Composite Plating Process
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PATENTS GRANTED In the Metal Finishing Field Printed copies of patents are furnished by the Patent and Trademark Office for $3.00 each Address orders to: Commissioner of Patents and Trademarks. Washington, D.C. 2023 1. Airless Spray Gun U.S. &dent 5,660,332. Aug. 26, 1997 D.H. Carey and J.D. Geberfh, assignors fo Titan Tool Inc., Oakland, IV.J. A spray tip guard for hydraulically op- erated airless spray gun. Blasting Nozzle U.S. Patent 5,660,560. Aug. 26,1997 7X Lehnig, assignor to Co/d Jet Inc., Cincinnati A nozzle for a cryogenic particle blast system. Electroless Gold Plating Solution U.S. Patent 5,660,619. Aug. 26, 1997 H. Wachi and Y Otani, assignors fo Electroplating Engineer of Japan Ltd., Tokyo An electroless gold plating solution con- taining a gold alkali metal cyanide, a bo- ron-based reducing agent, an alkali metal hydroxide as a pH controller, and a lead compound, wherein 0. I to IO g/L of a chelating agent and 5 to 99 m&/L of sodium nitrobenzenesulfonate, p-nitrobenzoic acid, or mixtures thereof are added, whereby the sodium nitrobenzenesulfonate or p-ni- trobenzoic acid is added as an oxidant to control the action of the reducing agent to reduce undesirable spread of plated areas. Removing Sputtered Deposits U.S.Patent 5660,640. Aug. 26, 1997 D.r? Laube, assignor to Joray Corp., Phoenix A method for the removal of deposited material from equipment components used in a vapor deposition process comprising immersing the components in an aqueous bath 5 to 8% by volume of ammonia hy- droxide and 3X to 42% by volume of hy- drogen peroxide; maintammg at a temper- ature below ambient during immersion: removing the components from the bath; subjecting to an acid etch; and applying a rinsing fluid. Sputtering Process U.S. Patenf 5,660,696. Aug. 26, 1997 J. Moon, assignor to Samsung Electronics Co. Ltd.. Suwon. Republic of Korea A method for forming titanium lines by sputtering. Electroplating Apparatus U.S. Pafent 5,660,699. Aug. 26, 1997 T Saito et al, assignors to Kao Corp., Tokyo An electroplating apparatus comprising a cathode electrode for supporting a sub- strate; a body disposed below the cathode for moving upwardly and Idownwardly rel- ative to the cathode and a clamp mounted on the body and adapted to clamp a periph- eral edge portion of the substrate against the cathode; and a pressure source for sup- plying compressed air through a first feed conduit so that the body and clamp are moved downwardly with respect to the cathode to clamp the substrate. Composite Plating Process U.S. Patenf 5,660,704. Aug. 26, 1997 Y: Murase, assignor to Yamaha Hatsudoki KK, Shizuoka-ken, Japan A method for forming a plating coating having a nonhomogeneous distribution of a dispersed substance consis.ting essentially of placing a hollow cylimlrical electrode having an end inside a work having a cy- lindrical inner surface. wherein an inner passage of plating liquid i:; formed inside the hollow cylindrical electrode, and an outer passage of plating liquid is formed between the hollow cylindrical electrode and the cylindrical inner surface of the work; permitting a plating liquid contain- ing a dispcrscr! substance to flow at a plat- ing liquid flow rate of I .O to 70 rn/sec through the outer passage and inner pas- sage; impressing a voltage between the work and electrode to <rive a current den- sity of 20 to 400 A/dm?therebetween; and after initiating deposition of a plating coat- ing changing the plating liquid flow rate, or the plating liquid flow rate and the electric current density, at intervals 1.n continuously such that the plating liquid flow rate is increased to decrease the ;amount of dis- persed substance to producs an outwardly nonhomogeneous distribution of dispersed substance. Method of Repairing a Steam- Generator Tube by Electroplating U.S. Pafent 5,660,705. Aug. 26, 1997 B. Michaut, assignor to Framatome. Courbevioe, France A method of repairing a steam-generator tube crimped in a tube plate lining, to repair a wall of the tube having cracks resulting from stress corrosion and to prevent leaks of primary cooling through the wall of the tube, said method consisting of electroplat- ing an inner surface of the tube with a rnetal layer in a region to be repaired, wherein the plated metal layer has a thick- ness greater than 0.5 mm and is a nonmag- netic nickel alloy to allow continuous mon- itoring of leaks by eddy currents. Electroless Plating Process U.S. Patent 5.660,706. Aug. 26, 1997 8. Zhao and PK Vasudev. assignors lo Sematech Inc., Ausfin, Texas A method for electric field initiated elec- troless metal deposition, Zinc-Coated Sheet Steel US. Patent 5,660,707. Aug. 26, 1997 CR. Shastry ef al, assignors lo Bethlehem Steel Corp., Bethlehem, Pa. A method for improving formability and weldability properties in sheet steel product on which a protective layer is formed on at least one surface thereof, the protective layer being an electroplated or hot-dip coated protective layer and comprising at least zinc by chemically applying an alka- line buffered solution comprising an oxi- dizer to the protective layer to form a zinc oxide layer thereon, said alkaline solution having a pH range of 7 to I I. Process for Manufacturing a Lead Frame US'. Patent 5,660,708. Aug. 26, 1997 Y Tezuka et a/., assignors to Sumitomo Metal Mining Co. Ltd., Tokyo A process for manufacturing a lead frame by polishing a blank for a lead frame electrolytically and plating the electrolyti- cally polished surface of the blank with a metal, wherein the electrolytic polishing of the blank is carried out by employing a contactless electrolytic polishing apparatus and applying a direct current with ripples having a frequency of 4.0 to 120 Hz alter- nately to the anode and cathode in an elec- trolytic polishing tank filled with an elec- trolytic polishing solution. so that the time METAL FINISHING . MAY 1998 77
Transcript of Composite Plating Process
PATENTS GRANTED In the Metal Finishing Field Printed copies of patents are furnished by the Patent and Trademark Office for $3.00 each Address orders to: Commissioner of Patents and Trademarks. Washington, D.C. 2023 1.
Airless Spray Gun U.S. &dent 5,660,332. Aug. 26, 1997 D.H. Carey and J.D. Geberfh, assignors fo Titan Tool Inc., Oakland, IV. J.
A spray tip guard for hydraulically op- erated airless spray gun.
Blasting Nozzle U.S. Patent 5,660,560. Aug. 26,1997 7X Lehnig, assignor to Co/d Jet Inc., Cincinnati
A nozzle for a cryogenic particle blast system.
Electroless Gold Plating Solution U.S. Patent 5,660,619. Aug. 26, 1997 H. Wachi and Y Otani, assignors fo Electroplating Engineer of Japan Ltd., Tokyo
An electroless gold plating solution con- taining a gold alkali metal cyanide, a bo- ron-based reducing agent, an alkali metal hydroxide as a pH controller, and a lead compound, wherein 0. I to IO g/L of a chelating agent and 5 to 99 m&/L of sodium nitrobenzenesulfonate, p-nitrobenzoic acid, or mixtures thereof are added, whereby the sodium nitrobenzenesulfonate or p-ni- trobenzoic acid is added as an oxidant to control the action of the reducing agent to reduce undesirable spread of plated areas.
Removing Sputtered Deposits U.S.Patent 5660,640. Aug. 26, 1997 D.r? Laube, assignor to Joray Corp., Phoenix
A method for the removal of deposited material from equipment components used in a vapor deposition process comprising immersing the components in an aqueous bath 5 to 8% by volume of ammonia hy- droxide and 3X to 42% by volume of hy- drogen peroxide; maintammg at a temper- ature below ambient during immersion: removing the components from the bath; subjecting to an acid etch; and applying a rinsing fluid.
Sputtering Process U.S. Patenf 5,660,696. Aug. 26, 1997 J. Moon, assignor to Samsung Electronics Co. Ltd.. Suwon. Republic of Korea
A method for forming titanium lines by sputtering.
Electroplating Apparatus U.S. Pafent 5,660,699. Aug. 26, 1997 T Saito et al, assignors to Kao Corp., Tokyo
An electroplating apparatus comprising a cathode electrode for supporting a sub- strate; a body disposed below the cathode for moving upwardly and Idownwardly rel- ative to the cathode and a clamp mounted on the body and adapted to clamp a periph- eral edge portion of the substrate against the cathode; and a pressure source for sup- plying compressed air through a first feed conduit so that the body and clamp are moved downwardly with respect to the cathode to clamp the substrate.
Composite Plating Process U.S. Patenf 5,660,704. Aug. 26, 1997 Y: Murase, assignor to Yamaha Hatsudoki KK, Shizuoka-ken, Japan
A method for forming a plating coating having a nonhomogeneous distribution of a dispersed substance consis.ting essentially of placing a hollow cylimlrical electrode having an end inside a work having a cy- lindrical inner surface. wherein an inner passage of plating liquid i:; formed inside the hollow cylindrical electrode, and an outer passage of plating liquid is formed between the hollow cylindrical electrode and the cylindrical inner surface of the work; permitting a plating liquid contain- ing a dispcrscr! substance to flow at a plat- ing liquid flow rate of I .O to 70 rn/sec through the outer passage and inner pas- sage; impressing a voltage between the work and electrode to <rive a current den- sity of 20 to 400 A/dm?therebetween; and after initiating deposition of a plating coat- ing changing the plating liquid flow rate, or the plating liquid flow rate and the electric current density, at intervals 1.n continuously such that the plating liquid flow rate is increased to decrease the ;amount of dis- persed substance to producs an outwardly nonhomogeneous distribution of dispersed substance.
Method of Repairing a Steam- Generator Tube by Electroplating U.S. Pafent 5,660,705. Aug. 26, 1997 B. Michaut, assignor to Framatome. Courbevioe, France
A method of repairing a steam-generator tube crimped in a tube plate lining, to repair a wall of the tube having cracks resulting from stress corrosion and to prevent leaks of primary cooling through the wall of the tube, said method consisting of electroplat- ing an inner surface of the tube with a rnetal layer in a region to be repaired, wherein the plated metal layer has a thick- ness greater than 0.5 mm and is a nonmag- netic nickel alloy to allow continuous mon- itoring of leaks by eddy currents.
Electroless Plating Process U.S. Patent 5.660,706. Aug. 26, 1997 8. Zhao and PK Vasudev. assignors lo Sematech Inc., Ausfin, Texas
A method for electric field initiated elec- troless metal deposition,
Zinc-Coated Sheet Steel US. Patent 5,660,707. Aug. 26, 1997 CR. Shastry ef al, assignors lo Bethlehem Steel Corp., Bethlehem, Pa.
A method for improving formability and weldability properties in sheet steel product on which a protective layer is formed on at least one surface thereof, the protective layer being an electroplated or hot-dip coated protective layer and comprising at least zinc by chemically applying an alka- line buffered solution comprising an oxi- dizer to the protective layer to form a zinc oxide layer thereon, said alkaline solution having a pH range of 7 to I I.
Process for Manufacturing a Lead Frame US'. Patent 5,660,708. Aug. 26, 1997 Y Tezuka et a/., assignors to Sumitomo Metal Mining Co. Ltd., Tokyo
A process for manufacturing a lead frame by polishing a blank for a lead frame electrolytically and plating the electrolyti- cally polished surface of the blank with a metal, wherein the electrolytic polishing of the blank is carried out by employing a contactless electrolytic polishing apparatus and applying a direct current with ripples having a frequency of 4.0 to 120 Hz alter- nately to the anode and cathode in an elec- trolytic polishing tank filled with an elec- trolytic polishing solution. so that the time
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