40ºC to +100ºC BGA 256
Reliability
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
54
CVP-360 Solder Paste
Reliability
After 1,500 Cycles -40ºC to +100ºC BGA 256Copper Component Pad
Copper Pad
Tin/Copper Intermetallic in Tact
Tin/Copper Intermetallic
Bulk BGA
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
55
CVP-360 Solder Paste
Reliability
Thermal Cycling- CERF Board Test Vehicle
Surface Mount 1206 Resistors
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
56
CVP-360 Solder Paste
Reliability
After 1,500 Cycles -40ºC to +100ºC 1206 Resistor
Surface Mount 1206 Resistor
Tin/Copper Intermetallic
Tin/Copper Intermetallic
Tin/Copper Intermetallic in Tact
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
57
CVP-360 Solder Paste
Reliability
Thermal Cycling- CERF Board Test Vehicle
LQFP 120
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
58
CVP-360 Solder Paste
Reliability
After 1,500 Cycles -40ºC to +100ºC LQFP 120 Copper Lead
Tin/Copper Intermetallic
Copper Pad
Tin/Copper Intermetallic
Tin/Copper Intermetallic in Tact
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
59
CVP-360 Solder Paste
Summary
•High performance paste with the economy of low silver SACX alloy Delivers excellent print deposit volume consistency Prints speed window from 1 to 6 in. (25 to 150 mm)/second Excellent stencil life – reducing paste scrap Better spread and wetting than leading SAC 305 brand Best in Class in circuit pin test yield Exceeds IPC and Bellcore electromigration and surface insulation resistance requirements Solder joints survive 1500 thermal cycles (-40ºC to +100ºC)
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
60
CVP-360 Solder Paste
Summary
Leading Products:
No Clean, SnPb• ALPHA OM-6106
•ALPHA OM-5100
No Clean, Lead-free• ALPHA OM-338 T
•ALPHA OM-338 PT
•ALPHA OM-340
•ALPHA OM-350
•ALPHA CVP-360
•ALPHA CVP-520
Water Soluble, SnPb• ALPHA WS-809
Water Soluble, Lead-free• ALPHA WS-820
CVP-360 Solder Paste
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
61
CVP-360 Solder Paste
AMERICAS
California, USAFlorida, USAIllinois, USANew York, USAPennsylvania, USAMexico City, MexicoMonterrey, MexicoManaus, BrazilSao Paulo, Brazil
EUROPE
Woking, EnglandTurnhout, BelgiumCholet, FranceBudapest, HungaryHatar, HungaryNaarden, NetherlandsEast Kilbride, Scotland
ASIA-PACIFIC
Hong Kong, ChinaGuangxi, ChinaShenzhen, ChinaShanghai, ChinaChennai, IndiaHiratsuka, JapanSihung City, KoreaSingaporeTaoyuan, Taiwan
Global Manufacturing Sites Summary
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
62
CVP-360 Solder Paste
AMERICAS
California, USAGeorgia, USAIllinois, USANew Jersey, USAPennsylvania, USAOntario, CanadaGuadalajara, MexicoBuenos Aires, ArgentinaSao Paulo, Brazil
EUROPE
Woking, EnglandTurnhout, BelgiumCholet, FranceLangenfeld, GermanyHatar, HungaryDublin, IrelandMilano, ItalyNaarden, NetherlandsEast Kilbride, Scotland
ASIA-PACIFICHong Kong, ChinaShenzhen, ChinaBeijing, ChinaChengdu, ChinaGuangxi, ChinaNanjing, ChinaShanghai, ChinaSuzhou, ChinaTianjin, ChinaXiamen, ChinaBangalore, India
Global Sales Support
Chennai, IndiaHiratsuka, JapanSihung City, KoreaPenang, MalaysiaMuntinlupa, PhilippinesSingaporeTaoyuan, TaiwanBangkok, ThailandThomastown, AustraliaAuckland, New ZealandVietnam
Summary
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
63
CVP-360 Solder Paste
AMERICAS
California, USANew Jersey, USAGeorgia, USAGuadalajara, MexicoMonterrey, MexicoBuenos Aires, ArgentinaSao Paulo, BrazilManaus, Brazil
EUROPE
Woking, EnglandTurnhout, BelgiumCholet, FranceLangenfeld, Germany
ASIA-PACIFIC
Hong Kong, ChinaShenzhen, ChinaBeijing, ChinaShanghai, ChinaSuzhou, ChinaTianjin, ChinaBangalore, India
Global Customer Technical Support
Chennai, IndiaHiratsuka, JapanSihung City, KoreaPenang, MalaysiaSingaporeTaoyuan, Taiwan
Summary