CTS-7700 Service Manual

8/16/2019 CTS-7700 Service Manual

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DCY2.782.7700WC/E-A00

CTS-7700Digital Ultrasound Imaging System

SERVICE MANUAL

SHANTOU INSTITUTE OF ULTRASONIC INSTRUMENTS, INC.

SHANTOU, CHINA


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I

CONTENTS

1. System Composi t i on and Technical Spec i f i cat ions …………….…….… 1-1

1.1 System Composition….…………………………………………………………………………… 1-1

1.2 Technical Specifications….………………………..………..……………………………………. 1-1

2. System Working Princ iple…...…………………………..………………………………... 2-1

2.1 Brief Introduction of Working Principle……………………..…………………………………… 2-1

2.2 Introduction of PCB……………………..……..…..……..……. ……………………………….. 2-3

2.2.1 Control Panel………………………………………….……………………………………… 2-3

2.2.2 Digital Processing Board..…………………………………..………………………………. 2-6

2.2.3 Order and Amplification Board.……………………………..……………………………… 2-13

2.2.4 Probe Interface Board………………………………………..……………………………… 2-19

2.3 Interconnection Signal List Between PCBs…...………………………………………………... 2-25

2.3.1 Probe Interface Board………………………………………..………………………………. 2-25

2.3.2 Order and Amplification Board……………………………..……………………………….. 2-27

2.3.3 Industrial Control Board..…………..………..………………………………………………. 2-29

2.4 Connection Diagram Between PCBs……………………………………………………………. 2-30

2.5 Disassemble Instruction..………………………………………………………………………… 2-31

2.5.1 General………………………………………………………………………………………… 2-31

2.5.2 Disassemble Plastic Housing..……………………………………………………………… 2-32

2.5.3 Disassemble Keyboard…..………………………………………………………………….. 2-34

2.5.4 Disassemble Rear Panel….………………………………………………………………… 2-35

2.5.5 Disassemble industrial control board……...……………………………………………….. 2-36

2.5.6 Disassemble PR board and RVA board……………………………………………………. 2-37

2.5.7 Disassemble Power Supply and Hard Disk…...…………………………………………… 2-38

2.5.8 Disassemble MONIT Board…………………………………………………………………. 2-39

2.5.9 Disassemble FEP Board…………………………………………………………………….. 2-42

2.5.10 Assemble Schematic of Main Unit………………………………………………………….. 2-42

2.6 Installation Instruction for Computer Main Board (Industrial Control Board).. ……………… 2-48


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II

2.6.1 Appearance of Computer Main Board..…………………………………………………… 2-48

2.6.2 Interface Position Map..…………………………………………………………………….. 2-48

2.6.3 Installation of System Memory….…………………………………………………………. 2-49

2.6.4 USB Port……………………………………………………………………………………… 2-49

2.6.5 IDE Port……..……………………………………………………………………………….. 2-50

2.6.6 Floppy Disk Port…..…………………………………………………………………………. 2-51

2.6.7 Display Port...………………………………………………………………………………... 2-52

2.6.8 Network Port…………………………………………………………………………………. 2-52

2.6.9 Keyboard and Mouse Port..……….……………………………………………………….. 2-53

2.6.10 Power Supply Port.…….…………………………………………………………………… 2-53

2.6.11 Fan Port..……….……………………….…………………………………………………… 2-55

2.6.12 Status Indication Port……………………………………………………………………….. 2-55

2.6.13 TV Output Port……………………………………………………………………………….. 2-56

3. Troubleshooting………………………………………………..……………..…..….…….. 3-1

3.1 PCB Function and Potential Failure……………………………………………………………... 3-1

3.1.1 Main Function and Potential Failure of Probe Interface Board…………………………... 3-1

3.1.2 Main Function and Potential Failure of Order and Amplification Board………………… 3-2

3.1.3 Main Function and Potential Failure of Digital Processing Board……………………….. 3-4

3.1.4 Main Function and Potential Failure of Power Supply Module………………………….. 3-7

3.1.5 Main Function and Potential Failure of Control Panel …………………………………… 3-8

3.1.6 Main Function and Potential Failure of Computer Main Board…………………………... 3-11

3.2 Common Failure and Troubleshooting………………………………………………………….. 3-12

3.2.1 System Cannot Start Up……………………………………………………………………... 3-12

3.2.2 Lowered Image Quality………………………………………………………………………. 3-14

3.2.3 Abnormal Image………………………………………………………………………………. 3-14

3.2.4 Failure Analysis on Monitor………………………………………………………………….. 3-16

3.2.5 Other Common Failures and Troubleshooting…………………………………………….. 3-20

4. Software Maintenance....…….……………………………………………………….……. 4-1

4.1 System Update...…….……………………………………………………………………………. 4-1


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System Composition & Technical Specifications

1-1

Chapter 1System Composition & Technical Specifications

1.1 System Composition

The system as shown below consists of a main unit, an operation panel, probes and

peripheral devices. The main unit includes Probe Interface Board, Order and Amplification

Board, Digital Processing Board, Control Platform, Monitor and Power Supply.

Fig. 1-1 Block Diagram of System Composition

1.2 Technical Specif ications

For detailed system specifications, please refer to the system operation manual.

USB Port

VideoOutput

Network Port

Operation

Panel

Ima e Data

Control

Main Unit

Power

Monitor

ControlPlatform

Digital

Processing

Board

Ultrasound

Receive/Transmit

Front-end

Probe

Interface

Board

Probe 1

Probe 2

Order

and

Ampli-

fication

Board


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System Working Principle

2-1

Chapter 2


2.1 Brief Introduct ion of Working Principle

The fundamental working principle of the main unit is as follows:

The Probe Interface Board receives transmit excitation signals from the Digital Processing

Board and generates transmit high-voltage pulse through high-voltage drive circuit. The

high-voltage pulse then is sent to the working elements of the probe to generate

ultrasound through the Probe Interface Board. The echo from the ultrasound during

propagation in human body is received by the same group of working elements and

converted into feeble echo electric signals, which will be sent to the Order and

Amplification Board through pre-amplification. There are two probe connectors available

on the Probe Interface Board, to which two probes can be connected at the same time.

The T/R control FPGA on the Digital Processing Board yields transmit excitation signals of

the current transmission based on control signals. This group of signals is then sent to the

Probe Interface Board. The pre-amplified echo signals from the Probe Interface Board is

ordered, and sent to the Digital Processing Board after two-step TGC amplification.

The echo signals are converted into digital signals via ADC by the Digital Processing

Board, and further into digital image signals after a series of processing, including beam

focusing, aperture control, dynamic apodization and beam forming, dynamic filtering,

dynamic range conversion, demodulation, persistence processing and scan conversion

and sent to the Ultrasound Control Platform through the Digital Processing Board.

The Digital Processing Board on one hand transmits the digital image signals to the

Control Platform, on the other hand receives control information from the Control Platform


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and generates corresponding control data to achieve control of the front end.

The Control Platform is the management center of the whole system control, which

receives operation commands from the control panel to manage the whole system control

in accordance with the current system state. The other functions the Control Platform

fulfills also include measurement and calculation, interface display and video processing,

management of patient data and images, control of storage, printing and communication.

The wiring diagram of the whole system is shown below:

C H 6

C H 4C H 8

X S 2

X S 3

X S 4 X S 1

X S 5

X S 6

X S 1

X S 8

X S 8

X S 2

K e y b o a r d

H a r d d i s k

M o n i t o r b o a r d

AT X p o w e r

d i g i t a l b o a r d

I n d u

s t r i a l

c o n t r o l

b o a r d

A m p l i f y

i n g b o

a r d

p r o b

e b o

a r d

X S 18

X S 11

X S 10 X S 12

X S 9 2 0 P p o w e r

R e a r p a n e l

4 P p o w e r

P o w

e r m o d

u l e b o

a r d

X S 4

X S 3

X S 3

X S 3

P R A

11

12

12

3

4

5

6

8

9

20

17

1314

15

19

18

10

16

21

C H 5

2 4 c m M o n i t o r t u b e

23

22

7

Ad j u s t i n g p l a t e

1— Internal AC Wire

2— Extended Network Card Wire

3— Extended USB Wire

4— Extended VGA Wire

5— Power Indicator Wire

6— Video Print Wire

7— PS/2 and Start-up Wire

8— COM2 Wire

9— Print Control Wire

10— Front-end Data Wire

11— Hard-disk Data Wire

12— +15, +30V Power Wire

13— +12V Fan Wire

14— +5V, +12V Power Wire

15— ±60V Power Wire

16— Hard Disk Data Wire

17— Keyboard Data Wire

18— External AC Power Wire

19— ±5V, ±12V, HVC Power Wire

20— Contrast & Brightness Adjust Control Wire

21— Contrast & Brightness Adjust DIsplay Wire

22— Deflecting Coil Connecting Wire

23— Monitor Tube High-voltage Wire

Fig. 2-1 Wiring Diagram for Whole System


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2.2 Introduction of PCB

2.2.1 Control Panel

2.2.1.1 Funct ional Descrip tion

The Control Panel as shown below in Fig. 2-2 consists of a keyboard (KB), a silicon-gel

membrane of the keyboard, a keyboard interface board (KBIF) and a trackball.

FPGA

Trackball

Encoder 1

Encoder n

Decoder 1

Decoder n

8 Gain control

potentiometers

ADC0809

Additional

logic

circuit

Serial

Interface

Single chip

Micro-

Computer

FEP Board

ADC0809

Control

logic

Operation Panel Main Unit

Key Array

Toggle Switch

Scanning

Logic

IndustrialControl Board

Fig. 2-2 Diagram of Control Panel

The keyboard mainly includes a printed circuit board (PCB) key array. Two key contact

points that are directly formed by exposed copper with gold plating on the printed circuit,

and an LED on each key for backlight. The keyboard button silicon gel membrane covers

on the keyboard. When the key on the silicon gel membrane is pressed, the conductive

silicon under the keys will connect the two contact points on the PCB to complete the key

operation for other circuit inspection.

The Keyboard Interface Board is the primary connection of control knobs, TGC adjust

potentiometers, and the required control circuit for the control panel. The primary task of

the Keyboard Interface Board is to monitor all the actions on the receiving panel, converts

them into established protocols and sends them to the main unit. Meanwhile, it receives

various control signals from the main unit and controls the related circuits on the Keyboard


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Interface Board.

The displacement signals directly outputted from the trackball are PS/2 protocol signals,

which will be combined with other signals to XS4 via XS8 plug on the Keyboard Interface

Board. XS4 plug is connected to the FEP board via a 34-core cable, and XS10 plug on the

FEP board is connected to the PS/2 port on the Industrial Control Board via another cable.

There are several control knobs and subsection gain controls on the keyboard. Configure

an FPGA (XCS10XL-TQ100) as a logic interface, a single chip microcomputer (also called

micro controller unit, MCU) AT89C51-24JI as the overall control and protocol conversion,

and RS-232 as the communication interface. Use an MAX232 as switchover between TTL

level and RS-232 level.

The MCU of the keyboard controls the FPGA to output line-scanning signals, reads array

signals from P1 on the MCU to obtain key information, converts it into established

protocols and sends it to the main unit. All the line and array signals on the Interface Board

are connected to the keyboard via XS1.

All the interfaces are connected to the FEP board through XS4 on the Interface Board,

and XS4 also provides the power supply for the keyboard board. The power input is +5V,

and the measuring point is +5V. All kinds of signals are connected to the corresponding

ports on computer main board via the FEP board.

Because the working voltage of FPGA is +3.3V, the voltage converting circuit is configured

to convert the voltage from +5V to +3.3V required by the FPGA. The converting

component adopted is MIC39100.

The control knobs are placed on the keyboard panel. Using encoder OAK-700, 5 pairs of

orthogonal signals outputted from 5 encoders are connected to the FPGA for decoding.

The encoder actions are converted into enumerated data by using the FPGA built-in

decoder as an interface. The enumerated results are read in by the MCU, converted into

established protocols and sent to the main unit via the serial interface.

The subsection gain controls use sliding potentiometers, which are installed on the


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Fig. 2-3 Pin Encapsulation of major Components

2.2.2 Digital Processing Board

The primary functions of the Digital Processing Board (DPB) include transmitting and

receiving controls, A/D conversion, digital beam forming, dynamic filtering, tissue imaging

processing, digital scan conversion, system control, PCI bus interface and also circuit for

voltage transform. The DPB receives multi-channel analog ultrasound echo signals from

the front-end processing module, goes through A/D conversion, and forms a channel of

digital signals through digital beam-forming in combination with control signals from the

Control Interface Module. After signal processing such as dynamic filtering and tissue

imaging, these signals then will be sent to the DSC part and converted into corresponding

display frame shape. Finally, the image will be sent to the Control Interface Module frame

ADC0809CN

LM1084IS-ADJ

AT89C51


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by frame. The Control Interface Module is a bridge between the Computer Module and the

Ultrasound Part. For the computer module at the upper level, it receives all kinds of data

from computer software via PCI bus, decomposes and distributes them to modules and

simultaneously yields control signals per requirements to control working of the whole

Ultrasound Part; for the Ultrasound Part at the lower level, it receives full frame image

signals from the DSC module and sends the image signals to the Computer Module via

PCI bus.

Based on Y_SYNC signals from the system control module and a series of parameters,

the T/R Control Module will configure the states of high voltage switch and folding matrix

switch at the front end according to related parameters when Y_SYNC is at low level.

When Y_SYNC signals turn high from low level, multi-channel transmit pulses are

outputted from FPGA and converted into high-voltage pulse excitation probe via the

high-voltage exciting circuit on the Probe Interface Board, thus to achieve an ultrasound

transmission. The ultrasonic signals reflected from tissues are amplified through the

pre-amplifier on the Probe Interface Board, and transmitted through two-level time gain

compensation amplification circuit on the Amplification Board, and the output echo signals

after symmetric folding are sent to the Digital Processing Board.

Having been sent to the Digital Processing Board, the multi-channel analog echo signals

are converted into multi-channel digital signals via A/D conversion, and sent to the

Beam-forming Module. As per relevant control parameters, the multi-channel digital

signals are delayed and added by the Beam-forming Module to achieve focusing function

of ultrasound receiving.

One essential problem of ultrasound diagnosis is that the relationship between

parenchyma (soft tissue) ultrasound attenuation and frequency is approximately in

linearity. Because the probes used for the system are broad-brand, center frequency of

transmit excitation signals will shift down as ultrasonic pulse transmits deeper. In order to

improve image quality, the near field receives high-frequency echoes only to improve

resolution, while the far field only receives low-frequency echoes to improve S/N ratio. A

time-variable band-pass filter is required, thus a Dynamic Filter Module is configured to


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achieve this function.

The data going through dynamic filtering are sent to the Tissue Imaging Processing

Module, the functions of which are to optimize ultrasound images. The functions, including

dynamic range conversion, logarithm compression, gray scale mapping, smoothness

enhancement and lateral filtering, significantly improve ultrasound image display quality,

which are conducive to better clinical diagnosis. There is an additional transmit voltage

control signal D/A output on the Dynamic Filter Module. The Dynamic Filter receives 8-bit

control information from the system Control Module and outputs it to the D/A part, sends to

the Power Module to control the transmit voltage outputted from the Power Module.

Meanwhile, Time Gain Compensation curve is sent out from the same module. After D/A

conversion and buffering, it is sent to the Amplification Board to control the corresponding

time gain compensation circuit.

Having been processed by the Tissue Imaging Processing Module, the ultrasonic signals

are sent to the Digital Scan Conversion Module in the form of scanning lines. The Digital

Scan Conversion Module coverts the image signals in line form to images in the same

geometric shape of the actual ultrasound scanning range (e.g. sector image of the convex

probe, rectangular image of the linear probe), as per the current probe and other control

parameters. At the same time, the image will be processed with interpolation when

required. Finally, an image is acquired for display.

The system Control Module receives image signals from the Digital Scan Conversion

Module and buffers them before sending them to the PCI Interface Module frame by frame

at an appropriate time. Meanwhile, the system Control Module receives and processes

the control parameters from the PCI Interface Module and yields the overall control

signals for ultrasound scanning and distributes some of the parameters to the modules

that need these parameters.

The PCI Interface Module is an important bridge in the whole ultrasound system. It via the

communicates with the computer via the PCI bus and acquires all kinds of settings and

control commands from the computer system; at the same time it reads in various state


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information from the Digital Processing Board and sends them to the computer via the PCI

bus. The most important task of it is to receive image signals from the system Control

Module and send them to the computer via the PCI cable, and to obtain a real-time

ultrasound image in the computer. The ultrasound image will be displayed on the screen

after being processed in the computer application.

The power supply changeover circuit transforms the inputted +5V voltage on the Power

Module into +3.3V and +2.5V for low-voltage parts like FPGA or SRAM on circuit boards.

The power changeover adopted is TPS76833QPWP and TPS76825QPWP manufactured

by TI. The schematic is shown below.

Fig. 2-4 Schematic of Power Supply Changeover Circuit

Indicators for the major power supplies on the circuit boards are for indicating whether the

voltages are proper or not. If any of the indicators is off, please use a multimeter to

measure the corresponding measured points to verify if the voltage meets the rated

values.


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Component composition:

The components on the Digital Processing Board mainly include power supply

changeover, A/D converter part, FPGA part and its configured FLASH ROM, signal drive

parts, SRAM part, resistors and capacitors.

The layout of major components:

C 1 6 4

1 0 4

C 1 6 3

1 0 4

C 9 1

1 0 4

R 8 9

2 2 0

R 8 8

3 3 1

R 8 7

2 0 1

C 9 0

1 0 4

C53 104

C50

156/25V

C63 104

C 3 7 9

1 5 6 / 2 5 V

C 3 8 0

1 5 6 / 2 5 V

C381

101

C382

1 5 6 / 2 5 V

C383

1 5 6 / 2 5 V

R 6 7 3 3 1

R 6 8

2 0 2

R 6 9

2 0 2

R70

152

R71

152

R72

152

R73152

R 7 4 1 5 2

R 7 5

1 0 1

R76

470

R 7 7

2 0 2

R 7 8

2 0 2

C 9156/25V

R 7 9 5 1 2

C8 1 5 6 / 2 5 V

C7

156/25V

C 6 1 0 4

C5

1 5 6 / 2 5 V

R 4 9

0 0 0

R 4 8

4 7 2

R 4 7

4 7 2

R 4 6

4 7 2

R 4 5

4 7 2

R 4 4

4 7 2

R 4 3

4 7 2

R 4 2

4 7 2

R 4 0

4 7 2

R 3 5

4 7 2

R 3 4

4 7 2

R33

472

R30

472

R 2 9

4 7 2

R 2 8

4 7 2

R 2 6

4 7 2

R 2 4

4 7 2

R 2 0

4 7 2

R 1 9

4 7 2

R 1 8

4 7 2

R 1 7

4 7 2

R 1 6

4 7 2

R 1 5

4 7 2

R 1 2

4 7 2

R 1 1

4 7 2

R 1 0

4 7 2

R 9

4 7 2

R 4 6 4

6 8 1

C142

104

C 1 4 0

1 0 4

C 1 3 9

1 0 4

C 1 3 8

1 0 4

C 1 3 7

1 0 4

C 1 3 5

1 0 4

C 1 3 3

1 0 4

C 1 3 0

1 0 4

C129

104

C162

104

C161

104

C160

104

C159104

C158104

C157

104

C155

104

C154

104

C153

104

C152

104

C 1 5 1

1 0 4

C150

104

C 1 4 9

1 0 4

C 1 4 8

1 0 4

C147

104

C146 104

C145

104

C144

104

C141 104

C 1 3 6

1 0 4

C 1 3 2

1 0 4

C 1 2 8

1 0 4

C 1 2 7

1 0 4

C126

104

C125

104

C 1 2 4

1 0 4

C122 104

C121

104

C 1 2 0

1 0 4

C 1 1 9

1 0 4

C 1 1 8

1 0 4

C 1 1 7

1 0 4

C 1 1 6

1 0 4

C 1 1 5

1 0 4

C114

104

4 7 3 / 5 0 0 V X 3

C110

104

C105

1 0 4

C104

1 0 4

C102

1 0 4

C101

1 0 4

C100

1 0 4

C99

1 0 4

C98

1 0 4

C97

1 0 4

C96

1 0 4

C95

1 0 4

C94

1 0 4

C92

1 0 4

C89

104 C 8 8 1 0 4

C87

104

C 8 6 1 0 4

C85104

C56

104

C55

104

C 5 4 1 0 4

C52

104

C 5 1

1 0 4

C 4 9

104

C48

104

C 4 7

1 0 4

C 4 6

1 0 4

C 4 5

1 0 4

C44

104

C 4 3

1 0 4

C42

104

C 4 1

1 0 4

C40

104

C 3 9

1 0 4

C38104

C37

104

C30

104

C29104

C28 104

C 1 3 4

1 0 4

C131

104

C65

104

C1

C2

C3

C 4

156/25V

C 2 1

1 5 6 / 2 5 V

C 3 3 1 0 4

C 3 4

1 0 4

C 3 5

1 0 4

C 3 6 1 0 4

C81

156/25V

C 8 2

1 0 4

C 8 3

1 0 4

C 9 3

1 0 4

C 1 0 3

1 0 4

C 1 1 1

156/25VC112104

C113104

C123104

C 2 3 1

1 0 4

C232

1 5 6 / 2 5 V

C233

156/25V

C 2 3 4

1 0 4

C 2 3 5

1 0 4

C 2 3 6

1 0 4

C 2

4 1

1 5

6 / 2 5 V

C 2

4 2

1 5

6 / 2 5 V

C 2 4 3

1 0 4

C 2 4 4

1 0 4

C 2 4 5

1 0 4

C 4 7 1

1 0 4

C472

104

C 4 7 3

2 2 2

C481

104

C482104

C 4 8 3

2 2 2

C511

1 5 6 / 2 5 V

C 5 1 3

1 0 4

C521

1 5 6 / 2 5 V

C 5 2 3

1 0 4

C 5 3 3

1 0 4

C 5 4 3

1 0 4

C 5 5 3

1 0 4

C 5 6 3

1 0 4

C 5 7 3

1 0 4

C 5 8 3

1 0 4

C 5 9 3

1 0 4

C 6 0 3

1 0 4

L3

2 2 0 u H

L4

2 2 0 u H

L5

2 2 0 u H

L6

2 2 0 u H

L7

2 2 0 u H

L8

2 2 0 u H

L9

2 2 0 u H

L10

2 2 0 u H

L11

2 2 0 u H

L12

2 2 0 u H

R 2 1

5 1 1

R22103

R 2 5 4 7 2

R 2 7 1 0 1

R 3 1

6 8 1 R 3 2 6 8 1

R 3 9

0 0 0

R 5 1

6 8 1

R 5 2

6 8 1

R 5 3 6 8 1

R 8 1

2 0 1

R 8 2

2 0 1

R83

472

R 9 1

2 0 1

R 9 2

2 0 1

R 1 0 1

2 0 1

R 1 0 2

2 0 1

R111201

R112331

R121201

R122331

R 1 3 1

6 8 1

R 1 3 2

6 8 1

R 1 3 3

6 8 1

R 1 6 1

6 8 1

R 1 6 2

6 8 1

R 1 6 3

6 8 1

R 2 1 1

6 8 1

R 2 1 2

6 8 1

R 2 1 3

6 8 1

R 2 2 1

6 8 1

R 2 2 2

6 8 1

R 2 2 3

6 8 1

R 8

1 0 3

R7 103

R6103

R 2 3 1

2 0 2

R 2 3 2

2 0 2

R 2 4 1

2 0 2

R 2 4 2

2 0 2

R 4 1 1

6 8 1

R 4 1 2

6 8 1

R 4 1 3

6 8 1

R 4 2 1

6 8 1

R 4 2 2

6 8 1

R 4 2 3

6 8 1

R 4 3 1

6 8 1

R 4 3 2

6 8 1

R 4 3 3

6 8 1

R 4 5 1

4 7 2

R 4 6 3

6 8 1

R 4 6 5

6 8 1

R471

152

R472

101

R

4 7 3

1 5 2

R474 102

R475

681

R477

470

R481

152

R482

101

R483152

R484102

R 4 8 5

1 0 2

R487

470

C13 104

C14 104

C 1 5

1 0 4

C16 104

C17

104

C 1 8

1 0 4

C 2 5 1 0 4

C26

104

C 2 7

1 0 4

C 7 0 1 0 4

C71 104

C 7 2 1 0 4

C73104

C 7 8 1 0 4

C79

1 0 4

C80

104

C84104

C 4 9 1

1 5 6 / 2 5 V

C 4 9 3

1 0 4

C501

1 5 6 / 2 5 V

C 5 0 3

1 0 4

C531

1 5 6 / 2 5 V

C541

1 5 6 / 2 5 V

C551

1 5 6 / 2 5 V

C561

1 5 6 / 2 5 V

C571

1 5 6 / 2 5 V

C581

1 5 6 / 2 5 V

C591

1 5 6 / 2 5 V

C601

1 5 6 / 2 5 V

L1

2 2 0 u H

L2

2 2 0 u H

C10104

C11

104

C 1 2

1 0 4

C 5 8

1 0 4

C60 104

C 6 2 1 0 4

C64104

C 6 6 1 0 4

C67 104

C 6 8 1 0 4

C 6 9

1 0 4

R5 103

R4 470

R3 470

R2 470

R1 470

R 3 6

0 0 0

R 3 7

0 0 0

C 1 4 3

1 0 4

R 3 8

0 0 0

R 5 0

0 0 0

R 5 4

0 0 0

R 5 5

0 0 0

R 5 6

0 0 0

R 5 7

0 0 0

R 5 8

0 0 0

R 5 9

0 0 0

R 6 0

0 0 0

R 6 1

0 0 0

R 6 2

0 0 0

R 6 3

0 0 0

R 6 4

0 0 0

R65 470

R66 470

C57104

C59104C61 104

R 8 4

0 0 0

R 8 5

5 1 2

R80

000

Fig. 2-5 FEP Welding Surface


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2-11

R 5 5 1

1 0 1

R 5 6 1

1 0 1

R 5 7 1

1 0 1

R 5 8 1

1 0 1

R 5 9 1

1 0 1

R 6 0 1

1 0 1

C 4 9 2

1 0 4

C 4 9 4

1 0 4

R 4 9 1

1 0 1

U41

XC2S200-5PQ208

U42

XC2S200-5PQ208

U43

XC2S200-5PQ208

U 4 7

AD712JR

U 4 8

AD712JR

U49

AD9057

U50

AD9057

U51

AD9057

U52

AD9057

U53

AD9057

U54

AD9057

U55

AD9057

U56

AD9057

U57

AD9057

U58

AD9057

U59

AD9057

U60

AD9057

U69

74LVC245A

U70

74LVC245A

U71

74LVC245A

C 5 0 4

1 0 4

R 5 0 1

1 0 1

A61

B48

A49A1

B2 B62

XS1

RJB60DCHN-S578

V 8

V 7

LIGHT2

D25 20 15 10 5 D1

1A510152025A

XS2

DHB-RB100-S13NN

25A 20 15 10 5 1A

D15101520D25

XS3

DHB-RB100-S13NN

2 5 A 2 0 1 5 1 0 5 1 A

D 1 5 1 0 1 5 2 0 D 2 5

XS4

DHB-RB100-S13NN

2 5 A 2 0 1 5 1 0 5 1 A

D 1 5 1 0 1 5 2 0 D 2 5

XS5

DHB-RB100-S13NN

XS7

2 1

3 4 3 3

XS8

L H - 3 4 R

1

XS9

B H - 1 0 S

GND

GND

GND

GND

GND

U46

XC2S200-5PQ208

U 6 5

7 4 L V C 2 4 5 A

U 6 6

7 4 L V C 2 4 5 A

U 6 7

7 4 L V C 2 4 5 A

U 6 8

XCF02S

U72

74LVC245A

U 1

I S 6 3 L V 1 0 2 4 L - 1 2 H

U2

AD712JR

U3

DAC0800LCM

U5

XC2S200-5PQ208

U6

XCF02S

U7

74LVC245A

U8

LM1084

U9

LM1084

U10

LM1084

U11

L M 1 0 8 4

U12

L M 1 0 8 4

U13

XC2S200-5PQ208

U 1 4

I S 6 3 L V 1 0 2 4 L - 1 2 H

U 1 5

IS63LV1024L-12H

U16

XC2S200-5PQ208

U17

74LVC245A

U18

74LVC245A

U19

74LVC245A

U20

74LVC245A

U21

XC2S200-5PQ208

U22

XC2S200-5PQ208

U23

DAC0800LCM

U24

DAC0800LCMU2550.0000MHz U26

IS63LV1024L-12HU27

IS63LV1024L-12H

U 2 8

I S 6 1 L V 1 2 8 1 6 L

U 2 9

I S 6 1 L V 1 2 8 1 6 L U30

XCF02S

U31

XCF02S

U32

XCF02S

U33

XCF02S

U34

XCF02S

U35

XCF02S

U36

XCF02S

U73

74LVC245A

U74

74LVC245A

U76

74LVC245A

N F 1

473

N F 2

473

N F 3

4 7 3

NF4

4 7 3

U81

IDT74FCT3807

V 1 0

V 1 1

V 1 2

V13

HZ5C1

V 9

X S 1 3

N S - 1 * 2

X S 1 4

N S - 1 * 2

X S 1 5

N S - 1 * 2

X S 1 6

N S - 1 * 2

X S 6

N S - 1 * 2

C22

104

C 2 3

1 0 4

C31 104

C 3 2

1 0 4

1

6

X S 1 8

J S - 1 0 0 1 - 6

WW17-215 X 6

1 0 4

1 6JS-1001-6

U4

LM1084

1

D45

AT27C020-70JI

1

D40

AT27C1024-70JI

N F 5

473

GND

1

11

XS12

J S - 1 0 0 1 - 1 1

14

1

XS11

J S - 1 0 0 1 - 1 4

1

10XS10

J S - 1 0 0 1 - 1 0

LIGHT1

V4

WW17-215 X 6

V3

V2

V1

U75

74LVC245A

C 5 0 2

C 5 1 2

1 0 4

C 5 1 4

1 0 4

C 5 2 2

1 0 4

C 5 2 4

1 0 4

C 5 3 2

1 0 4

C 5 3 4

1 0 4

C 5 4 2

1 0 4

C 5 4 4

1 0 4

C 5 5 2

1 0 4

C 5 5 4

1 0 4

C 5 6 2

1 0 4

C 5 6 4

1 0 4

C 5 7 2

1 0 4

C 5 7 4

1 0 4

C 5 8 2

1 0 4

C 5 8 4

1 0 4

C 5 9 2

1 0 4

C 5 9 4

1 0 4

C 6 0 2

1 0 4

C 6 0 4

1 0 4

R 5 1 1

1 0 1

R 5 2 1

1 0 1

R 5 3 1

1 0 1

R 5 4 1

1 0 1

Fig. 2-6 FEP Component Surface


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For the specific sockets, other circuit boards or modules, please refer to Fig. 2-1.

2.2.3 Order and Amplification Board

2.2.3.1 General

The Order and Amplification Board consists of the impedance transform circuit 3904, the

order folding matrix switch circuit MT8816 or CD22M3494, the two-step TGC amplification

circuit AD602, the drive and amplitude control circuit AD817 and the control signal

interface circuit SN74LVC245. The diagram for the Order and Amplification Board is

shown below in Fig. 2-8. After the echo signals are sent from the Pre-amplification Circuit

on the Probe Interface Board and before the signals enter the Folding Circuit, the emitter

made up of primary 3904 audion follows the circuit, in order to enhance loading capacity

of the Pre-amplification Circuit output, which also serves for impedance transform.

Impedance

Transform

3904

Audion

Array

Resettle

-ment

and

Folded

Circuit

MT8816

Array

AD602

Array

TGC

Amplifier

ADC

Driver

AD817

Array

EchosEchos RF Echos

Output

Echos

Control signals

Preamp

Output

Fig. 2-8 Circuit Diagram of Order and Amplification Board

The power voltages on the Order and Amplification Board are ±5 and ±12V. The

voltages of MT8816 or CD22M3494 and AD602 are ±5V. The voltages of 3904 and

AD817 are ±12V. The voltage of the Bus Interface Circuit SN74LC245 is +5V.

The channel parallel echo signals on the Probe Interface Board, after being pre-amplified

are ordered, with channel symmetry superposed and amplified, are finally sent to the

Digital Processing Board for A/D and following processing.

2.2.3.2 Order and Folding Circuit

The circuit adopted by the Order and Folding Circuit is CD22M3494E-MQ or MT8816

manufactured by INTERSIL, the chip of which has 16×8＝128 analog switches. Its


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appearance is shown below in Fig. 2-9. The chip has 44 pins, which is very convenient for

connection. It can be connected with 16 inputs and 8 outputs, or 8 inputs and 16 inputs.

The input and output pins are controlled separately. AX0~3 control pins X0~15, and

AY0~2 control pins Y0~Y7. The DATA pin can be disconnected against access. When

DATA is “0”, the addressed switch is disconnected. When DATA is “1”, the addressed

switch is connected. The RESET signal can reset all the switches. When RESET is high,

all the switches are disconnected.

Fig. 2-9 Outside Drawing of CD22M3494E-MQ


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Fig.2-10 Sequence Chart of CD22M3494E-MQ

The configured sequence chart of CD22M3494E-MQ or MT8816 chip is shown above in

Fig. 2-10.

And the truth tables are showed below in Table 2-1.


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Table 2-1 Truth Table of CD22M3494E-MQ or MT8816

As the central element for each transmission varies with the difference in each line, the

task of order and folding is to link echoes of the Amplification Circuit corresponding to the

current transmitted central elements to the channel center, to link the echoes of the

Amplification Circuit corresponding to echoes of the current transmitted edge elements to

the edge channel, and the rest may be deduced by analogy. The channels not to be

compounded are linked to pin XX12, which is linked to 0.1uF capacitance to ground.

Finally, the output signals from CD22M3494E-MQ or MT8816 chip are the channel echo

signals going through channel symmetric superposition and ordering.

2.2.3.3 Two-step TGC Amplification Circuit

The output signals of the echo signals from the folding circuit are pre-amplified by the

two-step TGC Amplification Circuit composed of AD602 part array.

The internal block diagram of one channel of AD602 is shown below in Fig. 2-11.


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Fig. 2-11 Internal Block Diagram of AD602

Table2-2 Pin Definition of AD602


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The pin definition of AD602 is shown above in Table 2-2.

a) Main features of AD602:

Each AD602 has two independent channels, namely two amplifiers;

The gain dB value of each channel is in direct proportion to the control voltage;

Low input noise 1.4nV/ Hz ;

High bandwidth, with -3dB bandwidth at DC~35MHz;

Each channel consists of a precise passive input attenuator and a fixed gain

amplifier (31dB);

The input attenuator is controlled by control voltage (CHI-CLO), the control

sensitivity is: 31.25mV/dB;

Power consumption of each channel is 125mW;

Gain control range of each channel is: -10dB~+30dB.

b) Calculation equation ofAD602 gain control:

Gain (dB)=32Vg+10

Vg (V)=CHI-CLO

Range of Vg: -625mv ~ +625mv

If: CHI1=0V~1.35V

CHI2= 0.312V~1.35V

When CLO is about 0.625V, the gain that first-step AD602 acquires is about

–10dB~+31.07dB, and the gain that the second-step AD602 acquires is about

0~+31.07dB. The second control voltage works only if the gain in the first stage runs out.

Including pre-amplification, in theory the maximum gain of the entire channel can reach

82.14dB, and the gain variable range is -10dB~62.14dB. Due to the resistance between

steps, the gain may decrease several dB.


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After processed by the folding circuit and the two-step TGC, the RF echoes are driven by

high speed operational amplifier comprised by AD817, the output echo range is limited

below 1.2 p p

V −

to meet requirements of the latter analog parts.

2.2.3.4 Input Power Supply

a) +5VA:

+5V analog power supply for AD602, interface circuit and CD22M3494E-MQ or MT8816

b) –5VA:

–5VA analog power supply for AD602 and CD22M3494E-MQ or MT8816

c) ±12V: For AD817 chip circuit.

2.2.4 Probe Interface Board

2.2.4.1 Introduct ion of the Probe Interface Board (PIB)

The Probe Interface Board provides connectors between the transducers and the main

unit. Two probe connectors are available on the PIB of CTS-7700. Each connector has a

corresponding high-voltage switch, which is HV232 or like products from Hitachi. Each

PIB has a SIUI912x2 pre-amplification and high-voltage pulse drive thick- film circuit.

There are several power voltages on the PIB:+5, ±12V, high-voltage switch power over

±60V and +HV. +5V voltage is used for logical configuration of high voltage switch, ±

12V for SIUI912x2 T/R circuit, +HV for transmit high voltage, the value of which is variable

between 0V~60V and above. The main unit provide excitation high-voltage pulse to

piezoelectric crystal array of the probe via the high-voltage switch array on the PIB,

pre-amplifies the ultrasound from the probe, and sends it to the Order and Amplification

Board. Another function of the high-voltage switch is selection of the current working

probe.

The top-level connection block diagram of the PIB is follows:


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d) Control Signal Pin:

Pin 36 is connected to chip selection signal CLR. When connecting this pin to “0” is

selected, Pin36 of the high-voltage switches corresponding to each probe are

connected together as a select signal for the working probe.

Pin 35 is a logical input enabled port/LE. When “1” is connected, parameter setup

this chip for is allowed.

Pin 34 is a logical input clock. The control data series shifts 1 bit whenever a clock

comes.

e) Void Pin:

Pins 2, 4, 6, 7, 9, 11, 13, 15, 17, 19, 21, 23, 26, 30, 31, 32, 38, 40, 42, 44, 46, 48

are void, which are suspended.

The internal logical circuit of HV232 is shown below in Fig. 2-14:

Fig. 2-14 Internal Logic Circuit of HV232


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2.2.4.3 Transmit Drive and Echo Pre-amplification

In the CTS-7700, the yield of transmit drive high-voltage pulse and the echo

pre-amplification are processed in the SIUI912x2 array. A piece of MOS field-effect tube in

each transmit circuit serves as a switch, with one end connected to transmit high voltage

and the drive pulse of which is 0~12V. This tube is ducted as drive pulse comes, and

forms high-voltage pulse, which will connect to probe elements via high-voltage switch.

The ultrasound received is also from the same path. The echo will have about 20dB

amplification in the pre-amplification Circuit SIUI912x2. Then the echo signals are sent to

the subsequent TGC Amplification Circuit for amplification.

2.2.4.4 Interface Circuit of the Probe Interface Board (PIB)

The Interface Circuit on the PIB consists of two pieces of SN74LVC245. U18 is for driving

probe select signals PRS1~2 and probe code select signals PIDS1~2. The driven

PROBE1~2 are linked respectively to Pin 36 of two groups of high-voltage switches as

selection signals of the working probe, and the driven PIDSEL1~2 is linked respectively to

Pin19 of U19 and U20 as the probe code gating circuit for the two probes. When any of

the signals of PIDSEL1~2 is at low level, the probe code of SN74LVC245 is sent to the

bus, otherwise the output of it is at high resistance. U17 is for driving high-voltage switch

data DIND0~DIND3, clock STROBEP and enabling signal LED.

Description of input and output signals on the PIB: There are two 100-pin sockets on the

PIB linking to 2 corresponding sockets on the Digital Board.

Description of input power

a) VCC:

+5V analog power to Pin29 on high-voltage switch;

b) ±12V:

To Pin7 and Pin8 on SIUI912x2 respectively;

c) Above ±60V:


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To Pin24 and P25 on high-voltage switch respectively;

d) +HV:

Variable input high voltage, varying from above 0V~60V, linked to Pin2 of SIUI912X2 for

generating transmit high-voltage pulse.

2.3 Interconnection Signal List Between PCBs

2.3.1 Probe Interface Board

Table 2-4 Interconnection Signal List for Probe Interface Board XS4

Probe Interface Board XS4 (XS4)

Pin Signal Pin Signal Pin Signal Pin Signal

A25 GND B25 GND C25 GND D25 GND


A23 +5VA B23 +5VA C23 +5VA D23 +5VA

A22 +5VA B22 +5VA C22 +5VA D22 +5VA



A19 -12V B19 -12V C19 -12V D19 -12V A18 -12V B18 -12V C18 -12V D18 -12V



A15 +12V B15 +12V C15 +12V D15 +12V

A14 +12V B14 +12V C14 +12V D14 +12V


A12 -NV B12 -NV C12 -NV D12 -NV

A11 -60V B11 -60V C11 -60V D11 -60V

A10-NV

B10-NV

C10-NV

D10-NV


A8 +PV B8 +PV C8 +PV D8 +PV

A7 +60V B7 +60V C7 +60V D7 +60V





A2 +HV B2 +HV C2 +HV D2 +HV

A1+HV

B1+HV

C1+HV

D1+HV


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Table 2-5 Interconnection Signal List for Probe Interface Board XS5

Probe Interface Board XS5 (XS5)


A25GND

B25PID0

C25GND

D25PID1

A24 GND B24 PID2 C24 GND D24 PID3



A21 GND B21 STROBEP C21 GND D21 LE

A20 GND B20 PRS1 C20 PRS3 D20 DIN0

A19 GND B19 PRS2 C19 PIDS3 D19 DIN1

A18 GND B18 PIDS1 C18 GND D18 DIN2

A17 GND B17 PIDS2 C17 GND D17 DIN3

A16 GND B16 DH2 C16 GND D16 DH1

















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Table 2-7 Interconnection Signal List for Order and Amplification Board XS3

Order and Amplification Board XS3 (XS3)


25AGND

B25RF10

C25GND

D25DCS4

24A GND B24 RF16 C24 GND D24 DCS3






18A GND B18 RF14 C18 GND D18 DAX3








10A GND B10 RF10 C10 GND D10 DAY2





5A GND B5 RF10 C5 GND D5 !TGATE

4A GND B4 GND C4 GND D4 RESSET

3A GND B3 RF9 C3 GND D3 DDATA

2A GND B2 RF9 C2 GND D2 STROBE

1A GND B1 GND C1 GND D1 STROBE


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2.3.3 Industrial Control Board

Table 2-8 Interconnection Signal List for Industrial Control Board

Industrial Control Board (XS1)

Pin Signal Pin Signal

A1 +5VP 1B NC

A2 NC 2B GND

A3 +5VP 3B GND

A4 +5VP 4B NC

A5 +5VP 5B +5VP

A6 INTA 6B NC

A7 NC 7B NC

A8 NC 8B NC

A9 NC 9B NC

A10 NC 10B REQ

A11 NC 11B NC

A12 GND 12B GND

A13 GND 13B GND

A14 GNT 14B NC

A15 RST 15B GND

A16 NC 16B CLK

A17 NC 17B GND

A18 GND 18B NC

A19 NC 19B NC

A20 AD30 20B AD31

A21 NC 21B AD29

A22 AD28 22B GND

A23 AD26 23B AD27

A24 GND 24B AD25

A25 AD24 25B NC

A26 NC 26B C_BE3

A27 NC 27B AD23

A28 AD22 28B GND

A29 AD20 29B AD21

A30 GND 30B AD19

A31 AD18 31B NC

A32 AD16 32B AD17

A33 NC 33B C_BE2

A34 FRAME 34B GND

A35 GND 35B IRDY

A36 TRDY 36B NC

A37 GND 37B DEVSEL


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Industrial Control Board (XS1)


A38 STOP 38B GND

A39 NC 39B NC

A40 NC 40B PERR A41 NC 41B NC

A42 GND 42B SERR

A43 PAR 43B NC

A44 AD15 44B C_BE1

A45 NC 45B AD14

A46 AD13 46B GND

A47 AD11 47B AD12

A48 GND 48B AD10

A49

AD949B

GND A50 NC 50B NC

A51 NC 51B NC

A52 C_BE0 52B AD8

A53 NC 53B AD7

A54 AD6 54B NC

A55 AD4 55B AD5

A56 GND 56B AD3

A57 AD2 57B GND

A58 AD0 58B AD1

A59 NC 59B NC

A60 NC 60B NC

A61 NC 61B NC

A62 NC 62B NC

2.4 Connection Diagram Between PCBs

For the connection diagram between PCBs, please refer to Fig. 2-1. The Industrial Control

Board diagram is shown below in Fig. 2-15:


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Example 2: screws assemblies, spec M4, expressed as: sc rews assemblies M4.

2.5.1.3 All the screws for disassembling are Phillips screws, so the operator of the

disassembly shall use corresponding Philips screwdrivers. Due to the heads of Phillips

screws have two types: shallow and deep, to avoid any damage to the screws and

consequent failure of screw disassembling, please select appropriate screwdrivers for the

screws when disassembling the screws. A small slotted screwdriver may be required

when disassembling some special parts.

Note: Generally, the screws we use are M3 or under M3 pan screws, as well as

under M3 (excluding M3) cheese head screws, whose Philips head are

shallow, while the others are deep.

2.5.1.4 Before disassembly, make sure that the power cable is unplugged, and all the

probes are disconnected and laid aside properly.

2.5.1.5 When unplugging the cables from the system, please mark the corresponding

plugs and sockets to facilitate plugging the plugs into the right sockets during reassembly.

2.5.1.6 During disassembly, the exterior plastic parts and the keyboard silicon-gel

buttons demounted shall be placed upon a bubble wrap bag or a PE foam, keeping them

away from the work area as far as possible to avoid any disfigurement caused by

disassembling other structural parts.

2.5.1.7 Due to updates of system parts and consequent structure changes, there might

be some tiny differences in disassembly of systems from different lots. This instruction

may not cover all these differences.

2.5.2 Disassemble Plastic Housing

2.5.2.1 Disassemble lower cover of back housing from main unit

The lower cover shall be disassembled following the steps below:

a) Unclench the left, right rubber stoppers on the back enclosure cover with a slotted

screwdriver. Remove two M4X8 pan screws fixing the back enclosure cover, and


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Note: The left and right rubber stoppers are not symmetric. Please be cautious to

distinguish the left and the right ones for the sake of reassembling them

properly.

2.5.3 Disassemble Keyboard

2.5.3.1 Disassemble keyboard fo rm main unit

The disassembly of the keyboard from the main unit shall follow the steps below:

a) Unfold the keyboard by pressing the buttons at the top of the front frame and lay it

down horizontally. Unclench the two rubber stoppers at the top of the keyboard

upper housing with a slotted screwdriver, and remove two M3X12 cheese head

screws.

b) Turn the keyboard 45 degrees proximately. Hold on the projection of the lower

cover of the keyboard tightly. Press upon the left and right edge of the upper cover

of keyboard with two thumbs, and draw the lower cover of keyboard toward the

operator to displace it from the upper cover of keyboard. And then unclench the

fixing buckles on the left and the right with a slotted screwdriver to remove the

lower cover of the keyboard.

c) Turn the keyboard vertically. Remove three M3X10 screw assemblies at the bottom

left, then withdraw the left turning shaft.

d) Unplug all the flat cables connecting to the main unit, withdraw the left side of the

keyboard slightly, remove the right turning shaft from the right supporting fixture of

keyboard, and then remove the keyboard.

2.5.3.2 Disassemble parts from the keyboard

After completing the operation in Section 2.5.3.1 (disassemble keyboard form main unit),

the parts of the keyboard shall be disassembled following the steps below:

a) Unplug the cable of the trackball. Remove two M3X8 screw assemblies fixing the

trackball to remove the trackball.


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b) Remove five knobs and eight slides on the keyboard with a slotted screwdriver, and

seven M3×20 screw assemblies of the KBIF board at the back of the keyboard.

Then remove the KBIF board.

Note: Please be cautious not to scratch the knobs or the keyboard surface

when unclenching the keyboard knobs. After the KBIF board is

removed, keep the seven braces of the KBIF board in place for

reassembly.

c) Having finished steps a) & b), remove all M3×6 screw assemblies on the KB board

at the back of the keyboard to remove the KB board.

Note: During disassembling the KB board, when splitting the positioning

nails at the back of the silicon-gel buttons embedded in the KB board,

special attention shall be paid to avoid breaking the positioning gel

nails.

d) Having removed the KB board, withdraw the silicon-gel buttons through the holes

on the plastic housing carefully.

Note: To prevent any scratch, the silicon-gel surface of the keyboard shall be

placed with the buttons upward.

2.5.4 Disassemble Rear Panel

2.5.4.1 Disassemble rear panel from main unit

After completing the operation in Section 2.5.2 (disassemble plastic housing), the rear

panel shall be disassembled following the steps below:

a) Remove six M3X6 screw assemblies in the right, left and upper parts.

b) Unplug all the cables connecting the real panel with the main unit, then

disassemble the real panel.

2.5.4.2 Disassemble platelets of the rear panel

After completing the operation in Section 2.5.4.1 (disassemble rear panel from main unit),


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all the platelets on the real panel shall be disassembled following the steps below:

a) Unplug the plug connecting the Fan Patch Board. Remove two M3×6 screw

assemblies and then remove the Fan Patch Board;

b) Unplug the plug connecting the Net Port Board. Remove two M3×6 screw

assemblies and then the Net Port Board;

c) Unplug the plug connected to the USB board. Remove four M3X6 screw

assemblies, and then take out USB board.

d) Unplug the plug connected the LED board. Remove M3X6 screw assembly, and

then take out LED board.

e) Unplug the plug connecting the Print Control Interface Board. Remove two M3X6

screw assemblies and then remove the Print Control Interface Board.

2.5.5 Disassemble Industrial Control Board

2.5.5.1 Solution 1:

After completing the operation in Section 2.5.4.1 (Disassemble rear panel from main unit),

follow the steps below to disassemble the Industrial Control Board:

a) Unplug all plugs on the top of the Industrial Control Board connecting to other

components;

b) Remove four M3×6 screw assemblies fixing the Industrial Control Board shield

enclosure, then remove the shield enclosure.

c) Unplug all plugs connecting to the Industrial Control Board.

d) To withdraw the Industrial Control Board from the slot, remove two M3×6 screw

assemblies fixing both corners of the Industrial Control Board.

2.5.5.2 Solution 2:

After completing the operation in Section 2.5.2 (Disassemble plastic housing), follow the

steps below to disassemble the Industrial Control Board:


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2.5.7 Disassemble Power Supply and Hard Disk

2.5.7.1 Disassemble hard disk


follow the steps below to disassemble the hard disk:

a) Unplug all the plugs connecting to the hard disk;

b) Remove two M3×6 screw assemblies fixing the Hard Disk Fixture to withdraw the

hard disk together with the fixture;

c) To remove the IDE interface board, remove two M3×6 screw assemblies;

d) Remove four M3×8 screw assemblies on both sides to take out the hard disk from

the fixture.

2.5.7.2 Disassemble power supply module from main un it


follow the steps below to disassemble the power supply:

a) Unplug all the plugs connecting to the power supply module and the plugs

connecting to the FEP Board;

b) Remove two M3×6 screw assemblies through the gap at the top of the Monitor

Board Fixture, and two M3×6 screw assemblies on the left of the frame through two

holes on the Industrial Control Board shield enclosure. Withdraw the power supply

module from the main unit.

Note: If it is too tight between the power supply module and the frame, loosen four

screw assemblies fixing the monito r back supporting board, then to withdraw

the power supply module from the frame.

2.5.7.3 Disassemble ATX power supply

After completing the operation in Section 2.5.7.2 (Disassemble power supply from main

unit), follow the steps below to disassemble the ATX power supply:


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a) Unplug all the plugs connecting the ATX power supply with the PW board;

b) Follow the process in Section 2.5.7.1(Disassemble hard disk) to withdraw the hard

disk together with the fixture from the hard disk box.

c) Remove three M3×6 screw assemblies to disassemble the fan and the fan fixture;

d) Remove four M3×6 screw assemblies and two M3×6 countersunk head screws of

the hard disk box to disassemble the ATX power supply cover;

e) Remove four M3×6 screw assemblies to withdraw the ATX power supply.

2.5.7.4 Disassemble PW board

After completing the operation in Section 2.5.7.2 (Disassemble power supply module from

main unit), follow the steps below to disassemble the PW board:

a) Remove eight M3×6 screw assemblies at the front and the back to disassemble the

power supply frame cover board and the hard disk box;

b) Remove four M3×6 screw assemblies and a M3×6 pan head screw on the right

side, then withdraw the PW board.

2.5.8 Disassemble MONIT Board

2.5.8.1 Disassemble front frame

2.5.8.1.1 Disassemble color filter

The color filter shall be disassembled as the following:

Unfold the keyboard and then level it. Toggle up the right and left buckles locking the top

of the color filter on the front frame, when the buckles are in place, the top of the color filter

will be ejected automatically with the bounce of the post at the top of the color filter. Then

draw out the whole color filter from the top.

Note: The operator shall wear gloves during the whole disassembly process. Dust

or fingerprint on the surface of the color filter, if any, could be wiped off with

lens cleaning paper. Attention shall be paid to prevent any scratch upon the

color filter.


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2.5.8.1.2 Disassemble front frame from main unit

After completing the operation in Section 2.5.3.1 (disassemble keyboard form main unit),

the front frame shall be disassembled following the steps below:

a) Remove six M3X10 screw assemblies fixing the front frame on the left and right

sides.

b) Draw out the front frame a little bit, and unplug the cables connecting the back of

the front frame with the contrast platelet. Then remove the whole front frame.

Note: Attention shall be paid to prevent any scratch upon the color filter after

disassembly of the front frame.

2.5.8.1.3 Disassemble contrast adjust platelet

After completing the operation in Section 2.5.8.1.2 (disassemble front frame from main

unit), remove three M3X8 screw assemblies to take out the contrast adjust platelet.

Note: After disassembling the contrast adjust platelet, take out four adjust knobs

and polyester plates, then place them aside properly for reassembly.

2.5.8.2 Disassemble MONIT board and monitor tube

2.5.8.2.1 Disassemble MONIT board

After completing the operation in Section 2.5.6 (disassemble PR Probe Board and RVA

Board), the MONIT board shall be disassembled following the steps below:

a) Remove four M3×6 screw assemblies, then remove the probe shield board on the

right side of the main unit.

b) Remove two M3×6 screw assemblies and two M3×6 countersunk head screws,

then remove the front board of the probe shied board.

c) Unclench the anode cap of the monitor tube carefully.

d) Remove four M4X8 screw assemblies and then rear arm of the handle.

e) Remove two M3X6 screw assemblies and turn the MONIT board to the vertical


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position.

f) Remove a M4X8 screw assembly on the front arm of the MONIT board to loosen

the earth cable.

g) Take out the mounting plate at the tail of monitor tube.

h) Unplug all the plugs connecting the MONIT board.

i) Draw out the tail of the rotation-supporting axis at the fixture tail of the monitor

board from the slot of the back supporting plate, then draw out the whole MONIT

board fixture backward.

j) Remove four M3X6 screw assemblies and then take out the MONIT board.

2.5.8.2.2 Disassemble monitor tube

After completing the operation in Section 2.5.8.2.1(Disassemble MONIT board), follow the

steps below to disassemble the Video Tube:

a) Remove four M4×8 screw assemblies on the top to disassemble the front

supporting piece of the handle.

b) Hold on the bottom of the monitor tube, remove six M4×8 screw assemblies on the

left and the right to withdraw the monitor tube together with the fixing structure

forward slowly.

Note: When drawing out the monitor tube, attention shall be paid to prevent

any collision with the tail of the tube. After the monitor tube is drawn

out, it shall be placed upon spacer such as bubble wrap bag with the

surface of the tube downward to avoid any scratch upon the surface of

the tube.

c) Remove four M4×8 screw assemblies and the fixing structure. Then remove the

monitor tube.


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2.5.9 Disassemble FEP Board


2.5.5 (Disassemble Industrial Control Board) and 2.5.6 (Disassemble PR Board and RVA

Board), follow the steps below to disassemble the FEP board:

a) Unplug all the plugs linking to the FEP board;

b) Remove two screw assemblies and six countersunk head screws fixing the frame

and the base to separate the frame from the base;

c) Remove twelve M3×6 screw assemblies to take out the FEP board.

2.5.10 Assemble Schematic of Main Unit

The assemble schematics of the main unit of the main unit are shown in Fig. 2-16 and Fig.

2-17, which can be used as an auxiliary reference chart for disassemble and assemble

process.


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Table 2-9 (Continued)

No. Descrip tion Quantity

38 Fan cover 1

39 Power socket 1

40 Fan socket strips 141 LED board 1

42 USB board 1

43 Net port board 1

44 Print control port board 1

45 Switch 1

46 Fuse holder 2

47 Video output 1

48 Ground pole 1

49 MONIT board 1

50 Panel fixture (left) 1

51 Panel fixture (right) 1

52 Frame 1

53 Handle fixture (front) 1

54 KB board 1

55 KBIF board 1

56 Trackball 1

57 Reversal seating (left) 1

58 Reversal seating (right) 1

59 Slider 8

60 Keyboard knob 5

61 Keyboard silicon-gel button panel 1

62 Keyboard panel stopper 2

63 Keyboard sleeve 7

64 Keyboard housing (upper) 1

65 Keyboard housing (lower) 1

66 Color filter 1

67 Dustproof net 1

68 Dustproof net 2

69 Front frame 1

70 Cover for ventilation opening (left) 1

71 Cover for ventilation opening (right) 1

72 Cover for ventilation opening (front) 1

73 Button 2 4

74 Button 1 1

75 Hook 1

76 Hook fixing press board 1

77 Polyester spacer 178 Contrast adjust board 1


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2.6 Installation Instruction for Computer Main Board (Industrial

Control Board)

2.6.1 Appearance of Computer Main Board

Unit: mm

Fig. 2-18 Appearance of Computer Main Board

2.6.2 Interface Position Map

Fig. 2-19 Interface Position Map


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2.6.3 Installation of System Memory

2.6.3.1 Please pay attention to the following when installing memory bank:

a) To install the memory bank, match the gap of DIMM memory bank and DIMM Slot,

then press down DIMM memory bank in place.

b) The 184Pin SO-DIMM memory module adopted for the Computer Main Board

(Industrial Control Board) shall be compliant with DDR 266/DDR333 specifications,

with the maximum capacity up to 1GMB.

2.6.4 USB Port

USB1 provides two standard USB ports, and USB2 is a set of 2×5 Pin USB device pin.

USB2 needs a conversion cable to connect the USB port signal to a standard USB port.

The pin definitions of USB ports are shown in Table 2-10 and Table 2-11:

Table 2-10 Pin Definition of USB1 Port

USB1 Signal

1 +5V

2 USB Data-

3 USB Data+

4 GND

Table 2-11 Pin Definition of USB2 Port


1 +5V 2 +5V

3 USB Data- 4 USB Data-

5 USB Data+ 6 USB Data+

7 GND 8 GND

9 VOID 10 GND


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2.6.6 Floppy Disk Port

The CPU card provides a set of 34-pin floppy drive port, which can be connected to at

most two 3.5-inch or 5.25-inch floppy disk drives. Please pay attention to the orientation of

the cables and the sockets during connection (The pin on the floppy drive cable marked in

red is first pin). See Table 2-13 and Table 2-14 for pin definition of the ports COM1, COM2,

COM3 and COM4.

Table 2-13 Pin Definition of Port COM1

Pin Signal

1 DCD, Data Carrier Detection

2 RXD, Receive Data

3 TXD, Transmit Data

4 DTR, Data Terminal Ready

5 GND, Ground

6 DSR, Data Set Ready

7 RTS, Request To Send

8 CTS, Clear To Send

9 RI, Ring Indicator

Table 2-14 Pin Definition of Port COM2/ COM3/COM4

Pin Signal

1 DCD, Data Carrier Detection

2 RXD, Receive Data

3 TXD, Transmit Data

4 DTR, Data Terminal Ready

5 GND, Ground

6 DSR, Data Set Ready

7 RTS, Request To Send

8 CTS, Clear To Send

9 RI, Ring Indicator

10 Not used


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2.6.7 Display Port

A 15-core model D VGA monitor socket can be connected to any monitor with standard

VGA port.

Table 2-15 Pin Definition of Display Port


1 Red 2 Green

3 Blue 4 Pull up to +5V

5 GND 6 GND

7 GND 8 GND

9 +5V 10 GND

11 Pull up to +5v 12 DDCDATA

13 HSYNC 14 VSYNC

15 DDCCLK

2.6.8 Network Port

LAN1 is a 10/100Mbps Ethernet port on the Main Board. LILED and ACTLED are the

green and the yellow LEDs on both sides of the Ethernet port, which indicates LAN activity

and transmitting status. Please refer to the following status description of each LED:

Fig. 2-20 Network Port

TD+,TD-：Positive/Negative Transmitting Data Signal

RD+,RD-：Positive/Negative Receiving Data Signal

ACTLED：Network Activity Indicator

LILED：Network Link Indicator

LILED

(Green Light)

Indication State

On: Network line available

Off: Network line not available


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ACTLED

（Yellow Light）

Indication State

2.6.9 Keyboard and Mouse Port

KM1 is a 6-pin mini DIN socket for the keyboard and the mouse, which can be connected

to a PS/2 keyboard directly. A 1 to 2 PS/2 keyboard mouse cable configured with the

single-chip computer is required for connecting the keyboard and the mouse at the same

time.

Table 2-16 Pin Definition of KM1

Pin Signal

1 Keyboard data

2 Mouse data

3 GND

4 +5V

5 Keyboard clock

6 Mouse clock

2.6.10 Power Supply Port

Note:

a) To avoid any damage to the CPU card, please use the 12V (4P to 2xP standard

port) power switchover cable (attached with the CPU card) to connect the PW2

(+12V power outlet) on the CPU card with the 4P power cable of the power supply,

or connect the special power cable on P4 power supply with PW2, so as to ensure

sufficient power supply to the CPU card.

b) Before using the ATX power supply, unplug AC power (100/200V), then plug the

ATX power supply plug into the ATX power supply socket tightly. Connect other

On: Transmitting or Receiving Data

Off: No Data being transmitted or received


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related accessories properly before connecting AC power (110/220V) to the AC

power socket.

1) ATX Power Supply Port

Table 2-17 Pin Definition of ATX Power Supply


1 +3.3V 11 +3.3V

2 +3.3V 12 -12V

3 GND 13 GND

4 +5V 14 PS-ON (power

switch control)

5 GND 15 GND

6 +5V 16 GND

7 GND 17 GND

8 Power Good 18 -5V

9 +5V SB (backup +5V) 19 +5V

10 +12V 20 +5V

2) +12V Power Supply Port

Table 2-18 Pin Definition of +12V Power Supply Port

Pin Signal

1 GND

2 GND

3 +12V

4 +12V


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2.6.11 Fan Port

The CPU card provides two sets of standard fan sockets [FAN1 (CPU fan), FAN2

(Housing fan)]. Please pay attention to the following 3 points when using the fan sockets:

a) The current for the fan shall be less than 350mA (4.2W, 12V).

b) Ensure that the connection

CTS-7700 Service Manual

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