Company Profile 2… · chipsets by 2021. Small Cell 18 Source:Skyworks According to an estimate...
Transcript of Company Profile 2… · chipsets by 2021. Small Cell 18 Source:Skyworks According to an estimate...
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Company Profile
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World-class leading edge with MOCVD
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Safe Harbor Notice
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Core Technology
MOCVD(有機金屬氣相沉積法有機金屬氣相沉積法有機金屬氣相沉積法有機金屬氣相沉積法)
- Metal Organic Chemical Vapor Deposition
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MOCVD(有機金屬氣相沉積法有機金屬氣相沉積法有機金屬氣相沉積法有機金屬氣相沉積法)
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Semiconductor(by Material)
Semiconductor
GaAs, InP, GaN, GaP, GaSb...
ElementSi ,Ge
CompoundIII-V
IV-IV SiC, SiGe
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Period Column II III IV V VI
2Be鈹
Beryllium
B硼Boron
C碳Carbon
N氮Nitrogen
O氧Oxygen
3Mg鎂
Magnesium
Al鋁Aluminum
Si矽Silicon
P磷Phosphorus
S硫Sulfur
4Zn鋅Zinc
Ga鎵Gallium
Ge鍺Germanium
As砷Arsenic
Se硒Selenium
5Cd鎘
Cadmium
In銦Indium
Sn錫Tin
Sb銻Antimony
Te碲Tellurium
6Hg汞
Mercury
Tl鉈Thallium
Pb鉛Lead
二元化合物 Binary : GaAs, InP, GaP,GaN, etc.
三元化合物 Ternary : InGaAs, InGaP, AlGaAs, etc.
四元化合物 Quaternary : AlGaInP, InGaAsP, etc.
五元化合物 Pentanary : AlGaInAsN, etc.
CompoundII-VI ZnSe, ZnS, CdS, etc.
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AsH : Arsine
化學反應式:
主要原物料:
MO Source + Hydride + Carrier Gas:H2
Chemical Reaction During Epitaxy
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TMAl Tri - Methyl - Aluminum ( CH3 )3Al
三 甲基 鋁
Al
CH3
CH3CH3
TEAl : Tri-ethyl-Aluminum ( C2H5 )3Al
TMGa : Tri-Methyl-Gallium ( CH3 )3 Ga
TMIn : Tri-Methyl-Indium ( CH3 )3In
DETe : Di-ethyl-Tellurium ( C2H5 )2Te
DEZn : Di-ethyl-Zinc ( C2H5 )2Zn
CP2Mg : Bis (cyclo-penta-dienyl ) Magnesium 環戊二烯鎂
AsH3 : Arsine
PH3 : Phosphine
SiH4 : Silane
Si2H6 : Disiline
H2Se : Hydrogen Selenide
CBr4 : Carbon Tetrabromide
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Advantages of CompoundsemiconductorAdvantages of CompoundsemiconductorAdvantages of CompoundsemiconductorAdvantages of Compoundsemiconductor
1. High Electron Mobility高電子移動速率(5.7x higher than CM0S)
2. High Frequency Response高頻率響應3. Wide Band Width 寬幅之頻寬4. High Linearity高線性度
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4. High Linearity高線性度5. High Power高功率6. Alternative Choice of Material材料選擇多元性7. 抗輻射
適用於無線通訊 、光纖通訊、光顯示(LED)& 太陽能產業
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GaAs in Wireless Communication Supply Chain
4~6 ”GaAs Substrate
Microelectronics
IC Process
GaAs Epi- Wafer
磊晶片磊晶片磊晶片磊晶片
Sumitomo, Freiberg, AXTSumitomo, Freiberg, AXTIDM:Skyworks, Qorvo,
Avago, Anadigics
IDM:Skyworks, Qorvo,
Avago, Anadigics
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Wireless Communication
MOCVD Reactor
IC Package & Testing
Substrate
Foundry:
WIN, AWSC,
GCS
Foundry:
WIN, AWSC,
GCS
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Global GaAs wafer market
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Global GaAs wafer market
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Source:Yole
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Global GaAs market
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GaAs with More and More Application
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•HBT
Microelectronics
•LD
Photonics
VPEC’s products
•HBT•PHEMY•BiHEMT•GaN on Sic
•LD•VCSEL•PD
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RF
Source:Avago
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IoT(802.11ac/802.11ax/802.11ad)
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802.11ax will greatly increase network capacity by supporting up to eightsimultaneous data streams, each delivering up to 1.2 Gbps, to connectmany more devices at greater speeds. 802.11ax portfolio includes 2.4GHzand 5GHz front-end modules (FEMs) and BAW filters.According to ABI Research, 802.11ax devices will account for 57% of Wi-Fi chipsets by 2021
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Small Cell
18Source:Skyworks
According to an estimate from Small Cell Forum, small cell shipments are expected to more than double from a base of 3.8 million units in 2016 to 7.8 million units by 2020 , creating a $6 billion market segment.
According to an estimate from Small Cell Forum, small cell shipments are expected to more than double from a base of 3.8 million units in 2016 to 7.8 million units by 2020 , creating a $6 billion market segment.
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iPhone XS
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Source:iFixit
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iPhone XR
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Source:iFixit
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iPhone XR
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Source:iFixit
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iPhone X(Intel)
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iPhone X(Qualcom)
23Source:iFixit
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Samsung Galaxy S9
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Source:iFixit
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Samsung Galaxy Note9
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Source:iFixit
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Huawei Mate20 Pro
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Source:iFixit
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Apple Watch
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Source:iFixit
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5G is coming
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Customers’ Design Win
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5G Smart Phone Shipments
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Source: Business WireSource: Business Wire
Ericsson Mobility Report forecasts over 1 billion subscriptions by the end of 2023, accounting for 20% of mobile data traffic worldwide.
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What’s new
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RF Outlook
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�Bandwidth
�Linearity
�Power management
�Bandwidth
�Linearity
�Power management
5G Brings New RF Challenges for Handsets
RF complexity
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�Power management�Power management
GaAs Provides The Key Ingredient For 5G Phones
Source:Compound Semiconductor Volume 23 lssue 8
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GaN on SiC
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High tempeture High frenqurency Excellenct Heat Dissipation
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PIN Diode
收光晶粒之上游材料收光晶粒之上游材料收光晶粒之上游材料收光晶粒之上游材料,可用於可用於可用於可用於PIN & APD, 具元件驗證能力具元件驗證能力具元件驗證能力具元件驗證能力
技術能力已達技術能力已達技術能力已達技術能力已達25G6.59% of revenue in 2013 18.88% of revenue in 2017Q112.49% of revenue in 2014 15.94% of revenue in 2017Q214.95% of revenue in 2015 6.9% of revenue in 2017Q317.93% of revenue in 2016 12.78% of revenue in 2017Q413.72 % of revenue in 2017 24.87% of revenue in 2018Q1
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13.72 % of revenue in 2017 24.87% of revenue in 2018Q117.78% of revenue in 2018Q218.61% of revenue in 2018Q3
Image sensor’s application: The concept of “Machine Vision”
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Seeing in Low Light Conditions-Night Vision
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Penetrate Atmosphere Obscurants
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Seeing through Smoke and Fire
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Product Inspection
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FP LD & DFB LD
� 1270 nm/1310 nm/1550 nm
� FP LD 2016/11 small volume shipment
� DFB LD 2018 Q2 small volume shipment
� Upgraded products in reliability test processprocess
� Product Advantage:
Far field angle design
Increase power & yield rate
Reduce lens cost
� Improve product mix & margin
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VCSEL inside iPhoneX
the Dot projector which projects 30,000 infrared dots onto your face to map its structure.
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The Flood illuminator is used in low-light and dark environments to illuminate your face using infrared light to enable the IR camera.
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VCSEL inside iPhoneX
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VCSEL inside iPhoneX
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How does a 3D laser sensor work?
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VCSEL Application
High Power940nm 3D
Sensing/808nm hairremoval and
High Speed
850nm
Datacom
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removal and other aestheticsapplications/LiDAR forAutonomousDriving/Surveillance
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VCSEL
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VCSEL
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Epi Wafer Market ConsolidationEpi Wafer Market Consolidation
2010
47Source:Strategy AnalyticsSource:Strategy Analytics
2013
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2017
48Source:Yole
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2014-2018Q1-Q3 Financial Result
2018 Q1-Q3 % 2017 % 2016 % 2015 % 2014 %
Revenue 1,573,520 100.00% 2,137,109 100.00% 2,182,825 100.00% 2,391,899 100.00% 2,073,370 100.00%
Gross margin 591,907 37.62% 743,467 34.79% 809,059 37.06% 896,369 37.48% 720,975 34.77%
Operating Profit 367,269 23.34% 515,093 24.10% 588,072 26.94% 670,700 28.04% 524,487 25.30%Operating Profit 367,269 23.34% 515,093 24.10% 588,072 26.94% 670,700 28.04% 524,487 25.30%
Financial Income 22,855 1.45% -35,375 -1.66% -29,431 -1.35% 20,258 0.85% 40,133 1.94%
Tax 71,387 4.54% -85,366 -3.99% -91,534 -4.19% -98,301 -4.11% -96,209 -4.64%
Net income 318,737 20.26% 394,352 18.45% 467,107 21.40% 592,657 24.78% 468,411 22.59%
EPS 1.72 2.15 2.12 2.4 1.9
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2019 Outlook
� New Momentum
� IOT Application(802.11ac or 802.11ax)
� New Products in Photonics
� Healthy Portfolio
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� Healthy Portfolio
� By products(improve product mix & margin)
� By customers