International Conference and Exhibitionon Integration Issues of Miniaturized Systems

Creating a smarter future.

Co-organizer:

Conference program

Dresden, Germany, 11 – 12 April 2018smartsystemsintegration.com

R E G I S T E R N O W AT

www.smartsystemsintegration.com/registration

In cooperation with:

Part of the activities of:

Welcome to the 12th Smart Systems Integration

Smart systems integration has become a driving force behind almost all product innovation. Smart-enabled solutions can be found in almost every application field: transportation, health, manufacturing, the Internet of Things (IoT), energy, natural resources and security. Smart systems are developed by using key enabling technologies and by integrating the knowledge from a variety of disciplines. They benefit from the progress in nanoelec-tronics and nanotechnologies, but also from design methods and tool development.

EPoSS – the European Platform on Smart Systems Integration has published its 2017 update of its Strategic Research Agenda, defining research and industry priorities for the next 15 years to come. Additionally, this was also the input for the ECSEL MASRIA 2017.

The Smart Systems Integration Conference and Exhibition serves as a communication platform for academia, research and industry and enables the exchange of know-how in the field of smart systems integration. The confer-ence addresses the application fields of smart systems as well as smart systems themselves, starting from the design via new building blocks for sensing, data process-ing, actuating, networking, and smart powering up to heterogeneous integration of the different building blocks and manufacturing of the systems. For the first time, a session addresses embedded software – self-X systems. X stands for learning, organizing, adaptive but also for optimizing and repairing.

As in previous years, EPoSS - the European Technology Platform on Smart Systems Integration - is organizing two special sessions on the first day of the conference. Participation in these sessions is open to all interested delegates.

New trends and technologies applied in industry are summarized in the SME session. The advantages of ecosystems, e.g. Research Fab Microelectronics Germany, are presented in a special session as well.

The IOSENSE Spring School and a LifeWear Workshop provided by TU Dresden organized by Mesago Messe Frankfurt takes place as co-located events next to the Smart Systems Integration 2018 at the Hilton Dresden.

The pre-conference field trip to the Smart Systems Hub in Dresden on Tuesday, April 10th 2018, completes the program. Attendees visit SAP as well as the IoT testbed and the test track for autonomous driving at Dresden University of Applied Sciences (HTW).

The day after the conference, a trip to Chemnitz is organized to visit the Smart Systems trail “smart sensor and production systems for industrial IoT“ of the Smart Systems HUB including the Smart Systems Campus in Chemnitz, the E3 factory as well as other companies.

The 12th Smart Systems Integration Conference 2018 will show a snapshot of the international work in the field of smart systems integration on an application and a basic research level. I’m looking forward to meeting you in Dresden.

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Prof. Dr. Thomas OttoFraunhofer Institute for Electronic Nano Systems, DE Conference chair, Smart Systems Integration 2018

Why to attendThe event features application-oriented as well as scientific sessions and addresses the complete value-added chain of smart systems. Moreover an overview of special European programs focusing on smart systems integration is given.

Who should attendSSI targets researchers, developers and users in equal measure. It is the platform for smart systems integration experts and managers from the automation, automotive, aerospace, telecommunication, medical technology, logistics, RFID and life sciences industry sectors.

Conference highlightsKeynotes by

T-Systems Multimedia Solutions GmbH STMicroelectronics SA Technical University Dresden University of Applied Sciences Dresden Delft University of Technology and Harvest Imaging

Special sessions Two EPoSS sessions System Integration Technologies Design of smart integrated systems SME session

Pre-conference field trip Tuesday, 10 April 2018 14:30 – 18:30 hrsThe pre-conference field trip on Tuesday, 10 April 2018 shows two trails of the Smart Systems Hub in Dresden, which belongs to the digital HUB initiative in Germany. In enabling sustainable networking between the scientific community, established companies, and founders, the hub contributes to the transformation of exciting ideas into innovative products and services. The focus is on developing the hardware, software, and connectivity components needed to foster intelligent solutions and facilitate the Internet of Things.

Participants of the guided tour have the chance to visit: The Smart Systems HUB office at SAP with introduction to the HUB as

well as presentation of digital factory as SAP The University of Applied Sciences Dresden (HTW)

Visit of test track for autonomous driving as well as IoT testbed. At the IoT testbed different production modules are installed e.g. CNC machine, different robotic working, big data cluster for sensor data. To the demonstrators belong e.g. condition monitoring solutions, indoor- localization and navigation as well as cloud based IoT-platform.

A shuttle bus brings participants to the visited facilities and back to Hilton Dresden. Within the tour snacks and beverages are offered.

Discover innovations. Find solutions. Share visions.

Conference dinnerThis year the traditional conference dinner on 11 April 2018 is taking place at a paddle steamer. We invite you to enjoy an adventure river cruise on the Elbe and a fantastic springtime buffet. The dinner offers the opportunity for intensive discussions and networking in a relaxed atmosphere. During the dinner the Best Paper and Best Poster Award of SSI 2017 will be presented.

After-conference field tripFriday, 13 April 2018 8:00 – 14:00 hrsThe after-conference field trip is organized by the Fraunhofer Institute for Electronic Nano Systems, Chemnitz, co-organizer of Smart Systems Integration.Participants of the guided tour have the chance to visit the Smart Systems trail »Sensor and production systems for industrial IoT« in Chemnitz.

The tour includes the visit of: Agilion GmbH - Industrial Supply Chain Tracking, Vehicle Tracking and

People Tracking EDC Electronic Design Chemnitz GmbH - customer and application

specific electronic systems and integrated circuits Chemnitz University of Technology – Virtual Reality Fraunhofer IWU – E³ production, efficient tools for the digitalization

in production Fraunhofer ENAS – Smart monitoring systems, presentation

Fraunhofer lighthouse project »Go Beyond 4.0«

A shuttle bus brings participants to the visited facilities and back to Hilton Dresden. Within the tour snacks and beverages are offered.

For further details and bookings, please contact Dr. Martina Vogel by e-mail to Martina.Vogel@enas.fraunhofer.de.

Registration to the pre-conference field trip as well as the dinner and the after field trip is required due to limited capacities!

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R E G I S T E R N O W AT

www.smartsystemsintegration.com/registration

Conference program Wednesday, 11 April 2018

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09:00 hrs Welcome Prof. Dr. Thomas Otto, Fraunhofer Institute for Electronic Nano Systems ENAS, DE

Keynote I – IIIChair: Prof. Dr. Thomas Otto, Fraunhofer Institute for Electronic Nano Systems ENAS, DE

09:10 hrsKeynote I: Machine Learning and Artificial Intelligence: From Hype to Customer Value Christoph Kögler, T-Systems Multimedia Solutions GmbH, DE

09:40 hrs Keynote II: Key Technologies for the Automobile of the Future and links to other smart electronics domains Dr. Jochen Langheim, STMicroelectronics SA, FR

10:10 hrs Keynote III: Fog Computing - a New Technology for Co-Working Robotics and Industry 4.0 Prof. Dr. Uwe Aßmann, Technical University Dresden, DE

10:40 hrs – 11:05 hrs COFFEE BREAK

The special sessions by EPoSS, the poster presentations and the exhibition are free of charge to all participants, exhibitors and registered visitors.

Printing ProcessesDr. Larraitz Añorga, IK4-Cidetec, ESProf. Dr. Reinhard R. Baumann, Fraunhofer Institute for Electronic Nano Systems ENAS, DE

System Integration Technologies IRolf Aschenbrenner, Fraunhofer Institute for Reliability and Microintegration IZM, DELouis Le Fur, Airbus Group Innovations, FR

EPoSS Session I: Smart Manufacturing – A Pan-European Perspective

11:05 hrsLaunch to the market a truly portable Electrochemical Biosensor for Sulphite Analysis in Food IndustryDr. Larraitz Añorga, Fundacion Cidetec, ES

11:05 hrsDevelopment of micro dispense and jetting process of battery electrodes for the fabrica-tion of substrate integrated micro batteriesDr. Robert Hahn, Fraunhofer Institute for Reliability and Microintegration IZM, DE

11:05 hrs – 12:45 hrs Today, progress in manufacturing is driven by sophisticated communication technologies and Industry 4.0. Integrated electronic compo-nents and Smart Systems Integration are the backbone of such progress. With the combina-tion of human flexibility and experience on the one hand as well as the potential of process and factory automation on the other hand, major breakthroughs in the manufactu-ring environment are achievable. In this light, this session will examine opportunities for Smart Systems in manufacturing by combining current industrial innovations with ongoing research undertaken at universities and RTOs on a pan-European level.

11:30 hrsOpen-access pilot line to accelerate industrial uptake of hybrid printed electronicsDr. Maarten Cauwe, Imec Cmst, BE

11:30 hrsNovel chip embedding and interconnection technology for mm-wave System-in- Package (SiP) applicationsChristof Landesberger, Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT, DE

11:55 hrs Inkjet printing of patterned nanocarbon absorber layers for pyroelectric infrared de-tectorsChristian Zeiner, Technische Universität Chem-nitz, DE

11:55 hrsReactive bonding with oxide based reactive multilayersKlaus Vogel, Fraunhofer Institute for Electronic Nano Systems ENAS, DE

12:20 hrsDeveloping a Roll-to-Roll integration & con-version process for smart labels within the FMCG and pharmaceutical sectorsTim Marsden, CPI - Centre for Process Innovation, UK

12:20 hrsReactive joining of sensitive materials for MEMS devices: characterization of joint qualityIrina Spies, Hahn-Schickard, DE

12:45 hrs – 13:45 hrs LUNCH BREAK

NOMINATED

BEST PAPER

AWARD 2018

Conference program Wednesday, 11 April 2018

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Advanced TechnologiesProf. Dr. P. J. French, Delft University of Technology, NL Jean-Philippe Polizzi, CEA-LETI, FR

System Integration Technologies II EPoSS Session II: The Automated World – Technology Trends for the Digital Society

13:45 hrsPost-CMOS MEMS Capacitive Pressure Sen-sor: compatible porous ALD membrane for Sacrificial Layer Release and Diaphragm SealingChristian Walk, Fraunhofer Institute for Microelectronic Circuits and Systems IMS, DE

13:45 hrs3D Wire - a novel approach for 3D Chips Interconnection for Harsh Environment ApplicationsJan Bickel, Hochschule für Technik und Wirtschaft Berlin, DE

13:45 hrs - 15:25 hrs Within the megatrend of digitisation, new concepts and approaches are developed in all industry sectors to respond to societal needs and to conceive new products and services. By pushing innovation, digitisation creates diverse opportunities and paths for the development of Smart Systems. This session will thus focus on Smart Systems solutions for those application areas that are massively affected by automation and are strongly benefitting from Smart Systems de-velopment such as health, transport, communi-cations, energy, water, textiles, agriculture and food, thereby answering societal challenges.

14:10 hrsMechanically coupled capacitive ultrasonic transducerMarcel Krenkel, Fraunhofer Institute for Photonic Microsystems IPMS, DE

14:10 hrsFabrication of 3D Ceramic Interconnect Devices by Laser Induced Selective MetallizationEugen Ermantraut, University of Stuttgart, DE

14:45 hrsFabrication and operation of protein-powered biocomputation using nanostructured networksDr. Christoph Meinecke, Technische Universität Chemnitz, DE

14:45 hrsSelective over molding of a CMos TSV wafer with the flexible 3D integration of Sensors and ComponentsTon van Weelden, Boschman Technologies B.V., NL

15:00 hrsAnalysis of resonance frequency and sensitivity on III-Nitride SAW based temperature sensorsIoana Giangu, IMT Bucharest, RO

15:00 hrsA Functional 3D- and Inkjet-Printed Housing for a Capacitive Position Sensor in a Spectrometer ApplicationLisa-Marie Faller, Alpen-Adria-Universität Klagenfurt, AT

15:25 hrs – 15:55 hrs COFFEE BREAK

15:25 hrs – 16:30 hrs POSTER SESSION The poster presenters will be available at their posters for questions and discussions.

SME sessionDr. Markus Riester, meisterwerk ventures GmbH, DE, Youri Ponomarev, Analog Devices, BE

Self-X SystemsChristoph Kögler, T-Systems Multimedia Solutions GmbH, DEWolfgang Dettmann, Infineon Technologies AG, DE

EcosystemsDr. Michael Scholles, Fraunhofer Institute for Photonic Microsystems IPMS, DEDr. Rolf Slatter, Sensitec GmbH, DE

16:30 hrsDevelopment of a new vacuum gauge based on Si MEMS structureStepan Konakov, Gyrooptics, RU

16:30 hrsThe Learning of the OpenLicht System, a self-learning Lighting System at the Edge of the NetworkKay Bierzynski, Infineon Technologies AG, DE

16:30 hrsStandardisation of Smart Systems Building Blocks: A requirement for a glob-ally competitive Cooperative FoundryPetra Weiler, VDI/VDE Innovation + Technik GmbH, DE

16:50 hrsSolmates Pulsed Laser Deposition systems enable the integration of critical novel thin film materials for the MEMS & 5G marketDr. Matthijn Dekkers, Solmates B. V. , NL

16:55 hrsComputing within Materials: Self-Adaptive Materials and Self-organizing AgentsDr. Stefan Bosse, Universität Bremen, DE

16:50 hrsResearch Fab Microelectronics Germany – a novel cooperation concept for jointly technology developmentJörg Amelung, Research Fab Microelectronics Germany (FMD), DE

17:10 hrsnCapsulate added value for system assemblyIgnas van Dommelen, Sencio BV, NL

17:30 hrsEnsuring sensor reliability by System Level TestingIngolf Leidert, SPEKTRA Schwingungs- technik und Akustik GmbH Dresden, DE

17:20 hrsManagement strategy: towards a holistic platform for runtime adaptation and reconfiguration of Building Automation SystemsTuan Linh Mai, Technische Universität Dresden, DE

17:10 hrsOptimized Ecosystem for effective Transfers of Research and Business Opportunities - The Bavarian WayDr. Klaus Funk, Zentrum Digitalisierung Bayern, DE

17:30 hrsThe gateone-project: a digital innovation hub accelerating innovation through ecosystem design and product trajectoryDr. Régis Hamelin, Blumorpho, FR

18:30 hrs – 22:00 hrs

Conference dinner

Conference program Thursday, 12 April 2018

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Keynote IV – V

09:00 hrs Keynote IV: From SMART to SMARTER: Recent Developments in CMOS Image Sensors Prof. Dr. Albert J.P. Theuwissen, Delft University of Technology, NL and Harvest Imaging, BE

09:30 hrsKeynote V: Assistive Robotics for public and AAL applications Prof. Hans-Joachim Böhme, University of Applied Sciences Dresden, DE

10:00 hrs – 10:30 hrs COFFEE BREAK

Smart ProductionWolfgang Gessner, VDI/VDE Innovation + Tech-nik, DEProf. Dr. Charles Cané, IMB-CNM (CSIC), ES

New Materials for Micro and Nano SystemsDr. Chris Merveille, IKERLAN, ESUwe Schwarz, X-FAB MEMS Foundry GmbH, DE

Design of smart integrated systems IDr. Christian Hedayat, Fraunhofer Institute for Electronic Nano Systems ENAS, DE

10:30 hrsCoDesign for the Integration of Energy Harvesters and Antennas for highly integrated CPSCarsten Brockmann, Fraunhofer Institute for Reliability and Microintegration IZM, DE

10:30 hrsSputter Epitaxy of Pb(Zr,Ti)O3 and Pb(Mg1/3,Nb2/3)O3-PbTiO3 Thin Films on Si for High-Performance Piezoelectric MEMSDr. Shinya Yoshida, Tohoku University, JP

10:30 hrsGeneric Integrated Forensic Toolbox (GIFT) for on-site CBRN investigationDr. Eric Moore, University College Cork Tyndall National Institute, IE

10:55 hrsRobust Magnetic Sensors for availability-oriented Product Service SystemsDr. Rolf Slatter, Sensitec GmbH, DE

10:55 hrsEnhanced optoelectronic property of ultra-thin Al–doped ZnO layers by inserting nano-Ag particles on roughed surface of seed layerProf. Yen-Sheng Lin, I-Shou University, TW

10:55 hrs Impact of Inter-Wafer Variations on MEMS’ FingerprintsOliver Willers, Robert Bosch GmbH, DE

11:20 hrsAutonomous robots and the Internet of Things in underground miningFrederic Güth, TU Bergakademie Freiberg, DE

11:20 hrsScaling up Integration of Carbon Nanotubes into Micro-Electro-Mechanical SystemsSimon Böttger, Technische Universität Chemnitz, DE

11:20 hrsA new generation of low-cost and highly reliable CO2 gas sensorsMatthias Eberl, Infineon Technologies AG, DE

11:45 hrsSmart system for Clutch-brake monitoringKepa Mayora, Ikerlan Scoop, ES

11:45 hrsIntegration of one-dimensional gas sensitive nanostructures grown via chemical vapor deposition into microdevicesProf. Dr. Carles Cané, Instituto de Microelectrónica de Barcelona IMB-CNM (CSIC), ES

11:45 hrsSuper-Low-Power ChipDesign for Smart SensorsDr. Gerd Teepe, Globalfoundries Dresden Module Two LLC & Co. KG, DE

12:10 hrsVisualization and Process Control with Real-Time production information and IoT-based Maintenance workflows with Augmented Reality in the digital factoryBjörn Schuster, N+P Informationssysteme GmbH, DE

12:10 hrsCapacitive Humidity Sensor based Nanograss Polyimide for Implementation in Various ApplicationsDr. Jamila Boudaden, Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT, DE

12:10 hrsSmart Models for MEMS Microphone Transducers Guido Janßen, X-FAB Semiconductor Foundries AG, DE

12:35 hrs – 13:30 hrs LUNCH BREAK

13:30 hrs – 14:30 hrs POSTER SESSION The poster presenters will be available at their posters for questions and discussions.

14:30 hrs – 15:00 hrs COFFEE BREAK

NOMINATED

BEST PAPER

AWARD 2018

NOMINATED

BEST PAPER

AWARD 2018

NOMINATED

BEST PAPER

AWARD 2018

NOMINATED

BEST PAPER

AWARD 2018

WINNER

BEST PAPER

AWARD 2017

WINNER

BEST POSTER

AWARD 2017

Conference program Thursday, 12 April 2018

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Smart Systems ApplicationDr. Rainer Günzler, Hahn-Schickard, DERenzo Dal Molin, CAIRDAC SAS, FR

Test and Reliability MethodologiesProf. Dr. Sven Rzepka, Fraunhofer Institute for Electronic Nano Systems ENAS, DEAlfons Dehé, Hahn-Schickard, DE

Design of smart integrated systems IIDr. Reinhard Neul, Robert Bosch GmbH, DE

15:00 hrsDefect Detection in high Quality Polymers used in the Smiconductor Manufacturing IndustryDr. Christina Hirschl, CTR Carinthian Tech Research AG, AT

15:00 hrsSecurity beyond Design: Embedding Roots-of-Trust in Silicon and Cryptographically Securing the Supply Chain from Design to ManufacturingRajeev Gulati, Data I/O Corporation, US

15:00 hrsOn Designing Wireless Building Automation Networks: Estimating the Network Layer Impact of Functional DesignsBastian Wollschlaeger, Technische Universität Dresden, DE

15:25 hrsConsiderations on Solar Energy Harvesting for Smart SystemsAstrid Della Mea, Alpen-Adria-Universität Klagenfurt, AT

15:25 hrsA technology toolbox concept to improve reliability evaluationDaniel Hahn, Fraunhofer Institute for Relia-bility and Microintegration IZM, DE

15:25 hrsNew Advancements in Using Statistical Models as Part of a Standard MEMS Design FlowChristine Dufour, Coventor Inc., FRChristof Hielscher, X-FAB Semiconductor Foundries AG, DE

15:50 hrsDevelopment of a lab-on-chip electro-chemical immunosensor for detection of Polycyclic Aromatic Hydrocarbons (PAH) in environmental waterShifa Felemban, University College Cork Tyn-dall National Institute, IE

16:15 hrsUWB Radar sensor characterization for obstacle detection with application to the smart white caneLaurent Ouvry, CEA-Léti, FR

15:50 hrsOn the Thermo-Mechanical Risk Assessment of Complex Printed Circuit Boards (PCB) by Finite Element Modelling and Warpage MeasurementsJan Albrecht, Fraunhofer Institute for Electronic Nano Systems ENAS, DE

15:50 hrsCharacterization of a 2D micro-convey-ance device based on digital actuatorsDr. Zhichao Shi, Université de Technologie de Compiègne, FR

16:15 hrsImproving the Selectivity of Vapor Trace Detection SystemProf. Dr. Drago Strle, University of Ljubljana, SL 16:15 hrs

Warpage Measurement on Bonded Wafers Under Thermal LoadBastian Tröger, FRT GmbH, DE

16:40 – END OF THE CONFERENCE

Full description of the presentations as well as biographies of the speakers are available atwww.smartsystemsintegration.com/program

NOMINATED

BEST PAPER

AWARD 2018

NOMINATED

BEST PAPER

AWARD 2018

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Poster session

11 April 2018, 15:25 hrs – 16:30 hrs 12 April 2018, 13:30 hrs – 14:30 hrs

Biomaterial based toxic gas sensor using microwave resonant cavityDr. Sahib Babaee Tooski, Azad University, IR

The use of Virtual Reality and Augmented Reality in the wineryMatteo Balderacchi, ValorItalia Spa, IT

Constructive solutions for RF-MEMS switch with thermo-electric actuating mechanismAngela Baracu, National Institute for Research and Development in Microtechnology, RO

Study of optimum thickness of self-buffer layer Ga-doped ZnO thin film deposited on PC flexible substrateChien-Ting Chen, I-Shou University, TW

Die-Level Patterning of Parylene F by Laser-Ablation for further Processing with ALD Functional LayersÖzgü Dogan, Fraunhofer Institute for Microelectronic Circuits and Systems IMS, DE

Using fluidic simulation for parameter optimization in compression molding of microelectronic packagesMarc Dreissigacker, TU Berlin, DE

Short Range LIDAR characterization for obstacle detection with application to a smart white caneGabriela Dudnik, CSEM Centre Suisse d´Electronique et de Microtechnique SA, CH

MEMS gas sensor based on nanostructured SnO2-ZnO layersBogdan Firtat, National Institute for Research and Development in Microtechnology, RO

Impedance-Controlled Design and Connection Technology for Micromounting and Hybrid Integration of High- Frequency and Mixed-Signal Systems with MID Technology (FREMISI)Volker Geneiß, Fraunhofer Institute for Electronic Nano Systems ENAS, DE

Die Attach for High Power VCSEL Array SystemsLena Goullon, Fraunhofer Institute for Reliability and Microintegration IZM, DE

Stochastic Analyzes and Monte-Carlo Simulations of nonlinear and non-ideal Mixed-Signal Phase-Locked LoopsDr. Christian Hangmann, Fraunhofer Institute for Electronic Nano Systems ENAS, DE

Challenges in transfer quantum dot sensitized solar cell on technical textilesKathleen Heinrich, Fraunhofer Institute for Electronic Nano Systems ENAS, DE

New DC-50MBd SFP transceiver with real time monitoring capability cuts power consumption by half and doubles fiber density for HVDC VBE systemAlek Indra, Broadcom Limited, SG

Vertical aligned carbon nanotube (CNT) films as absorption layers for IR applicationsMandar Kini, Chemnitz University of Technology, DE

Investigation of high pressure Ag sintered joints manufactured with different toolsJohannes Kripfgans, Fraunhofer Institute for Reliability and Microintegration IZM, DE

Performance Analysis of a Novel Flexible NFC Tag for IoT ApplicationsSanjeev Kumar, University College Cork Tyndall National Institute, IE

Study of AZO/CuO nano-particles/AZO layer to deposit on PC flexible substrateJhe-Wei Lai, I-Shou University, TW

Towards a portable smart spatial exploration system for environment perceptionDr. Suzanne Lesecq, CEA-Léti, FR

Ga doped-ZnO thin film with low cost intermittence process to apply on plus sensorJung-Yan Liu, I-Shou University, Taiwan

Deposition methods for C8-BTBT in flexible TFTsThorsten Meyers, Universität Paderborn, DE

Transducer Electronic Data Sheets on Smart Ultra Low Power DevicesTobias Mitterer, Alpen-Adria-Universität Klagenfurt, AT

DNA analysis with a LED based illumination moduleDr. Christian Möller, CIS Forschungsinstitut für Mikrosensorik GmbH, DE

Non-invasive Blood Pressure monitoring integrated in a smart watch form factorBrendan O`Flynn, University College Cork Tyndall National Institute, IE

Long Range LiDAR Characterisation for Obstacle Detection for use by the Visually Impaired and BlindDr. Rosemary O`Keeffe, University College Cork Tyndall National Institute, IE

Analytical Modeling and Measurement of Vias in PCB-Technology up to 20 GHzPaul Perlwitz, Fraunhofer Institute for Reliability and Microintegration IZM, DE

Portable Sensor System for UV-Irradiation MeasurementsDmitry Petrov, Universität Paderborn, DE

Deposition speed optimization for ZnO nanoparticle TFTs using doctor blade processJulia Reker, Universität Paderborn, DE

Multipurpose Sensing Platform Based on Laser-Reduced Graphene Oxide for Flexible and Ubiquitous ElectronicsDr. Almudena Rivadeneyra, Technische Universität München, DE

Functional Integration - Structure-Integrated Wireless Sensor Technology Targeting Smart Mechanical Engineering ApplicationsDr. Steffen Rülke, Fraunhofer Institute for Integrated Circuits IIS, DE

RFID units for a product based control of industrial production systemsMarco Schmidt, Fraunhofer Institute for Electronic Nano Systems ENAS, DE

Smart and efficient Optimization of NED ActuatorsDavid Schuffenhauer, Fraunhofer Institute for Photonic Microsystems (IPMS), DE

Active flow control in wind turbines - integration technologies and assessment of economic effectsMartin Schüller, Fraunhofer Institute for Electronic Nano Systems ENAS, DE

Bond strength and stability of solderjet bumping packaging technique for laser device miniaturizationBrigitta Septriani, Fraunhofer Institute for Applied Optics and Precision Engineering IOF, DE

Ontology-based microservices architecture for industrial assistant systemsAdrian Singer, Fraunhofer Institute for Machine Tools and Forming Technology IWU, DE

Using Intermittent Process to enhance the optoelectronic properties of Ga-doped ZnO thin filmsKun-Ta Wang, Chiao Tung University, TW

Multiscale residual stress analysis in thin film layersMarie Weißbach, Fraunhofer Institute for Reliability and Microintegration IZM, DE

Designed Ga doped-ZnO layer with nano-Ag particles to apply on plus sensorWei-De Wu, I-Shou University, TW

Supervision Unit for Harsh EnvironmentsDr. Heike Wünscher, CIS Forschungsinstitut für Mikrosensorik GmbH, DE

This session takes place on both conference days and is

free of charge to all participants, exhibitors and registered

visitors!

IoSense Spring School 2018Wednesday, 11 April 2018, 9:00 - 17:50 hrs

The Spring School of the JU ECSEL project IoSense demonstrates how to engineer innovative products in sensor-actuator networks.

The IoSense project focuses on the availability of top innovative, competitive sensors and sensor systems »Made in Europe« for »Internet of Sensor« applications in smart mobility, society, energy, health care and production.

Participants are enabled to build platforms and complements for hardwaresoftware ecosystems so that their future applications in the Internet of Sensors become reality. The IoSense Spring School presents newest sensor technologies as well as ways how to create innovations with them, extending the value chain with easy-to-build software for sensor applications.

Objectives and ScopeThe target of the IoSense Spring School is to show how to engineer innovative products. The goal is to enable IoT ecosystems based on hardware-software platforms and complementing apps for exible and high-performance data-aggregation and processing in sensor-actuator networks. The future technology of IoSense covers

Innovative sensor and multi-sensor technologies for heterogeneous application areas

Highlighting new approaches for developing sensors using exible Frontend and Backend pilot lines

Design of sensor and app components for market needs by involving customers early in the development process

Enabling external parties to built IoT ecosystems with IoSense technology

Closing the gap between chip manufacturing and application developers for transforming existing value chain approaches

Co-located events16 | 17

Workshop »Life with Wearables in Smart Rooms« Thursday, 12 April 2018, 9:00 - 16:40 hrs

With the advent of standard sensor-actuator platforms for wearable devices, such as smart watches, smartglasses, smart clothing, and exoskeletons, people carry multiple sensor-based devices simultaneously. This trend imposes completely new challenges to software engineering w.r.t. adaptivity, distribution, interaction, integration, data handling, resiliency, security and software architecture. Because in these devices, hardware and software interact tightly, new skills and processes are required when designing solutions.

The integration of wearable devices with other smart devices installed in an environment requires that the software architecture is highly dynamic. Therefore, there is a need for a new paradigm of software development for wearables in smart rooms, based on sensor nets, fog, and edge computing. For wearables in smart rooms, software engineering techniques must be established to improve their quality (e.g., re-usability, reliability,maintainability), so that life with them becomes secure, safe and convenient.

This trend suggests establishing a new joint community of researchers from sensor nets, wearables, fog computing, and software engineering. The workshop Life with Wear-ables in Smart Rooms aims to bring together researchers and practioneers from these communities, to present current approaches w.r.t. software engineering of wearable devices, gather requirements for future wearable systems and develop a roadmap for software engineering for wearables in smart rooms.

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During the SSI, the European Technology Platform on Smart Systems Integration (EPoSS) will host the following four meetings organised by its working group members:

»Transport«, »Healthy Living and Applied MNBS«, »Manufacturing & Robotics and Communications for Smart Devices« and »Key Technologies«.

The exact time and place of the working group meetings will be communicated on the EPoSS homepage in time. Participation in the working group meetings is free of charge and open to the public.

For further information, please write an e-mail to contact@smart-systems-integration.org

EPoSS working Group MeetingsInternational Exhibition and Conferencefor System Integration in Micro ElectronicsNuremberg, 5 –7 June 2018

smthybridpackaging.com

Nuremberg, the heart of electronic manufacturing

Exhibition Topics

Technologies and Processes Materials and Components Manufacturing Manufacturing equipment Reliability and Test Software and Systems Service and Consulting

Conference chair Prof. Dr. T. Otto, Fraunhofer ENAS, DE

Co-chairDr. G. Lugert, Siemens, EPoSS, DE

Local co-chair Dr. W. Dettmann, Infineon Technologies AG, DE

Prof. Dr.-Ing. habil. K. Kabitzsch, Dresden University of Technology, DE

C. Kögler, T-Systems Multimedia Solutions GmbH, Silicon Saxony e. V., DE

Prof. Dr. K.-D. Lang, Fraunhofer IZM, DE

Scientific committee L. Añorga, CIDETEC, ES R. Aschenbrenner, Fraunhofer IZM, DE

Prof. Dr. R. R. Baumann, Fraunhofer ENAS, DE

Prof. Dr. K. Bock, TU Dresden, DE

Dr. C. Bosshard, CSEM, CH

Dr. S. Brongersma, Holst Centre, IMEC, NL

Dr. B. Candaele, Thales, FR

Prof. Dr. C. Cané, Centro Nacional de Microelectrónica (CNM-IMB), ES

Dr. J. De Boeck, IMEC International, NL

Prof. Dr. A. Dehé, Hahn-Schickard, DE

M. Desmulliez, Heriot-Watt University, UK

K. Dyrbye, Grundfos Holding, DK

Dr. S. Finkbeiner, Bosch Sensortec, DE

Prof. Dr. P. J. French, Delft University of Technology, NL

U. Gäbler, Infineon, DE

W. Gessner, VDI/VDE-IT, DE

Dr. R. Günzler, Hahn-Schickard, DE

Dr. C. Hedayat, Fraunhofer ENAS, DE

Dr. H. Heinzelmann, CSEM, CH

Prof. Dr. C. Hierold, ETH, CH

Prof. Dr. K. Hiller, Chemnitz University of Technology, DE

D. Holden, CEA-LETI, FR

Dr. J. Kiihamäki, VTT Technical Research Centre of Finland, FI

Prof. Dr. C. Kutter, Fraunhofer EMFT, DE

L. Le Fur, Airbus Group Innovations, FR

Dr. C. Merveille, IKERLAN, ES

Prof. Dr. W. Mokwa, RWTH Aachen, DE

Committee list20 | 21

Dr. E. Moore, University College Cork, Tyndall National Institute, IE

Dr. A. Muller, IMT, RO

Dr. A. Nebeling, Elmos, DE

Prof. H.-E. Nilsson, Mid Sweden University, SE

Prof. Dr. H. Pereira Neves, Six Semiconductors, BR

J.-P. Polizzi, CEA-LETI, FR

Dr. Y. Ponomarev, Analog Devices, BE

Dr. I. V. Popova, Gyrooptics, RU

Dr. M. Riester, meisterwerk ventures GmbH, DE

Dr. G. Righini, Instituto di Fisica Applicata Nello Carrara Firenze, IT

Prof. A. Rydberg, University of Uppsala, SE

Prof. Dr. S. Rzepka, Fraunhofer ENAS, DE

Dr. M. Scholles, Fraunhofer IPMS, DE

U. Schwarz, X-FAB MEMS Foundry, DE

Dr. R. Slatter, Sensitec GmbH, DE

T. Stärz, microFAB, DE

Prof. J. Tuovinen, JoyHaptics Ltd, FI

J. Wolf, Fraunhofer IZM, DE

Advisory committeeInternational membersProf. Dr. M. Esashi, Tohoku University, JP

R. H. Grace, R. Grace Associates, US

Members of EPoSS advisory committeeR. Dal Molin, CAIRDAC SAS, FR

R. Groppo, Ideas & Motion, IT

A. Korhonen, Murata Electronics, FI

Dr. J. Langheim, STMicroelectronics, FR

Dr. R. Neul, Bosch, DE

A. Nguyen-Dinh, Vermon, FR

H. Rödig, Infineon Technologies, DE

Dr. W. van Driel, Philips Electronics, NL

Registration termsRegistration for Smart Systems Integration 2018 is binding and only accepted online at smartsystemsintegration.com/registration. Participation fees are due upon registration with payment by credit card (VISA, Master/Eurocard and Amex) via the Saferpay gate-way. An invoice for the fees will be issued by mail. Please note participation is only allowed after full payment. Once the regis-tration process is complete, you will receive an email registra-tion confirmation including an entry voucher to the conference, please make sure to bring this along. Your conference docu-ments will be issued on-site at the conference counter.

Cancellations will be accepted in writing only. Cancellations received by Mesago by 28 February 2018 will incur a processing fee of 85 EUR. Thereafter if the participant does not attend, the full fee will be due. If a participant is unable to attend, a substitute can be nominated. Mesago reserves the right to cancel the conference due to poor bookings or other reasons beyond our control. No further claims beyond the reimburse-ment of participation fees already paid will be accepted. The program or speakers are subject to change and no claims may be made in this respect.

The conference language is English.

Conference packageThe conference fee includes participation in the conference parts booked, proceedings (USB-stick), lunch on the days registered, coffee breaks and free admission to the exhibition, the poster sessions and the special session by EPoSS.

Opening hours registration counterThe conference counter will open 1 hour before the beginning of the conference.

Venue Hilton DresdenAn der Frauenkirche 501067 Dresden, Germanywww.hiltonhotels.de/deutschland/hilton-dresden

Accommodation and travelThe Hilton hotel is located in the heart of Dresden’s Old Town, directly opposite the famous Frauenkirche Church. You can reach it easily by plane, car, train or by public transportation. Detailed information as well as a list of hotels with special rates is available at smartsystemsintegration.com/travel

Registration

Registration feesUntil

Until 28 February 2018

From From 1 March

2018

Full conference 999 EUR 1,215 EUR

Full conference university staff and research institutes staff*

685 EUR 840 EUR

Full conference students 360 EUR 360 EUR

One conference day 650 EUR 730 EUR

Conference dinner 85 EUR 85 EUR

Pre-conference field trip 55 EUR 55 EUR

IoSense Spring School 180 EUR 300 EUR

Workshop 270 EUR 450 EUR

* University staff, research institute staff and students may only register for the full conference at special rates and must enclose a copy of their university/research institute ID-card.

For registration on-site a last-minute-fee of 30 EUR becomes due.All fees plus legal VAT.

22 | 23

At a glanceRegister now

and ensure early bird rates!

ExhibitionThe SSI conference is accompanied by an international exhibition with exhibitors from science and industry from all over Europe. To have a look at the exhibitors please visit www.smartsystemsintegration.com/exhibitorlist

ConferenceThe Smart Systems Integration Conference offers a comprehensive market overview and the possibility to gain high class expertise.

NetworkingMeet international specialists and industry colleagues from around the world and make valuable contacts.

Career coaching & Job boardHuman Resource professionals provide young professionals and experienced specialists with an individual career coaching on site. The job board allows to find out about current vacancies offered by the exhibiting and cooperating companies as well as research institutes and to contact potential employers directly on site.

Mesago Messe Frankfurt GmbH Rotebuehlstraße 83–85 70178 Stuttgart, Germany Board of Management: Petra HaarburgerMartin RoschkowskiHRB 13344

Mesago Messe Frankfurt GmbHMs. Liane PreussPhone: +49 711 61946-49, Fax: -1149E-Mail: liane.preuss@mesago.com

Contact for further details In cooperation with

Organizer Co-organizer

Part of the activities of