CONFERENCE GUIDE - EDI CON Chinaediconchina.com/docs/conferenceguide_2016.pdfCONFERENCE GUIDE April...

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www.EDICONCHINA.com

CONFERENCE GUIDE

April 14-16, 2015 2015年4月14-16日China National Convention Center

国家会议中心Beijing, China

中国北京

2015

ENGLISH VERSION

2015

The EDI CON 2015 organizers would like to thank the following for their help and valued support

of this year’s event.

SPONSORS

Bronze Sponsors

Silver Sponsors

Mini-CircuitsMini-Circuits®

ISO 9001 ISO 14001 AS 9100

Gold Sponsors

Host Sponsor Corporate SponsorDiamond Sponsor

Official PublicationsChina

Organized by: Media Partners

Table of Contents

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Sponsors.................................................................................................................................................... Inside Front Cover 2

Conference Matrix ................................................................................................................................................... 4

Plenary Opening Keynotes ..................................................................................................................................... 7

5G Forum Keynotes .................................................................................................................................................. 24

Exhibitor List............................................................................................................................................................. 50

Exhibitor Floor Plan ................................................................................................................................................ 51

Conference Program

Technical Sessions:

Tuesday, April 14, 201510:00 – 10:20 .......................................................................................... 1410:20 – 10:40 .......................................................................................... 1510:40 – 11:00 .......................................................................................... 1611:30 – 11:50 .......................................................................................... 1811:50 – 12:10 .......................................................................................... 1912:10 – 12:30 .......................................................................................... 20

Wednesday, April 15, 201509:30 – 09:50 ......................................................................................... 2309:50 – 10:10 .......................................................................................... 2510:10 – 10:30 .......................................................................................... 2711:00 – 11:20 .......................................................................................... 2811:20 – 11:40 .......................................................................................... 3011:40 – 12:00 .......................................................................................... 3112:00 – 12:20 .......................................................................................... 32

Thursday, April 16, 201509:30 – 09:50 .......................................................................................... 4009:50 – 10:10 .......................................................................................... 4110:10 – 10:30 .......................................................................................... 4211:00 – 11:20 .......................................................................................... 4311:20 – 11:40 .......................................................................................... 4511:40 – 12:00 .......................................................................................... 4612:00 – 12:20 .......................................................................................... 47

Workshops & Panels:

Tuesday, April 14, 201513:30 – 14:10 .......................................................................................... 2114:15 – 14:55 .......................................................................................... 22

Wednesday, April 15, 201513:30 – 14:10 .......................................................................................... 3414:15 – 14:55 .......................................................................................... 3515:30 – 16:10 .......................................................................................... 3716:15 – 16:55 .......................................................................................... 38

Thursday, April 16, 201513:30 – 14:10 ......................................................................................... 4814:15 – 14:55 .......................................................................................... 49

Details in this booklet were correct at the time of going to press. They are subject to change. For up-to-date information, visit our website at www.ediconchina.com.

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Tuesday, April 14, 2015

Measurements & Modeling Track:

PCB/Connector Focus

Design Track: Amplifier Focus

RF/Microwave & HSD Measurements/

Modeling Track

System-Level Measurements/ Modeling Track

Systems Engineering Track

Room 401 Room 402A/B Room 403 Room 405 Room 406

08:00 - 17:00 On-Site Registration Opens

General Technical Sessions

10:00 - 10:20TU_101 - Characterization of

PCB Insertion Loss with a New Calibration Method

Cheng, Keysight Technologies

TU_102 - Multi-Mode Stability Analysis of Power Amplifiers

Employing Mixed-Mode Parameters Yao, IMECAS

TU_103 - Characterization Using Multi-Purpose Source & Load Pull Tuners (MPT) for Inverse Class F PA First-Pass Design Tsironis, Focus Microwaves

TU_104 - Hybrid Over The Air Throughput Measurement

Young, Pace Americas

TU_105 - Power Distribution Control Room Electromagnetic

Field Simulation Modeling Du, CST

10:20 - 10:40TU_201 - Testing High Speed

PCBs with Vector Network Analyzers

Weiss, Rohde & Schwarz

TU_202 - A Simple Method for Changing the Frequency Range of an RF Power Amplifier Circuit

Vigneri, Freescale Semiconductor

TU_203 - High Speed Hybrid Active Injection Load-Pull (HAILP)

Tsironis, Focus Microwaves

TU_204 - WLAN 802.11ad Spectrum and Modulation

Measurements in the 60 GHz Range

Schmähling, Rohde & Schwarz

TU_205 - Simulation Approach for MIMO Antenna Diversity Strategies

Futter, Altair

10:40 - 11:00

TU_301 - Performing Reliable, Repeatable RF Measurements Using RF Test Probes On Board

to Board Connectors Masnou, Radiall

TU_302 - ET Test Solution and Result Analysis

Ma and Wang, Rohde & Schwarz

TU_303 - A New Method for Noise Figure Measurement Base

on Modern VNA Li, Keysight Technologies

TU_304 - From 802.11a to 802.11ah: A Survey of the New Features Available in

802.11ad/af/ah Hall, National Instruments

TU_305 - Addressing Multi-Channel Synchronization

and Calibration Needs for MIMO Testing

Hsu, Keysight Technologies

11:00 - 11:30 Tea Break - South Foyer

11:30 - 11:50TU_402 - A High Voltage GaN HEMT Power Amplifier Design

for Envelope Tracking Wang, Microsoft

TU_403 - Applying the Y-Factor Method for Noise Factor Measurements of LNAs

Hall, National Instruments

TU_404 - 16 Bit Vertical Resolution on Oscilloscopes

Beer, Rohde & Schwarz

TU_405 - Multiple Entities, Base Stations Efficient Testing

of Real Life Scenarios Thuemmler, Rohde & Schwarz

11:50 - 12:10TU_501 - Material for Improved

RFPA Performance Zhang, Arlon

TU_502 - Measuring the Time-Alignment in Envelope Tracking Power Amplifiers

Feng, Keysight Technologies

TU_503 - Noise Parameter Measurement System

Verification using On-Wafer Passive Attenuator

Tsironis, Focus Microwaves

TU_504 - Using Real Time Scope to Fully Analyze High

Speed Digital Signals Lu, Keysight Technologies

TU_505 - Improving Throughput of Multiport Network Analysis

using PXIe Vector Network Analyzer

Hirato, Keysight Technologies

12:10 - 12:30

TU_601 - Applying VNA for PCB Power Plane Ultra-Low Impedance and Inductance

Measurements Ko, Keysight Technologies

TU_602 - Envelope Tracking for Uplink LTE Carrier Agregation

Balteanu, Skyworks

TU_603 - Methods to Improve Noise Figure Measurement Accuracy in Signal Analyzer Rui, Keysight Technologies

TU_604 - Using Sequencer Technique to Speed Up

Femtocell Measurement Cong, Keysight Technologies

TU_605 - Accurate Simulation of Measurement Chambers

Futter, Altair

Press Conference

ExhibitionHours

12:00 - 18:30

12:30 - 13:30 Lunch Break - Exhibition Floor

Poster Session: Exhibition Floor

12:30 - 15:30

Workshops

13:30 - 14:10

WS_TU101 - Measurement of the Effect of Laminate Material Properties on the Temperature Rise of High Frequency Devices

Rogers

WS_TU102 - DPD, ET and Load Pull: Three PA

Measurement Techniques Every Engineer Should Know

National Instruments

WS_TU103 - Millimeter Wave VNA Development

and Application Anritsu

WS_TU104 - Simulation Enabled 5G Antenna Design

CST

WS_TU105 - LTE & LTE-A 4x4 MIMO Throughput Test Solution

Based on SystemVue & PXI Keysight Technologies

14:15 - 14:55WS_TU201 -

Impact of Cable Assemblies for Test and Measurement

W. L. Gore

WS_TU202 - Next Generation LDMOS for Multi-Markets (NXP)

Sponsored by: Transemic

WS_TU203 - Complete Millimeter Wave Test System

Includes Noise Figure Measurements

Keysight Technologies

WS_TU204 -The Design and Optimization of Power Amplifi-ers Based on Test Techniques

Rohde & Schwarz

WS_TU205 - Understanding TD-LTE

Qorvo

15:00 - 15:30 Tea Break - Exhibition Floor

15:30 - 17:30 Plenary Session - Featuring Chair Dr. Song, BUPT; Sponsors; Guest Keynotes: China Mobile, China Unicom, ZTE Auditorium Level 4

18:00 - 20:00 VIP Reception and Dinner (Sponsors and Invited Delegates) - Ballroom, Level 1/F

Details in this conference matrix were correct at the time of going to press. They are subject to change. For up-to-date information visit our website at www.ediconchina.com

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Wednesday, April 15, 2015

Design Track: Antennas/IoT/MMICs 5G Forum HSD/EMC Measurement &

Modeling Track

System-Level Measurements/Modeling

Track: Radar FocusSystems Engineering Track

Room 401 Room 402A/B Room 403 Room 405 Room 406

09:30 - 09:50

WE_101 - Active Antenna and RF Systems Deliver Critical

Connectivity for Wireless Devices – From Smartphones to IoT

Wang, Ethertronics

WE_102 Keynote: 5G and IoT Vision Dr. Zhengang Pan, China Mobile and

Hai Wang, Ericsson

WE_103 - Understanding Fully-Differential Amplifier

Specifications and the Benefits of FDAs When Driving ADCs

Du, Texas Instruments

WE_104 - Integrated Framework for Radar Design

Paparisto, National Instruments

WE_105 - Research and Applications on In-Circuit Test of Signal Processing

Boards Zeng, Beijing Herotec

09:50 - 10:10WE_201 - New IoT RF & Protocol

Testing Ma and Feng, Rohde & Schwarz

WE_202 - 5G Panel Session: Keysight Technologies,

Rohde & Schwarz, National Instruments, MACOM, China

Mobile and Shanghai Tech

WE_203 - Full-Wave Electromagnetic Simulation for SI and EMI in

High Speed Connectors Sun, CST

WE_204 - Ultra High Definition (UHD) Imaging for Aerospace

and Defense Applications; Dimitrakopoulos, Rohde & Schwarz

WE_205 - Next Generation Industrial Innovation and Manufacturing

(Siemens) Transemic

10:10 - 10:30WE_301 - HFSS Component Model

Libraries to Support Enterprise-Level Product Development and IoT Design

Chen, ANSYS

WE_303 - Serial Data Link Analysis with Measurement and IBIS-AMI

Simulation Correlation Wang, Keysight Technologies

WE_304 - A Bridge to Connect Antenna Design and Radar System Xie, Keysight Technologies

WE_305 - Real-Time DPD Design-to-Prototype

Inoue, National Instruments

10:30 - 11:00 Tea/Coffee Break - Exhibition Floor

Exhibition Hours10:00

to 17:00

11:00 - 11:20WE_401 - Design of W-Band MMICs

Based on InP HEMT Technique Yao, IMECAS

WE_302 - Massive MIMO System Design and Consideration

Yang, Keysight Technologies

WE_403 - High-Speed Circuit Board Clock Circuit EMI Simulation

and Testing Ren, CST

WE_404 - Segmented Capture for Analysis of Long Pulse Sequences for

RADAR Analysis Schmähling, Rohde & Schwarz

WE_405 - Implementing an FFT-Based EMI Measurement

Tye, Keysight Technologies

11:20 - 11:40WE_501 - Broadband, Low-Loss

Impedance Matching for W-Band Power Amplifier with 22 dB Gain

Yao, IMECAS

WE_402 - Compact Measurement System for 5G mmWave

Channel Sounding Eichler, Rohde & Schwarz

WE_503 - VFTO Radiated Interference Simulation in GIS Field

Liu, ANSYS

WE_504 - Automatic Analysis of 500 MHz or 2 GHz Wide Frequency Hopping

or Chirp Signals Used in Modern RADAR Applications Schmähling,

Rohde & Schwarz

WE_505 - Optimization of EVM Testing with VSA/VSG for Modulated Signal

Like 802.11 WLAN and LTE Lin, National Instruments

11:40 - 12:00

WE_601 - Multiband Triangular Planar Inverted F-Antenna Design for Wireless

Communication Applications

Ho

WE_502 - Flexible Testbed for 5G Massive MIMO: From Theory to Reality

Jia, National Instruments

WE_603 - Benefits of Multi-Tone Immunity Testing

Barth, AR

WE_604 - Modeling and Measurements of Frequency Stepped

Chirped Radar Nguyen, National Instruments

WE_605 - Design and Implementation of Large-Scale RF and Microwave Switch

System Qi, Pickering

12:00 - 12:20WE_701 - Implementation of a Zigbee

Circuit Reference Design Leong, National Instruments

WE_602 - mmWave MIMO Channel Sounding for 5G-Technical Challenges

and Prototype System Wen, Keysight Technologies

WE_703 - EMI and Crosstalk Mitigation on Power Tray

Fan, Cisco

WE_704 - Comprehensive Radar Testing

Heuel, Rohde & Schwarz

WE_705 - HFC Improvement for DOCSIS3.1 Evolution

Huang, Cisco Systems


Workshops & Panels

13:30 - 14:10WS_WE101 - Smart Antenna Technolo-

gy and Multi-Channel RF Measurements


13:30 - 13:50: WE702 - Transceiver Module & Multi-Element Phased

Array Design for 5G Paparisto, National Instruments

13:50 - 14:10: WE802 - Timing and CFO Synchronization in FBMC System Based

on Superimposed Zadoff-Chu Sequences

Zhang, Keysight Technologies

WS_WE103 - Minimizing EMI Through Effective Signal and

Power Integrity ANSYS

WS_WE104 - An Active Solution & Service from Microwave to Terahertz for Communications/Radar/Sensor

& Imaging Systems Farran

WS_WE105 - Commercialization of GaN for Cost-Sensitive Applications

MACOM

14:15 - 14:55WS_WE201- Why Reaching 0 Hz

Matters: The True DC Switch Brown, Peregrine Semiconductor

14:15 - 14:35: WE902 - Signal and Spectrum Analysis Challenges in 5G

Test and Measurement Schmähling, Rohde & Schwarz

14:35 - 14:55: WE1002 - HetNet on LTE and Wi-Fi

Yang, Shanghai Tech

WS_WE203 - 100G Backplane Test Challenges


WS_WE204 - Radar Complex Electro-magnetic Environment Simulation and

Evaluation Method Rohde & Schwarz

WS_WE205 - Small Cells Design Solutions

Richardson RFPD


15:30 - 16:10WS_WE301 -

Affordable RF Test Solutions Tektronix

WS_WE302 - Verification and Testing 5G and Millimeter Wave Ultra-Wide-

band Signals Keysight Technologies

WS_WE303 - Automated Test Equipment (ATE) and WiMAX, Wi-Fi, 3G, 4G, LTE, DVB Fading Simulators

Mini-Circuits

WS_WE304 - Advanced Modeling Techniques for Phased Array Antennas

Cao, ANSYS

WS_WE305 - Efficiency Enhanced GaN HEMT Allowing Flexible

RF Designs for LTE Applications RFHIC

16:15 - 16:55WS_WE401 - A Method to Reduce

Voids in Solder Attach for RF Devices Freescale

WS_WE402 - Introduction to Software Defined Radio in LabVIEW

National Instruments

WS_WE403 - Signal Integrity in Passive RF and Microwave Components

Huber+Suhner

WS_WE404 - Wideband Impedance Control for Modulated Signals

Focus Microwaves

PA_WE405 - GaN Panel Freescale, Qorvo, MACOM and

Empower RF Sponsored by: Richardson RFPD

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Thursday, April 16, 2015

Measurements & Modeling Track Design Track

EMC/EMI & HSD Measurements/Modeling

Track

System-Level Design Track

System-Level Measurements/ Modeling Track

Room 401 Room 402A Room 403 Room 405 Room 406

09:30 - 09:50TH_101 - A Finite-Element Thermal Model

for Compound Semiconductor Devices Implemented in SPICE

Tarazi, MACOM

TH_102 - Tunable VCO Filtering Circuitry

Ho

TH_103 - Integrated Low Pass Filter with ESD Protection for Audio Applications

Liu, OnSemi

TH_104 - System for Positioning and Locating of Missile Threats,

Mountable on Airliners Mohammadi, BAAM

TH_105 - Phase Coherent Signals, Challenges and Applications

Thuemmler, Rohde & Schwarz

09:50 - 10:10TH_201 - DynaFET: Accurate Modeling

of III-V HEMTs Based on NVNA Measurements and ANNs

Long, Keysight Technologies

TH_202 - Coupled Electro-Thermal Analysis

of High Power RF Filters Yuan, ANSYS

TH_203 - Addressing the Challenges of PAM-4 Receiver Stressed Input Testing

Hoehne, Keysight Technologies

TH_204 - A 60 and 80 GHz Point-to-Point Data Link with Throughput Up

to 160 & 225 Gb Mohammadi, BAAM

TH_205 - Facing Multi-Port Device Challenges with

Modern VNA Testing Techniques Bednorz, Rohde & Schwarz

10:10 - 10:30TH_301 - Statistical Model Extraction

Solution Fei, Keysight Technologies

TH_302 - Design Methodology for GaAs

MMIC and/or Basestation PA Lien, National Instruments/AWR

TH_303 - Analysis of Small Voltage Variation Under Large Signal Conditions

Beer, Rohde & Schwarz

TH_304 - A Novel Interpretation of Shipborne EMI Measurements by

Means of Fuzzy Theory Macedo, Inmetro

TH_305 - Complex RF Environment: Challenges in Telecommunications

and A&D Thuemmler/Heuel, Rohde & Schwarz


ExhibitionHours10:00

to 15:00

11:00 - 11:20TH_401 - Understanding the Effect of Source Isolation on Intermodulation

Distortion Measurements Fernandez, National Instruments

TH_402 - C-Band GaN Microwave Power Device Broadband Matching

Circuit Shen

TH_403 - Advanced Techniques for Test-ing High Speed, Multi-Lane PCI Express

3.0 and 4.0 Devices Eads, Keysight Technologies

TH_404 - A BPSK Demodulator Design for Onboard Satellite

Telecommand Receiver Basit, UET Taxila Pakistan

TH_405 - A Method to Improve the Efficiency of Agile Frequency

Synthesizer Testing Peng, Rohde & Schwarz

11:20 - 11:40TH_501 - Measurement of Passive

Intermodulation Using a Vector Network Analyzer

Bednorz, Rohde & Schwarz

TH_502 - A Rigorous and Simple Method

for Loop Circuit Stability Analysis Yao, IMECAS

TH_503 - How to Test the DDR4 Circuit and Timing Accurately

Zhao, Keysight Technologies

TH_504 - Overcoming RF-System Level Challenges in an UHF

Multi-Protocol RFID Reader Using Software-Defined Radio (SDR)

Wong, Avidus

TH_505 - mmWave Transceiver Modules for Wireless

Communications and W-Band Sensor for Short-Range Detection/

Imaging Sun and Wu, SIMIT, CAS

11:40 - 12:00TH_601 - Fundamentals of Pulsed

Power Measurements Fernandez, National Instruments

TH_602 - A 790 to 960 MHz Wideband 600 W LDMOS Asymmetry

Doherty Amplifier Hao, Freescale Semiconductor

TH_603 - Standard Document to the Test Floor Measurement - Challenges from

the Bluetooth Perspective Jia, National Instruments

TH_604 - Simulation to Measurement Workflow for DDR4 Electrical and

Timing Compliance Yang, Keysight Technologies

12:00 - 12:20TH_701 - S-Parameter Measurements

with Modulated Signals Bednorz, Rohde & Schwarz

TH_702 - Low Phase Noise and Fast Tuning Microwave Signal Generator

Fernandez, National Instruments

TH_703 - NFC Analogue Measurement Uncertainty Brought by Position Accuracy

He, VI Service

TH_704 - Microwave Power Combining System Based on Two Injection-Locked CW Magnetrons

Huang


Workshops

13:30 - 14:10WS_TH101 - Application Circuit to Extend the Bandwidth of Narrow Band Matched

MMIC Power Amplifiers Mini-Circuits

WS_TH102 - Highly Integrated mmWave PHEMT Foundry Processes

WIN Semiconductors

WS_TH103 - Resolving Cavity Resonance Effects in Microwave Circuits Leong, National Instruments

WS_TH104 - Microwave Absorbing Materials; Cuming Microwave

Sponsored by: Mitron

14:15 - 14:55WS_TH201 - PCB and Electronic Industry Materials Measurement Methods from

Low Frequency to Microwave Keysight Technologies

WS_TH202 - A Fast and Reliable High Efficiency GaN PA Design Approach

with Measurement Based Model Maury Microwave

WS_TH203 - Communication, Radar Signal Testing and Analysis, CETC41

EDI CON 2015 • Conference Guide

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▼ Tuesday, April 14, 2015 15:30 – 17:30 ▼Plenary Opening KeynotesLevel 4 Auditorium

Construction of Smart Cities / Communities Will Drive Rapid Development of ICT Industry in ChinaEDI CON 2015 Chairman, Dr. Junde Song, Professor Beijing University of Posts and Telecommunications

Abstract

Currently, around 400 cities are committed to constructing smart cities or communities in China. China has the larg-est number of smart cities or communities in the world. According to the experts, around RMB Ұ30 trillion (5 trillion US $) will be invested in smart cities in China from 2014 - 2017. The governors and the designers of smart cities look to ICT as one of main methods of investment and support. All of the smart cities or communities in China will use new technologies to realize intelligent management and service, such as IoT, cloud computing, big data, mobile internet, e-commerce, 4G/5G/Wi-Fi, and GIS. The supporting technologies of smart cities or communities are the content that this EDI CON event will discuss and showcase. The base products, software and sub-systems of smart city will be shown at EDI CON, such as radio/microwave devices and sub-systems, EMC/EMI, RFID/Zigbee, all kinds of sensors, VLSI technology, and all kinds of test equipment. Without these technologies, the dream of a smart city will not be realized.

This talk will introduce the current status and future of smart cities and communities in China. The application status and requirements of big data, IoT, mobile internet, 4G/5G, etc., is also a main topic. Finally, this talk also discusses what the new requirements are for software, EDI, test equipment, etc., in China.

Biography

As one of China’s leading telecom experts, Professor Song has won numerous awards including first prize (Ministry of Science and Technology Progress Award) from the State Education Commission for national scientific and technolog-ical progress in electronics and has been recognized by the National Natural Science Foundation for his science and technology research and international cooperation. Professor Song has published over a dozen books and teaching material along with nearly 200 technical papers on mobile communications and the Internet, the future of communi-cations, CTI/CRM and VLSI CAD field.

Professor Song, PhD supervisor, Electronic Engineering, Beijing University of Posts and Telecommunications is current-ly the Academic Council Director, Chairman of China Communications Standards Association, CMIS, honorary Doctor of the Moscow Institute of Electronic Engineering, the State Council Academic Degree Committee disciplinary assess-ment team members, the State Ministry of Personnel postdoctoral accreditation experts, the International Information Federation of IFIP TC7 Chinese President, Information Ministry of Communications Science and Technology Industry Committee members and the satellite and radio consultants, China Communications Standards Association Expert Advisory Committee of Experts, China Computer Federation and the data communication network, deputy director of the committee. Ministry of Information Industry and ministerial key laboratories PCN & CAD Center and CTI Research Centre, Beijing served as the Chairman of the Committee of Posts and Telecommunications large school degree, grad-uate school dean and other staff.

CHAIRMAn


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IoT Services: Opportunities and Challenges – A Perspective of a Mobile OperatorWai Chen, Chief Scientist and General Manager of IoT, China Mobile Research Institute

Abstract

The number of Internet-of-Things (IoT) devices worldwide exceeded 8 billion in 2014, and is expected to reach 26 billion in 2020 by some estimates. Rapid advances in sensorization of devices, pervasive networking connectivi-ty, rich information exchange, and smart data analytics, among others, have been propelling the emergence of IoT applications with self-learning capabilities. For mobile operators such as China Mobile, how to realize IoT value and accelerate implementation for specific business scenarios, by combining sensors, networks, IoT service platforms and integration present both opportunities and challenges.

This presentation will highlight some of the opportunities and challenges – particularly from the perspective of a mobile operator. It will highlight several high-impact IoT applications, namely cooperative ITS, cloud-assisted smart service systems (e.g., robots), and mobile asset tracking, to help illustrate some of our ongoing research involving the IoT service platform and the devices as well as the applications they support. Cloud-assisted smart service systems will leverage deep learning, cloud computing, and integration tools to achieve cloud-device (e.g., robots) collabora-tion and new approaches for optimization. Mobile asset tracking will create many new information sources, i.e., new gadgets or wearable devices that add rich information collection about and around the object, expanding the digital reach. Finally, some insights on business models based on current IoT services will be shared.

Biography

Dr. Wai Chen directs the R&D of Internet of Things (IoT) in China Mobile, where he is the Chief Scientist of China Mobile Research and the General Manager of China Mobile Internet-of-Things Research Institute. The R&D efforts include IoT systems, platforms, and applications, e.g., IoT services platform, data analytics, cloud-assisted smart machines, cooperative ITS, and IoT communications chipset and devices, among others. Prior to joining China Mobile, Dr. Chen was the Vice President and Group Director of ASTRI, Hong Kong, and was the Chief Scientist and Director of Applied Research in Bellcore / Telcordia Technologies, New Jersey, USA. While in Bellcore / Telcordia, Dr. Chen was Principal Investigator for several government-funded (US DARPA, US ARL) projects on advanced networking research, and led a research program over 10 years (2000 – 2010) in collaboration with a major automaker on connected vehi-cles. Dr. Chen received his B.S. degree from Zhejiang University, and M.S., M.Phil., and Ph.D. degrees from Columbia University, New York.

InVITED SPEAKER


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5G: Co-existing Opportunity and ChallengesHongbing Ma, Principal Expert of Wireless Technology, China Unicom

Abstract

5G is not only the evolution of technologies, but also the way to meet the customer’s service requirements, especially to cope with the rapid increasing volume of packet data of Mobile Internet. One of the core considerations of 5G is IoT, including M2M, D2D, V2V, etc. It has become a common view that IoT will be the next big potential market. The new demand in services brings us great challenges, such as the complexity of technologies, the backward-compatible with 4G or 3G, the more demand of spectrum above 5 GHz, more sophisticated coding / channelizing / modulation / massive MIMO /SON / Transmission network /SDN /NFV, etc. This presentation will analyze these great changes and try to give some suggestions.

Biography

Hongbing Ma studied wireless communications & image coding/transmissions at BUPT and received his bachelor’s degree of electronic engineering in 1989. His research focuses on Mobile Network Planning and Optimization. He has been responsible for the measurement and testing of LTE/HSPA/GPRS. He is the principle wireless technology expert of China Unicom Network Technology Research Institute, the standing committee member of China Unicom Science & Technology Committee, vice chairman of China Unicom Mobile communication Professional Committee, expert consul-tation group member of mobile and wireless communications and satellite communications technology committee of MII and member of the Seventh wireless and mobile communications committee of CIC (China Institute of Communi-cations).

InVITED SPEAKER


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5G and IoT Challenges and SolutionsHenry Komrij, General Manager of the PNA Organization, Keysight Technologies

Abstract

2G, 3G and 4G technical innovations and evolution has led to a successful commercialization of technology that meets the targets of voice and basic data access over the past 20 years. Today we find that the needs have and are changing and becoming more diverse, along with the maturing of mobile Internet and Internet of Things. To this end, new network architectures are needed to be more flexible and dynamic, providing the most effective and efficient services to meet the diversity of customers' requirements. The industry will reach a consensus of 5G mobile commu-nication networks, targeting the emerging industry needs such as ultra-high data access, ultra dense network, V2V, M2M, etc. These emerging trends lead to innovations in physical layer techniques and test & measurement challeng-es. Keysight Technologies, along with leading industry companies, has been conducting plenty of research and tests by the help of Keysight's most comprehensive test & measurement tools and solutions, accelerating the research and innovation of new technologies.

Biography

Henri Komrij is the general manager of the Performance Network Analyzer (PNA) organization at Keysight Technol-ogies. He leads the PNA organization and holds overall business responsibility. Henri started his career in Hewl-ett-Packard’s Microwave Technology Center in 1983. Two years later he joined the Network Measurement Division (NMD) as an applications engineer. Subsequently, he was named European product line manager based in Amster-dam from 1988 until 1991. Henri then led application and marketing efforts in component test, defense systems, signal generation, microwave switching, IC test, EMC test, signal monitoring, and phase noise measurements. In 1999, he was promoted to senior marketing manager of Component Test Division (CTD). In 2004, Henri became the CTD senior R&D manager where he led all product development activities including product planning, project manage-ment, and technology development. Henri holds a B.S. in Electrical Engineering from UCLA and a M.B.A. from Golden Gate University in San Francisco. Henri also completed an executive education course at Harvard University Business School.

InVITED SPEAKER


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Test & Measurement Equipment: Market Trends and Challenges for Design and ManufacturingRoland Steffen, Executive Vice President, Head of Test and Measurement Division, Rohde & Schwarz

Abstract

Test & Measurement products play an important role in the design process of electronic equipment. They shall shorten the design process by providing the tools for early validation of prototypes. They shall be easy to use, as the designer wants to concentrate on designing his or her product, rather than having a headache on how to verify T&M equipment performance. To be able to measure, T&M equipment has to be of high precision and exceed the physical specifications of the device under test. This puts some unique challenges to the design and manufacturing of T&M equipment. This talk describes some of the challenges and gives examples, how they can be solved. It closes by giving an outlook, what users can expect from future T&M instruments and examines the logic behind these trends.

Biography

After finishing high school and military service, Roland Steffen studied electrical engineering at Technische Hoch-schule in Aachen, Germany. He graduated in 1977 with a master's degree in microwave technology and subsequently joined Rohde & Schwarz as a development engineer for vector voltmeters and network analyzers and from 1980 on for logic analyzers. From 1985 until 1988 he was Head of Development for logic analyzers and from 1988 for GSM protocol analysis. In 1996 he has been appointed Director of Subdivision for Mobile Radio Test Sets. In July 2003 he has been appointed Executive Vice President and has taken over the responsibility for the Test and Measurement Di-vision. He also holds the position of a board member of Hameg Instruments GmbH Germany and of Rohde & Schwarz Messgerätebau, Memmingen.

InVITED SPEAKER


12


Moore Than a CPU: How Moore’s Law is Still Driving Instrumentation TechnologyJin Bains, Vice President of R&D for RF Products, National Instruments

Abstract

In 1965, Gordon Moore made the prediction that IC density would double every 2 years – and many of us attribute the last 50 years of improvements in CPU technology to “Moore’s Law.” Today, improvements in transistor technolo-gy – both digital and microwave – is driving a revolution in the instrumentation world. These improvements are both expanding the capabilities of instruments in the traditional sense – and expanding the range of applications our cus-tomers can solve with instrumentation. In this presentation, you will learn about some of the key technologies driving instrumentation performance and understand how they are helping engineers solve challenges ranging from radar test to 5G prototyping.

Biography

Jin Bains is the Vice President of R&D for RF products at National Instruments. Jin has been with National Instru-ments since 2006, when he led the formation of the Santa Rosa RF R&D design center. Since then Jin has been involved in a large expansion of RF at National Instruments, through both organic growth and multiple acquisitions. Jin currently manages global RF and Microwave HW and SW R&D teams, developing an array of RF test products and sys-tems that leverage National Instrument's PXI, LabVIEW, and RIO platforms. Prior to joining National Instruments, Jin spent 11+ years at Hewlett-Packard and Agilent Technologies in various roles, including R&D management of RF and baseband test instruments. Jin has a BSEE from UC Davis, where he focused on RF/microwave circuits and systems, and an MSEE from Stanford University, where his emphasis area was communications systems.

InVITED SPEAKER


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5G and Massive MIMO Research and CommercializationJianli Wang, CTO of RF Products, Senior Architect, ZTE

Abstract

This talk will introduce the various scenarios for 5G and some research activities on 5G technologies. Then it will address new research and testing on massive MIMO. The massive MIMO results will be reviewed presenting a path toward the commercialization of the technology to bring it to the market in the near future.

Biography

Jianli Wang received his Ph.D degree in 1998 from Tianjin University, and then went to work for ZTE. He has devel-oped and researched topics on the BTS system of GSM, UMTS and LTE for 15 years prior to joining ZTE. He is the CTO of RF products and the chief architect for wireless at ZTE now.

InVITED SPEAKER


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▼ Tuesday, April 14, 2015 10:00 – 10:20 ▼

Technical SessionsMeasurements & Modeling Track PCB/Connector FocusRoom: 401TU_101: Characterization of PCB Insertion Loss with a New Calibration MethodCheng Ning, Mike Resso, Keysight Technologies

Determination of the PCB unit length loss characteristics are critical for 1) material parameter extraction and PCB electrical performance estimation; 2) evaluation of the passive channel design and PCB material selection; 3) evalu-ation of the PCB fabrication quality, etc. There are several techniques like SET2DIL, Through-Reflection-Line (TRL) as well as Automatic Fixture Removal (AFR) with 2x through fixtures that can be utilized to characterize the insertion loss of the PCB. In this paper, 1) a new method for characterizing PCB loss by using AFR with 1x open fixtures is proposed. This new method has been proved to have similar accuracy with TRL and AFR with 2x through, but can save much more PCB area and measurement time; 2) based on measurements of transmission lines with different via depth and PCB layers, the measurement bandwidth, accuracy, efficiency and cost of these techniques are compared. This paper should provide help for SI engineers to choose the appropriate technique for their application and better understand the benefits and limitations of these methods.

Design Track: Amplifier FocusRoom: 402A/BTU_102: Multi-Mode Stability Analysis of Power Amplifiers Employing Mixed-Mode ParametersHongfei Yao, IMECAS

Mixed-mode parameters are adopted for multi-mode stability analysis of MMIC power amplifiers. In comparison to the traditional even/odd-mode method, it does not demand strict circuit symmetry. With the aid of this method imple-mented in commercial software, instability sources are quickly found and amended to eliminate the oscillation for a two-stage W-Band power amplifier. Measurements show that the saturated output power is 16.9 dBm with gain of 22 dB at 79 GHz, no oscillation was observed.

RF/Microwave & HSD Measurements/Modeling TrackRoom: 403TU_103: Characterization Using Multi-Purpose Source & Load Pull Tuners (MPT) for Inverse Class F PA First-Pass DesignChristos Tsironis, Focus Microwaves

In order to achieve a first-pass design for a high efficiency inverse Class F power amplifier, the transistor should be characterized precisely. In this paper, a one-tone characterization procedure for CGH40010 transistor by the multi-har-monic source and load-pull tuner system is proposed. During the characterization, the transistor is analyzed in terms of the power added efficiency (PAE) and the output power when the source and load impedances at the fundamental, 2nd and 3rd harmonic frequencies are controlled by the multi-harmonic source and load-pull tuner system. Based on the one-tone characterization results, an inverse Class F PA is designed and fabricated. The measured results of the fabricated inverse Class F PA are analyzed to evaluate the results obtained in the characterization. The fabricated PA offers maximum 79.76% PAE with an output power of 40.02 dBm and a gain of 12.08 dB at 3.5 GHz.

System-Level Measurements/ModelingRoom: 405TU_104: Hybrid Over-the-Air Throughput MeasurementNelson Young, Pace Americas

There is no one simple test to measure the overall performance of a WLAN device. Many tests are used in the indus-try to establish quantifiable metrics for the overall performance. On the system level, the challenges are even greater with the radiated nature of MIMO Wi-Fi radios in multipath environments. Traditionally, throughput measurement is a common figure of merit to compare system performance results. In the development phase, conducted physical layer testing can verify many hardware level parameters. After that, conducted throughput testing can verify system level performance. Finally, radiated throughput testing completes the validation of the product. Two types of radiated throughput test are widely used in the industry to accomplish this – radiated chamber test and Over-the-Air (OTA) test. Each test has its advantages and disadvantages. In this presentation, a new Hybrid Over-the-Air test method is discussed to show how HOTA combines the many advantages of both methods together into one test.


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Systems Engineering TrackRoom: 406TU_105: Power Distribution Control Room Electromagnetic Field Simulation ModelingHao Du, CST

A typical case of power distribution control room is introduced in a full-wave time domain, hybrid simulation model and streamlined multi-conductor transmission line (MTL) model. This method of reinforced concrete wall of a multilay-er structure establishes a streamlined model RLCG parametric circuit based network; the actual laying of the cable bundle, the establishment of multi-conductor transmission line based on the transverse electromagnetic (MTL) model, and the remaining space is used full-wave time domain. This method can effectively avoid the pure full-wave method which cannot be easily used due to the excessive number of meshing problems.

▼ Tuesday, April 14, 2015 10:20 – 10:40 ▼Measurements & Modeling Track PCB/Connector FocusRoom: 401TU_201: Testing High Speed PCBs with Vector Network AnalyzersWalter Weiss, Rohde & Schwarz

The production of PCBs with high speed digital lines is usually constantly monitored as part of quality control. In the past this was done by using a TDR based approach. Nowadays, as the used clock rates are constantly increasing and also more PCBs use such single-ended or differential lines, testing with a VNA is getting becoming more popular. The solution based on a VNA has clear technical advantages; especially if it comes to higher frequencies. In addition it provides significant commercial benefits compared to TDR.

Design Track: Amplifier FocusRoom: 402A/BTU_202: A Simple Method for Changing the Frequency Range of an RF Power Amplifier CircuitDonna Vigneri, Freescale Semiconductor

A simple method is described to change an RF amplifier circuit created to operate at one frequency range to oper-ate at another frequency range, without completely redesigning and optimizing the circuit using microwave design software, creating a new circuit board, or replacing a large number of expensive components. Rather, the approach requires only free Smith chart and transmission line calculator software available on the Web and a few inexpensive passive components. The circuit in the described example took only about one day’s work and cost very little. The paper describes the steps taken to obtain performance virtually identical to that of the original circuit and provides information about where to find the software tools as well as a reference design. While the example amplifier was converted from operating between 450 and 520 MHz to 350 and 470 MHz, the technique can be used with other RF power transistors, RF output powers, frequency ranges and bandwidth extensions.

RF/Microwave & HSD Measurements/Modeling TrackRoom: 403TU_203: High Speed Hybrid Active Injection Load-Pull (HAILP)Christos Tsironis, Focus Microwaves

This paper presents a new prediction based hybrid active injection load-pull system. This new system greatly improves the measurement time. The hybrid active system overcomes the limitations of traditional passive load-pull system using active injection to compensate for the inherent loss of the passive elements. In direct comparison with pure active load-pull, the hybrid active system offers a higher power handling capability, and is significantly less complex. The impedance synthesis speed is derived from newly-developed algorithms which predict the required active injec-tion amplitude and phase to reach the target impedance. Experimentally, this corresponds to speeds of 80 to 150 milliseconds per impedance point for the DUT (based on compression level of the DUT). Compared to the 1.5 second average impedance synthesis time of a traditional passive load-pull system, the prediction based hybrid load-pull system is an order of magnitude faster. Moreover, the hybrid active injection system is on par with the average per impedance time (114 milliseconds) of current generation pure active load-pull systems.


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System-Level Measurements/ModelingRoom: 405TU_204: WLAN 802.11ad - Spectrum and Modulation Measurements in the 60 GHz RangeWolfgang Wendler, Martin Schmähling, Rohde & Schwarz

Increasing data rates like HD streaming or other applications drive the WLAN standard to cover wider bandwidth like 2 GHz, which is available in the microwave range only. The WLAN 802.11ad standard for very high throughput (6.75 Gbps) short range transmissions of a few meters is available in the frequency range from 57 to 66 GHz. However, spectrum measurements like the spectrum emission mask measurement or adjacent channel leakage ratio are challenging for this frequency range and an analyzer is needed, where the spectrum is unambiguous without unwant-ed mixing products or images. For maximum dynamic range the input level at the down-converter has to be adjusted. Pre-selection up to 67 GHz and internal attenuator stages help. In addition, the measurement of modulation accuracy of the signal with a symbol rate of 1.76 GHz makes a wideband signal capture necessary to calculate EVM perfor-mance. All these requirements are covered along with modern signal analyzers in combination with digital oscillo-scopes.

Systems Engineering TrackRoom: 406TU_205: Simulation Approach for MIMO Antenna Diversity StrategiesPeter Futter, Altair Development S.A.

4G mobile technologies, like LTE, target increased bandwidth to deliver higher data speeds, improved network capaci-ty and better spectrum utilization. MIMO strategies are exploited to provide better channel performance. Antenna de-sign requirements are multi-faceted: multi-band performance with limited antenna volume; in the proximity of densely integrated components; delivering low mutual coupling; and good mean effective gain (MEG) for good MIMO perfor-mance. Although, the continuing trend towards larger tablet-like device form-factors might not necessarily imply larger antenna volume (devices have become thinner), the increase in PCB area offers more freedom with respect to where antennas are placed on the device. This is especially useful for MIMO where both individual and coupled element performance must be optimized. In this paper, we investigate a simulation approach for mobile MIMO antenna design. Specifically, the use of FEKO’s characteristic mode analysis (CMA) is applied to understand the modal behavior of the structures for optimum element placement to meet diversity strategy goals. This approach provides insight towards a more robust design practice.

▼ Tuesday, April 14, 2015 10:40 – 11:00 ▼Measurements & Modeling Track PCB/Connector FocusRoom: 401TU_301: Challenges to Perform Reliable, Repeatable RF Measurements Using Applying RF Test Probes on Board to Board RF ConnectorsChristophe Masnou, Radiall

Test engineers encounter the challenge of measuring RF signals in electronic circuit boards on the fly in a produc-tion environment. The high production rates, together with the increasing number of RF coaxial connectors on circuit boards, demand for more reliable and repeatable test methods using connectorized test probes. This presentation will compare the different methods and cost using conventional RF connector adapters with low mating cycles or using connectorized RF test probes with high mating cycles. The parameters which influence the stability of measure-ments will be discussed. Observations and test results will be shared. Recommendations will be proposed for the design optimization of connectorized RF test probes as well as for their proper use in production.

Design Track: Amplifier FocusRoom: 402A/BTU_302: ET Test Solution and Result AnalysisZhigang Ma, Lichun Wang, Rohde & Schwarz

Envelope tracking is an adaptive power supply scheme for improving the energy efficiency of RF PA. Comparing the traditional PA test solution with a signal generator and spectrum analyzer, the new PA test with an ET function needs an additional signal generator to provide an envelope signal to the DC modulator. Based on the R&S SMW and FSW, a new compact test solution is presented. Real test environment and results proved this solution to be useful and efficient for customers.


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RF/Microwave & HSD Measurements/Modeling TrackRoom: 403 TU_303: A New Method for Noise Figure Measurement Base on Modern VNAYangzhe Li, Keysight Technologies

The noise figure of a receiver is an important specification for radar, communication system and other electronic instruments. It will directly influence the receiver sensitivity. Determining how to accurately measure the noise figure receiver is a big challenge. The traditional method is the Y-Factor which uses a noise figure analyzer and spectrum analyzer. This paper will introduce a new method for noise figure measurement based on a modern VNA. This paper will illustrate the difference of measurement theory between the cold source method and Y-Factor method for measur-ing noise figure. Then it shows the advantages and disadvantages of the two methods. It will also give the result for noise figure measurement.

System-Level Measurements/ModelingRoom: 405TU_304: From 802.11a to 802.11ah: A Survey of the New Features Available in 802.11ad, 802.11af and 802.11ahDavid Hall, National Instruments

Over the past decade, the evolution of the IEEE 802.11 standard has produced variants that result in higher data rates and better channel robustness. Although the 802.11ac standard is one of the most recently popular revisions due to its adoption as a next generation Wi-Fi technology – additional 802.11 revisions are imminent. This paper pro-vides a survey of various 802.11 technologies – with a focus on in-work technologies such as 802.11ad, 802.11af and 802.11ah. This paper will not only compare and contrast the physical layers of ‘ad’, ‘af’, ‘ah’ with widespread Wi-Fi technologies such as 802.11 a, b, g and ac – but will explain the range of applications driving new standards development. The paper will also compare and contrast 802.11ad, 802.11af and 802.11ah with competing alternate technologies such as Bluetooth, ZigBee and UWB. As a result, attendees will gain a comprehensive understanding of 802.11 standards development as well as the design and test considerations required for development of wireless LAN devices.

Systems Engineering TrackRoom: 406TU_305: Addressing Multi-Channel Synchronization and Calibration Needs for MIMO TestingEric Hsu, Sheri Detomasi, Keysight Technologies

To improve wireless communications data rates and signal quality, MIMO and beamforming spatial multiplexing is becoming a more common requirement for many modern communications standards like 802.11n, 802.11ac, 3GPP LTE, WiMAX, 4G and 5G massive MIMO which is still being defined. As the number of antennas grows and beamform-ing is added, the verification tests become more complicated. This paper provides an overview of different multi-an-tenna transmission techniques and describes the critical beamforming test needed to verify the RF antenna design. The presentation will explore the importance of cross-channel synchronization and measurement calibration in the verification process. Measurement examples will also be provided.


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▼ Tuesday, April 14, 2015 11:30 – 11:50 ▼Design Track: Amplifier FocusRoom: 402A/BTU_402: A High Voltage GaN HEMT Power Amplifier Design for Envelope TrackingZhancang Wang, Microsoft

In this paper, a high voltage Class F-1 GaN HEMT power amplifier (PA) was developed and optimized for envelope tracking (ET) over 920 to 960 MHz. The design was facilitated by microstrip harmonic tuning. The PA achieved a high efficiency greater than 70% across the band by delivering over 25 W average power. It was optimized for ET, compared with Class A/AB power amplifiers based on 28 V GaN HEMT and GaAs HV-HBT gain efficiency trajectories, this work obtained superior ET system efficiency of back-off and predistortion linearization capability, respectively, with three metrics proposed for ET PA selection.

RF/Microwave & HSD Measurements/Modeling TrackRoom: 403 TU_403: Applying the Y-Factor Method for Noise Factor Measurements of LNAsDavid Hall, National Instruments

Noise figure (NF) remains one of the most crucial measurements of low noise amplifiers (LNA). Because the LNA is one of the first components in a receiver, the noise figure (along with the gain) of the LNA often drives the noise figure of the receiver. One of the most common techniques to measure noise figure of LNA’s or demodulator/transceivers is the Y-factor method. The process of measuring the noise figure of an RF component using the Y-factor method involves two steps: first a calibration step, and second a measurement step. First, in the calibration step, a noise source is connected to the input port of the RF signal analyzer. Using this configuration, you can measure the noise figure of the signal analyzer. The second measurement configuration involves a noise source connected to the input port of the DUT. With a noise source connected to the input of the DUT – either a LNA or a demodulator – you can essentially model the cascaded noise figure of the DUT in conjunction with the signal analyzer. By measuring the DUT gain, you can calculate the DUT noise figure by applying the Friis equation for cascaded noise figure. In this paper, NI provides a tutorial on how to accurately measure noise floor using the Y-factor method. As a result of this paper, attendees will gain a practical understanding how to apply this measurement technique.

System-Level Measurements/ModelingRoom: 405TU_404: 16 Bit Vertical Resolution on OscilloscopesMatthias Beer, Rohde & Schwarz

A/D converters which are typically used in digital oscilloscopes are limited to 8 bits resolution with a typical ENOB in the range of 5 to 6 bits. To display signals more sharply and to discover signals which are masked by noise, a higher vertical resolution for oscilloscopes is beneficial. To achieve a higher vertical resolution, a digital lowpass filter can be used after the A/D converter. This filtering reduces the noise power which, in return, increases the signal-to-noise ratio of the measurement and results in a higher vertical resolution.

Systems Engineering TrackRoom: 406TU_405: Multiple Entities, Base Stations Efficient Testing of Real Life ScenariosFrank-Werner Thuemmler, Rohde & Schwarz

When a UE reaches the cell border it normally changes from one to another BS by hard or soft handover. But when talking about better utilization of the network, higher data rates and reception reliability as well as interference re-duction, one modern approach is called Coordinated Multipoint (CoMP) - like specified in 4G LTE Advanced. This new technology becomes especially important at cell borders, where the transmitted energy of each eNB is rather small. A further essential requirement is the simulation of fading conditions and/or applying additional AWGN for each trans-mission channel. In this session you will see how easily signals under multiple entity conditions can be generated. It shows stepwise the signal setup and the main benefits of this T&M approach.


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▼ Tuesday, April 14, 2015 11:50 – 12:10 ▼Measurements & Modeling Track: PCB/Connector FocusRoom: 401TU_501: Material for Improved RFPA PerformanceBin Zhang, Arlon

This session will discuss basic RF material and selection guidelines. It will also highlight high thermally conductive material versus RF power amplifier performance.

Design Track: Amplifier FocusRoom: 402A/BTU_502: Measuring the Time-Alignment in Envelope Tracking Power AmplifiersXiang Feng, Keysight Technologies

Envelope tracking (ET) is a power supply technique for improving the efficiency of the PA by constantly adjusting the power supply voltage applied to the PA, in synchronism with the envelope of the RF signal. ET implementation difficul-ties include the requirements for very high bandwidth power supply and accurate envelope signal for power supply, which not only means accurate power level, but also strict time alignment between the output of power supply and the RF input of the PA. Usually the requirement for the synchronization accuracy is less than 0.1 ns. Measuring the time difference between the output of power supply and the RF input of the PA is critical during the design and debug phase. It is usually not practical to just monitor the signal at two ports directly using the instruments like scope, so we often do the time alignment by performing the measurement at output of the PA. This paper describes time align-ment procedure in an ET PA system and the measurement scheme. The performance of an ET PA system with differ-ence delay between two control inputs—RF input power and supply voltage is shown.

RF/Microwave & HSD Measurements/Modeling TrackRoom: 403 TU_503: Noise Parameter Measurement System Verification Using On-Wafer Passive AttenuatorChristos Tsironis, Focus Microwaves

This paper presents recent noise parameters measurement results of a fixed, on-wafer passive attenuator as a means to verify the repeatability and accuracy of a noise parameter measurement system. Repeatability and accuracy are the most important factors for any system acceptance verification and should be measured and compared with known passive standards whose theoretical noise parameters can be accurately computed.

System-Level Measurements/ModelingRoom: 405 TU_504: Using Real Time Scope to Fully Analyze High Speed Digital SignalsQiujie Lu, Keysight Technologies

With the continuous increase in the speed of popular digital interfaces, more challenges, considerations and require-ments are also added for fully analyzing and characterizing these signals. Real time scopes, being the most popular and easy-to-use instrument for engineers, are equipped as powerful analysis tools to get the results more quickly, more accurately, and even more meaningful. In this paper, the difficulties and challenges are introduced, and methods of using scopes to fully analyze high speed digital signals are emphasized.

Systems Engineering TrackRoom: 406TU_505: Improving Throughput of Multiport Network Analysis Using PXIe Vector Network AnalyzerTakuya Hirato, Keysight Technologies

This paper compares multiport vector network analyzer (VNA) and conventional multiport solutions using the VNA with external switch matrix. The multiport VNA provides higher performance by eliminating loss associated with switches, and faster speed with simultaneous data capture with multiple receivers. New approach of multiport network analysis using PXIe VNA is introduced that enables improved throughput with more flexible test configurations than convention-al benchtop solutions.


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▼ Tuesday, April 14, 2015 12:10 – 12:30 ▼ Measurements & Modeling Track: PCB/Connector FocusRoom: 401TU_601: Applying VNA for PCB Power Plane Ultra-Low Impedance and Inductance MeasurementsKo, Keysight Technologies

With processing speed and data rates constantly increasing, the PCB power plane design is important for providing stable voltage and current for SMD ICs and components in the power distribution network. Even when the device operating frequency is going to the GHz range, it is the criteria to make the power plane inductance to be as small as possible. Typical power plane inductance is designed to be in the nH range and the corresponding reactive impedance will be in the mOhm range. The vector network analyzer (VNA) has been widely employed to measure the transmission characteristics in the frequency domain as well as in the time domain even with eye diagrams, but it is challenging for VNA reflection measurements to determine accurately for small impedance in the mOhm range. In this paper, we shall introduce an innovative 2-Port VNA measurement technique which is the RF equivalent to the Kelvin DC technique. We shall further verify the PCB power plane computer simulated results with its measured results after VNA calibration and fixture de-embedding.

Design Track: Amplifier FocusRoom: 402A/BTU_602: Envelope Tracking for Uplink LTE Carrier AggregationFlorinel Balteanu, Skyworks Solutions

The demand for higher data rates has led to the utilization of higher frequency bands, where power amplifiers (PA) are inherently less linear, as well as carrier aggregation (CA) where linearity requirements are more stringent. In addition, cost reducing tactics for large volume applications naturally lead to CMOS based PAs which are less linear than the commonly used GaAs PAs. Envelope tracking techniques, together with digital signal processing (DSP), provide a method for achieving the linearity and efficiency required for CMOS PAs. This paper reviews the new technical chal-lenges associated with envelope tracking methods for high data rate PAs utilized in carrier aggregation systems. It also presents LTE carrier aggregation CMOS power amplifiers and introduces the concept of a three port power am-plifier which is suited for use in conjunction with an ET System. Contiguous and non-contiguous ET solutions are also presented. Also a true digital envelope interface is proposed for this system which is used with a Class E CMOS PA.

RF/Microwave & HSD Measurements/Modeling TrackRoom: 403 TU_603: Methods to Improve Noise Figure Measurement Accuracy in Signal AnalyzerYanhua Rui, Guoquan Lu, Keysight Technologies

Noise figure (NF) is often the key performance parameter in RF and microwave systems. Measurement uncertainty (MU) affects the device specifications that can be obtained. Signal analyzers with noise figure capability are more widely used to measure the noise figure and gain of the Device Under Test (DUT). The fundamental concept of noise figure measurement in signal analyzer is the Y-factor method, just the same as noise figure analyzer. As a signal analyzer is primarily designed for high dynamic range rather than low noise figure, the measurement results usually includes larger measurement uncertainty than a noise figure analyzer. This paper includes a detailed analysis of the measurement uncertainty of the noise figure measurement using a signal analyzer, describes some practical methods that can improve the noise figure measurement accuracy, and provides the simulation and test results. Choosing an appropriate noise source can always improve the measurement accuracy, even when the DUT gain is high. When the DUT gain is low, using an external low noise preamplifier can improve the measurement accuracy significantly. An ex-ample shows the measurement accuracy improvements after using a smart preamplifier. These methods can be used together to optimize the noise figure measurement and get more accurate results using the Y-factor method.

System-Level Measurements/ModelingRoom: 405 TU_604: Using Sequencer Technique to Speed Up Femtocell MeasurementShanshan Cong, Keysight Technologies

Small cell, especially Femtocell, manufacturers are speed sensitive. Traditional test methods provide a high dynamic range to meet Femtocell conformance testing requirements, however they are time consuming. A new technique Se-quencer (Sequence analyzer), which is used on the new Femtocell one box tester EXF, allows you test Femtocell with good enough performance and fast test speed to reduce testing costs. In this paper, we will introduce what Sequenc-er is, how Sequencer works, and how significant test speed improves the Sequencer. A comparison between tradition-al one button measurement and Sequencer will be discussed in this paper. We will also discuss the advantages to traditional femtocell manufactory test procedure by using a new test procedure based on Sequencer.


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Systems Engineering TrackRoom: 406TU_605: Accurate Simulation of Measurement ChambersPeter Futter, Altair Development S.A; Jinlong Jiao, Altair Engineering Software; Jordi Soler, Altair Engineering Inc.

EMC and antenna measurements can be time consuming, and chamber time is typically a limited resource. Further-more, early in the design process, prototypes may not yet be available for measurement, or it may be a design goal to reduce the number of intermediate prototypes in order to reduce costs. All of these factors are strong motivators to be able to replicate measurement chamber setups virtually, utilizing electromagnetic solvers to predict the result or outcome (pass/fail) of the measurement setup numerically. This can be applied to EMC radiation immunity, EMI emis-sion or standard antenna performance measurements. In the past, due to the large range of frequencies, different types of chambers, scale of complexity of the DUTs and several other factors, it was considered too computationally demanding to simulate chambers. But advances in numerical methods, combined with computer performance im-provements have made virtual simulation of measurement setup both feasible and efficient. This paper will present a review of novel simulation strategies that have been applied to a range of different measurement setups, including anechoic and reverberation chambers. It will also discuss and compare the different suitability, scalability and accura-cy of different numerical methods including frequency and time domain, hybridization and special enhancements.

▼ Tuesday, April 14, 2015 13:30 – 14:10 ▼

WorkshopsMeasurements & Modeling Track: PCB/Connector FocusRoom: 401WS_TU101: Measurement of the Effect of Laminate Material Properties on the Temperature Rise of High Frequency DevicesArt Aguayo, Rogers Corp.

Polymer composite circuit laminates are inherently low thermal conductivity (TC) materials compared to metals or ceramics. However, in circumstance where the heat must be removed through the dielectric, a moderate increase in the dielectric’s TC can substantially reduce the temperature rise. We compare the performance of a number of circuit laminate materials with TC values ranging from 0.3 to 1.4 W/m-K. The use of thermal vias reduces the temperature rise by a factor of 3 to 4 for all materials tested. The RF trace heating depended on both TC and loss. The trace heat-ing of a low loss, high TC material is less than 1/10th that of FR4.

Design Track: Amplifier FocusRoom: 402A/BWS_TU102: DPD, ET and Load-Pull: Three PA Measurement Techniques Every Engineer Should KnowDavid Hall, National Instruments

The drive to improve PA efficiency and linearity has resulted in new measurement techniques that are increasing the complexity of PA characterization. In this tutorial, we will explain three important test requirements and challenges of modern cellular handset PAs including: digital predistortion (DPD), envelope tracking characterization and load-pull. DPD effectively linearizes a PA at higher output powers and improves the likelihood that the device will meet stan-dard-specific transmission requirements for modulation quality and spectral purity. Envelope tracking is aimed at im-proving efficiency for high-PAPR waveforms by dynamically changing the efficiency profile of the device. Finally, load-pull enables engineers to improve the overall efficiency of the device by finding the optimal input and output impedance of the power transistor. In this tutorial, NI will explain the fundamental theory of operation for each of these technologies – and provide practical guidance for testing a PA under DPD, ET or load-pull conditions.

RF/Microwave & HSD Measurements/Modeling TrackRoom: 403 WS_TU103: Millimeter Wave VNA Development and ApplicationJenny Ye, Anritsu

With the increase in the millimeter wave test requirements, a new platform has launched a (VNA) test solution that is based on the nonlinear transmission line technology up to 125 or 145 GHz (coaxial) vector network analyzer. Thanks to research and development in nonlinear transmission line technology (NLTL), which solutions covering a wide frequency (40 kHz to 125 GHz / 145 GHz), small size, light weight, high stability, and can realize ALC power sweep function. The high-performance network analyzer has a dual vector network structure and can cover 40 kHz to 70 GHz. Multiple measurement functions on this plat-form integrates the industry's highest performance pulse measurement (2.5 ns time resolution), dual-source true differential measurements, and noise figure measurements. NLTL based technology also enables a 40 GHz handheld network analyzer, and compact network analyzer to meet customer millimeter wave testing for different applications.

Sponsored by:

Sponsored by:

Sponsored by:


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System-Level Measurements/Modeling TrackRoom: 405 WS_TU104: Simulation Enabled 5G Antenna DesignCST

Mobile communication speed requirements are rapidly increasing as the number, variety and function of mobile con-sumer devices flourish. To meet these needs, research and development regarding fifth generation (5G) antennas is already underway. In this workshop we will discuss workflow and simulation features in CST STUDIO SUITE that are enabling antenna engineers to envision and design the next generation of mobile device antennas. Compact, smart antenna array concepts provide the necessary data performance, but pose a unique challenge for antenna designers. First, we will demonstrate the use of Antenna Magus to synthesize and rapidly design array elements and initial array layouts, using the link between Antenna Magus and CST STUDIO SUITE to quickly create these designs in 3D. This is supplemented by additional phased array design tools within CST STUDIO SUITE. Next, the solvers and high-per-formance computing techniques available in CST STUDIO SUITE will be shown, in order to demonstrate how a 3D EM simulation of the full mobile device can be carried out efficiently. This will include the specialized post processing methods for MIMO calculations, such as envelope calculations for parameterized phase.

Systems Engineering TrackRoom: 406WS_TU105: LTE & LTE-A 4x4 MIMO Throughput Test Solution Based on SystemVue and PXILei Yue, Keysight Technologies

Keysight introduces a MIMO OTA test solution based on Keysight SystemVue and PXI modular. With the urgent needs of 5G technologies evolving, 4x4 up to 8x8 MIMO capabilities to effectively measure and test must have rapid devel-opment and breakthroughs; however system engineers are confronted with many challenges of design and testing. In this presentation, the author uses the model libraries of LTE/LTE-A baseband verification and up to 8x8 MIMO chan-nel of SystemVue to complete the throughput simulation and downloads the waveform generated by SystemVue into PXI modular to test and verify the prototype and its throughput.

▼ Tuesday, April 14, 2015 14:15 – 14:55 ▼Measurements & Modeling Track: PCB/Connector FocusRoom: 401WS_TU201: Impact of Cable Assemblies for Test and MeasurementW. L. Gore

Test systems typically consist of instruments and accessories. Cable assembly stability and durability will affect the stability and accuracy of the test system. In order to optimize the performance of the largest test systems, test engi-neers need to understand the impact of cable assemblies for test systems. Engineers expect the new cable assem-bly to maintain stable phase characteristics of steady increase, but want to use them hundreds of times over a few months or after bending and still be able to maintain stable amplitude and phase characteristics. Engineers do not buy replacement cable assemblies often, thereby improving test efficiency, saving test time and reducing the overall cost of test. This session discusses how the cable assembly and durability will have what effect on the test system, such as cable insertion loss, VSWR, phase stable performance leveled network analyzers, signal analyzers, oscillo-scopes test and measurement systems affected. Based on unique materials technology (ePTFE expanded polytet-rafluoroethylene), and Gore's proprietary inside armored cable, 9-layer structure solutions, the cable assemblies will perform in harsh environments, and even bend 10 million times while still able to maintain stable phase characteris-tics.

Design Track: Amplifier Focus Room 402A/BWS_TU202: Next Generation LDMOS for Multi-Markets NXP

NXP's new generation (Gen. 9) LDMOS is introduced including RF performance and ruggedness which is improved from previous generations. Also covered are LDMOS applications in A/D, ISM, etc.

Sponsored by:

Sponsored by:

Sponsored by:

Sponsored by:


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RF/Microwave & HSD Measurements/Modeling TrackRoom: 403 WS_TU203: Complete Millimeter Wave Test System Includes Noise Figure MeasurementsKeysight Technologies

Many commercial millimeter wave systems have been transferred from the military and consumer applications. These new applications require miniaturization and low-cost design, typically using MMIC technology. However, similar radio frequency applications, their performance must be guaranteed by the high-performance test, such as the gain and phase flatness, receiver sensitivity, noise figure and gain compression. Until now, all of these parameters needed a range of instruments on the rack and required connection to a variety of different instruments. In this article, we will show a new 4-port test system to measure millimeter wave converter and down-converter, which contains two millime-ter wave RF ports and two ports that can measure all of the above in the case of single connection parameters.

System-Level Measurements/Modeling TrackRoom: 405WS_TU204: The Design and Optimization of Power Amplifiers Based on Test TechniquesHongwen Yang, Rohde & Schwarz

The power amplifier is the most important component of the RF front-end, with the coming of 4G and THz era. The higher frequency, wider bandwidth and higher efficiency of the power amplifier, brings a lot of challenges for design and test. This topic will discuss a new flow of PA design based on test and modeling, especially with load-pull tech-niques to improve the performance of PAs. And further, Rohde & Schwarz together with Focus Microwave will setup the world’s first and most advanced harmonic active injection load-pull system in the workshop.

Systems Engineering TrackRoom: 406WS_TU205: Understanding TD-LTELocker Jiang, Qorvo

The global transition to LTE networks is driving a dramatic increase in smartphone complexity and creating new chal-lenges for design engineers. Join us to learn more about the far-reaching impact that TD-LTE will have on the future development of the global mobile Internet market. While many of the first 4G LTE mobile network deployments in the United States, Japan, South Korea and some European countries are based on Frequency-Division Duplex (FDD-LTE), the number of Time-Division (TD-LTE) networks is very likely to catch up in three to five years. The TD-LTE market received a major boost in December 2013, when China issued TD-LTE licenses to its three major mobile operators. China - with more than 800 million mobile subscribers - offers the largest potential market for TD-LTE. Big mobile carriers outside of China also are adopting TD-LTE, too, including Sprint in the U.S. and SoftBank in Japan. More than 40 TD-LTE commercial networks have launched in 26 countries, with more than 76 in progress or planned. Learn how to select the best RF solutions for challenging LTE mobile applications worldwide.

▼ Wednesday, April 15, 2015 09:30 – 09:50 ▼

Technical SessionsDesign Track: Antennas/IoT/MMICsRoom: 401WE_101: Active Antenna and RF Systems Deliver Critical Connectivity for Wireless Devices – From Smartphones to IoTQuanxin Wang, Jeff Shamblin, Ethertronics Inc.

From smartphones and tablets to M2M and the Internet of Things (IoT), there is no question that the global mobile device market is booming. Coupled with 4G, which promises lightning fast speeds and increased coverage, the market is expected to grow even more. All this great news, however, does not come without challenge. In particular, the 4G experience is only as good as the device’s connection to the network. Both OEMs and operators need to find solutions to overcome a variety of challenges, such as an increasing number of antennas needed for Multiple Input, Multiple Output (MIMO); a wide range of frequency bands; the continued increase in features and functionality being integrated into devices; and the “thin” trend. In smartphones/tablets, the screen/battery take the majority of space, and wearable’s unique form factors leave little room for antennas, which are often in less-than-ideal locations leading to poor performance and slow download speeds. This session will address solutions for these challenges, particularly how a move to “active” antenna and RF systems is critical for achieving high performance.

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5G ForumRoom: 402A/BWE_102: Plenary Talks

Software Defined Air Interface (SDAI) for 5G and IoTDr. Zhengang Pan, Principal Scientist, China Mobile Research Institute

Abstract

Mobile Internet and Internet of Things have been widely recognized as the two major driven forces of next generation wireless communication systems by a global community. A hidden factor behind this is the extreme diverse perfor-mance requirements of rich applications under these two umbrellas, from optical-fiber-like access to massive low data rate and low power connections, from extreme delay sensitive links to spare burst transmission. A globally optimized air interface based on traditional design principle will no longer perfectly match the requirement of each individual case. A Software Defined Air Interface (SDAI) concept is explored to make every aspect of wireless link tunable. This talk will share China Mobile's latest developments and future plan on SDAI concept.

Biography

Zhengang Pan, IEEE Senior Member, principle staff of Green Communication Research Center (GCRC) of China Mobile Research Institute (CMRI), is now leading a team working on the key technologies of next generation (5G) wireless communication systems. Dr. Pan is also the vice-chair of technical WG of China IMT-2020 PG. Before joining CMRI, Dr. Pan was working with Hong Kong based ASTRI for more than 6 years where he has been involved in multiple techni-cal fields, from wireless communication (Wi-Fi, WiMax, LTE), to mobile digital TV (T-DMB, DVB-T/H, CMMB), to wireline broadband access (HomePlug, MoCA), in both system/algorithm design and terminal SoC chip implementation. Dr. Pan has also been working with NTT DoCoMo Beijing Communication Labs Co. Ltd., on the frontier research for 4G wireless communication standards, including 802.11n, 802.16d/e, HSPA and LTE. Dr. Pan received his Ph.D degree in 2004, from Department of Electrical and Electronic Engineering, the University of Hong Kong. Dr. Pan is expertised in many technical fields including time/frequency/sampling synchronization technology for singlecarrier/ multi-carrier (OFDM/A) based system, channel estimation, forward error correction coding, multiple antennas systems (MIMO) and space-time processing/coding, cross layer optimization and so on. Dr. Pan has published more than 60+ papers in top journals and international conferences, and filed 50+ patents with 30+ granted so far.

5G, A Pathway to the Networked SocietyHai Wang, Head of Ericsson’s China Radio Research Lab

Abstract

This talk contains a high level overview of 5G benefits, expectations and technology components as key enabler. Ericsson 5G concept will be briefly presented as well as an update of Ericsson 5G test bed.

Biography

In his capacity as head of China Radio Research Lab (CRRL) and a research site manager, Wang Hai is responsible for two radio research areas (Wireless Access Networks, Radio Access Technologies) in Ericsson China. Being an in-tegrated part of Ericsson Research, CRRL conducts in-depth research in WCDMA/HSPA, LTE and 5G to drive selected topics in 3GPP standardization as well as to support product development. Utilizing the rich knowledge obtained from research projects and test-beds CRRL actively interacts with operators and research communities in China on the development of new technologies. Wang Hai joined Ericsson in March 1998 after receiving his Ph.D. degree in Beijing University of Posts and Telecommunications (BUPT). From June to December 1998 he worked at Ericsson Research in Stockholm as a visiting researcher. In 1999 he established China Radio Research Lab and now the lab hosts about 20 highly talented research staff. Hai holds 40 patents in WCDMA and LTE.


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HSD/EMC Measurement & Modeling TrackRoom: 403WE_103: Understanding Fully-Differential Amplifier Specifications and the Benefits of FDAs When Driving ADCsAndrew Du, Texas Instruments

In today’s world, most high-speed ADCs have differential inputs. This helps enable higher performance specifically in relation to second order artifacts. To support this input architecture, engineers must design the signal chain to inter-face to the ADC differentially. It is very easy to assume that one must choose a balun along the chain for best perfor-mance, despite the coupling issues this entails in some applications. However, this is not always the case, especially in test and measurements where the DC component is needed for some applications. In this article we will review the basics of fully-differential amplifiers (FDA), how to read an FDA datasheet (including terminology), and how to interface the signal chain using an FDA for a balun-type functionality with additional performance.

System-Level Measurements/Modeling: Radar FocusRoom: 405WE_104: Integrated Framework for Radar DesignGent Paparisto, National Instruments (formerly AWR Corp.)

Modern radar systems are very complex and depend heavily on advanced signal processing algorithms to improve the detection performance of the radar. To overcome these challenges, there is an increasing need for cooperation between digital and RF/microwave engineers such that the overall system performance metrics are jointly optimized across the two disparate domains. This presentation shows how NI AWR Design Environment can be combined with LabVIEW and PXI instruments to design, validate and prototype a radar system. NI AWR integrated framework provides a unique avenue for digital and RF engineers, as well as system engineers, to collaborate on a complex radar system.

Systems Engineering TrackRoom: 406WS_105: Research and Applications on In-Circuit Test of Signal Processing BoardsDian Zeng, Beijing Herotec Test & Control Technology Corp.

ICT is short for In Circuit Test, a method of component test. It usually tests electronic components on the PCB. ICT can search for electronic defects on the PCB production process, such as an open circuit, short, component miss, component fault, component damage and so on. This paper explores the test principle and application of auto test for signal processing boards.

▼ Wednesday, April 15, 2015 09:50 – 10:10 ▼Design Track Antennas/IoT/MMICsRoom: 401WE_201: New IoT RF & Protocol TestingZhigang Ma, Yu Feng, Rohde Schwarz

The development of Internet of Things (IoT) devices require intensive testing to ensure error free operation. Develop-ers and quality assurance test engineers face the challenges of whole test system integration to create their RF and protocol test system. A general FPGA platform capable to implement various wireless protocols like RFID or NFC has been developed. This paper covers test system integration challenges and achievements of this unique solution. The high performance demodulation algorithms and FPGA implementation will be presented.

5G ForumRoom: 402A/BWE_202: 5G Panel Session: Keysight Technologies, Rohde & Schwarz, National Instruments, MACOM, China Mobile, Ericsson and Shanghai Tech

The EDI CON 5G Panel is a moderated round table discussion among experts from Keysight Technologies, Rohde & Schwarz, National Instruments, MACOM, China Mobile, Ericsson and Shanghai Tech. This panel will examine the challenges to device design and device/system testing for 5G technologies such as mmWave/TeraHertz transceivers, Massive MIMO, HetNets/small cells, AESA radios, SDR, and other related technologies for the next generation of cellular communications. Panelists include:


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Zhengang Pan, Principal Scientist, China Mobile Research Institute

Zhengang Pan, IEEE Senior Member, principle staff of Green Communication Research Center (GCRC) of China Mobile Research Institute (CMRI), is now leading a team working on the key technologies of next generation (5G) wireless communication systems. Dr. Pan is also the vice-chair of technical WG of China IMT-2020 PG. Before joining CMRI, Dr. Pan was working with Hong Kong based ASTRI for more than 6 years where he has been involved in multiple technical fields, from wireless communication (Wi-Fi, WiMax, LTE), to mobile digital TV (T-DMB, DVB-T/H, CMMB), to wireline broadband access (HomePlug, MoCA), in both system/algorithm design and terminal SoC chip implementa-tion. Dr. Pan has also been working with NTT DoCoMo Beijing Communication Labs Co. Ltd., on the frontier research for 4G wireless communication standards, including 802.11n, 802.16d/e, HSPA and LTE. Dr. Pan received his Ph.D degree in year 2004, from Department of Electrical and Electronic Engineering, the University of Hong Kong. Dr. Pan is expertised in many technical fields including time/frequency/sampling synchronization technology for single-carrier/multi-carrier (OFDM/A) based system, channel estimation, forward error correction coding, multiple antennas systems (MIMO) and space-time processing/coding, cross layer optimization and so on. Dr. Pan has published more than 60+ papers in top journals and international conferences, and filed 50+ patents with 30+ granted so far.

Hai Wang, Head of Ericsson’s China Research Lab

In his capacity as head of China Radio Research Lab (CRRL) and a research site manager, Wang Hai is responsible for two radio research areas (Wireless Access Networks, Radio Access Technologies) in Ericsson China. Being an in-tegrated part of Ericsson Research, CRRL conducts in-depth research in WCDMA/HSPA, LTE and 5G to drive selected topics in 3GPP standardization as well as to support product development. Utilizing the rich knowledge obtained from research projects and test-beds CRRL actively interacts with operators and research communities in China on the development of new technologies. Wang Hai joined Ericsson in March 1998 after receiving his Ph.D. degree in Beijing University of Posts and Telecommunications (BUPT). From June to December 1998 he worked at Ericsson Research in Stockholm as a visiting researcher. In 1999 he established China Radio Research Lab and now the lab hosts about 20 highly talented research staff. Hai holds 40 patents in WCDMA and LTE.

Haitao Zhang, R&D Manager of China Communication Center of Keysight Technologies

Haitao Zhang leads the Keysight’s signal source, signal analyzer’s application development in China, including mobile communications standards, WLAN/Bluetooth, Digital TV, GNSS, etc. He also leads the local collaboration with CMRI projects. Mr. Zhang joined HP/Agilent/Keysight in July of 1999, and rotates in multiple product lines, took the roles of technical research and marketing jobs. Mr. Zhang was promoted as the R&D department manager in 2007. Zhang studied at Tsinghua University and received his MEng degree in 1997. He also received a second Bachelor’s Degree of Economics from Tsinghua University.

Ribo Tang, Business Development Manager, Rohde & Schwarz (China)

In 1987, Ribo Tang received the M.E.E.E Degree from 2nd Academy of Ministry of Aerospace Industry in Beijing. After graduate study, he worked in Beijing Institute of Radio Metrology & Measurement. He participated as the project leader in the research projects in Microwave VNA, Microwave Metrology, EMC Test and received the Ministry Science & Technology Progress Award in 1992. From 1996, he worked in Rohde & Schwarz Beijing Office in Sales, Sales Man-ager, and Business Development Manager. He is experienced in 2G, 3G, and 4G development, he is leading the 5G technology strategic development in R&S China.

James Kimery, Director of Marketing, RF and Communications, National Instruments

James Kimery is the director of marketing for RF, Communications and SDR initiatives at National Instruments. In this role, Kimery is responsible for the company’s communication system design and SDR strategies. He also manages NI’s advanced research RF/Communications Lead User Program. Prior to joining NI, he was the director of marketing at Si Labs. Kimery was a founding member of the VXIplug&play Systems Alliance, the Virtual Instrument Software Ar-chitecture working group and the PXI Systems Alliance. He has authored more than 26 technical papers and articles covering a variety of wireless and test/measurement topics. He earned a master’s degree in business administration from the University of Texas at Austin and bachelor’s degree in electrical engineering from Texas A&M University.

Sandra Zhang, Senior Technical Marketing Manager, MACOM

Sandra Zhang eceived her BSEE from University of Science and Technology of China in 1993, and her MSEE from Uni-versity of Massachusetts, Amherst in 1995. She started her career as a Systems and RF Design Engineer in Micro-wave Radio Corporation. In 1999, Sandra joined the New England Design Center of Infineon Technologies as a Senior RFIC Design Engineer. She became the Design Engineering Manager in charge of WLAN product development upon TriQuint’s acquisition of Infineon’s GaAs IC Business Unit in 2002. Sandra designed numerous RFICs and modules for wireless communications with over 100 million units sold. She joined MACOM as the Huawei Global Account Manager in April 2011. Her main focus now is China business development for the Carrier Networks BU.


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Dr. Yang Yang, Professor, Shanghai Tech

Dr. Yang Yang is currently a Professor with the School of Information Science and Technology, ShanghaiTech Universi-ty, and the Director of Shanghai Research Center for Wireless Communications (WiCO). Prior to that, he has served Shanghai Institute of Microsystem and Information Technology (SIMIT), Chinese Academy of Sciences, as a Professor; the Department of Electronic and Electrical Engineering at University College London (UCL), United Kingdom, as a Senior Lecturer; the Department of Electronic and Computer Engineering at Brunel University, United Kingdom, as a Lecturer; and the Department of Information Engineering at The Chinese University of Hong Kong as an Assistant Pro-fessor. His research interests include wireless ad hoc and sensor networks, wireless mesh networks, next generation mobile cellular systems, intelligent transport systems, and wireless testbed development and practical experiments.

HSD/EMC Measurement & Modeling TrackRoom: 403WE_203: Full-Wave Electromagnetic Simulation for SI and EMI in High Speed ConnectorsCheng Sun, Chen Ren, Du Hao, Ming Zhang, CST

Time domain finite integral algorithm-specific model of the real high-speed connectors for full-wave, broadband simula-tion, a simulation can be obtained by S-wide band high-speed connector key indicators.

System-Level Measurements/Modeling: Radar FocusRoom: 405WE_204: Ultra High Definition (UHD) Imaging for Aerospace and Defense ApplicationsNik Dimitrakopoulos, Rohde & Schwarz

In this paper the applications of ultra high definition (UHD) imaging in aerospace and defense (A&D) will be dis-cussed. The need for much higher image resolution implies higher data rate trafficking and more advanced encoding techniques to be implemented.

Systems Engineering TrackRoom: 406WE_205: Next Generation Industrial Innovation and Manufacturing Siemens/Transemic

Siemens introduces new trends in manufacturing and innovation from Siemens' vision and strategy for industry.

▼ Wednesday, April 15, 2015 10:10 – 10:30 ▼Design Track: Antennas/IoT/MMICsRoom: 401WE_301: HFSS Component Model Libraries to Support Enterprise-Level Product Development and the IoT Design Chain Timothy Chen, David Vye, ANSYS

The Internet of Things, unmanned aerial vehicles and continued growth of mobile devices is driving the demand for simulation tools that can be used to design RF/microwave components such as antennas and embedded passives, and also help engineers understand how to integrate and place such components within larger complex structures such as mobile devices and wearable electronics. New capabilities recently introduced into ANSYS HFSS allows engi-neers to design, optimize and share high frequency components across engineering departments and throughout the supply chain, leveraging component IP at higher levels of integration. This presentation looks at how the new compo-nent model library feature with encryption will support this collaboration throughout the design chain, allowing users to encrypt their component model into a black box that can be shared between component designers and system integrators.


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HSD/EMC Measurement & Modeling TrackRoom: 403WE_303: Serial Data Link Analysis with Measurement and IBIS-AMI Simulation CorrelationYi Wang, Zheofan Ma, Luping Liu, Cindy Cui, Keysight Technologies

As serial data rates keep increasing in communication and storage systems, new technologies like equalization are broadly implemented in SerDes receivers and IBIS Algorithmic Modeling Interface (IBIS-AMI) to verify in silicon-system level performance. For system link design, it is a big challenge to find an effective way to accurately correlate the board level signal parameters with the internal performance characterization with SerDes provided tools. Nowadays, oscilloscope vendors provide a general equalization processing function, but do not have chip specific Rx EQ pro-cessing capability. Real-time measurement and IBIS-AMI integration to present the signal performance after internal equalization or other structures will settle the system designing requirement. This paper proposes a new method to process measurable data with IBIS-AMI modeling simulation. Oscilloscope and ADS channel simulator are used to predict the performance after AMI EQ processing and there is also a demonstration on correlation between testing and simulation in 10 Gbps data link.

System-Level Measurements/Modeling Track: Radar FocusRoom: 405WE_304: A Bridge to Connect Antenna Design and Radar SystemChengcheng Xie, Keysight Technologies

In radar system design, the antenna designers usually focus on an antenna’s parameters, such as its gain, size, pattern and the reliability, etc. But what about the parameters effect on the whole radar system? Is there a relation of antenna pattern to the radar’s constant false alarm rate? We try to find a way to integrate the antenna/antenna array to the radar system, which could consider the radar system’s performance according to antenna’s parameters. For ex-ample, the different working modes: search and tracking, the user defined antenna pattern, the shape of the antenna array and the array’s reliability all could be considered in radar system and in the simulation.

Systems Engineering TrackRoom: 406WE_305: Real Time DPD Design-to-PrototypeTakao Inoue, National Instruments

Digital predistortion (DPD) techniques that enhance the linearity of power amplifiers (PA), while improving their effi-ciency, continues to be an important strategy in the design of base station PAs and now increasingly moving into the handset PAs. One challenge is in how to combine the baseband DPD algorithms with RF PA design as a system to ful-ly understand the system performance metrics and iterate on design optimization for both DPD and PA. Because the DPD and PA design/implementation comes from disparate areas with different engineering tools, a unified platform is needed to rapidly innovate and prototype the subsystem. In this presentation, we show how its platform can be used to combine the results from the digital and RF domains to obtain a real time test-bed for rapid design iteration.

▼ Wednesday, April 15, 2015 11:00 – 11:20 ▼Design Track: Antennas/IoT/MMICsRoom: 401WE_401: Design of W-Band MMICs Based on InP HEMT TechniqueHongfei Yao, IMECAS

The key issues, especially the stability problem, in the W-Band MMICs including W-Band low noise amplifiers, power amplifiers, 100 GHz voltage-controlled oscillators and frequency multipliers are presented. Several cases are illustrat-ed with the measurement results also shown. The LNA can cover the full W-Band with more than 20 dB gain and the frequency multiplier has +4.7 dB frequency conversion gain with Po of 5.8 dBm. The VCO's frequency is as high as 103 GHz with more than +7 dBm output power.


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5G ForumRoom: 402A/BWE_302: Massive MIMO System Design and ConsiderationJianbing Yang, Keysight Technologies

Massive MIMO adopts hundreds of antennas at the base station (BS) serving a much smaller number of terminals. The number of terminals that can be simultaneously served is limited due to inability to acquire channel-state infor-mation for an unlimited number of terminals. With an unlimited number of antennas, the transmit power can be made arbitrarily small and the uncorrelated interference and noise can be lost. Therefore, the system can reduce system signaling overhead and reduce the network latency. But, the performance is limited by pilot contamination and CSI acquisition and challenge by low cost RF device, channel calibration and low antenna gain of common channel access such as PBCH, PSS, etc. How to perform test and measurement is a challenging issue when configuring many anten-na connectors. This paper analyzes system design of Massive MIMO: PHY related topic: favorable channel, capacity and energy efficiency, codebook design, CSI feedback and design challenge. T&M related topic: four test solutions will be provided, conducted test, coupling test, OTA test and combined test.

HSD/EMC Measurement & Modeling TrackRoom: 403WE_403: High Speed Circuit Board Clock Circuit EMI Simulation and TestingCheng Sun, Chun Ren, Du Hao, Min Zhang, CST

High-speed circuit board clock simulation and testing of electromagnetic radiation is covered using CST.

System-Level Measurements/Modeling: Radar FocusRoom: 405WE_404: Segmented Capture for Analysis of Long Pulse Sequences for Radar AnalysisMartin Schmähling, Rohde & Schwarz

The introduction of signal and spectrum analyzers with a demodulation bandwidth of 500 MHz more than a year ago has opened the door to examine even extremely short radar pulses in the ns range. However, the required high sam-ple rate in combination with a limited capture buffer reduces the total seamless capture and analysis period. In order to optimize radar systems in terms of stability of the pulse parameters, a longer seamless analysis period is desired. The R&S®FSW-K6 pulse measurement option offers an efficient memory management for analyzing pulse trends over long periods. The segmented I/Q capture function ensures that I/Q data is only time stamped and stored in memo-ry when a pulse is detected. This increases the analysis period by up to the reciprocal of the duty cycle. The Signal and Spectrum Analyzer can be used to analyze trends of radar pulses over long seamless periods, together with an R&S®RTO Real Time Oscilloscope even up to 2 GHz bandwidth.

Systems Engineering TrackRoom: 406WE_405: Implementing an FFT-Based EMI MeasurementKuo-Yuan Tye, Keysight Technologies

Long test times when performing CISPR 16-1-1 measurements have always been a problem for many EMC custom-ers. In recent years, FFT-based measurements have become accepted as an alternative to traditional measurement methods. This paper describes how to implement an FFT-based EMI measurement and the benefits of such a mea-surement compared to a traditional swept based method. It will cover the CISPR 16-1-1 test methodology, and how an FFT-based measurement differs from a traditional swept measurement. There will be an emphasis on the software design, particularly in extending the existing feature set which the reader can leverage for her own implementation. Other aspects such as testing, and the benefit to the user will be explored. Finally, further areas of improvement will be discussed.


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▼ Wednesday, April 15, 2015 11:20 – 11:40 ▼Design Track: Antennas/IoT/MMICsRoom: 401WE_501: Broadband, Low-Loss Impedance Matching for W-Band Power Amplifier with 22 dB GainHongfei Yao, IMECAS

Broadband, low-loss impedance matching for W-Band power amplifiers is presented. Increasing the vertical space be-tween adjacent cell units, transistors are matched with more freedom toward low-Q impedance positions on the Smith chart immediately before and after the cell layouts. Two-section dual-frequency impedance transformers are employed at the input and output stages to acquire broadband, high gain performances. The inter-stage matching is performed between the individual cell units employing “#” type distributed transmission line network which lowers the loss and provides convenience for DC feeding and blocking. Coplanar waveguide technology is used for ease of fabrication. The chip size is 1.5 x 1.7 mm. Measured gain is more than 20 dB across 9 GHz band. At 79 GHz, the small signal gain is 22 dB and the saturated power is 16.9 dBm with gain of 15.2 dB.

5G ForumRoom: 402A/BWE_402: Compact Measurement System for 5G mmWave Channel SoundingTaro Eichler, Heinz Mellein, Rohde & Schwarz

In order to cope with the higher system capacity and higher data rate demands of 5G, one of the proposed solutions includes the extension of the spectrum using mmWaves because of the large available bandwidth and reduced size of the transmit and receive antennas and electronic components. A prerequisite for the design of a new physical layer in 5G is a detailed knowledge of the radio wave propagation channel, which is not yet completely understood for the mmWave frequency range. The aim of channel sounding is therefore to characterize a radio channel by decomposing the radio propagation path into its individual multipath components. Based on this information new channel models can be developed for the mmWave range, which already exist for the lower-frequency range. In this paper, we present a novel compact and broadband channel sounding measurement setup flexible to address various frequency ranges. The system setup comprises an R&S SMW200A used to transmit PN sequences for time delay measurements by correlation and an R&S FSW for the capture of data. The captured data is then processed with a software tool based on MATLAB. The first measurement results obtained at a frequency of 17 GHz using a horn transmit antenna and a dipole receive antenna will be presented.

HSD/EMC Measurement & Modeling TrackRoom: 403WE_503: VFTO Radiated Interference Simulation in GIS FieldYing Liu, Robert Chao, ANSYS Inc.

The very fast transient overvoltage (VFTO) generated by an ultra high voltage (UHV) gas insulated switchgear (GIS) has the potential to deviate the switches from normal operation and interfere with surrounding equipment. To address the problem, ANSYS proposes a novel methodology for electromagnetic (EM)-circuit co-simulation of VTFO electromagnetic interference (EMI). First, the equivalent circuit of a GIS is extracted by a quasi-static EM solver. Given the time-varying resistance model of the arc, the equivalent time-varying voltage source of the VFTO is further calculated by broadband circuit analysis. Consequently, the EM radiation and interference in the vicinity of the GIS are analyzed by a full-wave transient EM solver. The proposed methodology is universally applicable to the design of high voltage GIS.

System-Level Measurements/Modeling: Radar FocusRoom: 405WE_504: Automatic Analysis of 500 MHz or 2 GHz Wide Frequency Hopping or Chirp Signals Used in Modern Radar ApplicationsMartin Schmähling, Rohde & Schwarz

Frequency agility techniques in radar systems make it possible to quickly change modes of operation on a pulse-to-pulse basis to account for atmospheric effects, jamming, interference and detection avoidance. Automatic detection and analysis of hopping sequences is helpful for validation of radar systems. However, modern systems cover a wide frequency range and equipment is needed with analysis bandwidth of 500 MHz or even wider. The same is true for FM chirp signals, which are used in automotive radar applications covering a frequency range up to 2 GHz in the 70/80 GHz range. The R&S FSW can be used for this wideband application even in the microwave range. In addition, it offers a RBW of 50 MHz for measurement of EIRP in the UWB bands needed for automotive radar.


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Systems Engineering TrackRoom: 406WE_505: Optimization of EVM Testing with VSA/VSG for Modulated Signal like 802.11 WLAN and LTE Wei Lin, Trang Nguyen, National Instruments

For modulated signal analysis, error vector magnitude (EVM) is a common figure of merit for assessing the quality of digitally modulated signals. Therefore, the test equipment with vector signal capability is required such as vector signal analyzer (VSA) and a vector signal generator (VSG). The VSA and VSG instrument setup in both hardware and software testing can noticeably affect the quality of the EVM measurement floor and especially conspicuous when testing over a broad range of center frequencies, averaging power levels and instantaneous bandwidths. Because the imperfections of test equipments and misleading configurations will degrade the actual useable range of EVM testing, it is very important to setup the various modulated signal test scenarios to optimize the capability of EVM testing with VSA/VSG system.

▼ Wednesday, April 15, 2015 11:40 – 12:00 ▼Design Track: Antennas/IoT/MMICsRoom: 401WE_601: Multiband Triangular Planar Inverted-F Antenna Design for Wireless Communication ApplicationsSu Chen Ho

There are high demands for wireless applications which are able to operate in more than one frequency band such as dual-band and tri-band phones, with high efficiency and high gain as well. One of the significant applications is to include Bluetooth, operating at 2.4 GHz, for short-range wireless use, and Wireless LAN capability. A planar inverted-F antenna (PIFA) has advantages of compact, low profile, easy to manufacture due to its simple and stable structure, conformability to mounting host and automatic assembly. This paper examines the characteristics of a triangular shaped PIFA by performing studies on factors such as patch size, shorting position, feeding position, ground plane size and the height of the antenna. Then, V shaped slots are inserted within the antenna radiating surface and its characteristic are investigated to realize number of frequencies bands desired. Finally, based on the studies, a new dual-band triangular PIFA antenna resonating at 2.1 and 4.8 GHz, which are basically for UMTS and WiMAX usage is proposed and fabricated. The return loss (S11) of the fabricated dual-band PIFA is approximately -13.00 dB at 2.1 GHz and -17.1 dB at 4.8 GHz. S11 is -6 dB which is adequate for mobile applications, the bandwidth for 1st resonance is 270 MHz or 12.81% and second resonance is as wide as 640 MHz or 13.3%. Hence, the bandwidth obtained for the proposed antenna is adequate for UMTS and WiMAX applications. All work is presented along with simulation and measurement results under free space environment.

5G ForumRoom: 402A/BWE_502: Flexible Testbed for 5G Massive MIMO: From Theory to RealityYupeng Jia, Ian Wong, National Instruments

Massive multiple input, multiple output (MIMO) is an exciting area of 5G wireless research. For next-generation wireless data networks, it promises significant gains that offer the ability to accommodate more users at higher data rates with better reliability while consuming less power. Massive MIMO relies on coherent transmission and reception on large numbers of antenna elements, allowing efficient use of the propagation environment for spatial multiplex of many communication links. Massive MIMO is also considered one of the most promising technologies for substantial increase of spectral efficiency in future wireless systems. Theoretical studies show that, in favorable propagation conditions, both spectral and radiated energy efficiencies can be improved by one or more orders of magnitude. Initial measurements also show that real propagation environments can be favorable, in the sense that a large fraction of the theoretical gains can be harvested. The time has come to extend investigations from simulations and theory to real-life environments, with test beds capable of real-time massive MIMO transmissions in real communication scenarios. Using the NI Massive MIMO Application Framework, researchers can build 128-antenna MIMO testbeds to rapidly prototype large-scale antenna systems using award-winning LabVIEW system design software and state-of-the-art NI USRP™ RIO software defined radios (SDR). With a simplified design flow for creating FPGA-based logic and streamlined deployment for high performance processing, researchers in this field can meet the demands of prototyp-ing these highly complex systems with a unified hardware and software design flow.


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HSD/EMC Measurement & Modeling TrackRoom: 403WE_603: Benefits of Multi-Tone Immunity TestingGeorge Barth, Amplifier Research

Multi-tone testing has many benefits. While the multi-tone methodology was initially implemented to increase the speed of the test, it has been found that this method also improves equipment efficiency and can be fully compliant to standards, and offers greater flexibility to truly test the equipment under test (EUT) under real world threat condi-tions.

System-Level Measurements/Modeling: Radar FocusRoom: 405WE_604: Modeling and Measurements of Frequency Stepped Chirped RadarTrang Nguyen, Wei Lin, Frank Rafaelli, National Instruments

For modern radar and signal intelligence systems, it is a great challenge to simulate and to emulate accurately these complex systems using an intuitive interface that can make a seamless transition from the simulation to the real time signal processing hardware. In the emulation of phased-array antenna systems, for example, a modular platform can offer the extensibility to simulate and to build N channels while allowing the user precise control of phase matching and calibration of the array. Embedded real time DSP in the form of a modular scalable FPGA platform allows users to author firmware using legacy code, high-level or low-level programming. For very high bandwidth, high channel count, and high frequency applications, compact and reconfigurable software designed instruments enables system design with ease.

Systems Engineering TrackRoom: 406WE_605: Design and Implementation of Large-Scale RF and Microwave Switch SystemsQi, Pickering

This paper describes the actual case of two typical large-scale RF/microwave switch system design and implementa-tions. One switch for the past few years and the evolution of the system in 802.11n MIMO 802.11ac product testing, from the size, structure, performance and other aspects of a comprehensive analysis; the other for scientific research in the field of high-energy particles VLSI RF switching system design, modular structure, the height of the full-size in a 4U chassis from a variety of sizes 24×8 to 104×16 RF switch matrix, a signal bandwidth of up to 200 to 500 MHz, RF switch matrix system to achieve a qualitative leap.

▼ Wednesday, April 15, 2015 12:00 – 12:20 ▼Design Track: Antennas/IoT/MMICsRoom: 401WE_701: Implementation of a Zigbee Circuit Reference Design Francis Leong, National Instruments (formerly AWR Corp.)

This presentation will discuss the process of simulating in Microwave Office circuit design software the reference design of a TI CC2530 Zigbee chipset taken from datasheet information and analyzed all the way through to EM ver-ification, all while controlling the impedance condition as specified by the datasheet. The discussion will include how to import DXF files into Microwave Office for EM simulation and understanding the ways in which different layouts can lead to variations in circuit performance that can be quite different from the requirement specified in the datasheet. The use of iNet technology to quickly and easily route the interconnecting lines drawn across various PCB layers and automatically insert the vias will be demonstrated. We will also analyze the parasitic effects (including coupling) of each interconnecting line that has been introduced without using EM simulation, enabling designers to interactively monitor the S11 with each line introduced and decide if they should change the length/width of that line. Finally, veri-fying the final design using EM simulation will be demonstrated.


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5G ForumRoom: 402A/BWE_602: mmWave MIMO Channel Sounding for 5G Technical Challenges and Prototype SystemZhu Wen, Hong Wei, Keysight Technologies

Since 5G expects to use mmWave frequency bands, the mmWave channel sounding system, which are used to characterize the various mmWave wireless channel models, have become a very hot topic for 5G. In this paper, we focus on how to setup a mmWave MIMO channel sounding system with commercial instruments to fulfill the six major technical challenges foreseen in 5G as well as focusing on the main channel measurement requirements: the use of the mmWave frequency band, the use of ultra-broad bandwidth and massive MIMO. Then it provides considerations on how to best address these technical challenges based on the lastest generation of mmWave/microwave instru-mentation, measurement techniques and capabilities. At last, it proposes a reference prototype system design for 5G mmWave MIMO channel sounding system, the functionalities and where performance of the prototype system are discussed.

HSD/EMC Measurement & Modeling TrackRoom: 403WE_703: EMI and Crosstalk Mitigation on Power TrayHongmei Fan, Jianquan Lou, Teresa Nguyen, Alpesh Bhobe, Yingchun Shu, Jinghan Yu, Quihua Zhue, Cisco Systems

Power tray is a printed circuit board with connected power supply units (PSU) with backplane in the chassis. The pow-er tray provides DC-level and management logics for the system/platform. Nowadays, power supply noise becomes more critical for the system electromagnetic interference (EMI) and crosstalk control. Common PSUs are used in mul-tiple platforms. High EMI noise was experienced from PSUs in various platforms. The higher number of PSUs in the system, the higher the EMI risk. It is desirable to reduce the crosstalk between power input and output sides on the power tray, and also to mitigate the electromagnetic radiation at power tray level during product early design stage. For a large platform with many DC-DC PSUs, there was a high radiated emission risk at f < 500 MHz due to the cross-talk between the DC input and output. For a platform with AC-DC PSUs, high radiated emission happened at around 80 MHz due to the AC cable flying over the power tray. These cases are simulated by a hybrid, full-wave finite element solver engine in this paper, analyzing the noise coupling in power tray connected with DC-DC or AC-DC PSUs. It is found that adding stitching strips among leads of power input, power input return, and power output on the power tray is beneficial for the EMI and crosstalk mitigation. It is also recommended to avoid AC cable flying over the power tray; if this action has to be taken, then adding a common-mode choke on the AC cable can bring about some improvement at a certain frequency range. Measurements on power tray boards are taken for validating the simulation results.

System-Level Measurements/Modeling: Radar FocusRoom: 405WE_704: Comprehensive Radar TestingSteffen Heuel, Rohde & Schwarz

Test, measurement and verification of radar for aerospace & defense, automotive and other civil applications are necessary to ensure both functioning to specification and meeting customer requirements. Next to component test or signal and spectrum analysis during research, development and production, extensive field tests are often used to verify the entire radar system including signal processing and antenna; this is both costly and requires a great deal of time. To reduce test complexity and cost, automated radar tests become very important. This paper introduces au-tomated signal analysis and a radar target generator build out of the same measurement equipment as used before-hand. The approach is able to analyze pulse, continuous wave, or hopping signals and also allows, independently of the applied radar waveform, to generate a radar echo signal to test the entire radar system including the RF part. This truly enables the future of radar testing using commercial off-the-shelf (COTS) measurement equipment and reduces test time, complexity and cost by bringing parts of the field test into the lab.


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Systems Engineering TrackRoom: 406WE_705: HFC Improvement for DOCSIS3.1 EvolutionMaxwell Huang, Cisco Systems, Lei Yue, Keysight Technologies

DOCSIS 3.1 defines the fourth generation of high speed data-over-cable system. It will enable a new generation of cable services and help operators continue to meet consumer demand for high speed connections and sophisticated applications, positioning them to be the providers of choice in their markets. DOCSIS 3.1 technology provides sig-nificant new value for cable operators and consumer of broadband services including speed, quality, higher capacity, energy efficiency and flexible migration strategy. SystemVue provides a very efficient platform for the modeling of DOCSIS system, especially in waveform generation, testing and verification of complex algorithms. With a connect-ed-solution composed of SystemVue, M8190A, M9703A and VSA89601B, which implements the testing and verifi-cation of PHY algorithms and DOCSIS product hardware prototype in advance, and can mitigate the test challenges, decrease the pressure of time-to-market and costs. This paper introduces a ‘design to test’ platform solution for DOCSIS 3.1 physical layer, the entire physical layer system is modeled and simulated in SystemVue and system per-formances are measured through connected-solution.

▼ Wednesday, April 15, 2015 13:30 – 14:10 ▼

Workshops and PanelsDesign Track: Antennas/IoT/MMICsRoom: 401WS_WE101: Smart Antenna Technology and Multi-Channel RF MeasurementsHongbo Mi, Keysight Technologies

The expression “Smart Antenna” is applied to a number of technologies, often creating confusion. Smart antenna technology can be roughly divided into four different technologies: diversity, beam forming (phased array), multiple input, multiple output (MIMO), spatial division multiple access (SDMA). This paper focuses on beam forming (phased array) and MIMO. These two kinds of technology are widely used in radar and communications. In this paper, we will introduce the difference between MIMO radar and phased array radar, difference between radar and communication’s signals. Generally, beam forming and MIMO mean multi-channel RF measurements. Measurements are challenging and the requirement is different between beam forming and MIMO. Some test solutions will be introduced in this paper.

5G Forum (13:30-13:50)Room: 402A/BWE_702: Transceiver Module and Multi-Element Phased Array Design for 5G Gent Paparisto, National Instruments (formerly AWR Corp.)

This presentation overviews key features of Visual System Simulator™ (VSS) that enable designers to design and an-alyze transceiver modules and design multi-element phased arrays without the overhead encountered when they are modeled using discrete components, resulting in much shorter configuration and simulation times.

5G Forum (13:50-14:10)Room: 402A/BWE_802: Timing and CFO Synchronization in FBMC System Based on Superimposed Zadoff-Chu SequencesShuai Zhang, Zhou Deng, Keysight Technologies

In this paper, we propose a novel joint symbol timing and frequency offset estimation algorithm in filter bank multi-carrier (FBMC) systems. At first, the frame structure which is composed of preamble symbols and data symbols is designed. And the time domain preamble contains at least two blocks of identical Zadoff-Chu (ZC) sequences with different root indices superimposed to each other. Fractional frequency offset (FFO) is obtained by least square esti-mator using the identical parts of the preamble. Symbol timing and integer frequency offset (IFO) estimate are derived by cross correlation on ZC sequence with special root indices. Simulations show that this method brings satisfactory performance in additive white Gaussian noise (AWGN) and multipath channels even in low signal-to-noise ratio (SNR) with high transmit efficiency.

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HSD/EMC Measurement & Modeling TrackRoom: 403WS_WE103: Minimizing EMI Through Effective Signal and Power IntegrityTimothy Chen, Zhenghao Chu, ANSYS

Electromagnetic interference (EMI) issues that are discovered late in the design cycle can threaten product release dates. In order to meet these strict time frames, engineers need to adopt a design process that provides EMI insight early in the design cycle. Such EMI-aware design processes are achieved by using the same electromagnetic tools from ANSYS that are used for power and signal integrity design. This workshop highlights how Zuken’s system design solution and ANSYS EMI simulation capabilities address the challenges of first-time successful design.

System-Level Measurements/Modeling: Radar FocusRoom: 405WS_WE104: An Active Solution and Service from Microwave To Terahertz Communications/Radar/Sensor & Imaging SystemsDandan Li, Farran Technology

This presentation will provide 1) overview of Farran; 2) 60 GHz vector signal TR FEM frequency extension solution with Keysight AWG and OSC; 3) low noise and high power amplifier module at 94/140/220 GHz; 4) radiometer and Rx FEM at 89/94/183 GHz; 5) up to 500 GHz RFIC and MMIC on wafer solution and 6) one-stop solution service.

Systems Engineering TrackRoom: 406WS_WE105: Commercialization of GaN for Cost-Sensitive ApplicationsDavid Runton, MACOM

GaN technology offers the customer higher power and efficiency operation in a similar size and footprint compared to LDMOS or Si Bipolar technologies. The inherent higher thermal performance and higher breakdown voltage of GaN benefit the customer with great flexibility in wider-band operation, increased power handling leading to longer pulse lengths and duty cycles and increased ruggedness under load mismatch conditions. Whether a power supply for a MRI, a base station amplifier for mobile broadband, or a transmitter in a radar system, GaN both increases system performance and simplifies system architecture. One of the last remaining barriers to GaN adoption will be removed as the cost structure of GaN intersects and drops below that of GaAs. GaN technology is now making the transition from specialized, government funded technology to high volume commercial mainstay. By leveraging the scale volume of the silicon industry, which is two orders of magnitude greater than even the GaAs handset market, we will soon be able to leverage GaN for cost-sensitive applications. At maturity, MACOM believes that GaN on Si will benefit from silicon cost structures that are 3x lower than today’s highest volume GaAs and 100x lower cost than today’s GaN on SiC technology.

▼ Wednesday, April 15, 2015 14:15 – 14:55 ▼Design Track: Antennas/IoT/MMICsRoom: 401WS_WE201: Why Reaching 0 Hz Matters: The True DC SwitchCK Sun, Peregrine Semiconductor

For markets and applications that rely on accuracy and precision, the ability to reach a previously unobtainable por-tion of the frequency spectrum with a truly CMOS solid-state solution offers a unique advantage. Peregrine Semicon-ductor has set a new standard with the industry’s first RF integrated switch to achieve true DC capability. The UltraCMOS® True DC switch covers the signal routing over the frequency range of 0 Hz to 8 GHz. This frequency expansion is paramount to markets such as test and measurement where accurate signal testing is critical. The elimination of arc phenomenon, low supply currents of < 3 mA, high linearity from DC to 8 GHz and a CMOS control interface make the device well suited for applications ranging from analog and DC control loops to challenging and complex signal routing. The True DC SPDT switch features high power handling of 30 dBm at 0 Hz and 36 dBm from 20 MHz to 8 GHz, and maintains excellent RF performance and linearity across the frequency range. Moreover, it can switch DC and AC peak voltages in the range of +10 to -10 V at currents of up to 80 mA. The ability of the switch to function and operate when a DC signal voltage is present eliminates the need for any external DC blocking capacitor, a first for this kind of switch product.

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5G Forum (14:15-14:35)Room: 402A/BWE_902: Signal and Spectrum Analysis Challenges in 5G Test and MeasurementMartin Schmaehling, Rohde & Schwarz

While LTE has been established as the leading global cellular standard, many international research projects have started on the fifth generation (5G) for wireless communications technology. Key topics under discussion on the 5G radio interface are higher frequencies up to the E-Band, higher bandwidth, massive MIMO and beam forming and new modulation schemes (non-orthogonal, more spectrally agile than OFDM). For such signals, the propagation charac-teristics and transceiver architecture differ significantly from those of today’s cellular spectrum and are therefore a current research topic. This paper describes how with the combination of a signal and spectrum analyzer and real time oscilloscope signals with up to 2 GHz bandwidth and up to E-Band frequency can be characterized in terms of unwanted emissions and modulation quality.

5G Forum (14:35-14:55)Room: 402A/BWE_1002: HetNet on LTE and Wi-FiYang Yang, Shanghai Tech

In his talk, we provide an introduction to the 5G R&D program and current activities in mainland China. Following that will be a presentation of a recent study on future HetNets and 5G technologies including experimental results.

HSD/EMC Measurement & Modeling TrackRoom: 403WS_WE203: 100G Backplane Test ChallengesLi Kai, Felix Ma, Keysight Technologies

High speed backplane is key to high performance data centers. The data rate of one single lane has achieved 25 Gbps or higher in today’s 100G networking applications. CEI-25G-LR standard of OIF and 100GBase-KR4 standard of IEEE are all technology specifications of 100G backplane. And the challenge is how to satisfy the distance require-ments of the intended applications at this data rate. Insertion loss, return loss, impedance, cross talk, eye diagram and bit error ratio are all key test items to evaluate the performance of backplane. And the signal quality of the daughter card is also essential to guarantee system performance and reliability. This paper will talk about the chal-lenges of 100 Gbps backplane design and test solutions.

System-Level Measurements/Modeling: Radar FocusRoom: 405WS_WE204: Radar Complex Electromagnetic Environment Simulation and Evaluation MethodPeng Zhang, Rohde & Schwarz

Complex electromagnetic environment simulation and evaluation are very important for an electronic information sys-tem. R&S introduces a radar complex electromagnetic environment simulation system, using SMW200A vector signal generator and scenario building software, which let the customer build a complex radar environment efficiently and easily. R&S FSW signal and spectrum analyzer can provide a good method for complex electromagnetic environment analysis.

Systems Engineering TrackRoom: 406WS_WE205: Small Cells Design SolutionsRichardson RFPD

The Small Cell market is rapidly changing, with the traditional view of small cells primarily filling coverage gaps in homes being supplanted by the need for high LTE data rates and reliable QoS in urban environments and inside non-residential buildings. This workshop will address these Small Cell market trends as well as technology supporting these changes, and will discuss the newest innovative RF components that will help meet these challenges.

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▼ Wednesday, April 15, 2015 15:30 – 16:10 ▼Design Track: Antennas/IoT/MMICsRoom: 401WS_WE301: Affordable RF Test SolutionsTektronix

Wireless communication is everywhere. The requirements for the improvement of energy efficiency and more band-width result in continuous growth of needs for affordable, mid-range RF test and measurement solutions. In this exhi-bition, Tektronix will introduce RF solutions at affordable price with excellent performance, such as RSA306 spectrum analyzer, MDO4000B and MDO3000 mixed domain oscilloscope and new TSG4100A vector signal generator, empow-ering you in higher education, electronics R&D, consumer electronics manufacturing, transceiver testing, interference hunting, installation and maintenance of wireless equipment. In addition, Tektronix will show wideband communication and complex electro-magnetic environment solutions for government and high-end research, as well as a range of high performance test and measurement components which are debuted.

5G ForumRoom: 402A/BWS_WE302: Verification and Testing 5G and Millimeter Wave Ultra-Wideband SignalsBlair Lee, Felix Ma, Keysight Technologies

This paper presents 5G specifically for advanced technology research and development and design verification test platform that is based on SystemVue design software, M8190A arbitrary waveform generator, E8267D microwave vector signal generator and N9040B UXA UWB signal analyzer. 5G, with more than 500 MHz bandwidth, physical layer signal generation and analysis can be used directly as FBMC can also be extended to select the hardware above 3 GHz bandwidth. The platform provides a simple and fast UWB hardware linear distortion correction method, so that the test system to achieve the industry’s best feature vector error. The platform can be used to assist 5G physical layer algorithm development and validation, design and commissioning millimeter wave and ultra-wideband devices and modules, 5G channel modeling and verification, and validation of the transmitter and receiver test early with good flexibility and scalability.

HSD/EMC Measurement & Modeling TrackRoom: 403WS_WE303: Automated Test Equipment (ATE) and WiMAX, Wi-Fi, 3G, 4G, LTE, DVB Fading SimulatorsMini-Circuits

Mini-Circuits has an innovative line of Portable Test Equipment (PTE) that can improve test efficiency and provide reliable test results without a big investment in complex laboratory equipment. These products include signal gener-ators, switch matrices, programmable attenuators, and smart power sensors to custom integrated rack-mount test solutions. Most recently, Mini-Circuits has accelerated custom test solutions with modular test rack designs resulting in turnaround times as fast as 1 week and greatly simplifying system maintenance. Another breakthrough is our new 120 dB dynamic range programmable attenuator with 0.25 dB step size, which is widely used in Automated Test Equipment (ATE) and WiMAX, 3G, 4G, LTE and DVB Fading Simulators. Live demonstration of the latest products will be available at the exhibition.

System-Level Measurements/Modeling: Radar FocusRoom: 405WS_WE304: Advanced Modeling Techniques for Phased Array AntennasGenlin Cao, Timothy Chen, ANSYS

Electronically scanable antenna arrays often contain semi-arbitrary element layouts with hundreds or thousands of elements, creating a sizable challenge for electromagnetic simulation. This paper will introduce attendees to com-putational techniques in ANSYS HFSS that enhance the modeling capabilities required for analyzing finite phased antenna arrays. The presenter will discuss how solve times with ANSYS HFSS may be reduced by several orders of magnitude when only a subset of scan vectors is required or sped up significantly for an array desiring full scan infor-mation. Examples will demonstrate how pattern accuracy is enhanced with HFSS’s numerical absorbing boundary that is effective at all scan angles.

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Systems Engineering TrackRoom: 406WS_WE305: Efficiency Enhanced GaN HEMT Allowing Flexible RF Designs for LTE Applications RFHIC

Efficiency performance plays a very important role in reducing maintenance costs as well as reliability management of base RF designs to raise the competitiveness in LTE market. Efficiency enhanced RFHIC GaN HEMT solutions will provide alternatives in the highly competitive China LTE market. Two efficiency enhanced GaN transistor lineups are introduced: 2.1 GHz, 40 W and 3.5 GHz, 20 W for LTE base-station system.

▼ Wednesday, April 15, 2015 16:15 – 16:55▼

Design Track: Antennas/IoT/MMICsRoom: 401WS_WE401: A Method to Reduce Voids in Solder Attach For RF Power Devices Freescale

This presentation provides RFPA (Power Amplifier) customers with an innovative method to reduce voids in solder attach for RF Power devices from around 25% to 5%. This presentation will aid customers in developing an assembly process suitable for their design as well as their manufacturing operation. Each RF PA design has its own unique performance requirements. Similarly, each manufacturing operation also has its own process capabilities. However, the voids in solder attach is the key issue for both sides, especially for mass productions. The intent of this presenta-tion is to provide the method our customers need to establish the process that is most suitable for their design and compatible with their manufacturing operations.

5G ForumRoom: 402A/BWS_WE402: Introduction to Software Defined Radio in LabVIEWYuan Yao, National Instruments

National Instruments software defined radio (SDR) platforms provide an integrated hardware and software solution for rapidly prototyping high performance wireless communication systems. In this workshop, you will learn about LabVIEW tools for digital communication system design. Various trade-offs of host-based versus FPGA-based processing will be discussed and individual examples including 5G will be highlighted in the session.

HSD/EMC Measurement & Modeling TrackRoom: 403WS_WE403: Signal integrity in Passive RF and Microwave ComponentsHUBER+SUHNER

Passive RF and microwave components have seen a steep increase in terms of performance requirements over the last years. With the ever increasing need for bandwidth, the rise of transmission frequencies and the ongoing trend towards miniaturization and modularization, all aspects related to signal integrity have become more important. In this session we will take a closer look on how transmission characteristics, such as phase changes vs. temperature/movement, return loss, RF leakage, power handling or passive intermodulation can be improved by choosing the appropriate design, materials technology or manufacturing processes. The passive devices considered will span the range from connectors, cables and cable assemblies, as well as antennas.

System-Level Measurements/Modeling: Radar FocusRoom: 405WS_WE404: Wideband Impedance Control for Modulated SignalsFocus Microwaves

Load-pull has long been established as a key technique allowing enhanced understanding of new semiconductor device technologies and forming an integral part of the power amplifier design process. Existing load-pull systems however still have a limitation, namely, the inability to adequately deal with impedance control of complex wide-band modulated stimuli. With the ever-increasing complexity and bandwidth of modulation schemes used in communica-tions systems, the link between conventionally employed CW/Pulse measurements and the eventual stimulus the device or circuit encounters in the final application has become more tenuous. The novel architecture presented here allows the user to present controlled, wideband impedance to a DUT. This is achieved using a quasi-closed loop load-pull where signals with up to 100 MHz bandwidth can be controlled.

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Systems Engineering TrackRoom: 406PA_WE405: GaN Panel

GaN Panel featuring experts from Freescale, MACOM, Qorvo and Empower RF

The panelists will discuss the attributes of GaN for RF applications including wireless, automotive, multimedia and communications, covering the semiconductors strengths and weaknesses for addressing specific applications com-pared to other existing technologies and its outlook for development and adoption in new application targeting higher frequency green-field initiatives. Topics to be discussed include: • Thermal management and optimization • Broadband performance and applications • Ruggedness and reliability advantages • Packaging requirements • Cost drivers and pricing

Ting Xiong, Director of Sales, APAC Infrastructure & Defense Products, Qorvo (TriQuint)

Ting Xiong joined Qorvo (TriQuint) in 1999 and has worked in various positions including engineering, marketing and sales. He is currently the Sales Director of APAC for Qorvo’s Infrastructure and Defense Products, with key focus on customized solutions for point-to-point radio, optical and 4G base stations. Prior to Qorvo, Mr. Xiong worked in engi-neering at Mitsubishi and International Rectifier. Mr. Xiong has an MBA and MS in Physics from Portland State Univer-sity, and a BS in Physics from Peking University, China.

David Runton, Director of Design Engineering, MACOM

David Runton received his Bachelor of Science degree in Applied Physics from Jacksonville University in Jacksonville, FL in 1993, a Bachelor of Electrical Engineering (1993) and Master of Science in Electrical Engineering (MSEE) from Georgia Tech in 1994. He has also received a Master of Business Administration as part of the High Technology Pro-gram from Arizona State University in 1999. He has held positions as an RF Design and Applications Engineer with Motorola Semiconductor (now Freescale), led the High Power GaN engineering team at RFMD, VP of Engineering at Nitronex, and is now the Director of MACOM’s Design Center in Research Triangle Park (RTP), NC.

Eric Westberg, Portfolio Cellular Infrastructure, Freescale

Eric Westberg is a portfolio manager for cellular infrastructure RF products at Freescale Semiconductor. In addition to product management he has held engineering and management positions in application engineering, systems engi-neering and business development in the wireless and semiconductor industries. Eric earned his master’s degree in electrical engineering from Arizona State University and undergraduate degrees from Wheaton College and the Illinois Institute of Technology.

Jon Jacocks, President and CEO, Empower RF Systems

Jon is the President and CEO of Empower RF Systems. He joined Empower in November 2007 as the company’s first VP of Sales and served in that capacity until transitioning into the CEO role in January 2013. Empower RF Systems was an early adopter of GaN technology for use in vehicle mount electronic warfare applications as early as 2006 and the technical team continues to design with GaN devices for increasingly higher power applications in not only elec-tronic warfare, but also radar, test and measurement, and SATCOM.

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▼ Thursday, April 16, 2015 09:30 – 09:50 ▼

Technical SessionsMeasurements & Modeling Track Room: 401TH_101: A Finite-Element Thermal Model for Compound Semiconductor Devices Implemented in SPICEJabra Tarazi, MACOM

A finite element (FE) thermal model is presented as a tool to investigate device reliability. This model is implemented in SPICE so that it can be simplified and integrated into electrical design tools, which opens the possibility for elec-tro-thermal simulations. The thermal resistance paths through a transistor are modeled using resistors, by consider-ing the analogy between the flow of heat and electric current. Nonlinear temperature-dependent thermal conductivity is implemented by representing the resistances as nonlinear voltage-controlled current sources. The model is verified using measurements of AlGaN/GaN-on-SiC thermal test structures.

Design TrackRoom: 402ATH_102: Tunable VCO Filtering CircuitrySu Chen Ho

VCO unwanted harmonics levels are very crucial especially in communications systems as unwanted harmonics may cause many undesired performances such as radiated emissions, PLL unlocks due to distorted AC waveform, etc. Conventional VCO filtering circuits S12 response is fixed and in order to have better 2nd and higher order harmonics attenuation, we would normally trade off the desired frequency power by having higher attenuation steepness or high-er Q. In this paper, common Colpitts VCO with NE685M13 transistor is used to compare different types of a filter’s performance. A simple tunable filter using varicap parallels with filter capacitor is introduced. By doing so, the diode value varies from high capacitance to low capacitance as the tuning voltage increase, same concept as how volt-age-controlled oscillator works. This paper describes the innovation in resolving VCO unwanted harmonics. With the new filtering topology, a flat amplitude response in passband and high attenuation beyond it can be easily achieved. It is designed to be for any VCO circuitry and can be implemented in other applications as well.

EMC/EMI & HSD Measurements/Modeling TrackRoom: 403TH_103: Integrated Low Pass Filter with ESD Protection for Audio ApplicationsLiu, OnSemi

Portable and consumer products, such as smartphones, require Hi-Fi audio circuits for voice processing. Embedding of audio circuits in space-constrained high density PCBs increases the susceptibility of electromagnetic interference (EMI). In addition, radio frequency circuits used for wireless communication are also significant sources of EMI. Any long traces, vias, component leads and pins, and PCB board connectors emit radiation and become unintended sourc-es of EMI. The interference degrades the quality of high definition audio signals. To minimize interference and un-wanted noise, lowpass filters are utilized in most consumer devices. Additionally, it is also necessary to protect audio interface from electrostatic discharge (ESD) events. This paper presents a high level of miniaturization of an integrat-ed circuit comprising of a lowpass filter, ESD protection, biasing network, decoupling large capacitors and precision resistors. WLCSP technology is used to package the IC in a small form factor.

System-Level Design Track Room: 405TH_104: System for Positioning and Locating of Missile Threats, Mountable on AirlinersMajid Mohammadi, Mehdi Yaghoobi, BAAM Electronic

On 17 July 2014, a Missile Destroys Malaysia Airline Plane over Ukraine, Killing 298 People; Flight MH17; Plane: Boeing 777; Pro-Russia rebels are suspected of downing airliners and world leaders react with shock and revulsion. Where were the missiles fired from? We have solved this problem with the BM-1017 system. It is basically an X-Band high sensitivity receiver which is equipped to a novel array antenna as well as an ultra-high speed digital signal pro-cessing system and also a storage unit and a multi-way communication interface. This system operates as soon as a ground-base or airborne radar starts to track the airliner which system is mounted on it. The system determines the coordinate of the tracking system according to its position which is achieved from a GPS receiver and phase differ-ence of the received signal on the sub-array antenna. The DSP unit achieves its coordinate through a GPS receiver and then calculates the angle/direction of incident radio wave incoming from the tracker and finally determines the precise location of the source signal which is actually an X-Band radar tracking system. There is a multi-function port for data transferring between BM-1017 and the Airliner “Black Box”. In addition, the BM-1017 has a Ku-Band satellite transmitter and an UHF band digital coded transmitter to transfer the data including the tracker position to a ground receiving station directly or through a satellite.


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System-Level Measurements/Modeling TrackRoom: 406TH105: Phase Coherent Signals, Challenges and ApplicationsFrank-Werner Thuemmler, Rohde & Schwarz

One requirement in many modern telecommunication standards and in the A&D field is the generation of multi carrier signals. Getting the phase of each carrier somehow stable – especially when talking about beamforming or phased antenna array applications – is one challenging task. So phase coherency over a long time is the key point in order to get reliable and reproducible measurements in the applications mentioned before. This seminar shows you why phase coherency becomes more and more important and which T&M solution might be sufficient for your application. It gives an overview starting from the classical approach when connecting the frequency references only up to locked synthesizers with freely adjustable phases for each carrier.

▼ Thursday, April 16, 2015 09:50 – 10:10 ▼Measurements & Modeling Track Room: 401TH_201: DynaFET: Accurate Modeling of III-V HEMTs Base on NVNA Measurements and ANNsMa Long, Keysight Technologies

DynaFET is an innovative nonlinear model for advanced compound semiconductor transistors based on nonlinear vec-tor network analyzer (NVNA) and artificial neural networks (ANN). Unlike many other GaN/GaAs models, the scalable DynaFET model produces a general, global model with no need for application-specific parameter tuning. The model can therefore be used with confidence to design power amplifiers and circuits with GaN and GaAs transistors for all applications where the device is working in the active mode. In the paper, the basic model theory and the major steps in the characterization, model generation (extraction), and validation of the DynaFET model will be presented.

Design TrackRoom: 402ATH_202: Coupled Electro-Thermal Analysis of High-Power RF FiltersYong Yuan, Timothy Chen, ANSYS

Today’s wireless networks operating in crowded spectral environments require filter solutions with excellent selectivity to reduce co-site interference, well-defined bandwidth (passband, bandstop or agile) and insertion loss to preserve signal strength and reduce infrastructure operating expenses associated with base station power consumption. To address stringent design specifications which include harsh operating environments and power handling, RF filter designers are increasingly concerned with the impact on their filter performance due to thermal effects from environ-mental and high power operations. The bidirectional interaction between electrical and thermal behavior requires that engineers consider both properties and their impact on each other during the design phase. In the past, separate design teams relied on estimates for power densities and current capacity to facilitate some level of collaborative design often resulting in over-engineering that ends up increasing the overall design cost. Coupling the electronic de-sign flow to the thermal design flow, with feedback, allows both teams to operate efficiently to optimize performance for both disciplines simultaneously. This workshop examines how the analysis of electrical performance due to the thermal and structural loads is achieved with bidirectional coupling between HFSS and ANSYS multi-physics analysis, presenting a workflow that illustrates the impact on the overall filter performance with real-world examples.

EMC/EMI & HSD Measurements/Modeling TrackRoom: 403TH_203: Addressing the Challenges of PAM-4 Receiver Stressed Input TestingBeate Hoehne, Keysight Technologies

The switch to PAM-4 signaling is revolutionary in many aspects, including receiver input testing. The traditional jitter and amplitude stress types which have been used for years in NRZ do not emulate the impairments which cause problems in PAM-4. The session will cover new pattern generation solutions which offer the flexibility to create the new stress types for “deep” characterization of PAM-4 devices, including those devised by the users themselves.


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System-Level Design Track Room: 405TH_204: A 60 and 80 GHz Point-to-Point Data Link with Throughput up to 160 and 225 GbMajid Mohammadi, Mehdi Yaghoobi, BAAM Electronic

The maximum data rate for wireless systems (throughput) according to IEEE802.11ad is max up to 10 Gb on each channel. IEEE802.11ad operates in 57 to 64 GHz and consists of four channels and each of them with a bandwidth 1.76 GHz and 16-QAM or 64-QAM modulation, a total bandwidth 7 GHz, and a throughput 28 Gb (16-QAM) and 40 Gb (64-QAM). One of things that limits maximum speed rate is phase noise generated by VCO and then increased through other components such as mixer and power amplifiers. We have discovered and utilized hardware techniques which increase the limitation up to 225 Gb in short range (a few meters) and up to 160 Gb in long range (100 to 400 m) in overall bandwidth (7 GHz). The technique lets us utilize up to a full-band transceiver in the form of side by side, but with a level difference (offset) which permit increasing throughput to 640 Gb in long range (QAM-64) and of course, about 1 Tb in short range (QAM-256). Furthermore, there is a possible solution in which would be arranged up to 8 set (each set consist of 4 full-band transceivers) for reaching a throughput in overall band up to 8 Tb. We utilize above mentioned method and procedure in E-Band (71-86 GHz) to create a data link with a data throughput to 16 Tb. Of course, using 8 sets Wi-Gig link as well as utilizing 8 sets E-Band transceiver in the same time, might provide a total overall bandwidth throughput up to 24 Tb.

System-Level Measurements/Modeling TrackRoom: 406TH205: Facing Multi-Port Device Challenges with Modern VNA Testing TechniquesThilo Bednorz, Tanja Schulze, Rohde & Schwarz

Many devices under test (DUT) have more than four ports like splitters, cables or front-end modules for mobile phones. All these DUTs need to be tested and most of the time this is done with a vector network analyzer (VNA). The characteristics that are needed from the measurement equipment are widely dependent on the DUT and the area where the equipment is used. For example, in R&D often the highest possible RF performance is needed, whereas in production a high throughput is the most important factor. There are different ways to test multiport DUTs with a VNA: matrix solutions, e.g. R&S ZNB and R&S ZN-Z84, or true multiport VNAs, e.g. R&S ZNBT. The setup of these different types of multiport vector network analyzer systems will be analyzed and compared and the resulting performance explained. Also unique features of both solutions will be described, like number of ports, parallel measurements and so on, to help find the best solution for typical measurement problems when doing multiport VNA measurements.

▼ Thursday, April 16, 2015 10:10 – 10:30 ▼Measurements & Modeling Track Room: 401TH_301: Statistical Model Extraction SolutionLi Fei, Jiao Xiao, Zhao Peng, Zhong Yuping, Wu Yanjun, Keysight Technologies

With the scaling down of semiconductor integrated circuits, process variation effect becomes very important to the yield. Statistical Model is very critical to connect the process variation and design. However, statistical model extraction is still a challenge for the industry. In this paper, a turn-key statistical model solution will be introduced. Additionally, a real application case and extraction result will also be presented.

Design TrackRoom: 402ATH_302: Design Methodology for GaAs MMIC and/or Base Station PAMilton Lien, National Instruments

This presentation will show the design of a base station PA and GaAs MMIC. In the latter, this design consists of a high power, two stage, 1 W, X-Band MMIC amplifier – leveraging the Cripps linear power estimation method. Yet for either design example shown, the use of NI AWR Design Environment Microwave Office circuit design software will be featured as well as showcasing a number of useful features for aiding in the design and layout of the circuit, including advanced control of the schematic and layout, EM simulation of large portions of the matching networks, and connec-tivity checking and net highlighting. These tools reduce errors substantially by the time LVS is carried out after the design process is complete.


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EMC/EMI & HSD Measurements/Modeling TrackRoom: 403TH_303: Analysis of Small Voltage Variation Under Large Signal ConditionsMatthias Beer, Rohde & Schwarz

Measuring small voltage variations when high voltage components are present is a common challenge in electron-ic design and testing. Typical applications are switched-mode power supplies (SMPS) where the voltage across the switching transistor has to be measured during the switching period. In this case, the voltage difference between ON and OFF state of the transistor can reach easily a hundred volts or more. To measure under such conditions small voltage variations with the required accuracy, more than 8 bit of vertical resolution would be required on an oscillo-scope. The same requirements would apply for example when analyzing an AM modulated signal with low modulation index.

System-Level Design Track Room: 405TH_304: A Novel Interpretation of Shipborne EMI Measurements by Means of Fuzzy TheoryAntonio Macedo, Silvio Fernando Pinto, Inmetro, Adalgisa Silva, Alfaldelta Rio, Roberto Menna Barreto, QEMC

On board naval vessels the interference of one system over the others is a concern. Furthermore, shipborne EMC measurements are contaminated by spurious signals since it is hard to isolate a ship from its surrounding environ-ment. This is critical in respect to interference caused by radars and HF telecommunication systems. Hull generated harmonics caused by rusted junctions and some superstructure pieces widens the spectra of EMI and enhance EM pollution. This work suggests a new approach to take into account such effects. Here, the results from real mea-surements are seen as fuzzy numbers that can be combined through some fuzzy math rules and Ordered Weighted Average Operators. The focus here is not the degree of precision but a more flexible way to describe EMI and all its unpredictable factors. After introducing the problem, consider the case of a real naval Patrol Boat under construction.

System-Level Measurements/Modeling TrackRoom: 406TH_305: Complex RF Environment Challenges in the Telecommunications and A&DThuemmler/Heuel, Rohde & Schwarz

Complex RF environment simulation with enhanced sequencing, antenna diagrams, scan types or scenario simulation for single and multiple emitters enables research and development for today’s and next generation systems in tele-communication, aerospace & defense and automotive radar among others. With this new tool, you are able to gen-erate complex RF scenarios that can range from simple pulses for components tests to full scale testing of complex radar systems. Real signal environments with multiple emitters and interferers can be mapped into waveform files for replay. 3D visualization tools preview the configured signals, antenna diagrams and scan or the scenario geometry itself. Along with this a radar target generation possibility allows you to test the complete radar system by generating radar echo signals with arbitrary range, Doppler frequency and attenuation. Hence, virtual targets are generated mak-ing it possible to perform real-time tests on many kinds of aerospace and defense or commercial radar systems. In this session you will learn how to generate complex pulsed signals very fast and efficient by a stepwise signal setup. Besides this, the integration and usage of radar target generation is demonstrated.

▼ Thursday, April 16, 2015 11:00 – 11:20 ▼Measurements & Modeling Track Room: 401TH_401: Understanding the Effect of Source Isolation on Intermodulation Distortion MeasurementsVimal Fernandez, National Instruments

One of the significant challenges to making intermodulation distortion (IMD) measurements is to sufficiently isolate the two continuous wave (CW) signal generators from themselves. Insufficient isolation results in the signal genera-tors leaking into each other creating unwanted third and fifth order intermodulation products. By introducing distortion into the stimulus it becomes increasingly difficult to discern whether the output distortion products are due to the signal generator or the device under test (DUT). Best practices for two-tone IMD measurements involve the use of several methods to isolate each source. Common techniques include the use of attenuators, high reverse-isolation amplifiers, and isolators/circulators. By placing these components between each source and the combiner you can reduce the leakage from each signal generator into each other and improve the quality of the stimulus signal. In this paper we will investigate the measurement performance of all three techniques.


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Design TrackRoom: 402ATH_402: C-Band GaN Microwave Power Device Broadband Matching CircuitMeigen Shen

Based on GaN HEMT die technology, the development work carried out C-Band high-power microwave power devices. The device input and output impedance of 50 ohms, typical output power of 120 W, from 8 to 15 W output power of a single cell synthesis. In order to prevent the device from odd-mode oscillation, a 10 ohm resistor is used. In order to increase the overall input impedance of the device, increasing the gate resistance, reduce the Q value of the device, in favor of broadband applications. Input and output devices use two matching networks. The first stage matching network use the traditional T-matching network. The second-stage matching network uses a /4 transmission line im-pedance matching to 50 ohms. /4 transmission line for a special design, the RF input signal to the gate of each sin-gle cell can maintain the consistency of the amplitude and phase, in which the phase control in less than 5 degrees, which greatly improves the efficiency of the combined power and synthetic devices. Optimized device test results /4 transmission lines read as follows: the frequency F = 5.3 to 5.9 GHz, the typical output power of the device is greater than 120 W, gain greater than 10 dB, efficiency greater than 50%.

EMC/EMI & HSD Measurements/Modeling TrackRoom: 403TH_403: Advanced Techniques for Testing High Speed, Multi-Lane PCI Express 3.0 and 4.0 DevicesRick Eads, Keysight Technologies

With the evolution of the PCI Express standard to 16 GBit/s, validation engineers are required to now test between 416 and 752 separate transmitter test conditions across up to 16 output lanes. To accomplish this task with both accuracy and consistency of test to test will require a new approach to both accessing the transmitter outputs and controlling the device under test. This paper will introduce test methods for using a high performance oscilloscope in combination with a signal generator and high speed microwave switch to reduce test time by up to 50 percent or more over conventional practices requiring manual manipulation of test cable connections and manual control of the DUT TX output. Learn how to reduce your test time and potentially increase the accuracy of the measurements you are making by applying frequency domain compensation techniques to de-embed test cable, switch and connector losses.

System-Level Design Track Room: 405TH_404: A BPSK Demodulator Design for Onboard Satellite Telecommand ReceiverMuhammed Abdul Basit, Haq Nawaz, UET Taxila Pakistan

A Binary Phase Shift Keying (BPSK) Demodulator using a novel technique for data recovery process is designed and successfully implemented, hardware realization of demodulator architecture has been carried out and results are presented. The recovered output is differentially decoded to mitigate the phase ambiguity in BPSK demodulation pro-cess. The fabricated demodulator works at a carrier frequency of 8 kHz and has been tested at data rate of 1 kbps. Although the fabricated BPSK demodulator is tested for the data rate of 1 kbps, yet it can be tested for any data rate up to 8 kbps.

System-Level Measurements/Modeling TrackRoom: 406TH_405: A Method to Improve the Efficiency of Agile Frequency Synthesizer TestingPeng Zhang, Rohde & Schwarz

The frequency agility (FA) synthesizer is the core subsystems of frequency agile radar. This paper proposes a new method specifically for frequency hopping (FH/FA synthesizer test, i.e. Option K60 of R&S FSW real time signal and spectrum analyzer, enabling frequency agility signal test. This method not only achieves automatic measurement of FH/FA synthesizer parameters, but also solves the dwell time of frequency agility point, frequency deviation, FH (fre-quency hopping) frequency set, frequency converting time and other items that were not easy to test in the past. It is an efficient and more confidence measurement method.


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▼ Thursday, April 16, 2015 11:20 – 11:40 ▼Measurements & Modeling Track Room: 401TH_501: Measurement of Passive Intermodulation using a Vector Network AnalyzerThilo Bednorz, Rohde & Schwarz

A system is presented to measure intermodulation of passive components as it is necessary for base station filters for mobile communication applications. The system requires only a two source network analyzer that controls power amplifiers to achieve accurate power levels of the high power two tone signal and provides sufficient receiver linearity and sensitivity to measure the intermodulation products.

Design TrackRoom: 402ATH_502: A Rigorous and Simple Method for Loop Circuit Stability AnalysisHongfei Yao, IMECAS

This paper introduces a method for loop circuit stability analysis through investigating its closed-loop admittance and open-loop impedance. This method has wider adaptability and less limitation than the previous approach which uses power-wave transfer function Gamma(s). A 6 GHz HBT oscillator is designed to verify the above method. The measure-ment result shows its sustained effectiveness when the traditional method comes into failure.

EMC/EMI & HSD Measurements/Modeling TrackRoom: 403TH_503: How to Test the DDR4 Circuit and Timing AccuratelyYong Zhao, Keysight Technologies

Nowadays, the memory speed and integrity density is much higher, the DDR4 data rate is up to 3.2 GT/s and the operating voltage is low to 1.2 V, furthermore the chip bus width is up to 64. DDR test and timing analysis has much bigger differences than serial high speed signals, and so electronics engineers must consider the right test method in advance. Methods to test DDR4 signal accurately and timing analysis is introduced in this paper.

System-Level Design Track Room: 405TH_504: Overcoming RF-System Level Challenges in an UHF Multi-Protocol RFID Reader Using Software-Defined Radio (SDR)Tenvoon Wong, Avidus RF Solutions

This paper documents a number of technical challenges that were presented to the design and implementation of a multi-protocol RFID Reader. The RFID system has application in motor-way toll collection equipment, cargo and freight tracking application in and around airport cargo terminals, train depots, and baggage management system in airport terminals. The requirement to read and write multi-standard RFID, both active and passive tags and across many regions of the world, poses technical, inter-operability, and environmental design challenges. The Software-de-fined radio and techniques used to overcome these challenges are presented in this paper. Section 1 describes the requirements and the challenges of the RFID reader. Section 2 briefly outlines the advantages and disadvantages of transceiver architectures for this application. Section 3 presents the implemented solutions and work-around to meet requirements, and section 4 presents the results achieved by the design system. This paper concludes with a commentary on what could be further improved and how the implemented transceiver could be beneficial to other wireless implementation.

System-Level Measurements/Modeling TrackRoom: 406TH_505: mmWave Transceiver Modules for Wireless Communications and W-Band Sensor for Short-range Detection/ImagingXiao Wei Sun, Liang Wu, Minghui Yang, Hao Sun, Rong Qian and Yun Sun, Key Laboratory of Terahertz Solid-State Technology, Shanghai Institute of Micro-system and Information Technology, Chinese Academy of Sciences

This presentation will cover some recent achievements in mm-Wave solid state ICs and micro-systems technology at SIMIT, CAS. Focus will be on making affordable waveguide solutions from designer to customer for all-in-one solutions and concepts at mm-Wave bands. A Ka-band phased array front-end module by VM Technology, V-band (59 to 64 GHz) and E-band (71 to 86 GHz) gigabyte T/R front-end modules will be demonstrated. In addition, a W-band (92 to 98 GHz and 76 to 81GHz) FMCW sensor for short-range detection and imaging applications will be covered. A thin-film process will be shown for high performance mm-Wave and sub mm-Wave HMIC application, and the cut-off frequency for InP & GaAs Schottky barrier diodes will be up to 1 THz.


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▼ Thursday, April 16, 2015 11:40 – 12:00 ▼Measurements & Modeling Track Room: 401TH_601: Fundamentals of Pulsed Power MeasurementsVimal Fernandez, National Instruments

Pulsed RF transmissions such as those used for radar systems can place demanding challenges on RF test equip-ment. More specifically, measuring pulse characteristics of extremely narrow pulse widths requires wide instanta-neous bandwidths. In this presentation, we will explain various measurement techniques for measuring pulse power, rise time, width, and fall time of extremely narrow pulse widths using an RF signal analyzer. More specifically, we will explain how to apply techniques such as radar’s algorithm to improve the accuracy of pulse measurements. In addi-tion, we will explain the effects of RF signal analyzer measurement bandwidth on measurement accuracy. As a result of attending this presentation, engineers will be able to better interpret pulsed transmissions visually using an RF signal analyzer. In addition, they will become familiar with a range of RF signal analyzer settings that can improve the accuracy of the pulse measurements.

Design TrackRoom: 402ATH_602: A 790 to 960 MHz Wideband 600 W LDMOS Asymmetry Doherty Amplifier Huang Hao, Freescale Semiconductor

A 790 to 960 MHz wideband 600 W LDMOS Asymmetric Doherty Amplifier was successfully developed. The Doherty is assembled by a dual path device which operates at 50 V, the carrier side can output 250 W and the peaking side can output 500 W. The circuit can work at wideband from 790 to 960 MHz, about 20 percent bandwidth. It can achieve 18 to 19 dB of small signal gains as well as a peak efficiency of 53 to 58 percent and 8 dB back-off effi-ciency of 46 to 48 percent across the band. The amplifier achieved excellent linearization results when driven with wideband 45 MHz WCDMA signals.

EMC/EMI & HSD Measurements/Modeling TrackRoom: 403TH_603: Standard Document to the Test Floor Measurement - Challenges from the Bluetooth PerspectiveYupeng Jia, Craig Claassen, National Instruments

Bluetooth is driving major innovations in consumer electronics, such as gesture-based TV remote controls, smart watches, sports equipment, health and fitness monitors and home automation products. This presentation will dis-cuss the physical layer measurements of Bluetooth from specification to realization. The topics will include but not limited to hardware setup, transmitter/receiver measurements, test automation, measurement results reporting and analysis. The presentation will conclude with a discussion of the test challenges.

System-Level Design Track Room: 405TH_604: Simulation to Measurement Workflow for DDR4 Electrical and Timing ComplianceAilee Grumbine, Jian Yang, Keysight Technologies

DDR4 memory adoption is accelerated in high performance networking and computing applications. As the transfer speed gets to 3200 MT/s level, design margins for timing, noise and eye opening become tighter than those at 1600 MT/S speed level. This paper presents a simulation-to-measurement workflow for DDR4 electrical and timing com-pliance to JESD 79-4 specifications. Simulation is done on an entire signal path, from a driver pad on the processor chip to the receiver pad on the memory chip. With accurate models, the convolution-based transient simulation is able to predict the waveforms at the receiver pad for all the signal groups in memory design including DQ, DQS, CA (Command and Address), and control signals. These simulated signal waveforms are then fed to DDR4 compliance test software to check for electrical and timing compliance to JESD 74-4 specifications. In the characterization lab, the same DDR4 compliance test software is used to perform measurements on live signals captured with an oscillo-scope. With high performance probes and interposers, along with proper calibration and de-embedding procedures, a good correlation between simulations and measurements can be obtained. Practical examples will be used to illus-trate the benefits of the DDR4 simulation-to-measurement workflow..


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▼ Thursday, April 16, 2015 12:00 – 12:20 ▼Measurements & Modeling Track Room: 401TH_701: S-Parameter Measurements with Modulated SignalsThilo Bednorz, Rohde & Schwarz

A network analyzer system is presented that is able to measure the S-parameters of a device using modulated signals. It can analyze the output power and the S-parameters in time domain with high time resolution as well as in frequency domain. These measurements can be performed using pulsed CW signals as well as modulated RF signals as pulsed FM chirps.

Design TrackRoom: 402ATH_702: Low Phase Noise and Fast Tuning Microwave Signal GeneratorVimal Fernandez, National Instruments

Modern radar, intermodulation distortion (IMD), and interferer testing require high power, fast tuning continuous wave (CW) sources with low phase noise and distortion. NI has incorporated all these features in a small form factor and has developed a patented approach to microwave synthesizer design. Using a dual loop PLL with DDS references, the NI PXIe-5654 20 GHz RF signal generator can effectively achieve -133 dBc/Hz phase noise at 1 GHz (10 kHz offset) and precisely tune between 250 kHz and 20 GHz in less than 100 micro sec. Additionally, the added ability to generate high power levels with fine amplitude control using an automatic level controller (ALC) gives this synthesizer an edge over other designs. This paper will describe the architecture of the NI PXIe-5654 and the tradeoffs taken to achieve its unique performance.

EMC/EMI & HSD Measurements/Modeling TrackRoom: 403TH_703: NFC Analogue Measurement Uncertainty Brought by Position AccuracyTingting He, VI Service

When testing NFC Analogue test cases, there is a concept of operating volume. Up to 70 percent test cases are required to be tested inside the operating volume. As the RF test is very sensitive to test environment, the accuracy of the positioning acts a big role in final measurement uncertainty. In this paper, we will discuss about how posi-tioning accuracy influences the test results. Besides, in the RF specification of NFC Forum, the accuracy of the test positions is 0.5 mm. However, take NFC Forum Reference Equipment Verification Tests (TVRC) for example, we find it very difficult to get the measurement results compared with the test limits as the measurement results differs a lot when moving the antennas a bit which is inside the defined positioning uncertainty. Moreover, the limits of the test requirement are unable to be defined. As a result, the judge of antennas’ quality remains to be a doubt. The quality of the antenna will also affect the measurement. All in all, the positioning accuracy is very critical in NFC Analogue test. Based on all the results of the experiments, a more reasonable positioning accuracy is also recommended in this paper.

System-Level Design Track Room: 405TH_704: Microwave Power Combining System Based on Two Injection-Locked CW MagnetronsHeping Huang, Changjun Liu

A microwave power combining system based for magnetrons has been developed and measured. It is a basic ap-proach to achieve a high power microwave source based on magnetrons. Low power continuous wave magnetrons are applied to the coherent injection-locked and microwave power combining. The successful power combining of two S-Band 1 kW continuous wave microwave oven magnetrons requires that the magnetrons outputs are in-phase at a given frequency. The magnetron injection-locked technology and phase shift method in the experiments are present-ed. An automatic power combining operation and control module based on virtual instrument software are discussed as well.


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▼ Thursday, April 16, 2015 13:30 – 14:10 ▼

WorkshopsMeasurements & Modeling Track Room: 401WS_TH101: Application Circuit to Extend the Bandwidth of Narrow Band Matched MMIC Power AmplifiersMini-Circuits

Most MMIC power amplifiers available today operate with narrow-band matching circuits, usually offering 10% oper-ational bandwidth or less. Market emphasis on wireless communication bands has driven the semiconductor indus-try to focus design effort on these bands. Consequently, design activity on wideband performance in MMIC power amplifiers has waned. However, these narrow band designs are not practical for wideband applications such as VHF/UHF radio, instrumentation, software-defined radios and others. Furthermore, the need for more versatile performance in MMIC power amplifiers is evident, and this need is the basis for developing an application circuit to increase the flexibility of a MMIC amplifier that usually employs narrow band matching. This article will discuss the design of that application circuit for the Mini-Circuits MMIC power amplifier GVA-91+ and present test results demonstrating excel-lent amplifier performance significantly beyond the specified operating frequency range.

Design TrackRoom: 402AWS_TH102: Highly Integrated mmWave PHEMT Foundry ProcessesC. K. Lin, WIN Semiconductors

WIN Semiconductors is engaged in new process development continuously. Now we are aiming to offer the highly integrated mmWave PHEMT process technologies for customers’ high frequency applications, such as including the E-mode PHEMT of 0.15 or 0.1 μm PHEMT process. Moreover, in order to enhance customer’s design cycle and conve-nience, WIN is planning to offer the post wafer service-advanced RF testing probing and final testing.

EMC/EMI & HSD Measurements/Modeling TrackRoom: 403WS_TH103: Resolving Cavity Resonance Effects in Microwave CircuitsFrancis Leong, National Instruments

This presentation will demonstrate how to predict and overcome the effects of cavity resonance on a microwave circuit using features in NI AWR Design Environment; including X models, iCells, EM extraction, and parameterized modifiers. Design using co-simulation of ACE automatic circuit extraction + Analyst 3D finite element method (FEM) technologies will be demonstrated, as well as swept-EM analysis and verification using Analyst.

System-level Design TrackRoom: 405WS_TH104: Microwave-Absorbing MaterialsZhang Hong, Cuming Microwave

With the development of 4G mobile communications and research on 5G standards, there are more microwave com-munication applications being developed. With higher transmission frequency and wider bandwidths, components will be designed into smaller packages creating more challenges to the EMC designers. Cuming Microwave Corporation concentrates on RF & EMC field and provides microwave absorbing materials to designers to solve their EMC design problems and will review some of these applications.

Sponsored by:

Sponsored by:

Sponsored by:

Sponsored by:


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▼ Thursday, April 16, 2015 14:15 – 14:55 ▼Measurements & Modeling Track Room: 401WS_TH201: PCB and Electronic Industry Materials Measurement Methods from Low Frequency to MicrowaveRyoji Takizawa, Keysight Technologies

The dielectric properties measurement such as relative permittivity (dielectric constant: Dk) and dielectric loss tangent (dissipation factor: Df) is essential for the development and quality assurance of PCB materials. This paper introduces suitable methods for measuring dielectric properties of PCB with measurement data and accuracy anal-ysis. Multiple methods to measure general permittivity are discussed, each of which are with limitations in practical terms. Based on the characteristics of PCB material, resonant cavity is suitable for PCB materials whose loss tangent is in 10e-4 range; the parallel plate method is provided as the most easy-to-perform with ready-to-use instrument and fixtures in 1 MHz to 1 GHz range. The transmission line or the free space method should be used for higher frequen-cies.

Design TrackRoom: 402AWS_TH202: A Fast and Reliable High Efficiency GaN PA Design Approach with Measurement Based ModelHu Zhifu, Maury Microwave

GaN devices have the great potential in high-power microwave system applications due to their excellent power microwave characteristics. With the advancement both in process and reliability technology, a range of new GaN products has been put into market. As the competition is becoming more and more intense, design to deliver time of the products is required to be shorter and shorter. Therefore, an accurate device model is quite necessary to achieve success during products development. However, the GaN HEMTs model is still a challenge in PA design because of the troublesome issues such as thermal and dispersion phenomena as well as harmonics and scalability difficulty for big devices. At the beginning of the presentation, we will introduce the most widely used method of solving the problems, while the method is complicated and imperfect. After that, a fast and accurate measurement-based model which may be easier to get is presented in a practical GaN PA design example, the high efficiency PA is realized with only one-round design.

EMC/EMI & HSD Measurements/Modeling Track Room: 403WS_TH203: Communication, Radar Signal Testing and AnalysisWang Feng, CETC41

In recent years, modern radar and communication technology has been developing rapidly, such as the use of increas-ingly complex signal forms. Accordingly, the test for reception, capture and analysis method has been more complex. This paper briefly introduces the complex radar and communication signals test applications and new challenges, as well as the signal test and analysis technology in the core index, capture method, analysis and detection capability of the corresponding test solutions.

Sponsored by:

Sponsored by:

Sponsored by:


50

Exhibitor List

Altair Engineering Inc. ......................................430

Anritsu Co. Ltd. ...............................................309

ANSYS ...........................................................420

AR RF/Microwave Instrumentation ....................607

Arlon-Rogers. ..................................................419

Beijing Linkshire Technology Development Co. Ltd. ..................521

Beijing Mesh Communication Tech Co. Ltd. .......520

Bowei Integrated Circuits Co. Ltd. .....................434

CETC41 ..........................................................515

Changzhou Zhongying SCI&TEC Co. Ltd. ............539

Cobham Metelics ............................................611

Corad Technology Ltd. ......................................608

CST-Computer Simulation Technology AG ...........415

CTS Electronic Components .............................523

Dalian Dalicap Tech Co. Ltd. .............................239

DelfMEMS ......................................................431

Dynamic Engineers Inc. ...................................518

Dynax Semiconductor Inc. ................................332

Eastample Technology Ltd. ...............................507

EDI CON 2016, Press/Media ...........................337

eeWorld ..........................................................537

Electronic Engineering & Product World ..............535

EMC Technology/Florida RF Labs ......................211

EPC (Electronic Products China+21ic) ................533

ERA Spread Ltd. ..............................................201

Farran ............................................................409

Focus Microwaves Inc. .....................................409

Freescale Semiconductor Inc. ...........................338

Gigalane Co. Ltd. ............................................620

Gore ..............................................................437

Hebei Plasma Diamond Technology Co. Ltd. ......530

Hongke Technology Co. Ltd ..............................318

HUBER + SUHNER ...........................................300

Interference Technology ....................................231

Isola Group .....................................................219

JHT (Beijing) Technology Co. .............................205

Keysight Technologies ......................................401

MACOM ..........................................................321

Maury Microwave Corp. ....................................618

Microwave Journal ...........................................233

Microwave Vision AMS Ltd. ..............................223

Millitech Inc. ...................................................209

Mini-Circuits ....................................................501

Mitron Inc. ......................................................601

National Instruments ......................................315

Nelco Products Pte. Ltd. ..................................331

NXP Semiconductors .......................................427

Park Electrochemical Corp. ..............................331

Peregrine Semiconductor .................................308

Pickering Interfaces .........................................318

RFEDA ............................................................221

RFHIC Corp. ....................................................215

RFLab Circuits Ltd. ..........................................335

Richardson RFPD.............................................327

Rogers Corp. ...................................................421

Rohde & Schwarz ............................................301

Sample Technology (Shanghai) Co. Ltd. .............532

Sanetronic Co. Ltd...........................................304

Shanghai Huaxiang Computer Communication Engineering Co. Ltd. ..............307

Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences (RFID) ..........................606

Shanghai Radiall Electronics Co. Ltd. ................326

Shengyi Technology Co. Ltd. .............................531

Siemens PLM Software ....................................427

SignalCore Inc. ................................................207

Sino Microtech Beijing Co. Ltd. .........................409

Sonnet Software .............................................534

Spectratronix ..................................................529

Spectrum Elektrotechnik GmbH ........................433

Spinner Telecommunication Devices (Shanghai) Co. Ltd. .......................................506

Taconic Advanced Material (Suzhou) Co. Ltd. .....519

Tect Electronics ...............................................227

Tektronix (China) Co. Ltd. .................................536

Teledyne LeCroy ..............................................322

The MOSIS Service ..........................................435

Times Microwave Systems ...............................406

Transcom Instruments Co. Ltd. .........................407

TranSemic Technology Ltd. ...............................427

Tusonix ...........................................................523

Vi Service Network Co. Ltd. ..............................330

Wai Tat Electronics Ltd. ....................................509

WIN Semiconductors Corp. ..............................527

Company Booth Company Booth


51

Exhibitor Floor Plan

South Foyer 南序厅 – Panel Session

VIPRoom 4-2

Conference Rooms 会议室

East

Foyer

Registration北大堂，注册处

Entrance 出入口Press/Media

408409

401 402A 402B 403 405 406 407

Access to Conference Rooms 至会议室

Aud

itori

um

Walkway to CNCC Grand Hotel 步行至国家会议中心大酒店

Pere

grin

e

Cora

d

608

211EMC

Anritsu WaiTat

409

322LeCroy

Ansys

620

Giga

lane

223MVG

RFEDAMACOM 523

JHT

201 300

205

OMM

IC

209

215

219

221

304

Huber+Suhner

308

Sane

troni

c

318

RFHIC

PICO

Pick

erin

g

301

R&S罗德与施瓦茨

Keysight

Focus FarranSINO MW

TransemicNXP

Siemens PLMRichardson

307207SHX Times

309

315

NI

321

406

420

401

>3.5 m

407Transcom Spinner

506

415

CST

Roge

rs

421

419DEI518

Mes

h Co

mm

520

501

507

509

515

519Taconic

Maury

Linkshire

Eastample

CETC41

521

606

618

601

607

611Aeroflex

ARRF

国家会议中心4层4th �oor，China National Convention Center

北N

东序厅

Coffe

e/M

eetin

g A

rea

会

区域

Coffe

e/M

eetin

g A

rea

会

区域

338

CTS

WIN

PDT

SIMIT

Isola

Shengyi

Spectratronix

Zhongying

eeWorld

EEPW

Sample EPC534

536

Tekt

roni

x

530

532

434

430

535

537

539

533

531

Gore

527

529

Arlon

RFlab437

435

433

Millitech

SignalCore

Spectrum

Mosis SonnetBowei

431DELF-MEMS

427

337

EDI CON 2016

335

333

331

Altair

327

Free

scal

e

334

332Vi

Dynax

XtalTQ

330

Radi

all

326

MWJ

239Dalian

233

231IT

TECT

227

Mini-Circuits Mitron

>3.5 m >3.5

m

>3.5 m

Post

er S

essi

on 海

报论

文张

贴处

2015


52

Notes

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