Componenti passivi a microonde per applicazioni … Powder bed fusion: thermal energy selectively...

1st Workshop “Components4Space” - ASI 2016

Peverini O. A., Addamo G., Lumia M., Virone G., Tascone R.

Componenti passivi a microonde per applicazioni Spazio:

Stato dell'arte e prospettive basate sull'utilizzo di tecnologie di Additive Manufacturing

La Componentistica Nazionale per lo Spazio: Stato dell’arte, Sviluppi e Prospettive

ASI – Roma, 18-21 Gennaio 2016

Manfredi D., Ambrosio E. P., Calignano F., Cattano G., Chiappone A., Fino P., Lorusso M., Pakkenen J., Trevisan F.


Research Context

Expertise in RF equipment for Space

Instrumentation for scientific surveys (INAF, ASI)

Satellite communications (TAS-I - Space Antennas RF Design Unit)

Expertise in Additive Manufacturing

Robotic structures (IIT-ADVR)

Heat exchangers (PoliTo)


Additive Manufacturing

ASTM definition of Additive Manufacturing (AM)

A process of joining materials to make objects from 3-D model data, usually layer

upon layer, as opposed to subtractive manufacturing methodologies

ASTM classification of AM technologies

Binder jetting: a liquid bonding agent is selectively deposited to join powder materials.

Direct Energy deposition: focused thermal energy is used to fuse materials by melting as they are

being deposited.

Material extrusion: material is selectively dispensed through a nozzle or orifice (Fused Deposition

Modelling)

Material jetting: droplets of build materials are selectively deposited (3-D inkjet printing)

Powder bed fusion: thermal energy selectively fuses regions of a powder bed (Electron Beam

Melting, Selective Laser Melting)

Sheet laminations: sheets of material are bonded to form an object

Vat photo-polymerization: liquid photopolymer in a vat is selectively cured by light-activated

polymerization (Stereolitography)


Additive Manufacturing of RF Components

Technology Material Coating RF components Band

Fused Deposition Modeling

(FDM)

Polymers (ABS, PLA)

Conductive paintings

Patch and conical antennas Feed-horns

Microstrip and SIW filters Dielectric lenses

1 GHz – 18 GHz

3-D inkjet printing Polymers

Conductive inks Conductive paintings

Planar components 1 GHz – 18 GHz

Stereolitography (SLA) Ceramics

(alumina, zirconia) Polymers

Conductive paintings

Electroless plating

Waveguide filters Polarizers

Feed-horns Dielectric lenses

5 GHz – 110 GHz

Selective Laser Melting (SLM)

Metals (Al-alloy, Ni bronze)

Ag/Ni plating Waveguide filters

Ortho-mode transducers Beam-forming networks

10 GHz – 31 GHz

State of Art

13% 7%

11%

13% 56%

2004-2011

2012

2013

2014

2015


ESA R&D Activities in AM of RF Components

Some recent R&D activities under ESA ARTES 5.1 programme

Advanced design and manufacturing techniques for antenna feed chains

Additive manufacturing for user terminal front-ends

Miniaturised Ka-band beamforming network using additive manufacturing techniques

Low cost precision manufacturing RF passive hardware

Additive manufacturing of large focal arrays

Some potential R&D activities under ESA GSTP-6 E.1 programme

Development of one single part integrating waveguide filter, bends, couplers, supporting structures

made by additive manufacturing

Evaluation and consolidation of additive manufacturing processes and materials for the

manufacturing of RF hardware

Development of low areal density aluminium alloy mirrors using additive manufacturing


Application 1: Multi-Band Antenna Systems

Parameters Ku Tx Band Ku Rx Band K Tx Band

Operative Band (GHz) 10.7 12.75 13.0 14.5 17.7 21.2

Polarization and Versus HP&VP HP&VP LHCP/RHCP

Thermal bandwidth 35/50 MHz @ each band side

Cross Polarisation -40 dB -40 dB -40 dB

Return Loss (VSWR) -20 dB -20 dB -20 dB

Ports Isolation (any port, any band )

> 60 dB > 60 dB > 60 dB

Number of Ports 2 2 2

Waveguide WR75 WR75 WR51

Power Handling 10 carriers x

110 W (for each pol.)

N.A. 4 x 110W

(for each pol.)

Multipaction Free + 6 dB

margin N.A.

Free + 6 dB margin

Intermodulation Product Level

<-140 dBm@ (2x 120 W carriers)

Minimum IMP order 3rd 16th

TAS-I Ku/K-band antenna system for commercial SatCom

Ku Tx Ku Rx K Tx

Multi-band

antenna-feed

system


Ku/K-band OMJ

Wide-band feed-horn

Ku-band OMT

Dual-polarization LPF

Ku-band Tx V-pol. signals

Ku-band diplexer

Ku-band Rx V-pol. signals

Ku-band diplexer

Ku-band Tx H-pol. signals

Ku-band Rx H-pol. signals

K-band Tx RHCP signals

Hybrid coupler

K-band Tx LHCP signals


TAS-I Ku/K-band antenna-feed system developed with CNR-IEIIT

Ku Tx Ku Rx K Tx

Multi-band

antenna-feed

system


Bread-board

K-band rejection


TAS-I Ku/K-band antenna-feed

system developed with CNR-IEIIT

18 19 20 21-90

-80

-70

-60

-50

-40

-30

-20

-10

0

f [GHz]

ma

gn

itud

e [

dB

]

Computed

Measured (V-pol.)

Measured (H-pol.)

Ku/K-band

feed-horn Ku/K-band

self-diplexing

OMT Ku-band

OMT

K-band

90°

hybrid

K-band

combiners

X


Application 2: Multi-Spot SFB Antennas

Band

B1 B1 P

ola

riza

tio

n

RHCP

LHCP

Multi-spot Single-Feed per Beam (SFB)

architectures

Frequency reuse

A dedicated feed-system per each spot

(typical diameter 0.5o )

Overlapping spots

K/Ka

K/Ka

K/Ka

K/Ka


-20 -15 -10 -5 0 5 10 15 20-20

-18

-16

-14

-12

-10

-8

-6

-4

-2

0

Theta [deg]

Ma

gn

itu

de

[d

B]

Frequency 28.0 GHz

Veq

rx TE

11

Veq

rx TM

01

Veq

rxTE

21

Ka-band OMJ

Wide-band

feed-horn K-band OMT

Dual-polarization

Ka-band SBF

K-band Tx signals

Tracking

sub-system

D-mode HF Rx signal

for tracking

High-efficiency horn

HF hybrid +

diplexers

K-band Rx signals

In-line compact assembly

Radiation patterns @ 28 GHz

Application 2: Multi-Spot SFB Antennas

K/Ka-band antenna-feed system design study

by CNR-IEIIT & TAS-I


AM for Space RF Components

Advantages

Manufacturing of parts with complex geometries integration of several RF functionalities in a single block, minimization of flanges and screws (e.g. SFB and MFB SatCom systems), PIM product generation

Design flexibility novel layouts of waveguide components

Near-net shapes reduction of mass and waste

Reduction of lead time and cost more efficient component development


AM for Space RF Components

Main concerns (?)

Manufacturing accuracy and repeatability poor RF performance @ high frequencies (Ka, Q bands)

Maximum part size no applicability to low frequency applications (C, X bands)

Surface roughness high insertion losses

Advantages

Manufacturing of parts with complex geometries integration of several RF functionalities in a single block, minimization of flanges and screws (e.g. SFB and MFB SatCom systems), PIM product generation

Design flexibility novel layouts of waveguide components

Near-net shapes reduction of mass and waste

Reduction of lead time and cost more efficient component development


SLM Process: 3D CAD model

A set of parameters must be defined in order to respect the specifications as well as the manufacturing constraints (thicknesses, filled radii, ...).


The main functions of the supports are to fix the part to building platform and conduct excess heat away from the part.

SLM Process: Support Structure


A key enabling principle of AM part manufacture is the use of layers as finite 2D cross-sections of the 3D model.

SLM Process: Slicing


SLM Process: Part Build


SLM Process: Part Build

Technical Data

Effective building volume (including building platform)

250 mmx 250 mm x 215 mm

Building speed (material-dependent)

2 – 20 mm3/s

Layer thickness (material-dependent)

20 – 60 µm

Laser type Yb-fibre laser, 200 W

Precision optics F-theta-lens, high-speed scanner

Scan speed 100-3000 mm/s

Variable focus diameter 100 – 200 µm

Power supply 32 A

Power consuption Maximum 5.5 kW

Nitrogen generator Standard

Compressed air supply 7,000hPa; 20 m3/h

DMLS is an EOS Gmbh tradename for SLM

DMLS EOS M270 Dual Mode

Materials: StainlessSteel GP1/PH StainlessSteel AISI 316 CobaltChrome MP1 NickelAlloy IN625 NickelAlloy IN718 Titanium Ti64 Aluminium AlSi10Mg AISI 316L


Stress relieving by thermal treatment is used to remove residual stresses that have accumulated from manufacturing processes. The part must be separated from a build platform on which the part was produced.

SLM Process: Stress Relieving


Post-processing: shot-peening, polishing and sandpapering, or application of coatings

With glass microspheres (200μm) at 8 bar

Ra ~ 5 mm

Shot peening is a cold working process in which small spherical media called shot bombard the surface of a part

SLM Process: Post-processing

After As built


Study for optimizing the realization of holes (0.5:0.5:6) and slots (0.25:0.5:3)

Benchmark: helps to know the limits of the technology to be confident in designing

Different building degrees of slope

Mechanical Benchmarks for SLM

radii (positive and negative) angles dimensional control

(Reverse Engineering)


Transmission coefficient

RF Benchmarks for SLM

Nominal model

ρ = 1.0E1 mW cm (typical of EDM, milling)

K-band WR51 cavity in AlSi10Mg and in Ti6Al4V



Nominal model


DUT A

Ti6Al4V prototype “as built” ρ = 1.9E3 mW cm





Nominal model


DUT A


DUT B

Ti6Al4V prototype after thermal treatment and shot-peening ρ = 2.5E2 mW cm




Nominal model


DUT A


DUT B

Ti6Al4V prototype after thermal treatment and shot-peening ρ = 2.5E2 mW cm

DUT C

AlSi10Mg prototype after thermal treatment and shot-peening ρ = 4.0E1 mW cm





26 28 30 32 34 36 38-60

-50

-40

-30

Frequency (GHz)

Ma

gn

itu

de

(d

B)

26 28 30 32 34 36 38-0.1

-0.08

-0.06

-0.04

-0.02

0

Frequency (GHz)

Ma

gn

itu

de

(d

B)

26 28 30 32 34 36 38-70

-60

-50

-40

-30

Frequency (GHz)

Ma

gn

itu

de

(d

B) Reflection coefficient


Ka/Q-band waveguide straights in AlSi10Mg

WR28 straights WR22 straights Ka-band circular and square straights Q-band circular and square straights

Co-polar transmission

Cross-polarization


12 13 14 15 16

-0.25

-0.2

-0.15

-0.1

-0.05

0

Frequency (GHz)

Ma

gn

itu

de

(d

B)

Ku/K-band Low-pass Filter

Parameter Value

Pass-band 12.5 - 15.0 GHz

Stop-band 17.5 - 21.2 GHz

Return loss ≥ 24 dB

Insertion loss ≤ 0.11 dB

Rejection ≥ 40 dB

Port flange WR51

Dimension (width x height x length)

30 mm x 30 mm x 48 mm

Weight < 25 g

No tuning screws, part re-machining

or silver-plating

Insertion loss

Fifth-order WR51 stub filter in AlSi10Mg 3 prototypes

Return loss & Rejection

12 14 16 18 20 22-70

-60

-50

-40

-30

-20

-10

0

Frequency (GHz)

Ma

gn

itu

de

(d

B)

S11

S21


12 13 14 15 16

-0.25

-0.2

-0.15

-0.1

-0.05

0

Frequency (GHz)

Ma

gn

itu

de

(d

B)

S11

S21

Ku/K-band Low-pass Filter

Return loss & Rejection

Parameter Value

Pass-band 12.5 - 15.0 GHz

Stop-band 17.5 - 21.2 GHz

Return loss ≥ 25 dB

Insertion loss ≤ 0.12 dB

Rejection ≥ 50 dB

Port flange WR51

Dimension (width x height x length)

30 mm x 30 mm x 52 mm

Weight < 30 g No tuning screws, part re-machining

or silver-plating

Insertion loss

Sixth-order WR51 slanted-stub filter in AlSi10Mg 2 prototypes

12 14 16 18 20 22-80

-70

-60

-50

-40

-30

-20

-10

0

Frequency (GHz)

Ma

gn

itu

de

(d

B)

S11

S21


Conclusions

SLM manufacturing of RF components in AlSi10Mg

Mechanical accuracy: 0.1 mm (worst-case)

Surface roughness: Ra 5-15 mm

Electrical resistivity: < 16 mW cm (no coating is necessary)

Repeatability: good

Ku/K-band low-pass filters are feasible

K/Ka-band OMTs are under investigation

SLM manufacturing of RF components in Ti6Al4V

Mechanical accuracy: 0.05 mm (worst-case)

Surface roughness: Ra 4-10 mm

Electrical resistivity: > 200 mW cm (coating is necessary)

Repeatability: under investigation

Coating of complex parts is under investigation

Ku/K-band low-pass filters are under investigation


THANKS FOR YOUR ATTENTION

contacts: [email protected]

mailto:[email protected]


Examples of SLM Components

Hydraulic manifolds

Finger exoskeleton


high specific strength and stiffness good corrosion resistance good thermal conductivity final density 99.2% DMLS process reliable and

reproducible fracture’s surfaces with dimples of

nanometric thickness

Properties Applications

used for parts with thin walls and complex geometry subjected to high loads, as in the aerospace and automotive industries

Si: 9 – 11 wt%, Mg: 0.2 – 0.45 wt%,Fe, Cu, Ni, Zn: ≤0.1 wt% , Al: Balance

SLM for RF Components: Metal Powders

AlSi10Mg

Al: 5.5 – 6.5 wt %, V : 3.5 – 4.5 wt %, N < 500 ppm, C < 800 ppm, H < 120 ppm, Fe < 2500 ppm, Ti: Balance

Properties

excellent mechanical properties corrosion resistance low specific weight biocompatibility better surface finishing higher manufacturing accuracy higher powders costs

Applications

ideal for many high-performance engineering applications, for example in aerospace and motor racing, and also for the production of biomedical implants

Ti6Al4V

Componenti passivi a microonde per applicazioni … Powder bed fusion: thermal energy selectively...

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