CT DBLP31 - Osram · CT DBLP31.12 5 Version 1.2 | 2019-09-17 Brightness Groups Group Luminous...
Transcript of CT DBLP31 - Osram · CT DBLP31.12 5 Version 1.2 | 2019-09-17 Brightness Groups Group Luminous...
CT DBLP31.12
1 Version 1.3 | 2021-03-29
Produktdatenblatt | Version 1.1 www.osram-os.com
Applications
CT DBLP31.12
FIREFLY® The FIREFLY E2218 family expands OSRAM Opto Semiconductors’ portfolio of visible products for use in mobile devices like fitness tracking or health monitoring. It offers the highest efficiency output and lowest forward Voltage (Vf) operation, for longer bat-tery life in portable applications. The compact sizeof only 1.8 mm x 2.2 mm x 0.6 mm allows customers the benefit of more flexible product designs. The true green CT DBLP31.12 is specially designed for Heart Rate Monitor applications. It features a very high lu-minous intensity to ideally match these applications.
— Health Monitoring (Heart Rate Monitoring, Pulse Oximetry)
Features: — Package: white SMT package
— Chip technology: UX:3
— Typ. Radiation: 120° (Lambertian emitter)
— Color: λdom = 536 nm (● true green)
— ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)
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Ordering Information
Type Luminous Intensity 1) Ordering CodeIF = 20 mAIv
CT DBLP31.12-6C5D-56-J6Q4 3150 ... 5000 mcd Q65112A4607
CT DBLP31.12-6C5D-56-J6U6 3150 ... 5000 mcd Q65112A6091
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Maximum RatingsParameter Symbol Values
Operating Temperature Top min. max.
-40 °C 85 °C
Storage Temperature Tstg min. max.
-40 °C 85 °C
Junction Temperature Tj max. 125 °C
Forward current TS = 25 °C
IF min. max.
2.5 mA 140 mA
Surge Current t ≤ 10 µs; D = 0.005 ; TS = 25 °C
IFS max. 500 mA
ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)
VESD 8 kV
Reverse current 2) IR max. 200 mA
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CharacteristicsIF = 20 mA; TS = 25 °C
Parameter Symbol Values
Peak Wavelength λpeak typ. 536 nm
Dominant Wavelength 3) IF = 20 mA
λdom min. typ. max.
526 nm 536 nm 544 nm
Viewing angle at 50% IV 2φ typ. 120 °
Forward Voltage 4) IF = 20 mA
VF min. typ. max.
2.00 V 2.30 V 2.80 V
Reverse voltage (ESD device) VR ESD min. 45 V
Reverse voltage 2) IR = 20 mA
VR max. 1.2 V
Real thermal resistance junction/solderpoint 5) RthJS real typ. max.
15 K / W 18 K / W
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Brightness Groups
Group Luminous Intensity 1) Luminous Intensity. 1) Luminous Flux 6)
IF = 20 mA IF = 20 mA IF = 20 mAmin. max. typ.Iv Iv ΦV
6C 3150 mcd 3550 mcd 10100 mlm
7C 3550 mcd 4000 mcd 11300 mlm
8C 4000 mcd 4500 mcd 12800 mlm
5D 4500 mcd 5000 mcd 14300 mlm
Forward Voltage Groups
Group Forward Voltage 4) Forward Voltage 4)
IF = 20 mA IF = 20 mAmin. max.VF VF
J6 2.00 V 2.30 V
Q4 2.30 V 2.50 V
U6 2.50 V 2.80 V
Wavelength Groups
Group Dominant Wavelength 3) Dominant Wavelength 3)
IF = 20 mA IF = 20 mAmin. max.λdom λdom
5 526 nm 535 nm
6 535 nm 544 nm
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Group Name on Label Example: 5D-5-J6Brightness Wavelength Forward Voltage
5D 5 J6
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Radiation Characteristics 6), 7)
Irel = f (ϕ); TS = 25 °C
0
0.2
0.4
1.0
0.8
0.6
ϕ
1.0 0.8 0.6 0.4
0˚10˚20˚40˚ 30˚ OHL01660
50˚
60˚
70˚
80˚
90˚
100˚0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚
Relative Spectral Emission 6)
Irel = f (λ); IF = 20 mA; TS = 25 °C
CT DBLP31.12
350 400 450 500 550 600 650 700 750 800
λ [nm]
0,0
0,2
0,4
0,6
0,8
1,0Irel
: Vλ
: true green
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Forward current 6), 8)
IF = f(VF); TS = 25 °C
CT DBLP31.12
2,1 3,12,2 2,4 2,6 2,8 3,0VF / V
2,5
100
200
300
400
500IF / mA
Relative Luminous Flux 6), 8)
Iv/Iv(20 mA) = f(IF); TS = 25 °C
CT DBLP31.12
2,5
100
200
300
400
500
IF / mA
0
2
4
6
8
10
12IVIV(20mA)
Dominant Wavelength 6)
Δλdom = f(IF); TS = 25 °CCT DBLP31.12
2,5 20 40 60 80 10
012
014
0
IF [mA]
-10
-8
-6
-4
-2
0
2
4
6
8∆λ dom [nm]
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Forward Voltage 6)
ΔVF = VF - VF(25 °C) = f(Tj); IF = 20 mACT DBLP31.12
-40 -20 0 20 40 60 80 100 120
Tj [°C]
-0,3
-0,2
-0,1
0,0
0,1
0,2
0,3∆VF [V]
Relative Luminous Intensity 6)
Iv/Iv(25 °C) = f(Tj); IF = 20 mACT DBLP31.12
-40 -20 0 20 40 60 80 100 120
Tj [°C]
0,0
0,2
0,4
0,6
0,8
1,0
1,2IvIv(25°C)
Dominant Wavelength 6)
Δλdom = λdom - λdom(25 °C) = f(Tj); IF = 20 mACT DBLP31.12
-40 -20 0 20 40 60 80 100 120
Tj [°C]
-8
-6
-4
-2
0
2
4
6
8
10∆λ dom [nm]
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Max. Permissible Forward CurrentIF = f(T)
0 20 40 60 80Ts / °C
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150IF / mA
CT DBLP31.12
: TS
Permissible Pulse Handling CapabilityIF = f(tp); D: Duty cycle
10-6 10-5 10-4 10-3 0.01 0.1 1 10Pulse time / s
0.2
0.3
0.4
0.5
0.6IF / A
TS = 0°C ... 85°CCT DBLP31.12
: D = 1.0: D = 0.5: D = 0.2: D = 0.1: D = 0.05: D = 0.02: D = 0.01: D = 0.005
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Dimensional Drawing 9)
Further Information:
Approximate Weight: 6.0 mg
ESD advice: The device is protected by ESD device which is connected in parallel to the Chip.
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Electrical Internal Circuit
Recommended Solder Pad 9)
For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning.
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Reflow Soldering ProfileProduct complies to MSL Level 3 acc. to JEDEC J-STD-020E
00
s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300t
T
˚C
St
t
Pt
Tp240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
Profile Feature Symbol Pb-Free (SnAgCu) Assembly UnitMinimum Recommendation Maximum
Ramp-up rate to preheat*)
25 °C to 150 °C2 3 K/s
Time tSTSmin to TSmax
tS 60 100 120 s
Ramp-up rate to peak*)
TSmax to TP
2 3 K/s
Liquidus temperature TL 217 °C
Time above liquidus temperature tL 80 100 s
Peak temperature TP 245 260 °C
Time within 5 °C of the specified peaktemperature TP - 5 K
tP 10 20 30 s
Ramp-down rate*TP to 100 °C
3 6 K/s
Time25 °C to TP
480 s
All temperatures refer to the center of the package, measured on the top of the component* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
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Taping 9)
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Tape and Reel 10)
Reel DimensionsA W Nmin W1 W2 max Pieces per PU
180 mm 8 + 0.3 / - 0.1 mm 60 mm 8.4 + 2 mm 14.4 mm 4000
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Barcode-Product-Label (BPL)
Dry Packing Process and Materials 9)
OHA00539
OSRAM
Moisture-sensitive label or print
Barcode label
Desiccant
Humidity indicator
Barcode label
OSRAM
Please check the HIC immidiately afterbag opening.
Discard if circles overrun.Avoid metal contact.
WET
Do not eat.
Comparatorcheck dot
parts still adequately dry.
examine units, if necessary
examine units, if necessary
5%
15%
10%bake units
bake units
If wet,
change desiccant
If wet,
Humidity IndicatorMIL-I-8835
If wet,
Mois
ture
Level 3
Flo
or tim
e 168 H
ours
Mois
ture
Level 6
Flo
or tim
e 6
Hours
a) H
umid
ity In
dicato
r C
ard is
> 1
0% w
hen read a
t 23 ˚
C ±
5 ˚C
, or
reflo
w, v
apor-phase r
eflow
, or equiv
alent p
rocessin
g (peak p
ackage
2. Afte
r th
is b
ag is o
pened, devic
es that w
ill b
e subje
cted to
infrare
d
1. Shelf
life in
seale
d bag: 2
4 month
s at <
40 ˚
C a
nd < 9
0% rela
tive h
umid
ity (R
H).
Mois
ture
Level 5
a
at facto
ry c
onditions o
f
(if b
lank, s
eal date
is id
entical w
ith d
ate c
ode).
a) M
ounted w
ithin
b) S
tore
d at
body tem
p.
3. Devic
es require
bakin
g, befo
re m
ounting, i
f:
Bag s
eal date
Mois
ture
Level 1
Mois
ture
Level 2
Mois
ture
Level 2
a4. If b
aking is
require
d,
b) 2a o
r 2b is
not m
et.
Date
and ti
me o
pened:
refe
rence IP
C/J
ED
EC
J-S
TD
-033 fo
r bake p
rocedure
.
Flo
or tim
e see b
elow
If bla
nk, see b
ar code la
bel
Flo
or tim
e > 1
Year
Flo
or tim
e 1
Year
Flo
or tim
e 4
Weeks10%
RH
.
_<
Mois
ture
Level 4
Mois
ture
Level 5
˚C).
OPTO
SEM
ICO
NDUCTORS
MO
ISTURE S
ENSITIV
E
This b
ag conta
ins
CAUTION
Flo
or tim
e 72 H
ours
Flo
or tim
e 48 H
ours
Flo
or tim
e 24 H
ours
30 ˚C
/60%
RH
.
_<
LE
VE
L
If bla
nk, see
bar code la
bel
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.
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Chip Technology: P: Standard power class S: Highest power class
Package Type D: Top emitting device, leadframe based, white reflector package
Wavelength Emission Color (λdom typ.) T: 528 nm true green H: 645 nm hyper-red B: 470 nm blue R: 625 nm red W: white
Product version
C: Consumer Segment L: Automotive
Multi- market
Encapsulant Type / Lens Properties L: No lens (Lambertian)
Lead / Package Properties TOPlooker: B: 2218 E: 1608
Technology Concept S: Silicone casting 3: Silicone encapsulation
Type Designation System
C H D E L S S 1 . 1 2
Binning Information: Saturated colors 2: mcd
Special characteristics Saturated colors 1: InGAN saturated 2: InGaAIP saturated
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NotesThe evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet fall into the class moderate risk (exposure time 0.25 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye ex-ists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoy-ance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. There-fore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810.
For further application related information please visit www.osram-os.com/appnotes
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Disclaimer
Attention please!The information describes the type of component and shall not be considered as assured characteristics.Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances.For information on the types in question please contact our Sales Organization.If printed or downloaded, please find the latest version on the OSRAM OS website.
PackingPlease use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred.
Product and functional safety devices/applications or medical devices/applicationsOSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices.OSRAM OS products are not qualified at module and system level for such application.
In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordi-nate the customer-specific request between OSRAM OS and buyer and/or customer.
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Glossary1) Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal
reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of k = 3).
2) Reverse Operation: This product is intended to be operated applying a forward current within the specified range. Applying any continuous reverse bias or forward bias below the voltage range of light emission shall be avoided because it may cause migration which can change the electro-optical char-acteristics or damage the LED.
3) Wavelength: The wavelength is measured at a current pulse of typically 25 ms, with an internal repro-ducibility of ±0.5 nm and an expanded uncertainty of ±1 nm (acc. to GUM with a coverage factor of k = 3).
4) Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage factor of k = 3).
5) Thermal Resistance: Rth max is based on statistic values (6σ).6) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-
es, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could dif-fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.
7) Testing temperature: TA = 25°C (unless otherwise specified)8) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differ-
ences between single devices within one packing unit.9) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and
dimensions are specified in mm.10) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.
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Revision HistoryVersion Date Change
1.2 2019-09-17 Derating (Diagrams) Maximum Ratings
1.3 2021-03-29 Electro - Optical Characteristics (Diagrams)
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Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.