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INSTRUMENT DESIGN & DEVELOPMENT CENTRE

IDP70 3 Inst rume ntTechn ology Laboratory I3 credits (0-0-6) 

The laboratory essentially supports the

courses taught in the first semester

courses. It consists of experiments on:-

Study of packaging and characterisation

of transducers used for measurement of

different physical variables like

displacement, temperature, pressure,

strain, flow etc; Study of practical signal

conditioning techniques and electronic

measurement methods; Study of

Electronic subsystems used in

instruments.

Study of optical and fibre-optics

components, optical coatings, simple

optical systems; Measurement of

refractive index of solids (glass) and

liquids, measurement of focal length of

lenses and optical systems,

Measurement of flatness, estimation of

peak errors by optical methods,

measurement of angles, prisms, parallel

plates, radius of curvature, Vacuum

deposition of thin films, experiments with

optical fibres.

The structure of experiments is

designed to impart design level

familiarity with various subsystems of

instrumentation set up.

IDP70 4 Inst rume ntTechnology Laboratory II3 credits (0-0-6) 

The laboratory supports the subjects

taught in the second semester courses.

The laboratory consists experiments on:

Study of various techniques used for

analog and digital conditioning of

signals from various transducers/ 

detectors; Study on modulation/ 

demodulation techniques, noise

generation and measurement, Study of

testing and calibration methods ofinstruments.

Microprocessor/Microcontroller based

system design with emphasis on real

world interfacing.

Study of optical instruments,

interferometers and laser based

instruments. Interferometers and laser

based instruments; Experiments on

optical techniques; Experiments with

Fizeau Interferometer, Fitness/curvature/ 

surface quality, Experiments with optical

fibres, Measurement of vibrations using

optical methods, Digital speckle patterninterferometry/Talbot interferometry/ 

Moire interferometry, grating based

linear transducers, Laser speckel

method for displacement measurement.

Experiments on precision measurement

methods and metrology.

The structure of experiments has beendesigned to impart design level

familiarity with various subsystems of

instrumentation set up. The subsystems

may consist of a detector-transducer,

signal conditioner, a level power

amplifier, display, actuator/final control

element. The study will generally focus

attention on one of the above

subsystems.

IDP705 Advanced InstrumentTechnology Lab4 credits (0-0-8) 

IDL71 1 Inst rume ntationTransducers3 credits (3-0-0) 

Transducer Fundamentals : Transducer

terminology, principals, design and

performance characteristics, criteria for

transducer selection, smart sensor,

Resistive transducer; Inductive

transducers; capacitive transducers;

piezoelectric transducer; semiconductor

and other sensing structures.

Displacement transducers; tachometers

and velocity transducers;

accelerometers and gyros; strainguages; force and torque transducers;

flowmeters and level sensors; pressure

transducers; sound and ultrasonic

transducer. Phototubes and

photodiodes; photovoltaic and

photoconductive cells, photoemission,

photoelectromagnetic, detectors

pressure actuated photoelectric

detectors, design and operation of

optical detectors, detector

characteristics. Transducer Performance

: Electrical tests, measurement unit,

measurement of voltage, current,

frequency, impedance, noise, loading

errors, resolution and threshold tests.

Calibration, dynamic tests,

environmental test, life test. Application

of transducers: displacement, velocity,

acceleration, force, stress, strain,

pressure and temperature

measurement. angular and linear

encoders, Radar, laser and sonar

distance measurement, Tachometers,

Viscometer and densitometers.

IDL712 Electronic Techniquesfor Signal Conditioning andInterfacing3 credits (3-0-0) 

Analog and digital representation of

data; comparisons and relative merits;

multiplexing and demultiplexing of

analog and digital data, ADC/DAC.

Microcontroller and DSP applications.

Analog signal conditioning, Ultra-

precision conditioning, Gain; attenuation;

input and output impedances; single

ended and differential signals; CMRR;

system-module interfacing consideration;

measurement and characterisation of

electronic system modules.

Analog and digital data transmission;

modulation & demodulation; Data

transmission; channel noise and noise

immunity factors. Data busses; GPIB and

other standards in parallel data

transmission. Opto-electronic interfacing

techniques.

Application of CPU’s in signal and data

handling; response linearisation and

drift compensation; data logger,

computer aided measurement and

control.

Analog and digital System Co-housing:

EMI effects and EMC measures; circuit

card placement; shielding and

grounding techniques; ground loop

management; isolation and interference

filtering. EMI hardening and EMC

interfacing.

IDL713 Advanced ElectronicComponents and Circuits3 credit s (3-0-0) 

Review of Electronic Components:

Passive Components, Active

Components including components

used in Industrial Environment.

Electronic Circuits: Choppers, Clampers,

analog circuits, precision and

instrumentation amplifiers, signal

conditioning circuits, industrial electronic

circuits. Nonlinear devices and circuits,

computing circuits and waveform

generators.

Analog-Digital circuits: A/D and D/Aconverters, classification andcharacteristic parameters of DAC’s andADC’s, Testing criteria, MultiplyingDAC’s.

Digital Electronics: Logic gates,Combinational logic design, Sequentiallogic design, Counters, MemoryDevices, SRAM, DRAM, ROM, EPROM,Flash Memories and ProgrammableGate Arrays.

Microprocessors: 8 bit and 16 bitmicroprocessor, basic structure andprogramming. Application ofmicroprocessors in instruments,

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Introduction to micro-controllers and

embedded systems. Introduction to DSPChips and their application inInstruments.

IDL71 4 Inst rume nt Design

and Simulations3 credits (3-0-0) Review of circuit analysis and design.Review of signals and systems in timeand frequency domain: Fourier andLaplace Transforms, response plots.

Dynamic properties of instrumentsystems: Review of instrument control

systems, on-off, proportional and PIDcontrollers. Stability considerations, gainand phase margin. Use of pulse andharmonic test signals for performanceevaluation. Linear modeling of

instrument systems.Models for basic instrument buildingblocks. Simulation studies of circuits,

instrument modules, transducers andcontrol schemes using expert software:Numerical techniques for linearisation.

The theory will be supplemented withdesign and simulation laboratorysessions covering the above topics.

IDL71 6 Quality Cont rol &Standardisation3 credits (3-0-0) 

Measurement standards, errors of

measurement, classification of errors,statistical analysis of errors. Regressionand correlation. Analysis of variousmethods of measurement/testing.Minimisation of errors. Designconsiderations and instrument reliability.

Calibration and testing standards.Environmental testing of instruments.

IDL721 Materials andMechanical Design4 credits (3-0-2) Basics of Design: Stresses, strain,hardness, toughness, visco-elasticity,

torsion, bending, deflection of beams,combined stresses, energy methods.

Material: metals and their alloys, heattreatment, polymers, composites,ceramics etc.

Design of machine elements: Failuretheories for static and alternatingloadings. Design of shafts, fasteners,springs, curved beams, thick and thinvessels, gears etc; Lubrication, journalbearings and rolling contact bearings,limits, fits and tolerances. Deflection ofthin plates. Design of mechanicalelements for strain gage and otherinstrumentation applications. Intro-duction to vibrations and its isolation.Mechanical Fabrication techniques used

in instruments.

Practical sessions on basic mechanicalfabrication processes. Design anddrawing sessions.

IDL722 PrecisionMeasurement Systems3 credits (3-0-0) Measurements and errors; internal andexternal estimates of errors; least squaremethod and its applications, to deviationfrom true line, plane and circle.

Surface roughness and lengthmeasurements, study of some precisionmeasuring systems, such as, profileprojector, tool makers microscope,talysurf, talyond, floating micrometer,optical and mechanical comparator,interferometers, etc.

Fundamentals of precision engineering;basic design principles for precisionsystems; basic fabrication principles forprecision systems.

IDL72 4 Advance d Fabricationand Finishing3 credits (3-0-0) Manufacturing techniques for instrument

components : Injection and compression

moulding of plastics, mould design

considerations, common defects in

moulded parts and remedies. Vacuum

forming practices, former design and

manufacture, applications. Fibremoulding techniques, selection and use

of raw material. Pressure die casting of

non-ferrous instrument parts, die design

considerations. Press working of sheet

metal components, behaviour of

common engineering material under

press working, die design

considerations.

Newer methods of manufacturing like

EDM, ECM, laser machining and photo

fabrication techniques for fine and

intricate components. NC machining for

precision fabrication.

Finishing Processes : Heat treatment

like annealing, hardening, tempering

and stress relieving. Vaccum deposition,

electro-deposition, hard facing and

electroplating and anodizing of surfaces,

surface preparation and control of

parameters. Metallizing and decorative

finishing, applications. Painting

techniques, like electrostatic painting,

powder coating.

IDL730 PhotochemicalMachining

3 credits (2-0-2) 

Introduction: What is PCM, Design and

manufacture of Photo-tools, Microphoto-

graphy, Photo-resist technology,

Selection and preparation of metallic

materials, Isotropic etching-various etch

parameters and their measurements,

Etching to dimensional specifications,Quantitative Examination of Photo-

fabricated profiles, 2D-and 3D

machining with case studies. Inspection

& Quality control, Engineering, benefits,

Limitations and difficulties with PCM,

Electro-photo-etching and Photo-

forming. Technical considerations and

economic implication.

IDL731 Opt ic a l Compone ntsand Basic Inst rume nts3 credit s (3-0-0) 

Generation of light: Thermal, non-

thermal and semiconductor lightsources. Measurement of light;

photometry, colorimetry and

instrumentation, Properties and

propagation of light; The Ray Optics,

Wave Optics, and Electromagnetic

Optics; Basics of interference, diffraction

and polarization of light.

Optical Components: Reflecting

components, plane, spherical,

paraboloidal, phase conjugated,

dielectric multilayer and digital micro

mirrors, AR-coatings, total internal

reflection. Refracting components;Converging, diverging and combination

of lenses, Design analysis and image

formation by lenses, and micro-lenses,

Eyepieces: Huygens, Ramsden, and

special eyepieces; Prisms; Diffracting

components; diffraction by single/ 

multiple/openings, types of gratings and

fabrication techniques, gratings

produced by acousto-optics, and

electro-optics, and diffractive optical

elements. Polarizing components;

Polarization by reflection, and double

refraction, birefringence crystals, andpolarization based liquid-crystal optical

devices. Wavefront aberrations;

Monochromatic (Seidel), and chromatic

aberrations, optical and modulationtransfer function.

Optical instruments: Microscopes; simple,compound phase contrast and confocalmicroscopes. Telescopes; Refracting,reflecting, interferometric telescopes.Interferometers; two- beam, multiple-

beam, and shearing interferometers,Spectrum measuring instruments;Spectrometers/monochromators,Spectrophotometers, and Spectro-radiometers, and Fourier transform

spectrometers (FTIR-spectrometers),

Instrument Design & Development Centre 

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Instrument Design & Development Centre 

Detectors: Photodetectors, photo-

multiplier tubes, multi-channel plates,

image intensifiers, CCD and CMOS

detectors, IR-detectors.

IDL732 Optical Materials andTechniques3 credits (3-0-0) 

Optical measurements: Photometry,

Primary Standard, sub-standards and

working standards, measurement of

radiant intensity and flux. Application of

these measurements to optical systems,

Eye and Vision, Optical materials for UV,

visible and IR regions. Photosensitive

materials for photography,

photolithography and photo fabrication.

Optical fibres as optical components.

Multimode and single mode fibres. Fibre

coupling techniques. Introduction to fibrebased sensors, imaging systems and

communication links. Illuminating

systems. Detection of optical radiation,

noise in optical detection systems.

Design considerations of opto-

mechanical and opto-electronic systems,

including encoders and choppers, with

case studies.

IDL734 Laser BasedInstrumentation

3 credits (3-0-0) 

Basics of lasers; The photon and it ’s

properties, radiation and matterinteraction; Generation and properties

of laser light; laser systems and

instrumentation (gas, liquid, solid state,

semiconductor, and Ion laser systems);

laser beam optics; The Gaussian,

Hermite-Gaussian, Laguerre-Gaussian

and Bessel beams and their properties

Holographic techniques; Basic

holographic principle, Types of

Holograms, Recording media, and

applications of holography.

Laser Applications, Holographic

Interferometry; Double exposure, Time

averaged, Real time H.I., Laser speckletechniques; speckle photography/ interferometry, and digital specklepattern interferometry and applicationsof laser speckles, Lengths, displacement

and shape measurement; laser-heterodyne, two-wavelength ormultiplewavelength and phase-shiftinginterferometry, Velocity measurement;Laser Doppler and particle imagevelocimetry, Laser remote sensing:Different types of LIDARs (Light

Detection And Ranging), andApplications; Laser alignment, gaginginspection and Laser machine vision,Industrial laser systems andinstrumentation, beam delivery systems;and applications laser materialprocessing, Laser Applications to

Chemical and Environmental Analysis;Laser-induced fluorescence,Temperature measurement techniques;Laser based point-by-point, full field,holographic interferometry, and laserspeckle techniques. Laser Tweezers:Single-dual-and multiple-beamtweezers, and applications.

IDL73 5 Scientific andEngineering Applications of Moire Patterns3 credits (2-0-2) General introduction, theory of Moire

fringes, pure rotation, pure elongation,vernier mechanism of fringes. Linearand angular displacement transducers.Use of Moire technique in strainanalysis, vibrations, deflections,refractometry, surface roughness.Experimental techniques and fringephotography.

Technology to generate moire grids forvarious applications. High resolution

moire. photography and its applicationfor deformation studies in small, mediumand large size structures and in thermal

strains.

IDL741 InstrumentOrganisation and Ergonomics3 credit s (2-0-2) 

Management of Technology. Needanalysis and product specification.

Solution search, product planning andsystem break up. Subsystem interaction.Environmental factors for successfuloperation.

Classification of tasks of instruments;activity analysis in terms of man-machine tasks; identification ofconstraints on instrument design arisingout of scientific, technical, production,environmental and maintenanceconsiderations.

Design of configuration/options; designof controls, displays and graphics.Aesthetics of colour and form. ValueEngineering.

Design of manuals, job-aids andtraining aids.

IDP742 Industrial DesignPractice3 credit s (1-0-4) Cultural parameters of design, Creativethinking.

Free hand sketching, presentationdrawings, engineering drawings.

The design cycle, need analysis.Formulation of design problem product

planning, product conceptualisation,design methods for divergent,transformation and convergent thinking.

Instrument aesthetics, instrumentergonomics.

Model making.

IDL81 1 Selecte d Topics inInstrumentation3 credit s (3-0-0) 

(No prescribed course contents)

IDC812 Term and Seminar3 credit s (3-0-0)