CompactPCI and AdvancedTCA Systems - Volume 12...

48

Transcript of CompactPCI and AdvancedTCA Systems - Volume 12...

Page 1: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

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2008

B A

N D

W I

D T

H

Published by

copy 2008 OpenSystems Publishingreg CompactPCI PICMG AdvancedTCA ATCA MicroTCA and their logos are registered trademarks

of the PCI Industrial Computer Manufacturers GroupTM AdvancedMC and CompactTCA are trademarks of the PCI Industrial Computer Manufacturers Group copy 2008 CompactPCI and AdvancedTCA SystemsAll registered brands and trademarks in CompactPCI and AdvancedTCA Systems are property of their respective owners

OpenSystems Publishingtrade

wwwcompactpci-systemscom wwwadvancedtca-systemscom

Volu m e 12 bull N u m be r 1

FebruArY 20 08

C O L U M N S 8 Editorrsquos Foreword Why AdvancedTCA is at home in HSS By Joe Pavlat

10 Global Technology Award recognizes unique rugged camera control system By Hermann Strass

11 Software Corner Cable and CALEA A look at cable networks and lawful surveillance By Curt Schwaderer

D E PA R T M E N T S 44 New Products

E - C A S T Swwwcompactpci-systemsecast

Energy Efficient DesignsMarch 2008

Platform ManagementApril 2008

CompactPCI reg

AdvancedTCA regand Systems

The Magazine for Developers of Open Communication Industrial and Rugged Systems

W E B R E S O U R C E SRead the latest E-letter atwwwcompactpci-systemscomeletter

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F E A T U R E S

APPlICATIoN AdvancedTCA

15 Choose the right formula for compute-intensive HSS systems AdvancedTCA platforms versus 1U PCI rack-mount servers By Sven Freudenfeld Kontron

TeCHNoloGY BACKPLANES

22 Channel characteristics challenge backplane interoperability By Stuart Jamieson Emerson Network Power Embedded Computing

25 Developing IEEE 8023ap 10GBASE-KR compliant backplanes Why does AdvancedTCA need bandwidth scalability By Douglas Hynd Simclar Group

PRODUCT GUIDE

31 6U CompactPCI

COVEROn page 22 read about the channel characteristics that are challenging backplane interoperability as backplane speeds approach 100 Gbps

g

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34 ACTTechnico ndash Networking Hardware20 Adax Inc ndash ATMIV AMC Controller45 Adax Inc ndash SS7ATM Controller39 Advantech ndash Advanced Blade Solutions7 Annapolis Micro Systems ndash Wildstar 5 for IBM Blade 43 Astek ndash Storage41 Concurrent Technologies Inc ndash Dual-Core Processors47 ELMA Electronic ndash MicroTCA Solution13 Excalibur Systems Inc ndash Mil-1553 ccVME5 GE Fanuc Intelligent Platforms ndash Software development environment3 Harting Technology Group ndash AdvancedMC Connectors17 Hendon Semiconductors ndash I2C Bus Buffer8 Interface Concept ndash Embedded Products2 Interphase ndash AdvancedTCA and MicroTCA Solutions48 Kontron ndash Open Modular Solutions9 National Instruments ndash Automated test system14 One Stop Systems Inc ndash PCIe over Cable16 Performance Technologies ndash One-Stop Shopping23 Red Rock Technologies Inc ndash Mass Storage Modules28 Rittal ndash AdvancedTCAMicroTCA40 SDR Forum ndash Call for papers21 VON ndash digiumAsterisk World19 Winchester Electronics ndash Connector Solutions29 XALYO ndash XS-AMC2

A n O p e n S y S t e m S p u b l i c A t i O n

Communications Group n CompactPCI and AdvancedTCA Systems n C m ac P a d Ad an e T A R s u e Gu e n C m a tP I nd A a cedT A lett

Editorial Director Joe P lat jp vl pensy t ms-publishing com

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Technology Editor Curt Schwaderer cschwadereropensystems-publishingcom

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A D V e r T I S e r I N F o r m AT I o N

Page AdvertiserProduct description

CompactPCI reg

AdvancedTCA regand Systems

ompactPCIdvanc dTCA S

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By Joe Pavlat

CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems

EDITORrsquoS FOREWORD

Why AdvancedTCA is at home in HSS

With this first issue of 2008 (Happy New Year) our colleague Sven Freudenfeld from Kontron gives us an excellent and detailed comparison of 1U rack-mount servers and AdvancedTCA in a real application a Home Subscriber Server (HSS) He describes the application in detail and then compares

space cooling maintenance management capabilities scalability and switching require-ments Sven makes a compelling case that AdvancedTCA provides many essential application elements that must be separately and expensively added to 1U servers He concludes that AdvancedTCA allows Telecom Equipment Manufacturers to concentrate on developing software instead of hardware and that reduces development costs and speeds time to market

PICMG addressing new data bandwidth standardsWhile AdvancedTCA provides a great deal of backplane bandwidth especially in full mesh configurations designers want to go even faster to accommodate new bandwidth-hungry applications like IPTV Last year the IEEE ratified important new standards for 10 gigabit per second data transmission over a single pair of conductors Of special interest to our community is the 8023ap 10GBASE-KR standard which details how to achieve that blaz-ing speed over a backplane The PICMG community is moving towards setting up a new subcommittee to incorporate this technology into the AdvancedTCA standard and it may be operating when this issue hits the street It has the potential of providing a total useful backplane bandwidth of 10 terabits per second in a single shelf Thatrsquos a truly amazing

number Douglas Hynd from the Simclar Group introduces us to the details of designing systems at that speed discuss-ing losses signal skew and crosstalk At these speeds simulation is essential and Douglas describes some of the issues involved Also in this issue Stuart Jamieson from Emerson Network Power gives us additional insight into high-speed signaling design simulation and analysis

A name change from Technology in Europe to Global Technology goes into effect this month for the column written by industry veteran Hermann Strass In this issue Hermann tells us how CompactPCI products from MEN Micro have been incorporated into the design of a new highly sophisticated digital cinema camera developed by Silicon Imaging In addi-tion to providing very high resolution and speed the camera must also operate in harsh environments MEN Micro won the 2007 Intel Communications Alliance Innovate and Ignite Technology Showcase award for its work

Curt Schwadererrsquos Software Corner this month expands on a subject he wrote about last April (wwwcompactpci- systemscomcolumnssoftware_corner 200704) As cable companies expand their offering beyond television to voice and data services they become subject to the same laws relating to cyber crime as the traditional telecommunications pro-viders do They must provide law enforce-ment authorities surveillance that is the subject of a lawful warrant and industry standards are being rolled out to do this Itrsquos a timely topic as serious problems with identity theft and cyber crime ingeneral are on the rise Curtrsquos column isan interesting read

Joe Pavlat Editorial Director

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By Hermann StraSS

GLOBALTECHNOLOGY

CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems

Award recognizes unique ruggedcamera control system

The 2007 Intel Communications Alliance Innovate and Ignite Technology Showcase (ICA) named MEN Micro Inc the ICA Showcase winner on September 19 2007 at the Embedded Systems Conference Boston MEN Micro a

subsidiary of MEN Germany has developed a unique control system for a rugged digital movie camera

Silicon Imaging an innovator in IT-centric digital cinema cameras required a rugged camera control system for its new SI-2K camera The SI-2K (shown in Figure 1 courtesy of Silicon Imaging United States) executes direct-to-disk raw recording at either 1920x1080 pixel high definition or at 2048x1152 pixel for cinema resolutions Its 48-bit digital processing algorithms perform adaptive pixel-by-pixel calibration and color image enhancement The SI-2K fore-goes legacy fixed bit-rate DCT codec recording formats such as DVCPRO HD and HDCAM-SR for advanced wavelet compres-sion technology Current generation HD cameras destructively process and compress their imagery at the acquisition stage The SI-2K streams images as raw digital negatives over a standard GbE connection The Intel Core 2 Duo processor-based F17 system from MEN non-destructively processes the raw digital negatives in real time to the visually perfect CineForm RAW codec which makes capturing up to four hours of continuous footage on a single 160 GB notebook drive possible

MEN Micro developed a customized version of its Intel Core 2 Duo processor based F17 3U CompactPCI SBC a unique side card for advanced audio and video capabilities as well as a rug-ged compact enclosure Already being used at independent film production studios for the making of full-length feature films the digital camera employs technology that can be repackaged for surveillance military sports analytics 3D video and stereo ap-plications The camera can operate in environments ranging from desert to arctic

The F17 SBC from MEN (Germany) controlling the camera in-cludes an Intel Core 2 Duo processor T7600 running at 233 GHz The SI-2K uses MENrsquos SBC for simultaneous encoding of data An Intel Graphics Media Accelerator 950 (Intel GMA 950) per-forms image graphics processing colorization and visualization at full resolution The F17 is equipped with 2 GB fast DDR2 DRAM a hard disk on a removable slot and two Intel GbE PHYs which transfer data from the camera head to the camera control unit and to other standard IP hardware The custom side card enables the connection of a High-Definition Multimedia Interface (HDMI) headphones and balanced analog input and output ports for pro-fessional audio signals

Specified for an extended temperature range in harsh shooting environments the camera uses MEN Microrsquos F17 board equipped

with a massive tailored heat sink accompanied by a fan install-ed inside the camerarsquos housing The F17 is part of MENrsquos powerful family of intercompatible CompactPCI Express SBCs including the newer and more powerful F18 which is completely compatible with the F17 and will also be incorporated into Silicon Imagingrsquos new SI-2K camera

European eventsThe 26th MOTEK International Trade Fair and Exhibition the worldrsquos largest event for assembly handling and automation sup-port systems and devices was held for the first time in the brand- new Neue Messe in Stuttgart Germany from September 26 to September 27 2007 The exhibition space increased by 45 percent over last yearsrsquo event due to the new venue More than 1100 exhibitors from 20 different countries drew around 40000 visitors and filled all five new exhibition halls Mechatronics was speci-fically featured as were robots and automation equipment In 2008 about one million square feet of exhibition space will be available when four more halls are completed at Europersquos most modern fair grounds near the Stuttgart Airport Terminal

EMO 2007 (Hannover) the worldrsquos largest exhibition of metal-working equipment closed its gates on September 22 after six days of exhibition with around 160000 attendees visiting booths of 2100 exhibitors from 42 countries 18 million square feet was devoted to exhibition space The organizers German Association of Machine Tool Manufacturers (VDW) reported new busi-ness contracts at the rate of 4 billion EURO (almost $6 billion) Exhibitors such as TRUMPF Laser Germany (see my April 2007 column (wwwcompactpci-systemscomcolumnsTechnology_in_Europe200704) reported full success at EMO 2007

For more information contact Hermann athstrassopensystems-publishingcom

Figure 1

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By Curt SChwaderer

CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems

SOFTWARE CORNER

In the April 2007 Software Corner column (wwwcompact-pci-systemscomcolumnssoftware_corner200704) we explored surveillance systems and the Communications Assistance for Law Enforcement Act (CALEA) a lawful

surveillance capability mandate Internet access and VoIP pro- viders had to be compliant with CALEA by May 2007 or face severe financial penalties

In this monthrsquos column we will look at what cable companies are doing to provide lawful surveillance capabilities within their networks

The term cable company is now officially a misnomer Cable companies and their networks are capable Internet access and voice service networks that offer the general public a one-stop shop for all their communications and entertainment needs In fact cable companies now typically call themselves Multi-Service Operators (MSOs) Voice and data services form a significant and grow-ing source of revenues for the MSO To that end cable networks become subject to the same rules and regulations that telecommu-nications networks do

One of these regulations is CALEA which provides the ability for network providers to tap specific subscribers when served a warrant To their credit cable companies and their research and development consortium organization CableLabs (cablelabscom) have been very proactive planning for lawful surveillance capa-bilities and CALEA compliance within their networks CableLabs and its partners have been working on a set of PacketCable stan-dards that incorporate specifications for voice and broadband data intercept We will focus on the new Cable Broadband Intercept Specification (CBIS) what it encompasses and paths for imple-mentation within cable networks

Cable Broadband Intercept Specification The set of specifications governing cable network services and capabilities is called the Data-Over-Cable Service Interface Specifications (DOCSIS) The specification that covers lawful

surveillance for data services is CBIS The CBIS reference model is shown in Figure 1

The surveillance architecture consists of three components the Mediation Function (MF) Broadband Intercept Function (BIF) and Collection Function (CF) When a warrant for a subscriber is served the network administrator configures the MF to capture traffic coming to andor from the subscriber This traffic includes any dynamic IP address assignment transactions (called out-of-band traffic) as well as the traffic resulting from e-mail voice or data services being used by the subscriber in question Creating hashes of these files validates the captured traffic as not having been tampered with It is also important for the network provider to supply traffic only for the subscriber the warrant is served on Older methods of surveillance involve dumping all traffic from a particular service area from all users in that area then sifting through that traffic manually This method violates the privacy rights of all the other subscribers in the service area of the individual(s) the warrant is served on Surveillance equipment that can capture only the traffic to or from the subscriber in the warrant is critical to the lawful surveillance aspects of the deployment

So far this is similar to the Alliance for Telecommunications Industry Solutions (ATIS) standards governing voice and data surveillance for digital wire line systems Unlike the original ATIS specifications the CBIS specification includes the BIF The BIF is a buffering component where the Mediation Function pushes the surveillance information (in the form of surveillance files) to the BIF for retrieval by the Collection Function at a later date

The CF component gathers the surveillance information from the BIF under law enforcement control then analyzes and presents the surveillance information in a useful way The CF also validates the information by comparing hashes of the files against hashes generated by the surveillance equipment at the time of capture This ensures that from the time the traffic is captured it is not tampered with

Cable and CALEA A look at cable networks and lawful surveillance

Figure 1

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Buffering is importantThe buffering capability the BIF provides in the CBIS specifi- cation is an important distinction between it and the ATIS specification (for more information on the ATIS specs see the April 2007 Software Corner (wwwcompactpci-systemscom columnssoftware_corner200704)

Buffering is so important that ATIS has approved an additional standard for a Buffering Function (BF) within the ATIS lawful surveillance environment

The importance of buffering is best described in a presentation that Dr Glen Myers CEO of IP Fabrics gave at the December 2007 ISS World conference The real-time delivery that the initial ATIS specification defines can be problematic as Figure 2 shows Packet loss from congestion bit errors or QoS contracts can result in the entire surveillance stream being rendered inadmissible

Dr Myers further explained that ATIS allows their buffering model to be separate from or combined with the MF while the cable network CBIS model assumes the buffering function is always separate from the MF component (Figure 3)

The buffering function whether it be the Buffering Function in the ATIS model or the Broadband Intercept Function in the CBIS model minimizes the impact of packet loss and real-time data delivery The Mediation Function can repeatedly attempt to send surveillance information to the BIF through a secure reliable file transfer function such as secure FTP If there are problems connecting with the BIF alerts can be generated so the network administrator can find and fix the problem while the surveillance information is still resident on the MF system

Dr Myers mentioned other important benefits to providing a buffering function The network administrator does not need to

negotiate and install a dedicated link for each intercept between the MF and the Law Enforcement Agency or agencies (LEA) authorized for the information Dedicated pipes matching the subjectrsquos peak service bandwith are not needed Support for mul-tiple LEAs is easily implemented at the BIF instead of the Mediation Function Law enforcement collection equipment does not need to be co-located with the Mediation Function It also simplifies connectivity by eliminating Virtual Private Networks (VPNs) or other routing ele-ments between the MF and the LEA(s)

CALEA and CMTSIn a cable network the Cable Modem Termination System (CMTS) is typically the central point within which service provider traffic from the access network meets the cable core network (and ulti-mately the Internet) So the CMTS is an important interface point for lawful surveillance

CMTS equipment may provide varying levels of support for lawful surveillance The simplest is to provide access to all the raw traffic flowing through the CMTS using an Ethernet tap or span port In this scenario the Mediation Function must find the traffic belonging to the subscriber under surveillance generate the appro-priate CBIS files and send the files to the BIF

Cisco a leading supplier of CMTS equip-ment to the cable industry provides a capability called Service Independent Intercept (SII) within their CMTS prod-ucts Cisco SII is also used in their routers and intelligent switches for QoS control in addition to lawful surveillance While SII provides support for identifying traffic by MAC and IP address information it does

Figure 2

Figure 3

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not provide the high-level configuration and lawful surveillance messages required of the Mediation Function SII uses low-level SNMP MIBs that control MAC and IP address configuration commands which in turn trigger the Cisco SII device to send packets matching the configuration to a span port where the Mediation Function can use these matched packets to generate the lawful surveillance messages So SII provides a first-level filter for the Mediation Function which supplies a high-level configuration interface at the warrant description level as well as creation of the CBIS (or ATIS) messages to be sent to the BIF

CBIS-compliant productsThe CBIS specification is quite new so released products are mostly on the hori-zon However the IP Fabrics DeepSweep Lawful Surveillance product line does provide MF andor BIF functionality for the implementation of CBIS-compliant networks Dr Myers noted that the DeepSweep product line is based on a flexible architecture and a highly parallel processing environment comprised of many software surveillance modules that can be loaded and chained within the DeepSweep to provide a number of Layer two to seven surveillance and packet analysis activities The device is programmed through a GUI and operates as a full Mediation Function with the ability to identify subscriber-related IP address assignment and resulting traffic from a span port The DeepSweep also has software support to communicate with SII enabled routers and CMTS sys-tems to provide a fully compliant ATIS andor CBIS surveillance environment compatible with Cisco lawful intercept and QoS services

CBIS BIF and ATIS buffering appliances are also available to provide buffering compliant with CBIS and ATIS standards

ConclusionCyber crimes such as identity theft child pornography chat-room initiated abduc-tion national security and piracy are very real and growing issues in todayrsquos society Billions of corporate and personal dollars have been tied to cyber crooks that abuse the Internet to participate in these activities It is essential that these illegal activities can be identified and stopped It is a good idea to be aware that the cable industry and its proactive support of lawful surveillance standards as well as rolling out equipment that implements these standards will in turn enable law enforcement to catch these cyber crooks and make the Internet a safer place for us and our children to live learn and work

For more information on this or any Software Corner contact Curt atcschwadereropensystems-publishingcom

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APPLICATION g

Based on current overall network growth Telecom Equipment

Manufacturers (TEMs) and Network Equipment Providers (NEPs)

are being challenged to launch new communications platforms

that provide optimal scalability flexibility manageability and

high computing performance With the expected increase in new

subscribers who need to be supported across the network TEMs and

NEPs are focusing on COTS platforms that meet the requirements of

a carrier-grade environment

With these new challenges it is important to take a look at the different

applications in the network to thoroughly evaluate the best hardware

platform approach Comparing the scalability IO functionality

interconnectivity and overall performance gives TEMs and NEPs a

solid basis from which to choose the best cost-effective solution for

their applications This article compares the traditional 1U PCI

platform with a more modular AdvancedTCA-based approach to

a Home Subscriber Server (HSS)-based platform

Emerging next-generation network architecture IMS Carriers and service providers are focused on improving their Average Revenue Per User (ARPU) by deploying new services quickly and at a price that is acceptable to subscribers IP Multimedia Subsystems (IMS) enable service providers to offer differentiated services to their subscriber base integrating voice video text and content as part of their service mix regard-less of the access technology

The IMS framework provides the telecom industry with a modular standards-based IP service delivery infrastructure More than simply replacing existing circuit services with similar services delivered over IP IMS allows service providers to capitalize on faster and more cost-effective deployment of new and differentiated multimedia communication services

While these new technologies promise new sources of revenue and enhanced customer loyalty they also pose implemen- tation challenges One of the crucial net-work elements within an IMS framework is the manageability of the subscriber base Today an increasing number of users subscribe to multiple services such

By Sven FreudenFeld

Choose the right formula forcompute-intensive HSS systems

AdvancedTCA platforms

versus1U PCI rack-mount servers

AdvancedTCA

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as multimedia mobile phones VoIP or IPTV at home Service providers must manage ldquoduplicatedrdquo subscriber databases for each particular service Consequently managing a converging subscriber base for such network functions as billing across multiple different technologies presents a tremendous challenge Any downtime of this network element can be costly to the carrier or service provider not to mention the heavy risk of losing subscribers over the long term

The HSS and Home Location Register (HLR) are key elements in the IMS network required to manage the growing number of subscribers These platforms that manage millions of customersrsquo data need to be highly reliable with carrier-grade High Availability (HA) functionality Core requirements for the HSS computing platform are

n High compute density for application processingn Scalable performance and high densityn Fast read access to the subscriber datan Large storage and memory bandwidthn Ability to consolidate multiple IMS elements and subscriber data within a single

platform with a modular approach as a converged services platform

HSS plays network backbone roleHSS provides the important network backbone of the IMS architecture because it eases innovation and addresses a range of service-logic interaction issues that have plagued previous service architectures HSS offers open access to service-related data for each subscriber supporting the sharing of data among multiple services

HSS is essentially the master user database that supports IMS network entities that handle calls and sessions It contains user profiles performs authentication and authorization of the user and can provide information about the physical location of the user It plays a key role in provisioning service creation enabling subscriber data and managing control roaming and interconnection The Application Server (AS) which hosts and executes serv- ices in the IMS environment communicates with the HSS Call State Control Function

(CSCF) servers also communicate with the HSS which must be able to

n Support IMS-level authentication and authorization

n Maintain IMS subscriber profile(s) independent of access types

n Maintain service-specific datan Keep track of currently assigned

CSCFn Support CSCF and AS access

HLRHSS hardware platform design choicesHSS design must enable the HSS to be deployed cost-effectively and expand readily to meet future subscriber levels For example the trend to include more information as part of the data record for each subscriber will drive up memory requirements

From a technical perspective the key metrics to understand when developing the IMS HSS functions are the number of completed transactions required per sec-ond and the size of the subscriber base

HSS architecture typically comprises multiple processor units with extensive memory requirements With the introduction

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of multicore processors from Intel developers can scale performance while optimizing power consumption in the overall system design

To meet these requirements the hardware platform needs to provide scalability flexibil-ity and long-term cost efficiency In comparing the traditional 1U platform with a more modular approach to the HSS using AdvancedTCA consider the following

n High compute performance n High memory and storage capabilityn IO functionality to connect to multiple networks (such as SS7 and Ethernet)n Carrier-grade profile and redundancy

AdvancedTCA High density with scalability on a smaller footprintTable 1 illustrates a comparison of a sample AdvancedTCA-based platform and a 1U PCI rack-mounted platform for HSS applications This configuration assumes an increasing subscriber growth from 1 million (M) subscribers to 18M subscribers per platform

FootprintAdvancedTCA-based platforms provide a high density compute platform with scalability on a smaller footprint TEMs can easily add boards to a chassis to accommodate more traffic and to support new services This flexibility enables an increase in subscribers and the database without having a major impact on rack space in the central office environ-ment To meet the same capacity for 18M subscribers the 1U PCI approach will occupy two bays or cabinets with a total footprint of 28 square feet compared to the same capacity occupying one bay or cabinet with a footprint of 14 square feet (see Figure 1)

CoolingWhile the power consumption per square foot is higher than the 1U PCI platform AdvancedTCA offers better airflow and cooling distribution using a push-pull cooling system Each 1U PCI platform includes up to nine cooling fans and is dedicated to that CPU in the 1U server only which translates into higher overhead Therefore the airflow is

not optimized in the overall system design In the case of a fan failure AdvancedTCA platforms enable easier access to replace the fans which are field replaceable units The 1U platform also does not include any integrated centralized switching or management capabilities therefore the total does not include any switching or system management functionality

ScalabilityAdvancedTCA architecture lends itself well to scalability As AdvancedTCA sup-ports both a Base and Fabric interface into the backplane and the separation of data and control planes TEMs can also scale up their designs from 1 GbE to 10 GbE to accommodate new users and usage requirements AdvancedTCA based systems are designed for easy upgrade-ability to new processing blades switch fabrics and IO modules using Advanced Mezzanine Cards (such as SS7)

Since AdvancedTCA and AdvancedMCs offer hot swap capabilities and HA func-tionality growing a subscriber base by using additional CPU blades within the system with low maintenance or upgrade downtime is crucial for the HSS plat-form It also allows for the up and down

AdvancedTCA-based HSS Platform 1U PCI Rack-Mount HSS Platform

Number ofsubscribers

~1M subscribers = 4 CPU blades edundant ~1M subscribers = 4 x 1U

~4M subscribers = 7 CPU blades redundant ~4M subscribers = 7 x 1U

~6M subscribers = 12 CPU blades redundant ~6M subscribers = 12 x 1U

~18M subscribers = 36 CPU blades redundant= 3 AdvancedTCA shelves per rack

~18M subscribers= 36 x 1U+ external switch components for redundancy

Technicalspecs

1 CPU blade = 2 x Intel Xeon dual core = quad core 1 1U rack-mount Intel= Intel Xeon quad core or dual core CPU

16 G DDR 2 memory Max of 8 G DRY memory

+ 2 x SATA or SASS hot swap (RAID 0 and 1)+ 1x PCI Express for SS7 Dual GbE per 1U rack-mount server

4 x GbE per CPU with built in GbE backplane switching separating Control Pathand Data Path with multishelf expandability

External central switching required withmultiple external GbE connectivity

Systems and blade manageability built into the platform withIMP implementation SNMP and CLIP

Carrier-grade redundancy on switch and node

IO for SS7 or other interface modules

CPU blade hot swap capability

Thermaland power

requirements

~6M subscribers redundant= 14 slots with centralized chassis cooling

~6M subscribers redundant= 18 x 1U PCI with independent cooling and separate switch units and system management

Total power consumption= ok (3100 W for blades and RTM + 500 W Shim fan tray and SAP)

Total power consumption= ok

Table 1

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scaling of the platform depending on the subscriber increase or decrease When consolidating multiple services minimiz-ing multiple duplicate databases requires this flexibility

InterconnectivityThe AdvancedTCA platform offers a number of interconnectivity features including

n Separation between the data plane and the control plane

n Direct uplink in a multichassis envi-ronment with up to l0 GbE

n Node to node base and fabric connec-tivity with HA carrier-grade Ethernet functionality

n Easy upgrade path to l0 GbE for increased bandwidth

By contrast the 1U PCI platform requires

n Additional external interconnectiv-ity between 1U rack-mount servers which increases the number of points of failures and the operating and maintenance costs

n Additional switching equipment for carrier-grade Ethernet connectivity

n Additional manage-ment (Simple Network Management Protocol [SNMP]) for HA redundancy

PowerThe 1U-based platform also utilizes integrated AC power supply units usually the standard for the data center and enter-prise environments AC will increase the pro-viderrsquos OPEX in the long term since the power consumption per rack is significantly higher and

Figure 1

requires additional support equipment such as an Uninterruptible Power Supply (UPS) and an AC to DC converter per rack space and ultimately per CPU These factors along with the requirements for carrier-grade functionality HA support and a more favorable long-term OPEX further reduce the need to consider the 1U solution for HSS deployments in Central Office networks

ManageabilityAdvancedTCA chassis-level management is based on the industry-standard Intelligent Platform Management Interface (IPMI) IPMI makes possible interoperability among chassis and blowers compute nodes switches and management solutions from multiple vendors enabling these elements to work together seamlessly The resulting successful inter-blade communication for applications including failover and clustering provides full manageability on a per shelf and per bay basis

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One of the primary goals of the AdvancedTCA specification is to ensure a very low Mean Time to Repair (MTTR) and high Mean Time Between Failures (MTBF) There are no active components in the backplane ndash which can translate to expensive repairs in the field In addi-tion AdvancedTCA specifies that all com-ponents can be hot swappable in the field and the architecture provides redundancy at all levels This hot swap capability translates to less downtime for field replacement on a per CPU blade basis as compared to 1U PCI

SummaryAdvancedTCA provides an ideal platform and meets the technical requirements for deploying flexible and scalable IMS HSS applications While other platform archi-tectures such as 1U rack-mount servers may with considerable difficulty be able to deliver HSS capabilities AdvancedTCA offers a much more advantageous solution by providing a smaller footprint improved cooling and thermal characteristics bet-ter scalability enhanced interconnectivity and easier manageability This all contrib-utes to making AdvancedTCA a lower cost approach in terms of CAPEX and OPEX for long-term subscriber growth

1U PCI rack-mount servers are not considered to be the optimal hardware platform for HSS applications in a Central Office With its limitation for carrier-grade flexibility and HA functionality the 1U PCI platform is best suited for a full range of other enterprise and Internet infrastructure applications within a data center environment that does not require any significant flexibility and HA functionality around it It might also be a good entrance point for other enterprise applications with lower price points

The use of AdvancedTCA-based platforms enables TEMs to shift away from hardware development and refocus their efforts on delivering value-added software and services As a result they can realize lower development costs and faster time-to-market enabling increased flexibility with each product design through the use and reuse of standardized off-the-shelf components Equally significant are the advantages that can be realized by the service provider With a common platform and a flexible architecture that maximizes limited floor space service providers can rapidly and flexibly implement a broad range of feature-rich solutions for faster profitability

Sven Freudenfeld is responsible for North American Business Development for the Kontron AG line of AdvancedTCA AMC MicroTCA and Pre-Integrated Solutions Sven possesses more than 15 years of experience with voice data and wireless com-munications having worked extensively with Nortel Networks in Systems Engineering Sanmina-SCI in Test Engineeringand Deutsche Telekom in Network Engineering Sven holdsan electrical engineering degree from Germany and is also Chair of the CP-TA marketing workgroup focusing on the interoperability of COTS standard building blocks

Kontron bull svenfreudenfeldcakontroncom bull wwwkontroncom

Fo Sin Pnt

Fo Sin Pnt

TECHNOLOGY g BACkpLANES

Increasing demand for service and multimedia features is stimulating a growing need for speed in telecom-munications equipment While some

applications such as PBX systems can be addressed with the gigabit backplane technologies currently available others are running out of headroom Routers may soon need 10 Gbps and higher speed back-planes to keep up with network demand Many such applications can justify the expense of moving to higher performance if it becomes available

Currently telecom system designs offer backplanes that can handle interconnec-tions running as fast as 3125 Gbps raw data throughput per lane (with around a maxi-mum data rate capability of 5-625 Gbps per lane) The AdvancedTCA standard for instance uses Ethernetrsquos XAUI inter-face AdvancedTCA achieves a 10 Gbps net data rate by running four serial lanes for each interconnection with each lanersquos

SERrializerDESerializer (SERDES) op-erating at 3125 Gbps raw data (25 Gbs net)

As demand forces systems to move beyond these rates however new technologies will be needed One proposal calls for the use of XAUI+ or double XAUI which increases lane SERDES rates to 625 Gbps per lane and hence the throughput to 20 Gbps Another proposal is to use IEEE 8023ap known as 10GBASE-KR which runs a single SERDES lane at 125 Gbps raw data rate (103 Gbps net) But these are only short-term answers To address future demands organizations such as the Institute of Electrical and Electronic Engineers Standards Association (IEEE-SA) are developing specifications for Ethernet speeds of 40 Gbps to 100 Gbps which will be applied to backplane interconnect

Such high clock rates however will pose significant design challenges for developers

One of the first challenges that will need resolution is the design and layout of the backplane and other PCBs Common design practice today readily handles board clock rates of around 10 Gbps Well established design rules are in place and board layout tools such as autorouters can automatically handle board designs for speeds in the 10 Gbps range Designers may use specialized board material create additional ground planes and perform similar tasks in order to ensure proper board operation at the higher end but even speeds to 5 GHz are within current design tool capabilities

Design gets trickierAbove 5 GHz however board design gets more involved because feature dimensions become significant when compared to the signalrsquos wavelengths Variations in board thickness can affect signal propagation Corners where traces change direction and small spurs along edges of poorly etched

Channel characteristics

challenge backplane interoperability

Serial backplanes in telecommunications systems aim for high speed with room for

growth As systems began using 10 Gbps links however issues arose that affected backplane

communications among cards from different manufacturers Stuart points out that the

industry must define key backplane channel characteristics so that designs based on open

standards maintain interoperability as backplane speeds move to 40 Gbps and beyond

By Stuart JamieSon

Fo Sin Pnt

traces can act as antennae for the higher fre-quencies in digital signals As can be seen in Figure 1 sharp corners and minor flaws that are inconsequential at lower frequen-cies have the potential to become trouble-some antennae at future high speeds This can result in the trace radiating away the signalrsquos high frequency energy increasing EMI and crosstalk as well as altering signal waveforms New routing design rules such as making corners 30deg instead of 45deg and more careful board fabrication techniques may become necessary as designs move above the 10 Gbps per lane threshold

The move to higher frequencies will affect more than board fabrication and layout however Higher frequencies will also impose new requirements on signal tim-ing signal rise-time electrical distance and waveform shape if developers are to retain the mix-and-match system design approach that makes standards-based system design effective

For interoperability to be achievable at data rates above 10 Gbps organizations such as PICMG will need to carefully define a vari-ety of signal and design parameters in their specifications Some of the key parameters that will need consideration include

n Interconnect signal attenuationn Eye diagramn Jittern Input clock recoveryn Chip inputoutput pre-emphasis (PE) n Equalization (EQ)

Even slight variations in these parameters from device to device and lane to lane can shift the timing of signals a significant fraction of a clock cycle and affect the Bit Error Rate (BER) of a lanechannel Finally signal rise times will require tight control as signal rates increase in order to ensure control of system timing (see Figure 2)

In defining signal and design parameters specifications will also need to account for the increased location dependency that comes with higher frequencies Even subtle differences in attributes such as routing length and trace impedance become increasingly significant as signal speeds rise To ensure mix-and-match interopera-bility then design specifications may need to account for the specific backplane slot that a board is to occupy as well as introduce a method to obtain and control the PE and EQ of the devices connected to the lanes

Designers must also address fabrication standards The material used to fabricate

Figure 1

Figure 2

Fo Sin Pnt

the board the thickness and composition of metal cladding and the spacing between layers can all affect the trace characteris-tics Controlling these parameters under specification ensures that timing charac-teristics are sufficiently uniform from one board to another However current speci-fications are too detailed and stringent It is extremely difficult to attain compliance yet avoid adding cost to the design

Specifications need workSome of these parameters are already incorporated into current specifications The AMC module specifications from PICMG for instance include design parameters that ensure its proper opera-tion at signal speeds as fast as 125 Gbps per lane Establishing specifications for other system components will help achieve interoperability of standards-based designs at higher frequencies

Design tools may also need to be modified and the industry will need to create new design rules for high frequency and incor-porate these into the tools Developing new routing techniques will help avoid the issues of electrical phenomena such as skin effect dielectric loss and impedance mismatches These are much more preva-lent at higher frequencies and it becomes critical for engineers to model and simu-late these phenomena more accurately

Early efforts are already underway to address the challenges that higher fre-quency signals bring to standards-based design The Interconnect Channel Characterization Subcommittee of PICMG established in September 2006 is develop-ing ground rules and definitions to be used in characterizing transmission reflection and crosstalk performance in backplane and mezzanine carrier interconnects The committee aims to define the channel parameters to be measured or analyzed as well as the methods for doing so Its charter calls for it to address

n Definition of interfaces at which measurements are made or characteristics computed

n Test equipment fixtures and PCB test coupons

n Details of measurement proceduren Data formatsn Techniques for de-embedding

components of the channeln Techniques for validating

measurement based models ie passivity and causality

n Definitions that allow reasonable compliance testing

n Boundary definitions for different paths

n Define information regarding limita-tions or proper usage ie maximum data raterise times that are supported by the models

Such efforts are only a beginning how-ever Other design details still need to be addressed such as SERDES IO Configuration New functionality may need to be defined The design of high data rate system channel interfaces according to standardsspecifications does not currently cover the individual characteristics of the chip transmitterreceiver characteristics Thus work will be needed to address how such standard designs handle such dependency

Crossing an interoperability thresholdOne way of handling location dependen-cies might be to give the system control-ler the ability to inform modules what the channel transmitter and receiver PE and EQ technology is and importantly how to control it With this information along with the signal attenuation suffered (at a given bit rate) for the channel the system should be able to configure SERDES channels in different physical locations to run reliably and at the required BER In MicroTCA systems for instance this functionality could be incorporated into the MicroTCA Carrier Hub (MCH) as part of its electronic keying function Modules would have to be able to configure and control its backplane interfaces to allow for different positions

in the backplane An MCH (see Figure 3 courtesy Emerson) then would be able to instruct a module as to which parameters to use for interoperability

The specific approaches needed to handle location dependencies and other challenges that higher signal rates raise have yet to be developed The need to address these challenges however is clear Increasing demand for services is driving applications to utilize faster signal rates This in turn is driving backplane signaling speeds ever higher As speeds rise above 10 Gbps sig-nals will cross a threshold where current specifications will prove inadequate for ensuring interoperability among standards-based designs

The industry should begin developing new or enhanced specifications and design tools to address the challenges of higher signal rates Without such improvements the guarantees of interoperability that allow system developers to readily create solu-tions by combining off-the-shelf products will be compromised As backplane speeds approach 100 Gbps nothing can be taken for granted

Stuart Jamieson Director of Industry RelationsArchitect with Emerson Network Power Embedded Computing represents Emerson on PICMG committees and the SCOPE organization and previously served as a CP-TA Board member (Treasurer) He brings over 18 years of experience in hardware protocols embedded software and specification development to these groups Within Emerson he played a key role in the develop-ment of the technology central to Emersonrsquos bundled network-ing solutions Stuartrsquos positions within Emerson have included Director of Business Development Director of Advanced Technology and Architect He is the Draft Editor for the PICMG Interconnect Channel Characterization Subcommittee is the author of the introduction section for the new PICMG Ruggedized MicroTCA specification and served as the Draft Editor for the PICMG MicroTCA Specification Stuart gradu-ated from the Heriot-Watt University in 1989 with a 1st Class Honors degree in Electrical and Electronic Engineering and again in 1992 with an IBM-sponsored Master of Philosophy

Emerson Network Power Embedded ComputingStuartJamiesonEmersoncom bull wwwemersonembeddedcomputingcom

Figure 3

Fo Sin Pnt

TECHNOLOGY g BACkpLANES

2008

B A

N D

W I

D T

H

Signal integrity challenges to bandwidth scalabilityFor the purposes of this article each interconnected differential pair will be referred to as a Channel (which should not be confused with an aggregated AdvancedTCA channel comprising four trans-mit and four receive pairs)

14-slot full-mesh AdvancedTCA backplanes contain hundreds of Channels Each Channel is defined as the copper signal path from the output of a driver device to the input of a receiver device As

By douglaS Hynd

Developing IEEE 8023ap 10GBASE-KRcompliant backplanes

Why doesAdvancedTCA

need bandwidthscalability

PICMG AdvancedTCA 30 has emerged as the

industryrsquos Hardware Platform standard of choice and

is enjoying first-phase deployment However many

believe that for AdvancedTCA to realize its market

potential AdvancedTCA platforms need to seamlessly

scale to accommodate 40 GbE fabrics thereby

avoiding forklift upgrades as system bandwidth

demands increase over time A 40 GbE switch fabric

architecture would enable realization of a common

platform for computing storage control and media

and packet processing and provide the versatility and

long term ROI required by service providers in

todayrsquos increasingly competitive environment

The challenge was to develop a family of

AdvancedTCA products which feature PICMG 30

compliant dual star and full mesh advanced

backplane switch fabrics enabled up to 10 Gbps

per differential signal pair thereby giving 40 Gbps

per AdvancedTCA channel performance

This article describes the signal integrity challenges

presented in designing an IEEE 8023ap

10GBASE-KR-compliant bandwidth-scalable

14-slot AdvancedTCA platform and how these

challenges were overcome in development of full

mesh and dual star backplane reference designs

Fo Sin Pnt

shown in Figure 1 that signal path comprises a signal launch a blade PCB transmission line a daughtercard via a right-angled HM-ZD connector a mated HM-ZD backplane header a back-plane via a length of backplane PCB transmission line and then the same combination of connectors vias and transmission line at the receive end of the Channel

Sources of crosstalkFour principal sources of crosstalk in each Channel must be man-aged as shown in Table 2 Source number one is between adjacent differential pairs as they are routed across the backplane Common mode noise rejection in system differential pair structures makes this a minor issue The second source of crosstalk lies in the HM-ZD connector itself

Crosstalk in via fields our third source primarily arises from inductive coupling between adjacent differential pairs and domi-nates the crosstalk agenda in high-speed Channels This source of crosstalk is directly proportional to the length of the via barrel and where practical care must be taken to ensure that adjacent connector rows are terminated to different target routing Layers

The final source of crosstalk is caused by aggressor signals in through-routed via fields coupling with victim Channel traces as they pass through As mentioned earlier judicious and careful design can mitigate this impact

Skew Channel skew is a function of differential transmission path geometries At a fundamental frequency of 5 GHz skew can be a significant issue in high-speed system design due to narrowing the eye opening and increasing jitter Skew can have a significant impact on crosstalk it negatively impacts the common mode rejection of noise inherent to differential signaling Conductor surface roughness in lower performing dielectric materials can also cause skew in high-speed systems

Skew can be avoided through careful management of transmission path lengths in each Channel and by using higher-glass content (lower Dk) laminates

LossPotential

Potential Mismatches

Channel

Loss Potential Channel

PCB Tolerance -025 dB 2 -01 dB

Connector Tolerance -001 dB 4 -016 dB

Thru-routed Via Fields -001 dB 12 -144 dB

Connector Launch -025 dB+ 4 - 2 dB+

Quantity TotalNEXT

TotalFEXT

PCB Transmission Lines

24 in60 cm

-50 dB -70 dB

Connector Architecture 2 -26 dB -24 dB

Via Fields 4 -22 dB -20 dB

Connector Pass Through 8 -34 dB ndash34 dB

For the target application each one of these Channels must deliver a 10 Gbps Non-Return-To-Zero (NRZ) signal with sufficient signal fidelity to enable a receiver device to detect and process a differential signal The PICMG 30 specification is targeted at 3125 Gbps signaling with a fundamental frequency of 156 GHz Even in low loss dielectric materials insertion loss at 10 Gbps (5 GHz fundamental) is twice that of a 3125 Gbps signal

Therefore achieving acceptable signal fidelity requires careful management of signal losses and noise in each Channel such that an acceptable signal-to-noise (SN) ratio is achieved at the receiver

The design process therefore begins by understanding and mitigat-ing the sources of losses and noise in each Channel

Sources of lossThere are three sources of loss

n Conductor losses which are due to skin effects and can be addressed by maximizing the cross sectional area of the signal traces

n Material dispersion losses which are a function of the dielectric constants of the chosen material These can be mitigated by choosing a higher performance laminate material such as Nelco 4000-13SI or Megtron

n Reflected power loss due to impedance mismatches in the Channel as each signal transitions across the different copper media in each channel (connectors vias and PCB traces) and passes through the pad and anti-pad structures of the via fields of other backplane blade slots

Table 1 shows the relative effects of different sources of impedance mismatches The dominant source of impedance mismatches in every Channel resides in the via structures Successful mitigation of this problem requires that every via is tuned by back-drilling the stub and adjusting the pad and anti-pad structures to match the impedance to be 50 ohms irrespective of the target routing layer This in turn requires that the capacitive and inductive effects of the connector pin and via barrel combination are taken into account during the design of each Channel

Further complicating via design is the space the anti-pad structures need to accommodate Channels being routed between other blades while minimizing electro-magnetic coupling with them This space consideration makes the shape and orientation of pads and anti-pads extremely important

Figure 1

Table 1

Table 2

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IEEE 8023ap provides a design targetAs Ethernet has emerged as the industryrsquos dominant signaling methodology the IEEE has developed the 10GBASE-KR norma-tive Channel model to define interconnect Channel performance for NRZ signaling at 10 Gbps This standard defines acceptable performance in terms of S-parameter charts for through-Channel insertion loss and worst-case crosstalk Figures 2a and 2b illustrate masks for Draft 24 of the standard that was initially used for this exercise

In each case the mask defining compliant performance is shown in blue Channel insertion loss is shown in red in Figure 2a Crosstalk performance is defined by the ICR curve (Figure 2b) Minimum acceptable Channel performance is defined in the ICR chart (Figure 2b) by the blue line The effect of the sum of all aggressors on the through-Channel is shown in red The green ICR curve is the ratio of the crosstalk power sum calculated by summing the

magnitudes of any impacting crosstalk Channels for each fre-quency and using a straight line fit (using least-squares method) to determine the resulting average effect f the aggressors on the through-Channel This is then overlaid on the insertion loss and used to plot the ICR curve

This standard which has evolved through a variety of iterations forms the basis for developing a 40 GbE switch fabric backplane featuring 10 Gbps NRZ differential pairs If all differential pairs can meet this standard then the backplane can be considered to be 10GBASE-KR compliant

Applying 10GBASE-KR to a 14-slotAdvancedTCA applicationThe PICMG specification dictates that receive differential pairs are placed on the c-d and g-h rows of the HM-ZD connector and that transmit differential pairs are placed on the a-b and e-f rows Therefore the middle differential pair in row c-d of Slot B will be subject to the NEXT of three aggressors in each of the a-b and e-f transmit rows of slot B plus the FEXT of the signals being received in the c-d pairs in the top and bottom of slot B

In this topology it can be seen that worst-case crosstalk would occur if all the NEXT and FEXT aggressors were routed on the bottom Layer that is on the same Layer as that of the victim c-d However given that all signal vias must be back-drilled and tuned for impedance management purposes Channel crosstalk can simultaneously be reduced by allocating different routing Layers to differential pairs terminated in the same backplane connector

The principal factor in determining the feasibility of a 10GBASE-KR compliant backplane is based on understanding whether the Channel with the worst-case signal-to-noise ratio is compliant

The skew targets determine permissible layer separation between a-b c-d e-f and g-h pairs within each Channel and enable routing Layers to be allocated for each pair It is now possible to start the process of via tuning to optimize the channel performance for minimum insertion loss Modeling begins by defining the simulation boundaries for the channel so that Channel component models (PCB traces connectors vias) can easily be aggregated to model complete Channels Boundaries must be established at locations in the Channel where linear 3D structures exist These are shown in Figure 3 (next page)

Since the connector and via combinations for the backplane and daughtercard mating halves must each be treated as a whole it

PICMG 30Spec

TurboFabricSpec

Total Inter-PairSkew

(Fabric Interface)

05 mm in FR4(34 ps)

001 mmin N4000-13si

(00625 ps)

Total Intra-Channel Skew

(Fabric Interface)

254 mm in FR4(17 ps)

plusmn01 mmin N4000-13si

(0625ps)

Total Intra-Channel Skew

(Base Interface)

135 mm in FR4(90 ps)

plusmn01 mmin N4000-13si

(0625 ps)

Figures 2a and 2b

Table 3

Determining which Channel that is and identifying the worst-case SN requires making trade-offs with regard to PCB material Channel length via design connector row selection and NEXT and FEXT aggressor routing choices These trade-off choices can only take place using advanced 3D simulation tools such as Ansoft HFSS This was the essence of the design process employed in developing Simclarrsquos TurboFabric backplanes

The simulation processThe transmission length for full mesh and dual star backplanes design implementations varies from a maximum of 1632 inches to a minimum of 116 inches With an effective transmission length of 5 inches on each daughtercard this makes the longest effective Channel 2632 inches including two connectors

For a 10GBASE-KR application over this distance a high-perfor-mance laminate is essential for both reducing insertion loss and

ensuring high glass content in the weave to mitigate skew So the design process began by choosing a low-loss dielectric material (Nelco 4000-13SI for both the backplane and the daugh-tercards) and establishing targets for Inter-Pair and Intra-Channel skew as shown in Table 3

Adhering to the PICMG 30 specifi-cation for skew in a 10GBASE-KR application is impractical Instead a target of 00625 ps was set for Inter-Pair skew with 0625 ps set for Intra-Pair skew for the backplane only This equated to a maximum 001 mm differ-

ence being allowed between traces of any differential pair and 01 mm being permitted between traces of any four differential pairs in a Channel Given the topology of the HM-ZD connector daughter-card skew must be accounted for in the daughtercard layout Fo

Sin Pnt

should be noted that the simulation boundary is located within the mated connector

Tuning the connector and via structures to 50Ω is an iterative process involving the removal of excess pads back-drilling and tuning pads anti-pads and traces A Time Domain Reflectometer (TDR) plot illustrating the results of the tuning process is shown in Figure 4

Upon completion of the modeling process a total of 17 different optimized via and routing configurations had been designed for the full mesh design and nine for the dual star design

A plot of worst-case insertion loss is shown in Figure 5 and demonstrates that in both cases performance is well above the 10GBASE-KR mask

When all the through-Channels have been modeled adjacent Channel models can be combined and ICR curves plotted to evaluate the impact of crosstalk on through-Channel performance This valuable information can be used to adjust the position of signal Layers relative to pass-through aggressor traces on adjacent Layers or to reroute traces to reduce crosstalk Similarly routing Layers can be changed to reduce crosstalk in adjacent via barrels

Figure 6 plots worst-case ICR and demonstrates that performance is above the 10GBASE-KR mask Based on this result it was possible to proceed to physical implementation

Figure 3

Figure 4

Fo Sin Pnt

Physical realizationThe layout process was performed using the Mentor Board-Station CAD system Quad-routing (routing four traces between pads) was explored as a routing method-ology in order to reduce Layer count but this was dismissed due to the detrimental impact on crosstalk performance

The attributes of the physical backplanes produced as a result of the design effort are shown in Table 4

The design files produced included the usual gerber files plus detailed back-drilling instructions

The design validation process comprised a conventional continuity test followed by performance testing featuring Agilent equipment including 70340A signal generator 8720ES Network Analyzer NN18A S-Parameter test-set and 86100A sampling oscilloscope with Agilent 86112A module Figure 7 (next page) shows the test set up

Simclar developed special line cards to enable through-Channel measurements with and without crosstalk The signal launch featured compression mount SMAs terminated in a tuned via structure The Channel simulations included simu-lation of the tuned launch structures so de-embedding of the launches was not necessary for correlation to simulation purposes The development team also established a process for characterization of all Channels

Full Mesh Dual Star

Layer Count 34 18

Aspect Ratio 121 61

Tuned Vias 3952 768

Material Nelco 4000-13SI

Table 4

Figure 5 Figure 6

Fo Sin Pnt

In Figure 8 measured through-Channel performance and ICR curves are shown for the same Channels described in the simula-tion section earlier

As can be seen from Figure 8 there is close correlation between these and the simulated plots in Figures 5 and 6 In fact close correlation between all simulated and measured results was achieved resulting in a 728 Tbps capacity full mesh and a 960 Gbps capacity dual star backplane design now generally available as part of the Simclar TurboFabric shelf

Figure 7 Figure 8

Figure 9

Figure 10

Implications of 10GBASE-KR Draft 33versus Draft 25The work described above was targeted towards meeting the Channels specifications contained in Draft 25 of the IEEE 10GBASE-KR Since this work was completed the IEEE has up-issued the Draft revision level for the Standard from 25 to 33 While this has not impacted through-Channel performance demands it has increased Channel isolation requirements by around 10 dB In Figure 9 a Draft 33 mask is added to the ICR plot shown in Figure 8

From Figure 9 it can be seen how Draft 33 pulls the mask above the Channel ICR curve for this full mesh backplane Channel Surprisingly it is the Channelrsquos frequency response at relatively low frequencies between 100-500 MHz that is causing a problem The reasons for this are currently the subject of further detailed investigation

However Figure 10 shows a Draft 33 plot for a less demanding dual star AdvancedTCA implementation featuring shorter trans-mission distances This plot demonstrates compliance to Draft 33 of the IEEE 8023ap 10GBASE-KR Standard

ConclusionBy developing a close understanding of the many factors contrib-uting to loss and noise in multi-gigabit backplane Channels it is possible to characterize their performance using advanced simula-tion techniques and correlate that performance in physical prod-ucts using advanced test methods By overlaying the test results on S-Parameter masks defined by the IEEE 8023ap 10GBASE-KR Standard it has been demonstrated that backplanes that truly enable AdvancedTCA scalability are at last a reality

Douglas Hynd joined Simclar Group in 2006 as Director of Marketing as part of Simclarrsquos acquisition of Northrop Grumman Interconnect Technologies Division wherehe was Vice President of Marketing and Sales He has more than 24 yearsrsquo experience intechnology sales marketing and generalmanagement and holds a BSc (Eng) in Electronics and Electrical Engineeringfrom the University of Glasgow He isbased at Simclarrsquos Global HQ inDunfermline Scotland

Simclar Groupdouglashyndsimclarcom bull wwwsimclarcom

Fo Sin Pnt

6U CompactPCIPrOduCT GuIdE g

This monthrsquos issue includes a 6U CompactPCI Product Guide and Irsquod like to take the opportunity to reflect a bit on the success and evolution of that technology

Back in the 1994 time frame when CompactPCI was first being devel-oped it began as 3U-only technology It used the same Eurocardmechanics that were popularized by VME and an IEC standardized high-

density high-speed connector available from a number of vendors suitablefor 33 MHz PCI signaling That connector was selected by the engineers atZiatech with help from Mike Munroe then at ERNI The majority of VMEdesigns were 6U and based on this I was among a number of folks thatargued for adding the 6U CompactPCI form factor

The 6U form factor presented some challenges and opportunities Onechallenge was that the insertion and extraction forces were quite high when the entire rear of the card was populated with connectors Fortunately the IEEE standards for Eurocards evolved and injectorejector handles that pro-vided leverage became available Eike Waltz then at Rittal was instrumental in bringing that to the table Two of the opportunities that came along withthe extra connectors were a clean way to add secondary buses like the H110 telephony bus to the backplane and the ability to route IO out the rear through rear transition modules PICMG has developed quite a number of subsidiary specifications defining the interoperable use of the extra backplane pins made possible with the 6U form factor Both of these features have played a major part in CompactPCIrsquos success The next major evolution of 6U CompactPCI came with the PICMG 216 Packet Switched Backplane standard which was originally conceived by John Peters and his team at Performance Technologies PICMG 216 interconnected a shelf full of CompactPCI single board computers via redundant Ethernet switches also in the 6U CompactPCI form factor This dramatically increased usable backplane bandwidth and provided redundancy PICMG 216 paved the way for AdvancedTCA and was the industryrsquos first open standard for the switched serial interconnect standards we see popping up in many places

By Joe Pavlat

Looking back and ahead at6U CompactPCI

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Recent 6U CompactPCI related products are listed here For more informationenter the productrsquos RSC No at wwwcompactpci-systemscomrsc

cPCI-6910Dual-core Intel Xeon Processor LVULV Universal blade bull Supports Single Dual-Core Intel Xeon LV or ULV processorsbull Front Side Bus 667 MHz bull Up to 2 GB DDR2 400 MHz soldered SDRAM with ECC bull Four PCI Express GbEbull Up to 4 USB 20 ports bull PICMG 20 21 29 216 compliant

RSC No 35013

ADLINK Technologywwwadlinktechcom

CPCIStor Module6U CompactPCI storage blade bull Onboard ATA controller supports CDDVD HDD and solid-state flashbull Supports Hot Swap Removal (ask about RAID support) bull ATA disks available in Enhanced Dutycycle versions for NEBS Level 3 - 724 requirements bull Operating Systems supported VxWorksLinux and Windows

RSC No 34800

ACTTechnicowwwacttechnicocom

Prosody X cPCI E1T1An E1T1 digital network access card bull Suits telco developers and systems integrators bull Uses Aculabrsquos worldwide protocol coverage including Aculabrsquos SS7 stack available under a cost free license bull Available with 8 or 16 E1T1 trunks and software selectable E1T1 interfaces bull Flexible mix of protocols including ISDN CAS and SS7 (ITU-T China and ANSI) bull A variety of interconnect switching and protocol conversion solutions can be readily crafted bull High availability reliability and scalability with industry standard hardw re and software interoperability bull Up to 128 SS7 signaling links bull Non-circuit related (TCAP) messagingintensive applications such as prepaid and SMS

RSC No 35408

Aculabwwwaculabcom

Adexp8021Intel Core Duo L2400 (166 GHz) w E7520 server chipset bull Dual channel PC2-3200 Registered RAM SECDED or x4 SDDC bull Two GbE two Serial ATA four USB 20 bull Onboard SXGA graphics 1280 x 24-bitbull 6U CompactPCI Bus PICMG EXP0 R10 Specification bull RoHS compliant 0 degC to +55 degC operating range

RSC No 32837

Advanet Incwwwadvanetcojpen

TC84012 channel single-stop Time-to-Digital Converter (TDC) with single-start and multi-start acquisition modes bull 50 ps timing resolution bull Wide range with upto 20 s between first and last events bull Large internal memory buffer with up to 512 hits per channel bull Low jitter (lt3 ps rms) high stability (plusmn2 ppm) internalclock source bull External 10 MHz reference input bull FPGA based Data Processing Unit (DPU) bull Fast readout with DMA mode for increased data throughputbull Overvoltage-protected inputs with 50 Ω K-Lock (LEMO) connectors bull Built-in self calibration bull Modular single-slot 6U PXICompactPCI standardbull Low power consumption (lt22 W)

RSC No 33445

Agilent-Acqiriswwwacqiriscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

MIC-30428-slot 6U CompactPCI backplane bull AC or DC CompactPCI 500 W + 250 W redundant(2+1) power supplies bull PICMG 216 (CompactPCI Packet Switching Backplane) compliancebull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarmmodule (MIC-3924L-AE)

RSC No 32851

MIC-30436-slot 6U CompactPCI backplane bull Supports two hot-swappable SCSISATA or removableIDE HDD bays bull Built-in IDE slim-type DVD-ROM bull AC or DC CompactPCI 250 W + 250 Wredundant (1+1) power supplies bull Supports hot-swappable fan modules bull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarm module (MIC-3924L-AE)

RSC No 32850

Advantech Corporationwwwadvantechcom

Dual-Core Xeon CompactPCI SBCModel PP 42123x bull Dual CPU 6U CompactPCI SBC supporting two dual-core Xeon CPUs bull Up to 8 GB DDR2 ECC SDRAM in a single system or peripheralslot bull Dual processor SBC in a single 6U CompactPCI slot bull Supports two 166 GHz Dual-Core Intel Xeon ULV processors using Intel E7520 server chipsetbull Up to 8 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull PMCXMC site support 66 MHz PCI-X and x8 PCI Express bull Front and rear IO bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade bull Four GbE ports with option for PICMG 216

RSC No 34761

6U CompactPCI Core 2 Duo SBCModel PP 41203x bull 6U CompactPCI Core 2 Duo SBC supporting two PMC sites includingone XMC site bull Up to 4 GB DDR2 ECC SDRAM bull All in a single system or peripheral slot bull TwoPMC sites supporting up to 100 MHz PCI-X bull One XMC x8 PCI Express bull Front and rear IObull Supports 216 GHz or 15 GHz Intel Core 2 Duo processors bull Intel E7520 server chipsetbull Up to 4 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade

RSC No 34763

PP 30202xTwo processor versions available bull 18 GHz Intel Pentium M processor 745 uses mFC-PGA 478 (micro Flip-Chip Pin Grid Array) package bull 14 GHz Intel Pentium M processor Low Voltage 738uses mFC-BGA 479 (micro Flip-Chip Ball Grid Array) package bull 64 KB primary (L1) on-die cache2 MB of secondary (L2) on-die cache bull 400 MHz Front Side Bus (FSB) bull No CPU fan bull 16 GHz processor version (1 MB L2 cache) available see PP 30002x datasheet bull Utilizes 64-bitIntel 855GME chipset bull Supports 400 MHz bus frequency bull Uses Intel 6300ESB IO Controller Hub

RSC No 32659

Concurrent Technologies Incwwwgocctcom

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PrOduCT GuIdE6U CompactPCI

cCIBPMC6U-ETA 6U bridged dual PMC carrier that bridges extended temperature CompactPCI boards and PMCs bull Features a rugged CompactPCI form factor providing increased flexibility to military communications systems designers bull Provides additional design choices to users through its differing bus speeds maximizing the numberof PMCs that can be used CompactPCI andPMC buses can both run at 66 or 33 MHzbull Operating temperature range of -40 degC to+85 degC bull Signal conditioning bull DMA supportbull Low-power design +5 V +33 V +12 V -12 V bull User-selectable VIO of 33 V or 5 V to the PMC

RSC No 32891

Dynamic Engineeringwwwdynengcom

cPCI4IP-MMMinimized PCI address footprint IndustryPack carrier for CompactPCI applications bull 6U 4HP4 IP positions 832 clock selection for each slot fused filtered power IO options bull ID INT IO and Mem spaces are decoded for each IP slotbull Single and double wide IPrsquos bull 16- and 32- bit IPs bull 32-bit access to 16-bit IPs bull Full or mini-mized Memory Space decoding for 18 the PCI address requirement bull With the cPCI4IP-MM option 8 CompactPCI 4IP cards take the same PCI address space as 1 full Mem Space card

RSC No 34905

ACQ132CPCI32 channel MHz class simultaneous sampling intelligent digitizer bull 32 simultaneous analoginput channels 2-32 MSpschannel 14-bit resolution bull Differential inputs bull Intelligent cardwith 1 gigabyte memory and GbE on board bull Large distributed FPGA resource on boardbull Range of DSP functions including FIR filtering and Digital Downconverter

RSC No 35482

D-TACQ Solutions Ltdwwwd-tacqcouk

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CR11Based on the Intel Core Duo Processor the platform is designed to support processor speeds from 106 GHz up to 20 GHz bull Intel Core 2 Duo runs at 15 GHz up to 20 GHz bull Conduction cooled bull Two PMC slots bull PCI Express bull 2x GbE

RSC No 33156

ICS-72532-channel 6U CompactPCI DAC board bull 6U CompactPCI data acquisition card bull 32 differential output channels bull 16 or 24-bit sample size bull 288 kHzch data rate bull Simultaneous sampling across all channels on single or multiple boards bull 32 separate delta-sigma DACs bull 64-bit 66 MHz CompactPCI PICMG 20 Rev30 hot-swappable bull FPDP II 400 MBps interface

RSC No 33576

ICS-71032-channel 6U CompactPCI ADC board bull 6U CompactPCI data acquisition card bull 32 differential input channels bull 216 KHzch 24-bit resolution bull Software selectable full scale input bull FPDP II 400 MBpsinterface bull 64-bit 66 MHz CompactPCI PICMG 20 Rev 30 hot swappable bull 32 synchronous boards for simultaneous sampling bull Sonar acoustics and test and measurement applications

RSC No 33578

Tsumani 6U CPCI Development KitFPGA processor solution targeted at high performance software defined radio applications bull Dual Stratix EP1S80 FPGAs are tightly coupled to provide apower platform for signal processing bull Two PMC module sites provide IO connectivity to either front panel or back panel connections bull A direct highbandwidth 1 GBps path from the PMC P4 connector directly to the FPGAs bull Model 919 Dual DAC Mezzanine provides broadband analog signal generationin a compact form bull The board features two independent DAC channels each with its own 12-bit LVDS input capable of running at rates up to 160 MHz

RSC No 32026

CP11Rugged 6U SBC bull Up to 4 GB of DDR2 SDRAM (200 MHz) with enhanced ECC four independent onboard PCI buses system host and peripheral modesupport for the CompactPCI backplane two PMC interfaces (64-bit133 MHz and 32-bit33 MHz) bull Instead of the PMC1 a PCI Express based XMC interface is available on request bull Two GbE one Fast Ethernet two serial interfaces (RS-232 or RS-422485) USB 20 integrated HDD or flash drive bull High performance 2D3D ATI video controller capable of driving two displays in parallel supports VGADVI interface bull Intel Core 2 Duo at 216 GHz Intel Core Duo at 20 GHz2x PMC expansion site bull One XMC optional bull Up to 4 GB DDR2 SDRAM wECC 2x GbE

RSC No 33447

GE Fanuc Intelligent Platforms Incwwwgefanucembeddedcom

Single Board ComputersGD Canada designs and manufactures conduction-cooled Single Board Computers (SBCs)using Intel processors bull 6U and 3U form factors for CompactPCI backplanes bull Fully backward compatible with earlier models bull Upgradeable via the change-out of processor memory andIO modules bull Used within GD Canada computer systems and sold as individual products

RSC No 35281

General Dynamicswwwgdcanadacom

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PrOduCT GuIdE6U CompactPCI

cPCI6U-24DSI32R32-channel 24-bit delta-sigma CompactPCI 6U analog input board with rear IO bull Low noise 24-bit resolution low phase distortion andmulti-board synchronization bull Suits state-of-the-art sonar and noise monitoring applications bull 32-channel cPCI6U-24DSI32 analog input boardprovides a high-density 24-bit analog input resources on a standard 6U CompactPCI expansion board bull Applications from precision voltagemeasurements to complex audio signal and waveform analysis

RSC No 34985

General Standards Corporationwwwgeneralstandardscom

Duet 3U 64-bit 1 GHz TMS320C6416 DSP (x2) 64 MB SDRAM per processor bull Flexible internalexternalcommunication mesh bull 64-bit66 MHz CompactPCI bull PMCXMC site with Jn4 to FPGA and4 RocketIO per VITA 42 bull External data port up to 12 Gbps bull 4M or 5M Virtex-II Pro FPGAbull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM dedicated800 MBps links between DSPs bull 3U CompactPCI with PXI support bull Suits high-end co-processing wireless broadband communications RADAR video and biometrics

RSC No 32856

QuadiaQuad-DSP bull Dual FPGA bull Dual PMC sites bull Inter-processor connectivity and access to external interfaces bull Four C6416 DSPs split in two independent clusters each hosting a PMC site bull One large FPGA for end-user code bull Central FPGA routing interprocessor communication bull End-user FPGA communication bull External port serial IO for PCIe or other p ivate link bull Global memoryand PCI interface bull 1 GHz TMS320C6416 DSP (x4) bull 64 MB SDRAM per processor bull Flexible internalexternal communication mesh bull 64-bit66 MHz CompactPCI bull Two PMC sites with Jn4 to FPGA bull External data port up to 12 Gbps bull Two 4M Gate FPGA reserved for end-user code bull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM bull Up to 512 MB Global DDR SDRAM bull Suits high-end co-processing wireless and broadband communications

RSC No 34737

Quixote 64-bit 6UAdvanced signal capture generation and co-processing bull 1 GHz TMS320C6416 DSP and2 to 6 MGATE Virtex-II FPGA bull 32 MB SDRAM 8 MB ZBT SBSRAM and AD6645 and AD9764 converters bull 6432 bit CompactPCI 66 MHz 5 V33 V and complex trigger modes with HW event logging bull PMC site with Jn4 to FPGA DIO and PICMG 217 StarFabric compliant bull Suits Software Defined Radio wireless IP and RADAR development and hardware testing bull Physical Layer field testing ultra-fast flexible data acquisition vector signal generation and electronic warfare

RSC No 32861

Innovative Integrationwwwinnovative-dspcom

IC-e6-cPCIbHigh performance 6U CompactPCI board bull Powered by one or two of Freescalersquos mostadvanced 14 GHz MPC7448 PowerPC processors bull PICMG 216 compliant bull Marvell Discovery III chipset (MV64460) bull Low power consumption bull Standard extended and rugged grades

RSC No 32982

Interface Conceptwwwinterfaceconceptcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CP213Single-width 6U CompactPCIPXI module with either 32 or 64 differential analog input channelsbull 32 64 or 128 channels of analog input bull 16 multifunction digital IO (TTL) channels that may beconfigured as digital in digital out or selectively attached to 2 frequency in 2 counter in andor 2 timerout channels bull 16-bit resolution bull Programmable gain per channel programmable scan rates of lt1 Ss through 100 KSs bull Precision onboard reference for end-to-end calibration

RSC No 34804

KineticSystems Company LLCwwwkscorpcom

CP6001Energy efficient embedded Intel dual core processors bull 12 GHz Intel Core Duo U2500 ULV processor bull Intel Core 2 Duo L7400 LV processor bull Based on the Intel Mobile 945GM chipset with a front side bus of up to 667 MHz and ICH7-R Southbridge bull Two independent digital video outputs to the rear IO (2x DVI - 1x DVI and 1x HDMI) bull AC97 audio capabilities bull 3 x GbE bull 4 x SATA with RAID 01510 functionality bull 6 x USB 20 2 x COM and VGA or DVI bull Can also accommodate a PMC slot or an onboard 25 inch SATA HDD bull Up to 8 GB of USB or 2 GB soldered flash bull Supports Linux Windows XP XP embedded and VxWorks 6

RSC No 34182

CP6923 GbE Switch6U CompactPCI GbE Switch PICMG 216 compliant bull Leading edge te hnology basedon BCM5650X chip bull 24x GbE ports bull Non-blocking Layer 2 and 3 switching and routingbull Copper optical rear IO version bull Hot swap IPMI bull Fully managed bull Comprehensive firmware package bull Applies to VoIP installations such as call servers media gatewaysand trunking gateways in wireline and wireless networks as well as VoIP systems inenterprise networks with high demands on performance

RSC No 32256

Kontronwwwkontroncom

TMS320C6701 Virtex-IITexas Instrumentsrsquo C6701 DSP bull Xilinx Virtex-II series FPGA up to XC2V8000 bull Multiple IO interfaces Onboard CODEC VIM expansion sites 60-pin GPIO header and JTAG bull Hardware drivers integration in SimulinkXilinx System Generator Blocksets for quick implementation of Simulink models bull DSP and FPGA-in-the-loop cosimulation of SimulinkXilinx System Generator models bull Leading edge communication interface allowing real-time datamonitoring from Simulink scopes and remote operations

RSC No 32028

VHS-DACHigh performance multichannel DA for phased array antenna systems radarsonar communications receiversup-sampling to IF stage and RFIF AGC apps bull Eight 125 MSPS output channels bull Optional add-on daughter boardprovides 8 additional output channels or 8 additional input channels bull 32-bit 25 MHz bull FPDP interface with 400 MBps transfer rate (25 MSPS per channel at 8 channels 125 MSPS at 16 channels) bull Low level hardware drivers API andGUI bull High level hardware drivers integration in Simulink Blocksets bull Leading edge communication interface fordata recording and playback tofrom the onboard SDRAM

RSC No 32029

Lyrtechwwwlyrtechcom

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PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

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PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

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PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

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SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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Page 2: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

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2008

B A

N D

W I

D T

H

Published by

copy 2008 OpenSystems Publishingreg CompactPCI PICMG AdvancedTCA ATCA MicroTCA and their logos are registered trademarks

of the PCI Industrial Computer Manufacturers GroupTM AdvancedMC and CompactTCA are trademarks of the PCI Industrial Computer Manufacturers Group copy 2008 CompactPCI and AdvancedTCA SystemsAll registered brands and trademarks in CompactPCI and AdvancedTCA Systems are property of their respective owners

OpenSystems Publishingtrade

wwwcompactpci-systemscom wwwadvancedtca-systemscom

Volu m e 12 bull N u m be r 1

FebruArY 20 08

C O L U M N S 8 Editorrsquos Foreword Why AdvancedTCA is at home in HSS By Joe Pavlat

10 Global Technology Award recognizes unique rugged camera control system By Hermann Strass

11 Software Corner Cable and CALEA A look at cable networks and lawful surveillance By Curt Schwaderer

D E PA R T M E N T S 44 New Products

E - C A S T Swwwcompactpci-systemsecast

Energy Efficient DesignsMarch 2008

Platform ManagementApril 2008

CompactPCI reg

AdvancedTCA regand Systems

The Magazine for Developers of Open Communication Industrial and Rugged Systems

W E B R E S O U R C E SRead the latest E-letter atwwwcompactpci-systemscomeletter

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F E A T U R E S

APPlICATIoN AdvancedTCA

15 Choose the right formula for compute-intensive HSS systems AdvancedTCA platforms versus 1U PCI rack-mount servers By Sven Freudenfeld Kontron

TeCHNoloGY BACKPLANES

22 Channel characteristics challenge backplane interoperability By Stuart Jamieson Emerson Network Power Embedded Computing

25 Developing IEEE 8023ap 10GBASE-KR compliant backplanes Why does AdvancedTCA need bandwidth scalability By Douglas Hynd Simclar Group

PRODUCT GUIDE

31 6U CompactPCI

COVEROn page 22 read about the channel characteristics that are challenging backplane interoperability as backplane speeds approach 100 Gbps

g

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34 ACTTechnico ndash Networking Hardware20 Adax Inc ndash ATMIV AMC Controller45 Adax Inc ndash SS7ATM Controller39 Advantech ndash Advanced Blade Solutions7 Annapolis Micro Systems ndash Wildstar 5 for IBM Blade 43 Astek ndash Storage41 Concurrent Technologies Inc ndash Dual-Core Processors47 ELMA Electronic ndash MicroTCA Solution13 Excalibur Systems Inc ndash Mil-1553 ccVME5 GE Fanuc Intelligent Platforms ndash Software development environment3 Harting Technology Group ndash AdvancedMC Connectors17 Hendon Semiconductors ndash I2C Bus Buffer8 Interface Concept ndash Embedded Products2 Interphase ndash AdvancedTCA and MicroTCA Solutions48 Kontron ndash Open Modular Solutions9 National Instruments ndash Automated test system14 One Stop Systems Inc ndash PCIe over Cable16 Performance Technologies ndash One-Stop Shopping23 Red Rock Technologies Inc ndash Mass Storage Modules28 Rittal ndash AdvancedTCAMicroTCA40 SDR Forum ndash Call for papers21 VON ndash digiumAsterisk World19 Winchester Electronics ndash Connector Solutions29 XALYO ndash XS-AMC2

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A D V e r T I S e r I N F o r m AT I o N

Page AdvertiserProduct description

CompactPCI reg

AdvancedTCA regand Systems

ompactPCIdvanc dTCA S

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By Joe Pavlat

CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems

EDITORrsquoS FOREWORD

Why AdvancedTCA is at home in HSS

With this first issue of 2008 (Happy New Year) our colleague Sven Freudenfeld from Kontron gives us an excellent and detailed comparison of 1U rack-mount servers and AdvancedTCA in a real application a Home Subscriber Server (HSS) He describes the application in detail and then compares

space cooling maintenance management capabilities scalability and switching require-ments Sven makes a compelling case that AdvancedTCA provides many essential application elements that must be separately and expensively added to 1U servers He concludes that AdvancedTCA allows Telecom Equipment Manufacturers to concentrate on developing software instead of hardware and that reduces development costs and speeds time to market

PICMG addressing new data bandwidth standardsWhile AdvancedTCA provides a great deal of backplane bandwidth especially in full mesh configurations designers want to go even faster to accommodate new bandwidth-hungry applications like IPTV Last year the IEEE ratified important new standards for 10 gigabit per second data transmission over a single pair of conductors Of special interest to our community is the 8023ap 10GBASE-KR standard which details how to achieve that blaz-ing speed over a backplane The PICMG community is moving towards setting up a new subcommittee to incorporate this technology into the AdvancedTCA standard and it may be operating when this issue hits the street It has the potential of providing a total useful backplane bandwidth of 10 terabits per second in a single shelf Thatrsquos a truly amazing

number Douglas Hynd from the Simclar Group introduces us to the details of designing systems at that speed discuss-ing losses signal skew and crosstalk At these speeds simulation is essential and Douglas describes some of the issues involved Also in this issue Stuart Jamieson from Emerson Network Power gives us additional insight into high-speed signaling design simulation and analysis

A name change from Technology in Europe to Global Technology goes into effect this month for the column written by industry veteran Hermann Strass In this issue Hermann tells us how CompactPCI products from MEN Micro have been incorporated into the design of a new highly sophisticated digital cinema camera developed by Silicon Imaging In addi-tion to providing very high resolution and speed the camera must also operate in harsh environments MEN Micro won the 2007 Intel Communications Alliance Innovate and Ignite Technology Showcase award for its work

Curt Schwadererrsquos Software Corner this month expands on a subject he wrote about last April (wwwcompactpci- systemscomcolumnssoftware_corner 200704) As cable companies expand their offering beyond television to voice and data services they become subject to the same laws relating to cyber crime as the traditional telecommunications pro-viders do They must provide law enforce-ment authorities surveillance that is the subject of a lawful warrant and industry standards are being rolled out to do this Itrsquos a timely topic as serious problems with identity theft and cyber crime ingeneral are on the rise Curtrsquos column isan interesting read

Joe Pavlat Editorial Director

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By Hermann StraSS

GLOBALTECHNOLOGY

CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems

Award recognizes unique ruggedcamera control system

The 2007 Intel Communications Alliance Innovate and Ignite Technology Showcase (ICA) named MEN Micro Inc the ICA Showcase winner on September 19 2007 at the Embedded Systems Conference Boston MEN Micro a

subsidiary of MEN Germany has developed a unique control system for a rugged digital movie camera

Silicon Imaging an innovator in IT-centric digital cinema cameras required a rugged camera control system for its new SI-2K camera The SI-2K (shown in Figure 1 courtesy of Silicon Imaging United States) executes direct-to-disk raw recording at either 1920x1080 pixel high definition or at 2048x1152 pixel for cinema resolutions Its 48-bit digital processing algorithms perform adaptive pixel-by-pixel calibration and color image enhancement The SI-2K fore-goes legacy fixed bit-rate DCT codec recording formats such as DVCPRO HD and HDCAM-SR for advanced wavelet compres-sion technology Current generation HD cameras destructively process and compress their imagery at the acquisition stage The SI-2K streams images as raw digital negatives over a standard GbE connection The Intel Core 2 Duo processor-based F17 system from MEN non-destructively processes the raw digital negatives in real time to the visually perfect CineForm RAW codec which makes capturing up to four hours of continuous footage on a single 160 GB notebook drive possible

MEN Micro developed a customized version of its Intel Core 2 Duo processor based F17 3U CompactPCI SBC a unique side card for advanced audio and video capabilities as well as a rug-ged compact enclosure Already being used at independent film production studios for the making of full-length feature films the digital camera employs technology that can be repackaged for surveillance military sports analytics 3D video and stereo ap-plications The camera can operate in environments ranging from desert to arctic

The F17 SBC from MEN (Germany) controlling the camera in-cludes an Intel Core 2 Duo processor T7600 running at 233 GHz The SI-2K uses MENrsquos SBC for simultaneous encoding of data An Intel Graphics Media Accelerator 950 (Intel GMA 950) per-forms image graphics processing colorization and visualization at full resolution The F17 is equipped with 2 GB fast DDR2 DRAM a hard disk on a removable slot and two Intel GbE PHYs which transfer data from the camera head to the camera control unit and to other standard IP hardware The custom side card enables the connection of a High-Definition Multimedia Interface (HDMI) headphones and balanced analog input and output ports for pro-fessional audio signals

Specified for an extended temperature range in harsh shooting environments the camera uses MEN Microrsquos F17 board equipped

with a massive tailored heat sink accompanied by a fan install-ed inside the camerarsquos housing The F17 is part of MENrsquos powerful family of intercompatible CompactPCI Express SBCs including the newer and more powerful F18 which is completely compatible with the F17 and will also be incorporated into Silicon Imagingrsquos new SI-2K camera

European eventsThe 26th MOTEK International Trade Fair and Exhibition the worldrsquos largest event for assembly handling and automation sup-port systems and devices was held for the first time in the brand- new Neue Messe in Stuttgart Germany from September 26 to September 27 2007 The exhibition space increased by 45 percent over last yearsrsquo event due to the new venue More than 1100 exhibitors from 20 different countries drew around 40000 visitors and filled all five new exhibition halls Mechatronics was speci-fically featured as were robots and automation equipment In 2008 about one million square feet of exhibition space will be available when four more halls are completed at Europersquos most modern fair grounds near the Stuttgart Airport Terminal

EMO 2007 (Hannover) the worldrsquos largest exhibition of metal-working equipment closed its gates on September 22 after six days of exhibition with around 160000 attendees visiting booths of 2100 exhibitors from 42 countries 18 million square feet was devoted to exhibition space The organizers German Association of Machine Tool Manufacturers (VDW) reported new busi-ness contracts at the rate of 4 billion EURO (almost $6 billion) Exhibitors such as TRUMPF Laser Germany (see my April 2007 column (wwwcompactpci-systemscomcolumnsTechnology_in_Europe200704) reported full success at EMO 2007

For more information contact Hermann athstrassopensystems-publishingcom

Figure 1

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By Curt SChwaderer

CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems

SOFTWARE CORNER

In the April 2007 Software Corner column (wwwcompact-pci-systemscomcolumnssoftware_corner200704) we explored surveillance systems and the Communications Assistance for Law Enforcement Act (CALEA) a lawful

surveillance capability mandate Internet access and VoIP pro- viders had to be compliant with CALEA by May 2007 or face severe financial penalties

In this monthrsquos column we will look at what cable companies are doing to provide lawful surveillance capabilities within their networks

The term cable company is now officially a misnomer Cable companies and their networks are capable Internet access and voice service networks that offer the general public a one-stop shop for all their communications and entertainment needs In fact cable companies now typically call themselves Multi-Service Operators (MSOs) Voice and data services form a significant and grow-ing source of revenues for the MSO To that end cable networks become subject to the same rules and regulations that telecommu-nications networks do

One of these regulations is CALEA which provides the ability for network providers to tap specific subscribers when served a warrant To their credit cable companies and their research and development consortium organization CableLabs (cablelabscom) have been very proactive planning for lawful surveillance capa-bilities and CALEA compliance within their networks CableLabs and its partners have been working on a set of PacketCable stan-dards that incorporate specifications for voice and broadband data intercept We will focus on the new Cable Broadband Intercept Specification (CBIS) what it encompasses and paths for imple-mentation within cable networks

Cable Broadband Intercept Specification The set of specifications governing cable network services and capabilities is called the Data-Over-Cable Service Interface Specifications (DOCSIS) The specification that covers lawful

surveillance for data services is CBIS The CBIS reference model is shown in Figure 1

The surveillance architecture consists of three components the Mediation Function (MF) Broadband Intercept Function (BIF) and Collection Function (CF) When a warrant for a subscriber is served the network administrator configures the MF to capture traffic coming to andor from the subscriber This traffic includes any dynamic IP address assignment transactions (called out-of-band traffic) as well as the traffic resulting from e-mail voice or data services being used by the subscriber in question Creating hashes of these files validates the captured traffic as not having been tampered with It is also important for the network provider to supply traffic only for the subscriber the warrant is served on Older methods of surveillance involve dumping all traffic from a particular service area from all users in that area then sifting through that traffic manually This method violates the privacy rights of all the other subscribers in the service area of the individual(s) the warrant is served on Surveillance equipment that can capture only the traffic to or from the subscriber in the warrant is critical to the lawful surveillance aspects of the deployment

So far this is similar to the Alliance for Telecommunications Industry Solutions (ATIS) standards governing voice and data surveillance for digital wire line systems Unlike the original ATIS specifications the CBIS specification includes the BIF The BIF is a buffering component where the Mediation Function pushes the surveillance information (in the form of surveillance files) to the BIF for retrieval by the Collection Function at a later date

The CF component gathers the surveillance information from the BIF under law enforcement control then analyzes and presents the surveillance information in a useful way The CF also validates the information by comparing hashes of the files against hashes generated by the surveillance equipment at the time of capture This ensures that from the time the traffic is captured it is not tampered with

Cable and CALEA A look at cable networks and lawful surveillance

Figure 1

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Buffering is importantThe buffering capability the BIF provides in the CBIS specifi- cation is an important distinction between it and the ATIS specification (for more information on the ATIS specs see the April 2007 Software Corner (wwwcompactpci-systemscom columnssoftware_corner200704)

Buffering is so important that ATIS has approved an additional standard for a Buffering Function (BF) within the ATIS lawful surveillance environment

The importance of buffering is best described in a presentation that Dr Glen Myers CEO of IP Fabrics gave at the December 2007 ISS World conference The real-time delivery that the initial ATIS specification defines can be problematic as Figure 2 shows Packet loss from congestion bit errors or QoS contracts can result in the entire surveillance stream being rendered inadmissible

Dr Myers further explained that ATIS allows their buffering model to be separate from or combined with the MF while the cable network CBIS model assumes the buffering function is always separate from the MF component (Figure 3)

The buffering function whether it be the Buffering Function in the ATIS model or the Broadband Intercept Function in the CBIS model minimizes the impact of packet loss and real-time data delivery The Mediation Function can repeatedly attempt to send surveillance information to the BIF through a secure reliable file transfer function such as secure FTP If there are problems connecting with the BIF alerts can be generated so the network administrator can find and fix the problem while the surveillance information is still resident on the MF system

Dr Myers mentioned other important benefits to providing a buffering function The network administrator does not need to

negotiate and install a dedicated link for each intercept between the MF and the Law Enforcement Agency or agencies (LEA) authorized for the information Dedicated pipes matching the subjectrsquos peak service bandwith are not needed Support for mul-tiple LEAs is easily implemented at the BIF instead of the Mediation Function Law enforcement collection equipment does not need to be co-located with the Mediation Function It also simplifies connectivity by eliminating Virtual Private Networks (VPNs) or other routing ele-ments between the MF and the LEA(s)

CALEA and CMTSIn a cable network the Cable Modem Termination System (CMTS) is typically the central point within which service provider traffic from the access network meets the cable core network (and ulti-mately the Internet) So the CMTS is an important interface point for lawful surveillance

CMTS equipment may provide varying levels of support for lawful surveillance The simplest is to provide access to all the raw traffic flowing through the CMTS using an Ethernet tap or span port In this scenario the Mediation Function must find the traffic belonging to the subscriber under surveillance generate the appro-priate CBIS files and send the files to the BIF

Cisco a leading supplier of CMTS equip-ment to the cable industry provides a capability called Service Independent Intercept (SII) within their CMTS prod-ucts Cisco SII is also used in their routers and intelligent switches for QoS control in addition to lawful surveillance While SII provides support for identifying traffic by MAC and IP address information it does

Figure 2

Figure 3

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not provide the high-level configuration and lawful surveillance messages required of the Mediation Function SII uses low-level SNMP MIBs that control MAC and IP address configuration commands which in turn trigger the Cisco SII device to send packets matching the configuration to a span port where the Mediation Function can use these matched packets to generate the lawful surveillance messages So SII provides a first-level filter for the Mediation Function which supplies a high-level configuration interface at the warrant description level as well as creation of the CBIS (or ATIS) messages to be sent to the BIF

CBIS-compliant productsThe CBIS specification is quite new so released products are mostly on the hori-zon However the IP Fabrics DeepSweep Lawful Surveillance product line does provide MF andor BIF functionality for the implementation of CBIS-compliant networks Dr Myers noted that the DeepSweep product line is based on a flexible architecture and a highly parallel processing environment comprised of many software surveillance modules that can be loaded and chained within the DeepSweep to provide a number of Layer two to seven surveillance and packet analysis activities The device is programmed through a GUI and operates as a full Mediation Function with the ability to identify subscriber-related IP address assignment and resulting traffic from a span port The DeepSweep also has software support to communicate with SII enabled routers and CMTS sys-tems to provide a fully compliant ATIS andor CBIS surveillance environment compatible with Cisco lawful intercept and QoS services

CBIS BIF and ATIS buffering appliances are also available to provide buffering compliant with CBIS and ATIS standards

ConclusionCyber crimes such as identity theft child pornography chat-room initiated abduc-tion national security and piracy are very real and growing issues in todayrsquos society Billions of corporate and personal dollars have been tied to cyber crooks that abuse the Internet to participate in these activities It is essential that these illegal activities can be identified and stopped It is a good idea to be aware that the cable industry and its proactive support of lawful surveillance standards as well as rolling out equipment that implements these standards will in turn enable law enforcement to catch these cyber crooks and make the Internet a safer place for us and our children to live learn and work

For more information on this or any Software Corner contact Curt atcschwadereropensystems-publishingcom

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APPLICATION g

Based on current overall network growth Telecom Equipment

Manufacturers (TEMs) and Network Equipment Providers (NEPs)

are being challenged to launch new communications platforms

that provide optimal scalability flexibility manageability and

high computing performance With the expected increase in new

subscribers who need to be supported across the network TEMs and

NEPs are focusing on COTS platforms that meet the requirements of

a carrier-grade environment

With these new challenges it is important to take a look at the different

applications in the network to thoroughly evaluate the best hardware

platform approach Comparing the scalability IO functionality

interconnectivity and overall performance gives TEMs and NEPs a

solid basis from which to choose the best cost-effective solution for

their applications This article compares the traditional 1U PCI

platform with a more modular AdvancedTCA-based approach to

a Home Subscriber Server (HSS)-based platform

Emerging next-generation network architecture IMS Carriers and service providers are focused on improving their Average Revenue Per User (ARPU) by deploying new services quickly and at a price that is acceptable to subscribers IP Multimedia Subsystems (IMS) enable service providers to offer differentiated services to their subscriber base integrating voice video text and content as part of their service mix regard-less of the access technology

The IMS framework provides the telecom industry with a modular standards-based IP service delivery infrastructure More than simply replacing existing circuit services with similar services delivered over IP IMS allows service providers to capitalize on faster and more cost-effective deployment of new and differentiated multimedia communication services

While these new technologies promise new sources of revenue and enhanced customer loyalty they also pose implemen- tation challenges One of the crucial net-work elements within an IMS framework is the manageability of the subscriber base Today an increasing number of users subscribe to multiple services such

By Sven FreudenFeld

Choose the right formula forcompute-intensive HSS systems

AdvancedTCA platforms

versus1U PCI rack-mount servers

AdvancedTCA

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as multimedia mobile phones VoIP or IPTV at home Service providers must manage ldquoduplicatedrdquo subscriber databases for each particular service Consequently managing a converging subscriber base for such network functions as billing across multiple different technologies presents a tremendous challenge Any downtime of this network element can be costly to the carrier or service provider not to mention the heavy risk of losing subscribers over the long term

The HSS and Home Location Register (HLR) are key elements in the IMS network required to manage the growing number of subscribers These platforms that manage millions of customersrsquo data need to be highly reliable with carrier-grade High Availability (HA) functionality Core requirements for the HSS computing platform are

n High compute density for application processingn Scalable performance and high densityn Fast read access to the subscriber datan Large storage and memory bandwidthn Ability to consolidate multiple IMS elements and subscriber data within a single

platform with a modular approach as a converged services platform

HSS plays network backbone roleHSS provides the important network backbone of the IMS architecture because it eases innovation and addresses a range of service-logic interaction issues that have plagued previous service architectures HSS offers open access to service-related data for each subscriber supporting the sharing of data among multiple services

HSS is essentially the master user database that supports IMS network entities that handle calls and sessions It contains user profiles performs authentication and authorization of the user and can provide information about the physical location of the user It plays a key role in provisioning service creation enabling subscriber data and managing control roaming and interconnection The Application Server (AS) which hosts and executes serv- ices in the IMS environment communicates with the HSS Call State Control Function

(CSCF) servers also communicate with the HSS which must be able to

n Support IMS-level authentication and authorization

n Maintain IMS subscriber profile(s) independent of access types

n Maintain service-specific datan Keep track of currently assigned

CSCFn Support CSCF and AS access

HLRHSS hardware platform design choicesHSS design must enable the HSS to be deployed cost-effectively and expand readily to meet future subscriber levels For example the trend to include more information as part of the data record for each subscriber will drive up memory requirements

From a technical perspective the key metrics to understand when developing the IMS HSS functions are the number of completed transactions required per sec-ond and the size of the subscriber base

HSS architecture typically comprises multiple processor units with extensive memory requirements With the introduction

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of multicore processors from Intel developers can scale performance while optimizing power consumption in the overall system design

To meet these requirements the hardware platform needs to provide scalability flexibil-ity and long-term cost efficiency In comparing the traditional 1U platform with a more modular approach to the HSS using AdvancedTCA consider the following

n High compute performance n High memory and storage capabilityn IO functionality to connect to multiple networks (such as SS7 and Ethernet)n Carrier-grade profile and redundancy

AdvancedTCA High density with scalability on a smaller footprintTable 1 illustrates a comparison of a sample AdvancedTCA-based platform and a 1U PCI rack-mounted platform for HSS applications This configuration assumes an increasing subscriber growth from 1 million (M) subscribers to 18M subscribers per platform

FootprintAdvancedTCA-based platforms provide a high density compute platform with scalability on a smaller footprint TEMs can easily add boards to a chassis to accommodate more traffic and to support new services This flexibility enables an increase in subscribers and the database without having a major impact on rack space in the central office environ-ment To meet the same capacity for 18M subscribers the 1U PCI approach will occupy two bays or cabinets with a total footprint of 28 square feet compared to the same capacity occupying one bay or cabinet with a footprint of 14 square feet (see Figure 1)

CoolingWhile the power consumption per square foot is higher than the 1U PCI platform AdvancedTCA offers better airflow and cooling distribution using a push-pull cooling system Each 1U PCI platform includes up to nine cooling fans and is dedicated to that CPU in the 1U server only which translates into higher overhead Therefore the airflow is

not optimized in the overall system design In the case of a fan failure AdvancedTCA platforms enable easier access to replace the fans which are field replaceable units The 1U platform also does not include any integrated centralized switching or management capabilities therefore the total does not include any switching or system management functionality

ScalabilityAdvancedTCA architecture lends itself well to scalability As AdvancedTCA sup-ports both a Base and Fabric interface into the backplane and the separation of data and control planes TEMs can also scale up their designs from 1 GbE to 10 GbE to accommodate new users and usage requirements AdvancedTCA based systems are designed for easy upgrade-ability to new processing blades switch fabrics and IO modules using Advanced Mezzanine Cards (such as SS7)

Since AdvancedTCA and AdvancedMCs offer hot swap capabilities and HA func-tionality growing a subscriber base by using additional CPU blades within the system with low maintenance or upgrade downtime is crucial for the HSS plat-form It also allows for the up and down

AdvancedTCA-based HSS Platform 1U PCI Rack-Mount HSS Platform

Number ofsubscribers

~1M subscribers = 4 CPU blades edundant ~1M subscribers = 4 x 1U

~4M subscribers = 7 CPU blades redundant ~4M subscribers = 7 x 1U

~6M subscribers = 12 CPU blades redundant ~6M subscribers = 12 x 1U

~18M subscribers = 36 CPU blades redundant= 3 AdvancedTCA shelves per rack

~18M subscribers= 36 x 1U+ external switch components for redundancy

Technicalspecs

1 CPU blade = 2 x Intel Xeon dual core = quad core 1 1U rack-mount Intel= Intel Xeon quad core or dual core CPU

16 G DDR 2 memory Max of 8 G DRY memory

+ 2 x SATA or SASS hot swap (RAID 0 and 1)+ 1x PCI Express for SS7 Dual GbE per 1U rack-mount server

4 x GbE per CPU with built in GbE backplane switching separating Control Pathand Data Path with multishelf expandability

External central switching required withmultiple external GbE connectivity

Systems and blade manageability built into the platform withIMP implementation SNMP and CLIP

Carrier-grade redundancy on switch and node

IO for SS7 or other interface modules

CPU blade hot swap capability

Thermaland power

requirements

~6M subscribers redundant= 14 slots with centralized chassis cooling

~6M subscribers redundant= 18 x 1U PCI with independent cooling and separate switch units and system management

Total power consumption= ok (3100 W for blades and RTM + 500 W Shim fan tray and SAP)

Total power consumption= ok

Table 1

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scaling of the platform depending on the subscriber increase or decrease When consolidating multiple services minimiz-ing multiple duplicate databases requires this flexibility

InterconnectivityThe AdvancedTCA platform offers a number of interconnectivity features including

n Separation between the data plane and the control plane

n Direct uplink in a multichassis envi-ronment with up to l0 GbE

n Node to node base and fabric connec-tivity with HA carrier-grade Ethernet functionality

n Easy upgrade path to l0 GbE for increased bandwidth

By contrast the 1U PCI platform requires

n Additional external interconnectiv-ity between 1U rack-mount servers which increases the number of points of failures and the operating and maintenance costs

n Additional switching equipment for carrier-grade Ethernet connectivity

n Additional manage-ment (Simple Network Management Protocol [SNMP]) for HA redundancy

PowerThe 1U-based platform also utilizes integrated AC power supply units usually the standard for the data center and enter-prise environments AC will increase the pro-viderrsquos OPEX in the long term since the power consumption per rack is significantly higher and

Figure 1

requires additional support equipment such as an Uninterruptible Power Supply (UPS) and an AC to DC converter per rack space and ultimately per CPU These factors along with the requirements for carrier-grade functionality HA support and a more favorable long-term OPEX further reduce the need to consider the 1U solution for HSS deployments in Central Office networks

ManageabilityAdvancedTCA chassis-level management is based on the industry-standard Intelligent Platform Management Interface (IPMI) IPMI makes possible interoperability among chassis and blowers compute nodes switches and management solutions from multiple vendors enabling these elements to work together seamlessly The resulting successful inter-blade communication for applications including failover and clustering provides full manageability on a per shelf and per bay basis

Fo Sin Pnt

One of the primary goals of the AdvancedTCA specification is to ensure a very low Mean Time to Repair (MTTR) and high Mean Time Between Failures (MTBF) There are no active components in the backplane ndash which can translate to expensive repairs in the field In addi-tion AdvancedTCA specifies that all com-ponents can be hot swappable in the field and the architecture provides redundancy at all levels This hot swap capability translates to less downtime for field replacement on a per CPU blade basis as compared to 1U PCI

SummaryAdvancedTCA provides an ideal platform and meets the technical requirements for deploying flexible and scalable IMS HSS applications While other platform archi-tectures such as 1U rack-mount servers may with considerable difficulty be able to deliver HSS capabilities AdvancedTCA offers a much more advantageous solution by providing a smaller footprint improved cooling and thermal characteristics bet-ter scalability enhanced interconnectivity and easier manageability This all contrib-utes to making AdvancedTCA a lower cost approach in terms of CAPEX and OPEX for long-term subscriber growth

1U PCI rack-mount servers are not considered to be the optimal hardware platform for HSS applications in a Central Office With its limitation for carrier-grade flexibility and HA functionality the 1U PCI platform is best suited for a full range of other enterprise and Internet infrastructure applications within a data center environment that does not require any significant flexibility and HA functionality around it It might also be a good entrance point for other enterprise applications with lower price points

The use of AdvancedTCA-based platforms enables TEMs to shift away from hardware development and refocus their efforts on delivering value-added software and services As a result they can realize lower development costs and faster time-to-market enabling increased flexibility with each product design through the use and reuse of standardized off-the-shelf components Equally significant are the advantages that can be realized by the service provider With a common platform and a flexible architecture that maximizes limited floor space service providers can rapidly and flexibly implement a broad range of feature-rich solutions for faster profitability

Sven Freudenfeld is responsible for North American Business Development for the Kontron AG line of AdvancedTCA AMC MicroTCA and Pre-Integrated Solutions Sven possesses more than 15 years of experience with voice data and wireless com-munications having worked extensively with Nortel Networks in Systems Engineering Sanmina-SCI in Test Engineeringand Deutsche Telekom in Network Engineering Sven holdsan electrical engineering degree from Germany and is also Chair of the CP-TA marketing workgroup focusing on the interoperability of COTS standard building blocks

Kontron bull svenfreudenfeldcakontroncom bull wwwkontroncom

Fo Sin Pnt

Fo Sin Pnt

TECHNOLOGY g BACkpLANES

Increasing demand for service and multimedia features is stimulating a growing need for speed in telecom-munications equipment While some

applications such as PBX systems can be addressed with the gigabit backplane technologies currently available others are running out of headroom Routers may soon need 10 Gbps and higher speed back-planes to keep up with network demand Many such applications can justify the expense of moving to higher performance if it becomes available

Currently telecom system designs offer backplanes that can handle interconnec-tions running as fast as 3125 Gbps raw data throughput per lane (with around a maxi-mum data rate capability of 5-625 Gbps per lane) The AdvancedTCA standard for instance uses Ethernetrsquos XAUI inter-face AdvancedTCA achieves a 10 Gbps net data rate by running four serial lanes for each interconnection with each lanersquos

SERrializerDESerializer (SERDES) op-erating at 3125 Gbps raw data (25 Gbs net)

As demand forces systems to move beyond these rates however new technologies will be needed One proposal calls for the use of XAUI+ or double XAUI which increases lane SERDES rates to 625 Gbps per lane and hence the throughput to 20 Gbps Another proposal is to use IEEE 8023ap known as 10GBASE-KR which runs a single SERDES lane at 125 Gbps raw data rate (103 Gbps net) But these are only short-term answers To address future demands organizations such as the Institute of Electrical and Electronic Engineers Standards Association (IEEE-SA) are developing specifications for Ethernet speeds of 40 Gbps to 100 Gbps which will be applied to backplane interconnect

Such high clock rates however will pose significant design challenges for developers

One of the first challenges that will need resolution is the design and layout of the backplane and other PCBs Common design practice today readily handles board clock rates of around 10 Gbps Well established design rules are in place and board layout tools such as autorouters can automatically handle board designs for speeds in the 10 Gbps range Designers may use specialized board material create additional ground planes and perform similar tasks in order to ensure proper board operation at the higher end but even speeds to 5 GHz are within current design tool capabilities

Design gets trickierAbove 5 GHz however board design gets more involved because feature dimensions become significant when compared to the signalrsquos wavelengths Variations in board thickness can affect signal propagation Corners where traces change direction and small spurs along edges of poorly etched

Channel characteristics

challenge backplane interoperability

Serial backplanes in telecommunications systems aim for high speed with room for

growth As systems began using 10 Gbps links however issues arose that affected backplane

communications among cards from different manufacturers Stuart points out that the

industry must define key backplane channel characteristics so that designs based on open

standards maintain interoperability as backplane speeds move to 40 Gbps and beyond

By Stuart JamieSon

Fo Sin Pnt

traces can act as antennae for the higher fre-quencies in digital signals As can be seen in Figure 1 sharp corners and minor flaws that are inconsequential at lower frequen-cies have the potential to become trouble-some antennae at future high speeds This can result in the trace radiating away the signalrsquos high frequency energy increasing EMI and crosstalk as well as altering signal waveforms New routing design rules such as making corners 30deg instead of 45deg and more careful board fabrication techniques may become necessary as designs move above the 10 Gbps per lane threshold

The move to higher frequencies will affect more than board fabrication and layout however Higher frequencies will also impose new requirements on signal tim-ing signal rise-time electrical distance and waveform shape if developers are to retain the mix-and-match system design approach that makes standards-based system design effective

For interoperability to be achievable at data rates above 10 Gbps organizations such as PICMG will need to carefully define a vari-ety of signal and design parameters in their specifications Some of the key parameters that will need consideration include

n Interconnect signal attenuationn Eye diagramn Jittern Input clock recoveryn Chip inputoutput pre-emphasis (PE) n Equalization (EQ)

Even slight variations in these parameters from device to device and lane to lane can shift the timing of signals a significant fraction of a clock cycle and affect the Bit Error Rate (BER) of a lanechannel Finally signal rise times will require tight control as signal rates increase in order to ensure control of system timing (see Figure 2)

In defining signal and design parameters specifications will also need to account for the increased location dependency that comes with higher frequencies Even subtle differences in attributes such as routing length and trace impedance become increasingly significant as signal speeds rise To ensure mix-and-match interopera-bility then design specifications may need to account for the specific backplane slot that a board is to occupy as well as introduce a method to obtain and control the PE and EQ of the devices connected to the lanes

Designers must also address fabrication standards The material used to fabricate

Figure 1

Figure 2

Fo Sin Pnt

the board the thickness and composition of metal cladding and the spacing between layers can all affect the trace characteris-tics Controlling these parameters under specification ensures that timing charac-teristics are sufficiently uniform from one board to another However current speci-fications are too detailed and stringent It is extremely difficult to attain compliance yet avoid adding cost to the design

Specifications need workSome of these parameters are already incorporated into current specifications The AMC module specifications from PICMG for instance include design parameters that ensure its proper opera-tion at signal speeds as fast as 125 Gbps per lane Establishing specifications for other system components will help achieve interoperability of standards-based designs at higher frequencies

Design tools may also need to be modified and the industry will need to create new design rules for high frequency and incor-porate these into the tools Developing new routing techniques will help avoid the issues of electrical phenomena such as skin effect dielectric loss and impedance mismatches These are much more preva-lent at higher frequencies and it becomes critical for engineers to model and simu-late these phenomena more accurately

Early efforts are already underway to address the challenges that higher fre-quency signals bring to standards-based design The Interconnect Channel Characterization Subcommittee of PICMG established in September 2006 is develop-ing ground rules and definitions to be used in characterizing transmission reflection and crosstalk performance in backplane and mezzanine carrier interconnects The committee aims to define the channel parameters to be measured or analyzed as well as the methods for doing so Its charter calls for it to address

n Definition of interfaces at which measurements are made or characteristics computed

n Test equipment fixtures and PCB test coupons

n Details of measurement proceduren Data formatsn Techniques for de-embedding

components of the channeln Techniques for validating

measurement based models ie passivity and causality

n Definitions that allow reasonable compliance testing

n Boundary definitions for different paths

n Define information regarding limita-tions or proper usage ie maximum data raterise times that are supported by the models

Such efforts are only a beginning how-ever Other design details still need to be addressed such as SERDES IO Configuration New functionality may need to be defined The design of high data rate system channel interfaces according to standardsspecifications does not currently cover the individual characteristics of the chip transmitterreceiver characteristics Thus work will be needed to address how such standard designs handle such dependency

Crossing an interoperability thresholdOne way of handling location dependen-cies might be to give the system control-ler the ability to inform modules what the channel transmitter and receiver PE and EQ technology is and importantly how to control it With this information along with the signal attenuation suffered (at a given bit rate) for the channel the system should be able to configure SERDES channels in different physical locations to run reliably and at the required BER In MicroTCA systems for instance this functionality could be incorporated into the MicroTCA Carrier Hub (MCH) as part of its electronic keying function Modules would have to be able to configure and control its backplane interfaces to allow for different positions

in the backplane An MCH (see Figure 3 courtesy Emerson) then would be able to instruct a module as to which parameters to use for interoperability

The specific approaches needed to handle location dependencies and other challenges that higher signal rates raise have yet to be developed The need to address these challenges however is clear Increasing demand for services is driving applications to utilize faster signal rates This in turn is driving backplane signaling speeds ever higher As speeds rise above 10 Gbps sig-nals will cross a threshold where current specifications will prove inadequate for ensuring interoperability among standards-based designs

The industry should begin developing new or enhanced specifications and design tools to address the challenges of higher signal rates Without such improvements the guarantees of interoperability that allow system developers to readily create solu-tions by combining off-the-shelf products will be compromised As backplane speeds approach 100 Gbps nothing can be taken for granted

Stuart Jamieson Director of Industry RelationsArchitect with Emerson Network Power Embedded Computing represents Emerson on PICMG committees and the SCOPE organization and previously served as a CP-TA Board member (Treasurer) He brings over 18 years of experience in hardware protocols embedded software and specification development to these groups Within Emerson he played a key role in the develop-ment of the technology central to Emersonrsquos bundled network-ing solutions Stuartrsquos positions within Emerson have included Director of Business Development Director of Advanced Technology and Architect He is the Draft Editor for the PICMG Interconnect Channel Characterization Subcommittee is the author of the introduction section for the new PICMG Ruggedized MicroTCA specification and served as the Draft Editor for the PICMG MicroTCA Specification Stuart gradu-ated from the Heriot-Watt University in 1989 with a 1st Class Honors degree in Electrical and Electronic Engineering and again in 1992 with an IBM-sponsored Master of Philosophy

Emerson Network Power Embedded ComputingStuartJamiesonEmersoncom bull wwwemersonembeddedcomputingcom

Figure 3

Fo Sin Pnt

TECHNOLOGY g BACkpLANES

2008

B A

N D

W I

D T

H

Signal integrity challenges to bandwidth scalabilityFor the purposes of this article each interconnected differential pair will be referred to as a Channel (which should not be confused with an aggregated AdvancedTCA channel comprising four trans-mit and four receive pairs)

14-slot full-mesh AdvancedTCA backplanes contain hundreds of Channels Each Channel is defined as the copper signal path from the output of a driver device to the input of a receiver device As

By douglaS Hynd

Developing IEEE 8023ap 10GBASE-KRcompliant backplanes

Why doesAdvancedTCA

need bandwidthscalability

PICMG AdvancedTCA 30 has emerged as the

industryrsquos Hardware Platform standard of choice and

is enjoying first-phase deployment However many

believe that for AdvancedTCA to realize its market

potential AdvancedTCA platforms need to seamlessly

scale to accommodate 40 GbE fabrics thereby

avoiding forklift upgrades as system bandwidth

demands increase over time A 40 GbE switch fabric

architecture would enable realization of a common

platform for computing storage control and media

and packet processing and provide the versatility and

long term ROI required by service providers in

todayrsquos increasingly competitive environment

The challenge was to develop a family of

AdvancedTCA products which feature PICMG 30

compliant dual star and full mesh advanced

backplane switch fabrics enabled up to 10 Gbps

per differential signal pair thereby giving 40 Gbps

per AdvancedTCA channel performance

This article describes the signal integrity challenges

presented in designing an IEEE 8023ap

10GBASE-KR-compliant bandwidth-scalable

14-slot AdvancedTCA platform and how these

challenges were overcome in development of full

mesh and dual star backplane reference designs

Fo Sin Pnt

shown in Figure 1 that signal path comprises a signal launch a blade PCB transmission line a daughtercard via a right-angled HM-ZD connector a mated HM-ZD backplane header a back-plane via a length of backplane PCB transmission line and then the same combination of connectors vias and transmission line at the receive end of the Channel

Sources of crosstalkFour principal sources of crosstalk in each Channel must be man-aged as shown in Table 2 Source number one is between adjacent differential pairs as they are routed across the backplane Common mode noise rejection in system differential pair structures makes this a minor issue The second source of crosstalk lies in the HM-ZD connector itself

Crosstalk in via fields our third source primarily arises from inductive coupling between adjacent differential pairs and domi-nates the crosstalk agenda in high-speed Channels This source of crosstalk is directly proportional to the length of the via barrel and where practical care must be taken to ensure that adjacent connector rows are terminated to different target routing Layers

The final source of crosstalk is caused by aggressor signals in through-routed via fields coupling with victim Channel traces as they pass through As mentioned earlier judicious and careful design can mitigate this impact

Skew Channel skew is a function of differential transmission path geometries At a fundamental frequency of 5 GHz skew can be a significant issue in high-speed system design due to narrowing the eye opening and increasing jitter Skew can have a significant impact on crosstalk it negatively impacts the common mode rejection of noise inherent to differential signaling Conductor surface roughness in lower performing dielectric materials can also cause skew in high-speed systems

Skew can be avoided through careful management of transmission path lengths in each Channel and by using higher-glass content (lower Dk) laminates

LossPotential

Potential Mismatches

Channel

Loss Potential Channel

PCB Tolerance -025 dB 2 -01 dB

Connector Tolerance -001 dB 4 -016 dB

Thru-routed Via Fields -001 dB 12 -144 dB

Connector Launch -025 dB+ 4 - 2 dB+

Quantity TotalNEXT

TotalFEXT

PCB Transmission Lines

24 in60 cm

-50 dB -70 dB

Connector Architecture 2 -26 dB -24 dB

Via Fields 4 -22 dB -20 dB

Connector Pass Through 8 -34 dB ndash34 dB

For the target application each one of these Channels must deliver a 10 Gbps Non-Return-To-Zero (NRZ) signal with sufficient signal fidelity to enable a receiver device to detect and process a differential signal The PICMG 30 specification is targeted at 3125 Gbps signaling with a fundamental frequency of 156 GHz Even in low loss dielectric materials insertion loss at 10 Gbps (5 GHz fundamental) is twice that of a 3125 Gbps signal

Therefore achieving acceptable signal fidelity requires careful management of signal losses and noise in each Channel such that an acceptable signal-to-noise (SN) ratio is achieved at the receiver

The design process therefore begins by understanding and mitigat-ing the sources of losses and noise in each Channel

Sources of lossThere are three sources of loss

n Conductor losses which are due to skin effects and can be addressed by maximizing the cross sectional area of the signal traces

n Material dispersion losses which are a function of the dielectric constants of the chosen material These can be mitigated by choosing a higher performance laminate material such as Nelco 4000-13SI or Megtron

n Reflected power loss due to impedance mismatches in the Channel as each signal transitions across the different copper media in each channel (connectors vias and PCB traces) and passes through the pad and anti-pad structures of the via fields of other backplane blade slots

Table 1 shows the relative effects of different sources of impedance mismatches The dominant source of impedance mismatches in every Channel resides in the via structures Successful mitigation of this problem requires that every via is tuned by back-drilling the stub and adjusting the pad and anti-pad structures to match the impedance to be 50 ohms irrespective of the target routing layer This in turn requires that the capacitive and inductive effects of the connector pin and via barrel combination are taken into account during the design of each Channel

Further complicating via design is the space the anti-pad structures need to accommodate Channels being routed between other blades while minimizing electro-magnetic coupling with them This space consideration makes the shape and orientation of pads and anti-pads extremely important

Figure 1

Table 1

Table 2

Fo Sin Pnt

IEEE 8023ap provides a design targetAs Ethernet has emerged as the industryrsquos dominant signaling methodology the IEEE has developed the 10GBASE-KR norma-tive Channel model to define interconnect Channel performance for NRZ signaling at 10 Gbps This standard defines acceptable performance in terms of S-parameter charts for through-Channel insertion loss and worst-case crosstalk Figures 2a and 2b illustrate masks for Draft 24 of the standard that was initially used for this exercise

In each case the mask defining compliant performance is shown in blue Channel insertion loss is shown in red in Figure 2a Crosstalk performance is defined by the ICR curve (Figure 2b) Minimum acceptable Channel performance is defined in the ICR chart (Figure 2b) by the blue line The effect of the sum of all aggressors on the through-Channel is shown in red The green ICR curve is the ratio of the crosstalk power sum calculated by summing the

magnitudes of any impacting crosstalk Channels for each fre-quency and using a straight line fit (using least-squares method) to determine the resulting average effect f the aggressors on the through-Channel This is then overlaid on the insertion loss and used to plot the ICR curve

This standard which has evolved through a variety of iterations forms the basis for developing a 40 GbE switch fabric backplane featuring 10 Gbps NRZ differential pairs If all differential pairs can meet this standard then the backplane can be considered to be 10GBASE-KR compliant

Applying 10GBASE-KR to a 14-slotAdvancedTCA applicationThe PICMG specification dictates that receive differential pairs are placed on the c-d and g-h rows of the HM-ZD connector and that transmit differential pairs are placed on the a-b and e-f rows Therefore the middle differential pair in row c-d of Slot B will be subject to the NEXT of three aggressors in each of the a-b and e-f transmit rows of slot B plus the FEXT of the signals being received in the c-d pairs in the top and bottom of slot B

In this topology it can be seen that worst-case crosstalk would occur if all the NEXT and FEXT aggressors were routed on the bottom Layer that is on the same Layer as that of the victim c-d However given that all signal vias must be back-drilled and tuned for impedance management purposes Channel crosstalk can simultaneously be reduced by allocating different routing Layers to differential pairs terminated in the same backplane connector

The principal factor in determining the feasibility of a 10GBASE-KR compliant backplane is based on understanding whether the Channel with the worst-case signal-to-noise ratio is compliant

The skew targets determine permissible layer separation between a-b c-d e-f and g-h pairs within each Channel and enable routing Layers to be allocated for each pair It is now possible to start the process of via tuning to optimize the channel performance for minimum insertion loss Modeling begins by defining the simulation boundaries for the channel so that Channel component models (PCB traces connectors vias) can easily be aggregated to model complete Channels Boundaries must be established at locations in the Channel where linear 3D structures exist These are shown in Figure 3 (next page)

Since the connector and via combinations for the backplane and daughtercard mating halves must each be treated as a whole it

PICMG 30Spec

TurboFabricSpec

Total Inter-PairSkew

(Fabric Interface)

05 mm in FR4(34 ps)

001 mmin N4000-13si

(00625 ps)

Total Intra-Channel Skew

(Fabric Interface)

254 mm in FR4(17 ps)

plusmn01 mmin N4000-13si

(0625ps)

Total Intra-Channel Skew

(Base Interface)

135 mm in FR4(90 ps)

plusmn01 mmin N4000-13si

(0625 ps)

Figures 2a and 2b

Table 3

Determining which Channel that is and identifying the worst-case SN requires making trade-offs with regard to PCB material Channel length via design connector row selection and NEXT and FEXT aggressor routing choices These trade-off choices can only take place using advanced 3D simulation tools such as Ansoft HFSS This was the essence of the design process employed in developing Simclarrsquos TurboFabric backplanes

The simulation processThe transmission length for full mesh and dual star backplanes design implementations varies from a maximum of 1632 inches to a minimum of 116 inches With an effective transmission length of 5 inches on each daughtercard this makes the longest effective Channel 2632 inches including two connectors

For a 10GBASE-KR application over this distance a high-perfor-mance laminate is essential for both reducing insertion loss and

ensuring high glass content in the weave to mitigate skew So the design process began by choosing a low-loss dielectric material (Nelco 4000-13SI for both the backplane and the daugh-tercards) and establishing targets for Inter-Pair and Intra-Channel skew as shown in Table 3

Adhering to the PICMG 30 specifi-cation for skew in a 10GBASE-KR application is impractical Instead a target of 00625 ps was set for Inter-Pair skew with 0625 ps set for Intra-Pair skew for the backplane only This equated to a maximum 001 mm differ-

ence being allowed between traces of any differential pair and 01 mm being permitted between traces of any four differential pairs in a Channel Given the topology of the HM-ZD connector daughter-card skew must be accounted for in the daughtercard layout Fo

Sin Pnt

should be noted that the simulation boundary is located within the mated connector

Tuning the connector and via structures to 50Ω is an iterative process involving the removal of excess pads back-drilling and tuning pads anti-pads and traces A Time Domain Reflectometer (TDR) plot illustrating the results of the tuning process is shown in Figure 4

Upon completion of the modeling process a total of 17 different optimized via and routing configurations had been designed for the full mesh design and nine for the dual star design

A plot of worst-case insertion loss is shown in Figure 5 and demonstrates that in both cases performance is well above the 10GBASE-KR mask

When all the through-Channels have been modeled adjacent Channel models can be combined and ICR curves plotted to evaluate the impact of crosstalk on through-Channel performance This valuable information can be used to adjust the position of signal Layers relative to pass-through aggressor traces on adjacent Layers or to reroute traces to reduce crosstalk Similarly routing Layers can be changed to reduce crosstalk in adjacent via barrels

Figure 6 plots worst-case ICR and demonstrates that performance is above the 10GBASE-KR mask Based on this result it was possible to proceed to physical implementation

Figure 3

Figure 4

Fo Sin Pnt

Physical realizationThe layout process was performed using the Mentor Board-Station CAD system Quad-routing (routing four traces between pads) was explored as a routing method-ology in order to reduce Layer count but this was dismissed due to the detrimental impact on crosstalk performance

The attributes of the physical backplanes produced as a result of the design effort are shown in Table 4

The design files produced included the usual gerber files plus detailed back-drilling instructions

The design validation process comprised a conventional continuity test followed by performance testing featuring Agilent equipment including 70340A signal generator 8720ES Network Analyzer NN18A S-Parameter test-set and 86100A sampling oscilloscope with Agilent 86112A module Figure 7 (next page) shows the test set up

Simclar developed special line cards to enable through-Channel measurements with and without crosstalk The signal launch featured compression mount SMAs terminated in a tuned via structure The Channel simulations included simu-lation of the tuned launch structures so de-embedding of the launches was not necessary for correlation to simulation purposes The development team also established a process for characterization of all Channels

Full Mesh Dual Star

Layer Count 34 18

Aspect Ratio 121 61

Tuned Vias 3952 768

Material Nelco 4000-13SI

Table 4

Figure 5 Figure 6

Fo Sin Pnt

In Figure 8 measured through-Channel performance and ICR curves are shown for the same Channels described in the simula-tion section earlier

As can be seen from Figure 8 there is close correlation between these and the simulated plots in Figures 5 and 6 In fact close correlation between all simulated and measured results was achieved resulting in a 728 Tbps capacity full mesh and a 960 Gbps capacity dual star backplane design now generally available as part of the Simclar TurboFabric shelf

Figure 7 Figure 8

Figure 9

Figure 10

Implications of 10GBASE-KR Draft 33versus Draft 25The work described above was targeted towards meeting the Channels specifications contained in Draft 25 of the IEEE 10GBASE-KR Since this work was completed the IEEE has up-issued the Draft revision level for the Standard from 25 to 33 While this has not impacted through-Channel performance demands it has increased Channel isolation requirements by around 10 dB In Figure 9 a Draft 33 mask is added to the ICR plot shown in Figure 8

From Figure 9 it can be seen how Draft 33 pulls the mask above the Channel ICR curve for this full mesh backplane Channel Surprisingly it is the Channelrsquos frequency response at relatively low frequencies between 100-500 MHz that is causing a problem The reasons for this are currently the subject of further detailed investigation

However Figure 10 shows a Draft 33 plot for a less demanding dual star AdvancedTCA implementation featuring shorter trans-mission distances This plot demonstrates compliance to Draft 33 of the IEEE 8023ap 10GBASE-KR Standard

ConclusionBy developing a close understanding of the many factors contrib-uting to loss and noise in multi-gigabit backplane Channels it is possible to characterize their performance using advanced simula-tion techniques and correlate that performance in physical prod-ucts using advanced test methods By overlaying the test results on S-Parameter masks defined by the IEEE 8023ap 10GBASE-KR Standard it has been demonstrated that backplanes that truly enable AdvancedTCA scalability are at last a reality

Douglas Hynd joined Simclar Group in 2006 as Director of Marketing as part of Simclarrsquos acquisition of Northrop Grumman Interconnect Technologies Division wherehe was Vice President of Marketing and Sales He has more than 24 yearsrsquo experience intechnology sales marketing and generalmanagement and holds a BSc (Eng) in Electronics and Electrical Engineeringfrom the University of Glasgow He isbased at Simclarrsquos Global HQ inDunfermline Scotland

Simclar Groupdouglashyndsimclarcom bull wwwsimclarcom

Fo Sin Pnt

6U CompactPCIPrOduCT GuIdE g

This monthrsquos issue includes a 6U CompactPCI Product Guide and Irsquod like to take the opportunity to reflect a bit on the success and evolution of that technology

Back in the 1994 time frame when CompactPCI was first being devel-oped it began as 3U-only technology It used the same Eurocardmechanics that were popularized by VME and an IEC standardized high-

density high-speed connector available from a number of vendors suitablefor 33 MHz PCI signaling That connector was selected by the engineers atZiatech with help from Mike Munroe then at ERNI The majority of VMEdesigns were 6U and based on this I was among a number of folks thatargued for adding the 6U CompactPCI form factor

The 6U form factor presented some challenges and opportunities Onechallenge was that the insertion and extraction forces were quite high when the entire rear of the card was populated with connectors Fortunately the IEEE standards for Eurocards evolved and injectorejector handles that pro-vided leverage became available Eike Waltz then at Rittal was instrumental in bringing that to the table Two of the opportunities that came along withthe extra connectors were a clean way to add secondary buses like the H110 telephony bus to the backplane and the ability to route IO out the rear through rear transition modules PICMG has developed quite a number of subsidiary specifications defining the interoperable use of the extra backplane pins made possible with the 6U form factor Both of these features have played a major part in CompactPCIrsquos success The next major evolution of 6U CompactPCI came with the PICMG 216 Packet Switched Backplane standard which was originally conceived by John Peters and his team at Performance Technologies PICMG 216 interconnected a shelf full of CompactPCI single board computers via redundant Ethernet switches also in the 6U CompactPCI form factor This dramatically increased usable backplane bandwidth and provided redundancy PICMG 216 paved the way for AdvancedTCA and was the industryrsquos first open standard for the switched serial interconnect standards we see popping up in many places

By Joe Pavlat

Looking back and ahead at6U CompactPCI

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Recent 6U CompactPCI related products are listed here For more informationenter the productrsquos RSC No at wwwcompactpci-systemscomrsc

cPCI-6910Dual-core Intel Xeon Processor LVULV Universal blade bull Supports Single Dual-Core Intel Xeon LV or ULV processorsbull Front Side Bus 667 MHz bull Up to 2 GB DDR2 400 MHz soldered SDRAM with ECC bull Four PCI Express GbEbull Up to 4 USB 20 ports bull PICMG 20 21 29 216 compliant

RSC No 35013

ADLINK Technologywwwadlinktechcom

CPCIStor Module6U CompactPCI storage blade bull Onboard ATA controller supports CDDVD HDD and solid-state flashbull Supports Hot Swap Removal (ask about RAID support) bull ATA disks available in Enhanced Dutycycle versions for NEBS Level 3 - 724 requirements bull Operating Systems supported VxWorksLinux and Windows

RSC No 34800

ACTTechnicowwwacttechnicocom

Prosody X cPCI E1T1An E1T1 digital network access card bull Suits telco developers and systems integrators bull Uses Aculabrsquos worldwide protocol coverage including Aculabrsquos SS7 stack available under a cost free license bull Available with 8 or 16 E1T1 trunks and software selectable E1T1 interfaces bull Flexible mix of protocols including ISDN CAS and SS7 (ITU-T China and ANSI) bull A variety of interconnect switching and protocol conversion solutions can be readily crafted bull High availability reliability and scalability with industry standard hardw re and software interoperability bull Up to 128 SS7 signaling links bull Non-circuit related (TCAP) messagingintensive applications such as prepaid and SMS

RSC No 35408

Aculabwwwaculabcom

Adexp8021Intel Core Duo L2400 (166 GHz) w E7520 server chipset bull Dual channel PC2-3200 Registered RAM SECDED or x4 SDDC bull Two GbE two Serial ATA four USB 20 bull Onboard SXGA graphics 1280 x 24-bitbull 6U CompactPCI Bus PICMG EXP0 R10 Specification bull RoHS compliant 0 degC to +55 degC operating range

RSC No 32837

Advanet Incwwwadvanetcojpen

TC84012 channel single-stop Time-to-Digital Converter (TDC) with single-start and multi-start acquisition modes bull 50 ps timing resolution bull Wide range with upto 20 s between first and last events bull Large internal memory buffer with up to 512 hits per channel bull Low jitter (lt3 ps rms) high stability (plusmn2 ppm) internalclock source bull External 10 MHz reference input bull FPGA based Data Processing Unit (DPU) bull Fast readout with DMA mode for increased data throughputbull Overvoltage-protected inputs with 50 Ω K-Lock (LEMO) connectors bull Built-in self calibration bull Modular single-slot 6U PXICompactPCI standardbull Low power consumption (lt22 W)

RSC No 33445

Agilent-Acqiriswwwacqiriscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

MIC-30428-slot 6U CompactPCI backplane bull AC or DC CompactPCI 500 W + 250 W redundant(2+1) power supplies bull PICMG 216 (CompactPCI Packet Switching Backplane) compliancebull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarmmodule (MIC-3924L-AE)

RSC No 32851

MIC-30436-slot 6U CompactPCI backplane bull Supports two hot-swappable SCSISATA or removableIDE HDD bays bull Built-in IDE slim-type DVD-ROM bull AC or DC CompactPCI 250 W + 250 Wredundant (1+1) power supplies bull Supports hot-swappable fan modules bull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarm module (MIC-3924L-AE)

RSC No 32850

Advantech Corporationwwwadvantechcom

Dual-Core Xeon CompactPCI SBCModel PP 42123x bull Dual CPU 6U CompactPCI SBC supporting two dual-core Xeon CPUs bull Up to 8 GB DDR2 ECC SDRAM in a single system or peripheralslot bull Dual processor SBC in a single 6U CompactPCI slot bull Supports two 166 GHz Dual-Core Intel Xeon ULV processors using Intel E7520 server chipsetbull Up to 8 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull PMCXMC site support 66 MHz PCI-X and x8 PCI Express bull Front and rear IO bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade bull Four GbE ports with option for PICMG 216

RSC No 34761

6U CompactPCI Core 2 Duo SBCModel PP 41203x bull 6U CompactPCI Core 2 Duo SBC supporting two PMC sites includingone XMC site bull Up to 4 GB DDR2 ECC SDRAM bull All in a single system or peripheral slot bull TwoPMC sites supporting up to 100 MHz PCI-X bull One XMC x8 PCI Express bull Front and rear IObull Supports 216 GHz or 15 GHz Intel Core 2 Duo processors bull Intel E7520 server chipsetbull Up to 4 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade

RSC No 34763

PP 30202xTwo processor versions available bull 18 GHz Intel Pentium M processor 745 uses mFC-PGA 478 (micro Flip-Chip Pin Grid Array) package bull 14 GHz Intel Pentium M processor Low Voltage 738uses mFC-BGA 479 (micro Flip-Chip Ball Grid Array) package bull 64 KB primary (L1) on-die cache2 MB of secondary (L2) on-die cache bull 400 MHz Front Side Bus (FSB) bull No CPU fan bull 16 GHz processor version (1 MB L2 cache) available see PP 30002x datasheet bull Utilizes 64-bitIntel 855GME chipset bull Supports 400 MHz bus frequency bull Uses Intel 6300ESB IO Controller Hub

RSC No 32659

Concurrent Technologies Incwwwgocctcom

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PrOduCT GuIdE6U CompactPCI

cCIBPMC6U-ETA 6U bridged dual PMC carrier that bridges extended temperature CompactPCI boards and PMCs bull Features a rugged CompactPCI form factor providing increased flexibility to military communications systems designers bull Provides additional design choices to users through its differing bus speeds maximizing the numberof PMCs that can be used CompactPCI andPMC buses can both run at 66 or 33 MHzbull Operating temperature range of -40 degC to+85 degC bull Signal conditioning bull DMA supportbull Low-power design +5 V +33 V +12 V -12 V bull User-selectable VIO of 33 V or 5 V to the PMC

RSC No 32891

Dynamic Engineeringwwwdynengcom

cPCI4IP-MMMinimized PCI address footprint IndustryPack carrier for CompactPCI applications bull 6U 4HP4 IP positions 832 clock selection for each slot fused filtered power IO options bull ID INT IO and Mem spaces are decoded for each IP slotbull Single and double wide IPrsquos bull 16- and 32- bit IPs bull 32-bit access to 16-bit IPs bull Full or mini-mized Memory Space decoding for 18 the PCI address requirement bull With the cPCI4IP-MM option 8 CompactPCI 4IP cards take the same PCI address space as 1 full Mem Space card

RSC No 34905

ACQ132CPCI32 channel MHz class simultaneous sampling intelligent digitizer bull 32 simultaneous analoginput channels 2-32 MSpschannel 14-bit resolution bull Differential inputs bull Intelligent cardwith 1 gigabyte memory and GbE on board bull Large distributed FPGA resource on boardbull Range of DSP functions including FIR filtering and Digital Downconverter

RSC No 35482

D-TACQ Solutions Ltdwwwd-tacqcouk

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CR11Based on the Intel Core Duo Processor the platform is designed to support processor speeds from 106 GHz up to 20 GHz bull Intel Core 2 Duo runs at 15 GHz up to 20 GHz bull Conduction cooled bull Two PMC slots bull PCI Express bull 2x GbE

RSC No 33156

ICS-72532-channel 6U CompactPCI DAC board bull 6U CompactPCI data acquisition card bull 32 differential output channels bull 16 or 24-bit sample size bull 288 kHzch data rate bull Simultaneous sampling across all channels on single or multiple boards bull 32 separate delta-sigma DACs bull 64-bit 66 MHz CompactPCI PICMG 20 Rev30 hot-swappable bull FPDP II 400 MBps interface

RSC No 33576

ICS-71032-channel 6U CompactPCI ADC board bull 6U CompactPCI data acquisition card bull 32 differential input channels bull 216 KHzch 24-bit resolution bull Software selectable full scale input bull FPDP II 400 MBpsinterface bull 64-bit 66 MHz CompactPCI PICMG 20 Rev 30 hot swappable bull 32 synchronous boards for simultaneous sampling bull Sonar acoustics and test and measurement applications

RSC No 33578

Tsumani 6U CPCI Development KitFPGA processor solution targeted at high performance software defined radio applications bull Dual Stratix EP1S80 FPGAs are tightly coupled to provide apower platform for signal processing bull Two PMC module sites provide IO connectivity to either front panel or back panel connections bull A direct highbandwidth 1 GBps path from the PMC P4 connector directly to the FPGAs bull Model 919 Dual DAC Mezzanine provides broadband analog signal generationin a compact form bull The board features two independent DAC channels each with its own 12-bit LVDS input capable of running at rates up to 160 MHz

RSC No 32026

CP11Rugged 6U SBC bull Up to 4 GB of DDR2 SDRAM (200 MHz) with enhanced ECC four independent onboard PCI buses system host and peripheral modesupport for the CompactPCI backplane two PMC interfaces (64-bit133 MHz and 32-bit33 MHz) bull Instead of the PMC1 a PCI Express based XMC interface is available on request bull Two GbE one Fast Ethernet two serial interfaces (RS-232 or RS-422485) USB 20 integrated HDD or flash drive bull High performance 2D3D ATI video controller capable of driving two displays in parallel supports VGADVI interface bull Intel Core 2 Duo at 216 GHz Intel Core Duo at 20 GHz2x PMC expansion site bull One XMC optional bull Up to 4 GB DDR2 SDRAM wECC 2x GbE

RSC No 33447

GE Fanuc Intelligent Platforms Incwwwgefanucembeddedcom

Single Board ComputersGD Canada designs and manufactures conduction-cooled Single Board Computers (SBCs)using Intel processors bull 6U and 3U form factors for CompactPCI backplanes bull Fully backward compatible with earlier models bull Upgradeable via the change-out of processor memory andIO modules bull Used within GD Canada computer systems and sold as individual products

RSC No 35281

General Dynamicswwwgdcanadacom

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PrOduCT GuIdE6U CompactPCI

cPCI6U-24DSI32R32-channel 24-bit delta-sigma CompactPCI 6U analog input board with rear IO bull Low noise 24-bit resolution low phase distortion andmulti-board synchronization bull Suits state-of-the-art sonar and noise monitoring applications bull 32-channel cPCI6U-24DSI32 analog input boardprovides a high-density 24-bit analog input resources on a standard 6U CompactPCI expansion board bull Applications from precision voltagemeasurements to complex audio signal and waveform analysis

RSC No 34985

General Standards Corporationwwwgeneralstandardscom

Duet 3U 64-bit 1 GHz TMS320C6416 DSP (x2) 64 MB SDRAM per processor bull Flexible internalexternalcommunication mesh bull 64-bit66 MHz CompactPCI bull PMCXMC site with Jn4 to FPGA and4 RocketIO per VITA 42 bull External data port up to 12 Gbps bull 4M or 5M Virtex-II Pro FPGAbull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM dedicated800 MBps links between DSPs bull 3U CompactPCI with PXI support bull Suits high-end co-processing wireless broadband communications RADAR video and biometrics

RSC No 32856

QuadiaQuad-DSP bull Dual FPGA bull Dual PMC sites bull Inter-processor connectivity and access to external interfaces bull Four C6416 DSPs split in two independent clusters each hosting a PMC site bull One large FPGA for end-user code bull Central FPGA routing interprocessor communication bull End-user FPGA communication bull External port serial IO for PCIe or other p ivate link bull Global memoryand PCI interface bull 1 GHz TMS320C6416 DSP (x4) bull 64 MB SDRAM per processor bull Flexible internalexternal communication mesh bull 64-bit66 MHz CompactPCI bull Two PMC sites with Jn4 to FPGA bull External data port up to 12 Gbps bull Two 4M Gate FPGA reserved for end-user code bull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM bull Up to 512 MB Global DDR SDRAM bull Suits high-end co-processing wireless and broadband communications

RSC No 34737

Quixote 64-bit 6UAdvanced signal capture generation and co-processing bull 1 GHz TMS320C6416 DSP and2 to 6 MGATE Virtex-II FPGA bull 32 MB SDRAM 8 MB ZBT SBSRAM and AD6645 and AD9764 converters bull 6432 bit CompactPCI 66 MHz 5 V33 V and complex trigger modes with HW event logging bull PMC site with Jn4 to FPGA DIO and PICMG 217 StarFabric compliant bull Suits Software Defined Radio wireless IP and RADAR development and hardware testing bull Physical Layer field testing ultra-fast flexible data acquisition vector signal generation and electronic warfare

RSC No 32861

Innovative Integrationwwwinnovative-dspcom

IC-e6-cPCIbHigh performance 6U CompactPCI board bull Powered by one or two of Freescalersquos mostadvanced 14 GHz MPC7448 PowerPC processors bull PICMG 216 compliant bull Marvell Discovery III chipset (MV64460) bull Low power consumption bull Standard extended and rugged grades

RSC No 32982

Interface Conceptwwwinterfaceconceptcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CP213Single-width 6U CompactPCIPXI module with either 32 or 64 differential analog input channelsbull 32 64 or 128 channels of analog input bull 16 multifunction digital IO (TTL) channels that may beconfigured as digital in digital out or selectively attached to 2 frequency in 2 counter in andor 2 timerout channels bull 16-bit resolution bull Programmable gain per channel programmable scan rates of lt1 Ss through 100 KSs bull Precision onboard reference for end-to-end calibration

RSC No 34804

KineticSystems Company LLCwwwkscorpcom

CP6001Energy efficient embedded Intel dual core processors bull 12 GHz Intel Core Duo U2500 ULV processor bull Intel Core 2 Duo L7400 LV processor bull Based on the Intel Mobile 945GM chipset with a front side bus of up to 667 MHz and ICH7-R Southbridge bull Two independent digital video outputs to the rear IO (2x DVI - 1x DVI and 1x HDMI) bull AC97 audio capabilities bull 3 x GbE bull 4 x SATA with RAID 01510 functionality bull 6 x USB 20 2 x COM and VGA or DVI bull Can also accommodate a PMC slot or an onboard 25 inch SATA HDD bull Up to 8 GB of USB or 2 GB soldered flash bull Supports Linux Windows XP XP embedded and VxWorks 6

RSC No 34182

CP6923 GbE Switch6U CompactPCI GbE Switch PICMG 216 compliant bull Leading edge te hnology basedon BCM5650X chip bull 24x GbE ports bull Non-blocking Layer 2 and 3 switching and routingbull Copper optical rear IO version bull Hot swap IPMI bull Fully managed bull Comprehensive firmware package bull Applies to VoIP installations such as call servers media gatewaysand trunking gateways in wireline and wireless networks as well as VoIP systems inenterprise networks with high demands on performance

RSC No 32256

Kontronwwwkontroncom

TMS320C6701 Virtex-IITexas Instrumentsrsquo C6701 DSP bull Xilinx Virtex-II series FPGA up to XC2V8000 bull Multiple IO interfaces Onboard CODEC VIM expansion sites 60-pin GPIO header and JTAG bull Hardware drivers integration in SimulinkXilinx System Generator Blocksets for quick implementation of Simulink models bull DSP and FPGA-in-the-loop cosimulation of SimulinkXilinx System Generator models bull Leading edge communication interface allowing real-time datamonitoring from Simulink scopes and remote operations

RSC No 32028

VHS-DACHigh performance multichannel DA for phased array antenna systems radarsonar communications receiversup-sampling to IF stage and RFIF AGC apps bull Eight 125 MSPS output channels bull Optional add-on daughter boardprovides 8 additional output channels or 8 additional input channels bull 32-bit 25 MHz bull FPDP interface with 400 MBps transfer rate (25 MSPS per channel at 8 channels 125 MSPS at 16 channels) bull Low level hardware drivers API andGUI bull High level hardware drivers integration in Simulink Blocksets bull Leading edge communication interface fordata recording and playback tofrom the onboard SDRAM

RSC No 32029

Lyrtechwwwlyrtechcom

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PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

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PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

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PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

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SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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Page 3: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

2008

B A

N D

W I

D T

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Published by

copy 2008 OpenSystems Publishingreg CompactPCI PICMG AdvancedTCA ATCA MicroTCA and their logos are registered trademarks

of the PCI Industrial Computer Manufacturers GroupTM AdvancedMC and CompactTCA are trademarks of the PCI Industrial Computer Manufacturers Group copy 2008 CompactPCI and AdvancedTCA SystemsAll registered brands and trademarks in CompactPCI and AdvancedTCA Systems are property of their respective owners

OpenSystems Publishingtrade

wwwcompactpci-systemscom wwwadvancedtca-systemscom

Volu m e 12 bull N u m be r 1

FebruArY 20 08

C O L U M N S 8 Editorrsquos Foreword Why AdvancedTCA is at home in HSS By Joe Pavlat

10 Global Technology Award recognizes unique rugged camera control system By Hermann Strass

11 Software Corner Cable and CALEA A look at cable networks and lawful surveillance By Curt Schwaderer

D E PA R T M E N T S 44 New Products

E - C A S T Swwwcompactpci-systemsecast

Energy Efficient DesignsMarch 2008

Platform ManagementApril 2008

CompactPCI reg

AdvancedTCA regand Systems

The Magazine for Developers of Open Communication Industrial and Rugged Systems

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F E A T U R E S

APPlICATIoN AdvancedTCA

15 Choose the right formula for compute-intensive HSS systems AdvancedTCA platforms versus 1U PCI rack-mount servers By Sven Freudenfeld Kontron

TeCHNoloGY BACKPLANES

22 Channel characteristics challenge backplane interoperability By Stuart Jamieson Emerson Network Power Embedded Computing

25 Developing IEEE 8023ap 10GBASE-KR compliant backplanes Why does AdvancedTCA need bandwidth scalability By Douglas Hynd Simclar Group

PRODUCT GUIDE

31 6U CompactPCI

COVEROn page 22 read about the channel characteristics that are challenging backplane interoperability as backplane speeds approach 100 Gbps

g

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34 ACTTechnico ndash Networking Hardware20 Adax Inc ndash ATMIV AMC Controller45 Adax Inc ndash SS7ATM Controller39 Advantech ndash Advanced Blade Solutions7 Annapolis Micro Systems ndash Wildstar 5 for IBM Blade 43 Astek ndash Storage41 Concurrent Technologies Inc ndash Dual-Core Processors47 ELMA Electronic ndash MicroTCA Solution13 Excalibur Systems Inc ndash Mil-1553 ccVME5 GE Fanuc Intelligent Platforms ndash Software development environment3 Harting Technology Group ndash AdvancedMC Connectors17 Hendon Semiconductors ndash I2C Bus Buffer8 Interface Concept ndash Embedded Products2 Interphase ndash AdvancedTCA and MicroTCA Solutions48 Kontron ndash Open Modular Solutions9 National Instruments ndash Automated test system14 One Stop Systems Inc ndash PCIe over Cable16 Performance Technologies ndash One-Stop Shopping23 Red Rock Technologies Inc ndash Mass Storage Modules28 Rittal ndash AdvancedTCAMicroTCA40 SDR Forum ndash Call for papers21 VON ndash digiumAsterisk World19 Winchester Electronics ndash Connector Solutions29 XALYO ndash XS-AMC2

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A D V e r T I S e r I N F o r m AT I o N

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CompactPCI reg

AdvancedTCA regand Systems

ompactPCIdvanc dTCA S

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By Joe Pavlat

CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems

EDITORrsquoS FOREWORD

Why AdvancedTCA is at home in HSS

With this first issue of 2008 (Happy New Year) our colleague Sven Freudenfeld from Kontron gives us an excellent and detailed comparison of 1U rack-mount servers and AdvancedTCA in a real application a Home Subscriber Server (HSS) He describes the application in detail and then compares

space cooling maintenance management capabilities scalability and switching require-ments Sven makes a compelling case that AdvancedTCA provides many essential application elements that must be separately and expensively added to 1U servers He concludes that AdvancedTCA allows Telecom Equipment Manufacturers to concentrate on developing software instead of hardware and that reduces development costs and speeds time to market

PICMG addressing new data bandwidth standardsWhile AdvancedTCA provides a great deal of backplane bandwidth especially in full mesh configurations designers want to go even faster to accommodate new bandwidth-hungry applications like IPTV Last year the IEEE ratified important new standards for 10 gigabit per second data transmission over a single pair of conductors Of special interest to our community is the 8023ap 10GBASE-KR standard which details how to achieve that blaz-ing speed over a backplane The PICMG community is moving towards setting up a new subcommittee to incorporate this technology into the AdvancedTCA standard and it may be operating when this issue hits the street It has the potential of providing a total useful backplane bandwidth of 10 terabits per second in a single shelf Thatrsquos a truly amazing

number Douglas Hynd from the Simclar Group introduces us to the details of designing systems at that speed discuss-ing losses signal skew and crosstalk At these speeds simulation is essential and Douglas describes some of the issues involved Also in this issue Stuart Jamieson from Emerson Network Power gives us additional insight into high-speed signaling design simulation and analysis

A name change from Technology in Europe to Global Technology goes into effect this month for the column written by industry veteran Hermann Strass In this issue Hermann tells us how CompactPCI products from MEN Micro have been incorporated into the design of a new highly sophisticated digital cinema camera developed by Silicon Imaging In addi-tion to providing very high resolution and speed the camera must also operate in harsh environments MEN Micro won the 2007 Intel Communications Alliance Innovate and Ignite Technology Showcase award for its work

Curt Schwadererrsquos Software Corner this month expands on a subject he wrote about last April (wwwcompactpci- systemscomcolumnssoftware_corner 200704) As cable companies expand their offering beyond television to voice and data services they become subject to the same laws relating to cyber crime as the traditional telecommunications pro-viders do They must provide law enforce-ment authorities surveillance that is the subject of a lawful warrant and industry standards are being rolled out to do this Itrsquos a timely topic as serious problems with identity theft and cyber crime ingeneral are on the rise Curtrsquos column isan interesting read

Joe Pavlat Editorial Director

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By Hermann StraSS

GLOBALTECHNOLOGY

CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems

Award recognizes unique ruggedcamera control system

The 2007 Intel Communications Alliance Innovate and Ignite Technology Showcase (ICA) named MEN Micro Inc the ICA Showcase winner on September 19 2007 at the Embedded Systems Conference Boston MEN Micro a

subsidiary of MEN Germany has developed a unique control system for a rugged digital movie camera

Silicon Imaging an innovator in IT-centric digital cinema cameras required a rugged camera control system for its new SI-2K camera The SI-2K (shown in Figure 1 courtesy of Silicon Imaging United States) executes direct-to-disk raw recording at either 1920x1080 pixel high definition or at 2048x1152 pixel for cinema resolutions Its 48-bit digital processing algorithms perform adaptive pixel-by-pixel calibration and color image enhancement The SI-2K fore-goes legacy fixed bit-rate DCT codec recording formats such as DVCPRO HD and HDCAM-SR for advanced wavelet compres-sion technology Current generation HD cameras destructively process and compress their imagery at the acquisition stage The SI-2K streams images as raw digital negatives over a standard GbE connection The Intel Core 2 Duo processor-based F17 system from MEN non-destructively processes the raw digital negatives in real time to the visually perfect CineForm RAW codec which makes capturing up to four hours of continuous footage on a single 160 GB notebook drive possible

MEN Micro developed a customized version of its Intel Core 2 Duo processor based F17 3U CompactPCI SBC a unique side card for advanced audio and video capabilities as well as a rug-ged compact enclosure Already being used at independent film production studios for the making of full-length feature films the digital camera employs technology that can be repackaged for surveillance military sports analytics 3D video and stereo ap-plications The camera can operate in environments ranging from desert to arctic

The F17 SBC from MEN (Germany) controlling the camera in-cludes an Intel Core 2 Duo processor T7600 running at 233 GHz The SI-2K uses MENrsquos SBC for simultaneous encoding of data An Intel Graphics Media Accelerator 950 (Intel GMA 950) per-forms image graphics processing colorization and visualization at full resolution The F17 is equipped with 2 GB fast DDR2 DRAM a hard disk on a removable slot and two Intel GbE PHYs which transfer data from the camera head to the camera control unit and to other standard IP hardware The custom side card enables the connection of a High-Definition Multimedia Interface (HDMI) headphones and balanced analog input and output ports for pro-fessional audio signals

Specified for an extended temperature range in harsh shooting environments the camera uses MEN Microrsquos F17 board equipped

with a massive tailored heat sink accompanied by a fan install-ed inside the camerarsquos housing The F17 is part of MENrsquos powerful family of intercompatible CompactPCI Express SBCs including the newer and more powerful F18 which is completely compatible with the F17 and will also be incorporated into Silicon Imagingrsquos new SI-2K camera

European eventsThe 26th MOTEK International Trade Fair and Exhibition the worldrsquos largest event for assembly handling and automation sup-port systems and devices was held for the first time in the brand- new Neue Messe in Stuttgart Germany from September 26 to September 27 2007 The exhibition space increased by 45 percent over last yearsrsquo event due to the new venue More than 1100 exhibitors from 20 different countries drew around 40000 visitors and filled all five new exhibition halls Mechatronics was speci-fically featured as were robots and automation equipment In 2008 about one million square feet of exhibition space will be available when four more halls are completed at Europersquos most modern fair grounds near the Stuttgart Airport Terminal

EMO 2007 (Hannover) the worldrsquos largest exhibition of metal-working equipment closed its gates on September 22 after six days of exhibition with around 160000 attendees visiting booths of 2100 exhibitors from 42 countries 18 million square feet was devoted to exhibition space The organizers German Association of Machine Tool Manufacturers (VDW) reported new busi-ness contracts at the rate of 4 billion EURO (almost $6 billion) Exhibitors such as TRUMPF Laser Germany (see my April 2007 column (wwwcompactpci-systemscomcolumnsTechnology_in_Europe200704) reported full success at EMO 2007

For more information contact Hermann athstrassopensystems-publishingcom

Figure 1

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By Curt SChwaderer

CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems

SOFTWARE CORNER

In the April 2007 Software Corner column (wwwcompact-pci-systemscomcolumnssoftware_corner200704) we explored surveillance systems and the Communications Assistance for Law Enforcement Act (CALEA) a lawful

surveillance capability mandate Internet access and VoIP pro- viders had to be compliant with CALEA by May 2007 or face severe financial penalties

In this monthrsquos column we will look at what cable companies are doing to provide lawful surveillance capabilities within their networks

The term cable company is now officially a misnomer Cable companies and their networks are capable Internet access and voice service networks that offer the general public a one-stop shop for all their communications and entertainment needs In fact cable companies now typically call themselves Multi-Service Operators (MSOs) Voice and data services form a significant and grow-ing source of revenues for the MSO To that end cable networks become subject to the same rules and regulations that telecommu-nications networks do

One of these regulations is CALEA which provides the ability for network providers to tap specific subscribers when served a warrant To their credit cable companies and their research and development consortium organization CableLabs (cablelabscom) have been very proactive planning for lawful surveillance capa-bilities and CALEA compliance within their networks CableLabs and its partners have been working on a set of PacketCable stan-dards that incorporate specifications for voice and broadband data intercept We will focus on the new Cable Broadband Intercept Specification (CBIS) what it encompasses and paths for imple-mentation within cable networks

Cable Broadband Intercept Specification The set of specifications governing cable network services and capabilities is called the Data-Over-Cable Service Interface Specifications (DOCSIS) The specification that covers lawful

surveillance for data services is CBIS The CBIS reference model is shown in Figure 1

The surveillance architecture consists of three components the Mediation Function (MF) Broadband Intercept Function (BIF) and Collection Function (CF) When a warrant for a subscriber is served the network administrator configures the MF to capture traffic coming to andor from the subscriber This traffic includes any dynamic IP address assignment transactions (called out-of-band traffic) as well as the traffic resulting from e-mail voice or data services being used by the subscriber in question Creating hashes of these files validates the captured traffic as not having been tampered with It is also important for the network provider to supply traffic only for the subscriber the warrant is served on Older methods of surveillance involve dumping all traffic from a particular service area from all users in that area then sifting through that traffic manually This method violates the privacy rights of all the other subscribers in the service area of the individual(s) the warrant is served on Surveillance equipment that can capture only the traffic to or from the subscriber in the warrant is critical to the lawful surveillance aspects of the deployment

So far this is similar to the Alliance for Telecommunications Industry Solutions (ATIS) standards governing voice and data surveillance for digital wire line systems Unlike the original ATIS specifications the CBIS specification includes the BIF The BIF is a buffering component where the Mediation Function pushes the surveillance information (in the form of surveillance files) to the BIF for retrieval by the Collection Function at a later date

The CF component gathers the surveillance information from the BIF under law enforcement control then analyzes and presents the surveillance information in a useful way The CF also validates the information by comparing hashes of the files against hashes generated by the surveillance equipment at the time of capture This ensures that from the time the traffic is captured it is not tampered with

Cable and CALEA A look at cable networks and lawful surveillance

Figure 1

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Buffering is importantThe buffering capability the BIF provides in the CBIS specifi- cation is an important distinction between it and the ATIS specification (for more information on the ATIS specs see the April 2007 Software Corner (wwwcompactpci-systemscom columnssoftware_corner200704)

Buffering is so important that ATIS has approved an additional standard for a Buffering Function (BF) within the ATIS lawful surveillance environment

The importance of buffering is best described in a presentation that Dr Glen Myers CEO of IP Fabrics gave at the December 2007 ISS World conference The real-time delivery that the initial ATIS specification defines can be problematic as Figure 2 shows Packet loss from congestion bit errors or QoS contracts can result in the entire surveillance stream being rendered inadmissible

Dr Myers further explained that ATIS allows their buffering model to be separate from or combined with the MF while the cable network CBIS model assumes the buffering function is always separate from the MF component (Figure 3)

The buffering function whether it be the Buffering Function in the ATIS model or the Broadband Intercept Function in the CBIS model minimizes the impact of packet loss and real-time data delivery The Mediation Function can repeatedly attempt to send surveillance information to the BIF through a secure reliable file transfer function such as secure FTP If there are problems connecting with the BIF alerts can be generated so the network administrator can find and fix the problem while the surveillance information is still resident on the MF system

Dr Myers mentioned other important benefits to providing a buffering function The network administrator does not need to

negotiate and install a dedicated link for each intercept between the MF and the Law Enforcement Agency or agencies (LEA) authorized for the information Dedicated pipes matching the subjectrsquos peak service bandwith are not needed Support for mul-tiple LEAs is easily implemented at the BIF instead of the Mediation Function Law enforcement collection equipment does not need to be co-located with the Mediation Function It also simplifies connectivity by eliminating Virtual Private Networks (VPNs) or other routing ele-ments between the MF and the LEA(s)

CALEA and CMTSIn a cable network the Cable Modem Termination System (CMTS) is typically the central point within which service provider traffic from the access network meets the cable core network (and ulti-mately the Internet) So the CMTS is an important interface point for lawful surveillance

CMTS equipment may provide varying levels of support for lawful surveillance The simplest is to provide access to all the raw traffic flowing through the CMTS using an Ethernet tap or span port In this scenario the Mediation Function must find the traffic belonging to the subscriber under surveillance generate the appro-priate CBIS files and send the files to the BIF

Cisco a leading supplier of CMTS equip-ment to the cable industry provides a capability called Service Independent Intercept (SII) within their CMTS prod-ucts Cisco SII is also used in their routers and intelligent switches for QoS control in addition to lawful surveillance While SII provides support for identifying traffic by MAC and IP address information it does

Figure 2

Figure 3

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not provide the high-level configuration and lawful surveillance messages required of the Mediation Function SII uses low-level SNMP MIBs that control MAC and IP address configuration commands which in turn trigger the Cisco SII device to send packets matching the configuration to a span port where the Mediation Function can use these matched packets to generate the lawful surveillance messages So SII provides a first-level filter for the Mediation Function which supplies a high-level configuration interface at the warrant description level as well as creation of the CBIS (or ATIS) messages to be sent to the BIF

CBIS-compliant productsThe CBIS specification is quite new so released products are mostly on the hori-zon However the IP Fabrics DeepSweep Lawful Surveillance product line does provide MF andor BIF functionality for the implementation of CBIS-compliant networks Dr Myers noted that the DeepSweep product line is based on a flexible architecture and a highly parallel processing environment comprised of many software surveillance modules that can be loaded and chained within the DeepSweep to provide a number of Layer two to seven surveillance and packet analysis activities The device is programmed through a GUI and operates as a full Mediation Function with the ability to identify subscriber-related IP address assignment and resulting traffic from a span port The DeepSweep also has software support to communicate with SII enabled routers and CMTS sys-tems to provide a fully compliant ATIS andor CBIS surveillance environment compatible with Cisco lawful intercept and QoS services

CBIS BIF and ATIS buffering appliances are also available to provide buffering compliant with CBIS and ATIS standards

ConclusionCyber crimes such as identity theft child pornography chat-room initiated abduc-tion national security and piracy are very real and growing issues in todayrsquos society Billions of corporate and personal dollars have been tied to cyber crooks that abuse the Internet to participate in these activities It is essential that these illegal activities can be identified and stopped It is a good idea to be aware that the cable industry and its proactive support of lawful surveillance standards as well as rolling out equipment that implements these standards will in turn enable law enforcement to catch these cyber crooks and make the Internet a safer place for us and our children to live learn and work

For more information on this or any Software Corner contact Curt atcschwadereropensystems-publishingcom

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APPLICATION g

Based on current overall network growth Telecom Equipment

Manufacturers (TEMs) and Network Equipment Providers (NEPs)

are being challenged to launch new communications platforms

that provide optimal scalability flexibility manageability and

high computing performance With the expected increase in new

subscribers who need to be supported across the network TEMs and

NEPs are focusing on COTS platforms that meet the requirements of

a carrier-grade environment

With these new challenges it is important to take a look at the different

applications in the network to thoroughly evaluate the best hardware

platform approach Comparing the scalability IO functionality

interconnectivity and overall performance gives TEMs and NEPs a

solid basis from which to choose the best cost-effective solution for

their applications This article compares the traditional 1U PCI

platform with a more modular AdvancedTCA-based approach to

a Home Subscriber Server (HSS)-based platform

Emerging next-generation network architecture IMS Carriers and service providers are focused on improving their Average Revenue Per User (ARPU) by deploying new services quickly and at a price that is acceptable to subscribers IP Multimedia Subsystems (IMS) enable service providers to offer differentiated services to their subscriber base integrating voice video text and content as part of their service mix regard-less of the access technology

The IMS framework provides the telecom industry with a modular standards-based IP service delivery infrastructure More than simply replacing existing circuit services with similar services delivered over IP IMS allows service providers to capitalize on faster and more cost-effective deployment of new and differentiated multimedia communication services

While these new technologies promise new sources of revenue and enhanced customer loyalty they also pose implemen- tation challenges One of the crucial net-work elements within an IMS framework is the manageability of the subscriber base Today an increasing number of users subscribe to multiple services such

By Sven FreudenFeld

Choose the right formula forcompute-intensive HSS systems

AdvancedTCA platforms

versus1U PCI rack-mount servers

AdvancedTCA

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as multimedia mobile phones VoIP or IPTV at home Service providers must manage ldquoduplicatedrdquo subscriber databases for each particular service Consequently managing a converging subscriber base for such network functions as billing across multiple different technologies presents a tremendous challenge Any downtime of this network element can be costly to the carrier or service provider not to mention the heavy risk of losing subscribers over the long term

The HSS and Home Location Register (HLR) are key elements in the IMS network required to manage the growing number of subscribers These platforms that manage millions of customersrsquo data need to be highly reliable with carrier-grade High Availability (HA) functionality Core requirements for the HSS computing platform are

n High compute density for application processingn Scalable performance and high densityn Fast read access to the subscriber datan Large storage and memory bandwidthn Ability to consolidate multiple IMS elements and subscriber data within a single

platform with a modular approach as a converged services platform

HSS plays network backbone roleHSS provides the important network backbone of the IMS architecture because it eases innovation and addresses a range of service-logic interaction issues that have plagued previous service architectures HSS offers open access to service-related data for each subscriber supporting the sharing of data among multiple services

HSS is essentially the master user database that supports IMS network entities that handle calls and sessions It contains user profiles performs authentication and authorization of the user and can provide information about the physical location of the user It plays a key role in provisioning service creation enabling subscriber data and managing control roaming and interconnection The Application Server (AS) which hosts and executes serv- ices in the IMS environment communicates with the HSS Call State Control Function

(CSCF) servers also communicate with the HSS which must be able to

n Support IMS-level authentication and authorization

n Maintain IMS subscriber profile(s) independent of access types

n Maintain service-specific datan Keep track of currently assigned

CSCFn Support CSCF and AS access

HLRHSS hardware platform design choicesHSS design must enable the HSS to be deployed cost-effectively and expand readily to meet future subscriber levels For example the trend to include more information as part of the data record for each subscriber will drive up memory requirements

From a technical perspective the key metrics to understand when developing the IMS HSS functions are the number of completed transactions required per sec-ond and the size of the subscriber base

HSS architecture typically comprises multiple processor units with extensive memory requirements With the introduction

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of multicore processors from Intel developers can scale performance while optimizing power consumption in the overall system design

To meet these requirements the hardware platform needs to provide scalability flexibil-ity and long-term cost efficiency In comparing the traditional 1U platform with a more modular approach to the HSS using AdvancedTCA consider the following

n High compute performance n High memory and storage capabilityn IO functionality to connect to multiple networks (such as SS7 and Ethernet)n Carrier-grade profile and redundancy

AdvancedTCA High density with scalability on a smaller footprintTable 1 illustrates a comparison of a sample AdvancedTCA-based platform and a 1U PCI rack-mounted platform for HSS applications This configuration assumes an increasing subscriber growth from 1 million (M) subscribers to 18M subscribers per platform

FootprintAdvancedTCA-based platforms provide a high density compute platform with scalability on a smaller footprint TEMs can easily add boards to a chassis to accommodate more traffic and to support new services This flexibility enables an increase in subscribers and the database without having a major impact on rack space in the central office environ-ment To meet the same capacity for 18M subscribers the 1U PCI approach will occupy two bays or cabinets with a total footprint of 28 square feet compared to the same capacity occupying one bay or cabinet with a footprint of 14 square feet (see Figure 1)

CoolingWhile the power consumption per square foot is higher than the 1U PCI platform AdvancedTCA offers better airflow and cooling distribution using a push-pull cooling system Each 1U PCI platform includes up to nine cooling fans and is dedicated to that CPU in the 1U server only which translates into higher overhead Therefore the airflow is

not optimized in the overall system design In the case of a fan failure AdvancedTCA platforms enable easier access to replace the fans which are field replaceable units The 1U platform also does not include any integrated centralized switching or management capabilities therefore the total does not include any switching or system management functionality

ScalabilityAdvancedTCA architecture lends itself well to scalability As AdvancedTCA sup-ports both a Base and Fabric interface into the backplane and the separation of data and control planes TEMs can also scale up their designs from 1 GbE to 10 GbE to accommodate new users and usage requirements AdvancedTCA based systems are designed for easy upgrade-ability to new processing blades switch fabrics and IO modules using Advanced Mezzanine Cards (such as SS7)

Since AdvancedTCA and AdvancedMCs offer hot swap capabilities and HA func-tionality growing a subscriber base by using additional CPU blades within the system with low maintenance or upgrade downtime is crucial for the HSS plat-form It also allows for the up and down

AdvancedTCA-based HSS Platform 1U PCI Rack-Mount HSS Platform

Number ofsubscribers

~1M subscribers = 4 CPU blades edundant ~1M subscribers = 4 x 1U

~4M subscribers = 7 CPU blades redundant ~4M subscribers = 7 x 1U

~6M subscribers = 12 CPU blades redundant ~6M subscribers = 12 x 1U

~18M subscribers = 36 CPU blades redundant= 3 AdvancedTCA shelves per rack

~18M subscribers= 36 x 1U+ external switch components for redundancy

Technicalspecs

1 CPU blade = 2 x Intel Xeon dual core = quad core 1 1U rack-mount Intel= Intel Xeon quad core or dual core CPU

16 G DDR 2 memory Max of 8 G DRY memory

+ 2 x SATA or SASS hot swap (RAID 0 and 1)+ 1x PCI Express for SS7 Dual GbE per 1U rack-mount server

4 x GbE per CPU with built in GbE backplane switching separating Control Pathand Data Path with multishelf expandability

External central switching required withmultiple external GbE connectivity

Systems and blade manageability built into the platform withIMP implementation SNMP and CLIP

Carrier-grade redundancy on switch and node

IO for SS7 or other interface modules

CPU blade hot swap capability

Thermaland power

requirements

~6M subscribers redundant= 14 slots with centralized chassis cooling

~6M subscribers redundant= 18 x 1U PCI with independent cooling and separate switch units and system management

Total power consumption= ok (3100 W for blades and RTM + 500 W Shim fan tray and SAP)

Total power consumption= ok

Table 1

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scaling of the platform depending on the subscriber increase or decrease When consolidating multiple services minimiz-ing multiple duplicate databases requires this flexibility

InterconnectivityThe AdvancedTCA platform offers a number of interconnectivity features including

n Separation between the data plane and the control plane

n Direct uplink in a multichassis envi-ronment with up to l0 GbE

n Node to node base and fabric connec-tivity with HA carrier-grade Ethernet functionality

n Easy upgrade path to l0 GbE for increased bandwidth

By contrast the 1U PCI platform requires

n Additional external interconnectiv-ity between 1U rack-mount servers which increases the number of points of failures and the operating and maintenance costs

n Additional switching equipment for carrier-grade Ethernet connectivity

n Additional manage-ment (Simple Network Management Protocol [SNMP]) for HA redundancy

PowerThe 1U-based platform also utilizes integrated AC power supply units usually the standard for the data center and enter-prise environments AC will increase the pro-viderrsquos OPEX in the long term since the power consumption per rack is significantly higher and

Figure 1

requires additional support equipment such as an Uninterruptible Power Supply (UPS) and an AC to DC converter per rack space and ultimately per CPU These factors along with the requirements for carrier-grade functionality HA support and a more favorable long-term OPEX further reduce the need to consider the 1U solution for HSS deployments in Central Office networks

ManageabilityAdvancedTCA chassis-level management is based on the industry-standard Intelligent Platform Management Interface (IPMI) IPMI makes possible interoperability among chassis and blowers compute nodes switches and management solutions from multiple vendors enabling these elements to work together seamlessly The resulting successful inter-blade communication for applications including failover and clustering provides full manageability on a per shelf and per bay basis

Fo Sin Pnt

One of the primary goals of the AdvancedTCA specification is to ensure a very low Mean Time to Repair (MTTR) and high Mean Time Between Failures (MTBF) There are no active components in the backplane ndash which can translate to expensive repairs in the field In addi-tion AdvancedTCA specifies that all com-ponents can be hot swappable in the field and the architecture provides redundancy at all levels This hot swap capability translates to less downtime for field replacement on a per CPU blade basis as compared to 1U PCI

SummaryAdvancedTCA provides an ideal platform and meets the technical requirements for deploying flexible and scalable IMS HSS applications While other platform archi-tectures such as 1U rack-mount servers may with considerable difficulty be able to deliver HSS capabilities AdvancedTCA offers a much more advantageous solution by providing a smaller footprint improved cooling and thermal characteristics bet-ter scalability enhanced interconnectivity and easier manageability This all contrib-utes to making AdvancedTCA a lower cost approach in terms of CAPEX and OPEX for long-term subscriber growth

1U PCI rack-mount servers are not considered to be the optimal hardware platform for HSS applications in a Central Office With its limitation for carrier-grade flexibility and HA functionality the 1U PCI platform is best suited for a full range of other enterprise and Internet infrastructure applications within a data center environment that does not require any significant flexibility and HA functionality around it It might also be a good entrance point for other enterprise applications with lower price points

The use of AdvancedTCA-based platforms enables TEMs to shift away from hardware development and refocus their efforts on delivering value-added software and services As a result they can realize lower development costs and faster time-to-market enabling increased flexibility with each product design through the use and reuse of standardized off-the-shelf components Equally significant are the advantages that can be realized by the service provider With a common platform and a flexible architecture that maximizes limited floor space service providers can rapidly and flexibly implement a broad range of feature-rich solutions for faster profitability

Sven Freudenfeld is responsible for North American Business Development for the Kontron AG line of AdvancedTCA AMC MicroTCA and Pre-Integrated Solutions Sven possesses more than 15 years of experience with voice data and wireless com-munications having worked extensively with Nortel Networks in Systems Engineering Sanmina-SCI in Test Engineeringand Deutsche Telekom in Network Engineering Sven holdsan electrical engineering degree from Germany and is also Chair of the CP-TA marketing workgroup focusing on the interoperability of COTS standard building blocks

Kontron bull svenfreudenfeldcakontroncom bull wwwkontroncom

Fo Sin Pnt

Fo Sin Pnt

TECHNOLOGY g BACkpLANES

Increasing demand for service and multimedia features is stimulating a growing need for speed in telecom-munications equipment While some

applications such as PBX systems can be addressed with the gigabit backplane technologies currently available others are running out of headroom Routers may soon need 10 Gbps and higher speed back-planes to keep up with network demand Many such applications can justify the expense of moving to higher performance if it becomes available

Currently telecom system designs offer backplanes that can handle interconnec-tions running as fast as 3125 Gbps raw data throughput per lane (with around a maxi-mum data rate capability of 5-625 Gbps per lane) The AdvancedTCA standard for instance uses Ethernetrsquos XAUI inter-face AdvancedTCA achieves a 10 Gbps net data rate by running four serial lanes for each interconnection with each lanersquos

SERrializerDESerializer (SERDES) op-erating at 3125 Gbps raw data (25 Gbs net)

As demand forces systems to move beyond these rates however new technologies will be needed One proposal calls for the use of XAUI+ or double XAUI which increases lane SERDES rates to 625 Gbps per lane and hence the throughput to 20 Gbps Another proposal is to use IEEE 8023ap known as 10GBASE-KR which runs a single SERDES lane at 125 Gbps raw data rate (103 Gbps net) But these are only short-term answers To address future demands organizations such as the Institute of Electrical and Electronic Engineers Standards Association (IEEE-SA) are developing specifications for Ethernet speeds of 40 Gbps to 100 Gbps which will be applied to backplane interconnect

Such high clock rates however will pose significant design challenges for developers

One of the first challenges that will need resolution is the design and layout of the backplane and other PCBs Common design practice today readily handles board clock rates of around 10 Gbps Well established design rules are in place and board layout tools such as autorouters can automatically handle board designs for speeds in the 10 Gbps range Designers may use specialized board material create additional ground planes and perform similar tasks in order to ensure proper board operation at the higher end but even speeds to 5 GHz are within current design tool capabilities

Design gets trickierAbove 5 GHz however board design gets more involved because feature dimensions become significant when compared to the signalrsquos wavelengths Variations in board thickness can affect signal propagation Corners where traces change direction and small spurs along edges of poorly etched

Channel characteristics

challenge backplane interoperability

Serial backplanes in telecommunications systems aim for high speed with room for

growth As systems began using 10 Gbps links however issues arose that affected backplane

communications among cards from different manufacturers Stuart points out that the

industry must define key backplane channel characteristics so that designs based on open

standards maintain interoperability as backplane speeds move to 40 Gbps and beyond

By Stuart JamieSon

Fo Sin Pnt

traces can act as antennae for the higher fre-quencies in digital signals As can be seen in Figure 1 sharp corners and minor flaws that are inconsequential at lower frequen-cies have the potential to become trouble-some antennae at future high speeds This can result in the trace radiating away the signalrsquos high frequency energy increasing EMI and crosstalk as well as altering signal waveforms New routing design rules such as making corners 30deg instead of 45deg and more careful board fabrication techniques may become necessary as designs move above the 10 Gbps per lane threshold

The move to higher frequencies will affect more than board fabrication and layout however Higher frequencies will also impose new requirements on signal tim-ing signal rise-time electrical distance and waveform shape if developers are to retain the mix-and-match system design approach that makes standards-based system design effective

For interoperability to be achievable at data rates above 10 Gbps organizations such as PICMG will need to carefully define a vari-ety of signal and design parameters in their specifications Some of the key parameters that will need consideration include

n Interconnect signal attenuationn Eye diagramn Jittern Input clock recoveryn Chip inputoutput pre-emphasis (PE) n Equalization (EQ)

Even slight variations in these parameters from device to device and lane to lane can shift the timing of signals a significant fraction of a clock cycle and affect the Bit Error Rate (BER) of a lanechannel Finally signal rise times will require tight control as signal rates increase in order to ensure control of system timing (see Figure 2)

In defining signal and design parameters specifications will also need to account for the increased location dependency that comes with higher frequencies Even subtle differences in attributes such as routing length and trace impedance become increasingly significant as signal speeds rise To ensure mix-and-match interopera-bility then design specifications may need to account for the specific backplane slot that a board is to occupy as well as introduce a method to obtain and control the PE and EQ of the devices connected to the lanes

Designers must also address fabrication standards The material used to fabricate

Figure 1

Figure 2

Fo Sin Pnt

the board the thickness and composition of metal cladding and the spacing between layers can all affect the trace characteris-tics Controlling these parameters under specification ensures that timing charac-teristics are sufficiently uniform from one board to another However current speci-fications are too detailed and stringent It is extremely difficult to attain compliance yet avoid adding cost to the design

Specifications need workSome of these parameters are already incorporated into current specifications The AMC module specifications from PICMG for instance include design parameters that ensure its proper opera-tion at signal speeds as fast as 125 Gbps per lane Establishing specifications for other system components will help achieve interoperability of standards-based designs at higher frequencies

Design tools may also need to be modified and the industry will need to create new design rules for high frequency and incor-porate these into the tools Developing new routing techniques will help avoid the issues of electrical phenomena such as skin effect dielectric loss and impedance mismatches These are much more preva-lent at higher frequencies and it becomes critical for engineers to model and simu-late these phenomena more accurately

Early efforts are already underway to address the challenges that higher fre-quency signals bring to standards-based design The Interconnect Channel Characterization Subcommittee of PICMG established in September 2006 is develop-ing ground rules and definitions to be used in characterizing transmission reflection and crosstalk performance in backplane and mezzanine carrier interconnects The committee aims to define the channel parameters to be measured or analyzed as well as the methods for doing so Its charter calls for it to address

n Definition of interfaces at which measurements are made or characteristics computed

n Test equipment fixtures and PCB test coupons

n Details of measurement proceduren Data formatsn Techniques for de-embedding

components of the channeln Techniques for validating

measurement based models ie passivity and causality

n Definitions that allow reasonable compliance testing

n Boundary definitions for different paths

n Define information regarding limita-tions or proper usage ie maximum data raterise times that are supported by the models

Such efforts are only a beginning how-ever Other design details still need to be addressed such as SERDES IO Configuration New functionality may need to be defined The design of high data rate system channel interfaces according to standardsspecifications does not currently cover the individual characteristics of the chip transmitterreceiver characteristics Thus work will be needed to address how such standard designs handle such dependency

Crossing an interoperability thresholdOne way of handling location dependen-cies might be to give the system control-ler the ability to inform modules what the channel transmitter and receiver PE and EQ technology is and importantly how to control it With this information along with the signal attenuation suffered (at a given bit rate) for the channel the system should be able to configure SERDES channels in different physical locations to run reliably and at the required BER In MicroTCA systems for instance this functionality could be incorporated into the MicroTCA Carrier Hub (MCH) as part of its electronic keying function Modules would have to be able to configure and control its backplane interfaces to allow for different positions

in the backplane An MCH (see Figure 3 courtesy Emerson) then would be able to instruct a module as to which parameters to use for interoperability

The specific approaches needed to handle location dependencies and other challenges that higher signal rates raise have yet to be developed The need to address these challenges however is clear Increasing demand for services is driving applications to utilize faster signal rates This in turn is driving backplane signaling speeds ever higher As speeds rise above 10 Gbps sig-nals will cross a threshold where current specifications will prove inadequate for ensuring interoperability among standards-based designs

The industry should begin developing new or enhanced specifications and design tools to address the challenges of higher signal rates Without such improvements the guarantees of interoperability that allow system developers to readily create solu-tions by combining off-the-shelf products will be compromised As backplane speeds approach 100 Gbps nothing can be taken for granted

Stuart Jamieson Director of Industry RelationsArchitect with Emerson Network Power Embedded Computing represents Emerson on PICMG committees and the SCOPE organization and previously served as a CP-TA Board member (Treasurer) He brings over 18 years of experience in hardware protocols embedded software and specification development to these groups Within Emerson he played a key role in the develop-ment of the technology central to Emersonrsquos bundled network-ing solutions Stuartrsquos positions within Emerson have included Director of Business Development Director of Advanced Technology and Architect He is the Draft Editor for the PICMG Interconnect Channel Characterization Subcommittee is the author of the introduction section for the new PICMG Ruggedized MicroTCA specification and served as the Draft Editor for the PICMG MicroTCA Specification Stuart gradu-ated from the Heriot-Watt University in 1989 with a 1st Class Honors degree in Electrical and Electronic Engineering and again in 1992 with an IBM-sponsored Master of Philosophy

Emerson Network Power Embedded ComputingStuartJamiesonEmersoncom bull wwwemersonembeddedcomputingcom

Figure 3

Fo Sin Pnt

TECHNOLOGY g BACkpLANES

2008

B A

N D

W I

D T

H

Signal integrity challenges to bandwidth scalabilityFor the purposes of this article each interconnected differential pair will be referred to as a Channel (which should not be confused with an aggregated AdvancedTCA channel comprising four trans-mit and four receive pairs)

14-slot full-mesh AdvancedTCA backplanes contain hundreds of Channels Each Channel is defined as the copper signal path from the output of a driver device to the input of a receiver device As

By douglaS Hynd

Developing IEEE 8023ap 10GBASE-KRcompliant backplanes

Why doesAdvancedTCA

need bandwidthscalability

PICMG AdvancedTCA 30 has emerged as the

industryrsquos Hardware Platform standard of choice and

is enjoying first-phase deployment However many

believe that for AdvancedTCA to realize its market

potential AdvancedTCA platforms need to seamlessly

scale to accommodate 40 GbE fabrics thereby

avoiding forklift upgrades as system bandwidth

demands increase over time A 40 GbE switch fabric

architecture would enable realization of a common

platform for computing storage control and media

and packet processing and provide the versatility and

long term ROI required by service providers in

todayrsquos increasingly competitive environment

The challenge was to develop a family of

AdvancedTCA products which feature PICMG 30

compliant dual star and full mesh advanced

backplane switch fabrics enabled up to 10 Gbps

per differential signal pair thereby giving 40 Gbps

per AdvancedTCA channel performance

This article describes the signal integrity challenges

presented in designing an IEEE 8023ap

10GBASE-KR-compliant bandwidth-scalable

14-slot AdvancedTCA platform and how these

challenges were overcome in development of full

mesh and dual star backplane reference designs

Fo Sin Pnt

shown in Figure 1 that signal path comprises a signal launch a blade PCB transmission line a daughtercard via a right-angled HM-ZD connector a mated HM-ZD backplane header a back-plane via a length of backplane PCB transmission line and then the same combination of connectors vias and transmission line at the receive end of the Channel

Sources of crosstalkFour principal sources of crosstalk in each Channel must be man-aged as shown in Table 2 Source number one is between adjacent differential pairs as they are routed across the backplane Common mode noise rejection in system differential pair structures makes this a minor issue The second source of crosstalk lies in the HM-ZD connector itself

Crosstalk in via fields our third source primarily arises from inductive coupling between adjacent differential pairs and domi-nates the crosstalk agenda in high-speed Channels This source of crosstalk is directly proportional to the length of the via barrel and where practical care must be taken to ensure that adjacent connector rows are terminated to different target routing Layers

The final source of crosstalk is caused by aggressor signals in through-routed via fields coupling with victim Channel traces as they pass through As mentioned earlier judicious and careful design can mitigate this impact

Skew Channel skew is a function of differential transmission path geometries At a fundamental frequency of 5 GHz skew can be a significant issue in high-speed system design due to narrowing the eye opening and increasing jitter Skew can have a significant impact on crosstalk it negatively impacts the common mode rejection of noise inherent to differential signaling Conductor surface roughness in lower performing dielectric materials can also cause skew in high-speed systems

Skew can be avoided through careful management of transmission path lengths in each Channel and by using higher-glass content (lower Dk) laminates

LossPotential

Potential Mismatches

Channel

Loss Potential Channel

PCB Tolerance -025 dB 2 -01 dB

Connector Tolerance -001 dB 4 -016 dB

Thru-routed Via Fields -001 dB 12 -144 dB

Connector Launch -025 dB+ 4 - 2 dB+

Quantity TotalNEXT

TotalFEXT

PCB Transmission Lines

24 in60 cm

-50 dB -70 dB

Connector Architecture 2 -26 dB -24 dB

Via Fields 4 -22 dB -20 dB

Connector Pass Through 8 -34 dB ndash34 dB

For the target application each one of these Channels must deliver a 10 Gbps Non-Return-To-Zero (NRZ) signal with sufficient signal fidelity to enable a receiver device to detect and process a differential signal The PICMG 30 specification is targeted at 3125 Gbps signaling with a fundamental frequency of 156 GHz Even in low loss dielectric materials insertion loss at 10 Gbps (5 GHz fundamental) is twice that of a 3125 Gbps signal

Therefore achieving acceptable signal fidelity requires careful management of signal losses and noise in each Channel such that an acceptable signal-to-noise (SN) ratio is achieved at the receiver

The design process therefore begins by understanding and mitigat-ing the sources of losses and noise in each Channel

Sources of lossThere are three sources of loss

n Conductor losses which are due to skin effects and can be addressed by maximizing the cross sectional area of the signal traces

n Material dispersion losses which are a function of the dielectric constants of the chosen material These can be mitigated by choosing a higher performance laminate material such as Nelco 4000-13SI or Megtron

n Reflected power loss due to impedance mismatches in the Channel as each signal transitions across the different copper media in each channel (connectors vias and PCB traces) and passes through the pad and anti-pad structures of the via fields of other backplane blade slots

Table 1 shows the relative effects of different sources of impedance mismatches The dominant source of impedance mismatches in every Channel resides in the via structures Successful mitigation of this problem requires that every via is tuned by back-drilling the stub and adjusting the pad and anti-pad structures to match the impedance to be 50 ohms irrespective of the target routing layer This in turn requires that the capacitive and inductive effects of the connector pin and via barrel combination are taken into account during the design of each Channel

Further complicating via design is the space the anti-pad structures need to accommodate Channels being routed between other blades while minimizing electro-magnetic coupling with them This space consideration makes the shape and orientation of pads and anti-pads extremely important

Figure 1

Table 1

Table 2

Fo Sin Pnt

IEEE 8023ap provides a design targetAs Ethernet has emerged as the industryrsquos dominant signaling methodology the IEEE has developed the 10GBASE-KR norma-tive Channel model to define interconnect Channel performance for NRZ signaling at 10 Gbps This standard defines acceptable performance in terms of S-parameter charts for through-Channel insertion loss and worst-case crosstalk Figures 2a and 2b illustrate masks for Draft 24 of the standard that was initially used for this exercise

In each case the mask defining compliant performance is shown in blue Channel insertion loss is shown in red in Figure 2a Crosstalk performance is defined by the ICR curve (Figure 2b) Minimum acceptable Channel performance is defined in the ICR chart (Figure 2b) by the blue line The effect of the sum of all aggressors on the through-Channel is shown in red The green ICR curve is the ratio of the crosstalk power sum calculated by summing the

magnitudes of any impacting crosstalk Channels for each fre-quency and using a straight line fit (using least-squares method) to determine the resulting average effect f the aggressors on the through-Channel This is then overlaid on the insertion loss and used to plot the ICR curve

This standard which has evolved through a variety of iterations forms the basis for developing a 40 GbE switch fabric backplane featuring 10 Gbps NRZ differential pairs If all differential pairs can meet this standard then the backplane can be considered to be 10GBASE-KR compliant

Applying 10GBASE-KR to a 14-slotAdvancedTCA applicationThe PICMG specification dictates that receive differential pairs are placed on the c-d and g-h rows of the HM-ZD connector and that transmit differential pairs are placed on the a-b and e-f rows Therefore the middle differential pair in row c-d of Slot B will be subject to the NEXT of three aggressors in each of the a-b and e-f transmit rows of slot B plus the FEXT of the signals being received in the c-d pairs in the top and bottom of slot B

In this topology it can be seen that worst-case crosstalk would occur if all the NEXT and FEXT aggressors were routed on the bottom Layer that is on the same Layer as that of the victim c-d However given that all signal vias must be back-drilled and tuned for impedance management purposes Channel crosstalk can simultaneously be reduced by allocating different routing Layers to differential pairs terminated in the same backplane connector

The principal factor in determining the feasibility of a 10GBASE-KR compliant backplane is based on understanding whether the Channel with the worst-case signal-to-noise ratio is compliant

The skew targets determine permissible layer separation between a-b c-d e-f and g-h pairs within each Channel and enable routing Layers to be allocated for each pair It is now possible to start the process of via tuning to optimize the channel performance for minimum insertion loss Modeling begins by defining the simulation boundaries for the channel so that Channel component models (PCB traces connectors vias) can easily be aggregated to model complete Channels Boundaries must be established at locations in the Channel where linear 3D structures exist These are shown in Figure 3 (next page)

Since the connector and via combinations for the backplane and daughtercard mating halves must each be treated as a whole it

PICMG 30Spec

TurboFabricSpec

Total Inter-PairSkew

(Fabric Interface)

05 mm in FR4(34 ps)

001 mmin N4000-13si

(00625 ps)

Total Intra-Channel Skew

(Fabric Interface)

254 mm in FR4(17 ps)

plusmn01 mmin N4000-13si

(0625ps)

Total Intra-Channel Skew

(Base Interface)

135 mm in FR4(90 ps)

plusmn01 mmin N4000-13si

(0625 ps)

Figures 2a and 2b

Table 3

Determining which Channel that is and identifying the worst-case SN requires making trade-offs with regard to PCB material Channel length via design connector row selection and NEXT and FEXT aggressor routing choices These trade-off choices can only take place using advanced 3D simulation tools such as Ansoft HFSS This was the essence of the design process employed in developing Simclarrsquos TurboFabric backplanes

The simulation processThe transmission length for full mesh and dual star backplanes design implementations varies from a maximum of 1632 inches to a minimum of 116 inches With an effective transmission length of 5 inches on each daughtercard this makes the longest effective Channel 2632 inches including two connectors

For a 10GBASE-KR application over this distance a high-perfor-mance laminate is essential for both reducing insertion loss and

ensuring high glass content in the weave to mitigate skew So the design process began by choosing a low-loss dielectric material (Nelco 4000-13SI for both the backplane and the daugh-tercards) and establishing targets for Inter-Pair and Intra-Channel skew as shown in Table 3

Adhering to the PICMG 30 specifi-cation for skew in a 10GBASE-KR application is impractical Instead a target of 00625 ps was set for Inter-Pair skew with 0625 ps set for Intra-Pair skew for the backplane only This equated to a maximum 001 mm differ-

ence being allowed between traces of any differential pair and 01 mm being permitted between traces of any four differential pairs in a Channel Given the topology of the HM-ZD connector daughter-card skew must be accounted for in the daughtercard layout Fo

Sin Pnt

should be noted that the simulation boundary is located within the mated connector

Tuning the connector and via structures to 50Ω is an iterative process involving the removal of excess pads back-drilling and tuning pads anti-pads and traces A Time Domain Reflectometer (TDR) plot illustrating the results of the tuning process is shown in Figure 4

Upon completion of the modeling process a total of 17 different optimized via and routing configurations had been designed for the full mesh design and nine for the dual star design

A plot of worst-case insertion loss is shown in Figure 5 and demonstrates that in both cases performance is well above the 10GBASE-KR mask

When all the through-Channels have been modeled adjacent Channel models can be combined and ICR curves plotted to evaluate the impact of crosstalk on through-Channel performance This valuable information can be used to adjust the position of signal Layers relative to pass-through aggressor traces on adjacent Layers or to reroute traces to reduce crosstalk Similarly routing Layers can be changed to reduce crosstalk in adjacent via barrels

Figure 6 plots worst-case ICR and demonstrates that performance is above the 10GBASE-KR mask Based on this result it was possible to proceed to physical implementation

Figure 3

Figure 4

Fo Sin Pnt

Physical realizationThe layout process was performed using the Mentor Board-Station CAD system Quad-routing (routing four traces between pads) was explored as a routing method-ology in order to reduce Layer count but this was dismissed due to the detrimental impact on crosstalk performance

The attributes of the physical backplanes produced as a result of the design effort are shown in Table 4

The design files produced included the usual gerber files plus detailed back-drilling instructions

The design validation process comprised a conventional continuity test followed by performance testing featuring Agilent equipment including 70340A signal generator 8720ES Network Analyzer NN18A S-Parameter test-set and 86100A sampling oscilloscope with Agilent 86112A module Figure 7 (next page) shows the test set up

Simclar developed special line cards to enable through-Channel measurements with and without crosstalk The signal launch featured compression mount SMAs terminated in a tuned via structure The Channel simulations included simu-lation of the tuned launch structures so de-embedding of the launches was not necessary for correlation to simulation purposes The development team also established a process for characterization of all Channels

Full Mesh Dual Star

Layer Count 34 18

Aspect Ratio 121 61

Tuned Vias 3952 768

Material Nelco 4000-13SI

Table 4

Figure 5 Figure 6

Fo Sin Pnt

In Figure 8 measured through-Channel performance and ICR curves are shown for the same Channels described in the simula-tion section earlier

As can be seen from Figure 8 there is close correlation between these and the simulated plots in Figures 5 and 6 In fact close correlation between all simulated and measured results was achieved resulting in a 728 Tbps capacity full mesh and a 960 Gbps capacity dual star backplane design now generally available as part of the Simclar TurboFabric shelf

Figure 7 Figure 8

Figure 9

Figure 10

Implications of 10GBASE-KR Draft 33versus Draft 25The work described above was targeted towards meeting the Channels specifications contained in Draft 25 of the IEEE 10GBASE-KR Since this work was completed the IEEE has up-issued the Draft revision level for the Standard from 25 to 33 While this has not impacted through-Channel performance demands it has increased Channel isolation requirements by around 10 dB In Figure 9 a Draft 33 mask is added to the ICR plot shown in Figure 8

From Figure 9 it can be seen how Draft 33 pulls the mask above the Channel ICR curve for this full mesh backplane Channel Surprisingly it is the Channelrsquos frequency response at relatively low frequencies between 100-500 MHz that is causing a problem The reasons for this are currently the subject of further detailed investigation

However Figure 10 shows a Draft 33 plot for a less demanding dual star AdvancedTCA implementation featuring shorter trans-mission distances This plot demonstrates compliance to Draft 33 of the IEEE 8023ap 10GBASE-KR Standard

ConclusionBy developing a close understanding of the many factors contrib-uting to loss and noise in multi-gigabit backplane Channels it is possible to characterize their performance using advanced simula-tion techniques and correlate that performance in physical prod-ucts using advanced test methods By overlaying the test results on S-Parameter masks defined by the IEEE 8023ap 10GBASE-KR Standard it has been demonstrated that backplanes that truly enable AdvancedTCA scalability are at last a reality

Douglas Hynd joined Simclar Group in 2006 as Director of Marketing as part of Simclarrsquos acquisition of Northrop Grumman Interconnect Technologies Division wherehe was Vice President of Marketing and Sales He has more than 24 yearsrsquo experience intechnology sales marketing and generalmanagement and holds a BSc (Eng) in Electronics and Electrical Engineeringfrom the University of Glasgow He isbased at Simclarrsquos Global HQ inDunfermline Scotland

Simclar Groupdouglashyndsimclarcom bull wwwsimclarcom

Fo Sin Pnt

6U CompactPCIPrOduCT GuIdE g

This monthrsquos issue includes a 6U CompactPCI Product Guide and Irsquod like to take the opportunity to reflect a bit on the success and evolution of that technology

Back in the 1994 time frame when CompactPCI was first being devel-oped it began as 3U-only technology It used the same Eurocardmechanics that were popularized by VME and an IEC standardized high-

density high-speed connector available from a number of vendors suitablefor 33 MHz PCI signaling That connector was selected by the engineers atZiatech with help from Mike Munroe then at ERNI The majority of VMEdesigns were 6U and based on this I was among a number of folks thatargued for adding the 6U CompactPCI form factor

The 6U form factor presented some challenges and opportunities Onechallenge was that the insertion and extraction forces were quite high when the entire rear of the card was populated with connectors Fortunately the IEEE standards for Eurocards evolved and injectorejector handles that pro-vided leverage became available Eike Waltz then at Rittal was instrumental in bringing that to the table Two of the opportunities that came along withthe extra connectors were a clean way to add secondary buses like the H110 telephony bus to the backplane and the ability to route IO out the rear through rear transition modules PICMG has developed quite a number of subsidiary specifications defining the interoperable use of the extra backplane pins made possible with the 6U form factor Both of these features have played a major part in CompactPCIrsquos success The next major evolution of 6U CompactPCI came with the PICMG 216 Packet Switched Backplane standard which was originally conceived by John Peters and his team at Performance Technologies PICMG 216 interconnected a shelf full of CompactPCI single board computers via redundant Ethernet switches also in the 6U CompactPCI form factor This dramatically increased usable backplane bandwidth and provided redundancy PICMG 216 paved the way for AdvancedTCA and was the industryrsquos first open standard for the switched serial interconnect standards we see popping up in many places

By Joe Pavlat

Looking back and ahead at6U CompactPCI

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Recent 6U CompactPCI related products are listed here For more informationenter the productrsquos RSC No at wwwcompactpci-systemscomrsc

cPCI-6910Dual-core Intel Xeon Processor LVULV Universal blade bull Supports Single Dual-Core Intel Xeon LV or ULV processorsbull Front Side Bus 667 MHz bull Up to 2 GB DDR2 400 MHz soldered SDRAM with ECC bull Four PCI Express GbEbull Up to 4 USB 20 ports bull PICMG 20 21 29 216 compliant

RSC No 35013

ADLINK Technologywwwadlinktechcom

CPCIStor Module6U CompactPCI storage blade bull Onboard ATA controller supports CDDVD HDD and solid-state flashbull Supports Hot Swap Removal (ask about RAID support) bull ATA disks available in Enhanced Dutycycle versions for NEBS Level 3 - 724 requirements bull Operating Systems supported VxWorksLinux and Windows

RSC No 34800

ACTTechnicowwwacttechnicocom

Prosody X cPCI E1T1An E1T1 digital network access card bull Suits telco developers and systems integrators bull Uses Aculabrsquos worldwide protocol coverage including Aculabrsquos SS7 stack available under a cost free license bull Available with 8 or 16 E1T1 trunks and software selectable E1T1 interfaces bull Flexible mix of protocols including ISDN CAS and SS7 (ITU-T China and ANSI) bull A variety of interconnect switching and protocol conversion solutions can be readily crafted bull High availability reliability and scalability with industry standard hardw re and software interoperability bull Up to 128 SS7 signaling links bull Non-circuit related (TCAP) messagingintensive applications such as prepaid and SMS

RSC No 35408

Aculabwwwaculabcom

Adexp8021Intel Core Duo L2400 (166 GHz) w E7520 server chipset bull Dual channel PC2-3200 Registered RAM SECDED or x4 SDDC bull Two GbE two Serial ATA four USB 20 bull Onboard SXGA graphics 1280 x 24-bitbull 6U CompactPCI Bus PICMG EXP0 R10 Specification bull RoHS compliant 0 degC to +55 degC operating range

RSC No 32837

Advanet Incwwwadvanetcojpen

TC84012 channel single-stop Time-to-Digital Converter (TDC) with single-start and multi-start acquisition modes bull 50 ps timing resolution bull Wide range with upto 20 s between first and last events bull Large internal memory buffer with up to 512 hits per channel bull Low jitter (lt3 ps rms) high stability (plusmn2 ppm) internalclock source bull External 10 MHz reference input bull FPGA based Data Processing Unit (DPU) bull Fast readout with DMA mode for increased data throughputbull Overvoltage-protected inputs with 50 Ω K-Lock (LEMO) connectors bull Built-in self calibration bull Modular single-slot 6U PXICompactPCI standardbull Low power consumption (lt22 W)

RSC No 33445

Agilent-Acqiriswwwacqiriscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

MIC-30428-slot 6U CompactPCI backplane bull AC or DC CompactPCI 500 W + 250 W redundant(2+1) power supplies bull PICMG 216 (CompactPCI Packet Switching Backplane) compliancebull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarmmodule (MIC-3924L-AE)

RSC No 32851

MIC-30436-slot 6U CompactPCI backplane bull Supports two hot-swappable SCSISATA or removableIDE HDD bays bull Built-in IDE slim-type DVD-ROM bull AC or DC CompactPCI 250 W + 250 Wredundant (1+1) power supplies bull Supports hot-swappable fan modules bull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarm module (MIC-3924L-AE)

RSC No 32850

Advantech Corporationwwwadvantechcom

Dual-Core Xeon CompactPCI SBCModel PP 42123x bull Dual CPU 6U CompactPCI SBC supporting two dual-core Xeon CPUs bull Up to 8 GB DDR2 ECC SDRAM in a single system or peripheralslot bull Dual processor SBC in a single 6U CompactPCI slot bull Supports two 166 GHz Dual-Core Intel Xeon ULV processors using Intel E7520 server chipsetbull Up to 8 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull PMCXMC site support 66 MHz PCI-X and x8 PCI Express bull Front and rear IO bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade bull Four GbE ports with option for PICMG 216

RSC No 34761

6U CompactPCI Core 2 Duo SBCModel PP 41203x bull 6U CompactPCI Core 2 Duo SBC supporting two PMC sites includingone XMC site bull Up to 4 GB DDR2 ECC SDRAM bull All in a single system or peripheral slot bull TwoPMC sites supporting up to 100 MHz PCI-X bull One XMC x8 PCI Express bull Front and rear IObull Supports 216 GHz or 15 GHz Intel Core 2 Duo processors bull Intel E7520 server chipsetbull Up to 4 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade

RSC No 34763

PP 30202xTwo processor versions available bull 18 GHz Intel Pentium M processor 745 uses mFC-PGA 478 (micro Flip-Chip Pin Grid Array) package bull 14 GHz Intel Pentium M processor Low Voltage 738uses mFC-BGA 479 (micro Flip-Chip Ball Grid Array) package bull 64 KB primary (L1) on-die cache2 MB of secondary (L2) on-die cache bull 400 MHz Front Side Bus (FSB) bull No CPU fan bull 16 GHz processor version (1 MB L2 cache) available see PP 30002x datasheet bull Utilizes 64-bitIntel 855GME chipset bull Supports 400 MHz bus frequency bull Uses Intel 6300ESB IO Controller Hub

RSC No 32659

Concurrent Technologies Incwwwgocctcom

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PrOduCT GuIdE6U CompactPCI

cCIBPMC6U-ETA 6U bridged dual PMC carrier that bridges extended temperature CompactPCI boards and PMCs bull Features a rugged CompactPCI form factor providing increased flexibility to military communications systems designers bull Provides additional design choices to users through its differing bus speeds maximizing the numberof PMCs that can be used CompactPCI andPMC buses can both run at 66 or 33 MHzbull Operating temperature range of -40 degC to+85 degC bull Signal conditioning bull DMA supportbull Low-power design +5 V +33 V +12 V -12 V bull User-selectable VIO of 33 V or 5 V to the PMC

RSC No 32891

Dynamic Engineeringwwwdynengcom

cPCI4IP-MMMinimized PCI address footprint IndustryPack carrier for CompactPCI applications bull 6U 4HP4 IP positions 832 clock selection for each slot fused filtered power IO options bull ID INT IO and Mem spaces are decoded for each IP slotbull Single and double wide IPrsquos bull 16- and 32- bit IPs bull 32-bit access to 16-bit IPs bull Full or mini-mized Memory Space decoding for 18 the PCI address requirement bull With the cPCI4IP-MM option 8 CompactPCI 4IP cards take the same PCI address space as 1 full Mem Space card

RSC No 34905

ACQ132CPCI32 channel MHz class simultaneous sampling intelligent digitizer bull 32 simultaneous analoginput channels 2-32 MSpschannel 14-bit resolution bull Differential inputs bull Intelligent cardwith 1 gigabyte memory and GbE on board bull Large distributed FPGA resource on boardbull Range of DSP functions including FIR filtering and Digital Downconverter

RSC No 35482

D-TACQ Solutions Ltdwwwd-tacqcouk

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CR11Based on the Intel Core Duo Processor the platform is designed to support processor speeds from 106 GHz up to 20 GHz bull Intel Core 2 Duo runs at 15 GHz up to 20 GHz bull Conduction cooled bull Two PMC slots bull PCI Express bull 2x GbE

RSC No 33156

ICS-72532-channel 6U CompactPCI DAC board bull 6U CompactPCI data acquisition card bull 32 differential output channels bull 16 or 24-bit sample size bull 288 kHzch data rate bull Simultaneous sampling across all channels on single or multiple boards bull 32 separate delta-sigma DACs bull 64-bit 66 MHz CompactPCI PICMG 20 Rev30 hot-swappable bull FPDP II 400 MBps interface

RSC No 33576

ICS-71032-channel 6U CompactPCI ADC board bull 6U CompactPCI data acquisition card bull 32 differential input channels bull 216 KHzch 24-bit resolution bull Software selectable full scale input bull FPDP II 400 MBpsinterface bull 64-bit 66 MHz CompactPCI PICMG 20 Rev 30 hot swappable bull 32 synchronous boards for simultaneous sampling bull Sonar acoustics and test and measurement applications

RSC No 33578

Tsumani 6U CPCI Development KitFPGA processor solution targeted at high performance software defined radio applications bull Dual Stratix EP1S80 FPGAs are tightly coupled to provide apower platform for signal processing bull Two PMC module sites provide IO connectivity to either front panel or back panel connections bull A direct highbandwidth 1 GBps path from the PMC P4 connector directly to the FPGAs bull Model 919 Dual DAC Mezzanine provides broadband analog signal generationin a compact form bull The board features two independent DAC channels each with its own 12-bit LVDS input capable of running at rates up to 160 MHz

RSC No 32026

CP11Rugged 6U SBC bull Up to 4 GB of DDR2 SDRAM (200 MHz) with enhanced ECC four independent onboard PCI buses system host and peripheral modesupport for the CompactPCI backplane two PMC interfaces (64-bit133 MHz and 32-bit33 MHz) bull Instead of the PMC1 a PCI Express based XMC interface is available on request bull Two GbE one Fast Ethernet two serial interfaces (RS-232 or RS-422485) USB 20 integrated HDD or flash drive bull High performance 2D3D ATI video controller capable of driving two displays in parallel supports VGADVI interface bull Intel Core 2 Duo at 216 GHz Intel Core Duo at 20 GHz2x PMC expansion site bull One XMC optional bull Up to 4 GB DDR2 SDRAM wECC 2x GbE

RSC No 33447

GE Fanuc Intelligent Platforms Incwwwgefanucembeddedcom

Single Board ComputersGD Canada designs and manufactures conduction-cooled Single Board Computers (SBCs)using Intel processors bull 6U and 3U form factors for CompactPCI backplanes bull Fully backward compatible with earlier models bull Upgradeable via the change-out of processor memory andIO modules bull Used within GD Canada computer systems and sold as individual products

RSC No 35281

General Dynamicswwwgdcanadacom

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PrOduCT GuIdE6U CompactPCI

cPCI6U-24DSI32R32-channel 24-bit delta-sigma CompactPCI 6U analog input board with rear IO bull Low noise 24-bit resolution low phase distortion andmulti-board synchronization bull Suits state-of-the-art sonar and noise monitoring applications bull 32-channel cPCI6U-24DSI32 analog input boardprovides a high-density 24-bit analog input resources on a standard 6U CompactPCI expansion board bull Applications from precision voltagemeasurements to complex audio signal and waveform analysis

RSC No 34985

General Standards Corporationwwwgeneralstandardscom

Duet 3U 64-bit 1 GHz TMS320C6416 DSP (x2) 64 MB SDRAM per processor bull Flexible internalexternalcommunication mesh bull 64-bit66 MHz CompactPCI bull PMCXMC site with Jn4 to FPGA and4 RocketIO per VITA 42 bull External data port up to 12 Gbps bull 4M or 5M Virtex-II Pro FPGAbull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM dedicated800 MBps links between DSPs bull 3U CompactPCI with PXI support bull Suits high-end co-processing wireless broadband communications RADAR video and biometrics

RSC No 32856

QuadiaQuad-DSP bull Dual FPGA bull Dual PMC sites bull Inter-processor connectivity and access to external interfaces bull Four C6416 DSPs split in two independent clusters each hosting a PMC site bull One large FPGA for end-user code bull Central FPGA routing interprocessor communication bull End-user FPGA communication bull External port serial IO for PCIe or other p ivate link bull Global memoryand PCI interface bull 1 GHz TMS320C6416 DSP (x4) bull 64 MB SDRAM per processor bull Flexible internalexternal communication mesh bull 64-bit66 MHz CompactPCI bull Two PMC sites with Jn4 to FPGA bull External data port up to 12 Gbps bull Two 4M Gate FPGA reserved for end-user code bull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM bull Up to 512 MB Global DDR SDRAM bull Suits high-end co-processing wireless and broadband communications

RSC No 34737

Quixote 64-bit 6UAdvanced signal capture generation and co-processing bull 1 GHz TMS320C6416 DSP and2 to 6 MGATE Virtex-II FPGA bull 32 MB SDRAM 8 MB ZBT SBSRAM and AD6645 and AD9764 converters bull 6432 bit CompactPCI 66 MHz 5 V33 V and complex trigger modes with HW event logging bull PMC site with Jn4 to FPGA DIO and PICMG 217 StarFabric compliant bull Suits Software Defined Radio wireless IP and RADAR development and hardware testing bull Physical Layer field testing ultra-fast flexible data acquisition vector signal generation and electronic warfare

RSC No 32861

Innovative Integrationwwwinnovative-dspcom

IC-e6-cPCIbHigh performance 6U CompactPCI board bull Powered by one or two of Freescalersquos mostadvanced 14 GHz MPC7448 PowerPC processors bull PICMG 216 compliant bull Marvell Discovery III chipset (MV64460) bull Low power consumption bull Standard extended and rugged grades

RSC No 32982

Interface Conceptwwwinterfaceconceptcom

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PrOduCT GuIdE6U CompactPCI

CP213Single-width 6U CompactPCIPXI module with either 32 or 64 differential analog input channelsbull 32 64 or 128 channels of analog input bull 16 multifunction digital IO (TTL) channels that may beconfigured as digital in digital out or selectively attached to 2 frequency in 2 counter in andor 2 timerout channels bull 16-bit resolution bull Programmable gain per channel programmable scan rates of lt1 Ss through 100 KSs bull Precision onboard reference for end-to-end calibration

RSC No 34804

KineticSystems Company LLCwwwkscorpcom

CP6001Energy efficient embedded Intel dual core processors bull 12 GHz Intel Core Duo U2500 ULV processor bull Intel Core 2 Duo L7400 LV processor bull Based on the Intel Mobile 945GM chipset with a front side bus of up to 667 MHz and ICH7-R Southbridge bull Two independent digital video outputs to the rear IO (2x DVI - 1x DVI and 1x HDMI) bull AC97 audio capabilities bull 3 x GbE bull 4 x SATA with RAID 01510 functionality bull 6 x USB 20 2 x COM and VGA or DVI bull Can also accommodate a PMC slot or an onboard 25 inch SATA HDD bull Up to 8 GB of USB or 2 GB soldered flash bull Supports Linux Windows XP XP embedded and VxWorks 6

RSC No 34182

CP6923 GbE Switch6U CompactPCI GbE Switch PICMG 216 compliant bull Leading edge te hnology basedon BCM5650X chip bull 24x GbE ports bull Non-blocking Layer 2 and 3 switching and routingbull Copper optical rear IO version bull Hot swap IPMI bull Fully managed bull Comprehensive firmware package bull Applies to VoIP installations such as call servers media gatewaysand trunking gateways in wireline and wireless networks as well as VoIP systems inenterprise networks with high demands on performance

RSC No 32256

Kontronwwwkontroncom

TMS320C6701 Virtex-IITexas Instrumentsrsquo C6701 DSP bull Xilinx Virtex-II series FPGA up to XC2V8000 bull Multiple IO interfaces Onboard CODEC VIM expansion sites 60-pin GPIO header and JTAG bull Hardware drivers integration in SimulinkXilinx System Generator Blocksets for quick implementation of Simulink models bull DSP and FPGA-in-the-loop cosimulation of SimulinkXilinx System Generator models bull Leading edge communication interface allowing real-time datamonitoring from Simulink scopes and remote operations

RSC No 32028

VHS-DACHigh performance multichannel DA for phased array antenna systems radarsonar communications receiversup-sampling to IF stage and RFIF AGC apps bull Eight 125 MSPS output channels bull Optional add-on daughter boardprovides 8 additional output channels or 8 additional input channels bull 32-bit 25 MHz bull FPDP interface with 400 MBps transfer rate (25 MSPS per channel at 8 channels 125 MSPS at 16 channels) bull Low level hardware drivers API andGUI bull High level hardware drivers integration in Simulink Blocksets bull Leading edge communication interface fordata recording and playback tofrom the onboard SDRAM

RSC No 32029

Lyrtechwwwlyrtechcom

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PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

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PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

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PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

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PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

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PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

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SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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Page 4: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

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34 ACTTechnico ndash Networking Hardware20 Adax Inc ndash ATMIV AMC Controller45 Adax Inc ndash SS7ATM Controller39 Advantech ndash Advanced Blade Solutions7 Annapolis Micro Systems ndash Wildstar 5 for IBM Blade 43 Astek ndash Storage41 Concurrent Technologies Inc ndash Dual-Core Processors47 ELMA Electronic ndash MicroTCA Solution13 Excalibur Systems Inc ndash Mil-1553 ccVME5 GE Fanuc Intelligent Platforms ndash Software development environment3 Harting Technology Group ndash AdvancedMC Connectors17 Hendon Semiconductors ndash I2C Bus Buffer8 Interface Concept ndash Embedded Products2 Interphase ndash AdvancedTCA and MicroTCA Solutions48 Kontron ndash Open Modular Solutions9 National Instruments ndash Automated test system14 One Stop Systems Inc ndash PCIe over Cable16 Performance Technologies ndash One-Stop Shopping23 Red Rock Technologies Inc ndash Mass Storage Modules28 Rittal ndash AdvancedTCAMicroTCA40 SDR Forum ndash Call for papers21 VON ndash digiumAsterisk World19 Winchester Electronics ndash Connector Solutions29 XALYO ndash XS-AMC2

A n O p e n S y S t e m S p u b l i c A t i O n

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A D V e r T I S e r I N F o r m AT I o N

Page AdvertiserProduct description

CompactPCI reg

AdvancedTCA regand Systems

ompactPCIdvanc dTCA S

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By Joe Pavlat

CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems

EDITORrsquoS FOREWORD

Why AdvancedTCA is at home in HSS

With this first issue of 2008 (Happy New Year) our colleague Sven Freudenfeld from Kontron gives us an excellent and detailed comparison of 1U rack-mount servers and AdvancedTCA in a real application a Home Subscriber Server (HSS) He describes the application in detail and then compares

space cooling maintenance management capabilities scalability and switching require-ments Sven makes a compelling case that AdvancedTCA provides many essential application elements that must be separately and expensively added to 1U servers He concludes that AdvancedTCA allows Telecom Equipment Manufacturers to concentrate on developing software instead of hardware and that reduces development costs and speeds time to market

PICMG addressing new data bandwidth standardsWhile AdvancedTCA provides a great deal of backplane bandwidth especially in full mesh configurations designers want to go even faster to accommodate new bandwidth-hungry applications like IPTV Last year the IEEE ratified important new standards for 10 gigabit per second data transmission over a single pair of conductors Of special interest to our community is the 8023ap 10GBASE-KR standard which details how to achieve that blaz-ing speed over a backplane The PICMG community is moving towards setting up a new subcommittee to incorporate this technology into the AdvancedTCA standard and it may be operating when this issue hits the street It has the potential of providing a total useful backplane bandwidth of 10 terabits per second in a single shelf Thatrsquos a truly amazing

number Douglas Hynd from the Simclar Group introduces us to the details of designing systems at that speed discuss-ing losses signal skew and crosstalk At these speeds simulation is essential and Douglas describes some of the issues involved Also in this issue Stuart Jamieson from Emerson Network Power gives us additional insight into high-speed signaling design simulation and analysis

A name change from Technology in Europe to Global Technology goes into effect this month for the column written by industry veteran Hermann Strass In this issue Hermann tells us how CompactPCI products from MEN Micro have been incorporated into the design of a new highly sophisticated digital cinema camera developed by Silicon Imaging In addi-tion to providing very high resolution and speed the camera must also operate in harsh environments MEN Micro won the 2007 Intel Communications Alliance Innovate and Ignite Technology Showcase award for its work

Curt Schwadererrsquos Software Corner this month expands on a subject he wrote about last April (wwwcompactpci- systemscomcolumnssoftware_corner 200704) As cable companies expand their offering beyond television to voice and data services they become subject to the same laws relating to cyber crime as the traditional telecommunications pro-viders do They must provide law enforce-ment authorities surveillance that is the subject of a lawful warrant and industry standards are being rolled out to do this Itrsquos a timely topic as serious problems with identity theft and cyber crime ingeneral are on the rise Curtrsquos column isan interesting read

Joe Pavlat Editorial Director

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By Hermann StraSS

GLOBALTECHNOLOGY

CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems

Award recognizes unique ruggedcamera control system

The 2007 Intel Communications Alliance Innovate and Ignite Technology Showcase (ICA) named MEN Micro Inc the ICA Showcase winner on September 19 2007 at the Embedded Systems Conference Boston MEN Micro a

subsidiary of MEN Germany has developed a unique control system for a rugged digital movie camera

Silicon Imaging an innovator in IT-centric digital cinema cameras required a rugged camera control system for its new SI-2K camera The SI-2K (shown in Figure 1 courtesy of Silicon Imaging United States) executes direct-to-disk raw recording at either 1920x1080 pixel high definition or at 2048x1152 pixel for cinema resolutions Its 48-bit digital processing algorithms perform adaptive pixel-by-pixel calibration and color image enhancement The SI-2K fore-goes legacy fixed bit-rate DCT codec recording formats such as DVCPRO HD and HDCAM-SR for advanced wavelet compres-sion technology Current generation HD cameras destructively process and compress their imagery at the acquisition stage The SI-2K streams images as raw digital negatives over a standard GbE connection The Intel Core 2 Duo processor-based F17 system from MEN non-destructively processes the raw digital negatives in real time to the visually perfect CineForm RAW codec which makes capturing up to four hours of continuous footage on a single 160 GB notebook drive possible

MEN Micro developed a customized version of its Intel Core 2 Duo processor based F17 3U CompactPCI SBC a unique side card for advanced audio and video capabilities as well as a rug-ged compact enclosure Already being used at independent film production studios for the making of full-length feature films the digital camera employs technology that can be repackaged for surveillance military sports analytics 3D video and stereo ap-plications The camera can operate in environments ranging from desert to arctic

The F17 SBC from MEN (Germany) controlling the camera in-cludes an Intel Core 2 Duo processor T7600 running at 233 GHz The SI-2K uses MENrsquos SBC for simultaneous encoding of data An Intel Graphics Media Accelerator 950 (Intel GMA 950) per-forms image graphics processing colorization and visualization at full resolution The F17 is equipped with 2 GB fast DDR2 DRAM a hard disk on a removable slot and two Intel GbE PHYs which transfer data from the camera head to the camera control unit and to other standard IP hardware The custom side card enables the connection of a High-Definition Multimedia Interface (HDMI) headphones and balanced analog input and output ports for pro-fessional audio signals

Specified for an extended temperature range in harsh shooting environments the camera uses MEN Microrsquos F17 board equipped

with a massive tailored heat sink accompanied by a fan install-ed inside the camerarsquos housing The F17 is part of MENrsquos powerful family of intercompatible CompactPCI Express SBCs including the newer and more powerful F18 which is completely compatible with the F17 and will also be incorporated into Silicon Imagingrsquos new SI-2K camera

European eventsThe 26th MOTEK International Trade Fair and Exhibition the worldrsquos largest event for assembly handling and automation sup-port systems and devices was held for the first time in the brand- new Neue Messe in Stuttgart Germany from September 26 to September 27 2007 The exhibition space increased by 45 percent over last yearsrsquo event due to the new venue More than 1100 exhibitors from 20 different countries drew around 40000 visitors and filled all five new exhibition halls Mechatronics was speci-fically featured as were robots and automation equipment In 2008 about one million square feet of exhibition space will be available when four more halls are completed at Europersquos most modern fair grounds near the Stuttgart Airport Terminal

EMO 2007 (Hannover) the worldrsquos largest exhibition of metal-working equipment closed its gates on September 22 after six days of exhibition with around 160000 attendees visiting booths of 2100 exhibitors from 42 countries 18 million square feet was devoted to exhibition space The organizers German Association of Machine Tool Manufacturers (VDW) reported new busi-ness contracts at the rate of 4 billion EURO (almost $6 billion) Exhibitors such as TRUMPF Laser Germany (see my April 2007 column (wwwcompactpci-systemscomcolumnsTechnology_in_Europe200704) reported full success at EMO 2007

For more information contact Hermann athstrassopensystems-publishingcom

Figure 1

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By Curt SChwaderer

CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems

SOFTWARE CORNER

In the April 2007 Software Corner column (wwwcompact-pci-systemscomcolumnssoftware_corner200704) we explored surveillance systems and the Communications Assistance for Law Enforcement Act (CALEA) a lawful

surveillance capability mandate Internet access and VoIP pro- viders had to be compliant with CALEA by May 2007 or face severe financial penalties

In this monthrsquos column we will look at what cable companies are doing to provide lawful surveillance capabilities within their networks

The term cable company is now officially a misnomer Cable companies and their networks are capable Internet access and voice service networks that offer the general public a one-stop shop for all their communications and entertainment needs In fact cable companies now typically call themselves Multi-Service Operators (MSOs) Voice and data services form a significant and grow-ing source of revenues for the MSO To that end cable networks become subject to the same rules and regulations that telecommu-nications networks do

One of these regulations is CALEA which provides the ability for network providers to tap specific subscribers when served a warrant To their credit cable companies and their research and development consortium organization CableLabs (cablelabscom) have been very proactive planning for lawful surveillance capa-bilities and CALEA compliance within their networks CableLabs and its partners have been working on a set of PacketCable stan-dards that incorporate specifications for voice and broadband data intercept We will focus on the new Cable Broadband Intercept Specification (CBIS) what it encompasses and paths for imple-mentation within cable networks

Cable Broadband Intercept Specification The set of specifications governing cable network services and capabilities is called the Data-Over-Cable Service Interface Specifications (DOCSIS) The specification that covers lawful

surveillance for data services is CBIS The CBIS reference model is shown in Figure 1

The surveillance architecture consists of three components the Mediation Function (MF) Broadband Intercept Function (BIF) and Collection Function (CF) When a warrant for a subscriber is served the network administrator configures the MF to capture traffic coming to andor from the subscriber This traffic includes any dynamic IP address assignment transactions (called out-of-band traffic) as well as the traffic resulting from e-mail voice or data services being used by the subscriber in question Creating hashes of these files validates the captured traffic as not having been tampered with It is also important for the network provider to supply traffic only for the subscriber the warrant is served on Older methods of surveillance involve dumping all traffic from a particular service area from all users in that area then sifting through that traffic manually This method violates the privacy rights of all the other subscribers in the service area of the individual(s) the warrant is served on Surveillance equipment that can capture only the traffic to or from the subscriber in the warrant is critical to the lawful surveillance aspects of the deployment

So far this is similar to the Alliance for Telecommunications Industry Solutions (ATIS) standards governing voice and data surveillance for digital wire line systems Unlike the original ATIS specifications the CBIS specification includes the BIF The BIF is a buffering component where the Mediation Function pushes the surveillance information (in the form of surveillance files) to the BIF for retrieval by the Collection Function at a later date

The CF component gathers the surveillance information from the BIF under law enforcement control then analyzes and presents the surveillance information in a useful way The CF also validates the information by comparing hashes of the files against hashes generated by the surveillance equipment at the time of capture This ensures that from the time the traffic is captured it is not tampered with

Cable and CALEA A look at cable networks and lawful surveillance

Figure 1

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Buffering is importantThe buffering capability the BIF provides in the CBIS specifi- cation is an important distinction between it and the ATIS specification (for more information on the ATIS specs see the April 2007 Software Corner (wwwcompactpci-systemscom columnssoftware_corner200704)

Buffering is so important that ATIS has approved an additional standard for a Buffering Function (BF) within the ATIS lawful surveillance environment

The importance of buffering is best described in a presentation that Dr Glen Myers CEO of IP Fabrics gave at the December 2007 ISS World conference The real-time delivery that the initial ATIS specification defines can be problematic as Figure 2 shows Packet loss from congestion bit errors or QoS contracts can result in the entire surveillance stream being rendered inadmissible

Dr Myers further explained that ATIS allows their buffering model to be separate from or combined with the MF while the cable network CBIS model assumes the buffering function is always separate from the MF component (Figure 3)

The buffering function whether it be the Buffering Function in the ATIS model or the Broadband Intercept Function in the CBIS model minimizes the impact of packet loss and real-time data delivery The Mediation Function can repeatedly attempt to send surveillance information to the BIF through a secure reliable file transfer function such as secure FTP If there are problems connecting with the BIF alerts can be generated so the network administrator can find and fix the problem while the surveillance information is still resident on the MF system

Dr Myers mentioned other important benefits to providing a buffering function The network administrator does not need to

negotiate and install a dedicated link for each intercept between the MF and the Law Enforcement Agency or agencies (LEA) authorized for the information Dedicated pipes matching the subjectrsquos peak service bandwith are not needed Support for mul-tiple LEAs is easily implemented at the BIF instead of the Mediation Function Law enforcement collection equipment does not need to be co-located with the Mediation Function It also simplifies connectivity by eliminating Virtual Private Networks (VPNs) or other routing ele-ments between the MF and the LEA(s)

CALEA and CMTSIn a cable network the Cable Modem Termination System (CMTS) is typically the central point within which service provider traffic from the access network meets the cable core network (and ulti-mately the Internet) So the CMTS is an important interface point for lawful surveillance

CMTS equipment may provide varying levels of support for lawful surveillance The simplest is to provide access to all the raw traffic flowing through the CMTS using an Ethernet tap or span port In this scenario the Mediation Function must find the traffic belonging to the subscriber under surveillance generate the appro-priate CBIS files and send the files to the BIF

Cisco a leading supplier of CMTS equip-ment to the cable industry provides a capability called Service Independent Intercept (SII) within their CMTS prod-ucts Cisco SII is also used in their routers and intelligent switches for QoS control in addition to lawful surveillance While SII provides support for identifying traffic by MAC and IP address information it does

Figure 2

Figure 3

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not provide the high-level configuration and lawful surveillance messages required of the Mediation Function SII uses low-level SNMP MIBs that control MAC and IP address configuration commands which in turn trigger the Cisco SII device to send packets matching the configuration to a span port where the Mediation Function can use these matched packets to generate the lawful surveillance messages So SII provides a first-level filter for the Mediation Function which supplies a high-level configuration interface at the warrant description level as well as creation of the CBIS (or ATIS) messages to be sent to the BIF

CBIS-compliant productsThe CBIS specification is quite new so released products are mostly on the hori-zon However the IP Fabrics DeepSweep Lawful Surveillance product line does provide MF andor BIF functionality for the implementation of CBIS-compliant networks Dr Myers noted that the DeepSweep product line is based on a flexible architecture and a highly parallel processing environment comprised of many software surveillance modules that can be loaded and chained within the DeepSweep to provide a number of Layer two to seven surveillance and packet analysis activities The device is programmed through a GUI and operates as a full Mediation Function with the ability to identify subscriber-related IP address assignment and resulting traffic from a span port The DeepSweep also has software support to communicate with SII enabled routers and CMTS sys-tems to provide a fully compliant ATIS andor CBIS surveillance environment compatible with Cisco lawful intercept and QoS services

CBIS BIF and ATIS buffering appliances are also available to provide buffering compliant with CBIS and ATIS standards

ConclusionCyber crimes such as identity theft child pornography chat-room initiated abduc-tion national security and piracy are very real and growing issues in todayrsquos society Billions of corporate and personal dollars have been tied to cyber crooks that abuse the Internet to participate in these activities It is essential that these illegal activities can be identified and stopped It is a good idea to be aware that the cable industry and its proactive support of lawful surveillance standards as well as rolling out equipment that implements these standards will in turn enable law enforcement to catch these cyber crooks and make the Internet a safer place for us and our children to live learn and work

For more information on this or any Software Corner contact Curt atcschwadereropensystems-publishingcom

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APPLICATION g

Based on current overall network growth Telecom Equipment

Manufacturers (TEMs) and Network Equipment Providers (NEPs)

are being challenged to launch new communications platforms

that provide optimal scalability flexibility manageability and

high computing performance With the expected increase in new

subscribers who need to be supported across the network TEMs and

NEPs are focusing on COTS platforms that meet the requirements of

a carrier-grade environment

With these new challenges it is important to take a look at the different

applications in the network to thoroughly evaluate the best hardware

platform approach Comparing the scalability IO functionality

interconnectivity and overall performance gives TEMs and NEPs a

solid basis from which to choose the best cost-effective solution for

their applications This article compares the traditional 1U PCI

platform with a more modular AdvancedTCA-based approach to

a Home Subscriber Server (HSS)-based platform

Emerging next-generation network architecture IMS Carriers and service providers are focused on improving their Average Revenue Per User (ARPU) by deploying new services quickly and at a price that is acceptable to subscribers IP Multimedia Subsystems (IMS) enable service providers to offer differentiated services to their subscriber base integrating voice video text and content as part of their service mix regard-less of the access technology

The IMS framework provides the telecom industry with a modular standards-based IP service delivery infrastructure More than simply replacing existing circuit services with similar services delivered over IP IMS allows service providers to capitalize on faster and more cost-effective deployment of new and differentiated multimedia communication services

While these new technologies promise new sources of revenue and enhanced customer loyalty they also pose implemen- tation challenges One of the crucial net-work elements within an IMS framework is the manageability of the subscriber base Today an increasing number of users subscribe to multiple services such

By Sven FreudenFeld

Choose the right formula forcompute-intensive HSS systems

AdvancedTCA platforms

versus1U PCI rack-mount servers

AdvancedTCA

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as multimedia mobile phones VoIP or IPTV at home Service providers must manage ldquoduplicatedrdquo subscriber databases for each particular service Consequently managing a converging subscriber base for such network functions as billing across multiple different technologies presents a tremendous challenge Any downtime of this network element can be costly to the carrier or service provider not to mention the heavy risk of losing subscribers over the long term

The HSS and Home Location Register (HLR) are key elements in the IMS network required to manage the growing number of subscribers These platforms that manage millions of customersrsquo data need to be highly reliable with carrier-grade High Availability (HA) functionality Core requirements for the HSS computing platform are

n High compute density for application processingn Scalable performance and high densityn Fast read access to the subscriber datan Large storage and memory bandwidthn Ability to consolidate multiple IMS elements and subscriber data within a single

platform with a modular approach as a converged services platform

HSS plays network backbone roleHSS provides the important network backbone of the IMS architecture because it eases innovation and addresses a range of service-logic interaction issues that have plagued previous service architectures HSS offers open access to service-related data for each subscriber supporting the sharing of data among multiple services

HSS is essentially the master user database that supports IMS network entities that handle calls and sessions It contains user profiles performs authentication and authorization of the user and can provide information about the physical location of the user It plays a key role in provisioning service creation enabling subscriber data and managing control roaming and interconnection The Application Server (AS) which hosts and executes serv- ices in the IMS environment communicates with the HSS Call State Control Function

(CSCF) servers also communicate with the HSS which must be able to

n Support IMS-level authentication and authorization

n Maintain IMS subscriber profile(s) independent of access types

n Maintain service-specific datan Keep track of currently assigned

CSCFn Support CSCF and AS access

HLRHSS hardware platform design choicesHSS design must enable the HSS to be deployed cost-effectively and expand readily to meet future subscriber levels For example the trend to include more information as part of the data record for each subscriber will drive up memory requirements

From a technical perspective the key metrics to understand when developing the IMS HSS functions are the number of completed transactions required per sec-ond and the size of the subscriber base

HSS architecture typically comprises multiple processor units with extensive memory requirements With the introduction

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of multicore processors from Intel developers can scale performance while optimizing power consumption in the overall system design

To meet these requirements the hardware platform needs to provide scalability flexibil-ity and long-term cost efficiency In comparing the traditional 1U platform with a more modular approach to the HSS using AdvancedTCA consider the following

n High compute performance n High memory and storage capabilityn IO functionality to connect to multiple networks (such as SS7 and Ethernet)n Carrier-grade profile and redundancy

AdvancedTCA High density with scalability on a smaller footprintTable 1 illustrates a comparison of a sample AdvancedTCA-based platform and a 1U PCI rack-mounted platform for HSS applications This configuration assumes an increasing subscriber growth from 1 million (M) subscribers to 18M subscribers per platform

FootprintAdvancedTCA-based platforms provide a high density compute platform with scalability on a smaller footprint TEMs can easily add boards to a chassis to accommodate more traffic and to support new services This flexibility enables an increase in subscribers and the database without having a major impact on rack space in the central office environ-ment To meet the same capacity for 18M subscribers the 1U PCI approach will occupy two bays or cabinets with a total footprint of 28 square feet compared to the same capacity occupying one bay or cabinet with a footprint of 14 square feet (see Figure 1)

CoolingWhile the power consumption per square foot is higher than the 1U PCI platform AdvancedTCA offers better airflow and cooling distribution using a push-pull cooling system Each 1U PCI platform includes up to nine cooling fans and is dedicated to that CPU in the 1U server only which translates into higher overhead Therefore the airflow is

not optimized in the overall system design In the case of a fan failure AdvancedTCA platforms enable easier access to replace the fans which are field replaceable units The 1U platform also does not include any integrated centralized switching or management capabilities therefore the total does not include any switching or system management functionality

ScalabilityAdvancedTCA architecture lends itself well to scalability As AdvancedTCA sup-ports both a Base and Fabric interface into the backplane and the separation of data and control planes TEMs can also scale up their designs from 1 GbE to 10 GbE to accommodate new users and usage requirements AdvancedTCA based systems are designed for easy upgrade-ability to new processing blades switch fabrics and IO modules using Advanced Mezzanine Cards (such as SS7)

Since AdvancedTCA and AdvancedMCs offer hot swap capabilities and HA func-tionality growing a subscriber base by using additional CPU blades within the system with low maintenance or upgrade downtime is crucial for the HSS plat-form It also allows for the up and down

AdvancedTCA-based HSS Platform 1U PCI Rack-Mount HSS Platform

Number ofsubscribers

~1M subscribers = 4 CPU blades edundant ~1M subscribers = 4 x 1U

~4M subscribers = 7 CPU blades redundant ~4M subscribers = 7 x 1U

~6M subscribers = 12 CPU blades redundant ~6M subscribers = 12 x 1U

~18M subscribers = 36 CPU blades redundant= 3 AdvancedTCA shelves per rack

~18M subscribers= 36 x 1U+ external switch components for redundancy

Technicalspecs

1 CPU blade = 2 x Intel Xeon dual core = quad core 1 1U rack-mount Intel= Intel Xeon quad core or dual core CPU

16 G DDR 2 memory Max of 8 G DRY memory

+ 2 x SATA or SASS hot swap (RAID 0 and 1)+ 1x PCI Express for SS7 Dual GbE per 1U rack-mount server

4 x GbE per CPU with built in GbE backplane switching separating Control Pathand Data Path with multishelf expandability

External central switching required withmultiple external GbE connectivity

Systems and blade manageability built into the platform withIMP implementation SNMP and CLIP

Carrier-grade redundancy on switch and node

IO for SS7 or other interface modules

CPU blade hot swap capability

Thermaland power

requirements

~6M subscribers redundant= 14 slots with centralized chassis cooling

~6M subscribers redundant= 18 x 1U PCI with independent cooling and separate switch units and system management

Total power consumption= ok (3100 W for blades and RTM + 500 W Shim fan tray and SAP)

Total power consumption= ok

Table 1

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scaling of the platform depending on the subscriber increase or decrease When consolidating multiple services minimiz-ing multiple duplicate databases requires this flexibility

InterconnectivityThe AdvancedTCA platform offers a number of interconnectivity features including

n Separation between the data plane and the control plane

n Direct uplink in a multichassis envi-ronment with up to l0 GbE

n Node to node base and fabric connec-tivity with HA carrier-grade Ethernet functionality

n Easy upgrade path to l0 GbE for increased bandwidth

By contrast the 1U PCI platform requires

n Additional external interconnectiv-ity between 1U rack-mount servers which increases the number of points of failures and the operating and maintenance costs

n Additional switching equipment for carrier-grade Ethernet connectivity

n Additional manage-ment (Simple Network Management Protocol [SNMP]) for HA redundancy

PowerThe 1U-based platform also utilizes integrated AC power supply units usually the standard for the data center and enter-prise environments AC will increase the pro-viderrsquos OPEX in the long term since the power consumption per rack is significantly higher and

Figure 1

requires additional support equipment such as an Uninterruptible Power Supply (UPS) and an AC to DC converter per rack space and ultimately per CPU These factors along with the requirements for carrier-grade functionality HA support and a more favorable long-term OPEX further reduce the need to consider the 1U solution for HSS deployments in Central Office networks

ManageabilityAdvancedTCA chassis-level management is based on the industry-standard Intelligent Platform Management Interface (IPMI) IPMI makes possible interoperability among chassis and blowers compute nodes switches and management solutions from multiple vendors enabling these elements to work together seamlessly The resulting successful inter-blade communication for applications including failover and clustering provides full manageability on a per shelf and per bay basis

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One of the primary goals of the AdvancedTCA specification is to ensure a very low Mean Time to Repair (MTTR) and high Mean Time Between Failures (MTBF) There are no active components in the backplane ndash which can translate to expensive repairs in the field In addi-tion AdvancedTCA specifies that all com-ponents can be hot swappable in the field and the architecture provides redundancy at all levels This hot swap capability translates to less downtime for field replacement on a per CPU blade basis as compared to 1U PCI

SummaryAdvancedTCA provides an ideal platform and meets the technical requirements for deploying flexible and scalable IMS HSS applications While other platform archi-tectures such as 1U rack-mount servers may with considerable difficulty be able to deliver HSS capabilities AdvancedTCA offers a much more advantageous solution by providing a smaller footprint improved cooling and thermal characteristics bet-ter scalability enhanced interconnectivity and easier manageability This all contrib-utes to making AdvancedTCA a lower cost approach in terms of CAPEX and OPEX for long-term subscriber growth

1U PCI rack-mount servers are not considered to be the optimal hardware platform for HSS applications in a Central Office With its limitation for carrier-grade flexibility and HA functionality the 1U PCI platform is best suited for a full range of other enterprise and Internet infrastructure applications within a data center environment that does not require any significant flexibility and HA functionality around it It might also be a good entrance point for other enterprise applications with lower price points

The use of AdvancedTCA-based platforms enables TEMs to shift away from hardware development and refocus their efforts on delivering value-added software and services As a result they can realize lower development costs and faster time-to-market enabling increased flexibility with each product design through the use and reuse of standardized off-the-shelf components Equally significant are the advantages that can be realized by the service provider With a common platform and a flexible architecture that maximizes limited floor space service providers can rapidly and flexibly implement a broad range of feature-rich solutions for faster profitability

Sven Freudenfeld is responsible for North American Business Development for the Kontron AG line of AdvancedTCA AMC MicroTCA and Pre-Integrated Solutions Sven possesses more than 15 years of experience with voice data and wireless com-munications having worked extensively with Nortel Networks in Systems Engineering Sanmina-SCI in Test Engineeringand Deutsche Telekom in Network Engineering Sven holdsan electrical engineering degree from Germany and is also Chair of the CP-TA marketing workgroup focusing on the interoperability of COTS standard building blocks

Kontron bull svenfreudenfeldcakontroncom bull wwwkontroncom

Fo Sin Pnt

Fo Sin Pnt

TECHNOLOGY g BACkpLANES

Increasing demand for service and multimedia features is stimulating a growing need for speed in telecom-munications equipment While some

applications such as PBX systems can be addressed with the gigabit backplane technologies currently available others are running out of headroom Routers may soon need 10 Gbps and higher speed back-planes to keep up with network demand Many such applications can justify the expense of moving to higher performance if it becomes available

Currently telecom system designs offer backplanes that can handle interconnec-tions running as fast as 3125 Gbps raw data throughput per lane (with around a maxi-mum data rate capability of 5-625 Gbps per lane) The AdvancedTCA standard for instance uses Ethernetrsquos XAUI inter-face AdvancedTCA achieves a 10 Gbps net data rate by running four serial lanes for each interconnection with each lanersquos

SERrializerDESerializer (SERDES) op-erating at 3125 Gbps raw data (25 Gbs net)

As demand forces systems to move beyond these rates however new technologies will be needed One proposal calls for the use of XAUI+ or double XAUI which increases lane SERDES rates to 625 Gbps per lane and hence the throughput to 20 Gbps Another proposal is to use IEEE 8023ap known as 10GBASE-KR which runs a single SERDES lane at 125 Gbps raw data rate (103 Gbps net) But these are only short-term answers To address future demands organizations such as the Institute of Electrical and Electronic Engineers Standards Association (IEEE-SA) are developing specifications for Ethernet speeds of 40 Gbps to 100 Gbps which will be applied to backplane interconnect

Such high clock rates however will pose significant design challenges for developers

One of the first challenges that will need resolution is the design and layout of the backplane and other PCBs Common design practice today readily handles board clock rates of around 10 Gbps Well established design rules are in place and board layout tools such as autorouters can automatically handle board designs for speeds in the 10 Gbps range Designers may use specialized board material create additional ground planes and perform similar tasks in order to ensure proper board operation at the higher end but even speeds to 5 GHz are within current design tool capabilities

Design gets trickierAbove 5 GHz however board design gets more involved because feature dimensions become significant when compared to the signalrsquos wavelengths Variations in board thickness can affect signal propagation Corners where traces change direction and small spurs along edges of poorly etched

Channel characteristics

challenge backplane interoperability

Serial backplanes in telecommunications systems aim for high speed with room for

growth As systems began using 10 Gbps links however issues arose that affected backplane

communications among cards from different manufacturers Stuart points out that the

industry must define key backplane channel characteristics so that designs based on open

standards maintain interoperability as backplane speeds move to 40 Gbps and beyond

By Stuart JamieSon

Fo Sin Pnt

traces can act as antennae for the higher fre-quencies in digital signals As can be seen in Figure 1 sharp corners and minor flaws that are inconsequential at lower frequen-cies have the potential to become trouble-some antennae at future high speeds This can result in the trace radiating away the signalrsquos high frequency energy increasing EMI and crosstalk as well as altering signal waveforms New routing design rules such as making corners 30deg instead of 45deg and more careful board fabrication techniques may become necessary as designs move above the 10 Gbps per lane threshold

The move to higher frequencies will affect more than board fabrication and layout however Higher frequencies will also impose new requirements on signal tim-ing signal rise-time electrical distance and waveform shape if developers are to retain the mix-and-match system design approach that makes standards-based system design effective

For interoperability to be achievable at data rates above 10 Gbps organizations such as PICMG will need to carefully define a vari-ety of signal and design parameters in their specifications Some of the key parameters that will need consideration include

n Interconnect signal attenuationn Eye diagramn Jittern Input clock recoveryn Chip inputoutput pre-emphasis (PE) n Equalization (EQ)

Even slight variations in these parameters from device to device and lane to lane can shift the timing of signals a significant fraction of a clock cycle and affect the Bit Error Rate (BER) of a lanechannel Finally signal rise times will require tight control as signal rates increase in order to ensure control of system timing (see Figure 2)

In defining signal and design parameters specifications will also need to account for the increased location dependency that comes with higher frequencies Even subtle differences in attributes such as routing length and trace impedance become increasingly significant as signal speeds rise To ensure mix-and-match interopera-bility then design specifications may need to account for the specific backplane slot that a board is to occupy as well as introduce a method to obtain and control the PE and EQ of the devices connected to the lanes

Designers must also address fabrication standards The material used to fabricate

Figure 1

Figure 2

Fo Sin Pnt

the board the thickness and composition of metal cladding and the spacing between layers can all affect the trace characteris-tics Controlling these parameters under specification ensures that timing charac-teristics are sufficiently uniform from one board to another However current speci-fications are too detailed and stringent It is extremely difficult to attain compliance yet avoid adding cost to the design

Specifications need workSome of these parameters are already incorporated into current specifications The AMC module specifications from PICMG for instance include design parameters that ensure its proper opera-tion at signal speeds as fast as 125 Gbps per lane Establishing specifications for other system components will help achieve interoperability of standards-based designs at higher frequencies

Design tools may also need to be modified and the industry will need to create new design rules for high frequency and incor-porate these into the tools Developing new routing techniques will help avoid the issues of electrical phenomena such as skin effect dielectric loss and impedance mismatches These are much more preva-lent at higher frequencies and it becomes critical for engineers to model and simu-late these phenomena more accurately

Early efforts are already underway to address the challenges that higher fre-quency signals bring to standards-based design The Interconnect Channel Characterization Subcommittee of PICMG established in September 2006 is develop-ing ground rules and definitions to be used in characterizing transmission reflection and crosstalk performance in backplane and mezzanine carrier interconnects The committee aims to define the channel parameters to be measured or analyzed as well as the methods for doing so Its charter calls for it to address

n Definition of interfaces at which measurements are made or characteristics computed

n Test equipment fixtures and PCB test coupons

n Details of measurement proceduren Data formatsn Techniques for de-embedding

components of the channeln Techniques for validating

measurement based models ie passivity and causality

n Definitions that allow reasonable compliance testing

n Boundary definitions for different paths

n Define information regarding limita-tions or proper usage ie maximum data raterise times that are supported by the models

Such efforts are only a beginning how-ever Other design details still need to be addressed such as SERDES IO Configuration New functionality may need to be defined The design of high data rate system channel interfaces according to standardsspecifications does not currently cover the individual characteristics of the chip transmitterreceiver characteristics Thus work will be needed to address how such standard designs handle such dependency

Crossing an interoperability thresholdOne way of handling location dependen-cies might be to give the system control-ler the ability to inform modules what the channel transmitter and receiver PE and EQ technology is and importantly how to control it With this information along with the signal attenuation suffered (at a given bit rate) for the channel the system should be able to configure SERDES channels in different physical locations to run reliably and at the required BER In MicroTCA systems for instance this functionality could be incorporated into the MicroTCA Carrier Hub (MCH) as part of its electronic keying function Modules would have to be able to configure and control its backplane interfaces to allow for different positions

in the backplane An MCH (see Figure 3 courtesy Emerson) then would be able to instruct a module as to which parameters to use for interoperability

The specific approaches needed to handle location dependencies and other challenges that higher signal rates raise have yet to be developed The need to address these challenges however is clear Increasing demand for services is driving applications to utilize faster signal rates This in turn is driving backplane signaling speeds ever higher As speeds rise above 10 Gbps sig-nals will cross a threshold where current specifications will prove inadequate for ensuring interoperability among standards-based designs

The industry should begin developing new or enhanced specifications and design tools to address the challenges of higher signal rates Without such improvements the guarantees of interoperability that allow system developers to readily create solu-tions by combining off-the-shelf products will be compromised As backplane speeds approach 100 Gbps nothing can be taken for granted

Stuart Jamieson Director of Industry RelationsArchitect with Emerson Network Power Embedded Computing represents Emerson on PICMG committees and the SCOPE organization and previously served as a CP-TA Board member (Treasurer) He brings over 18 years of experience in hardware protocols embedded software and specification development to these groups Within Emerson he played a key role in the develop-ment of the technology central to Emersonrsquos bundled network-ing solutions Stuartrsquos positions within Emerson have included Director of Business Development Director of Advanced Technology and Architect He is the Draft Editor for the PICMG Interconnect Channel Characterization Subcommittee is the author of the introduction section for the new PICMG Ruggedized MicroTCA specification and served as the Draft Editor for the PICMG MicroTCA Specification Stuart gradu-ated from the Heriot-Watt University in 1989 with a 1st Class Honors degree in Electrical and Electronic Engineering and again in 1992 with an IBM-sponsored Master of Philosophy

Emerson Network Power Embedded ComputingStuartJamiesonEmersoncom bull wwwemersonembeddedcomputingcom

Figure 3

Fo Sin Pnt

TECHNOLOGY g BACkpLANES

2008

B A

N D

W I

D T

H

Signal integrity challenges to bandwidth scalabilityFor the purposes of this article each interconnected differential pair will be referred to as a Channel (which should not be confused with an aggregated AdvancedTCA channel comprising four trans-mit and four receive pairs)

14-slot full-mesh AdvancedTCA backplanes contain hundreds of Channels Each Channel is defined as the copper signal path from the output of a driver device to the input of a receiver device As

By douglaS Hynd

Developing IEEE 8023ap 10GBASE-KRcompliant backplanes

Why doesAdvancedTCA

need bandwidthscalability

PICMG AdvancedTCA 30 has emerged as the

industryrsquos Hardware Platform standard of choice and

is enjoying first-phase deployment However many

believe that for AdvancedTCA to realize its market

potential AdvancedTCA platforms need to seamlessly

scale to accommodate 40 GbE fabrics thereby

avoiding forklift upgrades as system bandwidth

demands increase over time A 40 GbE switch fabric

architecture would enable realization of a common

platform for computing storage control and media

and packet processing and provide the versatility and

long term ROI required by service providers in

todayrsquos increasingly competitive environment

The challenge was to develop a family of

AdvancedTCA products which feature PICMG 30

compliant dual star and full mesh advanced

backplane switch fabrics enabled up to 10 Gbps

per differential signal pair thereby giving 40 Gbps

per AdvancedTCA channel performance

This article describes the signal integrity challenges

presented in designing an IEEE 8023ap

10GBASE-KR-compliant bandwidth-scalable

14-slot AdvancedTCA platform and how these

challenges were overcome in development of full

mesh and dual star backplane reference designs

Fo Sin Pnt

shown in Figure 1 that signal path comprises a signal launch a blade PCB transmission line a daughtercard via a right-angled HM-ZD connector a mated HM-ZD backplane header a back-plane via a length of backplane PCB transmission line and then the same combination of connectors vias and transmission line at the receive end of the Channel

Sources of crosstalkFour principal sources of crosstalk in each Channel must be man-aged as shown in Table 2 Source number one is between adjacent differential pairs as they are routed across the backplane Common mode noise rejection in system differential pair structures makes this a minor issue The second source of crosstalk lies in the HM-ZD connector itself

Crosstalk in via fields our third source primarily arises from inductive coupling between adjacent differential pairs and domi-nates the crosstalk agenda in high-speed Channels This source of crosstalk is directly proportional to the length of the via barrel and where practical care must be taken to ensure that adjacent connector rows are terminated to different target routing Layers

The final source of crosstalk is caused by aggressor signals in through-routed via fields coupling with victim Channel traces as they pass through As mentioned earlier judicious and careful design can mitigate this impact

Skew Channel skew is a function of differential transmission path geometries At a fundamental frequency of 5 GHz skew can be a significant issue in high-speed system design due to narrowing the eye opening and increasing jitter Skew can have a significant impact on crosstalk it negatively impacts the common mode rejection of noise inherent to differential signaling Conductor surface roughness in lower performing dielectric materials can also cause skew in high-speed systems

Skew can be avoided through careful management of transmission path lengths in each Channel and by using higher-glass content (lower Dk) laminates

LossPotential

Potential Mismatches

Channel

Loss Potential Channel

PCB Tolerance -025 dB 2 -01 dB

Connector Tolerance -001 dB 4 -016 dB

Thru-routed Via Fields -001 dB 12 -144 dB

Connector Launch -025 dB+ 4 - 2 dB+

Quantity TotalNEXT

TotalFEXT

PCB Transmission Lines

24 in60 cm

-50 dB -70 dB

Connector Architecture 2 -26 dB -24 dB

Via Fields 4 -22 dB -20 dB

Connector Pass Through 8 -34 dB ndash34 dB

For the target application each one of these Channels must deliver a 10 Gbps Non-Return-To-Zero (NRZ) signal with sufficient signal fidelity to enable a receiver device to detect and process a differential signal The PICMG 30 specification is targeted at 3125 Gbps signaling with a fundamental frequency of 156 GHz Even in low loss dielectric materials insertion loss at 10 Gbps (5 GHz fundamental) is twice that of a 3125 Gbps signal

Therefore achieving acceptable signal fidelity requires careful management of signal losses and noise in each Channel such that an acceptable signal-to-noise (SN) ratio is achieved at the receiver

The design process therefore begins by understanding and mitigat-ing the sources of losses and noise in each Channel

Sources of lossThere are three sources of loss

n Conductor losses which are due to skin effects and can be addressed by maximizing the cross sectional area of the signal traces

n Material dispersion losses which are a function of the dielectric constants of the chosen material These can be mitigated by choosing a higher performance laminate material such as Nelco 4000-13SI or Megtron

n Reflected power loss due to impedance mismatches in the Channel as each signal transitions across the different copper media in each channel (connectors vias and PCB traces) and passes through the pad and anti-pad structures of the via fields of other backplane blade slots

Table 1 shows the relative effects of different sources of impedance mismatches The dominant source of impedance mismatches in every Channel resides in the via structures Successful mitigation of this problem requires that every via is tuned by back-drilling the stub and adjusting the pad and anti-pad structures to match the impedance to be 50 ohms irrespective of the target routing layer This in turn requires that the capacitive and inductive effects of the connector pin and via barrel combination are taken into account during the design of each Channel

Further complicating via design is the space the anti-pad structures need to accommodate Channels being routed between other blades while minimizing electro-magnetic coupling with them This space consideration makes the shape and orientation of pads and anti-pads extremely important

Figure 1

Table 1

Table 2

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IEEE 8023ap provides a design targetAs Ethernet has emerged as the industryrsquos dominant signaling methodology the IEEE has developed the 10GBASE-KR norma-tive Channel model to define interconnect Channel performance for NRZ signaling at 10 Gbps This standard defines acceptable performance in terms of S-parameter charts for through-Channel insertion loss and worst-case crosstalk Figures 2a and 2b illustrate masks for Draft 24 of the standard that was initially used for this exercise

In each case the mask defining compliant performance is shown in blue Channel insertion loss is shown in red in Figure 2a Crosstalk performance is defined by the ICR curve (Figure 2b) Minimum acceptable Channel performance is defined in the ICR chart (Figure 2b) by the blue line The effect of the sum of all aggressors on the through-Channel is shown in red The green ICR curve is the ratio of the crosstalk power sum calculated by summing the

magnitudes of any impacting crosstalk Channels for each fre-quency and using a straight line fit (using least-squares method) to determine the resulting average effect f the aggressors on the through-Channel This is then overlaid on the insertion loss and used to plot the ICR curve

This standard which has evolved through a variety of iterations forms the basis for developing a 40 GbE switch fabric backplane featuring 10 Gbps NRZ differential pairs If all differential pairs can meet this standard then the backplane can be considered to be 10GBASE-KR compliant

Applying 10GBASE-KR to a 14-slotAdvancedTCA applicationThe PICMG specification dictates that receive differential pairs are placed on the c-d and g-h rows of the HM-ZD connector and that transmit differential pairs are placed on the a-b and e-f rows Therefore the middle differential pair in row c-d of Slot B will be subject to the NEXT of three aggressors in each of the a-b and e-f transmit rows of slot B plus the FEXT of the signals being received in the c-d pairs in the top and bottom of slot B

In this topology it can be seen that worst-case crosstalk would occur if all the NEXT and FEXT aggressors were routed on the bottom Layer that is on the same Layer as that of the victim c-d However given that all signal vias must be back-drilled and tuned for impedance management purposes Channel crosstalk can simultaneously be reduced by allocating different routing Layers to differential pairs terminated in the same backplane connector

The principal factor in determining the feasibility of a 10GBASE-KR compliant backplane is based on understanding whether the Channel with the worst-case signal-to-noise ratio is compliant

The skew targets determine permissible layer separation between a-b c-d e-f and g-h pairs within each Channel and enable routing Layers to be allocated for each pair It is now possible to start the process of via tuning to optimize the channel performance for minimum insertion loss Modeling begins by defining the simulation boundaries for the channel so that Channel component models (PCB traces connectors vias) can easily be aggregated to model complete Channels Boundaries must be established at locations in the Channel where linear 3D structures exist These are shown in Figure 3 (next page)

Since the connector and via combinations for the backplane and daughtercard mating halves must each be treated as a whole it

PICMG 30Spec

TurboFabricSpec

Total Inter-PairSkew

(Fabric Interface)

05 mm in FR4(34 ps)

001 mmin N4000-13si

(00625 ps)

Total Intra-Channel Skew

(Fabric Interface)

254 mm in FR4(17 ps)

plusmn01 mmin N4000-13si

(0625ps)

Total Intra-Channel Skew

(Base Interface)

135 mm in FR4(90 ps)

plusmn01 mmin N4000-13si

(0625 ps)

Figures 2a and 2b

Table 3

Determining which Channel that is and identifying the worst-case SN requires making trade-offs with regard to PCB material Channel length via design connector row selection and NEXT and FEXT aggressor routing choices These trade-off choices can only take place using advanced 3D simulation tools such as Ansoft HFSS This was the essence of the design process employed in developing Simclarrsquos TurboFabric backplanes

The simulation processThe transmission length for full mesh and dual star backplanes design implementations varies from a maximum of 1632 inches to a minimum of 116 inches With an effective transmission length of 5 inches on each daughtercard this makes the longest effective Channel 2632 inches including two connectors

For a 10GBASE-KR application over this distance a high-perfor-mance laminate is essential for both reducing insertion loss and

ensuring high glass content in the weave to mitigate skew So the design process began by choosing a low-loss dielectric material (Nelco 4000-13SI for both the backplane and the daugh-tercards) and establishing targets for Inter-Pair and Intra-Channel skew as shown in Table 3

Adhering to the PICMG 30 specifi-cation for skew in a 10GBASE-KR application is impractical Instead a target of 00625 ps was set for Inter-Pair skew with 0625 ps set for Intra-Pair skew for the backplane only This equated to a maximum 001 mm differ-

ence being allowed between traces of any differential pair and 01 mm being permitted between traces of any four differential pairs in a Channel Given the topology of the HM-ZD connector daughter-card skew must be accounted for in the daughtercard layout Fo

Sin Pnt

should be noted that the simulation boundary is located within the mated connector

Tuning the connector and via structures to 50Ω is an iterative process involving the removal of excess pads back-drilling and tuning pads anti-pads and traces A Time Domain Reflectometer (TDR) plot illustrating the results of the tuning process is shown in Figure 4

Upon completion of the modeling process a total of 17 different optimized via and routing configurations had been designed for the full mesh design and nine for the dual star design

A plot of worst-case insertion loss is shown in Figure 5 and demonstrates that in both cases performance is well above the 10GBASE-KR mask

When all the through-Channels have been modeled adjacent Channel models can be combined and ICR curves plotted to evaluate the impact of crosstalk on through-Channel performance This valuable information can be used to adjust the position of signal Layers relative to pass-through aggressor traces on adjacent Layers or to reroute traces to reduce crosstalk Similarly routing Layers can be changed to reduce crosstalk in adjacent via barrels

Figure 6 plots worst-case ICR and demonstrates that performance is above the 10GBASE-KR mask Based on this result it was possible to proceed to physical implementation

Figure 3

Figure 4

Fo Sin Pnt

Physical realizationThe layout process was performed using the Mentor Board-Station CAD system Quad-routing (routing four traces between pads) was explored as a routing method-ology in order to reduce Layer count but this was dismissed due to the detrimental impact on crosstalk performance

The attributes of the physical backplanes produced as a result of the design effort are shown in Table 4

The design files produced included the usual gerber files plus detailed back-drilling instructions

The design validation process comprised a conventional continuity test followed by performance testing featuring Agilent equipment including 70340A signal generator 8720ES Network Analyzer NN18A S-Parameter test-set and 86100A sampling oscilloscope with Agilent 86112A module Figure 7 (next page) shows the test set up

Simclar developed special line cards to enable through-Channel measurements with and without crosstalk The signal launch featured compression mount SMAs terminated in a tuned via structure The Channel simulations included simu-lation of the tuned launch structures so de-embedding of the launches was not necessary for correlation to simulation purposes The development team also established a process for characterization of all Channels

Full Mesh Dual Star

Layer Count 34 18

Aspect Ratio 121 61

Tuned Vias 3952 768

Material Nelco 4000-13SI

Table 4

Figure 5 Figure 6

Fo Sin Pnt

In Figure 8 measured through-Channel performance and ICR curves are shown for the same Channels described in the simula-tion section earlier

As can be seen from Figure 8 there is close correlation between these and the simulated plots in Figures 5 and 6 In fact close correlation between all simulated and measured results was achieved resulting in a 728 Tbps capacity full mesh and a 960 Gbps capacity dual star backplane design now generally available as part of the Simclar TurboFabric shelf

Figure 7 Figure 8

Figure 9

Figure 10

Implications of 10GBASE-KR Draft 33versus Draft 25The work described above was targeted towards meeting the Channels specifications contained in Draft 25 of the IEEE 10GBASE-KR Since this work was completed the IEEE has up-issued the Draft revision level for the Standard from 25 to 33 While this has not impacted through-Channel performance demands it has increased Channel isolation requirements by around 10 dB In Figure 9 a Draft 33 mask is added to the ICR plot shown in Figure 8

From Figure 9 it can be seen how Draft 33 pulls the mask above the Channel ICR curve for this full mesh backplane Channel Surprisingly it is the Channelrsquos frequency response at relatively low frequencies between 100-500 MHz that is causing a problem The reasons for this are currently the subject of further detailed investigation

However Figure 10 shows a Draft 33 plot for a less demanding dual star AdvancedTCA implementation featuring shorter trans-mission distances This plot demonstrates compliance to Draft 33 of the IEEE 8023ap 10GBASE-KR Standard

ConclusionBy developing a close understanding of the many factors contrib-uting to loss and noise in multi-gigabit backplane Channels it is possible to characterize their performance using advanced simula-tion techniques and correlate that performance in physical prod-ucts using advanced test methods By overlaying the test results on S-Parameter masks defined by the IEEE 8023ap 10GBASE-KR Standard it has been demonstrated that backplanes that truly enable AdvancedTCA scalability are at last a reality

Douglas Hynd joined Simclar Group in 2006 as Director of Marketing as part of Simclarrsquos acquisition of Northrop Grumman Interconnect Technologies Division wherehe was Vice President of Marketing and Sales He has more than 24 yearsrsquo experience intechnology sales marketing and generalmanagement and holds a BSc (Eng) in Electronics and Electrical Engineeringfrom the University of Glasgow He isbased at Simclarrsquos Global HQ inDunfermline Scotland

Simclar Groupdouglashyndsimclarcom bull wwwsimclarcom

Fo Sin Pnt

6U CompactPCIPrOduCT GuIdE g

This monthrsquos issue includes a 6U CompactPCI Product Guide and Irsquod like to take the opportunity to reflect a bit on the success and evolution of that technology

Back in the 1994 time frame when CompactPCI was first being devel-oped it began as 3U-only technology It used the same Eurocardmechanics that were popularized by VME and an IEC standardized high-

density high-speed connector available from a number of vendors suitablefor 33 MHz PCI signaling That connector was selected by the engineers atZiatech with help from Mike Munroe then at ERNI The majority of VMEdesigns were 6U and based on this I was among a number of folks thatargued for adding the 6U CompactPCI form factor

The 6U form factor presented some challenges and opportunities Onechallenge was that the insertion and extraction forces were quite high when the entire rear of the card was populated with connectors Fortunately the IEEE standards for Eurocards evolved and injectorejector handles that pro-vided leverage became available Eike Waltz then at Rittal was instrumental in bringing that to the table Two of the opportunities that came along withthe extra connectors were a clean way to add secondary buses like the H110 telephony bus to the backplane and the ability to route IO out the rear through rear transition modules PICMG has developed quite a number of subsidiary specifications defining the interoperable use of the extra backplane pins made possible with the 6U form factor Both of these features have played a major part in CompactPCIrsquos success The next major evolution of 6U CompactPCI came with the PICMG 216 Packet Switched Backplane standard which was originally conceived by John Peters and his team at Performance Technologies PICMG 216 interconnected a shelf full of CompactPCI single board computers via redundant Ethernet switches also in the 6U CompactPCI form factor This dramatically increased usable backplane bandwidth and provided redundancy PICMG 216 paved the way for AdvancedTCA and was the industryrsquos first open standard for the switched serial interconnect standards we see popping up in many places

By Joe Pavlat

Looking back and ahead at6U CompactPCI

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Recent 6U CompactPCI related products are listed here For more informationenter the productrsquos RSC No at wwwcompactpci-systemscomrsc

cPCI-6910Dual-core Intel Xeon Processor LVULV Universal blade bull Supports Single Dual-Core Intel Xeon LV or ULV processorsbull Front Side Bus 667 MHz bull Up to 2 GB DDR2 400 MHz soldered SDRAM with ECC bull Four PCI Express GbEbull Up to 4 USB 20 ports bull PICMG 20 21 29 216 compliant

RSC No 35013

ADLINK Technologywwwadlinktechcom

CPCIStor Module6U CompactPCI storage blade bull Onboard ATA controller supports CDDVD HDD and solid-state flashbull Supports Hot Swap Removal (ask about RAID support) bull ATA disks available in Enhanced Dutycycle versions for NEBS Level 3 - 724 requirements bull Operating Systems supported VxWorksLinux and Windows

RSC No 34800

ACTTechnicowwwacttechnicocom

Prosody X cPCI E1T1An E1T1 digital network access card bull Suits telco developers and systems integrators bull Uses Aculabrsquos worldwide protocol coverage including Aculabrsquos SS7 stack available under a cost free license bull Available with 8 or 16 E1T1 trunks and software selectable E1T1 interfaces bull Flexible mix of protocols including ISDN CAS and SS7 (ITU-T China and ANSI) bull A variety of interconnect switching and protocol conversion solutions can be readily crafted bull High availability reliability and scalability with industry standard hardw re and software interoperability bull Up to 128 SS7 signaling links bull Non-circuit related (TCAP) messagingintensive applications such as prepaid and SMS

RSC No 35408

Aculabwwwaculabcom

Adexp8021Intel Core Duo L2400 (166 GHz) w E7520 server chipset bull Dual channel PC2-3200 Registered RAM SECDED or x4 SDDC bull Two GbE two Serial ATA four USB 20 bull Onboard SXGA graphics 1280 x 24-bitbull 6U CompactPCI Bus PICMG EXP0 R10 Specification bull RoHS compliant 0 degC to +55 degC operating range

RSC No 32837

Advanet Incwwwadvanetcojpen

TC84012 channel single-stop Time-to-Digital Converter (TDC) with single-start and multi-start acquisition modes bull 50 ps timing resolution bull Wide range with upto 20 s between first and last events bull Large internal memory buffer with up to 512 hits per channel bull Low jitter (lt3 ps rms) high stability (plusmn2 ppm) internalclock source bull External 10 MHz reference input bull FPGA based Data Processing Unit (DPU) bull Fast readout with DMA mode for increased data throughputbull Overvoltage-protected inputs with 50 Ω K-Lock (LEMO) connectors bull Built-in self calibration bull Modular single-slot 6U PXICompactPCI standardbull Low power consumption (lt22 W)

RSC No 33445

Agilent-Acqiriswwwacqiriscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

MIC-30428-slot 6U CompactPCI backplane bull AC or DC CompactPCI 500 W + 250 W redundant(2+1) power supplies bull PICMG 216 (CompactPCI Packet Switching Backplane) compliancebull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarmmodule (MIC-3924L-AE)

RSC No 32851

MIC-30436-slot 6U CompactPCI backplane bull Supports two hot-swappable SCSISATA or removableIDE HDD bays bull Built-in IDE slim-type DVD-ROM bull AC or DC CompactPCI 250 W + 250 Wredundant (1+1) power supplies bull Supports hot-swappable fan modules bull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarm module (MIC-3924L-AE)

RSC No 32850

Advantech Corporationwwwadvantechcom

Dual-Core Xeon CompactPCI SBCModel PP 42123x bull Dual CPU 6U CompactPCI SBC supporting two dual-core Xeon CPUs bull Up to 8 GB DDR2 ECC SDRAM in a single system or peripheralslot bull Dual processor SBC in a single 6U CompactPCI slot bull Supports two 166 GHz Dual-Core Intel Xeon ULV processors using Intel E7520 server chipsetbull Up to 8 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull PMCXMC site support 66 MHz PCI-X and x8 PCI Express bull Front and rear IO bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade bull Four GbE ports with option for PICMG 216

RSC No 34761

6U CompactPCI Core 2 Duo SBCModel PP 41203x bull 6U CompactPCI Core 2 Duo SBC supporting two PMC sites includingone XMC site bull Up to 4 GB DDR2 ECC SDRAM bull All in a single system or peripheral slot bull TwoPMC sites supporting up to 100 MHz PCI-X bull One XMC x8 PCI Express bull Front and rear IObull Supports 216 GHz or 15 GHz Intel Core 2 Duo processors bull Intel E7520 server chipsetbull Up to 4 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade

RSC No 34763

PP 30202xTwo processor versions available bull 18 GHz Intel Pentium M processor 745 uses mFC-PGA 478 (micro Flip-Chip Pin Grid Array) package bull 14 GHz Intel Pentium M processor Low Voltage 738uses mFC-BGA 479 (micro Flip-Chip Ball Grid Array) package bull 64 KB primary (L1) on-die cache2 MB of secondary (L2) on-die cache bull 400 MHz Front Side Bus (FSB) bull No CPU fan bull 16 GHz processor version (1 MB L2 cache) available see PP 30002x datasheet bull Utilizes 64-bitIntel 855GME chipset bull Supports 400 MHz bus frequency bull Uses Intel 6300ESB IO Controller Hub

RSC No 32659

Concurrent Technologies Incwwwgocctcom

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PrOduCT GuIdE6U CompactPCI

cCIBPMC6U-ETA 6U bridged dual PMC carrier that bridges extended temperature CompactPCI boards and PMCs bull Features a rugged CompactPCI form factor providing increased flexibility to military communications systems designers bull Provides additional design choices to users through its differing bus speeds maximizing the numberof PMCs that can be used CompactPCI andPMC buses can both run at 66 or 33 MHzbull Operating temperature range of -40 degC to+85 degC bull Signal conditioning bull DMA supportbull Low-power design +5 V +33 V +12 V -12 V bull User-selectable VIO of 33 V or 5 V to the PMC

RSC No 32891

Dynamic Engineeringwwwdynengcom

cPCI4IP-MMMinimized PCI address footprint IndustryPack carrier for CompactPCI applications bull 6U 4HP4 IP positions 832 clock selection for each slot fused filtered power IO options bull ID INT IO and Mem spaces are decoded for each IP slotbull Single and double wide IPrsquos bull 16- and 32- bit IPs bull 32-bit access to 16-bit IPs bull Full or mini-mized Memory Space decoding for 18 the PCI address requirement bull With the cPCI4IP-MM option 8 CompactPCI 4IP cards take the same PCI address space as 1 full Mem Space card

RSC No 34905

ACQ132CPCI32 channel MHz class simultaneous sampling intelligent digitizer bull 32 simultaneous analoginput channels 2-32 MSpschannel 14-bit resolution bull Differential inputs bull Intelligent cardwith 1 gigabyte memory and GbE on board bull Large distributed FPGA resource on boardbull Range of DSP functions including FIR filtering and Digital Downconverter

RSC No 35482

D-TACQ Solutions Ltdwwwd-tacqcouk

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CR11Based on the Intel Core Duo Processor the platform is designed to support processor speeds from 106 GHz up to 20 GHz bull Intel Core 2 Duo runs at 15 GHz up to 20 GHz bull Conduction cooled bull Two PMC slots bull PCI Express bull 2x GbE

RSC No 33156

ICS-72532-channel 6U CompactPCI DAC board bull 6U CompactPCI data acquisition card bull 32 differential output channels bull 16 or 24-bit sample size bull 288 kHzch data rate bull Simultaneous sampling across all channels on single or multiple boards bull 32 separate delta-sigma DACs bull 64-bit 66 MHz CompactPCI PICMG 20 Rev30 hot-swappable bull FPDP II 400 MBps interface

RSC No 33576

ICS-71032-channel 6U CompactPCI ADC board bull 6U CompactPCI data acquisition card bull 32 differential input channels bull 216 KHzch 24-bit resolution bull Software selectable full scale input bull FPDP II 400 MBpsinterface bull 64-bit 66 MHz CompactPCI PICMG 20 Rev 30 hot swappable bull 32 synchronous boards for simultaneous sampling bull Sonar acoustics and test and measurement applications

RSC No 33578

Tsumani 6U CPCI Development KitFPGA processor solution targeted at high performance software defined radio applications bull Dual Stratix EP1S80 FPGAs are tightly coupled to provide apower platform for signal processing bull Two PMC module sites provide IO connectivity to either front panel or back panel connections bull A direct highbandwidth 1 GBps path from the PMC P4 connector directly to the FPGAs bull Model 919 Dual DAC Mezzanine provides broadband analog signal generationin a compact form bull The board features two independent DAC channels each with its own 12-bit LVDS input capable of running at rates up to 160 MHz

RSC No 32026

CP11Rugged 6U SBC bull Up to 4 GB of DDR2 SDRAM (200 MHz) with enhanced ECC four independent onboard PCI buses system host and peripheral modesupport for the CompactPCI backplane two PMC interfaces (64-bit133 MHz and 32-bit33 MHz) bull Instead of the PMC1 a PCI Express based XMC interface is available on request bull Two GbE one Fast Ethernet two serial interfaces (RS-232 or RS-422485) USB 20 integrated HDD or flash drive bull High performance 2D3D ATI video controller capable of driving two displays in parallel supports VGADVI interface bull Intel Core 2 Duo at 216 GHz Intel Core Duo at 20 GHz2x PMC expansion site bull One XMC optional bull Up to 4 GB DDR2 SDRAM wECC 2x GbE

RSC No 33447

GE Fanuc Intelligent Platforms Incwwwgefanucembeddedcom

Single Board ComputersGD Canada designs and manufactures conduction-cooled Single Board Computers (SBCs)using Intel processors bull 6U and 3U form factors for CompactPCI backplanes bull Fully backward compatible with earlier models bull Upgradeable via the change-out of processor memory andIO modules bull Used within GD Canada computer systems and sold as individual products

RSC No 35281

General Dynamicswwwgdcanadacom

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PrOduCT GuIdE6U CompactPCI

cPCI6U-24DSI32R32-channel 24-bit delta-sigma CompactPCI 6U analog input board with rear IO bull Low noise 24-bit resolution low phase distortion andmulti-board synchronization bull Suits state-of-the-art sonar and noise monitoring applications bull 32-channel cPCI6U-24DSI32 analog input boardprovides a high-density 24-bit analog input resources on a standard 6U CompactPCI expansion board bull Applications from precision voltagemeasurements to complex audio signal and waveform analysis

RSC No 34985

General Standards Corporationwwwgeneralstandardscom

Duet 3U 64-bit 1 GHz TMS320C6416 DSP (x2) 64 MB SDRAM per processor bull Flexible internalexternalcommunication mesh bull 64-bit66 MHz CompactPCI bull PMCXMC site with Jn4 to FPGA and4 RocketIO per VITA 42 bull External data port up to 12 Gbps bull 4M or 5M Virtex-II Pro FPGAbull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM dedicated800 MBps links between DSPs bull 3U CompactPCI with PXI support bull Suits high-end co-processing wireless broadband communications RADAR video and biometrics

RSC No 32856

QuadiaQuad-DSP bull Dual FPGA bull Dual PMC sites bull Inter-processor connectivity and access to external interfaces bull Four C6416 DSPs split in two independent clusters each hosting a PMC site bull One large FPGA for end-user code bull Central FPGA routing interprocessor communication bull End-user FPGA communication bull External port serial IO for PCIe or other p ivate link bull Global memoryand PCI interface bull 1 GHz TMS320C6416 DSP (x4) bull 64 MB SDRAM per processor bull Flexible internalexternal communication mesh bull 64-bit66 MHz CompactPCI bull Two PMC sites with Jn4 to FPGA bull External data port up to 12 Gbps bull Two 4M Gate FPGA reserved for end-user code bull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM bull Up to 512 MB Global DDR SDRAM bull Suits high-end co-processing wireless and broadband communications

RSC No 34737

Quixote 64-bit 6UAdvanced signal capture generation and co-processing bull 1 GHz TMS320C6416 DSP and2 to 6 MGATE Virtex-II FPGA bull 32 MB SDRAM 8 MB ZBT SBSRAM and AD6645 and AD9764 converters bull 6432 bit CompactPCI 66 MHz 5 V33 V and complex trigger modes with HW event logging bull PMC site with Jn4 to FPGA DIO and PICMG 217 StarFabric compliant bull Suits Software Defined Radio wireless IP and RADAR development and hardware testing bull Physical Layer field testing ultra-fast flexible data acquisition vector signal generation and electronic warfare

RSC No 32861

Innovative Integrationwwwinnovative-dspcom

IC-e6-cPCIbHigh performance 6U CompactPCI board bull Powered by one or two of Freescalersquos mostadvanced 14 GHz MPC7448 PowerPC processors bull PICMG 216 compliant bull Marvell Discovery III chipset (MV64460) bull Low power consumption bull Standard extended and rugged grades

RSC No 32982

Interface Conceptwwwinterfaceconceptcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CP213Single-width 6U CompactPCIPXI module with either 32 or 64 differential analog input channelsbull 32 64 or 128 channels of analog input bull 16 multifunction digital IO (TTL) channels that may beconfigured as digital in digital out or selectively attached to 2 frequency in 2 counter in andor 2 timerout channels bull 16-bit resolution bull Programmable gain per channel programmable scan rates of lt1 Ss through 100 KSs bull Precision onboard reference for end-to-end calibration

RSC No 34804

KineticSystems Company LLCwwwkscorpcom

CP6001Energy efficient embedded Intel dual core processors bull 12 GHz Intel Core Duo U2500 ULV processor bull Intel Core 2 Duo L7400 LV processor bull Based on the Intel Mobile 945GM chipset with a front side bus of up to 667 MHz and ICH7-R Southbridge bull Two independent digital video outputs to the rear IO (2x DVI - 1x DVI and 1x HDMI) bull AC97 audio capabilities bull 3 x GbE bull 4 x SATA with RAID 01510 functionality bull 6 x USB 20 2 x COM and VGA or DVI bull Can also accommodate a PMC slot or an onboard 25 inch SATA HDD bull Up to 8 GB of USB or 2 GB soldered flash bull Supports Linux Windows XP XP embedded and VxWorks 6

RSC No 34182

CP6923 GbE Switch6U CompactPCI GbE Switch PICMG 216 compliant bull Leading edge te hnology basedon BCM5650X chip bull 24x GbE ports bull Non-blocking Layer 2 and 3 switching and routingbull Copper optical rear IO version bull Hot swap IPMI bull Fully managed bull Comprehensive firmware package bull Applies to VoIP installations such as call servers media gatewaysand trunking gateways in wireline and wireless networks as well as VoIP systems inenterprise networks with high demands on performance

RSC No 32256

Kontronwwwkontroncom

TMS320C6701 Virtex-IITexas Instrumentsrsquo C6701 DSP bull Xilinx Virtex-II series FPGA up to XC2V8000 bull Multiple IO interfaces Onboard CODEC VIM expansion sites 60-pin GPIO header and JTAG bull Hardware drivers integration in SimulinkXilinx System Generator Blocksets for quick implementation of Simulink models bull DSP and FPGA-in-the-loop cosimulation of SimulinkXilinx System Generator models bull Leading edge communication interface allowing real-time datamonitoring from Simulink scopes and remote operations

RSC No 32028

VHS-DACHigh performance multichannel DA for phased array antenna systems radarsonar communications receiversup-sampling to IF stage and RFIF AGC apps bull Eight 125 MSPS output channels bull Optional add-on daughter boardprovides 8 additional output channels or 8 additional input channels bull 32-bit 25 MHz bull FPDP interface with 400 MBps transfer rate (25 MSPS per channel at 8 channels 125 MSPS at 16 channels) bull Low level hardware drivers API andGUI bull High level hardware drivers integration in Simulink Blocksets bull Leading edge communication interface fordata recording and playback tofrom the onboard SDRAM

RSC No 32029

Lyrtechwwwlyrtechcom

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PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

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PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

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PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

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SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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Page 5: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

34 ACTTechnico ndash Networking Hardware20 Adax Inc ndash ATMIV AMC Controller45 Adax Inc ndash SS7ATM Controller39 Advantech ndash Advanced Blade Solutions7 Annapolis Micro Systems ndash Wildstar 5 for IBM Blade 43 Astek ndash Storage41 Concurrent Technologies Inc ndash Dual-Core Processors47 ELMA Electronic ndash MicroTCA Solution13 Excalibur Systems Inc ndash Mil-1553 ccVME5 GE Fanuc Intelligent Platforms ndash Software development environment3 Harting Technology Group ndash AdvancedMC Connectors17 Hendon Semiconductors ndash I2C Bus Buffer8 Interface Concept ndash Embedded Products2 Interphase ndash AdvancedTCA and MicroTCA Solutions48 Kontron ndash Open Modular Solutions9 National Instruments ndash Automated test system14 One Stop Systems Inc ndash PCIe over Cable16 Performance Technologies ndash One-Stop Shopping23 Red Rock Technologies Inc ndash Mass Storage Modules28 Rittal ndash AdvancedTCAMicroTCA40 SDR Forum ndash Call for papers21 VON ndash digiumAsterisk World19 Winchester Electronics ndash Connector Solutions29 XALYO ndash XS-AMC2

A n O p e n S y S t e m S p u b l i c A t i O n

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A D V e r T I S e r I N F o r m AT I o N

Page AdvertiserProduct description

CompactPCI reg

AdvancedTCA regand Systems

ompactPCIdvanc dTCA S

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By Joe Pavlat

CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems

EDITORrsquoS FOREWORD

Why AdvancedTCA is at home in HSS

With this first issue of 2008 (Happy New Year) our colleague Sven Freudenfeld from Kontron gives us an excellent and detailed comparison of 1U rack-mount servers and AdvancedTCA in a real application a Home Subscriber Server (HSS) He describes the application in detail and then compares

space cooling maintenance management capabilities scalability and switching require-ments Sven makes a compelling case that AdvancedTCA provides many essential application elements that must be separately and expensively added to 1U servers He concludes that AdvancedTCA allows Telecom Equipment Manufacturers to concentrate on developing software instead of hardware and that reduces development costs and speeds time to market

PICMG addressing new data bandwidth standardsWhile AdvancedTCA provides a great deal of backplane bandwidth especially in full mesh configurations designers want to go even faster to accommodate new bandwidth-hungry applications like IPTV Last year the IEEE ratified important new standards for 10 gigabit per second data transmission over a single pair of conductors Of special interest to our community is the 8023ap 10GBASE-KR standard which details how to achieve that blaz-ing speed over a backplane The PICMG community is moving towards setting up a new subcommittee to incorporate this technology into the AdvancedTCA standard and it may be operating when this issue hits the street It has the potential of providing a total useful backplane bandwidth of 10 terabits per second in a single shelf Thatrsquos a truly amazing

number Douglas Hynd from the Simclar Group introduces us to the details of designing systems at that speed discuss-ing losses signal skew and crosstalk At these speeds simulation is essential and Douglas describes some of the issues involved Also in this issue Stuart Jamieson from Emerson Network Power gives us additional insight into high-speed signaling design simulation and analysis

A name change from Technology in Europe to Global Technology goes into effect this month for the column written by industry veteran Hermann Strass In this issue Hermann tells us how CompactPCI products from MEN Micro have been incorporated into the design of a new highly sophisticated digital cinema camera developed by Silicon Imaging In addi-tion to providing very high resolution and speed the camera must also operate in harsh environments MEN Micro won the 2007 Intel Communications Alliance Innovate and Ignite Technology Showcase award for its work

Curt Schwadererrsquos Software Corner this month expands on a subject he wrote about last April (wwwcompactpci- systemscomcolumnssoftware_corner 200704) As cable companies expand their offering beyond television to voice and data services they become subject to the same laws relating to cyber crime as the traditional telecommunications pro-viders do They must provide law enforce-ment authorities surveillance that is the subject of a lawful warrant and industry standards are being rolled out to do this Itrsquos a timely topic as serious problems with identity theft and cyber crime ingeneral are on the rise Curtrsquos column isan interesting read

Joe Pavlat Editorial Director

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By Hermann StraSS

GLOBALTECHNOLOGY

CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems

Award recognizes unique ruggedcamera control system

The 2007 Intel Communications Alliance Innovate and Ignite Technology Showcase (ICA) named MEN Micro Inc the ICA Showcase winner on September 19 2007 at the Embedded Systems Conference Boston MEN Micro a

subsidiary of MEN Germany has developed a unique control system for a rugged digital movie camera

Silicon Imaging an innovator in IT-centric digital cinema cameras required a rugged camera control system for its new SI-2K camera The SI-2K (shown in Figure 1 courtesy of Silicon Imaging United States) executes direct-to-disk raw recording at either 1920x1080 pixel high definition or at 2048x1152 pixel for cinema resolutions Its 48-bit digital processing algorithms perform adaptive pixel-by-pixel calibration and color image enhancement The SI-2K fore-goes legacy fixed bit-rate DCT codec recording formats such as DVCPRO HD and HDCAM-SR for advanced wavelet compres-sion technology Current generation HD cameras destructively process and compress their imagery at the acquisition stage The SI-2K streams images as raw digital negatives over a standard GbE connection The Intel Core 2 Duo processor-based F17 system from MEN non-destructively processes the raw digital negatives in real time to the visually perfect CineForm RAW codec which makes capturing up to four hours of continuous footage on a single 160 GB notebook drive possible

MEN Micro developed a customized version of its Intel Core 2 Duo processor based F17 3U CompactPCI SBC a unique side card for advanced audio and video capabilities as well as a rug-ged compact enclosure Already being used at independent film production studios for the making of full-length feature films the digital camera employs technology that can be repackaged for surveillance military sports analytics 3D video and stereo ap-plications The camera can operate in environments ranging from desert to arctic

The F17 SBC from MEN (Germany) controlling the camera in-cludes an Intel Core 2 Duo processor T7600 running at 233 GHz The SI-2K uses MENrsquos SBC for simultaneous encoding of data An Intel Graphics Media Accelerator 950 (Intel GMA 950) per-forms image graphics processing colorization and visualization at full resolution The F17 is equipped with 2 GB fast DDR2 DRAM a hard disk on a removable slot and two Intel GbE PHYs which transfer data from the camera head to the camera control unit and to other standard IP hardware The custom side card enables the connection of a High-Definition Multimedia Interface (HDMI) headphones and balanced analog input and output ports for pro-fessional audio signals

Specified for an extended temperature range in harsh shooting environments the camera uses MEN Microrsquos F17 board equipped

with a massive tailored heat sink accompanied by a fan install-ed inside the camerarsquos housing The F17 is part of MENrsquos powerful family of intercompatible CompactPCI Express SBCs including the newer and more powerful F18 which is completely compatible with the F17 and will also be incorporated into Silicon Imagingrsquos new SI-2K camera

European eventsThe 26th MOTEK International Trade Fair and Exhibition the worldrsquos largest event for assembly handling and automation sup-port systems and devices was held for the first time in the brand- new Neue Messe in Stuttgart Germany from September 26 to September 27 2007 The exhibition space increased by 45 percent over last yearsrsquo event due to the new venue More than 1100 exhibitors from 20 different countries drew around 40000 visitors and filled all five new exhibition halls Mechatronics was speci-fically featured as were robots and automation equipment In 2008 about one million square feet of exhibition space will be available when four more halls are completed at Europersquos most modern fair grounds near the Stuttgart Airport Terminal

EMO 2007 (Hannover) the worldrsquos largest exhibition of metal-working equipment closed its gates on September 22 after six days of exhibition with around 160000 attendees visiting booths of 2100 exhibitors from 42 countries 18 million square feet was devoted to exhibition space The organizers German Association of Machine Tool Manufacturers (VDW) reported new busi-ness contracts at the rate of 4 billion EURO (almost $6 billion) Exhibitors such as TRUMPF Laser Germany (see my April 2007 column (wwwcompactpci-systemscomcolumnsTechnology_in_Europe200704) reported full success at EMO 2007

For more information contact Hermann athstrassopensystems-publishingcom

Figure 1

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By Curt SChwaderer

CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems

SOFTWARE CORNER

In the April 2007 Software Corner column (wwwcompact-pci-systemscomcolumnssoftware_corner200704) we explored surveillance systems and the Communications Assistance for Law Enforcement Act (CALEA) a lawful

surveillance capability mandate Internet access and VoIP pro- viders had to be compliant with CALEA by May 2007 or face severe financial penalties

In this monthrsquos column we will look at what cable companies are doing to provide lawful surveillance capabilities within their networks

The term cable company is now officially a misnomer Cable companies and their networks are capable Internet access and voice service networks that offer the general public a one-stop shop for all their communications and entertainment needs In fact cable companies now typically call themselves Multi-Service Operators (MSOs) Voice and data services form a significant and grow-ing source of revenues for the MSO To that end cable networks become subject to the same rules and regulations that telecommu-nications networks do

One of these regulations is CALEA which provides the ability for network providers to tap specific subscribers when served a warrant To their credit cable companies and their research and development consortium organization CableLabs (cablelabscom) have been very proactive planning for lawful surveillance capa-bilities and CALEA compliance within their networks CableLabs and its partners have been working on a set of PacketCable stan-dards that incorporate specifications for voice and broadband data intercept We will focus on the new Cable Broadband Intercept Specification (CBIS) what it encompasses and paths for imple-mentation within cable networks

Cable Broadband Intercept Specification The set of specifications governing cable network services and capabilities is called the Data-Over-Cable Service Interface Specifications (DOCSIS) The specification that covers lawful

surveillance for data services is CBIS The CBIS reference model is shown in Figure 1

The surveillance architecture consists of three components the Mediation Function (MF) Broadband Intercept Function (BIF) and Collection Function (CF) When a warrant for a subscriber is served the network administrator configures the MF to capture traffic coming to andor from the subscriber This traffic includes any dynamic IP address assignment transactions (called out-of-band traffic) as well as the traffic resulting from e-mail voice or data services being used by the subscriber in question Creating hashes of these files validates the captured traffic as not having been tampered with It is also important for the network provider to supply traffic only for the subscriber the warrant is served on Older methods of surveillance involve dumping all traffic from a particular service area from all users in that area then sifting through that traffic manually This method violates the privacy rights of all the other subscribers in the service area of the individual(s) the warrant is served on Surveillance equipment that can capture only the traffic to or from the subscriber in the warrant is critical to the lawful surveillance aspects of the deployment

So far this is similar to the Alliance for Telecommunications Industry Solutions (ATIS) standards governing voice and data surveillance for digital wire line systems Unlike the original ATIS specifications the CBIS specification includes the BIF The BIF is a buffering component where the Mediation Function pushes the surveillance information (in the form of surveillance files) to the BIF for retrieval by the Collection Function at a later date

The CF component gathers the surveillance information from the BIF under law enforcement control then analyzes and presents the surveillance information in a useful way The CF also validates the information by comparing hashes of the files against hashes generated by the surveillance equipment at the time of capture This ensures that from the time the traffic is captured it is not tampered with

Cable and CALEA A look at cable networks and lawful surveillance

Figure 1

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Buffering is importantThe buffering capability the BIF provides in the CBIS specifi- cation is an important distinction between it and the ATIS specification (for more information on the ATIS specs see the April 2007 Software Corner (wwwcompactpci-systemscom columnssoftware_corner200704)

Buffering is so important that ATIS has approved an additional standard for a Buffering Function (BF) within the ATIS lawful surveillance environment

The importance of buffering is best described in a presentation that Dr Glen Myers CEO of IP Fabrics gave at the December 2007 ISS World conference The real-time delivery that the initial ATIS specification defines can be problematic as Figure 2 shows Packet loss from congestion bit errors or QoS contracts can result in the entire surveillance stream being rendered inadmissible

Dr Myers further explained that ATIS allows their buffering model to be separate from or combined with the MF while the cable network CBIS model assumes the buffering function is always separate from the MF component (Figure 3)

The buffering function whether it be the Buffering Function in the ATIS model or the Broadband Intercept Function in the CBIS model minimizes the impact of packet loss and real-time data delivery The Mediation Function can repeatedly attempt to send surveillance information to the BIF through a secure reliable file transfer function such as secure FTP If there are problems connecting with the BIF alerts can be generated so the network administrator can find and fix the problem while the surveillance information is still resident on the MF system

Dr Myers mentioned other important benefits to providing a buffering function The network administrator does not need to

negotiate and install a dedicated link for each intercept between the MF and the Law Enforcement Agency or agencies (LEA) authorized for the information Dedicated pipes matching the subjectrsquos peak service bandwith are not needed Support for mul-tiple LEAs is easily implemented at the BIF instead of the Mediation Function Law enforcement collection equipment does not need to be co-located with the Mediation Function It also simplifies connectivity by eliminating Virtual Private Networks (VPNs) or other routing ele-ments between the MF and the LEA(s)

CALEA and CMTSIn a cable network the Cable Modem Termination System (CMTS) is typically the central point within which service provider traffic from the access network meets the cable core network (and ulti-mately the Internet) So the CMTS is an important interface point for lawful surveillance

CMTS equipment may provide varying levels of support for lawful surveillance The simplest is to provide access to all the raw traffic flowing through the CMTS using an Ethernet tap or span port In this scenario the Mediation Function must find the traffic belonging to the subscriber under surveillance generate the appro-priate CBIS files and send the files to the BIF

Cisco a leading supplier of CMTS equip-ment to the cable industry provides a capability called Service Independent Intercept (SII) within their CMTS prod-ucts Cisco SII is also used in their routers and intelligent switches for QoS control in addition to lawful surveillance While SII provides support for identifying traffic by MAC and IP address information it does

Figure 2

Figure 3

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not provide the high-level configuration and lawful surveillance messages required of the Mediation Function SII uses low-level SNMP MIBs that control MAC and IP address configuration commands which in turn trigger the Cisco SII device to send packets matching the configuration to a span port where the Mediation Function can use these matched packets to generate the lawful surveillance messages So SII provides a first-level filter for the Mediation Function which supplies a high-level configuration interface at the warrant description level as well as creation of the CBIS (or ATIS) messages to be sent to the BIF

CBIS-compliant productsThe CBIS specification is quite new so released products are mostly on the hori-zon However the IP Fabrics DeepSweep Lawful Surveillance product line does provide MF andor BIF functionality for the implementation of CBIS-compliant networks Dr Myers noted that the DeepSweep product line is based on a flexible architecture and a highly parallel processing environment comprised of many software surveillance modules that can be loaded and chained within the DeepSweep to provide a number of Layer two to seven surveillance and packet analysis activities The device is programmed through a GUI and operates as a full Mediation Function with the ability to identify subscriber-related IP address assignment and resulting traffic from a span port The DeepSweep also has software support to communicate with SII enabled routers and CMTS sys-tems to provide a fully compliant ATIS andor CBIS surveillance environment compatible with Cisco lawful intercept and QoS services

CBIS BIF and ATIS buffering appliances are also available to provide buffering compliant with CBIS and ATIS standards

ConclusionCyber crimes such as identity theft child pornography chat-room initiated abduc-tion national security and piracy are very real and growing issues in todayrsquos society Billions of corporate and personal dollars have been tied to cyber crooks that abuse the Internet to participate in these activities It is essential that these illegal activities can be identified and stopped It is a good idea to be aware that the cable industry and its proactive support of lawful surveillance standards as well as rolling out equipment that implements these standards will in turn enable law enforcement to catch these cyber crooks and make the Internet a safer place for us and our children to live learn and work

For more information on this or any Software Corner contact Curt atcschwadereropensystems-publishingcom

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APPLICATION g

Based on current overall network growth Telecom Equipment

Manufacturers (TEMs) and Network Equipment Providers (NEPs)

are being challenged to launch new communications platforms

that provide optimal scalability flexibility manageability and

high computing performance With the expected increase in new

subscribers who need to be supported across the network TEMs and

NEPs are focusing on COTS platforms that meet the requirements of

a carrier-grade environment

With these new challenges it is important to take a look at the different

applications in the network to thoroughly evaluate the best hardware

platform approach Comparing the scalability IO functionality

interconnectivity and overall performance gives TEMs and NEPs a

solid basis from which to choose the best cost-effective solution for

their applications This article compares the traditional 1U PCI

platform with a more modular AdvancedTCA-based approach to

a Home Subscriber Server (HSS)-based platform

Emerging next-generation network architecture IMS Carriers and service providers are focused on improving their Average Revenue Per User (ARPU) by deploying new services quickly and at a price that is acceptable to subscribers IP Multimedia Subsystems (IMS) enable service providers to offer differentiated services to their subscriber base integrating voice video text and content as part of their service mix regard-less of the access technology

The IMS framework provides the telecom industry with a modular standards-based IP service delivery infrastructure More than simply replacing existing circuit services with similar services delivered over IP IMS allows service providers to capitalize on faster and more cost-effective deployment of new and differentiated multimedia communication services

While these new technologies promise new sources of revenue and enhanced customer loyalty they also pose implemen- tation challenges One of the crucial net-work elements within an IMS framework is the manageability of the subscriber base Today an increasing number of users subscribe to multiple services such

By Sven FreudenFeld

Choose the right formula forcompute-intensive HSS systems

AdvancedTCA platforms

versus1U PCI rack-mount servers

AdvancedTCA

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as multimedia mobile phones VoIP or IPTV at home Service providers must manage ldquoduplicatedrdquo subscriber databases for each particular service Consequently managing a converging subscriber base for such network functions as billing across multiple different technologies presents a tremendous challenge Any downtime of this network element can be costly to the carrier or service provider not to mention the heavy risk of losing subscribers over the long term

The HSS and Home Location Register (HLR) are key elements in the IMS network required to manage the growing number of subscribers These platforms that manage millions of customersrsquo data need to be highly reliable with carrier-grade High Availability (HA) functionality Core requirements for the HSS computing platform are

n High compute density for application processingn Scalable performance and high densityn Fast read access to the subscriber datan Large storage and memory bandwidthn Ability to consolidate multiple IMS elements and subscriber data within a single

platform with a modular approach as a converged services platform

HSS plays network backbone roleHSS provides the important network backbone of the IMS architecture because it eases innovation and addresses a range of service-logic interaction issues that have plagued previous service architectures HSS offers open access to service-related data for each subscriber supporting the sharing of data among multiple services

HSS is essentially the master user database that supports IMS network entities that handle calls and sessions It contains user profiles performs authentication and authorization of the user and can provide information about the physical location of the user It plays a key role in provisioning service creation enabling subscriber data and managing control roaming and interconnection The Application Server (AS) which hosts and executes serv- ices in the IMS environment communicates with the HSS Call State Control Function

(CSCF) servers also communicate with the HSS which must be able to

n Support IMS-level authentication and authorization

n Maintain IMS subscriber profile(s) independent of access types

n Maintain service-specific datan Keep track of currently assigned

CSCFn Support CSCF and AS access

HLRHSS hardware platform design choicesHSS design must enable the HSS to be deployed cost-effectively and expand readily to meet future subscriber levels For example the trend to include more information as part of the data record for each subscriber will drive up memory requirements

From a technical perspective the key metrics to understand when developing the IMS HSS functions are the number of completed transactions required per sec-ond and the size of the subscriber base

HSS architecture typically comprises multiple processor units with extensive memory requirements With the introduction

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of multicore processors from Intel developers can scale performance while optimizing power consumption in the overall system design

To meet these requirements the hardware platform needs to provide scalability flexibil-ity and long-term cost efficiency In comparing the traditional 1U platform with a more modular approach to the HSS using AdvancedTCA consider the following

n High compute performance n High memory and storage capabilityn IO functionality to connect to multiple networks (such as SS7 and Ethernet)n Carrier-grade profile and redundancy

AdvancedTCA High density with scalability on a smaller footprintTable 1 illustrates a comparison of a sample AdvancedTCA-based platform and a 1U PCI rack-mounted platform for HSS applications This configuration assumes an increasing subscriber growth from 1 million (M) subscribers to 18M subscribers per platform

FootprintAdvancedTCA-based platforms provide a high density compute platform with scalability on a smaller footprint TEMs can easily add boards to a chassis to accommodate more traffic and to support new services This flexibility enables an increase in subscribers and the database without having a major impact on rack space in the central office environ-ment To meet the same capacity for 18M subscribers the 1U PCI approach will occupy two bays or cabinets with a total footprint of 28 square feet compared to the same capacity occupying one bay or cabinet with a footprint of 14 square feet (see Figure 1)

CoolingWhile the power consumption per square foot is higher than the 1U PCI platform AdvancedTCA offers better airflow and cooling distribution using a push-pull cooling system Each 1U PCI platform includes up to nine cooling fans and is dedicated to that CPU in the 1U server only which translates into higher overhead Therefore the airflow is

not optimized in the overall system design In the case of a fan failure AdvancedTCA platforms enable easier access to replace the fans which are field replaceable units The 1U platform also does not include any integrated centralized switching or management capabilities therefore the total does not include any switching or system management functionality

ScalabilityAdvancedTCA architecture lends itself well to scalability As AdvancedTCA sup-ports both a Base and Fabric interface into the backplane and the separation of data and control planes TEMs can also scale up their designs from 1 GbE to 10 GbE to accommodate new users and usage requirements AdvancedTCA based systems are designed for easy upgrade-ability to new processing blades switch fabrics and IO modules using Advanced Mezzanine Cards (such as SS7)

Since AdvancedTCA and AdvancedMCs offer hot swap capabilities and HA func-tionality growing a subscriber base by using additional CPU blades within the system with low maintenance or upgrade downtime is crucial for the HSS plat-form It also allows for the up and down

AdvancedTCA-based HSS Platform 1U PCI Rack-Mount HSS Platform

Number ofsubscribers

~1M subscribers = 4 CPU blades edundant ~1M subscribers = 4 x 1U

~4M subscribers = 7 CPU blades redundant ~4M subscribers = 7 x 1U

~6M subscribers = 12 CPU blades redundant ~6M subscribers = 12 x 1U

~18M subscribers = 36 CPU blades redundant= 3 AdvancedTCA shelves per rack

~18M subscribers= 36 x 1U+ external switch components for redundancy

Technicalspecs

1 CPU blade = 2 x Intel Xeon dual core = quad core 1 1U rack-mount Intel= Intel Xeon quad core or dual core CPU

16 G DDR 2 memory Max of 8 G DRY memory

+ 2 x SATA or SASS hot swap (RAID 0 and 1)+ 1x PCI Express for SS7 Dual GbE per 1U rack-mount server

4 x GbE per CPU with built in GbE backplane switching separating Control Pathand Data Path with multishelf expandability

External central switching required withmultiple external GbE connectivity

Systems and blade manageability built into the platform withIMP implementation SNMP and CLIP

Carrier-grade redundancy on switch and node

IO for SS7 or other interface modules

CPU blade hot swap capability

Thermaland power

requirements

~6M subscribers redundant= 14 slots with centralized chassis cooling

~6M subscribers redundant= 18 x 1U PCI with independent cooling and separate switch units and system management

Total power consumption= ok (3100 W for blades and RTM + 500 W Shim fan tray and SAP)

Total power consumption= ok

Table 1

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scaling of the platform depending on the subscriber increase or decrease When consolidating multiple services minimiz-ing multiple duplicate databases requires this flexibility

InterconnectivityThe AdvancedTCA platform offers a number of interconnectivity features including

n Separation between the data plane and the control plane

n Direct uplink in a multichassis envi-ronment with up to l0 GbE

n Node to node base and fabric connec-tivity with HA carrier-grade Ethernet functionality

n Easy upgrade path to l0 GbE for increased bandwidth

By contrast the 1U PCI platform requires

n Additional external interconnectiv-ity between 1U rack-mount servers which increases the number of points of failures and the operating and maintenance costs

n Additional switching equipment for carrier-grade Ethernet connectivity

n Additional manage-ment (Simple Network Management Protocol [SNMP]) for HA redundancy

PowerThe 1U-based platform also utilizes integrated AC power supply units usually the standard for the data center and enter-prise environments AC will increase the pro-viderrsquos OPEX in the long term since the power consumption per rack is significantly higher and

Figure 1

requires additional support equipment such as an Uninterruptible Power Supply (UPS) and an AC to DC converter per rack space and ultimately per CPU These factors along with the requirements for carrier-grade functionality HA support and a more favorable long-term OPEX further reduce the need to consider the 1U solution for HSS deployments in Central Office networks

ManageabilityAdvancedTCA chassis-level management is based on the industry-standard Intelligent Platform Management Interface (IPMI) IPMI makes possible interoperability among chassis and blowers compute nodes switches and management solutions from multiple vendors enabling these elements to work together seamlessly The resulting successful inter-blade communication for applications including failover and clustering provides full manageability on a per shelf and per bay basis

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One of the primary goals of the AdvancedTCA specification is to ensure a very low Mean Time to Repair (MTTR) and high Mean Time Between Failures (MTBF) There are no active components in the backplane ndash which can translate to expensive repairs in the field In addi-tion AdvancedTCA specifies that all com-ponents can be hot swappable in the field and the architecture provides redundancy at all levels This hot swap capability translates to less downtime for field replacement on a per CPU blade basis as compared to 1U PCI

SummaryAdvancedTCA provides an ideal platform and meets the technical requirements for deploying flexible and scalable IMS HSS applications While other platform archi-tectures such as 1U rack-mount servers may with considerable difficulty be able to deliver HSS capabilities AdvancedTCA offers a much more advantageous solution by providing a smaller footprint improved cooling and thermal characteristics bet-ter scalability enhanced interconnectivity and easier manageability This all contrib-utes to making AdvancedTCA a lower cost approach in terms of CAPEX and OPEX for long-term subscriber growth

1U PCI rack-mount servers are not considered to be the optimal hardware platform for HSS applications in a Central Office With its limitation for carrier-grade flexibility and HA functionality the 1U PCI platform is best suited for a full range of other enterprise and Internet infrastructure applications within a data center environment that does not require any significant flexibility and HA functionality around it It might also be a good entrance point for other enterprise applications with lower price points

The use of AdvancedTCA-based platforms enables TEMs to shift away from hardware development and refocus their efforts on delivering value-added software and services As a result they can realize lower development costs and faster time-to-market enabling increased flexibility with each product design through the use and reuse of standardized off-the-shelf components Equally significant are the advantages that can be realized by the service provider With a common platform and a flexible architecture that maximizes limited floor space service providers can rapidly and flexibly implement a broad range of feature-rich solutions for faster profitability

Sven Freudenfeld is responsible for North American Business Development for the Kontron AG line of AdvancedTCA AMC MicroTCA and Pre-Integrated Solutions Sven possesses more than 15 years of experience with voice data and wireless com-munications having worked extensively with Nortel Networks in Systems Engineering Sanmina-SCI in Test Engineeringand Deutsche Telekom in Network Engineering Sven holdsan electrical engineering degree from Germany and is also Chair of the CP-TA marketing workgroup focusing on the interoperability of COTS standard building blocks

Kontron bull svenfreudenfeldcakontroncom bull wwwkontroncom

Fo Sin Pnt

Fo Sin Pnt

TECHNOLOGY g BACkpLANES

Increasing demand for service and multimedia features is stimulating a growing need for speed in telecom-munications equipment While some

applications such as PBX systems can be addressed with the gigabit backplane technologies currently available others are running out of headroom Routers may soon need 10 Gbps and higher speed back-planes to keep up with network demand Many such applications can justify the expense of moving to higher performance if it becomes available

Currently telecom system designs offer backplanes that can handle interconnec-tions running as fast as 3125 Gbps raw data throughput per lane (with around a maxi-mum data rate capability of 5-625 Gbps per lane) The AdvancedTCA standard for instance uses Ethernetrsquos XAUI inter-face AdvancedTCA achieves a 10 Gbps net data rate by running four serial lanes for each interconnection with each lanersquos

SERrializerDESerializer (SERDES) op-erating at 3125 Gbps raw data (25 Gbs net)

As demand forces systems to move beyond these rates however new technologies will be needed One proposal calls for the use of XAUI+ or double XAUI which increases lane SERDES rates to 625 Gbps per lane and hence the throughput to 20 Gbps Another proposal is to use IEEE 8023ap known as 10GBASE-KR which runs a single SERDES lane at 125 Gbps raw data rate (103 Gbps net) But these are only short-term answers To address future demands organizations such as the Institute of Electrical and Electronic Engineers Standards Association (IEEE-SA) are developing specifications for Ethernet speeds of 40 Gbps to 100 Gbps which will be applied to backplane interconnect

Such high clock rates however will pose significant design challenges for developers

One of the first challenges that will need resolution is the design and layout of the backplane and other PCBs Common design practice today readily handles board clock rates of around 10 Gbps Well established design rules are in place and board layout tools such as autorouters can automatically handle board designs for speeds in the 10 Gbps range Designers may use specialized board material create additional ground planes and perform similar tasks in order to ensure proper board operation at the higher end but even speeds to 5 GHz are within current design tool capabilities

Design gets trickierAbove 5 GHz however board design gets more involved because feature dimensions become significant when compared to the signalrsquos wavelengths Variations in board thickness can affect signal propagation Corners where traces change direction and small spurs along edges of poorly etched

Channel characteristics

challenge backplane interoperability

Serial backplanes in telecommunications systems aim for high speed with room for

growth As systems began using 10 Gbps links however issues arose that affected backplane

communications among cards from different manufacturers Stuart points out that the

industry must define key backplane channel characteristics so that designs based on open

standards maintain interoperability as backplane speeds move to 40 Gbps and beyond

By Stuart JamieSon

Fo Sin Pnt

traces can act as antennae for the higher fre-quencies in digital signals As can be seen in Figure 1 sharp corners and minor flaws that are inconsequential at lower frequen-cies have the potential to become trouble-some antennae at future high speeds This can result in the trace radiating away the signalrsquos high frequency energy increasing EMI and crosstalk as well as altering signal waveforms New routing design rules such as making corners 30deg instead of 45deg and more careful board fabrication techniques may become necessary as designs move above the 10 Gbps per lane threshold

The move to higher frequencies will affect more than board fabrication and layout however Higher frequencies will also impose new requirements on signal tim-ing signal rise-time electrical distance and waveform shape if developers are to retain the mix-and-match system design approach that makes standards-based system design effective

For interoperability to be achievable at data rates above 10 Gbps organizations such as PICMG will need to carefully define a vari-ety of signal and design parameters in their specifications Some of the key parameters that will need consideration include

n Interconnect signal attenuationn Eye diagramn Jittern Input clock recoveryn Chip inputoutput pre-emphasis (PE) n Equalization (EQ)

Even slight variations in these parameters from device to device and lane to lane can shift the timing of signals a significant fraction of a clock cycle and affect the Bit Error Rate (BER) of a lanechannel Finally signal rise times will require tight control as signal rates increase in order to ensure control of system timing (see Figure 2)

In defining signal and design parameters specifications will also need to account for the increased location dependency that comes with higher frequencies Even subtle differences in attributes such as routing length and trace impedance become increasingly significant as signal speeds rise To ensure mix-and-match interopera-bility then design specifications may need to account for the specific backplane slot that a board is to occupy as well as introduce a method to obtain and control the PE and EQ of the devices connected to the lanes

Designers must also address fabrication standards The material used to fabricate

Figure 1

Figure 2

Fo Sin Pnt

the board the thickness and composition of metal cladding and the spacing between layers can all affect the trace characteris-tics Controlling these parameters under specification ensures that timing charac-teristics are sufficiently uniform from one board to another However current speci-fications are too detailed and stringent It is extremely difficult to attain compliance yet avoid adding cost to the design

Specifications need workSome of these parameters are already incorporated into current specifications The AMC module specifications from PICMG for instance include design parameters that ensure its proper opera-tion at signal speeds as fast as 125 Gbps per lane Establishing specifications for other system components will help achieve interoperability of standards-based designs at higher frequencies

Design tools may also need to be modified and the industry will need to create new design rules for high frequency and incor-porate these into the tools Developing new routing techniques will help avoid the issues of electrical phenomena such as skin effect dielectric loss and impedance mismatches These are much more preva-lent at higher frequencies and it becomes critical for engineers to model and simu-late these phenomena more accurately

Early efforts are already underway to address the challenges that higher fre-quency signals bring to standards-based design The Interconnect Channel Characterization Subcommittee of PICMG established in September 2006 is develop-ing ground rules and definitions to be used in characterizing transmission reflection and crosstalk performance in backplane and mezzanine carrier interconnects The committee aims to define the channel parameters to be measured or analyzed as well as the methods for doing so Its charter calls for it to address

n Definition of interfaces at which measurements are made or characteristics computed

n Test equipment fixtures and PCB test coupons

n Details of measurement proceduren Data formatsn Techniques for de-embedding

components of the channeln Techniques for validating

measurement based models ie passivity and causality

n Definitions that allow reasonable compliance testing

n Boundary definitions for different paths

n Define information regarding limita-tions or proper usage ie maximum data raterise times that are supported by the models

Such efforts are only a beginning how-ever Other design details still need to be addressed such as SERDES IO Configuration New functionality may need to be defined The design of high data rate system channel interfaces according to standardsspecifications does not currently cover the individual characteristics of the chip transmitterreceiver characteristics Thus work will be needed to address how such standard designs handle such dependency

Crossing an interoperability thresholdOne way of handling location dependen-cies might be to give the system control-ler the ability to inform modules what the channel transmitter and receiver PE and EQ technology is and importantly how to control it With this information along with the signal attenuation suffered (at a given bit rate) for the channel the system should be able to configure SERDES channels in different physical locations to run reliably and at the required BER In MicroTCA systems for instance this functionality could be incorporated into the MicroTCA Carrier Hub (MCH) as part of its electronic keying function Modules would have to be able to configure and control its backplane interfaces to allow for different positions

in the backplane An MCH (see Figure 3 courtesy Emerson) then would be able to instruct a module as to which parameters to use for interoperability

The specific approaches needed to handle location dependencies and other challenges that higher signal rates raise have yet to be developed The need to address these challenges however is clear Increasing demand for services is driving applications to utilize faster signal rates This in turn is driving backplane signaling speeds ever higher As speeds rise above 10 Gbps sig-nals will cross a threshold where current specifications will prove inadequate for ensuring interoperability among standards-based designs

The industry should begin developing new or enhanced specifications and design tools to address the challenges of higher signal rates Without such improvements the guarantees of interoperability that allow system developers to readily create solu-tions by combining off-the-shelf products will be compromised As backplane speeds approach 100 Gbps nothing can be taken for granted

Stuart Jamieson Director of Industry RelationsArchitect with Emerson Network Power Embedded Computing represents Emerson on PICMG committees and the SCOPE organization and previously served as a CP-TA Board member (Treasurer) He brings over 18 years of experience in hardware protocols embedded software and specification development to these groups Within Emerson he played a key role in the develop-ment of the technology central to Emersonrsquos bundled network-ing solutions Stuartrsquos positions within Emerson have included Director of Business Development Director of Advanced Technology and Architect He is the Draft Editor for the PICMG Interconnect Channel Characterization Subcommittee is the author of the introduction section for the new PICMG Ruggedized MicroTCA specification and served as the Draft Editor for the PICMG MicroTCA Specification Stuart gradu-ated from the Heriot-Watt University in 1989 with a 1st Class Honors degree in Electrical and Electronic Engineering and again in 1992 with an IBM-sponsored Master of Philosophy

Emerson Network Power Embedded ComputingStuartJamiesonEmersoncom bull wwwemersonembeddedcomputingcom

Figure 3

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TECHNOLOGY g BACkpLANES

2008

B A

N D

W I

D T

H

Signal integrity challenges to bandwidth scalabilityFor the purposes of this article each interconnected differential pair will be referred to as a Channel (which should not be confused with an aggregated AdvancedTCA channel comprising four trans-mit and four receive pairs)

14-slot full-mesh AdvancedTCA backplanes contain hundreds of Channels Each Channel is defined as the copper signal path from the output of a driver device to the input of a receiver device As

By douglaS Hynd

Developing IEEE 8023ap 10GBASE-KRcompliant backplanes

Why doesAdvancedTCA

need bandwidthscalability

PICMG AdvancedTCA 30 has emerged as the

industryrsquos Hardware Platform standard of choice and

is enjoying first-phase deployment However many

believe that for AdvancedTCA to realize its market

potential AdvancedTCA platforms need to seamlessly

scale to accommodate 40 GbE fabrics thereby

avoiding forklift upgrades as system bandwidth

demands increase over time A 40 GbE switch fabric

architecture would enable realization of a common

platform for computing storage control and media

and packet processing and provide the versatility and

long term ROI required by service providers in

todayrsquos increasingly competitive environment

The challenge was to develop a family of

AdvancedTCA products which feature PICMG 30

compliant dual star and full mesh advanced

backplane switch fabrics enabled up to 10 Gbps

per differential signal pair thereby giving 40 Gbps

per AdvancedTCA channel performance

This article describes the signal integrity challenges

presented in designing an IEEE 8023ap

10GBASE-KR-compliant bandwidth-scalable

14-slot AdvancedTCA platform and how these

challenges were overcome in development of full

mesh and dual star backplane reference designs

Fo Sin Pnt

shown in Figure 1 that signal path comprises a signal launch a blade PCB transmission line a daughtercard via a right-angled HM-ZD connector a mated HM-ZD backplane header a back-plane via a length of backplane PCB transmission line and then the same combination of connectors vias and transmission line at the receive end of the Channel

Sources of crosstalkFour principal sources of crosstalk in each Channel must be man-aged as shown in Table 2 Source number one is between adjacent differential pairs as they are routed across the backplane Common mode noise rejection in system differential pair structures makes this a minor issue The second source of crosstalk lies in the HM-ZD connector itself

Crosstalk in via fields our third source primarily arises from inductive coupling between adjacent differential pairs and domi-nates the crosstalk agenda in high-speed Channels This source of crosstalk is directly proportional to the length of the via barrel and where practical care must be taken to ensure that adjacent connector rows are terminated to different target routing Layers

The final source of crosstalk is caused by aggressor signals in through-routed via fields coupling with victim Channel traces as they pass through As mentioned earlier judicious and careful design can mitigate this impact

Skew Channel skew is a function of differential transmission path geometries At a fundamental frequency of 5 GHz skew can be a significant issue in high-speed system design due to narrowing the eye opening and increasing jitter Skew can have a significant impact on crosstalk it negatively impacts the common mode rejection of noise inherent to differential signaling Conductor surface roughness in lower performing dielectric materials can also cause skew in high-speed systems

Skew can be avoided through careful management of transmission path lengths in each Channel and by using higher-glass content (lower Dk) laminates

LossPotential

Potential Mismatches

Channel

Loss Potential Channel

PCB Tolerance -025 dB 2 -01 dB

Connector Tolerance -001 dB 4 -016 dB

Thru-routed Via Fields -001 dB 12 -144 dB

Connector Launch -025 dB+ 4 - 2 dB+

Quantity TotalNEXT

TotalFEXT

PCB Transmission Lines

24 in60 cm

-50 dB -70 dB

Connector Architecture 2 -26 dB -24 dB

Via Fields 4 -22 dB -20 dB

Connector Pass Through 8 -34 dB ndash34 dB

For the target application each one of these Channels must deliver a 10 Gbps Non-Return-To-Zero (NRZ) signal with sufficient signal fidelity to enable a receiver device to detect and process a differential signal The PICMG 30 specification is targeted at 3125 Gbps signaling with a fundamental frequency of 156 GHz Even in low loss dielectric materials insertion loss at 10 Gbps (5 GHz fundamental) is twice that of a 3125 Gbps signal

Therefore achieving acceptable signal fidelity requires careful management of signal losses and noise in each Channel such that an acceptable signal-to-noise (SN) ratio is achieved at the receiver

The design process therefore begins by understanding and mitigat-ing the sources of losses and noise in each Channel

Sources of lossThere are three sources of loss

n Conductor losses which are due to skin effects and can be addressed by maximizing the cross sectional area of the signal traces

n Material dispersion losses which are a function of the dielectric constants of the chosen material These can be mitigated by choosing a higher performance laminate material such as Nelco 4000-13SI or Megtron

n Reflected power loss due to impedance mismatches in the Channel as each signal transitions across the different copper media in each channel (connectors vias and PCB traces) and passes through the pad and anti-pad structures of the via fields of other backplane blade slots

Table 1 shows the relative effects of different sources of impedance mismatches The dominant source of impedance mismatches in every Channel resides in the via structures Successful mitigation of this problem requires that every via is tuned by back-drilling the stub and adjusting the pad and anti-pad structures to match the impedance to be 50 ohms irrespective of the target routing layer This in turn requires that the capacitive and inductive effects of the connector pin and via barrel combination are taken into account during the design of each Channel

Further complicating via design is the space the anti-pad structures need to accommodate Channels being routed between other blades while minimizing electro-magnetic coupling with them This space consideration makes the shape and orientation of pads and anti-pads extremely important

Figure 1

Table 1

Table 2

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IEEE 8023ap provides a design targetAs Ethernet has emerged as the industryrsquos dominant signaling methodology the IEEE has developed the 10GBASE-KR norma-tive Channel model to define interconnect Channel performance for NRZ signaling at 10 Gbps This standard defines acceptable performance in terms of S-parameter charts for through-Channel insertion loss and worst-case crosstalk Figures 2a and 2b illustrate masks for Draft 24 of the standard that was initially used for this exercise

In each case the mask defining compliant performance is shown in blue Channel insertion loss is shown in red in Figure 2a Crosstalk performance is defined by the ICR curve (Figure 2b) Minimum acceptable Channel performance is defined in the ICR chart (Figure 2b) by the blue line The effect of the sum of all aggressors on the through-Channel is shown in red The green ICR curve is the ratio of the crosstalk power sum calculated by summing the

magnitudes of any impacting crosstalk Channels for each fre-quency and using a straight line fit (using least-squares method) to determine the resulting average effect f the aggressors on the through-Channel This is then overlaid on the insertion loss and used to plot the ICR curve

This standard which has evolved through a variety of iterations forms the basis for developing a 40 GbE switch fabric backplane featuring 10 Gbps NRZ differential pairs If all differential pairs can meet this standard then the backplane can be considered to be 10GBASE-KR compliant

Applying 10GBASE-KR to a 14-slotAdvancedTCA applicationThe PICMG specification dictates that receive differential pairs are placed on the c-d and g-h rows of the HM-ZD connector and that transmit differential pairs are placed on the a-b and e-f rows Therefore the middle differential pair in row c-d of Slot B will be subject to the NEXT of three aggressors in each of the a-b and e-f transmit rows of slot B plus the FEXT of the signals being received in the c-d pairs in the top and bottom of slot B

In this topology it can be seen that worst-case crosstalk would occur if all the NEXT and FEXT aggressors were routed on the bottom Layer that is on the same Layer as that of the victim c-d However given that all signal vias must be back-drilled and tuned for impedance management purposes Channel crosstalk can simultaneously be reduced by allocating different routing Layers to differential pairs terminated in the same backplane connector

The principal factor in determining the feasibility of a 10GBASE-KR compliant backplane is based on understanding whether the Channel with the worst-case signal-to-noise ratio is compliant

The skew targets determine permissible layer separation between a-b c-d e-f and g-h pairs within each Channel and enable routing Layers to be allocated for each pair It is now possible to start the process of via tuning to optimize the channel performance for minimum insertion loss Modeling begins by defining the simulation boundaries for the channel so that Channel component models (PCB traces connectors vias) can easily be aggregated to model complete Channels Boundaries must be established at locations in the Channel where linear 3D structures exist These are shown in Figure 3 (next page)

Since the connector and via combinations for the backplane and daughtercard mating halves must each be treated as a whole it

PICMG 30Spec

TurboFabricSpec

Total Inter-PairSkew

(Fabric Interface)

05 mm in FR4(34 ps)

001 mmin N4000-13si

(00625 ps)

Total Intra-Channel Skew

(Fabric Interface)

254 mm in FR4(17 ps)

plusmn01 mmin N4000-13si

(0625ps)

Total Intra-Channel Skew

(Base Interface)

135 mm in FR4(90 ps)

plusmn01 mmin N4000-13si

(0625 ps)

Figures 2a and 2b

Table 3

Determining which Channel that is and identifying the worst-case SN requires making trade-offs with regard to PCB material Channel length via design connector row selection and NEXT and FEXT aggressor routing choices These trade-off choices can only take place using advanced 3D simulation tools such as Ansoft HFSS This was the essence of the design process employed in developing Simclarrsquos TurboFabric backplanes

The simulation processThe transmission length for full mesh and dual star backplanes design implementations varies from a maximum of 1632 inches to a minimum of 116 inches With an effective transmission length of 5 inches on each daughtercard this makes the longest effective Channel 2632 inches including two connectors

For a 10GBASE-KR application over this distance a high-perfor-mance laminate is essential for both reducing insertion loss and

ensuring high glass content in the weave to mitigate skew So the design process began by choosing a low-loss dielectric material (Nelco 4000-13SI for both the backplane and the daugh-tercards) and establishing targets for Inter-Pair and Intra-Channel skew as shown in Table 3

Adhering to the PICMG 30 specifi-cation for skew in a 10GBASE-KR application is impractical Instead a target of 00625 ps was set for Inter-Pair skew with 0625 ps set for Intra-Pair skew for the backplane only This equated to a maximum 001 mm differ-

ence being allowed between traces of any differential pair and 01 mm being permitted between traces of any four differential pairs in a Channel Given the topology of the HM-ZD connector daughter-card skew must be accounted for in the daughtercard layout Fo

Sin Pnt

should be noted that the simulation boundary is located within the mated connector

Tuning the connector and via structures to 50Ω is an iterative process involving the removal of excess pads back-drilling and tuning pads anti-pads and traces A Time Domain Reflectometer (TDR) plot illustrating the results of the tuning process is shown in Figure 4

Upon completion of the modeling process a total of 17 different optimized via and routing configurations had been designed for the full mesh design and nine for the dual star design

A plot of worst-case insertion loss is shown in Figure 5 and demonstrates that in both cases performance is well above the 10GBASE-KR mask

When all the through-Channels have been modeled adjacent Channel models can be combined and ICR curves plotted to evaluate the impact of crosstalk on through-Channel performance This valuable information can be used to adjust the position of signal Layers relative to pass-through aggressor traces on adjacent Layers or to reroute traces to reduce crosstalk Similarly routing Layers can be changed to reduce crosstalk in adjacent via barrels

Figure 6 plots worst-case ICR and demonstrates that performance is above the 10GBASE-KR mask Based on this result it was possible to proceed to physical implementation

Figure 3

Figure 4

Fo Sin Pnt

Physical realizationThe layout process was performed using the Mentor Board-Station CAD system Quad-routing (routing four traces between pads) was explored as a routing method-ology in order to reduce Layer count but this was dismissed due to the detrimental impact on crosstalk performance

The attributes of the physical backplanes produced as a result of the design effort are shown in Table 4

The design files produced included the usual gerber files plus detailed back-drilling instructions

The design validation process comprised a conventional continuity test followed by performance testing featuring Agilent equipment including 70340A signal generator 8720ES Network Analyzer NN18A S-Parameter test-set and 86100A sampling oscilloscope with Agilent 86112A module Figure 7 (next page) shows the test set up

Simclar developed special line cards to enable through-Channel measurements with and without crosstalk The signal launch featured compression mount SMAs terminated in a tuned via structure The Channel simulations included simu-lation of the tuned launch structures so de-embedding of the launches was not necessary for correlation to simulation purposes The development team also established a process for characterization of all Channels

Full Mesh Dual Star

Layer Count 34 18

Aspect Ratio 121 61

Tuned Vias 3952 768

Material Nelco 4000-13SI

Table 4

Figure 5 Figure 6

Fo Sin Pnt

In Figure 8 measured through-Channel performance and ICR curves are shown for the same Channels described in the simula-tion section earlier

As can be seen from Figure 8 there is close correlation between these and the simulated plots in Figures 5 and 6 In fact close correlation between all simulated and measured results was achieved resulting in a 728 Tbps capacity full mesh and a 960 Gbps capacity dual star backplane design now generally available as part of the Simclar TurboFabric shelf

Figure 7 Figure 8

Figure 9

Figure 10

Implications of 10GBASE-KR Draft 33versus Draft 25The work described above was targeted towards meeting the Channels specifications contained in Draft 25 of the IEEE 10GBASE-KR Since this work was completed the IEEE has up-issued the Draft revision level for the Standard from 25 to 33 While this has not impacted through-Channel performance demands it has increased Channel isolation requirements by around 10 dB In Figure 9 a Draft 33 mask is added to the ICR plot shown in Figure 8

From Figure 9 it can be seen how Draft 33 pulls the mask above the Channel ICR curve for this full mesh backplane Channel Surprisingly it is the Channelrsquos frequency response at relatively low frequencies between 100-500 MHz that is causing a problem The reasons for this are currently the subject of further detailed investigation

However Figure 10 shows a Draft 33 plot for a less demanding dual star AdvancedTCA implementation featuring shorter trans-mission distances This plot demonstrates compliance to Draft 33 of the IEEE 8023ap 10GBASE-KR Standard

ConclusionBy developing a close understanding of the many factors contrib-uting to loss and noise in multi-gigabit backplane Channels it is possible to characterize their performance using advanced simula-tion techniques and correlate that performance in physical prod-ucts using advanced test methods By overlaying the test results on S-Parameter masks defined by the IEEE 8023ap 10GBASE-KR Standard it has been demonstrated that backplanes that truly enable AdvancedTCA scalability are at last a reality

Douglas Hynd joined Simclar Group in 2006 as Director of Marketing as part of Simclarrsquos acquisition of Northrop Grumman Interconnect Technologies Division wherehe was Vice President of Marketing and Sales He has more than 24 yearsrsquo experience intechnology sales marketing and generalmanagement and holds a BSc (Eng) in Electronics and Electrical Engineeringfrom the University of Glasgow He isbased at Simclarrsquos Global HQ inDunfermline Scotland

Simclar Groupdouglashyndsimclarcom bull wwwsimclarcom

Fo Sin Pnt

6U CompactPCIPrOduCT GuIdE g

This monthrsquos issue includes a 6U CompactPCI Product Guide and Irsquod like to take the opportunity to reflect a bit on the success and evolution of that technology

Back in the 1994 time frame when CompactPCI was first being devel-oped it began as 3U-only technology It used the same Eurocardmechanics that were popularized by VME and an IEC standardized high-

density high-speed connector available from a number of vendors suitablefor 33 MHz PCI signaling That connector was selected by the engineers atZiatech with help from Mike Munroe then at ERNI The majority of VMEdesigns were 6U and based on this I was among a number of folks thatargued for adding the 6U CompactPCI form factor

The 6U form factor presented some challenges and opportunities Onechallenge was that the insertion and extraction forces were quite high when the entire rear of the card was populated with connectors Fortunately the IEEE standards for Eurocards evolved and injectorejector handles that pro-vided leverage became available Eike Waltz then at Rittal was instrumental in bringing that to the table Two of the opportunities that came along withthe extra connectors were a clean way to add secondary buses like the H110 telephony bus to the backplane and the ability to route IO out the rear through rear transition modules PICMG has developed quite a number of subsidiary specifications defining the interoperable use of the extra backplane pins made possible with the 6U form factor Both of these features have played a major part in CompactPCIrsquos success The next major evolution of 6U CompactPCI came with the PICMG 216 Packet Switched Backplane standard which was originally conceived by John Peters and his team at Performance Technologies PICMG 216 interconnected a shelf full of CompactPCI single board computers via redundant Ethernet switches also in the 6U CompactPCI form factor This dramatically increased usable backplane bandwidth and provided redundancy PICMG 216 paved the way for AdvancedTCA and was the industryrsquos first open standard for the switched serial interconnect standards we see popping up in many places

By Joe Pavlat

Looking back and ahead at6U CompactPCI

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Recent 6U CompactPCI related products are listed here For more informationenter the productrsquos RSC No at wwwcompactpci-systemscomrsc

cPCI-6910Dual-core Intel Xeon Processor LVULV Universal blade bull Supports Single Dual-Core Intel Xeon LV or ULV processorsbull Front Side Bus 667 MHz bull Up to 2 GB DDR2 400 MHz soldered SDRAM with ECC bull Four PCI Express GbEbull Up to 4 USB 20 ports bull PICMG 20 21 29 216 compliant

RSC No 35013

ADLINK Technologywwwadlinktechcom

CPCIStor Module6U CompactPCI storage blade bull Onboard ATA controller supports CDDVD HDD and solid-state flashbull Supports Hot Swap Removal (ask about RAID support) bull ATA disks available in Enhanced Dutycycle versions for NEBS Level 3 - 724 requirements bull Operating Systems supported VxWorksLinux and Windows

RSC No 34800

ACTTechnicowwwacttechnicocom

Prosody X cPCI E1T1An E1T1 digital network access card bull Suits telco developers and systems integrators bull Uses Aculabrsquos worldwide protocol coverage including Aculabrsquos SS7 stack available under a cost free license bull Available with 8 or 16 E1T1 trunks and software selectable E1T1 interfaces bull Flexible mix of protocols including ISDN CAS and SS7 (ITU-T China and ANSI) bull A variety of interconnect switching and protocol conversion solutions can be readily crafted bull High availability reliability and scalability with industry standard hardw re and software interoperability bull Up to 128 SS7 signaling links bull Non-circuit related (TCAP) messagingintensive applications such as prepaid and SMS

RSC No 35408

Aculabwwwaculabcom

Adexp8021Intel Core Duo L2400 (166 GHz) w E7520 server chipset bull Dual channel PC2-3200 Registered RAM SECDED or x4 SDDC bull Two GbE two Serial ATA four USB 20 bull Onboard SXGA graphics 1280 x 24-bitbull 6U CompactPCI Bus PICMG EXP0 R10 Specification bull RoHS compliant 0 degC to +55 degC operating range

RSC No 32837

Advanet Incwwwadvanetcojpen

TC84012 channel single-stop Time-to-Digital Converter (TDC) with single-start and multi-start acquisition modes bull 50 ps timing resolution bull Wide range with upto 20 s between first and last events bull Large internal memory buffer with up to 512 hits per channel bull Low jitter (lt3 ps rms) high stability (plusmn2 ppm) internalclock source bull External 10 MHz reference input bull FPGA based Data Processing Unit (DPU) bull Fast readout with DMA mode for increased data throughputbull Overvoltage-protected inputs with 50 Ω K-Lock (LEMO) connectors bull Built-in self calibration bull Modular single-slot 6U PXICompactPCI standardbull Low power consumption (lt22 W)

RSC No 33445

Agilent-Acqiriswwwacqiriscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

MIC-30428-slot 6U CompactPCI backplane bull AC or DC CompactPCI 500 W + 250 W redundant(2+1) power supplies bull PICMG 216 (CompactPCI Packet Switching Backplane) compliancebull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarmmodule (MIC-3924L-AE)

RSC No 32851

MIC-30436-slot 6U CompactPCI backplane bull Supports two hot-swappable SCSISATA or removableIDE HDD bays bull Built-in IDE slim-type DVD-ROM bull AC or DC CompactPCI 250 W + 250 Wredundant (1+1) power supplies bull Supports hot-swappable fan modules bull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarm module (MIC-3924L-AE)

RSC No 32850

Advantech Corporationwwwadvantechcom

Dual-Core Xeon CompactPCI SBCModel PP 42123x bull Dual CPU 6U CompactPCI SBC supporting two dual-core Xeon CPUs bull Up to 8 GB DDR2 ECC SDRAM in a single system or peripheralslot bull Dual processor SBC in a single 6U CompactPCI slot bull Supports two 166 GHz Dual-Core Intel Xeon ULV processors using Intel E7520 server chipsetbull Up to 8 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull PMCXMC site support 66 MHz PCI-X and x8 PCI Express bull Front and rear IO bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade bull Four GbE ports with option for PICMG 216

RSC No 34761

6U CompactPCI Core 2 Duo SBCModel PP 41203x bull 6U CompactPCI Core 2 Duo SBC supporting two PMC sites includingone XMC site bull Up to 4 GB DDR2 ECC SDRAM bull All in a single system or peripheral slot bull TwoPMC sites supporting up to 100 MHz PCI-X bull One XMC x8 PCI Express bull Front and rear IObull Supports 216 GHz or 15 GHz Intel Core 2 Duo processors bull Intel E7520 server chipsetbull Up to 4 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade

RSC No 34763

PP 30202xTwo processor versions available bull 18 GHz Intel Pentium M processor 745 uses mFC-PGA 478 (micro Flip-Chip Pin Grid Array) package bull 14 GHz Intel Pentium M processor Low Voltage 738uses mFC-BGA 479 (micro Flip-Chip Ball Grid Array) package bull 64 KB primary (L1) on-die cache2 MB of secondary (L2) on-die cache bull 400 MHz Front Side Bus (FSB) bull No CPU fan bull 16 GHz processor version (1 MB L2 cache) available see PP 30002x datasheet bull Utilizes 64-bitIntel 855GME chipset bull Supports 400 MHz bus frequency bull Uses Intel 6300ESB IO Controller Hub

RSC No 32659

Concurrent Technologies Incwwwgocctcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cCIBPMC6U-ETA 6U bridged dual PMC carrier that bridges extended temperature CompactPCI boards and PMCs bull Features a rugged CompactPCI form factor providing increased flexibility to military communications systems designers bull Provides additional design choices to users through its differing bus speeds maximizing the numberof PMCs that can be used CompactPCI andPMC buses can both run at 66 or 33 MHzbull Operating temperature range of -40 degC to+85 degC bull Signal conditioning bull DMA supportbull Low-power design +5 V +33 V +12 V -12 V bull User-selectable VIO of 33 V or 5 V to the PMC

RSC No 32891

Dynamic Engineeringwwwdynengcom

cPCI4IP-MMMinimized PCI address footprint IndustryPack carrier for CompactPCI applications bull 6U 4HP4 IP positions 832 clock selection for each slot fused filtered power IO options bull ID INT IO and Mem spaces are decoded for each IP slotbull Single and double wide IPrsquos bull 16- and 32- bit IPs bull 32-bit access to 16-bit IPs bull Full or mini-mized Memory Space decoding for 18 the PCI address requirement bull With the cPCI4IP-MM option 8 CompactPCI 4IP cards take the same PCI address space as 1 full Mem Space card

RSC No 34905

ACQ132CPCI32 channel MHz class simultaneous sampling intelligent digitizer bull 32 simultaneous analoginput channels 2-32 MSpschannel 14-bit resolution bull Differential inputs bull Intelligent cardwith 1 gigabyte memory and GbE on board bull Large distributed FPGA resource on boardbull Range of DSP functions including FIR filtering and Digital Downconverter

RSC No 35482

D-TACQ Solutions Ltdwwwd-tacqcouk

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CR11Based on the Intel Core Duo Processor the platform is designed to support processor speeds from 106 GHz up to 20 GHz bull Intel Core 2 Duo runs at 15 GHz up to 20 GHz bull Conduction cooled bull Two PMC slots bull PCI Express bull 2x GbE

RSC No 33156

ICS-72532-channel 6U CompactPCI DAC board bull 6U CompactPCI data acquisition card bull 32 differential output channels bull 16 or 24-bit sample size bull 288 kHzch data rate bull Simultaneous sampling across all channels on single or multiple boards bull 32 separate delta-sigma DACs bull 64-bit 66 MHz CompactPCI PICMG 20 Rev30 hot-swappable bull FPDP II 400 MBps interface

RSC No 33576

ICS-71032-channel 6U CompactPCI ADC board bull 6U CompactPCI data acquisition card bull 32 differential input channels bull 216 KHzch 24-bit resolution bull Software selectable full scale input bull FPDP II 400 MBpsinterface bull 64-bit 66 MHz CompactPCI PICMG 20 Rev 30 hot swappable bull 32 synchronous boards for simultaneous sampling bull Sonar acoustics and test and measurement applications

RSC No 33578

Tsumani 6U CPCI Development KitFPGA processor solution targeted at high performance software defined radio applications bull Dual Stratix EP1S80 FPGAs are tightly coupled to provide apower platform for signal processing bull Two PMC module sites provide IO connectivity to either front panel or back panel connections bull A direct highbandwidth 1 GBps path from the PMC P4 connector directly to the FPGAs bull Model 919 Dual DAC Mezzanine provides broadband analog signal generationin a compact form bull The board features two independent DAC channels each with its own 12-bit LVDS input capable of running at rates up to 160 MHz

RSC No 32026

CP11Rugged 6U SBC bull Up to 4 GB of DDR2 SDRAM (200 MHz) with enhanced ECC four independent onboard PCI buses system host and peripheral modesupport for the CompactPCI backplane two PMC interfaces (64-bit133 MHz and 32-bit33 MHz) bull Instead of the PMC1 a PCI Express based XMC interface is available on request bull Two GbE one Fast Ethernet two serial interfaces (RS-232 or RS-422485) USB 20 integrated HDD or flash drive bull High performance 2D3D ATI video controller capable of driving two displays in parallel supports VGADVI interface bull Intel Core 2 Duo at 216 GHz Intel Core Duo at 20 GHz2x PMC expansion site bull One XMC optional bull Up to 4 GB DDR2 SDRAM wECC 2x GbE

RSC No 33447

GE Fanuc Intelligent Platforms Incwwwgefanucembeddedcom

Single Board ComputersGD Canada designs and manufactures conduction-cooled Single Board Computers (SBCs)using Intel processors bull 6U and 3U form factors for CompactPCI backplanes bull Fully backward compatible with earlier models bull Upgradeable via the change-out of processor memory andIO modules bull Used within GD Canada computer systems and sold as individual products

RSC No 35281

General Dynamicswwwgdcanadacom

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PrOduCT GuIdE6U CompactPCI

cPCI6U-24DSI32R32-channel 24-bit delta-sigma CompactPCI 6U analog input board with rear IO bull Low noise 24-bit resolution low phase distortion andmulti-board synchronization bull Suits state-of-the-art sonar and noise monitoring applications bull 32-channel cPCI6U-24DSI32 analog input boardprovides a high-density 24-bit analog input resources on a standard 6U CompactPCI expansion board bull Applications from precision voltagemeasurements to complex audio signal and waveform analysis

RSC No 34985

General Standards Corporationwwwgeneralstandardscom

Duet 3U 64-bit 1 GHz TMS320C6416 DSP (x2) 64 MB SDRAM per processor bull Flexible internalexternalcommunication mesh bull 64-bit66 MHz CompactPCI bull PMCXMC site with Jn4 to FPGA and4 RocketIO per VITA 42 bull External data port up to 12 Gbps bull 4M or 5M Virtex-II Pro FPGAbull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM dedicated800 MBps links between DSPs bull 3U CompactPCI with PXI support bull Suits high-end co-processing wireless broadband communications RADAR video and biometrics

RSC No 32856

QuadiaQuad-DSP bull Dual FPGA bull Dual PMC sites bull Inter-processor connectivity and access to external interfaces bull Four C6416 DSPs split in two independent clusters each hosting a PMC site bull One large FPGA for end-user code bull Central FPGA routing interprocessor communication bull End-user FPGA communication bull External port serial IO for PCIe or other p ivate link bull Global memoryand PCI interface bull 1 GHz TMS320C6416 DSP (x4) bull 64 MB SDRAM per processor bull Flexible internalexternal communication mesh bull 64-bit66 MHz CompactPCI bull Two PMC sites with Jn4 to FPGA bull External data port up to 12 Gbps bull Two 4M Gate FPGA reserved for end-user code bull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM bull Up to 512 MB Global DDR SDRAM bull Suits high-end co-processing wireless and broadband communications

RSC No 34737

Quixote 64-bit 6UAdvanced signal capture generation and co-processing bull 1 GHz TMS320C6416 DSP and2 to 6 MGATE Virtex-II FPGA bull 32 MB SDRAM 8 MB ZBT SBSRAM and AD6645 and AD9764 converters bull 6432 bit CompactPCI 66 MHz 5 V33 V and complex trigger modes with HW event logging bull PMC site with Jn4 to FPGA DIO and PICMG 217 StarFabric compliant bull Suits Software Defined Radio wireless IP and RADAR development and hardware testing bull Physical Layer field testing ultra-fast flexible data acquisition vector signal generation and electronic warfare

RSC No 32861

Innovative Integrationwwwinnovative-dspcom

IC-e6-cPCIbHigh performance 6U CompactPCI board bull Powered by one or two of Freescalersquos mostadvanced 14 GHz MPC7448 PowerPC processors bull PICMG 216 compliant bull Marvell Discovery III chipset (MV64460) bull Low power consumption bull Standard extended and rugged grades

RSC No 32982

Interface Conceptwwwinterfaceconceptcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CP213Single-width 6U CompactPCIPXI module with either 32 or 64 differential analog input channelsbull 32 64 or 128 channels of analog input bull 16 multifunction digital IO (TTL) channels that may beconfigured as digital in digital out or selectively attached to 2 frequency in 2 counter in andor 2 timerout channels bull 16-bit resolution bull Programmable gain per channel programmable scan rates of lt1 Ss through 100 KSs bull Precision onboard reference for end-to-end calibration

RSC No 34804

KineticSystems Company LLCwwwkscorpcom

CP6001Energy efficient embedded Intel dual core processors bull 12 GHz Intel Core Duo U2500 ULV processor bull Intel Core 2 Duo L7400 LV processor bull Based on the Intel Mobile 945GM chipset with a front side bus of up to 667 MHz and ICH7-R Southbridge bull Two independent digital video outputs to the rear IO (2x DVI - 1x DVI and 1x HDMI) bull AC97 audio capabilities bull 3 x GbE bull 4 x SATA with RAID 01510 functionality bull 6 x USB 20 2 x COM and VGA or DVI bull Can also accommodate a PMC slot or an onboard 25 inch SATA HDD bull Up to 8 GB of USB or 2 GB soldered flash bull Supports Linux Windows XP XP embedded and VxWorks 6

RSC No 34182

CP6923 GbE Switch6U CompactPCI GbE Switch PICMG 216 compliant bull Leading edge te hnology basedon BCM5650X chip bull 24x GbE ports bull Non-blocking Layer 2 and 3 switching and routingbull Copper optical rear IO version bull Hot swap IPMI bull Fully managed bull Comprehensive firmware package bull Applies to VoIP installations such as call servers media gatewaysand trunking gateways in wireline and wireless networks as well as VoIP systems inenterprise networks with high demands on performance

RSC No 32256

Kontronwwwkontroncom

TMS320C6701 Virtex-IITexas Instrumentsrsquo C6701 DSP bull Xilinx Virtex-II series FPGA up to XC2V8000 bull Multiple IO interfaces Onboard CODEC VIM expansion sites 60-pin GPIO header and JTAG bull Hardware drivers integration in SimulinkXilinx System Generator Blocksets for quick implementation of Simulink models bull DSP and FPGA-in-the-loop cosimulation of SimulinkXilinx System Generator models bull Leading edge communication interface allowing real-time datamonitoring from Simulink scopes and remote operations

RSC No 32028

VHS-DACHigh performance multichannel DA for phased array antenna systems radarsonar communications receiversup-sampling to IF stage and RFIF AGC apps bull Eight 125 MSPS output channels bull Optional add-on daughter boardprovides 8 additional output channels or 8 additional input channels bull 32-bit 25 MHz bull FPDP interface with 400 MBps transfer rate (25 MSPS per channel at 8 channels 125 MSPS at 16 channels) bull Low level hardware drivers API andGUI bull High level hardware drivers integration in Simulink Blocksets bull Leading edge communication interface fordata recording and playback tofrom the onboard SDRAM

RSC No 32029

Lyrtechwwwlyrtechcom

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PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

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PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

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SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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Page 6: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

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By Joe Pavlat

CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems

EDITORrsquoS FOREWORD

Why AdvancedTCA is at home in HSS

With this first issue of 2008 (Happy New Year) our colleague Sven Freudenfeld from Kontron gives us an excellent and detailed comparison of 1U rack-mount servers and AdvancedTCA in a real application a Home Subscriber Server (HSS) He describes the application in detail and then compares

space cooling maintenance management capabilities scalability and switching require-ments Sven makes a compelling case that AdvancedTCA provides many essential application elements that must be separately and expensively added to 1U servers He concludes that AdvancedTCA allows Telecom Equipment Manufacturers to concentrate on developing software instead of hardware and that reduces development costs and speeds time to market

PICMG addressing new data bandwidth standardsWhile AdvancedTCA provides a great deal of backplane bandwidth especially in full mesh configurations designers want to go even faster to accommodate new bandwidth-hungry applications like IPTV Last year the IEEE ratified important new standards for 10 gigabit per second data transmission over a single pair of conductors Of special interest to our community is the 8023ap 10GBASE-KR standard which details how to achieve that blaz-ing speed over a backplane The PICMG community is moving towards setting up a new subcommittee to incorporate this technology into the AdvancedTCA standard and it may be operating when this issue hits the street It has the potential of providing a total useful backplane bandwidth of 10 terabits per second in a single shelf Thatrsquos a truly amazing

number Douglas Hynd from the Simclar Group introduces us to the details of designing systems at that speed discuss-ing losses signal skew and crosstalk At these speeds simulation is essential and Douglas describes some of the issues involved Also in this issue Stuart Jamieson from Emerson Network Power gives us additional insight into high-speed signaling design simulation and analysis

A name change from Technology in Europe to Global Technology goes into effect this month for the column written by industry veteran Hermann Strass In this issue Hermann tells us how CompactPCI products from MEN Micro have been incorporated into the design of a new highly sophisticated digital cinema camera developed by Silicon Imaging In addi-tion to providing very high resolution and speed the camera must also operate in harsh environments MEN Micro won the 2007 Intel Communications Alliance Innovate and Ignite Technology Showcase award for its work

Curt Schwadererrsquos Software Corner this month expands on a subject he wrote about last April (wwwcompactpci- systemscomcolumnssoftware_corner 200704) As cable companies expand their offering beyond television to voice and data services they become subject to the same laws relating to cyber crime as the traditional telecommunications pro-viders do They must provide law enforce-ment authorities surveillance that is the subject of a lawful warrant and industry standards are being rolled out to do this Itrsquos a timely topic as serious problems with identity theft and cyber crime ingeneral are on the rise Curtrsquos column isan interesting read

Joe Pavlat Editorial Director

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By Hermann StraSS

GLOBALTECHNOLOGY

CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems

Award recognizes unique ruggedcamera control system

The 2007 Intel Communications Alliance Innovate and Ignite Technology Showcase (ICA) named MEN Micro Inc the ICA Showcase winner on September 19 2007 at the Embedded Systems Conference Boston MEN Micro a

subsidiary of MEN Germany has developed a unique control system for a rugged digital movie camera

Silicon Imaging an innovator in IT-centric digital cinema cameras required a rugged camera control system for its new SI-2K camera The SI-2K (shown in Figure 1 courtesy of Silicon Imaging United States) executes direct-to-disk raw recording at either 1920x1080 pixel high definition or at 2048x1152 pixel for cinema resolutions Its 48-bit digital processing algorithms perform adaptive pixel-by-pixel calibration and color image enhancement The SI-2K fore-goes legacy fixed bit-rate DCT codec recording formats such as DVCPRO HD and HDCAM-SR for advanced wavelet compres-sion technology Current generation HD cameras destructively process and compress their imagery at the acquisition stage The SI-2K streams images as raw digital negatives over a standard GbE connection The Intel Core 2 Duo processor-based F17 system from MEN non-destructively processes the raw digital negatives in real time to the visually perfect CineForm RAW codec which makes capturing up to four hours of continuous footage on a single 160 GB notebook drive possible

MEN Micro developed a customized version of its Intel Core 2 Duo processor based F17 3U CompactPCI SBC a unique side card for advanced audio and video capabilities as well as a rug-ged compact enclosure Already being used at independent film production studios for the making of full-length feature films the digital camera employs technology that can be repackaged for surveillance military sports analytics 3D video and stereo ap-plications The camera can operate in environments ranging from desert to arctic

The F17 SBC from MEN (Germany) controlling the camera in-cludes an Intel Core 2 Duo processor T7600 running at 233 GHz The SI-2K uses MENrsquos SBC for simultaneous encoding of data An Intel Graphics Media Accelerator 950 (Intel GMA 950) per-forms image graphics processing colorization and visualization at full resolution The F17 is equipped with 2 GB fast DDR2 DRAM a hard disk on a removable slot and two Intel GbE PHYs which transfer data from the camera head to the camera control unit and to other standard IP hardware The custom side card enables the connection of a High-Definition Multimedia Interface (HDMI) headphones and balanced analog input and output ports for pro-fessional audio signals

Specified for an extended temperature range in harsh shooting environments the camera uses MEN Microrsquos F17 board equipped

with a massive tailored heat sink accompanied by a fan install-ed inside the camerarsquos housing The F17 is part of MENrsquos powerful family of intercompatible CompactPCI Express SBCs including the newer and more powerful F18 which is completely compatible with the F17 and will also be incorporated into Silicon Imagingrsquos new SI-2K camera

European eventsThe 26th MOTEK International Trade Fair and Exhibition the worldrsquos largest event for assembly handling and automation sup-port systems and devices was held for the first time in the brand- new Neue Messe in Stuttgart Germany from September 26 to September 27 2007 The exhibition space increased by 45 percent over last yearsrsquo event due to the new venue More than 1100 exhibitors from 20 different countries drew around 40000 visitors and filled all five new exhibition halls Mechatronics was speci-fically featured as were robots and automation equipment In 2008 about one million square feet of exhibition space will be available when four more halls are completed at Europersquos most modern fair grounds near the Stuttgart Airport Terminal

EMO 2007 (Hannover) the worldrsquos largest exhibition of metal-working equipment closed its gates on September 22 after six days of exhibition with around 160000 attendees visiting booths of 2100 exhibitors from 42 countries 18 million square feet was devoted to exhibition space The organizers German Association of Machine Tool Manufacturers (VDW) reported new busi-ness contracts at the rate of 4 billion EURO (almost $6 billion) Exhibitors such as TRUMPF Laser Germany (see my April 2007 column (wwwcompactpci-systemscomcolumnsTechnology_in_Europe200704) reported full success at EMO 2007

For more information contact Hermann athstrassopensystems-publishingcom

Figure 1

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By Curt SChwaderer

CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems

SOFTWARE CORNER

In the April 2007 Software Corner column (wwwcompact-pci-systemscomcolumnssoftware_corner200704) we explored surveillance systems and the Communications Assistance for Law Enforcement Act (CALEA) a lawful

surveillance capability mandate Internet access and VoIP pro- viders had to be compliant with CALEA by May 2007 or face severe financial penalties

In this monthrsquos column we will look at what cable companies are doing to provide lawful surveillance capabilities within their networks

The term cable company is now officially a misnomer Cable companies and their networks are capable Internet access and voice service networks that offer the general public a one-stop shop for all their communications and entertainment needs In fact cable companies now typically call themselves Multi-Service Operators (MSOs) Voice and data services form a significant and grow-ing source of revenues for the MSO To that end cable networks become subject to the same rules and regulations that telecommu-nications networks do

One of these regulations is CALEA which provides the ability for network providers to tap specific subscribers when served a warrant To their credit cable companies and their research and development consortium organization CableLabs (cablelabscom) have been very proactive planning for lawful surveillance capa-bilities and CALEA compliance within their networks CableLabs and its partners have been working on a set of PacketCable stan-dards that incorporate specifications for voice and broadband data intercept We will focus on the new Cable Broadband Intercept Specification (CBIS) what it encompasses and paths for imple-mentation within cable networks

Cable Broadband Intercept Specification The set of specifications governing cable network services and capabilities is called the Data-Over-Cable Service Interface Specifications (DOCSIS) The specification that covers lawful

surveillance for data services is CBIS The CBIS reference model is shown in Figure 1

The surveillance architecture consists of three components the Mediation Function (MF) Broadband Intercept Function (BIF) and Collection Function (CF) When a warrant for a subscriber is served the network administrator configures the MF to capture traffic coming to andor from the subscriber This traffic includes any dynamic IP address assignment transactions (called out-of-band traffic) as well as the traffic resulting from e-mail voice or data services being used by the subscriber in question Creating hashes of these files validates the captured traffic as not having been tampered with It is also important for the network provider to supply traffic only for the subscriber the warrant is served on Older methods of surveillance involve dumping all traffic from a particular service area from all users in that area then sifting through that traffic manually This method violates the privacy rights of all the other subscribers in the service area of the individual(s) the warrant is served on Surveillance equipment that can capture only the traffic to or from the subscriber in the warrant is critical to the lawful surveillance aspects of the deployment

So far this is similar to the Alliance for Telecommunications Industry Solutions (ATIS) standards governing voice and data surveillance for digital wire line systems Unlike the original ATIS specifications the CBIS specification includes the BIF The BIF is a buffering component where the Mediation Function pushes the surveillance information (in the form of surveillance files) to the BIF for retrieval by the Collection Function at a later date

The CF component gathers the surveillance information from the BIF under law enforcement control then analyzes and presents the surveillance information in a useful way The CF also validates the information by comparing hashes of the files against hashes generated by the surveillance equipment at the time of capture This ensures that from the time the traffic is captured it is not tampered with

Cable and CALEA A look at cable networks and lawful surveillance

Figure 1

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Buffering is importantThe buffering capability the BIF provides in the CBIS specifi- cation is an important distinction between it and the ATIS specification (for more information on the ATIS specs see the April 2007 Software Corner (wwwcompactpci-systemscom columnssoftware_corner200704)

Buffering is so important that ATIS has approved an additional standard for a Buffering Function (BF) within the ATIS lawful surveillance environment

The importance of buffering is best described in a presentation that Dr Glen Myers CEO of IP Fabrics gave at the December 2007 ISS World conference The real-time delivery that the initial ATIS specification defines can be problematic as Figure 2 shows Packet loss from congestion bit errors or QoS contracts can result in the entire surveillance stream being rendered inadmissible

Dr Myers further explained that ATIS allows their buffering model to be separate from or combined with the MF while the cable network CBIS model assumes the buffering function is always separate from the MF component (Figure 3)

The buffering function whether it be the Buffering Function in the ATIS model or the Broadband Intercept Function in the CBIS model minimizes the impact of packet loss and real-time data delivery The Mediation Function can repeatedly attempt to send surveillance information to the BIF through a secure reliable file transfer function such as secure FTP If there are problems connecting with the BIF alerts can be generated so the network administrator can find and fix the problem while the surveillance information is still resident on the MF system

Dr Myers mentioned other important benefits to providing a buffering function The network administrator does not need to

negotiate and install a dedicated link for each intercept between the MF and the Law Enforcement Agency or agencies (LEA) authorized for the information Dedicated pipes matching the subjectrsquos peak service bandwith are not needed Support for mul-tiple LEAs is easily implemented at the BIF instead of the Mediation Function Law enforcement collection equipment does not need to be co-located with the Mediation Function It also simplifies connectivity by eliminating Virtual Private Networks (VPNs) or other routing ele-ments between the MF and the LEA(s)

CALEA and CMTSIn a cable network the Cable Modem Termination System (CMTS) is typically the central point within which service provider traffic from the access network meets the cable core network (and ulti-mately the Internet) So the CMTS is an important interface point for lawful surveillance

CMTS equipment may provide varying levels of support for lawful surveillance The simplest is to provide access to all the raw traffic flowing through the CMTS using an Ethernet tap or span port In this scenario the Mediation Function must find the traffic belonging to the subscriber under surveillance generate the appro-priate CBIS files and send the files to the BIF

Cisco a leading supplier of CMTS equip-ment to the cable industry provides a capability called Service Independent Intercept (SII) within their CMTS prod-ucts Cisco SII is also used in their routers and intelligent switches for QoS control in addition to lawful surveillance While SII provides support for identifying traffic by MAC and IP address information it does

Figure 2

Figure 3

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not provide the high-level configuration and lawful surveillance messages required of the Mediation Function SII uses low-level SNMP MIBs that control MAC and IP address configuration commands which in turn trigger the Cisco SII device to send packets matching the configuration to a span port where the Mediation Function can use these matched packets to generate the lawful surveillance messages So SII provides a first-level filter for the Mediation Function which supplies a high-level configuration interface at the warrant description level as well as creation of the CBIS (or ATIS) messages to be sent to the BIF

CBIS-compliant productsThe CBIS specification is quite new so released products are mostly on the hori-zon However the IP Fabrics DeepSweep Lawful Surveillance product line does provide MF andor BIF functionality for the implementation of CBIS-compliant networks Dr Myers noted that the DeepSweep product line is based on a flexible architecture and a highly parallel processing environment comprised of many software surveillance modules that can be loaded and chained within the DeepSweep to provide a number of Layer two to seven surveillance and packet analysis activities The device is programmed through a GUI and operates as a full Mediation Function with the ability to identify subscriber-related IP address assignment and resulting traffic from a span port The DeepSweep also has software support to communicate with SII enabled routers and CMTS sys-tems to provide a fully compliant ATIS andor CBIS surveillance environment compatible with Cisco lawful intercept and QoS services

CBIS BIF and ATIS buffering appliances are also available to provide buffering compliant with CBIS and ATIS standards

ConclusionCyber crimes such as identity theft child pornography chat-room initiated abduc-tion national security and piracy are very real and growing issues in todayrsquos society Billions of corporate and personal dollars have been tied to cyber crooks that abuse the Internet to participate in these activities It is essential that these illegal activities can be identified and stopped It is a good idea to be aware that the cable industry and its proactive support of lawful surveillance standards as well as rolling out equipment that implements these standards will in turn enable law enforcement to catch these cyber crooks and make the Internet a safer place for us and our children to live learn and work

For more information on this or any Software Corner contact Curt atcschwadereropensystems-publishingcom

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APPLICATION g

Based on current overall network growth Telecom Equipment

Manufacturers (TEMs) and Network Equipment Providers (NEPs)

are being challenged to launch new communications platforms

that provide optimal scalability flexibility manageability and

high computing performance With the expected increase in new

subscribers who need to be supported across the network TEMs and

NEPs are focusing on COTS platforms that meet the requirements of

a carrier-grade environment

With these new challenges it is important to take a look at the different

applications in the network to thoroughly evaluate the best hardware

platform approach Comparing the scalability IO functionality

interconnectivity and overall performance gives TEMs and NEPs a

solid basis from which to choose the best cost-effective solution for

their applications This article compares the traditional 1U PCI

platform with a more modular AdvancedTCA-based approach to

a Home Subscriber Server (HSS)-based platform

Emerging next-generation network architecture IMS Carriers and service providers are focused on improving their Average Revenue Per User (ARPU) by deploying new services quickly and at a price that is acceptable to subscribers IP Multimedia Subsystems (IMS) enable service providers to offer differentiated services to their subscriber base integrating voice video text and content as part of their service mix regard-less of the access technology

The IMS framework provides the telecom industry with a modular standards-based IP service delivery infrastructure More than simply replacing existing circuit services with similar services delivered over IP IMS allows service providers to capitalize on faster and more cost-effective deployment of new and differentiated multimedia communication services

While these new technologies promise new sources of revenue and enhanced customer loyalty they also pose implemen- tation challenges One of the crucial net-work elements within an IMS framework is the manageability of the subscriber base Today an increasing number of users subscribe to multiple services such

By Sven FreudenFeld

Choose the right formula forcompute-intensive HSS systems

AdvancedTCA platforms

versus1U PCI rack-mount servers

AdvancedTCA

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as multimedia mobile phones VoIP or IPTV at home Service providers must manage ldquoduplicatedrdquo subscriber databases for each particular service Consequently managing a converging subscriber base for such network functions as billing across multiple different technologies presents a tremendous challenge Any downtime of this network element can be costly to the carrier or service provider not to mention the heavy risk of losing subscribers over the long term

The HSS and Home Location Register (HLR) are key elements in the IMS network required to manage the growing number of subscribers These platforms that manage millions of customersrsquo data need to be highly reliable with carrier-grade High Availability (HA) functionality Core requirements for the HSS computing platform are

n High compute density for application processingn Scalable performance and high densityn Fast read access to the subscriber datan Large storage and memory bandwidthn Ability to consolidate multiple IMS elements and subscriber data within a single

platform with a modular approach as a converged services platform

HSS plays network backbone roleHSS provides the important network backbone of the IMS architecture because it eases innovation and addresses a range of service-logic interaction issues that have plagued previous service architectures HSS offers open access to service-related data for each subscriber supporting the sharing of data among multiple services

HSS is essentially the master user database that supports IMS network entities that handle calls and sessions It contains user profiles performs authentication and authorization of the user and can provide information about the physical location of the user It plays a key role in provisioning service creation enabling subscriber data and managing control roaming and interconnection The Application Server (AS) which hosts and executes serv- ices in the IMS environment communicates with the HSS Call State Control Function

(CSCF) servers also communicate with the HSS which must be able to

n Support IMS-level authentication and authorization

n Maintain IMS subscriber profile(s) independent of access types

n Maintain service-specific datan Keep track of currently assigned

CSCFn Support CSCF and AS access

HLRHSS hardware platform design choicesHSS design must enable the HSS to be deployed cost-effectively and expand readily to meet future subscriber levels For example the trend to include more information as part of the data record for each subscriber will drive up memory requirements

From a technical perspective the key metrics to understand when developing the IMS HSS functions are the number of completed transactions required per sec-ond and the size of the subscriber base

HSS architecture typically comprises multiple processor units with extensive memory requirements With the introduction

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of multicore processors from Intel developers can scale performance while optimizing power consumption in the overall system design

To meet these requirements the hardware platform needs to provide scalability flexibil-ity and long-term cost efficiency In comparing the traditional 1U platform with a more modular approach to the HSS using AdvancedTCA consider the following

n High compute performance n High memory and storage capabilityn IO functionality to connect to multiple networks (such as SS7 and Ethernet)n Carrier-grade profile and redundancy

AdvancedTCA High density with scalability on a smaller footprintTable 1 illustrates a comparison of a sample AdvancedTCA-based platform and a 1U PCI rack-mounted platform for HSS applications This configuration assumes an increasing subscriber growth from 1 million (M) subscribers to 18M subscribers per platform

FootprintAdvancedTCA-based platforms provide a high density compute platform with scalability on a smaller footprint TEMs can easily add boards to a chassis to accommodate more traffic and to support new services This flexibility enables an increase in subscribers and the database without having a major impact on rack space in the central office environ-ment To meet the same capacity for 18M subscribers the 1U PCI approach will occupy two bays or cabinets with a total footprint of 28 square feet compared to the same capacity occupying one bay or cabinet with a footprint of 14 square feet (see Figure 1)

CoolingWhile the power consumption per square foot is higher than the 1U PCI platform AdvancedTCA offers better airflow and cooling distribution using a push-pull cooling system Each 1U PCI platform includes up to nine cooling fans and is dedicated to that CPU in the 1U server only which translates into higher overhead Therefore the airflow is

not optimized in the overall system design In the case of a fan failure AdvancedTCA platforms enable easier access to replace the fans which are field replaceable units The 1U platform also does not include any integrated centralized switching or management capabilities therefore the total does not include any switching or system management functionality

ScalabilityAdvancedTCA architecture lends itself well to scalability As AdvancedTCA sup-ports both a Base and Fabric interface into the backplane and the separation of data and control planes TEMs can also scale up their designs from 1 GbE to 10 GbE to accommodate new users and usage requirements AdvancedTCA based systems are designed for easy upgrade-ability to new processing blades switch fabrics and IO modules using Advanced Mezzanine Cards (such as SS7)

Since AdvancedTCA and AdvancedMCs offer hot swap capabilities and HA func-tionality growing a subscriber base by using additional CPU blades within the system with low maintenance or upgrade downtime is crucial for the HSS plat-form It also allows for the up and down

AdvancedTCA-based HSS Platform 1U PCI Rack-Mount HSS Platform

Number ofsubscribers

~1M subscribers = 4 CPU blades edundant ~1M subscribers = 4 x 1U

~4M subscribers = 7 CPU blades redundant ~4M subscribers = 7 x 1U

~6M subscribers = 12 CPU blades redundant ~6M subscribers = 12 x 1U

~18M subscribers = 36 CPU blades redundant= 3 AdvancedTCA shelves per rack

~18M subscribers= 36 x 1U+ external switch components for redundancy

Technicalspecs

1 CPU blade = 2 x Intel Xeon dual core = quad core 1 1U rack-mount Intel= Intel Xeon quad core or dual core CPU

16 G DDR 2 memory Max of 8 G DRY memory

+ 2 x SATA or SASS hot swap (RAID 0 and 1)+ 1x PCI Express for SS7 Dual GbE per 1U rack-mount server

4 x GbE per CPU with built in GbE backplane switching separating Control Pathand Data Path with multishelf expandability

External central switching required withmultiple external GbE connectivity

Systems and blade manageability built into the platform withIMP implementation SNMP and CLIP

Carrier-grade redundancy on switch and node

IO for SS7 or other interface modules

CPU blade hot swap capability

Thermaland power

requirements

~6M subscribers redundant= 14 slots with centralized chassis cooling

~6M subscribers redundant= 18 x 1U PCI with independent cooling and separate switch units and system management

Total power consumption= ok (3100 W for blades and RTM + 500 W Shim fan tray and SAP)

Total power consumption= ok

Table 1

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scaling of the platform depending on the subscriber increase or decrease When consolidating multiple services minimiz-ing multiple duplicate databases requires this flexibility

InterconnectivityThe AdvancedTCA platform offers a number of interconnectivity features including

n Separation between the data plane and the control plane

n Direct uplink in a multichassis envi-ronment with up to l0 GbE

n Node to node base and fabric connec-tivity with HA carrier-grade Ethernet functionality

n Easy upgrade path to l0 GbE for increased bandwidth

By contrast the 1U PCI platform requires

n Additional external interconnectiv-ity between 1U rack-mount servers which increases the number of points of failures and the operating and maintenance costs

n Additional switching equipment for carrier-grade Ethernet connectivity

n Additional manage-ment (Simple Network Management Protocol [SNMP]) for HA redundancy

PowerThe 1U-based platform also utilizes integrated AC power supply units usually the standard for the data center and enter-prise environments AC will increase the pro-viderrsquos OPEX in the long term since the power consumption per rack is significantly higher and

Figure 1

requires additional support equipment such as an Uninterruptible Power Supply (UPS) and an AC to DC converter per rack space and ultimately per CPU These factors along with the requirements for carrier-grade functionality HA support and a more favorable long-term OPEX further reduce the need to consider the 1U solution for HSS deployments in Central Office networks

ManageabilityAdvancedTCA chassis-level management is based on the industry-standard Intelligent Platform Management Interface (IPMI) IPMI makes possible interoperability among chassis and blowers compute nodes switches and management solutions from multiple vendors enabling these elements to work together seamlessly The resulting successful inter-blade communication for applications including failover and clustering provides full manageability on a per shelf and per bay basis

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One of the primary goals of the AdvancedTCA specification is to ensure a very low Mean Time to Repair (MTTR) and high Mean Time Between Failures (MTBF) There are no active components in the backplane ndash which can translate to expensive repairs in the field In addi-tion AdvancedTCA specifies that all com-ponents can be hot swappable in the field and the architecture provides redundancy at all levels This hot swap capability translates to less downtime for field replacement on a per CPU blade basis as compared to 1U PCI

SummaryAdvancedTCA provides an ideal platform and meets the technical requirements for deploying flexible and scalable IMS HSS applications While other platform archi-tectures such as 1U rack-mount servers may with considerable difficulty be able to deliver HSS capabilities AdvancedTCA offers a much more advantageous solution by providing a smaller footprint improved cooling and thermal characteristics bet-ter scalability enhanced interconnectivity and easier manageability This all contrib-utes to making AdvancedTCA a lower cost approach in terms of CAPEX and OPEX for long-term subscriber growth

1U PCI rack-mount servers are not considered to be the optimal hardware platform for HSS applications in a Central Office With its limitation for carrier-grade flexibility and HA functionality the 1U PCI platform is best suited for a full range of other enterprise and Internet infrastructure applications within a data center environment that does not require any significant flexibility and HA functionality around it It might also be a good entrance point for other enterprise applications with lower price points

The use of AdvancedTCA-based platforms enables TEMs to shift away from hardware development and refocus their efforts on delivering value-added software and services As a result they can realize lower development costs and faster time-to-market enabling increased flexibility with each product design through the use and reuse of standardized off-the-shelf components Equally significant are the advantages that can be realized by the service provider With a common platform and a flexible architecture that maximizes limited floor space service providers can rapidly and flexibly implement a broad range of feature-rich solutions for faster profitability

Sven Freudenfeld is responsible for North American Business Development for the Kontron AG line of AdvancedTCA AMC MicroTCA and Pre-Integrated Solutions Sven possesses more than 15 years of experience with voice data and wireless com-munications having worked extensively with Nortel Networks in Systems Engineering Sanmina-SCI in Test Engineeringand Deutsche Telekom in Network Engineering Sven holdsan electrical engineering degree from Germany and is also Chair of the CP-TA marketing workgroup focusing on the interoperability of COTS standard building blocks

Kontron bull svenfreudenfeldcakontroncom bull wwwkontroncom

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TECHNOLOGY g BACkpLANES

Increasing demand for service and multimedia features is stimulating a growing need for speed in telecom-munications equipment While some

applications such as PBX systems can be addressed with the gigabit backplane technologies currently available others are running out of headroom Routers may soon need 10 Gbps and higher speed back-planes to keep up with network demand Many such applications can justify the expense of moving to higher performance if it becomes available

Currently telecom system designs offer backplanes that can handle interconnec-tions running as fast as 3125 Gbps raw data throughput per lane (with around a maxi-mum data rate capability of 5-625 Gbps per lane) The AdvancedTCA standard for instance uses Ethernetrsquos XAUI inter-face AdvancedTCA achieves a 10 Gbps net data rate by running four serial lanes for each interconnection with each lanersquos

SERrializerDESerializer (SERDES) op-erating at 3125 Gbps raw data (25 Gbs net)

As demand forces systems to move beyond these rates however new technologies will be needed One proposal calls for the use of XAUI+ or double XAUI which increases lane SERDES rates to 625 Gbps per lane and hence the throughput to 20 Gbps Another proposal is to use IEEE 8023ap known as 10GBASE-KR which runs a single SERDES lane at 125 Gbps raw data rate (103 Gbps net) But these are only short-term answers To address future demands organizations such as the Institute of Electrical and Electronic Engineers Standards Association (IEEE-SA) are developing specifications for Ethernet speeds of 40 Gbps to 100 Gbps which will be applied to backplane interconnect

Such high clock rates however will pose significant design challenges for developers

One of the first challenges that will need resolution is the design and layout of the backplane and other PCBs Common design practice today readily handles board clock rates of around 10 Gbps Well established design rules are in place and board layout tools such as autorouters can automatically handle board designs for speeds in the 10 Gbps range Designers may use specialized board material create additional ground planes and perform similar tasks in order to ensure proper board operation at the higher end but even speeds to 5 GHz are within current design tool capabilities

Design gets trickierAbove 5 GHz however board design gets more involved because feature dimensions become significant when compared to the signalrsquos wavelengths Variations in board thickness can affect signal propagation Corners where traces change direction and small spurs along edges of poorly etched

Channel characteristics

challenge backplane interoperability

Serial backplanes in telecommunications systems aim for high speed with room for

growth As systems began using 10 Gbps links however issues arose that affected backplane

communications among cards from different manufacturers Stuart points out that the

industry must define key backplane channel characteristics so that designs based on open

standards maintain interoperability as backplane speeds move to 40 Gbps and beyond

By Stuart JamieSon

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traces can act as antennae for the higher fre-quencies in digital signals As can be seen in Figure 1 sharp corners and minor flaws that are inconsequential at lower frequen-cies have the potential to become trouble-some antennae at future high speeds This can result in the trace radiating away the signalrsquos high frequency energy increasing EMI and crosstalk as well as altering signal waveforms New routing design rules such as making corners 30deg instead of 45deg and more careful board fabrication techniques may become necessary as designs move above the 10 Gbps per lane threshold

The move to higher frequencies will affect more than board fabrication and layout however Higher frequencies will also impose new requirements on signal tim-ing signal rise-time electrical distance and waveform shape if developers are to retain the mix-and-match system design approach that makes standards-based system design effective

For interoperability to be achievable at data rates above 10 Gbps organizations such as PICMG will need to carefully define a vari-ety of signal and design parameters in their specifications Some of the key parameters that will need consideration include

n Interconnect signal attenuationn Eye diagramn Jittern Input clock recoveryn Chip inputoutput pre-emphasis (PE) n Equalization (EQ)

Even slight variations in these parameters from device to device and lane to lane can shift the timing of signals a significant fraction of a clock cycle and affect the Bit Error Rate (BER) of a lanechannel Finally signal rise times will require tight control as signal rates increase in order to ensure control of system timing (see Figure 2)

In defining signal and design parameters specifications will also need to account for the increased location dependency that comes with higher frequencies Even subtle differences in attributes such as routing length and trace impedance become increasingly significant as signal speeds rise To ensure mix-and-match interopera-bility then design specifications may need to account for the specific backplane slot that a board is to occupy as well as introduce a method to obtain and control the PE and EQ of the devices connected to the lanes

Designers must also address fabrication standards The material used to fabricate

Figure 1

Figure 2

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the board the thickness and composition of metal cladding and the spacing between layers can all affect the trace characteris-tics Controlling these parameters under specification ensures that timing charac-teristics are sufficiently uniform from one board to another However current speci-fications are too detailed and stringent It is extremely difficult to attain compliance yet avoid adding cost to the design

Specifications need workSome of these parameters are already incorporated into current specifications The AMC module specifications from PICMG for instance include design parameters that ensure its proper opera-tion at signal speeds as fast as 125 Gbps per lane Establishing specifications for other system components will help achieve interoperability of standards-based designs at higher frequencies

Design tools may also need to be modified and the industry will need to create new design rules for high frequency and incor-porate these into the tools Developing new routing techniques will help avoid the issues of electrical phenomena such as skin effect dielectric loss and impedance mismatches These are much more preva-lent at higher frequencies and it becomes critical for engineers to model and simu-late these phenomena more accurately

Early efforts are already underway to address the challenges that higher fre-quency signals bring to standards-based design The Interconnect Channel Characterization Subcommittee of PICMG established in September 2006 is develop-ing ground rules and definitions to be used in characterizing transmission reflection and crosstalk performance in backplane and mezzanine carrier interconnects The committee aims to define the channel parameters to be measured or analyzed as well as the methods for doing so Its charter calls for it to address

n Definition of interfaces at which measurements are made or characteristics computed

n Test equipment fixtures and PCB test coupons

n Details of measurement proceduren Data formatsn Techniques for de-embedding

components of the channeln Techniques for validating

measurement based models ie passivity and causality

n Definitions that allow reasonable compliance testing

n Boundary definitions for different paths

n Define information regarding limita-tions or proper usage ie maximum data raterise times that are supported by the models

Such efforts are only a beginning how-ever Other design details still need to be addressed such as SERDES IO Configuration New functionality may need to be defined The design of high data rate system channel interfaces according to standardsspecifications does not currently cover the individual characteristics of the chip transmitterreceiver characteristics Thus work will be needed to address how such standard designs handle such dependency

Crossing an interoperability thresholdOne way of handling location dependen-cies might be to give the system control-ler the ability to inform modules what the channel transmitter and receiver PE and EQ technology is and importantly how to control it With this information along with the signal attenuation suffered (at a given bit rate) for the channel the system should be able to configure SERDES channels in different physical locations to run reliably and at the required BER In MicroTCA systems for instance this functionality could be incorporated into the MicroTCA Carrier Hub (MCH) as part of its electronic keying function Modules would have to be able to configure and control its backplane interfaces to allow for different positions

in the backplane An MCH (see Figure 3 courtesy Emerson) then would be able to instruct a module as to which parameters to use for interoperability

The specific approaches needed to handle location dependencies and other challenges that higher signal rates raise have yet to be developed The need to address these challenges however is clear Increasing demand for services is driving applications to utilize faster signal rates This in turn is driving backplane signaling speeds ever higher As speeds rise above 10 Gbps sig-nals will cross a threshold where current specifications will prove inadequate for ensuring interoperability among standards-based designs

The industry should begin developing new or enhanced specifications and design tools to address the challenges of higher signal rates Without such improvements the guarantees of interoperability that allow system developers to readily create solu-tions by combining off-the-shelf products will be compromised As backplane speeds approach 100 Gbps nothing can be taken for granted

Stuart Jamieson Director of Industry RelationsArchitect with Emerson Network Power Embedded Computing represents Emerson on PICMG committees and the SCOPE organization and previously served as a CP-TA Board member (Treasurer) He brings over 18 years of experience in hardware protocols embedded software and specification development to these groups Within Emerson he played a key role in the develop-ment of the technology central to Emersonrsquos bundled network-ing solutions Stuartrsquos positions within Emerson have included Director of Business Development Director of Advanced Technology and Architect He is the Draft Editor for the PICMG Interconnect Channel Characterization Subcommittee is the author of the introduction section for the new PICMG Ruggedized MicroTCA specification and served as the Draft Editor for the PICMG MicroTCA Specification Stuart gradu-ated from the Heriot-Watt University in 1989 with a 1st Class Honors degree in Electrical and Electronic Engineering and again in 1992 with an IBM-sponsored Master of Philosophy

Emerson Network Power Embedded ComputingStuartJamiesonEmersoncom bull wwwemersonembeddedcomputingcom

Figure 3

Fo Sin Pnt

TECHNOLOGY g BACkpLANES

2008

B A

N D

W I

D T

H

Signal integrity challenges to bandwidth scalabilityFor the purposes of this article each interconnected differential pair will be referred to as a Channel (which should not be confused with an aggregated AdvancedTCA channel comprising four trans-mit and four receive pairs)

14-slot full-mesh AdvancedTCA backplanes contain hundreds of Channels Each Channel is defined as the copper signal path from the output of a driver device to the input of a receiver device As

By douglaS Hynd

Developing IEEE 8023ap 10GBASE-KRcompliant backplanes

Why doesAdvancedTCA

need bandwidthscalability

PICMG AdvancedTCA 30 has emerged as the

industryrsquos Hardware Platform standard of choice and

is enjoying first-phase deployment However many

believe that for AdvancedTCA to realize its market

potential AdvancedTCA platforms need to seamlessly

scale to accommodate 40 GbE fabrics thereby

avoiding forklift upgrades as system bandwidth

demands increase over time A 40 GbE switch fabric

architecture would enable realization of a common

platform for computing storage control and media

and packet processing and provide the versatility and

long term ROI required by service providers in

todayrsquos increasingly competitive environment

The challenge was to develop a family of

AdvancedTCA products which feature PICMG 30

compliant dual star and full mesh advanced

backplane switch fabrics enabled up to 10 Gbps

per differential signal pair thereby giving 40 Gbps

per AdvancedTCA channel performance

This article describes the signal integrity challenges

presented in designing an IEEE 8023ap

10GBASE-KR-compliant bandwidth-scalable

14-slot AdvancedTCA platform and how these

challenges were overcome in development of full

mesh and dual star backplane reference designs

Fo Sin Pnt

shown in Figure 1 that signal path comprises a signal launch a blade PCB transmission line a daughtercard via a right-angled HM-ZD connector a mated HM-ZD backplane header a back-plane via a length of backplane PCB transmission line and then the same combination of connectors vias and transmission line at the receive end of the Channel

Sources of crosstalkFour principal sources of crosstalk in each Channel must be man-aged as shown in Table 2 Source number one is between adjacent differential pairs as they are routed across the backplane Common mode noise rejection in system differential pair structures makes this a minor issue The second source of crosstalk lies in the HM-ZD connector itself

Crosstalk in via fields our third source primarily arises from inductive coupling between adjacent differential pairs and domi-nates the crosstalk agenda in high-speed Channels This source of crosstalk is directly proportional to the length of the via barrel and where practical care must be taken to ensure that adjacent connector rows are terminated to different target routing Layers

The final source of crosstalk is caused by aggressor signals in through-routed via fields coupling with victim Channel traces as they pass through As mentioned earlier judicious and careful design can mitigate this impact

Skew Channel skew is a function of differential transmission path geometries At a fundamental frequency of 5 GHz skew can be a significant issue in high-speed system design due to narrowing the eye opening and increasing jitter Skew can have a significant impact on crosstalk it negatively impacts the common mode rejection of noise inherent to differential signaling Conductor surface roughness in lower performing dielectric materials can also cause skew in high-speed systems

Skew can be avoided through careful management of transmission path lengths in each Channel and by using higher-glass content (lower Dk) laminates

LossPotential

Potential Mismatches

Channel

Loss Potential Channel

PCB Tolerance -025 dB 2 -01 dB

Connector Tolerance -001 dB 4 -016 dB

Thru-routed Via Fields -001 dB 12 -144 dB

Connector Launch -025 dB+ 4 - 2 dB+

Quantity TotalNEXT

TotalFEXT

PCB Transmission Lines

24 in60 cm

-50 dB -70 dB

Connector Architecture 2 -26 dB -24 dB

Via Fields 4 -22 dB -20 dB

Connector Pass Through 8 -34 dB ndash34 dB

For the target application each one of these Channels must deliver a 10 Gbps Non-Return-To-Zero (NRZ) signal with sufficient signal fidelity to enable a receiver device to detect and process a differential signal The PICMG 30 specification is targeted at 3125 Gbps signaling with a fundamental frequency of 156 GHz Even in low loss dielectric materials insertion loss at 10 Gbps (5 GHz fundamental) is twice that of a 3125 Gbps signal

Therefore achieving acceptable signal fidelity requires careful management of signal losses and noise in each Channel such that an acceptable signal-to-noise (SN) ratio is achieved at the receiver

The design process therefore begins by understanding and mitigat-ing the sources of losses and noise in each Channel

Sources of lossThere are three sources of loss

n Conductor losses which are due to skin effects and can be addressed by maximizing the cross sectional area of the signal traces

n Material dispersion losses which are a function of the dielectric constants of the chosen material These can be mitigated by choosing a higher performance laminate material such as Nelco 4000-13SI or Megtron

n Reflected power loss due to impedance mismatches in the Channel as each signal transitions across the different copper media in each channel (connectors vias and PCB traces) and passes through the pad and anti-pad structures of the via fields of other backplane blade slots

Table 1 shows the relative effects of different sources of impedance mismatches The dominant source of impedance mismatches in every Channel resides in the via structures Successful mitigation of this problem requires that every via is tuned by back-drilling the stub and adjusting the pad and anti-pad structures to match the impedance to be 50 ohms irrespective of the target routing layer This in turn requires that the capacitive and inductive effects of the connector pin and via barrel combination are taken into account during the design of each Channel

Further complicating via design is the space the anti-pad structures need to accommodate Channels being routed between other blades while minimizing electro-magnetic coupling with them This space consideration makes the shape and orientation of pads and anti-pads extremely important

Figure 1

Table 1

Table 2

Fo Sin Pnt

IEEE 8023ap provides a design targetAs Ethernet has emerged as the industryrsquos dominant signaling methodology the IEEE has developed the 10GBASE-KR norma-tive Channel model to define interconnect Channel performance for NRZ signaling at 10 Gbps This standard defines acceptable performance in terms of S-parameter charts for through-Channel insertion loss and worst-case crosstalk Figures 2a and 2b illustrate masks for Draft 24 of the standard that was initially used for this exercise

In each case the mask defining compliant performance is shown in blue Channel insertion loss is shown in red in Figure 2a Crosstalk performance is defined by the ICR curve (Figure 2b) Minimum acceptable Channel performance is defined in the ICR chart (Figure 2b) by the blue line The effect of the sum of all aggressors on the through-Channel is shown in red The green ICR curve is the ratio of the crosstalk power sum calculated by summing the

magnitudes of any impacting crosstalk Channels for each fre-quency and using a straight line fit (using least-squares method) to determine the resulting average effect f the aggressors on the through-Channel This is then overlaid on the insertion loss and used to plot the ICR curve

This standard which has evolved through a variety of iterations forms the basis for developing a 40 GbE switch fabric backplane featuring 10 Gbps NRZ differential pairs If all differential pairs can meet this standard then the backplane can be considered to be 10GBASE-KR compliant

Applying 10GBASE-KR to a 14-slotAdvancedTCA applicationThe PICMG specification dictates that receive differential pairs are placed on the c-d and g-h rows of the HM-ZD connector and that transmit differential pairs are placed on the a-b and e-f rows Therefore the middle differential pair in row c-d of Slot B will be subject to the NEXT of three aggressors in each of the a-b and e-f transmit rows of slot B plus the FEXT of the signals being received in the c-d pairs in the top and bottom of slot B

In this topology it can be seen that worst-case crosstalk would occur if all the NEXT and FEXT aggressors were routed on the bottom Layer that is on the same Layer as that of the victim c-d However given that all signal vias must be back-drilled and tuned for impedance management purposes Channel crosstalk can simultaneously be reduced by allocating different routing Layers to differential pairs terminated in the same backplane connector

The principal factor in determining the feasibility of a 10GBASE-KR compliant backplane is based on understanding whether the Channel with the worst-case signal-to-noise ratio is compliant

The skew targets determine permissible layer separation between a-b c-d e-f and g-h pairs within each Channel and enable routing Layers to be allocated for each pair It is now possible to start the process of via tuning to optimize the channel performance for minimum insertion loss Modeling begins by defining the simulation boundaries for the channel so that Channel component models (PCB traces connectors vias) can easily be aggregated to model complete Channels Boundaries must be established at locations in the Channel where linear 3D structures exist These are shown in Figure 3 (next page)

Since the connector and via combinations for the backplane and daughtercard mating halves must each be treated as a whole it

PICMG 30Spec

TurboFabricSpec

Total Inter-PairSkew

(Fabric Interface)

05 mm in FR4(34 ps)

001 mmin N4000-13si

(00625 ps)

Total Intra-Channel Skew

(Fabric Interface)

254 mm in FR4(17 ps)

plusmn01 mmin N4000-13si

(0625ps)

Total Intra-Channel Skew

(Base Interface)

135 mm in FR4(90 ps)

plusmn01 mmin N4000-13si

(0625 ps)

Figures 2a and 2b

Table 3

Determining which Channel that is and identifying the worst-case SN requires making trade-offs with regard to PCB material Channel length via design connector row selection and NEXT and FEXT aggressor routing choices These trade-off choices can only take place using advanced 3D simulation tools such as Ansoft HFSS This was the essence of the design process employed in developing Simclarrsquos TurboFabric backplanes

The simulation processThe transmission length for full mesh and dual star backplanes design implementations varies from a maximum of 1632 inches to a minimum of 116 inches With an effective transmission length of 5 inches on each daughtercard this makes the longest effective Channel 2632 inches including two connectors

For a 10GBASE-KR application over this distance a high-perfor-mance laminate is essential for both reducing insertion loss and

ensuring high glass content in the weave to mitigate skew So the design process began by choosing a low-loss dielectric material (Nelco 4000-13SI for both the backplane and the daugh-tercards) and establishing targets for Inter-Pair and Intra-Channel skew as shown in Table 3

Adhering to the PICMG 30 specifi-cation for skew in a 10GBASE-KR application is impractical Instead a target of 00625 ps was set for Inter-Pair skew with 0625 ps set for Intra-Pair skew for the backplane only This equated to a maximum 001 mm differ-

ence being allowed between traces of any differential pair and 01 mm being permitted between traces of any four differential pairs in a Channel Given the topology of the HM-ZD connector daughter-card skew must be accounted for in the daughtercard layout Fo

Sin Pnt

should be noted that the simulation boundary is located within the mated connector

Tuning the connector and via structures to 50Ω is an iterative process involving the removal of excess pads back-drilling and tuning pads anti-pads and traces A Time Domain Reflectometer (TDR) plot illustrating the results of the tuning process is shown in Figure 4

Upon completion of the modeling process a total of 17 different optimized via and routing configurations had been designed for the full mesh design and nine for the dual star design

A plot of worst-case insertion loss is shown in Figure 5 and demonstrates that in both cases performance is well above the 10GBASE-KR mask

When all the through-Channels have been modeled adjacent Channel models can be combined and ICR curves plotted to evaluate the impact of crosstalk on through-Channel performance This valuable information can be used to adjust the position of signal Layers relative to pass-through aggressor traces on adjacent Layers or to reroute traces to reduce crosstalk Similarly routing Layers can be changed to reduce crosstalk in adjacent via barrels

Figure 6 plots worst-case ICR and demonstrates that performance is above the 10GBASE-KR mask Based on this result it was possible to proceed to physical implementation

Figure 3

Figure 4

Fo Sin Pnt

Physical realizationThe layout process was performed using the Mentor Board-Station CAD system Quad-routing (routing four traces between pads) was explored as a routing method-ology in order to reduce Layer count but this was dismissed due to the detrimental impact on crosstalk performance

The attributes of the physical backplanes produced as a result of the design effort are shown in Table 4

The design files produced included the usual gerber files plus detailed back-drilling instructions

The design validation process comprised a conventional continuity test followed by performance testing featuring Agilent equipment including 70340A signal generator 8720ES Network Analyzer NN18A S-Parameter test-set and 86100A sampling oscilloscope with Agilent 86112A module Figure 7 (next page) shows the test set up

Simclar developed special line cards to enable through-Channel measurements with and without crosstalk The signal launch featured compression mount SMAs terminated in a tuned via structure The Channel simulations included simu-lation of the tuned launch structures so de-embedding of the launches was not necessary for correlation to simulation purposes The development team also established a process for characterization of all Channels

Full Mesh Dual Star

Layer Count 34 18

Aspect Ratio 121 61

Tuned Vias 3952 768

Material Nelco 4000-13SI

Table 4

Figure 5 Figure 6

Fo Sin Pnt

In Figure 8 measured through-Channel performance and ICR curves are shown for the same Channels described in the simula-tion section earlier

As can be seen from Figure 8 there is close correlation between these and the simulated plots in Figures 5 and 6 In fact close correlation between all simulated and measured results was achieved resulting in a 728 Tbps capacity full mesh and a 960 Gbps capacity dual star backplane design now generally available as part of the Simclar TurboFabric shelf

Figure 7 Figure 8

Figure 9

Figure 10

Implications of 10GBASE-KR Draft 33versus Draft 25The work described above was targeted towards meeting the Channels specifications contained in Draft 25 of the IEEE 10GBASE-KR Since this work was completed the IEEE has up-issued the Draft revision level for the Standard from 25 to 33 While this has not impacted through-Channel performance demands it has increased Channel isolation requirements by around 10 dB In Figure 9 a Draft 33 mask is added to the ICR plot shown in Figure 8

From Figure 9 it can be seen how Draft 33 pulls the mask above the Channel ICR curve for this full mesh backplane Channel Surprisingly it is the Channelrsquos frequency response at relatively low frequencies between 100-500 MHz that is causing a problem The reasons for this are currently the subject of further detailed investigation

However Figure 10 shows a Draft 33 plot for a less demanding dual star AdvancedTCA implementation featuring shorter trans-mission distances This plot demonstrates compliance to Draft 33 of the IEEE 8023ap 10GBASE-KR Standard

ConclusionBy developing a close understanding of the many factors contrib-uting to loss and noise in multi-gigabit backplane Channels it is possible to characterize their performance using advanced simula-tion techniques and correlate that performance in physical prod-ucts using advanced test methods By overlaying the test results on S-Parameter masks defined by the IEEE 8023ap 10GBASE-KR Standard it has been demonstrated that backplanes that truly enable AdvancedTCA scalability are at last a reality

Douglas Hynd joined Simclar Group in 2006 as Director of Marketing as part of Simclarrsquos acquisition of Northrop Grumman Interconnect Technologies Division wherehe was Vice President of Marketing and Sales He has more than 24 yearsrsquo experience intechnology sales marketing and generalmanagement and holds a BSc (Eng) in Electronics and Electrical Engineeringfrom the University of Glasgow He isbased at Simclarrsquos Global HQ inDunfermline Scotland

Simclar Groupdouglashyndsimclarcom bull wwwsimclarcom

Fo Sin Pnt

6U CompactPCIPrOduCT GuIdE g

This monthrsquos issue includes a 6U CompactPCI Product Guide and Irsquod like to take the opportunity to reflect a bit on the success and evolution of that technology

Back in the 1994 time frame when CompactPCI was first being devel-oped it began as 3U-only technology It used the same Eurocardmechanics that were popularized by VME and an IEC standardized high-

density high-speed connector available from a number of vendors suitablefor 33 MHz PCI signaling That connector was selected by the engineers atZiatech with help from Mike Munroe then at ERNI The majority of VMEdesigns were 6U and based on this I was among a number of folks thatargued for adding the 6U CompactPCI form factor

The 6U form factor presented some challenges and opportunities Onechallenge was that the insertion and extraction forces were quite high when the entire rear of the card was populated with connectors Fortunately the IEEE standards for Eurocards evolved and injectorejector handles that pro-vided leverage became available Eike Waltz then at Rittal was instrumental in bringing that to the table Two of the opportunities that came along withthe extra connectors were a clean way to add secondary buses like the H110 telephony bus to the backplane and the ability to route IO out the rear through rear transition modules PICMG has developed quite a number of subsidiary specifications defining the interoperable use of the extra backplane pins made possible with the 6U form factor Both of these features have played a major part in CompactPCIrsquos success The next major evolution of 6U CompactPCI came with the PICMG 216 Packet Switched Backplane standard which was originally conceived by John Peters and his team at Performance Technologies PICMG 216 interconnected a shelf full of CompactPCI single board computers via redundant Ethernet switches also in the 6U CompactPCI form factor This dramatically increased usable backplane bandwidth and provided redundancy PICMG 216 paved the way for AdvancedTCA and was the industryrsquos first open standard for the switched serial interconnect standards we see popping up in many places

By Joe Pavlat

Looking back and ahead at6U CompactPCI

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Recent 6U CompactPCI related products are listed here For more informationenter the productrsquos RSC No at wwwcompactpci-systemscomrsc

cPCI-6910Dual-core Intel Xeon Processor LVULV Universal blade bull Supports Single Dual-Core Intel Xeon LV or ULV processorsbull Front Side Bus 667 MHz bull Up to 2 GB DDR2 400 MHz soldered SDRAM with ECC bull Four PCI Express GbEbull Up to 4 USB 20 ports bull PICMG 20 21 29 216 compliant

RSC No 35013

ADLINK Technologywwwadlinktechcom

CPCIStor Module6U CompactPCI storage blade bull Onboard ATA controller supports CDDVD HDD and solid-state flashbull Supports Hot Swap Removal (ask about RAID support) bull ATA disks available in Enhanced Dutycycle versions for NEBS Level 3 - 724 requirements bull Operating Systems supported VxWorksLinux and Windows

RSC No 34800

ACTTechnicowwwacttechnicocom

Prosody X cPCI E1T1An E1T1 digital network access card bull Suits telco developers and systems integrators bull Uses Aculabrsquos worldwide protocol coverage including Aculabrsquos SS7 stack available under a cost free license bull Available with 8 or 16 E1T1 trunks and software selectable E1T1 interfaces bull Flexible mix of protocols including ISDN CAS and SS7 (ITU-T China and ANSI) bull A variety of interconnect switching and protocol conversion solutions can be readily crafted bull High availability reliability and scalability with industry standard hardw re and software interoperability bull Up to 128 SS7 signaling links bull Non-circuit related (TCAP) messagingintensive applications such as prepaid and SMS

RSC No 35408

Aculabwwwaculabcom

Adexp8021Intel Core Duo L2400 (166 GHz) w E7520 server chipset bull Dual channel PC2-3200 Registered RAM SECDED or x4 SDDC bull Two GbE two Serial ATA four USB 20 bull Onboard SXGA graphics 1280 x 24-bitbull 6U CompactPCI Bus PICMG EXP0 R10 Specification bull RoHS compliant 0 degC to +55 degC operating range

RSC No 32837

Advanet Incwwwadvanetcojpen

TC84012 channel single-stop Time-to-Digital Converter (TDC) with single-start and multi-start acquisition modes bull 50 ps timing resolution bull Wide range with upto 20 s between first and last events bull Large internal memory buffer with up to 512 hits per channel bull Low jitter (lt3 ps rms) high stability (plusmn2 ppm) internalclock source bull External 10 MHz reference input bull FPGA based Data Processing Unit (DPU) bull Fast readout with DMA mode for increased data throughputbull Overvoltage-protected inputs with 50 Ω K-Lock (LEMO) connectors bull Built-in self calibration bull Modular single-slot 6U PXICompactPCI standardbull Low power consumption (lt22 W)

RSC No 33445

Agilent-Acqiriswwwacqiriscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

MIC-30428-slot 6U CompactPCI backplane bull AC or DC CompactPCI 500 W + 250 W redundant(2+1) power supplies bull PICMG 216 (CompactPCI Packet Switching Backplane) compliancebull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarmmodule (MIC-3924L-AE)

RSC No 32851

MIC-30436-slot 6U CompactPCI backplane bull Supports two hot-swappable SCSISATA or removableIDE HDD bays bull Built-in IDE slim-type DVD-ROM bull AC or DC CompactPCI 250 W + 250 Wredundant (1+1) power supplies bull Supports hot-swappable fan modules bull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarm module (MIC-3924L-AE)

RSC No 32850

Advantech Corporationwwwadvantechcom

Dual-Core Xeon CompactPCI SBCModel PP 42123x bull Dual CPU 6U CompactPCI SBC supporting two dual-core Xeon CPUs bull Up to 8 GB DDR2 ECC SDRAM in a single system or peripheralslot bull Dual processor SBC in a single 6U CompactPCI slot bull Supports two 166 GHz Dual-Core Intel Xeon ULV processors using Intel E7520 server chipsetbull Up to 8 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull PMCXMC site support 66 MHz PCI-X and x8 PCI Express bull Front and rear IO bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade bull Four GbE ports with option for PICMG 216

RSC No 34761

6U CompactPCI Core 2 Duo SBCModel PP 41203x bull 6U CompactPCI Core 2 Duo SBC supporting two PMC sites includingone XMC site bull Up to 4 GB DDR2 ECC SDRAM bull All in a single system or peripheral slot bull TwoPMC sites supporting up to 100 MHz PCI-X bull One XMC x8 PCI Express bull Front and rear IObull Supports 216 GHz or 15 GHz Intel Core 2 Duo processors bull Intel E7520 server chipsetbull Up to 4 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade

RSC No 34763

PP 30202xTwo processor versions available bull 18 GHz Intel Pentium M processor 745 uses mFC-PGA 478 (micro Flip-Chip Pin Grid Array) package bull 14 GHz Intel Pentium M processor Low Voltage 738uses mFC-BGA 479 (micro Flip-Chip Ball Grid Array) package bull 64 KB primary (L1) on-die cache2 MB of secondary (L2) on-die cache bull 400 MHz Front Side Bus (FSB) bull No CPU fan bull 16 GHz processor version (1 MB L2 cache) available see PP 30002x datasheet bull Utilizes 64-bitIntel 855GME chipset bull Supports 400 MHz bus frequency bull Uses Intel 6300ESB IO Controller Hub

RSC No 32659

Concurrent Technologies Incwwwgocctcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cCIBPMC6U-ETA 6U bridged dual PMC carrier that bridges extended temperature CompactPCI boards and PMCs bull Features a rugged CompactPCI form factor providing increased flexibility to military communications systems designers bull Provides additional design choices to users through its differing bus speeds maximizing the numberof PMCs that can be used CompactPCI andPMC buses can both run at 66 or 33 MHzbull Operating temperature range of -40 degC to+85 degC bull Signal conditioning bull DMA supportbull Low-power design +5 V +33 V +12 V -12 V bull User-selectable VIO of 33 V or 5 V to the PMC

RSC No 32891

Dynamic Engineeringwwwdynengcom

cPCI4IP-MMMinimized PCI address footprint IndustryPack carrier for CompactPCI applications bull 6U 4HP4 IP positions 832 clock selection for each slot fused filtered power IO options bull ID INT IO and Mem spaces are decoded for each IP slotbull Single and double wide IPrsquos bull 16- and 32- bit IPs bull 32-bit access to 16-bit IPs bull Full or mini-mized Memory Space decoding for 18 the PCI address requirement bull With the cPCI4IP-MM option 8 CompactPCI 4IP cards take the same PCI address space as 1 full Mem Space card

RSC No 34905

ACQ132CPCI32 channel MHz class simultaneous sampling intelligent digitizer bull 32 simultaneous analoginput channels 2-32 MSpschannel 14-bit resolution bull Differential inputs bull Intelligent cardwith 1 gigabyte memory and GbE on board bull Large distributed FPGA resource on boardbull Range of DSP functions including FIR filtering and Digital Downconverter

RSC No 35482

D-TACQ Solutions Ltdwwwd-tacqcouk

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CR11Based on the Intel Core Duo Processor the platform is designed to support processor speeds from 106 GHz up to 20 GHz bull Intel Core 2 Duo runs at 15 GHz up to 20 GHz bull Conduction cooled bull Two PMC slots bull PCI Express bull 2x GbE

RSC No 33156

ICS-72532-channel 6U CompactPCI DAC board bull 6U CompactPCI data acquisition card bull 32 differential output channels bull 16 or 24-bit sample size bull 288 kHzch data rate bull Simultaneous sampling across all channels on single or multiple boards bull 32 separate delta-sigma DACs bull 64-bit 66 MHz CompactPCI PICMG 20 Rev30 hot-swappable bull FPDP II 400 MBps interface

RSC No 33576

ICS-71032-channel 6U CompactPCI ADC board bull 6U CompactPCI data acquisition card bull 32 differential input channels bull 216 KHzch 24-bit resolution bull Software selectable full scale input bull FPDP II 400 MBpsinterface bull 64-bit 66 MHz CompactPCI PICMG 20 Rev 30 hot swappable bull 32 synchronous boards for simultaneous sampling bull Sonar acoustics and test and measurement applications

RSC No 33578

Tsumani 6U CPCI Development KitFPGA processor solution targeted at high performance software defined radio applications bull Dual Stratix EP1S80 FPGAs are tightly coupled to provide apower platform for signal processing bull Two PMC module sites provide IO connectivity to either front panel or back panel connections bull A direct highbandwidth 1 GBps path from the PMC P4 connector directly to the FPGAs bull Model 919 Dual DAC Mezzanine provides broadband analog signal generationin a compact form bull The board features two independent DAC channels each with its own 12-bit LVDS input capable of running at rates up to 160 MHz

RSC No 32026

CP11Rugged 6U SBC bull Up to 4 GB of DDR2 SDRAM (200 MHz) with enhanced ECC four independent onboard PCI buses system host and peripheral modesupport for the CompactPCI backplane two PMC interfaces (64-bit133 MHz and 32-bit33 MHz) bull Instead of the PMC1 a PCI Express based XMC interface is available on request bull Two GbE one Fast Ethernet two serial interfaces (RS-232 or RS-422485) USB 20 integrated HDD or flash drive bull High performance 2D3D ATI video controller capable of driving two displays in parallel supports VGADVI interface bull Intel Core 2 Duo at 216 GHz Intel Core Duo at 20 GHz2x PMC expansion site bull One XMC optional bull Up to 4 GB DDR2 SDRAM wECC 2x GbE

RSC No 33447

GE Fanuc Intelligent Platforms Incwwwgefanucembeddedcom

Single Board ComputersGD Canada designs and manufactures conduction-cooled Single Board Computers (SBCs)using Intel processors bull 6U and 3U form factors for CompactPCI backplanes bull Fully backward compatible with earlier models bull Upgradeable via the change-out of processor memory andIO modules bull Used within GD Canada computer systems and sold as individual products

RSC No 35281

General Dynamicswwwgdcanadacom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cPCI6U-24DSI32R32-channel 24-bit delta-sigma CompactPCI 6U analog input board with rear IO bull Low noise 24-bit resolution low phase distortion andmulti-board synchronization bull Suits state-of-the-art sonar and noise monitoring applications bull 32-channel cPCI6U-24DSI32 analog input boardprovides a high-density 24-bit analog input resources on a standard 6U CompactPCI expansion board bull Applications from precision voltagemeasurements to complex audio signal and waveform analysis

RSC No 34985

General Standards Corporationwwwgeneralstandardscom

Duet 3U 64-bit 1 GHz TMS320C6416 DSP (x2) 64 MB SDRAM per processor bull Flexible internalexternalcommunication mesh bull 64-bit66 MHz CompactPCI bull PMCXMC site with Jn4 to FPGA and4 RocketIO per VITA 42 bull External data port up to 12 Gbps bull 4M or 5M Virtex-II Pro FPGAbull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM dedicated800 MBps links between DSPs bull 3U CompactPCI with PXI support bull Suits high-end co-processing wireless broadband communications RADAR video and biometrics

RSC No 32856

QuadiaQuad-DSP bull Dual FPGA bull Dual PMC sites bull Inter-processor connectivity and access to external interfaces bull Four C6416 DSPs split in two independent clusters each hosting a PMC site bull One large FPGA for end-user code bull Central FPGA routing interprocessor communication bull End-user FPGA communication bull External port serial IO for PCIe or other p ivate link bull Global memoryand PCI interface bull 1 GHz TMS320C6416 DSP (x4) bull 64 MB SDRAM per processor bull Flexible internalexternal communication mesh bull 64-bit66 MHz CompactPCI bull Two PMC sites with Jn4 to FPGA bull External data port up to 12 Gbps bull Two 4M Gate FPGA reserved for end-user code bull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM bull Up to 512 MB Global DDR SDRAM bull Suits high-end co-processing wireless and broadband communications

RSC No 34737

Quixote 64-bit 6UAdvanced signal capture generation and co-processing bull 1 GHz TMS320C6416 DSP and2 to 6 MGATE Virtex-II FPGA bull 32 MB SDRAM 8 MB ZBT SBSRAM and AD6645 and AD9764 converters bull 6432 bit CompactPCI 66 MHz 5 V33 V and complex trigger modes with HW event logging bull PMC site with Jn4 to FPGA DIO and PICMG 217 StarFabric compliant bull Suits Software Defined Radio wireless IP and RADAR development and hardware testing bull Physical Layer field testing ultra-fast flexible data acquisition vector signal generation and electronic warfare

RSC No 32861

Innovative Integrationwwwinnovative-dspcom

IC-e6-cPCIbHigh performance 6U CompactPCI board bull Powered by one or two of Freescalersquos mostadvanced 14 GHz MPC7448 PowerPC processors bull PICMG 216 compliant bull Marvell Discovery III chipset (MV64460) bull Low power consumption bull Standard extended and rugged grades

RSC No 32982

Interface Conceptwwwinterfaceconceptcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CP213Single-width 6U CompactPCIPXI module with either 32 or 64 differential analog input channelsbull 32 64 or 128 channels of analog input bull 16 multifunction digital IO (TTL) channels that may beconfigured as digital in digital out or selectively attached to 2 frequency in 2 counter in andor 2 timerout channels bull 16-bit resolution bull Programmable gain per channel programmable scan rates of lt1 Ss through 100 KSs bull Precision onboard reference for end-to-end calibration

RSC No 34804

KineticSystems Company LLCwwwkscorpcom

CP6001Energy efficient embedded Intel dual core processors bull 12 GHz Intel Core Duo U2500 ULV processor bull Intel Core 2 Duo L7400 LV processor bull Based on the Intel Mobile 945GM chipset with a front side bus of up to 667 MHz and ICH7-R Southbridge bull Two independent digital video outputs to the rear IO (2x DVI - 1x DVI and 1x HDMI) bull AC97 audio capabilities bull 3 x GbE bull 4 x SATA with RAID 01510 functionality bull 6 x USB 20 2 x COM and VGA or DVI bull Can also accommodate a PMC slot or an onboard 25 inch SATA HDD bull Up to 8 GB of USB or 2 GB soldered flash bull Supports Linux Windows XP XP embedded and VxWorks 6

RSC No 34182

CP6923 GbE Switch6U CompactPCI GbE Switch PICMG 216 compliant bull Leading edge te hnology basedon BCM5650X chip bull 24x GbE ports bull Non-blocking Layer 2 and 3 switching and routingbull Copper optical rear IO version bull Hot swap IPMI bull Fully managed bull Comprehensive firmware package bull Applies to VoIP installations such as call servers media gatewaysand trunking gateways in wireline and wireless networks as well as VoIP systems inenterprise networks with high demands on performance

RSC No 32256

Kontronwwwkontroncom

TMS320C6701 Virtex-IITexas Instrumentsrsquo C6701 DSP bull Xilinx Virtex-II series FPGA up to XC2V8000 bull Multiple IO interfaces Onboard CODEC VIM expansion sites 60-pin GPIO header and JTAG bull Hardware drivers integration in SimulinkXilinx System Generator Blocksets for quick implementation of Simulink models bull DSP and FPGA-in-the-loop cosimulation of SimulinkXilinx System Generator models bull Leading edge communication interface allowing real-time datamonitoring from Simulink scopes and remote operations

RSC No 32028

VHS-DACHigh performance multichannel DA for phased array antenna systems radarsonar communications receiversup-sampling to IF stage and RFIF AGC apps bull Eight 125 MSPS output channels bull Optional add-on daughter boardprovides 8 additional output channels or 8 additional input channels bull 32-bit 25 MHz bull FPDP interface with 400 MBps transfer rate (25 MSPS per channel at 8 channels 125 MSPS at 16 channels) bull Low level hardware drivers API andGUI bull High level hardware drivers integration in Simulink Blocksets bull Leading edge communication interface fordata recording and playback tofrom the onboard SDRAM

RSC No 32029

Lyrtechwwwlyrtechcom

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PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

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PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

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PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

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PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

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PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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Page 7: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

By Joe Pavlat

CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems

EDITORrsquoS FOREWORD

Why AdvancedTCA is at home in HSS

With this first issue of 2008 (Happy New Year) our colleague Sven Freudenfeld from Kontron gives us an excellent and detailed comparison of 1U rack-mount servers and AdvancedTCA in a real application a Home Subscriber Server (HSS) He describes the application in detail and then compares

space cooling maintenance management capabilities scalability and switching require-ments Sven makes a compelling case that AdvancedTCA provides many essential application elements that must be separately and expensively added to 1U servers He concludes that AdvancedTCA allows Telecom Equipment Manufacturers to concentrate on developing software instead of hardware and that reduces development costs and speeds time to market

PICMG addressing new data bandwidth standardsWhile AdvancedTCA provides a great deal of backplane bandwidth especially in full mesh configurations designers want to go even faster to accommodate new bandwidth-hungry applications like IPTV Last year the IEEE ratified important new standards for 10 gigabit per second data transmission over a single pair of conductors Of special interest to our community is the 8023ap 10GBASE-KR standard which details how to achieve that blaz-ing speed over a backplane The PICMG community is moving towards setting up a new subcommittee to incorporate this technology into the AdvancedTCA standard and it may be operating when this issue hits the street It has the potential of providing a total useful backplane bandwidth of 10 terabits per second in a single shelf Thatrsquos a truly amazing

number Douglas Hynd from the Simclar Group introduces us to the details of designing systems at that speed discuss-ing losses signal skew and crosstalk At these speeds simulation is essential and Douglas describes some of the issues involved Also in this issue Stuart Jamieson from Emerson Network Power gives us additional insight into high-speed signaling design simulation and analysis

A name change from Technology in Europe to Global Technology goes into effect this month for the column written by industry veteran Hermann Strass In this issue Hermann tells us how CompactPCI products from MEN Micro have been incorporated into the design of a new highly sophisticated digital cinema camera developed by Silicon Imaging In addi-tion to providing very high resolution and speed the camera must also operate in harsh environments MEN Micro won the 2007 Intel Communications Alliance Innovate and Ignite Technology Showcase award for its work

Curt Schwadererrsquos Software Corner this month expands on a subject he wrote about last April (wwwcompactpci- systemscomcolumnssoftware_corner 200704) As cable companies expand their offering beyond television to voice and data services they become subject to the same laws relating to cyber crime as the traditional telecommunications pro-viders do They must provide law enforce-ment authorities surveillance that is the subject of a lawful warrant and industry standards are being rolled out to do this Itrsquos a timely topic as serious problems with identity theft and cyber crime ingeneral are on the rise Curtrsquos column isan interesting read

Joe Pavlat Editorial Director

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By Hermann StraSS

GLOBALTECHNOLOGY

CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems

Award recognizes unique ruggedcamera control system

The 2007 Intel Communications Alliance Innovate and Ignite Technology Showcase (ICA) named MEN Micro Inc the ICA Showcase winner on September 19 2007 at the Embedded Systems Conference Boston MEN Micro a

subsidiary of MEN Germany has developed a unique control system for a rugged digital movie camera

Silicon Imaging an innovator in IT-centric digital cinema cameras required a rugged camera control system for its new SI-2K camera The SI-2K (shown in Figure 1 courtesy of Silicon Imaging United States) executes direct-to-disk raw recording at either 1920x1080 pixel high definition or at 2048x1152 pixel for cinema resolutions Its 48-bit digital processing algorithms perform adaptive pixel-by-pixel calibration and color image enhancement The SI-2K fore-goes legacy fixed bit-rate DCT codec recording formats such as DVCPRO HD and HDCAM-SR for advanced wavelet compres-sion technology Current generation HD cameras destructively process and compress their imagery at the acquisition stage The SI-2K streams images as raw digital negatives over a standard GbE connection The Intel Core 2 Duo processor-based F17 system from MEN non-destructively processes the raw digital negatives in real time to the visually perfect CineForm RAW codec which makes capturing up to four hours of continuous footage on a single 160 GB notebook drive possible

MEN Micro developed a customized version of its Intel Core 2 Duo processor based F17 3U CompactPCI SBC a unique side card for advanced audio and video capabilities as well as a rug-ged compact enclosure Already being used at independent film production studios for the making of full-length feature films the digital camera employs technology that can be repackaged for surveillance military sports analytics 3D video and stereo ap-plications The camera can operate in environments ranging from desert to arctic

The F17 SBC from MEN (Germany) controlling the camera in-cludes an Intel Core 2 Duo processor T7600 running at 233 GHz The SI-2K uses MENrsquos SBC for simultaneous encoding of data An Intel Graphics Media Accelerator 950 (Intel GMA 950) per-forms image graphics processing colorization and visualization at full resolution The F17 is equipped with 2 GB fast DDR2 DRAM a hard disk on a removable slot and two Intel GbE PHYs which transfer data from the camera head to the camera control unit and to other standard IP hardware The custom side card enables the connection of a High-Definition Multimedia Interface (HDMI) headphones and balanced analog input and output ports for pro-fessional audio signals

Specified for an extended temperature range in harsh shooting environments the camera uses MEN Microrsquos F17 board equipped

with a massive tailored heat sink accompanied by a fan install-ed inside the camerarsquos housing The F17 is part of MENrsquos powerful family of intercompatible CompactPCI Express SBCs including the newer and more powerful F18 which is completely compatible with the F17 and will also be incorporated into Silicon Imagingrsquos new SI-2K camera

European eventsThe 26th MOTEK International Trade Fair and Exhibition the worldrsquos largest event for assembly handling and automation sup-port systems and devices was held for the first time in the brand- new Neue Messe in Stuttgart Germany from September 26 to September 27 2007 The exhibition space increased by 45 percent over last yearsrsquo event due to the new venue More than 1100 exhibitors from 20 different countries drew around 40000 visitors and filled all five new exhibition halls Mechatronics was speci-fically featured as were robots and automation equipment In 2008 about one million square feet of exhibition space will be available when four more halls are completed at Europersquos most modern fair grounds near the Stuttgart Airport Terminal

EMO 2007 (Hannover) the worldrsquos largest exhibition of metal-working equipment closed its gates on September 22 after six days of exhibition with around 160000 attendees visiting booths of 2100 exhibitors from 42 countries 18 million square feet was devoted to exhibition space The organizers German Association of Machine Tool Manufacturers (VDW) reported new busi-ness contracts at the rate of 4 billion EURO (almost $6 billion) Exhibitors such as TRUMPF Laser Germany (see my April 2007 column (wwwcompactpci-systemscomcolumnsTechnology_in_Europe200704) reported full success at EMO 2007

For more information contact Hermann athstrassopensystems-publishingcom

Figure 1

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By Curt SChwaderer

CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems

SOFTWARE CORNER

In the April 2007 Software Corner column (wwwcompact-pci-systemscomcolumnssoftware_corner200704) we explored surveillance systems and the Communications Assistance for Law Enforcement Act (CALEA) a lawful

surveillance capability mandate Internet access and VoIP pro- viders had to be compliant with CALEA by May 2007 or face severe financial penalties

In this monthrsquos column we will look at what cable companies are doing to provide lawful surveillance capabilities within their networks

The term cable company is now officially a misnomer Cable companies and their networks are capable Internet access and voice service networks that offer the general public a one-stop shop for all their communications and entertainment needs In fact cable companies now typically call themselves Multi-Service Operators (MSOs) Voice and data services form a significant and grow-ing source of revenues for the MSO To that end cable networks become subject to the same rules and regulations that telecommu-nications networks do

One of these regulations is CALEA which provides the ability for network providers to tap specific subscribers when served a warrant To their credit cable companies and their research and development consortium organization CableLabs (cablelabscom) have been very proactive planning for lawful surveillance capa-bilities and CALEA compliance within their networks CableLabs and its partners have been working on a set of PacketCable stan-dards that incorporate specifications for voice and broadband data intercept We will focus on the new Cable Broadband Intercept Specification (CBIS) what it encompasses and paths for imple-mentation within cable networks

Cable Broadband Intercept Specification The set of specifications governing cable network services and capabilities is called the Data-Over-Cable Service Interface Specifications (DOCSIS) The specification that covers lawful

surveillance for data services is CBIS The CBIS reference model is shown in Figure 1

The surveillance architecture consists of three components the Mediation Function (MF) Broadband Intercept Function (BIF) and Collection Function (CF) When a warrant for a subscriber is served the network administrator configures the MF to capture traffic coming to andor from the subscriber This traffic includes any dynamic IP address assignment transactions (called out-of-band traffic) as well as the traffic resulting from e-mail voice or data services being used by the subscriber in question Creating hashes of these files validates the captured traffic as not having been tampered with It is also important for the network provider to supply traffic only for the subscriber the warrant is served on Older methods of surveillance involve dumping all traffic from a particular service area from all users in that area then sifting through that traffic manually This method violates the privacy rights of all the other subscribers in the service area of the individual(s) the warrant is served on Surveillance equipment that can capture only the traffic to or from the subscriber in the warrant is critical to the lawful surveillance aspects of the deployment

So far this is similar to the Alliance for Telecommunications Industry Solutions (ATIS) standards governing voice and data surveillance for digital wire line systems Unlike the original ATIS specifications the CBIS specification includes the BIF The BIF is a buffering component where the Mediation Function pushes the surveillance information (in the form of surveillance files) to the BIF for retrieval by the Collection Function at a later date

The CF component gathers the surveillance information from the BIF under law enforcement control then analyzes and presents the surveillance information in a useful way The CF also validates the information by comparing hashes of the files against hashes generated by the surveillance equipment at the time of capture This ensures that from the time the traffic is captured it is not tampered with

Cable and CALEA A look at cable networks and lawful surveillance

Figure 1

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Buffering is importantThe buffering capability the BIF provides in the CBIS specifi- cation is an important distinction between it and the ATIS specification (for more information on the ATIS specs see the April 2007 Software Corner (wwwcompactpci-systemscom columnssoftware_corner200704)

Buffering is so important that ATIS has approved an additional standard for a Buffering Function (BF) within the ATIS lawful surveillance environment

The importance of buffering is best described in a presentation that Dr Glen Myers CEO of IP Fabrics gave at the December 2007 ISS World conference The real-time delivery that the initial ATIS specification defines can be problematic as Figure 2 shows Packet loss from congestion bit errors or QoS contracts can result in the entire surveillance stream being rendered inadmissible

Dr Myers further explained that ATIS allows their buffering model to be separate from or combined with the MF while the cable network CBIS model assumes the buffering function is always separate from the MF component (Figure 3)

The buffering function whether it be the Buffering Function in the ATIS model or the Broadband Intercept Function in the CBIS model minimizes the impact of packet loss and real-time data delivery The Mediation Function can repeatedly attempt to send surveillance information to the BIF through a secure reliable file transfer function such as secure FTP If there are problems connecting with the BIF alerts can be generated so the network administrator can find and fix the problem while the surveillance information is still resident on the MF system

Dr Myers mentioned other important benefits to providing a buffering function The network administrator does not need to

negotiate and install a dedicated link for each intercept between the MF and the Law Enforcement Agency or agencies (LEA) authorized for the information Dedicated pipes matching the subjectrsquos peak service bandwith are not needed Support for mul-tiple LEAs is easily implemented at the BIF instead of the Mediation Function Law enforcement collection equipment does not need to be co-located with the Mediation Function It also simplifies connectivity by eliminating Virtual Private Networks (VPNs) or other routing ele-ments between the MF and the LEA(s)

CALEA and CMTSIn a cable network the Cable Modem Termination System (CMTS) is typically the central point within which service provider traffic from the access network meets the cable core network (and ulti-mately the Internet) So the CMTS is an important interface point for lawful surveillance

CMTS equipment may provide varying levels of support for lawful surveillance The simplest is to provide access to all the raw traffic flowing through the CMTS using an Ethernet tap or span port In this scenario the Mediation Function must find the traffic belonging to the subscriber under surveillance generate the appro-priate CBIS files and send the files to the BIF

Cisco a leading supplier of CMTS equip-ment to the cable industry provides a capability called Service Independent Intercept (SII) within their CMTS prod-ucts Cisco SII is also used in their routers and intelligent switches for QoS control in addition to lawful surveillance While SII provides support for identifying traffic by MAC and IP address information it does

Figure 2

Figure 3

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not provide the high-level configuration and lawful surveillance messages required of the Mediation Function SII uses low-level SNMP MIBs that control MAC and IP address configuration commands which in turn trigger the Cisco SII device to send packets matching the configuration to a span port where the Mediation Function can use these matched packets to generate the lawful surveillance messages So SII provides a first-level filter for the Mediation Function which supplies a high-level configuration interface at the warrant description level as well as creation of the CBIS (or ATIS) messages to be sent to the BIF

CBIS-compliant productsThe CBIS specification is quite new so released products are mostly on the hori-zon However the IP Fabrics DeepSweep Lawful Surveillance product line does provide MF andor BIF functionality for the implementation of CBIS-compliant networks Dr Myers noted that the DeepSweep product line is based on a flexible architecture and a highly parallel processing environment comprised of many software surveillance modules that can be loaded and chained within the DeepSweep to provide a number of Layer two to seven surveillance and packet analysis activities The device is programmed through a GUI and operates as a full Mediation Function with the ability to identify subscriber-related IP address assignment and resulting traffic from a span port The DeepSweep also has software support to communicate with SII enabled routers and CMTS sys-tems to provide a fully compliant ATIS andor CBIS surveillance environment compatible with Cisco lawful intercept and QoS services

CBIS BIF and ATIS buffering appliances are also available to provide buffering compliant with CBIS and ATIS standards

ConclusionCyber crimes such as identity theft child pornography chat-room initiated abduc-tion national security and piracy are very real and growing issues in todayrsquos society Billions of corporate and personal dollars have been tied to cyber crooks that abuse the Internet to participate in these activities It is essential that these illegal activities can be identified and stopped It is a good idea to be aware that the cable industry and its proactive support of lawful surveillance standards as well as rolling out equipment that implements these standards will in turn enable law enforcement to catch these cyber crooks and make the Internet a safer place for us and our children to live learn and work

For more information on this or any Software Corner contact Curt atcschwadereropensystems-publishingcom

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APPLICATION g

Based on current overall network growth Telecom Equipment

Manufacturers (TEMs) and Network Equipment Providers (NEPs)

are being challenged to launch new communications platforms

that provide optimal scalability flexibility manageability and

high computing performance With the expected increase in new

subscribers who need to be supported across the network TEMs and

NEPs are focusing on COTS platforms that meet the requirements of

a carrier-grade environment

With these new challenges it is important to take a look at the different

applications in the network to thoroughly evaluate the best hardware

platform approach Comparing the scalability IO functionality

interconnectivity and overall performance gives TEMs and NEPs a

solid basis from which to choose the best cost-effective solution for

their applications This article compares the traditional 1U PCI

platform with a more modular AdvancedTCA-based approach to

a Home Subscriber Server (HSS)-based platform

Emerging next-generation network architecture IMS Carriers and service providers are focused on improving their Average Revenue Per User (ARPU) by deploying new services quickly and at a price that is acceptable to subscribers IP Multimedia Subsystems (IMS) enable service providers to offer differentiated services to their subscriber base integrating voice video text and content as part of their service mix regard-less of the access technology

The IMS framework provides the telecom industry with a modular standards-based IP service delivery infrastructure More than simply replacing existing circuit services with similar services delivered over IP IMS allows service providers to capitalize on faster and more cost-effective deployment of new and differentiated multimedia communication services

While these new technologies promise new sources of revenue and enhanced customer loyalty they also pose implemen- tation challenges One of the crucial net-work elements within an IMS framework is the manageability of the subscriber base Today an increasing number of users subscribe to multiple services such

By Sven FreudenFeld

Choose the right formula forcompute-intensive HSS systems

AdvancedTCA platforms

versus1U PCI rack-mount servers

AdvancedTCA

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as multimedia mobile phones VoIP or IPTV at home Service providers must manage ldquoduplicatedrdquo subscriber databases for each particular service Consequently managing a converging subscriber base for such network functions as billing across multiple different technologies presents a tremendous challenge Any downtime of this network element can be costly to the carrier or service provider not to mention the heavy risk of losing subscribers over the long term

The HSS and Home Location Register (HLR) are key elements in the IMS network required to manage the growing number of subscribers These platforms that manage millions of customersrsquo data need to be highly reliable with carrier-grade High Availability (HA) functionality Core requirements for the HSS computing platform are

n High compute density for application processingn Scalable performance and high densityn Fast read access to the subscriber datan Large storage and memory bandwidthn Ability to consolidate multiple IMS elements and subscriber data within a single

platform with a modular approach as a converged services platform

HSS plays network backbone roleHSS provides the important network backbone of the IMS architecture because it eases innovation and addresses a range of service-logic interaction issues that have plagued previous service architectures HSS offers open access to service-related data for each subscriber supporting the sharing of data among multiple services

HSS is essentially the master user database that supports IMS network entities that handle calls and sessions It contains user profiles performs authentication and authorization of the user and can provide information about the physical location of the user It plays a key role in provisioning service creation enabling subscriber data and managing control roaming and interconnection The Application Server (AS) which hosts and executes serv- ices in the IMS environment communicates with the HSS Call State Control Function

(CSCF) servers also communicate with the HSS which must be able to

n Support IMS-level authentication and authorization

n Maintain IMS subscriber profile(s) independent of access types

n Maintain service-specific datan Keep track of currently assigned

CSCFn Support CSCF and AS access

HLRHSS hardware platform design choicesHSS design must enable the HSS to be deployed cost-effectively and expand readily to meet future subscriber levels For example the trend to include more information as part of the data record for each subscriber will drive up memory requirements

From a technical perspective the key metrics to understand when developing the IMS HSS functions are the number of completed transactions required per sec-ond and the size of the subscriber base

HSS architecture typically comprises multiple processor units with extensive memory requirements With the introduction

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of multicore processors from Intel developers can scale performance while optimizing power consumption in the overall system design

To meet these requirements the hardware platform needs to provide scalability flexibil-ity and long-term cost efficiency In comparing the traditional 1U platform with a more modular approach to the HSS using AdvancedTCA consider the following

n High compute performance n High memory and storage capabilityn IO functionality to connect to multiple networks (such as SS7 and Ethernet)n Carrier-grade profile and redundancy

AdvancedTCA High density with scalability on a smaller footprintTable 1 illustrates a comparison of a sample AdvancedTCA-based platform and a 1U PCI rack-mounted platform for HSS applications This configuration assumes an increasing subscriber growth from 1 million (M) subscribers to 18M subscribers per platform

FootprintAdvancedTCA-based platforms provide a high density compute platform with scalability on a smaller footprint TEMs can easily add boards to a chassis to accommodate more traffic and to support new services This flexibility enables an increase in subscribers and the database without having a major impact on rack space in the central office environ-ment To meet the same capacity for 18M subscribers the 1U PCI approach will occupy two bays or cabinets with a total footprint of 28 square feet compared to the same capacity occupying one bay or cabinet with a footprint of 14 square feet (see Figure 1)

CoolingWhile the power consumption per square foot is higher than the 1U PCI platform AdvancedTCA offers better airflow and cooling distribution using a push-pull cooling system Each 1U PCI platform includes up to nine cooling fans and is dedicated to that CPU in the 1U server only which translates into higher overhead Therefore the airflow is

not optimized in the overall system design In the case of a fan failure AdvancedTCA platforms enable easier access to replace the fans which are field replaceable units The 1U platform also does not include any integrated centralized switching or management capabilities therefore the total does not include any switching or system management functionality

ScalabilityAdvancedTCA architecture lends itself well to scalability As AdvancedTCA sup-ports both a Base and Fabric interface into the backplane and the separation of data and control planes TEMs can also scale up their designs from 1 GbE to 10 GbE to accommodate new users and usage requirements AdvancedTCA based systems are designed for easy upgrade-ability to new processing blades switch fabrics and IO modules using Advanced Mezzanine Cards (such as SS7)

Since AdvancedTCA and AdvancedMCs offer hot swap capabilities and HA func-tionality growing a subscriber base by using additional CPU blades within the system with low maintenance or upgrade downtime is crucial for the HSS plat-form It also allows for the up and down

AdvancedTCA-based HSS Platform 1U PCI Rack-Mount HSS Platform

Number ofsubscribers

~1M subscribers = 4 CPU blades edundant ~1M subscribers = 4 x 1U

~4M subscribers = 7 CPU blades redundant ~4M subscribers = 7 x 1U

~6M subscribers = 12 CPU blades redundant ~6M subscribers = 12 x 1U

~18M subscribers = 36 CPU blades redundant= 3 AdvancedTCA shelves per rack

~18M subscribers= 36 x 1U+ external switch components for redundancy

Technicalspecs

1 CPU blade = 2 x Intel Xeon dual core = quad core 1 1U rack-mount Intel= Intel Xeon quad core or dual core CPU

16 G DDR 2 memory Max of 8 G DRY memory

+ 2 x SATA or SASS hot swap (RAID 0 and 1)+ 1x PCI Express for SS7 Dual GbE per 1U rack-mount server

4 x GbE per CPU with built in GbE backplane switching separating Control Pathand Data Path with multishelf expandability

External central switching required withmultiple external GbE connectivity

Systems and blade manageability built into the platform withIMP implementation SNMP and CLIP

Carrier-grade redundancy on switch and node

IO for SS7 or other interface modules

CPU blade hot swap capability

Thermaland power

requirements

~6M subscribers redundant= 14 slots with centralized chassis cooling

~6M subscribers redundant= 18 x 1U PCI with independent cooling and separate switch units and system management

Total power consumption= ok (3100 W for blades and RTM + 500 W Shim fan tray and SAP)

Total power consumption= ok

Table 1

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scaling of the platform depending on the subscriber increase or decrease When consolidating multiple services minimiz-ing multiple duplicate databases requires this flexibility

InterconnectivityThe AdvancedTCA platform offers a number of interconnectivity features including

n Separation between the data plane and the control plane

n Direct uplink in a multichassis envi-ronment with up to l0 GbE

n Node to node base and fabric connec-tivity with HA carrier-grade Ethernet functionality

n Easy upgrade path to l0 GbE for increased bandwidth

By contrast the 1U PCI platform requires

n Additional external interconnectiv-ity between 1U rack-mount servers which increases the number of points of failures and the operating and maintenance costs

n Additional switching equipment for carrier-grade Ethernet connectivity

n Additional manage-ment (Simple Network Management Protocol [SNMP]) for HA redundancy

PowerThe 1U-based platform also utilizes integrated AC power supply units usually the standard for the data center and enter-prise environments AC will increase the pro-viderrsquos OPEX in the long term since the power consumption per rack is significantly higher and

Figure 1

requires additional support equipment such as an Uninterruptible Power Supply (UPS) and an AC to DC converter per rack space and ultimately per CPU These factors along with the requirements for carrier-grade functionality HA support and a more favorable long-term OPEX further reduce the need to consider the 1U solution for HSS deployments in Central Office networks

ManageabilityAdvancedTCA chassis-level management is based on the industry-standard Intelligent Platform Management Interface (IPMI) IPMI makes possible interoperability among chassis and blowers compute nodes switches and management solutions from multiple vendors enabling these elements to work together seamlessly The resulting successful inter-blade communication for applications including failover and clustering provides full manageability on a per shelf and per bay basis

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One of the primary goals of the AdvancedTCA specification is to ensure a very low Mean Time to Repair (MTTR) and high Mean Time Between Failures (MTBF) There are no active components in the backplane ndash which can translate to expensive repairs in the field In addi-tion AdvancedTCA specifies that all com-ponents can be hot swappable in the field and the architecture provides redundancy at all levels This hot swap capability translates to less downtime for field replacement on a per CPU blade basis as compared to 1U PCI

SummaryAdvancedTCA provides an ideal platform and meets the technical requirements for deploying flexible and scalable IMS HSS applications While other platform archi-tectures such as 1U rack-mount servers may with considerable difficulty be able to deliver HSS capabilities AdvancedTCA offers a much more advantageous solution by providing a smaller footprint improved cooling and thermal characteristics bet-ter scalability enhanced interconnectivity and easier manageability This all contrib-utes to making AdvancedTCA a lower cost approach in terms of CAPEX and OPEX for long-term subscriber growth

1U PCI rack-mount servers are not considered to be the optimal hardware platform for HSS applications in a Central Office With its limitation for carrier-grade flexibility and HA functionality the 1U PCI platform is best suited for a full range of other enterprise and Internet infrastructure applications within a data center environment that does not require any significant flexibility and HA functionality around it It might also be a good entrance point for other enterprise applications with lower price points

The use of AdvancedTCA-based platforms enables TEMs to shift away from hardware development and refocus their efforts on delivering value-added software and services As a result they can realize lower development costs and faster time-to-market enabling increased flexibility with each product design through the use and reuse of standardized off-the-shelf components Equally significant are the advantages that can be realized by the service provider With a common platform and a flexible architecture that maximizes limited floor space service providers can rapidly and flexibly implement a broad range of feature-rich solutions for faster profitability

Sven Freudenfeld is responsible for North American Business Development for the Kontron AG line of AdvancedTCA AMC MicroTCA and Pre-Integrated Solutions Sven possesses more than 15 years of experience with voice data and wireless com-munications having worked extensively with Nortel Networks in Systems Engineering Sanmina-SCI in Test Engineeringand Deutsche Telekom in Network Engineering Sven holdsan electrical engineering degree from Germany and is also Chair of the CP-TA marketing workgroup focusing on the interoperability of COTS standard building blocks

Kontron bull svenfreudenfeldcakontroncom bull wwwkontroncom

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TECHNOLOGY g BACkpLANES

Increasing demand for service and multimedia features is stimulating a growing need for speed in telecom-munications equipment While some

applications such as PBX systems can be addressed with the gigabit backplane technologies currently available others are running out of headroom Routers may soon need 10 Gbps and higher speed back-planes to keep up with network demand Many such applications can justify the expense of moving to higher performance if it becomes available

Currently telecom system designs offer backplanes that can handle interconnec-tions running as fast as 3125 Gbps raw data throughput per lane (with around a maxi-mum data rate capability of 5-625 Gbps per lane) The AdvancedTCA standard for instance uses Ethernetrsquos XAUI inter-face AdvancedTCA achieves a 10 Gbps net data rate by running four serial lanes for each interconnection with each lanersquos

SERrializerDESerializer (SERDES) op-erating at 3125 Gbps raw data (25 Gbs net)

As demand forces systems to move beyond these rates however new technologies will be needed One proposal calls for the use of XAUI+ or double XAUI which increases lane SERDES rates to 625 Gbps per lane and hence the throughput to 20 Gbps Another proposal is to use IEEE 8023ap known as 10GBASE-KR which runs a single SERDES lane at 125 Gbps raw data rate (103 Gbps net) But these are only short-term answers To address future demands organizations such as the Institute of Electrical and Electronic Engineers Standards Association (IEEE-SA) are developing specifications for Ethernet speeds of 40 Gbps to 100 Gbps which will be applied to backplane interconnect

Such high clock rates however will pose significant design challenges for developers

One of the first challenges that will need resolution is the design and layout of the backplane and other PCBs Common design practice today readily handles board clock rates of around 10 Gbps Well established design rules are in place and board layout tools such as autorouters can automatically handle board designs for speeds in the 10 Gbps range Designers may use specialized board material create additional ground planes and perform similar tasks in order to ensure proper board operation at the higher end but even speeds to 5 GHz are within current design tool capabilities

Design gets trickierAbove 5 GHz however board design gets more involved because feature dimensions become significant when compared to the signalrsquos wavelengths Variations in board thickness can affect signal propagation Corners where traces change direction and small spurs along edges of poorly etched

Channel characteristics

challenge backplane interoperability

Serial backplanes in telecommunications systems aim for high speed with room for

growth As systems began using 10 Gbps links however issues arose that affected backplane

communications among cards from different manufacturers Stuart points out that the

industry must define key backplane channel characteristics so that designs based on open

standards maintain interoperability as backplane speeds move to 40 Gbps and beyond

By Stuart JamieSon

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traces can act as antennae for the higher fre-quencies in digital signals As can be seen in Figure 1 sharp corners and minor flaws that are inconsequential at lower frequen-cies have the potential to become trouble-some antennae at future high speeds This can result in the trace radiating away the signalrsquos high frequency energy increasing EMI and crosstalk as well as altering signal waveforms New routing design rules such as making corners 30deg instead of 45deg and more careful board fabrication techniques may become necessary as designs move above the 10 Gbps per lane threshold

The move to higher frequencies will affect more than board fabrication and layout however Higher frequencies will also impose new requirements on signal tim-ing signal rise-time electrical distance and waveform shape if developers are to retain the mix-and-match system design approach that makes standards-based system design effective

For interoperability to be achievable at data rates above 10 Gbps organizations such as PICMG will need to carefully define a vari-ety of signal and design parameters in their specifications Some of the key parameters that will need consideration include

n Interconnect signal attenuationn Eye diagramn Jittern Input clock recoveryn Chip inputoutput pre-emphasis (PE) n Equalization (EQ)

Even slight variations in these parameters from device to device and lane to lane can shift the timing of signals a significant fraction of a clock cycle and affect the Bit Error Rate (BER) of a lanechannel Finally signal rise times will require tight control as signal rates increase in order to ensure control of system timing (see Figure 2)

In defining signal and design parameters specifications will also need to account for the increased location dependency that comes with higher frequencies Even subtle differences in attributes such as routing length and trace impedance become increasingly significant as signal speeds rise To ensure mix-and-match interopera-bility then design specifications may need to account for the specific backplane slot that a board is to occupy as well as introduce a method to obtain and control the PE and EQ of the devices connected to the lanes

Designers must also address fabrication standards The material used to fabricate

Figure 1

Figure 2

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the board the thickness and composition of metal cladding and the spacing between layers can all affect the trace characteris-tics Controlling these parameters under specification ensures that timing charac-teristics are sufficiently uniform from one board to another However current speci-fications are too detailed and stringent It is extremely difficult to attain compliance yet avoid adding cost to the design

Specifications need workSome of these parameters are already incorporated into current specifications The AMC module specifications from PICMG for instance include design parameters that ensure its proper opera-tion at signal speeds as fast as 125 Gbps per lane Establishing specifications for other system components will help achieve interoperability of standards-based designs at higher frequencies

Design tools may also need to be modified and the industry will need to create new design rules for high frequency and incor-porate these into the tools Developing new routing techniques will help avoid the issues of electrical phenomena such as skin effect dielectric loss and impedance mismatches These are much more preva-lent at higher frequencies and it becomes critical for engineers to model and simu-late these phenomena more accurately

Early efforts are already underway to address the challenges that higher fre-quency signals bring to standards-based design The Interconnect Channel Characterization Subcommittee of PICMG established in September 2006 is develop-ing ground rules and definitions to be used in characterizing transmission reflection and crosstalk performance in backplane and mezzanine carrier interconnects The committee aims to define the channel parameters to be measured or analyzed as well as the methods for doing so Its charter calls for it to address

n Definition of interfaces at which measurements are made or characteristics computed

n Test equipment fixtures and PCB test coupons

n Details of measurement proceduren Data formatsn Techniques for de-embedding

components of the channeln Techniques for validating

measurement based models ie passivity and causality

n Definitions that allow reasonable compliance testing

n Boundary definitions for different paths

n Define information regarding limita-tions or proper usage ie maximum data raterise times that are supported by the models

Such efforts are only a beginning how-ever Other design details still need to be addressed such as SERDES IO Configuration New functionality may need to be defined The design of high data rate system channel interfaces according to standardsspecifications does not currently cover the individual characteristics of the chip transmitterreceiver characteristics Thus work will be needed to address how such standard designs handle such dependency

Crossing an interoperability thresholdOne way of handling location dependen-cies might be to give the system control-ler the ability to inform modules what the channel transmitter and receiver PE and EQ technology is and importantly how to control it With this information along with the signal attenuation suffered (at a given bit rate) for the channel the system should be able to configure SERDES channels in different physical locations to run reliably and at the required BER In MicroTCA systems for instance this functionality could be incorporated into the MicroTCA Carrier Hub (MCH) as part of its electronic keying function Modules would have to be able to configure and control its backplane interfaces to allow for different positions

in the backplane An MCH (see Figure 3 courtesy Emerson) then would be able to instruct a module as to which parameters to use for interoperability

The specific approaches needed to handle location dependencies and other challenges that higher signal rates raise have yet to be developed The need to address these challenges however is clear Increasing demand for services is driving applications to utilize faster signal rates This in turn is driving backplane signaling speeds ever higher As speeds rise above 10 Gbps sig-nals will cross a threshold where current specifications will prove inadequate for ensuring interoperability among standards-based designs

The industry should begin developing new or enhanced specifications and design tools to address the challenges of higher signal rates Without such improvements the guarantees of interoperability that allow system developers to readily create solu-tions by combining off-the-shelf products will be compromised As backplane speeds approach 100 Gbps nothing can be taken for granted

Stuart Jamieson Director of Industry RelationsArchitect with Emerson Network Power Embedded Computing represents Emerson on PICMG committees and the SCOPE organization and previously served as a CP-TA Board member (Treasurer) He brings over 18 years of experience in hardware protocols embedded software and specification development to these groups Within Emerson he played a key role in the develop-ment of the technology central to Emersonrsquos bundled network-ing solutions Stuartrsquos positions within Emerson have included Director of Business Development Director of Advanced Technology and Architect He is the Draft Editor for the PICMG Interconnect Channel Characterization Subcommittee is the author of the introduction section for the new PICMG Ruggedized MicroTCA specification and served as the Draft Editor for the PICMG MicroTCA Specification Stuart gradu-ated from the Heriot-Watt University in 1989 with a 1st Class Honors degree in Electrical and Electronic Engineering and again in 1992 with an IBM-sponsored Master of Philosophy

Emerson Network Power Embedded ComputingStuartJamiesonEmersoncom bull wwwemersonembeddedcomputingcom

Figure 3

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TECHNOLOGY g BACkpLANES

2008

B A

N D

W I

D T

H

Signal integrity challenges to bandwidth scalabilityFor the purposes of this article each interconnected differential pair will be referred to as a Channel (which should not be confused with an aggregated AdvancedTCA channel comprising four trans-mit and four receive pairs)

14-slot full-mesh AdvancedTCA backplanes contain hundreds of Channels Each Channel is defined as the copper signal path from the output of a driver device to the input of a receiver device As

By douglaS Hynd

Developing IEEE 8023ap 10GBASE-KRcompliant backplanes

Why doesAdvancedTCA

need bandwidthscalability

PICMG AdvancedTCA 30 has emerged as the

industryrsquos Hardware Platform standard of choice and

is enjoying first-phase deployment However many

believe that for AdvancedTCA to realize its market

potential AdvancedTCA platforms need to seamlessly

scale to accommodate 40 GbE fabrics thereby

avoiding forklift upgrades as system bandwidth

demands increase over time A 40 GbE switch fabric

architecture would enable realization of a common

platform for computing storage control and media

and packet processing and provide the versatility and

long term ROI required by service providers in

todayrsquos increasingly competitive environment

The challenge was to develop a family of

AdvancedTCA products which feature PICMG 30

compliant dual star and full mesh advanced

backplane switch fabrics enabled up to 10 Gbps

per differential signal pair thereby giving 40 Gbps

per AdvancedTCA channel performance

This article describes the signal integrity challenges

presented in designing an IEEE 8023ap

10GBASE-KR-compliant bandwidth-scalable

14-slot AdvancedTCA platform and how these

challenges were overcome in development of full

mesh and dual star backplane reference designs

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shown in Figure 1 that signal path comprises a signal launch a blade PCB transmission line a daughtercard via a right-angled HM-ZD connector a mated HM-ZD backplane header a back-plane via a length of backplane PCB transmission line and then the same combination of connectors vias and transmission line at the receive end of the Channel

Sources of crosstalkFour principal sources of crosstalk in each Channel must be man-aged as shown in Table 2 Source number one is between adjacent differential pairs as they are routed across the backplane Common mode noise rejection in system differential pair structures makes this a minor issue The second source of crosstalk lies in the HM-ZD connector itself

Crosstalk in via fields our third source primarily arises from inductive coupling between adjacent differential pairs and domi-nates the crosstalk agenda in high-speed Channels This source of crosstalk is directly proportional to the length of the via barrel and where practical care must be taken to ensure that adjacent connector rows are terminated to different target routing Layers

The final source of crosstalk is caused by aggressor signals in through-routed via fields coupling with victim Channel traces as they pass through As mentioned earlier judicious and careful design can mitigate this impact

Skew Channel skew is a function of differential transmission path geometries At a fundamental frequency of 5 GHz skew can be a significant issue in high-speed system design due to narrowing the eye opening and increasing jitter Skew can have a significant impact on crosstalk it negatively impacts the common mode rejection of noise inherent to differential signaling Conductor surface roughness in lower performing dielectric materials can also cause skew in high-speed systems

Skew can be avoided through careful management of transmission path lengths in each Channel and by using higher-glass content (lower Dk) laminates

LossPotential

Potential Mismatches

Channel

Loss Potential Channel

PCB Tolerance -025 dB 2 -01 dB

Connector Tolerance -001 dB 4 -016 dB

Thru-routed Via Fields -001 dB 12 -144 dB

Connector Launch -025 dB+ 4 - 2 dB+

Quantity TotalNEXT

TotalFEXT

PCB Transmission Lines

24 in60 cm

-50 dB -70 dB

Connector Architecture 2 -26 dB -24 dB

Via Fields 4 -22 dB -20 dB

Connector Pass Through 8 -34 dB ndash34 dB

For the target application each one of these Channels must deliver a 10 Gbps Non-Return-To-Zero (NRZ) signal with sufficient signal fidelity to enable a receiver device to detect and process a differential signal The PICMG 30 specification is targeted at 3125 Gbps signaling with a fundamental frequency of 156 GHz Even in low loss dielectric materials insertion loss at 10 Gbps (5 GHz fundamental) is twice that of a 3125 Gbps signal

Therefore achieving acceptable signal fidelity requires careful management of signal losses and noise in each Channel such that an acceptable signal-to-noise (SN) ratio is achieved at the receiver

The design process therefore begins by understanding and mitigat-ing the sources of losses and noise in each Channel

Sources of lossThere are three sources of loss

n Conductor losses which are due to skin effects and can be addressed by maximizing the cross sectional area of the signal traces

n Material dispersion losses which are a function of the dielectric constants of the chosen material These can be mitigated by choosing a higher performance laminate material such as Nelco 4000-13SI or Megtron

n Reflected power loss due to impedance mismatches in the Channel as each signal transitions across the different copper media in each channel (connectors vias and PCB traces) and passes through the pad and anti-pad structures of the via fields of other backplane blade slots

Table 1 shows the relative effects of different sources of impedance mismatches The dominant source of impedance mismatches in every Channel resides in the via structures Successful mitigation of this problem requires that every via is tuned by back-drilling the stub and adjusting the pad and anti-pad structures to match the impedance to be 50 ohms irrespective of the target routing layer This in turn requires that the capacitive and inductive effects of the connector pin and via barrel combination are taken into account during the design of each Channel

Further complicating via design is the space the anti-pad structures need to accommodate Channels being routed between other blades while minimizing electro-magnetic coupling with them This space consideration makes the shape and orientation of pads and anti-pads extremely important

Figure 1

Table 1

Table 2

Fo Sin Pnt

IEEE 8023ap provides a design targetAs Ethernet has emerged as the industryrsquos dominant signaling methodology the IEEE has developed the 10GBASE-KR norma-tive Channel model to define interconnect Channel performance for NRZ signaling at 10 Gbps This standard defines acceptable performance in terms of S-parameter charts for through-Channel insertion loss and worst-case crosstalk Figures 2a and 2b illustrate masks for Draft 24 of the standard that was initially used for this exercise

In each case the mask defining compliant performance is shown in blue Channel insertion loss is shown in red in Figure 2a Crosstalk performance is defined by the ICR curve (Figure 2b) Minimum acceptable Channel performance is defined in the ICR chart (Figure 2b) by the blue line The effect of the sum of all aggressors on the through-Channel is shown in red The green ICR curve is the ratio of the crosstalk power sum calculated by summing the

magnitudes of any impacting crosstalk Channels for each fre-quency and using a straight line fit (using least-squares method) to determine the resulting average effect f the aggressors on the through-Channel This is then overlaid on the insertion loss and used to plot the ICR curve

This standard which has evolved through a variety of iterations forms the basis for developing a 40 GbE switch fabric backplane featuring 10 Gbps NRZ differential pairs If all differential pairs can meet this standard then the backplane can be considered to be 10GBASE-KR compliant

Applying 10GBASE-KR to a 14-slotAdvancedTCA applicationThe PICMG specification dictates that receive differential pairs are placed on the c-d and g-h rows of the HM-ZD connector and that transmit differential pairs are placed on the a-b and e-f rows Therefore the middle differential pair in row c-d of Slot B will be subject to the NEXT of three aggressors in each of the a-b and e-f transmit rows of slot B plus the FEXT of the signals being received in the c-d pairs in the top and bottom of slot B

In this topology it can be seen that worst-case crosstalk would occur if all the NEXT and FEXT aggressors were routed on the bottom Layer that is on the same Layer as that of the victim c-d However given that all signal vias must be back-drilled and tuned for impedance management purposes Channel crosstalk can simultaneously be reduced by allocating different routing Layers to differential pairs terminated in the same backplane connector

The principal factor in determining the feasibility of a 10GBASE-KR compliant backplane is based on understanding whether the Channel with the worst-case signal-to-noise ratio is compliant

The skew targets determine permissible layer separation between a-b c-d e-f and g-h pairs within each Channel and enable routing Layers to be allocated for each pair It is now possible to start the process of via tuning to optimize the channel performance for minimum insertion loss Modeling begins by defining the simulation boundaries for the channel so that Channel component models (PCB traces connectors vias) can easily be aggregated to model complete Channels Boundaries must be established at locations in the Channel where linear 3D structures exist These are shown in Figure 3 (next page)

Since the connector and via combinations for the backplane and daughtercard mating halves must each be treated as a whole it

PICMG 30Spec

TurboFabricSpec

Total Inter-PairSkew

(Fabric Interface)

05 mm in FR4(34 ps)

001 mmin N4000-13si

(00625 ps)

Total Intra-Channel Skew

(Fabric Interface)

254 mm in FR4(17 ps)

plusmn01 mmin N4000-13si

(0625ps)

Total Intra-Channel Skew

(Base Interface)

135 mm in FR4(90 ps)

plusmn01 mmin N4000-13si

(0625 ps)

Figures 2a and 2b

Table 3

Determining which Channel that is and identifying the worst-case SN requires making trade-offs with regard to PCB material Channel length via design connector row selection and NEXT and FEXT aggressor routing choices These trade-off choices can only take place using advanced 3D simulation tools such as Ansoft HFSS This was the essence of the design process employed in developing Simclarrsquos TurboFabric backplanes

The simulation processThe transmission length for full mesh and dual star backplanes design implementations varies from a maximum of 1632 inches to a minimum of 116 inches With an effective transmission length of 5 inches on each daughtercard this makes the longest effective Channel 2632 inches including two connectors

For a 10GBASE-KR application over this distance a high-perfor-mance laminate is essential for both reducing insertion loss and

ensuring high glass content in the weave to mitigate skew So the design process began by choosing a low-loss dielectric material (Nelco 4000-13SI for both the backplane and the daugh-tercards) and establishing targets for Inter-Pair and Intra-Channel skew as shown in Table 3

Adhering to the PICMG 30 specifi-cation for skew in a 10GBASE-KR application is impractical Instead a target of 00625 ps was set for Inter-Pair skew with 0625 ps set for Intra-Pair skew for the backplane only This equated to a maximum 001 mm differ-

ence being allowed between traces of any differential pair and 01 mm being permitted between traces of any four differential pairs in a Channel Given the topology of the HM-ZD connector daughter-card skew must be accounted for in the daughtercard layout Fo

Sin Pnt

should be noted that the simulation boundary is located within the mated connector

Tuning the connector and via structures to 50Ω is an iterative process involving the removal of excess pads back-drilling and tuning pads anti-pads and traces A Time Domain Reflectometer (TDR) plot illustrating the results of the tuning process is shown in Figure 4

Upon completion of the modeling process a total of 17 different optimized via and routing configurations had been designed for the full mesh design and nine for the dual star design

A plot of worst-case insertion loss is shown in Figure 5 and demonstrates that in both cases performance is well above the 10GBASE-KR mask

When all the through-Channels have been modeled adjacent Channel models can be combined and ICR curves plotted to evaluate the impact of crosstalk on through-Channel performance This valuable information can be used to adjust the position of signal Layers relative to pass-through aggressor traces on adjacent Layers or to reroute traces to reduce crosstalk Similarly routing Layers can be changed to reduce crosstalk in adjacent via barrels

Figure 6 plots worst-case ICR and demonstrates that performance is above the 10GBASE-KR mask Based on this result it was possible to proceed to physical implementation

Figure 3

Figure 4

Fo Sin Pnt

Physical realizationThe layout process was performed using the Mentor Board-Station CAD system Quad-routing (routing four traces between pads) was explored as a routing method-ology in order to reduce Layer count but this was dismissed due to the detrimental impact on crosstalk performance

The attributes of the physical backplanes produced as a result of the design effort are shown in Table 4

The design files produced included the usual gerber files plus detailed back-drilling instructions

The design validation process comprised a conventional continuity test followed by performance testing featuring Agilent equipment including 70340A signal generator 8720ES Network Analyzer NN18A S-Parameter test-set and 86100A sampling oscilloscope with Agilent 86112A module Figure 7 (next page) shows the test set up

Simclar developed special line cards to enable through-Channel measurements with and without crosstalk The signal launch featured compression mount SMAs terminated in a tuned via structure The Channel simulations included simu-lation of the tuned launch structures so de-embedding of the launches was not necessary for correlation to simulation purposes The development team also established a process for characterization of all Channels

Full Mesh Dual Star

Layer Count 34 18

Aspect Ratio 121 61

Tuned Vias 3952 768

Material Nelco 4000-13SI

Table 4

Figure 5 Figure 6

Fo Sin Pnt

In Figure 8 measured through-Channel performance and ICR curves are shown for the same Channels described in the simula-tion section earlier

As can be seen from Figure 8 there is close correlation between these and the simulated plots in Figures 5 and 6 In fact close correlation between all simulated and measured results was achieved resulting in a 728 Tbps capacity full mesh and a 960 Gbps capacity dual star backplane design now generally available as part of the Simclar TurboFabric shelf

Figure 7 Figure 8

Figure 9

Figure 10

Implications of 10GBASE-KR Draft 33versus Draft 25The work described above was targeted towards meeting the Channels specifications contained in Draft 25 of the IEEE 10GBASE-KR Since this work was completed the IEEE has up-issued the Draft revision level for the Standard from 25 to 33 While this has not impacted through-Channel performance demands it has increased Channel isolation requirements by around 10 dB In Figure 9 a Draft 33 mask is added to the ICR plot shown in Figure 8

From Figure 9 it can be seen how Draft 33 pulls the mask above the Channel ICR curve for this full mesh backplane Channel Surprisingly it is the Channelrsquos frequency response at relatively low frequencies between 100-500 MHz that is causing a problem The reasons for this are currently the subject of further detailed investigation

However Figure 10 shows a Draft 33 plot for a less demanding dual star AdvancedTCA implementation featuring shorter trans-mission distances This plot demonstrates compliance to Draft 33 of the IEEE 8023ap 10GBASE-KR Standard

ConclusionBy developing a close understanding of the many factors contrib-uting to loss and noise in multi-gigabit backplane Channels it is possible to characterize their performance using advanced simula-tion techniques and correlate that performance in physical prod-ucts using advanced test methods By overlaying the test results on S-Parameter masks defined by the IEEE 8023ap 10GBASE-KR Standard it has been demonstrated that backplanes that truly enable AdvancedTCA scalability are at last a reality

Douglas Hynd joined Simclar Group in 2006 as Director of Marketing as part of Simclarrsquos acquisition of Northrop Grumman Interconnect Technologies Division wherehe was Vice President of Marketing and Sales He has more than 24 yearsrsquo experience intechnology sales marketing and generalmanagement and holds a BSc (Eng) in Electronics and Electrical Engineeringfrom the University of Glasgow He isbased at Simclarrsquos Global HQ inDunfermline Scotland

Simclar Groupdouglashyndsimclarcom bull wwwsimclarcom

Fo Sin Pnt

6U CompactPCIPrOduCT GuIdE g

This monthrsquos issue includes a 6U CompactPCI Product Guide and Irsquod like to take the opportunity to reflect a bit on the success and evolution of that technology

Back in the 1994 time frame when CompactPCI was first being devel-oped it began as 3U-only technology It used the same Eurocardmechanics that were popularized by VME and an IEC standardized high-

density high-speed connector available from a number of vendors suitablefor 33 MHz PCI signaling That connector was selected by the engineers atZiatech with help from Mike Munroe then at ERNI The majority of VMEdesigns were 6U and based on this I was among a number of folks thatargued for adding the 6U CompactPCI form factor

The 6U form factor presented some challenges and opportunities Onechallenge was that the insertion and extraction forces were quite high when the entire rear of the card was populated with connectors Fortunately the IEEE standards for Eurocards evolved and injectorejector handles that pro-vided leverage became available Eike Waltz then at Rittal was instrumental in bringing that to the table Two of the opportunities that came along withthe extra connectors were a clean way to add secondary buses like the H110 telephony bus to the backplane and the ability to route IO out the rear through rear transition modules PICMG has developed quite a number of subsidiary specifications defining the interoperable use of the extra backplane pins made possible with the 6U form factor Both of these features have played a major part in CompactPCIrsquos success The next major evolution of 6U CompactPCI came with the PICMG 216 Packet Switched Backplane standard which was originally conceived by John Peters and his team at Performance Technologies PICMG 216 interconnected a shelf full of CompactPCI single board computers via redundant Ethernet switches also in the 6U CompactPCI form factor This dramatically increased usable backplane bandwidth and provided redundancy PICMG 216 paved the way for AdvancedTCA and was the industryrsquos first open standard for the switched serial interconnect standards we see popping up in many places

By Joe Pavlat

Looking back and ahead at6U CompactPCI

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Recent 6U CompactPCI related products are listed here For more informationenter the productrsquos RSC No at wwwcompactpci-systemscomrsc

cPCI-6910Dual-core Intel Xeon Processor LVULV Universal blade bull Supports Single Dual-Core Intel Xeon LV or ULV processorsbull Front Side Bus 667 MHz bull Up to 2 GB DDR2 400 MHz soldered SDRAM with ECC bull Four PCI Express GbEbull Up to 4 USB 20 ports bull PICMG 20 21 29 216 compliant

RSC No 35013

ADLINK Technologywwwadlinktechcom

CPCIStor Module6U CompactPCI storage blade bull Onboard ATA controller supports CDDVD HDD and solid-state flashbull Supports Hot Swap Removal (ask about RAID support) bull ATA disks available in Enhanced Dutycycle versions for NEBS Level 3 - 724 requirements bull Operating Systems supported VxWorksLinux and Windows

RSC No 34800

ACTTechnicowwwacttechnicocom

Prosody X cPCI E1T1An E1T1 digital network access card bull Suits telco developers and systems integrators bull Uses Aculabrsquos worldwide protocol coverage including Aculabrsquos SS7 stack available under a cost free license bull Available with 8 or 16 E1T1 trunks and software selectable E1T1 interfaces bull Flexible mix of protocols including ISDN CAS and SS7 (ITU-T China and ANSI) bull A variety of interconnect switching and protocol conversion solutions can be readily crafted bull High availability reliability and scalability with industry standard hardw re and software interoperability bull Up to 128 SS7 signaling links bull Non-circuit related (TCAP) messagingintensive applications such as prepaid and SMS

RSC No 35408

Aculabwwwaculabcom

Adexp8021Intel Core Duo L2400 (166 GHz) w E7520 server chipset bull Dual channel PC2-3200 Registered RAM SECDED or x4 SDDC bull Two GbE two Serial ATA four USB 20 bull Onboard SXGA graphics 1280 x 24-bitbull 6U CompactPCI Bus PICMG EXP0 R10 Specification bull RoHS compliant 0 degC to +55 degC operating range

RSC No 32837

Advanet Incwwwadvanetcojpen

TC84012 channel single-stop Time-to-Digital Converter (TDC) with single-start and multi-start acquisition modes bull 50 ps timing resolution bull Wide range with upto 20 s between first and last events bull Large internal memory buffer with up to 512 hits per channel bull Low jitter (lt3 ps rms) high stability (plusmn2 ppm) internalclock source bull External 10 MHz reference input bull FPGA based Data Processing Unit (DPU) bull Fast readout with DMA mode for increased data throughputbull Overvoltage-protected inputs with 50 Ω K-Lock (LEMO) connectors bull Built-in self calibration bull Modular single-slot 6U PXICompactPCI standardbull Low power consumption (lt22 W)

RSC No 33445

Agilent-Acqiriswwwacqiriscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

MIC-30428-slot 6U CompactPCI backplane bull AC or DC CompactPCI 500 W + 250 W redundant(2+1) power supplies bull PICMG 216 (CompactPCI Packet Switching Backplane) compliancebull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarmmodule (MIC-3924L-AE)

RSC No 32851

MIC-30436-slot 6U CompactPCI backplane bull Supports two hot-swappable SCSISATA or removableIDE HDD bays bull Built-in IDE slim-type DVD-ROM bull AC or DC CompactPCI 250 W + 250 Wredundant (1+1) power supplies bull Supports hot-swappable fan modules bull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarm module (MIC-3924L-AE)

RSC No 32850

Advantech Corporationwwwadvantechcom

Dual-Core Xeon CompactPCI SBCModel PP 42123x bull Dual CPU 6U CompactPCI SBC supporting two dual-core Xeon CPUs bull Up to 8 GB DDR2 ECC SDRAM in a single system or peripheralslot bull Dual processor SBC in a single 6U CompactPCI slot bull Supports two 166 GHz Dual-Core Intel Xeon ULV processors using Intel E7520 server chipsetbull Up to 8 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull PMCXMC site support 66 MHz PCI-X and x8 PCI Express bull Front and rear IO bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade bull Four GbE ports with option for PICMG 216

RSC No 34761

6U CompactPCI Core 2 Duo SBCModel PP 41203x bull 6U CompactPCI Core 2 Duo SBC supporting two PMC sites includingone XMC site bull Up to 4 GB DDR2 ECC SDRAM bull All in a single system or peripheral slot bull TwoPMC sites supporting up to 100 MHz PCI-X bull One XMC x8 PCI Express bull Front and rear IObull Supports 216 GHz or 15 GHz Intel Core 2 Duo processors bull Intel E7520 server chipsetbull Up to 4 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade

RSC No 34763

PP 30202xTwo processor versions available bull 18 GHz Intel Pentium M processor 745 uses mFC-PGA 478 (micro Flip-Chip Pin Grid Array) package bull 14 GHz Intel Pentium M processor Low Voltage 738uses mFC-BGA 479 (micro Flip-Chip Ball Grid Array) package bull 64 KB primary (L1) on-die cache2 MB of secondary (L2) on-die cache bull 400 MHz Front Side Bus (FSB) bull No CPU fan bull 16 GHz processor version (1 MB L2 cache) available see PP 30002x datasheet bull Utilizes 64-bitIntel 855GME chipset bull Supports 400 MHz bus frequency bull Uses Intel 6300ESB IO Controller Hub

RSC No 32659

Concurrent Technologies Incwwwgocctcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cCIBPMC6U-ETA 6U bridged dual PMC carrier that bridges extended temperature CompactPCI boards and PMCs bull Features a rugged CompactPCI form factor providing increased flexibility to military communications systems designers bull Provides additional design choices to users through its differing bus speeds maximizing the numberof PMCs that can be used CompactPCI andPMC buses can both run at 66 or 33 MHzbull Operating temperature range of -40 degC to+85 degC bull Signal conditioning bull DMA supportbull Low-power design +5 V +33 V +12 V -12 V bull User-selectable VIO of 33 V or 5 V to the PMC

RSC No 32891

Dynamic Engineeringwwwdynengcom

cPCI4IP-MMMinimized PCI address footprint IndustryPack carrier for CompactPCI applications bull 6U 4HP4 IP positions 832 clock selection for each slot fused filtered power IO options bull ID INT IO and Mem spaces are decoded for each IP slotbull Single and double wide IPrsquos bull 16- and 32- bit IPs bull 32-bit access to 16-bit IPs bull Full or mini-mized Memory Space decoding for 18 the PCI address requirement bull With the cPCI4IP-MM option 8 CompactPCI 4IP cards take the same PCI address space as 1 full Mem Space card

RSC No 34905

ACQ132CPCI32 channel MHz class simultaneous sampling intelligent digitizer bull 32 simultaneous analoginput channels 2-32 MSpschannel 14-bit resolution bull Differential inputs bull Intelligent cardwith 1 gigabyte memory and GbE on board bull Large distributed FPGA resource on boardbull Range of DSP functions including FIR filtering and Digital Downconverter

RSC No 35482

D-TACQ Solutions Ltdwwwd-tacqcouk

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CR11Based on the Intel Core Duo Processor the platform is designed to support processor speeds from 106 GHz up to 20 GHz bull Intel Core 2 Duo runs at 15 GHz up to 20 GHz bull Conduction cooled bull Two PMC slots bull PCI Express bull 2x GbE

RSC No 33156

ICS-72532-channel 6U CompactPCI DAC board bull 6U CompactPCI data acquisition card bull 32 differential output channels bull 16 or 24-bit sample size bull 288 kHzch data rate bull Simultaneous sampling across all channels on single or multiple boards bull 32 separate delta-sigma DACs bull 64-bit 66 MHz CompactPCI PICMG 20 Rev30 hot-swappable bull FPDP II 400 MBps interface

RSC No 33576

ICS-71032-channel 6U CompactPCI ADC board bull 6U CompactPCI data acquisition card bull 32 differential input channels bull 216 KHzch 24-bit resolution bull Software selectable full scale input bull FPDP II 400 MBpsinterface bull 64-bit 66 MHz CompactPCI PICMG 20 Rev 30 hot swappable bull 32 synchronous boards for simultaneous sampling bull Sonar acoustics and test and measurement applications

RSC No 33578

Tsumani 6U CPCI Development KitFPGA processor solution targeted at high performance software defined radio applications bull Dual Stratix EP1S80 FPGAs are tightly coupled to provide apower platform for signal processing bull Two PMC module sites provide IO connectivity to either front panel or back panel connections bull A direct highbandwidth 1 GBps path from the PMC P4 connector directly to the FPGAs bull Model 919 Dual DAC Mezzanine provides broadband analog signal generationin a compact form bull The board features two independent DAC channels each with its own 12-bit LVDS input capable of running at rates up to 160 MHz

RSC No 32026

CP11Rugged 6U SBC bull Up to 4 GB of DDR2 SDRAM (200 MHz) with enhanced ECC four independent onboard PCI buses system host and peripheral modesupport for the CompactPCI backplane two PMC interfaces (64-bit133 MHz and 32-bit33 MHz) bull Instead of the PMC1 a PCI Express based XMC interface is available on request bull Two GbE one Fast Ethernet two serial interfaces (RS-232 or RS-422485) USB 20 integrated HDD or flash drive bull High performance 2D3D ATI video controller capable of driving two displays in parallel supports VGADVI interface bull Intel Core 2 Duo at 216 GHz Intel Core Duo at 20 GHz2x PMC expansion site bull One XMC optional bull Up to 4 GB DDR2 SDRAM wECC 2x GbE

RSC No 33447

GE Fanuc Intelligent Platforms Incwwwgefanucembeddedcom

Single Board ComputersGD Canada designs and manufactures conduction-cooled Single Board Computers (SBCs)using Intel processors bull 6U and 3U form factors for CompactPCI backplanes bull Fully backward compatible with earlier models bull Upgradeable via the change-out of processor memory andIO modules bull Used within GD Canada computer systems and sold as individual products

RSC No 35281

General Dynamicswwwgdcanadacom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cPCI6U-24DSI32R32-channel 24-bit delta-sigma CompactPCI 6U analog input board with rear IO bull Low noise 24-bit resolution low phase distortion andmulti-board synchronization bull Suits state-of-the-art sonar and noise monitoring applications bull 32-channel cPCI6U-24DSI32 analog input boardprovides a high-density 24-bit analog input resources on a standard 6U CompactPCI expansion board bull Applications from precision voltagemeasurements to complex audio signal and waveform analysis

RSC No 34985

General Standards Corporationwwwgeneralstandardscom

Duet 3U 64-bit 1 GHz TMS320C6416 DSP (x2) 64 MB SDRAM per processor bull Flexible internalexternalcommunication mesh bull 64-bit66 MHz CompactPCI bull PMCXMC site with Jn4 to FPGA and4 RocketIO per VITA 42 bull External data port up to 12 Gbps bull 4M or 5M Virtex-II Pro FPGAbull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM dedicated800 MBps links between DSPs bull 3U CompactPCI with PXI support bull Suits high-end co-processing wireless broadband communications RADAR video and biometrics

RSC No 32856

QuadiaQuad-DSP bull Dual FPGA bull Dual PMC sites bull Inter-processor connectivity and access to external interfaces bull Four C6416 DSPs split in two independent clusters each hosting a PMC site bull One large FPGA for end-user code bull Central FPGA routing interprocessor communication bull End-user FPGA communication bull External port serial IO for PCIe or other p ivate link bull Global memoryand PCI interface bull 1 GHz TMS320C6416 DSP (x4) bull 64 MB SDRAM per processor bull Flexible internalexternal communication mesh bull 64-bit66 MHz CompactPCI bull Two PMC sites with Jn4 to FPGA bull External data port up to 12 Gbps bull Two 4M Gate FPGA reserved for end-user code bull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM bull Up to 512 MB Global DDR SDRAM bull Suits high-end co-processing wireless and broadband communications

RSC No 34737

Quixote 64-bit 6UAdvanced signal capture generation and co-processing bull 1 GHz TMS320C6416 DSP and2 to 6 MGATE Virtex-II FPGA bull 32 MB SDRAM 8 MB ZBT SBSRAM and AD6645 and AD9764 converters bull 6432 bit CompactPCI 66 MHz 5 V33 V and complex trigger modes with HW event logging bull PMC site with Jn4 to FPGA DIO and PICMG 217 StarFabric compliant bull Suits Software Defined Radio wireless IP and RADAR development and hardware testing bull Physical Layer field testing ultra-fast flexible data acquisition vector signal generation and electronic warfare

RSC No 32861

Innovative Integrationwwwinnovative-dspcom

IC-e6-cPCIbHigh performance 6U CompactPCI board bull Powered by one or two of Freescalersquos mostadvanced 14 GHz MPC7448 PowerPC processors bull PICMG 216 compliant bull Marvell Discovery III chipset (MV64460) bull Low power consumption bull Standard extended and rugged grades

RSC No 32982

Interface Conceptwwwinterfaceconceptcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CP213Single-width 6U CompactPCIPXI module with either 32 or 64 differential analog input channelsbull 32 64 or 128 channels of analog input bull 16 multifunction digital IO (TTL) channels that may beconfigured as digital in digital out or selectively attached to 2 frequency in 2 counter in andor 2 timerout channels bull 16-bit resolution bull Programmable gain per channel programmable scan rates of lt1 Ss through 100 KSs bull Precision onboard reference for end-to-end calibration

RSC No 34804

KineticSystems Company LLCwwwkscorpcom

CP6001Energy efficient embedded Intel dual core processors bull 12 GHz Intel Core Duo U2500 ULV processor bull Intel Core 2 Duo L7400 LV processor bull Based on the Intel Mobile 945GM chipset with a front side bus of up to 667 MHz and ICH7-R Southbridge bull Two independent digital video outputs to the rear IO (2x DVI - 1x DVI and 1x HDMI) bull AC97 audio capabilities bull 3 x GbE bull 4 x SATA with RAID 01510 functionality bull 6 x USB 20 2 x COM and VGA or DVI bull Can also accommodate a PMC slot or an onboard 25 inch SATA HDD bull Up to 8 GB of USB or 2 GB soldered flash bull Supports Linux Windows XP XP embedded and VxWorks 6

RSC No 34182

CP6923 GbE Switch6U CompactPCI GbE Switch PICMG 216 compliant bull Leading edge te hnology basedon BCM5650X chip bull 24x GbE ports bull Non-blocking Layer 2 and 3 switching and routingbull Copper optical rear IO version bull Hot swap IPMI bull Fully managed bull Comprehensive firmware package bull Applies to VoIP installations such as call servers media gatewaysand trunking gateways in wireline and wireless networks as well as VoIP systems inenterprise networks with high demands on performance

RSC No 32256

Kontronwwwkontroncom

TMS320C6701 Virtex-IITexas Instrumentsrsquo C6701 DSP bull Xilinx Virtex-II series FPGA up to XC2V8000 bull Multiple IO interfaces Onboard CODEC VIM expansion sites 60-pin GPIO header and JTAG bull Hardware drivers integration in SimulinkXilinx System Generator Blocksets for quick implementation of Simulink models bull DSP and FPGA-in-the-loop cosimulation of SimulinkXilinx System Generator models bull Leading edge communication interface allowing real-time datamonitoring from Simulink scopes and remote operations

RSC No 32028

VHS-DACHigh performance multichannel DA for phased array antenna systems radarsonar communications receiversup-sampling to IF stage and RFIF AGC apps bull Eight 125 MSPS output channels bull Optional add-on daughter boardprovides 8 additional output channels or 8 additional input channels bull 32-bit 25 MHz bull FPDP interface with 400 MBps transfer rate (25 MSPS per channel at 8 channels 125 MSPS at 16 channels) bull Low level hardware drivers API andGUI bull High level hardware drivers integration in Simulink Blocksets bull Leading edge communication interface fordata recording and playback tofrom the onboard SDRAM

RSC No 32029

Lyrtechwwwlyrtechcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

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PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

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PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

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PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

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PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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Page 8: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

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By Hermann StraSS

GLOBALTECHNOLOGY

CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems

Award recognizes unique ruggedcamera control system

The 2007 Intel Communications Alliance Innovate and Ignite Technology Showcase (ICA) named MEN Micro Inc the ICA Showcase winner on September 19 2007 at the Embedded Systems Conference Boston MEN Micro a

subsidiary of MEN Germany has developed a unique control system for a rugged digital movie camera

Silicon Imaging an innovator in IT-centric digital cinema cameras required a rugged camera control system for its new SI-2K camera The SI-2K (shown in Figure 1 courtesy of Silicon Imaging United States) executes direct-to-disk raw recording at either 1920x1080 pixel high definition or at 2048x1152 pixel for cinema resolutions Its 48-bit digital processing algorithms perform adaptive pixel-by-pixel calibration and color image enhancement The SI-2K fore-goes legacy fixed bit-rate DCT codec recording formats such as DVCPRO HD and HDCAM-SR for advanced wavelet compres-sion technology Current generation HD cameras destructively process and compress their imagery at the acquisition stage The SI-2K streams images as raw digital negatives over a standard GbE connection The Intel Core 2 Duo processor-based F17 system from MEN non-destructively processes the raw digital negatives in real time to the visually perfect CineForm RAW codec which makes capturing up to four hours of continuous footage on a single 160 GB notebook drive possible

MEN Micro developed a customized version of its Intel Core 2 Duo processor based F17 3U CompactPCI SBC a unique side card for advanced audio and video capabilities as well as a rug-ged compact enclosure Already being used at independent film production studios for the making of full-length feature films the digital camera employs technology that can be repackaged for surveillance military sports analytics 3D video and stereo ap-plications The camera can operate in environments ranging from desert to arctic

The F17 SBC from MEN (Germany) controlling the camera in-cludes an Intel Core 2 Duo processor T7600 running at 233 GHz The SI-2K uses MENrsquos SBC for simultaneous encoding of data An Intel Graphics Media Accelerator 950 (Intel GMA 950) per-forms image graphics processing colorization and visualization at full resolution The F17 is equipped with 2 GB fast DDR2 DRAM a hard disk on a removable slot and two Intel GbE PHYs which transfer data from the camera head to the camera control unit and to other standard IP hardware The custom side card enables the connection of a High-Definition Multimedia Interface (HDMI) headphones and balanced analog input and output ports for pro-fessional audio signals

Specified for an extended temperature range in harsh shooting environments the camera uses MEN Microrsquos F17 board equipped

with a massive tailored heat sink accompanied by a fan install-ed inside the camerarsquos housing The F17 is part of MENrsquos powerful family of intercompatible CompactPCI Express SBCs including the newer and more powerful F18 which is completely compatible with the F17 and will also be incorporated into Silicon Imagingrsquos new SI-2K camera

European eventsThe 26th MOTEK International Trade Fair and Exhibition the worldrsquos largest event for assembly handling and automation sup-port systems and devices was held for the first time in the brand- new Neue Messe in Stuttgart Germany from September 26 to September 27 2007 The exhibition space increased by 45 percent over last yearsrsquo event due to the new venue More than 1100 exhibitors from 20 different countries drew around 40000 visitors and filled all five new exhibition halls Mechatronics was speci-fically featured as were robots and automation equipment In 2008 about one million square feet of exhibition space will be available when four more halls are completed at Europersquos most modern fair grounds near the Stuttgart Airport Terminal

EMO 2007 (Hannover) the worldrsquos largest exhibition of metal-working equipment closed its gates on September 22 after six days of exhibition with around 160000 attendees visiting booths of 2100 exhibitors from 42 countries 18 million square feet was devoted to exhibition space The organizers German Association of Machine Tool Manufacturers (VDW) reported new busi-ness contracts at the rate of 4 billion EURO (almost $6 billion) Exhibitors such as TRUMPF Laser Germany (see my April 2007 column (wwwcompactpci-systemscomcolumnsTechnology_in_Europe200704) reported full success at EMO 2007

For more information contact Hermann athstrassopensystems-publishingcom

Figure 1

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By Curt SChwaderer

CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems

SOFTWARE CORNER

In the April 2007 Software Corner column (wwwcompact-pci-systemscomcolumnssoftware_corner200704) we explored surveillance systems and the Communications Assistance for Law Enforcement Act (CALEA) a lawful

surveillance capability mandate Internet access and VoIP pro- viders had to be compliant with CALEA by May 2007 or face severe financial penalties

In this monthrsquos column we will look at what cable companies are doing to provide lawful surveillance capabilities within their networks

The term cable company is now officially a misnomer Cable companies and their networks are capable Internet access and voice service networks that offer the general public a one-stop shop for all their communications and entertainment needs In fact cable companies now typically call themselves Multi-Service Operators (MSOs) Voice and data services form a significant and grow-ing source of revenues for the MSO To that end cable networks become subject to the same rules and regulations that telecommu-nications networks do

One of these regulations is CALEA which provides the ability for network providers to tap specific subscribers when served a warrant To their credit cable companies and their research and development consortium organization CableLabs (cablelabscom) have been very proactive planning for lawful surveillance capa-bilities and CALEA compliance within their networks CableLabs and its partners have been working on a set of PacketCable stan-dards that incorporate specifications for voice and broadband data intercept We will focus on the new Cable Broadband Intercept Specification (CBIS) what it encompasses and paths for imple-mentation within cable networks

Cable Broadband Intercept Specification The set of specifications governing cable network services and capabilities is called the Data-Over-Cable Service Interface Specifications (DOCSIS) The specification that covers lawful

surveillance for data services is CBIS The CBIS reference model is shown in Figure 1

The surveillance architecture consists of three components the Mediation Function (MF) Broadband Intercept Function (BIF) and Collection Function (CF) When a warrant for a subscriber is served the network administrator configures the MF to capture traffic coming to andor from the subscriber This traffic includes any dynamic IP address assignment transactions (called out-of-band traffic) as well as the traffic resulting from e-mail voice or data services being used by the subscriber in question Creating hashes of these files validates the captured traffic as not having been tampered with It is also important for the network provider to supply traffic only for the subscriber the warrant is served on Older methods of surveillance involve dumping all traffic from a particular service area from all users in that area then sifting through that traffic manually This method violates the privacy rights of all the other subscribers in the service area of the individual(s) the warrant is served on Surveillance equipment that can capture only the traffic to or from the subscriber in the warrant is critical to the lawful surveillance aspects of the deployment

So far this is similar to the Alliance for Telecommunications Industry Solutions (ATIS) standards governing voice and data surveillance for digital wire line systems Unlike the original ATIS specifications the CBIS specification includes the BIF The BIF is a buffering component where the Mediation Function pushes the surveillance information (in the form of surveillance files) to the BIF for retrieval by the Collection Function at a later date

The CF component gathers the surveillance information from the BIF under law enforcement control then analyzes and presents the surveillance information in a useful way The CF also validates the information by comparing hashes of the files against hashes generated by the surveillance equipment at the time of capture This ensures that from the time the traffic is captured it is not tampered with

Cable and CALEA A look at cable networks and lawful surveillance

Figure 1

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Buffering is importantThe buffering capability the BIF provides in the CBIS specifi- cation is an important distinction between it and the ATIS specification (for more information on the ATIS specs see the April 2007 Software Corner (wwwcompactpci-systemscom columnssoftware_corner200704)

Buffering is so important that ATIS has approved an additional standard for a Buffering Function (BF) within the ATIS lawful surveillance environment

The importance of buffering is best described in a presentation that Dr Glen Myers CEO of IP Fabrics gave at the December 2007 ISS World conference The real-time delivery that the initial ATIS specification defines can be problematic as Figure 2 shows Packet loss from congestion bit errors or QoS contracts can result in the entire surveillance stream being rendered inadmissible

Dr Myers further explained that ATIS allows their buffering model to be separate from or combined with the MF while the cable network CBIS model assumes the buffering function is always separate from the MF component (Figure 3)

The buffering function whether it be the Buffering Function in the ATIS model or the Broadband Intercept Function in the CBIS model minimizes the impact of packet loss and real-time data delivery The Mediation Function can repeatedly attempt to send surveillance information to the BIF through a secure reliable file transfer function such as secure FTP If there are problems connecting with the BIF alerts can be generated so the network administrator can find and fix the problem while the surveillance information is still resident on the MF system

Dr Myers mentioned other important benefits to providing a buffering function The network administrator does not need to

negotiate and install a dedicated link for each intercept between the MF and the Law Enforcement Agency or agencies (LEA) authorized for the information Dedicated pipes matching the subjectrsquos peak service bandwith are not needed Support for mul-tiple LEAs is easily implemented at the BIF instead of the Mediation Function Law enforcement collection equipment does not need to be co-located with the Mediation Function It also simplifies connectivity by eliminating Virtual Private Networks (VPNs) or other routing ele-ments between the MF and the LEA(s)

CALEA and CMTSIn a cable network the Cable Modem Termination System (CMTS) is typically the central point within which service provider traffic from the access network meets the cable core network (and ulti-mately the Internet) So the CMTS is an important interface point for lawful surveillance

CMTS equipment may provide varying levels of support for lawful surveillance The simplest is to provide access to all the raw traffic flowing through the CMTS using an Ethernet tap or span port In this scenario the Mediation Function must find the traffic belonging to the subscriber under surveillance generate the appro-priate CBIS files and send the files to the BIF

Cisco a leading supplier of CMTS equip-ment to the cable industry provides a capability called Service Independent Intercept (SII) within their CMTS prod-ucts Cisco SII is also used in their routers and intelligent switches for QoS control in addition to lawful surveillance While SII provides support for identifying traffic by MAC and IP address information it does

Figure 2

Figure 3

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not provide the high-level configuration and lawful surveillance messages required of the Mediation Function SII uses low-level SNMP MIBs that control MAC and IP address configuration commands which in turn trigger the Cisco SII device to send packets matching the configuration to a span port where the Mediation Function can use these matched packets to generate the lawful surveillance messages So SII provides a first-level filter for the Mediation Function which supplies a high-level configuration interface at the warrant description level as well as creation of the CBIS (or ATIS) messages to be sent to the BIF

CBIS-compliant productsThe CBIS specification is quite new so released products are mostly on the hori-zon However the IP Fabrics DeepSweep Lawful Surveillance product line does provide MF andor BIF functionality for the implementation of CBIS-compliant networks Dr Myers noted that the DeepSweep product line is based on a flexible architecture and a highly parallel processing environment comprised of many software surveillance modules that can be loaded and chained within the DeepSweep to provide a number of Layer two to seven surveillance and packet analysis activities The device is programmed through a GUI and operates as a full Mediation Function with the ability to identify subscriber-related IP address assignment and resulting traffic from a span port The DeepSweep also has software support to communicate with SII enabled routers and CMTS sys-tems to provide a fully compliant ATIS andor CBIS surveillance environment compatible with Cisco lawful intercept and QoS services

CBIS BIF and ATIS buffering appliances are also available to provide buffering compliant with CBIS and ATIS standards

ConclusionCyber crimes such as identity theft child pornography chat-room initiated abduc-tion national security and piracy are very real and growing issues in todayrsquos society Billions of corporate and personal dollars have been tied to cyber crooks that abuse the Internet to participate in these activities It is essential that these illegal activities can be identified and stopped It is a good idea to be aware that the cable industry and its proactive support of lawful surveillance standards as well as rolling out equipment that implements these standards will in turn enable law enforcement to catch these cyber crooks and make the Internet a safer place for us and our children to live learn and work

For more information on this or any Software Corner contact Curt atcschwadereropensystems-publishingcom

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APPLICATION g

Based on current overall network growth Telecom Equipment

Manufacturers (TEMs) and Network Equipment Providers (NEPs)

are being challenged to launch new communications platforms

that provide optimal scalability flexibility manageability and

high computing performance With the expected increase in new

subscribers who need to be supported across the network TEMs and

NEPs are focusing on COTS platforms that meet the requirements of

a carrier-grade environment

With these new challenges it is important to take a look at the different

applications in the network to thoroughly evaluate the best hardware

platform approach Comparing the scalability IO functionality

interconnectivity and overall performance gives TEMs and NEPs a

solid basis from which to choose the best cost-effective solution for

their applications This article compares the traditional 1U PCI

platform with a more modular AdvancedTCA-based approach to

a Home Subscriber Server (HSS)-based platform

Emerging next-generation network architecture IMS Carriers and service providers are focused on improving their Average Revenue Per User (ARPU) by deploying new services quickly and at a price that is acceptable to subscribers IP Multimedia Subsystems (IMS) enable service providers to offer differentiated services to their subscriber base integrating voice video text and content as part of their service mix regard-less of the access technology

The IMS framework provides the telecom industry with a modular standards-based IP service delivery infrastructure More than simply replacing existing circuit services with similar services delivered over IP IMS allows service providers to capitalize on faster and more cost-effective deployment of new and differentiated multimedia communication services

While these new technologies promise new sources of revenue and enhanced customer loyalty they also pose implemen- tation challenges One of the crucial net-work elements within an IMS framework is the manageability of the subscriber base Today an increasing number of users subscribe to multiple services such

By Sven FreudenFeld

Choose the right formula forcompute-intensive HSS systems

AdvancedTCA platforms

versus1U PCI rack-mount servers

AdvancedTCA

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as multimedia mobile phones VoIP or IPTV at home Service providers must manage ldquoduplicatedrdquo subscriber databases for each particular service Consequently managing a converging subscriber base for such network functions as billing across multiple different technologies presents a tremendous challenge Any downtime of this network element can be costly to the carrier or service provider not to mention the heavy risk of losing subscribers over the long term

The HSS and Home Location Register (HLR) are key elements in the IMS network required to manage the growing number of subscribers These platforms that manage millions of customersrsquo data need to be highly reliable with carrier-grade High Availability (HA) functionality Core requirements for the HSS computing platform are

n High compute density for application processingn Scalable performance and high densityn Fast read access to the subscriber datan Large storage and memory bandwidthn Ability to consolidate multiple IMS elements and subscriber data within a single

platform with a modular approach as a converged services platform

HSS plays network backbone roleHSS provides the important network backbone of the IMS architecture because it eases innovation and addresses a range of service-logic interaction issues that have plagued previous service architectures HSS offers open access to service-related data for each subscriber supporting the sharing of data among multiple services

HSS is essentially the master user database that supports IMS network entities that handle calls and sessions It contains user profiles performs authentication and authorization of the user and can provide information about the physical location of the user It plays a key role in provisioning service creation enabling subscriber data and managing control roaming and interconnection The Application Server (AS) which hosts and executes serv- ices in the IMS environment communicates with the HSS Call State Control Function

(CSCF) servers also communicate with the HSS which must be able to

n Support IMS-level authentication and authorization

n Maintain IMS subscriber profile(s) independent of access types

n Maintain service-specific datan Keep track of currently assigned

CSCFn Support CSCF and AS access

HLRHSS hardware platform design choicesHSS design must enable the HSS to be deployed cost-effectively and expand readily to meet future subscriber levels For example the trend to include more information as part of the data record for each subscriber will drive up memory requirements

From a technical perspective the key metrics to understand when developing the IMS HSS functions are the number of completed transactions required per sec-ond and the size of the subscriber base

HSS architecture typically comprises multiple processor units with extensive memory requirements With the introduction

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of multicore processors from Intel developers can scale performance while optimizing power consumption in the overall system design

To meet these requirements the hardware platform needs to provide scalability flexibil-ity and long-term cost efficiency In comparing the traditional 1U platform with a more modular approach to the HSS using AdvancedTCA consider the following

n High compute performance n High memory and storage capabilityn IO functionality to connect to multiple networks (such as SS7 and Ethernet)n Carrier-grade profile and redundancy

AdvancedTCA High density with scalability on a smaller footprintTable 1 illustrates a comparison of a sample AdvancedTCA-based platform and a 1U PCI rack-mounted platform for HSS applications This configuration assumes an increasing subscriber growth from 1 million (M) subscribers to 18M subscribers per platform

FootprintAdvancedTCA-based platforms provide a high density compute platform with scalability on a smaller footprint TEMs can easily add boards to a chassis to accommodate more traffic and to support new services This flexibility enables an increase in subscribers and the database without having a major impact on rack space in the central office environ-ment To meet the same capacity for 18M subscribers the 1U PCI approach will occupy two bays or cabinets with a total footprint of 28 square feet compared to the same capacity occupying one bay or cabinet with a footprint of 14 square feet (see Figure 1)

CoolingWhile the power consumption per square foot is higher than the 1U PCI platform AdvancedTCA offers better airflow and cooling distribution using a push-pull cooling system Each 1U PCI platform includes up to nine cooling fans and is dedicated to that CPU in the 1U server only which translates into higher overhead Therefore the airflow is

not optimized in the overall system design In the case of a fan failure AdvancedTCA platforms enable easier access to replace the fans which are field replaceable units The 1U platform also does not include any integrated centralized switching or management capabilities therefore the total does not include any switching or system management functionality

ScalabilityAdvancedTCA architecture lends itself well to scalability As AdvancedTCA sup-ports both a Base and Fabric interface into the backplane and the separation of data and control planes TEMs can also scale up their designs from 1 GbE to 10 GbE to accommodate new users and usage requirements AdvancedTCA based systems are designed for easy upgrade-ability to new processing blades switch fabrics and IO modules using Advanced Mezzanine Cards (such as SS7)

Since AdvancedTCA and AdvancedMCs offer hot swap capabilities and HA func-tionality growing a subscriber base by using additional CPU blades within the system with low maintenance or upgrade downtime is crucial for the HSS plat-form It also allows for the up and down

AdvancedTCA-based HSS Platform 1U PCI Rack-Mount HSS Platform

Number ofsubscribers

~1M subscribers = 4 CPU blades edundant ~1M subscribers = 4 x 1U

~4M subscribers = 7 CPU blades redundant ~4M subscribers = 7 x 1U

~6M subscribers = 12 CPU blades redundant ~6M subscribers = 12 x 1U

~18M subscribers = 36 CPU blades redundant= 3 AdvancedTCA shelves per rack

~18M subscribers= 36 x 1U+ external switch components for redundancy

Technicalspecs

1 CPU blade = 2 x Intel Xeon dual core = quad core 1 1U rack-mount Intel= Intel Xeon quad core or dual core CPU

16 G DDR 2 memory Max of 8 G DRY memory

+ 2 x SATA or SASS hot swap (RAID 0 and 1)+ 1x PCI Express for SS7 Dual GbE per 1U rack-mount server

4 x GbE per CPU with built in GbE backplane switching separating Control Pathand Data Path with multishelf expandability

External central switching required withmultiple external GbE connectivity

Systems and blade manageability built into the platform withIMP implementation SNMP and CLIP

Carrier-grade redundancy on switch and node

IO for SS7 or other interface modules

CPU blade hot swap capability

Thermaland power

requirements

~6M subscribers redundant= 14 slots with centralized chassis cooling

~6M subscribers redundant= 18 x 1U PCI with independent cooling and separate switch units and system management

Total power consumption= ok (3100 W for blades and RTM + 500 W Shim fan tray and SAP)

Total power consumption= ok

Table 1

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scaling of the platform depending on the subscriber increase or decrease When consolidating multiple services minimiz-ing multiple duplicate databases requires this flexibility

InterconnectivityThe AdvancedTCA platform offers a number of interconnectivity features including

n Separation between the data plane and the control plane

n Direct uplink in a multichassis envi-ronment with up to l0 GbE

n Node to node base and fabric connec-tivity with HA carrier-grade Ethernet functionality

n Easy upgrade path to l0 GbE for increased bandwidth

By contrast the 1U PCI platform requires

n Additional external interconnectiv-ity between 1U rack-mount servers which increases the number of points of failures and the operating and maintenance costs

n Additional switching equipment for carrier-grade Ethernet connectivity

n Additional manage-ment (Simple Network Management Protocol [SNMP]) for HA redundancy

PowerThe 1U-based platform also utilizes integrated AC power supply units usually the standard for the data center and enter-prise environments AC will increase the pro-viderrsquos OPEX in the long term since the power consumption per rack is significantly higher and

Figure 1

requires additional support equipment such as an Uninterruptible Power Supply (UPS) and an AC to DC converter per rack space and ultimately per CPU These factors along with the requirements for carrier-grade functionality HA support and a more favorable long-term OPEX further reduce the need to consider the 1U solution for HSS deployments in Central Office networks

ManageabilityAdvancedTCA chassis-level management is based on the industry-standard Intelligent Platform Management Interface (IPMI) IPMI makes possible interoperability among chassis and blowers compute nodes switches and management solutions from multiple vendors enabling these elements to work together seamlessly The resulting successful inter-blade communication for applications including failover and clustering provides full manageability on a per shelf and per bay basis

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One of the primary goals of the AdvancedTCA specification is to ensure a very low Mean Time to Repair (MTTR) and high Mean Time Between Failures (MTBF) There are no active components in the backplane ndash which can translate to expensive repairs in the field In addi-tion AdvancedTCA specifies that all com-ponents can be hot swappable in the field and the architecture provides redundancy at all levels This hot swap capability translates to less downtime for field replacement on a per CPU blade basis as compared to 1U PCI

SummaryAdvancedTCA provides an ideal platform and meets the technical requirements for deploying flexible and scalable IMS HSS applications While other platform archi-tectures such as 1U rack-mount servers may with considerable difficulty be able to deliver HSS capabilities AdvancedTCA offers a much more advantageous solution by providing a smaller footprint improved cooling and thermal characteristics bet-ter scalability enhanced interconnectivity and easier manageability This all contrib-utes to making AdvancedTCA a lower cost approach in terms of CAPEX and OPEX for long-term subscriber growth

1U PCI rack-mount servers are not considered to be the optimal hardware platform for HSS applications in a Central Office With its limitation for carrier-grade flexibility and HA functionality the 1U PCI platform is best suited for a full range of other enterprise and Internet infrastructure applications within a data center environment that does not require any significant flexibility and HA functionality around it It might also be a good entrance point for other enterprise applications with lower price points

The use of AdvancedTCA-based platforms enables TEMs to shift away from hardware development and refocus their efforts on delivering value-added software and services As a result they can realize lower development costs and faster time-to-market enabling increased flexibility with each product design through the use and reuse of standardized off-the-shelf components Equally significant are the advantages that can be realized by the service provider With a common platform and a flexible architecture that maximizes limited floor space service providers can rapidly and flexibly implement a broad range of feature-rich solutions for faster profitability

Sven Freudenfeld is responsible for North American Business Development for the Kontron AG line of AdvancedTCA AMC MicroTCA and Pre-Integrated Solutions Sven possesses more than 15 years of experience with voice data and wireless com-munications having worked extensively with Nortel Networks in Systems Engineering Sanmina-SCI in Test Engineeringand Deutsche Telekom in Network Engineering Sven holdsan electrical engineering degree from Germany and is also Chair of the CP-TA marketing workgroup focusing on the interoperability of COTS standard building blocks

Kontron bull svenfreudenfeldcakontroncom bull wwwkontroncom

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TECHNOLOGY g BACkpLANES

Increasing demand for service and multimedia features is stimulating a growing need for speed in telecom-munications equipment While some

applications such as PBX systems can be addressed with the gigabit backplane technologies currently available others are running out of headroom Routers may soon need 10 Gbps and higher speed back-planes to keep up with network demand Many such applications can justify the expense of moving to higher performance if it becomes available

Currently telecom system designs offer backplanes that can handle interconnec-tions running as fast as 3125 Gbps raw data throughput per lane (with around a maxi-mum data rate capability of 5-625 Gbps per lane) The AdvancedTCA standard for instance uses Ethernetrsquos XAUI inter-face AdvancedTCA achieves a 10 Gbps net data rate by running four serial lanes for each interconnection with each lanersquos

SERrializerDESerializer (SERDES) op-erating at 3125 Gbps raw data (25 Gbs net)

As demand forces systems to move beyond these rates however new technologies will be needed One proposal calls for the use of XAUI+ or double XAUI which increases lane SERDES rates to 625 Gbps per lane and hence the throughput to 20 Gbps Another proposal is to use IEEE 8023ap known as 10GBASE-KR which runs a single SERDES lane at 125 Gbps raw data rate (103 Gbps net) But these are only short-term answers To address future demands organizations such as the Institute of Electrical and Electronic Engineers Standards Association (IEEE-SA) are developing specifications for Ethernet speeds of 40 Gbps to 100 Gbps which will be applied to backplane interconnect

Such high clock rates however will pose significant design challenges for developers

One of the first challenges that will need resolution is the design and layout of the backplane and other PCBs Common design practice today readily handles board clock rates of around 10 Gbps Well established design rules are in place and board layout tools such as autorouters can automatically handle board designs for speeds in the 10 Gbps range Designers may use specialized board material create additional ground planes and perform similar tasks in order to ensure proper board operation at the higher end but even speeds to 5 GHz are within current design tool capabilities

Design gets trickierAbove 5 GHz however board design gets more involved because feature dimensions become significant when compared to the signalrsquos wavelengths Variations in board thickness can affect signal propagation Corners where traces change direction and small spurs along edges of poorly etched

Channel characteristics

challenge backplane interoperability

Serial backplanes in telecommunications systems aim for high speed with room for

growth As systems began using 10 Gbps links however issues arose that affected backplane

communications among cards from different manufacturers Stuart points out that the

industry must define key backplane channel characteristics so that designs based on open

standards maintain interoperability as backplane speeds move to 40 Gbps and beyond

By Stuart JamieSon

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traces can act as antennae for the higher fre-quencies in digital signals As can be seen in Figure 1 sharp corners and minor flaws that are inconsequential at lower frequen-cies have the potential to become trouble-some antennae at future high speeds This can result in the trace radiating away the signalrsquos high frequency energy increasing EMI and crosstalk as well as altering signal waveforms New routing design rules such as making corners 30deg instead of 45deg and more careful board fabrication techniques may become necessary as designs move above the 10 Gbps per lane threshold

The move to higher frequencies will affect more than board fabrication and layout however Higher frequencies will also impose new requirements on signal tim-ing signal rise-time electrical distance and waveform shape if developers are to retain the mix-and-match system design approach that makes standards-based system design effective

For interoperability to be achievable at data rates above 10 Gbps organizations such as PICMG will need to carefully define a vari-ety of signal and design parameters in their specifications Some of the key parameters that will need consideration include

n Interconnect signal attenuationn Eye diagramn Jittern Input clock recoveryn Chip inputoutput pre-emphasis (PE) n Equalization (EQ)

Even slight variations in these parameters from device to device and lane to lane can shift the timing of signals a significant fraction of a clock cycle and affect the Bit Error Rate (BER) of a lanechannel Finally signal rise times will require tight control as signal rates increase in order to ensure control of system timing (see Figure 2)

In defining signal and design parameters specifications will also need to account for the increased location dependency that comes with higher frequencies Even subtle differences in attributes such as routing length and trace impedance become increasingly significant as signal speeds rise To ensure mix-and-match interopera-bility then design specifications may need to account for the specific backplane slot that a board is to occupy as well as introduce a method to obtain and control the PE and EQ of the devices connected to the lanes

Designers must also address fabrication standards The material used to fabricate

Figure 1

Figure 2

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the board the thickness and composition of metal cladding and the spacing between layers can all affect the trace characteris-tics Controlling these parameters under specification ensures that timing charac-teristics are sufficiently uniform from one board to another However current speci-fications are too detailed and stringent It is extremely difficult to attain compliance yet avoid adding cost to the design

Specifications need workSome of these parameters are already incorporated into current specifications The AMC module specifications from PICMG for instance include design parameters that ensure its proper opera-tion at signal speeds as fast as 125 Gbps per lane Establishing specifications for other system components will help achieve interoperability of standards-based designs at higher frequencies

Design tools may also need to be modified and the industry will need to create new design rules for high frequency and incor-porate these into the tools Developing new routing techniques will help avoid the issues of electrical phenomena such as skin effect dielectric loss and impedance mismatches These are much more preva-lent at higher frequencies and it becomes critical for engineers to model and simu-late these phenomena more accurately

Early efforts are already underway to address the challenges that higher fre-quency signals bring to standards-based design The Interconnect Channel Characterization Subcommittee of PICMG established in September 2006 is develop-ing ground rules and definitions to be used in characterizing transmission reflection and crosstalk performance in backplane and mezzanine carrier interconnects The committee aims to define the channel parameters to be measured or analyzed as well as the methods for doing so Its charter calls for it to address

n Definition of interfaces at which measurements are made or characteristics computed

n Test equipment fixtures and PCB test coupons

n Details of measurement proceduren Data formatsn Techniques for de-embedding

components of the channeln Techniques for validating

measurement based models ie passivity and causality

n Definitions that allow reasonable compliance testing

n Boundary definitions for different paths

n Define information regarding limita-tions or proper usage ie maximum data raterise times that are supported by the models

Such efforts are only a beginning how-ever Other design details still need to be addressed such as SERDES IO Configuration New functionality may need to be defined The design of high data rate system channel interfaces according to standardsspecifications does not currently cover the individual characteristics of the chip transmitterreceiver characteristics Thus work will be needed to address how such standard designs handle such dependency

Crossing an interoperability thresholdOne way of handling location dependen-cies might be to give the system control-ler the ability to inform modules what the channel transmitter and receiver PE and EQ technology is and importantly how to control it With this information along with the signal attenuation suffered (at a given bit rate) for the channel the system should be able to configure SERDES channels in different physical locations to run reliably and at the required BER In MicroTCA systems for instance this functionality could be incorporated into the MicroTCA Carrier Hub (MCH) as part of its electronic keying function Modules would have to be able to configure and control its backplane interfaces to allow for different positions

in the backplane An MCH (see Figure 3 courtesy Emerson) then would be able to instruct a module as to which parameters to use for interoperability

The specific approaches needed to handle location dependencies and other challenges that higher signal rates raise have yet to be developed The need to address these challenges however is clear Increasing demand for services is driving applications to utilize faster signal rates This in turn is driving backplane signaling speeds ever higher As speeds rise above 10 Gbps sig-nals will cross a threshold where current specifications will prove inadequate for ensuring interoperability among standards-based designs

The industry should begin developing new or enhanced specifications and design tools to address the challenges of higher signal rates Without such improvements the guarantees of interoperability that allow system developers to readily create solu-tions by combining off-the-shelf products will be compromised As backplane speeds approach 100 Gbps nothing can be taken for granted

Stuart Jamieson Director of Industry RelationsArchitect with Emerson Network Power Embedded Computing represents Emerson on PICMG committees and the SCOPE organization and previously served as a CP-TA Board member (Treasurer) He brings over 18 years of experience in hardware protocols embedded software and specification development to these groups Within Emerson he played a key role in the develop-ment of the technology central to Emersonrsquos bundled network-ing solutions Stuartrsquos positions within Emerson have included Director of Business Development Director of Advanced Technology and Architect He is the Draft Editor for the PICMG Interconnect Channel Characterization Subcommittee is the author of the introduction section for the new PICMG Ruggedized MicroTCA specification and served as the Draft Editor for the PICMG MicroTCA Specification Stuart gradu-ated from the Heriot-Watt University in 1989 with a 1st Class Honors degree in Electrical and Electronic Engineering and again in 1992 with an IBM-sponsored Master of Philosophy

Emerson Network Power Embedded ComputingStuartJamiesonEmersoncom bull wwwemersonembeddedcomputingcom

Figure 3

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TECHNOLOGY g BACkpLANES

2008

B A

N D

W I

D T

H

Signal integrity challenges to bandwidth scalabilityFor the purposes of this article each interconnected differential pair will be referred to as a Channel (which should not be confused with an aggregated AdvancedTCA channel comprising four trans-mit and four receive pairs)

14-slot full-mesh AdvancedTCA backplanes contain hundreds of Channels Each Channel is defined as the copper signal path from the output of a driver device to the input of a receiver device As

By douglaS Hynd

Developing IEEE 8023ap 10GBASE-KRcompliant backplanes

Why doesAdvancedTCA

need bandwidthscalability

PICMG AdvancedTCA 30 has emerged as the

industryrsquos Hardware Platform standard of choice and

is enjoying first-phase deployment However many

believe that for AdvancedTCA to realize its market

potential AdvancedTCA platforms need to seamlessly

scale to accommodate 40 GbE fabrics thereby

avoiding forklift upgrades as system bandwidth

demands increase over time A 40 GbE switch fabric

architecture would enable realization of a common

platform for computing storage control and media

and packet processing and provide the versatility and

long term ROI required by service providers in

todayrsquos increasingly competitive environment

The challenge was to develop a family of

AdvancedTCA products which feature PICMG 30

compliant dual star and full mesh advanced

backplane switch fabrics enabled up to 10 Gbps

per differential signal pair thereby giving 40 Gbps

per AdvancedTCA channel performance

This article describes the signal integrity challenges

presented in designing an IEEE 8023ap

10GBASE-KR-compliant bandwidth-scalable

14-slot AdvancedTCA platform and how these

challenges were overcome in development of full

mesh and dual star backplane reference designs

Fo Sin Pnt

shown in Figure 1 that signal path comprises a signal launch a blade PCB transmission line a daughtercard via a right-angled HM-ZD connector a mated HM-ZD backplane header a back-plane via a length of backplane PCB transmission line and then the same combination of connectors vias and transmission line at the receive end of the Channel

Sources of crosstalkFour principal sources of crosstalk in each Channel must be man-aged as shown in Table 2 Source number one is between adjacent differential pairs as they are routed across the backplane Common mode noise rejection in system differential pair structures makes this a minor issue The second source of crosstalk lies in the HM-ZD connector itself

Crosstalk in via fields our third source primarily arises from inductive coupling between adjacent differential pairs and domi-nates the crosstalk agenda in high-speed Channels This source of crosstalk is directly proportional to the length of the via barrel and where practical care must be taken to ensure that adjacent connector rows are terminated to different target routing Layers

The final source of crosstalk is caused by aggressor signals in through-routed via fields coupling with victim Channel traces as they pass through As mentioned earlier judicious and careful design can mitigate this impact

Skew Channel skew is a function of differential transmission path geometries At a fundamental frequency of 5 GHz skew can be a significant issue in high-speed system design due to narrowing the eye opening and increasing jitter Skew can have a significant impact on crosstalk it negatively impacts the common mode rejection of noise inherent to differential signaling Conductor surface roughness in lower performing dielectric materials can also cause skew in high-speed systems

Skew can be avoided through careful management of transmission path lengths in each Channel and by using higher-glass content (lower Dk) laminates

LossPotential

Potential Mismatches

Channel

Loss Potential Channel

PCB Tolerance -025 dB 2 -01 dB

Connector Tolerance -001 dB 4 -016 dB

Thru-routed Via Fields -001 dB 12 -144 dB

Connector Launch -025 dB+ 4 - 2 dB+

Quantity TotalNEXT

TotalFEXT

PCB Transmission Lines

24 in60 cm

-50 dB -70 dB

Connector Architecture 2 -26 dB -24 dB

Via Fields 4 -22 dB -20 dB

Connector Pass Through 8 -34 dB ndash34 dB

For the target application each one of these Channels must deliver a 10 Gbps Non-Return-To-Zero (NRZ) signal with sufficient signal fidelity to enable a receiver device to detect and process a differential signal The PICMG 30 specification is targeted at 3125 Gbps signaling with a fundamental frequency of 156 GHz Even in low loss dielectric materials insertion loss at 10 Gbps (5 GHz fundamental) is twice that of a 3125 Gbps signal

Therefore achieving acceptable signal fidelity requires careful management of signal losses and noise in each Channel such that an acceptable signal-to-noise (SN) ratio is achieved at the receiver

The design process therefore begins by understanding and mitigat-ing the sources of losses and noise in each Channel

Sources of lossThere are three sources of loss

n Conductor losses which are due to skin effects and can be addressed by maximizing the cross sectional area of the signal traces

n Material dispersion losses which are a function of the dielectric constants of the chosen material These can be mitigated by choosing a higher performance laminate material such as Nelco 4000-13SI or Megtron

n Reflected power loss due to impedance mismatches in the Channel as each signal transitions across the different copper media in each channel (connectors vias and PCB traces) and passes through the pad and anti-pad structures of the via fields of other backplane blade slots

Table 1 shows the relative effects of different sources of impedance mismatches The dominant source of impedance mismatches in every Channel resides in the via structures Successful mitigation of this problem requires that every via is tuned by back-drilling the stub and adjusting the pad and anti-pad structures to match the impedance to be 50 ohms irrespective of the target routing layer This in turn requires that the capacitive and inductive effects of the connector pin and via barrel combination are taken into account during the design of each Channel

Further complicating via design is the space the anti-pad structures need to accommodate Channels being routed between other blades while minimizing electro-magnetic coupling with them This space consideration makes the shape and orientation of pads and anti-pads extremely important

Figure 1

Table 1

Table 2

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IEEE 8023ap provides a design targetAs Ethernet has emerged as the industryrsquos dominant signaling methodology the IEEE has developed the 10GBASE-KR norma-tive Channel model to define interconnect Channel performance for NRZ signaling at 10 Gbps This standard defines acceptable performance in terms of S-parameter charts for through-Channel insertion loss and worst-case crosstalk Figures 2a and 2b illustrate masks for Draft 24 of the standard that was initially used for this exercise

In each case the mask defining compliant performance is shown in blue Channel insertion loss is shown in red in Figure 2a Crosstalk performance is defined by the ICR curve (Figure 2b) Minimum acceptable Channel performance is defined in the ICR chart (Figure 2b) by the blue line The effect of the sum of all aggressors on the through-Channel is shown in red The green ICR curve is the ratio of the crosstalk power sum calculated by summing the

magnitudes of any impacting crosstalk Channels for each fre-quency and using a straight line fit (using least-squares method) to determine the resulting average effect f the aggressors on the through-Channel This is then overlaid on the insertion loss and used to plot the ICR curve

This standard which has evolved through a variety of iterations forms the basis for developing a 40 GbE switch fabric backplane featuring 10 Gbps NRZ differential pairs If all differential pairs can meet this standard then the backplane can be considered to be 10GBASE-KR compliant

Applying 10GBASE-KR to a 14-slotAdvancedTCA applicationThe PICMG specification dictates that receive differential pairs are placed on the c-d and g-h rows of the HM-ZD connector and that transmit differential pairs are placed on the a-b and e-f rows Therefore the middle differential pair in row c-d of Slot B will be subject to the NEXT of three aggressors in each of the a-b and e-f transmit rows of slot B plus the FEXT of the signals being received in the c-d pairs in the top and bottom of slot B

In this topology it can be seen that worst-case crosstalk would occur if all the NEXT and FEXT aggressors were routed on the bottom Layer that is on the same Layer as that of the victim c-d However given that all signal vias must be back-drilled and tuned for impedance management purposes Channel crosstalk can simultaneously be reduced by allocating different routing Layers to differential pairs terminated in the same backplane connector

The principal factor in determining the feasibility of a 10GBASE-KR compliant backplane is based on understanding whether the Channel with the worst-case signal-to-noise ratio is compliant

The skew targets determine permissible layer separation between a-b c-d e-f and g-h pairs within each Channel and enable routing Layers to be allocated for each pair It is now possible to start the process of via tuning to optimize the channel performance for minimum insertion loss Modeling begins by defining the simulation boundaries for the channel so that Channel component models (PCB traces connectors vias) can easily be aggregated to model complete Channels Boundaries must be established at locations in the Channel where linear 3D structures exist These are shown in Figure 3 (next page)

Since the connector and via combinations for the backplane and daughtercard mating halves must each be treated as a whole it

PICMG 30Spec

TurboFabricSpec

Total Inter-PairSkew

(Fabric Interface)

05 mm in FR4(34 ps)

001 mmin N4000-13si

(00625 ps)

Total Intra-Channel Skew

(Fabric Interface)

254 mm in FR4(17 ps)

plusmn01 mmin N4000-13si

(0625ps)

Total Intra-Channel Skew

(Base Interface)

135 mm in FR4(90 ps)

plusmn01 mmin N4000-13si

(0625 ps)

Figures 2a and 2b

Table 3

Determining which Channel that is and identifying the worst-case SN requires making trade-offs with regard to PCB material Channel length via design connector row selection and NEXT and FEXT aggressor routing choices These trade-off choices can only take place using advanced 3D simulation tools such as Ansoft HFSS This was the essence of the design process employed in developing Simclarrsquos TurboFabric backplanes

The simulation processThe transmission length for full mesh and dual star backplanes design implementations varies from a maximum of 1632 inches to a minimum of 116 inches With an effective transmission length of 5 inches on each daughtercard this makes the longest effective Channel 2632 inches including two connectors

For a 10GBASE-KR application over this distance a high-perfor-mance laminate is essential for both reducing insertion loss and

ensuring high glass content in the weave to mitigate skew So the design process began by choosing a low-loss dielectric material (Nelco 4000-13SI for both the backplane and the daugh-tercards) and establishing targets for Inter-Pair and Intra-Channel skew as shown in Table 3

Adhering to the PICMG 30 specifi-cation for skew in a 10GBASE-KR application is impractical Instead a target of 00625 ps was set for Inter-Pair skew with 0625 ps set for Intra-Pair skew for the backplane only This equated to a maximum 001 mm differ-

ence being allowed between traces of any differential pair and 01 mm being permitted between traces of any four differential pairs in a Channel Given the topology of the HM-ZD connector daughter-card skew must be accounted for in the daughtercard layout Fo

Sin Pnt

should be noted that the simulation boundary is located within the mated connector

Tuning the connector and via structures to 50Ω is an iterative process involving the removal of excess pads back-drilling and tuning pads anti-pads and traces A Time Domain Reflectometer (TDR) plot illustrating the results of the tuning process is shown in Figure 4

Upon completion of the modeling process a total of 17 different optimized via and routing configurations had been designed for the full mesh design and nine for the dual star design

A plot of worst-case insertion loss is shown in Figure 5 and demonstrates that in both cases performance is well above the 10GBASE-KR mask

When all the through-Channels have been modeled adjacent Channel models can be combined and ICR curves plotted to evaluate the impact of crosstalk on through-Channel performance This valuable information can be used to adjust the position of signal Layers relative to pass-through aggressor traces on adjacent Layers or to reroute traces to reduce crosstalk Similarly routing Layers can be changed to reduce crosstalk in adjacent via barrels

Figure 6 plots worst-case ICR and demonstrates that performance is above the 10GBASE-KR mask Based on this result it was possible to proceed to physical implementation

Figure 3

Figure 4

Fo Sin Pnt

Physical realizationThe layout process was performed using the Mentor Board-Station CAD system Quad-routing (routing four traces between pads) was explored as a routing method-ology in order to reduce Layer count but this was dismissed due to the detrimental impact on crosstalk performance

The attributes of the physical backplanes produced as a result of the design effort are shown in Table 4

The design files produced included the usual gerber files plus detailed back-drilling instructions

The design validation process comprised a conventional continuity test followed by performance testing featuring Agilent equipment including 70340A signal generator 8720ES Network Analyzer NN18A S-Parameter test-set and 86100A sampling oscilloscope with Agilent 86112A module Figure 7 (next page) shows the test set up

Simclar developed special line cards to enable through-Channel measurements with and without crosstalk The signal launch featured compression mount SMAs terminated in a tuned via structure The Channel simulations included simu-lation of the tuned launch structures so de-embedding of the launches was not necessary for correlation to simulation purposes The development team also established a process for characterization of all Channels

Full Mesh Dual Star

Layer Count 34 18

Aspect Ratio 121 61

Tuned Vias 3952 768

Material Nelco 4000-13SI

Table 4

Figure 5 Figure 6

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In Figure 8 measured through-Channel performance and ICR curves are shown for the same Channels described in the simula-tion section earlier

As can be seen from Figure 8 there is close correlation between these and the simulated plots in Figures 5 and 6 In fact close correlation between all simulated and measured results was achieved resulting in a 728 Tbps capacity full mesh and a 960 Gbps capacity dual star backplane design now generally available as part of the Simclar TurboFabric shelf

Figure 7 Figure 8

Figure 9

Figure 10

Implications of 10GBASE-KR Draft 33versus Draft 25The work described above was targeted towards meeting the Channels specifications contained in Draft 25 of the IEEE 10GBASE-KR Since this work was completed the IEEE has up-issued the Draft revision level for the Standard from 25 to 33 While this has not impacted through-Channel performance demands it has increased Channel isolation requirements by around 10 dB In Figure 9 a Draft 33 mask is added to the ICR plot shown in Figure 8

From Figure 9 it can be seen how Draft 33 pulls the mask above the Channel ICR curve for this full mesh backplane Channel Surprisingly it is the Channelrsquos frequency response at relatively low frequencies between 100-500 MHz that is causing a problem The reasons for this are currently the subject of further detailed investigation

However Figure 10 shows a Draft 33 plot for a less demanding dual star AdvancedTCA implementation featuring shorter trans-mission distances This plot demonstrates compliance to Draft 33 of the IEEE 8023ap 10GBASE-KR Standard

ConclusionBy developing a close understanding of the many factors contrib-uting to loss and noise in multi-gigabit backplane Channels it is possible to characterize their performance using advanced simula-tion techniques and correlate that performance in physical prod-ucts using advanced test methods By overlaying the test results on S-Parameter masks defined by the IEEE 8023ap 10GBASE-KR Standard it has been demonstrated that backplanes that truly enable AdvancedTCA scalability are at last a reality

Douglas Hynd joined Simclar Group in 2006 as Director of Marketing as part of Simclarrsquos acquisition of Northrop Grumman Interconnect Technologies Division wherehe was Vice President of Marketing and Sales He has more than 24 yearsrsquo experience intechnology sales marketing and generalmanagement and holds a BSc (Eng) in Electronics and Electrical Engineeringfrom the University of Glasgow He isbased at Simclarrsquos Global HQ inDunfermline Scotland

Simclar Groupdouglashyndsimclarcom bull wwwsimclarcom

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6U CompactPCIPrOduCT GuIdE g

This monthrsquos issue includes a 6U CompactPCI Product Guide and Irsquod like to take the opportunity to reflect a bit on the success and evolution of that technology

Back in the 1994 time frame when CompactPCI was first being devel-oped it began as 3U-only technology It used the same Eurocardmechanics that were popularized by VME and an IEC standardized high-

density high-speed connector available from a number of vendors suitablefor 33 MHz PCI signaling That connector was selected by the engineers atZiatech with help from Mike Munroe then at ERNI The majority of VMEdesigns were 6U and based on this I was among a number of folks thatargued for adding the 6U CompactPCI form factor

The 6U form factor presented some challenges and opportunities Onechallenge was that the insertion and extraction forces were quite high when the entire rear of the card was populated with connectors Fortunately the IEEE standards for Eurocards evolved and injectorejector handles that pro-vided leverage became available Eike Waltz then at Rittal was instrumental in bringing that to the table Two of the opportunities that came along withthe extra connectors were a clean way to add secondary buses like the H110 telephony bus to the backplane and the ability to route IO out the rear through rear transition modules PICMG has developed quite a number of subsidiary specifications defining the interoperable use of the extra backplane pins made possible with the 6U form factor Both of these features have played a major part in CompactPCIrsquos success The next major evolution of 6U CompactPCI came with the PICMG 216 Packet Switched Backplane standard which was originally conceived by John Peters and his team at Performance Technologies PICMG 216 interconnected a shelf full of CompactPCI single board computers via redundant Ethernet switches also in the 6U CompactPCI form factor This dramatically increased usable backplane bandwidth and provided redundancy PICMG 216 paved the way for AdvancedTCA and was the industryrsquos first open standard for the switched serial interconnect standards we see popping up in many places

By Joe Pavlat

Looking back and ahead at6U CompactPCI

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PrOduCT GuIdE6U CompactPCI

Recent 6U CompactPCI related products are listed here For more informationenter the productrsquos RSC No at wwwcompactpci-systemscomrsc

cPCI-6910Dual-core Intel Xeon Processor LVULV Universal blade bull Supports Single Dual-Core Intel Xeon LV or ULV processorsbull Front Side Bus 667 MHz bull Up to 2 GB DDR2 400 MHz soldered SDRAM with ECC bull Four PCI Express GbEbull Up to 4 USB 20 ports bull PICMG 20 21 29 216 compliant

RSC No 35013

ADLINK Technologywwwadlinktechcom

CPCIStor Module6U CompactPCI storage blade bull Onboard ATA controller supports CDDVD HDD and solid-state flashbull Supports Hot Swap Removal (ask about RAID support) bull ATA disks available in Enhanced Dutycycle versions for NEBS Level 3 - 724 requirements bull Operating Systems supported VxWorksLinux and Windows

RSC No 34800

ACTTechnicowwwacttechnicocom

Prosody X cPCI E1T1An E1T1 digital network access card bull Suits telco developers and systems integrators bull Uses Aculabrsquos worldwide protocol coverage including Aculabrsquos SS7 stack available under a cost free license bull Available with 8 or 16 E1T1 trunks and software selectable E1T1 interfaces bull Flexible mix of protocols including ISDN CAS and SS7 (ITU-T China and ANSI) bull A variety of interconnect switching and protocol conversion solutions can be readily crafted bull High availability reliability and scalability with industry standard hardw re and software interoperability bull Up to 128 SS7 signaling links bull Non-circuit related (TCAP) messagingintensive applications such as prepaid and SMS

RSC No 35408

Aculabwwwaculabcom

Adexp8021Intel Core Duo L2400 (166 GHz) w E7520 server chipset bull Dual channel PC2-3200 Registered RAM SECDED or x4 SDDC bull Two GbE two Serial ATA four USB 20 bull Onboard SXGA graphics 1280 x 24-bitbull 6U CompactPCI Bus PICMG EXP0 R10 Specification bull RoHS compliant 0 degC to +55 degC operating range

RSC No 32837

Advanet Incwwwadvanetcojpen

TC84012 channel single-stop Time-to-Digital Converter (TDC) with single-start and multi-start acquisition modes bull 50 ps timing resolution bull Wide range with upto 20 s between first and last events bull Large internal memory buffer with up to 512 hits per channel bull Low jitter (lt3 ps rms) high stability (plusmn2 ppm) internalclock source bull External 10 MHz reference input bull FPGA based Data Processing Unit (DPU) bull Fast readout with DMA mode for increased data throughputbull Overvoltage-protected inputs with 50 Ω K-Lock (LEMO) connectors bull Built-in self calibration bull Modular single-slot 6U PXICompactPCI standardbull Low power consumption (lt22 W)

RSC No 33445

Agilent-Acqiriswwwacqiriscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

MIC-30428-slot 6U CompactPCI backplane bull AC or DC CompactPCI 500 W + 250 W redundant(2+1) power supplies bull PICMG 216 (CompactPCI Packet Switching Backplane) compliancebull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarmmodule (MIC-3924L-AE)

RSC No 32851

MIC-30436-slot 6U CompactPCI backplane bull Supports two hot-swappable SCSISATA or removableIDE HDD bays bull Built-in IDE slim-type DVD-ROM bull AC or DC CompactPCI 250 W + 250 Wredundant (1+1) power supplies bull Supports hot-swappable fan modules bull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarm module (MIC-3924L-AE)

RSC No 32850

Advantech Corporationwwwadvantechcom

Dual-Core Xeon CompactPCI SBCModel PP 42123x bull Dual CPU 6U CompactPCI SBC supporting two dual-core Xeon CPUs bull Up to 8 GB DDR2 ECC SDRAM in a single system or peripheralslot bull Dual processor SBC in a single 6U CompactPCI slot bull Supports two 166 GHz Dual-Core Intel Xeon ULV processors using Intel E7520 server chipsetbull Up to 8 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull PMCXMC site support 66 MHz PCI-X and x8 PCI Express bull Front and rear IO bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade bull Four GbE ports with option for PICMG 216

RSC No 34761

6U CompactPCI Core 2 Duo SBCModel PP 41203x bull 6U CompactPCI Core 2 Duo SBC supporting two PMC sites includingone XMC site bull Up to 4 GB DDR2 ECC SDRAM bull All in a single system or peripheral slot bull TwoPMC sites supporting up to 100 MHz PCI-X bull One XMC x8 PCI Express bull Front and rear IObull Supports 216 GHz or 15 GHz Intel Core 2 Duo processors bull Intel E7520 server chipsetbull Up to 4 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade

RSC No 34763

PP 30202xTwo processor versions available bull 18 GHz Intel Pentium M processor 745 uses mFC-PGA 478 (micro Flip-Chip Pin Grid Array) package bull 14 GHz Intel Pentium M processor Low Voltage 738uses mFC-BGA 479 (micro Flip-Chip Ball Grid Array) package bull 64 KB primary (L1) on-die cache2 MB of secondary (L2) on-die cache bull 400 MHz Front Side Bus (FSB) bull No CPU fan bull 16 GHz processor version (1 MB L2 cache) available see PP 30002x datasheet bull Utilizes 64-bitIntel 855GME chipset bull Supports 400 MHz bus frequency bull Uses Intel 6300ESB IO Controller Hub

RSC No 32659

Concurrent Technologies Incwwwgocctcom

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PrOduCT GuIdE6U CompactPCI

cCIBPMC6U-ETA 6U bridged dual PMC carrier that bridges extended temperature CompactPCI boards and PMCs bull Features a rugged CompactPCI form factor providing increased flexibility to military communications systems designers bull Provides additional design choices to users through its differing bus speeds maximizing the numberof PMCs that can be used CompactPCI andPMC buses can both run at 66 or 33 MHzbull Operating temperature range of -40 degC to+85 degC bull Signal conditioning bull DMA supportbull Low-power design +5 V +33 V +12 V -12 V bull User-selectable VIO of 33 V or 5 V to the PMC

RSC No 32891

Dynamic Engineeringwwwdynengcom

cPCI4IP-MMMinimized PCI address footprint IndustryPack carrier for CompactPCI applications bull 6U 4HP4 IP positions 832 clock selection for each slot fused filtered power IO options bull ID INT IO and Mem spaces are decoded for each IP slotbull Single and double wide IPrsquos bull 16- and 32- bit IPs bull 32-bit access to 16-bit IPs bull Full or mini-mized Memory Space decoding for 18 the PCI address requirement bull With the cPCI4IP-MM option 8 CompactPCI 4IP cards take the same PCI address space as 1 full Mem Space card

RSC No 34905

ACQ132CPCI32 channel MHz class simultaneous sampling intelligent digitizer bull 32 simultaneous analoginput channels 2-32 MSpschannel 14-bit resolution bull Differential inputs bull Intelligent cardwith 1 gigabyte memory and GbE on board bull Large distributed FPGA resource on boardbull Range of DSP functions including FIR filtering and Digital Downconverter

RSC No 35482

D-TACQ Solutions Ltdwwwd-tacqcouk

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PrOduCT GuIdE6U CompactPCI

CR11Based on the Intel Core Duo Processor the platform is designed to support processor speeds from 106 GHz up to 20 GHz bull Intel Core 2 Duo runs at 15 GHz up to 20 GHz bull Conduction cooled bull Two PMC slots bull PCI Express bull 2x GbE

RSC No 33156

ICS-72532-channel 6U CompactPCI DAC board bull 6U CompactPCI data acquisition card bull 32 differential output channels bull 16 or 24-bit sample size bull 288 kHzch data rate bull Simultaneous sampling across all channels on single or multiple boards bull 32 separate delta-sigma DACs bull 64-bit 66 MHz CompactPCI PICMG 20 Rev30 hot-swappable bull FPDP II 400 MBps interface

RSC No 33576

ICS-71032-channel 6U CompactPCI ADC board bull 6U CompactPCI data acquisition card bull 32 differential input channels bull 216 KHzch 24-bit resolution bull Software selectable full scale input bull FPDP II 400 MBpsinterface bull 64-bit 66 MHz CompactPCI PICMG 20 Rev 30 hot swappable bull 32 synchronous boards for simultaneous sampling bull Sonar acoustics and test and measurement applications

RSC No 33578

Tsumani 6U CPCI Development KitFPGA processor solution targeted at high performance software defined radio applications bull Dual Stratix EP1S80 FPGAs are tightly coupled to provide apower platform for signal processing bull Two PMC module sites provide IO connectivity to either front panel or back panel connections bull A direct highbandwidth 1 GBps path from the PMC P4 connector directly to the FPGAs bull Model 919 Dual DAC Mezzanine provides broadband analog signal generationin a compact form bull The board features two independent DAC channels each with its own 12-bit LVDS input capable of running at rates up to 160 MHz

RSC No 32026

CP11Rugged 6U SBC bull Up to 4 GB of DDR2 SDRAM (200 MHz) with enhanced ECC four independent onboard PCI buses system host and peripheral modesupport for the CompactPCI backplane two PMC interfaces (64-bit133 MHz and 32-bit33 MHz) bull Instead of the PMC1 a PCI Express based XMC interface is available on request bull Two GbE one Fast Ethernet two serial interfaces (RS-232 or RS-422485) USB 20 integrated HDD or flash drive bull High performance 2D3D ATI video controller capable of driving two displays in parallel supports VGADVI interface bull Intel Core 2 Duo at 216 GHz Intel Core Duo at 20 GHz2x PMC expansion site bull One XMC optional bull Up to 4 GB DDR2 SDRAM wECC 2x GbE

RSC No 33447

GE Fanuc Intelligent Platforms Incwwwgefanucembeddedcom

Single Board ComputersGD Canada designs and manufactures conduction-cooled Single Board Computers (SBCs)using Intel processors bull 6U and 3U form factors for CompactPCI backplanes bull Fully backward compatible with earlier models bull Upgradeable via the change-out of processor memory andIO modules bull Used within GD Canada computer systems and sold as individual products

RSC No 35281

General Dynamicswwwgdcanadacom

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PrOduCT GuIdE6U CompactPCI

cPCI6U-24DSI32R32-channel 24-bit delta-sigma CompactPCI 6U analog input board with rear IO bull Low noise 24-bit resolution low phase distortion andmulti-board synchronization bull Suits state-of-the-art sonar and noise monitoring applications bull 32-channel cPCI6U-24DSI32 analog input boardprovides a high-density 24-bit analog input resources on a standard 6U CompactPCI expansion board bull Applications from precision voltagemeasurements to complex audio signal and waveform analysis

RSC No 34985

General Standards Corporationwwwgeneralstandardscom

Duet 3U 64-bit 1 GHz TMS320C6416 DSP (x2) 64 MB SDRAM per processor bull Flexible internalexternalcommunication mesh bull 64-bit66 MHz CompactPCI bull PMCXMC site with Jn4 to FPGA and4 RocketIO per VITA 42 bull External data port up to 12 Gbps bull 4M or 5M Virtex-II Pro FPGAbull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM dedicated800 MBps links between DSPs bull 3U CompactPCI with PXI support bull Suits high-end co-processing wireless broadband communications RADAR video and biometrics

RSC No 32856

QuadiaQuad-DSP bull Dual FPGA bull Dual PMC sites bull Inter-processor connectivity and access to external interfaces bull Four C6416 DSPs split in two independent clusters each hosting a PMC site bull One large FPGA for end-user code bull Central FPGA routing interprocessor communication bull End-user FPGA communication bull External port serial IO for PCIe or other p ivate link bull Global memoryand PCI interface bull 1 GHz TMS320C6416 DSP (x4) bull 64 MB SDRAM per processor bull Flexible internalexternal communication mesh bull 64-bit66 MHz CompactPCI bull Two PMC sites with Jn4 to FPGA bull External data port up to 12 Gbps bull Two 4M Gate FPGA reserved for end-user code bull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM bull Up to 512 MB Global DDR SDRAM bull Suits high-end co-processing wireless and broadband communications

RSC No 34737

Quixote 64-bit 6UAdvanced signal capture generation and co-processing bull 1 GHz TMS320C6416 DSP and2 to 6 MGATE Virtex-II FPGA bull 32 MB SDRAM 8 MB ZBT SBSRAM and AD6645 and AD9764 converters bull 6432 bit CompactPCI 66 MHz 5 V33 V and complex trigger modes with HW event logging bull PMC site with Jn4 to FPGA DIO and PICMG 217 StarFabric compliant bull Suits Software Defined Radio wireless IP and RADAR development and hardware testing bull Physical Layer field testing ultra-fast flexible data acquisition vector signal generation and electronic warfare

RSC No 32861

Innovative Integrationwwwinnovative-dspcom

IC-e6-cPCIbHigh performance 6U CompactPCI board bull Powered by one or two of Freescalersquos mostadvanced 14 GHz MPC7448 PowerPC processors bull PICMG 216 compliant bull Marvell Discovery III chipset (MV64460) bull Low power consumption bull Standard extended and rugged grades

RSC No 32982

Interface Conceptwwwinterfaceconceptcom

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PrOduCT GuIdE6U CompactPCI

CP213Single-width 6U CompactPCIPXI module with either 32 or 64 differential analog input channelsbull 32 64 or 128 channels of analog input bull 16 multifunction digital IO (TTL) channels that may beconfigured as digital in digital out or selectively attached to 2 frequency in 2 counter in andor 2 timerout channels bull 16-bit resolution bull Programmable gain per channel programmable scan rates of lt1 Ss through 100 KSs bull Precision onboard reference for end-to-end calibration

RSC No 34804

KineticSystems Company LLCwwwkscorpcom

CP6001Energy efficient embedded Intel dual core processors bull 12 GHz Intel Core Duo U2500 ULV processor bull Intel Core 2 Duo L7400 LV processor bull Based on the Intel Mobile 945GM chipset with a front side bus of up to 667 MHz and ICH7-R Southbridge bull Two independent digital video outputs to the rear IO (2x DVI - 1x DVI and 1x HDMI) bull AC97 audio capabilities bull 3 x GbE bull 4 x SATA with RAID 01510 functionality bull 6 x USB 20 2 x COM and VGA or DVI bull Can also accommodate a PMC slot or an onboard 25 inch SATA HDD bull Up to 8 GB of USB or 2 GB soldered flash bull Supports Linux Windows XP XP embedded and VxWorks 6

RSC No 34182

CP6923 GbE Switch6U CompactPCI GbE Switch PICMG 216 compliant bull Leading edge te hnology basedon BCM5650X chip bull 24x GbE ports bull Non-blocking Layer 2 and 3 switching and routingbull Copper optical rear IO version bull Hot swap IPMI bull Fully managed bull Comprehensive firmware package bull Applies to VoIP installations such as call servers media gatewaysand trunking gateways in wireline and wireless networks as well as VoIP systems inenterprise networks with high demands on performance

RSC No 32256

Kontronwwwkontroncom

TMS320C6701 Virtex-IITexas Instrumentsrsquo C6701 DSP bull Xilinx Virtex-II series FPGA up to XC2V8000 bull Multiple IO interfaces Onboard CODEC VIM expansion sites 60-pin GPIO header and JTAG bull Hardware drivers integration in SimulinkXilinx System Generator Blocksets for quick implementation of Simulink models bull DSP and FPGA-in-the-loop cosimulation of SimulinkXilinx System Generator models bull Leading edge communication interface allowing real-time datamonitoring from Simulink scopes and remote operations

RSC No 32028

VHS-DACHigh performance multichannel DA for phased array antenna systems radarsonar communications receiversup-sampling to IF stage and RFIF AGC apps bull Eight 125 MSPS output channels bull Optional add-on daughter boardprovides 8 additional output channels or 8 additional input channels bull 32-bit 25 MHz bull FPDP interface with 400 MBps transfer rate (25 MSPS per channel at 8 channels 125 MSPS at 16 channels) bull Low level hardware drivers API andGUI bull High level hardware drivers integration in Simulink Blocksets bull Leading edge communication interface fordata recording and playback tofrom the onboard SDRAM

RSC No 32029

Lyrtechwwwlyrtechcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

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PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

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PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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Page 9: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

By Hermann StraSS

GLOBALTECHNOLOGY

CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems

Award recognizes unique ruggedcamera control system

The 2007 Intel Communications Alliance Innovate and Ignite Technology Showcase (ICA) named MEN Micro Inc the ICA Showcase winner on September 19 2007 at the Embedded Systems Conference Boston MEN Micro a

subsidiary of MEN Germany has developed a unique control system for a rugged digital movie camera

Silicon Imaging an innovator in IT-centric digital cinema cameras required a rugged camera control system for its new SI-2K camera The SI-2K (shown in Figure 1 courtesy of Silicon Imaging United States) executes direct-to-disk raw recording at either 1920x1080 pixel high definition or at 2048x1152 pixel for cinema resolutions Its 48-bit digital processing algorithms perform adaptive pixel-by-pixel calibration and color image enhancement The SI-2K fore-goes legacy fixed bit-rate DCT codec recording formats such as DVCPRO HD and HDCAM-SR for advanced wavelet compres-sion technology Current generation HD cameras destructively process and compress their imagery at the acquisition stage The SI-2K streams images as raw digital negatives over a standard GbE connection The Intel Core 2 Duo processor-based F17 system from MEN non-destructively processes the raw digital negatives in real time to the visually perfect CineForm RAW codec which makes capturing up to four hours of continuous footage on a single 160 GB notebook drive possible

MEN Micro developed a customized version of its Intel Core 2 Duo processor based F17 3U CompactPCI SBC a unique side card for advanced audio and video capabilities as well as a rug-ged compact enclosure Already being used at independent film production studios for the making of full-length feature films the digital camera employs technology that can be repackaged for surveillance military sports analytics 3D video and stereo ap-plications The camera can operate in environments ranging from desert to arctic

The F17 SBC from MEN (Germany) controlling the camera in-cludes an Intel Core 2 Duo processor T7600 running at 233 GHz The SI-2K uses MENrsquos SBC for simultaneous encoding of data An Intel Graphics Media Accelerator 950 (Intel GMA 950) per-forms image graphics processing colorization and visualization at full resolution The F17 is equipped with 2 GB fast DDR2 DRAM a hard disk on a removable slot and two Intel GbE PHYs which transfer data from the camera head to the camera control unit and to other standard IP hardware The custom side card enables the connection of a High-Definition Multimedia Interface (HDMI) headphones and balanced analog input and output ports for pro-fessional audio signals

Specified for an extended temperature range in harsh shooting environments the camera uses MEN Microrsquos F17 board equipped

with a massive tailored heat sink accompanied by a fan install-ed inside the camerarsquos housing The F17 is part of MENrsquos powerful family of intercompatible CompactPCI Express SBCs including the newer and more powerful F18 which is completely compatible with the F17 and will also be incorporated into Silicon Imagingrsquos new SI-2K camera

European eventsThe 26th MOTEK International Trade Fair and Exhibition the worldrsquos largest event for assembly handling and automation sup-port systems and devices was held for the first time in the brand- new Neue Messe in Stuttgart Germany from September 26 to September 27 2007 The exhibition space increased by 45 percent over last yearsrsquo event due to the new venue More than 1100 exhibitors from 20 different countries drew around 40000 visitors and filled all five new exhibition halls Mechatronics was speci-fically featured as were robots and automation equipment In 2008 about one million square feet of exhibition space will be available when four more halls are completed at Europersquos most modern fair grounds near the Stuttgart Airport Terminal

EMO 2007 (Hannover) the worldrsquos largest exhibition of metal-working equipment closed its gates on September 22 after six days of exhibition with around 160000 attendees visiting booths of 2100 exhibitors from 42 countries 18 million square feet was devoted to exhibition space The organizers German Association of Machine Tool Manufacturers (VDW) reported new busi-ness contracts at the rate of 4 billion EURO (almost $6 billion) Exhibitors such as TRUMPF Laser Germany (see my April 2007 column (wwwcompactpci-systemscomcolumnsTechnology_in_Europe200704) reported full success at EMO 2007

For more information contact Hermann athstrassopensystems-publishingcom

Figure 1

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By Curt SChwaderer

CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems

SOFTWARE CORNER

In the April 2007 Software Corner column (wwwcompact-pci-systemscomcolumnssoftware_corner200704) we explored surveillance systems and the Communications Assistance for Law Enforcement Act (CALEA) a lawful

surveillance capability mandate Internet access and VoIP pro- viders had to be compliant with CALEA by May 2007 or face severe financial penalties

In this monthrsquos column we will look at what cable companies are doing to provide lawful surveillance capabilities within their networks

The term cable company is now officially a misnomer Cable companies and their networks are capable Internet access and voice service networks that offer the general public a one-stop shop for all their communications and entertainment needs In fact cable companies now typically call themselves Multi-Service Operators (MSOs) Voice and data services form a significant and grow-ing source of revenues for the MSO To that end cable networks become subject to the same rules and regulations that telecommu-nications networks do

One of these regulations is CALEA which provides the ability for network providers to tap specific subscribers when served a warrant To their credit cable companies and their research and development consortium organization CableLabs (cablelabscom) have been very proactive planning for lawful surveillance capa-bilities and CALEA compliance within their networks CableLabs and its partners have been working on a set of PacketCable stan-dards that incorporate specifications for voice and broadband data intercept We will focus on the new Cable Broadband Intercept Specification (CBIS) what it encompasses and paths for imple-mentation within cable networks

Cable Broadband Intercept Specification The set of specifications governing cable network services and capabilities is called the Data-Over-Cable Service Interface Specifications (DOCSIS) The specification that covers lawful

surveillance for data services is CBIS The CBIS reference model is shown in Figure 1

The surveillance architecture consists of three components the Mediation Function (MF) Broadband Intercept Function (BIF) and Collection Function (CF) When a warrant for a subscriber is served the network administrator configures the MF to capture traffic coming to andor from the subscriber This traffic includes any dynamic IP address assignment transactions (called out-of-band traffic) as well as the traffic resulting from e-mail voice or data services being used by the subscriber in question Creating hashes of these files validates the captured traffic as not having been tampered with It is also important for the network provider to supply traffic only for the subscriber the warrant is served on Older methods of surveillance involve dumping all traffic from a particular service area from all users in that area then sifting through that traffic manually This method violates the privacy rights of all the other subscribers in the service area of the individual(s) the warrant is served on Surveillance equipment that can capture only the traffic to or from the subscriber in the warrant is critical to the lawful surveillance aspects of the deployment

So far this is similar to the Alliance for Telecommunications Industry Solutions (ATIS) standards governing voice and data surveillance for digital wire line systems Unlike the original ATIS specifications the CBIS specification includes the BIF The BIF is a buffering component where the Mediation Function pushes the surveillance information (in the form of surveillance files) to the BIF for retrieval by the Collection Function at a later date

The CF component gathers the surveillance information from the BIF under law enforcement control then analyzes and presents the surveillance information in a useful way The CF also validates the information by comparing hashes of the files against hashes generated by the surveillance equipment at the time of capture This ensures that from the time the traffic is captured it is not tampered with

Cable and CALEA A look at cable networks and lawful surveillance

Figure 1

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Buffering is importantThe buffering capability the BIF provides in the CBIS specifi- cation is an important distinction between it and the ATIS specification (for more information on the ATIS specs see the April 2007 Software Corner (wwwcompactpci-systemscom columnssoftware_corner200704)

Buffering is so important that ATIS has approved an additional standard for a Buffering Function (BF) within the ATIS lawful surveillance environment

The importance of buffering is best described in a presentation that Dr Glen Myers CEO of IP Fabrics gave at the December 2007 ISS World conference The real-time delivery that the initial ATIS specification defines can be problematic as Figure 2 shows Packet loss from congestion bit errors or QoS contracts can result in the entire surveillance stream being rendered inadmissible

Dr Myers further explained that ATIS allows their buffering model to be separate from or combined with the MF while the cable network CBIS model assumes the buffering function is always separate from the MF component (Figure 3)

The buffering function whether it be the Buffering Function in the ATIS model or the Broadband Intercept Function in the CBIS model minimizes the impact of packet loss and real-time data delivery The Mediation Function can repeatedly attempt to send surveillance information to the BIF through a secure reliable file transfer function such as secure FTP If there are problems connecting with the BIF alerts can be generated so the network administrator can find and fix the problem while the surveillance information is still resident on the MF system

Dr Myers mentioned other important benefits to providing a buffering function The network administrator does not need to

negotiate and install a dedicated link for each intercept between the MF and the Law Enforcement Agency or agencies (LEA) authorized for the information Dedicated pipes matching the subjectrsquos peak service bandwith are not needed Support for mul-tiple LEAs is easily implemented at the BIF instead of the Mediation Function Law enforcement collection equipment does not need to be co-located with the Mediation Function It also simplifies connectivity by eliminating Virtual Private Networks (VPNs) or other routing ele-ments between the MF and the LEA(s)

CALEA and CMTSIn a cable network the Cable Modem Termination System (CMTS) is typically the central point within which service provider traffic from the access network meets the cable core network (and ulti-mately the Internet) So the CMTS is an important interface point for lawful surveillance

CMTS equipment may provide varying levels of support for lawful surveillance The simplest is to provide access to all the raw traffic flowing through the CMTS using an Ethernet tap or span port In this scenario the Mediation Function must find the traffic belonging to the subscriber under surveillance generate the appro-priate CBIS files and send the files to the BIF

Cisco a leading supplier of CMTS equip-ment to the cable industry provides a capability called Service Independent Intercept (SII) within their CMTS prod-ucts Cisco SII is also used in their routers and intelligent switches for QoS control in addition to lawful surveillance While SII provides support for identifying traffic by MAC and IP address information it does

Figure 2

Figure 3

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not provide the high-level configuration and lawful surveillance messages required of the Mediation Function SII uses low-level SNMP MIBs that control MAC and IP address configuration commands which in turn trigger the Cisco SII device to send packets matching the configuration to a span port where the Mediation Function can use these matched packets to generate the lawful surveillance messages So SII provides a first-level filter for the Mediation Function which supplies a high-level configuration interface at the warrant description level as well as creation of the CBIS (or ATIS) messages to be sent to the BIF

CBIS-compliant productsThe CBIS specification is quite new so released products are mostly on the hori-zon However the IP Fabrics DeepSweep Lawful Surveillance product line does provide MF andor BIF functionality for the implementation of CBIS-compliant networks Dr Myers noted that the DeepSweep product line is based on a flexible architecture and a highly parallel processing environment comprised of many software surveillance modules that can be loaded and chained within the DeepSweep to provide a number of Layer two to seven surveillance and packet analysis activities The device is programmed through a GUI and operates as a full Mediation Function with the ability to identify subscriber-related IP address assignment and resulting traffic from a span port The DeepSweep also has software support to communicate with SII enabled routers and CMTS sys-tems to provide a fully compliant ATIS andor CBIS surveillance environment compatible with Cisco lawful intercept and QoS services

CBIS BIF and ATIS buffering appliances are also available to provide buffering compliant with CBIS and ATIS standards

ConclusionCyber crimes such as identity theft child pornography chat-room initiated abduc-tion national security and piracy are very real and growing issues in todayrsquos society Billions of corporate and personal dollars have been tied to cyber crooks that abuse the Internet to participate in these activities It is essential that these illegal activities can be identified and stopped It is a good idea to be aware that the cable industry and its proactive support of lawful surveillance standards as well as rolling out equipment that implements these standards will in turn enable law enforcement to catch these cyber crooks and make the Internet a safer place for us and our children to live learn and work

For more information on this or any Software Corner contact Curt atcschwadereropensystems-publishingcom

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APPLICATION g

Based on current overall network growth Telecom Equipment

Manufacturers (TEMs) and Network Equipment Providers (NEPs)

are being challenged to launch new communications platforms

that provide optimal scalability flexibility manageability and

high computing performance With the expected increase in new

subscribers who need to be supported across the network TEMs and

NEPs are focusing on COTS platforms that meet the requirements of

a carrier-grade environment

With these new challenges it is important to take a look at the different

applications in the network to thoroughly evaluate the best hardware

platform approach Comparing the scalability IO functionality

interconnectivity and overall performance gives TEMs and NEPs a

solid basis from which to choose the best cost-effective solution for

their applications This article compares the traditional 1U PCI

platform with a more modular AdvancedTCA-based approach to

a Home Subscriber Server (HSS)-based platform

Emerging next-generation network architecture IMS Carriers and service providers are focused on improving their Average Revenue Per User (ARPU) by deploying new services quickly and at a price that is acceptable to subscribers IP Multimedia Subsystems (IMS) enable service providers to offer differentiated services to their subscriber base integrating voice video text and content as part of their service mix regard-less of the access technology

The IMS framework provides the telecom industry with a modular standards-based IP service delivery infrastructure More than simply replacing existing circuit services with similar services delivered over IP IMS allows service providers to capitalize on faster and more cost-effective deployment of new and differentiated multimedia communication services

While these new technologies promise new sources of revenue and enhanced customer loyalty they also pose implemen- tation challenges One of the crucial net-work elements within an IMS framework is the manageability of the subscriber base Today an increasing number of users subscribe to multiple services such

By Sven FreudenFeld

Choose the right formula forcompute-intensive HSS systems

AdvancedTCA platforms

versus1U PCI rack-mount servers

AdvancedTCA

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as multimedia mobile phones VoIP or IPTV at home Service providers must manage ldquoduplicatedrdquo subscriber databases for each particular service Consequently managing a converging subscriber base for such network functions as billing across multiple different technologies presents a tremendous challenge Any downtime of this network element can be costly to the carrier or service provider not to mention the heavy risk of losing subscribers over the long term

The HSS and Home Location Register (HLR) are key elements in the IMS network required to manage the growing number of subscribers These platforms that manage millions of customersrsquo data need to be highly reliable with carrier-grade High Availability (HA) functionality Core requirements for the HSS computing platform are

n High compute density for application processingn Scalable performance and high densityn Fast read access to the subscriber datan Large storage and memory bandwidthn Ability to consolidate multiple IMS elements and subscriber data within a single

platform with a modular approach as a converged services platform

HSS plays network backbone roleHSS provides the important network backbone of the IMS architecture because it eases innovation and addresses a range of service-logic interaction issues that have plagued previous service architectures HSS offers open access to service-related data for each subscriber supporting the sharing of data among multiple services

HSS is essentially the master user database that supports IMS network entities that handle calls and sessions It contains user profiles performs authentication and authorization of the user and can provide information about the physical location of the user It plays a key role in provisioning service creation enabling subscriber data and managing control roaming and interconnection The Application Server (AS) which hosts and executes serv- ices in the IMS environment communicates with the HSS Call State Control Function

(CSCF) servers also communicate with the HSS which must be able to

n Support IMS-level authentication and authorization

n Maintain IMS subscriber profile(s) independent of access types

n Maintain service-specific datan Keep track of currently assigned

CSCFn Support CSCF and AS access

HLRHSS hardware platform design choicesHSS design must enable the HSS to be deployed cost-effectively and expand readily to meet future subscriber levels For example the trend to include more information as part of the data record for each subscriber will drive up memory requirements

From a technical perspective the key metrics to understand when developing the IMS HSS functions are the number of completed transactions required per sec-ond and the size of the subscriber base

HSS architecture typically comprises multiple processor units with extensive memory requirements With the introduction

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of multicore processors from Intel developers can scale performance while optimizing power consumption in the overall system design

To meet these requirements the hardware platform needs to provide scalability flexibil-ity and long-term cost efficiency In comparing the traditional 1U platform with a more modular approach to the HSS using AdvancedTCA consider the following

n High compute performance n High memory and storage capabilityn IO functionality to connect to multiple networks (such as SS7 and Ethernet)n Carrier-grade profile and redundancy

AdvancedTCA High density with scalability on a smaller footprintTable 1 illustrates a comparison of a sample AdvancedTCA-based platform and a 1U PCI rack-mounted platform for HSS applications This configuration assumes an increasing subscriber growth from 1 million (M) subscribers to 18M subscribers per platform

FootprintAdvancedTCA-based platforms provide a high density compute platform with scalability on a smaller footprint TEMs can easily add boards to a chassis to accommodate more traffic and to support new services This flexibility enables an increase in subscribers and the database without having a major impact on rack space in the central office environ-ment To meet the same capacity for 18M subscribers the 1U PCI approach will occupy two bays or cabinets with a total footprint of 28 square feet compared to the same capacity occupying one bay or cabinet with a footprint of 14 square feet (see Figure 1)

CoolingWhile the power consumption per square foot is higher than the 1U PCI platform AdvancedTCA offers better airflow and cooling distribution using a push-pull cooling system Each 1U PCI platform includes up to nine cooling fans and is dedicated to that CPU in the 1U server only which translates into higher overhead Therefore the airflow is

not optimized in the overall system design In the case of a fan failure AdvancedTCA platforms enable easier access to replace the fans which are field replaceable units The 1U platform also does not include any integrated centralized switching or management capabilities therefore the total does not include any switching or system management functionality

ScalabilityAdvancedTCA architecture lends itself well to scalability As AdvancedTCA sup-ports both a Base and Fabric interface into the backplane and the separation of data and control planes TEMs can also scale up their designs from 1 GbE to 10 GbE to accommodate new users and usage requirements AdvancedTCA based systems are designed for easy upgrade-ability to new processing blades switch fabrics and IO modules using Advanced Mezzanine Cards (such as SS7)

Since AdvancedTCA and AdvancedMCs offer hot swap capabilities and HA func-tionality growing a subscriber base by using additional CPU blades within the system with low maintenance or upgrade downtime is crucial for the HSS plat-form It also allows for the up and down

AdvancedTCA-based HSS Platform 1U PCI Rack-Mount HSS Platform

Number ofsubscribers

~1M subscribers = 4 CPU blades edundant ~1M subscribers = 4 x 1U

~4M subscribers = 7 CPU blades redundant ~4M subscribers = 7 x 1U

~6M subscribers = 12 CPU blades redundant ~6M subscribers = 12 x 1U

~18M subscribers = 36 CPU blades redundant= 3 AdvancedTCA shelves per rack

~18M subscribers= 36 x 1U+ external switch components for redundancy

Technicalspecs

1 CPU blade = 2 x Intel Xeon dual core = quad core 1 1U rack-mount Intel= Intel Xeon quad core or dual core CPU

16 G DDR 2 memory Max of 8 G DRY memory

+ 2 x SATA or SASS hot swap (RAID 0 and 1)+ 1x PCI Express for SS7 Dual GbE per 1U rack-mount server

4 x GbE per CPU with built in GbE backplane switching separating Control Pathand Data Path with multishelf expandability

External central switching required withmultiple external GbE connectivity

Systems and blade manageability built into the platform withIMP implementation SNMP and CLIP

Carrier-grade redundancy on switch and node

IO for SS7 or other interface modules

CPU blade hot swap capability

Thermaland power

requirements

~6M subscribers redundant= 14 slots with centralized chassis cooling

~6M subscribers redundant= 18 x 1U PCI with independent cooling and separate switch units and system management

Total power consumption= ok (3100 W for blades and RTM + 500 W Shim fan tray and SAP)

Total power consumption= ok

Table 1

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scaling of the platform depending on the subscriber increase or decrease When consolidating multiple services minimiz-ing multiple duplicate databases requires this flexibility

InterconnectivityThe AdvancedTCA platform offers a number of interconnectivity features including

n Separation between the data plane and the control plane

n Direct uplink in a multichassis envi-ronment with up to l0 GbE

n Node to node base and fabric connec-tivity with HA carrier-grade Ethernet functionality

n Easy upgrade path to l0 GbE for increased bandwidth

By contrast the 1U PCI platform requires

n Additional external interconnectiv-ity between 1U rack-mount servers which increases the number of points of failures and the operating and maintenance costs

n Additional switching equipment for carrier-grade Ethernet connectivity

n Additional manage-ment (Simple Network Management Protocol [SNMP]) for HA redundancy

PowerThe 1U-based platform also utilizes integrated AC power supply units usually the standard for the data center and enter-prise environments AC will increase the pro-viderrsquos OPEX in the long term since the power consumption per rack is significantly higher and

Figure 1

requires additional support equipment such as an Uninterruptible Power Supply (UPS) and an AC to DC converter per rack space and ultimately per CPU These factors along with the requirements for carrier-grade functionality HA support and a more favorable long-term OPEX further reduce the need to consider the 1U solution for HSS deployments in Central Office networks

ManageabilityAdvancedTCA chassis-level management is based on the industry-standard Intelligent Platform Management Interface (IPMI) IPMI makes possible interoperability among chassis and blowers compute nodes switches and management solutions from multiple vendors enabling these elements to work together seamlessly The resulting successful inter-blade communication for applications including failover and clustering provides full manageability on a per shelf and per bay basis

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One of the primary goals of the AdvancedTCA specification is to ensure a very low Mean Time to Repair (MTTR) and high Mean Time Between Failures (MTBF) There are no active components in the backplane ndash which can translate to expensive repairs in the field In addi-tion AdvancedTCA specifies that all com-ponents can be hot swappable in the field and the architecture provides redundancy at all levels This hot swap capability translates to less downtime for field replacement on a per CPU blade basis as compared to 1U PCI

SummaryAdvancedTCA provides an ideal platform and meets the technical requirements for deploying flexible and scalable IMS HSS applications While other platform archi-tectures such as 1U rack-mount servers may with considerable difficulty be able to deliver HSS capabilities AdvancedTCA offers a much more advantageous solution by providing a smaller footprint improved cooling and thermal characteristics bet-ter scalability enhanced interconnectivity and easier manageability This all contrib-utes to making AdvancedTCA a lower cost approach in terms of CAPEX and OPEX for long-term subscriber growth

1U PCI rack-mount servers are not considered to be the optimal hardware platform for HSS applications in a Central Office With its limitation for carrier-grade flexibility and HA functionality the 1U PCI platform is best suited for a full range of other enterprise and Internet infrastructure applications within a data center environment that does not require any significant flexibility and HA functionality around it It might also be a good entrance point for other enterprise applications with lower price points

The use of AdvancedTCA-based platforms enables TEMs to shift away from hardware development and refocus their efforts on delivering value-added software and services As a result they can realize lower development costs and faster time-to-market enabling increased flexibility with each product design through the use and reuse of standardized off-the-shelf components Equally significant are the advantages that can be realized by the service provider With a common platform and a flexible architecture that maximizes limited floor space service providers can rapidly and flexibly implement a broad range of feature-rich solutions for faster profitability

Sven Freudenfeld is responsible for North American Business Development for the Kontron AG line of AdvancedTCA AMC MicroTCA and Pre-Integrated Solutions Sven possesses more than 15 years of experience with voice data and wireless com-munications having worked extensively with Nortel Networks in Systems Engineering Sanmina-SCI in Test Engineeringand Deutsche Telekom in Network Engineering Sven holdsan electrical engineering degree from Germany and is also Chair of the CP-TA marketing workgroup focusing on the interoperability of COTS standard building blocks

Kontron bull svenfreudenfeldcakontroncom bull wwwkontroncom

Fo Sin Pnt

Fo Sin Pnt

TECHNOLOGY g BACkpLANES

Increasing demand for service and multimedia features is stimulating a growing need for speed in telecom-munications equipment While some

applications such as PBX systems can be addressed with the gigabit backplane technologies currently available others are running out of headroom Routers may soon need 10 Gbps and higher speed back-planes to keep up with network demand Many such applications can justify the expense of moving to higher performance if it becomes available

Currently telecom system designs offer backplanes that can handle interconnec-tions running as fast as 3125 Gbps raw data throughput per lane (with around a maxi-mum data rate capability of 5-625 Gbps per lane) The AdvancedTCA standard for instance uses Ethernetrsquos XAUI inter-face AdvancedTCA achieves a 10 Gbps net data rate by running four serial lanes for each interconnection with each lanersquos

SERrializerDESerializer (SERDES) op-erating at 3125 Gbps raw data (25 Gbs net)

As demand forces systems to move beyond these rates however new technologies will be needed One proposal calls for the use of XAUI+ or double XAUI which increases lane SERDES rates to 625 Gbps per lane and hence the throughput to 20 Gbps Another proposal is to use IEEE 8023ap known as 10GBASE-KR which runs a single SERDES lane at 125 Gbps raw data rate (103 Gbps net) But these are only short-term answers To address future demands organizations such as the Institute of Electrical and Electronic Engineers Standards Association (IEEE-SA) are developing specifications for Ethernet speeds of 40 Gbps to 100 Gbps which will be applied to backplane interconnect

Such high clock rates however will pose significant design challenges for developers

One of the first challenges that will need resolution is the design and layout of the backplane and other PCBs Common design practice today readily handles board clock rates of around 10 Gbps Well established design rules are in place and board layout tools such as autorouters can automatically handle board designs for speeds in the 10 Gbps range Designers may use specialized board material create additional ground planes and perform similar tasks in order to ensure proper board operation at the higher end but even speeds to 5 GHz are within current design tool capabilities

Design gets trickierAbove 5 GHz however board design gets more involved because feature dimensions become significant when compared to the signalrsquos wavelengths Variations in board thickness can affect signal propagation Corners where traces change direction and small spurs along edges of poorly etched

Channel characteristics

challenge backplane interoperability

Serial backplanes in telecommunications systems aim for high speed with room for

growth As systems began using 10 Gbps links however issues arose that affected backplane

communications among cards from different manufacturers Stuart points out that the

industry must define key backplane channel characteristics so that designs based on open

standards maintain interoperability as backplane speeds move to 40 Gbps and beyond

By Stuart JamieSon

Fo Sin Pnt

traces can act as antennae for the higher fre-quencies in digital signals As can be seen in Figure 1 sharp corners and minor flaws that are inconsequential at lower frequen-cies have the potential to become trouble-some antennae at future high speeds This can result in the trace radiating away the signalrsquos high frequency energy increasing EMI and crosstalk as well as altering signal waveforms New routing design rules such as making corners 30deg instead of 45deg and more careful board fabrication techniques may become necessary as designs move above the 10 Gbps per lane threshold

The move to higher frequencies will affect more than board fabrication and layout however Higher frequencies will also impose new requirements on signal tim-ing signal rise-time electrical distance and waveform shape if developers are to retain the mix-and-match system design approach that makes standards-based system design effective

For interoperability to be achievable at data rates above 10 Gbps organizations such as PICMG will need to carefully define a vari-ety of signal and design parameters in their specifications Some of the key parameters that will need consideration include

n Interconnect signal attenuationn Eye diagramn Jittern Input clock recoveryn Chip inputoutput pre-emphasis (PE) n Equalization (EQ)

Even slight variations in these parameters from device to device and lane to lane can shift the timing of signals a significant fraction of a clock cycle and affect the Bit Error Rate (BER) of a lanechannel Finally signal rise times will require tight control as signal rates increase in order to ensure control of system timing (see Figure 2)

In defining signal and design parameters specifications will also need to account for the increased location dependency that comes with higher frequencies Even subtle differences in attributes such as routing length and trace impedance become increasingly significant as signal speeds rise To ensure mix-and-match interopera-bility then design specifications may need to account for the specific backplane slot that a board is to occupy as well as introduce a method to obtain and control the PE and EQ of the devices connected to the lanes

Designers must also address fabrication standards The material used to fabricate

Figure 1

Figure 2

Fo Sin Pnt

the board the thickness and composition of metal cladding and the spacing between layers can all affect the trace characteris-tics Controlling these parameters under specification ensures that timing charac-teristics are sufficiently uniform from one board to another However current speci-fications are too detailed and stringent It is extremely difficult to attain compliance yet avoid adding cost to the design

Specifications need workSome of these parameters are already incorporated into current specifications The AMC module specifications from PICMG for instance include design parameters that ensure its proper opera-tion at signal speeds as fast as 125 Gbps per lane Establishing specifications for other system components will help achieve interoperability of standards-based designs at higher frequencies

Design tools may also need to be modified and the industry will need to create new design rules for high frequency and incor-porate these into the tools Developing new routing techniques will help avoid the issues of electrical phenomena such as skin effect dielectric loss and impedance mismatches These are much more preva-lent at higher frequencies and it becomes critical for engineers to model and simu-late these phenomena more accurately

Early efforts are already underway to address the challenges that higher fre-quency signals bring to standards-based design The Interconnect Channel Characterization Subcommittee of PICMG established in September 2006 is develop-ing ground rules and definitions to be used in characterizing transmission reflection and crosstalk performance in backplane and mezzanine carrier interconnects The committee aims to define the channel parameters to be measured or analyzed as well as the methods for doing so Its charter calls for it to address

n Definition of interfaces at which measurements are made or characteristics computed

n Test equipment fixtures and PCB test coupons

n Details of measurement proceduren Data formatsn Techniques for de-embedding

components of the channeln Techniques for validating

measurement based models ie passivity and causality

n Definitions that allow reasonable compliance testing

n Boundary definitions for different paths

n Define information regarding limita-tions or proper usage ie maximum data raterise times that are supported by the models

Such efforts are only a beginning how-ever Other design details still need to be addressed such as SERDES IO Configuration New functionality may need to be defined The design of high data rate system channel interfaces according to standardsspecifications does not currently cover the individual characteristics of the chip transmitterreceiver characteristics Thus work will be needed to address how such standard designs handle such dependency

Crossing an interoperability thresholdOne way of handling location dependen-cies might be to give the system control-ler the ability to inform modules what the channel transmitter and receiver PE and EQ technology is and importantly how to control it With this information along with the signal attenuation suffered (at a given bit rate) for the channel the system should be able to configure SERDES channels in different physical locations to run reliably and at the required BER In MicroTCA systems for instance this functionality could be incorporated into the MicroTCA Carrier Hub (MCH) as part of its electronic keying function Modules would have to be able to configure and control its backplane interfaces to allow for different positions

in the backplane An MCH (see Figure 3 courtesy Emerson) then would be able to instruct a module as to which parameters to use for interoperability

The specific approaches needed to handle location dependencies and other challenges that higher signal rates raise have yet to be developed The need to address these challenges however is clear Increasing demand for services is driving applications to utilize faster signal rates This in turn is driving backplane signaling speeds ever higher As speeds rise above 10 Gbps sig-nals will cross a threshold where current specifications will prove inadequate for ensuring interoperability among standards-based designs

The industry should begin developing new or enhanced specifications and design tools to address the challenges of higher signal rates Without such improvements the guarantees of interoperability that allow system developers to readily create solu-tions by combining off-the-shelf products will be compromised As backplane speeds approach 100 Gbps nothing can be taken for granted

Stuart Jamieson Director of Industry RelationsArchitect with Emerson Network Power Embedded Computing represents Emerson on PICMG committees and the SCOPE organization and previously served as a CP-TA Board member (Treasurer) He brings over 18 years of experience in hardware protocols embedded software and specification development to these groups Within Emerson he played a key role in the develop-ment of the technology central to Emersonrsquos bundled network-ing solutions Stuartrsquos positions within Emerson have included Director of Business Development Director of Advanced Technology and Architect He is the Draft Editor for the PICMG Interconnect Channel Characterization Subcommittee is the author of the introduction section for the new PICMG Ruggedized MicroTCA specification and served as the Draft Editor for the PICMG MicroTCA Specification Stuart gradu-ated from the Heriot-Watt University in 1989 with a 1st Class Honors degree in Electrical and Electronic Engineering and again in 1992 with an IBM-sponsored Master of Philosophy

Emerson Network Power Embedded ComputingStuartJamiesonEmersoncom bull wwwemersonembeddedcomputingcom

Figure 3

Fo Sin Pnt

TECHNOLOGY g BACkpLANES

2008

B A

N D

W I

D T

H

Signal integrity challenges to bandwidth scalabilityFor the purposes of this article each interconnected differential pair will be referred to as a Channel (which should not be confused with an aggregated AdvancedTCA channel comprising four trans-mit and four receive pairs)

14-slot full-mesh AdvancedTCA backplanes contain hundreds of Channels Each Channel is defined as the copper signal path from the output of a driver device to the input of a receiver device As

By douglaS Hynd

Developing IEEE 8023ap 10GBASE-KRcompliant backplanes

Why doesAdvancedTCA

need bandwidthscalability

PICMG AdvancedTCA 30 has emerged as the

industryrsquos Hardware Platform standard of choice and

is enjoying first-phase deployment However many

believe that for AdvancedTCA to realize its market

potential AdvancedTCA platforms need to seamlessly

scale to accommodate 40 GbE fabrics thereby

avoiding forklift upgrades as system bandwidth

demands increase over time A 40 GbE switch fabric

architecture would enable realization of a common

platform for computing storage control and media

and packet processing and provide the versatility and

long term ROI required by service providers in

todayrsquos increasingly competitive environment

The challenge was to develop a family of

AdvancedTCA products which feature PICMG 30

compliant dual star and full mesh advanced

backplane switch fabrics enabled up to 10 Gbps

per differential signal pair thereby giving 40 Gbps

per AdvancedTCA channel performance

This article describes the signal integrity challenges

presented in designing an IEEE 8023ap

10GBASE-KR-compliant bandwidth-scalable

14-slot AdvancedTCA platform and how these

challenges were overcome in development of full

mesh and dual star backplane reference designs

Fo Sin Pnt

shown in Figure 1 that signal path comprises a signal launch a blade PCB transmission line a daughtercard via a right-angled HM-ZD connector a mated HM-ZD backplane header a back-plane via a length of backplane PCB transmission line and then the same combination of connectors vias and transmission line at the receive end of the Channel

Sources of crosstalkFour principal sources of crosstalk in each Channel must be man-aged as shown in Table 2 Source number one is between adjacent differential pairs as they are routed across the backplane Common mode noise rejection in system differential pair structures makes this a minor issue The second source of crosstalk lies in the HM-ZD connector itself

Crosstalk in via fields our third source primarily arises from inductive coupling between adjacent differential pairs and domi-nates the crosstalk agenda in high-speed Channels This source of crosstalk is directly proportional to the length of the via barrel and where practical care must be taken to ensure that adjacent connector rows are terminated to different target routing Layers

The final source of crosstalk is caused by aggressor signals in through-routed via fields coupling with victim Channel traces as they pass through As mentioned earlier judicious and careful design can mitigate this impact

Skew Channel skew is a function of differential transmission path geometries At a fundamental frequency of 5 GHz skew can be a significant issue in high-speed system design due to narrowing the eye opening and increasing jitter Skew can have a significant impact on crosstalk it negatively impacts the common mode rejection of noise inherent to differential signaling Conductor surface roughness in lower performing dielectric materials can also cause skew in high-speed systems

Skew can be avoided through careful management of transmission path lengths in each Channel and by using higher-glass content (lower Dk) laminates

LossPotential

Potential Mismatches

Channel

Loss Potential Channel

PCB Tolerance -025 dB 2 -01 dB

Connector Tolerance -001 dB 4 -016 dB

Thru-routed Via Fields -001 dB 12 -144 dB

Connector Launch -025 dB+ 4 - 2 dB+

Quantity TotalNEXT

TotalFEXT

PCB Transmission Lines

24 in60 cm

-50 dB -70 dB

Connector Architecture 2 -26 dB -24 dB

Via Fields 4 -22 dB -20 dB

Connector Pass Through 8 -34 dB ndash34 dB

For the target application each one of these Channels must deliver a 10 Gbps Non-Return-To-Zero (NRZ) signal with sufficient signal fidelity to enable a receiver device to detect and process a differential signal The PICMG 30 specification is targeted at 3125 Gbps signaling with a fundamental frequency of 156 GHz Even in low loss dielectric materials insertion loss at 10 Gbps (5 GHz fundamental) is twice that of a 3125 Gbps signal

Therefore achieving acceptable signal fidelity requires careful management of signal losses and noise in each Channel such that an acceptable signal-to-noise (SN) ratio is achieved at the receiver

The design process therefore begins by understanding and mitigat-ing the sources of losses and noise in each Channel

Sources of lossThere are three sources of loss

n Conductor losses which are due to skin effects and can be addressed by maximizing the cross sectional area of the signal traces

n Material dispersion losses which are a function of the dielectric constants of the chosen material These can be mitigated by choosing a higher performance laminate material such as Nelco 4000-13SI or Megtron

n Reflected power loss due to impedance mismatches in the Channel as each signal transitions across the different copper media in each channel (connectors vias and PCB traces) and passes through the pad and anti-pad structures of the via fields of other backplane blade slots

Table 1 shows the relative effects of different sources of impedance mismatches The dominant source of impedance mismatches in every Channel resides in the via structures Successful mitigation of this problem requires that every via is tuned by back-drilling the stub and adjusting the pad and anti-pad structures to match the impedance to be 50 ohms irrespective of the target routing layer This in turn requires that the capacitive and inductive effects of the connector pin and via barrel combination are taken into account during the design of each Channel

Further complicating via design is the space the anti-pad structures need to accommodate Channels being routed between other blades while minimizing electro-magnetic coupling with them This space consideration makes the shape and orientation of pads and anti-pads extremely important

Figure 1

Table 1

Table 2

Fo Sin Pnt

IEEE 8023ap provides a design targetAs Ethernet has emerged as the industryrsquos dominant signaling methodology the IEEE has developed the 10GBASE-KR norma-tive Channel model to define interconnect Channel performance for NRZ signaling at 10 Gbps This standard defines acceptable performance in terms of S-parameter charts for through-Channel insertion loss and worst-case crosstalk Figures 2a and 2b illustrate masks for Draft 24 of the standard that was initially used for this exercise

In each case the mask defining compliant performance is shown in blue Channel insertion loss is shown in red in Figure 2a Crosstalk performance is defined by the ICR curve (Figure 2b) Minimum acceptable Channel performance is defined in the ICR chart (Figure 2b) by the blue line The effect of the sum of all aggressors on the through-Channel is shown in red The green ICR curve is the ratio of the crosstalk power sum calculated by summing the

magnitudes of any impacting crosstalk Channels for each fre-quency and using a straight line fit (using least-squares method) to determine the resulting average effect f the aggressors on the through-Channel This is then overlaid on the insertion loss and used to plot the ICR curve

This standard which has evolved through a variety of iterations forms the basis for developing a 40 GbE switch fabric backplane featuring 10 Gbps NRZ differential pairs If all differential pairs can meet this standard then the backplane can be considered to be 10GBASE-KR compliant

Applying 10GBASE-KR to a 14-slotAdvancedTCA applicationThe PICMG specification dictates that receive differential pairs are placed on the c-d and g-h rows of the HM-ZD connector and that transmit differential pairs are placed on the a-b and e-f rows Therefore the middle differential pair in row c-d of Slot B will be subject to the NEXT of three aggressors in each of the a-b and e-f transmit rows of slot B plus the FEXT of the signals being received in the c-d pairs in the top and bottom of slot B

In this topology it can be seen that worst-case crosstalk would occur if all the NEXT and FEXT aggressors were routed on the bottom Layer that is on the same Layer as that of the victim c-d However given that all signal vias must be back-drilled and tuned for impedance management purposes Channel crosstalk can simultaneously be reduced by allocating different routing Layers to differential pairs terminated in the same backplane connector

The principal factor in determining the feasibility of a 10GBASE-KR compliant backplane is based on understanding whether the Channel with the worst-case signal-to-noise ratio is compliant

The skew targets determine permissible layer separation between a-b c-d e-f and g-h pairs within each Channel and enable routing Layers to be allocated for each pair It is now possible to start the process of via tuning to optimize the channel performance for minimum insertion loss Modeling begins by defining the simulation boundaries for the channel so that Channel component models (PCB traces connectors vias) can easily be aggregated to model complete Channels Boundaries must be established at locations in the Channel where linear 3D structures exist These are shown in Figure 3 (next page)

Since the connector and via combinations for the backplane and daughtercard mating halves must each be treated as a whole it

PICMG 30Spec

TurboFabricSpec

Total Inter-PairSkew

(Fabric Interface)

05 mm in FR4(34 ps)

001 mmin N4000-13si

(00625 ps)

Total Intra-Channel Skew

(Fabric Interface)

254 mm in FR4(17 ps)

plusmn01 mmin N4000-13si

(0625ps)

Total Intra-Channel Skew

(Base Interface)

135 mm in FR4(90 ps)

plusmn01 mmin N4000-13si

(0625 ps)

Figures 2a and 2b

Table 3

Determining which Channel that is and identifying the worst-case SN requires making trade-offs with regard to PCB material Channel length via design connector row selection and NEXT and FEXT aggressor routing choices These trade-off choices can only take place using advanced 3D simulation tools such as Ansoft HFSS This was the essence of the design process employed in developing Simclarrsquos TurboFabric backplanes

The simulation processThe transmission length for full mesh and dual star backplanes design implementations varies from a maximum of 1632 inches to a minimum of 116 inches With an effective transmission length of 5 inches on each daughtercard this makes the longest effective Channel 2632 inches including two connectors

For a 10GBASE-KR application over this distance a high-perfor-mance laminate is essential for both reducing insertion loss and

ensuring high glass content in the weave to mitigate skew So the design process began by choosing a low-loss dielectric material (Nelco 4000-13SI for both the backplane and the daugh-tercards) and establishing targets for Inter-Pair and Intra-Channel skew as shown in Table 3

Adhering to the PICMG 30 specifi-cation for skew in a 10GBASE-KR application is impractical Instead a target of 00625 ps was set for Inter-Pair skew with 0625 ps set for Intra-Pair skew for the backplane only This equated to a maximum 001 mm differ-

ence being allowed between traces of any differential pair and 01 mm being permitted between traces of any four differential pairs in a Channel Given the topology of the HM-ZD connector daughter-card skew must be accounted for in the daughtercard layout Fo

Sin Pnt

should be noted that the simulation boundary is located within the mated connector

Tuning the connector and via structures to 50Ω is an iterative process involving the removal of excess pads back-drilling and tuning pads anti-pads and traces A Time Domain Reflectometer (TDR) plot illustrating the results of the tuning process is shown in Figure 4

Upon completion of the modeling process a total of 17 different optimized via and routing configurations had been designed for the full mesh design and nine for the dual star design

A plot of worst-case insertion loss is shown in Figure 5 and demonstrates that in both cases performance is well above the 10GBASE-KR mask

When all the through-Channels have been modeled adjacent Channel models can be combined and ICR curves plotted to evaluate the impact of crosstalk on through-Channel performance This valuable information can be used to adjust the position of signal Layers relative to pass-through aggressor traces on adjacent Layers or to reroute traces to reduce crosstalk Similarly routing Layers can be changed to reduce crosstalk in adjacent via barrels

Figure 6 plots worst-case ICR and demonstrates that performance is above the 10GBASE-KR mask Based on this result it was possible to proceed to physical implementation

Figure 3

Figure 4

Fo Sin Pnt

Physical realizationThe layout process was performed using the Mentor Board-Station CAD system Quad-routing (routing four traces between pads) was explored as a routing method-ology in order to reduce Layer count but this was dismissed due to the detrimental impact on crosstalk performance

The attributes of the physical backplanes produced as a result of the design effort are shown in Table 4

The design files produced included the usual gerber files plus detailed back-drilling instructions

The design validation process comprised a conventional continuity test followed by performance testing featuring Agilent equipment including 70340A signal generator 8720ES Network Analyzer NN18A S-Parameter test-set and 86100A sampling oscilloscope with Agilent 86112A module Figure 7 (next page) shows the test set up

Simclar developed special line cards to enable through-Channel measurements with and without crosstalk The signal launch featured compression mount SMAs terminated in a tuned via structure The Channel simulations included simu-lation of the tuned launch structures so de-embedding of the launches was not necessary for correlation to simulation purposes The development team also established a process for characterization of all Channels

Full Mesh Dual Star

Layer Count 34 18

Aspect Ratio 121 61

Tuned Vias 3952 768

Material Nelco 4000-13SI

Table 4

Figure 5 Figure 6

Fo Sin Pnt

In Figure 8 measured through-Channel performance and ICR curves are shown for the same Channels described in the simula-tion section earlier

As can be seen from Figure 8 there is close correlation between these and the simulated plots in Figures 5 and 6 In fact close correlation between all simulated and measured results was achieved resulting in a 728 Tbps capacity full mesh and a 960 Gbps capacity dual star backplane design now generally available as part of the Simclar TurboFabric shelf

Figure 7 Figure 8

Figure 9

Figure 10

Implications of 10GBASE-KR Draft 33versus Draft 25The work described above was targeted towards meeting the Channels specifications contained in Draft 25 of the IEEE 10GBASE-KR Since this work was completed the IEEE has up-issued the Draft revision level for the Standard from 25 to 33 While this has not impacted through-Channel performance demands it has increased Channel isolation requirements by around 10 dB In Figure 9 a Draft 33 mask is added to the ICR plot shown in Figure 8

From Figure 9 it can be seen how Draft 33 pulls the mask above the Channel ICR curve for this full mesh backplane Channel Surprisingly it is the Channelrsquos frequency response at relatively low frequencies between 100-500 MHz that is causing a problem The reasons for this are currently the subject of further detailed investigation

However Figure 10 shows a Draft 33 plot for a less demanding dual star AdvancedTCA implementation featuring shorter trans-mission distances This plot demonstrates compliance to Draft 33 of the IEEE 8023ap 10GBASE-KR Standard

ConclusionBy developing a close understanding of the many factors contrib-uting to loss and noise in multi-gigabit backplane Channels it is possible to characterize their performance using advanced simula-tion techniques and correlate that performance in physical prod-ucts using advanced test methods By overlaying the test results on S-Parameter masks defined by the IEEE 8023ap 10GBASE-KR Standard it has been demonstrated that backplanes that truly enable AdvancedTCA scalability are at last a reality

Douglas Hynd joined Simclar Group in 2006 as Director of Marketing as part of Simclarrsquos acquisition of Northrop Grumman Interconnect Technologies Division wherehe was Vice President of Marketing and Sales He has more than 24 yearsrsquo experience intechnology sales marketing and generalmanagement and holds a BSc (Eng) in Electronics and Electrical Engineeringfrom the University of Glasgow He isbased at Simclarrsquos Global HQ inDunfermline Scotland

Simclar Groupdouglashyndsimclarcom bull wwwsimclarcom

Fo Sin Pnt

6U CompactPCIPrOduCT GuIdE g

This monthrsquos issue includes a 6U CompactPCI Product Guide and Irsquod like to take the opportunity to reflect a bit on the success and evolution of that technology

Back in the 1994 time frame when CompactPCI was first being devel-oped it began as 3U-only technology It used the same Eurocardmechanics that were popularized by VME and an IEC standardized high-

density high-speed connector available from a number of vendors suitablefor 33 MHz PCI signaling That connector was selected by the engineers atZiatech with help from Mike Munroe then at ERNI The majority of VMEdesigns were 6U and based on this I was among a number of folks thatargued for adding the 6U CompactPCI form factor

The 6U form factor presented some challenges and opportunities Onechallenge was that the insertion and extraction forces were quite high when the entire rear of the card was populated with connectors Fortunately the IEEE standards for Eurocards evolved and injectorejector handles that pro-vided leverage became available Eike Waltz then at Rittal was instrumental in bringing that to the table Two of the opportunities that came along withthe extra connectors were a clean way to add secondary buses like the H110 telephony bus to the backplane and the ability to route IO out the rear through rear transition modules PICMG has developed quite a number of subsidiary specifications defining the interoperable use of the extra backplane pins made possible with the 6U form factor Both of these features have played a major part in CompactPCIrsquos success The next major evolution of 6U CompactPCI came with the PICMG 216 Packet Switched Backplane standard which was originally conceived by John Peters and his team at Performance Technologies PICMG 216 interconnected a shelf full of CompactPCI single board computers via redundant Ethernet switches also in the 6U CompactPCI form factor This dramatically increased usable backplane bandwidth and provided redundancy PICMG 216 paved the way for AdvancedTCA and was the industryrsquos first open standard for the switched serial interconnect standards we see popping up in many places

By Joe Pavlat

Looking back and ahead at6U CompactPCI

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Recent 6U CompactPCI related products are listed here For more informationenter the productrsquos RSC No at wwwcompactpci-systemscomrsc

cPCI-6910Dual-core Intel Xeon Processor LVULV Universal blade bull Supports Single Dual-Core Intel Xeon LV or ULV processorsbull Front Side Bus 667 MHz bull Up to 2 GB DDR2 400 MHz soldered SDRAM with ECC bull Four PCI Express GbEbull Up to 4 USB 20 ports bull PICMG 20 21 29 216 compliant

RSC No 35013

ADLINK Technologywwwadlinktechcom

CPCIStor Module6U CompactPCI storage blade bull Onboard ATA controller supports CDDVD HDD and solid-state flashbull Supports Hot Swap Removal (ask about RAID support) bull ATA disks available in Enhanced Dutycycle versions for NEBS Level 3 - 724 requirements bull Operating Systems supported VxWorksLinux and Windows

RSC No 34800

ACTTechnicowwwacttechnicocom

Prosody X cPCI E1T1An E1T1 digital network access card bull Suits telco developers and systems integrators bull Uses Aculabrsquos worldwide protocol coverage including Aculabrsquos SS7 stack available under a cost free license bull Available with 8 or 16 E1T1 trunks and software selectable E1T1 interfaces bull Flexible mix of protocols including ISDN CAS and SS7 (ITU-T China and ANSI) bull A variety of interconnect switching and protocol conversion solutions can be readily crafted bull High availability reliability and scalability with industry standard hardw re and software interoperability bull Up to 128 SS7 signaling links bull Non-circuit related (TCAP) messagingintensive applications such as prepaid and SMS

RSC No 35408

Aculabwwwaculabcom

Adexp8021Intel Core Duo L2400 (166 GHz) w E7520 server chipset bull Dual channel PC2-3200 Registered RAM SECDED or x4 SDDC bull Two GbE two Serial ATA four USB 20 bull Onboard SXGA graphics 1280 x 24-bitbull 6U CompactPCI Bus PICMG EXP0 R10 Specification bull RoHS compliant 0 degC to +55 degC operating range

RSC No 32837

Advanet Incwwwadvanetcojpen

TC84012 channel single-stop Time-to-Digital Converter (TDC) with single-start and multi-start acquisition modes bull 50 ps timing resolution bull Wide range with upto 20 s between first and last events bull Large internal memory buffer with up to 512 hits per channel bull Low jitter (lt3 ps rms) high stability (plusmn2 ppm) internalclock source bull External 10 MHz reference input bull FPGA based Data Processing Unit (DPU) bull Fast readout with DMA mode for increased data throughputbull Overvoltage-protected inputs with 50 Ω K-Lock (LEMO) connectors bull Built-in self calibration bull Modular single-slot 6U PXICompactPCI standardbull Low power consumption (lt22 W)

RSC No 33445

Agilent-Acqiriswwwacqiriscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

MIC-30428-slot 6U CompactPCI backplane bull AC or DC CompactPCI 500 W + 250 W redundant(2+1) power supplies bull PICMG 216 (CompactPCI Packet Switching Backplane) compliancebull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarmmodule (MIC-3924L-AE)

RSC No 32851

MIC-30436-slot 6U CompactPCI backplane bull Supports two hot-swappable SCSISATA or removableIDE HDD bays bull Built-in IDE slim-type DVD-ROM bull AC or DC CompactPCI 250 W + 250 Wredundant (1+1) power supplies bull Supports hot-swappable fan modules bull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarm module (MIC-3924L-AE)

RSC No 32850

Advantech Corporationwwwadvantechcom

Dual-Core Xeon CompactPCI SBCModel PP 42123x bull Dual CPU 6U CompactPCI SBC supporting two dual-core Xeon CPUs bull Up to 8 GB DDR2 ECC SDRAM in a single system or peripheralslot bull Dual processor SBC in a single 6U CompactPCI slot bull Supports two 166 GHz Dual-Core Intel Xeon ULV processors using Intel E7520 server chipsetbull Up to 8 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull PMCXMC site support 66 MHz PCI-X and x8 PCI Express bull Front and rear IO bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade bull Four GbE ports with option for PICMG 216

RSC No 34761

6U CompactPCI Core 2 Duo SBCModel PP 41203x bull 6U CompactPCI Core 2 Duo SBC supporting two PMC sites includingone XMC site bull Up to 4 GB DDR2 ECC SDRAM bull All in a single system or peripheral slot bull TwoPMC sites supporting up to 100 MHz PCI-X bull One XMC x8 PCI Express bull Front and rear IObull Supports 216 GHz or 15 GHz Intel Core 2 Duo processors bull Intel E7520 server chipsetbull Up to 4 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade

RSC No 34763

PP 30202xTwo processor versions available bull 18 GHz Intel Pentium M processor 745 uses mFC-PGA 478 (micro Flip-Chip Pin Grid Array) package bull 14 GHz Intel Pentium M processor Low Voltage 738uses mFC-BGA 479 (micro Flip-Chip Ball Grid Array) package bull 64 KB primary (L1) on-die cache2 MB of secondary (L2) on-die cache bull 400 MHz Front Side Bus (FSB) bull No CPU fan bull 16 GHz processor version (1 MB L2 cache) available see PP 30002x datasheet bull Utilizes 64-bitIntel 855GME chipset bull Supports 400 MHz bus frequency bull Uses Intel 6300ESB IO Controller Hub

RSC No 32659

Concurrent Technologies Incwwwgocctcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cCIBPMC6U-ETA 6U bridged dual PMC carrier that bridges extended temperature CompactPCI boards and PMCs bull Features a rugged CompactPCI form factor providing increased flexibility to military communications systems designers bull Provides additional design choices to users through its differing bus speeds maximizing the numberof PMCs that can be used CompactPCI andPMC buses can both run at 66 or 33 MHzbull Operating temperature range of -40 degC to+85 degC bull Signal conditioning bull DMA supportbull Low-power design +5 V +33 V +12 V -12 V bull User-selectable VIO of 33 V or 5 V to the PMC

RSC No 32891

Dynamic Engineeringwwwdynengcom

cPCI4IP-MMMinimized PCI address footprint IndustryPack carrier for CompactPCI applications bull 6U 4HP4 IP positions 832 clock selection for each slot fused filtered power IO options bull ID INT IO and Mem spaces are decoded for each IP slotbull Single and double wide IPrsquos bull 16- and 32- bit IPs bull 32-bit access to 16-bit IPs bull Full or mini-mized Memory Space decoding for 18 the PCI address requirement bull With the cPCI4IP-MM option 8 CompactPCI 4IP cards take the same PCI address space as 1 full Mem Space card

RSC No 34905

ACQ132CPCI32 channel MHz class simultaneous sampling intelligent digitizer bull 32 simultaneous analoginput channels 2-32 MSpschannel 14-bit resolution bull Differential inputs bull Intelligent cardwith 1 gigabyte memory and GbE on board bull Large distributed FPGA resource on boardbull Range of DSP functions including FIR filtering and Digital Downconverter

RSC No 35482

D-TACQ Solutions Ltdwwwd-tacqcouk

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CR11Based on the Intel Core Duo Processor the platform is designed to support processor speeds from 106 GHz up to 20 GHz bull Intel Core 2 Duo runs at 15 GHz up to 20 GHz bull Conduction cooled bull Two PMC slots bull PCI Express bull 2x GbE

RSC No 33156

ICS-72532-channel 6U CompactPCI DAC board bull 6U CompactPCI data acquisition card bull 32 differential output channels bull 16 or 24-bit sample size bull 288 kHzch data rate bull Simultaneous sampling across all channels on single or multiple boards bull 32 separate delta-sigma DACs bull 64-bit 66 MHz CompactPCI PICMG 20 Rev30 hot-swappable bull FPDP II 400 MBps interface

RSC No 33576

ICS-71032-channel 6U CompactPCI ADC board bull 6U CompactPCI data acquisition card bull 32 differential input channels bull 216 KHzch 24-bit resolution bull Software selectable full scale input bull FPDP II 400 MBpsinterface bull 64-bit 66 MHz CompactPCI PICMG 20 Rev 30 hot swappable bull 32 synchronous boards for simultaneous sampling bull Sonar acoustics and test and measurement applications

RSC No 33578

Tsumani 6U CPCI Development KitFPGA processor solution targeted at high performance software defined radio applications bull Dual Stratix EP1S80 FPGAs are tightly coupled to provide apower platform for signal processing bull Two PMC module sites provide IO connectivity to either front panel or back panel connections bull A direct highbandwidth 1 GBps path from the PMC P4 connector directly to the FPGAs bull Model 919 Dual DAC Mezzanine provides broadband analog signal generationin a compact form bull The board features two independent DAC channels each with its own 12-bit LVDS input capable of running at rates up to 160 MHz

RSC No 32026

CP11Rugged 6U SBC bull Up to 4 GB of DDR2 SDRAM (200 MHz) with enhanced ECC four independent onboard PCI buses system host and peripheral modesupport for the CompactPCI backplane two PMC interfaces (64-bit133 MHz and 32-bit33 MHz) bull Instead of the PMC1 a PCI Express based XMC interface is available on request bull Two GbE one Fast Ethernet two serial interfaces (RS-232 or RS-422485) USB 20 integrated HDD or flash drive bull High performance 2D3D ATI video controller capable of driving two displays in parallel supports VGADVI interface bull Intel Core 2 Duo at 216 GHz Intel Core Duo at 20 GHz2x PMC expansion site bull One XMC optional bull Up to 4 GB DDR2 SDRAM wECC 2x GbE

RSC No 33447

GE Fanuc Intelligent Platforms Incwwwgefanucembeddedcom

Single Board ComputersGD Canada designs and manufactures conduction-cooled Single Board Computers (SBCs)using Intel processors bull 6U and 3U form factors for CompactPCI backplanes bull Fully backward compatible with earlier models bull Upgradeable via the change-out of processor memory andIO modules bull Used within GD Canada computer systems and sold as individual products

RSC No 35281

General Dynamicswwwgdcanadacom

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PrOduCT GuIdE6U CompactPCI

cPCI6U-24DSI32R32-channel 24-bit delta-sigma CompactPCI 6U analog input board with rear IO bull Low noise 24-bit resolution low phase distortion andmulti-board synchronization bull Suits state-of-the-art sonar and noise monitoring applications bull 32-channel cPCI6U-24DSI32 analog input boardprovides a high-density 24-bit analog input resources on a standard 6U CompactPCI expansion board bull Applications from precision voltagemeasurements to complex audio signal and waveform analysis

RSC No 34985

General Standards Corporationwwwgeneralstandardscom

Duet 3U 64-bit 1 GHz TMS320C6416 DSP (x2) 64 MB SDRAM per processor bull Flexible internalexternalcommunication mesh bull 64-bit66 MHz CompactPCI bull PMCXMC site with Jn4 to FPGA and4 RocketIO per VITA 42 bull External data port up to 12 Gbps bull 4M or 5M Virtex-II Pro FPGAbull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM dedicated800 MBps links between DSPs bull 3U CompactPCI with PXI support bull Suits high-end co-processing wireless broadband communications RADAR video and biometrics

RSC No 32856

QuadiaQuad-DSP bull Dual FPGA bull Dual PMC sites bull Inter-processor connectivity and access to external interfaces bull Four C6416 DSPs split in two independent clusters each hosting a PMC site bull One large FPGA for end-user code bull Central FPGA routing interprocessor communication bull End-user FPGA communication bull External port serial IO for PCIe or other p ivate link bull Global memoryand PCI interface bull 1 GHz TMS320C6416 DSP (x4) bull 64 MB SDRAM per processor bull Flexible internalexternal communication mesh bull 64-bit66 MHz CompactPCI bull Two PMC sites with Jn4 to FPGA bull External data port up to 12 Gbps bull Two 4M Gate FPGA reserved for end-user code bull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM bull Up to 512 MB Global DDR SDRAM bull Suits high-end co-processing wireless and broadband communications

RSC No 34737

Quixote 64-bit 6UAdvanced signal capture generation and co-processing bull 1 GHz TMS320C6416 DSP and2 to 6 MGATE Virtex-II FPGA bull 32 MB SDRAM 8 MB ZBT SBSRAM and AD6645 and AD9764 converters bull 6432 bit CompactPCI 66 MHz 5 V33 V and complex trigger modes with HW event logging bull PMC site with Jn4 to FPGA DIO and PICMG 217 StarFabric compliant bull Suits Software Defined Radio wireless IP and RADAR development and hardware testing bull Physical Layer field testing ultra-fast flexible data acquisition vector signal generation and electronic warfare

RSC No 32861

Innovative Integrationwwwinnovative-dspcom

IC-e6-cPCIbHigh performance 6U CompactPCI board bull Powered by one or two of Freescalersquos mostadvanced 14 GHz MPC7448 PowerPC processors bull PICMG 216 compliant bull Marvell Discovery III chipset (MV64460) bull Low power consumption bull Standard extended and rugged grades

RSC No 32982

Interface Conceptwwwinterfaceconceptcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CP213Single-width 6U CompactPCIPXI module with either 32 or 64 differential analog input channelsbull 32 64 or 128 channels of analog input bull 16 multifunction digital IO (TTL) channels that may beconfigured as digital in digital out or selectively attached to 2 frequency in 2 counter in andor 2 timerout channels bull 16-bit resolution bull Programmable gain per channel programmable scan rates of lt1 Ss through 100 KSs bull Precision onboard reference for end-to-end calibration

RSC No 34804

KineticSystems Company LLCwwwkscorpcom

CP6001Energy efficient embedded Intel dual core processors bull 12 GHz Intel Core Duo U2500 ULV processor bull Intel Core 2 Duo L7400 LV processor bull Based on the Intel Mobile 945GM chipset with a front side bus of up to 667 MHz and ICH7-R Southbridge bull Two independent digital video outputs to the rear IO (2x DVI - 1x DVI and 1x HDMI) bull AC97 audio capabilities bull 3 x GbE bull 4 x SATA with RAID 01510 functionality bull 6 x USB 20 2 x COM and VGA or DVI bull Can also accommodate a PMC slot or an onboard 25 inch SATA HDD bull Up to 8 GB of USB or 2 GB soldered flash bull Supports Linux Windows XP XP embedded and VxWorks 6

RSC No 34182

CP6923 GbE Switch6U CompactPCI GbE Switch PICMG 216 compliant bull Leading edge te hnology basedon BCM5650X chip bull 24x GbE ports bull Non-blocking Layer 2 and 3 switching and routingbull Copper optical rear IO version bull Hot swap IPMI bull Fully managed bull Comprehensive firmware package bull Applies to VoIP installations such as call servers media gatewaysand trunking gateways in wireline and wireless networks as well as VoIP systems inenterprise networks with high demands on performance

RSC No 32256

Kontronwwwkontroncom

TMS320C6701 Virtex-IITexas Instrumentsrsquo C6701 DSP bull Xilinx Virtex-II series FPGA up to XC2V8000 bull Multiple IO interfaces Onboard CODEC VIM expansion sites 60-pin GPIO header and JTAG bull Hardware drivers integration in SimulinkXilinx System Generator Blocksets for quick implementation of Simulink models bull DSP and FPGA-in-the-loop cosimulation of SimulinkXilinx System Generator models bull Leading edge communication interface allowing real-time datamonitoring from Simulink scopes and remote operations

RSC No 32028

VHS-DACHigh performance multichannel DA for phased array antenna systems radarsonar communications receiversup-sampling to IF stage and RFIF AGC apps bull Eight 125 MSPS output channels bull Optional add-on daughter boardprovides 8 additional output channels or 8 additional input channels bull 32-bit 25 MHz bull FPDP interface with 400 MBps transfer rate (25 MSPS per channel at 8 channels 125 MSPS at 16 channels) bull Low level hardware drivers API andGUI bull High level hardware drivers integration in Simulink Blocksets bull Leading edge communication interface fordata recording and playback tofrom the onboard SDRAM

RSC No 32029

Lyrtechwwwlyrtechcom

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PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

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PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

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SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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Page 10: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

By Curt SChwaderer

CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems CompactPCI and AdvancedTCA Systems

SOFTWARE CORNER

In the April 2007 Software Corner column (wwwcompact-pci-systemscomcolumnssoftware_corner200704) we explored surveillance systems and the Communications Assistance for Law Enforcement Act (CALEA) a lawful

surveillance capability mandate Internet access and VoIP pro- viders had to be compliant with CALEA by May 2007 or face severe financial penalties

In this monthrsquos column we will look at what cable companies are doing to provide lawful surveillance capabilities within their networks

The term cable company is now officially a misnomer Cable companies and their networks are capable Internet access and voice service networks that offer the general public a one-stop shop for all their communications and entertainment needs In fact cable companies now typically call themselves Multi-Service Operators (MSOs) Voice and data services form a significant and grow-ing source of revenues for the MSO To that end cable networks become subject to the same rules and regulations that telecommu-nications networks do

One of these regulations is CALEA which provides the ability for network providers to tap specific subscribers when served a warrant To their credit cable companies and their research and development consortium organization CableLabs (cablelabscom) have been very proactive planning for lawful surveillance capa-bilities and CALEA compliance within their networks CableLabs and its partners have been working on a set of PacketCable stan-dards that incorporate specifications for voice and broadband data intercept We will focus on the new Cable Broadband Intercept Specification (CBIS) what it encompasses and paths for imple-mentation within cable networks

Cable Broadband Intercept Specification The set of specifications governing cable network services and capabilities is called the Data-Over-Cable Service Interface Specifications (DOCSIS) The specification that covers lawful

surveillance for data services is CBIS The CBIS reference model is shown in Figure 1

The surveillance architecture consists of three components the Mediation Function (MF) Broadband Intercept Function (BIF) and Collection Function (CF) When a warrant for a subscriber is served the network administrator configures the MF to capture traffic coming to andor from the subscriber This traffic includes any dynamic IP address assignment transactions (called out-of-band traffic) as well as the traffic resulting from e-mail voice or data services being used by the subscriber in question Creating hashes of these files validates the captured traffic as not having been tampered with It is also important for the network provider to supply traffic only for the subscriber the warrant is served on Older methods of surveillance involve dumping all traffic from a particular service area from all users in that area then sifting through that traffic manually This method violates the privacy rights of all the other subscribers in the service area of the individual(s) the warrant is served on Surveillance equipment that can capture only the traffic to or from the subscriber in the warrant is critical to the lawful surveillance aspects of the deployment

So far this is similar to the Alliance for Telecommunications Industry Solutions (ATIS) standards governing voice and data surveillance for digital wire line systems Unlike the original ATIS specifications the CBIS specification includes the BIF The BIF is a buffering component where the Mediation Function pushes the surveillance information (in the form of surveillance files) to the BIF for retrieval by the Collection Function at a later date

The CF component gathers the surveillance information from the BIF under law enforcement control then analyzes and presents the surveillance information in a useful way The CF also validates the information by comparing hashes of the files against hashes generated by the surveillance equipment at the time of capture This ensures that from the time the traffic is captured it is not tampered with

Cable and CALEA A look at cable networks and lawful surveillance

Figure 1

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Buffering is importantThe buffering capability the BIF provides in the CBIS specifi- cation is an important distinction between it and the ATIS specification (for more information on the ATIS specs see the April 2007 Software Corner (wwwcompactpci-systemscom columnssoftware_corner200704)

Buffering is so important that ATIS has approved an additional standard for a Buffering Function (BF) within the ATIS lawful surveillance environment

The importance of buffering is best described in a presentation that Dr Glen Myers CEO of IP Fabrics gave at the December 2007 ISS World conference The real-time delivery that the initial ATIS specification defines can be problematic as Figure 2 shows Packet loss from congestion bit errors or QoS contracts can result in the entire surveillance stream being rendered inadmissible

Dr Myers further explained that ATIS allows their buffering model to be separate from or combined with the MF while the cable network CBIS model assumes the buffering function is always separate from the MF component (Figure 3)

The buffering function whether it be the Buffering Function in the ATIS model or the Broadband Intercept Function in the CBIS model minimizes the impact of packet loss and real-time data delivery The Mediation Function can repeatedly attempt to send surveillance information to the BIF through a secure reliable file transfer function such as secure FTP If there are problems connecting with the BIF alerts can be generated so the network administrator can find and fix the problem while the surveillance information is still resident on the MF system

Dr Myers mentioned other important benefits to providing a buffering function The network administrator does not need to

negotiate and install a dedicated link for each intercept between the MF and the Law Enforcement Agency or agencies (LEA) authorized for the information Dedicated pipes matching the subjectrsquos peak service bandwith are not needed Support for mul-tiple LEAs is easily implemented at the BIF instead of the Mediation Function Law enforcement collection equipment does not need to be co-located with the Mediation Function It also simplifies connectivity by eliminating Virtual Private Networks (VPNs) or other routing ele-ments between the MF and the LEA(s)

CALEA and CMTSIn a cable network the Cable Modem Termination System (CMTS) is typically the central point within which service provider traffic from the access network meets the cable core network (and ulti-mately the Internet) So the CMTS is an important interface point for lawful surveillance

CMTS equipment may provide varying levels of support for lawful surveillance The simplest is to provide access to all the raw traffic flowing through the CMTS using an Ethernet tap or span port In this scenario the Mediation Function must find the traffic belonging to the subscriber under surveillance generate the appro-priate CBIS files and send the files to the BIF

Cisco a leading supplier of CMTS equip-ment to the cable industry provides a capability called Service Independent Intercept (SII) within their CMTS prod-ucts Cisco SII is also used in their routers and intelligent switches for QoS control in addition to lawful surveillance While SII provides support for identifying traffic by MAC and IP address information it does

Figure 2

Figure 3

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not provide the high-level configuration and lawful surveillance messages required of the Mediation Function SII uses low-level SNMP MIBs that control MAC and IP address configuration commands which in turn trigger the Cisco SII device to send packets matching the configuration to a span port where the Mediation Function can use these matched packets to generate the lawful surveillance messages So SII provides a first-level filter for the Mediation Function which supplies a high-level configuration interface at the warrant description level as well as creation of the CBIS (or ATIS) messages to be sent to the BIF

CBIS-compliant productsThe CBIS specification is quite new so released products are mostly on the hori-zon However the IP Fabrics DeepSweep Lawful Surveillance product line does provide MF andor BIF functionality for the implementation of CBIS-compliant networks Dr Myers noted that the DeepSweep product line is based on a flexible architecture and a highly parallel processing environment comprised of many software surveillance modules that can be loaded and chained within the DeepSweep to provide a number of Layer two to seven surveillance and packet analysis activities The device is programmed through a GUI and operates as a full Mediation Function with the ability to identify subscriber-related IP address assignment and resulting traffic from a span port The DeepSweep also has software support to communicate with SII enabled routers and CMTS sys-tems to provide a fully compliant ATIS andor CBIS surveillance environment compatible with Cisco lawful intercept and QoS services

CBIS BIF and ATIS buffering appliances are also available to provide buffering compliant with CBIS and ATIS standards

ConclusionCyber crimes such as identity theft child pornography chat-room initiated abduc-tion national security and piracy are very real and growing issues in todayrsquos society Billions of corporate and personal dollars have been tied to cyber crooks that abuse the Internet to participate in these activities It is essential that these illegal activities can be identified and stopped It is a good idea to be aware that the cable industry and its proactive support of lawful surveillance standards as well as rolling out equipment that implements these standards will in turn enable law enforcement to catch these cyber crooks and make the Internet a safer place for us and our children to live learn and work

For more information on this or any Software Corner contact Curt atcschwadereropensystems-publishingcom

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APPLICATION g

Based on current overall network growth Telecom Equipment

Manufacturers (TEMs) and Network Equipment Providers (NEPs)

are being challenged to launch new communications platforms

that provide optimal scalability flexibility manageability and

high computing performance With the expected increase in new

subscribers who need to be supported across the network TEMs and

NEPs are focusing on COTS platforms that meet the requirements of

a carrier-grade environment

With these new challenges it is important to take a look at the different

applications in the network to thoroughly evaluate the best hardware

platform approach Comparing the scalability IO functionality

interconnectivity and overall performance gives TEMs and NEPs a

solid basis from which to choose the best cost-effective solution for

their applications This article compares the traditional 1U PCI

platform with a more modular AdvancedTCA-based approach to

a Home Subscriber Server (HSS)-based platform

Emerging next-generation network architecture IMS Carriers and service providers are focused on improving their Average Revenue Per User (ARPU) by deploying new services quickly and at a price that is acceptable to subscribers IP Multimedia Subsystems (IMS) enable service providers to offer differentiated services to their subscriber base integrating voice video text and content as part of their service mix regard-less of the access technology

The IMS framework provides the telecom industry with a modular standards-based IP service delivery infrastructure More than simply replacing existing circuit services with similar services delivered over IP IMS allows service providers to capitalize on faster and more cost-effective deployment of new and differentiated multimedia communication services

While these new technologies promise new sources of revenue and enhanced customer loyalty they also pose implemen- tation challenges One of the crucial net-work elements within an IMS framework is the manageability of the subscriber base Today an increasing number of users subscribe to multiple services such

By Sven FreudenFeld

Choose the right formula forcompute-intensive HSS systems

AdvancedTCA platforms

versus1U PCI rack-mount servers

AdvancedTCA

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as multimedia mobile phones VoIP or IPTV at home Service providers must manage ldquoduplicatedrdquo subscriber databases for each particular service Consequently managing a converging subscriber base for such network functions as billing across multiple different technologies presents a tremendous challenge Any downtime of this network element can be costly to the carrier or service provider not to mention the heavy risk of losing subscribers over the long term

The HSS and Home Location Register (HLR) are key elements in the IMS network required to manage the growing number of subscribers These platforms that manage millions of customersrsquo data need to be highly reliable with carrier-grade High Availability (HA) functionality Core requirements for the HSS computing platform are

n High compute density for application processingn Scalable performance and high densityn Fast read access to the subscriber datan Large storage and memory bandwidthn Ability to consolidate multiple IMS elements and subscriber data within a single

platform with a modular approach as a converged services platform

HSS plays network backbone roleHSS provides the important network backbone of the IMS architecture because it eases innovation and addresses a range of service-logic interaction issues that have plagued previous service architectures HSS offers open access to service-related data for each subscriber supporting the sharing of data among multiple services

HSS is essentially the master user database that supports IMS network entities that handle calls and sessions It contains user profiles performs authentication and authorization of the user and can provide information about the physical location of the user It plays a key role in provisioning service creation enabling subscriber data and managing control roaming and interconnection The Application Server (AS) which hosts and executes serv- ices in the IMS environment communicates with the HSS Call State Control Function

(CSCF) servers also communicate with the HSS which must be able to

n Support IMS-level authentication and authorization

n Maintain IMS subscriber profile(s) independent of access types

n Maintain service-specific datan Keep track of currently assigned

CSCFn Support CSCF and AS access

HLRHSS hardware platform design choicesHSS design must enable the HSS to be deployed cost-effectively and expand readily to meet future subscriber levels For example the trend to include more information as part of the data record for each subscriber will drive up memory requirements

From a technical perspective the key metrics to understand when developing the IMS HSS functions are the number of completed transactions required per sec-ond and the size of the subscriber base

HSS architecture typically comprises multiple processor units with extensive memory requirements With the introduction

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of multicore processors from Intel developers can scale performance while optimizing power consumption in the overall system design

To meet these requirements the hardware platform needs to provide scalability flexibil-ity and long-term cost efficiency In comparing the traditional 1U platform with a more modular approach to the HSS using AdvancedTCA consider the following

n High compute performance n High memory and storage capabilityn IO functionality to connect to multiple networks (such as SS7 and Ethernet)n Carrier-grade profile and redundancy

AdvancedTCA High density with scalability on a smaller footprintTable 1 illustrates a comparison of a sample AdvancedTCA-based platform and a 1U PCI rack-mounted platform for HSS applications This configuration assumes an increasing subscriber growth from 1 million (M) subscribers to 18M subscribers per platform

FootprintAdvancedTCA-based platforms provide a high density compute platform with scalability on a smaller footprint TEMs can easily add boards to a chassis to accommodate more traffic and to support new services This flexibility enables an increase in subscribers and the database without having a major impact on rack space in the central office environ-ment To meet the same capacity for 18M subscribers the 1U PCI approach will occupy two bays or cabinets with a total footprint of 28 square feet compared to the same capacity occupying one bay or cabinet with a footprint of 14 square feet (see Figure 1)

CoolingWhile the power consumption per square foot is higher than the 1U PCI platform AdvancedTCA offers better airflow and cooling distribution using a push-pull cooling system Each 1U PCI platform includes up to nine cooling fans and is dedicated to that CPU in the 1U server only which translates into higher overhead Therefore the airflow is

not optimized in the overall system design In the case of a fan failure AdvancedTCA platforms enable easier access to replace the fans which are field replaceable units The 1U platform also does not include any integrated centralized switching or management capabilities therefore the total does not include any switching or system management functionality

ScalabilityAdvancedTCA architecture lends itself well to scalability As AdvancedTCA sup-ports both a Base and Fabric interface into the backplane and the separation of data and control planes TEMs can also scale up their designs from 1 GbE to 10 GbE to accommodate new users and usage requirements AdvancedTCA based systems are designed for easy upgrade-ability to new processing blades switch fabrics and IO modules using Advanced Mezzanine Cards (such as SS7)

Since AdvancedTCA and AdvancedMCs offer hot swap capabilities and HA func-tionality growing a subscriber base by using additional CPU blades within the system with low maintenance or upgrade downtime is crucial for the HSS plat-form It also allows for the up and down

AdvancedTCA-based HSS Platform 1U PCI Rack-Mount HSS Platform

Number ofsubscribers

~1M subscribers = 4 CPU blades edundant ~1M subscribers = 4 x 1U

~4M subscribers = 7 CPU blades redundant ~4M subscribers = 7 x 1U

~6M subscribers = 12 CPU blades redundant ~6M subscribers = 12 x 1U

~18M subscribers = 36 CPU blades redundant= 3 AdvancedTCA shelves per rack

~18M subscribers= 36 x 1U+ external switch components for redundancy

Technicalspecs

1 CPU blade = 2 x Intel Xeon dual core = quad core 1 1U rack-mount Intel= Intel Xeon quad core or dual core CPU

16 G DDR 2 memory Max of 8 G DRY memory

+ 2 x SATA or SASS hot swap (RAID 0 and 1)+ 1x PCI Express for SS7 Dual GbE per 1U rack-mount server

4 x GbE per CPU with built in GbE backplane switching separating Control Pathand Data Path with multishelf expandability

External central switching required withmultiple external GbE connectivity

Systems and blade manageability built into the platform withIMP implementation SNMP and CLIP

Carrier-grade redundancy on switch and node

IO for SS7 or other interface modules

CPU blade hot swap capability

Thermaland power

requirements

~6M subscribers redundant= 14 slots with centralized chassis cooling

~6M subscribers redundant= 18 x 1U PCI with independent cooling and separate switch units and system management

Total power consumption= ok (3100 W for blades and RTM + 500 W Shim fan tray and SAP)

Total power consumption= ok

Table 1

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scaling of the platform depending on the subscriber increase or decrease When consolidating multiple services minimiz-ing multiple duplicate databases requires this flexibility

InterconnectivityThe AdvancedTCA platform offers a number of interconnectivity features including

n Separation between the data plane and the control plane

n Direct uplink in a multichassis envi-ronment with up to l0 GbE

n Node to node base and fabric connec-tivity with HA carrier-grade Ethernet functionality

n Easy upgrade path to l0 GbE for increased bandwidth

By contrast the 1U PCI platform requires

n Additional external interconnectiv-ity between 1U rack-mount servers which increases the number of points of failures and the operating and maintenance costs

n Additional switching equipment for carrier-grade Ethernet connectivity

n Additional manage-ment (Simple Network Management Protocol [SNMP]) for HA redundancy

PowerThe 1U-based platform also utilizes integrated AC power supply units usually the standard for the data center and enter-prise environments AC will increase the pro-viderrsquos OPEX in the long term since the power consumption per rack is significantly higher and

Figure 1

requires additional support equipment such as an Uninterruptible Power Supply (UPS) and an AC to DC converter per rack space and ultimately per CPU These factors along with the requirements for carrier-grade functionality HA support and a more favorable long-term OPEX further reduce the need to consider the 1U solution for HSS deployments in Central Office networks

ManageabilityAdvancedTCA chassis-level management is based on the industry-standard Intelligent Platform Management Interface (IPMI) IPMI makes possible interoperability among chassis and blowers compute nodes switches and management solutions from multiple vendors enabling these elements to work together seamlessly The resulting successful inter-blade communication for applications including failover and clustering provides full manageability on a per shelf and per bay basis

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One of the primary goals of the AdvancedTCA specification is to ensure a very low Mean Time to Repair (MTTR) and high Mean Time Between Failures (MTBF) There are no active components in the backplane ndash which can translate to expensive repairs in the field In addi-tion AdvancedTCA specifies that all com-ponents can be hot swappable in the field and the architecture provides redundancy at all levels This hot swap capability translates to less downtime for field replacement on a per CPU blade basis as compared to 1U PCI

SummaryAdvancedTCA provides an ideal platform and meets the technical requirements for deploying flexible and scalable IMS HSS applications While other platform archi-tectures such as 1U rack-mount servers may with considerable difficulty be able to deliver HSS capabilities AdvancedTCA offers a much more advantageous solution by providing a smaller footprint improved cooling and thermal characteristics bet-ter scalability enhanced interconnectivity and easier manageability This all contrib-utes to making AdvancedTCA a lower cost approach in terms of CAPEX and OPEX for long-term subscriber growth

1U PCI rack-mount servers are not considered to be the optimal hardware platform for HSS applications in a Central Office With its limitation for carrier-grade flexibility and HA functionality the 1U PCI platform is best suited for a full range of other enterprise and Internet infrastructure applications within a data center environment that does not require any significant flexibility and HA functionality around it It might also be a good entrance point for other enterprise applications with lower price points

The use of AdvancedTCA-based platforms enables TEMs to shift away from hardware development and refocus their efforts on delivering value-added software and services As a result they can realize lower development costs and faster time-to-market enabling increased flexibility with each product design through the use and reuse of standardized off-the-shelf components Equally significant are the advantages that can be realized by the service provider With a common platform and a flexible architecture that maximizes limited floor space service providers can rapidly and flexibly implement a broad range of feature-rich solutions for faster profitability

Sven Freudenfeld is responsible for North American Business Development for the Kontron AG line of AdvancedTCA AMC MicroTCA and Pre-Integrated Solutions Sven possesses more than 15 years of experience with voice data and wireless com-munications having worked extensively with Nortel Networks in Systems Engineering Sanmina-SCI in Test Engineeringand Deutsche Telekom in Network Engineering Sven holdsan electrical engineering degree from Germany and is also Chair of the CP-TA marketing workgroup focusing on the interoperability of COTS standard building blocks

Kontron bull svenfreudenfeldcakontroncom bull wwwkontroncom

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TECHNOLOGY g BACkpLANES

Increasing demand for service and multimedia features is stimulating a growing need for speed in telecom-munications equipment While some

applications such as PBX systems can be addressed with the gigabit backplane technologies currently available others are running out of headroom Routers may soon need 10 Gbps and higher speed back-planes to keep up with network demand Many such applications can justify the expense of moving to higher performance if it becomes available

Currently telecom system designs offer backplanes that can handle interconnec-tions running as fast as 3125 Gbps raw data throughput per lane (with around a maxi-mum data rate capability of 5-625 Gbps per lane) The AdvancedTCA standard for instance uses Ethernetrsquos XAUI inter-face AdvancedTCA achieves a 10 Gbps net data rate by running four serial lanes for each interconnection with each lanersquos

SERrializerDESerializer (SERDES) op-erating at 3125 Gbps raw data (25 Gbs net)

As demand forces systems to move beyond these rates however new technologies will be needed One proposal calls for the use of XAUI+ or double XAUI which increases lane SERDES rates to 625 Gbps per lane and hence the throughput to 20 Gbps Another proposal is to use IEEE 8023ap known as 10GBASE-KR which runs a single SERDES lane at 125 Gbps raw data rate (103 Gbps net) But these are only short-term answers To address future demands organizations such as the Institute of Electrical and Electronic Engineers Standards Association (IEEE-SA) are developing specifications for Ethernet speeds of 40 Gbps to 100 Gbps which will be applied to backplane interconnect

Such high clock rates however will pose significant design challenges for developers

One of the first challenges that will need resolution is the design and layout of the backplane and other PCBs Common design practice today readily handles board clock rates of around 10 Gbps Well established design rules are in place and board layout tools such as autorouters can automatically handle board designs for speeds in the 10 Gbps range Designers may use specialized board material create additional ground planes and perform similar tasks in order to ensure proper board operation at the higher end but even speeds to 5 GHz are within current design tool capabilities

Design gets trickierAbove 5 GHz however board design gets more involved because feature dimensions become significant when compared to the signalrsquos wavelengths Variations in board thickness can affect signal propagation Corners where traces change direction and small spurs along edges of poorly etched

Channel characteristics

challenge backplane interoperability

Serial backplanes in telecommunications systems aim for high speed with room for

growth As systems began using 10 Gbps links however issues arose that affected backplane

communications among cards from different manufacturers Stuart points out that the

industry must define key backplane channel characteristics so that designs based on open

standards maintain interoperability as backplane speeds move to 40 Gbps and beyond

By Stuart JamieSon

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traces can act as antennae for the higher fre-quencies in digital signals As can be seen in Figure 1 sharp corners and minor flaws that are inconsequential at lower frequen-cies have the potential to become trouble-some antennae at future high speeds This can result in the trace radiating away the signalrsquos high frequency energy increasing EMI and crosstalk as well as altering signal waveforms New routing design rules such as making corners 30deg instead of 45deg and more careful board fabrication techniques may become necessary as designs move above the 10 Gbps per lane threshold

The move to higher frequencies will affect more than board fabrication and layout however Higher frequencies will also impose new requirements on signal tim-ing signal rise-time electrical distance and waveform shape if developers are to retain the mix-and-match system design approach that makes standards-based system design effective

For interoperability to be achievable at data rates above 10 Gbps organizations such as PICMG will need to carefully define a vari-ety of signal and design parameters in their specifications Some of the key parameters that will need consideration include

n Interconnect signal attenuationn Eye diagramn Jittern Input clock recoveryn Chip inputoutput pre-emphasis (PE) n Equalization (EQ)

Even slight variations in these parameters from device to device and lane to lane can shift the timing of signals a significant fraction of a clock cycle and affect the Bit Error Rate (BER) of a lanechannel Finally signal rise times will require tight control as signal rates increase in order to ensure control of system timing (see Figure 2)

In defining signal and design parameters specifications will also need to account for the increased location dependency that comes with higher frequencies Even subtle differences in attributes such as routing length and trace impedance become increasingly significant as signal speeds rise To ensure mix-and-match interopera-bility then design specifications may need to account for the specific backplane slot that a board is to occupy as well as introduce a method to obtain and control the PE and EQ of the devices connected to the lanes

Designers must also address fabrication standards The material used to fabricate

Figure 1

Figure 2

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the board the thickness and composition of metal cladding and the spacing between layers can all affect the trace characteris-tics Controlling these parameters under specification ensures that timing charac-teristics are sufficiently uniform from one board to another However current speci-fications are too detailed and stringent It is extremely difficult to attain compliance yet avoid adding cost to the design

Specifications need workSome of these parameters are already incorporated into current specifications The AMC module specifications from PICMG for instance include design parameters that ensure its proper opera-tion at signal speeds as fast as 125 Gbps per lane Establishing specifications for other system components will help achieve interoperability of standards-based designs at higher frequencies

Design tools may also need to be modified and the industry will need to create new design rules for high frequency and incor-porate these into the tools Developing new routing techniques will help avoid the issues of electrical phenomena such as skin effect dielectric loss and impedance mismatches These are much more preva-lent at higher frequencies and it becomes critical for engineers to model and simu-late these phenomena more accurately

Early efforts are already underway to address the challenges that higher fre-quency signals bring to standards-based design The Interconnect Channel Characterization Subcommittee of PICMG established in September 2006 is develop-ing ground rules and definitions to be used in characterizing transmission reflection and crosstalk performance in backplane and mezzanine carrier interconnects The committee aims to define the channel parameters to be measured or analyzed as well as the methods for doing so Its charter calls for it to address

n Definition of interfaces at which measurements are made or characteristics computed

n Test equipment fixtures and PCB test coupons

n Details of measurement proceduren Data formatsn Techniques for de-embedding

components of the channeln Techniques for validating

measurement based models ie passivity and causality

n Definitions that allow reasonable compliance testing

n Boundary definitions for different paths

n Define information regarding limita-tions or proper usage ie maximum data raterise times that are supported by the models

Such efforts are only a beginning how-ever Other design details still need to be addressed such as SERDES IO Configuration New functionality may need to be defined The design of high data rate system channel interfaces according to standardsspecifications does not currently cover the individual characteristics of the chip transmitterreceiver characteristics Thus work will be needed to address how such standard designs handle such dependency

Crossing an interoperability thresholdOne way of handling location dependen-cies might be to give the system control-ler the ability to inform modules what the channel transmitter and receiver PE and EQ technology is and importantly how to control it With this information along with the signal attenuation suffered (at a given bit rate) for the channel the system should be able to configure SERDES channels in different physical locations to run reliably and at the required BER In MicroTCA systems for instance this functionality could be incorporated into the MicroTCA Carrier Hub (MCH) as part of its electronic keying function Modules would have to be able to configure and control its backplane interfaces to allow for different positions

in the backplane An MCH (see Figure 3 courtesy Emerson) then would be able to instruct a module as to which parameters to use for interoperability

The specific approaches needed to handle location dependencies and other challenges that higher signal rates raise have yet to be developed The need to address these challenges however is clear Increasing demand for services is driving applications to utilize faster signal rates This in turn is driving backplane signaling speeds ever higher As speeds rise above 10 Gbps sig-nals will cross a threshold where current specifications will prove inadequate for ensuring interoperability among standards-based designs

The industry should begin developing new or enhanced specifications and design tools to address the challenges of higher signal rates Without such improvements the guarantees of interoperability that allow system developers to readily create solu-tions by combining off-the-shelf products will be compromised As backplane speeds approach 100 Gbps nothing can be taken for granted

Stuart Jamieson Director of Industry RelationsArchitect with Emerson Network Power Embedded Computing represents Emerson on PICMG committees and the SCOPE organization and previously served as a CP-TA Board member (Treasurer) He brings over 18 years of experience in hardware protocols embedded software and specification development to these groups Within Emerson he played a key role in the develop-ment of the technology central to Emersonrsquos bundled network-ing solutions Stuartrsquos positions within Emerson have included Director of Business Development Director of Advanced Technology and Architect He is the Draft Editor for the PICMG Interconnect Channel Characterization Subcommittee is the author of the introduction section for the new PICMG Ruggedized MicroTCA specification and served as the Draft Editor for the PICMG MicroTCA Specification Stuart gradu-ated from the Heriot-Watt University in 1989 with a 1st Class Honors degree in Electrical and Electronic Engineering and again in 1992 with an IBM-sponsored Master of Philosophy

Emerson Network Power Embedded ComputingStuartJamiesonEmersoncom bull wwwemersonembeddedcomputingcom

Figure 3

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TECHNOLOGY g BACkpLANES

2008

B A

N D

W I

D T

H

Signal integrity challenges to bandwidth scalabilityFor the purposes of this article each interconnected differential pair will be referred to as a Channel (which should not be confused with an aggregated AdvancedTCA channel comprising four trans-mit and four receive pairs)

14-slot full-mesh AdvancedTCA backplanes contain hundreds of Channels Each Channel is defined as the copper signal path from the output of a driver device to the input of a receiver device As

By douglaS Hynd

Developing IEEE 8023ap 10GBASE-KRcompliant backplanes

Why doesAdvancedTCA

need bandwidthscalability

PICMG AdvancedTCA 30 has emerged as the

industryrsquos Hardware Platform standard of choice and

is enjoying first-phase deployment However many

believe that for AdvancedTCA to realize its market

potential AdvancedTCA platforms need to seamlessly

scale to accommodate 40 GbE fabrics thereby

avoiding forklift upgrades as system bandwidth

demands increase over time A 40 GbE switch fabric

architecture would enable realization of a common

platform for computing storage control and media

and packet processing and provide the versatility and

long term ROI required by service providers in

todayrsquos increasingly competitive environment

The challenge was to develop a family of

AdvancedTCA products which feature PICMG 30

compliant dual star and full mesh advanced

backplane switch fabrics enabled up to 10 Gbps

per differential signal pair thereby giving 40 Gbps

per AdvancedTCA channel performance

This article describes the signal integrity challenges

presented in designing an IEEE 8023ap

10GBASE-KR-compliant bandwidth-scalable

14-slot AdvancedTCA platform and how these

challenges were overcome in development of full

mesh and dual star backplane reference designs

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shown in Figure 1 that signal path comprises a signal launch a blade PCB transmission line a daughtercard via a right-angled HM-ZD connector a mated HM-ZD backplane header a back-plane via a length of backplane PCB transmission line and then the same combination of connectors vias and transmission line at the receive end of the Channel

Sources of crosstalkFour principal sources of crosstalk in each Channel must be man-aged as shown in Table 2 Source number one is between adjacent differential pairs as they are routed across the backplane Common mode noise rejection in system differential pair structures makes this a minor issue The second source of crosstalk lies in the HM-ZD connector itself

Crosstalk in via fields our third source primarily arises from inductive coupling between adjacent differential pairs and domi-nates the crosstalk agenda in high-speed Channels This source of crosstalk is directly proportional to the length of the via barrel and where practical care must be taken to ensure that adjacent connector rows are terminated to different target routing Layers

The final source of crosstalk is caused by aggressor signals in through-routed via fields coupling with victim Channel traces as they pass through As mentioned earlier judicious and careful design can mitigate this impact

Skew Channel skew is a function of differential transmission path geometries At a fundamental frequency of 5 GHz skew can be a significant issue in high-speed system design due to narrowing the eye opening and increasing jitter Skew can have a significant impact on crosstalk it negatively impacts the common mode rejection of noise inherent to differential signaling Conductor surface roughness in lower performing dielectric materials can also cause skew in high-speed systems

Skew can be avoided through careful management of transmission path lengths in each Channel and by using higher-glass content (lower Dk) laminates

LossPotential

Potential Mismatches

Channel

Loss Potential Channel

PCB Tolerance -025 dB 2 -01 dB

Connector Tolerance -001 dB 4 -016 dB

Thru-routed Via Fields -001 dB 12 -144 dB

Connector Launch -025 dB+ 4 - 2 dB+

Quantity TotalNEXT

TotalFEXT

PCB Transmission Lines

24 in60 cm

-50 dB -70 dB

Connector Architecture 2 -26 dB -24 dB

Via Fields 4 -22 dB -20 dB

Connector Pass Through 8 -34 dB ndash34 dB

For the target application each one of these Channels must deliver a 10 Gbps Non-Return-To-Zero (NRZ) signal with sufficient signal fidelity to enable a receiver device to detect and process a differential signal The PICMG 30 specification is targeted at 3125 Gbps signaling with a fundamental frequency of 156 GHz Even in low loss dielectric materials insertion loss at 10 Gbps (5 GHz fundamental) is twice that of a 3125 Gbps signal

Therefore achieving acceptable signal fidelity requires careful management of signal losses and noise in each Channel such that an acceptable signal-to-noise (SN) ratio is achieved at the receiver

The design process therefore begins by understanding and mitigat-ing the sources of losses and noise in each Channel

Sources of lossThere are three sources of loss

n Conductor losses which are due to skin effects and can be addressed by maximizing the cross sectional area of the signal traces

n Material dispersion losses which are a function of the dielectric constants of the chosen material These can be mitigated by choosing a higher performance laminate material such as Nelco 4000-13SI or Megtron

n Reflected power loss due to impedance mismatches in the Channel as each signal transitions across the different copper media in each channel (connectors vias and PCB traces) and passes through the pad and anti-pad structures of the via fields of other backplane blade slots

Table 1 shows the relative effects of different sources of impedance mismatches The dominant source of impedance mismatches in every Channel resides in the via structures Successful mitigation of this problem requires that every via is tuned by back-drilling the stub and adjusting the pad and anti-pad structures to match the impedance to be 50 ohms irrespective of the target routing layer This in turn requires that the capacitive and inductive effects of the connector pin and via barrel combination are taken into account during the design of each Channel

Further complicating via design is the space the anti-pad structures need to accommodate Channels being routed between other blades while minimizing electro-magnetic coupling with them This space consideration makes the shape and orientation of pads and anti-pads extremely important

Figure 1

Table 1

Table 2

Fo Sin Pnt

IEEE 8023ap provides a design targetAs Ethernet has emerged as the industryrsquos dominant signaling methodology the IEEE has developed the 10GBASE-KR norma-tive Channel model to define interconnect Channel performance for NRZ signaling at 10 Gbps This standard defines acceptable performance in terms of S-parameter charts for through-Channel insertion loss and worst-case crosstalk Figures 2a and 2b illustrate masks for Draft 24 of the standard that was initially used for this exercise

In each case the mask defining compliant performance is shown in blue Channel insertion loss is shown in red in Figure 2a Crosstalk performance is defined by the ICR curve (Figure 2b) Minimum acceptable Channel performance is defined in the ICR chart (Figure 2b) by the blue line The effect of the sum of all aggressors on the through-Channel is shown in red The green ICR curve is the ratio of the crosstalk power sum calculated by summing the

magnitudes of any impacting crosstalk Channels for each fre-quency and using a straight line fit (using least-squares method) to determine the resulting average effect f the aggressors on the through-Channel This is then overlaid on the insertion loss and used to plot the ICR curve

This standard which has evolved through a variety of iterations forms the basis for developing a 40 GbE switch fabric backplane featuring 10 Gbps NRZ differential pairs If all differential pairs can meet this standard then the backplane can be considered to be 10GBASE-KR compliant

Applying 10GBASE-KR to a 14-slotAdvancedTCA applicationThe PICMG specification dictates that receive differential pairs are placed on the c-d and g-h rows of the HM-ZD connector and that transmit differential pairs are placed on the a-b and e-f rows Therefore the middle differential pair in row c-d of Slot B will be subject to the NEXT of three aggressors in each of the a-b and e-f transmit rows of slot B plus the FEXT of the signals being received in the c-d pairs in the top and bottom of slot B

In this topology it can be seen that worst-case crosstalk would occur if all the NEXT and FEXT aggressors were routed on the bottom Layer that is on the same Layer as that of the victim c-d However given that all signal vias must be back-drilled and tuned for impedance management purposes Channel crosstalk can simultaneously be reduced by allocating different routing Layers to differential pairs terminated in the same backplane connector

The principal factor in determining the feasibility of a 10GBASE-KR compliant backplane is based on understanding whether the Channel with the worst-case signal-to-noise ratio is compliant

The skew targets determine permissible layer separation between a-b c-d e-f and g-h pairs within each Channel and enable routing Layers to be allocated for each pair It is now possible to start the process of via tuning to optimize the channel performance for minimum insertion loss Modeling begins by defining the simulation boundaries for the channel so that Channel component models (PCB traces connectors vias) can easily be aggregated to model complete Channels Boundaries must be established at locations in the Channel where linear 3D structures exist These are shown in Figure 3 (next page)

Since the connector and via combinations for the backplane and daughtercard mating halves must each be treated as a whole it

PICMG 30Spec

TurboFabricSpec

Total Inter-PairSkew

(Fabric Interface)

05 mm in FR4(34 ps)

001 mmin N4000-13si

(00625 ps)

Total Intra-Channel Skew

(Fabric Interface)

254 mm in FR4(17 ps)

plusmn01 mmin N4000-13si

(0625ps)

Total Intra-Channel Skew

(Base Interface)

135 mm in FR4(90 ps)

plusmn01 mmin N4000-13si

(0625 ps)

Figures 2a and 2b

Table 3

Determining which Channel that is and identifying the worst-case SN requires making trade-offs with regard to PCB material Channel length via design connector row selection and NEXT and FEXT aggressor routing choices These trade-off choices can only take place using advanced 3D simulation tools such as Ansoft HFSS This was the essence of the design process employed in developing Simclarrsquos TurboFabric backplanes

The simulation processThe transmission length for full mesh and dual star backplanes design implementations varies from a maximum of 1632 inches to a minimum of 116 inches With an effective transmission length of 5 inches on each daughtercard this makes the longest effective Channel 2632 inches including two connectors

For a 10GBASE-KR application over this distance a high-perfor-mance laminate is essential for both reducing insertion loss and

ensuring high glass content in the weave to mitigate skew So the design process began by choosing a low-loss dielectric material (Nelco 4000-13SI for both the backplane and the daugh-tercards) and establishing targets for Inter-Pair and Intra-Channel skew as shown in Table 3

Adhering to the PICMG 30 specifi-cation for skew in a 10GBASE-KR application is impractical Instead a target of 00625 ps was set for Inter-Pair skew with 0625 ps set for Intra-Pair skew for the backplane only This equated to a maximum 001 mm differ-

ence being allowed between traces of any differential pair and 01 mm being permitted between traces of any four differential pairs in a Channel Given the topology of the HM-ZD connector daughter-card skew must be accounted for in the daughtercard layout Fo

Sin Pnt

should be noted that the simulation boundary is located within the mated connector

Tuning the connector and via structures to 50Ω is an iterative process involving the removal of excess pads back-drilling and tuning pads anti-pads and traces A Time Domain Reflectometer (TDR) plot illustrating the results of the tuning process is shown in Figure 4

Upon completion of the modeling process a total of 17 different optimized via and routing configurations had been designed for the full mesh design and nine for the dual star design

A plot of worst-case insertion loss is shown in Figure 5 and demonstrates that in both cases performance is well above the 10GBASE-KR mask

When all the through-Channels have been modeled adjacent Channel models can be combined and ICR curves plotted to evaluate the impact of crosstalk on through-Channel performance This valuable information can be used to adjust the position of signal Layers relative to pass-through aggressor traces on adjacent Layers or to reroute traces to reduce crosstalk Similarly routing Layers can be changed to reduce crosstalk in adjacent via barrels

Figure 6 plots worst-case ICR and demonstrates that performance is above the 10GBASE-KR mask Based on this result it was possible to proceed to physical implementation

Figure 3

Figure 4

Fo Sin Pnt

Physical realizationThe layout process was performed using the Mentor Board-Station CAD system Quad-routing (routing four traces between pads) was explored as a routing method-ology in order to reduce Layer count but this was dismissed due to the detrimental impact on crosstalk performance

The attributes of the physical backplanes produced as a result of the design effort are shown in Table 4

The design files produced included the usual gerber files plus detailed back-drilling instructions

The design validation process comprised a conventional continuity test followed by performance testing featuring Agilent equipment including 70340A signal generator 8720ES Network Analyzer NN18A S-Parameter test-set and 86100A sampling oscilloscope with Agilent 86112A module Figure 7 (next page) shows the test set up

Simclar developed special line cards to enable through-Channel measurements with and without crosstalk The signal launch featured compression mount SMAs terminated in a tuned via structure The Channel simulations included simu-lation of the tuned launch structures so de-embedding of the launches was not necessary for correlation to simulation purposes The development team also established a process for characterization of all Channels

Full Mesh Dual Star

Layer Count 34 18

Aspect Ratio 121 61

Tuned Vias 3952 768

Material Nelco 4000-13SI

Table 4

Figure 5 Figure 6

Fo Sin Pnt

In Figure 8 measured through-Channel performance and ICR curves are shown for the same Channels described in the simula-tion section earlier

As can be seen from Figure 8 there is close correlation between these and the simulated plots in Figures 5 and 6 In fact close correlation between all simulated and measured results was achieved resulting in a 728 Tbps capacity full mesh and a 960 Gbps capacity dual star backplane design now generally available as part of the Simclar TurboFabric shelf

Figure 7 Figure 8

Figure 9

Figure 10

Implications of 10GBASE-KR Draft 33versus Draft 25The work described above was targeted towards meeting the Channels specifications contained in Draft 25 of the IEEE 10GBASE-KR Since this work was completed the IEEE has up-issued the Draft revision level for the Standard from 25 to 33 While this has not impacted through-Channel performance demands it has increased Channel isolation requirements by around 10 dB In Figure 9 a Draft 33 mask is added to the ICR plot shown in Figure 8

From Figure 9 it can be seen how Draft 33 pulls the mask above the Channel ICR curve for this full mesh backplane Channel Surprisingly it is the Channelrsquos frequency response at relatively low frequencies between 100-500 MHz that is causing a problem The reasons for this are currently the subject of further detailed investigation

However Figure 10 shows a Draft 33 plot for a less demanding dual star AdvancedTCA implementation featuring shorter trans-mission distances This plot demonstrates compliance to Draft 33 of the IEEE 8023ap 10GBASE-KR Standard

ConclusionBy developing a close understanding of the many factors contrib-uting to loss and noise in multi-gigabit backplane Channels it is possible to characterize their performance using advanced simula-tion techniques and correlate that performance in physical prod-ucts using advanced test methods By overlaying the test results on S-Parameter masks defined by the IEEE 8023ap 10GBASE-KR Standard it has been demonstrated that backplanes that truly enable AdvancedTCA scalability are at last a reality

Douglas Hynd joined Simclar Group in 2006 as Director of Marketing as part of Simclarrsquos acquisition of Northrop Grumman Interconnect Technologies Division wherehe was Vice President of Marketing and Sales He has more than 24 yearsrsquo experience intechnology sales marketing and generalmanagement and holds a BSc (Eng) in Electronics and Electrical Engineeringfrom the University of Glasgow He isbased at Simclarrsquos Global HQ inDunfermline Scotland

Simclar Groupdouglashyndsimclarcom bull wwwsimclarcom

Fo Sin Pnt

6U CompactPCIPrOduCT GuIdE g

This monthrsquos issue includes a 6U CompactPCI Product Guide and Irsquod like to take the opportunity to reflect a bit on the success and evolution of that technology

Back in the 1994 time frame when CompactPCI was first being devel-oped it began as 3U-only technology It used the same Eurocardmechanics that were popularized by VME and an IEC standardized high-

density high-speed connector available from a number of vendors suitablefor 33 MHz PCI signaling That connector was selected by the engineers atZiatech with help from Mike Munroe then at ERNI The majority of VMEdesigns were 6U and based on this I was among a number of folks thatargued for adding the 6U CompactPCI form factor

The 6U form factor presented some challenges and opportunities Onechallenge was that the insertion and extraction forces were quite high when the entire rear of the card was populated with connectors Fortunately the IEEE standards for Eurocards evolved and injectorejector handles that pro-vided leverage became available Eike Waltz then at Rittal was instrumental in bringing that to the table Two of the opportunities that came along withthe extra connectors were a clean way to add secondary buses like the H110 telephony bus to the backplane and the ability to route IO out the rear through rear transition modules PICMG has developed quite a number of subsidiary specifications defining the interoperable use of the extra backplane pins made possible with the 6U form factor Both of these features have played a major part in CompactPCIrsquos success The next major evolution of 6U CompactPCI came with the PICMG 216 Packet Switched Backplane standard which was originally conceived by John Peters and his team at Performance Technologies PICMG 216 interconnected a shelf full of CompactPCI single board computers via redundant Ethernet switches also in the 6U CompactPCI form factor This dramatically increased usable backplane bandwidth and provided redundancy PICMG 216 paved the way for AdvancedTCA and was the industryrsquos first open standard for the switched serial interconnect standards we see popping up in many places

By Joe Pavlat

Looking back and ahead at6U CompactPCI

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Recent 6U CompactPCI related products are listed here For more informationenter the productrsquos RSC No at wwwcompactpci-systemscomrsc

cPCI-6910Dual-core Intel Xeon Processor LVULV Universal blade bull Supports Single Dual-Core Intel Xeon LV or ULV processorsbull Front Side Bus 667 MHz bull Up to 2 GB DDR2 400 MHz soldered SDRAM with ECC bull Four PCI Express GbEbull Up to 4 USB 20 ports bull PICMG 20 21 29 216 compliant

RSC No 35013

ADLINK Technologywwwadlinktechcom

CPCIStor Module6U CompactPCI storage blade bull Onboard ATA controller supports CDDVD HDD and solid-state flashbull Supports Hot Swap Removal (ask about RAID support) bull ATA disks available in Enhanced Dutycycle versions for NEBS Level 3 - 724 requirements bull Operating Systems supported VxWorksLinux and Windows

RSC No 34800

ACTTechnicowwwacttechnicocom

Prosody X cPCI E1T1An E1T1 digital network access card bull Suits telco developers and systems integrators bull Uses Aculabrsquos worldwide protocol coverage including Aculabrsquos SS7 stack available under a cost free license bull Available with 8 or 16 E1T1 trunks and software selectable E1T1 interfaces bull Flexible mix of protocols including ISDN CAS and SS7 (ITU-T China and ANSI) bull A variety of interconnect switching and protocol conversion solutions can be readily crafted bull High availability reliability and scalability with industry standard hardw re and software interoperability bull Up to 128 SS7 signaling links bull Non-circuit related (TCAP) messagingintensive applications such as prepaid and SMS

RSC No 35408

Aculabwwwaculabcom

Adexp8021Intel Core Duo L2400 (166 GHz) w E7520 server chipset bull Dual channel PC2-3200 Registered RAM SECDED or x4 SDDC bull Two GbE two Serial ATA four USB 20 bull Onboard SXGA graphics 1280 x 24-bitbull 6U CompactPCI Bus PICMG EXP0 R10 Specification bull RoHS compliant 0 degC to +55 degC operating range

RSC No 32837

Advanet Incwwwadvanetcojpen

TC84012 channel single-stop Time-to-Digital Converter (TDC) with single-start and multi-start acquisition modes bull 50 ps timing resolution bull Wide range with upto 20 s between first and last events bull Large internal memory buffer with up to 512 hits per channel bull Low jitter (lt3 ps rms) high stability (plusmn2 ppm) internalclock source bull External 10 MHz reference input bull FPGA based Data Processing Unit (DPU) bull Fast readout with DMA mode for increased data throughputbull Overvoltage-protected inputs with 50 Ω K-Lock (LEMO) connectors bull Built-in self calibration bull Modular single-slot 6U PXICompactPCI standardbull Low power consumption (lt22 W)

RSC No 33445

Agilent-Acqiriswwwacqiriscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

MIC-30428-slot 6U CompactPCI backplane bull AC or DC CompactPCI 500 W + 250 W redundant(2+1) power supplies bull PICMG 216 (CompactPCI Packet Switching Backplane) compliancebull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarmmodule (MIC-3924L-AE)

RSC No 32851

MIC-30436-slot 6U CompactPCI backplane bull Supports two hot-swappable SCSISATA or removableIDE HDD bays bull Built-in IDE slim-type DVD-ROM bull AC or DC CompactPCI 250 W + 250 Wredundant (1+1) power supplies bull Supports hot-swappable fan modules bull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarm module (MIC-3924L-AE)

RSC No 32850

Advantech Corporationwwwadvantechcom

Dual-Core Xeon CompactPCI SBCModel PP 42123x bull Dual CPU 6U CompactPCI SBC supporting two dual-core Xeon CPUs bull Up to 8 GB DDR2 ECC SDRAM in a single system or peripheralslot bull Dual processor SBC in a single 6U CompactPCI slot bull Supports two 166 GHz Dual-Core Intel Xeon ULV processors using Intel E7520 server chipsetbull Up to 8 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull PMCXMC site support 66 MHz PCI-X and x8 PCI Express bull Front and rear IO bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade bull Four GbE ports with option for PICMG 216

RSC No 34761

6U CompactPCI Core 2 Duo SBCModel PP 41203x bull 6U CompactPCI Core 2 Duo SBC supporting two PMC sites includingone XMC site bull Up to 4 GB DDR2 ECC SDRAM bull All in a single system or peripheral slot bull TwoPMC sites supporting up to 100 MHz PCI-X bull One XMC x8 PCI Express bull Front and rear IObull Supports 216 GHz or 15 GHz Intel Core 2 Duo processors bull Intel E7520 server chipsetbull Up to 4 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade

RSC No 34763

PP 30202xTwo processor versions available bull 18 GHz Intel Pentium M processor 745 uses mFC-PGA 478 (micro Flip-Chip Pin Grid Array) package bull 14 GHz Intel Pentium M processor Low Voltage 738uses mFC-BGA 479 (micro Flip-Chip Ball Grid Array) package bull 64 KB primary (L1) on-die cache2 MB of secondary (L2) on-die cache bull 400 MHz Front Side Bus (FSB) bull No CPU fan bull 16 GHz processor version (1 MB L2 cache) available see PP 30002x datasheet bull Utilizes 64-bitIntel 855GME chipset bull Supports 400 MHz bus frequency bull Uses Intel 6300ESB IO Controller Hub

RSC No 32659

Concurrent Technologies Incwwwgocctcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cCIBPMC6U-ETA 6U bridged dual PMC carrier that bridges extended temperature CompactPCI boards and PMCs bull Features a rugged CompactPCI form factor providing increased flexibility to military communications systems designers bull Provides additional design choices to users through its differing bus speeds maximizing the numberof PMCs that can be used CompactPCI andPMC buses can both run at 66 or 33 MHzbull Operating temperature range of -40 degC to+85 degC bull Signal conditioning bull DMA supportbull Low-power design +5 V +33 V +12 V -12 V bull User-selectable VIO of 33 V or 5 V to the PMC

RSC No 32891

Dynamic Engineeringwwwdynengcom

cPCI4IP-MMMinimized PCI address footprint IndustryPack carrier for CompactPCI applications bull 6U 4HP4 IP positions 832 clock selection for each slot fused filtered power IO options bull ID INT IO and Mem spaces are decoded for each IP slotbull Single and double wide IPrsquos bull 16- and 32- bit IPs bull 32-bit access to 16-bit IPs bull Full or mini-mized Memory Space decoding for 18 the PCI address requirement bull With the cPCI4IP-MM option 8 CompactPCI 4IP cards take the same PCI address space as 1 full Mem Space card

RSC No 34905

ACQ132CPCI32 channel MHz class simultaneous sampling intelligent digitizer bull 32 simultaneous analoginput channels 2-32 MSpschannel 14-bit resolution bull Differential inputs bull Intelligent cardwith 1 gigabyte memory and GbE on board bull Large distributed FPGA resource on boardbull Range of DSP functions including FIR filtering and Digital Downconverter

RSC No 35482

D-TACQ Solutions Ltdwwwd-tacqcouk

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CR11Based on the Intel Core Duo Processor the platform is designed to support processor speeds from 106 GHz up to 20 GHz bull Intel Core 2 Duo runs at 15 GHz up to 20 GHz bull Conduction cooled bull Two PMC slots bull PCI Express bull 2x GbE

RSC No 33156

ICS-72532-channel 6U CompactPCI DAC board bull 6U CompactPCI data acquisition card bull 32 differential output channels bull 16 or 24-bit sample size bull 288 kHzch data rate bull Simultaneous sampling across all channels on single or multiple boards bull 32 separate delta-sigma DACs bull 64-bit 66 MHz CompactPCI PICMG 20 Rev30 hot-swappable bull FPDP II 400 MBps interface

RSC No 33576

ICS-71032-channel 6U CompactPCI ADC board bull 6U CompactPCI data acquisition card bull 32 differential input channels bull 216 KHzch 24-bit resolution bull Software selectable full scale input bull FPDP II 400 MBpsinterface bull 64-bit 66 MHz CompactPCI PICMG 20 Rev 30 hot swappable bull 32 synchronous boards for simultaneous sampling bull Sonar acoustics and test and measurement applications

RSC No 33578

Tsumani 6U CPCI Development KitFPGA processor solution targeted at high performance software defined radio applications bull Dual Stratix EP1S80 FPGAs are tightly coupled to provide apower platform for signal processing bull Two PMC module sites provide IO connectivity to either front panel or back panel connections bull A direct highbandwidth 1 GBps path from the PMC P4 connector directly to the FPGAs bull Model 919 Dual DAC Mezzanine provides broadband analog signal generationin a compact form bull The board features two independent DAC channels each with its own 12-bit LVDS input capable of running at rates up to 160 MHz

RSC No 32026

CP11Rugged 6U SBC bull Up to 4 GB of DDR2 SDRAM (200 MHz) with enhanced ECC four independent onboard PCI buses system host and peripheral modesupport for the CompactPCI backplane two PMC interfaces (64-bit133 MHz and 32-bit33 MHz) bull Instead of the PMC1 a PCI Express based XMC interface is available on request bull Two GbE one Fast Ethernet two serial interfaces (RS-232 or RS-422485) USB 20 integrated HDD or flash drive bull High performance 2D3D ATI video controller capable of driving two displays in parallel supports VGADVI interface bull Intel Core 2 Duo at 216 GHz Intel Core Duo at 20 GHz2x PMC expansion site bull One XMC optional bull Up to 4 GB DDR2 SDRAM wECC 2x GbE

RSC No 33447

GE Fanuc Intelligent Platforms Incwwwgefanucembeddedcom

Single Board ComputersGD Canada designs and manufactures conduction-cooled Single Board Computers (SBCs)using Intel processors bull 6U and 3U form factors for CompactPCI backplanes bull Fully backward compatible with earlier models bull Upgradeable via the change-out of processor memory andIO modules bull Used within GD Canada computer systems and sold as individual products

RSC No 35281

General Dynamicswwwgdcanadacom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cPCI6U-24DSI32R32-channel 24-bit delta-sigma CompactPCI 6U analog input board with rear IO bull Low noise 24-bit resolution low phase distortion andmulti-board synchronization bull Suits state-of-the-art sonar and noise monitoring applications bull 32-channel cPCI6U-24DSI32 analog input boardprovides a high-density 24-bit analog input resources on a standard 6U CompactPCI expansion board bull Applications from precision voltagemeasurements to complex audio signal and waveform analysis

RSC No 34985

General Standards Corporationwwwgeneralstandardscom

Duet 3U 64-bit 1 GHz TMS320C6416 DSP (x2) 64 MB SDRAM per processor bull Flexible internalexternalcommunication mesh bull 64-bit66 MHz CompactPCI bull PMCXMC site with Jn4 to FPGA and4 RocketIO per VITA 42 bull External data port up to 12 Gbps bull 4M or 5M Virtex-II Pro FPGAbull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM dedicated800 MBps links between DSPs bull 3U CompactPCI with PXI support bull Suits high-end co-processing wireless broadband communications RADAR video and biometrics

RSC No 32856

QuadiaQuad-DSP bull Dual FPGA bull Dual PMC sites bull Inter-processor connectivity and access to external interfaces bull Four C6416 DSPs split in two independent clusters each hosting a PMC site bull One large FPGA for end-user code bull Central FPGA routing interprocessor communication bull End-user FPGA communication bull External port serial IO for PCIe or other p ivate link bull Global memoryand PCI interface bull 1 GHz TMS320C6416 DSP (x4) bull 64 MB SDRAM per processor bull Flexible internalexternal communication mesh bull 64-bit66 MHz CompactPCI bull Two PMC sites with Jn4 to FPGA bull External data port up to 12 Gbps bull Two 4M Gate FPGA reserved for end-user code bull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM bull Up to 512 MB Global DDR SDRAM bull Suits high-end co-processing wireless and broadband communications

RSC No 34737

Quixote 64-bit 6UAdvanced signal capture generation and co-processing bull 1 GHz TMS320C6416 DSP and2 to 6 MGATE Virtex-II FPGA bull 32 MB SDRAM 8 MB ZBT SBSRAM and AD6645 and AD9764 converters bull 6432 bit CompactPCI 66 MHz 5 V33 V and complex trigger modes with HW event logging bull PMC site with Jn4 to FPGA DIO and PICMG 217 StarFabric compliant bull Suits Software Defined Radio wireless IP and RADAR development and hardware testing bull Physical Layer field testing ultra-fast flexible data acquisition vector signal generation and electronic warfare

RSC No 32861

Innovative Integrationwwwinnovative-dspcom

IC-e6-cPCIbHigh performance 6U CompactPCI board bull Powered by one or two of Freescalersquos mostadvanced 14 GHz MPC7448 PowerPC processors bull PICMG 216 compliant bull Marvell Discovery III chipset (MV64460) bull Low power consumption bull Standard extended and rugged grades

RSC No 32982

Interface Conceptwwwinterfaceconceptcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CP213Single-width 6U CompactPCIPXI module with either 32 or 64 differential analog input channelsbull 32 64 or 128 channels of analog input bull 16 multifunction digital IO (TTL) channels that may beconfigured as digital in digital out or selectively attached to 2 frequency in 2 counter in andor 2 timerout channels bull 16-bit resolution bull Programmable gain per channel programmable scan rates of lt1 Ss through 100 KSs bull Precision onboard reference for end-to-end calibration

RSC No 34804

KineticSystems Company LLCwwwkscorpcom

CP6001Energy efficient embedded Intel dual core processors bull 12 GHz Intel Core Duo U2500 ULV processor bull Intel Core 2 Duo L7400 LV processor bull Based on the Intel Mobile 945GM chipset with a front side bus of up to 667 MHz and ICH7-R Southbridge bull Two independent digital video outputs to the rear IO (2x DVI - 1x DVI and 1x HDMI) bull AC97 audio capabilities bull 3 x GbE bull 4 x SATA with RAID 01510 functionality bull 6 x USB 20 2 x COM and VGA or DVI bull Can also accommodate a PMC slot or an onboard 25 inch SATA HDD bull Up to 8 GB of USB or 2 GB soldered flash bull Supports Linux Windows XP XP embedded and VxWorks 6

RSC No 34182

CP6923 GbE Switch6U CompactPCI GbE Switch PICMG 216 compliant bull Leading edge te hnology basedon BCM5650X chip bull 24x GbE ports bull Non-blocking Layer 2 and 3 switching and routingbull Copper optical rear IO version bull Hot swap IPMI bull Fully managed bull Comprehensive firmware package bull Applies to VoIP installations such as call servers media gatewaysand trunking gateways in wireline and wireless networks as well as VoIP systems inenterprise networks with high demands on performance

RSC No 32256

Kontronwwwkontroncom

TMS320C6701 Virtex-IITexas Instrumentsrsquo C6701 DSP bull Xilinx Virtex-II series FPGA up to XC2V8000 bull Multiple IO interfaces Onboard CODEC VIM expansion sites 60-pin GPIO header and JTAG bull Hardware drivers integration in SimulinkXilinx System Generator Blocksets for quick implementation of Simulink models bull DSP and FPGA-in-the-loop cosimulation of SimulinkXilinx System Generator models bull Leading edge communication interface allowing real-time datamonitoring from Simulink scopes and remote operations

RSC No 32028

VHS-DACHigh performance multichannel DA for phased array antenna systems radarsonar communications receiversup-sampling to IF stage and RFIF AGC apps bull Eight 125 MSPS output channels bull Optional add-on daughter boardprovides 8 additional output channels or 8 additional input channels bull 32-bit 25 MHz bull FPDP interface with 400 MBps transfer rate (25 MSPS per channel at 8 channels 125 MSPS at 16 channels) bull Low level hardware drivers API andGUI bull High level hardware drivers integration in Simulink Blocksets bull Leading edge communication interface fordata recording and playback tofrom the onboard SDRAM

RSC No 32029

Lyrtechwwwlyrtechcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

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PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

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PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

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PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

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PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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Page 11: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

Buffering is importantThe buffering capability the BIF provides in the CBIS specifi- cation is an important distinction between it and the ATIS specification (for more information on the ATIS specs see the April 2007 Software Corner (wwwcompactpci-systemscom columnssoftware_corner200704)

Buffering is so important that ATIS has approved an additional standard for a Buffering Function (BF) within the ATIS lawful surveillance environment

The importance of buffering is best described in a presentation that Dr Glen Myers CEO of IP Fabrics gave at the December 2007 ISS World conference The real-time delivery that the initial ATIS specification defines can be problematic as Figure 2 shows Packet loss from congestion bit errors or QoS contracts can result in the entire surveillance stream being rendered inadmissible

Dr Myers further explained that ATIS allows their buffering model to be separate from or combined with the MF while the cable network CBIS model assumes the buffering function is always separate from the MF component (Figure 3)

The buffering function whether it be the Buffering Function in the ATIS model or the Broadband Intercept Function in the CBIS model minimizes the impact of packet loss and real-time data delivery The Mediation Function can repeatedly attempt to send surveillance information to the BIF through a secure reliable file transfer function such as secure FTP If there are problems connecting with the BIF alerts can be generated so the network administrator can find and fix the problem while the surveillance information is still resident on the MF system

Dr Myers mentioned other important benefits to providing a buffering function The network administrator does not need to

negotiate and install a dedicated link for each intercept between the MF and the Law Enforcement Agency or agencies (LEA) authorized for the information Dedicated pipes matching the subjectrsquos peak service bandwith are not needed Support for mul-tiple LEAs is easily implemented at the BIF instead of the Mediation Function Law enforcement collection equipment does not need to be co-located with the Mediation Function It also simplifies connectivity by eliminating Virtual Private Networks (VPNs) or other routing ele-ments between the MF and the LEA(s)

CALEA and CMTSIn a cable network the Cable Modem Termination System (CMTS) is typically the central point within which service provider traffic from the access network meets the cable core network (and ulti-mately the Internet) So the CMTS is an important interface point for lawful surveillance

CMTS equipment may provide varying levels of support for lawful surveillance The simplest is to provide access to all the raw traffic flowing through the CMTS using an Ethernet tap or span port In this scenario the Mediation Function must find the traffic belonging to the subscriber under surveillance generate the appro-priate CBIS files and send the files to the BIF

Cisco a leading supplier of CMTS equip-ment to the cable industry provides a capability called Service Independent Intercept (SII) within their CMTS prod-ucts Cisco SII is also used in their routers and intelligent switches for QoS control in addition to lawful surveillance While SII provides support for identifying traffic by MAC and IP address information it does

Figure 2

Figure 3

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not provide the high-level configuration and lawful surveillance messages required of the Mediation Function SII uses low-level SNMP MIBs that control MAC and IP address configuration commands which in turn trigger the Cisco SII device to send packets matching the configuration to a span port where the Mediation Function can use these matched packets to generate the lawful surveillance messages So SII provides a first-level filter for the Mediation Function which supplies a high-level configuration interface at the warrant description level as well as creation of the CBIS (or ATIS) messages to be sent to the BIF

CBIS-compliant productsThe CBIS specification is quite new so released products are mostly on the hori-zon However the IP Fabrics DeepSweep Lawful Surveillance product line does provide MF andor BIF functionality for the implementation of CBIS-compliant networks Dr Myers noted that the DeepSweep product line is based on a flexible architecture and a highly parallel processing environment comprised of many software surveillance modules that can be loaded and chained within the DeepSweep to provide a number of Layer two to seven surveillance and packet analysis activities The device is programmed through a GUI and operates as a full Mediation Function with the ability to identify subscriber-related IP address assignment and resulting traffic from a span port The DeepSweep also has software support to communicate with SII enabled routers and CMTS sys-tems to provide a fully compliant ATIS andor CBIS surveillance environment compatible with Cisco lawful intercept and QoS services

CBIS BIF and ATIS buffering appliances are also available to provide buffering compliant with CBIS and ATIS standards

ConclusionCyber crimes such as identity theft child pornography chat-room initiated abduc-tion national security and piracy are very real and growing issues in todayrsquos society Billions of corporate and personal dollars have been tied to cyber crooks that abuse the Internet to participate in these activities It is essential that these illegal activities can be identified and stopped It is a good idea to be aware that the cable industry and its proactive support of lawful surveillance standards as well as rolling out equipment that implements these standards will in turn enable law enforcement to catch these cyber crooks and make the Internet a safer place for us and our children to live learn and work

For more information on this or any Software Corner contact Curt atcschwadereropensystems-publishingcom

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APPLICATION g

Based on current overall network growth Telecom Equipment

Manufacturers (TEMs) and Network Equipment Providers (NEPs)

are being challenged to launch new communications platforms

that provide optimal scalability flexibility manageability and

high computing performance With the expected increase in new

subscribers who need to be supported across the network TEMs and

NEPs are focusing on COTS platforms that meet the requirements of

a carrier-grade environment

With these new challenges it is important to take a look at the different

applications in the network to thoroughly evaluate the best hardware

platform approach Comparing the scalability IO functionality

interconnectivity and overall performance gives TEMs and NEPs a

solid basis from which to choose the best cost-effective solution for

their applications This article compares the traditional 1U PCI

platform with a more modular AdvancedTCA-based approach to

a Home Subscriber Server (HSS)-based platform

Emerging next-generation network architecture IMS Carriers and service providers are focused on improving their Average Revenue Per User (ARPU) by deploying new services quickly and at a price that is acceptable to subscribers IP Multimedia Subsystems (IMS) enable service providers to offer differentiated services to their subscriber base integrating voice video text and content as part of their service mix regard-less of the access technology

The IMS framework provides the telecom industry with a modular standards-based IP service delivery infrastructure More than simply replacing existing circuit services with similar services delivered over IP IMS allows service providers to capitalize on faster and more cost-effective deployment of new and differentiated multimedia communication services

While these new technologies promise new sources of revenue and enhanced customer loyalty they also pose implemen- tation challenges One of the crucial net-work elements within an IMS framework is the manageability of the subscriber base Today an increasing number of users subscribe to multiple services such

By Sven FreudenFeld

Choose the right formula forcompute-intensive HSS systems

AdvancedTCA platforms

versus1U PCI rack-mount servers

AdvancedTCA

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as multimedia mobile phones VoIP or IPTV at home Service providers must manage ldquoduplicatedrdquo subscriber databases for each particular service Consequently managing a converging subscriber base for such network functions as billing across multiple different technologies presents a tremendous challenge Any downtime of this network element can be costly to the carrier or service provider not to mention the heavy risk of losing subscribers over the long term

The HSS and Home Location Register (HLR) are key elements in the IMS network required to manage the growing number of subscribers These platforms that manage millions of customersrsquo data need to be highly reliable with carrier-grade High Availability (HA) functionality Core requirements for the HSS computing platform are

n High compute density for application processingn Scalable performance and high densityn Fast read access to the subscriber datan Large storage and memory bandwidthn Ability to consolidate multiple IMS elements and subscriber data within a single

platform with a modular approach as a converged services platform

HSS plays network backbone roleHSS provides the important network backbone of the IMS architecture because it eases innovation and addresses a range of service-logic interaction issues that have plagued previous service architectures HSS offers open access to service-related data for each subscriber supporting the sharing of data among multiple services

HSS is essentially the master user database that supports IMS network entities that handle calls and sessions It contains user profiles performs authentication and authorization of the user and can provide information about the physical location of the user It plays a key role in provisioning service creation enabling subscriber data and managing control roaming and interconnection The Application Server (AS) which hosts and executes serv- ices in the IMS environment communicates with the HSS Call State Control Function

(CSCF) servers also communicate with the HSS which must be able to

n Support IMS-level authentication and authorization

n Maintain IMS subscriber profile(s) independent of access types

n Maintain service-specific datan Keep track of currently assigned

CSCFn Support CSCF and AS access

HLRHSS hardware platform design choicesHSS design must enable the HSS to be deployed cost-effectively and expand readily to meet future subscriber levels For example the trend to include more information as part of the data record for each subscriber will drive up memory requirements

From a technical perspective the key metrics to understand when developing the IMS HSS functions are the number of completed transactions required per sec-ond and the size of the subscriber base

HSS architecture typically comprises multiple processor units with extensive memory requirements With the introduction

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of multicore processors from Intel developers can scale performance while optimizing power consumption in the overall system design

To meet these requirements the hardware platform needs to provide scalability flexibil-ity and long-term cost efficiency In comparing the traditional 1U platform with a more modular approach to the HSS using AdvancedTCA consider the following

n High compute performance n High memory and storage capabilityn IO functionality to connect to multiple networks (such as SS7 and Ethernet)n Carrier-grade profile and redundancy

AdvancedTCA High density with scalability on a smaller footprintTable 1 illustrates a comparison of a sample AdvancedTCA-based platform and a 1U PCI rack-mounted platform for HSS applications This configuration assumes an increasing subscriber growth from 1 million (M) subscribers to 18M subscribers per platform

FootprintAdvancedTCA-based platforms provide a high density compute platform with scalability on a smaller footprint TEMs can easily add boards to a chassis to accommodate more traffic and to support new services This flexibility enables an increase in subscribers and the database without having a major impact on rack space in the central office environ-ment To meet the same capacity for 18M subscribers the 1U PCI approach will occupy two bays or cabinets with a total footprint of 28 square feet compared to the same capacity occupying one bay or cabinet with a footprint of 14 square feet (see Figure 1)

CoolingWhile the power consumption per square foot is higher than the 1U PCI platform AdvancedTCA offers better airflow and cooling distribution using a push-pull cooling system Each 1U PCI platform includes up to nine cooling fans and is dedicated to that CPU in the 1U server only which translates into higher overhead Therefore the airflow is

not optimized in the overall system design In the case of a fan failure AdvancedTCA platforms enable easier access to replace the fans which are field replaceable units The 1U platform also does not include any integrated centralized switching or management capabilities therefore the total does not include any switching or system management functionality

ScalabilityAdvancedTCA architecture lends itself well to scalability As AdvancedTCA sup-ports both a Base and Fabric interface into the backplane and the separation of data and control planes TEMs can also scale up their designs from 1 GbE to 10 GbE to accommodate new users and usage requirements AdvancedTCA based systems are designed for easy upgrade-ability to new processing blades switch fabrics and IO modules using Advanced Mezzanine Cards (such as SS7)

Since AdvancedTCA and AdvancedMCs offer hot swap capabilities and HA func-tionality growing a subscriber base by using additional CPU blades within the system with low maintenance or upgrade downtime is crucial for the HSS plat-form It also allows for the up and down

AdvancedTCA-based HSS Platform 1U PCI Rack-Mount HSS Platform

Number ofsubscribers

~1M subscribers = 4 CPU blades edundant ~1M subscribers = 4 x 1U

~4M subscribers = 7 CPU blades redundant ~4M subscribers = 7 x 1U

~6M subscribers = 12 CPU blades redundant ~6M subscribers = 12 x 1U

~18M subscribers = 36 CPU blades redundant= 3 AdvancedTCA shelves per rack

~18M subscribers= 36 x 1U+ external switch components for redundancy

Technicalspecs

1 CPU blade = 2 x Intel Xeon dual core = quad core 1 1U rack-mount Intel= Intel Xeon quad core or dual core CPU

16 G DDR 2 memory Max of 8 G DRY memory

+ 2 x SATA or SASS hot swap (RAID 0 and 1)+ 1x PCI Express for SS7 Dual GbE per 1U rack-mount server

4 x GbE per CPU with built in GbE backplane switching separating Control Pathand Data Path with multishelf expandability

External central switching required withmultiple external GbE connectivity

Systems and blade manageability built into the platform withIMP implementation SNMP and CLIP

Carrier-grade redundancy on switch and node

IO for SS7 or other interface modules

CPU blade hot swap capability

Thermaland power

requirements

~6M subscribers redundant= 14 slots with centralized chassis cooling

~6M subscribers redundant= 18 x 1U PCI with independent cooling and separate switch units and system management

Total power consumption= ok (3100 W for blades and RTM + 500 W Shim fan tray and SAP)

Total power consumption= ok

Table 1

Fo Sin Pnt

scaling of the platform depending on the subscriber increase or decrease When consolidating multiple services minimiz-ing multiple duplicate databases requires this flexibility

InterconnectivityThe AdvancedTCA platform offers a number of interconnectivity features including

n Separation between the data plane and the control plane

n Direct uplink in a multichassis envi-ronment with up to l0 GbE

n Node to node base and fabric connec-tivity with HA carrier-grade Ethernet functionality

n Easy upgrade path to l0 GbE for increased bandwidth

By contrast the 1U PCI platform requires

n Additional external interconnectiv-ity between 1U rack-mount servers which increases the number of points of failures and the operating and maintenance costs

n Additional switching equipment for carrier-grade Ethernet connectivity

n Additional manage-ment (Simple Network Management Protocol [SNMP]) for HA redundancy

PowerThe 1U-based platform also utilizes integrated AC power supply units usually the standard for the data center and enter-prise environments AC will increase the pro-viderrsquos OPEX in the long term since the power consumption per rack is significantly higher and

Figure 1

requires additional support equipment such as an Uninterruptible Power Supply (UPS) and an AC to DC converter per rack space and ultimately per CPU These factors along with the requirements for carrier-grade functionality HA support and a more favorable long-term OPEX further reduce the need to consider the 1U solution for HSS deployments in Central Office networks

ManageabilityAdvancedTCA chassis-level management is based on the industry-standard Intelligent Platform Management Interface (IPMI) IPMI makes possible interoperability among chassis and blowers compute nodes switches and management solutions from multiple vendors enabling these elements to work together seamlessly The resulting successful inter-blade communication for applications including failover and clustering provides full manageability on a per shelf and per bay basis

Fo Sin Pnt

One of the primary goals of the AdvancedTCA specification is to ensure a very low Mean Time to Repair (MTTR) and high Mean Time Between Failures (MTBF) There are no active components in the backplane ndash which can translate to expensive repairs in the field In addi-tion AdvancedTCA specifies that all com-ponents can be hot swappable in the field and the architecture provides redundancy at all levels This hot swap capability translates to less downtime for field replacement on a per CPU blade basis as compared to 1U PCI

SummaryAdvancedTCA provides an ideal platform and meets the technical requirements for deploying flexible and scalable IMS HSS applications While other platform archi-tectures such as 1U rack-mount servers may with considerable difficulty be able to deliver HSS capabilities AdvancedTCA offers a much more advantageous solution by providing a smaller footprint improved cooling and thermal characteristics bet-ter scalability enhanced interconnectivity and easier manageability This all contrib-utes to making AdvancedTCA a lower cost approach in terms of CAPEX and OPEX for long-term subscriber growth

1U PCI rack-mount servers are not considered to be the optimal hardware platform for HSS applications in a Central Office With its limitation for carrier-grade flexibility and HA functionality the 1U PCI platform is best suited for a full range of other enterprise and Internet infrastructure applications within a data center environment that does not require any significant flexibility and HA functionality around it It might also be a good entrance point for other enterprise applications with lower price points

The use of AdvancedTCA-based platforms enables TEMs to shift away from hardware development and refocus their efforts on delivering value-added software and services As a result they can realize lower development costs and faster time-to-market enabling increased flexibility with each product design through the use and reuse of standardized off-the-shelf components Equally significant are the advantages that can be realized by the service provider With a common platform and a flexible architecture that maximizes limited floor space service providers can rapidly and flexibly implement a broad range of feature-rich solutions for faster profitability

Sven Freudenfeld is responsible for North American Business Development for the Kontron AG line of AdvancedTCA AMC MicroTCA and Pre-Integrated Solutions Sven possesses more than 15 years of experience with voice data and wireless com-munications having worked extensively with Nortel Networks in Systems Engineering Sanmina-SCI in Test Engineeringand Deutsche Telekom in Network Engineering Sven holdsan electrical engineering degree from Germany and is also Chair of the CP-TA marketing workgroup focusing on the interoperability of COTS standard building blocks

Kontron bull svenfreudenfeldcakontroncom bull wwwkontroncom

Fo Sin Pnt

Fo Sin Pnt

TECHNOLOGY g BACkpLANES

Increasing demand for service and multimedia features is stimulating a growing need for speed in telecom-munications equipment While some

applications such as PBX systems can be addressed with the gigabit backplane technologies currently available others are running out of headroom Routers may soon need 10 Gbps and higher speed back-planes to keep up with network demand Many such applications can justify the expense of moving to higher performance if it becomes available

Currently telecom system designs offer backplanes that can handle interconnec-tions running as fast as 3125 Gbps raw data throughput per lane (with around a maxi-mum data rate capability of 5-625 Gbps per lane) The AdvancedTCA standard for instance uses Ethernetrsquos XAUI inter-face AdvancedTCA achieves a 10 Gbps net data rate by running four serial lanes for each interconnection with each lanersquos

SERrializerDESerializer (SERDES) op-erating at 3125 Gbps raw data (25 Gbs net)

As demand forces systems to move beyond these rates however new technologies will be needed One proposal calls for the use of XAUI+ or double XAUI which increases lane SERDES rates to 625 Gbps per lane and hence the throughput to 20 Gbps Another proposal is to use IEEE 8023ap known as 10GBASE-KR which runs a single SERDES lane at 125 Gbps raw data rate (103 Gbps net) But these are only short-term answers To address future demands organizations such as the Institute of Electrical and Electronic Engineers Standards Association (IEEE-SA) are developing specifications for Ethernet speeds of 40 Gbps to 100 Gbps which will be applied to backplane interconnect

Such high clock rates however will pose significant design challenges for developers

One of the first challenges that will need resolution is the design and layout of the backplane and other PCBs Common design practice today readily handles board clock rates of around 10 Gbps Well established design rules are in place and board layout tools such as autorouters can automatically handle board designs for speeds in the 10 Gbps range Designers may use specialized board material create additional ground planes and perform similar tasks in order to ensure proper board operation at the higher end but even speeds to 5 GHz are within current design tool capabilities

Design gets trickierAbove 5 GHz however board design gets more involved because feature dimensions become significant when compared to the signalrsquos wavelengths Variations in board thickness can affect signal propagation Corners where traces change direction and small spurs along edges of poorly etched

Channel characteristics

challenge backplane interoperability

Serial backplanes in telecommunications systems aim for high speed with room for

growth As systems began using 10 Gbps links however issues arose that affected backplane

communications among cards from different manufacturers Stuart points out that the

industry must define key backplane channel characteristics so that designs based on open

standards maintain interoperability as backplane speeds move to 40 Gbps and beyond

By Stuart JamieSon

Fo Sin Pnt

traces can act as antennae for the higher fre-quencies in digital signals As can be seen in Figure 1 sharp corners and minor flaws that are inconsequential at lower frequen-cies have the potential to become trouble-some antennae at future high speeds This can result in the trace radiating away the signalrsquos high frequency energy increasing EMI and crosstalk as well as altering signal waveforms New routing design rules such as making corners 30deg instead of 45deg and more careful board fabrication techniques may become necessary as designs move above the 10 Gbps per lane threshold

The move to higher frequencies will affect more than board fabrication and layout however Higher frequencies will also impose new requirements on signal tim-ing signal rise-time electrical distance and waveform shape if developers are to retain the mix-and-match system design approach that makes standards-based system design effective

For interoperability to be achievable at data rates above 10 Gbps organizations such as PICMG will need to carefully define a vari-ety of signal and design parameters in their specifications Some of the key parameters that will need consideration include

n Interconnect signal attenuationn Eye diagramn Jittern Input clock recoveryn Chip inputoutput pre-emphasis (PE) n Equalization (EQ)

Even slight variations in these parameters from device to device and lane to lane can shift the timing of signals a significant fraction of a clock cycle and affect the Bit Error Rate (BER) of a lanechannel Finally signal rise times will require tight control as signal rates increase in order to ensure control of system timing (see Figure 2)

In defining signal and design parameters specifications will also need to account for the increased location dependency that comes with higher frequencies Even subtle differences in attributes such as routing length and trace impedance become increasingly significant as signal speeds rise To ensure mix-and-match interopera-bility then design specifications may need to account for the specific backplane slot that a board is to occupy as well as introduce a method to obtain and control the PE and EQ of the devices connected to the lanes

Designers must also address fabrication standards The material used to fabricate

Figure 1

Figure 2

Fo Sin Pnt

the board the thickness and composition of metal cladding and the spacing between layers can all affect the trace characteris-tics Controlling these parameters under specification ensures that timing charac-teristics are sufficiently uniform from one board to another However current speci-fications are too detailed and stringent It is extremely difficult to attain compliance yet avoid adding cost to the design

Specifications need workSome of these parameters are already incorporated into current specifications The AMC module specifications from PICMG for instance include design parameters that ensure its proper opera-tion at signal speeds as fast as 125 Gbps per lane Establishing specifications for other system components will help achieve interoperability of standards-based designs at higher frequencies

Design tools may also need to be modified and the industry will need to create new design rules for high frequency and incor-porate these into the tools Developing new routing techniques will help avoid the issues of electrical phenomena such as skin effect dielectric loss and impedance mismatches These are much more preva-lent at higher frequencies and it becomes critical for engineers to model and simu-late these phenomena more accurately

Early efforts are already underway to address the challenges that higher fre-quency signals bring to standards-based design The Interconnect Channel Characterization Subcommittee of PICMG established in September 2006 is develop-ing ground rules and definitions to be used in characterizing transmission reflection and crosstalk performance in backplane and mezzanine carrier interconnects The committee aims to define the channel parameters to be measured or analyzed as well as the methods for doing so Its charter calls for it to address

n Definition of interfaces at which measurements are made or characteristics computed

n Test equipment fixtures and PCB test coupons

n Details of measurement proceduren Data formatsn Techniques for de-embedding

components of the channeln Techniques for validating

measurement based models ie passivity and causality

n Definitions that allow reasonable compliance testing

n Boundary definitions for different paths

n Define information regarding limita-tions or proper usage ie maximum data raterise times that are supported by the models

Such efforts are only a beginning how-ever Other design details still need to be addressed such as SERDES IO Configuration New functionality may need to be defined The design of high data rate system channel interfaces according to standardsspecifications does not currently cover the individual characteristics of the chip transmitterreceiver characteristics Thus work will be needed to address how such standard designs handle such dependency

Crossing an interoperability thresholdOne way of handling location dependen-cies might be to give the system control-ler the ability to inform modules what the channel transmitter and receiver PE and EQ technology is and importantly how to control it With this information along with the signal attenuation suffered (at a given bit rate) for the channel the system should be able to configure SERDES channels in different physical locations to run reliably and at the required BER In MicroTCA systems for instance this functionality could be incorporated into the MicroTCA Carrier Hub (MCH) as part of its electronic keying function Modules would have to be able to configure and control its backplane interfaces to allow for different positions

in the backplane An MCH (see Figure 3 courtesy Emerson) then would be able to instruct a module as to which parameters to use for interoperability

The specific approaches needed to handle location dependencies and other challenges that higher signal rates raise have yet to be developed The need to address these challenges however is clear Increasing demand for services is driving applications to utilize faster signal rates This in turn is driving backplane signaling speeds ever higher As speeds rise above 10 Gbps sig-nals will cross a threshold where current specifications will prove inadequate for ensuring interoperability among standards-based designs

The industry should begin developing new or enhanced specifications and design tools to address the challenges of higher signal rates Without such improvements the guarantees of interoperability that allow system developers to readily create solu-tions by combining off-the-shelf products will be compromised As backplane speeds approach 100 Gbps nothing can be taken for granted

Stuart Jamieson Director of Industry RelationsArchitect with Emerson Network Power Embedded Computing represents Emerson on PICMG committees and the SCOPE organization and previously served as a CP-TA Board member (Treasurer) He brings over 18 years of experience in hardware protocols embedded software and specification development to these groups Within Emerson he played a key role in the develop-ment of the technology central to Emersonrsquos bundled network-ing solutions Stuartrsquos positions within Emerson have included Director of Business Development Director of Advanced Technology and Architect He is the Draft Editor for the PICMG Interconnect Channel Characterization Subcommittee is the author of the introduction section for the new PICMG Ruggedized MicroTCA specification and served as the Draft Editor for the PICMG MicroTCA Specification Stuart gradu-ated from the Heriot-Watt University in 1989 with a 1st Class Honors degree in Electrical and Electronic Engineering and again in 1992 with an IBM-sponsored Master of Philosophy

Emerson Network Power Embedded ComputingStuartJamiesonEmersoncom bull wwwemersonembeddedcomputingcom

Figure 3

Fo Sin Pnt

TECHNOLOGY g BACkpLANES

2008

B A

N D

W I

D T

H

Signal integrity challenges to bandwidth scalabilityFor the purposes of this article each interconnected differential pair will be referred to as a Channel (which should not be confused with an aggregated AdvancedTCA channel comprising four trans-mit and four receive pairs)

14-slot full-mesh AdvancedTCA backplanes contain hundreds of Channels Each Channel is defined as the copper signal path from the output of a driver device to the input of a receiver device As

By douglaS Hynd

Developing IEEE 8023ap 10GBASE-KRcompliant backplanes

Why doesAdvancedTCA

need bandwidthscalability

PICMG AdvancedTCA 30 has emerged as the

industryrsquos Hardware Platform standard of choice and

is enjoying first-phase deployment However many

believe that for AdvancedTCA to realize its market

potential AdvancedTCA platforms need to seamlessly

scale to accommodate 40 GbE fabrics thereby

avoiding forklift upgrades as system bandwidth

demands increase over time A 40 GbE switch fabric

architecture would enable realization of a common

platform for computing storage control and media

and packet processing and provide the versatility and

long term ROI required by service providers in

todayrsquos increasingly competitive environment

The challenge was to develop a family of

AdvancedTCA products which feature PICMG 30

compliant dual star and full mesh advanced

backplane switch fabrics enabled up to 10 Gbps

per differential signal pair thereby giving 40 Gbps

per AdvancedTCA channel performance

This article describes the signal integrity challenges

presented in designing an IEEE 8023ap

10GBASE-KR-compliant bandwidth-scalable

14-slot AdvancedTCA platform and how these

challenges were overcome in development of full

mesh and dual star backplane reference designs

Fo Sin Pnt

shown in Figure 1 that signal path comprises a signal launch a blade PCB transmission line a daughtercard via a right-angled HM-ZD connector a mated HM-ZD backplane header a back-plane via a length of backplane PCB transmission line and then the same combination of connectors vias and transmission line at the receive end of the Channel

Sources of crosstalkFour principal sources of crosstalk in each Channel must be man-aged as shown in Table 2 Source number one is between adjacent differential pairs as they are routed across the backplane Common mode noise rejection in system differential pair structures makes this a minor issue The second source of crosstalk lies in the HM-ZD connector itself

Crosstalk in via fields our third source primarily arises from inductive coupling between adjacent differential pairs and domi-nates the crosstalk agenda in high-speed Channels This source of crosstalk is directly proportional to the length of the via barrel and where practical care must be taken to ensure that adjacent connector rows are terminated to different target routing Layers

The final source of crosstalk is caused by aggressor signals in through-routed via fields coupling with victim Channel traces as they pass through As mentioned earlier judicious and careful design can mitigate this impact

Skew Channel skew is a function of differential transmission path geometries At a fundamental frequency of 5 GHz skew can be a significant issue in high-speed system design due to narrowing the eye opening and increasing jitter Skew can have a significant impact on crosstalk it negatively impacts the common mode rejection of noise inherent to differential signaling Conductor surface roughness in lower performing dielectric materials can also cause skew in high-speed systems

Skew can be avoided through careful management of transmission path lengths in each Channel and by using higher-glass content (lower Dk) laminates

LossPotential

Potential Mismatches

Channel

Loss Potential Channel

PCB Tolerance -025 dB 2 -01 dB

Connector Tolerance -001 dB 4 -016 dB

Thru-routed Via Fields -001 dB 12 -144 dB

Connector Launch -025 dB+ 4 - 2 dB+

Quantity TotalNEXT

TotalFEXT

PCB Transmission Lines

24 in60 cm

-50 dB -70 dB

Connector Architecture 2 -26 dB -24 dB

Via Fields 4 -22 dB -20 dB

Connector Pass Through 8 -34 dB ndash34 dB

For the target application each one of these Channels must deliver a 10 Gbps Non-Return-To-Zero (NRZ) signal with sufficient signal fidelity to enable a receiver device to detect and process a differential signal The PICMG 30 specification is targeted at 3125 Gbps signaling with a fundamental frequency of 156 GHz Even in low loss dielectric materials insertion loss at 10 Gbps (5 GHz fundamental) is twice that of a 3125 Gbps signal

Therefore achieving acceptable signal fidelity requires careful management of signal losses and noise in each Channel such that an acceptable signal-to-noise (SN) ratio is achieved at the receiver

The design process therefore begins by understanding and mitigat-ing the sources of losses and noise in each Channel

Sources of lossThere are three sources of loss

n Conductor losses which are due to skin effects and can be addressed by maximizing the cross sectional area of the signal traces

n Material dispersion losses which are a function of the dielectric constants of the chosen material These can be mitigated by choosing a higher performance laminate material such as Nelco 4000-13SI or Megtron

n Reflected power loss due to impedance mismatches in the Channel as each signal transitions across the different copper media in each channel (connectors vias and PCB traces) and passes through the pad and anti-pad structures of the via fields of other backplane blade slots

Table 1 shows the relative effects of different sources of impedance mismatches The dominant source of impedance mismatches in every Channel resides in the via structures Successful mitigation of this problem requires that every via is tuned by back-drilling the stub and adjusting the pad and anti-pad structures to match the impedance to be 50 ohms irrespective of the target routing layer This in turn requires that the capacitive and inductive effects of the connector pin and via barrel combination are taken into account during the design of each Channel

Further complicating via design is the space the anti-pad structures need to accommodate Channels being routed between other blades while minimizing electro-magnetic coupling with them This space consideration makes the shape and orientation of pads and anti-pads extremely important

Figure 1

Table 1

Table 2

Fo Sin Pnt

IEEE 8023ap provides a design targetAs Ethernet has emerged as the industryrsquos dominant signaling methodology the IEEE has developed the 10GBASE-KR norma-tive Channel model to define interconnect Channel performance for NRZ signaling at 10 Gbps This standard defines acceptable performance in terms of S-parameter charts for through-Channel insertion loss and worst-case crosstalk Figures 2a and 2b illustrate masks for Draft 24 of the standard that was initially used for this exercise

In each case the mask defining compliant performance is shown in blue Channel insertion loss is shown in red in Figure 2a Crosstalk performance is defined by the ICR curve (Figure 2b) Minimum acceptable Channel performance is defined in the ICR chart (Figure 2b) by the blue line The effect of the sum of all aggressors on the through-Channel is shown in red The green ICR curve is the ratio of the crosstalk power sum calculated by summing the

magnitudes of any impacting crosstalk Channels for each fre-quency and using a straight line fit (using least-squares method) to determine the resulting average effect f the aggressors on the through-Channel This is then overlaid on the insertion loss and used to plot the ICR curve

This standard which has evolved through a variety of iterations forms the basis for developing a 40 GbE switch fabric backplane featuring 10 Gbps NRZ differential pairs If all differential pairs can meet this standard then the backplane can be considered to be 10GBASE-KR compliant

Applying 10GBASE-KR to a 14-slotAdvancedTCA applicationThe PICMG specification dictates that receive differential pairs are placed on the c-d and g-h rows of the HM-ZD connector and that transmit differential pairs are placed on the a-b and e-f rows Therefore the middle differential pair in row c-d of Slot B will be subject to the NEXT of three aggressors in each of the a-b and e-f transmit rows of slot B plus the FEXT of the signals being received in the c-d pairs in the top and bottom of slot B

In this topology it can be seen that worst-case crosstalk would occur if all the NEXT and FEXT aggressors were routed on the bottom Layer that is on the same Layer as that of the victim c-d However given that all signal vias must be back-drilled and tuned for impedance management purposes Channel crosstalk can simultaneously be reduced by allocating different routing Layers to differential pairs terminated in the same backplane connector

The principal factor in determining the feasibility of a 10GBASE-KR compliant backplane is based on understanding whether the Channel with the worst-case signal-to-noise ratio is compliant

The skew targets determine permissible layer separation between a-b c-d e-f and g-h pairs within each Channel and enable routing Layers to be allocated for each pair It is now possible to start the process of via tuning to optimize the channel performance for minimum insertion loss Modeling begins by defining the simulation boundaries for the channel so that Channel component models (PCB traces connectors vias) can easily be aggregated to model complete Channels Boundaries must be established at locations in the Channel where linear 3D structures exist These are shown in Figure 3 (next page)

Since the connector and via combinations for the backplane and daughtercard mating halves must each be treated as a whole it

PICMG 30Spec

TurboFabricSpec

Total Inter-PairSkew

(Fabric Interface)

05 mm in FR4(34 ps)

001 mmin N4000-13si

(00625 ps)

Total Intra-Channel Skew

(Fabric Interface)

254 mm in FR4(17 ps)

plusmn01 mmin N4000-13si

(0625ps)

Total Intra-Channel Skew

(Base Interface)

135 mm in FR4(90 ps)

plusmn01 mmin N4000-13si

(0625 ps)

Figures 2a and 2b

Table 3

Determining which Channel that is and identifying the worst-case SN requires making trade-offs with regard to PCB material Channel length via design connector row selection and NEXT and FEXT aggressor routing choices These trade-off choices can only take place using advanced 3D simulation tools such as Ansoft HFSS This was the essence of the design process employed in developing Simclarrsquos TurboFabric backplanes

The simulation processThe transmission length for full mesh and dual star backplanes design implementations varies from a maximum of 1632 inches to a minimum of 116 inches With an effective transmission length of 5 inches on each daughtercard this makes the longest effective Channel 2632 inches including two connectors

For a 10GBASE-KR application over this distance a high-perfor-mance laminate is essential for both reducing insertion loss and

ensuring high glass content in the weave to mitigate skew So the design process began by choosing a low-loss dielectric material (Nelco 4000-13SI for both the backplane and the daugh-tercards) and establishing targets for Inter-Pair and Intra-Channel skew as shown in Table 3

Adhering to the PICMG 30 specifi-cation for skew in a 10GBASE-KR application is impractical Instead a target of 00625 ps was set for Inter-Pair skew with 0625 ps set for Intra-Pair skew for the backplane only This equated to a maximum 001 mm differ-

ence being allowed between traces of any differential pair and 01 mm being permitted between traces of any four differential pairs in a Channel Given the topology of the HM-ZD connector daughter-card skew must be accounted for in the daughtercard layout Fo

Sin Pnt

should be noted that the simulation boundary is located within the mated connector

Tuning the connector and via structures to 50Ω is an iterative process involving the removal of excess pads back-drilling and tuning pads anti-pads and traces A Time Domain Reflectometer (TDR) plot illustrating the results of the tuning process is shown in Figure 4

Upon completion of the modeling process a total of 17 different optimized via and routing configurations had been designed for the full mesh design and nine for the dual star design

A plot of worst-case insertion loss is shown in Figure 5 and demonstrates that in both cases performance is well above the 10GBASE-KR mask

When all the through-Channels have been modeled adjacent Channel models can be combined and ICR curves plotted to evaluate the impact of crosstalk on through-Channel performance This valuable information can be used to adjust the position of signal Layers relative to pass-through aggressor traces on adjacent Layers or to reroute traces to reduce crosstalk Similarly routing Layers can be changed to reduce crosstalk in adjacent via barrels

Figure 6 plots worst-case ICR and demonstrates that performance is above the 10GBASE-KR mask Based on this result it was possible to proceed to physical implementation

Figure 3

Figure 4

Fo Sin Pnt

Physical realizationThe layout process was performed using the Mentor Board-Station CAD system Quad-routing (routing four traces between pads) was explored as a routing method-ology in order to reduce Layer count but this was dismissed due to the detrimental impact on crosstalk performance

The attributes of the physical backplanes produced as a result of the design effort are shown in Table 4

The design files produced included the usual gerber files plus detailed back-drilling instructions

The design validation process comprised a conventional continuity test followed by performance testing featuring Agilent equipment including 70340A signal generator 8720ES Network Analyzer NN18A S-Parameter test-set and 86100A sampling oscilloscope with Agilent 86112A module Figure 7 (next page) shows the test set up

Simclar developed special line cards to enable through-Channel measurements with and without crosstalk The signal launch featured compression mount SMAs terminated in a tuned via structure The Channel simulations included simu-lation of the tuned launch structures so de-embedding of the launches was not necessary for correlation to simulation purposes The development team also established a process for characterization of all Channels

Full Mesh Dual Star

Layer Count 34 18

Aspect Ratio 121 61

Tuned Vias 3952 768

Material Nelco 4000-13SI

Table 4

Figure 5 Figure 6

Fo Sin Pnt

In Figure 8 measured through-Channel performance and ICR curves are shown for the same Channels described in the simula-tion section earlier

As can be seen from Figure 8 there is close correlation between these and the simulated plots in Figures 5 and 6 In fact close correlation between all simulated and measured results was achieved resulting in a 728 Tbps capacity full mesh and a 960 Gbps capacity dual star backplane design now generally available as part of the Simclar TurboFabric shelf

Figure 7 Figure 8

Figure 9

Figure 10

Implications of 10GBASE-KR Draft 33versus Draft 25The work described above was targeted towards meeting the Channels specifications contained in Draft 25 of the IEEE 10GBASE-KR Since this work was completed the IEEE has up-issued the Draft revision level for the Standard from 25 to 33 While this has not impacted through-Channel performance demands it has increased Channel isolation requirements by around 10 dB In Figure 9 a Draft 33 mask is added to the ICR plot shown in Figure 8

From Figure 9 it can be seen how Draft 33 pulls the mask above the Channel ICR curve for this full mesh backplane Channel Surprisingly it is the Channelrsquos frequency response at relatively low frequencies between 100-500 MHz that is causing a problem The reasons for this are currently the subject of further detailed investigation

However Figure 10 shows a Draft 33 plot for a less demanding dual star AdvancedTCA implementation featuring shorter trans-mission distances This plot demonstrates compliance to Draft 33 of the IEEE 8023ap 10GBASE-KR Standard

ConclusionBy developing a close understanding of the many factors contrib-uting to loss and noise in multi-gigabit backplane Channels it is possible to characterize their performance using advanced simula-tion techniques and correlate that performance in physical prod-ucts using advanced test methods By overlaying the test results on S-Parameter masks defined by the IEEE 8023ap 10GBASE-KR Standard it has been demonstrated that backplanes that truly enable AdvancedTCA scalability are at last a reality

Douglas Hynd joined Simclar Group in 2006 as Director of Marketing as part of Simclarrsquos acquisition of Northrop Grumman Interconnect Technologies Division wherehe was Vice President of Marketing and Sales He has more than 24 yearsrsquo experience intechnology sales marketing and generalmanagement and holds a BSc (Eng) in Electronics and Electrical Engineeringfrom the University of Glasgow He isbased at Simclarrsquos Global HQ inDunfermline Scotland

Simclar Groupdouglashyndsimclarcom bull wwwsimclarcom

Fo Sin Pnt

6U CompactPCIPrOduCT GuIdE g

This monthrsquos issue includes a 6U CompactPCI Product Guide and Irsquod like to take the opportunity to reflect a bit on the success and evolution of that technology

Back in the 1994 time frame when CompactPCI was first being devel-oped it began as 3U-only technology It used the same Eurocardmechanics that were popularized by VME and an IEC standardized high-

density high-speed connector available from a number of vendors suitablefor 33 MHz PCI signaling That connector was selected by the engineers atZiatech with help from Mike Munroe then at ERNI The majority of VMEdesigns were 6U and based on this I was among a number of folks thatargued for adding the 6U CompactPCI form factor

The 6U form factor presented some challenges and opportunities Onechallenge was that the insertion and extraction forces were quite high when the entire rear of the card was populated with connectors Fortunately the IEEE standards for Eurocards evolved and injectorejector handles that pro-vided leverage became available Eike Waltz then at Rittal was instrumental in bringing that to the table Two of the opportunities that came along withthe extra connectors were a clean way to add secondary buses like the H110 telephony bus to the backplane and the ability to route IO out the rear through rear transition modules PICMG has developed quite a number of subsidiary specifications defining the interoperable use of the extra backplane pins made possible with the 6U form factor Both of these features have played a major part in CompactPCIrsquos success The next major evolution of 6U CompactPCI came with the PICMG 216 Packet Switched Backplane standard which was originally conceived by John Peters and his team at Performance Technologies PICMG 216 interconnected a shelf full of CompactPCI single board computers via redundant Ethernet switches also in the 6U CompactPCI form factor This dramatically increased usable backplane bandwidth and provided redundancy PICMG 216 paved the way for AdvancedTCA and was the industryrsquos first open standard for the switched serial interconnect standards we see popping up in many places

By Joe Pavlat

Looking back and ahead at6U CompactPCI

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Recent 6U CompactPCI related products are listed here For more informationenter the productrsquos RSC No at wwwcompactpci-systemscomrsc

cPCI-6910Dual-core Intel Xeon Processor LVULV Universal blade bull Supports Single Dual-Core Intel Xeon LV or ULV processorsbull Front Side Bus 667 MHz bull Up to 2 GB DDR2 400 MHz soldered SDRAM with ECC bull Four PCI Express GbEbull Up to 4 USB 20 ports bull PICMG 20 21 29 216 compliant

RSC No 35013

ADLINK Technologywwwadlinktechcom

CPCIStor Module6U CompactPCI storage blade bull Onboard ATA controller supports CDDVD HDD and solid-state flashbull Supports Hot Swap Removal (ask about RAID support) bull ATA disks available in Enhanced Dutycycle versions for NEBS Level 3 - 724 requirements bull Operating Systems supported VxWorksLinux and Windows

RSC No 34800

ACTTechnicowwwacttechnicocom

Prosody X cPCI E1T1An E1T1 digital network access card bull Suits telco developers and systems integrators bull Uses Aculabrsquos worldwide protocol coverage including Aculabrsquos SS7 stack available under a cost free license bull Available with 8 or 16 E1T1 trunks and software selectable E1T1 interfaces bull Flexible mix of protocols including ISDN CAS and SS7 (ITU-T China and ANSI) bull A variety of interconnect switching and protocol conversion solutions can be readily crafted bull High availability reliability and scalability with industry standard hardw re and software interoperability bull Up to 128 SS7 signaling links bull Non-circuit related (TCAP) messagingintensive applications such as prepaid and SMS

RSC No 35408

Aculabwwwaculabcom

Adexp8021Intel Core Duo L2400 (166 GHz) w E7520 server chipset bull Dual channel PC2-3200 Registered RAM SECDED or x4 SDDC bull Two GbE two Serial ATA four USB 20 bull Onboard SXGA graphics 1280 x 24-bitbull 6U CompactPCI Bus PICMG EXP0 R10 Specification bull RoHS compliant 0 degC to +55 degC operating range

RSC No 32837

Advanet Incwwwadvanetcojpen

TC84012 channel single-stop Time-to-Digital Converter (TDC) with single-start and multi-start acquisition modes bull 50 ps timing resolution bull Wide range with upto 20 s between first and last events bull Large internal memory buffer with up to 512 hits per channel bull Low jitter (lt3 ps rms) high stability (plusmn2 ppm) internalclock source bull External 10 MHz reference input bull FPGA based Data Processing Unit (DPU) bull Fast readout with DMA mode for increased data throughputbull Overvoltage-protected inputs with 50 Ω K-Lock (LEMO) connectors bull Built-in self calibration bull Modular single-slot 6U PXICompactPCI standardbull Low power consumption (lt22 W)

RSC No 33445

Agilent-Acqiriswwwacqiriscom

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PrOduCT GuIdE6U CompactPCI

MIC-30428-slot 6U CompactPCI backplane bull AC or DC CompactPCI 500 W + 250 W redundant(2+1) power supplies bull PICMG 216 (CompactPCI Packet Switching Backplane) compliancebull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarmmodule (MIC-3924L-AE)

RSC No 32851

MIC-30436-slot 6U CompactPCI backplane bull Supports two hot-swappable SCSISATA or removableIDE HDD bays bull Built-in IDE slim-type DVD-ROM bull AC or DC CompactPCI 250 W + 250 Wredundant (1+1) power supplies bull Supports hot-swappable fan modules bull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarm module (MIC-3924L-AE)

RSC No 32850

Advantech Corporationwwwadvantechcom

Dual-Core Xeon CompactPCI SBCModel PP 42123x bull Dual CPU 6U CompactPCI SBC supporting two dual-core Xeon CPUs bull Up to 8 GB DDR2 ECC SDRAM in a single system or peripheralslot bull Dual processor SBC in a single 6U CompactPCI slot bull Supports two 166 GHz Dual-Core Intel Xeon ULV processors using Intel E7520 server chipsetbull Up to 8 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull PMCXMC site support 66 MHz PCI-X and x8 PCI Express bull Front and rear IO bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade bull Four GbE ports with option for PICMG 216

RSC No 34761

6U CompactPCI Core 2 Duo SBCModel PP 41203x bull 6U CompactPCI Core 2 Duo SBC supporting two PMC sites includingone XMC site bull Up to 4 GB DDR2 ECC SDRAM bull All in a single system or peripheral slot bull TwoPMC sites supporting up to 100 MHz PCI-X bull One XMC x8 PCI Express bull Front and rear IObull Supports 216 GHz or 15 GHz Intel Core 2 Duo processors bull Intel E7520 server chipsetbull Up to 4 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade

RSC No 34763

PP 30202xTwo processor versions available bull 18 GHz Intel Pentium M processor 745 uses mFC-PGA 478 (micro Flip-Chip Pin Grid Array) package bull 14 GHz Intel Pentium M processor Low Voltage 738uses mFC-BGA 479 (micro Flip-Chip Ball Grid Array) package bull 64 KB primary (L1) on-die cache2 MB of secondary (L2) on-die cache bull 400 MHz Front Side Bus (FSB) bull No CPU fan bull 16 GHz processor version (1 MB L2 cache) available see PP 30002x datasheet bull Utilizes 64-bitIntel 855GME chipset bull Supports 400 MHz bus frequency bull Uses Intel 6300ESB IO Controller Hub

RSC No 32659

Concurrent Technologies Incwwwgocctcom

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PrOduCT GuIdE6U CompactPCI

cCIBPMC6U-ETA 6U bridged dual PMC carrier that bridges extended temperature CompactPCI boards and PMCs bull Features a rugged CompactPCI form factor providing increased flexibility to military communications systems designers bull Provides additional design choices to users through its differing bus speeds maximizing the numberof PMCs that can be used CompactPCI andPMC buses can both run at 66 or 33 MHzbull Operating temperature range of -40 degC to+85 degC bull Signal conditioning bull DMA supportbull Low-power design +5 V +33 V +12 V -12 V bull User-selectable VIO of 33 V or 5 V to the PMC

RSC No 32891

Dynamic Engineeringwwwdynengcom

cPCI4IP-MMMinimized PCI address footprint IndustryPack carrier for CompactPCI applications bull 6U 4HP4 IP positions 832 clock selection for each slot fused filtered power IO options bull ID INT IO and Mem spaces are decoded for each IP slotbull Single and double wide IPrsquos bull 16- and 32- bit IPs bull 32-bit access to 16-bit IPs bull Full or mini-mized Memory Space decoding for 18 the PCI address requirement bull With the cPCI4IP-MM option 8 CompactPCI 4IP cards take the same PCI address space as 1 full Mem Space card

RSC No 34905

ACQ132CPCI32 channel MHz class simultaneous sampling intelligent digitizer bull 32 simultaneous analoginput channels 2-32 MSpschannel 14-bit resolution bull Differential inputs bull Intelligent cardwith 1 gigabyte memory and GbE on board bull Large distributed FPGA resource on boardbull Range of DSP functions including FIR filtering and Digital Downconverter

RSC No 35482

D-TACQ Solutions Ltdwwwd-tacqcouk

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CR11Based on the Intel Core Duo Processor the platform is designed to support processor speeds from 106 GHz up to 20 GHz bull Intel Core 2 Duo runs at 15 GHz up to 20 GHz bull Conduction cooled bull Two PMC slots bull PCI Express bull 2x GbE

RSC No 33156

ICS-72532-channel 6U CompactPCI DAC board bull 6U CompactPCI data acquisition card bull 32 differential output channels bull 16 or 24-bit sample size bull 288 kHzch data rate bull Simultaneous sampling across all channels on single or multiple boards bull 32 separate delta-sigma DACs bull 64-bit 66 MHz CompactPCI PICMG 20 Rev30 hot-swappable bull FPDP II 400 MBps interface

RSC No 33576

ICS-71032-channel 6U CompactPCI ADC board bull 6U CompactPCI data acquisition card bull 32 differential input channels bull 216 KHzch 24-bit resolution bull Software selectable full scale input bull FPDP II 400 MBpsinterface bull 64-bit 66 MHz CompactPCI PICMG 20 Rev 30 hot swappable bull 32 synchronous boards for simultaneous sampling bull Sonar acoustics and test and measurement applications

RSC No 33578

Tsumani 6U CPCI Development KitFPGA processor solution targeted at high performance software defined radio applications bull Dual Stratix EP1S80 FPGAs are tightly coupled to provide apower platform for signal processing bull Two PMC module sites provide IO connectivity to either front panel or back panel connections bull A direct highbandwidth 1 GBps path from the PMC P4 connector directly to the FPGAs bull Model 919 Dual DAC Mezzanine provides broadband analog signal generationin a compact form bull The board features two independent DAC channels each with its own 12-bit LVDS input capable of running at rates up to 160 MHz

RSC No 32026

CP11Rugged 6U SBC bull Up to 4 GB of DDR2 SDRAM (200 MHz) with enhanced ECC four independent onboard PCI buses system host and peripheral modesupport for the CompactPCI backplane two PMC interfaces (64-bit133 MHz and 32-bit33 MHz) bull Instead of the PMC1 a PCI Express based XMC interface is available on request bull Two GbE one Fast Ethernet two serial interfaces (RS-232 or RS-422485) USB 20 integrated HDD or flash drive bull High performance 2D3D ATI video controller capable of driving two displays in parallel supports VGADVI interface bull Intel Core 2 Duo at 216 GHz Intel Core Duo at 20 GHz2x PMC expansion site bull One XMC optional bull Up to 4 GB DDR2 SDRAM wECC 2x GbE

RSC No 33447

GE Fanuc Intelligent Platforms Incwwwgefanucembeddedcom

Single Board ComputersGD Canada designs and manufactures conduction-cooled Single Board Computers (SBCs)using Intel processors bull 6U and 3U form factors for CompactPCI backplanes bull Fully backward compatible with earlier models bull Upgradeable via the change-out of processor memory andIO modules bull Used within GD Canada computer systems and sold as individual products

RSC No 35281

General Dynamicswwwgdcanadacom

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PrOduCT GuIdE6U CompactPCI

cPCI6U-24DSI32R32-channel 24-bit delta-sigma CompactPCI 6U analog input board with rear IO bull Low noise 24-bit resolution low phase distortion andmulti-board synchronization bull Suits state-of-the-art sonar and noise monitoring applications bull 32-channel cPCI6U-24DSI32 analog input boardprovides a high-density 24-bit analog input resources on a standard 6U CompactPCI expansion board bull Applications from precision voltagemeasurements to complex audio signal and waveform analysis

RSC No 34985

General Standards Corporationwwwgeneralstandardscom

Duet 3U 64-bit 1 GHz TMS320C6416 DSP (x2) 64 MB SDRAM per processor bull Flexible internalexternalcommunication mesh bull 64-bit66 MHz CompactPCI bull PMCXMC site with Jn4 to FPGA and4 RocketIO per VITA 42 bull External data port up to 12 Gbps bull 4M or 5M Virtex-II Pro FPGAbull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM dedicated800 MBps links between DSPs bull 3U CompactPCI with PXI support bull Suits high-end co-processing wireless broadband communications RADAR video and biometrics

RSC No 32856

QuadiaQuad-DSP bull Dual FPGA bull Dual PMC sites bull Inter-processor connectivity and access to external interfaces bull Four C6416 DSPs split in two independent clusters each hosting a PMC site bull One large FPGA for end-user code bull Central FPGA routing interprocessor communication bull End-user FPGA communication bull External port serial IO for PCIe or other p ivate link bull Global memoryand PCI interface bull 1 GHz TMS320C6416 DSP (x4) bull 64 MB SDRAM per processor bull Flexible internalexternal communication mesh bull 64-bit66 MHz CompactPCI bull Two PMC sites with Jn4 to FPGA bull External data port up to 12 Gbps bull Two 4M Gate FPGA reserved for end-user code bull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM bull Up to 512 MB Global DDR SDRAM bull Suits high-end co-processing wireless and broadband communications

RSC No 34737

Quixote 64-bit 6UAdvanced signal capture generation and co-processing bull 1 GHz TMS320C6416 DSP and2 to 6 MGATE Virtex-II FPGA bull 32 MB SDRAM 8 MB ZBT SBSRAM and AD6645 and AD9764 converters bull 6432 bit CompactPCI 66 MHz 5 V33 V and complex trigger modes with HW event logging bull PMC site with Jn4 to FPGA DIO and PICMG 217 StarFabric compliant bull Suits Software Defined Radio wireless IP and RADAR development and hardware testing bull Physical Layer field testing ultra-fast flexible data acquisition vector signal generation and electronic warfare

RSC No 32861

Innovative Integrationwwwinnovative-dspcom

IC-e6-cPCIbHigh performance 6U CompactPCI board bull Powered by one or two of Freescalersquos mostadvanced 14 GHz MPC7448 PowerPC processors bull PICMG 216 compliant bull Marvell Discovery III chipset (MV64460) bull Low power consumption bull Standard extended and rugged grades

RSC No 32982

Interface Conceptwwwinterfaceconceptcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CP213Single-width 6U CompactPCIPXI module with either 32 or 64 differential analog input channelsbull 32 64 or 128 channels of analog input bull 16 multifunction digital IO (TTL) channels that may beconfigured as digital in digital out or selectively attached to 2 frequency in 2 counter in andor 2 timerout channels bull 16-bit resolution bull Programmable gain per channel programmable scan rates of lt1 Ss through 100 KSs bull Precision onboard reference for end-to-end calibration

RSC No 34804

KineticSystems Company LLCwwwkscorpcom

CP6001Energy efficient embedded Intel dual core processors bull 12 GHz Intel Core Duo U2500 ULV processor bull Intel Core 2 Duo L7400 LV processor bull Based on the Intel Mobile 945GM chipset with a front side bus of up to 667 MHz and ICH7-R Southbridge bull Two independent digital video outputs to the rear IO (2x DVI - 1x DVI and 1x HDMI) bull AC97 audio capabilities bull 3 x GbE bull 4 x SATA with RAID 01510 functionality bull 6 x USB 20 2 x COM and VGA or DVI bull Can also accommodate a PMC slot or an onboard 25 inch SATA HDD bull Up to 8 GB of USB or 2 GB soldered flash bull Supports Linux Windows XP XP embedded and VxWorks 6

RSC No 34182

CP6923 GbE Switch6U CompactPCI GbE Switch PICMG 216 compliant bull Leading edge te hnology basedon BCM5650X chip bull 24x GbE ports bull Non-blocking Layer 2 and 3 switching and routingbull Copper optical rear IO version bull Hot swap IPMI bull Fully managed bull Comprehensive firmware package bull Applies to VoIP installations such as call servers media gatewaysand trunking gateways in wireline and wireless networks as well as VoIP systems inenterprise networks with high demands on performance

RSC No 32256

Kontronwwwkontroncom

TMS320C6701 Virtex-IITexas Instrumentsrsquo C6701 DSP bull Xilinx Virtex-II series FPGA up to XC2V8000 bull Multiple IO interfaces Onboard CODEC VIM expansion sites 60-pin GPIO header and JTAG bull Hardware drivers integration in SimulinkXilinx System Generator Blocksets for quick implementation of Simulink models bull DSP and FPGA-in-the-loop cosimulation of SimulinkXilinx System Generator models bull Leading edge communication interface allowing real-time datamonitoring from Simulink scopes and remote operations

RSC No 32028

VHS-DACHigh performance multichannel DA for phased array antenna systems radarsonar communications receiversup-sampling to IF stage and RFIF AGC apps bull Eight 125 MSPS output channels bull Optional add-on daughter boardprovides 8 additional output channels or 8 additional input channels bull 32-bit 25 MHz bull FPDP interface with 400 MBps transfer rate (25 MSPS per channel at 8 channels 125 MSPS at 16 channels) bull Low level hardware drivers API andGUI bull High level hardware drivers integration in Simulink Blocksets bull Leading edge communication interface fordata recording and playback tofrom the onboard SDRAM

RSC No 32029

Lyrtechwwwlyrtechcom

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PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

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PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

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SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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Page 12: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

not provide the high-level configuration and lawful surveillance messages required of the Mediation Function SII uses low-level SNMP MIBs that control MAC and IP address configuration commands which in turn trigger the Cisco SII device to send packets matching the configuration to a span port where the Mediation Function can use these matched packets to generate the lawful surveillance messages So SII provides a first-level filter for the Mediation Function which supplies a high-level configuration interface at the warrant description level as well as creation of the CBIS (or ATIS) messages to be sent to the BIF

CBIS-compliant productsThe CBIS specification is quite new so released products are mostly on the hori-zon However the IP Fabrics DeepSweep Lawful Surveillance product line does provide MF andor BIF functionality for the implementation of CBIS-compliant networks Dr Myers noted that the DeepSweep product line is based on a flexible architecture and a highly parallel processing environment comprised of many software surveillance modules that can be loaded and chained within the DeepSweep to provide a number of Layer two to seven surveillance and packet analysis activities The device is programmed through a GUI and operates as a full Mediation Function with the ability to identify subscriber-related IP address assignment and resulting traffic from a span port The DeepSweep also has software support to communicate with SII enabled routers and CMTS sys-tems to provide a fully compliant ATIS andor CBIS surveillance environment compatible with Cisco lawful intercept and QoS services

CBIS BIF and ATIS buffering appliances are also available to provide buffering compliant with CBIS and ATIS standards

ConclusionCyber crimes such as identity theft child pornography chat-room initiated abduc-tion national security and piracy are very real and growing issues in todayrsquos society Billions of corporate and personal dollars have been tied to cyber crooks that abuse the Internet to participate in these activities It is essential that these illegal activities can be identified and stopped It is a good idea to be aware that the cable industry and its proactive support of lawful surveillance standards as well as rolling out equipment that implements these standards will in turn enable law enforcement to catch these cyber crooks and make the Internet a safer place for us and our children to live learn and work

For more information on this or any Software Corner contact Curt atcschwadereropensystems-publishingcom

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APPLICATION g

Based on current overall network growth Telecom Equipment

Manufacturers (TEMs) and Network Equipment Providers (NEPs)

are being challenged to launch new communications platforms

that provide optimal scalability flexibility manageability and

high computing performance With the expected increase in new

subscribers who need to be supported across the network TEMs and

NEPs are focusing on COTS platforms that meet the requirements of

a carrier-grade environment

With these new challenges it is important to take a look at the different

applications in the network to thoroughly evaluate the best hardware

platform approach Comparing the scalability IO functionality

interconnectivity and overall performance gives TEMs and NEPs a

solid basis from which to choose the best cost-effective solution for

their applications This article compares the traditional 1U PCI

platform with a more modular AdvancedTCA-based approach to

a Home Subscriber Server (HSS)-based platform

Emerging next-generation network architecture IMS Carriers and service providers are focused on improving their Average Revenue Per User (ARPU) by deploying new services quickly and at a price that is acceptable to subscribers IP Multimedia Subsystems (IMS) enable service providers to offer differentiated services to their subscriber base integrating voice video text and content as part of their service mix regard-less of the access technology

The IMS framework provides the telecom industry with a modular standards-based IP service delivery infrastructure More than simply replacing existing circuit services with similar services delivered over IP IMS allows service providers to capitalize on faster and more cost-effective deployment of new and differentiated multimedia communication services

While these new technologies promise new sources of revenue and enhanced customer loyalty they also pose implemen- tation challenges One of the crucial net-work elements within an IMS framework is the manageability of the subscriber base Today an increasing number of users subscribe to multiple services such

By Sven FreudenFeld

Choose the right formula forcompute-intensive HSS systems

AdvancedTCA platforms

versus1U PCI rack-mount servers

AdvancedTCA

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as multimedia mobile phones VoIP or IPTV at home Service providers must manage ldquoduplicatedrdquo subscriber databases for each particular service Consequently managing a converging subscriber base for such network functions as billing across multiple different technologies presents a tremendous challenge Any downtime of this network element can be costly to the carrier or service provider not to mention the heavy risk of losing subscribers over the long term

The HSS and Home Location Register (HLR) are key elements in the IMS network required to manage the growing number of subscribers These platforms that manage millions of customersrsquo data need to be highly reliable with carrier-grade High Availability (HA) functionality Core requirements for the HSS computing platform are

n High compute density for application processingn Scalable performance and high densityn Fast read access to the subscriber datan Large storage and memory bandwidthn Ability to consolidate multiple IMS elements and subscriber data within a single

platform with a modular approach as a converged services platform

HSS plays network backbone roleHSS provides the important network backbone of the IMS architecture because it eases innovation and addresses a range of service-logic interaction issues that have plagued previous service architectures HSS offers open access to service-related data for each subscriber supporting the sharing of data among multiple services

HSS is essentially the master user database that supports IMS network entities that handle calls and sessions It contains user profiles performs authentication and authorization of the user and can provide information about the physical location of the user It plays a key role in provisioning service creation enabling subscriber data and managing control roaming and interconnection The Application Server (AS) which hosts and executes serv- ices in the IMS environment communicates with the HSS Call State Control Function

(CSCF) servers also communicate with the HSS which must be able to

n Support IMS-level authentication and authorization

n Maintain IMS subscriber profile(s) independent of access types

n Maintain service-specific datan Keep track of currently assigned

CSCFn Support CSCF and AS access

HLRHSS hardware platform design choicesHSS design must enable the HSS to be deployed cost-effectively and expand readily to meet future subscriber levels For example the trend to include more information as part of the data record for each subscriber will drive up memory requirements

From a technical perspective the key metrics to understand when developing the IMS HSS functions are the number of completed transactions required per sec-ond and the size of the subscriber base

HSS architecture typically comprises multiple processor units with extensive memory requirements With the introduction

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of multicore processors from Intel developers can scale performance while optimizing power consumption in the overall system design

To meet these requirements the hardware platform needs to provide scalability flexibil-ity and long-term cost efficiency In comparing the traditional 1U platform with a more modular approach to the HSS using AdvancedTCA consider the following

n High compute performance n High memory and storage capabilityn IO functionality to connect to multiple networks (such as SS7 and Ethernet)n Carrier-grade profile and redundancy

AdvancedTCA High density with scalability on a smaller footprintTable 1 illustrates a comparison of a sample AdvancedTCA-based platform and a 1U PCI rack-mounted platform for HSS applications This configuration assumes an increasing subscriber growth from 1 million (M) subscribers to 18M subscribers per platform

FootprintAdvancedTCA-based platforms provide a high density compute platform with scalability on a smaller footprint TEMs can easily add boards to a chassis to accommodate more traffic and to support new services This flexibility enables an increase in subscribers and the database without having a major impact on rack space in the central office environ-ment To meet the same capacity for 18M subscribers the 1U PCI approach will occupy two bays or cabinets with a total footprint of 28 square feet compared to the same capacity occupying one bay or cabinet with a footprint of 14 square feet (see Figure 1)

CoolingWhile the power consumption per square foot is higher than the 1U PCI platform AdvancedTCA offers better airflow and cooling distribution using a push-pull cooling system Each 1U PCI platform includes up to nine cooling fans and is dedicated to that CPU in the 1U server only which translates into higher overhead Therefore the airflow is

not optimized in the overall system design In the case of a fan failure AdvancedTCA platforms enable easier access to replace the fans which are field replaceable units The 1U platform also does not include any integrated centralized switching or management capabilities therefore the total does not include any switching or system management functionality

ScalabilityAdvancedTCA architecture lends itself well to scalability As AdvancedTCA sup-ports both a Base and Fabric interface into the backplane and the separation of data and control planes TEMs can also scale up their designs from 1 GbE to 10 GbE to accommodate new users and usage requirements AdvancedTCA based systems are designed for easy upgrade-ability to new processing blades switch fabrics and IO modules using Advanced Mezzanine Cards (such as SS7)

Since AdvancedTCA and AdvancedMCs offer hot swap capabilities and HA func-tionality growing a subscriber base by using additional CPU blades within the system with low maintenance or upgrade downtime is crucial for the HSS plat-form It also allows for the up and down

AdvancedTCA-based HSS Platform 1U PCI Rack-Mount HSS Platform

Number ofsubscribers

~1M subscribers = 4 CPU blades edundant ~1M subscribers = 4 x 1U

~4M subscribers = 7 CPU blades redundant ~4M subscribers = 7 x 1U

~6M subscribers = 12 CPU blades redundant ~6M subscribers = 12 x 1U

~18M subscribers = 36 CPU blades redundant= 3 AdvancedTCA shelves per rack

~18M subscribers= 36 x 1U+ external switch components for redundancy

Technicalspecs

1 CPU blade = 2 x Intel Xeon dual core = quad core 1 1U rack-mount Intel= Intel Xeon quad core or dual core CPU

16 G DDR 2 memory Max of 8 G DRY memory

+ 2 x SATA or SASS hot swap (RAID 0 and 1)+ 1x PCI Express for SS7 Dual GbE per 1U rack-mount server

4 x GbE per CPU with built in GbE backplane switching separating Control Pathand Data Path with multishelf expandability

External central switching required withmultiple external GbE connectivity

Systems and blade manageability built into the platform withIMP implementation SNMP and CLIP

Carrier-grade redundancy on switch and node

IO for SS7 or other interface modules

CPU blade hot swap capability

Thermaland power

requirements

~6M subscribers redundant= 14 slots with centralized chassis cooling

~6M subscribers redundant= 18 x 1U PCI with independent cooling and separate switch units and system management

Total power consumption= ok (3100 W for blades and RTM + 500 W Shim fan tray and SAP)

Total power consumption= ok

Table 1

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scaling of the platform depending on the subscriber increase or decrease When consolidating multiple services minimiz-ing multiple duplicate databases requires this flexibility

InterconnectivityThe AdvancedTCA platform offers a number of interconnectivity features including

n Separation between the data plane and the control plane

n Direct uplink in a multichassis envi-ronment with up to l0 GbE

n Node to node base and fabric connec-tivity with HA carrier-grade Ethernet functionality

n Easy upgrade path to l0 GbE for increased bandwidth

By contrast the 1U PCI platform requires

n Additional external interconnectiv-ity between 1U rack-mount servers which increases the number of points of failures and the operating and maintenance costs

n Additional switching equipment for carrier-grade Ethernet connectivity

n Additional manage-ment (Simple Network Management Protocol [SNMP]) for HA redundancy

PowerThe 1U-based platform also utilizes integrated AC power supply units usually the standard for the data center and enter-prise environments AC will increase the pro-viderrsquos OPEX in the long term since the power consumption per rack is significantly higher and

Figure 1

requires additional support equipment such as an Uninterruptible Power Supply (UPS) and an AC to DC converter per rack space and ultimately per CPU These factors along with the requirements for carrier-grade functionality HA support and a more favorable long-term OPEX further reduce the need to consider the 1U solution for HSS deployments in Central Office networks

ManageabilityAdvancedTCA chassis-level management is based on the industry-standard Intelligent Platform Management Interface (IPMI) IPMI makes possible interoperability among chassis and blowers compute nodes switches and management solutions from multiple vendors enabling these elements to work together seamlessly The resulting successful inter-blade communication for applications including failover and clustering provides full manageability on a per shelf and per bay basis

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One of the primary goals of the AdvancedTCA specification is to ensure a very low Mean Time to Repair (MTTR) and high Mean Time Between Failures (MTBF) There are no active components in the backplane ndash which can translate to expensive repairs in the field In addi-tion AdvancedTCA specifies that all com-ponents can be hot swappable in the field and the architecture provides redundancy at all levels This hot swap capability translates to less downtime for field replacement on a per CPU blade basis as compared to 1U PCI

SummaryAdvancedTCA provides an ideal platform and meets the technical requirements for deploying flexible and scalable IMS HSS applications While other platform archi-tectures such as 1U rack-mount servers may with considerable difficulty be able to deliver HSS capabilities AdvancedTCA offers a much more advantageous solution by providing a smaller footprint improved cooling and thermal characteristics bet-ter scalability enhanced interconnectivity and easier manageability This all contrib-utes to making AdvancedTCA a lower cost approach in terms of CAPEX and OPEX for long-term subscriber growth

1U PCI rack-mount servers are not considered to be the optimal hardware platform for HSS applications in a Central Office With its limitation for carrier-grade flexibility and HA functionality the 1U PCI platform is best suited for a full range of other enterprise and Internet infrastructure applications within a data center environment that does not require any significant flexibility and HA functionality around it It might also be a good entrance point for other enterprise applications with lower price points

The use of AdvancedTCA-based platforms enables TEMs to shift away from hardware development and refocus their efforts on delivering value-added software and services As a result they can realize lower development costs and faster time-to-market enabling increased flexibility with each product design through the use and reuse of standardized off-the-shelf components Equally significant are the advantages that can be realized by the service provider With a common platform and a flexible architecture that maximizes limited floor space service providers can rapidly and flexibly implement a broad range of feature-rich solutions for faster profitability

Sven Freudenfeld is responsible for North American Business Development for the Kontron AG line of AdvancedTCA AMC MicroTCA and Pre-Integrated Solutions Sven possesses more than 15 years of experience with voice data and wireless com-munications having worked extensively with Nortel Networks in Systems Engineering Sanmina-SCI in Test Engineeringand Deutsche Telekom in Network Engineering Sven holdsan electrical engineering degree from Germany and is also Chair of the CP-TA marketing workgroup focusing on the interoperability of COTS standard building blocks

Kontron bull svenfreudenfeldcakontroncom bull wwwkontroncom

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TECHNOLOGY g BACkpLANES

Increasing demand for service and multimedia features is stimulating a growing need for speed in telecom-munications equipment While some

applications such as PBX systems can be addressed with the gigabit backplane technologies currently available others are running out of headroom Routers may soon need 10 Gbps and higher speed back-planes to keep up with network demand Many such applications can justify the expense of moving to higher performance if it becomes available

Currently telecom system designs offer backplanes that can handle interconnec-tions running as fast as 3125 Gbps raw data throughput per lane (with around a maxi-mum data rate capability of 5-625 Gbps per lane) The AdvancedTCA standard for instance uses Ethernetrsquos XAUI inter-face AdvancedTCA achieves a 10 Gbps net data rate by running four serial lanes for each interconnection with each lanersquos

SERrializerDESerializer (SERDES) op-erating at 3125 Gbps raw data (25 Gbs net)

As demand forces systems to move beyond these rates however new technologies will be needed One proposal calls for the use of XAUI+ or double XAUI which increases lane SERDES rates to 625 Gbps per lane and hence the throughput to 20 Gbps Another proposal is to use IEEE 8023ap known as 10GBASE-KR which runs a single SERDES lane at 125 Gbps raw data rate (103 Gbps net) But these are only short-term answers To address future demands organizations such as the Institute of Electrical and Electronic Engineers Standards Association (IEEE-SA) are developing specifications for Ethernet speeds of 40 Gbps to 100 Gbps which will be applied to backplane interconnect

Such high clock rates however will pose significant design challenges for developers

One of the first challenges that will need resolution is the design and layout of the backplane and other PCBs Common design practice today readily handles board clock rates of around 10 Gbps Well established design rules are in place and board layout tools such as autorouters can automatically handle board designs for speeds in the 10 Gbps range Designers may use specialized board material create additional ground planes and perform similar tasks in order to ensure proper board operation at the higher end but even speeds to 5 GHz are within current design tool capabilities

Design gets trickierAbove 5 GHz however board design gets more involved because feature dimensions become significant when compared to the signalrsquos wavelengths Variations in board thickness can affect signal propagation Corners where traces change direction and small spurs along edges of poorly etched

Channel characteristics

challenge backplane interoperability

Serial backplanes in telecommunications systems aim for high speed with room for

growth As systems began using 10 Gbps links however issues arose that affected backplane

communications among cards from different manufacturers Stuart points out that the

industry must define key backplane channel characteristics so that designs based on open

standards maintain interoperability as backplane speeds move to 40 Gbps and beyond

By Stuart JamieSon

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traces can act as antennae for the higher fre-quencies in digital signals As can be seen in Figure 1 sharp corners and minor flaws that are inconsequential at lower frequen-cies have the potential to become trouble-some antennae at future high speeds This can result in the trace radiating away the signalrsquos high frequency energy increasing EMI and crosstalk as well as altering signal waveforms New routing design rules such as making corners 30deg instead of 45deg and more careful board fabrication techniques may become necessary as designs move above the 10 Gbps per lane threshold

The move to higher frequencies will affect more than board fabrication and layout however Higher frequencies will also impose new requirements on signal tim-ing signal rise-time electrical distance and waveform shape if developers are to retain the mix-and-match system design approach that makes standards-based system design effective

For interoperability to be achievable at data rates above 10 Gbps organizations such as PICMG will need to carefully define a vari-ety of signal and design parameters in their specifications Some of the key parameters that will need consideration include

n Interconnect signal attenuationn Eye diagramn Jittern Input clock recoveryn Chip inputoutput pre-emphasis (PE) n Equalization (EQ)

Even slight variations in these parameters from device to device and lane to lane can shift the timing of signals a significant fraction of a clock cycle and affect the Bit Error Rate (BER) of a lanechannel Finally signal rise times will require tight control as signal rates increase in order to ensure control of system timing (see Figure 2)

In defining signal and design parameters specifications will also need to account for the increased location dependency that comes with higher frequencies Even subtle differences in attributes such as routing length and trace impedance become increasingly significant as signal speeds rise To ensure mix-and-match interopera-bility then design specifications may need to account for the specific backplane slot that a board is to occupy as well as introduce a method to obtain and control the PE and EQ of the devices connected to the lanes

Designers must also address fabrication standards The material used to fabricate

Figure 1

Figure 2

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the board the thickness and composition of metal cladding and the spacing between layers can all affect the trace characteris-tics Controlling these parameters under specification ensures that timing charac-teristics are sufficiently uniform from one board to another However current speci-fications are too detailed and stringent It is extremely difficult to attain compliance yet avoid adding cost to the design

Specifications need workSome of these parameters are already incorporated into current specifications The AMC module specifications from PICMG for instance include design parameters that ensure its proper opera-tion at signal speeds as fast as 125 Gbps per lane Establishing specifications for other system components will help achieve interoperability of standards-based designs at higher frequencies

Design tools may also need to be modified and the industry will need to create new design rules for high frequency and incor-porate these into the tools Developing new routing techniques will help avoid the issues of electrical phenomena such as skin effect dielectric loss and impedance mismatches These are much more preva-lent at higher frequencies and it becomes critical for engineers to model and simu-late these phenomena more accurately

Early efforts are already underway to address the challenges that higher fre-quency signals bring to standards-based design The Interconnect Channel Characterization Subcommittee of PICMG established in September 2006 is develop-ing ground rules and definitions to be used in characterizing transmission reflection and crosstalk performance in backplane and mezzanine carrier interconnects The committee aims to define the channel parameters to be measured or analyzed as well as the methods for doing so Its charter calls for it to address

n Definition of interfaces at which measurements are made or characteristics computed

n Test equipment fixtures and PCB test coupons

n Details of measurement proceduren Data formatsn Techniques for de-embedding

components of the channeln Techniques for validating

measurement based models ie passivity and causality

n Definitions that allow reasonable compliance testing

n Boundary definitions for different paths

n Define information regarding limita-tions or proper usage ie maximum data raterise times that are supported by the models

Such efforts are only a beginning how-ever Other design details still need to be addressed such as SERDES IO Configuration New functionality may need to be defined The design of high data rate system channel interfaces according to standardsspecifications does not currently cover the individual characteristics of the chip transmitterreceiver characteristics Thus work will be needed to address how such standard designs handle such dependency

Crossing an interoperability thresholdOne way of handling location dependen-cies might be to give the system control-ler the ability to inform modules what the channel transmitter and receiver PE and EQ technology is and importantly how to control it With this information along with the signal attenuation suffered (at a given bit rate) for the channel the system should be able to configure SERDES channels in different physical locations to run reliably and at the required BER In MicroTCA systems for instance this functionality could be incorporated into the MicroTCA Carrier Hub (MCH) as part of its electronic keying function Modules would have to be able to configure and control its backplane interfaces to allow for different positions

in the backplane An MCH (see Figure 3 courtesy Emerson) then would be able to instruct a module as to which parameters to use for interoperability

The specific approaches needed to handle location dependencies and other challenges that higher signal rates raise have yet to be developed The need to address these challenges however is clear Increasing demand for services is driving applications to utilize faster signal rates This in turn is driving backplane signaling speeds ever higher As speeds rise above 10 Gbps sig-nals will cross a threshold where current specifications will prove inadequate for ensuring interoperability among standards-based designs

The industry should begin developing new or enhanced specifications and design tools to address the challenges of higher signal rates Without such improvements the guarantees of interoperability that allow system developers to readily create solu-tions by combining off-the-shelf products will be compromised As backplane speeds approach 100 Gbps nothing can be taken for granted

Stuart Jamieson Director of Industry RelationsArchitect with Emerson Network Power Embedded Computing represents Emerson on PICMG committees and the SCOPE organization and previously served as a CP-TA Board member (Treasurer) He brings over 18 years of experience in hardware protocols embedded software and specification development to these groups Within Emerson he played a key role in the develop-ment of the technology central to Emersonrsquos bundled network-ing solutions Stuartrsquos positions within Emerson have included Director of Business Development Director of Advanced Technology and Architect He is the Draft Editor for the PICMG Interconnect Channel Characterization Subcommittee is the author of the introduction section for the new PICMG Ruggedized MicroTCA specification and served as the Draft Editor for the PICMG MicroTCA Specification Stuart gradu-ated from the Heriot-Watt University in 1989 with a 1st Class Honors degree in Electrical and Electronic Engineering and again in 1992 with an IBM-sponsored Master of Philosophy

Emerson Network Power Embedded ComputingStuartJamiesonEmersoncom bull wwwemersonembeddedcomputingcom

Figure 3

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TECHNOLOGY g BACkpLANES

2008

B A

N D

W I

D T

H

Signal integrity challenges to bandwidth scalabilityFor the purposes of this article each interconnected differential pair will be referred to as a Channel (which should not be confused with an aggregated AdvancedTCA channel comprising four trans-mit and four receive pairs)

14-slot full-mesh AdvancedTCA backplanes contain hundreds of Channels Each Channel is defined as the copper signal path from the output of a driver device to the input of a receiver device As

By douglaS Hynd

Developing IEEE 8023ap 10GBASE-KRcompliant backplanes

Why doesAdvancedTCA

need bandwidthscalability

PICMG AdvancedTCA 30 has emerged as the

industryrsquos Hardware Platform standard of choice and

is enjoying first-phase deployment However many

believe that for AdvancedTCA to realize its market

potential AdvancedTCA platforms need to seamlessly

scale to accommodate 40 GbE fabrics thereby

avoiding forklift upgrades as system bandwidth

demands increase over time A 40 GbE switch fabric

architecture would enable realization of a common

platform for computing storage control and media

and packet processing and provide the versatility and

long term ROI required by service providers in

todayrsquos increasingly competitive environment

The challenge was to develop a family of

AdvancedTCA products which feature PICMG 30

compliant dual star and full mesh advanced

backplane switch fabrics enabled up to 10 Gbps

per differential signal pair thereby giving 40 Gbps

per AdvancedTCA channel performance

This article describes the signal integrity challenges

presented in designing an IEEE 8023ap

10GBASE-KR-compliant bandwidth-scalable

14-slot AdvancedTCA platform and how these

challenges were overcome in development of full

mesh and dual star backplane reference designs

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shown in Figure 1 that signal path comprises a signal launch a blade PCB transmission line a daughtercard via a right-angled HM-ZD connector a mated HM-ZD backplane header a back-plane via a length of backplane PCB transmission line and then the same combination of connectors vias and transmission line at the receive end of the Channel

Sources of crosstalkFour principal sources of crosstalk in each Channel must be man-aged as shown in Table 2 Source number one is between adjacent differential pairs as they are routed across the backplane Common mode noise rejection in system differential pair structures makes this a minor issue The second source of crosstalk lies in the HM-ZD connector itself

Crosstalk in via fields our third source primarily arises from inductive coupling between adjacent differential pairs and domi-nates the crosstalk agenda in high-speed Channels This source of crosstalk is directly proportional to the length of the via barrel and where practical care must be taken to ensure that adjacent connector rows are terminated to different target routing Layers

The final source of crosstalk is caused by aggressor signals in through-routed via fields coupling with victim Channel traces as they pass through As mentioned earlier judicious and careful design can mitigate this impact

Skew Channel skew is a function of differential transmission path geometries At a fundamental frequency of 5 GHz skew can be a significant issue in high-speed system design due to narrowing the eye opening and increasing jitter Skew can have a significant impact on crosstalk it negatively impacts the common mode rejection of noise inherent to differential signaling Conductor surface roughness in lower performing dielectric materials can also cause skew in high-speed systems

Skew can be avoided through careful management of transmission path lengths in each Channel and by using higher-glass content (lower Dk) laminates

LossPotential

Potential Mismatches

Channel

Loss Potential Channel

PCB Tolerance -025 dB 2 -01 dB

Connector Tolerance -001 dB 4 -016 dB

Thru-routed Via Fields -001 dB 12 -144 dB

Connector Launch -025 dB+ 4 - 2 dB+

Quantity TotalNEXT

TotalFEXT

PCB Transmission Lines

24 in60 cm

-50 dB -70 dB

Connector Architecture 2 -26 dB -24 dB

Via Fields 4 -22 dB -20 dB

Connector Pass Through 8 -34 dB ndash34 dB

For the target application each one of these Channels must deliver a 10 Gbps Non-Return-To-Zero (NRZ) signal with sufficient signal fidelity to enable a receiver device to detect and process a differential signal The PICMG 30 specification is targeted at 3125 Gbps signaling with a fundamental frequency of 156 GHz Even in low loss dielectric materials insertion loss at 10 Gbps (5 GHz fundamental) is twice that of a 3125 Gbps signal

Therefore achieving acceptable signal fidelity requires careful management of signal losses and noise in each Channel such that an acceptable signal-to-noise (SN) ratio is achieved at the receiver

The design process therefore begins by understanding and mitigat-ing the sources of losses and noise in each Channel

Sources of lossThere are three sources of loss

n Conductor losses which are due to skin effects and can be addressed by maximizing the cross sectional area of the signal traces

n Material dispersion losses which are a function of the dielectric constants of the chosen material These can be mitigated by choosing a higher performance laminate material such as Nelco 4000-13SI or Megtron

n Reflected power loss due to impedance mismatches in the Channel as each signal transitions across the different copper media in each channel (connectors vias and PCB traces) and passes through the pad and anti-pad structures of the via fields of other backplane blade slots

Table 1 shows the relative effects of different sources of impedance mismatches The dominant source of impedance mismatches in every Channel resides in the via structures Successful mitigation of this problem requires that every via is tuned by back-drilling the stub and adjusting the pad and anti-pad structures to match the impedance to be 50 ohms irrespective of the target routing layer This in turn requires that the capacitive and inductive effects of the connector pin and via barrel combination are taken into account during the design of each Channel

Further complicating via design is the space the anti-pad structures need to accommodate Channels being routed between other blades while minimizing electro-magnetic coupling with them This space consideration makes the shape and orientation of pads and anti-pads extremely important

Figure 1

Table 1

Table 2

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IEEE 8023ap provides a design targetAs Ethernet has emerged as the industryrsquos dominant signaling methodology the IEEE has developed the 10GBASE-KR norma-tive Channel model to define interconnect Channel performance for NRZ signaling at 10 Gbps This standard defines acceptable performance in terms of S-parameter charts for through-Channel insertion loss and worst-case crosstalk Figures 2a and 2b illustrate masks for Draft 24 of the standard that was initially used for this exercise

In each case the mask defining compliant performance is shown in blue Channel insertion loss is shown in red in Figure 2a Crosstalk performance is defined by the ICR curve (Figure 2b) Minimum acceptable Channel performance is defined in the ICR chart (Figure 2b) by the blue line The effect of the sum of all aggressors on the through-Channel is shown in red The green ICR curve is the ratio of the crosstalk power sum calculated by summing the

magnitudes of any impacting crosstalk Channels for each fre-quency and using a straight line fit (using least-squares method) to determine the resulting average effect f the aggressors on the through-Channel This is then overlaid on the insertion loss and used to plot the ICR curve

This standard which has evolved through a variety of iterations forms the basis for developing a 40 GbE switch fabric backplane featuring 10 Gbps NRZ differential pairs If all differential pairs can meet this standard then the backplane can be considered to be 10GBASE-KR compliant

Applying 10GBASE-KR to a 14-slotAdvancedTCA applicationThe PICMG specification dictates that receive differential pairs are placed on the c-d and g-h rows of the HM-ZD connector and that transmit differential pairs are placed on the a-b and e-f rows Therefore the middle differential pair in row c-d of Slot B will be subject to the NEXT of three aggressors in each of the a-b and e-f transmit rows of slot B plus the FEXT of the signals being received in the c-d pairs in the top and bottom of slot B

In this topology it can be seen that worst-case crosstalk would occur if all the NEXT and FEXT aggressors were routed on the bottom Layer that is on the same Layer as that of the victim c-d However given that all signal vias must be back-drilled and tuned for impedance management purposes Channel crosstalk can simultaneously be reduced by allocating different routing Layers to differential pairs terminated in the same backplane connector

The principal factor in determining the feasibility of a 10GBASE-KR compliant backplane is based on understanding whether the Channel with the worst-case signal-to-noise ratio is compliant

The skew targets determine permissible layer separation between a-b c-d e-f and g-h pairs within each Channel and enable routing Layers to be allocated for each pair It is now possible to start the process of via tuning to optimize the channel performance for minimum insertion loss Modeling begins by defining the simulation boundaries for the channel so that Channel component models (PCB traces connectors vias) can easily be aggregated to model complete Channels Boundaries must be established at locations in the Channel where linear 3D structures exist These are shown in Figure 3 (next page)

Since the connector and via combinations for the backplane and daughtercard mating halves must each be treated as a whole it

PICMG 30Spec

TurboFabricSpec

Total Inter-PairSkew

(Fabric Interface)

05 mm in FR4(34 ps)

001 mmin N4000-13si

(00625 ps)

Total Intra-Channel Skew

(Fabric Interface)

254 mm in FR4(17 ps)

plusmn01 mmin N4000-13si

(0625ps)

Total Intra-Channel Skew

(Base Interface)

135 mm in FR4(90 ps)

plusmn01 mmin N4000-13si

(0625 ps)

Figures 2a and 2b

Table 3

Determining which Channel that is and identifying the worst-case SN requires making trade-offs with regard to PCB material Channel length via design connector row selection and NEXT and FEXT aggressor routing choices These trade-off choices can only take place using advanced 3D simulation tools such as Ansoft HFSS This was the essence of the design process employed in developing Simclarrsquos TurboFabric backplanes

The simulation processThe transmission length for full mesh and dual star backplanes design implementations varies from a maximum of 1632 inches to a minimum of 116 inches With an effective transmission length of 5 inches on each daughtercard this makes the longest effective Channel 2632 inches including two connectors

For a 10GBASE-KR application over this distance a high-perfor-mance laminate is essential for both reducing insertion loss and

ensuring high glass content in the weave to mitigate skew So the design process began by choosing a low-loss dielectric material (Nelco 4000-13SI for both the backplane and the daugh-tercards) and establishing targets for Inter-Pair and Intra-Channel skew as shown in Table 3

Adhering to the PICMG 30 specifi-cation for skew in a 10GBASE-KR application is impractical Instead a target of 00625 ps was set for Inter-Pair skew with 0625 ps set for Intra-Pair skew for the backplane only This equated to a maximum 001 mm differ-

ence being allowed between traces of any differential pair and 01 mm being permitted between traces of any four differential pairs in a Channel Given the topology of the HM-ZD connector daughter-card skew must be accounted for in the daughtercard layout Fo

Sin Pnt

should be noted that the simulation boundary is located within the mated connector

Tuning the connector and via structures to 50Ω is an iterative process involving the removal of excess pads back-drilling and tuning pads anti-pads and traces A Time Domain Reflectometer (TDR) plot illustrating the results of the tuning process is shown in Figure 4

Upon completion of the modeling process a total of 17 different optimized via and routing configurations had been designed for the full mesh design and nine for the dual star design

A plot of worst-case insertion loss is shown in Figure 5 and demonstrates that in both cases performance is well above the 10GBASE-KR mask

When all the through-Channels have been modeled adjacent Channel models can be combined and ICR curves plotted to evaluate the impact of crosstalk on through-Channel performance This valuable information can be used to adjust the position of signal Layers relative to pass-through aggressor traces on adjacent Layers or to reroute traces to reduce crosstalk Similarly routing Layers can be changed to reduce crosstalk in adjacent via barrels

Figure 6 plots worst-case ICR and demonstrates that performance is above the 10GBASE-KR mask Based on this result it was possible to proceed to physical implementation

Figure 3

Figure 4

Fo Sin Pnt

Physical realizationThe layout process was performed using the Mentor Board-Station CAD system Quad-routing (routing four traces between pads) was explored as a routing method-ology in order to reduce Layer count but this was dismissed due to the detrimental impact on crosstalk performance

The attributes of the physical backplanes produced as a result of the design effort are shown in Table 4

The design files produced included the usual gerber files plus detailed back-drilling instructions

The design validation process comprised a conventional continuity test followed by performance testing featuring Agilent equipment including 70340A signal generator 8720ES Network Analyzer NN18A S-Parameter test-set and 86100A sampling oscilloscope with Agilent 86112A module Figure 7 (next page) shows the test set up

Simclar developed special line cards to enable through-Channel measurements with and without crosstalk The signal launch featured compression mount SMAs terminated in a tuned via structure The Channel simulations included simu-lation of the tuned launch structures so de-embedding of the launches was not necessary for correlation to simulation purposes The development team also established a process for characterization of all Channels

Full Mesh Dual Star

Layer Count 34 18

Aspect Ratio 121 61

Tuned Vias 3952 768

Material Nelco 4000-13SI

Table 4

Figure 5 Figure 6

Fo Sin Pnt

In Figure 8 measured through-Channel performance and ICR curves are shown for the same Channels described in the simula-tion section earlier

As can be seen from Figure 8 there is close correlation between these and the simulated plots in Figures 5 and 6 In fact close correlation between all simulated and measured results was achieved resulting in a 728 Tbps capacity full mesh and a 960 Gbps capacity dual star backplane design now generally available as part of the Simclar TurboFabric shelf

Figure 7 Figure 8

Figure 9

Figure 10

Implications of 10GBASE-KR Draft 33versus Draft 25The work described above was targeted towards meeting the Channels specifications contained in Draft 25 of the IEEE 10GBASE-KR Since this work was completed the IEEE has up-issued the Draft revision level for the Standard from 25 to 33 While this has not impacted through-Channel performance demands it has increased Channel isolation requirements by around 10 dB In Figure 9 a Draft 33 mask is added to the ICR plot shown in Figure 8

From Figure 9 it can be seen how Draft 33 pulls the mask above the Channel ICR curve for this full mesh backplane Channel Surprisingly it is the Channelrsquos frequency response at relatively low frequencies between 100-500 MHz that is causing a problem The reasons for this are currently the subject of further detailed investigation

However Figure 10 shows a Draft 33 plot for a less demanding dual star AdvancedTCA implementation featuring shorter trans-mission distances This plot demonstrates compliance to Draft 33 of the IEEE 8023ap 10GBASE-KR Standard

ConclusionBy developing a close understanding of the many factors contrib-uting to loss and noise in multi-gigabit backplane Channels it is possible to characterize their performance using advanced simula-tion techniques and correlate that performance in physical prod-ucts using advanced test methods By overlaying the test results on S-Parameter masks defined by the IEEE 8023ap 10GBASE-KR Standard it has been demonstrated that backplanes that truly enable AdvancedTCA scalability are at last a reality

Douglas Hynd joined Simclar Group in 2006 as Director of Marketing as part of Simclarrsquos acquisition of Northrop Grumman Interconnect Technologies Division wherehe was Vice President of Marketing and Sales He has more than 24 yearsrsquo experience intechnology sales marketing and generalmanagement and holds a BSc (Eng) in Electronics and Electrical Engineeringfrom the University of Glasgow He isbased at Simclarrsquos Global HQ inDunfermline Scotland

Simclar Groupdouglashyndsimclarcom bull wwwsimclarcom

Fo Sin Pnt

6U CompactPCIPrOduCT GuIdE g

This monthrsquos issue includes a 6U CompactPCI Product Guide and Irsquod like to take the opportunity to reflect a bit on the success and evolution of that technology

Back in the 1994 time frame when CompactPCI was first being devel-oped it began as 3U-only technology It used the same Eurocardmechanics that were popularized by VME and an IEC standardized high-

density high-speed connector available from a number of vendors suitablefor 33 MHz PCI signaling That connector was selected by the engineers atZiatech with help from Mike Munroe then at ERNI The majority of VMEdesigns were 6U and based on this I was among a number of folks thatargued for adding the 6U CompactPCI form factor

The 6U form factor presented some challenges and opportunities Onechallenge was that the insertion and extraction forces were quite high when the entire rear of the card was populated with connectors Fortunately the IEEE standards for Eurocards evolved and injectorejector handles that pro-vided leverage became available Eike Waltz then at Rittal was instrumental in bringing that to the table Two of the opportunities that came along withthe extra connectors were a clean way to add secondary buses like the H110 telephony bus to the backplane and the ability to route IO out the rear through rear transition modules PICMG has developed quite a number of subsidiary specifications defining the interoperable use of the extra backplane pins made possible with the 6U form factor Both of these features have played a major part in CompactPCIrsquos success The next major evolution of 6U CompactPCI came with the PICMG 216 Packet Switched Backplane standard which was originally conceived by John Peters and his team at Performance Technologies PICMG 216 interconnected a shelf full of CompactPCI single board computers via redundant Ethernet switches also in the 6U CompactPCI form factor This dramatically increased usable backplane bandwidth and provided redundancy PICMG 216 paved the way for AdvancedTCA and was the industryrsquos first open standard for the switched serial interconnect standards we see popping up in many places

By Joe Pavlat

Looking back and ahead at6U CompactPCI

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Recent 6U CompactPCI related products are listed here For more informationenter the productrsquos RSC No at wwwcompactpci-systemscomrsc

cPCI-6910Dual-core Intel Xeon Processor LVULV Universal blade bull Supports Single Dual-Core Intel Xeon LV or ULV processorsbull Front Side Bus 667 MHz bull Up to 2 GB DDR2 400 MHz soldered SDRAM with ECC bull Four PCI Express GbEbull Up to 4 USB 20 ports bull PICMG 20 21 29 216 compliant

RSC No 35013

ADLINK Technologywwwadlinktechcom

CPCIStor Module6U CompactPCI storage blade bull Onboard ATA controller supports CDDVD HDD and solid-state flashbull Supports Hot Swap Removal (ask about RAID support) bull ATA disks available in Enhanced Dutycycle versions for NEBS Level 3 - 724 requirements bull Operating Systems supported VxWorksLinux and Windows

RSC No 34800

ACTTechnicowwwacttechnicocom

Prosody X cPCI E1T1An E1T1 digital network access card bull Suits telco developers and systems integrators bull Uses Aculabrsquos worldwide protocol coverage including Aculabrsquos SS7 stack available under a cost free license bull Available with 8 or 16 E1T1 trunks and software selectable E1T1 interfaces bull Flexible mix of protocols including ISDN CAS and SS7 (ITU-T China and ANSI) bull A variety of interconnect switching and protocol conversion solutions can be readily crafted bull High availability reliability and scalability with industry standard hardw re and software interoperability bull Up to 128 SS7 signaling links bull Non-circuit related (TCAP) messagingintensive applications such as prepaid and SMS

RSC No 35408

Aculabwwwaculabcom

Adexp8021Intel Core Duo L2400 (166 GHz) w E7520 server chipset bull Dual channel PC2-3200 Registered RAM SECDED or x4 SDDC bull Two GbE two Serial ATA four USB 20 bull Onboard SXGA graphics 1280 x 24-bitbull 6U CompactPCI Bus PICMG EXP0 R10 Specification bull RoHS compliant 0 degC to +55 degC operating range

RSC No 32837

Advanet Incwwwadvanetcojpen

TC84012 channel single-stop Time-to-Digital Converter (TDC) with single-start and multi-start acquisition modes bull 50 ps timing resolution bull Wide range with upto 20 s between first and last events bull Large internal memory buffer with up to 512 hits per channel bull Low jitter (lt3 ps rms) high stability (plusmn2 ppm) internalclock source bull External 10 MHz reference input bull FPGA based Data Processing Unit (DPU) bull Fast readout with DMA mode for increased data throughputbull Overvoltage-protected inputs with 50 Ω K-Lock (LEMO) connectors bull Built-in self calibration bull Modular single-slot 6U PXICompactPCI standardbull Low power consumption (lt22 W)

RSC No 33445

Agilent-Acqiriswwwacqiriscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

MIC-30428-slot 6U CompactPCI backplane bull AC or DC CompactPCI 500 W + 250 W redundant(2+1) power supplies bull PICMG 216 (CompactPCI Packet Switching Backplane) compliancebull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarmmodule (MIC-3924L-AE)

RSC No 32851

MIC-30436-slot 6U CompactPCI backplane bull Supports two hot-swappable SCSISATA or removableIDE HDD bays bull Built-in IDE slim-type DVD-ROM bull AC or DC CompactPCI 250 W + 250 Wredundant (1+1) power supplies bull Supports hot-swappable fan modules bull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarm module (MIC-3924L-AE)

RSC No 32850

Advantech Corporationwwwadvantechcom

Dual-Core Xeon CompactPCI SBCModel PP 42123x bull Dual CPU 6U CompactPCI SBC supporting two dual-core Xeon CPUs bull Up to 8 GB DDR2 ECC SDRAM in a single system or peripheralslot bull Dual processor SBC in a single 6U CompactPCI slot bull Supports two 166 GHz Dual-Core Intel Xeon ULV processors using Intel E7520 server chipsetbull Up to 8 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull PMCXMC site support 66 MHz PCI-X and x8 PCI Express bull Front and rear IO bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade bull Four GbE ports with option for PICMG 216

RSC No 34761

6U CompactPCI Core 2 Duo SBCModel PP 41203x bull 6U CompactPCI Core 2 Duo SBC supporting two PMC sites includingone XMC site bull Up to 4 GB DDR2 ECC SDRAM bull All in a single system or peripheral slot bull TwoPMC sites supporting up to 100 MHz PCI-X bull One XMC x8 PCI Express bull Front and rear IObull Supports 216 GHz or 15 GHz Intel Core 2 Duo processors bull Intel E7520 server chipsetbull Up to 4 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade

RSC No 34763

PP 30202xTwo processor versions available bull 18 GHz Intel Pentium M processor 745 uses mFC-PGA 478 (micro Flip-Chip Pin Grid Array) package bull 14 GHz Intel Pentium M processor Low Voltage 738uses mFC-BGA 479 (micro Flip-Chip Ball Grid Array) package bull 64 KB primary (L1) on-die cache2 MB of secondary (L2) on-die cache bull 400 MHz Front Side Bus (FSB) bull No CPU fan bull 16 GHz processor version (1 MB L2 cache) available see PP 30002x datasheet bull Utilizes 64-bitIntel 855GME chipset bull Supports 400 MHz bus frequency bull Uses Intel 6300ESB IO Controller Hub

RSC No 32659

Concurrent Technologies Incwwwgocctcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cCIBPMC6U-ETA 6U bridged dual PMC carrier that bridges extended temperature CompactPCI boards and PMCs bull Features a rugged CompactPCI form factor providing increased flexibility to military communications systems designers bull Provides additional design choices to users through its differing bus speeds maximizing the numberof PMCs that can be used CompactPCI andPMC buses can both run at 66 or 33 MHzbull Operating temperature range of -40 degC to+85 degC bull Signal conditioning bull DMA supportbull Low-power design +5 V +33 V +12 V -12 V bull User-selectable VIO of 33 V or 5 V to the PMC

RSC No 32891

Dynamic Engineeringwwwdynengcom

cPCI4IP-MMMinimized PCI address footprint IndustryPack carrier for CompactPCI applications bull 6U 4HP4 IP positions 832 clock selection for each slot fused filtered power IO options bull ID INT IO and Mem spaces are decoded for each IP slotbull Single and double wide IPrsquos bull 16- and 32- bit IPs bull 32-bit access to 16-bit IPs bull Full or mini-mized Memory Space decoding for 18 the PCI address requirement bull With the cPCI4IP-MM option 8 CompactPCI 4IP cards take the same PCI address space as 1 full Mem Space card

RSC No 34905

ACQ132CPCI32 channel MHz class simultaneous sampling intelligent digitizer bull 32 simultaneous analoginput channels 2-32 MSpschannel 14-bit resolution bull Differential inputs bull Intelligent cardwith 1 gigabyte memory and GbE on board bull Large distributed FPGA resource on boardbull Range of DSP functions including FIR filtering and Digital Downconverter

RSC No 35482

D-TACQ Solutions Ltdwwwd-tacqcouk

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CR11Based on the Intel Core Duo Processor the platform is designed to support processor speeds from 106 GHz up to 20 GHz bull Intel Core 2 Duo runs at 15 GHz up to 20 GHz bull Conduction cooled bull Two PMC slots bull PCI Express bull 2x GbE

RSC No 33156

ICS-72532-channel 6U CompactPCI DAC board bull 6U CompactPCI data acquisition card bull 32 differential output channels bull 16 or 24-bit sample size bull 288 kHzch data rate bull Simultaneous sampling across all channels on single or multiple boards bull 32 separate delta-sigma DACs bull 64-bit 66 MHz CompactPCI PICMG 20 Rev30 hot-swappable bull FPDP II 400 MBps interface

RSC No 33576

ICS-71032-channel 6U CompactPCI ADC board bull 6U CompactPCI data acquisition card bull 32 differential input channels bull 216 KHzch 24-bit resolution bull Software selectable full scale input bull FPDP II 400 MBpsinterface bull 64-bit 66 MHz CompactPCI PICMG 20 Rev 30 hot swappable bull 32 synchronous boards for simultaneous sampling bull Sonar acoustics and test and measurement applications

RSC No 33578

Tsumani 6U CPCI Development KitFPGA processor solution targeted at high performance software defined radio applications bull Dual Stratix EP1S80 FPGAs are tightly coupled to provide apower platform for signal processing bull Two PMC module sites provide IO connectivity to either front panel or back panel connections bull A direct highbandwidth 1 GBps path from the PMC P4 connector directly to the FPGAs bull Model 919 Dual DAC Mezzanine provides broadband analog signal generationin a compact form bull The board features two independent DAC channels each with its own 12-bit LVDS input capable of running at rates up to 160 MHz

RSC No 32026

CP11Rugged 6U SBC bull Up to 4 GB of DDR2 SDRAM (200 MHz) with enhanced ECC four independent onboard PCI buses system host and peripheral modesupport for the CompactPCI backplane two PMC interfaces (64-bit133 MHz and 32-bit33 MHz) bull Instead of the PMC1 a PCI Express based XMC interface is available on request bull Two GbE one Fast Ethernet two serial interfaces (RS-232 or RS-422485) USB 20 integrated HDD or flash drive bull High performance 2D3D ATI video controller capable of driving two displays in parallel supports VGADVI interface bull Intel Core 2 Duo at 216 GHz Intel Core Duo at 20 GHz2x PMC expansion site bull One XMC optional bull Up to 4 GB DDR2 SDRAM wECC 2x GbE

RSC No 33447

GE Fanuc Intelligent Platforms Incwwwgefanucembeddedcom

Single Board ComputersGD Canada designs and manufactures conduction-cooled Single Board Computers (SBCs)using Intel processors bull 6U and 3U form factors for CompactPCI backplanes bull Fully backward compatible with earlier models bull Upgradeable via the change-out of processor memory andIO modules bull Used within GD Canada computer systems and sold as individual products

RSC No 35281

General Dynamicswwwgdcanadacom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cPCI6U-24DSI32R32-channel 24-bit delta-sigma CompactPCI 6U analog input board with rear IO bull Low noise 24-bit resolution low phase distortion andmulti-board synchronization bull Suits state-of-the-art sonar and noise monitoring applications bull 32-channel cPCI6U-24DSI32 analog input boardprovides a high-density 24-bit analog input resources on a standard 6U CompactPCI expansion board bull Applications from precision voltagemeasurements to complex audio signal and waveform analysis

RSC No 34985

General Standards Corporationwwwgeneralstandardscom

Duet 3U 64-bit 1 GHz TMS320C6416 DSP (x2) 64 MB SDRAM per processor bull Flexible internalexternalcommunication mesh bull 64-bit66 MHz CompactPCI bull PMCXMC site with Jn4 to FPGA and4 RocketIO per VITA 42 bull External data port up to 12 Gbps bull 4M or 5M Virtex-II Pro FPGAbull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM dedicated800 MBps links between DSPs bull 3U CompactPCI with PXI support bull Suits high-end co-processing wireless broadband communications RADAR video and biometrics

RSC No 32856

QuadiaQuad-DSP bull Dual FPGA bull Dual PMC sites bull Inter-processor connectivity and access to external interfaces bull Four C6416 DSPs split in two independent clusters each hosting a PMC site bull One large FPGA for end-user code bull Central FPGA routing interprocessor communication bull End-user FPGA communication bull External port serial IO for PCIe or other p ivate link bull Global memoryand PCI interface bull 1 GHz TMS320C6416 DSP (x4) bull 64 MB SDRAM per processor bull Flexible internalexternal communication mesh bull 64-bit66 MHz CompactPCI bull Two PMC sites with Jn4 to FPGA bull External data port up to 12 Gbps bull Two 4M Gate FPGA reserved for end-user code bull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM bull Up to 512 MB Global DDR SDRAM bull Suits high-end co-processing wireless and broadband communications

RSC No 34737

Quixote 64-bit 6UAdvanced signal capture generation and co-processing bull 1 GHz TMS320C6416 DSP and2 to 6 MGATE Virtex-II FPGA bull 32 MB SDRAM 8 MB ZBT SBSRAM and AD6645 and AD9764 converters bull 6432 bit CompactPCI 66 MHz 5 V33 V and complex trigger modes with HW event logging bull PMC site with Jn4 to FPGA DIO and PICMG 217 StarFabric compliant bull Suits Software Defined Radio wireless IP and RADAR development and hardware testing bull Physical Layer field testing ultra-fast flexible data acquisition vector signal generation and electronic warfare

RSC No 32861

Innovative Integrationwwwinnovative-dspcom

IC-e6-cPCIbHigh performance 6U CompactPCI board bull Powered by one or two of Freescalersquos mostadvanced 14 GHz MPC7448 PowerPC processors bull PICMG 216 compliant bull Marvell Discovery III chipset (MV64460) bull Low power consumption bull Standard extended and rugged grades

RSC No 32982

Interface Conceptwwwinterfaceconceptcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CP213Single-width 6U CompactPCIPXI module with either 32 or 64 differential analog input channelsbull 32 64 or 128 channels of analog input bull 16 multifunction digital IO (TTL) channels that may beconfigured as digital in digital out or selectively attached to 2 frequency in 2 counter in andor 2 timerout channels bull 16-bit resolution bull Programmable gain per channel programmable scan rates of lt1 Ss through 100 KSs bull Precision onboard reference for end-to-end calibration

RSC No 34804

KineticSystems Company LLCwwwkscorpcom

CP6001Energy efficient embedded Intel dual core processors bull 12 GHz Intel Core Duo U2500 ULV processor bull Intel Core 2 Duo L7400 LV processor bull Based on the Intel Mobile 945GM chipset with a front side bus of up to 667 MHz and ICH7-R Southbridge bull Two independent digital video outputs to the rear IO (2x DVI - 1x DVI and 1x HDMI) bull AC97 audio capabilities bull 3 x GbE bull 4 x SATA with RAID 01510 functionality bull 6 x USB 20 2 x COM and VGA or DVI bull Can also accommodate a PMC slot or an onboard 25 inch SATA HDD bull Up to 8 GB of USB or 2 GB soldered flash bull Supports Linux Windows XP XP embedded and VxWorks 6

RSC No 34182

CP6923 GbE Switch6U CompactPCI GbE Switch PICMG 216 compliant bull Leading edge te hnology basedon BCM5650X chip bull 24x GbE ports bull Non-blocking Layer 2 and 3 switching and routingbull Copper optical rear IO version bull Hot swap IPMI bull Fully managed bull Comprehensive firmware package bull Applies to VoIP installations such as call servers media gatewaysand trunking gateways in wireline and wireless networks as well as VoIP systems inenterprise networks with high demands on performance

RSC No 32256

Kontronwwwkontroncom

TMS320C6701 Virtex-IITexas Instrumentsrsquo C6701 DSP bull Xilinx Virtex-II series FPGA up to XC2V8000 bull Multiple IO interfaces Onboard CODEC VIM expansion sites 60-pin GPIO header and JTAG bull Hardware drivers integration in SimulinkXilinx System Generator Blocksets for quick implementation of Simulink models bull DSP and FPGA-in-the-loop cosimulation of SimulinkXilinx System Generator models bull Leading edge communication interface allowing real-time datamonitoring from Simulink scopes and remote operations

RSC No 32028

VHS-DACHigh performance multichannel DA for phased array antenna systems radarsonar communications receiversup-sampling to IF stage and RFIF AGC apps bull Eight 125 MSPS output channels bull Optional add-on daughter boardprovides 8 additional output channels or 8 additional input channels bull 32-bit 25 MHz bull FPDP interface with 400 MBps transfer rate (25 MSPS per channel at 8 channels 125 MSPS at 16 channels) bull Low level hardware drivers API andGUI bull High level hardware drivers integration in Simulink Blocksets bull Leading edge communication interface fordata recording and playback tofrom the onboard SDRAM

RSC No 32029

Lyrtechwwwlyrtechcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

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PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

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PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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Page 13: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

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APPLICATION g

Based on current overall network growth Telecom Equipment

Manufacturers (TEMs) and Network Equipment Providers (NEPs)

are being challenged to launch new communications platforms

that provide optimal scalability flexibility manageability and

high computing performance With the expected increase in new

subscribers who need to be supported across the network TEMs and

NEPs are focusing on COTS platforms that meet the requirements of

a carrier-grade environment

With these new challenges it is important to take a look at the different

applications in the network to thoroughly evaluate the best hardware

platform approach Comparing the scalability IO functionality

interconnectivity and overall performance gives TEMs and NEPs a

solid basis from which to choose the best cost-effective solution for

their applications This article compares the traditional 1U PCI

platform with a more modular AdvancedTCA-based approach to

a Home Subscriber Server (HSS)-based platform

Emerging next-generation network architecture IMS Carriers and service providers are focused on improving their Average Revenue Per User (ARPU) by deploying new services quickly and at a price that is acceptable to subscribers IP Multimedia Subsystems (IMS) enable service providers to offer differentiated services to their subscriber base integrating voice video text and content as part of their service mix regard-less of the access technology

The IMS framework provides the telecom industry with a modular standards-based IP service delivery infrastructure More than simply replacing existing circuit services with similar services delivered over IP IMS allows service providers to capitalize on faster and more cost-effective deployment of new and differentiated multimedia communication services

While these new technologies promise new sources of revenue and enhanced customer loyalty they also pose implemen- tation challenges One of the crucial net-work elements within an IMS framework is the manageability of the subscriber base Today an increasing number of users subscribe to multiple services such

By Sven FreudenFeld

Choose the right formula forcompute-intensive HSS systems

AdvancedTCA platforms

versus1U PCI rack-mount servers

AdvancedTCA

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as multimedia mobile phones VoIP or IPTV at home Service providers must manage ldquoduplicatedrdquo subscriber databases for each particular service Consequently managing a converging subscriber base for such network functions as billing across multiple different technologies presents a tremendous challenge Any downtime of this network element can be costly to the carrier or service provider not to mention the heavy risk of losing subscribers over the long term

The HSS and Home Location Register (HLR) are key elements in the IMS network required to manage the growing number of subscribers These platforms that manage millions of customersrsquo data need to be highly reliable with carrier-grade High Availability (HA) functionality Core requirements for the HSS computing platform are

n High compute density for application processingn Scalable performance and high densityn Fast read access to the subscriber datan Large storage and memory bandwidthn Ability to consolidate multiple IMS elements and subscriber data within a single

platform with a modular approach as a converged services platform

HSS plays network backbone roleHSS provides the important network backbone of the IMS architecture because it eases innovation and addresses a range of service-logic interaction issues that have plagued previous service architectures HSS offers open access to service-related data for each subscriber supporting the sharing of data among multiple services

HSS is essentially the master user database that supports IMS network entities that handle calls and sessions It contains user profiles performs authentication and authorization of the user and can provide information about the physical location of the user It plays a key role in provisioning service creation enabling subscriber data and managing control roaming and interconnection The Application Server (AS) which hosts and executes serv- ices in the IMS environment communicates with the HSS Call State Control Function

(CSCF) servers also communicate with the HSS which must be able to

n Support IMS-level authentication and authorization

n Maintain IMS subscriber profile(s) independent of access types

n Maintain service-specific datan Keep track of currently assigned

CSCFn Support CSCF and AS access

HLRHSS hardware platform design choicesHSS design must enable the HSS to be deployed cost-effectively and expand readily to meet future subscriber levels For example the trend to include more information as part of the data record for each subscriber will drive up memory requirements

From a technical perspective the key metrics to understand when developing the IMS HSS functions are the number of completed transactions required per sec-ond and the size of the subscriber base

HSS architecture typically comprises multiple processor units with extensive memory requirements With the introduction

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of multicore processors from Intel developers can scale performance while optimizing power consumption in the overall system design

To meet these requirements the hardware platform needs to provide scalability flexibil-ity and long-term cost efficiency In comparing the traditional 1U platform with a more modular approach to the HSS using AdvancedTCA consider the following

n High compute performance n High memory and storage capabilityn IO functionality to connect to multiple networks (such as SS7 and Ethernet)n Carrier-grade profile and redundancy

AdvancedTCA High density with scalability on a smaller footprintTable 1 illustrates a comparison of a sample AdvancedTCA-based platform and a 1U PCI rack-mounted platform for HSS applications This configuration assumes an increasing subscriber growth from 1 million (M) subscribers to 18M subscribers per platform

FootprintAdvancedTCA-based platforms provide a high density compute platform with scalability on a smaller footprint TEMs can easily add boards to a chassis to accommodate more traffic and to support new services This flexibility enables an increase in subscribers and the database without having a major impact on rack space in the central office environ-ment To meet the same capacity for 18M subscribers the 1U PCI approach will occupy two bays or cabinets with a total footprint of 28 square feet compared to the same capacity occupying one bay or cabinet with a footprint of 14 square feet (see Figure 1)

CoolingWhile the power consumption per square foot is higher than the 1U PCI platform AdvancedTCA offers better airflow and cooling distribution using a push-pull cooling system Each 1U PCI platform includes up to nine cooling fans and is dedicated to that CPU in the 1U server only which translates into higher overhead Therefore the airflow is

not optimized in the overall system design In the case of a fan failure AdvancedTCA platforms enable easier access to replace the fans which are field replaceable units The 1U platform also does not include any integrated centralized switching or management capabilities therefore the total does not include any switching or system management functionality

ScalabilityAdvancedTCA architecture lends itself well to scalability As AdvancedTCA sup-ports both a Base and Fabric interface into the backplane and the separation of data and control planes TEMs can also scale up their designs from 1 GbE to 10 GbE to accommodate new users and usage requirements AdvancedTCA based systems are designed for easy upgrade-ability to new processing blades switch fabrics and IO modules using Advanced Mezzanine Cards (such as SS7)

Since AdvancedTCA and AdvancedMCs offer hot swap capabilities and HA func-tionality growing a subscriber base by using additional CPU blades within the system with low maintenance or upgrade downtime is crucial for the HSS plat-form It also allows for the up and down

AdvancedTCA-based HSS Platform 1U PCI Rack-Mount HSS Platform

Number ofsubscribers

~1M subscribers = 4 CPU blades edundant ~1M subscribers = 4 x 1U

~4M subscribers = 7 CPU blades redundant ~4M subscribers = 7 x 1U

~6M subscribers = 12 CPU blades redundant ~6M subscribers = 12 x 1U

~18M subscribers = 36 CPU blades redundant= 3 AdvancedTCA shelves per rack

~18M subscribers= 36 x 1U+ external switch components for redundancy

Technicalspecs

1 CPU blade = 2 x Intel Xeon dual core = quad core 1 1U rack-mount Intel= Intel Xeon quad core or dual core CPU

16 G DDR 2 memory Max of 8 G DRY memory

+ 2 x SATA or SASS hot swap (RAID 0 and 1)+ 1x PCI Express for SS7 Dual GbE per 1U rack-mount server

4 x GbE per CPU with built in GbE backplane switching separating Control Pathand Data Path with multishelf expandability

External central switching required withmultiple external GbE connectivity

Systems and blade manageability built into the platform withIMP implementation SNMP and CLIP

Carrier-grade redundancy on switch and node

IO for SS7 or other interface modules

CPU blade hot swap capability

Thermaland power

requirements

~6M subscribers redundant= 14 slots with centralized chassis cooling

~6M subscribers redundant= 18 x 1U PCI with independent cooling and separate switch units and system management

Total power consumption= ok (3100 W for blades and RTM + 500 W Shim fan tray and SAP)

Total power consumption= ok

Table 1

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scaling of the platform depending on the subscriber increase or decrease When consolidating multiple services minimiz-ing multiple duplicate databases requires this flexibility

InterconnectivityThe AdvancedTCA platform offers a number of interconnectivity features including

n Separation between the data plane and the control plane

n Direct uplink in a multichassis envi-ronment with up to l0 GbE

n Node to node base and fabric connec-tivity with HA carrier-grade Ethernet functionality

n Easy upgrade path to l0 GbE for increased bandwidth

By contrast the 1U PCI platform requires

n Additional external interconnectiv-ity between 1U rack-mount servers which increases the number of points of failures and the operating and maintenance costs

n Additional switching equipment for carrier-grade Ethernet connectivity

n Additional manage-ment (Simple Network Management Protocol [SNMP]) for HA redundancy

PowerThe 1U-based platform also utilizes integrated AC power supply units usually the standard for the data center and enter-prise environments AC will increase the pro-viderrsquos OPEX in the long term since the power consumption per rack is significantly higher and

Figure 1

requires additional support equipment such as an Uninterruptible Power Supply (UPS) and an AC to DC converter per rack space and ultimately per CPU These factors along with the requirements for carrier-grade functionality HA support and a more favorable long-term OPEX further reduce the need to consider the 1U solution for HSS deployments in Central Office networks

ManageabilityAdvancedTCA chassis-level management is based on the industry-standard Intelligent Platform Management Interface (IPMI) IPMI makes possible interoperability among chassis and blowers compute nodes switches and management solutions from multiple vendors enabling these elements to work together seamlessly The resulting successful inter-blade communication for applications including failover and clustering provides full manageability on a per shelf and per bay basis

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One of the primary goals of the AdvancedTCA specification is to ensure a very low Mean Time to Repair (MTTR) and high Mean Time Between Failures (MTBF) There are no active components in the backplane ndash which can translate to expensive repairs in the field In addi-tion AdvancedTCA specifies that all com-ponents can be hot swappable in the field and the architecture provides redundancy at all levels This hot swap capability translates to less downtime for field replacement on a per CPU blade basis as compared to 1U PCI

SummaryAdvancedTCA provides an ideal platform and meets the technical requirements for deploying flexible and scalable IMS HSS applications While other platform archi-tectures such as 1U rack-mount servers may with considerable difficulty be able to deliver HSS capabilities AdvancedTCA offers a much more advantageous solution by providing a smaller footprint improved cooling and thermal characteristics bet-ter scalability enhanced interconnectivity and easier manageability This all contrib-utes to making AdvancedTCA a lower cost approach in terms of CAPEX and OPEX for long-term subscriber growth

1U PCI rack-mount servers are not considered to be the optimal hardware platform for HSS applications in a Central Office With its limitation for carrier-grade flexibility and HA functionality the 1U PCI platform is best suited for a full range of other enterprise and Internet infrastructure applications within a data center environment that does not require any significant flexibility and HA functionality around it It might also be a good entrance point for other enterprise applications with lower price points

The use of AdvancedTCA-based platforms enables TEMs to shift away from hardware development and refocus their efforts on delivering value-added software and services As a result they can realize lower development costs and faster time-to-market enabling increased flexibility with each product design through the use and reuse of standardized off-the-shelf components Equally significant are the advantages that can be realized by the service provider With a common platform and a flexible architecture that maximizes limited floor space service providers can rapidly and flexibly implement a broad range of feature-rich solutions for faster profitability

Sven Freudenfeld is responsible for North American Business Development for the Kontron AG line of AdvancedTCA AMC MicroTCA and Pre-Integrated Solutions Sven possesses more than 15 years of experience with voice data and wireless com-munications having worked extensively with Nortel Networks in Systems Engineering Sanmina-SCI in Test Engineeringand Deutsche Telekom in Network Engineering Sven holdsan electrical engineering degree from Germany and is also Chair of the CP-TA marketing workgroup focusing on the interoperability of COTS standard building blocks

Kontron bull svenfreudenfeldcakontroncom bull wwwkontroncom

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TECHNOLOGY g BACkpLANES

Increasing demand for service and multimedia features is stimulating a growing need for speed in telecom-munications equipment While some

applications such as PBX systems can be addressed with the gigabit backplane technologies currently available others are running out of headroom Routers may soon need 10 Gbps and higher speed back-planes to keep up with network demand Many such applications can justify the expense of moving to higher performance if it becomes available

Currently telecom system designs offer backplanes that can handle interconnec-tions running as fast as 3125 Gbps raw data throughput per lane (with around a maxi-mum data rate capability of 5-625 Gbps per lane) The AdvancedTCA standard for instance uses Ethernetrsquos XAUI inter-face AdvancedTCA achieves a 10 Gbps net data rate by running four serial lanes for each interconnection with each lanersquos

SERrializerDESerializer (SERDES) op-erating at 3125 Gbps raw data (25 Gbs net)

As demand forces systems to move beyond these rates however new technologies will be needed One proposal calls for the use of XAUI+ or double XAUI which increases lane SERDES rates to 625 Gbps per lane and hence the throughput to 20 Gbps Another proposal is to use IEEE 8023ap known as 10GBASE-KR which runs a single SERDES lane at 125 Gbps raw data rate (103 Gbps net) But these are only short-term answers To address future demands organizations such as the Institute of Electrical and Electronic Engineers Standards Association (IEEE-SA) are developing specifications for Ethernet speeds of 40 Gbps to 100 Gbps which will be applied to backplane interconnect

Such high clock rates however will pose significant design challenges for developers

One of the first challenges that will need resolution is the design and layout of the backplane and other PCBs Common design practice today readily handles board clock rates of around 10 Gbps Well established design rules are in place and board layout tools such as autorouters can automatically handle board designs for speeds in the 10 Gbps range Designers may use specialized board material create additional ground planes and perform similar tasks in order to ensure proper board operation at the higher end but even speeds to 5 GHz are within current design tool capabilities

Design gets trickierAbove 5 GHz however board design gets more involved because feature dimensions become significant when compared to the signalrsquos wavelengths Variations in board thickness can affect signal propagation Corners where traces change direction and small spurs along edges of poorly etched

Channel characteristics

challenge backplane interoperability

Serial backplanes in telecommunications systems aim for high speed with room for

growth As systems began using 10 Gbps links however issues arose that affected backplane

communications among cards from different manufacturers Stuart points out that the

industry must define key backplane channel characteristics so that designs based on open

standards maintain interoperability as backplane speeds move to 40 Gbps and beyond

By Stuart JamieSon

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traces can act as antennae for the higher fre-quencies in digital signals As can be seen in Figure 1 sharp corners and minor flaws that are inconsequential at lower frequen-cies have the potential to become trouble-some antennae at future high speeds This can result in the trace radiating away the signalrsquos high frequency energy increasing EMI and crosstalk as well as altering signal waveforms New routing design rules such as making corners 30deg instead of 45deg and more careful board fabrication techniques may become necessary as designs move above the 10 Gbps per lane threshold

The move to higher frequencies will affect more than board fabrication and layout however Higher frequencies will also impose new requirements on signal tim-ing signal rise-time electrical distance and waveform shape if developers are to retain the mix-and-match system design approach that makes standards-based system design effective

For interoperability to be achievable at data rates above 10 Gbps organizations such as PICMG will need to carefully define a vari-ety of signal and design parameters in their specifications Some of the key parameters that will need consideration include

n Interconnect signal attenuationn Eye diagramn Jittern Input clock recoveryn Chip inputoutput pre-emphasis (PE) n Equalization (EQ)

Even slight variations in these parameters from device to device and lane to lane can shift the timing of signals a significant fraction of a clock cycle and affect the Bit Error Rate (BER) of a lanechannel Finally signal rise times will require tight control as signal rates increase in order to ensure control of system timing (see Figure 2)

In defining signal and design parameters specifications will also need to account for the increased location dependency that comes with higher frequencies Even subtle differences in attributes such as routing length and trace impedance become increasingly significant as signal speeds rise To ensure mix-and-match interopera-bility then design specifications may need to account for the specific backplane slot that a board is to occupy as well as introduce a method to obtain and control the PE and EQ of the devices connected to the lanes

Designers must also address fabrication standards The material used to fabricate

Figure 1

Figure 2

Fo Sin Pnt

the board the thickness and composition of metal cladding and the spacing between layers can all affect the trace characteris-tics Controlling these parameters under specification ensures that timing charac-teristics are sufficiently uniform from one board to another However current speci-fications are too detailed and stringent It is extremely difficult to attain compliance yet avoid adding cost to the design

Specifications need workSome of these parameters are already incorporated into current specifications The AMC module specifications from PICMG for instance include design parameters that ensure its proper opera-tion at signal speeds as fast as 125 Gbps per lane Establishing specifications for other system components will help achieve interoperability of standards-based designs at higher frequencies

Design tools may also need to be modified and the industry will need to create new design rules for high frequency and incor-porate these into the tools Developing new routing techniques will help avoid the issues of electrical phenomena such as skin effect dielectric loss and impedance mismatches These are much more preva-lent at higher frequencies and it becomes critical for engineers to model and simu-late these phenomena more accurately

Early efforts are already underway to address the challenges that higher fre-quency signals bring to standards-based design The Interconnect Channel Characterization Subcommittee of PICMG established in September 2006 is develop-ing ground rules and definitions to be used in characterizing transmission reflection and crosstalk performance in backplane and mezzanine carrier interconnects The committee aims to define the channel parameters to be measured or analyzed as well as the methods for doing so Its charter calls for it to address

n Definition of interfaces at which measurements are made or characteristics computed

n Test equipment fixtures and PCB test coupons

n Details of measurement proceduren Data formatsn Techniques for de-embedding

components of the channeln Techniques for validating

measurement based models ie passivity and causality

n Definitions that allow reasonable compliance testing

n Boundary definitions for different paths

n Define information regarding limita-tions or proper usage ie maximum data raterise times that are supported by the models

Such efforts are only a beginning how-ever Other design details still need to be addressed such as SERDES IO Configuration New functionality may need to be defined The design of high data rate system channel interfaces according to standardsspecifications does not currently cover the individual characteristics of the chip transmitterreceiver characteristics Thus work will be needed to address how such standard designs handle such dependency

Crossing an interoperability thresholdOne way of handling location dependen-cies might be to give the system control-ler the ability to inform modules what the channel transmitter and receiver PE and EQ technology is and importantly how to control it With this information along with the signal attenuation suffered (at a given bit rate) for the channel the system should be able to configure SERDES channels in different physical locations to run reliably and at the required BER In MicroTCA systems for instance this functionality could be incorporated into the MicroTCA Carrier Hub (MCH) as part of its electronic keying function Modules would have to be able to configure and control its backplane interfaces to allow for different positions

in the backplane An MCH (see Figure 3 courtesy Emerson) then would be able to instruct a module as to which parameters to use for interoperability

The specific approaches needed to handle location dependencies and other challenges that higher signal rates raise have yet to be developed The need to address these challenges however is clear Increasing demand for services is driving applications to utilize faster signal rates This in turn is driving backplane signaling speeds ever higher As speeds rise above 10 Gbps sig-nals will cross a threshold where current specifications will prove inadequate for ensuring interoperability among standards-based designs

The industry should begin developing new or enhanced specifications and design tools to address the challenges of higher signal rates Without such improvements the guarantees of interoperability that allow system developers to readily create solu-tions by combining off-the-shelf products will be compromised As backplane speeds approach 100 Gbps nothing can be taken for granted

Stuart Jamieson Director of Industry RelationsArchitect with Emerson Network Power Embedded Computing represents Emerson on PICMG committees and the SCOPE organization and previously served as a CP-TA Board member (Treasurer) He brings over 18 years of experience in hardware protocols embedded software and specification development to these groups Within Emerson he played a key role in the develop-ment of the technology central to Emersonrsquos bundled network-ing solutions Stuartrsquos positions within Emerson have included Director of Business Development Director of Advanced Technology and Architect He is the Draft Editor for the PICMG Interconnect Channel Characterization Subcommittee is the author of the introduction section for the new PICMG Ruggedized MicroTCA specification and served as the Draft Editor for the PICMG MicroTCA Specification Stuart gradu-ated from the Heriot-Watt University in 1989 with a 1st Class Honors degree in Electrical and Electronic Engineering and again in 1992 with an IBM-sponsored Master of Philosophy

Emerson Network Power Embedded ComputingStuartJamiesonEmersoncom bull wwwemersonembeddedcomputingcom

Figure 3

Fo Sin Pnt

TECHNOLOGY g BACkpLANES

2008

B A

N D

W I

D T

H

Signal integrity challenges to bandwidth scalabilityFor the purposes of this article each interconnected differential pair will be referred to as a Channel (which should not be confused with an aggregated AdvancedTCA channel comprising four trans-mit and four receive pairs)

14-slot full-mesh AdvancedTCA backplanes contain hundreds of Channels Each Channel is defined as the copper signal path from the output of a driver device to the input of a receiver device As

By douglaS Hynd

Developing IEEE 8023ap 10GBASE-KRcompliant backplanes

Why doesAdvancedTCA

need bandwidthscalability

PICMG AdvancedTCA 30 has emerged as the

industryrsquos Hardware Platform standard of choice and

is enjoying first-phase deployment However many

believe that for AdvancedTCA to realize its market

potential AdvancedTCA platforms need to seamlessly

scale to accommodate 40 GbE fabrics thereby

avoiding forklift upgrades as system bandwidth

demands increase over time A 40 GbE switch fabric

architecture would enable realization of a common

platform for computing storage control and media

and packet processing and provide the versatility and

long term ROI required by service providers in

todayrsquos increasingly competitive environment

The challenge was to develop a family of

AdvancedTCA products which feature PICMG 30

compliant dual star and full mesh advanced

backplane switch fabrics enabled up to 10 Gbps

per differential signal pair thereby giving 40 Gbps

per AdvancedTCA channel performance

This article describes the signal integrity challenges

presented in designing an IEEE 8023ap

10GBASE-KR-compliant bandwidth-scalable

14-slot AdvancedTCA platform and how these

challenges were overcome in development of full

mesh and dual star backplane reference designs

Fo Sin Pnt

shown in Figure 1 that signal path comprises a signal launch a blade PCB transmission line a daughtercard via a right-angled HM-ZD connector a mated HM-ZD backplane header a back-plane via a length of backplane PCB transmission line and then the same combination of connectors vias and transmission line at the receive end of the Channel

Sources of crosstalkFour principal sources of crosstalk in each Channel must be man-aged as shown in Table 2 Source number one is between adjacent differential pairs as they are routed across the backplane Common mode noise rejection in system differential pair structures makes this a minor issue The second source of crosstalk lies in the HM-ZD connector itself

Crosstalk in via fields our third source primarily arises from inductive coupling between adjacent differential pairs and domi-nates the crosstalk agenda in high-speed Channels This source of crosstalk is directly proportional to the length of the via barrel and where practical care must be taken to ensure that adjacent connector rows are terminated to different target routing Layers

The final source of crosstalk is caused by aggressor signals in through-routed via fields coupling with victim Channel traces as they pass through As mentioned earlier judicious and careful design can mitigate this impact

Skew Channel skew is a function of differential transmission path geometries At a fundamental frequency of 5 GHz skew can be a significant issue in high-speed system design due to narrowing the eye opening and increasing jitter Skew can have a significant impact on crosstalk it negatively impacts the common mode rejection of noise inherent to differential signaling Conductor surface roughness in lower performing dielectric materials can also cause skew in high-speed systems

Skew can be avoided through careful management of transmission path lengths in each Channel and by using higher-glass content (lower Dk) laminates

LossPotential

Potential Mismatches

Channel

Loss Potential Channel

PCB Tolerance -025 dB 2 -01 dB

Connector Tolerance -001 dB 4 -016 dB

Thru-routed Via Fields -001 dB 12 -144 dB

Connector Launch -025 dB+ 4 - 2 dB+

Quantity TotalNEXT

TotalFEXT

PCB Transmission Lines

24 in60 cm

-50 dB -70 dB

Connector Architecture 2 -26 dB -24 dB

Via Fields 4 -22 dB -20 dB

Connector Pass Through 8 -34 dB ndash34 dB

For the target application each one of these Channels must deliver a 10 Gbps Non-Return-To-Zero (NRZ) signal with sufficient signal fidelity to enable a receiver device to detect and process a differential signal The PICMG 30 specification is targeted at 3125 Gbps signaling with a fundamental frequency of 156 GHz Even in low loss dielectric materials insertion loss at 10 Gbps (5 GHz fundamental) is twice that of a 3125 Gbps signal

Therefore achieving acceptable signal fidelity requires careful management of signal losses and noise in each Channel such that an acceptable signal-to-noise (SN) ratio is achieved at the receiver

The design process therefore begins by understanding and mitigat-ing the sources of losses and noise in each Channel

Sources of lossThere are three sources of loss

n Conductor losses which are due to skin effects and can be addressed by maximizing the cross sectional area of the signal traces

n Material dispersion losses which are a function of the dielectric constants of the chosen material These can be mitigated by choosing a higher performance laminate material such as Nelco 4000-13SI or Megtron

n Reflected power loss due to impedance mismatches in the Channel as each signal transitions across the different copper media in each channel (connectors vias and PCB traces) and passes through the pad and anti-pad structures of the via fields of other backplane blade slots

Table 1 shows the relative effects of different sources of impedance mismatches The dominant source of impedance mismatches in every Channel resides in the via structures Successful mitigation of this problem requires that every via is tuned by back-drilling the stub and adjusting the pad and anti-pad structures to match the impedance to be 50 ohms irrespective of the target routing layer This in turn requires that the capacitive and inductive effects of the connector pin and via barrel combination are taken into account during the design of each Channel

Further complicating via design is the space the anti-pad structures need to accommodate Channels being routed between other blades while minimizing electro-magnetic coupling with them This space consideration makes the shape and orientation of pads and anti-pads extremely important

Figure 1

Table 1

Table 2

Fo Sin Pnt

IEEE 8023ap provides a design targetAs Ethernet has emerged as the industryrsquos dominant signaling methodology the IEEE has developed the 10GBASE-KR norma-tive Channel model to define interconnect Channel performance for NRZ signaling at 10 Gbps This standard defines acceptable performance in terms of S-parameter charts for through-Channel insertion loss and worst-case crosstalk Figures 2a and 2b illustrate masks for Draft 24 of the standard that was initially used for this exercise

In each case the mask defining compliant performance is shown in blue Channel insertion loss is shown in red in Figure 2a Crosstalk performance is defined by the ICR curve (Figure 2b) Minimum acceptable Channel performance is defined in the ICR chart (Figure 2b) by the blue line The effect of the sum of all aggressors on the through-Channel is shown in red The green ICR curve is the ratio of the crosstalk power sum calculated by summing the

magnitudes of any impacting crosstalk Channels for each fre-quency and using a straight line fit (using least-squares method) to determine the resulting average effect f the aggressors on the through-Channel This is then overlaid on the insertion loss and used to plot the ICR curve

This standard which has evolved through a variety of iterations forms the basis for developing a 40 GbE switch fabric backplane featuring 10 Gbps NRZ differential pairs If all differential pairs can meet this standard then the backplane can be considered to be 10GBASE-KR compliant

Applying 10GBASE-KR to a 14-slotAdvancedTCA applicationThe PICMG specification dictates that receive differential pairs are placed on the c-d and g-h rows of the HM-ZD connector and that transmit differential pairs are placed on the a-b and e-f rows Therefore the middle differential pair in row c-d of Slot B will be subject to the NEXT of three aggressors in each of the a-b and e-f transmit rows of slot B plus the FEXT of the signals being received in the c-d pairs in the top and bottom of slot B

In this topology it can be seen that worst-case crosstalk would occur if all the NEXT and FEXT aggressors were routed on the bottom Layer that is on the same Layer as that of the victim c-d However given that all signal vias must be back-drilled and tuned for impedance management purposes Channel crosstalk can simultaneously be reduced by allocating different routing Layers to differential pairs terminated in the same backplane connector

The principal factor in determining the feasibility of a 10GBASE-KR compliant backplane is based on understanding whether the Channel with the worst-case signal-to-noise ratio is compliant

The skew targets determine permissible layer separation between a-b c-d e-f and g-h pairs within each Channel and enable routing Layers to be allocated for each pair It is now possible to start the process of via tuning to optimize the channel performance for minimum insertion loss Modeling begins by defining the simulation boundaries for the channel so that Channel component models (PCB traces connectors vias) can easily be aggregated to model complete Channels Boundaries must be established at locations in the Channel where linear 3D structures exist These are shown in Figure 3 (next page)

Since the connector and via combinations for the backplane and daughtercard mating halves must each be treated as a whole it

PICMG 30Spec

TurboFabricSpec

Total Inter-PairSkew

(Fabric Interface)

05 mm in FR4(34 ps)

001 mmin N4000-13si

(00625 ps)

Total Intra-Channel Skew

(Fabric Interface)

254 mm in FR4(17 ps)

plusmn01 mmin N4000-13si

(0625ps)

Total Intra-Channel Skew

(Base Interface)

135 mm in FR4(90 ps)

plusmn01 mmin N4000-13si

(0625 ps)

Figures 2a and 2b

Table 3

Determining which Channel that is and identifying the worst-case SN requires making trade-offs with regard to PCB material Channel length via design connector row selection and NEXT and FEXT aggressor routing choices These trade-off choices can only take place using advanced 3D simulation tools such as Ansoft HFSS This was the essence of the design process employed in developing Simclarrsquos TurboFabric backplanes

The simulation processThe transmission length for full mesh and dual star backplanes design implementations varies from a maximum of 1632 inches to a minimum of 116 inches With an effective transmission length of 5 inches on each daughtercard this makes the longest effective Channel 2632 inches including two connectors

For a 10GBASE-KR application over this distance a high-perfor-mance laminate is essential for both reducing insertion loss and

ensuring high glass content in the weave to mitigate skew So the design process began by choosing a low-loss dielectric material (Nelco 4000-13SI for both the backplane and the daugh-tercards) and establishing targets for Inter-Pair and Intra-Channel skew as shown in Table 3

Adhering to the PICMG 30 specifi-cation for skew in a 10GBASE-KR application is impractical Instead a target of 00625 ps was set for Inter-Pair skew with 0625 ps set for Intra-Pair skew for the backplane only This equated to a maximum 001 mm differ-

ence being allowed between traces of any differential pair and 01 mm being permitted between traces of any four differential pairs in a Channel Given the topology of the HM-ZD connector daughter-card skew must be accounted for in the daughtercard layout Fo

Sin Pnt

should be noted that the simulation boundary is located within the mated connector

Tuning the connector and via structures to 50Ω is an iterative process involving the removal of excess pads back-drilling and tuning pads anti-pads and traces A Time Domain Reflectometer (TDR) plot illustrating the results of the tuning process is shown in Figure 4

Upon completion of the modeling process a total of 17 different optimized via and routing configurations had been designed for the full mesh design and nine for the dual star design

A plot of worst-case insertion loss is shown in Figure 5 and demonstrates that in both cases performance is well above the 10GBASE-KR mask

When all the through-Channels have been modeled adjacent Channel models can be combined and ICR curves plotted to evaluate the impact of crosstalk on through-Channel performance This valuable information can be used to adjust the position of signal Layers relative to pass-through aggressor traces on adjacent Layers or to reroute traces to reduce crosstalk Similarly routing Layers can be changed to reduce crosstalk in adjacent via barrels

Figure 6 plots worst-case ICR and demonstrates that performance is above the 10GBASE-KR mask Based on this result it was possible to proceed to physical implementation

Figure 3

Figure 4

Fo Sin Pnt

Physical realizationThe layout process was performed using the Mentor Board-Station CAD system Quad-routing (routing four traces between pads) was explored as a routing method-ology in order to reduce Layer count but this was dismissed due to the detrimental impact on crosstalk performance

The attributes of the physical backplanes produced as a result of the design effort are shown in Table 4

The design files produced included the usual gerber files plus detailed back-drilling instructions

The design validation process comprised a conventional continuity test followed by performance testing featuring Agilent equipment including 70340A signal generator 8720ES Network Analyzer NN18A S-Parameter test-set and 86100A sampling oscilloscope with Agilent 86112A module Figure 7 (next page) shows the test set up

Simclar developed special line cards to enable through-Channel measurements with and without crosstalk The signal launch featured compression mount SMAs terminated in a tuned via structure The Channel simulations included simu-lation of the tuned launch structures so de-embedding of the launches was not necessary for correlation to simulation purposes The development team also established a process for characterization of all Channels

Full Mesh Dual Star

Layer Count 34 18

Aspect Ratio 121 61

Tuned Vias 3952 768

Material Nelco 4000-13SI

Table 4

Figure 5 Figure 6

Fo Sin Pnt

In Figure 8 measured through-Channel performance and ICR curves are shown for the same Channels described in the simula-tion section earlier

As can be seen from Figure 8 there is close correlation between these and the simulated plots in Figures 5 and 6 In fact close correlation between all simulated and measured results was achieved resulting in a 728 Tbps capacity full mesh and a 960 Gbps capacity dual star backplane design now generally available as part of the Simclar TurboFabric shelf

Figure 7 Figure 8

Figure 9

Figure 10

Implications of 10GBASE-KR Draft 33versus Draft 25The work described above was targeted towards meeting the Channels specifications contained in Draft 25 of the IEEE 10GBASE-KR Since this work was completed the IEEE has up-issued the Draft revision level for the Standard from 25 to 33 While this has not impacted through-Channel performance demands it has increased Channel isolation requirements by around 10 dB In Figure 9 a Draft 33 mask is added to the ICR plot shown in Figure 8

From Figure 9 it can be seen how Draft 33 pulls the mask above the Channel ICR curve for this full mesh backplane Channel Surprisingly it is the Channelrsquos frequency response at relatively low frequencies between 100-500 MHz that is causing a problem The reasons for this are currently the subject of further detailed investigation

However Figure 10 shows a Draft 33 plot for a less demanding dual star AdvancedTCA implementation featuring shorter trans-mission distances This plot demonstrates compliance to Draft 33 of the IEEE 8023ap 10GBASE-KR Standard

ConclusionBy developing a close understanding of the many factors contrib-uting to loss and noise in multi-gigabit backplane Channels it is possible to characterize their performance using advanced simula-tion techniques and correlate that performance in physical prod-ucts using advanced test methods By overlaying the test results on S-Parameter masks defined by the IEEE 8023ap 10GBASE-KR Standard it has been demonstrated that backplanes that truly enable AdvancedTCA scalability are at last a reality

Douglas Hynd joined Simclar Group in 2006 as Director of Marketing as part of Simclarrsquos acquisition of Northrop Grumman Interconnect Technologies Division wherehe was Vice President of Marketing and Sales He has more than 24 yearsrsquo experience intechnology sales marketing and generalmanagement and holds a BSc (Eng) in Electronics and Electrical Engineeringfrom the University of Glasgow He isbased at Simclarrsquos Global HQ inDunfermline Scotland

Simclar Groupdouglashyndsimclarcom bull wwwsimclarcom

Fo Sin Pnt

6U CompactPCIPrOduCT GuIdE g

This monthrsquos issue includes a 6U CompactPCI Product Guide and Irsquod like to take the opportunity to reflect a bit on the success and evolution of that technology

Back in the 1994 time frame when CompactPCI was first being devel-oped it began as 3U-only technology It used the same Eurocardmechanics that were popularized by VME and an IEC standardized high-

density high-speed connector available from a number of vendors suitablefor 33 MHz PCI signaling That connector was selected by the engineers atZiatech with help from Mike Munroe then at ERNI The majority of VMEdesigns were 6U and based on this I was among a number of folks thatargued for adding the 6U CompactPCI form factor

The 6U form factor presented some challenges and opportunities Onechallenge was that the insertion and extraction forces were quite high when the entire rear of the card was populated with connectors Fortunately the IEEE standards for Eurocards evolved and injectorejector handles that pro-vided leverage became available Eike Waltz then at Rittal was instrumental in bringing that to the table Two of the opportunities that came along withthe extra connectors were a clean way to add secondary buses like the H110 telephony bus to the backplane and the ability to route IO out the rear through rear transition modules PICMG has developed quite a number of subsidiary specifications defining the interoperable use of the extra backplane pins made possible with the 6U form factor Both of these features have played a major part in CompactPCIrsquos success The next major evolution of 6U CompactPCI came with the PICMG 216 Packet Switched Backplane standard which was originally conceived by John Peters and his team at Performance Technologies PICMG 216 interconnected a shelf full of CompactPCI single board computers via redundant Ethernet switches also in the 6U CompactPCI form factor This dramatically increased usable backplane bandwidth and provided redundancy PICMG 216 paved the way for AdvancedTCA and was the industryrsquos first open standard for the switched serial interconnect standards we see popping up in many places

By Joe Pavlat

Looking back and ahead at6U CompactPCI

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Recent 6U CompactPCI related products are listed here For more informationenter the productrsquos RSC No at wwwcompactpci-systemscomrsc

cPCI-6910Dual-core Intel Xeon Processor LVULV Universal blade bull Supports Single Dual-Core Intel Xeon LV or ULV processorsbull Front Side Bus 667 MHz bull Up to 2 GB DDR2 400 MHz soldered SDRAM with ECC bull Four PCI Express GbEbull Up to 4 USB 20 ports bull PICMG 20 21 29 216 compliant

RSC No 35013

ADLINK Technologywwwadlinktechcom

CPCIStor Module6U CompactPCI storage blade bull Onboard ATA controller supports CDDVD HDD and solid-state flashbull Supports Hot Swap Removal (ask about RAID support) bull ATA disks available in Enhanced Dutycycle versions for NEBS Level 3 - 724 requirements bull Operating Systems supported VxWorksLinux and Windows

RSC No 34800

ACTTechnicowwwacttechnicocom

Prosody X cPCI E1T1An E1T1 digital network access card bull Suits telco developers and systems integrators bull Uses Aculabrsquos worldwide protocol coverage including Aculabrsquos SS7 stack available under a cost free license bull Available with 8 or 16 E1T1 trunks and software selectable E1T1 interfaces bull Flexible mix of protocols including ISDN CAS and SS7 (ITU-T China and ANSI) bull A variety of interconnect switching and protocol conversion solutions can be readily crafted bull High availability reliability and scalability with industry standard hardw re and software interoperability bull Up to 128 SS7 signaling links bull Non-circuit related (TCAP) messagingintensive applications such as prepaid and SMS

RSC No 35408

Aculabwwwaculabcom

Adexp8021Intel Core Duo L2400 (166 GHz) w E7520 server chipset bull Dual channel PC2-3200 Registered RAM SECDED or x4 SDDC bull Two GbE two Serial ATA four USB 20 bull Onboard SXGA graphics 1280 x 24-bitbull 6U CompactPCI Bus PICMG EXP0 R10 Specification bull RoHS compliant 0 degC to +55 degC operating range

RSC No 32837

Advanet Incwwwadvanetcojpen

TC84012 channel single-stop Time-to-Digital Converter (TDC) with single-start and multi-start acquisition modes bull 50 ps timing resolution bull Wide range with upto 20 s between first and last events bull Large internal memory buffer with up to 512 hits per channel bull Low jitter (lt3 ps rms) high stability (plusmn2 ppm) internalclock source bull External 10 MHz reference input bull FPGA based Data Processing Unit (DPU) bull Fast readout with DMA mode for increased data throughputbull Overvoltage-protected inputs with 50 Ω K-Lock (LEMO) connectors bull Built-in self calibration bull Modular single-slot 6U PXICompactPCI standardbull Low power consumption (lt22 W)

RSC No 33445

Agilent-Acqiriswwwacqiriscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

MIC-30428-slot 6U CompactPCI backplane bull AC or DC CompactPCI 500 W + 250 W redundant(2+1) power supplies bull PICMG 216 (CompactPCI Packet Switching Backplane) compliancebull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarmmodule (MIC-3924L-AE)

RSC No 32851

MIC-30436-slot 6U CompactPCI backplane bull Supports two hot-swappable SCSISATA or removableIDE HDD bays bull Built-in IDE slim-type DVD-ROM bull AC or DC CompactPCI 250 W + 250 Wredundant (1+1) power supplies bull Supports hot-swappable fan modules bull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarm module (MIC-3924L-AE)

RSC No 32850

Advantech Corporationwwwadvantechcom

Dual-Core Xeon CompactPCI SBCModel PP 42123x bull Dual CPU 6U CompactPCI SBC supporting two dual-core Xeon CPUs bull Up to 8 GB DDR2 ECC SDRAM in a single system or peripheralslot bull Dual processor SBC in a single 6U CompactPCI slot bull Supports two 166 GHz Dual-Core Intel Xeon ULV processors using Intel E7520 server chipsetbull Up to 8 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull PMCXMC site support 66 MHz PCI-X and x8 PCI Express bull Front and rear IO bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade bull Four GbE ports with option for PICMG 216

RSC No 34761

6U CompactPCI Core 2 Duo SBCModel PP 41203x bull 6U CompactPCI Core 2 Duo SBC supporting two PMC sites includingone XMC site bull Up to 4 GB DDR2 ECC SDRAM bull All in a single system or peripheral slot bull TwoPMC sites supporting up to 100 MHz PCI-X bull One XMC x8 PCI Express bull Front and rear IObull Supports 216 GHz or 15 GHz Intel Core 2 Duo processors bull Intel E7520 server chipsetbull Up to 4 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade

RSC No 34763

PP 30202xTwo processor versions available bull 18 GHz Intel Pentium M processor 745 uses mFC-PGA 478 (micro Flip-Chip Pin Grid Array) package bull 14 GHz Intel Pentium M processor Low Voltage 738uses mFC-BGA 479 (micro Flip-Chip Ball Grid Array) package bull 64 KB primary (L1) on-die cache2 MB of secondary (L2) on-die cache bull 400 MHz Front Side Bus (FSB) bull No CPU fan bull 16 GHz processor version (1 MB L2 cache) available see PP 30002x datasheet bull Utilizes 64-bitIntel 855GME chipset bull Supports 400 MHz bus frequency bull Uses Intel 6300ESB IO Controller Hub

RSC No 32659

Concurrent Technologies Incwwwgocctcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cCIBPMC6U-ETA 6U bridged dual PMC carrier that bridges extended temperature CompactPCI boards and PMCs bull Features a rugged CompactPCI form factor providing increased flexibility to military communications systems designers bull Provides additional design choices to users through its differing bus speeds maximizing the numberof PMCs that can be used CompactPCI andPMC buses can both run at 66 or 33 MHzbull Operating temperature range of -40 degC to+85 degC bull Signal conditioning bull DMA supportbull Low-power design +5 V +33 V +12 V -12 V bull User-selectable VIO of 33 V or 5 V to the PMC

RSC No 32891

Dynamic Engineeringwwwdynengcom

cPCI4IP-MMMinimized PCI address footprint IndustryPack carrier for CompactPCI applications bull 6U 4HP4 IP positions 832 clock selection for each slot fused filtered power IO options bull ID INT IO and Mem spaces are decoded for each IP slotbull Single and double wide IPrsquos bull 16- and 32- bit IPs bull 32-bit access to 16-bit IPs bull Full or mini-mized Memory Space decoding for 18 the PCI address requirement bull With the cPCI4IP-MM option 8 CompactPCI 4IP cards take the same PCI address space as 1 full Mem Space card

RSC No 34905

ACQ132CPCI32 channel MHz class simultaneous sampling intelligent digitizer bull 32 simultaneous analoginput channels 2-32 MSpschannel 14-bit resolution bull Differential inputs bull Intelligent cardwith 1 gigabyte memory and GbE on board bull Large distributed FPGA resource on boardbull Range of DSP functions including FIR filtering and Digital Downconverter

RSC No 35482

D-TACQ Solutions Ltdwwwd-tacqcouk

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CR11Based on the Intel Core Duo Processor the platform is designed to support processor speeds from 106 GHz up to 20 GHz bull Intel Core 2 Duo runs at 15 GHz up to 20 GHz bull Conduction cooled bull Two PMC slots bull PCI Express bull 2x GbE

RSC No 33156

ICS-72532-channel 6U CompactPCI DAC board bull 6U CompactPCI data acquisition card bull 32 differential output channels bull 16 or 24-bit sample size bull 288 kHzch data rate bull Simultaneous sampling across all channels on single or multiple boards bull 32 separate delta-sigma DACs bull 64-bit 66 MHz CompactPCI PICMG 20 Rev30 hot-swappable bull FPDP II 400 MBps interface

RSC No 33576

ICS-71032-channel 6U CompactPCI ADC board bull 6U CompactPCI data acquisition card bull 32 differential input channels bull 216 KHzch 24-bit resolution bull Software selectable full scale input bull FPDP II 400 MBpsinterface bull 64-bit 66 MHz CompactPCI PICMG 20 Rev 30 hot swappable bull 32 synchronous boards for simultaneous sampling bull Sonar acoustics and test and measurement applications

RSC No 33578

Tsumani 6U CPCI Development KitFPGA processor solution targeted at high performance software defined radio applications bull Dual Stratix EP1S80 FPGAs are tightly coupled to provide apower platform for signal processing bull Two PMC module sites provide IO connectivity to either front panel or back panel connections bull A direct highbandwidth 1 GBps path from the PMC P4 connector directly to the FPGAs bull Model 919 Dual DAC Mezzanine provides broadband analog signal generationin a compact form bull The board features two independent DAC channels each with its own 12-bit LVDS input capable of running at rates up to 160 MHz

RSC No 32026

CP11Rugged 6U SBC bull Up to 4 GB of DDR2 SDRAM (200 MHz) with enhanced ECC four independent onboard PCI buses system host and peripheral modesupport for the CompactPCI backplane two PMC interfaces (64-bit133 MHz and 32-bit33 MHz) bull Instead of the PMC1 a PCI Express based XMC interface is available on request bull Two GbE one Fast Ethernet two serial interfaces (RS-232 or RS-422485) USB 20 integrated HDD or flash drive bull High performance 2D3D ATI video controller capable of driving two displays in parallel supports VGADVI interface bull Intel Core 2 Duo at 216 GHz Intel Core Duo at 20 GHz2x PMC expansion site bull One XMC optional bull Up to 4 GB DDR2 SDRAM wECC 2x GbE

RSC No 33447

GE Fanuc Intelligent Platforms Incwwwgefanucembeddedcom

Single Board ComputersGD Canada designs and manufactures conduction-cooled Single Board Computers (SBCs)using Intel processors bull 6U and 3U form factors for CompactPCI backplanes bull Fully backward compatible with earlier models bull Upgradeable via the change-out of processor memory andIO modules bull Used within GD Canada computer systems and sold as individual products

RSC No 35281

General Dynamicswwwgdcanadacom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cPCI6U-24DSI32R32-channel 24-bit delta-sigma CompactPCI 6U analog input board with rear IO bull Low noise 24-bit resolution low phase distortion andmulti-board synchronization bull Suits state-of-the-art sonar and noise monitoring applications bull 32-channel cPCI6U-24DSI32 analog input boardprovides a high-density 24-bit analog input resources on a standard 6U CompactPCI expansion board bull Applications from precision voltagemeasurements to complex audio signal and waveform analysis

RSC No 34985

General Standards Corporationwwwgeneralstandardscom

Duet 3U 64-bit 1 GHz TMS320C6416 DSP (x2) 64 MB SDRAM per processor bull Flexible internalexternalcommunication mesh bull 64-bit66 MHz CompactPCI bull PMCXMC site with Jn4 to FPGA and4 RocketIO per VITA 42 bull External data port up to 12 Gbps bull 4M or 5M Virtex-II Pro FPGAbull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM dedicated800 MBps links between DSPs bull 3U CompactPCI with PXI support bull Suits high-end co-processing wireless broadband communications RADAR video and biometrics

RSC No 32856

QuadiaQuad-DSP bull Dual FPGA bull Dual PMC sites bull Inter-processor connectivity and access to external interfaces bull Four C6416 DSPs split in two independent clusters each hosting a PMC site bull One large FPGA for end-user code bull Central FPGA routing interprocessor communication bull End-user FPGA communication bull External port serial IO for PCIe or other p ivate link bull Global memoryand PCI interface bull 1 GHz TMS320C6416 DSP (x4) bull 64 MB SDRAM per processor bull Flexible internalexternal communication mesh bull 64-bit66 MHz CompactPCI bull Two PMC sites with Jn4 to FPGA bull External data port up to 12 Gbps bull Two 4M Gate FPGA reserved for end-user code bull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM bull Up to 512 MB Global DDR SDRAM bull Suits high-end co-processing wireless and broadband communications

RSC No 34737

Quixote 64-bit 6UAdvanced signal capture generation and co-processing bull 1 GHz TMS320C6416 DSP and2 to 6 MGATE Virtex-II FPGA bull 32 MB SDRAM 8 MB ZBT SBSRAM and AD6645 and AD9764 converters bull 6432 bit CompactPCI 66 MHz 5 V33 V and complex trigger modes with HW event logging bull PMC site with Jn4 to FPGA DIO and PICMG 217 StarFabric compliant bull Suits Software Defined Radio wireless IP and RADAR development and hardware testing bull Physical Layer field testing ultra-fast flexible data acquisition vector signal generation and electronic warfare

RSC No 32861

Innovative Integrationwwwinnovative-dspcom

IC-e6-cPCIbHigh performance 6U CompactPCI board bull Powered by one or two of Freescalersquos mostadvanced 14 GHz MPC7448 PowerPC processors bull PICMG 216 compliant bull Marvell Discovery III chipset (MV64460) bull Low power consumption bull Standard extended and rugged grades

RSC No 32982

Interface Conceptwwwinterfaceconceptcom

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PrOduCT GuIdE6U CompactPCI

CP213Single-width 6U CompactPCIPXI module with either 32 or 64 differential analog input channelsbull 32 64 or 128 channels of analog input bull 16 multifunction digital IO (TTL) channels that may beconfigured as digital in digital out or selectively attached to 2 frequency in 2 counter in andor 2 timerout channels bull 16-bit resolution bull Programmable gain per channel programmable scan rates of lt1 Ss through 100 KSs bull Precision onboard reference for end-to-end calibration

RSC No 34804

KineticSystems Company LLCwwwkscorpcom

CP6001Energy efficient embedded Intel dual core processors bull 12 GHz Intel Core Duo U2500 ULV processor bull Intel Core 2 Duo L7400 LV processor bull Based on the Intel Mobile 945GM chipset with a front side bus of up to 667 MHz and ICH7-R Southbridge bull Two independent digital video outputs to the rear IO (2x DVI - 1x DVI and 1x HDMI) bull AC97 audio capabilities bull 3 x GbE bull 4 x SATA with RAID 01510 functionality bull 6 x USB 20 2 x COM and VGA or DVI bull Can also accommodate a PMC slot or an onboard 25 inch SATA HDD bull Up to 8 GB of USB or 2 GB soldered flash bull Supports Linux Windows XP XP embedded and VxWorks 6

RSC No 34182

CP6923 GbE Switch6U CompactPCI GbE Switch PICMG 216 compliant bull Leading edge te hnology basedon BCM5650X chip bull 24x GbE ports bull Non-blocking Layer 2 and 3 switching and routingbull Copper optical rear IO version bull Hot swap IPMI bull Fully managed bull Comprehensive firmware package bull Applies to VoIP installations such as call servers media gatewaysand trunking gateways in wireline and wireless networks as well as VoIP systems inenterprise networks with high demands on performance

RSC No 32256

Kontronwwwkontroncom

TMS320C6701 Virtex-IITexas Instrumentsrsquo C6701 DSP bull Xilinx Virtex-II series FPGA up to XC2V8000 bull Multiple IO interfaces Onboard CODEC VIM expansion sites 60-pin GPIO header and JTAG bull Hardware drivers integration in SimulinkXilinx System Generator Blocksets for quick implementation of Simulink models bull DSP and FPGA-in-the-loop cosimulation of SimulinkXilinx System Generator models bull Leading edge communication interface allowing real-time datamonitoring from Simulink scopes and remote operations

RSC No 32028

VHS-DACHigh performance multichannel DA for phased array antenna systems radarsonar communications receiversup-sampling to IF stage and RFIF AGC apps bull Eight 125 MSPS output channels bull Optional add-on daughter boardprovides 8 additional output channels or 8 additional input channels bull 32-bit 25 MHz bull FPDP interface with 400 MBps transfer rate (25 MSPS per channel at 8 channels 125 MSPS at 16 channels) bull Low level hardware drivers API andGUI bull High level hardware drivers integration in Simulink Blocksets bull Leading edge communication interface fordata recording and playback tofrom the onboard SDRAM

RSC No 32029

Lyrtechwwwlyrtechcom

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PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

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PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

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PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

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PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

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PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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Page 14: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

APPLICATION g

Based on current overall network growth Telecom Equipment

Manufacturers (TEMs) and Network Equipment Providers (NEPs)

are being challenged to launch new communications platforms

that provide optimal scalability flexibility manageability and

high computing performance With the expected increase in new

subscribers who need to be supported across the network TEMs and

NEPs are focusing on COTS platforms that meet the requirements of

a carrier-grade environment

With these new challenges it is important to take a look at the different

applications in the network to thoroughly evaluate the best hardware

platform approach Comparing the scalability IO functionality

interconnectivity and overall performance gives TEMs and NEPs a

solid basis from which to choose the best cost-effective solution for

their applications This article compares the traditional 1U PCI

platform with a more modular AdvancedTCA-based approach to

a Home Subscriber Server (HSS)-based platform

Emerging next-generation network architecture IMS Carriers and service providers are focused on improving their Average Revenue Per User (ARPU) by deploying new services quickly and at a price that is acceptable to subscribers IP Multimedia Subsystems (IMS) enable service providers to offer differentiated services to their subscriber base integrating voice video text and content as part of their service mix regard-less of the access technology

The IMS framework provides the telecom industry with a modular standards-based IP service delivery infrastructure More than simply replacing existing circuit services with similar services delivered over IP IMS allows service providers to capitalize on faster and more cost-effective deployment of new and differentiated multimedia communication services

While these new technologies promise new sources of revenue and enhanced customer loyalty they also pose implemen- tation challenges One of the crucial net-work elements within an IMS framework is the manageability of the subscriber base Today an increasing number of users subscribe to multiple services such

By Sven FreudenFeld

Choose the right formula forcompute-intensive HSS systems

AdvancedTCA platforms

versus1U PCI rack-mount servers

AdvancedTCA

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as multimedia mobile phones VoIP or IPTV at home Service providers must manage ldquoduplicatedrdquo subscriber databases for each particular service Consequently managing a converging subscriber base for such network functions as billing across multiple different technologies presents a tremendous challenge Any downtime of this network element can be costly to the carrier or service provider not to mention the heavy risk of losing subscribers over the long term

The HSS and Home Location Register (HLR) are key elements in the IMS network required to manage the growing number of subscribers These platforms that manage millions of customersrsquo data need to be highly reliable with carrier-grade High Availability (HA) functionality Core requirements for the HSS computing platform are

n High compute density for application processingn Scalable performance and high densityn Fast read access to the subscriber datan Large storage and memory bandwidthn Ability to consolidate multiple IMS elements and subscriber data within a single

platform with a modular approach as a converged services platform

HSS plays network backbone roleHSS provides the important network backbone of the IMS architecture because it eases innovation and addresses a range of service-logic interaction issues that have plagued previous service architectures HSS offers open access to service-related data for each subscriber supporting the sharing of data among multiple services

HSS is essentially the master user database that supports IMS network entities that handle calls and sessions It contains user profiles performs authentication and authorization of the user and can provide information about the physical location of the user It plays a key role in provisioning service creation enabling subscriber data and managing control roaming and interconnection The Application Server (AS) which hosts and executes serv- ices in the IMS environment communicates with the HSS Call State Control Function

(CSCF) servers also communicate with the HSS which must be able to

n Support IMS-level authentication and authorization

n Maintain IMS subscriber profile(s) independent of access types

n Maintain service-specific datan Keep track of currently assigned

CSCFn Support CSCF and AS access

HLRHSS hardware platform design choicesHSS design must enable the HSS to be deployed cost-effectively and expand readily to meet future subscriber levels For example the trend to include more information as part of the data record for each subscriber will drive up memory requirements

From a technical perspective the key metrics to understand when developing the IMS HSS functions are the number of completed transactions required per sec-ond and the size of the subscriber base

HSS architecture typically comprises multiple processor units with extensive memory requirements With the introduction

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of multicore processors from Intel developers can scale performance while optimizing power consumption in the overall system design

To meet these requirements the hardware platform needs to provide scalability flexibil-ity and long-term cost efficiency In comparing the traditional 1U platform with a more modular approach to the HSS using AdvancedTCA consider the following

n High compute performance n High memory and storage capabilityn IO functionality to connect to multiple networks (such as SS7 and Ethernet)n Carrier-grade profile and redundancy

AdvancedTCA High density with scalability on a smaller footprintTable 1 illustrates a comparison of a sample AdvancedTCA-based platform and a 1U PCI rack-mounted platform for HSS applications This configuration assumes an increasing subscriber growth from 1 million (M) subscribers to 18M subscribers per platform

FootprintAdvancedTCA-based platforms provide a high density compute platform with scalability on a smaller footprint TEMs can easily add boards to a chassis to accommodate more traffic and to support new services This flexibility enables an increase in subscribers and the database without having a major impact on rack space in the central office environ-ment To meet the same capacity for 18M subscribers the 1U PCI approach will occupy two bays or cabinets with a total footprint of 28 square feet compared to the same capacity occupying one bay or cabinet with a footprint of 14 square feet (see Figure 1)

CoolingWhile the power consumption per square foot is higher than the 1U PCI platform AdvancedTCA offers better airflow and cooling distribution using a push-pull cooling system Each 1U PCI platform includes up to nine cooling fans and is dedicated to that CPU in the 1U server only which translates into higher overhead Therefore the airflow is

not optimized in the overall system design In the case of a fan failure AdvancedTCA platforms enable easier access to replace the fans which are field replaceable units The 1U platform also does not include any integrated centralized switching or management capabilities therefore the total does not include any switching or system management functionality

ScalabilityAdvancedTCA architecture lends itself well to scalability As AdvancedTCA sup-ports both a Base and Fabric interface into the backplane and the separation of data and control planes TEMs can also scale up their designs from 1 GbE to 10 GbE to accommodate new users and usage requirements AdvancedTCA based systems are designed for easy upgrade-ability to new processing blades switch fabrics and IO modules using Advanced Mezzanine Cards (such as SS7)

Since AdvancedTCA and AdvancedMCs offer hot swap capabilities and HA func-tionality growing a subscriber base by using additional CPU blades within the system with low maintenance or upgrade downtime is crucial for the HSS plat-form It also allows for the up and down

AdvancedTCA-based HSS Platform 1U PCI Rack-Mount HSS Platform

Number ofsubscribers

~1M subscribers = 4 CPU blades edundant ~1M subscribers = 4 x 1U

~4M subscribers = 7 CPU blades redundant ~4M subscribers = 7 x 1U

~6M subscribers = 12 CPU blades redundant ~6M subscribers = 12 x 1U

~18M subscribers = 36 CPU blades redundant= 3 AdvancedTCA shelves per rack

~18M subscribers= 36 x 1U+ external switch components for redundancy

Technicalspecs

1 CPU blade = 2 x Intel Xeon dual core = quad core 1 1U rack-mount Intel= Intel Xeon quad core or dual core CPU

16 G DDR 2 memory Max of 8 G DRY memory

+ 2 x SATA or SASS hot swap (RAID 0 and 1)+ 1x PCI Express for SS7 Dual GbE per 1U rack-mount server

4 x GbE per CPU with built in GbE backplane switching separating Control Pathand Data Path with multishelf expandability

External central switching required withmultiple external GbE connectivity

Systems and blade manageability built into the platform withIMP implementation SNMP and CLIP

Carrier-grade redundancy on switch and node

IO for SS7 or other interface modules

CPU blade hot swap capability

Thermaland power

requirements

~6M subscribers redundant= 14 slots with centralized chassis cooling

~6M subscribers redundant= 18 x 1U PCI with independent cooling and separate switch units and system management

Total power consumption= ok (3100 W for blades and RTM + 500 W Shim fan tray and SAP)

Total power consumption= ok

Table 1

Fo Sin Pnt

scaling of the platform depending on the subscriber increase or decrease When consolidating multiple services minimiz-ing multiple duplicate databases requires this flexibility

InterconnectivityThe AdvancedTCA platform offers a number of interconnectivity features including

n Separation between the data plane and the control plane

n Direct uplink in a multichassis envi-ronment with up to l0 GbE

n Node to node base and fabric connec-tivity with HA carrier-grade Ethernet functionality

n Easy upgrade path to l0 GbE for increased bandwidth

By contrast the 1U PCI platform requires

n Additional external interconnectiv-ity between 1U rack-mount servers which increases the number of points of failures and the operating and maintenance costs

n Additional switching equipment for carrier-grade Ethernet connectivity

n Additional manage-ment (Simple Network Management Protocol [SNMP]) for HA redundancy

PowerThe 1U-based platform also utilizes integrated AC power supply units usually the standard for the data center and enter-prise environments AC will increase the pro-viderrsquos OPEX in the long term since the power consumption per rack is significantly higher and

Figure 1

requires additional support equipment such as an Uninterruptible Power Supply (UPS) and an AC to DC converter per rack space and ultimately per CPU These factors along with the requirements for carrier-grade functionality HA support and a more favorable long-term OPEX further reduce the need to consider the 1U solution for HSS deployments in Central Office networks

ManageabilityAdvancedTCA chassis-level management is based on the industry-standard Intelligent Platform Management Interface (IPMI) IPMI makes possible interoperability among chassis and blowers compute nodes switches and management solutions from multiple vendors enabling these elements to work together seamlessly The resulting successful inter-blade communication for applications including failover and clustering provides full manageability on a per shelf and per bay basis

Fo Sin Pnt

One of the primary goals of the AdvancedTCA specification is to ensure a very low Mean Time to Repair (MTTR) and high Mean Time Between Failures (MTBF) There are no active components in the backplane ndash which can translate to expensive repairs in the field In addi-tion AdvancedTCA specifies that all com-ponents can be hot swappable in the field and the architecture provides redundancy at all levels This hot swap capability translates to less downtime for field replacement on a per CPU blade basis as compared to 1U PCI

SummaryAdvancedTCA provides an ideal platform and meets the technical requirements for deploying flexible and scalable IMS HSS applications While other platform archi-tectures such as 1U rack-mount servers may with considerable difficulty be able to deliver HSS capabilities AdvancedTCA offers a much more advantageous solution by providing a smaller footprint improved cooling and thermal characteristics bet-ter scalability enhanced interconnectivity and easier manageability This all contrib-utes to making AdvancedTCA a lower cost approach in terms of CAPEX and OPEX for long-term subscriber growth

1U PCI rack-mount servers are not considered to be the optimal hardware platform for HSS applications in a Central Office With its limitation for carrier-grade flexibility and HA functionality the 1U PCI platform is best suited for a full range of other enterprise and Internet infrastructure applications within a data center environment that does not require any significant flexibility and HA functionality around it It might also be a good entrance point for other enterprise applications with lower price points

The use of AdvancedTCA-based platforms enables TEMs to shift away from hardware development and refocus their efforts on delivering value-added software and services As a result they can realize lower development costs and faster time-to-market enabling increased flexibility with each product design through the use and reuse of standardized off-the-shelf components Equally significant are the advantages that can be realized by the service provider With a common platform and a flexible architecture that maximizes limited floor space service providers can rapidly and flexibly implement a broad range of feature-rich solutions for faster profitability

Sven Freudenfeld is responsible for North American Business Development for the Kontron AG line of AdvancedTCA AMC MicroTCA and Pre-Integrated Solutions Sven possesses more than 15 years of experience with voice data and wireless com-munications having worked extensively with Nortel Networks in Systems Engineering Sanmina-SCI in Test Engineeringand Deutsche Telekom in Network Engineering Sven holdsan electrical engineering degree from Germany and is also Chair of the CP-TA marketing workgroup focusing on the interoperability of COTS standard building blocks

Kontron bull svenfreudenfeldcakontroncom bull wwwkontroncom

Fo Sin Pnt

Fo Sin Pnt

TECHNOLOGY g BACkpLANES

Increasing demand for service and multimedia features is stimulating a growing need for speed in telecom-munications equipment While some

applications such as PBX systems can be addressed with the gigabit backplane technologies currently available others are running out of headroom Routers may soon need 10 Gbps and higher speed back-planes to keep up with network demand Many such applications can justify the expense of moving to higher performance if it becomes available

Currently telecom system designs offer backplanes that can handle interconnec-tions running as fast as 3125 Gbps raw data throughput per lane (with around a maxi-mum data rate capability of 5-625 Gbps per lane) The AdvancedTCA standard for instance uses Ethernetrsquos XAUI inter-face AdvancedTCA achieves a 10 Gbps net data rate by running four serial lanes for each interconnection with each lanersquos

SERrializerDESerializer (SERDES) op-erating at 3125 Gbps raw data (25 Gbs net)

As demand forces systems to move beyond these rates however new technologies will be needed One proposal calls for the use of XAUI+ or double XAUI which increases lane SERDES rates to 625 Gbps per lane and hence the throughput to 20 Gbps Another proposal is to use IEEE 8023ap known as 10GBASE-KR which runs a single SERDES lane at 125 Gbps raw data rate (103 Gbps net) But these are only short-term answers To address future demands organizations such as the Institute of Electrical and Electronic Engineers Standards Association (IEEE-SA) are developing specifications for Ethernet speeds of 40 Gbps to 100 Gbps which will be applied to backplane interconnect

Such high clock rates however will pose significant design challenges for developers

One of the first challenges that will need resolution is the design and layout of the backplane and other PCBs Common design practice today readily handles board clock rates of around 10 Gbps Well established design rules are in place and board layout tools such as autorouters can automatically handle board designs for speeds in the 10 Gbps range Designers may use specialized board material create additional ground planes and perform similar tasks in order to ensure proper board operation at the higher end but even speeds to 5 GHz are within current design tool capabilities

Design gets trickierAbove 5 GHz however board design gets more involved because feature dimensions become significant when compared to the signalrsquos wavelengths Variations in board thickness can affect signal propagation Corners where traces change direction and small spurs along edges of poorly etched

Channel characteristics

challenge backplane interoperability

Serial backplanes in telecommunications systems aim for high speed with room for

growth As systems began using 10 Gbps links however issues arose that affected backplane

communications among cards from different manufacturers Stuart points out that the

industry must define key backplane channel characteristics so that designs based on open

standards maintain interoperability as backplane speeds move to 40 Gbps and beyond

By Stuart JamieSon

Fo Sin Pnt

traces can act as antennae for the higher fre-quencies in digital signals As can be seen in Figure 1 sharp corners and minor flaws that are inconsequential at lower frequen-cies have the potential to become trouble-some antennae at future high speeds This can result in the trace radiating away the signalrsquos high frequency energy increasing EMI and crosstalk as well as altering signal waveforms New routing design rules such as making corners 30deg instead of 45deg and more careful board fabrication techniques may become necessary as designs move above the 10 Gbps per lane threshold

The move to higher frequencies will affect more than board fabrication and layout however Higher frequencies will also impose new requirements on signal tim-ing signal rise-time electrical distance and waveform shape if developers are to retain the mix-and-match system design approach that makes standards-based system design effective

For interoperability to be achievable at data rates above 10 Gbps organizations such as PICMG will need to carefully define a vari-ety of signal and design parameters in their specifications Some of the key parameters that will need consideration include

n Interconnect signal attenuationn Eye diagramn Jittern Input clock recoveryn Chip inputoutput pre-emphasis (PE) n Equalization (EQ)

Even slight variations in these parameters from device to device and lane to lane can shift the timing of signals a significant fraction of a clock cycle and affect the Bit Error Rate (BER) of a lanechannel Finally signal rise times will require tight control as signal rates increase in order to ensure control of system timing (see Figure 2)

In defining signal and design parameters specifications will also need to account for the increased location dependency that comes with higher frequencies Even subtle differences in attributes such as routing length and trace impedance become increasingly significant as signal speeds rise To ensure mix-and-match interopera-bility then design specifications may need to account for the specific backplane slot that a board is to occupy as well as introduce a method to obtain and control the PE and EQ of the devices connected to the lanes

Designers must also address fabrication standards The material used to fabricate

Figure 1

Figure 2

Fo Sin Pnt

the board the thickness and composition of metal cladding and the spacing between layers can all affect the trace characteris-tics Controlling these parameters under specification ensures that timing charac-teristics are sufficiently uniform from one board to another However current speci-fications are too detailed and stringent It is extremely difficult to attain compliance yet avoid adding cost to the design

Specifications need workSome of these parameters are already incorporated into current specifications The AMC module specifications from PICMG for instance include design parameters that ensure its proper opera-tion at signal speeds as fast as 125 Gbps per lane Establishing specifications for other system components will help achieve interoperability of standards-based designs at higher frequencies

Design tools may also need to be modified and the industry will need to create new design rules for high frequency and incor-porate these into the tools Developing new routing techniques will help avoid the issues of electrical phenomena such as skin effect dielectric loss and impedance mismatches These are much more preva-lent at higher frequencies and it becomes critical for engineers to model and simu-late these phenomena more accurately

Early efforts are already underway to address the challenges that higher fre-quency signals bring to standards-based design The Interconnect Channel Characterization Subcommittee of PICMG established in September 2006 is develop-ing ground rules and definitions to be used in characterizing transmission reflection and crosstalk performance in backplane and mezzanine carrier interconnects The committee aims to define the channel parameters to be measured or analyzed as well as the methods for doing so Its charter calls for it to address

n Definition of interfaces at which measurements are made or characteristics computed

n Test equipment fixtures and PCB test coupons

n Details of measurement proceduren Data formatsn Techniques for de-embedding

components of the channeln Techniques for validating

measurement based models ie passivity and causality

n Definitions that allow reasonable compliance testing

n Boundary definitions for different paths

n Define information regarding limita-tions or proper usage ie maximum data raterise times that are supported by the models

Such efforts are only a beginning how-ever Other design details still need to be addressed such as SERDES IO Configuration New functionality may need to be defined The design of high data rate system channel interfaces according to standardsspecifications does not currently cover the individual characteristics of the chip transmitterreceiver characteristics Thus work will be needed to address how such standard designs handle such dependency

Crossing an interoperability thresholdOne way of handling location dependen-cies might be to give the system control-ler the ability to inform modules what the channel transmitter and receiver PE and EQ technology is and importantly how to control it With this information along with the signal attenuation suffered (at a given bit rate) for the channel the system should be able to configure SERDES channels in different physical locations to run reliably and at the required BER In MicroTCA systems for instance this functionality could be incorporated into the MicroTCA Carrier Hub (MCH) as part of its electronic keying function Modules would have to be able to configure and control its backplane interfaces to allow for different positions

in the backplane An MCH (see Figure 3 courtesy Emerson) then would be able to instruct a module as to which parameters to use for interoperability

The specific approaches needed to handle location dependencies and other challenges that higher signal rates raise have yet to be developed The need to address these challenges however is clear Increasing demand for services is driving applications to utilize faster signal rates This in turn is driving backplane signaling speeds ever higher As speeds rise above 10 Gbps sig-nals will cross a threshold where current specifications will prove inadequate for ensuring interoperability among standards-based designs

The industry should begin developing new or enhanced specifications and design tools to address the challenges of higher signal rates Without such improvements the guarantees of interoperability that allow system developers to readily create solu-tions by combining off-the-shelf products will be compromised As backplane speeds approach 100 Gbps nothing can be taken for granted

Stuart Jamieson Director of Industry RelationsArchitect with Emerson Network Power Embedded Computing represents Emerson on PICMG committees and the SCOPE organization and previously served as a CP-TA Board member (Treasurer) He brings over 18 years of experience in hardware protocols embedded software and specification development to these groups Within Emerson he played a key role in the develop-ment of the technology central to Emersonrsquos bundled network-ing solutions Stuartrsquos positions within Emerson have included Director of Business Development Director of Advanced Technology and Architect He is the Draft Editor for the PICMG Interconnect Channel Characterization Subcommittee is the author of the introduction section for the new PICMG Ruggedized MicroTCA specification and served as the Draft Editor for the PICMG MicroTCA Specification Stuart gradu-ated from the Heriot-Watt University in 1989 with a 1st Class Honors degree in Electrical and Electronic Engineering and again in 1992 with an IBM-sponsored Master of Philosophy

Emerson Network Power Embedded ComputingStuartJamiesonEmersoncom bull wwwemersonembeddedcomputingcom

Figure 3

Fo Sin Pnt

TECHNOLOGY g BACkpLANES

2008

B A

N D

W I

D T

H

Signal integrity challenges to bandwidth scalabilityFor the purposes of this article each interconnected differential pair will be referred to as a Channel (which should not be confused with an aggregated AdvancedTCA channel comprising four trans-mit and four receive pairs)

14-slot full-mesh AdvancedTCA backplanes contain hundreds of Channels Each Channel is defined as the copper signal path from the output of a driver device to the input of a receiver device As

By douglaS Hynd

Developing IEEE 8023ap 10GBASE-KRcompliant backplanes

Why doesAdvancedTCA

need bandwidthscalability

PICMG AdvancedTCA 30 has emerged as the

industryrsquos Hardware Platform standard of choice and

is enjoying first-phase deployment However many

believe that for AdvancedTCA to realize its market

potential AdvancedTCA platforms need to seamlessly

scale to accommodate 40 GbE fabrics thereby

avoiding forklift upgrades as system bandwidth

demands increase over time A 40 GbE switch fabric

architecture would enable realization of a common

platform for computing storage control and media

and packet processing and provide the versatility and

long term ROI required by service providers in

todayrsquos increasingly competitive environment

The challenge was to develop a family of

AdvancedTCA products which feature PICMG 30

compliant dual star and full mesh advanced

backplane switch fabrics enabled up to 10 Gbps

per differential signal pair thereby giving 40 Gbps

per AdvancedTCA channel performance

This article describes the signal integrity challenges

presented in designing an IEEE 8023ap

10GBASE-KR-compliant bandwidth-scalable

14-slot AdvancedTCA platform and how these

challenges were overcome in development of full

mesh and dual star backplane reference designs

Fo Sin Pnt

shown in Figure 1 that signal path comprises a signal launch a blade PCB transmission line a daughtercard via a right-angled HM-ZD connector a mated HM-ZD backplane header a back-plane via a length of backplane PCB transmission line and then the same combination of connectors vias and transmission line at the receive end of the Channel

Sources of crosstalkFour principal sources of crosstalk in each Channel must be man-aged as shown in Table 2 Source number one is between adjacent differential pairs as they are routed across the backplane Common mode noise rejection in system differential pair structures makes this a minor issue The second source of crosstalk lies in the HM-ZD connector itself

Crosstalk in via fields our third source primarily arises from inductive coupling between adjacent differential pairs and domi-nates the crosstalk agenda in high-speed Channels This source of crosstalk is directly proportional to the length of the via barrel and where practical care must be taken to ensure that adjacent connector rows are terminated to different target routing Layers

The final source of crosstalk is caused by aggressor signals in through-routed via fields coupling with victim Channel traces as they pass through As mentioned earlier judicious and careful design can mitigate this impact

Skew Channel skew is a function of differential transmission path geometries At a fundamental frequency of 5 GHz skew can be a significant issue in high-speed system design due to narrowing the eye opening and increasing jitter Skew can have a significant impact on crosstalk it negatively impacts the common mode rejection of noise inherent to differential signaling Conductor surface roughness in lower performing dielectric materials can also cause skew in high-speed systems

Skew can be avoided through careful management of transmission path lengths in each Channel and by using higher-glass content (lower Dk) laminates

LossPotential

Potential Mismatches

Channel

Loss Potential Channel

PCB Tolerance -025 dB 2 -01 dB

Connector Tolerance -001 dB 4 -016 dB

Thru-routed Via Fields -001 dB 12 -144 dB

Connector Launch -025 dB+ 4 - 2 dB+

Quantity TotalNEXT

TotalFEXT

PCB Transmission Lines

24 in60 cm

-50 dB -70 dB

Connector Architecture 2 -26 dB -24 dB

Via Fields 4 -22 dB -20 dB

Connector Pass Through 8 -34 dB ndash34 dB

For the target application each one of these Channels must deliver a 10 Gbps Non-Return-To-Zero (NRZ) signal with sufficient signal fidelity to enable a receiver device to detect and process a differential signal The PICMG 30 specification is targeted at 3125 Gbps signaling with a fundamental frequency of 156 GHz Even in low loss dielectric materials insertion loss at 10 Gbps (5 GHz fundamental) is twice that of a 3125 Gbps signal

Therefore achieving acceptable signal fidelity requires careful management of signal losses and noise in each Channel such that an acceptable signal-to-noise (SN) ratio is achieved at the receiver

The design process therefore begins by understanding and mitigat-ing the sources of losses and noise in each Channel

Sources of lossThere are three sources of loss

n Conductor losses which are due to skin effects and can be addressed by maximizing the cross sectional area of the signal traces

n Material dispersion losses which are a function of the dielectric constants of the chosen material These can be mitigated by choosing a higher performance laminate material such as Nelco 4000-13SI or Megtron

n Reflected power loss due to impedance mismatches in the Channel as each signal transitions across the different copper media in each channel (connectors vias and PCB traces) and passes through the pad and anti-pad structures of the via fields of other backplane blade slots

Table 1 shows the relative effects of different sources of impedance mismatches The dominant source of impedance mismatches in every Channel resides in the via structures Successful mitigation of this problem requires that every via is tuned by back-drilling the stub and adjusting the pad and anti-pad structures to match the impedance to be 50 ohms irrespective of the target routing layer This in turn requires that the capacitive and inductive effects of the connector pin and via barrel combination are taken into account during the design of each Channel

Further complicating via design is the space the anti-pad structures need to accommodate Channels being routed between other blades while minimizing electro-magnetic coupling with them This space consideration makes the shape and orientation of pads and anti-pads extremely important

Figure 1

Table 1

Table 2

Fo Sin Pnt

IEEE 8023ap provides a design targetAs Ethernet has emerged as the industryrsquos dominant signaling methodology the IEEE has developed the 10GBASE-KR norma-tive Channel model to define interconnect Channel performance for NRZ signaling at 10 Gbps This standard defines acceptable performance in terms of S-parameter charts for through-Channel insertion loss and worst-case crosstalk Figures 2a and 2b illustrate masks for Draft 24 of the standard that was initially used for this exercise

In each case the mask defining compliant performance is shown in blue Channel insertion loss is shown in red in Figure 2a Crosstalk performance is defined by the ICR curve (Figure 2b) Minimum acceptable Channel performance is defined in the ICR chart (Figure 2b) by the blue line The effect of the sum of all aggressors on the through-Channel is shown in red The green ICR curve is the ratio of the crosstalk power sum calculated by summing the

magnitudes of any impacting crosstalk Channels for each fre-quency and using a straight line fit (using least-squares method) to determine the resulting average effect f the aggressors on the through-Channel This is then overlaid on the insertion loss and used to plot the ICR curve

This standard which has evolved through a variety of iterations forms the basis for developing a 40 GbE switch fabric backplane featuring 10 Gbps NRZ differential pairs If all differential pairs can meet this standard then the backplane can be considered to be 10GBASE-KR compliant

Applying 10GBASE-KR to a 14-slotAdvancedTCA applicationThe PICMG specification dictates that receive differential pairs are placed on the c-d and g-h rows of the HM-ZD connector and that transmit differential pairs are placed on the a-b and e-f rows Therefore the middle differential pair in row c-d of Slot B will be subject to the NEXT of three aggressors in each of the a-b and e-f transmit rows of slot B plus the FEXT of the signals being received in the c-d pairs in the top and bottom of slot B

In this topology it can be seen that worst-case crosstalk would occur if all the NEXT and FEXT aggressors were routed on the bottom Layer that is on the same Layer as that of the victim c-d However given that all signal vias must be back-drilled and tuned for impedance management purposes Channel crosstalk can simultaneously be reduced by allocating different routing Layers to differential pairs terminated in the same backplane connector

The principal factor in determining the feasibility of a 10GBASE-KR compliant backplane is based on understanding whether the Channel with the worst-case signal-to-noise ratio is compliant

The skew targets determine permissible layer separation between a-b c-d e-f and g-h pairs within each Channel and enable routing Layers to be allocated for each pair It is now possible to start the process of via tuning to optimize the channel performance for minimum insertion loss Modeling begins by defining the simulation boundaries for the channel so that Channel component models (PCB traces connectors vias) can easily be aggregated to model complete Channels Boundaries must be established at locations in the Channel where linear 3D structures exist These are shown in Figure 3 (next page)

Since the connector and via combinations for the backplane and daughtercard mating halves must each be treated as a whole it

PICMG 30Spec

TurboFabricSpec

Total Inter-PairSkew

(Fabric Interface)

05 mm in FR4(34 ps)

001 mmin N4000-13si

(00625 ps)

Total Intra-Channel Skew

(Fabric Interface)

254 mm in FR4(17 ps)

plusmn01 mmin N4000-13si

(0625ps)

Total Intra-Channel Skew

(Base Interface)

135 mm in FR4(90 ps)

plusmn01 mmin N4000-13si

(0625 ps)

Figures 2a and 2b

Table 3

Determining which Channel that is and identifying the worst-case SN requires making trade-offs with regard to PCB material Channel length via design connector row selection and NEXT and FEXT aggressor routing choices These trade-off choices can only take place using advanced 3D simulation tools such as Ansoft HFSS This was the essence of the design process employed in developing Simclarrsquos TurboFabric backplanes

The simulation processThe transmission length for full mesh and dual star backplanes design implementations varies from a maximum of 1632 inches to a minimum of 116 inches With an effective transmission length of 5 inches on each daughtercard this makes the longest effective Channel 2632 inches including two connectors

For a 10GBASE-KR application over this distance a high-perfor-mance laminate is essential for both reducing insertion loss and

ensuring high glass content in the weave to mitigate skew So the design process began by choosing a low-loss dielectric material (Nelco 4000-13SI for both the backplane and the daugh-tercards) and establishing targets for Inter-Pair and Intra-Channel skew as shown in Table 3

Adhering to the PICMG 30 specifi-cation for skew in a 10GBASE-KR application is impractical Instead a target of 00625 ps was set for Inter-Pair skew with 0625 ps set for Intra-Pair skew for the backplane only This equated to a maximum 001 mm differ-

ence being allowed between traces of any differential pair and 01 mm being permitted between traces of any four differential pairs in a Channel Given the topology of the HM-ZD connector daughter-card skew must be accounted for in the daughtercard layout Fo

Sin Pnt

should be noted that the simulation boundary is located within the mated connector

Tuning the connector and via structures to 50Ω is an iterative process involving the removal of excess pads back-drilling and tuning pads anti-pads and traces A Time Domain Reflectometer (TDR) plot illustrating the results of the tuning process is shown in Figure 4

Upon completion of the modeling process a total of 17 different optimized via and routing configurations had been designed for the full mesh design and nine for the dual star design

A plot of worst-case insertion loss is shown in Figure 5 and demonstrates that in both cases performance is well above the 10GBASE-KR mask

When all the through-Channels have been modeled adjacent Channel models can be combined and ICR curves plotted to evaluate the impact of crosstalk on through-Channel performance This valuable information can be used to adjust the position of signal Layers relative to pass-through aggressor traces on adjacent Layers or to reroute traces to reduce crosstalk Similarly routing Layers can be changed to reduce crosstalk in adjacent via barrels

Figure 6 plots worst-case ICR and demonstrates that performance is above the 10GBASE-KR mask Based on this result it was possible to proceed to physical implementation

Figure 3

Figure 4

Fo Sin Pnt

Physical realizationThe layout process was performed using the Mentor Board-Station CAD system Quad-routing (routing four traces between pads) was explored as a routing method-ology in order to reduce Layer count but this was dismissed due to the detrimental impact on crosstalk performance

The attributes of the physical backplanes produced as a result of the design effort are shown in Table 4

The design files produced included the usual gerber files plus detailed back-drilling instructions

The design validation process comprised a conventional continuity test followed by performance testing featuring Agilent equipment including 70340A signal generator 8720ES Network Analyzer NN18A S-Parameter test-set and 86100A sampling oscilloscope with Agilent 86112A module Figure 7 (next page) shows the test set up

Simclar developed special line cards to enable through-Channel measurements with and without crosstalk The signal launch featured compression mount SMAs terminated in a tuned via structure The Channel simulations included simu-lation of the tuned launch structures so de-embedding of the launches was not necessary for correlation to simulation purposes The development team also established a process for characterization of all Channels

Full Mesh Dual Star

Layer Count 34 18

Aspect Ratio 121 61

Tuned Vias 3952 768

Material Nelco 4000-13SI

Table 4

Figure 5 Figure 6

Fo Sin Pnt

In Figure 8 measured through-Channel performance and ICR curves are shown for the same Channels described in the simula-tion section earlier

As can be seen from Figure 8 there is close correlation between these and the simulated plots in Figures 5 and 6 In fact close correlation between all simulated and measured results was achieved resulting in a 728 Tbps capacity full mesh and a 960 Gbps capacity dual star backplane design now generally available as part of the Simclar TurboFabric shelf

Figure 7 Figure 8

Figure 9

Figure 10

Implications of 10GBASE-KR Draft 33versus Draft 25The work described above was targeted towards meeting the Channels specifications contained in Draft 25 of the IEEE 10GBASE-KR Since this work was completed the IEEE has up-issued the Draft revision level for the Standard from 25 to 33 While this has not impacted through-Channel performance demands it has increased Channel isolation requirements by around 10 dB In Figure 9 a Draft 33 mask is added to the ICR plot shown in Figure 8

From Figure 9 it can be seen how Draft 33 pulls the mask above the Channel ICR curve for this full mesh backplane Channel Surprisingly it is the Channelrsquos frequency response at relatively low frequencies between 100-500 MHz that is causing a problem The reasons for this are currently the subject of further detailed investigation

However Figure 10 shows a Draft 33 plot for a less demanding dual star AdvancedTCA implementation featuring shorter trans-mission distances This plot demonstrates compliance to Draft 33 of the IEEE 8023ap 10GBASE-KR Standard

ConclusionBy developing a close understanding of the many factors contrib-uting to loss and noise in multi-gigabit backplane Channels it is possible to characterize their performance using advanced simula-tion techniques and correlate that performance in physical prod-ucts using advanced test methods By overlaying the test results on S-Parameter masks defined by the IEEE 8023ap 10GBASE-KR Standard it has been demonstrated that backplanes that truly enable AdvancedTCA scalability are at last a reality

Douglas Hynd joined Simclar Group in 2006 as Director of Marketing as part of Simclarrsquos acquisition of Northrop Grumman Interconnect Technologies Division wherehe was Vice President of Marketing and Sales He has more than 24 yearsrsquo experience intechnology sales marketing and generalmanagement and holds a BSc (Eng) in Electronics and Electrical Engineeringfrom the University of Glasgow He isbased at Simclarrsquos Global HQ inDunfermline Scotland

Simclar Groupdouglashyndsimclarcom bull wwwsimclarcom

Fo Sin Pnt

6U CompactPCIPrOduCT GuIdE g

This monthrsquos issue includes a 6U CompactPCI Product Guide and Irsquod like to take the opportunity to reflect a bit on the success and evolution of that technology

Back in the 1994 time frame when CompactPCI was first being devel-oped it began as 3U-only technology It used the same Eurocardmechanics that were popularized by VME and an IEC standardized high-

density high-speed connector available from a number of vendors suitablefor 33 MHz PCI signaling That connector was selected by the engineers atZiatech with help from Mike Munroe then at ERNI The majority of VMEdesigns were 6U and based on this I was among a number of folks thatargued for adding the 6U CompactPCI form factor

The 6U form factor presented some challenges and opportunities Onechallenge was that the insertion and extraction forces were quite high when the entire rear of the card was populated with connectors Fortunately the IEEE standards for Eurocards evolved and injectorejector handles that pro-vided leverage became available Eike Waltz then at Rittal was instrumental in bringing that to the table Two of the opportunities that came along withthe extra connectors were a clean way to add secondary buses like the H110 telephony bus to the backplane and the ability to route IO out the rear through rear transition modules PICMG has developed quite a number of subsidiary specifications defining the interoperable use of the extra backplane pins made possible with the 6U form factor Both of these features have played a major part in CompactPCIrsquos success The next major evolution of 6U CompactPCI came with the PICMG 216 Packet Switched Backplane standard which was originally conceived by John Peters and his team at Performance Technologies PICMG 216 interconnected a shelf full of CompactPCI single board computers via redundant Ethernet switches also in the 6U CompactPCI form factor This dramatically increased usable backplane bandwidth and provided redundancy PICMG 216 paved the way for AdvancedTCA and was the industryrsquos first open standard for the switched serial interconnect standards we see popping up in many places

By Joe Pavlat

Looking back and ahead at6U CompactPCI

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Recent 6U CompactPCI related products are listed here For more informationenter the productrsquos RSC No at wwwcompactpci-systemscomrsc

cPCI-6910Dual-core Intel Xeon Processor LVULV Universal blade bull Supports Single Dual-Core Intel Xeon LV or ULV processorsbull Front Side Bus 667 MHz bull Up to 2 GB DDR2 400 MHz soldered SDRAM with ECC bull Four PCI Express GbEbull Up to 4 USB 20 ports bull PICMG 20 21 29 216 compliant

RSC No 35013

ADLINK Technologywwwadlinktechcom

CPCIStor Module6U CompactPCI storage blade bull Onboard ATA controller supports CDDVD HDD and solid-state flashbull Supports Hot Swap Removal (ask about RAID support) bull ATA disks available in Enhanced Dutycycle versions for NEBS Level 3 - 724 requirements bull Operating Systems supported VxWorksLinux and Windows

RSC No 34800

ACTTechnicowwwacttechnicocom

Prosody X cPCI E1T1An E1T1 digital network access card bull Suits telco developers and systems integrators bull Uses Aculabrsquos worldwide protocol coverage including Aculabrsquos SS7 stack available under a cost free license bull Available with 8 or 16 E1T1 trunks and software selectable E1T1 interfaces bull Flexible mix of protocols including ISDN CAS and SS7 (ITU-T China and ANSI) bull A variety of interconnect switching and protocol conversion solutions can be readily crafted bull High availability reliability and scalability with industry standard hardw re and software interoperability bull Up to 128 SS7 signaling links bull Non-circuit related (TCAP) messagingintensive applications such as prepaid and SMS

RSC No 35408

Aculabwwwaculabcom

Adexp8021Intel Core Duo L2400 (166 GHz) w E7520 server chipset bull Dual channel PC2-3200 Registered RAM SECDED or x4 SDDC bull Two GbE two Serial ATA four USB 20 bull Onboard SXGA graphics 1280 x 24-bitbull 6U CompactPCI Bus PICMG EXP0 R10 Specification bull RoHS compliant 0 degC to +55 degC operating range

RSC No 32837

Advanet Incwwwadvanetcojpen

TC84012 channel single-stop Time-to-Digital Converter (TDC) with single-start and multi-start acquisition modes bull 50 ps timing resolution bull Wide range with upto 20 s between first and last events bull Large internal memory buffer with up to 512 hits per channel bull Low jitter (lt3 ps rms) high stability (plusmn2 ppm) internalclock source bull External 10 MHz reference input bull FPGA based Data Processing Unit (DPU) bull Fast readout with DMA mode for increased data throughputbull Overvoltage-protected inputs with 50 Ω K-Lock (LEMO) connectors bull Built-in self calibration bull Modular single-slot 6U PXICompactPCI standardbull Low power consumption (lt22 W)

RSC No 33445

Agilent-Acqiriswwwacqiriscom

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PrOduCT GuIdE6U CompactPCI

MIC-30428-slot 6U CompactPCI backplane bull AC or DC CompactPCI 500 W + 250 W redundant(2+1) power supplies bull PICMG 216 (CompactPCI Packet Switching Backplane) compliancebull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarmmodule (MIC-3924L-AE)

RSC No 32851

MIC-30436-slot 6U CompactPCI backplane bull Supports two hot-swappable SCSISATA or removableIDE HDD bays bull Built-in IDE slim-type DVD-ROM bull AC or DC CompactPCI 250 W + 250 Wredundant (1+1) power supplies bull Supports hot-swappable fan modules bull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarm module (MIC-3924L-AE)

RSC No 32850

Advantech Corporationwwwadvantechcom

Dual-Core Xeon CompactPCI SBCModel PP 42123x bull Dual CPU 6U CompactPCI SBC supporting two dual-core Xeon CPUs bull Up to 8 GB DDR2 ECC SDRAM in a single system or peripheralslot bull Dual processor SBC in a single 6U CompactPCI slot bull Supports two 166 GHz Dual-Core Intel Xeon ULV processors using Intel E7520 server chipsetbull Up to 8 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull PMCXMC site support 66 MHz PCI-X and x8 PCI Express bull Front and rear IO bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade bull Four GbE ports with option for PICMG 216

RSC No 34761

6U CompactPCI Core 2 Duo SBCModel PP 41203x bull 6U CompactPCI Core 2 Duo SBC supporting two PMC sites includingone XMC site bull Up to 4 GB DDR2 ECC SDRAM bull All in a single system or peripheral slot bull TwoPMC sites supporting up to 100 MHz PCI-X bull One XMC x8 PCI Express bull Front and rear IObull Supports 216 GHz or 15 GHz Intel Core 2 Duo processors bull Intel E7520 server chipsetbull Up to 4 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade

RSC No 34763

PP 30202xTwo processor versions available bull 18 GHz Intel Pentium M processor 745 uses mFC-PGA 478 (micro Flip-Chip Pin Grid Array) package bull 14 GHz Intel Pentium M processor Low Voltage 738uses mFC-BGA 479 (micro Flip-Chip Ball Grid Array) package bull 64 KB primary (L1) on-die cache2 MB of secondary (L2) on-die cache bull 400 MHz Front Side Bus (FSB) bull No CPU fan bull 16 GHz processor version (1 MB L2 cache) available see PP 30002x datasheet bull Utilizes 64-bitIntel 855GME chipset bull Supports 400 MHz bus frequency bull Uses Intel 6300ESB IO Controller Hub

RSC No 32659

Concurrent Technologies Incwwwgocctcom

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PrOduCT GuIdE6U CompactPCI

cCIBPMC6U-ETA 6U bridged dual PMC carrier that bridges extended temperature CompactPCI boards and PMCs bull Features a rugged CompactPCI form factor providing increased flexibility to military communications systems designers bull Provides additional design choices to users through its differing bus speeds maximizing the numberof PMCs that can be used CompactPCI andPMC buses can both run at 66 or 33 MHzbull Operating temperature range of -40 degC to+85 degC bull Signal conditioning bull DMA supportbull Low-power design +5 V +33 V +12 V -12 V bull User-selectable VIO of 33 V or 5 V to the PMC

RSC No 32891

Dynamic Engineeringwwwdynengcom

cPCI4IP-MMMinimized PCI address footprint IndustryPack carrier for CompactPCI applications bull 6U 4HP4 IP positions 832 clock selection for each slot fused filtered power IO options bull ID INT IO and Mem spaces are decoded for each IP slotbull Single and double wide IPrsquos bull 16- and 32- bit IPs bull 32-bit access to 16-bit IPs bull Full or mini-mized Memory Space decoding for 18 the PCI address requirement bull With the cPCI4IP-MM option 8 CompactPCI 4IP cards take the same PCI address space as 1 full Mem Space card

RSC No 34905

ACQ132CPCI32 channel MHz class simultaneous sampling intelligent digitizer bull 32 simultaneous analoginput channels 2-32 MSpschannel 14-bit resolution bull Differential inputs bull Intelligent cardwith 1 gigabyte memory and GbE on board bull Large distributed FPGA resource on boardbull Range of DSP functions including FIR filtering and Digital Downconverter

RSC No 35482

D-TACQ Solutions Ltdwwwd-tacqcouk

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PrOduCT GuIdE6U CompactPCI

CR11Based on the Intel Core Duo Processor the platform is designed to support processor speeds from 106 GHz up to 20 GHz bull Intel Core 2 Duo runs at 15 GHz up to 20 GHz bull Conduction cooled bull Two PMC slots bull PCI Express bull 2x GbE

RSC No 33156

ICS-72532-channel 6U CompactPCI DAC board bull 6U CompactPCI data acquisition card bull 32 differential output channels bull 16 or 24-bit sample size bull 288 kHzch data rate bull Simultaneous sampling across all channels on single or multiple boards bull 32 separate delta-sigma DACs bull 64-bit 66 MHz CompactPCI PICMG 20 Rev30 hot-swappable bull FPDP II 400 MBps interface

RSC No 33576

ICS-71032-channel 6U CompactPCI ADC board bull 6U CompactPCI data acquisition card bull 32 differential input channels bull 216 KHzch 24-bit resolution bull Software selectable full scale input bull FPDP II 400 MBpsinterface bull 64-bit 66 MHz CompactPCI PICMG 20 Rev 30 hot swappable bull 32 synchronous boards for simultaneous sampling bull Sonar acoustics and test and measurement applications

RSC No 33578

Tsumani 6U CPCI Development KitFPGA processor solution targeted at high performance software defined radio applications bull Dual Stratix EP1S80 FPGAs are tightly coupled to provide apower platform for signal processing bull Two PMC module sites provide IO connectivity to either front panel or back panel connections bull A direct highbandwidth 1 GBps path from the PMC P4 connector directly to the FPGAs bull Model 919 Dual DAC Mezzanine provides broadband analog signal generationin a compact form bull The board features two independent DAC channels each with its own 12-bit LVDS input capable of running at rates up to 160 MHz

RSC No 32026

CP11Rugged 6U SBC bull Up to 4 GB of DDR2 SDRAM (200 MHz) with enhanced ECC four independent onboard PCI buses system host and peripheral modesupport for the CompactPCI backplane two PMC interfaces (64-bit133 MHz and 32-bit33 MHz) bull Instead of the PMC1 a PCI Express based XMC interface is available on request bull Two GbE one Fast Ethernet two serial interfaces (RS-232 or RS-422485) USB 20 integrated HDD or flash drive bull High performance 2D3D ATI video controller capable of driving two displays in parallel supports VGADVI interface bull Intel Core 2 Duo at 216 GHz Intel Core Duo at 20 GHz2x PMC expansion site bull One XMC optional bull Up to 4 GB DDR2 SDRAM wECC 2x GbE

RSC No 33447

GE Fanuc Intelligent Platforms Incwwwgefanucembeddedcom

Single Board ComputersGD Canada designs and manufactures conduction-cooled Single Board Computers (SBCs)using Intel processors bull 6U and 3U form factors for CompactPCI backplanes bull Fully backward compatible with earlier models bull Upgradeable via the change-out of processor memory andIO modules bull Used within GD Canada computer systems and sold as individual products

RSC No 35281

General Dynamicswwwgdcanadacom

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PrOduCT GuIdE6U CompactPCI

cPCI6U-24DSI32R32-channel 24-bit delta-sigma CompactPCI 6U analog input board with rear IO bull Low noise 24-bit resolution low phase distortion andmulti-board synchronization bull Suits state-of-the-art sonar and noise monitoring applications bull 32-channel cPCI6U-24DSI32 analog input boardprovides a high-density 24-bit analog input resources on a standard 6U CompactPCI expansion board bull Applications from precision voltagemeasurements to complex audio signal and waveform analysis

RSC No 34985

General Standards Corporationwwwgeneralstandardscom

Duet 3U 64-bit 1 GHz TMS320C6416 DSP (x2) 64 MB SDRAM per processor bull Flexible internalexternalcommunication mesh bull 64-bit66 MHz CompactPCI bull PMCXMC site with Jn4 to FPGA and4 RocketIO per VITA 42 bull External data port up to 12 Gbps bull 4M or 5M Virtex-II Pro FPGAbull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM dedicated800 MBps links between DSPs bull 3U CompactPCI with PXI support bull Suits high-end co-processing wireless broadband communications RADAR video and biometrics

RSC No 32856

QuadiaQuad-DSP bull Dual FPGA bull Dual PMC sites bull Inter-processor connectivity and access to external interfaces bull Four C6416 DSPs split in two independent clusters each hosting a PMC site bull One large FPGA for end-user code bull Central FPGA routing interprocessor communication bull End-user FPGA communication bull External port serial IO for PCIe or other p ivate link bull Global memoryand PCI interface bull 1 GHz TMS320C6416 DSP (x4) bull 64 MB SDRAM per processor bull Flexible internalexternal communication mesh bull 64-bit66 MHz CompactPCI bull Two PMC sites with Jn4 to FPGA bull External data port up to 12 Gbps bull Two 4M Gate FPGA reserved for end-user code bull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM bull Up to 512 MB Global DDR SDRAM bull Suits high-end co-processing wireless and broadband communications

RSC No 34737

Quixote 64-bit 6UAdvanced signal capture generation and co-processing bull 1 GHz TMS320C6416 DSP and2 to 6 MGATE Virtex-II FPGA bull 32 MB SDRAM 8 MB ZBT SBSRAM and AD6645 and AD9764 converters bull 6432 bit CompactPCI 66 MHz 5 V33 V and complex trigger modes with HW event logging bull PMC site with Jn4 to FPGA DIO and PICMG 217 StarFabric compliant bull Suits Software Defined Radio wireless IP and RADAR development and hardware testing bull Physical Layer field testing ultra-fast flexible data acquisition vector signal generation and electronic warfare

RSC No 32861

Innovative Integrationwwwinnovative-dspcom

IC-e6-cPCIbHigh performance 6U CompactPCI board bull Powered by one or two of Freescalersquos mostadvanced 14 GHz MPC7448 PowerPC processors bull PICMG 216 compliant bull Marvell Discovery III chipset (MV64460) bull Low power consumption bull Standard extended and rugged grades

RSC No 32982

Interface Conceptwwwinterfaceconceptcom

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PrOduCT GuIdE6U CompactPCI

CP213Single-width 6U CompactPCIPXI module with either 32 or 64 differential analog input channelsbull 32 64 or 128 channels of analog input bull 16 multifunction digital IO (TTL) channels that may beconfigured as digital in digital out or selectively attached to 2 frequency in 2 counter in andor 2 timerout channels bull 16-bit resolution bull Programmable gain per channel programmable scan rates of lt1 Ss through 100 KSs bull Precision onboard reference for end-to-end calibration

RSC No 34804

KineticSystems Company LLCwwwkscorpcom

CP6001Energy efficient embedded Intel dual core processors bull 12 GHz Intel Core Duo U2500 ULV processor bull Intel Core 2 Duo L7400 LV processor bull Based on the Intel Mobile 945GM chipset with a front side bus of up to 667 MHz and ICH7-R Southbridge bull Two independent digital video outputs to the rear IO (2x DVI - 1x DVI and 1x HDMI) bull AC97 audio capabilities bull 3 x GbE bull 4 x SATA with RAID 01510 functionality bull 6 x USB 20 2 x COM and VGA or DVI bull Can also accommodate a PMC slot or an onboard 25 inch SATA HDD bull Up to 8 GB of USB or 2 GB soldered flash bull Supports Linux Windows XP XP embedded and VxWorks 6

RSC No 34182

CP6923 GbE Switch6U CompactPCI GbE Switch PICMG 216 compliant bull Leading edge te hnology basedon BCM5650X chip bull 24x GbE ports bull Non-blocking Layer 2 and 3 switching and routingbull Copper optical rear IO version bull Hot swap IPMI bull Fully managed bull Comprehensive firmware package bull Applies to VoIP installations such as call servers media gatewaysand trunking gateways in wireline and wireless networks as well as VoIP systems inenterprise networks with high demands on performance

RSC No 32256

Kontronwwwkontroncom

TMS320C6701 Virtex-IITexas Instrumentsrsquo C6701 DSP bull Xilinx Virtex-II series FPGA up to XC2V8000 bull Multiple IO interfaces Onboard CODEC VIM expansion sites 60-pin GPIO header and JTAG bull Hardware drivers integration in SimulinkXilinx System Generator Blocksets for quick implementation of Simulink models bull DSP and FPGA-in-the-loop cosimulation of SimulinkXilinx System Generator models bull Leading edge communication interface allowing real-time datamonitoring from Simulink scopes and remote operations

RSC No 32028

VHS-DACHigh performance multichannel DA for phased array antenna systems radarsonar communications receiversup-sampling to IF stage and RFIF AGC apps bull Eight 125 MSPS output channels bull Optional add-on daughter boardprovides 8 additional output channels or 8 additional input channels bull 32-bit 25 MHz bull FPDP interface with 400 MBps transfer rate (25 MSPS per channel at 8 channels 125 MSPS at 16 channels) bull Low level hardware drivers API andGUI bull High level hardware drivers integration in Simulink Blocksets bull Leading edge communication interface fordata recording and playback tofrom the onboard SDRAM

RSC No 32029

Lyrtechwwwlyrtechcom

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PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

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PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

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PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

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PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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Page 15: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

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as multimedia mobile phones VoIP or IPTV at home Service providers must manage ldquoduplicatedrdquo subscriber databases for each particular service Consequently managing a converging subscriber base for such network functions as billing across multiple different technologies presents a tremendous challenge Any downtime of this network element can be costly to the carrier or service provider not to mention the heavy risk of losing subscribers over the long term

The HSS and Home Location Register (HLR) are key elements in the IMS network required to manage the growing number of subscribers These platforms that manage millions of customersrsquo data need to be highly reliable with carrier-grade High Availability (HA) functionality Core requirements for the HSS computing platform are

n High compute density for application processingn Scalable performance and high densityn Fast read access to the subscriber datan Large storage and memory bandwidthn Ability to consolidate multiple IMS elements and subscriber data within a single

platform with a modular approach as a converged services platform

HSS plays network backbone roleHSS provides the important network backbone of the IMS architecture because it eases innovation and addresses a range of service-logic interaction issues that have plagued previous service architectures HSS offers open access to service-related data for each subscriber supporting the sharing of data among multiple services

HSS is essentially the master user database that supports IMS network entities that handle calls and sessions It contains user profiles performs authentication and authorization of the user and can provide information about the physical location of the user It plays a key role in provisioning service creation enabling subscriber data and managing control roaming and interconnection The Application Server (AS) which hosts and executes serv- ices in the IMS environment communicates with the HSS Call State Control Function

(CSCF) servers also communicate with the HSS which must be able to

n Support IMS-level authentication and authorization

n Maintain IMS subscriber profile(s) independent of access types

n Maintain service-specific datan Keep track of currently assigned

CSCFn Support CSCF and AS access

HLRHSS hardware platform design choicesHSS design must enable the HSS to be deployed cost-effectively and expand readily to meet future subscriber levels For example the trend to include more information as part of the data record for each subscriber will drive up memory requirements

From a technical perspective the key metrics to understand when developing the IMS HSS functions are the number of completed transactions required per sec-ond and the size of the subscriber base

HSS architecture typically comprises multiple processor units with extensive memory requirements With the introduction

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of multicore processors from Intel developers can scale performance while optimizing power consumption in the overall system design

To meet these requirements the hardware platform needs to provide scalability flexibil-ity and long-term cost efficiency In comparing the traditional 1U platform with a more modular approach to the HSS using AdvancedTCA consider the following

n High compute performance n High memory and storage capabilityn IO functionality to connect to multiple networks (such as SS7 and Ethernet)n Carrier-grade profile and redundancy

AdvancedTCA High density with scalability on a smaller footprintTable 1 illustrates a comparison of a sample AdvancedTCA-based platform and a 1U PCI rack-mounted platform for HSS applications This configuration assumes an increasing subscriber growth from 1 million (M) subscribers to 18M subscribers per platform

FootprintAdvancedTCA-based platforms provide a high density compute platform with scalability on a smaller footprint TEMs can easily add boards to a chassis to accommodate more traffic and to support new services This flexibility enables an increase in subscribers and the database without having a major impact on rack space in the central office environ-ment To meet the same capacity for 18M subscribers the 1U PCI approach will occupy two bays or cabinets with a total footprint of 28 square feet compared to the same capacity occupying one bay or cabinet with a footprint of 14 square feet (see Figure 1)

CoolingWhile the power consumption per square foot is higher than the 1U PCI platform AdvancedTCA offers better airflow and cooling distribution using a push-pull cooling system Each 1U PCI platform includes up to nine cooling fans and is dedicated to that CPU in the 1U server only which translates into higher overhead Therefore the airflow is

not optimized in the overall system design In the case of a fan failure AdvancedTCA platforms enable easier access to replace the fans which are field replaceable units The 1U platform also does not include any integrated centralized switching or management capabilities therefore the total does not include any switching or system management functionality

ScalabilityAdvancedTCA architecture lends itself well to scalability As AdvancedTCA sup-ports both a Base and Fabric interface into the backplane and the separation of data and control planes TEMs can also scale up their designs from 1 GbE to 10 GbE to accommodate new users and usage requirements AdvancedTCA based systems are designed for easy upgrade-ability to new processing blades switch fabrics and IO modules using Advanced Mezzanine Cards (such as SS7)

Since AdvancedTCA and AdvancedMCs offer hot swap capabilities and HA func-tionality growing a subscriber base by using additional CPU blades within the system with low maintenance or upgrade downtime is crucial for the HSS plat-form It also allows for the up and down

AdvancedTCA-based HSS Platform 1U PCI Rack-Mount HSS Platform

Number ofsubscribers

~1M subscribers = 4 CPU blades edundant ~1M subscribers = 4 x 1U

~4M subscribers = 7 CPU blades redundant ~4M subscribers = 7 x 1U

~6M subscribers = 12 CPU blades redundant ~6M subscribers = 12 x 1U

~18M subscribers = 36 CPU blades redundant= 3 AdvancedTCA shelves per rack

~18M subscribers= 36 x 1U+ external switch components for redundancy

Technicalspecs

1 CPU blade = 2 x Intel Xeon dual core = quad core 1 1U rack-mount Intel= Intel Xeon quad core or dual core CPU

16 G DDR 2 memory Max of 8 G DRY memory

+ 2 x SATA or SASS hot swap (RAID 0 and 1)+ 1x PCI Express for SS7 Dual GbE per 1U rack-mount server

4 x GbE per CPU with built in GbE backplane switching separating Control Pathand Data Path with multishelf expandability

External central switching required withmultiple external GbE connectivity

Systems and blade manageability built into the platform withIMP implementation SNMP and CLIP

Carrier-grade redundancy on switch and node

IO for SS7 or other interface modules

CPU blade hot swap capability

Thermaland power

requirements

~6M subscribers redundant= 14 slots with centralized chassis cooling

~6M subscribers redundant= 18 x 1U PCI with independent cooling and separate switch units and system management

Total power consumption= ok (3100 W for blades and RTM + 500 W Shim fan tray and SAP)

Total power consumption= ok

Table 1

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scaling of the platform depending on the subscriber increase or decrease When consolidating multiple services minimiz-ing multiple duplicate databases requires this flexibility

InterconnectivityThe AdvancedTCA platform offers a number of interconnectivity features including

n Separation between the data plane and the control plane

n Direct uplink in a multichassis envi-ronment with up to l0 GbE

n Node to node base and fabric connec-tivity with HA carrier-grade Ethernet functionality

n Easy upgrade path to l0 GbE for increased bandwidth

By contrast the 1U PCI platform requires

n Additional external interconnectiv-ity between 1U rack-mount servers which increases the number of points of failures and the operating and maintenance costs

n Additional switching equipment for carrier-grade Ethernet connectivity

n Additional manage-ment (Simple Network Management Protocol [SNMP]) for HA redundancy

PowerThe 1U-based platform also utilizes integrated AC power supply units usually the standard for the data center and enter-prise environments AC will increase the pro-viderrsquos OPEX in the long term since the power consumption per rack is significantly higher and

Figure 1

requires additional support equipment such as an Uninterruptible Power Supply (UPS) and an AC to DC converter per rack space and ultimately per CPU These factors along with the requirements for carrier-grade functionality HA support and a more favorable long-term OPEX further reduce the need to consider the 1U solution for HSS deployments in Central Office networks

ManageabilityAdvancedTCA chassis-level management is based on the industry-standard Intelligent Platform Management Interface (IPMI) IPMI makes possible interoperability among chassis and blowers compute nodes switches and management solutions from multiple vendors enabling these elements to work together seamlessly The resulting successful inter-blade communication for applications including failover and clustering provides full manageability on a per shelf and per bay basis

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One of the primary goals of the AdvancedTCA specification is to ensure a very low Mean Time to Repair (MTTR) and high Mean Time Between Failures (MTBF) There are no active components in the backplane ndash which can translate to expensive repairs in the field In addi-tion AdvancedTCA specifies that all com-ponents can be hot swappable in the field and the architecture provides redundancy at all levels This hot swap capability translates to less downtime for field replacement on a per CPU blade basis as compared to 1U PCI

SummaryAdvancedTCA provides an ideal platform and meets the technical requirements for deploying flexible and scalable IMS HSS applications While other platform archi-tectures such as 1U rack-mount servers may with considerable difficulty be able to deliver HSS capabilities AdvancedTCA offers a much more advantageous solution by providing a smaller footprint improved cooling and thermal characteristics bet-ter scalability enhanced interconnectivity and easier manageability This all contrib-utes to making AdvancedTCA a lower cost approach in terms of CAPEX and OPEX for long-term subscriber growth

1U PCI rack-mount servers are not considered to be the optimal hardware platform for HSS applications in a Central Office With its limitation for carrier-grade flexibility and HA functionality the 1U PCI platform is best suited for a full range of other enterprise and Internet infrastructure applications within a data center environment that does not require any significant flexibility and HA functionality around it It might also be a good entrance point for other enterprise applications with lower price points

The use of AdvancedTCA-based platforms enables TEMs to shift away from hardware development and refocus their efforts on delivering value-added software and services As a result they can realize lower development costs and faster time-to-market enabling increased flexibility with each product design through the use and reuse of standardized off-the-shelf components Equally significant are the advantages that can be realized by the service provider With a common platform and a flexible architecture that maximizes limited floor space service providers can rapidly and flexibly implement a broad range of feature-rich solutions for faster profitability

Sven Freudenfeld is responsible for North American Business Development for the Kontron AG line of AdvancedTCA AMC MicroTCA and Pre-Integrated Solutions Sven possesses more than 15 years of experience with voice data and wireless com-munications having worked extensively with Nortel Networks in Systems Engineering Sanmina-SCI in Test Engineeringand Deutsche Telekom in Network Engineering Sven holdsan electrical engineering degree from Germany and is also Chair of the CP-TA marketing workgroup focusing on the interoperability of COTS standard building blocks

Kontron bull svenfreudenfeldcakontroncom bull wwwkontroncom

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TECHNOLOGY g BACkpLANES

Increasing demand for service and multimedia features is stimulating a growing need for speed in telecom-munications equipment While some

applications such as PBX systems can be addressed with the gigabit backplane technologies currently available others are running out of headroom Routers may soon need 10 Gbps and higher speed back-planes to keep up with network demand Many such applications can justify the expense of moving to higher performance if it becomes available

Currently telecom system designs offer backplanes that can handle interconnec-tions running as fast as 3125 Gbps raw data throughput per lane (with around a maxi-mum data rate capability of 5-625 Gbps per lane) The AdvancedTCA standard for instance uses Ethernetrsquos XAUI inter-face AdvancedTCA achieves a 10 Gbps net data rate by running four serial lanes for each interconnection with each lanersquos

SERrializerDESerializer (SERDES) op-erating at 3125 Gbps raw data (25 Gbs net)

As demand forces systems to move beyond these rates however new technologies will be needed One proposal calls for the use of XAUI+ or double XAUI which increases lane SERDES rates to 625 Gbps per lane and hence the throughput to 20 Gbps Another proposal is to use IEEE 8023ap known as 10GBASE-KR which runs a single SERDES lane at 125 Gbps raw data rate (103 Gbps net) But these are only short-term answers To address future demands organizations such as the Institute of Electrical and Electronic Engineers Standards Association (IEEE-SA) are developing specifications for Ethernet speeds of 40 Gbps to 100 Gbps which will be applied to backplane interconnect

Such high clock rates however will pose significant design challenges for developers

One of the first challenges that will need resolution is the design and layout of the backplane and other PCBs Common design practice today readily handles board clock rates of around 10 Gbps Well established design rules are in place and board layout tools such as autorouters can automatically handle board designs for speeds in the 10 Gbps range Designers may use specialized board material create additional ground planes and perform similar tasks in order to ensure proper board operation at the higher end but even speeds to 5 GHz are within current design tool capabilities

Design gets trickierAbove 5 GHz however board design gets more involved because feature dimensions become significant when compared to the signalrsquos wavelengths Variations in board thickness can affect signal propagation Corners where traces change direction and small spurs along edges of poorly etched

Channel characteristics

challenge backplane interoperability

Serial backplanes in telecommunications systems aim for high speed with room for

growth As systems began using 10 Gbps links however issues arose that affected backplane

communications among cards from different manufacturers Stuart points out that the

industry must define key backplane channel characteristics so that designs based on open

standards maintain interoperability as backplane speeds move to 40 Gbps and beyond

By Stuart JamieSon

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traces can act as antennae for the higher fre-quencies in digital signals As can be seen in Figure 1 sharp corners and minor flaws that are inconsequential at lower frequen-cies have the potential to become trouble-some antennae at future high speeds This can result in the trace radiating away the signalrsquos high frequency energy increasing EMI and crosstalk as well as altering signal waveforms New routing design rules such as making corners 30deg instead of 45deg and more careful board fabrication techniques may become necessary as designs move above the 10 Gbps per lane threshold

The move to higher frequencies will affect more than board fabrication and layout however Higher frequencies will also impose new requirements on signal tim-ing signal rise-time electrical distance and waveform shape if developers are to retain the mix-and-match system design approach that makes standards-based system design effective

For interoperability to be achievable at data rates above 10 Gbps organizations such as PICMG will need to carefully define a vari-ety of signal and design parameters in their specifications Some of the key parameters that will need consideration include

n Interconnect signal attenuationn Eye diagramn Jittern Input clock recoveryn Chip inputoutput pre-emphasis (PE) n Equalization (EQ)

Even slight variations in these parameters from device to device and lane to lane can shift the timing of signals a significant fraction of a clock cycle and affect the Bit Error Rate (BER) of a lanechannel Finally signal rise times will require tight control as signal rates increase in order to ensure control of system timing (see Figure 2)

In defining signal and design parameters specifications will also need to account for the increased location dependency that comes with higher frequencies Even subtle differences in attributes such as routing length and trace impedance become increasingly significant as signal speeds rise To ensure mix-and-match interopera-bility then design specifications may need to account for the specific backplane slot that a board is to occupy as well as introduce a method to obtain and control the PE and EQ of the devices connected to the lanes

Designers must also address fabrication standards The material used to fabricate

Figure 1

Figure 2

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the board the thickness and composition of metal cladding and the spacing between layers can all affect the trace characteris-tics Controlling these parameters under specification ensures that timing charac-teristics are sufficiently uniform from one board to another However current speci-fications are too detailed and stringent It is extremely difficult to attain compliance yet avoid adding cost to the design

Specifications need workSome of these parameters are already incorporated into current specifications The AMC module specifications from PICMG for instance include design parameters that ensure its proper opera-tion at signal speeds as fast as 125 Gbps per lane Establishing specifications for other system components will help achieve interoperability of standards-based designs at higher frequencies

Design tools may also need to be modified and the industry will need to create new design rules for high frequency and incor-porate these into the tools Developing new routing techniques will help avoid the issues of electrical phenomena such as skin effect dielectric loss and impedance mismatches These are much more preva-lent at higher frequencies and it becomes critical for engineers to model and simu-late these phenomena more accurately

Early efforts are already underway to address the challenges that higher fre-quency signals bring to standards-based design The Interconnect Channel Characterization Subcommittee of PICMG established in September 2006 is develop-ing ground rules and definitions to be used in characterizing transmission reflection and crosstalk performance in backplane and mezzanine carrier interconnects The committee aims to define the channel parameters to be measured or analyzed as well as the methods for doing so Its charter calls for it to address

n Definition of interfaces at which measurements are made or characteristics computed

n Test equipment fixtures and PCB test coupons

n Details of measurement proceduren Data formatsn Techniques for de-embedding

components of the channeln Techniques for validating

measurement based models ie passivity and causality

n Definitions that allow reasonable compliance testing

n Boundary definitions for different paths

n Define information regarding limita-tions or proper usage ie maximum data raterise times that are supported by the models

Such efforts are only a beginning how-ever Other design details still need to be addressed such as SERDES IO Configuration New functionality may need to be defined The design of high data rate system channel interfaces according to standardsspecifications does not currently cover the individual characteristics of the chip transmitterreceiver characteristics Thus work will be needed to address how such standard designs handle such dependency

Crossing an interoperability thresholdOne way of handling location dependen-cies might be to give the system control-ler the ability to inform modules what the channel transmitter and receiver PE and EQ technology is and importantly how to control it With this information along with the signal attenuation suffered (at a given bit rate) for the channel the system should be able to configure SERDES channels in different physical locations to run reliably and at the required BER In MicroTCA systems for instance this functionality could be incorporated into the MicroTCA Carrier Hub (MCH) as part of its electronic keying function Modules would have to be able to configure and control its backplane interfaces to allow for different positions

in the backplane An MCH (see Figure 3 courtesy Emerson) then would be able to instruct a module as to which parameters to use for interoperability

The specific approaches needed to handle location dependencies and other challenges that higher signal rates raise have yet to be developed The need to address these challenges however is clear Increasing demand for services is driving applications to utilize faster signal rates This in turn is driving backplane signaling speeds ever higher As speeds rise above 10 Gbps sig-nals will cross a threshold where current specifications will prove inadequate for ensuring interoperability among standards-based designs

The industry should begin developing new or enhanced specifications and design tools to address the challenges of higher signal rates Without such improvements the guarantees of interoperability that allow system developers to readily create solu-tions by combining off-the-shelf products will be compromised As backplane speeds approach 100 Gbps nothing can be taken for granted

Stuart Jamieson Director of Industry RelationsArchitect with Emerson Network Power Embedded Computing represents Emerson on PICMG committees and the SCOPE organization and previously served as a CP-TA Board member (Treasurer) He brings over 18 years of experience in hardware protocols embedded software and specification development to these groups Within Emerson he played a key role in the develop-ment of the technology central to Emersonrsquos bundled network-ing solutions Stuartrsquos positions within Emerson have included Director of Business Development Director of Advanced Technology and Architect He is the Draft Editor for the PICMG Interconnect Channel Characterization Subcommittee is the author of the introduction section for the new PICMG Ruggedized MicroTCA specification and served as the Draft Editor for the PICMG MicroTCA Specification Stuart gradu-ated from the Heriot-Watt University in 1989 with a 1st Class Honors degree in Electrical and Electronic Engineering and again in 1992 with an IBM-sponsored Master of Philosophy

Emerson Network Power Embedded ComputingStuartJamiesonEmersoncom bull wwwemersonembeddedcomputingcom

Figure 3

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TECHNOLOGY g BACkpLANES

2008

B A

N D

W I

D T

H

Signal integrity challenges to bandwidth scalabilityFor the purposes of this article each interconnected differential pair will be referred to as a Channel (which should not be confused with an aggregated AdvancedTCA channel comprising four trans-mit and four receive pairs)

14-slot full-mesh AdvancedTCA backplanes contain hundreds of Channels Each Channel is defined as the copper signal path from the output of a driver device to the input of a receiver device As

By douglaS Hynd

Developing IEEE 8023ap 10GBASE-KRcompliant backplanes

Why doesAdvancedTCA

need bandwidthscalability

PICMG AdvancedTCA 30 has emerged as the

industryrsquos Hardware Platform standard of choice and

is enjoying first-phase deployment However many

believe that for AdvancedTCA to realize its market

potential AdvancedTCA platforms need to seamlessly

scale to accommodate 40 GbE fabrics thereby

avoiding forklift upgrades as system bandwidth

demands increase over time A 40 GbE switch fabric

architecture would enable realization of a common

platform for computing storage control and media

and packet processing and provide the versatility and

long term ROI required by service providers in

todayrsquos increasingly competitive environment

The challenge was to develop a family of

AdvancedTCA products which feature PICMG 30

compliant dual star and full mesh advanced

backplane switch fabrics enabled up to 10 Gbps

per differential signal pair thereby giving 40 Gbps

per AdvancedTCA channel performance

This article describes the signal integrity challenges

presented in designing an IEEE 8023ap

10GBASE-KR-compliant bandwidth-scalable

14-slot AdvancedTCA platform and how these

challenges were overcome in development of full

mesh and dual star backplane reference designs

Fo Sin Pnt

shown in Figure 1 that signal path comprises a signal launch a blade PCB transmission line a daughtercard via a right-angled HM-ZD connector a mated HM-ZD backplane header a back-plane via a length of backplane PCB transmission line and then the same combination of connectors vias and transmission line at the receive end of the Channel

Sources of crosstalkFour principal sources of crosstalk in each Channel must be man-aged as shown in Table 2 Source number one is between adjacent differential pairs as they are routed across the backplane Common mode noise rejection in system differential pair structures makes this a minor issue The second source of crosstalk lies in the HM-ZD connector itself

Crosstalk in via fields our third source primarily arises from inductive coupling between adjacent differential pairs and domi-nates the crosstalk agenda in high-speed Channels This source of crosstalk is directly proportional to the length of the via barrel and where practical care must be taken to ensure that adjacent connector rows are terminated to different target routing Layers

The final source of crosstalk is caused by aggressor signals in through-routed via fields coupling with victim Channel traces as they pass through As mentioned earlier judicious and careful design can mitigate this impact

Skew Channel skew is a function of differential transmission path geometries At a fundamental frequency of 5 GHz skew can be a significant issue in high-speed system design due to narrowing the eye opening and increasing jitter Skew can have a significant impact on crosstalk it negatively impacts the common mode rejection of noise inherent to differential signaling Conductor surface roughness in lower performing dielectric materials can also cause skew in high-speed systems

Skew can be avoided through careful management of transmission path lengths in each Channel and by using higher-glass content (lower Dk) laminates

LossPotential

Potential Mismatches

Channel

Loss Potential Channel

PCB Tolerance -025 dB 2 -01 dB

Connector Tolerance -001 dB 4 -016 dB

Thru-routed Via Fields -001 dB 12 -144 dB

Connector Launch -025 dB+ 4 - 2 dB+

Quantity TotalNEXT

TotalFEXT

PCB Transmission Lines

24 in60 cm

-50 dB -70 dB

Connector Architecture 2 -26 dB -24 dB

Via Fields 4 -22 dB -20 dB

Connector Pass Through 8 -34 dB ndash34 dB

For the target application each one of these Channels must deliver a 10 Gbps Non-Return-To-Zero (NRZ) signal with sufficient signal fidelity to enable a receiver device to detect and process a differential signal The PICMG 30 specification is targeted at 3125 Gbps signaling with a fundamental frequency of 156 GHz Even in low loss dielectric materials insertion loss at 10 Gbps (5 GHz fundamental) is twice that of a 3125 Gbps signal

Therefore achieving acceptable signal fidelity requires careful management of signal losses and noise in each Channel such that an acceptable signal-to-noise (SN) ratio is achieved at the receiver

The design process therefore begins by understanding and mitigat-ing the sources of losses and noise in each Channel

Sources of lossThere are three sources of loss

n Conductor losses which are due to skin effects and can be addressed by maximizing the cross sectional area of the signal traces

n Material dispersion losses which are a function of the dielectric constants of the chosen material These can be mitigated by choosing a higher performance laminate material such as Nelco 4000-13SI or Megtron

n Reflected power loss due to impedance mismatches in the Channel as each signal transitions across the different copper media in each channel (connectors vias and PCB traces) and passes through the pad and anti-pad structures of the via fields of other backplane blade slots

Table 1 shows the relative effects of different sources of impedance mismatches The dominant source of impedance mismatches in every Channel resides in the via structures Successful mitigation of this problem requires that every via is tuned by back-drilling the stub and adjusting the pad and anti-pad structures to match the impedance to be 50 ohms irrespective of the target routing layer This in turn requires that the capacitive and inductive effects of the connector pin and via barrel combination are taken into account during the design of each Channel

Further complicating via design is the space the anti-pad structures need to accommodate Channels being routed between other blades while minimizing electro-magnetic coupling with them This space consideration makes the shape and orientation of pads and anti-pads extremely important

Figure 1

Table 1

Table 2

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IEEE 8023ap provides a design targetAs Ethernet has emerged as the industryrsquos dominant signaling methodology the IEEE has developed the 10GBASE-KR norma-tive Channel model to define interconnect Channel performance for NRZ signaling at 10 Gbps This standard defines acceptable performance in terms of S-parameter charts for through-Channel insertion loss and worst-case crosstalk Figures 2a and 2b illustrate masks for Draft 24 of the standard that was initially used for this exercise

In each case the mask defining compliant performance is shown in blue Channel insertion loss is shown in red in Figure 2a Crosstalk performance is defined by the ICR curve (Figure 2b) Minimum acceptable Channel performance is defined in the ICR chart (Figure 2b) by the blue line The effect of the sum of all aggressors on the through-Channel is shown in red The green ICR curve is the ratio of the crosstalk power sum calculated by summing the

magnitudes of any impacting crosstalk Channels for each fre-quency and using a straight line fit (using least-squares method) to determine the resulting average effect f the aggressors on the through-Channel This is then overlaid on the insertion loss and used to plot the ICR curve

This standard which has evolved through a variety of iterations forms the basis for developing a 40 GbE switch fabric backplane featuring 10 Gbps NRZ differential pairs If all differential pairs can meet this standard then the backplane can be considered to be 10GBASE-KR compliant

Applying 10GBASE-KR to a 14-slotAdvancedTCA applicationThe PICMG specification dictates that receive differential pairs are placed on the c-d and g-h rows of the HM-ZD connector and that transmit differential pairs are placed on the a-b and e-f rows Therefore the middle differential pair in row c-d of Slot B will be subject to the NEXT of three aggressors in each of the a-b and e-f transmit rows of slot B plus the FEXT of the signals being received in the c-d pairs in the top and bottom of slot B

In this topology it can be seen that worst-case crosstalk would occur if all the NEXT and FEXT aggressors were routed on the bottom Layer that is on the same Layer as that of the victim c-d However given that all signal vias must be back-drilled and tuned for impedance management purposes Channel crosstalk can simultaneously be reduced by allocating different routing Layers to differential pairs terminated in the same backplane connector

The principal factor in determining the feasibility of a 10GBASE-KR compliant backplane is based on understanding whether the Channel with the worst-case signal-to-noise ratio is compliant

The skew targets determine permissible layer separation between a-b c-d e-f and g-h pairs within each Channel and enable routing Layers to be allocated for each pair It is now possible to start the process of via tuning to optimize the channel performance for minimum insertion loss Modeling begins by defining the simulation boundaries for the channel so that Channel component models (PCB traces connectors vias) can easily be aggregated to model complete Channels Boundaries must be established at locations in the Channel where linear 3D structures exist These are shown in Figure 3 (next page)

Since the connector and via combinations for the backplane and daughtercard mating halves must each be treated as a whole it

PICMG 30Spec

TurboFabricSpec

Total Inter-PairSkew

(Fabric Interface)

05 mm in FR4(34 ps)

001 mmin N4000-13si

(00625 ps)

Total Intra-Channel Skew

(Fabric Interface)

254 mm in FR4(17 ps)

plusmn01 mmin N4000-13si

(0625ps)

Total Intra-Channel Skew

(Base Interface)

135 mm in FR4(90 ps)

plusmn01 mmin N4000-13si

(0625 ps)

Figures 2a and 2b

Table 3

Determining which Channel that is and identifying the worst-case SN requires making trade-offs with regard to PCB material Channel length via design connector row selection and NEXT and FEXT aggressor routing choices These trade-off choices can only take place using advanced 3D simulation tools such as Ansoft HFSS This was the essence of the design process employed in developing Simclarrsquos TurboFabric backplanes

The simulation processThe transmission length for full mesh and dual star backplanes design implementations varies from a maximum of 1632 inches to a minimum of 116 inches With an effective transmission length of 5 inches on each daughtercard this makes the longest effective Channel 2632 inches including two connectors

For a 10GBASE-KR application over this distance a high-perfor-mance laminate is essential for both reducing insertion loss and

ensuring high glass content in the weave to mitigate skew So the design process began by choosing a low-loss dielectric material (Nelco 4000-13SI for both the backplane and the daugh-tercards) and establishing targets for Inter-Pair and Intra-Channel skew as shown in Table 3

Adhering to the PICMG 30 specifi-cation for skew in a 10GBASE-KR application is impractical Instead a target of 00625 ps was set for Inter-Pair skew with 0625 ps set for Intra-Pair skew for the backplane only This equated to a maximum 001 mm differ-

ence being allowed between traces of any differential pair and 01 mm being permitted between traces of any four differential pairs in a Channel Given the topology of the HM-ZD connector daughter-card skew must be accounted for in the daughtercard layout Fo

Sin Pnt

should be noted that the simulation boundary is located within the mated connector

Tuning the connector and via structures to 50Ω is an iterative process involving the removal of excess pads back-drilling and tuning pads anti-pads and traces A Time Domain Reflectometer (TDR) plot illustrating the results of the tuning process is shown in Figure 4

Upon completion of the modeling process a total of 17 different optimized via and routing configurations had been designed for the full mesh design and nine for the dual star design

A plot of worst-case insertion loss is shown in Figure 5 and demonstrates that in both cases performance is well above the 10GBASE-KR mask

When all the through-Channels have been modeled adjacent Channel models can be combined and ICR curves plotted to evaluate the impact of crosstalk on through-Channel performance This valuable information can be used to adjust the position of signal Layers relative to pass-through aggressor traces on adjacent Layers or to reroute traces to reduce crosstalk Similarly routing Layers can be changed to reduce crosstalk in adjacent via barrels

Figure 6 plots worst-case ICR and demonstrates that performance is above the 10GBASE-KR mask Based on this result it was possible to proceed to physical implementation

Figure 3

Figure 4

Fo Sin Pnt

Physical realizationThe layout process was performed using the Mentor Board-Station CAD system Quad-routing (routing four traces between pads) was explored as a routing method-ology in order to reduce Layer count but this was dismissed due to the detrimental impact on crosstalk performance

The attributes of the physical backplanes produced as a result of the design effort are shown in Table 4

The design files produced included the usual gerber files plus detailed back-drilling instructions

The design validation process comprised a conventional continuity test followed by performance testing featuring Agilent equipment including 70340A signal generator 8720ES Network Analyzer NN18A S-Parameter test-set and 86100A sampling oscilloscope with Agilent 86112A module Figure 7 (next page) shows the test set up

Simclar developed special line cards to enable through-Channel measurements with and without crosstalk The signal launch featured compression mount SMAs terminated in a tuned via structure The Channel simulations included simu-lation of the tuned launch structures so de-embedding of the launches was not necessary for correlation to simulation purposes The development team also established a process for characterization of all Channels

Full Mesh Dual Star

Layer Count 34 18

Aspect Ratio 121 61

Tuned Vias 3952 768

Material Nelco 4000-13SI

Table 4

Figure 5 Figure 6

Fo Sin Pnt

In Figure 8 measured through-Channel performance and ICR curves are shown for the same Channels described in the simula-tion section earlier

As can be seen from Figure 8 there is close correlation between these and the simulated plots in Figures 5 and 6 In fact close correlation between all simulated and measured results was achieved resulting in a 728 Tbps capacity full mesh and a 960 Gbps capacity dual star backplane design now generally available as part of the Simclar TurboFabric shelf

Figure 7 Figure 8

Figure 9

Figure 10

Implications of 10GBASE-KR Draft 33versus Draft 25The work described above was targeted towards meeting the Channels specifications contained in Draft 25 of the IEEE 10GBASE-KR Since this work was completed the IEEE has up-issued the Draft revision level for the Standard from 25 to 33 While this has not impacted through-Channel performance demands it has increased Channel isolation requirements by around 10 dB In Figure 9 a Draft 33 mask is added to the ICR plot shown in Figure 8

From Figure 9 it can be seen how Draft 33 pulls the mask above the Channel ICR curve for this full mesh backplane Channel Surprisingly it is the Channelrsquos frequency response at relatively low frequencies between 100-500 MHz that is causing a problem The reasons for this are currently the subject of further detailed investigation

However Figure 10 shows a Draft 33 plot for a less demanding dual star AdvancedTCA implementation featuring shorter trans-mission distances This plot demonstrates compliance to Draft 33 of the IEEE 8023ap 10GBASE-KR Standard

ConclusionBy developing a close understanding of the many factors contrib-uting to loss and noise in multi-gigabit backplane Channels it is possible to characterize their performance using advanced simula-tion techniques and correlate that performance in physical prod-ucts using advanced test methods By overlaying the test results on S-Parameter masks defined by the IEEE 8023ap 10GBASE-KR Standard it has been demonstrated that backplanes that truly enable AdvancedTCA scalability are at last a reality

Douglas Hynd joined Simclar Group in 2006 as Director of Marketing as part of Simclarrsquos acquisition of Northrop Grumman Interconnect Technologies Division wherehe was Vice President of Marketing and Sales He has more than 24 yearsrsquo experience intechnology sales marketing and generalmanagement and holds a BSc (Eng) in Electronics and Electrical Engineeringfrom the University of Glasgow He isbased at Simclarrsquos Global HQ inDunfermline Scotland

Simclar Groupdouglashyndsimclarcom bull wwwsimclarcom

Fo Sin Pnt

6U CompactPCIPrOduCT GuIdE g

This monthrsquos issue includes a 6U CompactPCI Product Guide and Irsquod like to take the opportunity to reflect a bit on the success and evolution of that technology

Back in the 1994 time frame when CompactPCI was first being devel-oped it began as 3U-only technology It used the same Eurocardmechanics that were popularized by VME and an IEC standardized high-

density high-speed connector available from a number of vendors suitablefor 33 MHz PCI signaling That connector was selected by the engineers atZiatech with help from Mike Munroe then at ERNI The majority of VMEdesigns were 6U and based on this I was among a number of folks thatargued for adding the 6U CompactPCI form factor

The 6U form factor presented some challenges and opportunities Onechallenge was that the insertion and extraction forces were quite high when the entire rear of the card was populated with connectors Fortunately the IEEE standards for Eurocards evolved and injectorejector handles that pro-vided leverage became available Eike Waltz then at Rittal was instrumental in bringing that to the table Two of the opportunities that came along withthe extra connectors were a clean way to add secondary buses like the H110 telephony bus to the backplane and the ability to route IO out the rear through rear transition modules PICMG has developed quite a number of subsidiary specifications defining the interoperable use of the extra backplane pins made possible with the 6U form factor Both of these features have played a major part in CompactPCIrsquos success The next major evolution of 6U CompactPCI came with the PICMG 216 Packet Switched Backplane standard which was originally conceived by John Peters and his team at Performance Technologies PICMG 216 interconnected a shelf full of CompactPCI single board computers via redundant Ethernet switches also in the 6U CompactPCI form factor This dramatically increased usable backplane bandwidth and provided redundancy PICMG 216 paved the way for AdvancedTCA and was the industryrsquos first open standard for the switched serial interconnect standards we see popping up in many places

By Joe Pavlat

Looking back and ahead at6U CompactPCI

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Recent 6U CompactPCI related products are listed here For more informationenter the productrsquos RSC No at wwwcompactpci-systemscomrsc

cPCI-6910Dual-core Intel Xeon Processor LVULV Universal blade bull Supports Single Dual-Core Intel Xeon LV or ULV processorsbull Front Side Bus 667 MHz bull Up to 2 GB DDR2 400 MHz soldered SDRAM with ECC bull Four PCI Express GbEbull Up to 4 USB 20 ports bull PICMG 20 21 29 216 compliant

RSC No 35013

ADLINK Technologywwwadlinktechcom

CPCIStor Module6U CompactPCI storage blade bull Onboard ATA controller supports CDDVD HDD and solid-state flashbull Supports Hot Swap Removal (ask about RAID support) bull ATA disks available in Enhanced Dutycycle versions for NEBS Level 3 - 724 requirements bull Operating Systems supported VxWorksLinux and Windows

RSC No 34800

ACTTechnicowwwacttechnicocom

Prosody X cPCI E1T1An E1T1 digital network access card bull Suits telco developers and systems integrators bull Uses Aculabrsquos worldwide protocol coverage including Aculabrsquos SS7 stack available under a cost free license bull Available with 8 or 16 E1T1 trunks and software selectable E1T1 interfaces bull Flexible mix of protocols including ISDN CAS and SS7 (ITU-T China and ANSI) bull A variety of interconnect switching and protocol conversion solutions can be readily crafted bull High availability reliability and scalability with industry standard hardw re and software interoperability bull Up to 128 SS7 signaling links bull Non-circuit related (TCAP) messagingintensive applications such as prepaid and SMS

RSC No 35408

Aculabwwwaculabcom

Adexp8021Intel Core Duo L2400 (166 GHz) w E7520 server chipset bull Dual channel PC2-3200 Registered RAM SECDED or x4 SDDC bull Two GbE two Serial ATA four USB 20 bull Onboard SXGA graphics 1280 x 24-bitbull 6U CompactPCI Bus PICMG EXP0 R10 Specification bull RoHS compliant 0 degC to +55 degC operating range

RSC No 32837

Advanet Incwwwadvanetcojpen

TC84012 channel single-stop Time-to-Digital Converter (TDC) with single-start and multi-start acquisition modes bull 50 ps timing resolution bull Wide range with upto 20 s between first and last events bull Large internal memory buffer with up to 512 hits per channel bull Low jitter (lt3 ps rms) high stability (plusmn2 ppm) internalclock source bull External 10 MHz reference input bull FPGA based Data Processing Unit (DPU) bull Fast readout with DMA mode for increased data throughputbull Overvoltage-protected inputs with 50 Ω K-Lock (LEMO) connectors bull Built-in self calibration bull Modular single-slot 6U PXICompactPCI standardbull Low power consumption (lt22 W)

RSC No 33445

Agilent-Acqiriswwwacqiriscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

MIC-30428-slot 6U CompactPCI backplane bull AC or DC CompactPCI 500 W + 250 W redundant(2+1) power supplies bull PICMG 216 (CompactPCI Packet Switching Backplane) compliancebull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarmmodule (MIC-3924L-AE)

RSC No 32851

MIC-30436-slot 6U CompactPCI backplane bull Supports two hot-swappable SCSISATA or removableIDE HDD bays bull Built-in IDE slim-type DVD-ROM bull AC or DC CompactPCI 250 W + 250 Wredundant (1+1) power supplies bull Supports hot-swappable fan modules bull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarm module (MIC-3924L-AE)

RSC No 32850

Advantech Corporationwwwadvantechcom

Dual-Core Xeon CompactPCI SBCModel PP 42123x bull Dual CPU 6U CompactPCI SBC supporting two dual-core Xeon CPUs bull Up to 8 GB DDR2 ECC SDRAM in a single system or peripheralslot bull Dual processor SBC in a single 6U CompactPCI slot bull Supports two 166 GHz Dual-Core Intel Xeon ULV processors using Intel E7520 server chipsetbull Up to 8 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull PMCXMC site support 66 MHz PCI-X and x8 PCI Express bull Front and rear IO bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade bull Four GbE ports with option for PICMG 216

RSC No 34761

6U CompactPCI Core 2 Duo SBCModel PP 41203x bull 6U CompactPCI Core 2 Duo SBC supporting two PMC sites includingone XMC site bull Up to 4 GB DDR2 ECC SDRAM bull All in a single system or peripheral slot bull TwoPMC sites supporting up to 100 MHz PCI-X bull One XMC x8 PCI Express bull Front and rear IObull Supports 216 GHz or 15 GHz Intel Core 2 Duo processors bull Intel E7520 server chipsetbull Up to 4 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade

RSC No 34763

PP 30202xTwo processor versions available bull 18 GHz Intel Pentium M processor 745 uses mFC-PGA 478 (micro Flip-Chip Pin Grid Array) package bull 14 GHz Intel Pentium M processor Low Voltage 738uses mFC-BGA 479 (micro Flip-Chip Ball Grid Array) package bull 64 KB primary (L1) on-die cache2 MB of secondary (L2) on-die cache bull 400 MHz Front Side Bus (FSB) bull No CPU fan bull 16 GHz processor version (1 MB L2 cache) available see PP 30002x datasheet bull Utilizes 64-bitIntel 855GME chipset bull Supports 400 MHz bus frequency bull Uses Intel 6300ESB IO Controller Hub

RSC No 32659

Concurrent Technologies Incwwwgocctcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cCIBPMC6U-ETA 6U bridged dual PMC carrier that bridges extended temperature CompactPCI boards and PMCs bull Features a rugged CompactPCI form factor providing increased flexibility to military communications systems designers bull Provides additional design choices to users through its differing bus speeds maximizing the numberof PMCs that can be used CompactPCI andPMC buses can both run at 66 or 33 MHzbull Operating temperature range of -40 degC to+85 degC bull Signal conditioning bull DMA supportbull Low-power design +5 V +33 V +12 V -12 V bull User-selectable VIO of 33 V or 5 V to the PMC

RSC No 32891

Dynamic Engineeringwwwdynengcom

cPCI4IP-MMMinimized PCI address footprint IndustryPack carrier for CompactPCI applications bull 6U 4HP4 IP positions 832 clock selection for each slot fused filtered power IO options bull ID INT IO and Mem spaces are decoded for each IP slotbull Single and double wide IPrsquos bull 16- and 32- bit IPs bull 32-bit access to 16-bit IPs bull Full or mini-mized Memory Space decoding for 18 the PCI address requirement bull With the cPCI4IP-MM option 8 CompactPCI 4IP cards take the same PCI address space as 1 full Mem Space card

RSC No 34905

ACQ132CPCI32 channel MHz class simultaneous sampling intelligent digitizer bull 32 simultaneous analoginput channels 2-32 MSpschannel 14-bit resolution bull Differential inputs bull Intelligent cardwith 1 gigabyte memory and GbE on board bull Large distributed FPGA resource on boardbull Range of DSP functions including FIR filtering and Digital Downconverter

RSC No 35482

D-TACQ Solutions Ltdwwwd-tacqcouk

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CR11Based on the Intel Core Duo Processor the platform is designed to support processor speeds from 106 GHz up to 20 GHz bull Intel Core 2 Duo runs at 15 GHz up to 20 GHz bull Conduction cooled bull Two PMC slots bull PCI Express bull 2x GbE

RSC No 33156

ICS-72532-channel 6U CompactPCI DAC board bull 6U CompactPCI data acquisition card bull 32 differential output channels bull 16 or 24-bit sample size bull 288 kHzch data rate bull Simultaneous sampling across all channels on single or multiple boards bull 32 separate delta-sigma DACs bull 64-bit 66 MHz CompactPCI PICMG 20 Rev30 hot-swappable bull FPDP II 400 MBps interface

RSC No 33576

ICS-71032-channel 6U CompactPCI ADC board bull 6U CompactPCI data acquisition card bull 32 differential input channels bull 216 KHzch 24-bit resolution bull Software selectable full scale input bull FPDP II 400 MBpsinterface bull 64-bit 66 MHz CompactPCI PICMG 20 Rev 30 hot swappable bull 32 synchronous boards for simultaneous sampling bull Sonar acoustics and test and measurement applications

RSC No 33578

Tsumani 6U CPCI Development KitFPGA processor solution targeted at high performance software defined radio applications bull Dual Stratix EP1S80 FPGAs are tightly coupled to provide apower platform for signal processing bull Two PMC module sites provide IO connectivity to either front panel or back panel connections bull A direct highbandwidth 1 GBps path from the PMC P4 connector directly to the FPGAs bull Model 919 Dual DAC Mezzanine provides broadband analog signal generationin a compact form bull The board features two independent DAC channels each with its own 12-bit LVDS input capable of running at rates up to 160 MHz

RSC No 32026

CP11Rugged 6U SBC bull Up to 4 GB of DDR2 SDRAM (200 MHz) with enhanced ECC four independent onboard PCI buses system host and peripheral modesupport for the CompactPCI backplane two PMC interfaces (64-bit133 MHz and 32-bit33 MHz) bull Instead of the PMC1 a PCI Express based XMC interface is available on request bull Two GbE one Fast Ethernet two serial interfaces (RS-232 or RS-422485) USB 20 integrated HDD or flash drive bull High performance 2D3D ATI video controller capable of driving two displays in parallel supports VGADVI interface bull Intel Core 2 Duo at 216 GHz Intel Core Duo at 20 GHz2x PMC expansion site bull One XMC optional bull Up to 4 GB DDR2 SDRAM wECC 2x GbE

RSC No 33447

GE Fanuc Intelligent Platforms Incwwwgefanucembeddedcom

Single Board ComputersGD Canada designs and manufactures conduction-cooled Single Board Computers (SBCs)using Intel processors bull 6U and 3U form factors for CompactPCI backplanes bull Fully backward compatible with earlier models bull Upgradeable via the change-out of processor memory andIO modules bull Used within GD Canada computer systems and sold as individual products

RSC No 35281

General Dynamicswwwgdcanadacom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cPCI6U-24DSI32R32-channel 24-bit delta-sigma CompactPCI 6U analog input board with rear IO bull Low noise 24-bit resolution low phase distortion andmulti-board synchronization bull Suits state-of-the-art sonar and noise monitoring applications bull 32-channel cPCI6U-24DSI32 analog input boardprovides a high-density 24-bit analog input resources on a standard 6U CompactPCI expansion board bull Applications from precision voltagemeasurements to complex audio signal and waveform analysis

RSC No 34985

General Standards Corporationwwwgeneralstandardscom

Duet 3U 64-bit 1 GHz TMS320C6416 DSP (x2) 64 MB SDRAM per processor bull Flexible internalexternalcommunication mesh bull 64-bit66 MHz CompactPCI bull PMCXMC site with Jn4 to FPGA and4 RocketIO per VITA 42 bull External data port up to 12 Gbps bull 4M or 5M Virtex-II Pro FPGAbull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM dedicated800 MBps links between DSPs bull 3U CompactPCI with PXI support bull Suits high-end co-processing wireless broadband communications RADAR video and biometrics

RSC No 32856

QuadiaQuad-DSP bull Dual FPGA bull Dual PMC sites bull Inter-processor connectivity and access to external interfaces bull Four C6416 DSPs split in two independent clusters each hosting a PMC site bull One large FPGA for end-user code bull Central FPGA routing interprocessor communication bull End-user FPGA communication bull External port serial IO for PCIe or other p ivate link bull Global memoryand PCI interface bull 1 GHz TMS320C6416 DSP (x4) bull 64 MB SDRAM per processor bull Flexible internalexternal communication mesh bull 64-bit66 MHz CompactPCI bull Two PMC sites with Jn4 to FPGA bull External data port up to 12 Gbps bull Two 4M Gate FPGA reserved for end-user code bull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM bull Up to 512 MB Global DDR SDRAM bull Suits high-end co-processing wireless and broadband communications

RSC No 34737

Quixote 64-bit 6UAdvanced signal capture generation and co-processing bull 1 GHz TMS320C6416 DSP and2 to 6 MGATE Virtex-II FPGA bull 32 MB SDRAM 8 MB ZBT SBSRAM and AD6645 and AD9764 converters bull 6432 bit CompactPCI 66 MHz 5 V33 V and complex trigger modes with HW event logging bull PMC site with Jn4 to FPGA DIO and PICMG 217 StarFabric compliant bull Suits Software Defined Radio wireless IP and RADAR development and hardware testing bull Physical Layer field testing ultra-fast flexible data acquisition vector signal generation and electronic warfare

RSC No 32861

Innovative Integrationwwwinnovative-dspcom

IC-e6-cPCIbHigh performance 6U CompactPCI board bull Powered by one or two of Freescalersquos mostadvanced 14 GHz MPC7448 PowerPC processors bull PICMG 216 compliant bull Marvell Discovery III chipset (MV64460) bull Low power consumption bull Standard extended and rugged grades

RSC No 32982

Interface Conceptwwwinterfaceconceptcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CP213Single-width 6U CompactPCIPXI module with either 32 or 64 differential analog input channelsbull 32 64 or 128 channels of analog input bull 16 multifunction digital IO (TTL) channels that may beconfigured as digital in digital out or selectively attached to 2 frequency in 2 counter in andor 2 timerout channels bull 16-bit resolution bull Programmable gain per channel programmable scan rates of lt1 Ss through 100 KSs bull Precision onboard reference for end-to-end calibration

RSC No 34804

KineticSystems Company LLCwwwkscorpcom

CP6001Energy efficient embedded Intel dual core processors bull 12 GHz Intel Core Duo U2500 ULV processor bull Intel Core 2 Duo L7400 LV processor bull Based on the Intel Mobile 945GM chipset with a front side bus of up to 667 MHz and ICH7-R Southbridge bull Two independent digital video outputs to the rear IO (2x DVI - 1x DVI and 1x HDMI) bull AC97 audio capabilities bull 3 x GbE bull 4 x SATA with RAID 01510 functionality bull 6 x USB 20 2 x COM and VGA or DVI bull Can also accommodate a PMC slot or an onboard 25 inch SATA HDD bull Up to 8 GB of USB or 2 GB soldered flash bull Supports Linux Windows XP XP embedded and VxWorks 6

RSC No 34182

CP6923 GbE Switch6U CompactPCI GbE Switch PICMG 216 compliant bull Leading edge te hnology basedon BCM5650X chip bull 24x GbE ports bull Non-blocking Layer 2 and 3 switching and routingbull Copper optical rear IO version bull Hot swap IPMI bull Fully managed bull Comprehensive firmware package bull Applies to VoIP installations such as call servers media gatewaysand trunking gateways in wireline and wireless networks as well as VoIP systems inenterprise networks with high demands on performance

RSC No 32256

Kontronwwwkontroncom

TMS320C6701 Virtex-IITexas Instrumentsrsquo C6701 DSP bull Xilinx Virtex-II series FPGA up to XC2V8000 bull Multiple IO interfaces Onboard CODEC VIM expansion sites 60-pin GPIO header and JTAG bull Hardware drivers integration in SimulinkXilinx System Generator Blocksets for quick implementation of Simulink models bull DSP and FPGA-in-the-loop cosimulation of SimulinkXilinx System Generator models bull Leading edge communication interface allowing real-time datamonitoring from Simulink scopes and remote operations

RSC No 32028

VHS-DACHigh performance multichannel DA for phased array antenna systems radarsonar communications receiversup-sampling to IF stage and RFIF AGC apps bull Eight 125 MSPS output channels bull Optional add-on daughter boardprovides 8 additional output channels or 8 additional input channels bull 32-bit 25 MHz bull FPDP interface with 400 MBps transfer rate (25 MSPS per channel at 8 channels 125 MSPS at 16 channels) bull Low level hardware drivers API andGUI bull High level hardware drivers integration in Simulink Blocksets bull Leading edge communication interface fordata recording and playback tofrom the onboard SDRAM

RSC No 32029

Lyrtechwwwlyrtechcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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Page 16: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

as multimedia mobile phones VoIP or IPTV at home Service providers must manage ldquoduplicatedrdquo subscriber databases for each particular service Consequently managing a converging subscriber base for such network functions as billing across multiple different technologies presents a tremendous challenge Any downtime of this network element can be costly to the carrier or service provider not to mention the heavy risk of losing subscribers over the long term

The HSS and Home Location Register (HLR) are key elements in the IMS network required to manage the growing number of subscribers These platforms that manage millions of customersrsquo data need to be highly reliable with carrier-grade High Availability (HA) functionality Core requirements for the HSS computing platform are

n High compute density for application processingn Scalable performance and high densityn Fast read access to the subscriber datan Large storage and memory bandwidthn Ability to consolidate multiple IMS elements and subscriber data within a single

platform with a modular approach as a converged services platform

HSS plays network backbone roleHSS provides the important network backbone of the IMS architecture because it eases innovation and addresses a range of service-logic interaction issues that have plagued previous service architectures HSS offers open access to service-related data for each subscriber supporting the sharing of data among multiple services

HSS is essentially the master user database that supports IMS network entities that handle calls and sessions It contains user profiles performs authentication and authorization of the user and can provide information about the physical location of the user It plays a key role in provisioning service creation enabling subscriber data and managing control roaming and interconnection The Application Server (AS) which hosts and executes serv- ices in the IMS environment communicates with the HSS Call State Control Function

(CSCF) servers also communicate with the HSS which must be able to

n Support IMS-level authentication and authorization

n Maintain IMS subscriber profile(s) independent of access types

n Maintain service-specific datan Keep track of currently assigned

CSCFn Support CSCF and AS access

HLRHSS hardware platform design choicesHSS design must enable the HSS to be deployed cost-effectively and expand readily to meet future subscriber levels For example the trend to include more information as part of the data record for each subscriber will drive up memory requirements

From a technical perspective the key metrics to understand when developing the IMS HSS functions are the number of completed transactions required per sec-ond and the size of the subscriber base

HSS architecture typically comprises multiple processor units with extensive memory requirements With the introduction

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of multicore processors from Intel developers can scale performance while optimizing power consumption in the overall system design

To meet these requirements the hardware platform needs to provide scalability flexibil-ity and long-term cost efficiency In comparing the traditional 1U platform with a more modular approach to the HSS using AdvancedTCA consider the following

n High compute performance n High memory and storage capabilityn IO functionality to connect to multiple networks (such as SS7 and Ethernet)n Carrier-grade profile and redundancy

AdvancedTCA High density with scalability on a smaller footprintTable 1 illustrates a comparison of a sample AdvancedTCA-based platform and a 1U PCI rack-mounted platform for HSS applications This configuration assumes an increasing subscriber growth from 1 million (M) subscribers to 18M subscribers per platform

FootprintAdvancedTCA-based platforms provide a high density compute platform with scalability on a smaller footprint TEMs can easily add boards to a chassis to accommodate more traffic and to support new services This flexibility enables an increase in subscribers and the database without having a major impact on rack space in the central office environ-ment To meet the same capacity for 18M subscribers the 1U PCI approach will occupy two bays or cabinets with a total footprint of 28 square feet compared to the same capacity occupying one bay or cabinet with a footprint of 14 square feet (see Figure 1)

CoolingWhile the power consumption per square foot is higher than the 1U PCI platform AdvancedTCA offers better airflow and cooling distribution using a push-pull cooling system Each 1U PCI platform includes up to nine cooling fans and is dedicated to that CPU in the 1U server only which translates into higher overhead Therefore the airflow is

not optimized in the overall system design In the case of a fan failure AdvancedTCA platforms enable easier access to replace the fans which are field replaceable units The 1U platform also does not include any integrated centralized switching or management capabilities therefore the total does not include any switching or system management functionality

ScalabilityAdvancedTCA architecture lends itself well to scalability As AdvancedTCA sup-ports both a Base and Fabric interface into the backplane and the separation of data and control planes TEMs can also scale up their designs from 1 GbE to 10 GbE to accommodate new users and usage requirements AdvancedTCA based systems are designed for easy upgrade-ability to new processing blades switch fabrics and IO modules using Advanced Mezzanine Cards (such as SS7)

Since AdvancedTCA and AdvancedMCs offer hot swap capabilities and HA func-tionality growing a subscriber base by using additional CPU blades within the system with low maintenance or upgrade downtime is crucial for the HSS plat-form It also allows for the up and down

AdvancedTCA-based HSS Platform 1U PCI Rack-Mount HSS Platform

Number ofsubscribers

~1M subscribers = 4 CPU blades edundant ~1M subscribers = 4 x 1U

~4M subscribers = 7 CPU blades redundant ~4M subscribers = 7 x 1U

~6M subscribers = 12 CPU blades redundant ~6M subscribers = 12 x 1U

~18M subscribers = 36 CPU blades redundant= 3 AdvancedTCA shelves per rack

~18M subscribers= 36 x 1U+ external switch components for redundancy

Technicalspecs

1 CPU blade = 2 x Intel Xeon dual core = quad core 1 1U rack-mount Intel= Intel Xeon quad core or dual core CPU

16 G DDR 2 memory Max of 8 G DRY memory

+ 2 x SATA or SASS hot swap (RAID 0 and 1)+ 1x PCI Express for SS7 Dual GbE per 1U rack-mount server

4 x GbE per CPU with built in GbE backplane switching separating Control Pathand Data Path with multishelf expandability

External central switching required withmultiple external GbE connectivity

Systems and blade manageability built into the platform withIMP implementation SNMP and CLIP

Carrier-grade redundancy on switch and node

IO for SS7 or other interface modules

CPU blade hot swap capability

Thermaland power

requirements

~6M subscribers redundant= 14 slots with centralized chassis cooling

~6M subscribers redundant= 18 x 1U PCI with independent cooling and separate switch units and system management

Total power consumption= ok (3100 W for blades and RTM + 500 W Shim fan tray and SAP)

Total power consumption= ok

Table 1

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scaling of the platform depending on the subscriber increase or decrease When consolidating multiple services minimiz-ing multiple duplicate databases requires this flexibility

InterconnectivityThe AdvancedTCA platform offers a number of interconnectivity features including

n Separation between the data plane and the control plane

n Direct uplink in a multichassis envi-ronment with up to l0 GbE

n Node to node base and fabric connec-tivity with HA carrier-grade Ethernet functionality

n Easy upgrade path to l0 GbE for increased bandwidth

By contrast the 1U PCI platform requires

n Additional external interconnectiv-ity between 1U rack-mount servers which increases the number of points of failures and the operating and maintenance costs

n Additional switching equipment for carrier-grade Ethernet connectivity

n Additional manage-ment (Simple Network Management Protocol [SNMP]) for HA redundancy

PowerThe 1U-based platform also utilizes integrated AC power supply units usually the standard for the data center and enter-prise environments AC will increase the pro-viderrsquos OPEX in the long term since the power consumption per rack is significantly higher and

Figure 1

requires additional support equipment such as an Uninterruptible Power Supply (UPS) and an AC to DC converter per rack space and ultimately per CPU These factors along with the requirements for carrier-grade functionality HA support and a more favorable long-term OPEX further reduce the need to consider the 1U solution for HSS deployments in Central Office networks

ManageabilityAdvancedTCA chassis-level management is based on the industry-standard Intelligent Platform Management Interface (IPMI) IPMI makes possible interoperability among chassis and blowers compute nodes switches and management solutions from multiple vendors enabling these elements to work together seamlessly The resulting successful inter-blade communication for applications including failover and clustering provides full manageability on a per shelf and per bay basis

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One of the primary goals of the AdvancedTCA specification is to ensure a very low Mean Time to Repair (MTTR) and high Mean Time Between Failures (MTBF) There are no active components in the backplane ndash which can translate to expensive repairs in the field In addi-tion AdvancedTCA specifies that all com-ponents can be hot swappable in the field and the architecture provides redundancy at all levels This hot swap capability translates to less downtime for field replacement on a per CPU blade basis as compared to 1U PCI

SummaryAdvancedTCA provides an ideal platform and meets the technical requirements for deploying flexible and scalable IMS HSS applications While other platform archi-tectures such as 1U rack-mount servers may with considerable difficulty be able to deliver HSS capabilities AdvancedTCA offers a much more advantageous solution by providing a smaller footprint improved cooling and thermal characteristics bet-ter scalability enhanced interconnectivity and easier manageability This all contrib-utes to making AdvancedTCA a lower cost approach in terms of CAPEX and OPEX for long-term subscriber growth

1U PCI rack-mount servers are not considered to be the optimal hardware platform for HSS applications in a Central Office With its limitation for carrier-grade flexibility and HA functionality the 1U PCI platform is best suited for a full range of other enterprise and Internet infrastructure applications within a data center environment that does not require any significant flexibility and HA functionality around it It might also be a good entrance point for other enterprise applications with lower price points

The use of AdvancedTCA-based platforms enables TEMs to shift away from hardware development and refocus their efforts on delivering value-added software and services As a result they can realize lower development costs and faster time-to-market enabling increased flexibility with each product design through the use and reuse of standardized off-the-shelf components Equally significant are the advantages that can be realized by the service provider With a common platform and a flexible architecture that maximizes limited floor space service providers can rapidly and flexibly implement a broad range of feature-rich solutions for faster profitability

Sven Freudenfeld is responsible for North American Business Development for the Kontron AG line of AdvancedTCA AMC MicroTCA and Pre-Integrated Solutions Sven possesses more than 15 years of experience with voice data and wireless com-munications having worked extensively with Nortel Networks in Systems Engineering Sanmina-SCI in Test Engineeringand Deutsche Telekom in Network Engineering Sven holdsan electrical engineering degree from Germany and is also Chair of the CP-TA marketing workgroup focusing on the interoperability of COTS standard building blocks

Kontron bull svenfreudenfeldcakontroncom bull wwwkontroncom

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TECHNOLOGY g BACkpLANES

Increasing demand for service and multimedia features is stimulating a growing need for speed in telecom-munications equipment While some

applications such as PBX systems can be addressed with the gigabit backplane technologies currently available others are running out of headroom Routers may soon need 10 Gbps and higher speed back-planes to keep up with network demand Many such applications can justify the expense of moving to higher performance if it becomes available

Currently telecom system designs offer backplanes that can handle interconnec-tions running as fast as 3125 Gbps raw data throughput per lane (with around a maxi-mum data rate capability of 5-625 Gbps per lane) The AdvancedTCA standard for instance uses Ethernetrsquos XAUI inter-face AdvancedTCA achieves a 10 Gbps net data rate by running four serial lanes for each interconnection with each lanersquos

SERrializerDESerializer (SERDES) op-erating at 3125 Gbps raw data (25 Gbs net)

As demand forces systems to move beyond these rates however new technologies will be needed One proposal calls for the use of XAUI+ or double XAUI which increases lane SERDES rates to 625 Gbps per lane and hence the throughput to 20 Gbps Another proposal is to use IEEE 8023ap known as 10GBASE-KR which runs a single SERDES lane at 125 Gbps raw data rate (103 Gbps net) But these are only short-term answers To address future demands organizations such as the Institute of Electrical and Electronic Engineers Standards Association (IEEE-SA) are developing specifications for Ethernet speeds of 40 Gbps to 100 Gbps which will be applied to backplane interconnect

Such high clock rates however will pose significant design challenges for developers

One of the first challenges that will need resolution is the design and layout of the backplane and other PCBs Common design practice today readily handles board clock rates of around 10 Gbps Well established design rules are in place and board layout tools such as autorouters can automatically handle board designs for speeds in the 10 Gbps range Designers may use specialized board material create additional ground planes and perform similar tasks in order to ensure proper board operation at the higher end but even speeds to 5 GHz are within current design tool capabilities

Design gets trickierAbove 5 GHz however board design gets more involved because feature dimensions become significant when compared to the signalrsquos wavelengths Variations in board thickness can affect signal propagation Corners where traces change direction and small spurs along edges of poorly etched

Channel characteristics

challenge backplane interoperability

Serial backplanes in telecommunications systems aim for high speed with room for

growth As systems began using 10 Gbps links however issues arose that affected backplane

communications among cards from different manufacturers Stuart points out that the

industry must define key backplane channel characteristics so that designs based on open

standards maintain interoperability as backplane speeds move to 40 Gbps and beyond

By Stuart JamieSon

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traces can act as antennae for the higher fre-quencies in digital signals As can be seen in Figure 1 sharp corners and minor flaws that are inconsequential at lower frequen-cies have the potential to become trouble-some antennae at future high speeds This can result in the trace radiating away the signalrsquos high frequency energy increasing EMI and crosstalk as well as altering signal waveforms New routing design rules such as making corners 30deg instead of 45deg and more careful board fabrication techniques may become necessary as designs move above the 10 Gbps per lane threshold

The move to higher frequencies will affect more than board fabrication and layout however Higher frequencies will also impose new requirements on signal tim-ing signal rise-time electrical distance and waveform shape if developers are to retain the mix-and-match system design approach that makes standards-based system design effective

For interoperability to be achievable at data rates above 10 Gbps organizations such as PICMG will need to carefully define a vari-ety of signal and design parameters in their specifications Some of the key parameters that will need consideration include

n Interconnect signal attenuationn Eye diagramn Jittern Input clock recoveryn Chip inputoutput pre-emphasis (PE) n Equalization (EQ)

Even slight variations in these parameters from device to device and lane to lane can shift the timing of signals a significant fraction of a clock cycle and affect the Bit Error Rate (BER) of a lanechannel Finally signal rise times will require tight control as signal rates increase in order to ensure control of system timing (see Figure 2)

In defining signal and design parameters specifications will also need to account for the increased location dependency that comes with higher frequencies Even subtle differences in attributes such as routing length and trace impedance become increasingly significant as signal speeds rise To ensure mix-and-match interopera-bility then design specifications may need to account for the specific backplane slot that a board is to occupy as well as introduce a method to obtain and control the PE and EQ of the devices connected to the lanes

Designers must also address fabrication standards The material used to fabricate

Figure 1

Figure 2

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the board the thickness and composition of metal cladding and the spacing between layers can all affect the trace characteris-tics Controlling these parameters under specification ensures that timing charac-teristics are sufficiently uniform from one board to another However current speci-fications are too detailed and stringent It is extremely difficult to attain compliance yet avoid adding cost to the design

Specifications need workSome of these parameters are already incorporated into current specifications The AMC module specifications from PICMG for instance include design parameters that ensure its proper opera-tion at signal speeds as fast as 125 Gbps per lane Establishing specifications for other system components will help achieve interoperability of standards-based designs at higher frequencies

Design tools may also need to be modified and the industry will need to create new design rules for high frequency and incor-porate these into the tools Developing new routing techniques will help avoid the issues of electrical phenomena such as skin effect dielectric loss and impedance mismatches These are much more preva-lent at higher frequencies and it becomes critical for engineers to model and simu-late these phenomena more accurately

Early efforts are already underway to address the challenges that higher fre-quency signals bring to standards-based design The Interconnect Channel Characterization Subcommittee of PICMG established in September 2006 is develop-ing ground rules and definitions to be used in characterizing transmission reflection and crosstalk performance in backplane and mezzanine carrier interconnects The committee aims to define the channel parameters to be measured or analyzed as well as the methods for doing so Its charter calls for it to address

n Definition of interfaces at which measurements are made or characteristics computed

n Test equipment fixtures and PCB test coupons

n Details of measurement proceduren Data formatsn Techniques for de-embedding

components of the channeln Techniques for validating

measurement based models ie passivity and causality

n Definitions that allow reasonable compliance testing

n Boundary definitions for different paths

n Define information regarding limita-tions or proper usage ie maximum data raterise times that are supported by the models

Such efforts are only a beginning how-ever Other design details still need to be addressed such as SERDES IO Configuration New functionality may need to be defined The design of high data rate system channel interfaces according to standardsspecifications does not currently cover the individual characteristics of the chip transmitterreceiver characteristics Thus work will be needed to address how such standard designs handle such dependency

Crossing an interoperability thresholdOne way of handling location dependen-cies might be to give the system control-ler the ability to inform modules what the channel transmitter and receiver PE and EQ technology is and importantly how to control it With this information along with the signal attenuation suffered (at a given bit rate) for the channel the system should be able to configure SERDES channels in different physical locations to run reliably and at the required BER In MicroTCA systems for instance this functionality could be incorporated into the MicroTCA Carrier Hub (MCH) as part of its electronic keying function Modules would have to be able to configure and control its backplane interfaces to allow for different positions

in the backplane An MCH (see Figure 3 courtesy Emerson) then would be able to instruct a module as to which parameters to use for interoperability

The specific approaches needed to handle location dependencies and other challenges that higher signal rates raise have yet to be developed The need to address these challenges however is clear Increasing demand for services is driving applications to utilize faster signal rates This in turn is driving backplane signaling speeds ever higher As speeds rise above 10 Gbps sig-nals will cross a threshold where current specifications will prove inadequate for ensuring interoperability among standards-based designs

The industry should begin developing new or enhanced specifications and design tools to address the challenges of higher signal rates Without such improvements the guarantees of interoperability that allow system developers to readily create solu-tions by combining off-the-shelf products will be compromised As backplane speeds approach 100 Gbps nothing can be taken for granted

Stuart Jamieson Director of Industry RelationsArchitect with Emerson Network Power Embedded Computing represents Emerson on PICMG committees and the SCOPE organization and previously served as a CP-TA Board member (Treasurer) He brings over 18 years of experience in hardware protocols embedded software and specification development to these groups Within Emerson he played a key role in the develop-ment of the technology central to Emersonrsquos bundled network-ing solutions Stuartrsquos positions within Emerson have included Director of Business Development Director of Advanced Technology and Architect He is the Draft Editor for the PICMG Interconnect Channel Characterization Subcommittee is the author of the introduction section for the new PICMG Ruggedized MicroTCA specification and served as the Draft Editor for the PICMG MicroTCA Specification Stuart gradu-ated from the Heriot-Watt University in 1989 with a 1st Class Honors degree in Electrical and Electronic Engineering and again in 1992 with an IBM-sponsored Master of Philosophy

Emerson Network Power Embedded ComputingStuartJamiesonEmersoncom bull wwwemersonembeddedcomputingcom

Figure 3

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TECHNOLOGY g BACkpLANES

2008

B A

N D

W I

D T

H

Signal integrity challenges to bandwidth scalabilityFor the purposes of this article each interconnected differential pair will be referred to as a Channel (which should not be confused with an aggregated AdvancedTCA channel comprising four trans-mit and four receive pairs)

14-slot full-mesh AdvancedTCA backplanes contain hundreds of Channels Each Channel is defined as the copper signal path from the output of a driver device to the input of a receiver device As

By douglaS Hynd

Developing IEEE 8023ap 10GBASE-KRcompliant backplanes

Why doesAdvancedTCA

need bandwidthscalability

PICMG AdvancedTCA 30 has emerged as the

industryrsquos Hardware Platform standard of choice and

is enjoying first-phase deployment However many

believe that for AdvancedTCA to realize its market

potential AdvancedTCA platforms need to seamlessly

scale to accommodate 40 GbE fabrics thereby

avoiding forklift upgrades as system bandwidth

demands increase over time A 40 GbE switch fabric

architecture would enable realization of a common

platform for computing storage control and media

and packet processing and provide the versatility and

long term ROI required by service providers in

todayrsquos increasingly competitive environment

The challenge was to develop a family of

AdvancedTCA products which feature PICMG 30

compliant dual star and full mesh advanced

backplane switch fabrics enabled up to 10 Gbps

per differential signal pair thereby giving 40 Gbps

per AdvancedTCA channel performance

This article describes the signal integrity challenges

presented in designing an IEEE 8023ap

10GBASE-KR-compliant bandwidth-scalable

14-slot AdvancedTCA platform and how these

challenges were overcome in development of full

mesh and dual star backplane reference designs

Fo Sin Pnt

shown in Figure 1 that signal path comprises a signal launch a blade PCB transmission line a daughtercard via a right-angled HM-ZD connector a mated HM-ZD backplane header a back-plane via a length of backplane PCB transmission line and then the same combination of connectors vias and transmission line at the receive end of the Channel

Sources of crosstalkFour principal sources of crosstalk in each Channel must be man-aged as shown in Table 2 Source number one is between adjacent differential pairs as they are routed across the backplane Common mode noise rejection in system differential pair structures makes this a minor issue The second source of crosstalk lies in the HM-ZD connector itself

Crosstalk in via fields our third source primarily arises from inductive coupling between adjacent differential pairs and domi-nates the crosstalk agenda in high-speed Channels This source of crosstalk is directly proportional to the length of the via barrel and where practical care must be taken to ensure that adjacent connector rows are terminated to different target routing Layers

The final source of crosstalk is caused by aggressor signals in through-routed via fields coupling with victim Channel traces as they pass through As mentioned earlier judicious and careful design can mitigate this impact

Skew Channel skew is a function of differential transmission path geometries At a fundamental frequency of 5 GHz skew can be a significant issue in high-speed system design due to narrowing the eye opening and increasing jitter Skew can have a significant impact on crosstalk it negatively impacts the common mode rejection of noise inherent to differential signaling Conductor surface roughness in lower performing dielectric materials can also cause skew in high-speed systems

Skew can be avoided through careful management of transmission path lengths in each Channel and by using higher-glass content (lower Dk) laminates

LossPotential

Potential Mismatches

Channel

Loss Potential Channel

PCB Tolerance -025 dB 2 -01 dB

Connector Tolerance -001 dB 4 -016 dB

Thru-routed Via Fields -001 dB 12 -144 dB

Connector Launch -025 dB+ 4 - 2 dB+

Quantity TotalNEXT

TotalFEXT

PCB Transmission Lines

24 in60 cm

-50 dB -70 dB

Connector Architecture 2 -26 dB -24 dB

Via Fields 4 -22 dB -20 dB

Connector Pass Through 8 -34 dB ndash34 dB

For the target application each one of these Channels must deliver a 10 Gbps Non-Return-To-Zero (NRZ) signal with sufficient signal fidelity to enable a receiver device to detect and process a differential signal The PICMG 30 specification is targeted at 3125 Gbps signaling with a fundamental frequency of 156 GHz Even in low loss dielectric materials insertion loss at 10 Gbps (5 GHz fundamental) is twice that of a 3125 Gbps signal

Therefore achieving acceptable signal fidelity requires careful management of signal losses and noise in each Channel such that an acceptable signal-to-noise (SN) ratio is achieved at the receiver

The design process therefore begins by understanding and mitigat-ing the sources of losses and noise in each Channel

Sources of lossThere are three sources of loss

n Conductor losses which are due to skin effects and can be addressed by maximizing the cross sectional area of the signal traces

n Material dispersion losses which are a function of the dielectric constants of the chosen material These can be mitigated by choosing a higher performance laminate material such as Nelco 4000-13SI or Megtron

n Reflected power loss due to impedance mismatches in the Channel as each signal transitions across the different copper media in each channel (connectors vias and PCB traces) and passes through the pad and anti-pad structures of the via fields of other backplane blade slots

Table 1 shows the relative effects of different sources of impedance mismatches The dominant source of impedance mismatches in every Channel resides in the via structures Successful mitigation of this problem requires that every via is tuned by back-drilling the stub and adjusting the pad and anti-pad structures to match the impedance to be 50 ohms irrespective of the target routing layer This in turn requires that the capacitive and inductive effects of the connector pin and via barrel combination are taken into account during the design of each Channel

Further complicating via design is the space the anti-pad structures need to accommodate Channels being routed between other blades while minimizing electro-magnetic coupling with them This space consideration makes the shape and orientation of pads and anti-pads extremely important

Figure 1

Table 1

Table 2

Fo Sin Pnt

IEEE 8023ap provides a design targetAs Ethernet has emerged as the industryrsquos dominant signaling methodology the IEEE has developed the 10GBASE-KR norma-tive Channel model to define interconnect Channel performance for NRZ signaling at 10 Gbps This standard defines acceptable performance in terms of S-parameter charts for through-Channel insertion loss and worst-case crosstalk Figures 2a and 2b illustrate masks for Draft 24 of the standard that was initially used for this exercise

In each case the mask defining compliant performance is shown in blue Channel insertion loss is shown in red in Figure 2a Crosstalk performance is defined by the ICR curve (Figure 2b) Minimum acceptable Channel performance is defined in the ICR chart (Figure 2b) by the blue line The effect of the sum of all aggressors on the through-Channel is shown in red The green ICR curve is the ratio of the crosstalk power sum calculated by summing the

magnitudes of any impacting crosstalk Channels for each fre-quency and using a straight line fit (using least-squares method) to determine the resulting average effect f the aggressors on the through-Channel This is then overlaid on the insertion loss and used to plot the ICR curve

This standard which has evolved through a variety of iterations forms the basis for developing a 40 GbE switch fabric backplane featuring 10 Gbps NRZ differential pairs If all differential pairs can meet this standard then the backplane can be considered to be 10GBASE-KR compliant

Applying 10GBASE-KR to a 14-slotAdvancedTCA applicationThe PICMG specification dictates that receive differential pairs are placed on the c-d and g-h rows of the HM-ZD connector and that transmit differential pairs are placed on the a-b and e-f rows Therefore the middle differential pair in row c-d of Slot B will be subject to the NEXT of three aggressors in each of the a-b and e-f transmit rows of slot B plus the FEXT of the signals being received in the c-d pairs in the top and bottom of slot B

In this topology it can be seen that worst-case crosstalk would occur if all the NEXT and FEXT aggressors were routed on the bottom Layer that is on the same Layer as that of the victim c-d However given that all signal vias must be back-drilled and tuned for impedance management purposes Channel crosstalk can simultaneously be reduced by allocating different routing Layers to differential pairs terminated in the same backplane connector

The principal factor in determining the feasibility of a 10GBASE-KR compliant backplane is based on understanding whether the Channel with the worst-case signal-to-noise ratio is compliant

The skew targets determine permissible layer separation between a-b c-d e-f and g-h pairs within each Channel and enable routing Layers to be allocated for each pair It is now possible to start the process of via tuning to optimize the channel performance for minimum insertion loss Modeling begins by defining the simulation boundaries for the channel so that Channel component models (PCB traces connectors vias) can easily be aggregated to model complete Channels Boundaries must be established at locations in the Channel where linear 3D structures exist These are shown in Figure 3 (next page)

Since the connector and via combinations for the backplane and daughtercard mating halves must each be treated as a whole it

PICMG 30Spec

TurboFabricSpec

Total Inter-PairSkew

(Fabric Interface)

05 mm in FR4(34 ps)

001 mmin N4000-13si

(00625 ps)

Total Intra-Channel Skew

(Fabric Interface)

254 mm in FR4(17 ps)

plusmn01 mmin N4000-13si

(0625ps)

Total Intra-Channel Skew

(Base Interface)

135 mm in FR4(90 ps)

plusmn01 mmin N4000-13si

(0625 ps)

Figures 2a and 2b

Table 3

Determining which Channel that is and identifying the worst-case SN requires making trade-offs with regard to PCB material Channel length via design connector row selection and NEXT and FEXT aggressor routing choices These trade-off choices can only take place using advanced 3D simulation tools such as Ansoft HFSS This was the essence of the design process employed in developing Simclarrsquos TurboFabric backplanes

The simulation processThe transmission length for full mesh and dual star backplanes design implementations varies from a maximum of 1632 inches to a minimum of 116 inches With an effective transmission length of 5 inches on each daughtercard this makes the longest effective Channel 2632 inches including two connectors

For a 10GBASE-KR application over this distance a high-perfor-mance laminate is essential for both reducing insertion loss and

ensuring high glass content in the weave to mitigate skew So the design process began by choosing a low-loss dielectric material (Nelco 4000-13SI for both the backplane and the daugh-tercards) and establishing targets for Inter-Pair and Intra-Channel skew as shown in Table 3

Adhering to the PICMG 30 specifi-cation for skew in a 10GBASE-KR application is impractical Instead a target of 00625 ps was set for Inter-Pair skew with 0625 ps set for Intra-Pair skew for the backplane only This equated to a maximum 001 mm differ-

ence being allowed between traces of any differential pair and 01 mm being permitted between traces of any four differential pairs in a Channel Given the topology of the HM-ZD connector daughter-card skew must be accounted for in the daughtercard layout Fo

Sin Pnt

should be noted that the simulation boundary is located within the mated connector

Tuning the connector and via structures to 50Ω is an iterative process involving the removal of excess pads back-drilling and tuning pads anti-pads and traces A Time Domain Reflectometer (TDR) plot illustrating the results of the tuning process is shown in Figure 4

Upon completion of the modeling process a total of 17 different optimized via and routing configurations had been designed for the full mesh design and nine for the dual star design

A plot of worst-case insertion loss is shown in Figure 5 and demonstrates that in both cases performance is well above the 10GBASE-KR mask

When all the through-Channels have been modeled adjacent Channel models can be combined and ICR curves plotted to evaluate the impact of crosstalk on through-Channel performance This valuable information can be used to adjust the position of signal Layers relative to pass-through aggressor traces on adjacent Layers or to reroute traces to reduce crosstalk Similarly routing Layers can be changed to reduce crosstalk in adjacent via barrels

Figure 6 plots worst-case ICR and demonstrates that performance is above the 10GBASE-KR mask Based on this result it was possible to proceed to physical implementation

Figure 3

Figure 4

Fo Sin Pnt

Physical realizationThe layout process was performed using the Mentor Board-Station CAD system Quad-routing (routing four traces between pads) was explored as a routing method-ology in order to reduce Layer count but this was dismissed due to the detrimental impact on crosstalk performance

The attributes of the physical backplanes produced as a result of the design effort are shown in Table 4

The design files produced included the usual gerber files plus detailed back-drilling instructions

The design validation process comprised a conventional continuity test followed by performance testing featuring Agilent equipment including 70340A signal generator 8720ES Network Analyzer NN18A S-Parameter test-set and 86100A sampling oscilloscope with Agilent 86112A module Figure 7 (next page) shows the test set up

Simclar developed special line cards to enable through-Channel measurements with and without crosstalk The signal launch featured compression mount SMAs terminated in a tuned via structure The Channel simulations included simu-lation of the tuned launch structures so de-embedding of the launches was not necessary for correlation to simulation purposes The development team also established a process for characterization of all Channels

Full Mesh Dual Star

Layer Count 34 18

Aspect Ratio 121 61

Tuned Vias 3952 768

Material Nelco 4000-13SI

Table 4

Figure 5 Figure 6

Fo Sin Pnt

In Figure 8 measured through-Channel performance and ICR curves are shown for the same Channels described in the simula-tion section earlier

As can be seen from Figure 8 there is close correlation between these and the simulated plots in Figures 5 and 6 In fact close correlation between all simulated and measured results was achieved resulting in a 728 Tbps capacity full mesh and a 960 Gbps capacity dual star backplane design now generally available as part of the Simclar TurboFabric shelf

Figure 7 Figure 8

Figure 9

Figure 10

Implications of 10GBASE-KR Draft 33versus Draft 25The work described above was targeted towards meeting the Channels specifications contained in Draft 25 of the IEEE 10GBASE-KR Since this work was completed the IEEE has up-issued the Draft revision level for the Standard from 25 to 33 While this has not impacted through-Channel performance demands it has increased Channel isolation requirements by around 10 dB In Figure 9 a Draft 33 mask is added to the ICR plot shown in Figure 8

From Figure 9 it can be seen how Draft 33 pulls the mask above the Channel ICR curve for this full mesh backplane Channel Surprisingly it is the Channelrsquos frequency response at relatively low frequencies between 100-500 MHz that is causing a problem The reasons for this are currently the subject of further detailed investigation

However Figure 10 shows a Draft 33 plot for a less demanding dual star AdvancedTCA implementation featuring shorter trans-mission distances This plot demonstrates compliance to Draft 33 of the IEEE 8023ap 10GBASE-KR Standard

ConclusionBy developing a close understanding of the many factors contrib-uting to loss and noise in multi-gigabit backplane Channels it is possible to characterize their performance using advanced simula-tion techniques and correlate that performance in physical prod-ucts using advanced test methods By overlaying the test results on S-Parameter masks defined by the IEEE 8023ap 10GBASE-KR Standard it has been demonstrated that backplanes that truly enable AdvancedTCA scalability are at last a reality

Douglas Hynd joined Simclar Group in 2006 as Director of Marketing as part of Simclarrsquos acquisition of Northrop Grumman Interconnect Technologies Division wherehe was Vice President of Marketing and Sales He has more than 24 yearsrsquo experience intechnology sales marketing and generalmanagement and holds a BSc (Eng) in Electronics and Electrical Engineeringfrom the University of Glasgow He isbased at Simclarrsquos Global HQ inDunfermline Scotland

Simclar Groupdouglashyndsimclarcom bull wwwsimclarcom

Fo Sin Pnt

6U CompactPCIPrOduCT GuIdE g

This monthrsquos issue includes a 6U CompactPCI Product Guide and Irsquod like to take the opportunity to reflect a bit on the success and evolution of that technology

Back in the 1994 time frame when CompactPCI was first being devel-oped it began as 3U-only technology It used the same Eurocardmechanics that were popularized by VME and an IEC standardized high-

density high-speed connector available from a number of vendors suitablefor 33 MHz PCI signaling That connector was selected by the engineers atZiatech with help from Mike Munroe then at ERNI The majority of VMEdesigns were 6U and based on this I was among a number of folks thatargued for adding the 6U CompactPCI form factor

The 6U form factor presented some challenges and opportunities Onechallenge was that the insertion and extraction forces were quite high when the entire rear of the card was populated with connectors Fortunately the IEEE standards for Eurocards evolved and injectorejector handles that pro-vided leverage became available Eike Waltz then at Rittal was instrumental in bringing that to the table Two of the opportunities that came along withthe extra connectors were a clean way to add secondary buses like the H110 telephony bus to the backplane and the ability to route IO out the rear through rear transition modules PICMG has developed quite a number of subsidiary specifications defining the interoperable use of the extra backplane pins made possible with the 6U form factor Both of these features have played a major part in CompactPCIrsquos success The next major evolution of 6U CompactPCI came with the PICMG 216 Packet Switched Backplane standard which was originally conceived by John Peters and his team at Performance Technologies PICMG 216 interconnected a shelf full of CompactPCI single board computers via redundant Ethernet switches also in the 6U CompactPCI form factor This dramatically increased usable backplane bandwidth and provided redundancy PICMG 216 paved the way for AdvancedTCA and was the industryrsquos first open standard for the switched serial interconnect standards we see popping up in many places

By Joe Pavlat

Looking back and ahead at6U CompactPCI

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Recent 6U CompactPCI related products are listed here For more informationenter the productrsquos RSC No at wwwcompactpci-systemscomrsc

cPCI-6910Dual-core Intel Xeon Processor LVULV Universal blade bull Supports Single Dual-Core Intel Xeon LV or ULV processorsbull Front Side Bus 667 MHz bull Up to 2 GB DDR2 400 MHz soldered SDRAM with ECC bull Four PCI Express GbEbull Up to 4 USB 20 ports bull PICMG 20 21 29 216 compliant

RSC No 35013

ADLINK Technologywwwadlinktechcom

CPCIStor Module6U CompactPCI storage blade bull Onboard ATA controller supports CDDVD HDD and solid-state flashbull Supports Hot Swap Removal (ask about RAID support) bull ATA disks available in Enhanced Dutycycle versions for NEBS Level 3 - 724 requirements bull Operating Systems supported VxWorksLinux and Windows

RSC No 34800

ACTTechnicowwwacttechnicocom

Prosody X cPCI E1T1An E1T1 digital network access card bull Suits telco developers and systems integrators bull Uses Aculabrsquos worldwide protocol coverage including Aculabrsquos SS7 stack available under a cost free license bull Available with 8 or 16 E1T1 trunks and software selectable E1T1 interfaces bull Flexible mix of protocols including ISDN CAS and SS7 (ITU-T China and ANSI) bull A variety of interconnect switching and protocol conversion solutions can be readily crafted bull High availability reliability and scalability with industry standard hardw re and software interoperability bull Up to 128 SS7 signaling links bull Non-circuit related (TCAP) messagingintensive applications such as prepaid and SMS

RSC No 35408

Aculabwwwaculabcom

Adexp8021Intel Core Duo L2400 (166 GHz) w E7520 server chipset bull Dual channel PC2-3200 Registered RAM SECDED or x4 SDDC bull Two GbE two Serial ATA four USB 20 bull Onboard SXGA graphics 1280 x 24-bitbull 6U CompactPCI Bus PICMG EXP0 R10 Specification bull RoHS compliant 0 degC to +55 degC operating range

RSC No 32837

Advanet Incwwwadvanetcojpen

TC84012 channel single-stop Time-to-Digital Converter (TDC) with single-start and multi-start acquisition modes bull 50 ps timing resolution bull Wide range with upto 20 s between first and last events bull Large internal memory buffer with up to 512 hits per channel bull Low jitter (lt3 ps rms) high stability (plusmn2 ppm) internalclock source bull External 10 MHz reference input bull FPGA based Data Processing Unit (DPU) bull Fast readout with DMA mode for increased data throughputbull Overvoltage-protected inputs with 50 Ω K-Lock (LEMO) connectors bull Built-in self calibration bull Modular single-slot 6U PXICompactPCI standardbull Low power consumption (lt22 W)

RSC No 33445

Agilent-Acqiriswwwacqiriscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

MIC-30428-slot 6U CompactPCI backplane bull AC or DC CompactPCI 500 W + 250 W redundant(2+1) power supplies bull PICMG 216 (CompactPCI Packet Switching Backplane) compliancebull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarmmodule (MIC-3924L-AE)

RSC No 32851

MIC-30436-slot 6U CompactPCI backplane bull Supports two hot-swappable SCSISATA or removableIDE HDD bays bull Built-in IDE slim-type DVD-ROM bull AC or DC CompactPCI 250 W + 250 Wredundant (1+1) power supplies bull Supports hot-swappable fan modules bull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarm module (MIC-3924L-AE)

RSC No 32850

Advantech Corporationwwwadvantechcom

Dual-Core Xeon CompactPCI SBCModel PP 42123x bull Dual CPU 6U CompactPCI SBC supporting two dual-core Xeon CPUs bull Up to 8 GB DDR2 ECC SDRAM in a single system or peripheralslot bull Dual processor SBC in a single 6U CompactPCI slot bull Supports two 166 GHz Dual-Core Intel Xeon ULV processors using Intel E7520 server chipsetbull Up to 8 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull PMCXMC site support 66 MHz PCI-X and x8 PCI Express bull Front and rear IO bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade bull Four GbE ports with option for PICMG 216

RSC No 34761

6U CompactPCI Core 2 Duo SBCModel PP 41203x bull 6U CompactPCI Core 2 Duo SBC supporting two PMC sites includingone XMC site bull Up to 4 GB DDR2 ECC SDRAM bull All in a single system or peripheral slot bull TwoPMC sites supporting up to 100 MHz PCI-X bull One XMC x8 PCI Express bull Front and rear IObull Supports 216 GHz or 15 GHz Intel Core 2 Duo processors bull Intel E7520 server chipsetbull Up to 4 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade

RSC No 34763

PP 30202xTwo processor versions available bull 18 GHz Intel Pentium M processor 745 uses mFC-PGA 478 (micro Flip-Chip Pin Grid Array) package bull 14 GHz Intel Pentium M processor Low Voltage 738uses mFC-BGA 479 (micro Flip-Chip Ball Grid Array) package bull 64 KB primary (L1) on-die cache2 MB of secondary (L2) on-die cache bull 400 MHz Front Side Bus (FSB) bull No CPU fan bull 16 GHz processor version (1 MB L2 cache) available see PP 30002x datasheet bull Utilizes 64-bitIntel 855GME chipset bull Supports 400 MHz bus frequency bull Uses Intel 6300ESB IO Controller Hub

RSC No 32659

Concurrent Technologies Incwwwgocctcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cCIBPMC6U-ETA 6U bridged dual PMC carrier that bridges extended temperature CompactPCI boards and PMCs bull Features a rugged CompactPCI form factor providing increased flexibility to military communications systems designers bull Provides additional design choices to users through its differing bus speeds maximizing the numberof PMCs that can be used CompactPCI andPMC buses can both run at 66 or 33 MHzbull Operating temperature range of -40 degC to+85 degC bull Signal conditioning bull DMA supportbull Low-power design +5 V +33 V +12 V -12 V bull User-selectable VIO of 33 V or 5 V to the PMC

RSC No 32891

Dynamic Engineeringwwwdynengcom

cPCI4IP-MMMinimized PCI address footprint IndustryPack carrier for CompactPCI applications bull 6U 4HP4 IP positions 832 clock selection for each slot fused filtered power IO options bull ID INT IO and Mem spaces are decoded for each IP slotbull Single and double wide IPrsquos bull 16- and 32- bit IPs bull 32-bit access to 16-bit IPs bull Full or mini-mized Memory Space decoding for 18 the PCI address requirement bull With the cPCI4IP-MM option 8 CompactPCI 4IP cards take the same PCI address space as 1 full Mem Space card

RSC No 34905

ACQ132CPCI32 channel MHz class simultaneous sampling intelligent digitizer bull 32 simultaneous analoginput channels 2-32 MSpschannel 14-bit resolution bull Differential inputs bull Intelligent cardwith 1 gigabyte memory and GbE on board bull Large distributed FPGA resource on boardbull Range of DSP functions including FIR filtering and Digital Downconverter

RSC No 35482

D-TACQ Solutions Ltdwwwd-tacqcouk

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CR11Based on the Intel Core Duo Processor the platform is designed to support processor speeds from 106 GHz up to 20 GHz bull Intel Core 2 Duo runs at 15 GHz up to 20 GHz bull Conduction cooled bull Two PMC slots bull PCI Express bull 2x GbE

RSC No 33156

ICS-72532-channel 6U CompactPCI DAC board bull 6U CompactPCI data acquisition card bull 32 differential output channels bull 16 or 24-bit sample size bull 288 kHzch data rate bull Simultaneous sampling across all channels on single or multiple boards bull 32 separate delta-sigma DACs bull 64-bit 66 MHz CompactPCI PICMG 20 Rev30 hot-swappable bull FPDP II 400 MBps interface

RSC No 33576

ICS-71032-channel 6U CompactPCI ADC board bull 6U CompactPCI data acquisition card bull 32 differential input channels bull 216 KHzch 24-bit resolution bull Software selectable full scale input bull FPDP II 400 MBpsinterface bull 64-bit 66 MHz CompactPCI PICMG 20 Rev 30 hot swappable bull 32 synchronous boards for simultaneous sampling bull Sonar acoustics and test and measurement applications

RSC No 33578

Tsumani 6U CPCI Development KitFPGA processor solution targeted at high performance software defined radio applications bull Dual Stratix EP1S80 FPGAs are tightly coupled to provide apower platform for signal processing bull Two PMC module sites provide IO connectivity to either front panel or back panel connections bull A direct highbandwidth 1 GBps path from the PMC P4 connector directly to the FPGAs bull Model 919 Dual DAC Mezzanine provides broadband analog signal generationin a compact form bull The board features two independent DAC channels each with its own 12-bit LVDS input capable of running at rates up to 160 MHz

RSC No 32026

CP11Rugged 6U SBC bull Up to 4 GB of DDR2 SDRAM (200 MHz) with enhanced ECC four independent onboard PCI buses system host and peripheral modesupport for the CompactPCI backplane two PMC interfaces (64-bit133 MHz and 32-bit33 MHz) bull Instead of the PMC1 a PCI Express based XMC interface is available on request bull Two GbE one Fast Ethernet two serial interfaces (RS-232 or RS-422485) USB 20 integrated HDD or flash drive bull High performance 2D3D ATI video controller capable of driving two displays in parallel supports VGADVI interface bull Intel Core 2 Duo at 216 GHz Intel Core Duo at 20 GHz2x PMC expansion site bull One XMC optional bull Up to 4 GB DDR2 SDRAM wECC 2x GbE

RSC No 33447

GE Fanuc Intelligent Platforms Incwwwgefanucembeddedcom

Single Board ComputersGD Canada designs and manufactures conduction-cooled Single Board Computers (SBCs)using Intel processors bull 6U and 3U form factors for CompactPCI backplanes bull Fully backward compatible with earlier models bull Upgradeable via the change-out of processor memory andIO modules bull Used within GD Canada computer systems and sold as individual products

RSC No 35281

General Dynamicswwwgdcanadacom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cPCI6U-24DSI32R32-channel 24-bit delta-sigma CompactPCI 6U analog input board with rear IO bull Low noise 24-bit resolution low phase distortion andmulti-board synchronization bull Suits state-of-the-art sonar and noise monitoring applications bull 32-channel cPCI6U-24DSI32 analog input boardprovides a high-density 24-bit analog input resources on a standard 6U CompactPCI expansion board bull Applications from precision voltagemeasurements to complex audio signal and waveform analysis

RSC No 34985

General Standards Corporationwwwgeneralstandardscom

Duet 3U 64-bit 1 GHz TMS320C6416 DSP (x2) 64 MB SDRAM per processor bull Flexible internalexternalcommunication mesh bull 64-bit66 MHz CompactPCI bull PMCXMC site with Jn4 to FPGA and4 RocketIO per VITA 42 bull External data port up to 12 Gbps bull 4M or 5M Virtex-II Pro FPGAbull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM dedicated800 MBps links between DSPs bull 3U CompactPCI with PXI support bull Suits high-end co-processing wireless broadband communications RADAR video and biometrics

RSC No 32856

QuadiaQuad-DSP bull Dual FPGA bull Dual PMC sites bull Inter-processor connectivity and access to external interfaces bull Four C6416 DSPs split in two independent clusters each hosting a PMC site bull One large FPGA for end-user code bull Central FPGA routing interprocessor communication bull End-user FPGA communication bull External port serial IO for PCIe or other p ivate link bull Global memoryand PCI interface bull 1 GHz TMS320C6416 DSP (x4) bull 64 MB SDRAM per processor bull Flexible internalexternal communication mesh bull 64-bit66 MHz CompactPCI bull Two PMC sites with Jn4 to FPGA bull External data port up to 12 Gbps bull Two 4M Gate FPGA reserved for end-user code bull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM bull Up to 512 MB Global DDR SDRAM bull Suits high-end co-processing wireless and broadband communications

RSC No 34737

Quixote 64-bit 6UAdvanced signal capture generation and co-processing bull 1 GHz TMS320C6416 DSP and2 to 6 MGATE Virtex-II FPGA bull 32 MB SDRAM 8 MB ZBT SBSRAM and AD6645 and AD9764 converters bull 6432 bit CompactPCI 66 MHz 5 V33 V and complex trigger modes with HW event logging bull PMC site with Jn4 to FPGA DIO and PICMG 217 StarFabric compliant bull Suits Software Defined Radio wireless IP and RADAR development and hardware testing bull Physical Layer field testing ultra-fast flexible data acquisition vector signal generation and electronic warfare

RSC No 32861

Innovative Integrationwwwinnovative-dspcom

IC-e6-cPCIbHigh performance 6U CompactPCI board bull Powered by one or two of Freescalersquos mostadvanced 14 GHz MPC7448 PowerPC processors bull PICMG 216 compliant bull Marvell Discovery III chipset (MV64460) bull Low power consumption bull Standard extended and rugged grades

RSC No 32982

Interface Conceptwwwinterfaceconceptcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CP213Single-width 6U CompactPCIPXI module with either 32 or 64 differential analog input channelsbull 32 64 or 128 channels of analog input bull 16 multifunction digital IO (TTL) channels that may beconfigured as digital in digital out or selectively attached to 2 frequency in 2 counter in andor 2 timerout channels bull 16-bit resolution bull Programmable gain per channel programmable scan rates of lt1 Ss through 100 KSs bull Precision onboard reference for end-to-end calibration

RSC No 34804

KineticSystems Company LLCwwwkscorpcom

CP6001Energy efficient embedded Intel dual core processors bull 12 GHz Intel Core Duo U2500 ULV processor bull Intel Core 2 Duo L7400 LV processor bull Based on the Intel Mobile 945GM chipset with a front side bus of up to 667 MHz and ICH7-R Southbridge bull Two independent digital video outputs to the rear IO (2x DVI - 1x DVI and 1x HDMI) bull AC97 audio capabilities bull 3 x GbE bull 4 x SATA with RAID 01510 functionality bull 6 x USB 20 2 x COM and VGA or DVI bull Can also accommodate a PMC slot or an onboard 25 inch SATA HDD bull Up to 8 GB of USB or 2 GB soldered flash bull Supports Linux Windows XP XP embedded and VxWorks 6

RSC No 34182

CP6923 GbE Switch6U CompactPCI GbE Switch PICMG 216 compliant bull Leading edge te hnology basedon BCM5650X chip bull 24x GbE ports bull Non-blocking Layer 2 and 3 switching and routingbull Copper optical rear IO version bull Hot swap IPMI bull Fully managed bull Comprehensive firmware package bull Applies to VoIP installations such as call servers media gatewaysand trunking gateways in wireline and wireless networks as well as VoIP systems inenterprise networks with high demands on performance

RSC No 32256

Kontronwwwkontroncom

TMS320C6701 Virtex-IITexas Instrumentsrsquo C6701 DSP bull Xilinx Virtex-II series FPGA up to XC2V8000 bull Multiple IO interfaces Onboard CODEC VIM expansion sites 60-pin GPIO header and JTAG bull Hardware drivers integration in SimulinkXilinx System Generator Blocksets for quick implementation of Simulink models bull DSP and FPGA-in-the-loop cosimulation of SimulinkXilinx System Generator models bull Leading edge communication interface allowing real-time datamonitoring from Simulink scopes and remote operations

RSC No 32028

VHS-DACHigh performance multichannel DA for phased array antenna systems radarsonar communications receiversup-sampling to IF stage and RFIF AGC apps bull Eight 125 MSPS output channels bull Optional add-on daughter boardprovides 8 additional output channels or 8 additional input channels bull 32-bit 25 MHz bull FPDP interface with 400 MBps transfer rate (25 MSPS per channel at 8 channels 125 MSPS at 16 channels) bull Low level hardware drivers API andGUI bull High level hardware drivers integration in Simulink Blocksets bull Leading edge communication interface fordata recording and playback tofrom the onboard SDRAM

RSC No 32029

Lyrtechwwwlyrtechcom

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PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

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PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

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PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

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PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

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PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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Page 17: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

of multicore processors from Intel developers can scale performance while optimizing power consumption in the overall system design

To meet these requirements the hardware platform needs to provide scalability flexibil-ity and long-term cost efficiency In comparing the traditional 1U platform with a more modular approach to the HSS using AdvancedTCA consider the following

n High compute performance n High memory and storage capabilityn IO functionality to connect to multiple networks (such as SS7 and Ethernet)n Carrier-grade profile and redundancy

AdvancedTCA High density with scalability on a smaller footprintTable 1 illustrates a comparison of a sample AdvancedTCA-based platform and a 1U PCI rack-mounted platform for HSS applications This configuration assumes an increasing subscriber growth from 1 million (M) subscribers to 18M subscribers per platform

FootprintAdvancedTCA-based platforms provide a high density compute platform with scalability on a smaller footprint TEMs can easily add boards to a chassis to accommodate more traffic and to support new services This flexibility enables an increase in subscribers and the database without having a major impact on rack space in the central office environ-ment To meet the same capacity for 18M subscribers the 1U PCI approach will occupy two bays or cabinets with a total footprint of 28 square feet compared to the same capacity occupying one bay or cabinet with a footprint of 14 square feet (see Figure 1)

CoolingWhile the power consumption per square foot is higher than the 1U PCI platform AdvancedTCA offers better airflow and cooling distribution using a push-pull cooling system Each 1U PCI platform includes up to nine cooling fans and is dedicated to that CPU in the 1U server only which translates into higher overhead Therefore the airflow is

not optimized in the overall system design In the case of a fan failure AdvancedTCA platforms enable easier access to replace the fans which are field replaceable units The 1U platform also does not include any integrated centralized switching or management capabilities therefore the total does not include any switching or system management functionality

ScalabilityAdvancedTCA architecture lends itself well to scalability As AdvancedTCA sup-ports both a Base and Fabric interface into the backplane and the separation of data and control planes TEMs can also scale up their designs from 1 GbE to 10 GbE to accommodate new users and usage requirements AdvancedTCA based systems are designed for easy upgrade-ability to new processing blades switch fabrics and IO modules using Advanced Mezzanine Cards (such as SS7)

Since AdvancedTCA and AdvancedMCs offer hot swap capabilities and HA func-tionality growing a subscriber base by using additional CPU blades within the system with low maintenance or upgrade downtime is crucial for the HSS plat-form It also allows for the up and down

AdvancedTCA-based HSS Platform 1U PCI Rack-Mount HSS Platform

Number ofsubscribers

~1M subscribers = 4 CPU blades edundant ~1M subscribers = 4 x 1U

~4M subscribers = 7 CPU blades redundant ~4M subscribers = 7 x 1U

~6M subscribers = 12 CPU blades redundant ~6M subscribers = 12 x 1U

~18M subscribers = 36 CPU blades redundant= 3 AdvancedTCA shelves per rack

~18M subscribers= 36 x 1U+ external switch components for redundancy

Technicalspecs

1 CPU blade = 2 x Intel Xeon dual core = quad core 1 1U rack-mount Intel= Intel Xeon quad core or dual core CPU

16 G DDR 2 memory Max of 8 G DRY memory

+ 2 x SATA or SASS hot swap (RAID 0 and 1)+ 1x PCI Express for SS7 Dual GbE per 1U rack-mount server

4 x GbE per CPU with built in GbE backplane switching separating Control Pathand Data Path with multishelf expandability

External central switching required withmultiple external GbE connectivity

Systems and blade manageability built into the platform withIMP implementation SNMP and CLIP

Carrier-grade redundancy on switch and node

IO for SS7 or other interface modules

CPU blade hot swap capability

Thermaland power

requirements

~6M subscribers redundant= 14 slots with centralized chassis cooling

~6M subscribers redundant= 18 x 1U PCI with independent cooling and separate switch units and system management

Total power consumption= ok (3100 W for blades and RTM + 500 W Shim fan tray and SAP)

Total power consumption= ok

Table 1

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scaling of the platform depending on the subscriber increase or decrease When consolidating multiple services minimiz-ing multiple duplicate databases requires this flexibility

InterconnectivityThe AdvancedTCA platform offers a number of interconnectivity features including

n Separation between the data plane and the control plane

n Direct uplink in a multichassis envi-ronment with up to l0 GbE

n Node to node base and fabric connec-tivity with HA carrier-grade Ethernet functionality

n Easy upgrade path to l0 GbE for increased bandwidth

By contrast the 1U PCI platform requires

n Additional external interconnectiv-ity between 1U rack-mount servers which increases the number of points of failures and the operating and maintenance costs

n Additional switching equipment for carrier-grade Ethernet connectivity

n Additional manage-ment (Simple Network Management Protocol [SNMP]) for HA redundancy

PowerThe 1U-based platform also utilizes integrated AC power supply units usually the standard for the data center and enter-prise environments AC will increase the pro-viderrsquos OPEX in the long term since the power consumption per rack is significantly higher and

Figure 1

requires additional support equipment such as an Uninterruptible Power Supply (UPS) and an AC to DC converter per rack space and ultimately per CPU These factors along with the requirements for carrier-grade functionality HA support and a more favorable long-term OPEX further reduce the need to consider the 1U solution for HSS deployments in Central Office networks

ManageabilityAdvancedTCA chassis-level management is based on the industry-standard Intelligent Platform Management Interface (IPMI) IPMI makes possible interoperability among chassis and blowers compute nodes switches and management solutions from multiple vendors enabling these elements to work together seamlessly The resulting successful inter-blade communication for applications including failover and clustering provides full manageability on a per shelf and per bay basis

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One of the primary goals of the AdvancedTCA specification is to ensure a very low Mean Time to Repair (MTTR) and high Mean Time Between Failures (MTBF) There are no active components in the backplane ndash which can translate to expensive repairs in the field In addi-tion AdvancedTCA specifies that all com-ponents can be hot swappable in the field and the architecture provides redundancy at all levels This hot swap capability translates to less downtime for field replacement on a per CPU blade basis as compared to 1U PCI

SummaryAdvancedTCA provides an ideal platform and meets the technical requirements for deploying flexible and scalable IMS HSS applications While other platform archi-tectures such as 1U rack-mount servers may with considerable difficulty be able to deliver HSS capabilities AdvancedTCA offers a much more advantageous solution by providing a smaller footprint improved cooling and thermal characteristics bet-ter scalability enhanced interconnectivity and easier manageability This all contrib-utes to making AdvancedTCA a lower cost approach in terms of CAPEX and OPEX for long-term subscriber growth

1U PCI rack-mount servers are not considered to be the optimal hardware platform for HSS applications in a Central Office With its limitation for carrier-grade flexibility and HA functionality the 1U PCI platform is best suited for a full range of other enterprise and Internet infrastructure applications within a data center environment that does not require any significant flexibility and HA functionality around it It might also be a good entrance point for other enterprise applications with lower price points

The use of AdvancedTCA-based platforms enables TEMs to shift away from hardware development and refocus their efforts on delivering value-added software and services As a result they can realize lower development costs and faster time-to-market enabling increased flexibility with each product design through the use and reuse of standardized off-the-shelf components Equally significant are the advantages that can be realized by the service provider With a common platform and a flexible architecture that maximizes limited floor space service providers can rapidly and flexibly implement a broad range of feature-rich solutions for faster profitability

Sven Freudenfeld is responsible for North American Business Development for the Kontron AG line of AdvancedTCA AMC MicroTCA and Pre-Integrated Solutions Sven possesses more than 15 years of experience with voice data and wireless com-munications having worked extensively with Nortel Networks in Systems Engineering Sanmina-SCI in Test Engineeringand Deutsche Telekom in Network Engineering Sven holdsan electrical engineering degree from Germany and is also Chair of the CP-TA marketing workgroup focusing on the interoperability of COTS standard building blocks

Kontron bull svenfreudenfeldcakontroncom bull wwwkontroncom

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TECHNOLOGY g BACkpLANES

Increasing demand for service and multimedia features is stimulating a growing need for speed in telecom-munications equipment While some

applications such as PBX systems can be addressed with the gigabit backplane technologies currently available others are running out of headroom Routers may soon need 10 Gbps and higher speed back-planes to keep up with network demand Many such applications can justify the expense of moving to higher performance if it becomes available

Currently telecom system designs offer backplanes that can handle interconnec-tions running as fast as 3125 Gbps raw data throughput per lane (with around a maxi-mum data rate capability of 5-625 Gbps per lane) The AdvancedTCA standard for instance uses Ethernetrsquos XAUI inter-face AdvancedTCA achieves a 10 Gbps net data rate by running four serial lanes for each interconnection with each lanersquos

SERrializerDESerializer (SERDES) op-erating at 3125 Gbps raw data (25 Gbs net)

As demand forces systems to move beyond these rates however new technologies will be needed One proposal calls for the use of XAUI+ or double XAUI which increases lane SERDES rates to 625 Gbps per lane and hence the throughput to 20 Gbps Another proposal is to use IEEE 8023ap known as 10GBASE-KR which runs a single SERDES lane at 125 Gbps raw data rate (103 Gbps net) But these are only short-term answers To address future demands organizations such as the Institute of Electrical and Electronic Engineers Standards Association (IEEE-SA) are developing specifications for Ethernet speeds of 40 Gbps to 100 Gbps which will be applied to backplane interconnect

Such high clock rates however will pose significant design challenges for developers

One of the first challenges that will need resolution is the design and layout of the backplane and other PCBs Common design practice today readily handles board clock rates of around 10 Gbps Well established design rules are in place and board layout tools such as autorouters can automatically handle board designs for speeds in the 10 Gbps range Designers may use specialized board material create additional ground planes and perform similar tasks in order to ensure proper board operation at the higher end but even speeds to 5 GHz are within current design tool capabilities

Design gets trickierAbove 5 GHz however board design gets more involved because feature dimensions become significant when compared to the signalrsquos wavelengths Variations in board thickness can affect signal propagation Corners where traces change direction and small spurs along edges of poorly etched

Channel characteristics

challenge backplane interoperability

Serial backplanes in telecommunications systems aim for high speed with room for

growth As systems began using 10 Gbps links however issues arose that affected backplane

communications among cards from different manufacturers Stuart points out that the

industry must define key backplane channel characteristics so that designs based on open

standards maintain interoperability as backplane speeds move to 40 Gbps and beyond

By Stuart JamieSon

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traces can act as antennae for the higher fre-quencies in digital signals As can be seen in Figure 1 sharp corners and minor flaws that are inconsequential at lower frequen-cies have the potential to become trouble-some antennae at future high speeds This can result in the trace radiating away the signalrsquos high frequency energy increasing EMI and crosstalk as well as altering signal waveforms New routing design rules such as making corners 30deg instead of 45deg and more careful board fabrication techniques may become necessary as designs move above the 10 Gbps per lane threshold

The move to higher frequencies will affect more than board fabrication and layout however Higher frequencies will also impose new requirements on signal tim-ing signal rise-time electrical distance and waveform shape if developers are to retain the mix-and-match system design approach that makes standards-based system design effective

For interoperability to be achievable at data rates above 10 Gbps organizations such as PICMG will need to carefully define a vari-ety of signal and design parameters in their specifications Some of the key parameters that will need consideration include

n Interconnect signal attenuationn Eye diagramn Jittern Input clock recoveryn Chip inputoutput pre-emphasis (PE) n Equalization (EQ)

Even slight variations in these parameters from device to device and lane to lane can shift the timing of signals a significant fraction of a clock cycle and affect the Bit Error Rate (BER) of a lanechannel Finally signal rise times will require tight control as signal rates increase in order to ensure control of system timing (see Figure 2)

In defining signal and design parameters specifications will also need to account for the increased location dependency that comes with higher frequencies Even subtle differences in attributes such as routing length and trace impedance become increasingly significant as signal speeds rise To ensure mix-and-match interopera-bility then design specifications may need to account for the specific backplane slot that a board is to occupy as well as introduce a method to obtain and control the PE and EQ of the devices connected to the lanes

Designers must also address fabrication standards The material used to fabricate

Figure 1

Figure 2

Fo Sin Pnt

the board the thickness and composition of metal cladding and the spacing between layers can all affect the trace characteris-tics Controlling these parameters under specification ensures that timing charac-teristics are sufficiently uniform from one board to another However current speci-fications are too detailed and stringent It is extremely difficult to attain compliance yet avoid adding cost to the design

Specifications need workSome of these parameters are already incorporated into current specifications The AMC module specifications from PICMG for instance include design parameters that ensure its proper opera-tion at signal speeds as fast as 125 Gbps per lane Establishing specifications for other system components will help achieve interoperability of standards-based designs at higher frequencies

Design tools may also need to be modified and the industry will need to create new design rules for high frequency and incor-porate these into the tools Developing new routing techniques will help avoid the issues of electrical phenomena such as skin effect dielectric loss and impedance mismatches These are much more preva-lent at higher frequencies and it becomes critical for engineers to model and simu-late these phenomena more accurately

Early efforts are already underway to address the challenges that higher fre-quency signals bring to standards-based design The Interconnect Channel Characterization Subcommittee of PICMG established in September 2006 is develop-ing ground rules and definitions to be used in characterizing transmission reflection and crosstalk performance in backplane and mezzanine carrier interconnects The committee aims to define the channel parameters to be measured or analyzed as well as the methods for doing so Its charter calls for it to address

n Definition of interfaces at which measurements are made or characteristics computed

n Test equipment fixtures and PCB test coupons

n Details of measurement proceduren Data formatsn Techniques for de-embedding

components of the channeln Techniques for validating

measurement based models ie passivity and causality

n Definitions that allow reasonable compliance testing

n Boundary definitions for different paths

n Define information regarding limita-tions or proper usage ie maximum data raterise times that are supported by the models

Such efforts are only a beginning how-ever Other design details still need to be addressed such as SERDES IO Configuration New functionality may need to be defined The design of high data rate system channel interfaces according to standardsspecifications does not currently cover the individual characteristics of the chip transmitterreceiver characteristics Thus work will be needed to address how such standard designs handle such dependency

Crossing an interoperability thresholdOne way of handling location dependen-cies might be to give the system control-ler the ability to inform modules what the channel transmitter and receiver PE and EQ technology is and importantly how to control it With this information along with the signal attenuation suffered (at a given bit rate) for the channel the system should be able to configure SERDES channels in different physical locations to run reliably and at the required BER In MicroTCA systems for instance this functionality could be incorporated into the MicroTCA Carrier Hub (MCH) as part of its electronic keying function Modules would have to be able to configure and control its backplane interfaces to allow for different positions

in the backplane An MCH (see Figure 3 courtesy Emerson) then would be able to instruct a module as to which parameters to use for interoperability

The specific approaches needed to handle location dependencies and other challenges that higher signal rates raise have yet to be developed The need to address these challenges however is clear Increasing demand for services is driving applications to utilize faster signal rates This in turn is driving backplane signaling speeds ever higher As speeds rise above 10 Gbps sig-nals will cross a threshold where current specifications will prove inadequate for ensuring interoperability among standards-based designs

The industry should begin developing new or enhanced specifications and design tools to address the challenges of higher signal rates Without such improvements the guarantees of interoperability that allow system developers to readily create solu-tions by combining off-the-shelf products will be compromised As backplane speeds approach 100 Gbps nothing can be taken for granted

Stuart Jamieson Director of Industry RelationsArchitect with Emerson Network Power Embedded Computing represents Emerson on PICMG committees and the SCOPE organization and previously served as a CP-TA Board member (Treasurer) He brings over 18 years of experience in hardware protocols embedded software and specification development to these groups Within Emerson he played a key role in the develop-ment of the technology central to Emersonrsquos bundled network-ing solutions Stuartrsquos positions within Emerson have included Director of Business Development Director of Advanced Technology and Architect He is the Draft Editor for the PICMG Interconnect Channel Characterization Subcommittee is the author of the introduction section for the new PICMG Ruggedized MicroTCA specification and served as the Draft Editor for the PICMG MicroTCA Specification Stuart gradu-ated from the Heriot-Watt University in 1989 with a 1st Class Honors degree in Electrical and Electronic Engineering and again in 1992 with an IBM-sponsored Master of Philosophy

Emerson Network Power Embedded ComputingStuartJamiesonEmersoncom bull wwwemersonembeddedcomputingcom

Figure 3

Fo Sin Pnt

TECHNOLOGY g BACkpLANES

2008

B A

N D

W I

D T

H

Signal integrity challenges to bandwidth scalabilityFor the purposes of this article each interconnected differential pair will be referred to as a Channel (which should not be confused with an aggregated AdvancedTCA channel comprising four trans-mit and four receive pairs)

14-slot full-mesh AdvancedTCA backplanes contain hundreds of Channels Each Channel is defined as the copper signal path from the output of a driver device to the input of a receiver device As

By douglaS Hynd

Developing IEEE 8023ap 10GBASE-KRcompliant backplanes

Why doesAdvancedTCA

need bandwidthscalability

PICMG AdvancedTCA 30 has emerged as the

industryrsquos Hardware Platform standard of choice and

is enjoying first-phase deployment However many

believe that for AdvancedTCA to realize its market

potential AdvancedTCA platforms need to seamlessly

scale to accommodate 40 GbE fabrics thereby

avoiding forklift upgrades as system bandwidth

demands increase over time A 40 GbE switch fabric

architecture would enable realization of a common

platform for computing storage control and media

and packet processing and provide the versatility and

long term ROI required by service providers in

todayrsquos increasingly competitive environment

The challenge was to develop a family of

AdvancedTCA products which feature PICMG 30

compliant dual star and full mesh advanced

backplane switch fabrics enabled up to 10 Gbps

per differential signal pair thereby giving 40 Gbps

per AdvancedTCA channel performance

This article describes the signal integrity challenges

presented in designing an IEEE 8023ap

10GBASE-KR-compliant bandwidth-scalable

14-slot AdvancedTCA platform and how these

challenges were overcome in development of full

mesh and dual star backplane reference designs

Fo Sin Pnt

shown in Figure 1 that signal path comprises a signal launch a blade PCB transmission line a daughtercard via a right-angled HM-ZD connector a mated HM-ZD backplane header a back-plane via a length of backplane PCB transmission line and then the same combination of connectors vias and transmission line at the receive end of the Channel

Sources of crosstalkFour principal sources of crosstalk in each Channel must be man-aged as shown in Table 2 Source number one is between adjacent differential pairs as they are routed across the backplane Common mode noise rejection in system differential pair structures makes this a minor issue The second source of crosstalk lies in the HM-ZD connector itself

Crosstalk in via fields our third source primarily arises from inductive coupling between adjacent differential pairs and domi-nates the crosstalk agenda in high-speed Channels This source of crosstalk is directly proportional to the length of the via barrel and where practical care must be taken to ensure that adjacent connector rows are terminated to different target routing Layers

The final source of crosstalk is caused by aggressor signals in through-routed via fields coupling with victim Channel traces as they pass through As mentioned earlier judicious and careful design can mitigate this impact

Skew Channel skew is a function of differential transmission path geometries At a fundamental frequency of 5 GHz skew can be a significant issue in high-speed system design due to narrowing the eye opening and increasing jitter Skew can have a significant impact on crosstalk it negatively impacts the common mode rejection of noise inherent to differential signaling Conductor surface roughness in lower performing dielectric materials can also cause skew in high-speed systems

Skew can be avoided through careful management of transmission path lengths in each Channel and by using higher-glass content (lower Dk) laminates

LossPotential

Potential Mismatches

Channel

Loss Potential Channel

PCB Tolerance -025 dB 2 -01 dB

Connector Tolerance -001 dB 4 -016 dB

Thru-routed Via Fields -001 dB 12 -144 dB

Connector Launch -025 dB+ 4 - 2 dB+

Quantity TotalNEXT

TotalFEXT

PCB Transmission Lines

24 in60 cm

-50 dB -70 dB

Connector Architecture 2 -26 dB -24 dB

Via Fields 4 -22 dB -20 dB

Connector Pass Through 8 -34 dB ndash34 dB

For the target application each one of these Channels must deliver a 10 Gbps Non-Return-To-Zero (NRZ) signal with sufficient signal fidelity to enable a receiver device to detect and process a differential signal The PICMG 30 specification is targeted at 3125 Gbps signaling with a fundamental frequency of 156 GHz Even in low loss dielectric materials insertion loss at 10 Gbps (5 GHz fundamental) is twice that of a 3125 Gbps signal

Therefore achieving acceptable signal fidelity requires careful management of signal losses and noise in each Channel such that an acceptable signal-to-noise (SN) ratio is achieved at the receiver

The design process therefore begins by understanding and mitigat-ing the sources of losses and noise in each Channel

Sources of lossThere are three sources of loss

n Conductor losses which are due to skin effects and can be addressed by maximizing the cross sectional area of the signal traces

n Material dispersion losses which are a function of the dielectric constants of the chosen material These can be mitigated by choosing a higher performance laminate material such as Nelco 4000-13SI or Megtron

n Reflected power loss due to impedance mismatches in the Channel as each signal transitions across the different copper media in each channel (connectors vias and PCB traces) and passes through the pad and anti-pad structures of the via fields of other backplane blade slots

Table 1 shows the relative effects of different sources of impedance mismatches The dominant source of impedance mismatches in every Channel resides in the via structures Successful mitigation of this problem requires that every via is tuned by back-drilling the stub and adjusting the pad and anti-pad structures to match the impedance to be 50 ohms irrespective of the target routing layer This in turn requires that the capacitive and inductive effects of the connector pin and via barrel combination are taken into account during the design of each Channel

Further complicating via design is the space the anti-pad structures need to accommodate Channels being routed between other blades while minimizing electro-magnetic coupling with them This space consideration makes the shape and orientation of pads and anti-pads extremely important

Figure 1

Table 1

Table 2

Fo Sin Pnt

IEEE 8023ap provides a design targetAs Ethernet has emerged as the industryrsquos dominant signaling methodology the IEEE has developed the 10GBASE-KR norma-tive Channel model to define interconnect Channel performance for NRZ signaling at 10 Gbps This standard defines acceptable performance in terms of S-parameter charts for through-Channel insertion loss and worst-case crosstalk Figures 2a and 2b illustrate masks for Draft 24 of the standard that was initially used for this exercise

In each case the mask defining compliant performance is shown in blue Channel insertion loss is shown in red in Figure 2a Crosstalk performance is defined by the ICR curve (Figure 2b) Minimum acceptable Channel performance is defined in the ICR chart (Figure 2b) by the blue line The effect of the sum of all aggressors on the through-Channel is shown in red The green ICR curve is the ratio of the crosstalk power sum calculated by summing the

magnitudes of any impacting crosstalk Channels for each fre-quency and using a straight line fit (using least-squares method) to determine the resulting average effect f the aggressors on the through-Channel This is then overlaid on the insertion loss and used to plot the ICR curve

This standard which has evolved through a variety of iterations forms the basis for developing a 40 GbE switch fabric backplane featuring 10 Gbps NRZ differential pairs If all differential pairs can meet this standard then the backplane can be considered to be 10GBASE-KR compliant

Applying 10GBASE-KR to a 14-slotAdvancedTCA applicationThe PICMG specification dictates that receive differential pairs are placed on the c-d and g-h rows of the HM-ZD connector and that transmit differential pairs are placed on the a-b and e-f rows Therefore the middle differential pair in row c-d of Slot B will be subject to the NEXT of three aggressors in each of the a-b and e-f transmit rows of slot B plus the FEXT of the signals being received in the c-d pairs in the top and bottom of slot B

In this topology it can be seen that worst-case crosstalk would occur if all the NEXT and FEXT aggressors were routed on the bottom Layer that is on the same Layer as that of the victim c-d However given that all signal vias must be back-drilled and tuned for impedance management purposes Channel crosstalk can simultaneously be reduced by allocating different routing Layers to differential pairs terminated in the same backplane connector

The principal factor in determining the feasibility of a 10GBASE-KR compliant backplane is based on understanding whether the Channel with the worst-case signal-to-noise ratio is compliant

The skew targets determine permissible layer separation between a-b c-d e-f and g-h pairs within each Channel and enable routing Layers to be allocated for each pair It is now possible to start the process of via tuning to optimize the channel performance for minimum insertion loss Modeling begins by defining the simulation boundaries for the channel so that Channel component models (PCB traces connectors vias) can easily be aggregated to model complete Channels Boundaries must be established at locations in the Channel where linear 3D structures exist These are shown in Figure 3 (next page)

Since the connector and via combinations for the backplane and daughtercard mating halves must each be treated as a whole it

PICMG 30Spec

TurboFabricSpec

Total Inter-PairSkew

(Fabric Interface)

05 mm in FR4(34 ps)

001 mmin N4000-13si

(00625 ps)

Total Intra-Channel Skew

(Fabric Interface)

254 mm in FR4(17 ps)

plusmn01 mmin N4000-13si

(0625ps)

Total Intra-Channel Skew

(Base Interface)

135 mm in FR4(90 ps)

plusmn01 mmin N4000-13si

(0625 ps)

Figures 2a and 2b

Table 3

Determining which Channel that is and identifying the worst-case SN requires making trade-offs with regard to PCB material Channel length via design connector row selection and NEXT and FEXT aggressor routing choices These trade-off choices can only take place using advanced 3D simulation tools such as Ansoft HFSS This was the essence of the design process employed in developing Simclarrsquos TurboFabric backplanes

The simulation processThe transmission length for full mesh and dual star backplanes design implementations varies from a maximum of 1632 inches to a minimum of 116 inches With an effective transmission length of 5 inches on each daughtercard this makes the longest effective Channel 2632 inches including two connectors

For a 10GBASE-KR application over this distance a high-perfor-mance laminate is essential for both reducing insertion loss and

ensuring high glass content in the weave to mitigate skew So the design process began by choosing a low-loss dielectric material (Nelco 4000-13SI for both the backplane and the daugh-tercards) and establishing targets for Inter-Pair and Intra-Channel skew as shown in Table 3

Adhering to the PICMG 30 specifi-cation for skew in a 10GBASE-KR application is impractical Instead a target of 00625 ps was set for Inter-Pair skew with 0625 ps set for Intra-Pair skew for the backplane only This equated to a maximum 001 mm differ-

ence being allowed between traces of any differential pair and 01 mm being permitted between traces of any four differential pairs in a Channel Given the topology of the HM-ZD connector daughter-card skew must be accounted for in the daughtercard layout Fo

Sin Pnt

should be noted that the simulation boundary is located within the mated connector

Tuning the connector and via structures to 50Ω is an iterative process involving the removal of excess pads back-drilling and tuning pads anti-pads and traces A Time Domain Reflectometer (TDR) plot illustrating the results of the tuning process is shown in Figure 4

Upon completion of the modeling process a total of 17 different optimized via and routing configurations had been designed for the full mesh design and nine for the dual star design

A plot of worst-case insertion loss is shown in Figure 5 and demonstrates that in both cases performance is well above the 10GBASE-KR mask

When all the through-Channels have been modeled adjacent Channel models can be combined and ICR curves plotted to evaluate the impact of crosstalk on through-Channel performance This valuable information can be used to adjust the position of signal Layers relative to pass-through aggressor traces on adjacent Layers or to reroute traces to reduce crosstalk Similarly routing Layers can be changed to reduce crosstalk in adjacent via barrels

Figure 6 plots worst-case ICR and demonstrates that performance is above the 10GBASE-KR mask Based on this result it was possible to proceed to physical implementation

Figure 3

Figure 4

Fo Sin Pnt

Physical realizationThe layout process was performed using the Mentor Board-Station CAD system Quad-routing (routing four traces between pads) was explored as a routing method-ology in order to reduce Layer count but this was dismissed due to the detrimental impact on crosstalk performance

The attributes of the physical backplanes produced as a result of the design effort are shown in Table 4

The design files produced included the usual gerber files plus detailed back-drilling instructions

The design validation process comprised a conventional continuity test followed by performance testing featuring Agilent equipment including 70340A signal generator 8720ES Network Analyzer NN18A S-Parameter test-set and 86100A sampling oscilloscope with Agilent 86112A module Figure 7 (next page) shows the test set up

Simclar developed special line cards to enable through-Channel measurements with and without crosstalk The signal launch featured compression mount SMAs terminated in a tuned via structure The Channel simulations included simu-lation of the tuned launch structures so de-embedding of the launches was not necessary for correlation to simulation purposes The development team also established a process for characterization of all Channels

Full Mesh Dual Star

Layer Count 34 18

Aspect Ratio 121 61

Tuned Vias 3952 768

Material Nelco 4000-13SI

Table 4

Figure 5 Figure 6

Fo Sin Pnt

In Figure 8 measured through-Channel performance and ICR curves are shown for the same Channels described in the simula-tion section earlier

As can be seen from Figure 8 there is close correlation between these and the simulated plots in Figures 5 and 6 In fact close correlation between all simulated and measured results was achieved resulting in a 728 Tbps capacity full mesh and a 960 Gbps capacity dual star backplane design now generally available as part of the Simclar TurboFabric shelf

Figure 7 Figure 8

Figure 9

Figure 10

Implications of 10GBASE-KR Draft 33versus Draft 25The work described above was targeted towards meeting the Channels specifications contained in Draft 25 of the IEEE 10GBASE-KR Since this work was completed the IEEE has up-issued the Draft revision level for the Standard from 25 to 33 While this has not impacted through-Channel performance demands it has increased Channel isolation requirements by around 10 dB In Figure 9 a Draft 33 mask is added to the ICR plot shown in Figure 8

From Figure 9 it can be seen how Draft 33 pulls the mask above the Channel ICR curve for this full mesh backplane Channel Surprisingly it is the Channelrsquos frequency response at relatively low frequencies between 100-500 MHz that is causing a problem The reasons for this are currently the subject of further detailed investigation

However Figure 10 shows a Draft 33 plot for a less demanding dual star AdvancedTCA implementation featuring shorter trans-mission distances This plot demonstrates compliance to Draft 33 of the IEEE 8023ap 10GBASE-KR Standard

ConclusionBy developing a close understanding of the many factors contrib-uting to loss and noise in multi-gigabit backplane Channels it is possible to characterize their performance using advanced simula-tion techniques and correlate that performance in physical prod-ucts using advanced test methods By overlaying the test results on S-Parameter masks defined by the IEEE 8023ap 10GBASE-KR Standard it has been demonstrated that backplanes that truly enable AdvancedTCA scalability are at last a reality

Douglas Hynd joined Simclar Group in 2006 as Director of Marketing as part of Simclarrsquos acquisition of Northrop Grumman Interconnect Technologies Division wherehe was Vice President of Marketing and Sales He has more than 24 yearsrsquo experience intechnology sales marketing and generalmanagement and holds a BSc (Eng) in Electronics and Electrical Engineeringfrom the University of Glasgow He isbased at Simclarrsquos Global HQ inDunfermline Scotland

Simclar Groupdouglashyndsimclarcom bull wwwsimclarcom

Fo Sin Pnt

6U CompactPCIPrOduCT GuIdE g

This monthrsquos issue includes a 6U CompactPCI Product Guide and Irsquod like to take the opportunity to reflect a bit on the success and evolution of that technology

Back in the 1994 time frame when CompactPCI was first being devel-oped it began as 3U-only technology It used the same Eurocardmechanics that were popularized by VME and an IEC standardized high-

density high-speed connector available from a number of vendors suitablefor 33 MHz PCI signaling That connector was selected by the engineers atZiatech with help from Mike Munroe then at ERNI The majority of VMEdesigns were 6U and based on this I was among a number of folks thatargued for adding the 6U CompactPCI form factor

The 6U form factor presented some challenges and opportunities Onechallenge was that the insertion and extraction forces were quite high when the entire rear of the card was populated with connectors Fortunately the IEEE standards for Eurocards evolved and injectorejector handles that pro-vided leverage became available Eike Waltz then at Rittal was instrumental in bringing that to the table Two of the opportunities that came along withthe extra connectors were a clean way to add secondary buses like the H110 telephony bus to the backplane and the ability to route IO out the rear through rear transition modules PICMG has developed quite a number of subsidiary specifications defining the interoperable use of the extra backplane pins made possible with the 6U form factor Both of these features have played a major part in CompactPCIrsquos success The next major evolution of 6U CompactPCI came with the PICMG 216 Packet Switched Backplane standard which was originally conceived by John Peters and his team at Performance Technologies PICMG 216 interconnected a shelf full of CompactPCI single board computers via redundant Ethernet switches also in the 6U CompactPCI form factor This dramatically increased usable backplane bandwidth and provided redundancy PICMG 216 paved the way for AdvancedTCA and was the industryrsquos first open standard for the switched serial interconnect standards we see popping up in many places

By Joe Pavlat

Looking back and ahead at6U CompactPCI

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Recent 6U CompactPCI related products are listed here For more informationenter the productrsquos RSC No at wwwcompactpci-systemscomrsc

cPCI-6910Dual-core Intel Xeon Processor LVULV Universal blade bull Supports Single Dual-Core Intel Xeon LV or ULV processorsbull Front Side Bus 667 MHz bull Up to 2 GB DDR2 400 MHz soldered SDRAM with ECC bull Four PCI Express GbEbull Up to 4 USB 20 ports bull PICMG 20 21 29 216 compliant

RSC No 35013

ADLINK Technologywwwadlinktechcom

CPCIStor Module6U CompactPCI storage blade bull Onboard ATA controller supports CDDVD HDD and solid-state flashbull Supports Hot Swap Removal (ask about RAID support) bull ATA disks available in Enhanced Dutycycle versions for NEBS Level 3 - 724 requirements bull Operating Systems supported VxWorksLinux and Windows

RSC No 34800

ACTTechnicowwwacttechnicocom

Prosody X cPCI E1T1An E1T1 digital network access card bull Suits telco developers and systems integrators bull Uses Aculabrsquos worldwide protocol coverage including Aculabrsquos SS7 stack available under a cost free license bull Available with 8 or 16 E1T1 trunks and software selectable E1T1 interfaces bull Flexible mix of protocols including ISDN CAS and SS7 (ITU-T China and ANSI) bull A variety of interconnect switching and protocol conversion solutions can be readily crafted bull High availability reliability and scalability with industry standard hardw re and software interoperability bull Up to 128 SS7 signaling links bull Non-circuit related (TCAP) messagingintensive applications such as prepaid and SMS

RSC No 35408

Aculabwwwaculabcom

Adexp8021Intel Core Duo L2400 (166 GHz) w E7520 server chipset bull Dual channel PC2-3200 Registered RAM SECDED or x4 SDDC bull Two GbE two Serial ATA four USB 20 bull Onboard SXGA graphics 1280 x 24-bitbull 6U CompactPCI Bus PICMG EXP0 R10 Specification bull RoHS compliant 0 degC to +55 degC operating range

RSC No 32837

Advanet Incwwwadvanetcojpen

TC84012 channel single-stop Time-to-Digital Converter (TDC) with single-start and multi-start acquisition modes bull 50 ps timing resolution bull Wide range with upto 20 s between first and last events bull Large internal memory buffer with up to 512 hits per channel bull Low jitter (lt3 ps rms) high stability (plusmn2 ppm) internalclock source bull External 10 MHz reference input bull FPGA based Data Processing Unit (DPU) bull Fast readout with DMA mode for increased data throughputbull Overvoltage-protected inputs with 50 Ω K-Lock (LEMO) connectors bull Built-in self calibration bull Modular single-slot 6U PXICompactPCI standardbull Low power consumption (lt22 W)

RSC No 33445

Agilent-Acqiriswwwacqiriscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

MIC-30428-slot 6U CompactPCI backplane bull AC or DC CompactPCI 500 W + 250 W redundant(2+1) power supplies bull PICMG 216 (CompactPCI Packet Switching Backplane) compliancebull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarmmodule (MIC-3924L-AE)

RSC No 32851

MIC-30436-slot 6U CompactPCI backplane bull Supports two hot-swappable SCSISATA or removableIDE HDD bays bull Built-in IDE slim-type DVD-ROM bull AC or DC CompactPCI 250 W + 250 Wredundant (1+1) power supplies bull Supports hot-swappable fan modules bull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarm module (MIC-3924L-AE)

RSC No 32850

Advantech Corporationwwwadvantechcom

Dual-Core Xeon CompactPCI SBCModel PP 42123x bull Dual CPU 6U CompactPCI SBC supporting two dual-core Xeon CPUs bull Up to 8 GB DDR2 ECC SDRAM in a single system or peripheralslot bull Dual processor SBC in a single 6U CompactPCI slot bull Supports two 166 GHz Dual-Core Intel Xeon ULV processors using Intel E7520 server chipsetbull Up to 8 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull PMCXMC site support 66 MHz PCI-X and x8 PCI Express bull Front and rear IO bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade bull Four GbE ports with option for PICMG 216

RSC No 34761

6U CompactPCI Core 2 Duo SBCModel PP 41203x bull 6U CompactPCI Core 2 Duo SBC supporting two PMC sites includingone XMC site bull Up to 4 GB DDR2 ECC SDRAM bull All in a single system or peripheral slot bull TwoPMC sites supporting up to 100 MHz PCI-X bull One XMC x8 PCI Express bull Front and rear IObull Supports 216 GHz or 15 GHz Intel Core 2 Duo processors bull Intel E7520 server chipsetbull Up to 4 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade

RSC No 34763

PP 30202xTwo processor versions available bull 18 GHz Intel Pentium M processor 745 uses mFC-PGA 478 (micro Flip-Chip Pin Grid Array) package bull 14 GHz Intel Pentium M processor Low Voltage 738uses mFC-BGA 479 (micro Flip-Chip Ball Grid Array) package bull 64 KB primary (L1) on-die cache2 MB of secondary (L2) on-die cache bull 400 MHz Front Side Bus (FSB) bull No CPU fan bull 16 GHz processor version (1 MB L2 cache) available see PP 30002x datasheet bull Utilizes 64-bitIntel 855GME chipset bull Supports 400 MHz bus frequency bull Uses Intel 6300ESB IO Controller Hub

RSC No 32659

Concurrent Technologies Incwwwgocctcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cCIBPMC6U-ETA 6U bridged dual PMC carrier that bridges extended temperature CompactPCI boards and PMCs bull Features a rugged CompactPCI form factor providing increased flexibility to military communications systems designers bull Provides additional design choices to users through its differing bus speeds maximizing the numberof PMCs that can be used CompactPCI andPMC buses can both run at 66 or 33 MHzbull Operating temperature range of -40 degC to+85 degC bull Signal conditioning bull DMA supportbull Low-power design +5 V +33 V +12 V -12 V bull User-selectable VIO of 33 V or 5 V to the PMC

RSC No 32891

Dynamic Engineeringwwwdynengcom

cPCI4IP-MMMinimized PCI address footprint IndustryPack carrier for CompactPCI applications bull 6U 4HP4 IP positions 832 clock selection for each slot fused filtered power IO options bull ID INT IO and Mem spaces are decoded for each IP slotbull Single and double wide IPrsquos bull 16- and 32- bit IPs bull 32-bit access to 16-bit IPs bull Full or mini-mized Memory Space decoding for 18 the PCI address requirement bull With the cPCI4IP-MM option 8 CompactPCI 4IP cards take the same PCI address space as 1 full Mem Space card

RSC No 34905

ACQ132CPCI32 channel MHz class simultaneous sampling intelligent digitizer bull 32 simultaneous analoginput channels 2-32 MSpschannel 14-bit resolution bull Differential inputs bull Intelligent cardwith 1 gigabyte memory and GbE on board bull Large distributed FPGA resource on boardbull Range of DSP functions including FIR filtering and Digital Downconverter

RSC No 35482

D-TACQ Solutions Ltdwwwd-tacqcouk

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CR11Based on the Intel Core Duo Processor the platform is designed to support processor speeds from 106 GHz up to 20 GHz bull Intel Core 2 Duo runs at 15 GHz up to 20 GHz bull Conduction cooled bull Two PMC slots bull PCI Express bull 2x GbE

RSC No 33156

ICS-72532-channel 6U CompactPCI DAC board bull 6U CompactPCI data acquisition card bull 32 differential output channels bull 16 or 24-bit sample size bull 288 kHzch data rate bull Simultaneous sampling across all channels on single or multiple boards bull 32 separate delta-sigma DACs bull 64-bit 66 MHz CompactPCI PICMG 20 Rev30 hot-swappable bull FPDP II 400 MBps interface

RSC No 33576

ICS-71032-channel 6U CompactPCI ADC board bull 6U CompactPCI data acquisition card bull 32 differential input channels bull 216 KHzch 24-bit resolution bull Software selectable full scale input bull FPDP II 400 MBpsinterface bull 64-bit 66 MHz CompactPCI PICMG 20 Rev 30 hot swappable bull 32 synchronous boards for simultaneous sampling bull Sonar acoustics and test and measurement applications

RSC No 33578

Tsumani 6U CPCI Development KitFPGA processor solution targeted at high performance software defined radio applications bull Dual Stratix EP1S80 FPGAs are tightly coupled to provide apower platform for signal processing bull Two PMC module sites provide IO connectivity to either front panel or back panel connections bull A direct highbandwidth 1 GBps path from the PMC P4 connector directly to the FPGAs bull Model 919 Dual DAC Mezzanine provides broadband analog signal generationin a compact form bull The board features two independent DAC channels each with its own 12-bit LVDS input capable of running at rates up to 160 MHz

RSC No 32026

CP11Rugged 6U SBC bull Up to 4 GB of DDR2 SDRAM (200 MHz) with enhanced ECC four independent onboard PCI buses system host and peripheral modesupport for the CompactPCI backplane two PMC interfaces (64-bit133 MHz and 32-bit33 MHz) bull Instead of the PMC1 a PCI Express based XMC interface is available on request bull Two GbE one Fast Ethernet two serial interfaces (RS-232 or RS-422485) USB 20 integrated HDD or flash drive bull High performance 2D3D ATI video controller capable of driving two displays in parallel supports VGADVI interface bull Intel Core 2 Duo at 216 GHz Intel Core Duo at 20 GHz2x PMC expansion site bull One XMC optional bull Up to 4 GB DDR2 SDRAM wECC 2x GbE

RSC No 33447

GE Fanuc Intelligent Platforms Incwwwgefanucembeddedcom

Single Board ComputersGD Canada designs and manufactures conduction-cooled Single Board Computers (SBCs)using Intel processors bull 6U and 3U form factors for CompactPCI backplanes bull Fully backward compatible with earlier models bull Upgradeable via the change-out of processor memory andIO modules bull Used within GD Canada computer systems and sold as individual products

RSC No 35281

General Dynamicswwwgdcanadacom

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PrOduCT GuIdE6U CompactPCI

cPCI6U-24DSI32R32-channel 24-bit delta-sigma CompactPCI 6U analog input board with rear IO bull Low noise 24-bit resolution low phase distortion andmulti-board synchronization bull Suits state-of-the-art sonar and noise monitoring applications bull 32-channel cPCI6U-24DSI32 analog input boardprovides a high-density 24-bit analog input resources on a standard 6U CompactPCI expansion board bull Applications from precision voltagemeasurements to complex audio signal and waveform analysis

RSC No 34985

General Standards Corporationwwwgeneralstandardscom

Duet 3U 64-bit 1 GHz TMS320C6416 DSP (x2) 64 MB SDRAM per processor bull Flexible internalexternalcommunication mesh bull 64-bit66 MHz CompactPCI bull PMCXMC site with Jn4 to FPGA and4 RocketIO per VITA 42 bull External data port up to 12 Gbps bull 4M or 5M Virtex-II Pro FPGAbull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM dedicated800 MBps links between DSPs bull 3U CompactPCI with PXI support bull Suits high-end co-processing wireless broadband communications RADAR video and biometrics

RSC No 32856

QuadiaQuad-DSP bull Dual FPGA bull Dual PMC sites bull Inter-processor connectivity and access to external interfaces bull Four C6416 DSPs split in two independent clusters each hosting a PMC site bull One large FPGA for end-user code bull Central FPGA routing interprocessor communication bull End-user FPGA communication bull External port serial IO for PCIe or other p ivate link bull Global memoryand PCI interface bull 1 GHz TMS320C6416 DSP (x4) bull 64 MB SDRAM per processor bull Flexible internalexternal communication mesh bull 64-bit66 MHz CompactPCI bull Two PMC sites with Jn4 to FPGA bull External data port up to 12 Gbps bull Two 4M Gate FPGA reserved for end-user code bull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM bull Up to 512 MB Global DDR SDRAM bull Suits high-end co-processing wireless and broadband communications

RSC No 34737

Quixote 64-bit 6UAdvanced signal capture generation and co-processing bull 1 GHz TMS320C6416 DSP and2 to 6 MGATE Virtex-II FPGA bull 32 MB SDRAM 8 MB ZBT SBSRAM and AD6645 and AD9764 converters bull 6432 bit CompactPCI 66 MHz 5 V33 V and complex trigger modes with HW event logging bull PMC site with Jn4 to FPGA DIO and PICMG 217 StarFabric compliant bull Suits Software Defined Radio wireless IP and RADAR development and hardware testing bull Physical Layer field testing ultra-fast flexible data acquisition vector signal generation and electronic warfare

RSC No 32861

Innovative Integrationwwwinnovative-dspcom

IC-e6-cPCIbHigh performance 6U CompactPCI board bull Powered by one or two of Freescalersquos mostadvanced 14 GHz MPC7448 PowerPC processors bull PICMG 216 compliant bull Marvell Discovery III chipset (MV64460) bull Low power consumption bull Standard extended and rugged grades

RSC No 32982

Interface Conceptwwwinterfaceconceptcom

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PrOduCT GuIdE6U CompactPCI

CP213Single-width 6U CompactPCIPXI module with either 32 or 64 differential analog input channelsbull 32 64 or 128 channels of analog input bull 16 multifunction digital IO (TTL) channels that may beconfigured as digital in digital out or selectively attached to 2 frequency in 2 counter in andor 2 timerout channels bull 16-bit resolution bull Programmable gain per channel programmable scan rates of lt1 Ss through 100 KSs bull Precision onboard reference for end-to-end calibration

RSC No 34804

KineticSystems Company LLCwwwkscorpcom

CP6001Energy efficient embedded Intel dual core processors bull 12 GHz Intel Core Duo U2500 ULV processor bull Intel Core 2 Duo L7400 LV processor bull Based on the Intel Mobile 945GM chipset with a front side bus of up to 667 MHz and ICH7-R Southbridge bull Two independent digital video outputs to the rear IO (2x DVI - 1x DVI and 1x HDMI) bull AC97 audio capabilities bull 3 x GbE bull 4 x SATA with RAID 01510 functionality bull 6 x USB 20 2 x COM and VGA or DVI bull Can also accommodate a PMC slot or an onboard 25 inch SATA HDD bull Up to 8 GB of USB or 2 GB soldered flash bull Supports Linux Windows XP XP embedded and VxWorks 6

RSC No 34182

CP6923 GbE Switch6U CompactPCI GbE Switch PICMG 216 compliant bull Leading edge te hnology basedon BCM5650X chip bull 24x GbE ports bull Non-blocking Layer 2 and 3 switching and routingbull Copper optical rear IO version bull Hot swap IPMI bull Fully managed bull Comprehensive firmware package bull Applies to VoIP installations such as call servers media gatewaysand trunking gateways in wireline and wireless networks as well as VoIP systems inenterprise networks with high demands on performance

RSC No 32256

Kontronwwwkontroncom

TMS320C6701 Virtex-IITexas Instrumentsrsquo C6701 DSP bull Xilinx Virtex-II series FPGA up to XC2V8000 bull Multiple IO interfaces Onboard CODEC VIM expansion sites 60-pin GPIO header and JTAG bull Hardware drivers integration in SimulinkXilinx System Generator Blocksets for quick implementation of Simulink models bull DSP and FPGA-in-the-loop cosimulation of SimulinkXilinx System Generator models bull Leading edge communication interface allowing real-time datamonitoring from Simulink scopes and remote operations

RSC No 32028

VHS-DACHigh performance multichannel DA for phased array antenna systems radarsonar communications receiversup-sampling to IF stage and RFIF AGC apps bull Eight 125 MSPS output channels bull Optional add-on daughter boardprovides 8 additional output channels or 8 additional input channels bull 32-bit 25 MHz bull FPDP interface with 400 MBps transfer rate (25 MSPS per channel at 8 channels 125 MSPS at 16 channels) bull Low level hardware drivers API andGUI bull High level hardware drivers integration in Simulink Blocksets bull Leading edge communication interface fordata recording and playback tofrom the onboard SDRAM

RSC No 32029

Lyrtechwwwlyrtechcom

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PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

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PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

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PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

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PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

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PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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Page 18: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

scaling of the platform depending on the subscriber increase or decrease When consolidating multiple services minimiz-ing multiple duplicate databases requires this flexibility

InterconnectivityThe AdvancedTCA platform offers a number of interconnectivity features including

n Separation between the data plane and the control plane

n Direct uplink in a multichassis envi-ronment with up to l0 GbE

n Node to node base and fabric connec-tivity with HA carrier-grade Ethernet functionality

n Easy upgrade path to l0 GbE for increased bandwidth

By contrast the 1U PCI platform requires

n Additional external interconnectiv-ity between 1U rack-mount servers which increases the number of points of failures and the operating and maintenance costs

n Additional switching equipment for carrier-grade Ethernet connectivity

n Additional manage-ment (Simple Network Management Protocol [SNMP]) for HA redundancy

PowerThe 1U-based platform also utilizes integrated AC power supply units usually the standard for the data center and enter-prise environments AC will increase the pro-viderrsquos OPEX in the long term since the power consumption per rack is significantly higher and

Figure 1

requires additional support equipment such as an Uninterruptible Power Supply (UPS) and an AC to DC converter per rack space and ultimately per CPU These factors along with the requirements for carrier-grade functionality HA support and a more favorable long-term OPEX further reduce the need to consider the 1U solution for HSS deployments in Central Office networks

ManageabilityAdvancedTCA chassis-level management is based on the industry-standard Intelligent Platform Management Interface (IPMI) IPMI makes possible interoperability among chassis and blowers compute nodes switches and management solutions from multiple vendors enabling these elements to work together seamlessly The resulting successful inter-blade communication for applications including failover and clustering provides full manageability on a per shelf and per bay basis

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One of the primary goals of the AdvancedTCA specification is to ensure a very low Mean Time to Repair (MTTR) and high Mean Time Between Failures (MTBF) There are no active components in the backplane ndash which can translate to expensive repairs in the field In addi-tion AdvancedTCA specifies that all com-ponents can be hot swappable in the field and the architecture provides redundancy at all levels This hot swap capability translates to less downtime for field replacement on a per CPU blade basis as compared to 1U PCI

SummaryAdvancedTCA provides an ideal platform and meets the technical requirements for deploying flexible and scalable IMS HSS applications While other platform archi-tectures such as 1U rack-mount servers may with considerable difficulty be able to deliver HSS capabilities AdvancedTCA offers a much more advantageous solution by providing a smaller footprint improved cooling and thermal characteristics bet-ter scalability enhanced interconnectivity and easier manageability This all contrib-utes to making AdvancedTCA a lower cost approach in terms of CAPEX and OPEX for long-term subscriber growth

1U PCI rack-mount servers are not considered to be the optimal hardware platform for HSS applications in a Central Office With its limitation for carrier-grade flexibility and HA functionality the 1U PCI platform is best suited for a full range of other enterprise and Internet infrastructure applications within a data center environment that does not require any significant flexibility and HA functionality around it It might also be a good entrance point for other enterprise applications with lower price points

The use of AdvancedTCA-based platforms enables TEMs to shift away from hardware development and refocus their efforts on delivering value-added software and services As a result they can realize lower development costs and faster time-to-market enabling increased flexibility with each product design through the use and reuse of standardized off-the-shelf components Equally significant are the advantages that can be realized by the service provider With a common platform and a flexible architecture that maximizes limited floor space service providers can rapidly and flexibly implement a broad range of feature-rich solutions for faster profitability

Sven Freudenfeld is responsible for North American Business Development for the Kontron AG line of AdvancedTCA AMC MicroTCA and Pre-Integrated Solutions Sven possesses more than 15 years of experience with voice data and wireless com-munications having worked extensively with Nortel Networks in Systems Engineering Sanmina-SCI in Test Engineeringand Deutsche Telekom in Network Engineering Sven holdsan electrical engineering degree from Germany and is also Chair of the CP-TA marketing workgroup focusing on the interoperability of COTS standard building blocks

Kontron bull svenfreudenfeldcakontroncom bull wwwkontroncom

Fo Sin Pnt

Fo Sin Pnt

TECHNOLOGY g BACkpLANES

Increasing demand for service and multimedia features is stimulating a growing need for speed in telecom-munications equipment While some

applications such as PBX systems can be addressed with the gigabit backplane technologies currently available others are running out of headroom Routers may soon need 10 Gbps and higher speed back-planes to keep up with network demand Many such applications can justify the expense of moving to higher performance if it becomes available

Currently telecom system designs offer backplanes that can handle interconnec-tions running as fast as 3125 Gbps raw data throughput per lane (with around a maxi-mum data rate capability of 5-625 Gbps per lane) The AdvancedTCA standard for instance uses Ethernetrsquos XAUI inter-face AdvancedTCA achieves a 10 Gbps net data rate by running four serial lanes for each interconnection with each lanersquos

SERrializerDESerializer (SERDES) op-erating at 3125 Gbps raw data (25 Gbs net)

As demand forces systems to move beyond these rates however new technologies will be needed One proposal calls for the use of XAUI+ or double XAUI which increases lane SERDES rates to 625 Gbps per lane and hence the throughput to 20 Gbps Another proposal is to use IEEE 8023ap known as 10GBASE-KR which runs a single SERDES lane at 125 Gbps raw data rate (103 Gbps net) But these are only short-term answers To address future demands organizations such as the Institute of Electrical and Electronic Engineers Standards Association (IEEE-SA) are developing specifications for Ethernet speeds of 40 Gbps to 100 Gbps which will be applied to backplane interconnect

Such high clock rates however will pose significant design challenges for developers

One of the first challenges that will need resolution is the design and layout of the backplane and other PCBs Common design practice today readily handles board clock rates of around 10 Gbps Well established design rules are in place and board layout tools such as autorouters can automatically handle board designs for speeds in the 10 Gbps range Designers may use specialized board material create additional ground planes and perform similar tasks in order to ensure proper board operation at the higher end but even speeds to 5 GHz are within current design tool capabilities

Design gets trickierAbove 5 GHz however board design gets more involved because feature dimensions become significant when compared to the signalrsquos wavelengths Variations in board thickness can affect signal propagation Corners where traces change direction and small spurs along edges of poorly etched

Channel characteristics

challenge backplane interoperability

Serial backplanes in telecommunications systems aim for high speed with room for

growth As systems began using 10 Gbps links however issues arose that affected backplane

communications among cards from different manufacturers Stuart points out that the

industry must define key backplane channel characteristics so that designs based on open

standards maintain interoperability as backplane speeds move to 40 Gbps and beyond

By Stuart JamieSon

Fo Sin Pnt

traces can act as antennae for the higher fre-quencies in digital signals As can be seen in Figure 1 sharp corners and minor flaws that are inconsequential at lower frequen-cies have the potential to become trouble-some antennae at future high speeds This can result in the trace radiating away the signalrsquos high frequency energy increasing EMI and crosstalk as well as altering signal waveforms New routing design rules such as making corners 30deg instead of 45deg and more careful board fabrication techniques may become necessary as designs move above the 10 Gbps per lane threshold

The move to higher frequencies will affect more than board fabrication and layout however Higher frequencies will also impose new requirements on signal tim-ing signal rise-time electrical distance and waveform shape if developers are to retain the mix-and-match system design approach that makes standards-based system design effective

For interoperability to be achievable at data rates above 10 Gbps organizations such as PICMG will need to carefully define a vari-ety of signal and design parameters in their specifications Some of the key parameters that will need consideration include

n Interconnect signal attenuationn Eye diagramn Jittern Input clock recoveryn Chip inputoutput pre-emphasis (PE) n Equalization (EQ)

Even slight variations in these parameters from device to device and lane to lane can shift the timing of signals a significant fraction of a clock cycle and affect the Bit Error Rate (BER) of a lanechannel Finally signal rise times will require tight control as signal rates increase in order to ensure control of system timing (see Figure 2)

In defining signal and design parameters specifications will also need to account for the increased location dependency that comes with higher frequencies Even subtle differences in attributes such as routing length and trace impedance become increasingly significant as signal speeds rise To ensure mix-and-match interopera-bility then design specifications may need to account for the specific backplane slot that a board is to occupy as well as introduce a method to obtain and control the PE and EQ of the devices connected to the lanes

Designers must also address fabrication standards The material used to fabricate

Figure 1

Figure 2

Fo Sin Pnt

the board the thickness and composition of metal cladding and the spacing between layers can all affect the trace characteris-tics Controlling these parameters under specification ensures that timing charac-teristics are sufficiently uniform from one board to another However current speci-fications are too detailed and stringent It is extremely difficult to attain compliance yet avoid adding cost to the design

Specifications need workSome of these parameters are already incorporated into current specifications The AMC module specifications from PICMG for instance include design parameters that ensure its proper opera-tion at signal speeds as fast as 125 Gbps per lane Establishing specifications for other system components will help achieve interoperability of standards-based designs at higher frequencies

Design tools may also need to be modified and the industry will need to create new design rules for high frequency and incor-porate these into the tools Developing new routing techniques will help avoid the issues of electrical phenomena such as skin effect dielectric loss and impedance mismatches These are much more preva-lent at higher frequencies and it becomes critical for engineers to model and simu-late these phenomena more accurately

Early efforts are already underway to address the challenges that higher fre-quency signals bring to standards-based design The Interconnect Channel Characterization Subcommittee of PICMG established in September 2006 is develop-ing ground rules and definitions to be used in characterizing transmission reflection and crosstalk performance in backplane and mezzanine carrier interconnects The committee aims to define the channel parameters to be measured or analyzed as well as the methods for doing so Its charter calls for it to address

n Definition of interfaces at which measurements are made or characteristics computed

n Test equipment fixtures and PCB test coupons

n Details of measurement proceduren Data formatsn Techniques for de-embedding

components of the channeln Techniques for validating

measurement based models ie passivity and causality

n Definitions that allow reasonable compliance testing

n Boundary definitions for different paths

n Define information regarding limita-tions or proper usage ie maximum data raterise times that are supported by the models

Such efforts are only a beginning how-ever Other design details still need to be addressed such as SERDES IO Configuration New functionality may need to be defined The design of high data rate system channel interfaces according to standardsspecifications does not currently cover the individual characteristics of the chip transmitterreceiver characteristics Thus work will be needed to address how such standard designs handle such dependency

Crossing an interoperability thresholdOne way of handling location dependen-cies might be to give the system control-ler the ability to inform modules what the channel transmitter and receiver PE and EQ technology is and importantly how to control it With this information along with the signal attenuation suffered (at a given bit rate) for the channel the system should be able to configure SERDES channels in different physical locations to run reliably and at the required BER In MicroTCA systems for instance this functionality could be incorporated into the MicroTCA Carrier Hub (MCH) as part of its electronic keying function Modules would have to be able to configure and control its backplane interfaces to allow for different positions

in the backplane An MCH (see Figure 3 courtesy Emerson) then would be able to instruct a module as to which parameters to use for interoperability

The specific approaches needed to handle location dependencies and other challenges that higher signal rates raise have yet to be developed The need to address these challenges however is clear Increasing demand for services is driving applications to utilize faster signal rates This in turn is driving backplane signaling speeds ever higher As speeds rise above 10 Gbps sig-nals will cross a threshold where current specifications will prove inadequate for ensuring interoperability among standards-based designs

The industry should begin developing new or enhanced specifications and design tools to address the challenges of higher signal rates Without such improvements the guarantees of interoperability that allow system developers to readily create solu-tions by combining off-the-shelf products will be compromised As backplane speeds approach 100 Gbps nothing can be taken for granted

Stuart Jamieson Director of Industry RelationsArchitect with Emerson Network Power Embedded Computing represents Emerson on PICMG committees and the SCOPE organization and previously served as a CP-TA Board member (Treasurer) He brings over 18 years of experience in hardware protocols embedded software and specification development to these groups Within Emerson he played a key role in the develop-ment of the technology central to Emersonrsquos bundled network-ing solutions Stuartrsquos positions within Emerson have included Director of Business Development Director of Advanced Technology and Architect He is the Draft Editor for the PICMG Interconnect Channel Characterization Subcommittee is the author of the introduction section for the new PICMG Ruggedized MicroTCA specification and served as the Draft Editor for the PICMG MicroTCA Specification Stuart gradu-ated from the Heriot-Watt University in 1989 with a 1st Class Honors degree in Electrical and Electronic Engineering and again in 1992 with an IBM-sponsored Master of Philosophy

Emerson Network Power Embedded ComputingStuartJamiesonEmersoncom bull wwwemersonembeddedcomputingcom

Figure 3

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TECHNOLOGY g BACkpLANES

2008

B A

N D

W I

D T

H

Signal integrity challenges to bandwidth scalabilityFor the purposes of this article each interconnected differential pair will be referred to as a Channel (which should not be confused with an aggregated AdvancedTCA channel comprising four trans-mit and four receive pairs)

14-slot full-mesh AdvancedTCA backplanes contain hundreds of Channels Each Channel is defined as the copper signal path from the output of a driver device to the input of a receiver device As

By douglaS Hynd

Developing IEEE 8023ap 10GBASE-KRcompliant backplanes

Why doesAdvancedTCA

need bandwidthscalability

PICMG AdvancedTCA 30 has emerged as the

industryrsquos Hardware Platform standard of choice and

is enjoying first-phase deployment However many

believe that for AdvancedTCA to realize its market

potential AdvancedTCA platforms need to seamlessly

scale to accommodate 40 GbE fabrics thereby

avoiding forklift upgrades as system bandwidth

demands increase over time A 40 GbE switch fabric

architecture would enable realization of a common

platform for computing storage control and media

and packet processing and provide the versatility and

long term ROI required by service providers in

todayrsquos increasingly competitive environment

The challenge was to develop a family of

AdvancedTCA products which feature PICMG 30

compliant dual star and full mesh advanced

backplane switch fabrics enabled up to 10 Gbps

per differential signal pair thereby giving 40 Gbps

per AdvancedTCA channel performance

This article describes the signal integrity challenges

presented in designing an IEEE 8023ap

10GBASE-KR-compliant bandwidth-scalable

14-slot AdvancedTCA platform and how these

challenges were overcome in development of full

mesh and dual star backplane reference designs

Fo Sin Pnt

shown in Figure 1 that signal path comprises a signal launch a blade PCB transmission line a daughtercard via a right-angled HM-ZD connector a mated HM-ZD backplane header a back-plane via a length of backplane PCB transmission line and then the same combination of connectors vias and transmission line at the receive end of the Channel

Sources of crosstalkFour principal sources of crosstalk in each Channel must be man-aged as shown in Table 2 Source number one is between adjacent differential pairs as they are routed across the backplane Common mode noise rejection in system differential pair structures makes this a minor issue The second source of crosstalk lies in the HM-ZD connector itself

Crosstalk in via fields our third source primarily arises from inductive coupling between adjacent differential pairs and domi-nates the crosstalk agenda in high-speed Channels This source of crosstalk is directly proportional to the length of the via barrel and where practical care must be taken to ensure that adjacent connector rows are terminated to different target routing Layers

The final source of crosstalk is caused by aggressor signals in through-routed via fields coupling with victim Channel traces as they pass through As mentioned earlier judicious and careful design can mitigate this impact

Skew Channel skew is a function of differential transmission path geometries At a fundamental frequency of 5 GHz skew can be a significant issue in high-speed system design due to narrowing the eye opening and increasing jitter Skew can have a significant impact on crosstalk it negatively impacts the common mode rejection of noise inherent to differential signaling Conductor surface roughness in lower performing dielectric materials can also cause skew in high-speed systems

Skew can be avoided through careful management of transmission path lengths in each Channel and by using higher-glass content (lower Dk) laminates

LossPotential

Potential Mismatches

Channel

Loss Potential Channel

PCB Tolerance -025 dB 2 -01 dB

Connector Tolerance -001 dB 4 -016 dB

Thru-routed Via Fields -001 dB 12 -144 dB

Connector Launch -025 dB+ 4 - 2 dB+

Quantity TotalNEXT

TotalFEXT

PCB Transmission Lines

24 in60 cm

-50 dB -70 dB

Connector Architecture 2 -26 dB -24 dB

Via Fields 4 -22 dB -20 dB

Connector Pass Through 8 -34 dB ndash34 dB

For the target application each one of these Channels must deliver a 10 Gbps Non-Return-To-Zero (NRZ) signal with sufficient signal fidelity to enable a receiver device to detect and process a differential signal The PICMG 30 specification is targeted at 3125 Gbps signaling with a fundamental frequency of 156 GHz Even in low loss dielectric materials insertion loss at 10 Gbps (5 GHz fundamental) is twice that of a 3125 Gbps signal

Therefore achieving acceptable signal fidelity requires careful management of signal losses and noise in each Channel such that an acceptable signal-to-noise (SN) ratio is achieved at the receiver

The design process therefore begins by understanding and mitigat-ing the sources of losses and noise in each Channel

Sources of lossThere are three sources of loss

n Conductor losses which are due to skin effects and can be addressed by maximizing the cross sectional area of the signal traces

n Material dispersion losses which are a function of the dielectric constants of the chosen material These can be mitigated by choosing a higher performance laminate material such as Nelco 4000-13SI or Megtron

n Reflected power loss due to impedance mismatches in the Channel as each signal transitions across the different copper media in each channel (connectors vias and PCB traces) and passes through the pad and anti-pad structures of the via fields of other backplane blade slots

Table 1 shows the relative effects of different sources of impedance mismatches The dominant source of impedance mismatches in every Channel resides in the via structures Successful mitigation of this problem requires that every via is tuned by back-drilling the stub and adjusting the pad and anti-pad structures to match the impedance to be 50 ohms irrespective of the target routing layer This in turn requires that the capacitive and inductive effects of the connector pin and via barrel combination are taken into account during the design of each Channel

Further complicating via design is the space the anti-pad structures need to accommodate Channels being routed between other blades while minimizing electro-magnetic coupling with them This space consideration makes the shape and orientation of pads and anti-pads extremely important

Figure 1

Table 1

Table 2

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IEEE 8023ap provides a design targetAs Ethernet has emerged as the industryrsquos dominant signaling methodology the IEEE has developed the 10GBASE-KR norma-tive Channel model to define interconnect Channel performance for NRZ signaling at 10 Gbps This standard defines acceptable performance in terms of S-parameter charts for through-Channel insertion loss and worst-case crosstalk Figures 2a and 2b illustrate masks for Draft 24 of the standard that was initially used for this exercise

In each case the mask defining compliant performance is shown in blue Channel insertion loss is shown in red in Figure 2a Crosstalk performance is defined by the ICR curve (Figure 2b) Minimum acceptable Channel performance is defined in the ICR chart (Figure 2b) by the blue line The effect of the sum of all aggressors on the through-Channel is shown in red The green ICR curve is the ratio of the crosstalk power sum calculated by summing the

magnitudes of any impacting crosstalk Channels for each fre-quency and using a straight line fit (using least-squares method) to determine the resulting average effect f the aggressors on the through-Channel This is then overlaid on the insertion loss and used to plot the ICR curve

This standard which has evolved through a variety of iterations forms the basis for developing a 40 GbE switch fabric backplane featuring 10 Gbps NRZ differential pairs If all differential pairs can meet this standard then the backplane can be considered to be 10GBASE-KR compliant

Applying 10GBASE-KR to a 14-slotAdvancedTCA applicationThe PICMG specification dictates that receive differential pairs are placed on the c-d and g-h rows of the HM-ZD connector and that transmit differential pairs are placed on the a-b and e-f rows Therefore the middle differential pair in row c-d of Slot B will be subject to the NEXT of three aggressors in each of the a-b and e-f transmit rows of slot B plus the FEXT of the signals being received in the c-d pairs in the top and bottom of slot B

In this topology it can be seen that worst-case crosstalk would occur if all the NEXT and FEXT aggressors were routed on the bottom Layer that is on the same Layer as that of the victim c-d However given that all signal vias must be back-drilled and tuned for impedance management purposes Channel crosstalk can simultaneously be reduced by allocating different routing Layers to differential pairs terminated in the same backplane connector

The principal factor in determining the feasibility of a 10GBASE-KR compliant backplane is based on understanding whether the Channel with the worst-case signal-to-noise ratio is compliant

The skew targets determine permissible layer separation between a-b c-d e-f and g-h pairs within each Channel and enable routing Layers to be allocated for each pair It is now possible to start the process of via tuning to optimize the channel performance for minimum insertion loss Modeling begins by defining the simulation boundaries for the channel so that Channel component models (PCB traces connectors vias) can easily be aggregated to model complete Channels Boundaries must be established at locations in the Channel where linear 3D structures exist These are shown in Figure 3 (next page)

Since the connector and via combinations for the backplane and daughtercard mating halves must each be treated as a whole it

PICMG 30Spec

TurboFabricSpec

Total Inter-PairSkew

(Fabric Interface)

05 mm in FR4(34 ps)

001 mmin N4000-13si

(00625 ps)

Total Intra-Channel Skew

(Fabric Interface)

254 mm in FR4(17 ps)

plusmn01 mmin N4000-13si

(0625ps)

Total Intra-Channel Skew

(Base Interface)

135 mm in FR4(90 ps)

plusmn01 mmin N4000-13si

(0625 ps)

Figures 2a and 2b

Table 3

Determining which Channel that is and identifying the worst-case SN requires making trade-offs with regard to PCB material Channel length via design connector row selection and NEXT and FEXT aggressor routing choices These trade-off choices can only take place using advanced 3D simulation tools such as Ansoft HFSS This was the essence of the design process employed in developing Simclarrsquos TurboFabric backplanes

The simulation processThe transmission length for full mesh and dual star backplanes design implementations varies from a maximum of 1632 inches to a minimum of 116 inches With an effective transmission length of 5 inches on each daughtercard this makes the longest effective Channel 2632 inches including two connectors

For a 10GBASE-KR application over this distance a high-perfor-mance laminate is essential for both reducing insertion loss and

ensuring high glass content in the weave to mitigate skew So the design process began by choosing a low-loss dielectric material (Nelco 4000-13SI for both the backplane and the daugh-tercards) and establishing targets for Inter-Pair and Intra-Channel skew as shown in Table 3

Adhering to the PICMG 30 specifi-cation for skew in a 10GBASE-KR application is impractical Instead a target of 00625 ps was set for Inter-Pair skew with 0625 ps set for Intra-Pair skew for the backplane only This equated to a maximum 001 mm differ-

ence being allowed between traces of any differential pair and 01 mm being permitted between traces of any four differential pairs in a Channel Given the topology of the HM-ZD connector daughter-card skew must be accounted for in the daughtercard layout Fo

Sin Pnt

should be noted that the simulation boundary is located within the mated connector

Tuning the connector and via structures to 50Ω is an iterative process involving the removal of excess pads back-drilling and tuning pads anti-pads and traces A Time Domain Reflectometer (TDR) plot illustrating the results of the tuning process is shown in Figure 4

Upon completion of the modeling process a total of 17 different optimized via and routing configurations had been designed for the full mesh design and nine for the dual star design

A plot of worst-case insertion loss is shown in Figure 5 and demonstrates that in both cases performance is well above the 10GBASE-KR mask

When all the through-Channels have been modeled adjacent Channel models can be combined and ICR curves plotted to evaluate the impact of crosstalk on through-Channel performance This valuable information can be used to adjust the position of signal Layers relative to pass-through aggressor traces on adjacent Layers or to reroute traces to reduce crosstalk Similarly routing Layers can be changed to reduce crosstalk in adjacent via barrels

Figure 6 plots worst-case ICR and demonstrates that performance is above the 10GBASE-KR mask Based on this result it was possible to proceed to physical implementation

Figure 3

Figure 4

Fo Sin Pnt

Physical realizationThe layout process was performed using the Mentor Board-Station CAD system Quad-routing (routing four traces between pads) was explored as a routing method-ology in order to reduce Layer count but this was dismissed due to the detrimental impact on crosstalk performance

The attributes of the physical backplanes produced as a result of the design effort are shown in Table 4

The design files produced included the usual gerber files plus detailed back-drilling instructions

The design validation process comprised a conventional continuity test followed by performance testing featuring Agilent equipment including 70340A signal generator 8720ES Network Analyzer NN18A S-Parameter test-set and 86100A sampling oscilloscope with Agilent 86112A module Figure 7 (next page) shows the test set up

Simclar developed special line cards to enable through-Channel measurements with and without crosstalk The signal launch featured compression mount SMAs terminated in a tuned via structure The Channel simulations included simu-lation of the tuned launch structures so de-embedding of the launches was not necessary for correlation to simulation purposes The development team also established a process for characterization of all Channels

Full Mesh Dual Star

Layer Count 34 18

Aspect Ratio 121 61

Tuned Vias 3952 768

Material Nelco 4000-13SI

Table 4

Figure 5 Figure 6

Fo Sin Pnt

In Figure 8 measured through-Channel performance and ICR curves are shown for the same Channels described in the simula-tion section earlier

As can be seen from Figure 8 there is close correlation between these and the simulated plots in Figures 5 and 6 In fact close correlation between all simulated and measured results was achieved resulting in a 728 Tbps capacity full mesh and a 960 Gbps capacity dual star backplane design now generally available as part of the Simclar TurboFabric shelf

Figure 7 Figure 8

Figure 9

Figure 10

Implications of 10GBASE-KR Draft 33versus Draft 25The work described above was targeted towards meeting the Channels specifications contained in Draft 25 of the IEEE 10GBASE-KR Since this work was completed the IEEE has up-issued the Draft revision level for the Standard from 25 to 33 While this has not impacted through-Channel performance demands it has increased Channel isolation requirements by around 10 dB In Figure 9 a Draft 33 mask is added to the ICR plot shown in Figure 8

From Figure 9 it can be seen how Draft 33 pulls the mask above the Channel ICR curve for this full mesh backplane Channel Surprisingly it is the Channelrsquos frequency response at relatively low frequencies between 100-500 MHz that is causing a problem The reasons for this are currently the subject of further detailed investigation

However Figure 10 shows a Draft 33 plot for a less demanding dual star AdvancedTCA implementation featuring shorter trans-mission distances This plot demonstrates compliance to Draft 33 of the IEEE 8023ap 10GBASE-KR Standard

ConclusionBy developing a close understanding of the many factors contrib-uting to loss and noise in multi-gigabit backplane Channels it is possible to characterize their performance using advanced simula-tion techniques and correlate that performance in physical prod-ucts using advanced test methods By overlaying the test results on S-Parameter masks defined by the IEEE 8023ap 10GBASE-KR Standard it has been demonstrated that backplanes that truly enable AdvancedTCA scalability are at last a reality

Douglas Hynd joined Simclar Group in 2006 as Director of Marketing as part of Simclarrsquos acquisition of Northrop Grumman Interconnect Technologies Division wherehe was Vice President of Marketing and Sales He has more than 24 yearsrsquo experience intechnology sales marketing and generalmanagement and holds a BSc (Eng) in Electronics and Electrical Engineeringfrom the University of Glasgow He isbased at Simclarrsquos Global HQ inDunfermline Scotland

Simclar Groupdouglashyndsimclarcom bull wwwsimclarcom

Fo Sin Pnt

6U CompactPCIPrOduCT GuIdE g

This monthrsquos issue includes a 6U CompactPCI Product Guide and Irsquod like to take the opportunity to reflect a bit on the success and evolution of that technology

Back in the 1994 time frame when CompactPCI was first being devel-oped it began as 3U-only technology It used the same Eurocardmechanics that were popularized by VME and an IEC standardized high-

density high-speed connector available from a number of vendors suitablefor 33 MHz PCI signaling That connector was selected by the engineers atZiatech with help from Mike Munroe then at ERNI The majority of VMEdesigns were 6U and based on this I was among a number of folks thatargued for adding the 6U CompactPCI form factor

The 6U form factor presented some challenges and opportunities Onechallenge was that the insertion and extraction forces were quite high when the entire rear of the card was populated with connectors Fortunately the IEEE standards for Eurocards evolved and injectorejector handles that pro-vided leverage became available Eike Waltz then at Rittal was instrumental in bringing that to the table Two of the opportunities that came along withthe extra connectors were a clean way to add secondary buses like the H110 telephony bus to the backplane and the ability to route IO out the rear through rear transition modules PICMG has developed quite a number of subsidiary specifications defining the interoperable use of the extra backplane pins made possible with the 6U form factor Both of these features have played a major part in CompactPCIrsquos success The next major evolution of 6U CompactPCI came with the PICMG 216 Packet Switched Backplane standard which was originally conceived by John Peters and his team at Performance Technologies PICMG 216 interconnected a shelf full of CompactPCI single board computers via redundant Ethernet switches also in the 6U CompactPCI form factor This dramatically increased usable backplane bandwidth and provided redundancy PICMG 216 paved the way for AdvancedTCA and was the industryrsquos first open standard for the switched serial interconnect standards we see popping up in many places

By Joe Pavlat

Looking back and ahead at6U CompactPCI

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Recent 6U CompactPCI related products are listed here For more informationenter the productrsquos RSC No at wwwcompactpci-systemscomrsc

cPCI-6910Dual-core Intel Xeon Processor LVULV Universal blade bull Supports Single Dual-Core Intel Xeon LV or ULV processorsbull Front Side Bus 667 MHz bull Up to 2 GB DDR2 400 MHz soldered SDRAM with ECC bull Four PCI Express GbEbull Up to 4 USB 20 ports bull PICMG 20 21 29 216 compliant

RSC No 35013

ADLINK Technologywwwadlinktechcom

CPCIStor Module6U CompactPCI storage blade bull Onboard ATA controller supports CDDVD HDD and solid-state flashbull Supports Hot Swap Removal (ask about RAID support) bull ATA disks available in Enhanced Dutycycle versions for NEBS Level 3 - 724 requirements bull Operating Systems supported VxWorksLinux and Windows

RSC No 34800

ACTTechnicowwwacttechnicocom

Prosody X cPCI E1T1An E1T1 digital network access card bull Suits telco developers and systems integrators bull Uses Aculabrsquos worldwide protocol coverage including Aculabrsquos SS7 stack available under a cost free license bull Available with 8 or 16 E1T1 trunks and software selectable E1T1 interfaces bull Flexible mix of protocols including ISDN CAS and SS7 (ITU-T China and ANSI) bull A variety of interconnect switching and protocol conversion solutions can be readily crafted bull High availability reliability and scalability with industry standard hardw re and software interoperability bull Up to 128 SS7 signaling links bull Non-circuit related (TCAP) messagingintensive applications such as prepaid and SMS

RSC No 35408

Aculabwwwaculabcom

Adexp8021Intel Core Duo L2400 (166 GHz) w E7520 server chipset bull Dual channel PC2-3200 Registered RAM SECDED or x4 SDDC bull Two GbE two Serial ATA four USB 20 bull Onboard SXGA graphics 1280 x 24-bitbull 6U CompactPCI Bus PICMG EXP0 R10 Specification bull RoHS compliant 0 degC to +55 degC operating range

RSC No 32837

Advanet Incwwwadvanetcojpen

TC84012 channel single-stop Time-to-Digital Converter (TDC) with single-start and multi-start acquisition modes bull 50 ps timing resolution bull Wide range with upto 20 s between first and last events bull Large internal memory buffer with up to 512 hits per channel bull Low jitter (lt3 ps rms) high stability (plusmn2 ppm) internalclock source bull External 10 MHz reference input bull FPGA based Data Processing Unit (DPU) bull Fast readout with DMA mode for increased data throughputbull Overvoltage-protected inputs with 50 Ω K-Lock (LEMO) connectors bull Built-in self calibration bull Modular single-slot 6U PXICompactPCI standardbull Low power consumption (lt22 W)

RSC No 33445

Agilent-Acqiriswwwacqiriscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

MIC-30428-slot 6U CompactPCI backplane bull AC or DC CompactPCI 500 W + 250 W redundant(2+1) power supplies bull PICMG 216 (CompactPCI Packet Switching Backplane) compliancebull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarmmodule (MIC-3924L-AE)

RSC No 32851

MIC-30436-slot 6U CompactPCI backplane bull Supports two hot-swappable SCSISATA or removableIDE HDD bays bull Built-in IDE slim-type DVD-ROM bull AC or DC CompactPCI 250 W + 250 Wredundant (1+1) power supplies bull Supports hot-swappable fan modules bull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarm module (MIC-3924L-AE)

RSC No 32850

Advantech Corporationwwwadvantechcom

Dual-Core Xeon CompactPCI SBCModel PP 42123x bull Dual CPU 6U CompactPCI SBC supporting two dual-core Xeon CPUs bull Up to 8 GB DDR2 ECC SDRAM in a single system or peripheralslot bull Dual processor SBC in a single 6U CompactPCI slot bull Supports two 166 GHz Dual-Core Intel Xeon ULV processors using Intel E7520 server chipsetbull Up to 8 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull PMCXMC site support 66 MHz PCI-X and x8 PCI Express bull Front and rear IO bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade bull Four GbE ports with option for PICMG 216

RSC No 34761

6U CompactPCI Core 2 Duo SBCModel PP 41203x bull 6U CompactPCI Core 2 Duo SBC supporting two PMC sites includingone XMC site bull Up to 4 GB DDR2 ECC SDRAM bull All in a single system or peripheral slot bull TwoPMC sites supporting up to 100 MHz PCI-X bull One XMC x8 PCI Express bull Front and rear IObull Supports 216 GHz or 15 GHz Intel Core 2 Duo processors bull Intel E7520 server chipsetbull Up to 4 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade

RSC No 34763

PP 30202xTwo processor versions available bull 18 GHz Intel Pentium M processor 745 uses mFC-PGA 478 (micro Flip-Chip Pin Grid Array) package bull 14 GHz Intel Pentium M processor Low Voltage 738uses mFC-BGA 479 (micro Flip-Chip Ball Grid Array) package bull 64 KB primary (L1) on-die cache2 MB of secondary (L2) on-die cache bull 400 MHz Front Side Bus (FSB) bull No CPU fan bull 16 GHz processor version (1 MB L2 cache) available see PP 30002x datasheet bull Utilizes 64-bitIntel 855GME chipset bull Supports 400 MHz bus frequency bull Uses Intel 6300ESB IO Controller Hub

RSC No 32659

Concurrent Technologies Incwwwgocctcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cCIBPMC6U-ETA 6U bridged dual PMC carrier that bridges extended temperature CompactPCI boards and PMCs bull Features a rugged CompactPCI form factor providing increased flexibility to military communications systems designers bull Provides additional design choices to users through its differing bus speeds maximizing the numberof PMCs that can be used CompactPCI andPMC buses can both run at 66 or 33 MHzbull Operating temperature range of -40 degC to+85 degC bull Signal conditioning bull DMA supportbull Low-power design +5 V +33 V +12 V -12 V bull User-selectable VIO of 33 V or 5 V to the PMC

RSC No 32891

Dynamic Engineeringwwwdynengcom

cPCI4IP-MMMinimized PCI address footprint IndustryPack carrier for CompactPCI applications bull 6U 4HP4 IP positions 832 clock selection for each slot fused filtered power IO options bull ID INT IO and Mem spaces are decoded for each IP slotbull Single and double wide IPrsquos bull 16- and 32- bit IPs bull 32-bit access to 16-bit IPs bull Full or mini-mized Memory Space decoding for 18 the PCI address requirement bull With the cPCI4IP-MM option 8 CompactPCI 4IP cards take the same PCI address space as 1 full Mem Space card

RSC No 34905

ACQ132CPCI32 channel MHz class simultaneous sampling intelligent digitizer bull 32 simultaneous analoginput channels 2-32 MSpschannel 14-bit resolution bull Differential inputs bull Intelligent cardwith 1 gigabyte memory and GbE on board bull Large distributed FPGA resource on boardbull Range of DSP functions including FIR filtering and Digital Downconverter

RSC No 35482

D-TACQ Solutions Ltdwwwd-tacqcouk

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PrOduCT GuIdE6U CompactPCI

CR11Based on the Intel Core Duo Processor the platform is designed to support processor speeds from 106 GHz up to 20 GHz bull Intel Core 2 Duo runs at 15 GHz up to 20 GHz bull Conduction cooled bull Two PMC slots bull PCI Express bull 2x GbE

RSC No 33156

ICS-72532-channel 6U CompactPCI DAC board bull 6U CompactPCI data acquisition card bull 32 differential output channels bull 16 or 24-bit sample size bull 288 kHzch data rate bull Simultaneous sampling across all channels on single or multiple boards bull 32 separate delta-sigma DACs bull 64-bit 66 MHz CompactPCI PICMG 20 Rev30 hot-swappable bull FPDP II 400 MBps interface

RSC No 33576

ICS-71032-channel 6U CompactPCI ADC board bull 6U CompactPCI data acquisition card bull 32 differential input channels bull 216 KHzch 24-bit resolution bull Software selectable full scale input bull FPDP II 400 MBpsinterface bull 64-bit 66 MHz CompactPCI PICMG 20 Rev 30 hot swappable bull 32 synchronous boards for simultaneous sampling bull Sonar acoustics and test and measurement applications

RSC No 33578

Tsumani 6U CPCI Development KitFPGA processor solution targeted at high performance software defined radio applications bull Dual Stratix EP1S80 FPGAs are tightly coupled to provide apower platform for signal processing bull Two PMC module sites provide IO connectivity to either front panel or back panel connections bull A direct highbandwidth 1 GBps path from the PMC P4 connector directly to the FPGAs bull Model 919 Dual DAC Mezzanine provides broadband analog signal generationin a compact form bull The board features two independent DAC channels each with its own 12-bit LVDS input capable of running at rates up to 160 MHz

RSC No 32026

CP11Rugged 6U SBC bull Up to 4 GB of DDR2 SDRAM (200 MHz) with enhanced ECC four independent onboard PCI buses system host and peripheral modesupport for the CompactPCI backplane two PMC interfaces (64-bit133 MHz and 32-bit33 MHz) bull Instead of the PMC1 a PCI Express based XMC interface is available on request bull Two GbE one Fast Ethernet two serial interfaces (RS-232 or RS-422485) USB 20 integrated HDD or flash drive bull High performance 2D3D ATI video controller capable of driving two displays in parallel supports VGADVI interface bull Intel Core 2 Duo at 216 GHz Intel Core Duo at 20 GHz2x PMC expansion site bull One XMC optional bull Up to 4 GB DDR2 SDRAM wECC 2x GbE

RSC No 33447

GE Fanuc Intelligent Platforms Incwwwgefanucembeddedcom

Single Board ComputersGD Canada designs and manufactures conduction-cooled Single Board Computers (SBCs)using Intel processors bull 6U and 3U form factors for CompactPCI backplanes bull Fully backward compatible with earlier models bull Upgradeable via the change-out of processor memory andIO modules bull Used within GD Canada computer systems and sold as individual products

RSC No 35281

General Dynamicswwwgdcanadacom

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PrOduCT GuIdE6U CompactPCI

cPCI6U-24DSI32R32-channel 24-bit delta-sigma CompactPCI 6U analog input board with rear IO bull Low noise 24-bit resolution low phase distortion andmulti-board synchronization bull Suits state-of-the-art sonar and noise monitoring applications bull 32-channel cPCI6U-24DSI32 analog input boardprovides a high-density 24-bit analog input resources on a standard 6U CompactPCI expansion board bull Applications from precision voltagemeasurements to complex audio signal and waveform analysis

RSC No 34985

General Standards Corporationwwwgeneralstandardscom

Duet 3U 64-bit 1 GHz TMS320C6416 DSP (x2) 64 MB SDRAM per processor bull Flexible internalexternalcommunication mesh bull 64-bit66 MHz CompactPCI bull PMCXMC site with Jn4 to FPGA and4 RocketIO per VITA 42 bull External data port up to 12 Gbps bull 4M or 5M Virtex-II Pro FPGAbull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM dedicated800 MBps links between DSPs bull 3U CompactPCI with PXI support bull Suits high-end co-processing wireless broadband communications RADAR video and biometrics

RSC No 32856

QuadiaQuad-DSP bull Dual FPGA bull Dual PMC sites bull Inter-processor connectivity and access to external interfaces bull Four C6416 DSPs split in two independent clusters each hosting a PMC site bull One large FPGA for end-user code bull Central FPGA routing interprocessor communication bull End-user FPGA communication bull External port serial IO for PCIe or other p ivate link bull Global memoryand PCI interface bull 1 GHz TMS320C6416 DSP (x4) bull 64 MB SDRAM per processor bull Flexible internalexternal communication mesh bull 64-bit66 MHz CompactPCI bull Two PMC sites with Jn4 to FPGA bull External data port up to 12 Gbps bull Two 4M Gate FPGA reserved for end-user code bull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM bull Up to 512 MB Global DDR SDRAM bull Suits high-end co-processing wireless and broadband communications

RSC No 34737

Quixote 64-bit 6UAdvanced signal capture generation and co-processing bull 1 GHz TMS320C6416 DSP and2 to 6 MGATE Virtex-II FPGA bull 32 MB SDRAM 8 MB ZBT SBSRAM and AD6645 and AD9764 converters bull 6432 bit CompactPCI 66 MHz 5 V33 V and complex trigger modes with HW event logging bull PMC site with Jn4 to FPGA DIO and PICMG 217 StarFabric compliant bull Suits Software Defined Radio wireless IP and RADAR development and hardware testing bull Physical Layer field testing ultra-fast flexible data acquisition vector signal generation and electronic warfare

RSC No 32861

Innovative Integrationwwwinnovative-dspcom

IC-e6-cPCIbHigh performance 6U CompactPCI board bull Powered by one or two of Freescalersquos mostadvanced 14 GHz MPC7448 PowerPC processors bull PICMG 216 compliant bull Marvell Discovery III chipset (MV64460) bull Low power consumption bull Standard extended and rugged grades

RSC No 32982

Interface Conceptwwwinterfaceconceptcom

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PrOduCT GuIdE6U CompactPCI

CP213Single-width 6U CompactPCIPXI module with either 32 or 64 differential analog input channelsbull 32 64 or 128 channels of analog input bull 16 multifunction digital IO (TTL) channels that may beconfigured as digital in digital out or selectively attached to 2 frequency in 2 counter in andor 2 timerout channels bull 16-bit resolution bull Programmable gain per channel programmable scan rates of lt1 Ss through 100 KSs bull Precision onboard reference for end-to-end calibration

RSC No 34804

KineticSystems Company LLCwwwkscorpcom

CP6001Energy efficient embedded Intel dual core processors bull 12 GHz Intel Core Duo U2500 ULV processor bull Intel Core 2 Duo L7400 LV processor bull Based on the Intel Mobile 945GM chipset with a front side bus of up to 667 MHz and ICH7-R Southbridge bull Two independent digital video outputs to the rear IO (2x DVI - 1x DVI and 1x HDMI) bull AC97 audio capabilities bull 3 x GbE bull 4 x SATA with RAID 01510 functionality bull 6 x USB 20 2 x COM and VGA or DVI bull Can also accommodate a PMC slot or an onboard 25 inch SATA HDD bull Up to 8 GB of USB or 2 GB soldered flash bull Supports Linux Windows XP XP embedded and VxWorks 6

RSC No 34182

CP6923 GbE Switch6U CompactPCI GbE Switch PICMG 216 compliant bull Leading edge te hnology basedon BCM5650X chip bull 24x GbE ports bull Non-blocking Layer 2 and 3 switching and routingbull Copper optical rear IO version bull Hot swap IPMI bull Fully managed bull Comprehensive firmware package bull Applies to VoIP installations such as call servers media gatewaysand trunking gateways in wireline and wireless networks as well as VoIP systems inenterprise networks with high demands on performance

RSC No 32256

Kontronwwwkontroncom

TMS320C6701 Virtex-IITexas Instrumentsrsquo C6701 DSP bull Xilinx Virtex-II series FPGA up to XC2V8000 bull Multiple IO interfaces Onboard CODEC VIM expansion sites 60-pin GPIO header and JTAG bull Hardware drivers integration in SimulinkXilinx System Generator Blocksets for quick implementation of Simulink models bull DSP and FPGA-in-the-loop cosimulation of SimulinkXilinx System Generator models bull Leading edge communication interface allowing real-time datamonitoring from Simulink scopes and remote operations

RSC No 32028

VHS-DACHigh performance multichannel DA for phased array antenna systems radarsonar communications receiversup-sampling to IF stage and RFIF AGC apps bull Eight 125 MSPS output channels bull Optional add-on daughter boardprovides 8 additional output channels or 8 additional input channels bull 32-bit 25 MHz bull FPDP interface with 400 MBps transfer rate (25 MSPS per channel at 8 channels 125 MSPS at 16 channels) bull Low level hardware drivers API andGUI bull High level hardware drivers integration in Simulink Blocksets bull Leading edge communication interface fordata recording and playback tofrom the onboard SDRAM

RSC No 32029

Lyrtechwwwlyrtechcom

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PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

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PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

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PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

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PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

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PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

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SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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Page 19: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

One of the primary goals of the AdvancedTCA specification is to ensure a very low Mean Time to Repair (MTTR) and high Mean Time Between Failures (MTBF) There are no active components in the backplane ndash which can translate to expensive repairs in the field In addi-tion AdvancedTCA specifies that all com-ponents can be hot swappable in the field and the architecture provides redundancy at all levels This hot swap capability translates to less downtime for field replacement on a per CPU blade basis as compared to 1U PCI

SummaryAdvancedTCA provides an ideal platform and meets the technical requirements for deploying flexible and scalable IMS HSS applications While other platform archi-tectures such as 1U rack-mount servers may with considerable difficulty be able to deliver HSS capabilities AdvancedTCA offers a much more advantageous solution by providing a smaller footprint improved cooling and thermal characteristics bet-ter scalability enhanced interconnectivity and easier manageability This all contrib-utes to making AdvancedTCA a lower cost approach in terms of CAPEX and OPEX for long-term subscriber growth

1U PCI rack-mount servers are not considered to be the optimal hardware platform for HSS applications in a Central Office With its limitation for carrier-grade flexibility and HA functionality the 1U PCI platform is best suited for a full range of other enterprise and Internet infrastructure applications within a data center environment that does not require any significant flexibility and HA functionality around it It might also be a good entrance point for other enterprise applications with lower price points

The use of AdvancedTCA-based platforms enables TEMs to shift away from hardware development and refocus their efforts on delivering value-added software and services As a result they can realize lower development costs and faster time-to-market enabling increased flexibility with each product design through the use and reuse of standardized off-the-shelf components Equally significant are the advantages that can be realized by the service provider With a common platform and a flexible architecture that maximizes limited floor space service providers can rapidly and flexibly implement a broad range of feature-rich solutions for faster profitability

Sven Freudenfeld is responsible for North American Business Development for the Kontron AG line of AdvancedTCA AMC MicroTCA and Pre-Integrated Solutions Sven possesses more than 15 years of experience with voice data and wireless com-munications having worked extensively with Nortel Networks in Systems Engineering Sanmina-SCI in Test Engineeringand Deutsche Telekom in Network Engineering Sven holdsan electrical engineering degree from Germany and is also Chair of the CP-TA marketing workgroup focusing on the interoperability of COTS standard building blocks

Kontron bull svenfreudenfeldcakontroncom bull wwwkontroncom

Fo Sin Pnt

Fo Sin Pnt

TECHNOLOGY g BACkpLANES

Increasing demand for service and multimedia features is stimulating a growing need for speed in telecom-munications equipment While some

applications such as PBX systems can be addressed with the gigabit backplane technologies currently available others are running out of headroom Routers may soon need 10 Gbps and higher speed back-planes to keep up with network demand Many such applications can justify the expense of moving to higher performance if it becomes available

Currently telecom system designs offer backplanes that can handle interconnec-tions running as fast as 3125 Gbps raw data throughput per lane (with around a maxi-mum data rate capability of 5-625 Gbps per lane) The AdvancedTCA standard for instance uses Ethernetrsquos XAUI inter-face AdvancedTCA achieves a 10 Gbps net data rate by running four serial lanes for each interconnection with each lanersquos

SERrializerDESerializer (SERDES) op-erating at 3125 Gbps raw data (25 Gbs net)

As demand forces systems to move beyond these rates however new technologies will be needed One proposal calls for the use of XAUI+ or double XAUI which increases lane SERDES rates to 625 Gbps per lane and hence the throughput to 20 Gbps Another proposal is to use IEEE 8023ap known as 10GBASE-KR which runs a single SERDES lane at 125 Gbps raw data rate (103 Gbps net) But these are only short-term answers To address future demands organizations such as the Institute of Electrical and Electronic Engineers Standards Association (IEEE-SA) are developing specifications for Ethernet speeds of 40 Gbps to 100 Gbps which will be applied to backplane interconnect

Such high clock rates however will pose significant design challenges for developers

One of the first challenges that will need resolution is the design and layout of the backplane and other PCBs Common design practice today readily handles board clock rates of around 10 Gbps Well established design rules are in place and board layout tools such as autorouters can automatically handle board designs for speeds in the 10 Gbps range Designers may use specialized board material create additional ground planes and perform similar tasks in order to ensure proper board operation at the higher end but even speeds to 5 GHz are within current design tool capabilities

Design gets trickierAbove 5 GHz however board design gets more involved because feature dimensions become significant when compared to the signalrsquos wavelengths Variations in board thickness can affect signal propagation Corners where traces change direction and small spurs along edges of poorly etched

Channel characteristics

challenge backplane interoperability

Serial backplanes in telecommunications systems aim for high speed with room for

growth As systems began using 10 Gbps links however issues arose that affected backplane

communications among cards from different manufacturers Stuart points out that the

industry must define key backplane channel characteristics so that designs based on open

standards maintain interoperability as backplane speeds move to 40 Gbps and beyond

By Stuart JamieSon

Fo Sin Pnt

traces can act as antennae for the higher fre-quencies in digital signals As can be seen in Figure 1 sharp corners and minor flaws that are inconsequential at lower frequen-cies have the potential to become trouble-some antennae at future high speeds This can result in the trace radiating away the signalrsquos high frequency energy increasing EMI and crosstalk as well as altering signal waveforms New routing design rules such as making corners 30deg instead of 45deg and more careful board fabrication techniques may become necessary as designs move above the 10 Gbps per lane threshold

The move to higher frequencies will affect more than board fabrication and layout however Higher frequencies will also impose new requirements on signal tim-ing signal rise-time electrical distance and waveform shape if developers are to retain the mix-and-match system design approach that makes standards-based system design effective

For interoperability to be achievable at data rates above 10 Gbps organizations such as PICMG will need to carefully define a vari-ety of signal and design parameters in their specifications Some of the key parameters that will need consideration include

n Interconnect signal attenuationn Eye diagramn Jittern Input clock recoveryn Chip inputoutput pre-emphasis (PE) n Equalization (EQ)

Even slight variations in these parameters from device to device and lane to lane can shift the timing of signals a significant fraction of a clock cycle and affect the Bit Error Rate (BER) of a lanechannel Finally signal rise times will require tight control as signal rates increase in order to ensure control of system timing (see Figure 2)

In defining signal and design parameters specifications will also need to account for the increased location dependency that comes with higher frequencies Even subtle differences in attributes such as routing length and trace impedance become increasingly significant as signal speeds rise To ensure mix-and-match interopera-bility then design specifications may need to account for the specific backplane slot that a board is to occupy as well as introduce a method to obtain and control the PE and EQ of the devices connected to the lanes

Designers must also address fabrication standards The material used to fabricate

Figure 1

Figure 2

Fo Sin Pnt

the board the thickness and composition of metal cladding and the spacing between layers can all affect the trace characteris-tics Controlling these parameters under specification ensures that timing charac-teristics are sufficiently uniform from one board to another However current speci-fications are too detailed and stringent It is extremely difficult to attain compliance yet avoid adding cost to the design

Specifications need workSome of these parameters are already incorporated into current specifications The AMC module specifications from PICMG for instance include design parameters that ensure its proper opera-tion at signal speeds as fast as 125 Gbps per lane Establishing specifications for other system components will help achieve interoperability of standards-based designs at higher frequencies

Design tools may also need to be modified and the industry will need to create new design rules for high frequency and incor-porate these into the tools Developing new routing techniques will help avoid the issues of electrical phenomena such as skin effect dielectric loss and impedance mismatches These are much more preva-lent at higher frequencies and it becomes critical for engineers to model and simu-late these phenomena more accurately

Early efforts are already underway to address the challenges that higher fre-quency signals bring to standards-based design The Interconnect Channel Characterization Subcommittee of PICMG established in September 2006 is develop-ing ground rules and definitions to be used in characterizing transmission reflection and crosstalk performance in backplane and mezzanine carrier interconnects The committee aims to define the channel parameters to be measured or analyzed as well as the methods for doing so Its charter calls for it to address

n Definition of interfaces at which measurements are made or characteristics computed

n Test equipment fixtures and PCB test coupons

n Details of measurement proceduren Data formatsn Techniques for de-embedding

components of the channeln Techniques for validating

measurement based models ie passivity and causality

n Definitions that allow reasonable compliance testing

n Boundary definitions for different paths

n Define information regarding limita-tions or proper usage ie maximum data raterise times that are supported by the models

Such efforts are only a beginning how-ever Other design details still need to be addressed such as SERDES IO Configuration New functionality may need to be defined The design of high data rate system channel interfaces according to standardsspecifications does not currently cover the individual characteristics of the chip transmitterreceiver characteristics Thus work will be needed to address how such standard designs handle such dependency

Crossing an interoperability thresholdOne way of handling location dependen-cies might be to give the system control-ler the ability to inform modules what the channel transmitter and receiver PE and EQ technology is and importantly how to control it With this information along with the signal attenuation suffered (at a given bit rate) for the channel the system should be able to configure SERDES channels in different physical locations to run reliably and at the required BER In MicroTCA systems for instance this functionality could be incorporated into the MicroTCA Carrier Hub (MCH) as part of its electronic keying function Modules would have to be able to configure and control its backplane interfaces to allow for different positions

in the backplane An MCH (see Figure 3 courtesy Emerson) then would be able to instruct a module as to which parameters to use for interoperability

The specific approaches needed to handle location dependencies and other challenges that higher signal rates raise have yet to be developed The need to address these challenges however is clear Increasing demand for services is driving applications to utilize faster signal rates This in turn is driving backplane signaling speeds ever higher As speeds rise above 10 Gbps sig-nals will cross a threshold where current specifications will prove inadequate for ensuring interoperability among standards-based designs

The industry should begin developing new or enhanced specifications and design tools to address the challenges of higher signal rates Without such improvements the guarantees of interoperability that allow system developers to readily create solu-tions by combining off-the-shelf products will be compromised As backplane speeds approach 100 Gbps nothing can be taken for granted

Stuart Jamieson Director of Industry RelationsArchitect with Emerson Network Power Embedded Computing represents Emerson on PICMG committees and the SCOPE organization and previously served as a CP-TA Board member (Treasurer) He brings over 18 years of experience in hardware protocols embedded software and specification development to these groups Within Emerson he played a key role in the develop-ment of the technology central to Emersonrsquos bundled network-ing solutions Stuartrsquos positions within Emerson have included Director of Business Development Director of Advanced Technology and Architect He is the Draft Editor for the PICMG Interconnect Channel Characterization Subcommittee is the author of the introduction section for the new PICMG Ruggedized MicroTCA specification and served as the Draft Editor for the PICMG MicroTCA Specification Stuart gradu-ated from the Heriot-Watt University in 1989 with a 1st Class Honors degree in Electrical and Electronic Engineering and again in 1992 with an IBM-sponsored Master of Philosophy

Emerson Network Power Embedded ComputingStuartJamiesonEmersoncom bull wwwemersonembeddedcomputingcom

Figure 3

Fo Sin Pnt

TECHNOLOGY g BACkpLANES

2008

B A

N D

W I

D T

H

Signal integrity challenges to bandwidth scalabilityFor the purposes of this article each interconnected differential pair will be referred to as a Channel (which should not be confused with an aggregated AdvancedTCA channel comprising four trans-mit and four receive pairs)

14-slot full-mesh AdvancedTCA backplanes contain hundreds of Channels Each Channel is defined as the copper signal path from the output of a driver device to the input of a receiver device As

By douglaS Hynd

Developing IEEE 8023ap 10GBASE-KRcompliant backplanes

Why doesAdvancedTCA

need bandwidthscalability

PICMG AdvancedTCA 30 has emerged as the

industryrsquos Hardware Platform standard of choice and

is enjoying first-phase deployment However many

believe that for AdvancedTCA to realize its market

potential AdvancedTCA platforms need to seamlessly

scale to accommodate 40 GbE fabrics thereby

avoiding forklift upgrades as system bandwidth

demands increase over time A 40 GbE switch fabric

architecture would enable realization of a common

platform for computing storage control and media

and packet processing and provide the versatility and

long term ROI required by service providers in

todayrsquos increasingly competitive environment

The challenge was to develop a family of

AdvancedTCA products which feature PICMG 30

compliant dual star and full mesh advanced

backplane switch fabrics enabled up to 10 Gbps

per differential signal pair thereby giving 40 Gbps

per AdvancedTCA channel performance

This article describes the signal integrity challenges

presented in designing an IEEE 8023ap

10GBASE-KR-compliant bandwidth-scalable

14-slot AdvancedTCA platform and how these

challenges were overcome in development of full

mesh and dual star backplane reference designs

Fo Sin Pnt

shown in Figure 1 that signal path comprises a signal launch a blade PCB transmission line a daughtercard via a right-angled HM-ZD connector a mated HM-ZD backplane header a back-plane via a length of backplane PCB transmission line and then the same combination of connectors vias and transmission line at the receive end of the Channel

Sources of crosstalkFour principal sources of crosstalk in each Channel must be man-aged as shown in Table 2 Source number one is between adjacent differential pairs as they are routed across the backplane Common mode noise rejection in system differential pair structures makes this a minor issue The second source of crosstalk lies in the HM-ZD connector itself

Crosstalk in via fields our third source primarily arises from inductive coupling between adjacent differential pairs and domi-nates the crosstalk agenda in high-speed Channels This source of crosstalk is directly proportional to the length of the via barrel and where practical care must be taken to ensure that adjacent connector rows are terminated to different target routing Layers

The final source of crosstalk is caused by aggressor signals in through-routed via fields coupling with victim Channel traces as they pass through As mentioned earlier judicious and careful design can mitigate this impact

Skew Channel skew is a function of differential transmission path geometries At a fundamental frequency of 5 GHz skew can be a significant issue in high-speed system design due to narrowing the eye opening and increasing jitter Skew can have a significant impact on crosstalk it negatively impacts the common mode rejection of noise inherent to differential signaling Conductor surface roughness in lower performing dielectric materials can also cause skew in high-speed systems

Skew can be avoided through careful management of transmission path lengths in each Channel and by using higher-glass content (lower Dk) laminates

LossPotential

Potential Mismatches

Channel

Loss Potential Channel

PCB Tolerance -025 dB 2 -01 dB

Connector Tolerance -001 dB 4 -016 dB

Thru-routed Via Fields -001 dB 12 -144 dB

Connector Launch -025 dB+ 4 - 2 dB+

Quantity TotalNEXT

TotalFEXT

PCB Transmission Lines

24 in60 cm

-50 dB -70 dB

Connector Architecture 2 -26 dB -24 dB

Via Fields 4 -22 dB -20 dB

Connector Pass Through 8 -34 dB ndash34 dB

For the target application each one of these Channels must deliver a 10 Gbps Non-Return-To-Zero (NRZ) signal with sufficient signal fidelity to enable a receiver device to detect and process a differential signal The PICMG 30 specification is targeted at 3125 Gbps signaling with a fundamental frequency of 156 GHz Even in low loss dielectric materials insertion loss at 10 Gbps (5 GHz fundamental) is twice that of a 3125 Gbps signal

Therefore achieving acceptable signal fidelity requires careful management of signal losses and noise in each Channel such that an acceptable signal-to-noise (SN) ratio is achieved at the receiver

The design process therefore begins by understanding and mitigat-ing the sources of losses and noise in each Channel

Sources of lossThere are three sources of loss

n Conductor losses which are due to skin effects and can be addressed by maximizing the cross sectional area of the signal traces

n Material dispersion losses which are a function of the dielectric constants of the chosen material These can be mitigated by choosing a higher performance laminate material such as Nelco 4000-13SI or Megtron

n Reflected power loss due to impedance mismatches in the Channel as each signal transitions across the different copper media in each channel (connectors vias and PCB traces) and passes through the pad and anti-pad structures of the via fields of other backplane blade slots

Table 1 shows the relative effects of different sources of impedance mismatches The dominant source of impedance mismatches in every Channel resides in the via structures Successful mitigation of this problem requires that every via is tuned by back-drilling the stub and adjusting the pad and anti-pad structures to match the impedance to be 50 ohms irrespective of the target routing layer This in turn requires that the capacitive and inductive effects of the connector pin and via barrel combination are taken into account during the design of each Channel

Further complicating via design is the space the anti-pad structures need to accommodate Channels being routed between other blades while minimizing electro-magnetic coupling with them This space consideration makes the shape and orientation of pads and anti-pads extremely important

Figure 1

Table 1

Table 2

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IEEE 8023ap provides a design targetAs Ethernet has emerged as the industryrsquos dominant signaling methodology the IEEE has developed the 10GBASE-KR norma-tive Channel model to define interconnect Channel performance for NRZ signaling at 10 Gbps This standard defines acceptable performance in terms of S-parameter charts for through-Channel insertion loss and worst-case crosstalk Figures 2a and 2b illustrate masks for Draft 24 of the standard that was initially used for this exercise

In each case the mask defining compliant performance is shown in blue Channel insertion loss is shown in red in Figure 2a Crosstalk performance is defined by the ICR curve (Figure 2b) Minimum acceptable Channel performance is defined in the ICR chart (Figure 2b) by the blue line The effect of the sum of all aggressors on the through-Channel is shown in red The green ICR curve is the ratio of the crosstalk power sum calculated by summing the

magnitudes of any impacting crosstalk Channels for each fre-quency and using a straight line fit (using least-squares method) to determine the resulting average effect f the aggressors on the through-Channel This is then overlaid on the insertion loss and used to plot the ICR curve

This standard which has evolved through a variety of iterations forms the basis for developing a 40 GbE switch fabric backplane featuring 10 Gbps NRZ differential pairs If all differential pairs can meet this standard then the backplane can be considered to be 10GBASE-KR compliant

Applying 10GBASE-KR to a 14-slotAdvancedTCA applicationThe PICMG specification dictates that receive differential pairs are placed on the c-d and g-h rows of the HM-ZD connector and that transmit differential pairs are placed on the a-b and e-f rows Therefore the middle differential pair in row c-d of Slot B will be subject to the NEXT of three aggressors in each of the a-b and e-f transmit rows of slot B plus the FEXT of the signals being received in the c-d pairs in the top and bottom of slot B

In this topology it can be seen that worst-case crosstalk would occur if all the NEXT and FEXT aggressors were routed on the bottom Layer that is on the same Layer as that of the victim c-d However given that all signal vias must be back-drilled and tuned for impedance management purposes Channel crosstalk can simultaneously be reduced by allocating different routing Layers to differential pairs terminated in the same backplane connector

The principal factor in determining the feasibility of a 10GBASE-KR compliant backplane is based on understanding whether the Channel with the worst-case signal-to-noise ratio is compliant

The skew targets determine permissible layer separation between a-b c-d e-f and g-h pairs within each Channel and enable routing Layers to be allocated for each pair It is now possible to start the process of via tuning to optimize the channel performance for minimum insertion loss Modeling begins by defining the simulation boundaries for the channel so that Channel component models (PCB traces connectors vias) can easily be aggregated to model complete Channels Boundaries must be established at locations in the Channel where linear 3D structures exist These are shown in Figure 3 (next page)

Since the connector and via combinations for the backplane and daughtercard mating halves must each be treated as a whole it

PICMG 30Spec

TurboFabricSpec

Total Inter-PairSkew

(Fabric Interface)

05 mm in FR4(34 ps)

001 mmin N4000-13si

(00625 ps)

Total Intra-Channel Skew

(Fabric Interface)

254 mm in FR4(17 ps)

plusmn01 mmin N4000-13si

(0625ps)

Total Intra-Channel Skew

(Base Interface)

135 mm in FR4(90 ps)

plusmn01 mmin N4000-13si

(0625 ps)

Figures 2a and 2b

Table 3

Determining which Channel that is and identifying the worst-case SN requires making trade-offs with regard to PCB material Channel length via design connector row selection and NEXT and FEXT aggressor routing choices These trade-off choices can only take place using advanced 3D simulation tools such as Ansoft HFSS This was the essence of the design process employed in developing Simclarrsquos TurboFabric backplanes

The simulation processThe transmission length for full mesh and dual star backplanes design implementations varies from a maximum of 1632 inches to a minimum of 116 inches With an effective transmission length of 5 inches on each daughtercard this makes the longest effective Channel 2632 inches including two connectors

For a 10GBASE-KR application over this distance a high-perfor-mance laminate is essential for both reducing insertion loss and

ensuring high glass content in the weave to mitigate skew So the design process began by choosing a low-loss dielectric material (Nelco 4000-13SI for both the backplane and the daugh-tercards) and establishing targets for Inter-Pair and Intra-Channel skew as shown in Table 3

Adhering to the PICMG 30 specifi-cation for skew in a 10GBASE-KR application is impractical Instead a target of 00625 ps was set for Inter-Pair skew with 0625 ps set for Intra-Pair skew for the backplane only This equated to a maximum 001 mm differ-

ence being allowed between traces of any differential pair and 01 mm being permitted between traces of any four differential pairs in a Channel Given the topology of the HM-ZD connector daughter-card skew must be accounted for in the daughtercard layout Fo

Sin Pnt

should be noted that the simulation boundary is located within the mated connector

Tuning the connector and via structures to 50Ω is an iterative process involving the removal of excess pads back-drilling and tuning pads anti-pads and traces A Time Domain Reflectometer (TDR) plot illustrating the results of the tuning process is shown in Figure 4

Upon completion of the modeling process a total of 17 different optimized via and routing configurations had been designed for the full mesh design and nine for the dual star design

A plot of worst-case insertion loss is shown in Figure 5 and demonstrates that in both cases performance is well above the 10GBASE-KR mask

When all the through-Channels have been modeled adjacent Channel models can be combined and ICR curves plotted to evaluate the impact of crosstalk on through-Channel performance This valuable information can be used to adjust the position of signal Layers relative to pass-through aggressor traces on adjacent Layers or to reroute traces to reduce crosstalk Similarly routing Layers can be changed to reduce crosstalk in adjacent via barrels

Figure 6 plots worst-case ICR and demonstrates that performance is above the 10GBASE-KR mask Based on this result it was possible to proceed to physical implementation

Figure 3

Figure 4

Fo Sin Pnt

Physical realizationThe layout process was performed using the Mentor Board-Station CAD system Quad-routing (routing four traces between pads) was explored as a routing method-ology in order to reduce Layer count but this was dismissed due to the detrimental impact on crosstalk performance

The attributes of the physical backplanes produced as a result of the design effort are shown in Table 4

The design files produced included the usual gerber files plus detailed back-drilling instructions

The design validation process comprised a conventional continuity test followed by performance testing featuring Agilent equipment including 70340A signal generator 8720ES Network Analyzer NN18A S-Parameter test-set and 86100A sampling oscilloscope with Agilent 86112A module Figure 7 (next page) shows the test set up

Simclar developed special line cards to enable through-Channel measurements with and without crosstalk The signal launch featured compression mount SMAs terminated in a tuned via structure The Channel simulations included simu-lation of the tuned launch structures so de-embedding of the launches was not necessary for correlation to simulation purposes The development team also established a process for characterization of all Channels

Full Mesh Dual Star

Layer Count 34 18

Aspect Ratio 121 61

Tuned Vias 3952 768

Material Nelco 4000-13SI

Table 4

Figure 5 Figure 6

Fo Sin Pnt

In Figure 8 measured through-Channel performance and ICR curves are shown for the same Channels described in the simula-tion section earlier

As can be seen from Figure 8 there is close correlation between these and the simulated plots in Figures 5 and 6 In fact close correlation between all simulated and measured results was achieved resulting in a 728 Tbps capacity full mesh and a 960 Gbps capacity dual star backplane design now generally available as part of the Simclar TurboFabric shelf

Figure 7 Figure 8

Figure 9

Figure 10

Implications of 10GBASE-KR Draft 33versus Draft 25The work described above was targeted towards meeting the Channels specifications contained in Draft 25 of the IEEE 10GBASE-KR Since this work was completed the IEEE has up-issued the Draft revision level for the Standard from 25 to 33 While this has not impacted through-Channel performance demands it has increased Channel isolation requirements by around 10 dB In Figure 9 a Draft 33 mask is added to the ICR plot shown in Figure 8

From Figure 9 it can be seen how Draft 33 pulls the mask above the Channel ICR curve for this full mesh backplane Channel Surprisingly it is the Channelrsquos frequency response at relatively low frequencies between 100-500 MHz that is causing a problem The reasons for this are currently the subject of further detailed investigation

However Figure 10 shows a Draft 33 plot for a less demanding dual star AdvancedTCA implementation featuring shorter trans-mission distances This plot demonstrates compliance to Draft 33 of the IEEE 8023ap 10GBASE-KR Standard

ConclusionBy developing a close understanding of the many factors contrib-uting to loss and noise in multi-gigabit backplane Channels it is possible to characterize their performance using advanced simula-tion techniques and correlate that performance in physical prod-ucts using advanced test methods By overlaying the test results on S-Parameter masks defined by the IEEE 8023ap 10GBASE-KR Standard it has been demonstrated that backplanes that truly enable AdvancedTCA scalability are at last a reality

Douglas Hynd joined Simclar Group in 2006 as Director of Marketing as part of Simclarrsquos acquisition of Northrop Grumman Interconnect Technologies Division wherehe was Vice President of Marketing and Sales He has more than 24 yearsrsquo experience intechnology sales marketing and generalmanagement and holds a BSc (Eng) in Electronics and Electrical Engineeringfrom the University of Glasgow He isbased at Simclarrsquos Global HQ inDunfermline Scotland

Simclar Groupdouglashyndsimclarcom bull wwwsimclarcom

Fo Sin Pnt

6U CompactPCIPrOduCT GuIdE g

This monthrsquos issue includes a 6U CompactPCI Product Guide and Irsquod like to take the opportunity to reflect a bit on the success and evolution of that technology

Back in the 1994 time frame when CompactPCI was first being devel-oped it began as 3U-only technology It used the same Eurocardmechanics that were popularized by VME and an IEC standardized high-

density high-speed connector available from a number of vendors suitablefor 33 MHz PCI signaling That connector was selected by the engineers atZiatech with help from Mike Munroe then at ERNI The majority of VMEdesigns were 6U and based on this I was among a number of folks thatargued for adding the 6U CompactPCI form factor

The 6U form factor presented some challenges and opportunities Onechallenge was that the insertion and extraction forces were quite high when the entire rear of the card was populated with connectors Fortunately the IEEE standards for Eurocards evolved and injectorejector handles that pro-vided leverage became available Eike Waltz then at Rittal was instrumental in bringing that to the table Two of the opportunities that came along withthe extra connectors were a clean way to add secondary buses like the H110 telephony bus to the backplane and the ability to route IO out the rear through rear transition modules PICMG has developed quite a number of subsidiary specifications defining the interoperable use of the extra backplane pins made possible with the 6U form factor Both of these features have played a major part in CompactPCIrsquos success The next major evolution of 6U CompactPCI came with the PICMG 216 Packet Switched Backplane standard which was originally conceived by John Peters and his team at Performance Technologies PICMG 216 interconnected a shelf full of CompactPCI single board computers via redundant Ethernet switches also in the 6U CompactPCI form factor This dramatically increased usable backplane bandwidth and provided redundancy PICMG 216 paved the way for AdvancedTCA and was the industryrsquos first open standard for the switched serial interconnect standards we see popping up in many places

By Joe Pavlat

Looking back and ahead at6U CompactPCI

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Recent 6U CompactPCI related products are listed here For more informationenter the productrsquos RSC No at wwwcompactpci-systemscomrsc

cPCI-6910Dual-core Intel Xeon Processor LVULV Universal blade bull Supports Single Dual-Core Intel Xeon LV or ULV processorsbull Front Side Bus 667 MHz bull Up to 2 GB DDR2 400 MHz soldered SDRAM with ECC bull Four PCI Express GbEbull Up to 4 USB 20 ports bull PICMG 20 21 29 216 compliant

RSC No 35013

ADLINK Technologywwwadlinktechcom

CPCIStor Module6U CompactPCI storage blade bull Onboard ATA controller supports CDDVD HDD and solid-state flashbull Supports Hot Swap Removal (ask about RAID support) bull ATA disks available in Enhanced Dutycycle versions for NEBS Level 3 - 724 requirements bull Operating Systems supported VxWorksLinux and Windows

RSC No 34800

ACTTechnicowwwacttechnicocom

Prosody X cPCI E1T1An E1T1 digital network access card bull Suits telco developers and systems integrators bull Uses Aculabrsquos worldwide protocol coverage including Aculabrsquos SS7 stack available under a cost free license bull Available with 8 or 16 E1T1 trunks and software selectable E1T1 interfaces bull Flexible mix of protocols including ISDN CAS and SS7 (ITU-T China and ANSI) bull A variety of interconnect switching and protocol conversion solutions can be readily crafted bull High availability reliability and scalability with industry standard hardw re and software interoperability bull Up to 128 SS7 signaling links bull Non-circuit related (TCAP) messagingintensive applications such as prepaid and SMS

RSC No 35408

Aculabwwwaculabcom

Adexp8021Intel Core Duo L2400 (166 GHz) w E7520 server chipset bull Dual channel PC2-3200 Registered RAM SECDED or x4 SDDC bull Two GbE two Serial ATA four USB 20 bull Onboard SXGA graphics 1280 x 24-bitbull 6U CompactPCI Bus PICMG EXP0 R10 Specification bull RoHS compliant 0 degC to +55 degC operating range

RSC No 32837

Advanet Incwwwadvanetcojpen

TC84012 channel single-stop Time-to-Digital Converter (TDC) with single-start and multi-start acquisition modes bull 50 ps timing resolution bull Wide range with upto 20 s between first and last events bull Large internal memory buffer with up to 512 hits per channel bull Low jitter (lt3 ps rms) high stability (plusmn2 ppm) internalclock source bull External 10 MHz reference input bull FPGA based Data Processing Unit (DPU) bull Fast readout with DMA mode for increased data throughputbull Overvoltage-protected inputs with 50 Ω K-Lock (LEMO) connectors bull Built-in self calibration bull Modular single-slot 6U PXICompactPCI standardbull Low power consumption (lt22 W)

RSC No 33445

Agilent-Acqiriswwwacqiriscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

MIC-30428-slot 6U CompactPCI backplane bull AC or DC CompactPCI 500 W + 250 W redundant(2+1) power supplies bull PICMG 216 (CompactPCI Packet Switching Backplane) compliancebull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarmmodule (MIC-3924L-AE)

RSC No 32851

MIC-30436-slot 6U CompactPCI backplane bull Supports two hot-swappable SCSISATA or removableIDE HDD bays bull Built-in IDE slim-type DVD-ROM bull AC or DC CompactPCI 250 W + 250 Wredundant (1+1) power supplies bull Supports hot-swappable fan modules bull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarm module (MIC-3924L-AE)

RSC No 32850

Advantech Corporationwwwadvantechcom

Dual-Core Xeon CompactPCI SBCModel PP 42123x bull Dual CPU 6U CompactPCI SBC supporting two dual-core Xeon CPUs bull Up to 8 GB DDR2 ECC SDRAM in a single system or peripheralslot bull Dual processor SBC in a single 6U CompactPCI slot bull Supports two 166 GHz Dual-Core Intel Xeon ULV processors using Intel E7520 server chipsetbull Up to 8 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull PMCXMC site support 66 MHz PCI-X and x8 PCI Express bull Front and rear IO bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade bull Four GbE ports with option for PICMG 216

RSC No 34761

6U CompactPCI Core 2 Duo SBCModel PP 41203x bull 6U CompactPCI Core 2 Duo SBC supporting two PMC sites includingone XMC site bull Up to 4 GB DDR2 ECC SDRAM bull All in a single system or peripheral slot bull TwoPMC sites supporting up to 100 MHz PCI-X bull One XMC x8 PCI Express bull Front and rear IObull Supports 216 GHz or 15 GHz Intel Core 2 Duo processors bull Intel E7520 server chipsetbull Up to 4 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade

RSC No 34763

PP 30202xTwo processor versions available bull 18 GHz Intel Pentium M processor 745 uses mFC-PGA 478 (micro Flip-Chip Pin Grid Array) package bull 14 GHz Intel Pentium M processor Low Voltage 738uses mFC-BGA 479 (micro Flip-Chip Ball Grid Array) package bull 64 KB primary (L1) on-die cache2 MB of secondary (L2) on-die cache bull 400 MHz Front Side Bus (FSB) bull No CPU fan bull 16 GHz processor version (1 MB L2 cache) available see PP 30002x datasheet bull Utilizes 64-bitIntel 855GME chipset bull Supports 400 MHz bus frequency bull Uses Intel 6300ESB IO Controller Hub

RSC No 32659

Concurrent Technologies Incwwwgocctcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cCIBPMC6U-ETA 6U bridged dual PMC carrier that bridges extended temperature CompactPCI boards and PMCs bull Features a rugged CompactPCI form factor providing increased flexibility to military communications systems designers bull Provides additional design choices to users through its differing bus speeds maximizing the numberof PMCs that can be used CompactPCI andPMC buses can both run at 66 or 33 MHzbull Operating temperature range of -40 degC to+85 degC bull Signal conditioning bull DMA supportbull Low-power design +5 V +33 V +12 V -12 V bull User-selectable VIO of 33 V or 5 V to the PMC

RSC No 32891

Dynamic Engineeringwwwdynengcom

cPCI4IP-MMMinimized PCI address footprint IndustryPack carrier for CompactPCI applications bull 6U 4HP4 IP positions 832 clock selection for each slot fused filtered power IO options bull ID INT IO and Mem spaces are decoded for each IP slotbull Single and double wide IPrsquos bull 16- and 32- bit IPs bull 32-bit access to 16-bit IPs bull Full or mini-mized Memory Space decoding for 18 the PCI address requirement bull With the cPCI4IP-MM option 8 CompactPCI 4IP cards take the same PCI address space as 1 full Mem Space card

RSC No 34905

ACQ132CPCI32 channel MHz class simultaneous sampling intelligent digitizer bull 32 simultaneous analoginput channels 2-32 MSpschannel 14-bit resolution bull Differential inputs bull Intelligent cardwith 1 gigabyte memory and GbE on board bull Large distributed FPGA resource on boardbull Range of DSP functions including FIR filtering and Digital Downconverter

RSC No 35482

D-TACQ Solutions Ltdwwwd-tacqcouk

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CR11Based on the Intel Core Duo Processor the platform is designed to support processor speeds from 106 GHz up to 20 GHz bull Intel Core 2 Duo runs at 15 GHz up to 20 GHz bull Conduction cooled bull Two PMC slots bull PCI Express bull 2x GbE

RSC No 33156

ICS-72532-channel 6U CompactPCI DAC board bull 6U CompactPCI data acquisition card bull 32 differential output channels bull 16 or 24-bit sample size bull 288 kHzch data rate bull Simultaneous sampling across all channels on single or multiple boards bull 32 separate delta-sigma DACs bull 64-bit 66 MHz CompactPCI PICMG 20 Rev30 hot-swappable bull FPDP II 400 MBps interface

RSC No 33576

ICS-71032-channel 6U CompactPCI ADC board bull 6U CompactPCI data acquisition card bull 32 differential input channels bull 216 KHzch 24-bit resolution bull Software selectable full scale input bull FPDP II 400 MBpsinterface bull 64-bit 66 MHz CompactPCI PICMG 20 Rev 30 hot swappable bull 32 synchronous boards for simultaneous sampling bull Sonar acoustics and test and measurement applications

RSC No 33578

Tsumani 6U CPCI Development KitFPGA processor solution targeted at high performance software defined radio applications bull Dual Stratix EP1S80 FPGAs are tightly coupled to provide apower platform for signal processing bull Two PMC module sites provide IO connectivity to either front panel or back panel connections bull A direct highbandwidth 1 GBps path from the PMC P4 connector directly to the FPGAs bull Model 919 Dual DAC Mezzanine provides broadband analog signal generationin a compact form bull The board features two independent DAC channels each with its own 12-bit LVDS input capable of running at rates up to 160 MHz

RSC No 32026

CP11Rugged 6U SBC bull Up to 4 GB of DDR2 SDRAM (200 MHz) with enhanced ECC four independent onboard PCI buses system host and peripheral modesupport for the CompactPCI backplane two PMC interfaces (64-bit133 MHz and 32-bit33 MHz) bull Instead of the PMC1 a PCI Express based XMC interface is available on request bull Two GbE one Fast Ethernet two serial interfaces (RS-232 or RS-422485) USB 20 integrated HDD or flash drive bull High performance 2D3D ATI video controller capable of driving two displays in parallel supports VGADVI interface bull Intel Core 2 Duo at 216 GHz Intel Core Duo at 20 GHz2x PMC expansion site bull One XMC optional bull Up to 4 GB DDR2 SDRAM wECC 2x GbE

RSC No 33447

GE Fanuc Intelligent Platforms Incwwwgefanucembeddedcom

Single Board ComputersGD Canada designs and manufactures conduction-cooled Single Board Computers (SBCs)using Intel processors bull 6U and 3U form factors for CompactPCI backplanes bull Fully backward compatible with earlier models bull Upgradeable via the change-out of processor memory andIO modules bull Used within GD Canada computer systems and sold as individual products

RSC No 35281

General Dynamicswwwgdcanadacom

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PrOduCT GuIdE6U CompactPCI

cPCI6U-24DSI32R32-channel 24-bit delta-sigma CompactPCI 6U analog input board with rear IO bull Low noise 24-bit resolution low phase distortion andmulti-board synchronization bull Suits state-of-the-art sonar and noise monitoring applications bull 32-channel cPCI6U-24DSI32 analog input boardprovides a high-density 24-bit analog input resources on a standard 6U CompactPCI expansion board bull Applications from precision voltagemeasurements to complex audio signal and waveform analysis

RSC No 34985

General Standards Corporationwwwgeneralstandardscom

Duet 3U 64-bit 1 GHz TMS320C6416 DSP (x2) 64 MB SDRAM per processor bull Flexible internalexternalcommunication mesh bull 64-bit66 MHz CompactPCI bull PMCXMC site with Jn4 to FPGA and4 RocketIO per VITA 42 bull External data port up to 12 Gbps bull 4M or 5M Virtex-II Pro FPGAbull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM dedicated800 MBps links between DSPs bull 3U CompactPCI with PXI support bull Suits high-end co-processing wireless broadband communications RADAR video and biometrics

RSC No 32856

QuadiaQuad-DSP bull Dual FPGA bull Dual PMC sites bull Inter-processor connectivity and access to external interfaces bull Four C6416 DSPs split in two independent clusters each hosting a PMC site bull One large FPGA for end-user code bull Central FPGA routing interprocessor communication bull End-user FPGA communication bull External port serial IO for PCIe or other p ivate link bull Global memoryand PCI interface bull 1 GHz TMS320C6416 DSP (x4) bull 64 MB SDRAM per processor bull Flexible internalexternal communication mesh bull 64-bit66 MHz CompactPCI bull Two PMC sites with Jn4 to FPGA bull External data port up to 12 Gbps bull Two 4M Gate FPGA reserved for end-user code bull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM bull Up to 512 MB Global DDR SDRAM bull Suits high-end co-processing wireless and broadband communications

RSC No 34737

Quixote 64-bit 6UAdvanced signal capture generation and co-processing bull 1 GHz TMS320C6416 DSP and2 to 6 MGATE Virtex-II FPGA bull 32 MB SDRAM 8 MB ZBT SBSRAM and AD6645 and AD9764 converters bull 6432 bit CompactPCI 66 MHz 5 V33 V and complex trigger modes with HW event logging bull PMC site with Jn4 to FPGA DIO and PICMG 217 StarFabric compliant bull Suits Software Defined Radio wireless IP and RADAR development and hardware testing bull Physical Layer field testing ultra-fast flexible data acquisition vector signal generation and electronic warfare

RSC No 32861

Innovative Integrationwwwinnovative-dspcom

IC-e6-cPCIbHigh performance 6U CompactPCI board bull Powered by one or two of Freescalersquos mostadvanced 14 GHz MPC7448 PowerPC processors bull PICMG 216 compliant bull Marvell Discovery III chipset (MV64460) bull Low power consumption bull Standard extended and rugged grades

RSC No 32982

Interface Conceptwwwinterfaceconceptcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CP213Single-width 6U CompactPCIPXI module with either 32 or 64 differential analog input channelsbull 32 64 or 128 channels of analog input bull 16 multifunction digital IO (TTL) channels that may beconfigured as digital in digital out or selectively attached to 2 frequency in 2 counter in andor 2 timerout channels bull 16-bit resolution bull Programmable gain per channel programmable scan rates of lt1 Ss through 100 KSs bull Precision onboard reference for end-to-end calibration

RSC No 34804

KineticSystems Company LLCwwwkscorpcom

CP6001Energy efficient embedded Intel dual core processors bull 12 GHz Intel Core Duo U2500 ULV processor bull Intel Core 2 Duo L7400 LV processor bull Based on the Intel Mobile 945GM chipset with a front side bus of up to 667 MHz and ICH7-R Southbridge bull Two independent digital video outputs to the rear IO (2x DVI - 1x DVI and 1x HDMI) bull AC97 audio capabilities bull 3 x GbE bull 4 x SATA with RAID 01510 functionality bull 6 x USB 20 2 x COM and VGA or DVI bull Can also accommodate a PMC slot or an onboard 25 inch SATA HDD bull Up to 8 GB of USB or 2 GB soldered flash bull Supports Linux Windows XP XP embedded and VxWorks 6

RSC No 34182

CP6923 GbE Switch6U CompactPCI GbE Switch PICMG 216 compliant bull Leading edge te hnology basedon BCM5650X chip bull 24x GbE ports bull Non-blocking Layer 2 and 3 switching and routingbull Copper optical rear IO version bull Hot swap IPMI bull Fully managed bull Comprehensive firmware package bull Applies to VoIP installations such as call servers media gatewaysand trunking gateways in wireline and wireless networks as well as VoIP systems inenterprise networks with high demands on performance

RSC No 32256

Kontronwwwkontroncom

TMS320C6701 Virtex-IITexas Instrumentsrsquo C6701 DSP bull Xilinx Virtex-II series FPGA up to XC2V8000 bull Multiple IO interfaces Onboard CODEC VIM expansion sites 60-pin GPIO header and JTAG bull Hardware drivers integration in SimulinkXilinx System Generator Blocksets for quick implementation of Simulink models bull DSP and FPGA-in-the-loop cosimulation of SimulinkXilinx System Generator models bull Leading edge communication interface allowing real-time datamonitoring from Simulink scopes and remote operations

RSC No 32028

VHS-DACHigh performance multichannel DA for phased array antenna systems radarsonar communications receiversup-sampling to IF stage and RFIF AGC apps bull Eight 125 MSPS output channels bull Optional add-on daughter boardprovides 8 additional output channels or 8 additional input channels bull 32-bit 25 MHz bull FPDP interface with 400 MBps transfer rate (25 MSPS per channel at 8 channels 125 MSPS at 16 channels) bull Low level hardware drivers API andGUI bull High level hardware drivers integration in Simulink Blocksets bull Leading edge communication interface fordata recording and playback tofrom the onboard SDRAM

RSC No 32029

Lyrtechwwwlyrtechcom

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PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

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PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

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SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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Fo Sin Pnt

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Page 20: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

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TECHNOLOGY g BACkpLANES

Increasing demand for service and multimedia features is stimulating a growing need for speed in telecom-munications equipment While some

applications such as PBX systems can be addressed with the gigabit backplane technologies currently available others are running out of headroom Routers may soon need 10 Gbps and higher speed back-planes to keep up with network demand Many such applications can justify the expense of moving to higher performance if it becomes available

Currently telecom system designs offer backplanes that can handle interconnec-tions running as fast as 3125 Gbps raw data throughput per lane (with around a maxi-mum data rate capability of 5-625 Gbps per lane) The AdvancedTCA standard for instance uses Ethernetrsquos XAUI inter-face AdvancedTCA achieves a 10 Gbps net data rate by running four serial lanes for each interconnection with each lanersquos

SERrializerDESerializer (SERDES) op-erating at 3125 Gbps raw data (25 Gbs net)

As demand forces systems to move beyond these rates however new technologies will be needed One proposal calls for the use of XAUI+ or double XAUI which increases lane SERDES rates to 625 Gbps per lane and hence the throughput to 20 Gbps Another proposal is to use IEEE 8023ap known as 10GBASE-KR which runs a single SERDES lane at 125 Gbps raw data rate (103 Gbps net) But these are only short-term answers To address future demands organizations such as the Institute of Electrical and Electronic Engineers Standards Association (IEEE-SA) are developing specifications for Ethernet speeds of 40 Gbps to 100 Gbps which will be applied to backplane interconnect

Such high clock rates however will pose significant design challenges for developers

One of the first challenges that will need resolution is the design and layout of the backplane and other PCBs Common design practice today readily handles board clock rates of around 10 Gbps Well established design rules are in place and board layout tools such as autorouters can automatically handle board designs for speeds in the 10 Gbps range Designers may use specialized board material create additional ground planes and perform similar tasks in order to ensure proper board operation at the higher end but even speeds to 5 GHz are within current design tool capabilities

Design gets trickierAbove 5 GHz however board design gets more involved because feature dimensions become significant when compared to the signalrsquos wavelengths Variations in board thickness can affect signal propagation Corners where traces change direction and small spurs along edges of poorly etched

Channel characteristics

challenge backplane interoperability

Serial backplanes in telecommunications systems aim for high speed with room for

growth As systems began using 10 Gbps links however issues arose that affected backplane

communications among cards from different manufacturers Stuart points out that the

industry must define key backplane channel characteristics so that designs based on open

standards maintain interoperability as backplane speeds move to 40 Gbps and beyond

By Stuart JamieSon

Fo Sin Pnt

traces can act as antennae for the higher fre-quencies in digital signals As can be seen in Figure 1 sharp corners and minor flaws that are inconsequential at lower frequen-cies have the potential to become trouble-some antennae at future high speeds This can result in the trace radiating away the signalrsquos high frequency energy increasing EMI and crosstalk as well as altering signal waveforms New routing design rules such as making corners 30deg instead of 45deg and more careful board fabrication techniques may become necessary as designs move above the 10 Gbps per lane threshold

The move to higher frequencies will affect more than board fabrication and layout however Higher frequencies will also impose new requirements on signal tim-ing signal rise-time electrical distance and waveform shape if developers are to retain the mix-and-match system design approach that makes standards-based system design effective

For interoperability to be achievable at data rates above 10 Gbps organizations such as PICMG will need to carefully define a vari-ety of signal and design parameters in their specifications Some of the key parameters that will need consideration include

n Interconnect signal attenuationn Eye diagramn Jittern Input clock recoveryn Chip inputoutput pre-emphasis (PE) n Equalization (EQ)

Even slight variations in these parameters from device to device and lane to lane can shift the timing of signals a significant fraction of a clock cycle and affect the Bit Error Rate (BER) of a lanechannel Finally signal rise times will require tight control as signal rates increase in order to ensure control of system timing (see Figure 2)

In defining signal and design parameters specifications will also need to account for the increased location dependency that comes with higher frequencies Even subtle differences in attributes such as routing length and trace impedance become increasingly significant as signal speeds rise To ensure mix-and-match interopera-bility then design specifications may need to account for the specific backplane slot that a board is to occupy as well as introduce a method to obtain and control the PE and EQ of the devices connected to the lanes

Designers must also address fabrication standards The material used to fabricate

Figure 1

Figure 2

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the board the thickness and composition of metal cladding and the spacing between layers can all affect the trace characteris-tics Controlling these parameters under specification ensures that timing charac-teristics are sufficiently uniform from one board to another However current speci-fications are too detailed and stringent It is extremely difficult to attain compliance yet avoid adding cost to the design

Specifications need workSome of these parameters are already incorporated into current specifications The AMC module specifications from PICMG for instance include design parameters that ensure its proper opera-tion at signal speeds as fast as 125 Gbps per lane Establishing specifications for other system components will help achieve interoperability of standards-based designs at higher frequencies

Design tools may also need to be modified and the industry will need to create new design rules for high frequency and incor-porate these into the tools Developing new routing techniques will help avoid the issues of electrical phenomena such as skin effect dielectric loss and impedance mismatches These are much more preva-lent at higher frequencies and it becomes critical for engineers to model and simu-late these phenomena more accurately

Early efforts are already underway to address the challenges that higher fre-quency signals bring to standards-based design The Interconnect Channel Characterization Subcommittee of PICMG established in September 2006 is develop-ing ground rules and definitions to be used in characterizing transmission reflection and crosstalk performance in backplane and mezzanine carrier interconnects The committee aims to define the channel parameters to be measured or analyzed as well as the methods for doing so Its charter calls for it to address

n Definition of interfaces at which measurements are made or characteristics computed

n Test equipment fixtures and PCB test coupons

n Details of measurement proceduren Data formatsn Techniques for de-embedding

components of the channeln Techniques for validating

measurement based models ie passivity and causality

n Definitions that allow reasonable compliance testing

n Boundary definitions for different paths

n Define information regarding limita-tions or proper usage ie maximum data raterise times that are supported by the models

Such efforts are only a beginning how-ever Other design details still need to be addressed such as SERDES IO Configuration New functionality may need to be defined The design of high data rate system channel interfaces according to standardsspecifications does not currently cover the individual characteristics of the chip transmitterreceiver characteristics Thus work will be needed to address how such standard designs handle such dependency

Crossing an interoperability thresholdOne way of handling location dependen-cies might be to give the system control-ler the ability to inform modules what the channel transmitter and receiver PE and EQ technology is and importantly how to control it With this information along with the signal attenuation suffered (at a given bit rate) for the channel the system should be able to configure SERDES channels in different physical locations to run reliably and at the required BER In MicroTCA systems for instance this functionality could be incorporated into the MicroTCA Carrier Hub (MCH) as part of its electronic keying function Modules would have to be able to configure and control its backplane interfaces to allow for different positions

in the backplane An MCH (see Figure 3 courtesy Emerson) then would be able to instruct a module as to which parameters to use for interoperability

The specific approaches needed to handle location dependencies and other challenges that higher signal rates raise have yet to be developed The need to address these challenges however is clear Increasing demand for services is driving applications to utilize faster signal rates This in turn is driving backplane signaling speeds ever higher As speeds rise above 10 Gbps sig-nals will cross a threshold where current specifications will prove inadequate for ensuring interoperability among standards-based designs

The industry should begin developing new or enhanced specifications and design tools to address the challenges of higher signal rates Without such improvements the guarantees of interoperability that allow system developers to readily create solu-tions by combining off-the-shelf products will be compromised As backplane speeds approach 100 Gbps nothing can be taken for granted

Stuart Jamieson Director of Industry RelationsArchitect with Emerson Network Power Embedded Computing represents Emerson on PICMG committees and the SCOPE organization and previously served as a CP-TA Board member (Treasurer) He brings over 18 years of experience in hardware protocols embedded software and specification development to these groups Within Emerson he played a key role in the develop-ment of the technology central to Emersonrsquos bundled network-ing solutions Stuartrsquos positions within Emerson have included Director of Business Development Director of Advanced Technology and Architect He is the Draft Editor for the PICMG Interconnect Channel Characterization Subcommittee is the author of the introduction section for the new PICMG Ruggedized MicroTCA specification and served as the Draft Editor for the PICMG MicroTCA Specification Stuart gradu-ated from the Heriot-Watt University in 1989 with a 1st Class Honors degree in Electrical and Electronic Engineering and again in 1992 with an IBM-sponsored Master of Philosophy

Emerson Network Power Embedded ComputingStuartJamiesonEmersoncom bull wwwemersonembeddedcomputingcom

Figure 3

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TECHNOLOGY g BACkpLANES

2008

B A

N D

W I

D T

H

Signal integrity challenges to bandwidth scalabilityFor the purposes of this article each interconnected differential pair will be referred to as a Channel (which should not be confused with an aggregated AdvancedTCA channel comprising four trans-mit and four receive pairs)

14-slot full-mesh AdvancedTCA backplanes contain hundreds of Channels Each Channel is defined as the copper signal path from the output of a driver device to the input of a receiver device As

By douglaS Hynd

Developing IEEE 8023ap 10GBASE-KRcompliant backplanes

Why doesAdvancedTCA

need bandwidthscalability

PICMG AdvancedTCA 30 has emerged as the

industryrsquos Hardware Platform standard of choice and

is enjoying first-phase deployment However many

believe that for AdvancedTCA to realize its market

potential AdvancedTCA platforms need to seamlessly

scale to accommodate 40 GbE fabrics thereby

avoiding forklift upgrades as system bandwidth

demands increase over time A 40 GbE switch fabric

architecture would enable realization of a common

platform for computing storage control and media

and packet processing and provide the versatility and

long term ROI required by service providers in

todayrsquos increasingly competitive environment

The challenge was to develop a family of

AdvancedTCA products which feature PICMG 30

compliant dual star and full mesh advanced

backplane switch fabrics enabled up to 10 Gbps

per differential signal pair thereby giving 40 Gbps

per AdvancedTCA channel performance

This article describes the signal integrity challenges

presented in designing an IEEE 8023ap

10GBASE-KR-compliant bandwidth-scalable

14-slot AdvancedTCA platform and how these

challenges were overcome in development of full

mesh and dual star backplane reference designs

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shown in Figure 1 that signal path comprises a signal launch a blade PCB transmission line a daughtercard via a right-angled HM-ZD connector a mated HM-ZD backplane header a back-plane via a length of backplane PCB transmission line and then the same combination of connectors vias and transmission line at the receive end of the Channel

Sources of crosstalkFour principal sources of crosstalk in each Channel must be man-aged as shown in Table 2 Source number one is between adjacent differential pairs as they are routed across the backplane Common mode noise rejection in system differential pair structures makes this a minor issue The second source of crosstalk lies in the HM-ZD connector itself

Crosstalk in via fields our third source primarily arises from inductive coupling between adjacent differential pairs and domi-nates the crosstalk agenda in high-speed Channels This source of crosstalk is directly proportional to the length of the via barrel and where practical care must be taken to ensure that adjacent connector rows are terminated to different target routing Layers

The final source of crosstalk is caused by aggressor signals in through-routed via fields coupling with victim Channel traces as they pass through As mentioned earlier judicious and careful design can mitigate this impact

Skew Channel skew is a function of differential transmission path geometries At a fundamental frequency of 5 GHz skew can be a significant issue in high-speed system design due to narrowing the eye opening and increasing jitter Skew can have a significant impact on crosstalk it negatively impacts the common mode rejection of noise inherent to differential signaling Conductor surface roughness in lower performing dielectric materials can also cause skew in high-speed systems

Skew can be avoided through careful management of transmission path lengths in each Channel and by using higher-glass content (lower Dk) laminates

LossPotential

Potential Mismatches

Channel

Loss Potential Channel

PCB Tolerance -025 dB 2 -01 dB

Connector Tolerance -001 dB 4 -016 dB

Thru-routed Via Fields -001 dB 12 -144 dB

Connector Launch -025 dB+ 4 - 2 dB+

Quantity TotalNEXT

TotalFEXT

PCB Transmission Lines

24 in60 cm

-50 dB -70 dB

Connector Architecture 2 -26 dB -24 dB

Via Fields 4 -22 dB -20 dB

Connector Pass Through 8 -34 dB ndash34 dB

For the target application each one of these Channels must deliver a 10 Gbps Non-Return-To-Zero (NRZ) signal with sufficient signal fidelity to enable a receiver device to detect and process a differential signal The PICMG 30 specification is targeted at 3125 Gbps signaling with a fundamental frequency of 156 GHz Even in low loss dielectric materials insertion loss at 10 Gbps (5 GHz fundamental) is twice that of a 3125 Gbps signal

Therefore achieving acceptable signal fidelity requires careful management of signal losses and noise in each Channel such that an acceptable signal-to-noise (SN) ratio is achieved at the receiver

The design process therefore begins by understanding and mitigat-ing the sources of losses and noise in each Channel

Sources of lossThere are three sources of loss

n Conductor losses which are due to skin effects and can be addressed by maximizing the cross sectional area of the signal traces

n Material dispersion losses which are a function of the dielectric constants of the chosen material These can be mitigated by choosing a higher performance laminate material such as Nelco 4000-13SI or Megtron

n Reflected power loss due to impedance mismatches in the Channel as each signal transitions across the different copper media in each channel (connectors vias and PCB traces) and passes through the pad and anti-pad structures of the via fields of other backplane blade slots

Table 1 shows the relative effects of different sources of impedance mismatches The dominant source of impedance mismatches in every Channel resides in the via structures Successful mitigation of this problem requires that every via is tuned by back-drilling the stub and adjusting the pad and anti-pad structures to match the impedance to be 50 ohms irrespective of the target routing layer This in turn requires that the capacitive and inductive effects of the connector pin and via barrel combination are taken into account during the design of each Channel

Further complicating via design is the space the anti-pad structures need to accommodate Channels being routed between other blades while minimizing electro-magnetic coupling with them This space consideration makes the shape and orientation of pads and anti-pads extremely important

Figure 1

Table 1

Table 2

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IEEE 8023ap provides a design targetAs Ethernet has emerged as the industryrsquos dominant signaling methodology the IEEE has developed the 10GBASE-KR norma-tive Channel model to define interconnect Channel performance for NRZ signaling at 10 Gbps This standard defines acceptable performance in terms of S-parameter charts for through-Channel insertion loss and worst-case crosstalk Figures 2a and 2b illustrate masks for Draft 24 of the standard that was initially used for this exercise

In each case the mask defining compliant performance is shown in blue Channel insertion loss is shown in red in Figure 2a Crosstalk performance is defined by the ICR curve (Figure 2b) Minimum acceptable Channel performance is defined in the ICR chart (Figure 2b) by the blue line The effect of the sum of all aggressors on the through-Channel is shown in red The green ICR curve is the ratio of the crosstalk power sum calculated by summing the

magnitudes of any impacting crosstalk Channels for each fre-quency and using a straight line fit (using least-squares method) to determine the resulting average effect f the aggressors on the through-Channel This is then overlaid on the insertion loss and used to plot the ICR curve

This standard which has evolved through a variety of iterations forms the basis for developing a 40 GbE switch fabric backplane featuring 10 Gbps NRZ differential pairs If all differential pairs can meet this standard then the backplane can be considered to be 10GBASE-KR compliant

Applying 10GBASE-KR to a 14-slotAdvancedTCA applicationThe PICMG specification dictates that receive differential pairs are placed on the c-d and g-h rows of the HM-ZD connector and that transmit differential pairs are placed on the a-b and e-f rows Therefore the middle differential pair in row c-d of Slot B will be subject to the NEXT of three aggressors in each of the a-b and e-f transmit rows of slot B plus the FEXT of the signals being received in the c-d pairs in the top and bottom of slot B

In this topology it can be seen that worst-case crosstalk would occur if all the NEXT and FEXT aggressors were routed on the bottom Layer that is on the same Layer as that of the victim c-d However given that all signal vias must be back-drilled and tuned for impedance management purposes Channel crosstalk can simultaneously be reduced by allocating different routing Layers to differential pairs terminated in the same backplane connector

The principal factor in determining the feasibility of a 10GBASE-KR compliant backplane is based on understanding whether the Channel with the worst-case signal-to-noise ratio is compliant

The skew targets determine permissible layer separation between a-b c-d e-f and g-h pairs within each Channel and enable routing Layers to be allocated for each pair It is now possible to start the process of via tuning to optimize the channel performance for minimum insertion loss Modeling begins by defining the simulation boundaries for the channel so that Channel component models (PCB traces connectors vias) can easily be aggregated to model complete Channels Boundaries must be established at locations in the Channel where linear 3D structures exist These are shown in Figure 3 (next page)

Since the connector and via combinations for the backplane and daughtercard mating halves must each be treated as a whole it

PICMG 30Spec

TurboFabricSpec

Total Inter-PairSkew

(Fabric Interface)

05 mm in FR4(34 ps)

001 mmin N4000-13si

(00625 ps)

Total Intra-Channel Skew

(Fabric Interface)

254 mm in FR4(17 ps)

plusmn01 mmin N4000-13si

(0625ps)

Total Intra-Channel Skew

(Base Interface)

135 mm in FR4(90 ps)

plusmn01 mmin N4000-13si

(0625 ps)

Figures 2a and 2b

Table 3

Determining which Channel that is and identifying the worst-case SN requires making trade-offs with regard to PCB material Channel length via design connector row selection and NEXT and FEXT aggressor routing choices These trade-off choices can only take place using advanced 3D simulation tools such as Ansoft HFSS This was the essence of the design process employed in developing Simclarrsquos TurboFabric backplanes

The simulation processThe transmission length for full mesh and dual star backplanes design implementations varies from a maximum of 1632 inches to a minimum of 116 inches With an effective transmission length of 5 inches on each daughtercard this makes the longest effective Channel 2632 inches including two connectors

For a 10GBASE-KR application over this distance a high-perfor-mance laminate is essential for both reducing insertion loss and

ensuring high glass content in the weave to mitigate skew So the design process began by choosing a low-loss dielectric material (Nelco 4000-13SI for both the backplane and the daugh-tercards) and establishing targets for Inter-Pair and Intra-Channel skew as shown in Table 3

Adhering to the PICMG 30 specifi-cation for skew in a 10GBASE-KR application is impractical Instead a target of 00625 ps was set for Inter-Pair skew with 0625 ps set for Intra-Pair skew for the backplane only This equated to a maximum 001 mm differ-

ence being allowed between traces of any differential pair and 01 mm being permitted between traces of any four differential pairs in a Channel Given the topology of the HM-ZD connector daughter-card skew must be accounted for in the daughtercard layout Fo

Sin Pnt

should be noted that the simulation boundary is located within the mated connector

Tuning the connector and via structures to 50Ω is an iterative process involving the removal of excess pads back-drilling and tuning pads anti-pads and traces A Time Domain Reflectometer (TDR) plot illustrating the results of the tuning process is shown in Figure 4

Upon completion of the modeling process a total of 17 different optimized via and routing configurations had been designed for the full mesh design and nine for the dual star design

A plot of worst-case insertion loss is shown in Figure 5 and demonstrates that in both cases performance is well above the 10GBASE-KR mask

When all the through-Channels have been modeled adjacent Channel models can be combined and ICR curves plotted to evaluate the impact of crosstalk on through-Channel performance This valuable information can be used to adjust the position of signal Layers relative to pass-through aggressor traces on adjacent Layers or to reroute traces to reduce crosstalk Similarly routing Layers can be changed to reduce crosstalk in adjacent via barrels

Figure 6 plots worst-case ICR and demonstrates that performance is above the 10GBASE-KR mask Based on this result it was possible to proceed to physical implementation

Figure 3

Figure 4

Fo Sin Pnt

Physical realizationThe layout process was performed using the Mentor Board-Station CAD system Quad-routing (routing four traces between pads) was explored as a routing method-ology in order to reduce Layer count but this was dismissed due to the detrimental impact on crosstalk performance

The attributes of the physical backplanes produced as a result of the design effort are shown in Table 4

The design files produced included the usual gerber files plus detailed back-drilling instructions

The design validation process comprised a conventional continuity test followed by performance testing featuring Agilent equipment including 70340A signal generator 8720ES Network Analyzer NN18A S-Parameter test-set and 86100A sampling oscilloscope with Agilent 86112A module Figure 7 (next page) shows the test set up

Simclar developed special line cards to enable through-Channel measurements with and without crosstalk The signal launch featured compression mount SMAs terminated in a tuned via structure The Channel simulations included simu-lation of the tuned launch structures so de-embedding of the launches was not necessary for correlation to simulation purposes The development team also established a process for characterization of all Channels

Full Mesh Dual Star

Layer Count 34 18

Aspect Ratio 121 61

Tuned Vias 3952 768

Material Nelco 4000-13SI

Table 4

Figure 5 Figure 6

Fo Sin Pnt

In Figure 8 measured through-Channel performance and ICR curves are shown for the same Channels described in the simula-tion section earlier

As can be seen from Figure 8 there is close correlation between these and the simulated plots in Figures 5 and 6 In fact close correlation between all simulated and measured results was achieved resulting in a 728 Tbps capacity full mesh and a 960 Gbps capacity dual star backplane design now generally available as part of the Simclar TurboFabric shelf

Figure 7 Figure 8

Figure 9

Figure 10

Implications of 10GBASE-KR Draft 33versus Draft 25The work described above was targeted towards meeting the Channels specifications contained in Draft 25 of the IEEE 10GBASE-KR Since this work was completed the IEEE has up-issued the Draft revision level for the Standard from 25 to 33 While this has not impacted through-Channel performance demands it has increased Channel isolation requirements by around 10 dB In Figure 9 a Draft 33 mask is added to the ICR plot shown in Figure 8

From Figure 9 it can be seen how Draft 33 pulls the mask above the Channel ICR curve for this full mesh backplane Channel Surprisingly it is the Channelrsquos frequency response at relatively low frequencies between 100-500 MHz that is causing a problem The reasons for this are currently the subject of further detailed investigation

However Figure 10 shows a Draft 33 plot for a less demanding dual star AdvancedTCA implementation featuring shorter trans-mission distances This plot demonstrates compliance to Draft 33 of the IEEE 8023ap 10GBASE-KR Standard

ConclusionBy developing a close understanding of the many factors contrib-uting to loss and noise in multi-gigabit backplane Channels it is possible to characterize their performance using advanced simula-tion techniques and correlate that performance in physical prod-ucts using advanced test methods By overlaying the test results on S-Parameter masks defined by the IEEE 8023ap 10GBASE-KR Standard it has been demonstrated that backplanes that truly enable AdvancedTCA scalability are at last a reality

Douglas Hynd joined Simclar Group in 2006 as Director of Marketing as part of Simclarrsquos acquisition of Northrop Grumman Interconnect Technologies Division wherehe was Vice President of Marketing and Sales He has more than 24 yearsrsquo experience intechnology sales marketing and generalmanagement and holds a BSc (Eng) in Electronics and Electrical Engineeringfrom the University of Glasgow He isbased at Simclarrsquos Global HQ inDunfermline Scotland

Simclar Groupdouglashyndsimclarcom bull wwwsimclarcom

Fo Sin Pnt

6U CompactPCIPrOduCT GuIdE g

This monthrsquos issue includes a 6U CompactPCI Product Guide and Irsquod like to take the opportunity to reflect a bit on the success and evolution of that technology

Back in the 1994 time frame when CompactPCI was first being devel-oped it began as 3U-only technology It used the same Eurocardmechanics that were popularized by VME and an IEC standardized high-

density high-speed connector available from a number of vendors suitablefor 33 MHz PCI signaling That connector was selected by the engineers atZiatech with help from Mike Munroe then at ERNI The majority of VMEdesigns were 6U and based on this I was among a number of folks thatargued for adding the 6U CompactPCI form factor

The 6U form factor presented some challenges and opportunities Onechallenge was that the insertion and extraction forces were quite high when the entire rear of the card was populated with connectors Fortunately the IEEE standards for Eurocards evolved and injectorejector handles that pro-vided leverage became available Eike Waltz then at Rittal was instrumental in bringing that to the table Two of the opportunities that came along withthe extra connectors were a clean way to add secondary buses like the H110 telephony bus to the backplane and the ability to route IO out the rear through rear transition modules PICMG has developed quite a number of subsidiary specifications defining the interoperable use of the extra backplane pins made possible with the 6U form factor Both of these features have played a major part in CompactPCIrsquos success The next major evolution of 6U CompactPCI came with the PICMG 216 Packet Switched Backplane standard which was originally conceived by John Peters and his team at Performance Technologies PICMG 216 interconnected a shelf full of CompactPCI single board computers via redundant Ethernet switches also in the 6U CompactPCI form factor This dramatically increased usable backplane bandwidth and provided redundancy PICMG 216 paved the way for AdvancedTCA and was the industryrsquos first open standard for the switched serial interconnect standards we see popping up in many places

By Joe Pavlat

Looking back and ahead at6U CompactPCI

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Recent 6U CompactPCI related products are listed here For more informationenter the productrsquos RSC No at wwwcompactpci-systemscomrsc

cPCI-6910Dual-core Intel Xeon Processor LVULV Universal blade bull Supports Single Dual-Core Intel Xeon LV or ULV processorsbull Front Side Bus 667 MHz bull Up to 2 GB DDR2 400 MHz soldered SDRAM with ECC bull Four PCI Express GbEbull Up to 4 USB 20 ports bull PICMG 20 21 29 216 compliant

RSC No 35013

ADLINK Technologywwwadlinktechcom

CPCIStor Module6U CompactPCI storage blade bull Onboard ATA controller supports CDDVD HDD and solid-state flashbull Supports Hot Swap Removal (ask about RAID support) bull ATA disks available in Enhanced Dutycycle versions for NEBS Level 3 - 724 requirements bull Operating Systems supported VxWorksLinux and Windows

RSC No 34800

ACTTechnicowwwacttechnicocom

Prosody X cPCI E1T1An E1T1 digital network access card bull Suits telco developers and systems integrators bull Uses Aculabrsquos worldwide protocol coverage including Aculabrsquos SS7 stack available under a cost free license bull Available with 8 or 16 E1T1 trunks and software selectable E1T1 interfaces bull Flexible mix of protocols including ISDN CAS and SS7 (ITU-T China and ANSI) bull A variety of interconnect switching and protocol conversion solutions can be readily crafted bull High availability reliability and scalability with industry standard hardw re and software interoperability bull Up to 128 SS7 signaling links bull Non-circuit related (TCAP) messagingintensive applications such as prepaid and SMS

RSC No 35408

Aculabwwwaculabcom

Adexp8021Intel Core Duo L2400 (166 GHz) w E7520 server chipset bull Dual channel PC2-3200 Registered RAM SECDED or x4 SDDC bull Two GbE two Serial ATA four USB 20 bull Onboard SXGA graphics 1280 x 24-bitbull 6U CompactPCI Bus PICMG EXP0 R10 Specification bull RoHS compliant 0 degC to +55 degC operating range

RSC No 32837

Advanet Incwwwadvanetcojpen

TC84012 channel single-stop Time-to-Digital Converter (TDC) with single-start and multi-start acquisition modes bull 50 ps timing resolution bull Wide range with upto 20 s between first and last events bull Large internal memory buffer with up to 512 hits per channel bull Low jitter (lt3 ps rms) high stability (plusmn2 ppm) internalclock source bull External 10 MHz reference input bull FPGA based Data Processing Unit (DPU) bull Fast readout with DMA mode for increased data throughputbull Overvoltage-protected inputs with 50 Ω K-Lock (LEMO) connectors bull Built-in self calibration bull Modular single-slot 6U PXICompactPCI standardbull Low power consumption (lt22 W)

RSC No 33445

Agilent-Acqiriswwwacqiriscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

MIC-30428-slot 6U CompactPCI backplane bull AC or DC CompactPCI 500 W + 250 W redundant(2+1) power supplies bull PICMG 216 (CompactPCI Packet Switching Backplane) compliancebull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarmmodule (MIC-3924L-AE)

RSC No 32851

MIC-30436-slot 6U CompactPCI backplane bull Supports two hot-swappable SCSISATA or removableIDE HDD bays bull Built-in IDE slim-type DVD-ROM bull AC or DC CompactPCI 250 W + 250 Wredundant (1+1) power supplies bull Supports hot-swappable fan modules bull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarm module (MIC-3924L-AE)

RSC No 32850

Advantech Corporationwwwadvantechcom

Dual-Core Xeon CompactPCI SBCModel PP 42123x bull Dual CPU 6U CompactPCI SBC supporting two dual-core Xeon CPUs bull Up to 8 GB DDR2 ECC SDRAM in a single system or peripheralslot bull Dual processor SBC in a single 6U CompactPCI slot bull Supports two 166 GHz Dual-Core Intel Xeon ULV processors using Intel E7520 server chipsetbull Up to 8 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull PMCXMC site support 66 MHz PCI-X and x8 PCI Express bull Front and rear IO bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade bull Four GbE ports with option for PICMG 216

RSC No 34761

6U CompactPCI Core 2 Duo SBCModel PP 41203x bull 6U CompactPCI Core 2 Duo SBC supporting two PMC sites includingone XMC site bull Up to 4 GB DDR2 ECC SDRAM bull All in a single system or peripheral slot bull TwoPMC sites supporting up to 100 MHz PCI-X bull One XMC x8 PCI Express bull Front and rear IObull Supports 216 GHz or 15 GHz Intel Core 2 Duo processors bull Intel E7520 server chipsetbull Up to 4 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade

RSC No 34763

PP 30202xTwo processor versions available bull 18 GHz Intel Pentium M processor 745 uses mFC-PGA 478 (micro Flip-Chip Pin Grid Array) package bull 14 GHz Intel Pentium M processor Low Voltage 738uses mFC-BGA 479 (micro Flip-Chip Ball Grid Array) package bull 64 KB primary (L1) on-die cache2 MB of secondary (L2) on-die cache bull 400 MHz Front Side Bus (FSB) bull No CPU fan bull 16 GHz processor version (1 MB L2 cache) available see PP 30002x datasheet bull Utilizes 64-bitIntel 855GME chipset bull Supports 400 MHz bus frequency bull Uses Intel 6300ESB IO Controller Hub

RSC No 32659

Concurrent Technologies Incwwwgocctcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cCIBPMC6U-ETA 6U bridged dual PMC carrier that bridges extended temperature CompactPCI boards and PMCs bull Features a rugged CompactPCI form factor providing increased flexibility to military communications systems designers bull Provides additional design choices to users through its differing bus speeds maximizing the numberof PMCs that can be used CompactPCI andPMC buses can both run at 66 or 33 MHzbull Operating temperature range of -40 degC to+85 degC bull Signal conditioning bull DMA supportbull Low-power design +5 V +33 V +12 V -12 V bull User-selectable VIO of 33 V or 5 V to the PMC

RSC No 32891

Dynamic Engineeringwwwdynengcom

cPCI4IP-MMMinimized PCI address footprint IndustryPack carrier for CompactPCI applications bull 6U 4HP4 IP positions 832 clock selection for each slot fused filtered power IO options bull ID INT IO and Mem spaces are decoded for each IP slotbull Single and double wide IPrsquos bull 16- and 32- bit IPs bull 32-bit access to 16-bit IPs bull Full or mini-mized Memory Space decoding for 18 the PCI address requirement bull With the cPCI4IP-MM option 8 CompactPCI 4IP cards take the same PCI address space as 1 full Mem Space card

RSC No 34905

ACQ132CPCI32 channel MHz class simultaneous sampling intelligent digitizer bull 32 simultaneous analoginput channels 2-32 MSpschannel 14-bit resolution bull Differential inputs bull Intelligent cardwith 1 gigabyte memory and GbE on board bull Large distributed FPGA resource on boardbull Range of DSP functions including FIR filtering and Digital Downconverter

RSC No 35482

D-TACQ Solutions Ltdwwwd-tacqcouk

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CR11Based on the Intel Core Duo Processor the platform is designed to support processor speeds from 106 GHz up to 20 GHz bull Intel Core 2 Duo runs at 15 GHz up to 20 GHz bull Conduction cooled bull Two PMC slots bull PCI Express bull 2x GbE

RSC No 33156

ICS-72532-channel 6U CompactPCI DAC board bull 6U CompactPCI data acquisition card bull 32 differential output channels bull 16 or 24-bit sample size bull 288 kHzch data rate bull Simultaneous sampling across all channels on single or multiple boards bull 32 separate delta-sigma DACs bull 64-bit 66 MHz CompactPCI PICMG 20 Rev30 hot-swappable bull FPDP II 400 MBps interface

RSC No 33576

ICS-71032-channel 6U CompactPCI ADC board bull 6U CompactPCI data acquisition card bull 32 differential input channels bull 216 KHzch 24-bit resolution bull Software selectable full scale input bull FPDP II 400 MBpsinterface bull 64-bit 66 MHz CompactPCI PICMG 20 Rev 30 hot swappable bull 32 synchronous boards for simultaneous sampling bull Sonar acoustics and test and measurement applications

RSC No 33578

Tsumani 6U CPCI Development KitFPGA processor solution targeted at high performance software defined radio applications bull Dual Stratix EP1S80 FPGAs are tightly coupled to provide apower platform for signal processing bull Two PMC module sites provide IO connectivity to either front panel or back panel connections bull A direct highbandwidth 1 GBps path from the PMC P4 connector directly to the FPGAs bull Model 919 Dual DAC Mezzanine provides broadband analog signal generationin a compact form bull The board features two independent DAC channels each with its own 12-bit LVDS input capable of running at rates up to 160 MHz

RSC No 32026

CP11Rugged 6U SBC bull Up to 4 GB of DDR2 SDRAM (200 MHz) with enhanced ECC four independent onboard PCI buses system host and peripheral modesupport for the CompactPCI backplane two PMC interfaces (64-bit133 MHz and 32-bit33 MHz) bull Instead of the PMC1 a PCI Express based XMC interface is available on request bull Two GbE one Fast Ethernet two serial interfaces (RS-232 or RS-422485) USB 20 integrated HDD or flash drive bull High performance 2D3D ATI video controller capable of driving two displays in parallel supports VGADVI interface bull Intel Core 2 Duo at 216 GHz Intel Core Duo at 20 GHz2x PMC expansion site bull One XMC optional bull Up to 4 GB DDR2 SDRAM wECC 2x GbE

RSC No 33447

GE Fanuc Intelligent Platforms Incwwwgefanucembeddedcom

Single Board ComputersGD Canada designs and manufactures conduction-cooled Single Board Computers (SBCs)using Intel processors bull 6U and 3U form factors for CompactPCI backplanes bull Fully backward compatible with earlier models bull Upgradeable via the change-out of processor memory andIO modules bull Used within GD Canada computer systems and sold as individual products

RSC No 35281

General Dynamicswwwgdcanadacom

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PrOduCT GuIdE6U CompactPCI

cPCI6U-24DSI32R32-channel 24-bit delta-sigma CompactPCI 6U analog input board with rear IO bull Low noise 24-bit resolution low phase distortion andmulti-board synchronization bull Suits state-of-the-art sonar and noise monitoring applications bull 32-channel cPCI6U-24DSI32 analog input boardprovides a high-density 24-bit analog input resources on a standard 6U CompactPCI expansion board bull Applications from precision voltagemeasurements to complex audio signal and waveform analysis

RSC No 34985

General Standards Corporationwwwgeneralstandardscom

Duet 3U 64-bit 1 GHz TMS320C6416 DSP (x2) 64 MB SDRAM per processor bull Flexible internalexternalcommunication mesh bull 64-bit66 MHz CompactPCI bull PMCXMC site with Jn4 to FPGA and4 RocketIO per VITA 42 bull External data port up to 12 Gbps bull 4M or 5M Virtex-II Pro FPGAbull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM dedicated800 MBps links between DSPs bull 3U CompactPCI with PXI support bull Suits high-end co-processing wireless broadband communications RADAR video and biometrics

RSC No 32856

QuadiaQuad-DSP bull Dual FPGA bull Dual PMC sites bull Inter-processor connectivity and access to external interfaces bull Four C6416 DSPs split in two independent clusters each hosting a PMC site bull One large FPGA for end-user code bull Central FPGA routing interprocessor communication bull End-user FPGA communication bull External port serial IO for PCIe or other p ivate link bull Global memoryand PCI interface bull 1 GHz TMS320C6416 DSP (x4) bull 64 MB SDRAM per processor bull Flexible internalexternal communication mesh bull 64-bit66 MHz CompactPCI bull Two PMC sites with Jn4 to FPGA bull External data port up to 12 Gbps bull Two 4M Gate FPGA reserved for end-user code bull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM bull Up to 512 MB Global DDR SDRAM bull Suits high-end co-processing wireless and broadband communications

RSC No 34737

Quixote 64-bit 6UAdvanced signal capture generation and co-processing bull 1 GHz TMS320C6416 DSP and2 to 6 MGATE Virtex-II FPGA bull 32 MB SDRAM 8 MB ZBT SBSRAM and AD6645 and AD9764 converters bull 6432 bit CompactPCI 66 MHz 5 V33 V and complex trigger modes with HW event logging bull PMC site with Jn4 to FPGA DIO and PICMG 217 StarFabric compliant bull Suits Software Defined Radio wireless IP and RADAR development and hardware testing bull Physical Layer field testing ultra-fast flexible data acquisition vector signal generation and electronic warfare

RSC No 32861

Innovative Integrationwwwinnovative-dspcom

IC-e6-cPCIbHigh performance 6U CompactPCI board bull Powered by one or two of Freescalersquos mostadvanced 14 GHz MPC7448 PowerPC processors bull PICMG 216 compliant bull Marvell Discovery III chipset (MV64460) bull Low power consumption bull Standard extended and rugged grades

RSC No 32982

Interface Conceptwwwinterfaceconceptcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CP213Single-width 6U CompactPCIPXI module with either 32 or 64 differential analog input channelsbull 32 64 or 128 channels of analog input bull 16 multifunction digital IO (TTL) channels that may beconfigured as digital in digital out or selectively attached to 2 frequency in 2 counter in andor 2 timerout channels bull 16-bit resolution bull Programmable gain per channel programmable scan rates of lt1 Ss through 100 KSs bull Precision onboard reference for end-to-end calibration

RSC No 34804

KineticSystems Company LLCwwwkscorpcom

CP6001Energy efficient embedded Intel dual core processors bull 12 GHz Intel Core Duo U2500 ULV processor bull Intel Core 2 Duo L7400 LV processor bull Based on the Intel Mobile 945GM chipset with a front side bus of up to 667 MHz and ICH7-R Southbridge bull Two independent digital video outputs to the rear IO (2x DVI - 1x DVI and 1x HDMI) bull AC97 audio capabilities bull 3 x GbE bull 4 x SATA with RAID 01510 functionality bull 6 x USB 20 2 x COM and VGA or DVI bull Can also accommodate a PMC slot or an onboard 25 inch SATA HDD bull Up to 8 GB of USB or 2 GB soldered flash bull Supports Linux Windows XP XP embedded and VxWorks 6

RSC No 34182

CP6923 GbE Switch6U CompactPCI GbE Switch PICMG 216 compliant bull Leading edge te hnology basedon BCM5650X chip bull 24x GbE ports bull Non-blocking Layer 2 and 3 switching and routingbull Copper optical rear IO version bull Hot swap IPMI bull Fully managed bull Comprehensive firmware package bull Applies to VoIP installations such as call servers media gatewaysand trunking gateways in wireline and wireless networks as well as VoIP systems inenterprise networks with high demands on performance

RSC No 32256

Kontronwwwkontroncom

TMS320C6701 Virtex-IITexas Instrumentsrsquo C6701 DSP bull Xilinx Virtex-II series FPGA up to XC2V8000 bull Multiple IO interfaces Onboard CODEC VIM expansion sites 60-pin GPIO header and JTAG bull Hardware drivers integration in SimulinkXilinx System Generator Blocksets for quick implementation of Simulink models bull DSP and FPGA-in-the-loop cosimulation of SimulinkXilinx System Generator models bull Leading edge communication interface allowing real-time datamonitoring from Simulink scopes and remote operations

RSC No 32028

VHS-DACHigh performance multichannel DA for phased array antenna systems radarsonar communications receiversup-sampling to IF stage and RFIF AGC apps bull Eight 125 MSPS output channels bull Optional add-on daughter boardprovides 8 additional output channels or 8 additional input channels bull 32-bit 25 MHz bull FPDP interface with 400 MBps transfer rate (25 MSPS per channel at 8 channels 125 MSPS at 16 channels) bull Low level hardware drivers API andGUI bull High level hardware drivers integration in Simulink Blocksets bull Leading edge communication interface fordata recording and playback tofrom the onboard SDRAM

RSC No 32029

Lyrtechwwwlyrtechcom

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PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

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PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

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SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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Page 21: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

TECHNOLOGY g BACkpLANES

Increasing demand for service and multimedia features is stimulating a growing need for speed in telecom-munications equipment While some

applications such as PBX systems can be addressed with the gigabit backplane technologies currently available others are running out of headroom Routers may soon need 10 Gbps and higher speed back-planes to keep up with network demand Many such applications can justify the expense of moving to higher performance if it becomes available

Currently telecom system designs offer backplanes that can handle interconnec-tions running as fast as 3125 Gbps raw data throughput per lane (with around a maxi-mum data rate capability of 5-625 Gbps per lane) The AdvancedTCA standard for instance uses Ethernetrsquos XAUI inter-face AdvancedTCA achieves a 10 Gbps net data rate by running four serial lanes for each interconnection with each lanersquos

SERrializerDESerializer (SERDES) op-erating at 3125 Gbps raw data (25 Gbs net)

As demand forces systems to move beyond these rates however new technologies will be needed One proposal calls for the use of XAUI+ or double XAUI which increases lane SERDES rates to 625 Gbps per lane and hence the throughput to 20 Gbps Another proposal is to use IEEE 8023ap known as 10GBASE-KR which runs a single SERDES lane at 125 Gbps raw data rate (103 Gbps net) But these are only short-term answers To address future demands organizations such as the Institute of Electrical and Electronic Engineers Standards Association (IEEE-SA) are developing specifications for Ethernet speeds of 40 Gbps to 100 Gbps which will be applied to backplane interconnect

Such high clock rates however will pose significant design challenges for developers

One of the first challenges that will need resolution is the design and layout of the backplane and other PCBs Common design practice today readily handles board clock rates of around 10 Gbps Well established design rules are in place and board layout tools such as autorouters can automatically handle board designs for speeds in the 10 Gbps range Designers may use specialized board material create additional ground planes and perform similar tasks in order to ensure proper board operation at the higher end but even speeds to 5 GHz are within current design tool capabilities

Design gets trickierAbove 5 GHz however board design gets more involved because feature dimensions become significant when compared to the signalrsquos wavelengths Variations in board thickness can affect signal propagation Corners where traces change direction and small spurs along edges of poorly etched

Channel characteristics

challenge backplane interoperability

Serial backplanes in telecommunications systems aim for high speed with room for

growth As systems began using 10 Gbps links however issues arose that affected backplane

communications among cards from different manufacturers Stuart points out that the

industry must define key backplane channel characteristics so that designs based on open

standards maintain interoperability as backplane speeds move to 40 Gbps and beyond

By Stuart JamieSon

Fo Sin Pnt

traces can act as antennae for the higher fre-quencies in digital signals As can be seen in Figure 1 sharp corners and minor flaws that are inconsequential at lower frequen-cies have the potential to become trouble-some antennae at future high speeds This can result in the trace radiating away the signalrsquos high frequency energy increasing EMI and crosstalk as well as altering signal waveforms New routing design rules such as making corners 30deg instead of 45deg and more careful board fabrication techniques may become necessary as designs move above the 10 Gbps per lane threshold

The move to higher frequencies will affect more than board fabrication and layout however Higher frequencies will also impose new requirements on signal tim-ing signal rise-time electrical distance and waveform shape if developers are to retain the mix-and-match system design approach that makes standards-based system design effective

For interoperability to be achievable at data rates above 10 Gbps organizations such as PICMG will need to carefully define a vari-ety of signal and design parameters in their specifications Some of the key parameters that will need consideration include

n Interconnect signal attenuationn Eye diagramn Jittern Input clock recoveryn Chip inputoutput pre-emphasis (PE) n Equalization (EQ)

Even slight variations in these parameters from device to device and lane to lane can shift the timing of signals a significant fraction of a clock cycle and affect the Bit Error Rate (BER) of a lanechannel Finally signal rise times will require tight control as signal rates increase in order to ensure control of system timing (see Figure 2)

In defining signal and design parameters specifications will also need to account for the increased location dependency that comes with higher frequencies Even subtle differences in attributes such as routing length and trace impedance become increasingly significant as signal speeds rise To ensure mix-and-match interopera-bility then design specifications may need to account for the specific backplane slot that a board is to occupy as well as introduce a method to obtain and control the PE and EQ of the devices connected to the lanes

Designers must also address fabrication standards The material used to fabricate

Figure 1

Figure 2

Fo Sin Pnt

the board the thickness and composition of metal cladding and the spacing between layers can all affect the trace characteris-tics Controlling these parameters under specification ensures that timing charac-teristics are sufficiently uniform from one board to another However current speci-fications are too detailed and stringent It is extremely difficult to attain compliance yet avoid adding cost to the design

Specifications need workSome of these parameters are already incorporated into current specifications The AMC module specifications from PICMG for instance include design parameters that ensure its proper opera-tion at signal speeds as fast as 125 Gbps per lane Establishing specifications for other system components will help achieve interoperability of standards-based designs at higher frequencies

Design tools may also need to be modified and the industry will need to create new design rules for high frequency and incor-porate these into the tools Developing new routing techniques will help avoid the issues of electrical phenomena such as skin effect dielectric loss and impedance mismatches These are much more preva-lent at higher frequencies and it becomes critical for engineers to model and simu-late these phenomena more accurately

Early efforts are already underway to address the challenges that higher fre-quency signals bring to standards-based design The Interconnect Channel Characterization Subcommittee of PICMG established in September 2006 is develop-ing ground rules and definitions to be used in characterizing transmission reflection and crosstalk performance in backplane and mezzanine carrier interconnects The committee aims to define the channel parameters to be measured or analyzed as well as the methods for doing so Its charter calls for it to address

n Definition of interfaces at which measurements are made or characteristics computed

n Test equipment fixtures and PCB test coupons

n Details of measurement proceduren Data formatsn Techniques for de-embedding

components of the channeln Techniques for validating

measurement based models ie passivity and causality

n Definitions that allow reasonable compliance testing

n Boundary definitions for different paths

n Define information regarding limita-tions or proper usage ie maximum data raterise times that are supported by the models

Such efforts are only a beginning how-ever Other design details still need to be addressed such as SERDES IO Configuration New functionality may need to be defined The design of high data rate system channel interfaces according to standardsspecifications does not currently cover the individual characteristics of the chip transmitterreceiver characteristics Thus work will be needed to address how such standard designs handle such dependency

Crossing an interoperability thresholdOne way of handling location dependen-cies might be to give the system control-ler the ability to inform modules what the channel transmitter and receiver PE and EQ technology is and importantly how to control it With this information along with the signal attenuation suffered (at a given bit rate) for the channel the system should be able to configure SERDES channels in different physical locations to run reliably and at the required BER In MicroTCA systems for instance this functionality could be incorporated into the MicroTCA Carrier Hub (MCH) as part of its electronic keying function Modules would have to be able to configure and control its backplane interfaces to allow for different positions

in the backplane An MCH (see Figure 3 courtesy Emerson) then would be able to instruct a module as to which parameters to use for interoperability

The specific approaches needed to handle location dependencies and other challenges that higher signal rates raise have yet to be developed The need to address these challenges however is clear Increasing demand for services is driving applications to utilize faster signal rates This in turn is driving backplane signaling speeds ever higher As speeds rise above 10 Gbps sig-nals will cross a threshold where current specifications will prove inadequate for ensuring interoperability among standards-based designs

The industry should begin developing new or enhanced specifications and design tools to address the challenges of higher signal rates Without such improvements the guarantees of interoperability that allow system developers to readily create solu-tions by combining off-the-shelf products will be compromised As backplane speeds approach 100 Gbps nothing can be taken for granted

Stuart Jamieson Director of Industry RelationsArchitect with Emerson Network Power Embedded Computing represents Emerson on PICMG committees and the SCOPE organization and previously served as a CP-TA Board member (Treasurer) He brings over 18 years of experience in hardware protocols embedded software and specification development to these groups Within Emerson he played a key role in the develop-ment of the technology central to Emersonrsquos bundled network-ing solutions Stuartrsquos positions within Emerson have included Director of Business Development Director of Advanced Technology and Architect He is the Draft Editor for the PICMG Interconnect Channel Characterization Subcommittee is the author of the introduction section for the new PICMG Ruggedized MicroTCA specification and served as the Draft Editor for the PICMG MicroTCA Specification Stuart gradu-ated from the Heriot-Watt University in 1989 with a 1st Class Honors degree in Electrical and Electronic Engineering and again in 1992 with an IBM-sponsored Master of Philosophy

Emerson Network Power Embedded ComputingStuartJamiesonEmersoncom bull wwwemersonembeddedcomputingcom

Figure 3

Fo Sin Pnt

TECHNOLOGY g BACkpLANES

2008

B A

N D

W I

D T

H

Signal integrity challenges to bandwidth scalabilityFor the purposes of this article each interconnected differential pair will be referred to as a Channel (which should not be confused with an aggregated AdvancedTCA channel comprising four trans-mit and four receive pairs)

14-slot full-mesh AdvancedTCA backplanes contain hundreds of Channels Each Channel is defined as the copper signal path from the output of a driver device to the input of a receiver device As

By douglaS Hynd

Developing IEEE 8023ap 10GBASE-KRcompliant backplanes

Why doesAdvancedTCA

need bandwidthscalability

PICMG AdvancedTCA 30 has emerged as the

industryrsquos Hardware Platform standard of choice and

is enjoying first-phase deployment However many

believe that for AdvancedTCA to realize its market

potential AdvancedTCA platforms need to seamlessly

scale to accommodate 40 GbE fabrics thereby

avoiding forklift upgrades as system bandwidth

demands increase over time A 40 GbE switch fabric

architecture would enable realization of a common

platform for computing storage control and media

and packet processing and provide the versatility and

long term ROI required by service providers in

todayrsquos increasingly competitive environment

The challenge was to develop a family of

AdvancedTCA products which feature PICMG 30

compliant dual star and full mesh advanced

backplane switch fabrics enabled up to 10 Gbps

per differential signal pair thereby giving 40 Gbps

per AdvancedTCA channel performance

This article describes the signal integrity challenges

presented in designing an IEEE 8023ap

10GBASE-KR-compliant bandwidth-scalable

14-slot AdvancedTCA platform and how these

challenges were overcome in development of full

mesh and dual star backplane reference designs

Fo Sin Pnt

shown in Figure 1 that signal path comprises a signal launch a blade PCB transmission line a daughtercard via a right-angled HM-ZD connector a mated HM-ZD backplane header a back-plane via a length of backplane PCB transmission line and then the same combination of connectors vias and transmission line at the receive end of the Channel

Sources of crosstalkFour principal sources of crosstalk in each Channel must be man-aged as shown in Table 2 Source number one is between adjacent differential pairs as they are routed across the backplane Common mode noise rejection in system differential pair structures makes this a minor issue The second source of crosstalk lies in the HM-ZD connector itself

Crosstalk in via fields our third source primarily arises from inductive coupling between adjacent differential pairs and domi-nates the crosstalk agenda in high-speed Channels This source of crosstalk is directly proportional to the length of the via barrel and where practical care must be taken to ensure that adjacent connector rows are terminated to different target routing Layers

The final source of crosstalk is caused by aggressor signals in through-routed via fields coupling with victim Channel traces as they pass through As mentioned earlier judicious and careful design can mitigate this impact

Skew Channel skew is a function of differential transmission path geometries At a fundamental frequency of 5 GHz skew can be a significant issue in high-speed system design due to narrowing the eye opening and increasing jitter Skew can have a significant impact on crosstalk it negatively impacts the common mode rejection of noise inherent to differential signaling Conductor surface roughness in lower performing dielectric materials can also cause skew in high-speed systems

Skew can be avoided through careful management of transmission path lengths in each Channel and by using higher-glass content (lower Dk) laminates

LossPotential

Potential Mismatches

Channel

Loss Potential Channel

PCB Tolerance -025 dB 2 -01 dB

Connector Tolerance -001 dB 4 -016 dB

Thru-routed Via Fields -001 dB 12 -144 dB

Connector Launch -025 dB+ 4 - 2 dB+

Quantity TotalNEXT

TotalFEXT

PCB Transmission Lines

24 in60 cm

-50 dB -70 dB

Connector Architecture 2 -26 dB -24 dB

Via Fields 4 -22 dB -20 dB

Connector Pass Through 8 -34 dB ndash34 dB

For the target application each one of these Channels must deliver a 10 Gbps Non-Return-To-Zero (NRZ) signal with sufficient signal fidelity to enable a receiver device to detect and process a differential signal The PICMG 30 specification is targeted at 3125 Gbps signaling with a fundamental frequency of 156 GHz Even in low loss dielectric materials insertion loss at 10 Gbps (5 GHz fundamental) is twice that of a 3125 Gbps signal

Therefore achieving acceptable signal fidelity requires careful management of signal losses and noise in each Channel such that an acceptable signal-to-noise (SN) ratio is achieved at the receiver

The design process therefore begins by understanding and mitigat-ing the sources of losses and noise in each Channel

Sources of lossThere are three sources of loss

n Conductor losses which are due to skin effects and can be addressed by maximizing the cross sectional area of the signal traces

n Material dispersion losses which are a function of the dielectric constants of the chosen material These can be mitigated by choosing a higher performance laminate material such as Nelco 4000-13SI or Megtron

n Reflected power loss due to impedance mismatches in the Channel as each signal transitions across the different copper media in each channel (connectors vias and PCB traces) and passes through the pad and anti-pad structures of the via fields of other backplane blade slots

Table 1 shows the relative effects of different sources of impedance mismatches The dominant source of impedance mismatches in every Channel resides in the via structures Successful mitigation of this problem requires that every via is tuned by back-drilling the stub and adjusting the pad and anti-pad structures to match the impedance to be 50 ohms irrespective of the target routing layer This in turn requires that the capacitive and inductive effects of the connector pin and via barrel combination are taken into account during the design of each Channel

Further complicating via design is the space the anti-pad structures need to accommodate Channels being routed between other blades while minimizing electro-magnetic coupling with them This space consideration makes the shape and orientation of pads and anti-pads extremely important

Figure 1

Table 1

Table 2

Fo Sin Pnt

IEEE 8023ap provides a design targetAs Ethernet has emerged as the industryrsquos dominant signaling methodology the IEEE has developed the 10GBASE-KR norma-tive Channel model to define interconnect Channel performance for NRZ signaling at 10 Gbps This standard defines acceptable performance in terms of S-parameter charts for through-Channel insertion loss and worst-case crosstalk Figures 2a and 2b illustrate masks for Draft 24 of the standard that was initially used for this exercise

In each case the mask defining compliant performance is shown in blue Channel insertion loss is shown in red in Figure 2a Crosstalk performance is defined by the ICR curve (Figure 2b) Minimum acceptable Channel performance is defined in the ICR chart (Figure 2b) by the blue line The effect of the sum of all aggressors on the through-Channel is shown in red The green ICR curve is the ratio of the crosstalk power sum calculated by summing the

magnitudes of any impacting crosstalk Channels for each fre-quency and using a straight line fit (using least-squares method) to determine the resulting average effect f the aggressors on the through-Channel This is then overlaid on the insertion loss and used to plot the ICR curve

This standard which has evolved through a variety of iterations forms the basis for developing a 40 GbE switch fabric backplane featuring 10 Gbps NRZ differential pairs If all differential pairs can meet this standard then the backplane can be considered to be 10GBASE-KR compliant

Applying 10GBASE-KR to a 14-slotAdvancedTCA applicationThe PICMG specification dictates that receive differential pairs are placed on the c-d and g-h rows of the HM-ZD connector and that transmit differential pairs are placed on the a-b and e-f rows Therefore the middle differential pair in row c-d of Slot B will be subject to the NEXT of three aggressors in each of the a-b and e-f transmit rows of slot B plus the FEXT of the signals being received in the c-d pairs in the top and bottom of slot B

In this topology it can be seen that worst-case crosstalk would occur if all the NEXT and FEXT aggressors were routed on the bottom Layer that is on the same Layer as that of the victim c-d However given that all signal vias must be back-drilled and tuned for impedance management purposes Channel crosstalk can simultaneously be reduced by allocating different routing Layers to differential pairs terminated in the same backplane connector

The principal factor in determining the feasibility of a 10GBASE-KR compliant backplane is based on understanding whether the Channel with the worst-case signal-to-noise ratio is compliant

The skew targets determine permissible layer separation between a-b c-d e-f and g-h pairs within each Channel and enable routing Layers to be allocated for each pair It is now possible to start the process of via tuning to optimize the channel performance for minimum insertion loss Modeling begins by defining the simulation boundaries for the channel so that Channel component models (PCB traces connectors vias) can easily be aggregated to model complete Channels Boundaries must be established at locations in the Channel where linear 3D structures exist These are shown in Figure 3 (next page)

Since the connector and via combinations for the backplane and daughtercard mating halves must each be treated as a whole it

PICMG 30Spec

TurboFabricSpec

Total Inter-PairSkew

(Fabric Interface)

05 mm in FR4(34 ps)

001 mmin N4000-13si

(00625 ps)

Total Intra-Channel Skew

(Fabric Interface)

254 mm in FR4(17 ps)

plusmn01 mmin N4000-13si

(0625ps)

Total Intra-Channel Skew

(Base Interface)

135 mm in FR4(90 ps)

plusmn01 mmin N4000-13si

(0625 ps)

Figures 2a and 2b

Table 3

Determining which Channel that is and identifying the worst-case SN requires making trade-offs with regard to PCB material Channel length via design connector row selection and NEXT and FEXT aggressor routing choices These trade-off choices can only take place using advanced 3D simulation tools such as Ansoft HFSS This was the essence of the design process employed in developing Simclarrsquos TurboFabric backplanes

The simulation processThe transmission length for full mesh and dual star backplanes design implementations varies from a maximum of 1632 inches to a minimum of 116 inches With an effective transmission length of 5 inches on each daughtercard this makes the longest effective Channel 2632 inches including two connectors

For a 10GBASE-KR application over this distance a high-perfor-mance laminate is essential for both reducing insertion loss and

ensuring high glass content in the weave to mitigate skew So the design process began by choosing a low-loss dielectric material (Nelco 4000-13SI for both the backplane and the daugh-tercards) and establishing targets for Inter-Pair and Intra-Channel skew as shown in Table 3

Adhering to the PICMG 30 specifi-cation for skew in a 10GBASE-KR application is impractical Instead a target of 00625 ps was set for Inter-Pair skew with 0625 ps set for Intra-Pair skew for the backplane only This equated to a maximum 001 mm differ-

ence being allowed between traces of any differential pair and 01 mm being permitted between traces of any four differential pairs in a Channel Given the topology of the HM-ZD connector daughter-card skew must be accounted for in the daughtercard layout Fo

Sin Pnt

should be noted that the simulation boundary is located within the mated connector

Tuning the connector and via structures to 50Ω is an iterative process involving the removal of excess pads back-drilling and tuning pads anti-pads and traces A Time Domain Reflectometer (TDR) plot illustrating the results of the tuning process is shown in Figure 4

Upon completion of the modeling process a total of 17 different optimized via and routing configurations had been designed for the full mesh design and nine for the dual star design

A plot of worst-case insertion loss is shown in Figure 5 and demonstrates that in both cases performance is well above the 10GBASE-KR mask

When all the through-Channels have been modeled adjacent Channel models can be combined and ICR curves plotted to evaluate the impact of crosstalk on through-Channel performance This valuable information can be used to adjust the position of signal Layers relative to pass-through aggressor traces on adjacent Layers or to reroute traces to reduce crosstalk Similarly routing Layers can be changed to reduce crosstalk in adjacent via barrels

Figure 6 plots worst-case ICR and demonstrates that performance is above the 10GBASE-KR mask Based on this result it was possible to proceed to physical implementation

Figure 3

Figure 4

Fo Sin Pnt

Physical realizationThe layout process was performed using the Mentor Board-Station CAD system Quad-routing (routing four traces between pads) was explored as a routing method-ology in order to reduce Layer count but this was dismissed due to the detrimental impact on crosstalk performance

The attributes of the physical backplanes produced as a result of the design effort are shown in Table 4

The design files produced included the usual gerber files plus detailed back-drilling instructions

The design validation process comprised a conventional continuity test followed by performance testing featuring Agilent equipment including 70340A signal generator 8720ES Network Analyzer NN18A S-Parameter test-set and 86100A sampling oscilloscope with Agilent 86112A module Figure 7 (next page) shows the test set up

Simclar developed special line cards to enable through-Channel measurements with and without crosstalk The signal launch featured compression mount SMAs terminated in a tuned via structure The Channel simulations included simu-lation of the tuned launch structures so de-embedding of the launches was not necessary for correlation to simulation purposes The development team also established a process for characterization of all Channels

Full Mesh Dual Star

Layer Count 34 18

Aspect Ratio 121 61

Tuned Vias 3952 768

Material Nelco 4000-13SI

Table 4

Figure 5 Figure 6

Fo Sin Pnt

In Figure 8 measured through-Channel performance and ICR curves are shown for the same Channels described in the simula-tion section earlier

As can be seen from Figure 8 there is close correlation between these and the simulated plots in Figures 5 and 6 In fact close correlation between all simulated and measured results was achieved resulting in a 728 Tbps capacity full mesh and a 960 Gbps capacity dual star backplane design now generally available as part of the Simclar TurboFabric shelf

Figure 7 Figure 8

Figure 9

Figure 10

Implications of 10GBASE-KR Draft 33versus Draft 25The work described above was targeted towards meeting the Channels specifications contained in Draft 25 of the IEEE 10GBASE-KR Since this work was completed the IEEE has up-issued the Draft revision level for the Standard from 25 to 33 While this has not impacted through-Channel performance demands it has increased Channel isolation requirements by around 10 dB In Figure 9 a Draft 33 mask is added to the ICR plot shown in Figure 8

From Figure 9 it can be seen how Draft 33 pulls the mask above the Channel ICR curve for this full mesh backplane Channel Surprisingly it is the Channelrsquos frequency response at relatively low frequencies between 100-500 MHz that is causing a problem The reasons for this are currently the subject of further detailed investigation

However Figure 10 shows a Draft 33 plot for a less demanding dual star AdvancedTCA implementation featuring shorter trans-mission distances This plot demonstrates compliance to Draft 33 of the IEEE 8023ap 10GBASE-KR Standard

ConclusionBy developing a close understanding of the many factors contrib-uting to loss and noise in multi-gigabit backplane Channels it is possible to characterize their performance using advanced simula-tion techniques and correlate that performance in physical prod-ucts using advanced test methods By overlaying the test results on S-Parameter masks defined by the IEEE 8023ap 10GBASE-KR Standard it has been demonstrated that backplanes that truly enable AdvancedTCA scalability are at last a reality

Douglas Hynd joined Simclar Group in 2006 as Director of Marketing as part of Simclarrsquos acquisition of Northrop Grumman Interconnect Technologies Division wherehe was Vice President of Marketing and Sales He has more than 24 yearsrsquo experience intechnology sales marketing and generalmanagement and holds a BSc (Eng) in Electronics and Electrical Engineeringfrom the University of Glasgow He isbased at Simclarrsquos Global HQ inDunfermline Scotland

Simclar Groupdouglashyndsimclarcom bull wwwsimclarcom

Fo Sin Pnt

6U CompactPCIPrOduCT GuIdE g

This monthrsquos issue includes a 6U CompactPCI Product Guide and Irsquod like to take the opportunity to reflect a bit on the success and evolution of that technology

Back in the 1994 time frame when CompactPCI was first being devel-oped it began as 3U-only technology It used the same Eurocardmechanics that were popularized by VME and an IEC standardized high-

density high-speed connector available from a number of vendors suitablefor 33 MHz PCI signaling That connector was selected by the engineers atZiatech with help from Mike Munroe then at ERNI The majority of VMEdesigns were 6U and based on this I was among a number of folks thatargued for adding the 6U CompactPCI form factor

The 6U form factor presented some challenges and opportunities Onechallenge was that the insertion and extraction forces were quite high when the entire rear of the card was populated with connectors Fortunately the IEEE standards for Eurocards evolved and injectorejector handles that pro-vided leverage became available Eike Waltz then at Rittal was instrumental in bringing that to the table Two of the opportunities that came along withthe extra connectors were a clean way to add secondary buses like the H110 telephony bus to the backplane and the ability to route IO out the rear through rear transition modules PICMG has developed quite a number of subsidiary specifications defining the interoperable use of the extra backplane pins made possible with the 6U form factor Both of these features have played a major part in CompactPCIrsquos success The next major evolution of 6U CompactPCI came with the PICMG 216 Packet Switched Backplane standard which was originally conceived by John Peters and his team at Performance Technologies PICMG 216 interconnected a shelf full of CompactPCI single board computers via redundant Ethernet switches also in the 6U CompactPCI form factor This dramatically increased usable backplane bandwidth and provided redundancy PICMG 216 paved the way for AdvancedTCA and was the industryrsquos first open standard for the switched serial interconnect standards we see popping up in many places

By Joe Pavlat

Looking back and ahead at6U CompactPCI

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Recent 6U CompactPCI related products are listed here For more informationenter the productrsquos RSC No at wwwcompactpci-systemscomrsc

cPCI-6910Dual-core Intel Xeon Processor LVULV Universal blade bull Supports Single Dual-Core Intel Xeon LV or ULV processorsbull Front Side Bus 667 MHz bull Up to 2 GB DDR2 400 MHz soldered SDRAM with ECC bull Four PCI Express GbEbull Up to 4 USB 20 ports bull PICMG 20 21 29 216 compliant

RSC No 35013

ADLINK Technologywwwadlinktechcom

CPCIStor Module6U CompactPCI storage blade bull Onboard ATA controller supports CDDVD HDD and solid-state flashbull Supports Hot Swap Removal (ask about RAID support) bull ATA disks available in Enhanced Dutycycle versions for NEBS Level 3 - 724 requirements bull Operating Systems supported VxWorksLinux and Windows

RSC No 34800

ACTTechnicowwwacttechnicocom

Prosody X cPCI E1T1An E1T1 digital network access card bull Suits telco developers and systems integrators bull Uses Aculabrsquos worldwide protocol coverage including Aculabrsquos SS7 stack available under a cost free license bull Available with 8 or 16 E1T1 trunks and software selectable E1T1 interfaces bull Flexible mix of protocols including ISDN CAS and SS7 (ITU-T China and ANSI) bull A variety of interconnect switching and protocol conversion solutions can be readily crafted bull High availability reliability and scalability with industry standard hardw re and software interoperability bull Up to 128 SS7 signaling links bull Non-circuit related (TCAP) messagingintensive applications such as prepaid and SMS

RSC No 35408

Aculabwwwaculabcom

Adexp8021Intel Core Duo L2400 (166 GHz) w E7520 server chipset bull Dual channel PC2-3200 Registered RAM SECDED or x4 SDDC bull Two GbE two Serial ATA four USB 20 bull Onboard SXGA graphics 1280 x 24-bitbull 6U CompactPCI Bus PICMG EXP0 R10 Specification bull RoHS compliant 0 degC to +55 degC operating range

RSC No 32837

Advanet Incwwwadvanetcojpen

TC84012 channel single-stop Time-to-Digital Converter (TDC) with single-start and multi-start acquisition modes bull 50 ps timing resolution bull Wide range with upto 20 s between first and last events bull Large internal memory buffer with up to 512 hits per channel bull Low jitter (lt3 ps rms) high stability (plusmn2 ppm) internalclock source bull External 10 MHz reference input bull FPGA based Data Processing Unit (DPU) bull Fast readout with DMA mode for increased data throughputbull Overvoltage-protected inputs with 50 Ω K-Lock (LEMO) connectors bull Built-in self calibration bull Modular single-slot 6U PXICompactPCI standardbull Low power consumption (lt22 W)

RSC No 33445

Agilent-Acqiriswwwacqiriscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

MIC-30428-slot 6U CompactPCI backplane bull AC or DC CompactPCI 500 W + 250 W redundant(2+1) power supplies bull PICMG 216 (CompactPCI Packet Switching Backplane) compliancebull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarmmodule (MIC-3924L-AE)

RSC No 32851

MIC-30436-slot 6U CompactPCI backplane bull Supports two hot-swappable SCSISATA or removableIDE HDD bays bull Built-in IDE slim-type DVD-ROM bull AC or DC CompactPCI 250 W + 250 Wredundant (1+1) power supplies bull Supports hot-swappable fan modules bull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarm module (MIC-3924L-AE)

RSC No 32850

Advantech Corporationwwwadvantechcom

Dual-Core Xeon CompactPCI SBCModel PP 42123x bull Dual CPU 6U CompactPCI SBC supporting two dual-core Xeon CPUs bull Up to 8 GB DDR2 ECC SDRAM in a single system or peripheralslot bull Dual processor SBC in a single 6U CompactPCI slot bull Supports two 166 GHz Dual-Core Intel Xeon ULV processors using Intel E7520 server chipsetbull Up to 8 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull PMCXMC site support 66 MHz PCI-X and x8 PCI Express bull Front and rear IO bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade bull Four GbE ports with option for PICMG 216

RSC No 34761

6U CompactPCI Core 2 Duo SBCModel PP 41203x bull 6U CompactPCI Core 2 Duo SBC supporting two PMC sites includingone XMC site bull Up to 4 GB DDR2 ECC SDRAM bull All in a single system or peripheral slot bull TwoPMC sites supporting up to 100 MHz PCI-X bull One XMC x8 PCI Express bull Front and rear IObull Supports 216 GHz or 15 GHz Intel Core 2 Duo processors bull Intel E7520 server chipsetbull Up to 4 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade

RSC No 34763

PP 30202xTwo processor versions available bull 18 GHz Intel Pentium M processor 745 uses mFC-PGA 478 (micro Flip-Chip Pin Grid Array) package bull 14 GHz Intel Pentium M processor Low Voltage 738uses mFC-BGA 479 (micro Flip-Chip Ball Grid Array) package bull 64 KB primary (L1) on-die cache2 MB of secondary (L2) on-die cache bull 400 MHz Front Side Bus (FSB) bull No CPU fan bull 16 GHz processor version (1 MB L2 cache) available see PP 30002x datasheet bull Utilizes 64-bitIntel 855GME chipset bull Supports 400 MHz bus frequency bull Uses Intel 6300ESB IO Controller Hub

RSC No 32659

Concurrent Technologies Incwwwgocctcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cCIBPMC6U-ETA 6U bridged dual PMC carrier that bridges extended temperature CompactPCI boards and PMCs bull Features a rugged CompactPCI form factor providing increased flexibility to military communications systems designers bull Provides additional design choices to users through its differing bus speeds maximizing the numberof PMCs that can be used CompactPCI andPMC buses can both run at 66 or 33 MHzbull Operating temperature range of -40 degC to+85 degC bull Signal conditioning bull DMA supportbull Low-power design +5 V +33 V +12 V -12 V bull User-selectable VIO of 33 V or 5 V to the PMC

RSC No 32891

Dynamic Engineeringwwwdynengcom

cPCI4IP-MMMinimized PCI address footprint IndustryPack carrier for CompactPCI applications bull 6U 4HP4 IP positions 832 clock selection for each slot fused filtered power IO options bull ID INT IO and Mem spaces are decoded for each IP slotbull Single and double wide IPrsquos bull 16- and 32- bit IPs bull 32-bit access to 16-bit IPs bull Full or mini-mized Memory Space decoding for 18 the PCI address requirement bull With the cPCI4IP-MM option 8 CompactPCI 4IP cards take the same PCI address space as 1 full Mem Space card

RSC No 34905

ACQ132CPCI32 channel MHz class simultaneous sampling intelligent digitizer bull 32 simultaneous analoginput channels 2-32 MSpschannel 14-bit resolution bull Differential inputs bull Intelligent cardwith 1 gigabyte memory and GbE on board bull Large distributed FPGA resource on boardbull Range of DSP functions including FIR filtering and Digital Downconverter

RSC No 35482

D-TACQ Solutions Ltdwwwd-tacqcouk

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CR11Based on the Intel Core Duo Processor the platform is designed to support processor speeds from 106 GHz up to 20 GHz bull Intel Core 2 Duo runs at 15 GHz up to 20 GHz bull Conduction cooled bull Two PMC slots bull PCI Express bull 2x GbE

RSC No 33156

ICS-72532-channel 6U CompactPCI DAC board bull 6U CompactPCI data acquisition card bull 32 differential output channels bull 16 or 24-bit sample size bull 288 kHzch data rate bull Simultaneous sampling across all channels on single or multiple boards bull 32 separate delta-sigma DACs bull 64-bit 66 MHz CompactPCI PICMG 20 Rev30 hot-swappable bull FPDP II 400 MBps interface

RSC No 33576

ICS-71032-channel 6U CompactPCI ADC board bull 6U CompactPCI data acquisition card bull 32 differential input channels bull 216 KHzch 24-bit resolution bull Software selectable full scale input bull FPDP II 400 MBpsinterface bull 64-bit 66 MHz CompactPCI PICMG 20 Rev 30 hot swappable bull 32 synchronous boards for simultaneous sampling bull Sonar acoustics and test and measurement applications

RSC No 33578

Tsumani 6U CPCI Development KitFPGA processor solution targeted at high performance software defined radio applications bull Dual Stratix EP1S80 FPGAs are tightly coupled to provide apower platform for signal processing bull Two PMC module sites provide IO connectivity to either front panel or back panel connections bull A direct highbandwidth 1 GBps path from the PMC P4 connector directly to the FPGAs bull Model 919 Dual DAC Mezzanine provides broadband analog signal generationin a compact form bull The board features two independent DAC channels each with its own 12-bit LVDS input capable of running at rates up to 160 MHz

RSC No 32026

CP11Rugged 6U SBC bull Up to 4 GB of DDR2 SDRAM (200 MHz) with enhanced ECC four independent onboard PCI buses system host and peripheral modesupport for the CompactPCI backplane two PMC interfaces (64-bit133 MHz and 32-bit33 MHz) bull Instead of the PMC1 a PCI Express based XMC interface is available on request bull Two GbE one Fast Ethernet two serial interfaces (RS-232 or RS-422485) USB 20 integrated HDD or flash drive bull High performance 2D3D ATI video controller capable of driving two displays in parallel supports VGADVI interface bull Intel Core 2 Duo at 216 GHz Intel Core Duo at 20 GHz2x PMC expansion site bull One XMC optional bull Up to 4 GB DDR2 SDRAM wECC 2x GbE

RSC No 33447

GE Fanuc Intelligent Platforms Incwwwgefanucembeddedcom

Single Board ComputersGD Canada designs and manufactures conduction-cooled Single Board Computers (SBCs)using Intel processors bull 6U and 3U form factors for CompactPCI backplanes bull Fully backward compatible with earlier models bull Upgradeable via the change-out of processor memory andIO modules bull Used within GD Canada computer systems and sold as individual products

RSC No 35281

General Dynamicswwwgdcanadacom

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PrOduCT GuIdE6U CompactPCI

cPCI6U-24DSI32R32-channel 24-bit delta-sigma CompactPCI 6U analog input board with rear IO bull Low noise 24-bit resolution low phase distortion andmulti-board synchronization bull Suits state-of-the-art sonar and noise monitoring applications bull 32-channel cPCI6U-24DSI32 analog input boardprovides a high-density 24-bit analog input resources on a standard 6U CompactPCI expansion board bull Applications from precision voltagemeasurements to complex audio signal and waveform analysis

RSC No 34985

General Standards Corporationwwwgeneralstandardscom

Duet 3U 64-bit 1 GHz TMS320C6416 DSP (x2) 64 MB SDRAM per processor bull Flexible internalexternalcommunication mesh bull 64-bit66 MHz CompactPCI bull PMCXMC site with Jn4 to FPGA and4 RocketIO per VITA 42 bull External data port up to 12 Gbps bull 4M or 5M Virtex-II Pro FPGAbull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM dedicated800 MBps links between DSPs bull 3U CompactPCI with PXI support bull Suits high-end co-processing wireless broadband communications RADAR video and biometrics

RSC No 32856

QuadiaQuad-DSP bull Dual FPGA bull Dual PMC sites bull Inter-processor connectivity and access to external interfaces bull Four C6416 DSPs split in two independent clusters each hosting a PMC site bull One large FPGA for end-user code bull Central FPGA routing interprocessor communication bull End-user FPGA communication bull External port serial IO for PCIe or other p ivate link bull Global memoryand PCI interface bull 1 GHz TMS320C6416 DSP (x4) bull 64 MB SDRAM per processor bull Flexible internalexternal communication mesh bull 64-bit66 MHz CompactPCI bull Two PMC sites with Jn4 to FPGA bull External data port up to 12 Gbps bull Two 4M Gate FPGA reserved for end-user code bull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM bull Up to 512 MB Global DDR SDRAM bull Suits high-end co-processing wireless and broadband communications

RSC No 34737

Quixote 64-bit 6UAdvanced signal capture generation and co-processing bull 1 GHz TMS320C6416 DSP and2 to 6 MGATE Virtex-II FPGA bull 32 MB SDRAM 8 MB ZBT SBSRAM and AD6645 and AD9764 converters bull 6432 bit CompactPCI 66 MHz 5 V33 V and complex trigger modes with HW event logging bull PMC site with Jn4 to FPGA DIO and PICMG 217 StarFabric compliant bull Suits Software Defined Radio wireless IP and RADAR development and hardware testing bull Physical Layer field testing ultra-fast flexible data acquisition vector signal generation and electronic warfare

RSC No 32861

Innovative Integrationwwwinnovative-dspcom

IC-e6-cPCIbHigh performance 6U CompactPCI board bull Powered by one or two of Freescalersquos mostadvanced 14 GHz MPC7448 PowerPC processors bull PICMG 216 compliant bull Marvell Discovery III chipset (MV64460) bull Low power consumption bull Standard extended and rugged grades

RSC No 32982

Interface Conceptwwwinterfaceconceptcom

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PrOduCT GuIdE6U CompactPCI

CP213Single-width 6U CompactPCIPXI module with either 32 or 64 differential analog input channelsbull 32 64 or 128 channels of analog input bull 16 multifunction digital IO (TTL) channels that may beconfigured as digital in digital out or selectively attached to 2 frequency in 2 counter in andor 2 timerout channels bull 16-bit resolution bull Programmable gain per channel programmable scan rates of lt1 Ss through 100 KSs bull Precision onboard reference for end-to-end calibration

RSC No 34804

KineticSystems Company LLCwwwkscorpcom

CP6001Energy efficient embedded Intel dual core processors bull 12 GHz Intel Core Duo U2500 ULV processor bull Intel Core 2 Duo L7400 LV processor bull Based on the Intel Mobile 945GM chipset with a front side bus of up to 667 MHz and ICH7-R Southbridge bull Two independent digital video outputs to the rear IO (2x DVI - 1x DVI and 1x HDMI) bull AC97 audio capabilities bull 3 x GbE bull 4 x SATA with RAID 01510 functionality bull 6 x USB 20 2 x COM and VGA or DVI bull Can also accommodate a PMC slot or an onboard 25 inch SATA HDD bull Up to 8 GB of USB or 2 GB soldered flash bull Supports Linux Windows XP XP embedded and VxWorks 6

RSC No 34182

CP6923 GbE Switch6U CompactPCI GbE Switch PICMG 216 compliant bull Leading edge te hnology basedon BCM5650X chip bull 24x GbE ports bull Non-blocking Layer 2 and 3 switching and routingbull Copper optical rear IO version bull Hot swap IPMI bull Fully managed bull Comprehensive firmware package bull Applies to VoIP installations such as call servers media gatewaysand trunking gateways in wireline and wireless networks as well as VoIP systems inenterprise networks with high demands on performance

RSC No 32256

Kontronwwwkontroncom

TMS320C6701 Virtex-IITexas Instrumentsrsquo C6701 DSP bull Xilinx Virtex-II series FPGA up to XC2V8000 bull Multiple IO interfaces Onboard CODEC VIM expansion sites 60-pin GPIO header and JTAG bull Hardware drivers integration in SimulinkXilinx System Generator Blocksets for quick implementation of Simulink models bull DSP and FPGA-in-the-loop cosimulation of SimulinkXilinx System Generator models bull Leading edge communication interface allowing real-time datamonitoring from Simulink scopes and remote operations

RSC No 32028

VHS-DACHigh performance multichannel DA for phased array antenna systems radarsonar communications receiversup-sampling to IF stage and RFIF AGC apps bull Eight 125 MSPS output channels bull Optional add-on daughter boardprovides 8 additional output channels or 8 additional input channels bull 32-bit 25 MHz bull FPDP interface with 400 MBps transfer rate (25 MSPS per channel at 8 channels 125 MSPS at 16 channels) bull Low level hardware drivers API andGUI bull High level hardware drivers integration in Simulink Blocksets bull Leading edge communication interface fordata recording and playback tofrom the onboard SDRAM

RSC No 32029

Lyrtechwwwlyrtechcom

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PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

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PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

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PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

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PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

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SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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Page 22: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

traces can act as antennae for the higher fre-quencies in digital signals As can be seen in Figure 1 sharp corners and minor flaws that are inconsequential at lower frequen-cies have the potential to become trouble-some antennae at future high speeds This can result in the trace radiating away the signalrsquos high frequency energy increasing EMI and crosstalk as well as altering signal waveforms New routing design rules such as making corners 30deg instead of 45deg and more careful board fabrication techniques may become necessary as designs move above the 10 Gbps per lane threshold

The move to higher frequencies will affect more than board fabrication and layout however Higher frequencies will also impose new requirements on signal tim-ing signal rise-time electrical distance and waveform shape if developers are to retain the mix-and-match system design approach that makes standards-based system design effective

For interoperability to be achievable at data rates above 10 Gbps organizations such as PICMG will need to carefully define a vari-ety of signal and design parameters in their specifications Some of the key parameters that will need consideration include

n Interconnect signal attenuationn Eye diagramn Jittern Input clock recoveryn Chip inputoutput pre-emphasis (PE) n Equalization (EQ)

Even slight variations in these parameters from device to device and lane to lane can shift the timing of signals a significant fraction of a clock cycle and affect the Bit Error Rate (BER) of a lanechannel Finally signal rise times will require tight control as signal rates increase in order to ensure control of system timing (see Figure 2)

In defining signal and design parameters specifications will also need to account for the increased location dependency that comes with higher frequencies Even subtle differences in attributes such as routing length and trace impedance become increasingly significant as signal speeds rise To ensure mix-and-match interopera-bility then design specifications may need to account for the specific backplane slot that a board is to occupy as well as introduce a method to obtain and control the PE and EQ of the devices connected to the lanes

Designers must also address fabrication standards The material used to fabricate

Figure 1

Figure 2

Fo Sin Pnt

the board the thickness and composition of metal cladding and the spacing between layers can all affect the trace characteris-tics Controlling these parameters under specification ensures that timing charac-teristics are sufficiently uniform from one board to another However current speci-fications are too detailed and stringent It is extremely difficult to attain compliance yet avoid adding cost to the design

Specifications need workSome of these parameters are already incorporated into current specifications The AMC module specifications from PICMG for instance include design parameters that ensure its proper opera-tion at signal speeds as fast as 125 Gbps per lane Establishing specifications for other system components will help achieve interoperability of standards-based designs at higher frequencies

Design tools may also need to be modified and the industry will need to create new design rules for high frequency and incor-porate these into the tools Developing new routing techniques will help avoid the issues of electrical phenomena such as skin effect dielectric loss and impedance mismatches These are much more preva-lent at higher frequencies and it becomes critical for engineers to model and simu-late these phenomena more accurately

Early efforts are already underway to address the challenges that higher fre-quency signals bring to standards-based design The Interconnect Channel Characterization Subcommittee of PICMG established in September 2006 is develop-ing ground rules and definitions to be used in characterizing transmission reflection and crosstalk performance in backplane and mezzanine carrier interconnects The committee aims to define the channel parameters to be measured or analyzed as well as the methods for doing so Its charter calls for it to address

n Definition of interfaces at which measurements are made or characteristics computed

n Test equipment fixtures and PCB test coupons

n Details of measurement proceduren Data formatsn Techniques for de-embedding

components of the channeln Techniques for validating

measurement based models ie passivity and causality

n Definitions that allow reasonable compliance testing

n Boundary definitions for different paths

n Define information regarding limita-tions or proper usage ie maximum data raterise times that are supported by the models

Such efforts are only a beginning how-ever Other design details still need to be addressed such as SERDES IO Configuration New functionality may need to be defined The design of high data rate system channel interfaces according to standardsspecifications does not currently cover the individual characteristics of the chip transmitterreceiver characteristics Thus work will be needed to address how such standard designs handle such dependency

Crossing an interoperability thresholdOne way of handling location dependen-cies might be to give the system control-ler the ability to inform modules what the channel transmitter and receiver PE and EQ technology is and importantly how to control it With this information along with the signal attenuation suffered (at a given bit rate) for the channel the system should be able to configure SERDES channels in different physical locations to run reliably and at the required BER In MicroTCA systems for instance this functionality could be incorporated into the MicroTCA Carrier Hub (MCH) as part of its electronic keying function Modules would have to be able to configure and control its backplane interfaces to allow for different positions

in the backplane An MCH (see Figure 3 courtesy Emerson) then would be able to instruct a module as to which parameters to use for interoperability

The specific approaches needed to handle location dependencies and other challenges that higher signal rates raise have yet to be developed The need to address these challenges however is clear Increasing demand for services is driving applications to utilize faster signal rates This in turn is driving backplane signaling speeds ever higher As speeds rise above 10 Gbps sig-nals will cross a threshold where current specifications will prove inadequate for ensuring interoperability among standards-based designs

The industry should begin developing new or enhanced specifications and design tools to address the challenges of higher signal rates Without such improvements the guarantees of interoperability that allow system developers to readily create solu-tions by combining off-the-shelf products will be compromised As backplane speeds approach 100 Gbps nothing can be taken for granted

Stuart Jamieson Director of Industry RelationsArchitect with Emerson Network Power Embedded Computing represents Emerson on PICMG committees and the SCOPE organization and previously served as a CP-TA Board member (Treasurer) He brings over 18 years of experience in hardware protocols embedded software and specification development to these groups Within Emerson he played a key role in the develop-ment of the technology central to Emersonrsquos bundled network-ing solutions Stuartrsquos positions within Emerson have included Director of Business Development Director of Advanced Technology and Architect He is the Draft Editor for the PICMG Interconnect Channel Characterization Subcommittee is the author of the introduction section for the new PICMG Ruggedized MicroTCA specification and served as the Draft Editor for the PICMG MicroTCA Specification Stuart gradu-ated from the Heriot-Watt University in 1989 with a 1st Class Honors degree in Electrical and Electronic Engineering and again in 1992 with an IBM-sponsored Master of Philosophy

Emerson Network Power Embedded ComputingStuartJamiesonEmersoncom bull wwwemersonembeddedcomputingcom

Figure 3

Fo Sin Pnt

TECHNOLOGY g BACkpLANES

2008

B A

N D

W I

D T

H

Signal integrity challenges to bandwidth scalabilityFor the purposes of this article each interconnected differential pair will be referred to as a Channel (which should not be confused with an aggregated AdvancedTCA channel comprising four trans-mit and four receive pairs)

14-slot full-mesh AdvancedTCA backplanes contain hundreds of Channels Each Channel is defined as the copper signal path from the output of a driver device to the input of a receiver device As

By douglaS Hynd

Developing IEEE 8023ap 10GBASE-KRcompliant backplanes

Why doesAdvancedTCA

need bandwidthscalability

PICMG AdvancedTCA 30 has emerged as the

industryrsquos Hardware Platform standard of choice and

is enjoying first-phase deployment However many

believe that for AdvancedTCA to realize its market

potential AdvancedTCA platforms need to seamlessly

scale to accommodate 40 GbE fabrics thereby

avoiding forklift upgrades as system bandwidth

demands increase over time A 40 GbE switch fabric

architecture would enable realization of a common

platform for computing storage control and media

and packet processing and provide the versatility and

long term ROI required by service providers in

todayrsquos increasingly competitive environment

The challenge was to develop a family of

AdvancedTCA products which feature PICMG 30

compliant dual star and full mesh advanced

backplane switch fabrics enabled up to 10 Gbps

per differential signal pair thereby giving 40 Gbps

per AdvancedTCA channel performance

This article describes the signal integrity challenges

presented in designing an IEEE 8023ap

10GBASE-KR-compliant bandwidth-scalable

14-slot AdvancedTCA platform and how these

challenges were overcome in development of full

mesh and dual star backplane reference designs

Fo Sin Pnt

shown in Figure 1 that signal path comprises a signal launch a blade PCB transmission line a daughtercard via a right-angled HM-ZD connector a mated HM-ZD backplane header a back-plane via a length of backplane PCB transmission line and then the same combination of connectors vias and transmission line at the receive end of the Channel

Sources of crosstalkFour principal sources of crosstalk in each Channel must be man-aged as shown in Table 2 Source number one is between adjacent differential pairs as they are routed across the backplane Common mode noise rejection in system differential pair structures makes this a minor issue The second source of crosstalk lies in the HM-ZD connector itself

Crosstalk in via fields our third source primarily arises from inductive coupling between adjacent differential pairs and domi-nates the crosstalk agenda in high-speed Channels This source of crosstalk is directly proportional to the length of the via barrel and where practical care must be taken to ensure that adjacent connector rows are terminated to different target routing Layers

The final source of crosstalk is caused by aggressor signals in through-routed via fields coupling with victim Channel traces as they pass through As mentioned earlier judicious and careful design can mitigate this impact

Skew Channel skew is a function of differential transmission path geometries At a fundamental frequency of 5 GHz skew can be a significant issue in high-speed system design due to narrowing the eye opening and increasing jitter Skew can have a significant impact on crosstalk it negatively impacts the common mode rejection of noise inherent to differential signaling Conductor surface roughness in lower performing dielectric materials can also cause skew in high-speed systems

Skew can be avoided through careful management of transmission path lengths in each Channel and by using higher-glass content (lower Dk) laminates

LossPotential

Potential Mismatches

Channel

Loss Potential Channel

PCB Tolerance -025 dB 2 -01 dB

Connector Tolerance -001 dB 4 -016 dB

Thru-routed Via Fields -001 dB 12 -144 dB

Connector Launch -025 dB+ 4 - 2 dB+

Quantity TotalNEXT

TotalFEXT

PCB Transmission Lines

24 in60 cm

-50 dB -70 dB

Connector Architecture 2 -26 dB -24 dB

Via Fields 4 -22 dB -20 dB

Connector Pass Through 8 -34 dB ndash34 dB

For the target application each one of these Channels must deliver a 10 Gbps Non-Return-To-Zero (NRZ) signal with sufficient signal fidelity to enable a receiver device to detect and process a differential signal The PICMG 30 specification is targeted at 3125 Gbps signaling with a fundamental frequency of 156 GHz Even in low loss dielectric materials insertion loss at 10 Gbps (5 GHz fundamental) is twice that of a 3125 Gbps signal

Therefore achieving acceptable signal fidelity requires careful management of signal losses and noise in each Channel such that an acceptable signal-to-noise (SN) ratio is achieved at the receiver

The design process therefore begins by understanding and mitigat-ing the sources of losses and noise in each Channel

Sources of lossThere are three sources of loss

n Conductor losses which are due to skin effects and can be addressed by maximizing the cross sectional area of the signal traces

n Material dispersion losses which are a function of the dielectric constants of the chosen material These can be mitigated by choosing a higher performance laminate material such as Nelco 4000-13SI or Megtron

n Reflected power loss due to impedance mismatches in the Channel as each signal transitions across the different copper media in each channel (connectors vias and PCB traces) and passes through the pad and anti-pad structures of the via fields of other backplane blade slots

Table 1 shows the relative effects of different sources of impedance mismatches The dominant source of impedance mismatches in every Channel resides in the via structures Successful mitigation of this problem requires that every via is tuned by back-drilling the stub and adjusting the pad and anti-pad structures to match the impedance to be 50 ohms irrespective of the target routing layer This in turn requires that the capacitive and inductive effects of the connector pin and via barrel combination are taken into account during the design of each Channel

Further complicating via design is the space the anti-pad structures need to accommodate Channels being routed between other blades while minimizing electro-magnetic coupling with them This space consideration makes the shape and orientation of pads and anti-pads extremely important

Figure 1

Table 1

Table 2

Fo Sin Pnt

IEEE 8023ap provides a design targetAs Ethernet has emerged as the industryrsquos dominant signaling methodology the IEEE has developed the 10GBASE-KR norma-tive Channel model to define interconnect Channel performance for NRZ signaling at 10 Gbps This standard defines acceptable performance in terms of S-parameter charts for through-Channel insertion loss and worst-case crosstalk Figures 2a and 2b illustrate masks for Draft 24 of the standard that was initially used for this exercise

In each case the mask defining compliant performance is shown in blue Channel insertion loss is shown in red in Figure 2a Crosstalk performance is defined by the ICR curve (Figure 2b) Minimum acceptable Channel performance is defined in the ICR chart (Figure 2b) by the blue line The effect of the sum of all aggressors on the through-Channel is shown in red The green ICR curve is the ratio of the crosstalk power sum calculated by summing the

magnitudes of any impacting crosstalk Channels for each fre-quency and using a straight line fit (using least-squares method) to determine the resulting average effect f the aggressors on the through-Channel This is then overlaid on the insertion loss and used to plot the ICR curve

This standard which has evolved through a variety of iterations forms the basis for developing a 40 GbE switch fabric backplane featuring 10 Gbps NRZ differential pairs If all differential pairs can meet this standard then the backplane can be considered to be 10GBASE-KR compliant

Applying 10GBASE-KR to a 14-slotAdvancedTCA applicationThe PICMG specification dictates that receive differential pairs are placed on the c-d and g-h rows of the HM-ZD connector and that transmit differential pairs are placed on the a-b and e-f rows Therefore the middle differential pair in row c-d of Slot B will be subject to the NEXT of three aggressors in each of the a-b and e-f transmit rows of slot B plus the FEXT of the signals being received in the c-d pairs in the top and bottom of slot B

In this topology it can be seen that worst-case crosstalk would occur if all the NEXT and FEXT aggressors were routed on the bottom Layer that is on the same Layer as that of the victim c-d However given that all signal vias must be back-drilled and tuned for impedance management purposes Channel crosstalk can simultaneously be reduced by allocating different routing Layers to differential pairs terminated in the same backplane connector

The principal factor in determining the feasibility of a 10GBASE-KR compliant backplane is based on understanding whether the Channel with the worst-case signal-to-noise ratio is compliant

The skew targets determine permissible layer separation between a-b c-d e-f and g-h pairs within each Channel and enable routing Layers to be allocated for each pair It is now possible to start the process of via tuning to optimize the channel performance for minimum insertion loss Modeling begins by defining the simulation boundaries for the channel so that Channel component models (PCB traces connectors vias) can easily be aggregated to model complete Channels Boundaries must be established at locations in the Channel where linear 3D structures exist These are shown in Figure 3 (next page)

Since the connector and via combinations for the backplane and daughtercard mating halves must each be treated as a whole it

PICMG 30Spec

TurboFabricSpec

Total Inter-PairSkew

(Fabric Interface)

05 mm in FR4(34 ps)

001 mmin N4000-13si

(00625 ps)

Total Intra-Channel Skew

(Fabric Interface)

254 mm in FR4(17 ps)

plusmn01 mmin N4000-13si

(0625ps)

Total Intra-Channel Skew

(Base Interface)

135 mm in FR4(90 ps)

plusmn01 mmin N4000-13si

(0625 ps)

Figures 2a and 2b

Table 3

Determining which Channel that is and identifying the worst-case SN requires making trade-offs with regard to PCB material Channel length via design connector row selection and NEXT and FEXT aggressor routing choices These trade-off choices can only take place using advanced 3D simulation tools such as Ansoft HFSS This was the essence of the design process employed in developing Simclarrsquos TurboFabric backplanes

The simulation processThe transmission length for full mesh and dual star backplanes design implementations varies from a maximum of 1632 inches to a minimum of 116 inches With an effective transmission length of 5 inches on each daughtercard this makes the longest effective Channel 2632 inches including two connectors

For a 10GBASE-KR application over this distance a high-perfor-mance laminate is essential for both reducing insertion loss and

ensuring high glass content in the weave to mitigate skew So the design process began by choosing a low-loss dielectric material (Nelco 4000-13SI for both the backplane and the daugh-tercards) and establishing targets for Inter-Pair and Intra-Channel skew as shown in Table 3

Adhering to the PICMG 30 specifi-cation for skew in a 10GBASE-KR application is impractical Instead a target of 00625 ps was set for Inter-Pair skew with 0625 ps set for Intra-Pair skew for the backplane only This equated to a maximum 001 mm differ-

ence being allowed between traces of any differential pair and 01 mm being permitted between traces of any four differential pairs in a Channel Given the topology of the HM-ZD connector daughter-card skew must be accounted for in the daughtercard layout Fo

Sin Pnt

should be noted that the simulation boundary is located within the mated connector

Tuning the connector and via structures to 50Ω is an iterative process involving the removal of excess pads back-drilling and tuning pads anti-pads and traces A Time Domain Reflectometer (TDR) plot illustrating the results of the tuning process is shown in Figure 4

Upon completion of the modeling process a total of 17 different optimized via and routing configurations had been designed for the full mesh design and nine for the dual star design

A plot of worst-case insertion loss is shown in Figure 5 and demonstrates that in both cases performance is well above the 10GBASE-KR mask

When all the through-Channels have been modeled adjacent Channel models can be combined and ICR curves plotted to evaluate the impact of crosstalk on through-Channel performance This valuable information can be used to adjust the position of signal Layers relative to pass-through aggressor traces on adjacent Layers or to reroute traces to reduce crosstalk Similarly routing Layers can be changed to reduce crosstalk in adjacent via barrels

Figure 6 plots worst-case ICR and demonstrates that performance is above the 10GBASE-KR mask Based on this result it was possible to proceed to physical implementation

Figure 3

Figure 4

Fo Sin Pnt

Physical realizationThe layout process was performed using the Mentor Board-Station CAD system Quad-routing (routing four traces between pads) was explored as a routing method-ology in order to reduce Layer count but this was dismissed due to the detrimental impact on crosstalk performance

The attributes of the physical backplanes produced as a result of the design effort are shown in Table 4

The design files produced included the usual gerber files plus detailed back-drilling instructions

The design validation process comprised a conventional continuity test followed by performance testing featuring Agilent equipment including 70340A signal generator 8720ES Network Analyzer NN18A S-Parameter test-set and 86100A sampling oscilloscope with Agilent 86112A module Figure 7 (next page) shows the test set up

Simclar developed special line cards to enable through-Channel measurements with and without crosstalk The signal launch featured compression mount SMAs terminated in a tuned via structure The Channel simulations included simu-lation of the tuned launch structures so de-embedding of the launches was not necessary for correlation to simulation purposes The development team also established a process for characterization of all Channels

Full Mesh Dual Star

Layer Count 34 18

Aspect Ratio 121 61

Tuned Vias 3952 768

Material Nelco 4000-13SI

Table 4

Figure 5 Figure 6

Fo Sin Pnt

In Figure 8 measured through-Channel performance and ICR curves are shown for the same Channels described in the simula-tion section earlier

As can be seen from Figure 8 there is close correlation between these and the simulated plots in Figures 5 and 6 In fact close correlation between all simulated and measured results was achieved resulting in a 728 Tbps capacity full mesh and a 960 Gbps capacity dual star backplane design now generally available as part of the Simclar TurboFabric shelf

Figure 7 Figure 8

Figure 9

Figure 10

Implications of 10GBASE-KR Draft 33versus Draft 25The work described above was targeted towards meeting the Channels specifications contained in Draft 25 of the IEEE 10GBASE-KR Since this work was completed the IEEE has up-issued the Draft revision level for the Standard from 25 to 33 While this has not impacted through-Channel performance demands it has increased Channel isolation requirements by around 10 dB In Figure 9 a Draft 33 mask is added to the ICR plot shown in Figure 8

From Figure 9 it can be seen how Draft 33 pulls the mask above the Channel ICR curve for this full mesh backplane Channel Surprisingly it is the Channelrsquos frequency response at relatively low frequencies between 100-500 MHz that is causing a problem The reasons for this are currently the subject of further detailed investigation

However Figure 10 shows a Draft 33 plot for a less demanding dual star AdvancedTCA implementation featuring shorter trans-mission distances This plot demonstrates compliance to Draft 33 of the IEEE 8023ap 10GBASE-KR Standard

ConclusionBy developing a close understanding of the many factors contrib-uting to loss and noise in multi-gigabit backplane Channels it is possible to characterize their performance using advanced simula-tion techniques and correlate that performance in physical prod-ucts using advanced test methods By overlaying the test results on S-Parameter masks defined by the IEEE 8023ap 10GBASE-KR Standard it has been demonstrated that backplanes that truly enable AdvancedTCA scalability are at last a reality

Douglas Hynd joined Simclar Group in 2006 as Director of Marketing as part of Simclarrsquos acquisition of Northrop Grumman Interconnect Technologies Division wherehe was Vice President of Marketing and Sales He has more than 24 yearsrsquo experience intechnology sales marketing and generalmanagement and holds a BSc (Eng) in Electronics and Electrical Engineeringfrom the University of Glasgow He isbased at Simclarrsquos Global HQ inDunfermline Scotland

Simclar Groupdouglashyndsimclarcom bull wwwsimclarcom

Fo Sin Pnt

6U CompactPCIPrOduCT GuIdE g

This monthrsquos issue includes a 6U CompactPCI Product Guide and Irsquod like to take the opportunity to reflect a bit on the success and evolution of that technology

Back in the 1994 time frame when CompactPCI was first being devel-oped it began as 3U-only technology It used the same Eurocardmechanics that were popularized by VME and an IEC standardized high-

density high-speed connector available from a number of vendors suitablefor 33 MHz PCI signaling That connector was selected by the engineers atZiatech with help from Mike Munroe then at ERNI The majority of VMEdesigns were 6U and based on this I was among a number of folks thatargued for adding the 6U CompactPCI form factor

The 6U form factor presented some challenges and opportunities Onechallenge was that the insertion and extraction forces were quite high when the entire rear of the card was populated with connectors Fortunately the IEEE standards for Eurocards evolved and injectorejector handles that pro-vided leverage became available Eike Waltz then at Rittal was instrumental in bringing that to the table Two of the opportunities that came along withthe extra connectors were a clean way to add secondary buses like the H110 telephony bus to the backplane and the ability to route IO out the rear through rear transition modules PICMG has developed quite a number of subsidiary specifications defining the interoperable use of the extra backplane pins made possible with the 6U form factor Both of these features have played a major part in CompactPCIrsquos success The next major evolution of 6U CompactPCI came with the PICMG 216 Packet Switched Backplane standard which was originally conceived by John Peters and his team at Performance Technologies PICMG 216 interconnected a shelf full of CompactPCI single board computers via redundant Ethernet switches also in the 6U CompactPCI form factor This dramatically increased usable backplane bandwidth and provided redundancy PICMG 216 paved the way for AdvancedTCA and was the industryrsquos first open standard for the switched serial interconnect standards we see popping up in many places

By Joe Pavlat

Looking back and ahead at6U CompactPCI

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Recent 6U CompactPCI related products are listed here For more informationenter the productrsquos RSC No at wwwcompactpci-systemscomrsc

cPCI-6910Dual-core Intel Xeon Processor LVULV Universal blade bull Supports Single Dual-Core Intel Xeon LV or ULV processorsbull Front Side Bus 667 MHz bull Up to 2 GB DDR2 400 MHz soldered SDRAM with ECC bull Four PCI Express GbEbull Up to 4 USB 20 ports bull PICMG 20 21 29 216 compliant

RSC No 35013

ADLINK Technologywwwadlinktechcom

CPCIStor Module6U CompactPCI storage blade bull Onboard ATA controller supports CDDVD HDD and solid-state flashbull Supports Hot Swap Removal (ask about RAID support) bull ATA disks available in Enhanced Dutycycle versions for NEBS Level 3 - 724 requirements bull Operating Systems supported VxWorksLinux and Windows

RSC No 34800

ACTTechnicowwwacttechnicocom

Prosody X cPCI E1T1An E1T1 digital network access card bull Suits telco developers and systems integrators bull Uses Aculabrsquos worldwide protocol coverage including Aculabrsquos SS7 stack available under a cost free license bull Available with 8 or 16 E1T1 trunks and software selectable E1T1 interfaces bull Flexible mix of protocols including ISDN CAS and SS7 (ITU-T China and ANSI) bull A variety of interconnect switching and protocol conversion solutions can be readily crafted bull High availability reliability and scalability with industry standard hardw re and software interoperability bull Up to 128 SS7 signaling links bull Non-circuit related (TCAP) messagingintensive applications such as prepaid and SMS

RSC No 35408

Aculabwwwaculabcom

Adexp8021Intel Core Duo L2400 (166 GHz) w E7520 server chipset bull Dual channel PC2-3200 Registered RAM SECDED or x4 SDDC bull Two GbE two Serial ATA four USB 20 bull Onboard SXGA graphics 1280 x 24-bitbull 6U CompactPCI Bus PICMG EXP0 R10 Specification bull RoHS compliant 0 degC to +55 degC operating range

RSC No 32837

Advanet Incwwwadvanetcojpen

TC84012 channel single-stop Time-to-Digital Converter (TDC) with single-start and multi-start acquisition modes bull 50 ps timing resolution bull Wide range with upto 20 s between first and last events bull Large internal memory buffer with up to 512 hits per channel bull Low jitter (lt3 ps rms) high stability (plusmn2 ppm) internalclock source bull External 10 MHz reference input bull FPGA based Data Processing Unit (DPU) bull Fast readout with DMA mode for increased data throughputbull Overvoltage-protected inputs with 50 Ω K-Lock (LEMO) connectors bull Built-in self calibration bull Modular single-slot 6U PXICompactPCI standardbull Low power consumption (lt22 W)

RSC No 33445

Agilent-Acqiriswwwacqiriscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

MIC-30428-slot 6U CompactPCI backplane bull AC or DC CompactPCI 500 W + 250 W redundant(2+1) power supplies bull PICMG 216 (CompactPCI Packet Switching Backplane) compliancebull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarmmodule (MIC-3924L-AE)

RSC No 32851

MIC-30436-slot 6U CompactPCI backplane bull Supports two hot-swappable SCSISATA or removableIDE HDD bays bull Built-in IDE slim-type DVD-ROM bull AC or DC CompactPCI 250 W + 250 Wredundant (1+1) power supplies bull Supports hot-swappable fan modules bull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarm module (MIC-3924L-AE)

RSC No 32850

Advantech Corporationwwwadvantechcom

Dual-Core Xeon CompactPCI SBCModel PP 42123x bull Dual CPU 6U CompactPCI SBC supporting two dual-core Xeon CPUs bull Up to 8 GB DDR2 ECC SDRAM in a single system or peripheralslot bull Dual processor SBC in a single 6U CompactPCI slot bull Supports two 166 GHz Dual-Core Intel Xeon ULV processors using Intel E7520 server chipsetbull Up to 8 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull PMCXMC site support 66 MHz PCI-X and x8 PCI Express bull Front and rear IO bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade bull Four GbE ports with option for PICMG 216

RSC No 34761

6U CompactPCI Core 2 Duo SBCModel PP 41203x bull 6U CompactPCI Core 2 Duo SBC supporting two PMC sites includingone XMC site bull Up to 4 GB DDR2 ECC SDRAM bull All in a single system or peripheral slot bull TwoPMC sites supporting up to 100 MHz PCI-X bull One XMC x8 PCI Express bull Front and rear IObull Supports 216 GHz or 15 GHz Intel Core 2 Duo processors bull Intel E7520 server chipsetbull Up to 4 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade

RSC No 34763

PP 30202xTwo processor versions available bull 18 GHz Intel Pentium M processor 745 uses mFC-PGA 478 (micro Flip-Chip Pin Grid Array) package bull 14 GHz Intel Pentium M processor Low Voltage 738uses mFC-BGA 479 (micro Flip-Chip Ball Grid Array) package bull 64 KB primary (L1) on-die cache2 MB of secondary (L2) on-die cache bull 400 MHz Front Side Bus (FSB) bull No CPU fan bull 16 GHz processor version (1 MB L2 cache) available see PP 30002x datasheet bull Utilizes 64-bitIntel 855GME chipset bull Supports 400 MHz bus frequency bull Uses Intel 6300ESB IO Controller Hub

RSC No 32659

Concurrent Technologies Incwwwgocctcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cCIBPMC6U-ETA 6U bridged dual PMC carrier that bridges extended temperature CompactPCI boards and PMCs bull Features a rugged CompactPCI form factor providing increased flexibility to military communications systems designers bull Provides additional design choices to users through its differing bus speeds maximizing the numberof PMCs that can be used CompactPCI andPMC buses can both run at 66 or 33 MHzbull Operating temperature range of -40 degC to+85 degC bull Signal conditioning bull DMA supportbull Low-power design +5 V +33 V +12 V -12 V bull User-selectable VIO of 33 V or 5 V to the PMC

RSC No 32891

Dynamic Engineeringwwwdynengcom

cPCI4IP-MMMinimized PCI address footprint IndustryPack carrier for CompactPCI applications bull 6U 4HP4 IP positions 832 clock selection for each slot fused filtered power IO options bull ID INT IO and Mem spaces are decoded for each IP slotbull Single and double wide IPrsquos bull 16- and 32- bit IPs bull 32-bit access to 16-bit IPs bull Full or mini-mized Memory Space decoding for 18 the PCI address requirement bull With the cPCI4IP-MM option 8 CompactPCI 4IP cards take the same PCI address space as 1 full Mem Space card

RSC No 34905

ACQ132CPCI32 channel MHz class simultaneous sampling intelligent digitizer bull 32 simultaneous analoginput channels 2-32 MSpschannel 14-bit resolution bull Differential inputs bull Intelligent cardwith 1 gigabyte memory and GbE on board bull Large distributed FPGA resource on boardbull Range of DSP functions including FIR filtering and Digital Downconverter

RSC No 35482

D-TACQ Solutions Ltdwwwd-tacqcouk

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CR11Based on the Intel Core Duo Processor the platform is designed to support processor speeds from 106 GHz up to 20 GHz bull Intel Core 2 Duo runs at 15 GHz up to 20 GHz bull Conduction cooled bull Two PMC slots bull PCI Express bull 2x GbE

RSC No 33156

ICS-72532-channel 6U CompactPCI DAC board bull 6U CompactPCI data acquisition card bull 32 differential output channels bull 16 or 24-bit sample size bull 288 kHzch data rate bull Simultaneous sampling across all channels on single or multiple boards bull 32 separate delta-sigma DACs bull 64-bit 66 MHz CompactPCI PICMG 20 Rev30 hot-swappable bull FPDP II 400 MBps interface

RSC No 33576

ICS-71032-channel 6U CompactPCI ADC board bull 6U CompactPCI data acquisition card bull 32 differential input channels bull 216 KHzch 24-bit resolution bull Software selectable full scale input bull FPDP II 400 MBpsinterface bull 64-bit 66 MHz CompactPCI PICMG 20 Rev 30 hot swappable bull 32 synchronous boards for simultaneous sampling bull Sonar acoustics and test and measurement applications

RSC No 33578

Tsumani 6U CPCI Development KitFPGA processor solution targeted at high performance software defined radio applications bull Dual Stratix EP1S80 FPGAs are tightly coupled to provide apower platform for signal processing bull Two PMC module sites provide IO connectivity to either front panel or back panel connections bull A direct highbandwidth 1 GBps path from the PMC P4 connector directly to the FPGAs bull Model 919 Dual DAC Mezzanine provides broadband analog signal generationin a compact form bull The board features two independent DAC channels each with its own 12-bit LVDS input capable of running at rates up to 160 MHz

RSC No 32026

CP11Rugged 6U SBC bull Up to 4 GB of DDR2 SDRAM (200 MHz) with enhanced ECC four independent onboard PCI buses system host and peripheral modesupport for the CompactPCI backplane two PMC interfaces (64-bit133 MHz and 32-bit33 MHz) bull Instead of the PMC1 a PCI Express based XMC interface is available on request bull Two GbE one Fast Ethernet two serial interfaces (RS-232 or RS-422485) USB 20 integrated HDD or flash drive bull High performance 2D3D ATI video controller capable of driving two displays in parallel supports VGADVI interface bull Intel Core 2 Duo at 216 GHz Intel Core Duo at 20 GHz2x PMC expansion site bull One XMC optional bull Up to 4 GB DDR2 SDRAM wECC 2x GbE

RSC No 33447

GE Fanuc Intelligent Platforms Incwwwgefanucembeddedcom

Single Board ComputersGD Canada designs and manufactures conduction-cooled Single Board Computers (SBCs)using Intel processors bull 6U and 3U form factors for CompactPCI backplanes bull Fully backward compatible with earlier models bull Upgradeable via the change-out of processor memory andIO modules bull Used within GD Canada computer systems and sold as individual products

RSC No 35281

General Dynamicswwwgdcanadacom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cPCI6U-24DSI32R32-channel 24-bit delta-sigma CompactPCI 6U analog input board with rear IO bull Low noise 24-bit resolution low phase distortion andmulti-board synchronization bull Suits state-of-the-art sonar and noise monitoring applications bull 32-channel cPCI6U-24DSI32 analog input boardprovides a high-density 24-bit analog input resources on a standard 6U CompactPCI expansion board bull Applications from precision voltagemeasurements to complex audio signal and waveform analysis

RSC No 34985

General Standards Corporationwwwgeneralstandardscom

Duet 3U 64-bit 1 GHz TMS320C6416 DSP (x2) 64 MB SDRAM per processor bull Flexible internalexternalcommunication mesh bull 64-bit66 MHz CompactPCI bull PMCXMC site with Jn4 to FPGA and4 RocketIO per VITA 42 bull External data port up to 12 Gbps bull 4M or 5M Virtex-II Pro FPGAbull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM dedicated800 MBps links between DSPs bull 3U CompactPCI with PXI support bull Suits high-end co-processing wireless broadband communications RADAR video and biometrics

RSC No 32856

QuadiaQuad-DSP bull Dual FPGA bull Dual PMC sites bull Inter-processor connectivity and access to external interfaces bull Four C6416 DSPs split in two independent clusters each hosting a PMC site bull One large FPGA for end-user code bull Central FPGA routing interprocessor communication bull End-user FPGA communication bull External port serial IO for PCIe or other p ivate link bull Global memoryand PCI interface bull 1 GHz TMS320C6416 DSP (x4) bull 64 MB SDRAM per processor bull Flexible internalexternal communication mesh bull 64-bit66 MHz CompactPCI bull Two PMC sites with Jn4 to FPGA bull External data port up to 12 Gbps bull Two 4M Gate FPGA reserved for end-user code bull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM bull Up to 512 MB Global DDR SDRAM bull Suits high-end co-processing wireless and broadband communications

RSC No 34737

Quixote 64-bit 6UAdvanced signal capture generation and co-processing bull 1 GHz TMS320C6416 DSP and2 to 6 MGATE Virtex-II FPGA bull 32 MB SDRAM 8 MB ZBT SBSRAM and AD6645 and AD9764 converters bull 6432 bit CompactPCI 66 MHz 5 V33 V and complex trigger modes with HW event logging bull PMC site with Jn4 to FPGA DIO and PICMG 217 StarFabric compliant bull Suits Software Defined Radio wireless IP and RADAR development and hardware testing bull Physical Layer field testing ultra-fast flexible data acquisition vector signal generation and electronic warfare

RSC No 32861

Innovative Integrationwwwinnovative-dspcom

IC-e6-cPCIbHigh performance 6U CompactPCI board bull Powered by one or two of Freescalersquos mostadvanced 14 GHz MPC7448 PowerPC processors bull PICMG 216 compliant bull Marvell Discovery III chipset (MV64460) bull Low power consumption bull Standard extended and rugged grades

RSC No 32982

Interface Conceptwwwinterfaceconceptcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CP213Single-width 6U CompactPCIPXI module with either 32 or 64 differential analog input channelsbull 32 64 or 128 channels of analog input bull 16 multifunction digital IO (TTL) channels that may beconfigured as digital in digital out or selectively attached to 2 frequency in 2 counter in andor 2 timerout channels bull 16-bit resolution bull Programmable gain per channel programmable scan rates of lt1 Ss through 100 KSs bull Precision onboard reference for end-to-end calibration

RSC No 34804

KineticSystems Company LLCwwwkscorpcom

CP6001Energy efficient embedded Intel dual core processors bull 12 GHz Intel Core Duo U2500 ULV processor bull Intel Core 2 Duo L7400 LV processor bull Based on the Intel Mobile 945GM chipset with a front side bus of up to 667 MHz and ICH7-R Southbridge bull Two independent digital video outputs to the rear IO (2x DVI - 1x DVI and 1x HDMI) bull AC97 audio capabilities bull 3 x GbE bull 4 x SATA with RAID 01510 functionality bull 6 x USB 20 2 x COM and VGA or DVI bull Can also accommodate a PMC slot or an onboard 25 inch SATA HDD bull Up to 8 GB of USB or 2 GB soldered flash bull Supports Linux Windows XP XP embedded and VxWorks 6

RSC No 34182

CP6923 GbE Switch6U CompactPCI GbE Switch PICMG 216 compliant bull Leading edge te hnology basedon BCM5650X chip bull 24x GbE ports bull Non-blocking Layer 2 and 3 switching and routingbull Copper optical rear IO version bull Hot swap IPMI bull Fully managed bull Comprehensive firmware package bull Applies to VoIP installations such as call servers media gatewaysand trunking gateways in wireline and wireless networks as well as VoIP systems inenterprise networks with high demands on performance

RSC No 32256

Kontronwwwkontroncom

TMS320C6701 Virtex-IITexas Instrumentsrsquo C6701 DSP bull Xilinx Virtex-II series FPGA up to XC2V8000 bull Multiple IO interfaces Onboard CODEC VIM expansion sites 60-pin GPIO header and JTAG bull Hardware drivers integration in SimulinkXilinx System Generator Blocksets for quick implementation of Simulink models bull DSP and FPGA-in-the-loop cosimulation of SimulinkXilinx System Generator models bull Leading edge communication interface allowing real-time datamonitoring from Simulink scopes and remote operations

RSC No 32028

VHS-DACHigh performance multichannel DA for phased array antenna systems radarsonar communications receiversup-sampling to IF stage and RFIF AGC apps bull Eight 125 MSPS output channels bull Optional add-on daughter boardprovides 8 additional output channels or 8 additional input channels bull 32-bit 25 MHz bull FPDP interface with 400 MBps transfer rate (25 MSPS per channel at 8 channels 125 MSPS at 16 channels) bull Low level hardware drivers API andGUI bull High level hardware drivers integration in Simulink Blocksets bull Leading edge communication interface fordata recording and playback tofrom the onboard SDRAM

RSC No 32029

Lyrtechwwwlyrtechcom

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PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

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PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

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PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

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PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

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PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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Page 23: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

the board the thickness and composition of metal cladding and the spacing between layers can all affect the trace characteris-tics Controlling these parameters under specification ensures that timing charac-teristics are sufficiently uniform from one board to another However current speci-fications are too detailed and stringent It is extremely difficult to attain compliance yet avoid adding cost to the design

Specifications need workSome of these parameters are already incorporated into current specifications The AMC module specifications from PICMG for instance include design parameters that ensure its proper opera-tion at signal speeds as fast as 125 Gbps per lane Establishing specifications for other system components will help achieve interoperability of standards-based designs at higher frequencies

Design tools may also need to be modified and the industry will need to create new design rules for high frequency and incor-porate these into the tools Developing new routing techniques will help avoid the issues of electrical phenomena such as skin effect dielectric loss and impedance mismatches These are much more preva-lent at higher frequencies and it becomes critical for engineers to model and simu-late these phenomena more accurately

Early efforts are already underway to address the challenges that higher fre-quency signals bring to standards-based design The Interconnect Channel Characterization Subcommittee of PICMG established in September 2006 is develop-ing ground rules and definitions to be used in characterizing transmission reflection and crosstalk performance in backplane and mezzanine carrier interconnects The committee aims to define the channel parameters to be measured or analyzed as well as the methods for doing so Its charter calls for it to address

n Definition of interfaces at which measurements are made or characteristics computed

n Test equipment fixtures and PCB test coupons

n Details of measurement proceduren Data formatsn Techniques for de-embedding

components of the channeln Techniques for validating

measurement based models ie passivity and causality

n Definitions that allow reasonable compliance testing

n Boundary definitions for different paths

n Define information regarding limita-tions or proper usage ie maximum data raterise times that are supported by the models

Such efforts are only a beginning how-ever Other design details still need to be addressed such as SERDES IO Configuration New functionality may need to be defined The design of high data rate system channel interfaces according to standardsspecifications does not currently cover the individual characteristics of the chip transmitterreceiver characteristics Thus work will be needed to address how such standard designs handle such dependency

Crossing an interoperability thresholdOne way of handling location dependen-cies might be to give the system control-ler the ability to inform modules what the channel transmitter and receiver PE and EQ technology is and importantly how to control it With this information along with the signal attenuation suffered (at a given bit rate) for the channel the system should be able to configure SERDES channels in different physical locations to run reliably and at the required BER In MicroTCA systems for instance this functionality could be incorporated into the MicroTCA Carrier Hub (MCH) as part of its electronic keying function Modules would have to be able to configure and control its backplane interfaces to allow for different positions

in the backplane An MCH (see Figure 3 courtesy Emerson) then would be able to instruct a module as to which parameters to use for interoperability

The specific approaches needed to handle location dependencies and other challenges that higher signal rates raise have yet to be developed The need to address these challenges however is clear Increasing demand for services is driving applications to utilize faster signal rates This in turn is driving backplane signaling speeds ever higher As speeds rise above 10 Gbps sig-nals will cross a threshold where current specifications will prove inadequate for ensuring interoperability among standards-based designs

The industry should begin developing new or enhanced specifications and design tools to address the challenges of higher signal rates Without such improvements the guarantees of interoperability that allow system developers to readily create solu-tions by combining off-the-shelf products will be compromised As backplane speeds approach 100 Gbps nothing can be taken for granted

Stuart Jamieson Director of Industry RelationsArchitect with Emerson Network Power Embedded Computing represents Emerson on PICMG committees and the SCOPE organization and previously served as a CP-TA Board member (Treasurer) He brings over 18 years of experience in hardware protocols embedded software and specification development to these groups Within Emerson he played a key role in the develop-ment of the technology central to Emersonrsquos bundled network-ing solutions Stuartrsquos positions within Emerson have included Director of Business Development Director of Advanced Technology and Architect He is the Draft Editor for the PICMG Interconnect Channel Characterization Subcommittee is the author of the introduction section for the new PICMG Ruggedized MicroTCA specification and served as the Draft Editor for the PICMG MicroTCA Specification Stuart gradu-ated from the Heriot-Watt University in 1989 with a 1st Class Honors degree in Electrical and Electronic Engineering and again in 1992 with an IBM-sponsored Master of Philosophy

Emerson Network Power Embedded ComputingStuartJamiesonEmersoncom bull wwwemersonembeddedcomputingcom

Figure 3

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TECHNOLOGY g BACkpLANES

2008

B A

N D

W I

D T

H

Signal integrity challenges to bandwidth scalabilityFor the purposes of this article each interconnected differential pair will be referred to as a Channel (which should not be confused with an aggregated AdvancedTCA channel comprising four trans-mit and four receive pairs)

14-slot full-mesh AdvancedTCA backplanes contain hundreds of Channels Each Channel is defined as the copper signal path from the output of a driver device to the input of a receiver device As

By douglaS Hynd

Developing IEEE 8023ap 10GBASE-KRcompliant backplanes

Why doesAdvancedTCA

need bandwidthscalability

PICMG AdvancedTCA 30 has emerged as the

industryrsquos Hardware Platform standard of choice and

is enjoying first-phase deployment However many

believe that for AdvancedTCA to realize its market

potential AdvancedTCA platforms need to seamlessly

scale to accommodate 40 GbE fabrics thereby

avoiding forklift upgrades as system bandwidth

demands increase over time A 40 GbE switch fabric

architecture would enable realization of a common

platform for computing storage control and media

and packet processing and provide the versatility and

long term ROI required by service providers in

todayrsquos increasingly competitive environment

The challenge was to develop a family of

AdvancedTCA products which feature PICMG 30

compliant dual star and full mesh advanced

backplane switch fabrics enabled up to 10 Gbps

per differential signal pair thereby giving 40 Gbps

per AdvancedTCA channel performance

This article describes the signal integrity challenges

presented in designing an IEEE 8023ap

10GBASE-KR-compliant bandwidth-scalable

14-slot AdvancedTCA platform and how these

challenges were overcome in development of full

mesh and dual star backplane reference designs

Fo Sin Pnt

shown in Figure 1 that signal path comprises a signal launch a blade PCB transmission line a daughtercard via a right-angled HM-ZD connector a mated HM-ZD backplane header a back-plane via a length of backplane PCB transmission line and then the same combination of connectors vias and transmission line at the receive end of the Channel

Sources of crosstalkFour principal sources of crosstalk in each Channel must be man-aged as shown in Table 2 Source number one is between adjacent differential pairs as they are routed across the backplane Common mode noise rejection in system differential pair structures makes this a minor issue The second source of crosstalk lies in the HM-ZD connector itself

Crosstalk in via fields our third source primarily arises from inductive coupling between adjacent differential pairs and domi-nates the crosstalk agenda in high-speed Channels This source of crosstalk is directly proportional to the length of the via barrel and where practical care must be taken to ensure that adjacent connector rows are terminated to different target routing Layers

The final source of crosstalk is caused by aggressor signals in through-routed via fields coupling with victim Channel traces as they pass through As mentioned earlier judicious and careful design can mitigate this impact

Skew Channel skew is a function of differential transmission path geometries At a fundamental frequency of 5 GHz skew can be a significant issue in high-speed system design due to narrowing the eye opening and increasing jitter Skew can have a significant impact on crosstalk it negatively impacts the common mode rejection of noise inherent to differential signaling Conductor surface roughness in lower performing dielectric materials can also cause skew in high-speed systems

Skew can be avoided through careful management of transmission path lengths in each Channel and by using higher-glass content (lower Dk) laminates

LossPotential

Potential Mismatches

Channel

Loss Potential Channel

PCB Tolerance -025 dB 2 -01 dB

Connector Tolerance -001 dB 4 -016 dB

Thru-routed Via Fields -001 dB 12 -144 dB

Connector Launch -025 dB+ 4 - 2 dB+

Quantity TotalNEXT

TotalFEXT

PCB Transmission Lines

24 in60 cm

-50 dB -70 dB

Connector Architecture 2 -26 dB -24 dB

Via Fields 4 -22 dB -20 dB

Connector Pass Through 8 -34 dB ndash34 dB

For the target application each one of these Channels must deliver a 10 Gbps Non-Return-To-Zero (NRZ) signal with sufficient signal fidelity to enable a receiver device to detect and process a differential signal The PICMG 30 specification is targeted at 3125 Gbps signaling with a fundamental frequency of 156 GHz Even in low loss dielectric materials insertion loss at 10 Gbps (5 GHz fundamental) is twice that of a 3125 Gbps signal

Therefore achieving acceptable signal fidelity requires careful management of signal losses and noise in each Channel such that an acceptable signal-to-noise (SN) ratio is achieved at the receiver

The design process therefore begins by understanding and mitigat-ing the sources of losses and noise in each Channel

Sources of lossThere are three sources of loss

n Conductor losses which are due to skin effects and can be addressed by maximizing the cross sectional area of the signal traces

n Material dispersion losses which are a function of the dielectric constants of the chosen material These can be mitigated by choosing a higher performance laminate material such as Nelco 4000-13SI or Megtron

n Reflected power loss due to impedance mismatches in the Channel as each signal transitions across the different copper media in each channel (connectors vias and PCB traces) and passes through the pad and anti-pad structures of the via fields of other backplane blade slots

Table 1 shows the relative effects of different sources of impedance mismatches The dominant source of impedance mismatches in every Channel resides in the via structures Successful mitigation of this problem requires that every via is tuned by back-drilling the stub and adjusting the pad and anti-pad structures to match the impedance to be 50 ohms irrespective of the target routing layer This in turn requires that the capacitive and inductive effects of the connector pin and via barrel combination are taken into account during the design of each Channel

Further complicating via design is the space the anti-pad structures need to accommodate Channels being routed between other blades while minimizing electro-magnetic coupling with them This space consideration makes the shape and orientation of pads and anti-pads extremely important

Figure 1

Table 1

Table 2

Fo Sin Pnt

IEEE 8023ap provides a design targetAs Ethernet has emerged as the industryrsquos dominant signaling methodology the IEEE has developed the 10GBASE-KR norma-tive Channel model to define interconnect Channel performance for NRZ signaling at 10 Gbps This standard defines acceptable performance in terms of S-parameter charts for through-Channel insertion loss and worst-case crosstalk Figures 2a and 2b illustrate masks for Draft 24 of the standard that was initially used for this exercise

In each case the mask defining compliant performance is shown in blue Channel insertion loss is shown in red in Figure 2a Crosstalk performance is defined by the ICR curve (Figure 2b) Minimum acceptable Channel performance is defined in the ICR chart (Figure 2b) by the blue line The effect of the sum of all aggressors on the through-Channel is shown in red The green ICR curve is the ratio of the crosstalk power sum calculated by summing the

magnitudes of any impacting crosstalk Channels for each fre-quency and using a straight line fit (using least-squares method) to determine the resulting average effect f the aggressors on the through-Channel This is then overlaid on the insertion loss and used to plot the ICR curve

This standard which has evolved through a variety of iterations forms the basis for developing a 40 GbE switch fabric backplane featuring 10 Gbps NRZ differential pairs If all differential pairs can meet this standard then the backplane can be considered to be 10GBASE-KR compliant

Applying 10GBASE-KR to a 14-slotAdvancedTCA applicationThe PICMG specification dictates that receive differential pairs are placed on the c-d and g-h rows of the HM-ZD connector and that transmit differential pairs are placed on the a-b and e-f rows Therefore the middle differential pair in row c-d of Slot B will be subject to the NEXT of three aggressors in each of the a-b and e-f transmit rows of slot B plus the FEXT of the signals being received in the c-d pairs in the top and bottom of slot B

In this topology it can be seen that worst-case crosstalk would occur if all the NEXT and FEXT aggressors were routed on the bottom Layer that is on the same Layer as that of the victim c-d However given that all signal vias must be back-drilled and tuned for impedance management purposes Channel crosstalk can simultaneously be reduced by allocating different routing Layers to differential pairs terminated in the same backplane connector

The principal factor in determining the feasibility of a 10GBASE-KR compliant backplane is based on understanding whether the Channel with the worst-case signal-to-noise ratio is compliant

The skew targets determine permissible layer separation between a-b c-d e-f and g-h pairs within each Channel and enable routing Layers to be allocated for each pair It is now possible to start the process of via tuning to optimize the channel performance for minimum insertion loss Modeling begins by defining the simulation boundaries for the channel so that Channel component models (PCB traces connectors vias) can easily be aggregated to model complete Channels Boundaries must be established at locations in the Channel where linear 3D structures exist These are shown in Figure 3 (next page)

Since the connector and via combinations for the backplane and daughtercard mating halves must each be treated as a whole it

PICMG 30Spec

TurboFabricSpec

Total Inter-PairSkew

(Fabric Interface)

05 mm in FR4(34 ps)

001 mmin N4000-13si

(00625 ps)

Total Intra-Channel Skew

(Fabric Interface)

254 mm in FR4(17 ps)

plusmn01 mmin N4000-13si

(0625ps)

Total Intra-Channel Skew

(Base Interface)

135 mm in FR4(90 ps)

plusmn01 mmin N4000-13si

(0625 ps)

Figures 2a and 2b

Table 3

Determining which Channel that is and identifying the worst-case SN requires making trade-offs with regard to PCB material Channel length via design connector row selection and NEXT and FEXT aggressor routing choices These trade-off choices can only take place using advanced 3D simulation tools such as Ansoft HFSS This was the essence of the design process employed in developing Simclarrsquos TurboFabric backplanes

The simulation processThe transmission length for full mesh and dual star backplanes design implementations varies from a maximum of 1632 inches to a minimum of 116 inches With an effective transmission length of 5 inches on each daughtercard this makes the longest effective Channel 2632 inches including two connectors

For a 10GBASE-KR application over this distance a high-perfor-mance laminate is essential for both reducing insertion loss and

ensuring high glass content in the weave to mitigate skew So the design process began by choosing a low-loss dielectric material (Nelco 4000-13SI for both the backplane and the daugh-tercards) and establishing targets for Inter-Pair and Intra-Channel skew as shown in Table 3

Adhering to the PICMG 30 specifi-cation for skew in a 10GBASE-KR application is impractical Instead a target of 00625 ps was set for Inter-Pair skew with 0625 ps set for Intra-Pair skew for the backplane only This equated to a maximum 001 mm differ-

ence being allowed between traces of any differential pair and 01 mm being permitted between traces of any four differential pairs in a Channel Given the topology of the HM-ZD connector daughter-card skew must be accounted for in the daughtercard layout Fo

Sin Pnt

should be noted that the simulation boundary is located within the mated connector

Tuning the connector and via structures to 50Ω is an iterative process involving the removal of excess pads back-drilling and tuning pads anti-pads and traces A Time Domain Reflectometer (TDR) plot illustrating the results of the tuning process is shown in Figure 4

Upon completion of the modeling process a total of 17 different optimized via and routing configurations had been designed for the full mesh design and nine for the dual star design

A plot of worst-case insertion loss is shown in Figure 5 and demonstrates that in both cases performance is well above the 10GBASE-KR mask

When all the through-Channels have been modeled adjacent Channel models can be combined and ICR curves plotted to evaluate the impact of crosstalk on through-Channel performance This valuable information can be used to adjust the position of signal Layers relative to pass-through aggressor traces on adjacent Layers or to reroute traces to reduce crosstalk Similarly routing Layers can be changed to reduce crosstalk in adjacent via barrels

Figure 6 plots worst-case ICR and demonstrates that performance is above the 10GBASE-KR mask Based on this result it was possible to proceed to physical implementation

Figure 3

Figure 4

Fo Sin Pnt

Physical realizationThe layout process was performed using the Mentor Board-Station CAD system Quad-routing (routing four traces between pads) was explored as a routing method-ology in order to reduce Layer count but this was dismissed due to the detrimental impact on crosstalk performance

The attributes of the physical backplanes produced as a result of the design effort are shown in Table 4

The design files produced included the usual gerber files plus detailed back-drilling instructions

The design validation process comprised a conventional continuity test followed by performance testing featuring Agilent equipment including 70340A signal generator 8720ES Network Analyzer NN18A S-Parameter test-set and 86100A sampling oscilloscope with Agilent 86112A module Figure 7 (next page) shows the test set up

Simclar developed special line cards to enable through-Channel measurements with and without crosstalk The signal launch featured compression mount SMAs terminated in a tuned via structure The Channel simulations included simu-lation of the tuned launch structures so de-embedding of the launches was not necessary for correlation to simulation purposes The development team also established a process for characterization of all Channels

Full Mesh Dual Star

Layer Count 34 18

Aspect Ratio 121 61

Tuned Vias 3952 768

Material Nelco 4000-13SI

Table 4

Figure 5 Figure 6

Fo Sin Pnt

In Figure 8 measured through-Channel performance and ICR curves are shown for the same Channels described in the simula-tion section earlier

As can be seen from Figure 8 there is close correlation between these and the simulated plots in Figures 5 and 6 In fact close correlation between all simulated and measured results was achieved resulting in a 728 Tbps capacity full mesh and a 960 Gbps capacity dual star backplane design now generally available as part of the Simclar TurboFabric shelf

Figure 7 Figure 8

Figure 9

Figure 10

Implications of 10GBASE-KR Draft 33versus Draft 25The work described above was targeted towards meeting the Channels specifications contained in Draft 25 of the IEEE 10GBASE-KR Since this work was completed the IEEE has up-issued the Draft revision level for the Standard from 25 to 33 While this has not impacted through-Channel performance demands it has increased Channel isolation requirements by around 10 dB In Figure 9 a Draft 33 mask is added to the ICR plot shown in Figure 8

From Figure 9 it can be seen how Draft 33 pulls the mask above the Channel ICR curve for this full mesh backplane Channel Surprisingly it is the Channelrsquos frequency response at relatively low frequencies between 100-500 MHz that is causing a problem The reasons for this are currently the subject of further detailed investigation

However Figure 10 shows a Draft 33 plot for a less demanding dual star AdvancedTCA implementation featuring shorter trans-mission distances This plot demonstrates compliance to Draft 33 of the IEEE 8023ap 10GBASE-KR Standard

ConclusionBy developing a close understanding of the many factors contrib-uting to loss and noise in multi-gigabit backplane Channels it is possible to characterize their performance using advanced simula-tion techniques and correlate that performance in physical prod-ucts using advanced test methods By overlaying the test results on S-Parameter masks defined by the IEEE 8023ap 10GBASE-KR Standard it has been demonstrated that backplanes that truly enable AdvancedTCA scalability are at last a reality

Douglas Hynd joined Simclar Group in 2006 as Director of Marketing as part of Simclarrsquos acquisition of Northrop Grumman Interconnect Technologies Division wherehe was Vice President of Marketing and Sales He has more than 24 yearsrsquo experience intechnology sales marketing and generalmanagement and holds a BSc (Eng) in Electronics and Electrical Engineeringfrom the University of Glasgow He isbased at Simclarrsquos Global HQ inDunfermline Scotland

Simclar Groupdouglashyndsimclarcom bull wwwsimclarcom

Fo Sin Pnt

6U CompactPCIPrOduCT GuIdE g

This monthrsquos issue includes a 6U CompactPCI Product Guide and Irsquod like to take the opportunity to reflect a bit on the success and evolution of that technology

Back in the 1994 time frame when CompactPCI was first being devel-oped it began as 3U-only technology It used the same Eurocardmechanics that were popularized by VME and an IEC standardized high-

density high-speed connector available from a number of vendors suitablefor 33 MHz PCI signaling That connector was selected by the engineers atZiatech with help from Mike Munroe then at ERNI The majority of VMEdesigns were 6U and based on this I was among a number of folks thatargued for adding the 6U CompactPCI form factor

The 6U form factor presented some challenges and opportunities Onechallenge was that the insertion and extraction forces were quite high when the entire rear of the card was populated with connectors Fortunately the IEEE standards for Eurocards evolved and injectorejector handles that pro-vided leverage became available Eike Waltz then at Rittal was instrumental in bringing that to the table Two of the opportunities that came along withthe extra connectors were a clean way to add secondary buses like the H110 telephony bus to the backplane and the ability to route IO out the rear through rear transition modules PICMG has developed quite a number of subsidiary specifications defining the interoperable use of the extra backplane pins made possible with the 6U form factor Both of these features have played a major part in CompactPCIrsquos success The next major evolution of 6U CompactPCI came with the PICMG 216 Packet Switched Backplane standard which was originally conceived by John Peters and his team at Performance Technologies PICMG 216 interconnected a shelf full of CompactPCI single board computers via redundant Ethernet switches also in the 6U CompactPCI form factor This dramatically increased usable backplane bandwidth and provided redundancy PICMG 216 paved the way for AdvancedTCA and was the industryrsquos first open standard for the switched serial interconnect standards we see popping up in many places

By Joe Pavlat

Looking back and ahead at6U CompactPCI

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Recent 6U CompactPCI related products are listed here For more informationenter the productrsquos RSC No at wwwcompactpci-systemscomrsc

cPCI-6910Dual-core Intel Xeon Processor LVULV Universal blade bull Supports Single Dual-Core Intel Xeon LV or ULV processorsbull Front Side Bus 667 MHz bull Up to 2 GB DDR2 400 MHz soldered SDRAM with ECC bull Four PCI Express GbEbull Up to 4 USB 20 ports bull PICMG 20 21 29 216 compliant

RSC No 35013

ADLINK Technologywwwadlinktechcom

CPCIStor Module6U CompactPCI storage blade bull Onboard ATA controller supports CDDVD HDD and solid-state flashbull Supports Hot Swap Removal (ask about RAID support) bull ATA disks available in Enhanced Dutycycle versions for NEBS Level 3 - 724 requirements bull Operating Systems supported VxWorksLinux and Windows

RSC No 34800

ACTTechnicowwwacttechnicocom

Prosody X cPCI E1T1An E1T1 digital network access card bull Suits telco developers and systems integrators bull Uses Aculabrsquos worldwide protocol coverage including Aculabrsquos SS7 stack available under a cost free license bull Available with 8 or 16 E1T1 trunks and software selectable E1T1 interfaces bull Flexible mix of protocols including ISDN CAS and SS7 (ITU-T China and ANSI) bull A variety of interconnect switching and protocol conversion solutions can be readily crafted bull High availability reliability and scalability with industry standard hardw re and software interoperability bull Up to 128 SS7 signaling links bull Non-circuit related (TCAP) messagingintensive applications such as prepaid and SMS

RSC No 35408

Aculabwwwaculabcom

Adexp8021Intel Core Duo L2400 (166 GHz) w E7520 server chipset bull Dual channel PC2-3200 Registered RAM SECDED or x4 SDDC bull Two GbE two Serial ATA four USB 20 bull Onboard SXGA graphics 1280 x 24-bitbull 6U CompactPCI Bus PICMG EXP0 R10 Specification bull RoHS compliant 0 degC to +55 degC operating range

RSC No 32837

Advanet Incwwwadvanetcojpen

TC84012 channel single-stop Time-to-Digital Converter (TDC) with single-start and multi-start acquisition modes bull 50 ps timing resolution bull Wide range with upto 20 s between first and last events bull Large internal memory buffer with up to 512 hits per channel bull Low jitter (lt3 ps rms) high stability (plusmn2 ppm) internalclock source bull External 10 MHz reference input bull FPGA based Data Processing Unit (DPU) bull Fast readout with DMA mode for increased data throughputbull Overvoltage-protected inputs with 50 Ω K-Lock (LEMO) connectors bull Built-in self calibration bull Modular single-slot 6U PXICompactPCI standardbull Low power consumption (lt22 W)

RSC No 33445

Agilent-Acqiriswwwacqiriscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

MIC-30428-slot 6U CompactPCI backplane bull AC or DC CompactPCI 500 W + 250 W redundant(2+1) power supplies bull PICMG 216 (CompactPCI Packet Switching Backplane) compliancebull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarmmodule (MIC-3924L-AE)

RSC No 32851

MIC-30436-slot 6U CompactPCI backplane bull Supports two hot-swappable SCSISATA or removableIDE HDD bays bull Built-in IDE slim-type DVD-ROM bull AC or DC CompactPCI 250 W + 250 Wredundant (1+1) power supplies bull Supports hot-swappable fan modules bull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarm module (MIC-3924L-AE)

RSC No 32850

Advantech Corporationwwwadvantechcom

Dual-Core Xeon CompactPCI SBCModel PP 42123x bull Dual CPU 6U CompactPCI SBC supporting two dual-core Xeon CPUs bull Up to 8 GB DDR2 ECC SDRAM in a single system or peripheralslot bull Dual processor SBC in a single 6U CompactPCI slot bull Supports two 166 GHz Dual-Core Intel Xeon ULV processors using Intel E7520 server chipsetbull Up to 8 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull PMCXMC site support 66 MHz PCI-X and x8 PCI Express bull Front and rear IO bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade bull Four GbE ports with option for PICMG 216

RSC No 34761

6U CompactPCI Core 2 Duo SBCModel PP 41203x bull 6U CompactPCI Core 2 Duo SBC supporting two PMC sites includingone XMC site bull Up to 4 GB DDR2 ECC SDRAM bull All in a single system or peripheral slot bull TwoPMC sites supporting up to 100 MHz PCI-X bull One XMC x8 PCI Express bull Front and rear IObull Supports 216 GHz or 15 GHz Intel Core 2 Duo processors bull Intel E7520 server chipsetbull Up to 4 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade

RSC No 34763

PP 30202xTwo processor versions available bull 18 GHz Intel Pentium M processor 745 uses mFC-PGA 478 (micro Flip-Chip Pin Grid Array) package bull 14 GHz Intel Pentium M processor Low Voltage 738uses mFC-BGA 479 (micro Flip-Chip Ball Grid Array) package bull 64 KB primary (L1) on-die cache2 MB of secondary (L2) on-die cache bull 400 MHz Front Side Bus (FSB) bull No CPU fan bull 16 GHz processor version (1 MB L2 cache) available see PP 30002x datasheet bull Utilizes 64-bitIntel 855GME chipset bull Supports 400 MHz bus frequency bull Uses Intel 6300ESB IO Controller Hub

RSC No 32659

Concurrent Technologies Incwwwgocctcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cCIBPMC6U-ETA 6U bridged dual PMC carrier that bridges extended temperature CompactPCI boards and PMCs bull Features a rugged CompactPCI form factor providing increased flexibility to military communications systems designers bull Provides additional design choices to users through its differing bus speeds maximizing the numberof PMCs that can be used CompactPCI andPMC buses can both run at 66 or 33 MHzbull Operating temperature range of -40 degC to+85 degC bull Signal conditioning bull DMA supportbull Low-power design +5 V +33 V +12 V -12 V bull User-selectable VIO of 33 V or 5 V to the PMC

RSC No 32891

Dynamic Engineeringwwwdynengcom

cPCI4IP-MMMinimized PCI address footprint IndustryPack carrier for CompactPCI applications bull 6U 4HP4 IP positions 832 clock selection for each slot fused filtered power IO options bull ID INT IO and Mem spaces are decoded for each IP slotbull Single and double wide IPrsquos bull 16- and 32- bit IPs bull 32-bit access to 16-bit IPs bull Full or mini-mized Memory Space decoding for 18 the PCI address requirement bull With the cPCI4IP-MM option 8 CompactPCI 4IP cards take the same PCI address space as 1 full Mem Space card

RSC No 34905

ACQ132CPCI32 channel MHz class simultaneous sampling intelligent digitizer bull 32 simultaneous analoginput channels 2-32 MSpschannel 14-bit resolution bull Differential inputs bull Intelligent cardwith 1 gigabyte memory and GbE on board bull Large distributed FPGA resource on boardbull Range of DSP functions including FIR filtering and Digital Downconverter

RSC No 35482

D-TACQ Solutions Ltdwwwd-tacqcouk

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CR11Based on the Intel Core Duo Processor the platform is designed to support processor speeds from 106 GHz up to 20 GHz bull Intel Core 2 Duo runs at 15 GHz up to 20 GHz bull Conduction cooled bull Two PMC slots bull PCI Express bull 2x GbE

RSC No 33156

ICS-72532-channel 6U CompactPCI DAC board bull 6U CompactPCI data acquisition card bull 32 differential output channels bull 16 or 24-bit sample size bull 288 kHzch data rate bull Simultaneous sampling across all channels on single or multiple boards bull 32 separate delta-sigma DACs bull 64-bit 66 MHz CompactPCI PICMG 20 Rev30 hot-swappable bull FPDP II 400 MBps interface

RSC No 33576

ICS-71032-channel 6U CompactPCI ADC board bull 6U CompactPCI data acquisition card bull 32 differential input channels bull 216 KHzch 24-bit resolution bull Software selectable full scale input bull FPDP II 400 MBpsinterface bull 64-bit 66 MHz CompactPCI PICMG 20 Rev 30 hot swappable bull 32 synchronous boards for simultaneous sampling bull Sonar acoustics and test and measurement applications

RSC No 33578

Tsumani 6U CPCI Development KitFPGA processor solution targeted at high performance software defined radio applications bull Dual Stratix EP1S80 FPGAs are tightly coupled to provide apower platform for signal processing bull Two PMC module sites provide IO connectivity to either front panel or back panel connections bull A direct highbandwidth 1 GBps path from the PMC P4 connector directly to the FPGAs bull Model 919 Dual DAC Mezzanine provides broadband analog signal generationin a compact form bull The board features two independent DAC channels each with its own 12-bit LVDS input capable of running at rates up to 160 MHz

RSC No 32026

CP11Rugged 6U SBC bull Up to 4 GB of DDR2 SDRAM (200 MHz) with enhanced ECC four independent onboard PCI buses system host and peripheral modesupport for the CompactPCI backplane two PMC interfaces (64-bit133 MHz and 32-bit33 MHz) bull Instead of the PMC1 a PCI Express based XMC interface is available on request bull Two GbE one Fast Ethernet two serial interfaces (RS-232 or RS-422485) USB 20 integrated HDD or flash drive bull High performance 2D3D ATI video controller capable of driving two displays in parallel supports VGADVI interface bull Intel Core 2 Duo at 216 GHz Intel Core Duo at 20 GHz2x PMC expansion site bull One XMC optional bull Up to 4 GB DDR2 SDRAM wECC 2x GbE

RSC No 33447

GE Fanuc Intelligent Platforms Incwwwgefanucembeddedcom

Single Board ComputersGD Canada designs and manufactures conduction-cooled Single Board Computers (SBCs)using Intel processors bull 6U and 3U form factors for CompactPCI backplanes bull Fully backward compatible with earlier models bull Upgradeable via the change-out of processor memory andIO modules bull Used within GD Canada computer systems and sold as individual products

RSC No 35281

General Dynamicswwwgdcanadacom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cPCI6U-24DSI32R32-channel 24-bit delta-sigma CompactPCI 6U analog input board with rear IO bull Low noise 24-bit resolution low phase distortion andmulti-board synchronization bull Suits state-of-the-art sonar and noise monitoring applications bull 32-channel cPCI6U-24DSI32 analog input boardprovides a high-density 24-bit analog input resources on a standard 6U CompactPCI expansion board bull Applications from precision voltagemeasurements to complex audio signal and waveform analysis

RSC No 34985

General Standards Corporationwwwgeneralstandardscom

Duet 3U 64-bit 1 GHz TMS320C6416 DSP (x2) 64 MB SDRAM per processor bull Flexible internalexternalcommunication mesh bull 64-bit66 MHz CompactPCI bull PMCXMC site with Jn4 to FPGA and4 RocketIO per VITA 42 bull External data port up to 12 Gbps bull 4M or 5M Virtex-II Pro FPGAbull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM dedicated800 MBps links between DSPs bull 3U CompactPCI with PXI support bull Suits high-end co-processing wireless broadband communications RADAR video and biometrics

RSC No 32856

QuadiaQuad-DSP bull Dual FPGA bull Dual PMC sites bull Inter-processor connectivity and access to external interfaces bull Four C6416 DSPs split in two independent clusters each hosting a PMC site bull One large FPGA for end-user code bull Central FPGA routing interprocessor communication bull End-user FPGA communication bull External port serial IO for PCIe or other p ivate link bull Global memoryand PCI interface bull 1 GHz TMS320C6416 DSP (x4) bull 64 MB SDRAM per processor bull Flexible internalexternal communication mesh bull 64-bit66 MHz CompactPCI bull Two PMC sites with Jn4 to FPGA bull External data port up to 12 Gbps bull Two 4M Gate FPGA reserved for end-user code bull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM bull Up to 512 MB Global DDR SDRAM bull Suits high-end co-processing wireless and broadband communications

RSC No 34737

Quixote 64-bit 6UAdvanced signal capture generation and co-processing bull 1 GHz TMS320C6416 DSP and2 to 6 MGATE Virtex-II FPGA bull 32 MB SDRAM 8 MB ZBT SBSRAM and AD6645 and AD9764 converters bull 6432 bit CompactPCI 66 MHz 5 V33 V and complex trigger modes with HW event logging bull PMC site with Jn4 to FPGA DIO and PICMG 217 StarFabric compliant bull Suits Software Defined Radio wireless IP and RADAR development and hardware testing bull Physical Layer field testing ultra-fast flexible data acquisition vector signal generation and electronic warfare

RSC No 32861

Innovative Integrationwwwinnovative-dspcom

IC-e6-cPCIbHigh performance 6U CompactPCI board bull Powered by one or two of Freescalersquos mostadvanced 14 GHz MPC7448 PowerPC processors bull PICMG 216 compliant bull Marvell Discovery III chipset (MV64460) bull Low power consumption bull Standard extended and rugged grades

RSC No 32982

Interface Conceptwwwinterfaceconceptcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CP213Single-width 6U CompactPCIPXI module with either 32 or 64 differential analog input channelsbull 32 64 or 128 channels of analog input bull 16 multifunction digital IO (TTL) channels that may beconfigured as digital in digital out or selectively attached to 2 frequency in 2 counter in andor 2 timerout channels bull 16-bit resolution bull Programmable gain per channel programmable scan rates of lt1 Ss through 100 KSs bull Precision onboard reference for end-to-end calibration

RSC No 34804

KineticSystems Company LLCwwwkscorpcom

CP6001Energy efficient embedded Intel dual core processors bull 12 GHz Intel Core Duo U2500 ULV processor bull Intel Core 2 Duo L7400 LV processor bull Based on the Intel Mobile 945GM chipset with a front side bus of up to 667 MHz and ICH7-R Southbridge bull Two independent digital video outputs to the rear IO (2x DVI - 1x DVI and 1x HDMI) bull AC97 audio capabilities bull 3 x GbE bull 4 x SATA with RAID 01510 functionality bull 6 x USB 20 2 x COM and VGA or DVI bull Can also accommodate a PMC slot or an onboard 25 inch SATA HDD bull Up to 8 GB of USB or 2 GB soldered flash bull Supports Linux Windows XP XP embedded and VxWorks 6

RSC No 34182

CP6923 GbE Switch6U CompactPCI GbE Switch PICMG 216 compliant bull Leading edge te hnology basedon BCM5650X chip bull 24x GbE ports bull Non-blocking Layer 2 and 3 switching and routingbull Copper optical rear IO version bull Hot swap IPMI bull Fully managed bull Comprehensive firmware package bull Applies to VoIP installations such as call servers media gatewaysand trunking gateways in wireline and wireless networks as well as VoIP systems inenterprise networks with high demands on performance

RSC No 32256

Kontronwwwkontroncom

TMS320C6701 Virtex-IITexas Instrumentsrsquo C6701 DSP bull Xilinx Virtex-II series FPGA up to XC2V8000 bull Multiple IO interfaces Onboard CODEC VIM expansion sites 60-pin GPIO header and JTAG bull Hardware drivers integration in SimulinkXilinx System Generator Blocksets for quick implementation of Simulink models bull DSP and FPGA-in-the-loop cosimulation of SimulinkXilinx System Generator models bull Leading edge communication interface allowing real-time datamonitoring from Simulink scopes and remote operations

RSC No 32028

VHS-DACHigh performance multichannel DA for phased array antenna systems radarsonar communications receiversup-sampling to IF stage and RFIF AGC apps bull Eight 125 MSPS output channels bull Optional add-on daughter boardprovides 8 additional output channels or 8 additional input channels bull 32-bit 25 MHz bull FPDP interface with 400 MBps transfer rate (25 MSPS per channel at 8 channels 125 MSPS at 16 channels) bull Low level hardware drivers API andGUI bull High level hardware drivers integration in Simulink Blocksets bull Leading edge communication interface fordata recording and playback tofrom the onboard SDRAM

RSC No 32029

Lyrtechwwwlyrtechcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

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PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

Fo Sin Pnt

wwwcompactpci-systemscomproductsNEw PrOduCTs g

SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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Page 24: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

TECHNOLOGY g BACkpLANES

2008

B A

N D

W I

D T

H

Signal integrity challenges to bandwidth scalabilityFor the purposes of this article each interconnected differential pair will be referred to as a Channel (which should not be confused with an aggregated AdvancedTCA channel comprising four trans-mit and four receive pairs)

14-slot full-mesh AdvancedTCA backplanes contain hundreds of Channels Each Channel is defined as the copper signal path from the output of a driver device to the input of a receiver device As

By douglaS Hynd

Developing IEEE 8023ap 10GBASE-KRcompliant backplanes

Why doesAdvancedTCA

need bandwidthscalability

PICMG AdvancedTCA 30 has emerged as the

industryrsquos Hardware Platform standard of choice and

is enjoying first-phase deployment However many

believe that for AdvancedTCA to realize its market

potential AdvancedTCA platforms need to seamlessly

scale to accommodate 40 GbE fabrics thereby

avoiding forklift upgrades as system bandwidth

demands increase over time A 40 GbE switch fabric

architecture would enable realization of a common

platform for computing storage control and media

and packet processing and provide the versatility and

long term ROI required by service providers in

todayrsquos increasingly competitive environment

The challenge was to develop a family of

AdvancedTCA products which feature PICMG 30

compliant dual star and full mesh advanced

backplane switch fabrics enabled up to 10 Gbps

per differential signal pair thereby giving 40 Gbps

per AdvancedTCA channel performance

This article describes the signal integrity challenges

presented in designing an IEEE 8023ap

10GBASE-KR-compliant bandwidth-scalable

14-slot AdvancedTCA platform and how these

challenges were overcome in development of full

mesh and dual star backplane reference designs

Fo Sin Pnt

shown in Figure 1 that signal path comprises a signal launch a blade PCB transmission line a daughtercard via a right-angled HM-ZD connector a mated HM-ZD backplane header a back-plane via a length of backplane PCB transmission line and then the same combination of connectors vias and transmission line at the receive end of the Channel

Sources of crosstalkFour principal sources of crosstalk in each Channel must be man-aged as shown in Table 2 Source number one is between adjacent differential pairs as they are routed across the backplane Common mode noise rejection in system differential pair structures makes this a minor issue The second source of crosstalk lies in the HM-ZD connector itself

Crosstalk in via fields our third source primarily arises from inductive coupling between adjacent differential pairs and domi-nates the crosstalk agenda in high-speed Channels This source of crosstalk is directly proportional to the length of the via barrel and where practical care must be taken to ensure that adjacent connector rows are terminated to different target routing Layers

The final source of crosstalk is caused by aggressor signals in through-routed via fields coupling with victim Channel traces as they pass through As mentioned earlier judicious and careful design can mitigate this impact

Skew Channel skew is a function of differential transmission path geometries At a fundamental frequency of 5 GHz skew can be a significant issue in high-speed system design due to narrowing the eye opening and increasing jitter Skew can have a significant impact on crosstalk it negatively impacts the common mode rejection of noise inherent to differential signaling Conductor surface roughness in lower performing dielectric materials can also cause skew in high-speed systems

Skew can be avoided through careful management of transmission path lengths in each Channel and by using higher-glass content (lower Dk) laminates

LossPotential

Potential Mismatches

Channel

Loss Potential Channel

PCB Tolerance -025 dB 2 -01 dB

Connector Tolerance -001 dB 4 -016 dB

Thru-routed Via Fields -001 dB 12 -144 dB

Connector Launch -025 dB+ 4 - 2 dB+

Quantity TotalNEXT

TotalFEXT

PCB Transmission Lines

24 in60 cm

-50 dB -70 dB

Connector Architecture 2 -26 dB -24 dB

Via Fields 4 -22 dB -20 dB

Connector Pass Through 8 -34 dB ndash34 dB

For the target application each one of these Channels must deliver a 10 Gbps Non-Return-To-Zero (NRZ) signal with sufficient signal fidelity to enable a receiver device to detect and process a differential signal The PICMG 30 specification is targeted at 3125 Gbps signaling with a fundamental frequency of 156 GHz Even in low loss dielectric materials insertion loss at 10 Gbps (5 GHz fundamental) is twice that of a 3125 Gbps signal

Therefore achieving acceptable signal fidelity requires careful management of signal losses and noise in each Channel such that an acceptable signal-to-noise (SN) ratio is achieved at the receiver

The design process therefore begins by understanding and mitigat-ing the sources of losses and noise in each Channel

Sources of lossThere are three sources of loss

n Conductor losses which are due to skin effects and can be addressed by maximizing the cross sectional area of the signal traces

n Material dispersion losses which are a function of the dielectric constants of the chosen material These can be mitigated by choosing a higher performance laminate material such as Nelco 4000-13SI or Megtron

n Reflected power loss due to impedance mismatches in the Channel as each signal transitions across the different copper media in each channel (connectors vias and PCB traces) and passes through the pad and anti-pad structures of the via fields of other backplane blade slots

Table 1 shows the relative effects of different sources of impedance mismatches The dominant source of impedance mismatches in every Channel resides in the via structures Successful mitigation of this problem requires that every via is tuned by back-drilling the stub and adjusting the pad and anti-pad structures to match the impedance to be 50 ohms irrespective of the target routing layer This in turn requires that the capacitive and inductive effects of the connector pin and via barrel combination are taken into account during the design of each Channel

Further complicating via design is the space the anti-pad structures need to accommodate Channels being routed between other blades while minimizing electro-magnetic coupling with them This space consideration makes the shape and orientation of pads and anti-pads extremely important

Figure 1

Table 1

Table 2

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IEEE 8023ap provides a design targetAs Ethernet has emerged as the industryrsquos dominant signaling methodology the IEEE has developed the 10GBASE-KR norma-tive Channel model to define interconnect Channel performance for NRZ signaling at 10 Gbps This standard defines acceptable performance in terms of S-parameter charts for through-Channel insertion loss and worst-case crosstalk Figures 2a and 2b illustrate masks for Draft 24 of the standard that was initially used for this exercise

In each case the mask defining compliant performance is shown in blue Channel insertion loss is shown in red in Figure 2a Crosstalk performance is defined by the ICR curve (Figure 2b) Minimum acceptable Channel performance is defined in the ICR chart (Figure 2b) by the blue line The effect of the sum of all aggressors on the through-Channel is shown in red The green ICR curve is the ratio of the crosstalk power sum calculated by summing the

magnitudes of any impacting crosstalk Channels for each fre-quency and using a straight line fit (using least-squares method) to determine the resulting average effect f the aggressors on the through-Channel This is then overlaid on the insertion loss and used to plot the ICR curve

This standard which has evolved through a variety of iterations forms the basis for developing a 40 GbE switch fabric backplane featuring 10 Gbps NRZ differential pairs If all differential pairs can meet this standard then the backplane can be considered to be 10GBASE-KR compliant

Applying 10GBASE-KR to a 14-slotAdvancedTCA applicationThe PICMG specification dictates that receive differential pairs are placed on the c-d and g-h rows of the HM-ZD connector and that transmit differential pairs are placed on the a-b and e-f rows Therefore the middle differential pair in row c-d of Slot B will be subject to the NEXT of three aggressors in each of the a-b and e-f transmit rows of slot B plus the FEXT of the signals being received in the c-d pairs in the top and bottom of slot B

In this topology it can be seen that worst-case crosstalk would occur if all the NEXT and FEXT aggressors were routed on the bottom Layer that is on the same Layer as that of the victim c-d However given that all signal vias must be back-drilled and tuned for impedance management purposes Channel crosstalk can simultaneously be reduced by allocating different routing Layers to differential pairs terminated in the same backplane connector

The principal factor in determining the feasibility of a 10GBASE-KR compliant backplane is based on understanding whether the Channel with the worst-case signal-to-noise ratio is compliant

The skew targets determine permissible layer separation between a-b c-d e-f and g-h pairs within each Channel and enable routing Layers to be allocated for each pair It is now possible to start the process of via tuning to optimize the channel performance for minimum insertion loss Modeling begins by defining the simulation boundaries for the channel so that Channel component models (PCB traces connectors vias) can easily be aggregated to model complete Channels Boundaries must be established at locations in the Channel where linear 3D structures exist These are shown in Figure 3 (next page)

Since the connector and via combinations for the backplane and daughtercard mating halves must each be treated as a whole it

PICMG 30Spec

TurboFabricSpec

Total Inter-PairSkew

(Fabric Interface)

05 mm in FR4(34 ps)

001 mmin N4000-13si

(00625 ps)

Total Intra-Channel Skew

(Fabric Interface)

254 mm in FR4(17 ps)

plusmn01 mmin N4000-13si

(0625ps)

Total Intra-Channel Skew

(Base Interface)

135 mm in FR4(90 ps)

plusmn01 mmin N4000-13si

(0625 ps)

Figures 2a and 2b

Table 3

Determining which Channel that is and identifying the worst-case SN requires making trade-offs with regard to PCB material Channel length via design connector row selection and NEXT and FEXT aggressor routing choices These trade-off choices can only take place using advanced 3D simulation tools such as Ansoft HFSS This was the essence of the design process employed in developing Simclarrsquos TurboFabric backplanes

The simulation processThe transmission length for full mesh and dual star backplanes design implementations varies from a maximum of 1632 inches to a minimum of 116 inches With an effective transmission length of 5 inches on each daughtercard this makes the longest effective Channel 2632 inches including two connectors

For a 10GBASE-KR application over this distance a high-perfor-mance laminate is essential for both reducing insertion loss and

ensuring high glass content in the weave to mitigate skew So the design process began by choosing a low-loss dielectric material (Nelco 4000-13SI for both the backplane and the daugh-tercards) and establishing targets for Inter-Pair and Intra-Channel skew as shown in Table 3

Adhering to the PICMG 30 specifi-cation for skew in a 10GBASE-KR application is impractical Instead a target of 00625 ps was set for Inter-Pair skew with 0625 ps set for Intra-Pair skew for the backplane only This equated to a maximum 001 mm differ-

ence being allowed between traces of any differential pair and 01 mm being permitted between traces of any four differential pairs in a Channel Given the topology of the HM-ZD connector daughter-card skew must be accounted for in the daughtercard layout Fo

Sin Pnt

should be noted that the simulation boundary is located within the mated connector

Tuning the connector and via structures to 50Ω is an iterative process involving the removal of excess pads back-drilling and tuning pads anti-pads and traces A Time Domain Reflectometer (TDR) plot illustrating the results of the tuning process is shown in Figure 4

Upon completion of the modeling process a total of 17 different optimized via and routing configurations had been designed for the full mesh design and nine for the dual star design

A plot of worst-case insertion loss is shown in Figure 5 and demonstrates that in both cases performance is well above the 10GBASE-KR mask

When all the through-Channels have been modeled adjacent Channel models can be combined and ICR curves plotted to evaluate the impact of crosstalk on through-Channel performance This valuable information can be used to adjust the position of signal Layers relative to pass-through aggressor traces on adjacent Layers or to reroute traces to reduce crosstalk Similarly routing Layers can be changed to reduce crosstalk in adjacent via barrels

Figure 6 plots worst-case ICR and demonstrates that performance is above the 10GBASE-KR mask Based on this result it was possible to proceed to physical implementation

Figure 3

Figure 4

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Physical realizationThe layout process was performed using the Mentor Board-Station CAD system Quad-routing (routing four traces between pads) was explored as a routing method-ology in order to reduce Layer count but this was dismissed due to the detrimental impact on crosstalk performance

The attributes of the physical backplanes produced as a result of the design effort are shown in Table 4

The design files produced included the usual gerber files plus detailed back-drilling instructions

The design validation process comprised a conventional continuity test followed by performance testing featuring Agilent equipment including 70340A signal generator 8720ES Network Analyzer NN18A S-Parameter test-set and 86100A sampling oscilloscope with Agilent 86112A module Figure 7 (next page) shows the test set up

Simclar developed special line cards to enable through-Channel measurements with and without crosstalk The signal launch featured compression mount SMAs terminated in a tuned via structure The Channel simulations included simu-lation of the tuned launch structures so de-embedding of the launches was not necessary for correlation to simulation purposes The development team also established a process for characterization of all Channels

Full Mesh Dual Star

Layer Count 34 18

Aspect Ratio 121 61

Tuned Vias 3952 768

Material Nelco 4000-13SI

Table 4

Figure 5 Figure 6

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In Figure 8 measured through-Channel performance and ICR curves are shown for the same Channels described in the simula-tion section earlier

As can be seen from Figure 8 there is close correlation between these and the simulated plots in Figures 5 and 6 In fact close correlation between all simulated and measured results was achieved resulting in a 728 Tbps capacity full mesh and a 960 Gbps capacity dual star backplane design now generally available as part of the Simclar TurboFabric shelf

Figure 7 Figure 8

Figure 9

Figure 10

Implications of 10GBASE-KR Draft 33versus Draft 25The work described above was targeted towards meeting the Channels specifications contained in Draft 25 of the IEEE 10GBASE-KR Since this work was completed the IEEE has up-issued the Draft revision level for the Standard from 25 to 33 While this has not impacted through-Channel performance demands it has increased Channel isolation requirements by around 10 dB In Figure 9 a Draft 33 mask is added to the ICR plot shown in Figure 8

From Figure 9 it can be seen how Draft 33 pulls the mask above the Channel ICR curve for this full mesh backplane Channel Surprisingly it is the Channelrsquos frequency response at relatively low frequencies between 100-500 MHz that is causing a problem The reasons for this are currently the subject of further detailed investigation

However Figure 10 shows a Draft 33 plot for a less demanding dual star AdvancedTCA implementation featuring shorter trans-mission distances This plot demonstrates compliance to Draft 33 of the IEEE 8023ap 10GBASE-KR Standard

ConclusionBy developing a close understanding of the many factors contrib-uting to loss and noise in multi-gigabit backplane Channels it is possible to characterize their performance using advanced simula-tion techniques and correlate that performance in physical prod-ucts using advanced test methods By overlaying the test results on S-Parameter masks defined by the IEEE 8023ap 10GBASE-KR Standard it has been demonstrated that backplanes that truly enable AdvancedTCA scalability are at last a reality

Douglas Hynd joined Simclar Group in 2006 as Director of Marketing as part of Simclarrsquos acquisition of Northrop Grumman Interconnect Technologies Division wherehe was Vice President of Marketing and Sales He has more than 24 yearsrsquo experience intechnology sales marketing and generalmanagement and holds a BSc (Eng) in Electronics and Electrical Engineeringfrom the University of Glasgow He isbased at Simclarrsquos Global HQ inDunfermline Scotland

Simclar Groupdouglashyndsimclarcom bull wwwsimclarcom

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6U CompactPCIPrOduCT GuIdE g

This monthrsquos issue includes a 6U CompactPCI Product Guide and Irsquod like to take the opportunity to reflect a bit on the success and evolution of that technology

Back in the 1994 time frame when CompactPCI was first being devel-oped it began as 3U-only technology It used the same Eurocardmechanics that were popularized by VME and an IEC standardized high-

density high-speed connector available from a number of vendors suitablefor 33 MHz PCI signaling That connector was selected by the engineers atZiatech with help from Mike Munroe then at ERNI The majority of VMEdesigns were 6U and based on this I was among a number of folks thatargued for adding the 6U CompactPCI form factor

The 6U form factor presented some challenges and opportunities Onechallenge was that the insertion and extraction forces were quite high when the entire rear of the card was populated with connectors Fortunately the IEEE standards for Eurocards evolved and injectorejector handles that pro-vided leverage became available Eike Waltz then at Rittal was instrumental in bringing that to the table Two of the opportunities that came along withthe extra connectors were a clean way to add secondary buses like the H110 telephony bus to the backplane and the ability to route IO out the rear through rear transition modules PICMG has developed quite a number of subsidiary specifications defining the interoperable use of the extra backplane pins made possible with the 6U form factor Both of these features have played a major part in CompactPCIrsquos success The next major evolution of 6U CompactPCI came with the PICMG 216 Packet Switched Backplane standard which was originally conceived by John Peters and his team at Performance Technologies PICMG 216 interconnected a shelf full of CompactPCI single board computers via redundant Ethernet switches also in the 6U CompactPCI form factor This dramatically increased usable backplane bandwidth and provided redundancy PICMG 216 paved the way for AdvancedTCA and was the industryrsquos first open standard for the switched serial interconnect standards we see popping up in many places

By Joe Pavlat

Looking back and ahead at6U CompactPCI

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PrOduCT GuIdE6U CompactPCI

Recent 6U CompactPCI related products are listed here For more informationenter the productrsquos RSC No at wwwcompactpci-systemscomrsc

cPCI-6910Dual-core Intel Xeon Processor LVULV Universal blade bull Supports Single Dual-Core Intel Xeon LV or ULV processorsbull Front Side Bus 667 MHz bull Up to 2 GB DDR2 400 MHz soldered SDRAM with ECC bull Four PCI Express GbEbull Up to 4 USB 20 ports bull PICMG 20 21 29 216 compliant

RSC No 35013

ADLINK Technologywwwadlinktechcom

CPCIStor Module6U CompactPCI storage blade bull Onboard ATA controller supports CDDVD HDD and solid-state flashbull Supports Hot Swap Removal (ask about RAID support) bull ATA disks available in Enhanced Dutycycle versions for NEBS Level 3 - 724 requirements bull Operating Systems supported VxWorksLinux and Windows

RSC No 34800

ACTTechnicowwwacttechnicocom

Prosody X cPCI E1T1An E1T1 digital network access card bull Suits telco developers and systems integrators bull Uses Aculabrsquos worldwide protocol coverage including Aculabrsquos SS7 stack available under a cost free license bull Available with 8 or 16 E1T1 trunks and software selectable E1T1 interfaces bull Flexible mix of protocols including ISDN CAS and SS7 (ITU-T China and ANSI) bull A variety of interconnect switching and protocol conversion solutions can be readily crafted bull High availability reliability and scalability with industry standard hardw re and software interoperability bull Up to 128 SS7 signaling links bull Non-circuit related (TCAP) messagingintensive applications such as prepaid and SMS

RSC No 35408

Aculabwwwaculabcom

Adexp8021Intel Core Duo L2400 (166 GHz) w E7520 server chipset bull Dual channel PC2-3200 Registered RAM SECDED or x4 SDDC bull Two GbE two Serial ATA four USB 20 bull Onboard SXGA graphics 1280 x 24-bitbull 6U CompactPCI Bus PICMG EXP0 R10 Specification bull RoHS compliant 0 degC to +55 degC operating range

RSC No 32837

Advanet Incwwwadvanetcojpen

TC84012 channel single-stop Time-to-Digital Converter (TDC) with single-start and multi-start acquisition modes bull 50 ps timing resolution bull Wide range with upto 20 s between first and last events bull Large internal memory buffer with up to 512 hits per channel bull Low jitter (lt3 ps rms) high stability (plusmn2 ppm) internalclock source bull External 10 MHz reference input bull FPGA based Data Processing Unit (DPU) bull Fast readout with DMA mode for increased data throughputbull Overvoltage-protected inputs with 50 Ω K-Lock (LEMO) connectors bull Built-in self calibration bull Modular single-slot 6U PXICompactPCI standardbull Low power consumption (lt22 W)

RSC No 33445

Agilent-Acqiriswwwacqiriscom

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PrOduCT GuIdE6U CompactPCI

MIC-30428-slot 6U CompactPCI backplane bull AC or DC CompactPCI 500 W + 250 W redundant(2+1) power supplies bull PICMG 216 (CompactPCI Packet Switching Backplane) compliancebull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarmmodule (MIC-3924L-AE)

RSC No 32851

MIC-30436-slot 6U CompactPCI backplane bull Supports two hot-swappable SCSISATA or removableIDE HDD bays bull Built-in IDE slim-type DVD-ROM bull AC or DC CompactPCI 250 W + 250 Wredundant (1+1) power supplies bull Supports hot-swappable fan modules bull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarm module (MIC-3924L-AE)

RSC No 32850

Advantech Corporationwwwadvantechcom

Dual-Core Xeon CompactPCI SBCModel PP 42123x bull Dual CPU 6U CompactPCI SBC supporting two dual-core Xeon CPUs bull Up to 8 GB DDR2 ECC SDRAM in a single system or peripheralslot bull Dual processor SBC in a single 6U CompactPCI slot bull Supports two 166 GHz Dual-Core Intel Xeon ULV processors using Intel E7520 server chipsetbull Up to 8 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull PMCXMC site support 66 MHz PCI-X and x8 PCI Express bull Front and rear IO bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade bull Four GbE ports with option for PICMG 216

RSC No 34761

6U CompactPCI Core 2 Duo SBCModel PP 41203x bull 6U CompactPCI Core 2 Duo SBC supporting two PMC sites includingone XMC site bull Up to 4 GB DDR2 ECC SDRAM bull All in a single system or peripheral slot bull TwoPMC sites supporting up to 100 MHz PCI-X bull One XMC x8 PCI Express bull Front and rear IObull Supports 216 GHz or 15 GHz Intel Core 2 Duo processors bull Intel E7520 server chipsetbull Up to 4 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade

RSC No 34763

PP 30202xTwo processor versions available bull 18 GHz Intel Pentium M processor 745 uses mFC-PGA 478 (micro Flip-Chip Pin Grid Array) package bull 14 GHz Intel Pentium M processor Low Voltage 738uses mFC-BGA 479 (micro Flip-Chip Ball Grid Array) package bull 64 KB primary (L1) on-die cache2 MB of secondary (L2) on-die cache bull 400 MHz Front Side Bus (FSB) bull No CPU fan bull 16 GHz processor version (1 MB L2 cache) available see PP 30002x datasheet bull Utilizes 64-bitIntel 855GME chipset bull Supports 400 MHz bus frequency bull Uses Intel 6300ESB IO Controller Hub

RSC No 32659

Concurrent Technologies Incwwwgocctcom

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PrOduCT GuIdE6U CompactPCI

cCIBPMC6U-ETA 6U bridged dual PMC carrier that bridges extended temperature CompactPCI boards and PMCs bull Features a rugged CompactPCI form factor providing increased flexibility to military communications systems designers bull Provides additional design choices to users through its differing bus speeds maximizing the numberof PMCs that can be used CompactPCI andPMC buses can both run at 66 or 33 MHzbull Operating temperature range of -40 degC to+85 degC bull Signal conditioning bull DMA supportbull Low-power design +5 V +33 V +12 V -12 V bull User-selectable VIO of 33 V or 5 V to the PMC

RSC No 32891

Dynamic Engineeringwwwdynengcom

cPCI4IP-MMMinimized PCI address footprint IndustryPack carrier for CompactPCI applications bull 6U 4HP4 IP positions 832 clock selection for each slot fused filtered power IO options bull ID INT IO and Mem spaces are decoded for each IP slotbull Single and double wide IPrsquos bull 16- and 32- bit IPs bull 32-bit access to 16-bit IPs bull Full or mini-mized Memory Space decoding for 18 the PCI address requirement bull With the cPCI4IP-MM option 8 CompactPCI 4IP cards take the same PCI address space as 1 full Mem Space card

RSC No 34905

ACQ132CPCI32 channel MHz class simultaneous sampling intelligent digitizer bull 32 simultaneous analoginput channels 2-32 MSpschannel 14-bit resolution bull Differential inputs bull Intelligent cardwith 1 gigabyte memory and GbE on board bull Large distributed FPGA resource on boardbull Range of DSP functions including FIR filtering and Digital Downconverter

RSC No 35482

D-TACQ Solutions Ltdwwwd-tacqcouk

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CR11Based on the Intel Core Duo Processor the platform is designed to support processor speeds from 106 GHz up to 20 GHz bull Intel Core 2 Duo runs at 15 GHz up to 20 GHz bull Conduction cooled bull Two PMC slots bull PCI Express bull 2x GbE

RSC No 33156

ICS-72532-channel 6U CompactPCI DAC board bull 6U CompactPCI data acquisition card bull 32 differential output channels bull 16 or 24-bit sample size bull 288 kHzch data rate bull Simultaneous sampling across all channels on single or multiple boards bull 32 separate delta-sigma DACs bull 64-bit 66 MHz CompactPCI PICMG 20 Rev30 hot-swappable bull FPDP II 400 MBps interface

RSC No 33576

ICS-71032-channel 6U CompactPCI ADC board bull 6U CompactPCI data acquisition card bull 32 differential input channels bull 216 KHzch 24-bit resolution bull Software selectable full scale input bull FPDP II 400 MBpsinterface bull 64-bit 66 MHz CompactPCI PICMG 20 Rev 30 hot swappable bull 32 synchronous boards for simultaneous sampling bull Sonar acoustics and test and measurement applications

RSC No 33578

Tsumani 6U CPCI Development KitFPGA processor solution targeted at high performance software defined radio applications bull Dual Stratix EP1S80 FPGAs are tightly coupled to provide apower platform for signal processing bull Two PMC module sites provide IO connectivity to either front panel or back panel connections bull A direct highbandwidth 1 GBps path from the PMC P4 connector directly to the FPGAs bull Model 919 Dual DAC Mezzanine provides broadband analog signal generationin a compact form bull The board features two independent DAC channels each with its own 12-bit LVDS input capable of running at rates up to 160 MHz

RSC No 32026

CP11Rugged 6U SBC bull Up to 4 GB of DDR2 SDRAM (200 MHz) with enhanced ECC four independent onboard PCI buses system host and peripheral modesupport for the CompactPCI backplane two PMC interfaces (64-bit133 MHz and 32-bit33 MHz) bull Instead of the PMC1 a PCI Express based XMC interface is available on request bull Two GbE one Fast Ethernet two serial interfaces (RS-232 or RS-422485) USB 20 integrated HDD or flash drive bull High performance 2D3D ATI video controller capable of driving two displays in parallel supports VGADVI interface bull Intel Core 2 Duo at 216 GHz Intel Core Duo at 20 GHz2x PMC expansion site bull One XMC optional bull Up to 4 GB DDR2 SDRAM wECC 2x GbE

RSC No 33447

GE Fanuc Intelligent Platforms Incwwwgefanucembeddedcom

Single Board ComputersGD Canada designs and manufactures conduction-cooled Single Board Computers (SBCs)using Intel processors bull 6U and 3U form factors for CompactPCI backplanes bull Fully backward compatible with earlier models bull Upgradeable via the change-out of processor memory andIO modules bull Used within GD Canada computer systems and sold as individual products

RSC No 35281

General Dynamicswwwgdcanadacom

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PrOduCT GuIdE6U CompactPCI

cPCI6U-24DSI32R32-channel 24-bit delta-sigma CompactPCI 6U analog input board with rear IO bull Low noise 24-bit resolution low phase distortion andmulti-board synchronization bull Suits state-of-the-art sonar and noise monitoring applications bull 32-channel cPCI6U-24DSI32 analog input boardprovides a high-density 24-bit analog input resources on a standard 6U CompactPCI expansion board bull Applications from precision voltagemeasurements to complex audio signal and waveform analysis

RSC No 34985

General Standards Corporationwwwgeneralstandardscom

Duet 3U 64-bit 1 GHz TMS320C6416 DSP (x2) 64 MB SDRAM per processor bull Flexible internalexternalcommunication mesh bull 64-bit66 MHz CompactPCI bull PMCXMC site with Jn4 to FPGA and4 RocketIO per VITA 42 bull External data port up to 12 Gbps bull 4M or 5M Virtex-II Pro FPGAbull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM dedicated800 MBps links between DSPs bull 3U CompactPCI with PXI support bull Suits high-end co-processing wireless broadband communications RADAR video and biometrics

RSC No 32856

QuadiaQuad-DSP bull Dual FPGA bull Dual PMC sites bull Inter-processor connectivity and access to external interfaces bull Four C6416 DSPs split in two independent clusters each hosting a PMC site bull One large FPGA for end-user code bull Central FPGA routing interprocessor communication bull End-user FPGA communication bull External port serial IO for PCIe or other p ivate link bull Global memoryand PCI interface bull 1 GHz TMS320C6416 DSP (x4) bull 64 MB SDRAM per processor bull Flexible internalexternal communication mesh bull 64-bit66 MHz CompactPCI bull Two PMC sites with Jn4 to FPGA bull External data port up to 12 Gbps bull Two 4M Gate FPGA reserved for end-user code bull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM bull Up to 512 MB Global DDR SDRAM bull Suits high-end co-processing wireless and broadband communications

RSC No 34737

Quixote 64-bit 6UAdvanced signal capture generation and co-processing bull 1 GHz TMS320C6416 DSP and2 to 6 MGATE Virtex-II FPGA bull 32 MB SDRAM 8 MB ZBT SBSRAM and AD6645 and AD9764 converters bull 6432 bit CompactPCI 66 MHz 5 V33 V and complex trigger modes with HW event logging bull PMC site with Jn4 to FPGA DIO and PICMG 217 StarFabric compliant bull Suits Software Defined Radio wireless IP and RADAR development and hardware testing bull Physical Layer field testing ultra-fast flexible data acquisition vector signal generation and electronic warfare

RSC No 32861

Innovative Integrationwwwinnovative-dspcom

IC-e6-cPCIbHigh performance 6U CompactPCI board bull Powered by one or two of Freescalersquos mostadvanced 14 GHz MPC7448 PowerPC processors bull PICMG 216 compliant bull Marvell Discovery III chipset (MV64460) bull Low power consumption bull Standard extended and rugged grades

RSC No 32982

Interface Conceptwwwinterfaceconceptcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CP213Single-width 6U CompactPCIPXI module with either 32 or 64 differential analog input channelsbull 32 64 or 128 channels of analog input bull 16 multifunction digital IO (TTL) channels that may beconfigured as digital in digital out or selectively attached to 2 frequency in 2 counter in andor 2 timerout channels bull 16-bit resolution bull Programmable gain per channel programmable scan rates of lt1 Ss through 100 KSs bull Precision onboard reference for end-to-end calibration

RSC No 34804

KineticSystems Company LLCwwwkscorpcom

CP6001Energy efficient embedded Intel dual core processors bull 12 GHz Intel Core Duo U2500 ULV processor bull Intel Core 2 Duo L7400 LV processor bull Based on the Intel Mobile 945GM chipset with a front side bus of up to 667 MHz and ICH7-R Southbridge bull Two independent digital video outputs to the rear IO (2x DVI - 1x DVI and 1x HDMI) bull AC97 audio capabilities bull 3 x GbE bull 4 x SATA with RAID 01510 functionality bull 6 x USB 20 2 x COM and VGA or DVI bull Can also accommodate a PMC slot or an onboard 25 inch SATA HDD bull Up to 8 GB of USB or 2 GB soldered flash bull Supports Linux Windows XP XP embedded and VxWorks 6

RSC No 34182

CP6923 GbE Switch6U CompactPCI GbE Switch PICMG 216 compliant bull Leading edge te hnology basedon BCM5650X chip bull 24x GbE ports bull Non-blocking Layer 2 and 3 switching and routingbull Copper optical rear IO version bull Hot swap IPMI bull Fully managed bull Comprehensive firmware package bull Applies to VoIP installations such as call servers media gatewaysand trunking gateways in wireline and wireless networks as well as VoIP systems inenterprise networks with high demands on performance

RSC No 32256

Kontronwwwkontroncom

TMS320C6701 Virtex-IITexas Instrumentsrsquo C6701 DSP bull Xilinx Virtex-II series FPGA up to XC2V8000 bull Multiple IO interfaces Onboard CODEC VIM expansion sites 60-pin GPIO header and JTAG bull Hardware drivers integration in SimulinkXilinx System Generator Blocksets for quick implementation of Simulink models bull DSP and FPGA-in-the-loop cosimulation of SimulinkXilinx System Generator models bull Leading edge communication interface allowing real-time datamonitoring from Simulink scopes and remote operations

RSC No 32028

VHS-DACHigh performance multichannel DA for phased array antenna systems radarsonar communications receiversup-sampling to IF stage and RFIF AGC apps bull Eight 125 MSPS output channels bull Optional add-on daughter boardprovides 8 additional output channels or 8 additional input channels bull 32-bit 25 MHz bull FPDP interface with 400 MBps transfer rate (25 MSPS per channel at 8 channels 125 MSPS at 16 channels) bull Low level hardware drivers API andGUI bull High level hardware drivers integration in Simulink Blocksets bull Leading edge communication interface fordata recording and playback tofrom the onboard SDRAM

RSC No 32029

Lyrtechwwwlyrtechcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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Page 25: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

shown in Figure 1 that signal path comprises a signal launch a blade PCB transmission line a daughtercard via a right-angled HM-ZD connector a mated HM-ZD backplane header a back-plane via a length of backplane PCB transmission line and then the same combination of connectors vias and transmission line at the receive end of the Channel

Sources of crosstalkFour principal sources of crosstalk in each Channel must be man-aged as shown in Table 2 Source number one is between adjacent differential pairs as they are routed across the backplane Common mode noise rejection in system differential pair structures makes this a minor issue The second source of crosstalk lies in the HM-ZD connector itself

Crosstalk in via fields our third source primarily arises from inductive coupling between adjacent differential pairs and domi-nates the crosstalk agenda in high-speed Channels This source of crosstalk is directly proportional to the length of the via barrel and where practical care must be taken to ensure that adjacent connector rows are terminated to different target routing Layers

The final source of crosstalk is caused by aggressor signals in through-routed via fields coupling with victim Channel traces as they pass through As mentioned earlier judicious and careful design can mitigate this impact

Skew Channel skew is a function of differential transmission path geometries At a fundamental frequency of 5 GHz skew can be a significant issue in high-speed system design due to narrowing the eye opening and increasing jitter Skew can have a significant impact on crosstalk it negatively impacts the common mode rejection of noise inherent to differential signaling Conductor surface roughness in lower performing dielectric materials can also cause skew in high-speed systems

Skew can be avoided through careful management of transmission path lengths in each Channel and by using higher-glass content (lower Dk) laminates

LossPotential

Potential Mismatches

Channel

Loss Potential Channel

PCB Tolerance -025 dB 2 -01 dB

Connector Tolerance -001 dB 4 -016 dB

Thru-routed Via Fields -001 dB 12 -144 dB

Connector Launch -025 dB+ 4 - 2 dB+

Quantity TotalNEXT

TotalFEXT

PCB Transmission Lines

24 in60 cm

-50 dB -70 dB

Connector Architecture 2 -26 dB -24 dB

Via Fields 4 -22 dB -20 dB

Connector Pass Through 8 -34 dB ndash34 dB

For the target application each one of these Channels must deliver a 10 Gbps Non-Return-To-Zero (NRZ) signal with sufficient signal fidelity to enable a receiver device to detect and process a differential signal The PICMG 30 specification is targeted at 3125 Gbps signaling with a fundamental frequency of 156 GHz Even in low loss dielectric materials insertion loss at 10 Gbps (5 GHz fundamental) is twice that of a 3125 Gbps signal

Therefore achieving acceptable signal fidelity requires careful management of signal losses and noise in each Channel such that an acceptable signal-to-noise (SN) ratio is achieved at the receiver

The design process therefore begins by understanding and mitigat-ing the sources of losses and noise in each Channel

Sources of lossThere are three sources of loss

n Conductor losses which are due to skin effects and can be addressed by maximizing the cross sectional area of the signal traces

n Material dispersion losses which are a function of the dielectric constants of the chosen material These can be mitigated by choosing a higher performance laminate material such as Nelco 4000-13SI or Megtron

n Reflected power loss due to impedance mismatches in the Channel as each signal transitions across the different copper media in each channel (connectors vias and PCB traces) and passes through the pad and anti-pad structures of the via fields of other backplane blade slots

Table 1 shows the relative effects of different sources of impedance mismatches The dominant source of impedance mismatches in every Channel resides in the via structures Successful mitigation of this problem requires that every via is tuned by back-drilling the stub and adjusting the pad and anti-pad structures to match the impedance to be 50 ohms irrespective of the target routing layer This in turn requires that the capacitive and inductive effects of the connector pin and via barrel combination are taken into account during the design of each Channel

Further complicating via design is the space the anti-pad structures need to accommodate Channels being routed between other blades while minimizing electro-magnetic coupling with them This space consideration makes the shape and orientation of pads and anti-pads extremely important

Figure 1

Table 1

Table 2

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IEEE 8023ap provides a design targetAs Ethernet has emerged as the industryrsquos dominant signaling methodology the IEEE has developed the 10GBASE-KR norma-tive Channel model to define interconnect Channel performance for NRZ signaling at 10 Gbps This standard defines acceptable performance in terms of S-parameter charts for through-Channel insertion loss and worst-case crosstalk Figures 2a and 2b illustrate masks for Draft 24 of the standard that was initially used for this exercise

In each case the mask defining compliant performance is shown in blue Channel insertion loss is shown in red in Figure 2a Crosstalk performance is defined by the ICR curve (Figure 2b) Minimum acceptable Channel performance is defined in the ICR chart (Figure 2b) by the blue line The effect of the sum of all aggressors on the through-Channel is shown in red The green ICR curve is the ratio of the crosstalk power sum calculated by summing the

magnitudes of any impacting crosstalk Channels for each fre-quency and using a straight line fit (using least-squares method) to determine the resulting average effect f the aggressors on the through-Channel This is then overlaid on the insertion loss and used to plot the ICR curve

This standard which has evolved through a variety of iterations forms the basis for developing a 40 GbE switch fabric backplane featuring 10 Gbps NRZ differential pairs If all differential pairs can meet this standard then the backplane can be considered to be 10GBASE-KR compliant

Applying 10GBASE-KR to a 14-slotAdvancedTCA applicationThe PICMG specification dictates that receive differential pairs are placed on the c-d and g-h rows of the HM-ZD connector and that transmit differential pairs are placed on the a-b and e-f rows Therefore the middle differential pair in row c-d of Slot B will be subject to the NEXT of three aggressors in each of the a-b and e-f transmit rows of slot B plus the FEXT of the signals being received in the c-d pairs in the top and bottom of slot B

In this topology it can be seen that worst-case crosstalk would occur if all the NEXT and FEXT aggressors were routed on the bottom Layer that is on the same Layer as that of the victim c-d However given that all signal vias must be back-drilled and tuned for impedance management purposes Channel crosstalk can simultaneously be reduced by allocating different routing Layers to differential pairs terminated in the same backplane connector

The principal factor in determining the feasibility of a 10GBASE-KR compliant backplane is based on understanding whether the Channel with the worst-case signal-to-noise ratio is compliant

The skew targets determine permissible layer separation between a-b c-d e-f and g-h pairs within each Channel and enable routing Layers to be allocated for each pair It is now possible to start the process of via tuning to optimize the channel performance for minimum insertion loss Modeling begins by defining the simulation boundaries for the channel so that Channel component models (PCB traces connectors vias) can easily be aggregated to model complete Channels Boundaries must be established at locations in the Channel where linear 3D structures exist These are shown in Figure 3 (next page)

Since the connector and via combinations for the backplane and daughtercard mating halves must each be treated as a whole it

PICMG 30Spec

TurboFabricSpec

Total Inter-PairSkew

(Fabric Interface)

05 mm in FR4(34 ps)

001 mmin N4000-13si

(00625 ps)

Total Intra-Channel Skew

(Fabric Interface)

254 mm in FR4(17 ps)

plusmn01 mmin N4000-13si

(0625ps)

Total Intra-Channel Skew

(Base Interface)

135 mm in FR4(90 ps)

plusmn01 mmin N4000-13si

(0625 ps)

Figures 2a and 2b

Table 3

Determining which Channel that is and identifying the worst-case SN requires making trade-offs with regard to PCB material Channel length via design connector row selection and NEXT and FEXT aggressor routing choices These trade-off choices can only take place using advanced 3D simulation tools such as Ansoft HFSS This was the essence of the design process employed in developing Simclarrsquos TurboFabric backplanes

The simulation processThe transmission length for full mesh and dual star backplanes design implementations varies from a maximum of 1632 inches to a minimum of 116 inches With an effective transmission length of 5 inches on each daughtercard this makes the longest effective Channel 2632 inches including two connectors

For a 10GBASE-KR application over this distance a high-perfor-mance laminate is essential for both reducing insertion loss and

ensuring high glass content in the weave to mitigate skew So the design process began by choosing a low-loss dielectric material (Nelco 4000-13SI for both the backplane and the daugh-tercards) and establishing targets for Inter-Pair and Intra-Channel skew as shown in Table 3

Adhering to the PICMG 30 specifi-cation for skew in a 10GBASE-KR application is impractical Instead a target of 00625 ps was set for Inter-Pair skew with 0625 ps set for Intra-Pair skew for the backplane only This equated to a maximum 001 mm differ-

ence being allowed between traces of any differential pair and 01 mm being permitted between traces of any four differential pairs in a Channel Given the topology of the HM-ZD connector daughter-card skew must be accounted for in the daughtercard layout Fo

Sin Pnt

should be noted that the simulation boundary is located within the mated connector

Tuning the connector and via structures to 50Ω is an iterative process involving the removal of excess pads back-drilling and tuning pads anti-pads and traces A Time Domain Reflectometer (TDR) plot illustrating the results of the tuning process is shown in Figure 4

Upon completion of the modeling process a total of 17 different optimized via and routing configurations had been designed for the full mesh design and nine for the dual star design

A plot of worst-case insertion loss is shown in Figure 5 and demonstrates that in both cases performance is well above the 10GBASE-KR mask

When all the through-Channels have been modeled adjacent Channel models can be combined and ICR curves plotted to evaluate the impact of crosstalk on through-Channel performance This valuable information can be used to adjust the position of signal Layers relative to pass-through aggressor traces on adjacent Layers or to reroute traces to reduce crosstalk Similarly routing Layers can be changed to reduce crosstalk in adjacent via barrels

Figure 6 plots worst-case ICR and demonstrates that performance is above the 10GBASE-KR mask Based on this result it was possible to proceed to physical implementation

Figure 3

Figure 4

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Physical realizationThe layout process was performed using the Mentor Board-Station CAD system Quad-routing (routing four traces between pads) was explored as a routing method-ology in order to reduce Layer count but this was dismissed due to the detrimental impact on crosstalk performance

The attributes of the physical backplanes produced as a result of the design effort are shown in Table 4

The design files produced included the usual gerber files plus detailed back-drilling instructions

The design validation process comprised a conventional continuity test followed by performance testing featuring Agilent equipment including 70340A signal generator 8720ES Network Analyzer NN18A S-Parameter test-set and 86100A sampling oscilloscope with Agilent 86112A module Figure 7 (next page) shows the test set up

Simclar developed special line cards to enable through-Channel measurements with and without crosstalk The signal launch featured compression mount SMAs terminated in a tuned via structure The Channel simulations included simu-lation of the tuned launch structures so de-embedding of the launches was not necessary for correlation to simulation purposes The development team also established a process for characterization of all Channels

Full Mesh Dual Star

Layer Count 34 18

Aspect Ratio 121 61

Tuned Vias 3952 768

Material Nelco 4000-13SI

Table 4

Figure 5 Figure 6

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In Figure 8 measured through-Channel performance and ICR curves are shown for the same Channels described in the simula-tion section earlier

As can be seen from Figure 8 there is close correlation between these and the simulated plots in Figures 5 and 6 In fact close correlation between all simulated and measured results was achieved resulting in a 728 Tbps capacity full mesh and a 960 Gbps capacity dual star backplane design now generally available as part of the Simclar TurboFabric shelf

Figure 7 Figure 8

Figure 9

Figure 10

Implications of 10GBASE-KR Draft 33versus Draft 25The work described above was targeted towards meeting the Channels specifications contained in Draft 25 of the IEEE 10GBASE-KR Since this work was completed the IEEE has up-issued the Draft revision level for the Standard from 25 to 33 While this has not impacted through-Channel performance demands it has increased Channel isolation requirements by around 10 dB In Figure 9 a Draft 33 mask is added to the ICR plot shown in Figure 8

From Figure 9 it can be seen how Draft 33 pulls the mask above the Channel ICR curve for this full mesh backplane Channel Surprisingly it is the Channelrsquos frequency response at relatively low frequencies between 100-500 MHz that is causing a problem The reasons for this are currently the subject of further detailed investigation

However Figure 10 shows a Draft 33 plot for a less demanding dual star AdvancedTCA implementation featuring shorter trans-mission distances This plot demonstrates compliance to Draft 33 of the IEEE 8023ap 10GBASE-KR Standard

ConclusionBy developing a close understanding of the many factors contrib-uting to loss and noise in multi-gigabit backplane Channels it is possible to characterize their performance using advanced simula-tion techniques and correlate that performance in physical prod-ucts using advanced test methods By overlaying the test results on S-Parameter masks defined by the IEEE 8023ap 10GBASE-KR Standard it has been demonstrated that backplanes that truly enable AdvancedTCA scalability are at last a reality

Douglas Hynd joined Simclar Group in 2006 as Director of Marketing as part of Simclarrsquos acquisition of Northrop Grumman Interconnect Technologies Division wherehe was Vice President of Marketing and Sales He has more than 24 yearsrsquo experience intechnology sales marketing and generalmanagement and holds a BSc (Eng) in Electronics and Electrical Engineeringfrom the University of Glasgow He isbased at Simclarrsquos Global HQ inDunfermline Scotland

Simclar Groupdouglashyndsimclarcom bull wwwsimclarcom

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6U CompactPCIPrOduCT GuIdE g

This monthrsquos issue includes a 6U CompactPCI Product Guide and Irsquod like to take the opportunity to reflect a bit on the success and evolution of that technology

Back in the 1994 time frame when CompactPCI was first being devel-oped it began as 3U-only technology It used the same Eurocardmechanics that were popularized by VME and an IEC standardized high-

density high-speed connector available from a number of vendors suitablefor 33 MHz PCI signaling That connector was selected by the engineers atZiatech with help from Mike Munroe then at ERNI The majority of VMEdesigns were 6U and based on this I was among a number of folks thatargued for adding the 6U CompactPCI form factor

The 6U form factor presented some challenges and opportunities Onechallenge was that the insertion and extraction forces were quite high when the entire rear of the card was populated with connectors Fortunately the IEEE standards for Eurocards evolved and injectorejector handles that pro-vided leverage became available Eike Waltz then at Rittal was instrumental in bringing that to the table Two of the opportunities that came along withthe extra connectors were a clean way to add secondary buses like the H110 telephony bus to the backplane and the ability to route IO out the rear through rear transition modules PICMG has developed quite a number of subsidiary specifications defining the interoperable use of the extra backplane pins made possible with the 6U form factor Both of these features have played a major part in CompactPCIrsquos success The next major evolution of 6U CompactPCI came with the PICMG 216 Packet Switched Backplane standard which was originally conceived by John Peters and his team at Performance Technologies PICMG 216 interconnected a shelf full of CompactPCI single board computers via redundant Ethernet switches also in the 6U CompactPCI form factor This dramatically increased usable backplane bandwidth and provided redundancy PICMG 216 paved the way for AdvancedTCA and was the industryrsquos first open standard for the switched serial interconnect standards we see popping up in many places

By Joe Pavlat

Looking back and ahead at6U CompactPCI

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Recent 6U CompactPCI related products are listed here For more informationenter the productrsquos RSC No at wwwcompactpci-systemscomrsc

cPCI-6910Dual-core Intel Xeon Processor LVULV Universal blade bull Supports Single Dual-Core Intel Xeon LV or ULV processorsbull Front Side Bus 667 MHz bull Up to 2 GB DDR2 400 MHz soldered SDRAM with ECC bull Four PCI Express GbEbull Up to 4 USB 20 ports bull PICMG 20 21 29 216 compliant

RSC No 35013

ADLINK Technologywwwadlinktechcom

CPCIStor Module6U CompactPCI storage blade bull Onboard ATA controller supports CDDVD HDD and solid-state flashbull Supports Hot Swap Removal (ask about RAID support) bull ATA disks available in Enhanced Dutycycle versions for NEBS Level 3 - 724 requirements bull Operating Systems supported VxWorksLinux and Windows

RSC No 34800

ACTTechnicowwwacttechnicocom

Prosody X cPCI E1T1An E1T1 digital network access card bull Suits telco developers and systems integrators bull Uses Aculabrsquos worldwide protocol coverage including Aculabrsquos SS7 stack available under a cost free license bull Available with 8 or 16 E1T1 trunks and software selectable E1T1 interfaces bull Flexible mix of protocols including ISDN CAS and SS7 (ITU-T China and ANSI) bull A variety of interconnect switching and protocol conversion solutions can be readily crafted bull High availability reliability and scalability with industry standard hardw re and software interoperability bull Up to 128 SS7 signaling links bull Non-circuit related (TCAP) messagingintensive applications such as prepaid and SMS

RSC No 35408

Aculabwwwaculabcom

Adexp8021Intel Core Duo L2400 (166 GHz) w E7520 server chipset bull Dual channel PC2-3200 Registered RAM SECDED or x4 SDDC bull Two GbE two Serial ATA four USB 20 bull Onboard SXGA graphics 1280 x 24-bitbull 6U CompactPCI Bus PICMG EXP0 R10 Specification bull RoHS compliant 0 degC to +55 degC operating range

RSC No 32837

Advanet Incwwwadvanetcojpen

TC84012 channel single-stop Time-to-Digital Converter (TDC) with single-start and multi-start acquisition modes bull 50 ps timing resolution bull Wide range with upto 20 s between first and last events bull Large internal memory buffer with up to 512 hits per channel bull Low jitter (lt3 ps rms) high stability (plusmn2 ppm) internalclock source bull External 10 MHz reference input bull FPGA based Data Processing Unit (DPU) bull Fast readout with DMA mode for increased data throughputbull Overvoltage-protected inputs with 50 Ω K-Lock (LEMO) connectors bull Built-in self calibration bull Modular single-slot 6U PXICompactPCI standardbull Low power consumption (lt22 W)

RSC No 33445

Agilent-Acqiriswwwacqiriscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

MIC-30428-slot 6U CompactPCI backplane bull AC or DC CompactPCI 500 W + 250 W redundant(2+1) power supplies bull PICMG 216 (CompactPCI Packet Switching Backplane) compliancebull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarmmodule (MIC-3924L-AE)

RSC No 32851

MIC-30436-slot 6U CompactPCI backplane bull Supports two hot-swappable SCSISATA or removableIDE HDD bays bull Built-in IDE slim-type DVD-ROM bull AC or DC CompactPCI 250 W + 250 Wredundant (1+1) power supplies bull Supports hot-swappable fan modules bull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarm module (MIC-3924L-AE)

RSC No 32850

Advantech Corporationwwwadvantechcom

Dual-Core Xeon CompactPCI SBCModel PP 42123x bull Dual CPU 6U CompactPCI SBC supporting two dual-core Xeon CPUs bull Up to 8 GB DDR2 ECC SDRAM in a single system or peripheralslot bull Dual processor SBC in a single 6U CompactPCI slot bull Supports two 166 GHz Dual-Core Intel Xeon ULV processors using Intel E7520 server chipsetbull Up to 8 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull PMCXMC site support 66 MHz PCI-X and x8 PCI Express bull Front and rear IO bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade bull Four GbE ports with option for PICMG 216

RSC No 34761

6U CompactPCI Core 2 Duo SBCModel PP 41203x bull 6U CompactPCI Core 2 Duo SBC supporting two PMC sites includingone XMC site bull Up to 4 GB DDR2 ECC SDRAM bull All in a single system or peripheral slot bull TwoPMC sites supporting up to 100 MHz PCI-X bull One XMC x8 PCI Express bull Front and rear IObull Supports 216 GHz or 15 GHz Intel Core 2 Duo processors bull Intel E7520 server chipsetbull Up to 4 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade

RSC No 34763

PP 30202xTwo processor versions available bull 18 GHz Intel Pentium M processor 745 uses mFC-PGA 478 (micro Flip-Chip Pin Grid Array) package bull 14 GHz Intel Pentium M processor Low Voltage 738uses mFC-BGA 479 (micro Flip-Chip Ball Grid Array) package bull 64 KB primary (L1) on-die cache2 MB of secondary (L2) on-die cache bull 400 MHz Front Side Bus (FSB) bull No CPU fan bull 16 GHz processor version (1 MB L2 cache) available see PP 30002x datasheet bull Utilizes 64-bitIntel 855GME chipset bull Supports 400 MHz bus frequency bull Uses Intel 6300ESB IO Controller Hub

RSC No 32659

Concurrent Technologies Incwwwgocctcom

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PrOduCT GuIdE6U CompactPCI

cCIBPMC6U-ETA 6U bridged dual PMC carrier that bridges extended temperature CompactPCI boards and PMCs bull Features a rugged CompactPCI form factor providing increased flexibility to military communications systems designers bull Provides additional design choices to users through its differing bus speeds maximizing the numberof PMCs that can be used CompactPCI andPMC buses can both run at 66 or 33 MHzbull Operating temperature range of -40 degC to+85 degC bull Signal conditioning bull DMA supportbull Low-power design +5 V +33 V +12 V -12 V bull User-selectable VIO of 33 V or 5 V to the PMC

RSC No 32891

Dynamic Engineeringwwwdynengcom

cPCI4IP-MMMinimized PCI address footprint IndustryPack carrier for CompactPCI applications bull 6U 4HP4 IP positions 832 clock selection for each slot fused filtered power IO options bull ID INT IO and Mem spaces are decoded for each IP slotbull Single and double wide IPrsquos bull 16- and 32- bit IPs bull 32-bit access to 16-bit IPs bull Full or mini-mized Memory Space decoding for 18 the PCI address requirement bull With the cPCI4IP-MM option 8 CompactPCI 4IP cards take the same PCI address space as 1 full Mem Space card

RSC No 34905

ACQ132CPCI32 channel MHz class simultaneous sampling intelligent digitizer bull 32 simultaneous analoginput channels 2-32 MSpschannel 14-bit resolution bull Differential inputs bull Intelligent cardwith 1 gigabyte memory and GbE on board bull Large distributed FPGA resource on boardbull Range of DSP functions including FIR filtering and Digital Downconverter

RSC No 35482

D-TACQ Solutions Ltdwwwd-tacqcouk

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CR11Based on the Intel Core Duo Processor the platform is designed to support processor speeds from 106 GHz up to 20 GHz bull Intel Core 2 Duo runs at 15 GHz up to 20 GHz bull Conduction cooled bull Two PMC slots bull PCI Express bull 2x GbE

RSC No 33156

ICS-72532-channel 6U CompactPCI DAC board bull 6U CompactPCI data acquisition card bull 32 differential output channels bull 16 or 24-bit sample size bull 288 kHzch data rate bull Simultaneous sampling across all channels on single or multiple boards bull 32 separate delta-sigma DACs bull 64-bit 66 MHz CompactPCI PICMG 20 Rev30 hot-swappable bull FPDP II 400 MBps interface

RSC No 33576

ICS-71032-channel 6U CompactPCI ADC board bull 6U CompactPCI data acquisition card bull 32 differential input channels bull 216 KHzch 24-bit resolution bull Software selectable full scale input bull FPDP II 400 MBpsinterface bull 64-bit 66 MHz CompactPCI PICMG 20 Rev 30 hot swappable bull 32 synchronous boards for simultaneous sampling bull Sonar acoustics and test and measurement applications

RSC No 33578

Tsumani 6U CPCI Development KitFPGA processor solution targeted at high performance software defined radio applications bull Dual Stratix EP1S80 FPGAs are tightly coupled to provide apower platform for signal processing bull Two PMC module sites provide IO connectivity to either front panel or back panel connections bull A direct highbandwidth 1 GBps path from the PMC P4 connector directly to the FPGAs bull Model 919 Dual DAC Mezzanine provides broadband analog signal generationin a compact form bull The board features two independent DAC channels each with its own 12-bit LVDS input capable of running at rates up to 160 MHz

RSC No 32026

CP11Rugged 6U SBC bull Up to 4 GB of DDR2 SDRAM (200 MHz) with enhanced ECC four independent onboard PCI buses system host and peripheral modesupport for the CompactPCI backplane two PMC interfaces (64-bit133 MHz and 32-bit33 MHz) bull Instead of the PMC1 a PCI Express based XMC interface is available on request bull Two GbE one Fast Ethernet two serial interfaces (RS-232 or RS-422485) USB 20 integrated HDD or flash drive bull High performance 2D3D ATI video controller capable of driving two displays in parallel supports VGADVI interface bull Intel Core 2 Duo at 216 GHz Intel Core Duo at 20 GHz2x PMC expansion site bull One XMC optional bull Up to 4 GB DDR2 SDRAM wECC 2x GbE

RSC No 33447

GE Fanuc Intelligent Platforms Incwwwgefanucembeddedcom

Single Board ComputersGD Canada designs and manufactures conduction-cooled Single Board Computers (SBCs)using Intel processors bull 6U and 3U form factors for CompactPCI backplanes bull Fully backward compatible with earlier models bull Upgradeable via the change-out of processor memory andIO modules bull Used within GD Canada computer systems and sold as individual products

RSC No 35281

General Dynamicswwwgdcanadacom

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PrOduCT GuIdE6U CompactPCI

cPCI6U-24DSI32R32-channel 24-bit delta-sigma CompactPCI 6U analog input board with rear IO bull Low noise 24-bit resolution low phase distortion andmulti-board synchronization bull Suits state-of-the-art sonar and noise monitoring applications bull 32-channel cPCI6U-24DSI32 analog input boardprovides a high-density 24-bit analog input resources on a standard 6U CompactPCI expansion board bull Applications from precision voltagemeasurements to complex audio signal and waveform analysis

RSC No 34985

General Standards Corporationwwwgeneralstandardscom

Duet 3U 64-bit 1 GHz TMS320C6416 DSP (x2) 64 MB SDRAM per processor bull Flexible internalexternalcommunication mesh bull 64-bit66 MHz CompactPCI bull PMCXMC site with Jn4 to FPGA and4 RocketIO per VITA 42 bull External data port up to 12 Gbps bull 4M or 5M Virtex-II Pro FPGAbull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM dedicated800 MBps links between DSPs bull 3U CompactPCI with PXI support bull Suits high-end co-processing wireless broadband communications RADAR video and biometrics

RSC No 32856

QuadiaQuad-DSP bull Dual FPGA bull Dual PMC sites bull Inter-processor connectivity and access to external interfaces bull Four C6416 DSPs split in two independent clusters each hosting a PMC site bull One large FPGA for end-user code bull Central FPGA routing interprocessor communication bull End-user FPGA communication bull External port serial IO for PCIe or other p ivate link bull Global memoryand PCI interface bull 1 GHz TMS320C6416 DSP (x4) bull 64 MB SDRAM per processor bull Flexible internalexternal communication mesh bull 64-bit66 MHz CompactPCI bull Two PMC sites with Jn4 to FPGA bull External data port up to 12 Gbps bull Two 4M Gate FPGA reserved for end-user code bull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM bull Up to 512 MB Global DDR SDRAM bull Suits high-end co-processing wireless and broadband communications

RSC No 34737

Quixote 64-bit 6UAdvanced signal capture generation and co-processing bull 1 GHz TMS320C6416 DSP and2 to 6 MGATE Virtex-II FPGA bull 32 MB SDRAM 8 MB ZBT SBSRAM and AD6645 and AD9764 converters bull 6432 bit CompactPCI 66 MHz 5 V33 V and complex trigger modes with HW event logging bull PMC site with Jn4 to FPGA DIO and PICMG 217 StarFabric compliant bull Suits Software Defined Radio wireless IP and RADAR development and hardware testing bull Physical Layer field testing ultra-fast flexible data acquisition vector signal generation and electronic warfare

RSC No 32861

Innovative Integrationwwwinnovative-dspcom

IC-e6-cPCIbHigh performance 6U CompactPCI board bull Powered by one or two of Freescalersquos mostadvanced 14 GHz MPC7448 PowerPC processors bull PICMG 216 compliant bull Marvell Discovery III chipset (MV64460) bull Low power consumption bull Standard extended and rugged grades

RSC No 32982

Interface Conceptwwwinterfaceconceptcom

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PrOduCT GuIdE6U CompactPCI

CP213Single-width 6U CompactPCIPXI module with either 32 or 64 differential analog input channelsbull 32 64 or 128 channels of analog input bull 16 multifunction digital IO (TTL) channels that may beconfigured as digital in digital out or selectively attached to 2 frequency in 2 counter in andor 2 timerout channels bull 16-bit resolution bull Programmable gain per channel programmable scan rates of lt1 Ss through 100 KSs bull Precision onboard reference for end-to-end calibration

RSC No 34804

KineticSystems Company LLCwwwkscorpcom

CP6001Energy efficient embedded Intel dual core processors bull 12 GHz Intel Core Duo U2500 ULV processor bull Intel Core 2 Duo L7400 LV processor bull Based on the Intel Mobile 945GM chipset with a front side bus of up to 667 MHz and ICH7-R Southbridge bull Two independent digital video outputs to the rear IO (2x DVI - 1x DVI and 1x HDMI) bull AC97 audio capabilities bull 3 x GbE bull 4 x SATA with RAID 01510 functionality bull 6 x USB 20 2 x COM and VGA or DVI bull Can also accommodate a PMC slot or an onboard 25 inch SATA HDD bull Up to 8 GB of USB or 2 GB soldered flash bull Supports Linux Windows XP XP embedded and VxWorks 6

RSC No 34182

CP6923 GbE Switch6U CompactPCI GbE Switch PICMG 216 compliant bull Leading edge te hnology basedon BCM5650X chip bull 24x GbE ports bull Non-blocking Layer 2 and 3 switching and routingbull Copper optical rear IO version bull Hot swap IPMI bull Fully managed bull Comprehensive firmware package bull Applies to VoIP installations such as call servers media gatewaysand trunking gateways in wireline and wireless networks as well as VoIP systems inenterprise networks with high demands on performance

RSC No 32256

Kontronwwwkontroncom

TMS320C6701 Virtex-IITexas Instrumentsrsquo C6701 DSP bull Xilinx Virtex-II series FPGA up to XC2V8000 bull Multiple IO interfaces Onboard CODEC VIM expansion sites 60-pin GPIO header and JTAG bull Hardware drivers integration in SimulinkXilinx System Generator Blocksets for quick implementation of Simulink models bull DSP and FPGA-in-the-loop cosimulation of SimulinkXilinx System Generator models bull Leading edge communication interface allowing real-time datamonitoring from Simulink scopes and remote operations

RSC No 32028

VHS-DACHigh performance multichannel DA for phased array antenna systems radarsonar communications receiversup-sampling to IF stage and RFIF AGC apps bull Eight 125 MSPS output channels bull Optional add-on daughter boardprovides 8 additional output channels or 8 additional input channels bull 32-bit 25 MHz bull FPDP interface with 400 MBps transfer rate (25 MSPS per channel at 8 channels 125 MSPS at 16 channels) bull Low level hardware drivers API andGUI bull High level hardware drivers integration in Simulink Blocksets bull Leading edge communication interface fordata recording and playback tofrom the onboard SDRAM

RSC No 32029

Lyrtechwwwlyrtechcom

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PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

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PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

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PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

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PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

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PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

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SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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Page 26: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

IEEE 8023ap provides a design targetAs Ethernet has emerged as the industryrsquos dominant signaling methodology the IEEE has developed the 10GBASE-KR norma-tive Channel model to define interconnect Channel performance for NRZ signaling at 10 Gbps This standard defines acceptable performance in terms of S-parameter charts for through-Channel insertion loss and worst-case crosstalk Figures 2a and 2b illustrate masks for Draft 24 of the standard that was initially used for this exercise

In each case the mask defining compliant performance is shown in blue Channel insertion loss is shown in red in Figure 2a Crosstalk performance is defined by the ICR curve (Figure 2b) Minimum acceptable Channel performance is defined in the ICR chart (Figure 2b) by the blue line The effect of the sum of all aggressors on the through-Channel is shown in red The green ICR curve is the ratio of the crosstalk power sum calculated by summing the

magnitudes of any impacting crosstalk Channels for each fre-quency and using a straight line fit (using least-squares method) to determine the resulting average effect f the aggressors on the through-Channel This is then overlaid on the insertion loss and used to plot the ICR curve

This standard which has evolved through a variety of iterations forms the basis for developing a 40 GbE switch fabric backplane featuring 10 Gbps NRZ differential pairs If all differential pairs can meet this standard then the backplane can be considered to be 10GBASE-KR compliant

Applying 10GBASE-KR to a 14-slotAdvancedTCA applicationThe PICMG specification dictates that receive differential pairs are placed on the c-d and g-h rows of the HM-ZD connector and that transmit differential pairs are placed on the a-b and e-f rows Therefore the middle differential pair in row c-d of Slot B will be subject to the NEXT of three aggressors in each of the a-b and e-f transmit rows of slot B plus the FEXT of the signals being received in the c-d pairs in the top and bottom of slot B

In this topology it can be seen that worst-case crosstalk would occur if all the NEXT and FEXT aggressors were routed on the bottom Layer that is on the same Layer as that of the victim c-d However given that all signal vias must be back-drilled and tuned for impedance management purposes Channel crosstalk can simultaneously be reduced by allocating different routing Layers to differential pairs terminated in the same backplane connector

The principal factor in determining the feasibility of a 10GBASE-KR compliant backplane is based on understanding whether the Channel with the worst-case signal-to-noise ratio is compliant

The skew targets determine permissible layer separation between a-b c-d e-f and g-h pairs within each Channel and enable routing Layers to be allocated for each pair It is now possible to start the process of via tuning to optimize the channel performance for minimum insertion loss Modeling begins by defining the simulation boundaries for the channel so that Channel component models (PCB traces connectors vias) can easily be aggregated to model complete Channels Boundaries must be established at locations in the Channel where linear 3D structures exist These are shown in Figure 3 (next page)

Since the connector and via combinations for the backplane and daughtercard mating halves must each be treated as a whole it

PICMG 30Spec

TurboFabricSpec

Total Inter-PairSkew

(Fabric Interface)

05 mm in FR4(34 ps)

001 mmin N4000-13si

(00625 ps)

Total Intra-Channel Skew

(Fabric Interface)

254 mm in FR4(17 ps)

plusmn01 mmin N4000-13si

(0625ps)

Total Intra-Channel Skew

(Base Interface)

135 mm in FR4(90 ps)

plusmn01 mmin N4000-13si

(0625 ps)

Figures 2a and 2b

Table 3

Determining which Channel that is and identifying the worst-case SN requires making trade-offs with regard to PCB material Channel length via design connector row selection and NEXT and FEXT aggressor routing choices These trade-off choices can only take place using advanced 3D simulation tools such as Ansoft HFSS This was the essence of the design process employed in developing Simclarrsquos TurboFabric backplanes

The simulation processThe transmission length for full mesh and dual star backplanes design implementations varies from a maximum of 1632 inches to a minimum of 116 inches With an effective transmission length of 5 inches on each daughtercard this makes the longest effective Channel 2632 inches including two connectors

For a 10GBASE-KR application over this distance a high-perfor-mance laminate is essential for both reducing insertion loss and

ensuring high glass content in the weave to mitigate skew So the design process began by choosing a low-loss dielectric material (Nelco 4000-13SI for both the backplane and the daugh-tercards) and establishing targets for Inter-Pair and Intra-Channel skew as shown in Table 3

Adhering to the PICMG 30 specifi-cation for skew in a 10GBASE-KR application is impractical Instead a target of 00625 ps was set for Inter-Pair skew with 0625 ps set for Intra-Pair skew for the backplane only This equated to a maximum 001 mm differ-

ence being allowed between traces of any differential pair and 01 mm being permitted between traces of any four differential pairs in a Channel Given the topology of the HM-ZD connector daughter-card skew must be accounted for in the daughtercard layout Fo

Sin Pnt

should be noted that the simulation boundary is located within the mated connector

Tuning the connector and via structures to 50Ω is an iterative process involving the removal of excess pads back-drilling and tuning pads anti-pads and traces A Time Domain Reflectometer (TDR) plot illustrating the results of the tuning process is shown in Figure 4

Upon completion of the modeling process a total of 17 different optimized via and routing configurations had been designed for the full mesh design and nine for the dual star design

A plot of worst-case insertion loss is shown in Figure 5 and demonstrates that in both cases performance is well above the 10GBASE-KR mask

When all the through-Channels have been modeled adjacent Channel models can be combined and ICR curves plotted to evaluate the impact of crosstalk on through-Channel performance This valuable information can be used to adjust the position of signal Layers relative to pass-through aggressor traces on adjacent Layers or to reroute traces to reduce crosstalk Similarly routing Layers can be changed to reduce crosstalk in adjacent via barrels

Figure 6 plots worst-case ICR and demonstrates that performance is above the 10GBASE-KR mask Based on this result it was possible to proceed to physical implementation

Figure 3

Figure 4

Fo Sin Pnt

Physical realizationThe layout process was performed using the Mentor Board-Station CAD system Quad-routing (routing four traces between pads) was explored as a routing method-ology in order to reduce Layer count but this was dismissed due to the detrimental impact on crosstalk performance

The attributes of the physical backplanes produced as a result of the design effort are shown in Table 4

The design files produced included the usual gerber files plus detailed back-drilling instructions

The design validation process comprised a conventional continuity test followed by performance testing featuring Agilent equipment including 70340A signal generator 8720ES Network Analyzer NN18A S-Parameter test-set and 86100A sampling oscilloscope with Agilent 86112A module Figure 7 (next page) shows the test set up

Simclar developed special line cards to enable through-Channel measurements with and without crosstalk The signal launch featured compression mount SMAs terminated in a tuned via structure The Channel simulations included simu-lation of the tuned launch structures so de-embedding of the launches was not necessary for correlation to simulation purposes The development team also established a process for characterization of all Channels

Full Mesh Dual Star

Layer Count 34 18

Aspect Ratio 121 61

Tuned Vias 3952 768

Material Nelco 4000-13SI

Table 4

Figure 5 Figure 6

Fo Sin Pnt

In Figure 8 measured through-Channel performance and ICR curves are shown for the same Channels described in the simula-tion section earlier

As can be seen from Figure 8 there is close correlation between these and the simulated plots in Figures 5 and 6 In fact close correlation between all simulated and measured results was achieved resulting in a 728 Tbps capacity full mesh and a 960 Gbps capacity dual star backplane design now generally available as part of the Simclar TurboFabric shelf

Figure 7 Figure 8

Figure 9

Figure 10

Implications of 10GBASE-KR Draft 33versus Draft 25The work described above was targeted towards meeting the Channels specifications contained in Draft 25 of the IEEE 10GBASE-KR Since this work was completed the IEEE has up-issued the Draft revision level for the Standard from 25 to 33 While this has not impacted through-Channel performance demands it has increased Channel isolation requirements by around 10 dB In Figure 9 a Draft 33 mask is added to the ICR plot shown in Figure 8

From Figure 9 it can be seen how Draft 33 pulls the mask above the Channel ICR curve for this full mesh backplane Channel Surprisingly it is the Channelrsquos frequency response at relatively low frequencies between 100-500 MHz that is causing a problem The reasons for this are currently the subject of further detailed investigation

However Figure 10 shows a Draft 33 plot for a less demanding dual star AdvancedTCA implementation featuring shorter trans-mission distances This plot demonstrates compliance to Draft 33 of the IEEE 8023ap 10GBASE-KR Standard

ConclusionBy developing a close understanding of the many factors contrib-uting to loss and noise in multi-gigabit backplane Channels it is possible to characterize their performance using advanced simula-tion techniques and correlate that performance in physical prod-ucts using advanced test methods By overlaying the test results on S-Parameter masks defined by the IEEE 8023ap 10GBASE-KR Standard it has been demonstrated that backplanes that truly enable AdvancedTCA scalability are at last a reality

Douglas Hynd joined Simclar Group in 2006 as Director of Marketing as part of Simclarrsquos acquisition of Northrop Grumman Interconnect Technologies Division wherehe was Vice President of Marketing and Sales He has more than 24 yearsrsquo experience intechnology sales marketing and generalmanagement and holds a BSc (Eng) in Electronics and Electrical Engineeringfrom the University of Glasgow He isbased at Simclarrsquos Global HQ inDunfermline Scotland

Simclar Groupdouglashyndsimclarcom bull wwwsimclarcom

Fo Sin Pnt

6U CompactPCIPrOduCT GuIdE g

This monthrsquos issue includes a 6U CompactPCI Product Guide and Irsquod like to take the opportunity to reflect a bit on the success and evolution of that technology

Back in the 1994 time frame when CompactPCI was first being devel-oped it began as 3U-only technology It used the same Eurocardmechanics that were popularized by VME and an IEC standardized high-

density high-speed connector available from a number of vendors suitablefor 33 MHz PCI signaling That connector was selected by the engineers atZiatech with help from Mike Munroe then at ERNI The majority of VMEdesigns were 6U and based on this I was among a number of folks thatargued for adding the 6U CompactPCI form factor

The 6U form factor presented some challenges and opportunities Onechallenge was that the insertion and extraction forces were quite high when the entire rear of the card was populated with connectors Fortunately the IEEE standards for Eurocards evolved and injectorejector handles that pro-vided leverage became available Eike Waltz then at Rittal was instrumental in bringing that to the table Two of the opportunities that came along withthe extra connectors were a clean way to add secondary buses like the H110 telephony bus to the backplane and the ability to route IO out the rear through rear transition modules PICMG has developed quite a number of subsidiary specifications defining the interoperable use of the extra backplane pins made possible with the 6U form factor Both of these features have played a major part in CompactPCIrsquos success The next major evolution of 6U CompactPCI came with the PICMG 216 Packet Switched Backplane standard which was originally conceived by John Peters and his team at Performance Technologies PICMG 216 interconnected a shelf full of CompactPCI single board computers via redundant Ethernet switches also in the 6U CompactPCI form factor This dramatically increased usable backplane bandwidth and provided redundancy PICMG 216 paved the way for AdvancedTCA and was the industryrsquos first open standard for the switched serial interconnect standards we see popping up in many places

By Joe Pavlat

Looking back and ahead at6U CompactPCI

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Recent 6U CompactPCI related products are listed here For more informationenter the productrsquos RSC No at wwwcompactpci-systemscomrsc

cPCI-6910Dual-core Intel Xeon Processor LVULV Universal blade bull Supports Single Dual-Core Intel Xeon LV or ULV processorsbull Front Side Bus 667 MHz bull Up to 2 GB DDR2 400 MHz soldered SDRAM with ECC bull Four PCI Express GbEbull Up to 4 USB 20 ports bull PICMG 20 21 29 216 compliant

RSC No 35013

ADLINK Technologywwwadlinktechcom

CPCIStor Module6U CompactPCI storage blade bull Onboard ATA controller supports CDDVD HDD and solid-state flashbull Supports Hot Swap Removal (ask about RAID support) bull ATA disks available in Enhanced Dutycycle versions for NEBS Level 3 - 724 requirements bull Operating Systems supported VxWorksLinux and Windows

RSC No 34800

ACTTechnicowwwacttechnicocom

Prosody X cPCI E1T1An E1T1 digital network access card bull Suits telco developers and systems integrators bull Uses Aculabrsquos worldwide protocol coverage including Aculabrsquos SS7 stack available under a cost free license bull Available with 8 or 16 E1T1 trunks and software selectable E1T1 interfaces bull Flexible mix of protocols including ISDN CAS and SS7 (ITU-T China and ANSI) bull A variety of interconnect switching and protocol conversion solutions can be readily crafted bull High availability reliability and scalability with industry standard hardw re and software interoperability bull Up to 128 SS7 signaling links bull Non-circuit related (TCAP) messagingintensive applications such as prepaid and SMS

RSC No 35408

Aculabwwwaculabcom

Adexp8021Intel Core Duo L2400 (166 GHz) w E7520 server chipset bull Dual channel PC2-3200 Registered RAM SECDED or x4 SDDC bull Two GbE two Serial ATA four USB 20 bull Onboard SXGA graphics 1280 x 24-bitbull 6U CompactPCI Bus PICMG EXP0 R10 Specification bull RoHS compliant 0 degC to +55 degC operating range

RSC No 32837

Advanet Incwwwadvanetcojpen

TC84012 channel single-stop Time-to-Digital Converter (TDC) with single-start and multi-start acquisition modes bull 50 ps timing resolution bull Wide range with upto 20 s between first and last events bull Large internal memory buffer with up to 512 hits per channel bull Low jitter (lt3 ps rms) high stability (plusmn2 ppm) internalclock source bull External 10 MHz reference input bull FPGA based Data Processing Unit (DPU) bull Fast readout with DMA mode for increased data throughputbull Overvoltage-protected inputs with 50 Ω K-Lock (LEMO) connectors bull Built-in self calibration bull Modular single-slot 6U PXICompactPCI standardbull Low power consumption (lt22 W)

RSC No 33445

Agilent-Acqiriswwwacqiriscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

MIC-30428-slot 6U CompactPCI backplane bull AC or DC CompactPCI 500 W + 250 W redundant(2+1) power supplies bull PICMG 216 (CompactPCI Packet Switching Backplane) compliancebull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarmmodule (MIC-3924L-AE)

RSC No 32851

MIC-30436-slot 6U CompactPCI backplane bull Supports two hot-swappable SCSISATA or removableIDE HDD bays bull Built-in IDE slim-type DVD-ROM bull AC or DC CompactPCI 250 W + 250 Wredundant (1+1) power supplies bull Supports hot-swappable fan modules bull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarm module (MIC-3924L-AE)

RSC No 32850

Advantech Corporationwwwadvantechcom

Dual-Core Xeon CompactPCI SBCModel PP 42123x bull Dual CPU 6U CompactPCI SBC supporting two dual-core Xeon CPUs bull Up to 8 GB DDR2 ECC SDRAM in a single system or peripheralslot bull Dual processor SBC in a single 6U CompactPCI slot bull Supports two 166 GHz Dual-Core Intel Xeon ULV processors using Intel E7520 server chipsetbull Up to 8 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull PMCXMC site support 66 MHz PCI-X and x8 PCI Express bull Front and rear IO bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade bull Four GbE ports with option for PICMG 216

RSC No 34761

6U CompactPCI Core 2 Duo SBCModel PP 41203x bull 6U CompactPCI Core 2 Duo SBC supporting two PMC sites includingone XMC site bull Up to 4 GB DDR2 ECC SDRAM bull All in a single system or peripheral slot bull TwoPMC sites supporting up to 100 MHz PCI-X bull One XMC x8 PCI Express bull Front and rear IObull Supports 216 GHz or 15 GHz Intel Core 2 Duo processors bull Intel E7520 server chipsetbull Up to 4 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade

RSC No 34763

PP 30202xTwo processor versions available bull 18 GHz Intel Pentium M processor 745 uses mFC-PGA 478 (micro Flip-Chip Pin Grid Array) package bull 14 GHz Intel Pentium M processor Low Voltage 738uses mFC-BGA 479 (micro Flip-Chip Ball Grid Array) package bull 64 KB primary (L1) on-die cache2 MB of secondary (L2) on-die cache bull 400 MHz Front Side Bus (FSB) bull No CPU fan bull 16 GHz processor version (1 MB L2 cache) available see PP 30002x datasheet bull Utilizes 64-bitIntel 855GME chipset bull Supports 400 MHz bus frequency bull Uses Intel 6300ESB IO Controller Hub

RSC No 32659

Concurrent Technologies Incwwwgocctcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cCIBPMC6U-ETA 6U bridged dual PMC carrier that bridges extended temperature CompactPCI boards and PMCs bull Features a rugged CompactPCI form factor providing increased flexibility to military communications systems designers bull Provides additional design choices to users through its differing bus speeds maximizing the numberof PMCs that can be used CompactPCI andPMC buses can both run at 66 or 33 MHzbull Operating temperature range of -40 degC to+85 degC bull Signal conditioning bull DMA supportbull Low-power design +5 V +33 V +12 V -12 V bull User-selectable VIO of 33 V or 5 V to the PMC

RSC No 32891

Dynamic Engineeringwwwdynengcom

cPCI4IP-MMMinimized PCI address footprint IndustryPack carrier for CompactPCI applications bull 6U 4HP4 IP positions 832 clock selection for each slot fused filtered power IO options bull ID INT IO and Mem spaces are decoded for each IP slotbull Single and double wide IPrsquos bull 16- and 32- bit IPs bull 32-bit access to 16-bit IPs bull Full or mini-mized Memory Space decoding for 18 the PCI address requirement bull With the cPCI4IP-MM option 8 CompactPCI 4IP cards take the same PCI address space as 1 full Mem Space card

RSC No 34905

ACQ132CPCI32 channel MHz class simultaneous sampling intelligent digitizer bull 32 simultaneous analoginput channels 2-32 MSpschannel 14-bit resolution bull Differential inputs bull Intelligent cardwith 1 gigabyte memory and GbE on board bull Large distributed FPGA resource on boardbull Range of DSP functions including FIR filtering and Digital Downconverter

RSC No 35482

D-TACQ Solutions Ltdwwwd-tacqcouk

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CR11Based on the Intel Core Duo Processor the platform is designed to support processor speeds from 106 GHz up to 20 GHz bull Intel Core 2 Duo runs at 15 GHz up to 20 GHz bull Conduction cooled bull Two PMC slots bull PCI Express bull 2x GbE

RSC No 33156

ICS-72532-channel 6U CompactPCI DAC board bull 6U CompactPCI data acquisition card bull 32 differential output channels bull 16 or 24-bit sample size bull 288 kHzch data rate bull Simultaneous sampling across all channels on single or multiple boards bull 32 separate delta-sigma DACs bull 64-bit 66 MHz CompactPCI PICMG 20 Rev30 hot-swappable bull FPDP II 400 MBps interface

RSC No 33576

ICS-71032-channel 6U CompactPCI ADC board bull 6U CompactPCI data acquisition card bull 32 differential input channels bull 216 KHzch 24-bit resolution bull Software selectable full scale input bull FPDP II 400 MBpsinterface bull 64-bit 66 MHz CompactPCI PICMG 20 Rev 30 hot swappable bull 32 synchronous boards for simultaneous sampling bull Sonar acoustics and test and measurement applications

RSC No 33578

Tsumani 6U CPCI Development KitFPGA processor solution targeted at high performance software defined radio applications bull Dual Stratix EP1S80 FPGAs are tightly coupled to provide apower platform for signal processing bull Two PMC module sites provide IO connectivity to either front panel or back panel connections bull A direct highbandwidth 1 GBps path from the PMC P4 connector directly to the FPGAs bull Model 919 Dual DAC Mezzanine provides broadband analog signal generationin a compact form bull The board features two independent DAC channels each with its own 12-bit LVDS input capable of running at rates up to 160 MHz

RSC No 32026

CP11Rugged 6U SBC bull Up to 4 GB of DDR2 SDRAM (200 MHz) with enhanced ECC four independent onboard PCI buses system host and peripheral modesupport for the CompactPCI backplane two PMC interfaces (64-bit133 MHz and 32-bit33 MHz) bull Instead of the PMC1 a PCI Express based XMC interface is available on request bull Two GbE one Fast Ethernet two serial interfaces (RS-232 or RS-422485) USB 20 integrated HDD or flash drive bull High performance 2D3D ATI video controller capable of driving two displays in parallel supports VGADVI interface bull Intel Core 2 Duo at 216 GHz Intel Core Duo at 20 GHz2x PMC expansion site bull One XMC optional bull Up to 4 GB DDR2 SDRAM wECC 2x GbE

RSC No 33447

GE Fanuc Intelligent Platforms Incwwwgefanucembeddedcom

Single Board ComputersGD Canada designs and manufactures conduction-cooled Single Board Computers (SBCs)using Intel processors bull 6U and 3U form factors for CompactPCI backplanes bull Fully backward compatible with earlier models bull Upgradeable via the change-out of processor memory andIO modules bull Used within GD Canada computer systems and sold as individual products

RSC No 35281

General Dynamicswwwgdcanadacom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cPCI6U-24DSI32R32-channel 24-bit delta-sigma CompactPCI 6U analog input board with rear IO bull Low noise 24-bit resolution low phase distortion andmulti-board synchronization bull Suits state-of-the-art sonar and noise monitoring applications bull 32-channel cPCI6U-24DSI32 analog input boardprovides a high-density 24-bit analog input resources on a standard 6U CompactPCI expansion board bull Applications from precision voltagemeasurements to complex audio signal and waveform analysis

RSC No 34985

General Standards Corporationwwwgeneralstandardscom

Duet 3U 64-bit 1 GHz TMS320C6416 DSP (x2) 64 MB SDRAM per processor bull Flexible internalexternalcommunication mesh bull 64-bit66 MHz CompactPCI bull PMCXMC site with Jn4 to FPGA and4 RocketIO per VITA 42 bull External data port up to 12 Gbps bull 4M or 5M Virtex-II Pro FPGAbull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM dedicated800 MBps links between DSPs bull 3U CompactPCI with PXI support bull Suits high-end co-processing wireless broadband communications RADAR video and biometrics

RSC No 32856

QuadiaQuad-DSP bull Dual FPGA bull Dual PMC sites bull Inter-processor connectivity and access to external interfaces bull Four C6416 DSPs split in two independent clusters each hosting a PMC site bull One large FPGA for end-user code bull Central FPGA routing interprocessor communication bull End-user FPGA communication bull External port serial IO for PCIe or other p ivate link bull Global memoryand PCI interface bull 1 GHz TMS320C6416 DSP (x4) bull 64 MB SDRAM per processor bull Flexible internalexternal communication mesh bull 64-bit66 MHz CompactPCI bull Two PMC sites with Jn4 to FPGA bull External data port up to 12 Gbps bull Two 4M Gate FPGA reserved for end-user code bull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM bull Up to 512 MB Global DDR SDRAM bull Suits high-end co-processing wireless and broadband communications

RSC No 34737

Quixote 64-bit 6UAdvanced signal capture generation and co-processing bull 1 GHz TMS320C6416 DSP and2 to 6 MGATE Virtex-II FPGA bull 32 MB SDRAM 8 MB ZBT SBSRAM and AD6645 and AD9764 converters bull 6432 bit CompactPCI 66 MHz 5 V33 V and complex trigger modes with HW event logging bull PMC site with Jn4 to FPGA DIO and PICMG 217 StarFabric compliant bull Suits Software Defined Radio wireless IP and RADAR development and hardware testing bull Physical Layer field testing ultra-fast flexible data acquisition vector signal generation and electronic warfare

RSC No 32861

Innovative Integrationwwwinnovative-dspcom

IC-e6-cPCIbHigh performance 6U CompactPCI board bull Powered by one or two of Freescalersquos mostadvanced 14 GHz MPC7448 PowerPC processors bull PICMG 216 compliant bull Marvell Discovery III chipset (MV64460) bull Low power consumption bull Standard extended and rugged grades

RSC No 32982

Interface Conceptwwwinterfaceconceptcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CP213Single-width 6U CompactPCIPXI module with either 32 or 64 differential analog input channelsbull 32 64 or 128 channels of analog input bull 16 multifunction digital IO (TTL) channels that may beconfigured as digital in digital out or selectively attached to 2 frequency in 2 counter in andor 2 timerout channels bull 16-bit resolution bull Programmable gain per channel programmable scan rates of lt1 Ss through 100 KSs bull Precision onboard reference for end-to-end calibration

RSC No 34804

KineticSystems Company LLCwwwkscorpcom

CP6001Energy efficient embedded Intel dual core processors bull 12 GHz Intel Core Duo U2500 ULV processor bull Intel Core 2 Duo L7400 LV processor bull Based on the Intel Mobile 945GM chipset with a front side bus of up to 667 MHz and ICH7-R Southbridge bull Two independent digital video outputs to the rear IO (2x DVI - 1x DVI and 1x HDMI) bull AC97 audio capabilities bull 3 x GbE bull 4 x SATA with RAID 01510 functionality bull 6 x USB 20 2 x COM and VGA or DVI bull Can also accommodate a PMC slot or an onboard 25 inch SATA HDD bull Up to 8 GB of USB or 2 GB soldered flash bull Supports Linux Windows XP XP embedded and VxWorks 6

RSC No 34182

CP6923 GbE Switch6U CompactPCI GbE Switch PICMG 216 compliant bull Leading edge te hnology basedon BCM5650X chip bull 24x GbE ports bull Non-blocking Layer 2 and 3 switching and routingbull Copper optical rear IO version bull Hot swap IPMI bull Fully managed bull Comprehensive firmware package bull Applies to VoIP installations such as call servers media gatewaysand trunking gateways in wireline and wireless networks as well as VoIP systems inenterprise networks with high demands on performance

RSC No 32256

Kontronwwwkontroncom

TMS320C6701 Virtex-IITexas Instrumentsrsquo C6701 DSP bull Xilinx Virtex-II series FPGA up to XC2V8000 bull Multiple IO interfaces Onboard CODEC VIM expansion sites 60-pin GPIO header and JTAG bull Hardware drivers integration in SimulinkXilinx System Generator Blocksets for quick implementation of Simulink models bull DSP and FPGA-in-the-loop cosimulation of SimulinkXilinx System Generator models bull Leading edge communication interface allowing real-time datamonitoring from Simulink scopes and remote operations

RSC No 32028

VHS-DACHigh performance multichannel DA for phased array antenna systems radarsonar communications receiversup-sampling to IF stage and RFIF AGC apps bull Eight 125 MSPS output channels bull Optional add-on daughter boardprovides 8 additional output channels or 8 additional input channels bull 32-bit 25 MHz bull FPDP interface with 400 MBps transfer rate (25 MSPS per channel at 8 channels 125 MSPS at 16 channels) bull Low level hardware drivers API andGUI bull High level hardware drivers integration in Simulink Blocksets bull Leading edge communication interface fordata recording and playback tofrom the onboard SDRAM

RSC No 32029

Lyrtechwwwlyrtechcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

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PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

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PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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Page 27: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

should be noted that the simulation boundary is located within the mated connector

Tuning the connector and via structures to 50Ω is an iterative process involving the removal of excess pads back-drilling and tuning pads anti-pads and traces A Time Domain Reflectometer (TDR) plot illustrating the results of the tuning process is shown in Figure 4

Upon completion of the modeling process a total of 17 different optimized via and routing configurations had been designed for the full mesh design and nine for the dual star design

A plot of worst-case insertion loss is shown in Figure 5 and demonstrates that in both cases performance is well above the 10GBASE-KR mask

When all the through-Channels have been modeled adjacent Channel models can be combined and ICR curves plotted to evaluate the impact of crosstalk on through-Channel performance This valuable information can be used to adjust the position of signal Layers relative to pass-through aggressor traces on adjacent Layers or to reroute traces to reduce crosstalk Similarly routing Layers can be changed to reduce crosstalk in adjacent via barrels

Figure 6 plots worst-case ICR and demonstrates that performance is above the 10GBASE-KR mask Based on this result it was possible to proceed to physical implementation

Figure 3

Figure 4

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Physical realizationThe layout process was performed using the Mentor Board-Station CAD system Quad-routing (routing four traces between pads) was explored as a routing method-ology in order to reduce Layer count but this was dismissed due to the detrimental impact on crosstalk performance

The attributes of the physical backplanes produced as a result of the design effort are shown in Table 4

The design files produced included the usual gerber files plus detailed back-drilling instructions

The design validation process comprised a conventional continuity test followed by performance testing featuring Agilent equipment including 70340A signal generator 8720ES Network Analyzer NN18A S-Parameter test-set and 86100A sampling oscilloscope with Agilent 86112A module Figure 7 (next page) shows the test set up

Simclar developed special line cards to enable through-Channel measurements with and without crosstalk The signal launch featured compression mount SMAs terminated in a tuned via structure The Channel simulations included simu-lation of the tuned launch structures so de-embedding of the launches was not necessary for correlation to simulation purposes The development team also established a process for characterization of all Channels

Full Mesh Dual Star

Layer Count 34 18

Aspect Ratio 121 61

Tuned Vias 3952 768

Material Nelco 4000-13SI

Table 4

Figure 5 Figure 6

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In Figure 8 measured through-Channel performance and ICR curves are shown for the same Channels described in the simula-tion section earlier

As can be seen from Figure 8 there is close correlation between these and the simulated plots in Figures 5 and 6 In fact close correlation between all simulated and measured results was achieved resulting in a 728 Tbps capacity full mesh and a 960 Gbps capacity dual star backplane design now generally available as part of the Simclar TurboFabric shelf

Figure 7 Figure 8

Figure 9

Figure 10

Implications of 10GBASE-KR Draft 33versus Draft 25The work described above was targeted towards meeting the Channels specifications contained in Draft 25 of the IEEE 10GBASE-KR Since this work was completed the IEEE has up-issued the Draft revision level for the Standard from 25 to 33 While this has not impacted through-Channel performance demands it has increased Channel isolation requirements by around 10 dB In Figure 9 a Draft 33 mask is added to the ICR plot shown in Figure 8

From Figure 9 it can be seen how Draft 33 pulls the mask above the Channel ICR curve for this full mesh backplane Channel Surprisingly it is the Channelrsquos frequency response at relatively low frequencies between 100-500 MHz that is causing a problem The reasons for this are currently the subject of further detailed investigation

However Figure 10 shows a Draft 33 plot for a less demanding dual star AdvancedTCA implementation featuring shorter trans-mission distances This plot demonstrates compliance to Draft 33 of the IEEE 8023ap 10GBASE-KR Standard

ConclusionBy developing a close understanding of the many factors contrib-uting to loss and noise in multi-gigabit backplane Channels it is possible to characterize their performance using advanced simula-tion techniques and correlate that performance in physical prod-ucts using advanced test methods By overlaying the test results on S-Parameter masks defined by the IEEE 8023ap 10GBASE-KR Standard it has been demonstrated that backplanes that truly enable AdvancedTCA scalability are at last a reality

Douglas Hynd joined Simclar Group in 2006 as Director of Marketing as part of Simclarrsquos acquisition of Northrop Grumman Interconnect Technologies Division wherehe was Vice President of Marketing and Sales He has more than 24 yearsrsquo experience intechnology sales marketing and generalmanagement and holds a BSc (Eng) in Electronics and Electrical Engineeringfrom the University of Glasgow He isbased at Simclarrsquos Global HQ inDunfermline Scotland

Simclar Groupdouglashyndsimclarcom bull wwwsimclarcom

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6U CompactPCIPrOduCT GuIdE g

This monthrsquos issue includes a 6U CompactPCI Product Guide and Irsquod like to take the opportunity to reflect a bit on the success and evolution of that technology

Back in the 1994 time frame when CompactPCI was first being devel-oped it began as 3U-only technology It used the same Eurocardmechanics that were popularized by VME and an IEC standardized high-

density high-speed connector available from a number of vendors suitablefor 33 MHz PCI signaling That connector was selected by the engineers atZiatech with help from Mike Munroe then at ERNI The majority of VMEdesigns were 6U and based on this I was among a number of folks thatargued for adding the 6U CompactPCI form factor

The 6U form factor presented some challenges and opportunities Onechallenge was that the insertion and extraction forces were quite high when the entire rear of the card was populated with connectors Fortunately the IEEE standards for Eurocards evolved and injectorejector handles that pro-vided leverage became available Eike Waltz then at Rittal was instrumental in bringing that to the table Two of the opportunities that came along withthe extra connectors were a clean way to add secondary buses like the H110 telephony bus to the backplane and the ability to route IO out the rear through rear transition modules PICMG has developed quite a number of subsidiary specifications defining the interoperable use of the extra backplane pins made possible with the 6U form factor Both of these features have played a major part in CompactPCIrsquos success The next major evolution of 6U CompactPCI came with the PICMG 216 Packet Switched Backplane standard which was originally conceived by John Peters and his team at Performance Technologies PICMG 216 interconnected a shelf full of CompactPCI single board computers via redundant Ethernet switches also in the 6U CompactPCI form factor This dramatically increased usable backplane bandwidth and provided redundancy PICMG 216 paved the way for AdvancedTCA and was the industryrsquos first open standard for the switched serial interconnect standards we see popping up in many places

By Joe Pavlat

Looking back and ahead at6U CompactPCI

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PrOduCT GuIdE6U CompactPCI

Recent 6U CompactPCI related products are listed here For more informationenter the productrsquos RSC No at wwwcompactpci-systemscomrsc

cPCI-6910Dual-core Intel Xeon Processor LVULV Universal blade bull Supports Single Dual-Core Intel Xeon LV or ULV processorsbull Front Side Bus 667 MHz bull Up to 2 GB DDR2 400 MHz soldered SDRAM with ECC bull Four PCI Express GbEbull Up to 4 USB 20 ports bull PICMG 20 21 29 216 compliant

RSC No 35013

ADLINK Technologywwwadlinktechcom

CPCIStor Module6U CompactPCI storage blade bull Onboard ATA controller supports CDDVD HDD and solid-state flashbull Supports Hot Swap Removal (ask about RAID support) bull ATA disks available in Enhanced Dutycycle versions for NEBS Level 3 - 724 requirements bull Operating Systems supported VxWorksLinux and Windows

RSC No 34800

ACTTechnicowwwacttechnicocom

Prosody X cPCI E1T1An E1T1 digital network access card bull Suits telco developers and systems integrators bull Uses Aculabrsquos worldwide protocol coverage including Aculabrsquos SS7 stack available under a cost free license bull Available with 8 or 16 E1T1 trunks and software selectable E1T1 interfaces bull Flexible mix of protocols including ISDN CAS and SS7 (ITU-T China and ANSI) bull A variety of interconnect switching and protocol conversion solutions can be readily crafted bull High availability reliability and scalability with industry standard hardw re and software interoperability bull Up to 128 SS7 signaling links bull Non-circuit related (TCAP) messagingintensive applications such as prepaid and SMS

RSC No 35408

Aculabwwwaculabcom

Adexp8021Intel Core Duo L2400 (166 GHz) w E7520 server chipset bull Dual channel PC2-3200 Registered RAM SECDED or x4 SDDC bull Two GbE two Serial ATA four USB 20 bull Onboard SXGA graphics 1280 x 24-bitbull 6U CompactPCI Bus PICMG EXP0 R10 Specification bull RoHS compliant 0 degC to +55 degC operating range

RSC No 32837

Advanet Incwwwadvanetcojpen

TC84012 channel single-stop Time-to-Digital Converter (TDC) with single-start and multi-start acquisition modes bull 50 ps timing resolution bull Wide range with upto 20 s between first and last events bull Large internal memory buffer with up to 512 hits per channel bull Low jitter (lt3 ps rms) high stability (plusmn2 ppm) internalclock source bull External 10 MHz reference input bull FPGA based Data Processing Unit (DPU) bull Fast readout with DMA mode for increased data throughputbull Overvoltage-protected inputs with 50 Ω K-Lock (LEMO) connectors bull Built-in self calibration bull Modular single-slot 6U PXICompactPCI standardbull Low power consumption (lt22 W)

RSC No 33445

Agilent-Acqiriswwwacqiriscom

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PrOduCT GuIdE6U CompactPCI

MIC-30428-slot 6U CompactPCI backplane bull AC or DC CompactPCI 500 W + 250 W redundant(2+1) power supplies bull PICMG 216 (CompactPCI Packet Switching Backplane) compliancebull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarmmodule (MIC-3924L-AE)

RSC No 32851

MIC-30436-slot 6U CompactPCI backplane bull Supports two hot-swappable SCSISATA or removableIDE HDD bays bull Built-in IDE slim-type DVD-ROM bull AC or DC CompactPCI 250 W + 250 Wredundant (1+1) power supplies bull Supports hot-swappable fan modules bull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarm module (MIC-3924L-AE)

RSC No 32850

Advantech Corporationwwwadvantechcom

Dual-Core Xeon CompactPCI SBCModel PP 42123x bull Dual CPU 6U CompactPCI SBC supporting two dual-core Xeon CPUs bull Up to 8 GB DDR2 ECC SDRAM in a single system or peripheralslot bull Dual processor SBC in a single 6U CompactPCI slot bull Supports two 166 GHz Dual-Core Intel Xeon ULV processors using Intel E7520 server chipsetbull Up to 8 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull PMCXMC site support 66 MHz PCI-X and x8 PCI Express bull Front and rear IO bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade bull Four GbE ports with option for PICMG 216

RSC No 34761

6U CompactPCI Core 2 Duo SBCModel PP 41203x bull 6U CompactPCI Core 2 Duo SBC supporting two PMC sites includingone XMC site bull Up to 4 GB DDR2 ECC SDRAM bull All in a single system or peripheral slot bull TwoPMC sites supporting up to 100 MHz PCI-X bull One XMC x8 PCI Express bull Front and rear IObull Supports 216 GHz or 15 GHz Intel Core 2 Duo processors bull Intel E7520 server chipsetbull Up to 4 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade

RSC No 34763

PP 30202xTwo processor versions available bull 18 GHz Intel Pentium M processor 745 uses mFC-PGA 478 (micro Flip-Chip Pin Grid Array) package bull 14 GHz Intel Pentium M processor Low Voltage 738uses mFC-BGA 479 (micro Flip-Chip Ball Grid Array) package bull 64 KB primary (L1) on-die cache2 MB of secondary (L2) on-die cache bull 400 MHz Front Side Bus (FSB) bull No CPU fan bull 16 GHz processor version (1 MB L2 cache) available see PP 30002x datasheet bull Utilizes 64-bitIntel 855GME chipset bull Supports 400 MHz bus frequency bull Uses Intel 6300ESB IO Controller Hub

RSC No 32659

Concurrent Technologies Incwwwgocctcom

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PrOduCT GuIdE6U CompactPCI

cCIBPMC6U-ETA 6U bridged dual PMC carrier that bridges extended temperature CompactPCI boards and PMCs bull Features a rugged CompactPCI form factor providing increased flexibility to military communications systems designers bull Provides additional design choices to users through its differing bus speeds maximizing the numberof PMCs that can be used CompactPCI andPMC buses can both run at 66 or 33 MHzbull Operating temperature range of -40 degC to+85 degC bull Signal conditioning bull DMA supportbull Low-power design +5 V +33 V +12 V -12 V bull User-selectable VIO of 33 V or 5 V to the PMC

RSC No 32891

Dynamic Engineeringwwwdynengcom

cPCI4IP-MMMinimized PCI address footprint IndustryPack carrier for CompactPCI applications bull 6U 4HP4 IP positions 832 clock selection for each slot fused filtered power IO options bull ID INT IO and Mem spaces are decoded for each IP slotbull Single and double wide IPrsquos bull 16- and 32- bit IPs bull 32-bit access to 16-bit IPs bull Full or mini-mized Memory Space decoding for 18 the PCI address requirement bull With the cPCI4IP-MM option 8 CompactPCI 4IP cards take the same PCI address space as 1 full Mem Space card

RSC No 34905

ACQ132CPCI32 channel MHz class simultaneous sampling intelligent digitizer bull 32 simultaneous analoginput channels 2-32 MSpschannel 14-bit resolution bull Differential inputs bull Intelligent cardwith 1 gigabyte memory and GbE on board bull Large distributed FPGA resource on boardbull Range of DSP functions including FIR filtering and Digital Downconverter

RSC No 35482

D-TACQ Solutions Ltdwwwd-tacqcouk

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PrOduCT GuIdE6U CompactPCI

CR11Based on the Intel Core Duo Processor the platform is designed to support processor speeds from 106 GHz up to 20 GHz bull Intel Core 2 Duo runs at 15 GHz up to 20 GHz bull Conduction cooled bull Two PMC slots bull PCI Express bull 2x GbE

RSC No 33156

ICS-72532-channel 6U CompactPCI DAC board bull 6U CompactPCI data acquisition card bull 32 differential output channels bull 16 or 24-bit sample size bull 288 kHzch data rate bull Simultaneous sampling across all channels on single or multiple boards bull 32 separate delta-sigma DACs bull 64-bit 66 MHz CompactPCI PICMG 20 Rev30 hot-swappable bull FPDP II 400 MBps interface

RSC No 33576

ICS-71032-channel 6U CompactPCI ADC board bull 6U CompactPCI data acquisition card bull 32 differential input channels bull 216 KHzch 24-bit resolution bull Software selectable full scale input bull FPDP II 400 MBpsinterface bull 64-bit 66 MHz CompactPCI PICMG 20 Rev 30 hot swappable bull 32 synchronous boards for simultaneous sampling bull Sonar acoustics and test and measurement applications

RSC No 33578

Tsumani 6U CPCI Development KitFPGA processor solution targeted at high performance software defined radio applications bull Dual Stratix EP1S80 FPGAs are tightly coupled to provide apower platform for signal processing bull Two PMC module sites provide IO connectivity to either front panel or back panel connections bull A direct highbandwidth 1 GBps path from the PMC P4 connector directly to the FPGAs bull Model 919 Dual DAC Mezzanine provides broadband analog signal generationin a compact form bull The board features two independent DAC channels each with its own 12-bit LVDS input capable of running at rates up to 160 MHz

RSC No 32026

CP11Rugged 6U SBC bull Up to 4 GB of DDR2 SDRAM (200 MHz) with enhanced ECC four independent onboard PCI buses system host and peripheral modesupport for the CompactPCI backplane two PMC interfaces (64-bit133 MHz and 32-bit33 MHz) bull Instead of the PMC1 a PCI Express based XMC interface is available on request bull Two GbE one Fast Ethernet two serial interfaces (RS-232 or RS-422485) USB 20 integrated HDD or flash drive bull High performance 2D3D ATI video controller capable of driving two displays in parallel supports VGADVI interface bull Intel Core 2 Duo at 216 GHz Intel Core Duo at 20 GHz2x PMC expansion site bull One XMC optional bull Up to 4 GB DDR2 SDRAM wECC 2x GbE

RSC No 33447

GE Fanuc Intelligent Platforms Incwwwgefanucembeddedcom

Single Board ComputersGD Canada designs and manufactures conduction-cooled Single Board Computers (SBCs)using Intel processors bull 6U and 3U form factors for CompactPCI backplanes bull Fully backward compatible with earlier models bull Upgradeable via the change-out of processor memory andIO modules bull Used within GD Canada computer systems and sold as individual products

RSC No 35281

General Dynamicswwwgdcanadacom

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PrOduCT GuIdE6U CompactPCI

cPCI6U-24DSI32R32-channel 24-bit delta-sigma CompactPCI 6U analog input board with rear IO bull Low noise 24-bit resolution low phase distortion andmulti-board synchronization bull Suits state-of-the-art sonar and noise monitoring applications bull 32-channel cPCI6U-24DSI32 analog input boardprovides a high-density 24-bit analog input resources on a standard 6U CompactPCI expansion board bull Applications from precision voltagemeasurements to complex audio signal and waveform analysis

RSC No 34985

General Standards Corporationwwwgeneralstandardscom

Duet 3U 64-bit 1 GHz TMS320C6416 DSP (x2) 64 MB SDRAM per processor bull Flexible internalexternalcommunication mesh bull 64-bit66 MHz CompactPCI bull PMCXMC site with Jn4 to FPGA and4 RocketIO per VITA 42 bull External data port up to 12 Gbps bull 4M or 5M Virtex-II Pro FPGAbull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM dedicated800 MBps links between DSPs bull 3U CompactPCI with PXI support bull Suits high-end co-processing wireless broadband communications RADAR video and biometrics

RSC No 32856

QuadiaQuad-DSP bull Dual FPGA bull Dual PMC sites bull Inter-processor connectivity and access to external interfaces bull Four C6416 DSPs split in two independent clusters each hosting a PMC site bull One large FPGA for end-user code bull Central FPGA routing interprocessor communication bull End-user FPGA communication bull External port serial IO for PCIe or other p ivate link bull Global memoryand PCI interface bull 1 GHz TMS320C6416 DSP (x4) bull 64 MB SDRAM per processor bull Flexible internalexternal communication mesh bull 64-bit66 MHz CompactPCI bull Two PMC sites with Jn4 to FPGA bull External data port up to 12 Gbps bull Two 4M Gate FPGA reserved for end-user code bull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM bull Up to 512 MB Global DDR SDRAM bull Suits high-end co-processing wireless and broadband communications

RSC No 34737

Quixote 64-bit 6UAdvanced signal capture generation and co-processing bull 1 GHz TMS320C6416 DSP and2 to 6 MGATE Virtex-II FPGA bull 32 MB SDRAM 8 MB ZBT SBSRAM and AD6645 and AD9764 converters bull 6432 bit CompactPCI 66 MHz 5 V33 V and complex trigger modes with HW event logging bull PMC site with Jn4 to FPGA DIO and PICMG 217 StarFabric compliant bull Suits Software Defined Radio wireless IP and RADAR development and hardware testing bull Physical Layer field testing ultra-fast flexible data acquisition vector signal generation and electronic warfare

RSC No 32861

Innovative Integrationwwwinnovative-dspcom

IC-e6-cPCIbHigh performance 6U CompactPCI board bull Powered by one or two of Freescalersquos mostadvanced 14 GHz MPC7448 PowerPC processors bull PICMG 216 compliant bull Marvell Discovery III chipset (MV64460) bull Low power consumption bull Standard extended and rugged grades

RSC No 32982

Interface Conceptwwwinterfaceconceptcom

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PrOduCT GuIdE6U CompactPCI

CP213Single-width 6U CompactPCIPXI module with either 32 or 64 differential analog input channelsbull 32 64 or 128 channels of analog input bull 16 multifunction digital IO (TTL) channels that may beconfigured as digital in digital out or selectively attached to 2 frequency in 2 counter in andor 2 timerout channels bull 16-bit resolution bull Programmable gain per channel programmable scan rates of lt1 Ss through 100 KSs bull Precision onboard reference for end-to-end calibration

RSC No 34804

KineticSystems Company LLCwwwkscorpcom

CP6001Energy efficient embedded Intel dual core processors bull 12 GHz Intel Core Duo U2500 ULV processor bull Intel Core 2 Duo L7400 LV processor bull Based on the Intel Mobile 945GM chipset with a front side bus of up to 667 MHz and ICH7-R Southbridge bull Two independent digital video outputs to the rear IO (2x DVI - 1x DVI and 1x HDMI) bull AC97 audio capabilities bull 3 x GbE bull 4 x SATA with RAID 01510 functionality bull 6 x USB 20 2 x COM and VGA or DVI bull Can also accommodate a PMC slot or an onboard 25 inch SATA HDD bull Up to 8 GB of USB or 2 GB soldered flash bull Supports Linux Windows XP XP embedded and VxWorks 6

RSC No 34182

CP6923 GbE Switch6U CompactPCI GbE Switch PICMG 216 compliant bull Leading edge te hnology basedon BCM5650X chip bull 24x GbE ports bull Non-blocking Layer 2 and 3 switching and routingbull Copper optical rear IO version bull Hot swap IPMI bull Fully managed bull Comprehensive firmware package bull Applies to VoIP installations such as call servers media gatewaysand trunking gateways in wireline and wireless networks as well as VoIP systems inenterprise networks with high demands on performance

RSC No 32256

Kontronwwwkontroncom

TMS320C6701 Virtex-IITexas Instrumentsrsquo C6701 DSP bull Xilinx Virtex-II series FPGA up to XC2V8000 bull Multiple IO interfaces Onboard CODEC VIM expansion sites 60-pin GPIO header and JTAG bull Hardware drivers integration in SimulinkXilinx System Generator Blocksets for quick implementation of Simulink models bull DSP and FPGA-in-the-loop cosimulation of SimulinkXilinx System Generator models bull Leading edge communication interface allowing real-time datamonitoring from Simulink scopes and remote operations

RSC No 32028

VHS-DACHigh performance multichannel DA for phased array antenna systems radarsonar communications receiversup-sampling to IF stage and RFIF AGC apps bull Eight 125 MSPS output channels bull Optional add-on daughter boardprovides 8 additional output channels or 8 additional input channels bull 32-bit 25 MHz bull FPDP interface with 400 MBps transfer rate (25 MSPS per channel at 8 channels 125 MSPS at 16 channels) bull Low level hardware drivers API andGUI bull High level hardware drivers integration in Simulink Blocksets bull Leading edge communication interface fordata recording and playback tofrom the onboard SDRAM

RSC No 32029

Lyrtechwwwlyrtechcom

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PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

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PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

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PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

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PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

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PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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Page 28: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

Physical realizationThe layout process was performed using the Mentor Board-Station CAD system Quad-routing (routing four traces between pads) was explored as a routing method-ology in order to reduce Layer count but this was dismissed due to the detrimental impact on crosstalk performance

The attributes of the physical backplanes produced as a result of the design effort are shown in Table 4

The design files produced included the usual gerber files plus detailed back-drilling instructions

The design validation process comprised a conventional continuity test followed by performance testing featuring Agilent equipment including 70340A signal generator 8720ES Network Analyzer NN18A S-Parameter test-set and 86100A sampling oscilloscope with Agilent 86112A module Figure 7 (next page) shows the test set up

Simclar developed special line cards to enable through-Channel measurements with and without crosstalk The signal launch featured compression mount SMAs terminated in a tuned via structure The Channel simulations included simu-lation of the tuned launch structures so de-embedding of the launches was not necessary for correlation to simulation purposes The development team also established a process for characterization of all Channels

Full Mesh Dual Star

Layer Count 34 18

Aspect Ratio 121 61

Tuned Vias 3952 768

Material Nelco 4000-13SI

Table 4

Figure 5 Figure 6

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In Figure 8 measured through-Channel performance and ICR curves are shown for the same Channels described in the simula-tion section earlier

As can be seen from Figure 8 there is close correlation between these and the simulated plots in Figures 5 and 6 In fact close correlation between all simulated and measured results was achieved resulting in a 728 Tbps capacity full mesh and a 960 Gbps capacity dual star backplane design now generally available as part of the Simclar TurboFabric shelf

Figure 7 Figure 8

Figure 9

Figure 10

Implications of 10GBASE-KR Draft 33versus Draft 25The work described above was targeted towards meeting the Channels specifications contained in Draft 25 of the IEEE 10GBASE-KR Since this work was completed the IEEE has up-issued the Draft revision level for the Standard from 25 to 33 While this has not impacted through-Channel performance demands it has increased Channel isolation requirements by around 10 dB In Figure 9 a Draft 33 mask is added to the ICR plot shown in Figure 8

From Figure 9 it can be seen how Draft 33 pulls the mask above the Channel ICR curve for this full mesh backplane Channel Surprisingly it is the Channelrsquos frequency response at relatively low frequencies between 100-500 MHz that is causing a problem The reasons for this are currently the subject of further detailed investigation

However Figure 10 shows a Draft 33 plot for a less demanding dual star AdvancedTCA implementation featuring shorter trans-mission distances This plot demonstrates compliance to Draft 33 of the IEEE 8023ap 10GBASE-KR Standard

ConclusionBy developing a close understanding of the many factors contrib-uting to loss and noise in multi-gigabit backplane Channels it is possible to characterize their performance using advanced simula-tion techniques and correlate that performance in physical prod-ucts using advanced test methods By overlaying the test results on S-Parameter masks defined by the IEEE 8023ap 10GBASE-KR Standard it has been demonstrated that backplanes that truly enable AdvancedTCA scalability are at last a reality

Douglas Hynd joined Simclar Group in 2006 as Director of Marketing as part of Simclarrsquos acquisition of Northrop Grumman Interconnect Technologies Division wherehe was Vice President of Marketing and Sales He has more than 24 yearsrsquo experience intechnology sales marketing and generalmanagement and holds a BSc (Eng) in Electronics and Electrical Engineeringfrom the University of Glasgow He isbased at Simclarrsquos Global HQ inDunfermline Scotland

Simclar Groupdouglashyndsimclarcom bull wwwsimclarcom

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6U CompactPCIPrOduCT GuIdE g

This monthrsquos issue includes a 6U CompactPCI Product Guide and Irsquod like to take the opportunity to reflect a bit on the success and evolution of that technology

Back in the 1994 time frame when CompactPCI was first being devel-oped it began as 3U-only technology It used the same Eurocardmechanics that were popularized by VME and an IEC standardized high-

density high-speed connector available from a number of vendors suitablefor 33 MHz PCI signaling That connector was selected by the engineers atZiatech with help from Mike Munroe then at ERNI The majority of VMEdesigns were 6U and based on this I was among a number of folks thatargued for adding the 6U CompactPCI form factor

The 6U form factor presented some challenges and opportunities Onechallenge was that the insertion and extraction forces were quite high when the entire rear of the card was populated with connectors Fortunately the IEEE standards for Eurocards evolved and injectorejector handles that pro-vided leverage became available Eike Waltz then at Rittal was instrumental in bringing that to the table Two of the opportunities that came along withthe extra connectors were a clean way to add secondary buses like the H110 telephony bus to the backplane and the ability to route IO out the rear through rear transition modules PICMG has developed quite a number of subsidiary specifications defining the interoperable use of the extra backplane pins made possible with the 6U form factor Both of these features have played a major part in CompactPCIrsquos success The next major evolution of 6U CompactPCI came with the PICMG 216 Packet Switched Backplane standard which was originally conceived by John Peters and his team at Performance Technologies PICMG 216 interconnected a shelf full of CompactPCI single board computers via redundant Ethernet switches also in the 6U CompactPCI form factor This dramatically increased usable backplane bandwidth and provided redundancy PICMG 216 paved the way for AdvancedTCA and was the industryrsquos first open standard for the switched serial interconnect standards we see popping up in many places

By Joe Pavlat

Looking back and ahead at6U CompactPCI

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PrOduCT GuIdE6U CompactPCI

Recent 6U CompactPCI related products are listed here For more informationenter the productrsquos RSC No at wwwcompactpci-systemscomrsc

cPCI-6910Dual-core Intel Xeon Processor LVULV Universal blade bull Supports Single Dual-Core Intel Xeon LV or ULV processorsbull Front Side Bus 667 MHz bull Up to 2 GB DDR2 400 MHz soldered SDRAM with ECC bull Four PCI Express GbEbull Up to 4 USB 20 ports bull PICMG 20 21 29 216 compliant

RSC No 35013

ADLINK Technologywwwadlinktechcom

CPCIStor Module6U CompactPCI storage blade bull Onboard ATA controller supports CDDVD HDD and solid-state flashbull Supports Hot Swap Removal (ask about RAID support) bull ATA disks available in Enhanced Dutycycle versions for NEBS Level 3 - 724 requirements bull Operating Systems supported VxWorksLinux and Windows

RSC No 34800

ACTTechnicowwwacttechnicocom

Prosody X cPCI E1T1An E1T1 digital network access card bull Suits telco developers and systems integrators bull Uses Aculabrsquos worldwide protocol coverage including Aculabrsquos SS7 stack available under a cost free license bull Available with 8 or 16 E1T1 trunks and software selectable E1T1 interfaces bull Flexible mix of protocols including ISDN CAS and SS7 (ITU-T China and ANSI) bull A variety of interconnect switching and protocol conversion solutions can be readily crafted bull High availability reliability and scalability with industry standard hardw re and software interoperability bull Up to 128 SS7 signaling links bull Non-circuit related (TCAP) messagingintensive applications such as prepaid and SMS

RSC No 35408

Aculabwwwaculabcom

Adexp8021Intel Core Duo L2400 (166 GHz) w E7520 server chipset bull Dual channel PC2-3200 Registered RAM SECDED or x4 SDDC bull Two GbE two Serial ATA four USB 20 bull Onboard SXGA graphics 1280 x 24-bitbull 6U CompactPCI Bus PICMG EXP0 R10 Specification bull RoHS compliant 0 degC to +55 degC operating range

RSC No 32837

Advanet Incwwwadvanetcojpen

TC84012 channel single-stop Time-to-Digital Converter (TDC) with single-start and multi-start acquisition modes bull 50 ps timing resolution bull Wide range with upto 20 s between first and last events bull Large internal memory buffer with up to 512 hits per channel bull Low jitter (lt3 ps rms) high stability (plusmn2 ppm) internalclock source bull External 10 MHz reference input bull FPGA based Data Processing Unit (DPU) bull Fast readout with DMA mode for increased data throughputbull Overvoltage-protected inputs with 50 Ω K-Lock (LEMO) connectors bull Built-in self calibration bull Modular single-slot 6U PXICompactPCI standardbull Low power consumption (lt22 W)

RSC No 33445

Agilent-Acqiriswwwacqiriscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

MIC-30428-slot 6U CompactPCI backplane bull AC or DC CompactPCI 500 W + 250 W redundant(2+1) power supplies bull PICMG 216 (CompactPCI Packet Switching Backplane) compliancebull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarmmodule (MIC-3924L-AE)

RSC No 32851

MIC-30436-slot 6U CompactPCI backplane bull Supports two hot-swappable SCSISATA or removableIDE HDD bays bull Built-in IDE slim-type DVD-ROM bull AC or DC CompactPCI 250 W + 250 Wredundant (1+1) power supplies bull Supports hot-swappable fan modules bull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarm module (MIC-3924L-AE)

RSC No 32850

Advantech Corporationwwwadvantechcom

Dual-Core Xeon CompactPCI SBCModel PP 42123x bull Dual CPU 6U CompactPCI SBC supporting two dual-core Xeon CPUs bull Up to 8 GB DDR2 ECC SDRAM in a single system or peripheralslot bull Dual processor SBC in a single 6U CompactPCI slot bull Supports two 166 GHz Dual-Core Intel Xeon ULV processors using Intel E7520 server chipsetbull Up to 8 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull PMCXMC site support 66 MHz PCI-X and x8 PCI Express bull Front and rear IO bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade bull Four GbE ports with option for PICMG 216

RSC No 34761

6U CompactPCI Core 2 Duo SBCModel PP 41203x bull 6U CompactPCI Core 2 Duo SBC supporting two PMC sites includingone XMC site bull Up to 4 GB DDR2 ECC SDRAM bull All in a single system or peripheral slot bull TwoPMC sites supporting up to 100 MHz PCI-X bull One XMC x8 PCI Express bull Front and rear IObull Supports 216 GHz or 15 GHz Intel Core 2 Duo processors bull Intel E7520 server chipsetbull Up to 4 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade

RSC No 34763

PP 30202xTwo processor versions available bull 18 GHz Intel Pentium M processor 745 uses mFC-PGA 478 (micro Flip-Chip Pin Grid Array) package bull 14 GHz Intel Pentium M processor Low Voltage 738uses mFC-BGA 479 (micro Flip-Chip Ball Grid Array) package bull 64 KB primary (L1) on-die cache2 MB of secondary (L2) on-die cache bull 400 MHz Front Side Bus (FSB) bull No CPU fan bull 16 GHz processor version (1 MB L2 cache) available see PP 30002x datasheet bull Utilizes 64-bitIntel 855GME chipset bull Supports 400 MHz bus frequency bull Uses Intel 6300ESB IO Controller Hub

RSC No 32659

Concurrent Technologies Incwwwgocctcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cCIBPMC6U-ETA 6U bridged dual PMC carrier that bridges extended temperature CompactPCI boards and PMCs bull Features a rugged CompactPCI form factor providing increased flexibility to military communications systems designers bull Provides additional design choices to users through its differing bus speeds maximizing the numberof PMCs that can be used CompactPCI andPMC buses can both run at 66 or 33 MHzbull Operating temperature range of -40 degC to+85 degC bull Signal conditioning bull DMA supportbull Low-power design +5 V +33 V +12 V -12 V bull User-selectable VIO of 33 V or 5 V to the PMC

RSC No 32891

Dynamic Engineeringwwwdynengcom

cPCI4IP-MMMinimized PCI address footprint IndustryPack carrier for CompactPCI applications bull 6U 4HP4 IP positions 832 clock selection for each slot fused filtered power IO options bull ID INT IO and Mem spaces are decoded for each IP slotbull Single and double wide IPrsquos bull 16- and 32- bit IPs bull 32-bit access to 16-bit IPs bull Full or mini-mized Memory Space decoding for 18 the PCI address requirement bull With the cPCI4IP-MM option 8 CompactPCI 4IP cards take the same PCI address space as 1 full Mem Space card

RSC No 34905

ACQ132CPCI32 channel MHz class simultaneous sampling intelligent digitizer bull 32 simultaneous analoginput channels 2-32 MSpschannel 14-bit resolution bull Differential inputs bull Intelligent cardwith 1 gigabyte memory and GbE on board bull Large distributed FPGA resource on boardbull Range of DSP functions including FIR filtering and Digital Downconverter

RSC No 35482

D-TACQ Solutions Ltdwwwd-tacqcouk

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CR11Based on the Intel Core Duo Processor the platform is designed to support processor speeds from 106 GHz up to 20 GHz bull Intel Core 2 Duo runs at 15 GHz up to 20 GHz bull Conduction cooled bull Two PMC slots bull PCI Express bull 2x GbE

RSC No 33156

ICS-72532-channel 6U CompactPCI DAC board bull 6U CompactPCI data acquisition card bull 32 differential output channels bull 16 or 24-bit sample size bull 288 kHzch data rate bull Simultaneous sampling across all channels on single or multiple boards bull 32 separate delta-sigma DACs bull 64-bit 66 MHz CompactPCI PICMG 20 Rev30 hot-swappable bull FPDP II 400 MBps interface

RSC No 33576

ICS-71032-channel 6U CompactPCI ADC board bull 6U CompactPCI data acquisition card bull 32 differential input channels bull 216 KHzch 24-bit resolution bull Software selectable full scale input bull FPDP II 400 MBpsinterface bull 64-bit 66 MHz CompactPCI PICMG 20 Rev 30 hot swappable bull 32 synchronous boards for simultaneous sampling bull Sonar acoustics and test and measurement applications

RSC No 33578

Tsumani 6U CPCI Development KitFPGA processor solution targeted at high performance software defined radio applications bull Dual Stratix EP1S80 FPGAs are tightly coupled to provide apower platform for signal processing bull Two PMC module sites provide IO connectivity to either front panel or back panel connections bull A direct highbandwidth 1 GBps path from the PMC P4 connector directly to the FPGAs bull Model 919 Dual DAC Mezzanine provides broadband analog signal generationin a compact form bull The board features two independent DAC channels each with its own 12-bit LVDS input capable of running at rates up to 160 MHz

RSC No 32026

CP11Rugged 6U SBC bull Up to 4 GB of DDR2 SDRAM (200 MHz) with enhanced ECC four independent onboard PCI buses system host and peripheral modesupport for the CompactPCI backplane two PMC interfaces (64-bit133 MHz and 32-bit33 MHz) bull Instead of the PMC1 a PCI Express based XMC interface is available on request bull Two GbE one Fast Ethernet two serial interfaces (RS-232 or RS-422485) USB 20 integrated HDD or flash drive bull High performance 2D3D ATI video controller capable of driving two displays in parallel supports VGADVI interface bull Intel Core 2 Duo at 216 GHz Intel Core Duo at 20 GHz2x PMC expansion site bull One XMC optional bull Up to 4 GB DDR2 SDRAM wECC 2x GbE

RSC No 33447

GE Fanuc Intelligent Platforms Incwwwgefanucembeddedcom

Single Board ComputersGD Canada designs and manufactures conduction-cooled Single Board Computers (SBCs)using Intel processors bull 6U and 3U form factors for CompactPCI backplanes bull Fully backward compatible with earlier models bull Upgradeable via the change-out of processor memory andIO modules bull Used within GD Canada computer systems and sold as individual products

RSC No 35281

General Dynamicswwwgdcanadacom

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PrOduCT GuIdE6U CompactPCI

cPCI6U-24DSI32R32-channel 24-bit delta-sigma CompactPCI 6U analog input board with rear IO bull Low noise 24-bit resolution low phase distortion andmulti-board synchronization bull Suits state-of-the-art sonar and noise monitoring applications bull 32-channel cPCI6U-24DSI32 analog input boardprovides a high-density 24-bit analog input resources on a standard 6U CompactPCI expansion board bull Applications from precision voltagemeasurements to complex audio signal and waveform analysis

RSC No 34985

General Standards Corporationwwwgeneralstandardscom

Duet 3U 64-bit 1 GHz TMS320C6416 DSP (x2) 64 MB SDRAM per processor bull Flexible internalexternalcommunication mesh bull 64-bit66 MHz CompactPCI bull PMCXMC site with Jn4 to FPGA and4 RocketIO per VITA 42 bull External data port up to 12 Gbps bull 4M or 5M Virtex-II Pro FPGAbull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM dedicated800 MBps links between DSPs bull 3U CompactPCI with PXI support bull Suits high-end co-processing wireless broadband communications RADAR video and biometrics

RSC No 32856

QuadiaQuad-DSP bull Dual FPGA bull Dual PMC sites bull Inter-processor connectivity and access to external interfaces bull Four C6416 DSPs split in two independent clusters each hosting a PMC site bull One large FPGA for end-user code bull Central FPGA routing interprocessor communication bull End-user FPGA communication bull External port serial IO for PCIe or other p ivate link bull Global memoryand PCI interface bull 1 GHz TMS320C6416 DSP (x4) bull 64 MB SDRAM per processor bull Flexible internalexternal communication mesh bull 64-bit66 MHz CompactPCI bull Two PMC sites with Jn4 to FPGA bull External data port up to 12 Gbps bull Two 4M Gate FPGA reserved for end-user code bull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM bull Up to 512 MB Global DDR SDRAM bull Suits high-end co-processing wireless and broadband communications

RSC No 34737

Quixote 64-bit 6UAdvanced signal capture generation and co-processing bull 1 GHz TMS320C6416 DSP and2 to 6 MGATE Virtex-II FPGA bull 32 MB SDRAM 8 MB ZBT SBSRAM and AD6645 and AD9764 converters bull 6432 bit CompactPCI 66 MHz 5 V33 V and complex trigger modes with HW event logging bull PMC site with Jn4 to FPGA DIO and PICMG 217 StarFabric compliant bull Suits Software Defined Radio wireless IP and RADAR development and hardware testing bull Physical Layer field testing ultra-fast flexible data acquisition vector signal generation and electronic warfare

RSC No 32861

Innovative Integrationwwwinnovative-dspcom

IC-e6-cPCIbHigh performance 6U CompactPCI board bull Powered by one or two of Freescalersquos mostadvanced 14 GHz MPC7448 PowerPC processors bull PICMG 216 compliant bull Marvell Discovery III chipset (MV64460) bull Low power consumption bull Standard extended and rugged grades

RSC No 32982

Interface Conceptwwwinterfaceconceptcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CP213Single-width 6U CompactPCIPXI module with either 32 or 64 differential analog input channelsbull 32 64 or 128 channels of analog input bull 16 multifunction digital IO (TTL) channels that may beconfigured as digital in digital out or selectively attached to 2 frequency in 2 counter in andor 2 timerout channels bull 16-bit resolution bull Programmable gain per channel programmable scan rates of lt1 Ss through 100 KSs bull Precision onboard reference for end-to-end calibration

RSC No 34804

KineticSystems Company LLCwwwkscorpcom

CP6001Energy efficient embedded Intel dual core processors bull 12 GHz Intel Core Duo U2500 ULV processor bull Intel Core 2 Duo L7400 LV processor bull Based on the Intel Mobile 945GM chipset with a front side bus of up to 667 MHz and ICH7-R Southbridge bull Two independent digital video outputs to the rear IO (2x DVI - 1x DVI and 1x HDMI) bull AC97 audio capabilities bull 3 x GbE bull 4 x SATA with RAID 01510 functionality bull 6 x USB 20 2 x COM and VGA or DVI bull Can also accommodate a PMC slot or an onboard 25 inch SATA HDD bull Up to 8 GB of USB or 2 GB soldered flash bull Supports Linux Windows XP XP embedded and VxWorks 6

RSC No 34182

CP6923 GbE Switch6U CompactPCI GbE Switch PICMG 216 compliant bull Leading edge te hnology basedon BCM5650X chip bull 24x GbE ports bull Non-blocking Layer 2 and 3 switching and routingbull Copper optical rear IO version bull Hot swap IPMI bull Fully managed bull Comprehensive firmware package bull Applies to VoIP installations such as call servers media gatewaysand trunking gateways in wireline and wireless networks as well as VoIP systems inenterprise networks with high demands on performance

RSC No 32256

Kontronwwwkontroncom

TMS320C6701 Virtex-IITexas Instrumentsrsquo C6701 DSP bull Xilinx Virtex-II series FPGA up to XC2V8000 bull Multiple IO interfaces Onboard CODEC VIM expansion sites 60-pin GPIO header and JTAG bull Hardware drivers integration in SimulinkXilinx System Generator Blocksets for quick implementation of Simulink models bull DSP and FPGA-in-the-loop cosimulation of SimulinkXilinx System Generator models bull Leading edge communication interface allowing real-time datamonitoring from Simulink scopes and remote operations

RSC No 32028

VHS-DACHigh performance multichannel DA for phased array antenna systems radarsonar communications receiversup-sampling to IF stage and RFIF AGC apps bull Eight 125 MSPS output channels bull Optional add-on daughter boardprovides 8 additional output channels or 8 additional input channels bull 32-bit 25 MHz bull FPDP interface with 400 MBps transfer rate (25 MSPS per channel at 8 channels 125 MSPS at 16 channels) bull Low level hardware drivers API andGUI bull High level hardware drivers integration in Simulink Blocksets bull Leading edge communication interface fordata recording and playback tofrom the onboard SDRAM

RSC No 32029

Lyrtechwwwlyrtechcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

Fo Sin Pnt

Fo Sin Pnt

wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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Page 29: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

In Figure 8 measured through-Channel performance and ICR curves are shown for the same Channels described in the simula-tion section earlier

As can be seen from Figure 8 there is close correlation between these and the simulated plots in Figures 5 and 6 In fact close correlation between all simulated and measured results was achieved resulting in a 728 Tbps capacity full mesh and a 960 Gbps capacity dual star backplane design now generally available as part of the Simclar TurboFabric shelf

Figure 7 Figure 8

Figure 9

Figure 10

Implications of 10GBASE-KR Draft 33versus Draft 25The work described above was targeted towards meeting the Channels specifications contained in Draft 25 of the IEEE 10GBASE-KR Since this work was completed the IEEE has up-issued the Draft revision level for the Standard from 25 to 33 While this has not impacted through-Channel performance demands it has increased Channel isolation requirements by around 10 dB In Figure 9 a Draft 33 mask is added to the ICR plot shown in Figure 8

From Figure 9 it can be seen how Draft 33 pulls the mask above the Channel ICR curve for this full mesh backplane Channel Surprisingly it is the Channelrsquos frequency response at relatively low frequencies between 100-500 MHz that is causing a problem The reasons for this are currently the subject of further detailed investigation

However Figure 10 shows a Draft 33 plot for a less demanding dual star AdvancedTCA implementation featuring shorter trans-mission distances This plot demonstrates compliance to Draft 33 of the IEEE 8023ap 10GBASE-KR Standard

ConclusionBy developing a close understanding of the many factors contrib-uting to loss and noise in multi-gigabit backplane Channels it is possible to characterize their performance using advanced simula-tion techniques and correlate that performance in physical prod-ucts using advanced test methods By overlaying the test results on S-Parameter masks defined by the IEEE 8023ap 10GBASE-KR Standard it has been demonstrated that backplanes that truly enable AdvancedTCA scalability are at last a reality

Douglas Hynd joined Simclar Group in 2006 as Director of Marketing as part of Simclarrsquos acquisition of Northrop Grumman Interconnect Technologies Division wherehe was Vice President of Marketing and Sales He has more than 24 yearsrsquo experience intechnology sales marketing and generalmanagement and holds a BSc (Eng) in Electronics and Electrical Engineeringfrom the University of Glasgow He isbased at Simclarrsquos Global HQ inDunfermline Scotland

Simclar Groupdouglashyndsimclarcom bull wwwsimclarcom

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6U CompactPCIPrOduCT GuIdE g

This monthrsquos issue includes a 6U CompactPCI Product Guide and Irsquod like to take the opportunity to reflect a bit on the success and evolution of that technology

Back in the 1994 time frame when CompactPCI was first being devel-oped it began as 3U-only technology It used the same Eurocardmechanics that were popularized by VME and an IEC standardized high-

density high-speed connector available from a number of vendors suitablefor 33 MHz PCI signaling That connector was selected by the engineers atZiatech with help from Mike Munroe then at ERNI The majority of VMEdesigns were 6U and based on this I was among a number of folks thatargued for adding the 6U CompactPCI form factor

The 6U form factor presented some challenges and opportunities Onechallenge was that the insertion and extraction forces were quite high when the entire rear of the card was populated with connectors Fortunately the IEEE standards for Eurocards evolved and injectorejector handles that pro-vided leverage became available Eike Waltz then at Rittal was instrumental in bringing that to the table Two of the opportunities that came along withthe extra connectors were a clean way to add secondary buses like the H110 telephony bus to the backplane and the ability to route IO out the rear through rear transition modules PICMG has developed quite a number of subsidiary specifications defining the interoperable use of the extra backplane pins made possible with the 6U form factor Both of these features have played a major part in CompactPCIrsquos success The next major evolution of 6U CompactPCI came with the PICMG 216 Packet Switched Backplane standard which was originally conceived by John Peters and his team at Performance Technologies PICMG 216 interconnected a shelf full of CompactPCI single board computers via redundant Ethernet switches also in the 6U CompactPCI form factor This dramatically increased usable backplane bandwidth and provided redundancy PICMG 216 paved the way for AdvancedTCA and was the industryrsquos first open standard for the switched serial interconnect standards we see popping up in many places

By Joe Pavlat

Looking back and ahead at6U CompactPCI

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Recent 6U CompactPCI related products are listed here For more informationenter the productrsquos RSC No at wwwcompactpci-systemscomrsc

cPCI-6910Dual-core Intel Xeon Processor LVULV Universal blade bull Supports Single Dual-Core Intel Xeon LV or ULV processorsbull Front Side Bus 667 MHz bull Up to 2 GB DDR2 400 MHz soldered SDRAM with ECC bull Four PCI Express GbEbull Up to 4 USB 20 ports bull PICMG 20 21 29 216 compliant

RSC No 35013

ADLINK Technologywwwadlinktechcom

CPCIStor Module6U CompactPCI storage blade bull Onboard ATA controller supports CDDVD HDD and solid-state flashbull Supports Hot Swap Removal (ask about RAID support) bull ATA disks available in Enhanced Dutycycle versions for NEBS Level 3 - 724 requirements bull Operating Systems supported VxWorksLinux and Windows

RSC No 34800

ACTTechnicowwwacttechnicocom

Prosody X cPCI E1T1An E1T1 digital network access card bull Suits telco developers and systems integrators bull Uses Aculabrsquos worldwide protocol coverage including Aculabrsquos SS7 stack available under a cost free license bull Available with 8 or 16 E1T1 trunks and software selectable E1T1 interfaces bull Flexible mix of protocols including ISDN CAS and SS7 (ITU-T China and ANSI) bull A variety of interconnect switching and protocol conversion solutions can be readily crafted bull High availability reliability and scalability with industry standard hardw re and software interoperability bull Up to 128 SS7 signaling links bull Non-circuit related (TCAP) messagingintensive applications such as prepaid and SMS

RSC No 35408

Aculabwwwaculabcom

Adexp8021Intel Core Duo L2400 (166 GHz) w E7520 server chipset bull Dual channel PC2-3200 Registered RAM SECDED or x4 SDDC bull Two GbE two Serial ATA four USB 20 bull Onboard SXGA graphics 1280 x 24-bitbull 6U CompactPCI Bus PICMG EXP0 R10 Specification bull RoHS compliant 0 degC to +55 degC operating range

RSC No 32837

Advanet Incwwwadvanetcojpen

TC84012 channel single-stop Time-to-Digital Converter (TDC) with single-start and multi-start acquisition modes bull 50 ps timing resolution bull Wide range with upto 20 s between first and last events bull Large internal memory buffer with up to 512 hits per channel bull Low jitter (lt3 ps rms) high stability (plusmn2 ppm) internalclock source bull External 10 MHz reference input bull FPGA based Data Processing Unit (DPU) bull Fast readout with DMA mode for increased data throughputbull Overvoltage-protected inputs with 50 Ω K-Lock (LEMO) connectors bull Built-in self calibration bull Modular single-slot 6U PXICompactPCI standardbull Low power consumption (lt22 W)

RSC No 33445

Agilent-Acqiriswwwacqiriscom

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PrOduCT GuIdE6U CompactPCI

MIC-30428-slot 6U CompactPCI backplane bull AC or DC CompactPCI 500 W + 250 W redundant(2+1) power supplies bull PICMG 216 (CompactPCI Packet Switching Backplane) compliancebull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarmmodule (MIC-3924L-AE)

RSC No 32851

MIC-30436-slot 6U CompactPCI backplane bull Supports two hot-swappable SCSISATA or removableIDE HDD bays bull Built-in IDE slim-type DVD-ROM bull AC or DC CompactPCI 250 W + 250 Wredundant (1+1) power supplies bull Supports hot-swappable fan modules bull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarm module (MIC-3924L-AE)

RSC No 32850

Advantech Corporationwwwadvantechcom

Dual-Core Xeon CompactPCI SBCModel PP 42123x bull Dual CPU 6U CompactPCI SBC supporting two dual-core Xeon CPUs bull Up to 8 GB DDR2 ECC SDRAM in a single system or peripheralslot bull Dual processor SBC in a single 6U CompactPCI slot bull Supports two 166 GHz Dual-Core Intel Xeon ULV processors using Intel E7520 server chipsetbull Up to 8 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull PMCXMC site support 66 MHz PCI-X and x8 PCI Express bull Front and rear IO bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade bull Four GbE ports with option for PICMG 216

RSC No 34761

6U CompactPCI Core 2 Duo SBCModel PP 41203x bull 6U CompactPCI Core 2 Duo SBC supporting two PMC sites includingone XMC site bull Up to 4 GB DDR2 ECC SDRAM bull All in a single system or peripheral slot bull TwoPMC sites supporting up to 100 MHz PCI-X bull One XMC x8 PCI Express bull Front and rear IObull Supports 216 GHz or 15 GHz Intel Core 2 Duo processors bull Intel E7520 server chipsetbull Up to 4 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade

RSC No 34763

PP 30202xTwo processor versions available bull 18 GHz Intel Pentium M processor 745 uses mFC-PGA 478 (micro Flip-Chip Pin Grid Array) package bull 14 GHz Intel Pentium M processor Low Voltage 738uses mFC-BGA 479 (micro Flip-Chip Ball Grid Array) package bull 64 KB primary (L1) on-die cache2 MB of secondary (L2) on-die cache bull 400 MHz Front Side Bus (FSB) bull No CPU fan bull 16 GHz processor version (1 MB L2 cache) available see PP 30002x datasheet bull Utilizes 64-bitIntel 855GME chipset bull Supports 400 MHz bus frequency bull Uses Intel 6300ESB IO Controller Hub

RSC No 32659

Concurrent Technologies Incwwwgocctcom

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PrOduCT GuIdE6U CompactPCI

cCIBPMC6U-ETA 6U bridged dual PMC carrier that bridges extended temperature CompactPCI boards and PMCs bull Features a rugged CompactPCI form factor providing increased flexibility to military communications systems designers bull Provides additional design choices to users through its differing bus speeds maximizing the numberof PMCs that can be used CompactPCI andPMC buses can both run at 66 or 33 MHzbull Operating temperature range of -40 degC to+85 degC bull Signal conditioning bull DMA supportbull Low-power design +5 V +33 V +12 V -12 V bull User-selectable VIO of 33 V or 5 V to the PMC

RSC No 32891

Dynamic Engineeringwwwdynengcom

cPCI4IP-MMMinimized PCI address footprint IndustryPack carrier for CompactPCI applications bull 6U 4HP4 IP positions 832 clock selection for each slot fused filtered power IO options bull ID INT IO and Mem spaces are decoded for each IP slotbull Single and double wide IPrsquos bull 16- and 32- bit IPs bull 32-bit access to 16-bit IPs bull Full or mini-mized Memory Space decoding for 18 the PCI address requirement bull With the cPCI4IP-MM option 8 CompactPCI 4IP cards take the same PCI address space as 1 full Mem Space card

RSC No 34905

ACQ132CPCI32 channel MHz class simultaneous sampling intelligent digitizer bull 32 simultaneous analoginput channels 2-32 MSpschannel 14-bit resolution bull Differential inputs bull Intelligent cardwith 1 gigabyte memory and GbE on board bull Large distributed FPGA resource on boardbull Range of DSP functions including FIR filtering and Digital Downconverter

RSC No 35482

D-TACQ Solutions Ltdwwwd-tacqcouk

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PrOduCT GuIdE6U CompactPCI

CR11Based on the Intel Core Duo Processor the platform is designed to support processor speeds from 106 GHz up to 20 GHz bull Intel Core 2 Duo runs at 15 GHz up to 20 GHz bull Conduction cooled bull Two PMC slots bull PCI Express bull 2x GbE

RSC No 33156

ICS-72532-channel 6U CompactPCI DAC board bull 6U CompactPCI data acquisition card bull 32 differential output channels bull 16 or 24-bit sample size bull 288 kHzch data rate bull Simultaneous sampling across all channels on single or multiple boards bull 32 separate delta-sigma DACs bull 64-bit 66 MHz CompactPCI PICMG 20 Rev30 hot-swappable bull FPDP II 400 MBps interface

RSC No 33576

ICS-71032-channel 6U CompactPCI ADC board bull 6U CompactPCI data acquisition card bull 32 differential input channels bull 216 KHzch 24-bit resolution bull Software selectable full scale input bull FPDP II 400 MBpsinterface bull 64-bit 66 MHz CompactPCI PICMG 20 Rev 30 hot swappable bull 32 synchronous boards for simultaneous sampling bull Sonar acoustics and test and measurement applications

RSC No 33578

Tsumani 6U CPCI Development KitFPGA processor solution targeted at high performance software defined radio applications bull Dual Stratix EP1S80 FPGAs are tightly coupled to provide apower platform for signal processing bull Two PMC module sites provide IO connectivity to either front panel or back panel connections bull A direct highbandwidth 1 GBps path from the PMC P4 connector directly to the FPGAs bull Model 919 Dual DAC Mezzanine provides broadband analog signal generationin a compact form bull The board features two independent DAC channels each with its own 12-bit LVDS input capable of running at rates up to 160 MHz

RSC No 32026

CP11Rugged 6U SBC bull Up to 4 GB of DDR2 SDRAM (200 MHz) with enhanced ECC four independent onboard PCI buses system host and peripheral modesupport for the CompactPCI backplane two PMC interfaces (64-bit133 MHz and 32-bit33 MHz) bull Instead of the PMC1 a PCI Express based XMC interface is available on request bull Two GbE one Fast Ethernet two serial interfaces (RS-232 or RS-422485) USB 20 integrated HDD or flash drive bull High performance 2D3D ATI video controller capable of driving two displays in parallel supports VGADVI interface bull Intel Core 2 Duo at 216 GHz Intel Core Duo at 20 GHz2x PMC expansion site bull One XMC optional bull Up to 4 GB DDR2 SDRAM wECC 2x GbE

RSC No 33447

GE Fanuc Intelligent Platforms Incwwwgefanucembeddedcom

Single Board ComputersGD Canada designs and manufactures conduction-cooled Single Board Computers (SBCs)using Intel processors bull 6U and 3U form factors for CompactPCI backplanes bull Fully backward compatible with earlier models bull Upgradeable via the change-out of processor memory andIO modules bull Used within GD Canada computer systems and sold as individual products

RSC No 35281

General Dynamicswwwgdcanadacom

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PrOduCT GuIdE6U CompactPCI

cPCI6U-24DSI32R32-channel 24-bit delta-sigma CompactPCI 6U analog input board with rear IO bull Low noise 24-bit resolution low phase distortion andmulti-board synchronization bull Suits state-of-the-art sonar and noise monitoring applications bull 32-channel cPCI6U-24DSI32 analog input boardprovides a high-density 24-bit analog input resources on a standard 6U CompactPCI expansion board bull Applications from precision voltagemeasurements to complex audio signal and waveform analysis

RSC No 34985

General Standards Corporationwwwgeneralstandardscom

Duet 3U 64-bit 1 GHz TMS320C6416 DSP (x2) 64 MB SDRAM per processor bull Flexible internalexternalcommunication mesh bull 64-bit66 MHz CompactPCI bull PMCXMC site with Jn4 to FPGA and4 RocketIO per VITA 42 bull External data port up to 12 Gbps bull 4M or 5M Virtex-II Pro FPGAbull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM dedicated800 MBps links between DSPs bull 3U CompactPCI with PXI support bull Suits high-end co-processing wireless broadband communications RADAR video and biometrics

RSC No 32856

QuadiaQuad-DSP bull Dual FPGA bull Dual PMC sites bull Inter-processor connectivity and access to external interfaces bull Four C6416 DSPs split in two independent clusters each hosting a PMC site bull One large FPGA for end-user code bull Central FPGA routing interprocessor communication bull End-user FPGA communication bull External port serial IO for PCIe or other p ivate link bull Global memoryand PCI interface bull 1 GHz TMS320C6416 DSP (x4) bull 64 MB SDRAM per processor bull Flexible internalexternal communication mesh bull 64-bit66 MHz CompactPCI bull Two PMC sites with Jn4 to FPGA bull External data port up to 12 Gbps bull Two 4M Gate FPGA reserved for end-user code bull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM bull Up to 512 MB Global DDR SDRAM bull Suits high-end co-processing wireless and broadband communications

RSC No 34737

Quixote 64-bit 6UAdvanced signal capture generation and co-processing bull 1 GHz TMS320C6416 DSP and2 to 6 MGATE Virtex-II FPGA bull 32 MB SDRAM 8 MB ZBT SBSRAM and AD6645 and AD9764 converters bull 6432 bit CompactPCI 66 MHz 5 V33 V and complex trigger modes with HW event logging bull PMC site with Jn4 to FPGA DIO and PICMG 217 StarFabric compliant bull Suits Software Defined Radio wireless IP and RADAR development and hardware testing bull Physical Layer field testing ultra-fast flexible data acquisition vector signal generation and electronic warfare

RSC No 32861

Innovative Integrationwwwinnovative-dspcom

IC-e6-cPCIbHigh performance 6U CompactPCI board bull Powered by one or two of Freescalersquos mostadvanced 14 GHz MPC7448 PowerPC processors bull PICMG 216 compliant bull Marvell Discovery III chipset (MV64460) bull Low power consumption bull Standard extended and rugged grades

RSC No 32982

Interface Conceptwwwinterfaceconceptcom

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PrOduCT GuIdE6U CompactPCI

CP213Single-width 6U CompactPCIPXI module with either 32 or 64 differential analog input channelsbull 32 64 or 128 channels of analog input bull 16 multifunction digital IO (TTL) channels that may beconfigured as digital in digital out or selectively attached to 2 frequency in 2 counter in andor 2 timerout channels bull 16-bit resolution bull Programmable gain per channel programmable scan rates of lt1 Ss through 100 KSs bull Precision onboard reference for end-to-end calibration

RSC No 34804

KineticSystems Company LLCwwwkscorpcom

CP6001Energy efficient embedded Intel dual core processors bull 12 GHz Intel Core Duo U2500 ULV processor bull Intel Core 2 Duo L7400 LV processor bull Based on the Intel Mobile 945GM chipset with a front side bus of up to 667 MHz and ICH7-R Southbridge bull Two independent digital video outputs to the rear IO (2x DVI - 1x DVI and 1x HDMI) bull AC97 audio capabilities bull 3 x GbE bull 4 x SATA with RAID 01510 functionality bull 6 x USB 20 2 x COM and VGA or DVI bull Can also accommodate a PMC slot or an onboard 25 inch SATA HDD bull Up to 8 GB of USB or 2 GB soldered flash bull Supports Linux Windows XP XP embedded and VxWorks 6

RSC No 34182

CP6923 GbE Switch6U CompactPCI GbE Switch PICMG 216 compliant bull Leading edge te hnology basedon BCM5650X chip bull 24x GbE ports bull Non-blocking Layer 2 and 3 switching and routingbull Copper optical rear IO version bull Hot swap IPMI bull Fully managed bull Comprehensive firmware package bull Applies to VoIP installations such as call servers media gatewaysand trunking gateways in wireline and wireless networks as well as VoIP systems inenterprise networks with high demands on performance

RSC No 32256

Kontronwwwkontroncom

TMS320C6701 Virtex-IITexas Instrumentsrsquo C6701 DSP bull Xilinx Virtex-II series FPGA up to XC2V8000 bull Multiple IO interfaces Onboard CODEC VIM expansion sites 60-pin GPIO header and JTAG bull Hardware drivers integration in SimulinkXilinx System Generator Blocksets for quick implementation of Simulink models bull DSP and FPGA-in-the-loop cosimulation of SimulinkXilinx System Generator models bull Leading edge communication interface allowing real-time datamonitoring from Simulink scopes and remote operations

RSC No 32028

VHS-DACHigh performance multichannel DA for phased array antenna systems radarsonar communications receiversup-sampling to IF stage and RFIF AGC apps bull Eight 125 MSPS output channels bull Optional add-on daughter boardprovides 8 additional output channels or 8 additional input channels bull 32-bit 25 MHz bull FPDP interface with 400 MBps transfer rate (25 MSPS per channel at 8 channels 125 MSPS at 16 channels) bull Low level hardware drivers API andGUI bull High level hardware drivers integration in Simulink Blocksets bull Leading edge communication interface fordata recording and playback tofrom the onboard SDRAM

RSC No 32029

Lyrtechwwwlyrtechcom

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PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

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PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

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PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

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PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

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SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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Page 30: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

6U CompactPCIPrOduCT GuIdE g

This monthrsquos issue includes a 6U CompactPCI Product Guide and Irsquod like to take the opportunity to reflect a bit on the success and evolution of that technology

Back in the 1994 time frame when CompactPCI was first being devel-oped it began as 3U-only technology It used the same Eurocardmechanics that were popularized by VME and an IEC standardized high-

density high-speed connector available from a number of vendors suitablefor 33 MHz PCI signaling That connector was selected by the engineers atZiatech with help from Mike Munroe then at ERNI The majority of VMEdesigns were 6U and based on this I was among a number of folks thatargued for adding the 6U CompactPCI form factor

The 6U form factor presented some challenges and opportunities Onechallenge was that the insertion and extraction forces were quite high when the entire rear of the card was populated with connectors Fortunately the IEEE standards for Eurocards evolved and injectorejector handles that pro-vided leverage became available Eike Waltz then at Rittal was instrumental in bringing that to the table Two of the opportunities that came along withthe extra connectors were a clean way to add secondary buses like the H110 telephony bus to the backplane and the ability to route IO out the rear through rear transition modules PICMG has developed quite a number of subsidiary specifications defining the interoperable use of the extra backplane pins made possible with the 6U form factor Both of these features have played a major part in CompactPCIrsquos success The next major evolution of 6U CompactPCI came with the PICMG 216 Packet Switched Backplane standard which was originally conceived by John Peters and his team at Performance Technologies PICMG 216 interconnected a shelf full of CompactPCI single board computers via redundant Ethernet switches also in the 6U CompactPCI form factor This dramatically increased usable backplane bandwidth and provided redundancy PICMG 216 paved the way for AdvancedTCA and was the industryrsquos first open standard for the switched serial interconnect standards we see popping up in many places

By Joe Pavlat

Looking back and ahead at6U CompactPCI

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PrOduCT GuIdE6U CompactPCI

Recent 6U CompactPCI related products are listed here For more informationenter the productrsquos RSC No at wwwcompactpci-systemscomrsc

cPCI-6910Dual-core Intel Xeon Processor LVULV Universal blade bull Supports Single Dual-Core Intel Xeon LV or ULV processorsbull Front Side Bus 667 MHz bull Up to 2 GB DDR2 400 MHz soldered SDRAM with ECC bull Four PCI Express GbEbull Up to 4 USB 20 ports bull PICMG 20 21 29 216 compliant

RSC No 35013

ADLINK Technologywwwadlinktechcom

CPCIStor Module6U CompactPCI storage blade bull Onboard ATA controller supports CDDVD HDD and solid-state flashbull Supports Hot Swap Removal (ask about RAID support) bull ATA disks available in Enhanced Dutycycle versions for NEBS Level 3 - 724 requirements bull Operating Systems supported VxWorksLinux and Windows

RSC No 34800

ACTTechnicowwwacttechnicocom

Prosody X cPCI E1T1An E1T1 digital network access card bull Suits telco developers and systems integrators bull Uses Aculabrsquos worldwide protocol coverage including Aculabrsquos SS7 stack available under a cost free license bull Available with 8 or 16 E1T1 trunks and software selectable E1T1 interfaces bull Flexible mix of protocols including ISDN CAS and SS7 (ITU-T China and ANSI) bull A variety of interconnect switching and protocol conversion solutions can be readily crafted bull High availability reliability and scalability with industry standard hardw re and software interoperability bull Up to 128 SS7 signaling links bull Non-circuit related (TCAP) messagingintensive applications such as prepaid and SMS

RSC No 35408

Aculabwwwaculabcom

Adexp8021Intel Core Duo L2400 (166 GHz) w E7520 server chipset bull Dual channel PC2-3200 Registered RAM SECDED or x4 SDDC bull Two GbE two Serial ATA four USB 20 bull Onboard SXGA graphics 1280 x 24-bitbull 6U CompactPCI Bus PICMG EXP0 R10 Specification bull RoHS compliant 0 degC to +55 degC operating range

RSC No 32837

Advanet Incwwwadvanetcojpen

TC84012 channel single-stop Time-to-Digital Converter (TDC) with single-start and multi-start acquisition modes bull 50 ps timing resolution bull Wide range with upto 20 s between first and last events bull Large internal memory buffer with up to 512 hits per channel bull Low jitter (lt3 ps rms) high stability (plusmn2 ppm) internalclock source bull External 10 MHz reference input bull FPGA based Data Processing Unit (DPU) bull Fast readout with DMA mode for increased data throughputbull Overvoltage-protected inputs with 50 Ω K-Lock (LEMO) connectors bull Built-in self calibration bull Modular single-slot 6U PXICompactPCI standardbull Low power consumption (lt22 W)

RSC No 33445

Agilent-Acqiriswwwacqiriscom

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PrOduCT GuIdE6U CompactPCI

MIC-30428-slot 6U CompactPCI backplane bull AC or DC CompactPCI 500 W + 250 W redundant(2+1) power supplies bull PICMG 216 (CompactPCI Packet Switching Backplane) compliancebull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarmmodule (MIC-3924L-AE)

RSC No 32851

MIC-30436-slot 6U CompactPCI backplane bull Supports two hot-swappable SCSISATA or removableIDE HDD bays bull Built-in IDE slim-type DVD-ROM bull AC or DC CompactPCI 250 W + 250 Wredundant (1+1) power supplies bull Supports hot-swappable fan modules bull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarm module (MIC-3924L-AE)

RSC No 32850

Advantech Corporationwwwadvantechcom

Dual-Core Xeon CompactPCI SBCModel PP 42123x bull Dual CPU 6U CompactPCI SBC supporting two dual-core Xeon CPUs bull Up to 8 GB DDR2 ECC SDRAM in a single system or peripheralslot bull Dual processor SBC in a single 6U CompactPCI slot bull Supports two 166 GHz Dual-Core Intel Xeon ULV processors using Intel E7520 server chipsetbull Up to 8 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull PMCXMC site support 66 MHz PCI-X and x8 PCI Express bull Front and rear IO bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade bull Four GbE ports with option for PICMG 216

RSC No 34761

6U CompactPCI Core 2 Duo SBCModel PP 41203x bull 6U CompactPCI Core 2 Duo SBC supporting two PMC sites includingone XMC site bull Up to 4 GB DDR2 ECC SDRAM bull All in a single system or peripheral slot bull TwoPMC sites supporting up to 100 MHz PCI-X bull One XMC x8 PCI Express bull Front and rear IObull Supports 216 GHz or 15 GHz Intel Core 2 Duo processors bull Intel E7520 server chipsetbull Up to 4 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade

RSC No 34763

PP 30202xTwo processor versions available bull 18 GHz Intel Pentium M processor 745 uses mFC-PGA 478 (micro Flip-Chip Pin Grid Array) package bull 14 GHz Intel Pentium M processor Low Voltage 738uses mFC-BGA 479 (micro Flip-Chip Ball Grid Array) package bull 64 KB primary (L1) on-die cache2 MB of secondary (L2) on-die cache bull 400 MHz Front Side Bus (FSB) bull No CPU fan bull 16 GHz processor version (1 MB L2 cache) available see PP 30002x datasheet bull Utilizes 64-bitIntel 855GME chipset bull Supports 400 MHz bus frequency bull Uses Intel 6300ESB IO Controller Hub

RSC No 32659

Concurrent Technologies Incwwwgocctcom

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cCIBPMC6U-ETA 6U bridged dual PMC carrier that bridges extended temperature CompactPCI boards and PMCs bull Features a rugged CompactPCI form factor providing increased flexibility to military communications systems designers bull Provides additional design choices to users through its differing bus speeds maximizing the numberof PMCs that can be used CompactPCI andPMC buses can both run at 66 or 33 MHzbull Operating temperature range of -40 degC to+85 degC bull Signal conditioning bull DMA supportbull Low-power design +5 V +33 V +12 V -12 V bull User-selectable VIO of 33 V or 5 V to the PMC

RSC No 32891

Dynamic Engineeringwwwdynengcom

cPCI4IP-MMMinimized PCI address footprint IndustryPack carrier for CompactPCI applications bull 6U 4HP4 IP positions 832 clock selection for each slot fused filtered power IO options bull ID INT IO and Mem spaces are decoded for each IP slotbull Single and double wide IPrsquos bull 16- and 32- bit IPs bull 32-bit access to 16-bit IPs bull Full or mini-mized Memory Space decoding for 18 the PCI address requirement bull With the cPCI4IP-MM option 8 CompactPCI 4IP cards take the same PCI address space as 1 full Mem Space card

RSC No 34905

ACQ132CPCI32 channel MHz class simultaneous sampling intelligent digitizer bull 32 simultaneous analoginput channels 2-32 MSpschannel 14-bit resolution bull Differential inputs bull Intelligent cardwith 1 gigabyte memory and GbE on board bull Large distributed FPGA resource on boardbull Range of DSP functions including FIR filtering and Digital Downconverter

RSC No 35482

D-TACQ Solutions Ltdwwwd-tacqcouk

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CR11Based on the Intel Core Duo Processor the platform is designed to support processor speeds from 106 GHz up to 20 GHz bull Intel Core 2 Duo runs at 15 GHz up to 20 GHz bull Conduction cooled bull Two PMC slots bull PCI Express bull 2x GbE

RSC No 33156

ICS-72532-channel 6U CompactPCI DAC board bull 6U CompactPCI data acquisition card bull 32 differential output channels bull 16 or 24-bit sample size bull 288 kHzch data rate bull Simultaneous sampling across all channels on single or multiple boards bull 32 separate delta-sigma DACs bull 64-bit 66 MHz CompactPCI PICMG 20 Rev30 hot-swappable bull FPDP II 400 MBps interface

RSC No 33576

ICS-71032-channel 6U CompactPCI ADC board bull 6U CompactPCI data acquisition card bull 32 differential input channels bull 216 KHzch 24-bit resolution bull Software selectable full scale input bull FPDP II 400 MBpsinterface bull 64-bit 66 MHz CompactPCI PICMG 20 Rev 30 hot swappable bull 32 synchronous boards for simultaneous sampling bull Sonar acoustics and test and measurement applications

RSC No 33578

Tsumani 6U CPCI Development KitFPGA processor solution targeted at high performance software defined radio applications bull Dual Stratix EP1S80 FPGAs are tightly coupled to provide apower platform for signal processing bull Two PMC module sites provide IO connectivity to either front panel or back panel connections bull A direct highbandwidth 1 GBps path from the PMC P4 connector directly to the FPGAs bull Model 919 Dual DAC Mezzanine provides broadband analog signal generationin a compact form bull The board features two independent DAC channels each with its own 12-bit LVDS input capable of running at rates up to 160 MHz

RSC No 32026

CP11Rugged 6U SBC bull Up to 4 GB of DDR2 SDRAM (200 MHz) with enhanced ECC four independent onboard PCI buses system host and peripheral modesupport for the CompactPCI backplane two PMC interfaces (64-bit133 MHz and 32-bit33 MHz) bull Instead of the PMC1 a PCI Express based XMC interface is available on request bull Two GbE one Fast Ethernet two serial interfaces (RS-232 or RS-422485) USB 20 integrated HDD or flash drive bull High performance 2D3D ATI video controller capable of driving two displays in parallel supports VGADVI interface bull Intel Core 2 Duo at 216 GHz Intel Core Duo at 20 GHz2x PMC expansion site bull One XMC optional bull Up to 4 GB DDR2 SDRAM wECC 2x GbE

RSC No 33447

GE Fanuc Intelligent Platforms Incwwwgefanucembeddedcom

Single Board ComputersGD Canada designs and manufactures conduction-cooled Single Board Computers (SBCs)using Intel processors bull 6U and 3U form factors for CompactPCI backplanes bull Fully backward compatible with earlier models bull Upgradeable via the change-out of processor memory andIO modules bull Used within GD Canada computer systems and sold as individual products

RSC No 35281

General Dynamicswwwgdcanadacom

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PrOduCT GuIdE6U CompactPCI

cPCI6U-24DSI32R32-channel 24-bit delta-sigma CompactPCI 6U analog input board with rear IO bull Low noise 24-bit resolution low phase distortion andmulti-board synchronization bull Suits state-of-the-art sonar and noise monitoring applications bull 32-channel cPCI6U-24DSI32 analog input boardprovides a high-density 24-bit analog input resources on a standard 6U CompactPCI expansion board bull Applications from precision voltagemeasurements to complex audio signal and waveform analysis

RSC No 34985

General Standards Corporationwwwgeneralstandardscom

Duet 3U 64-bit 1 GHz TMS320C6416 DSP (x2) 64 MB SDRAM per processor bull Flexible internalexternalcommunication mesh bull 64-bit66 MHz CompactPCI bull PMCXMC site with Jn4 to FPGA and4 RocketIO per VITA 42 bull External data port up to 12 Gbps bull 4M or 5M Virtex-II Pro FPGAbull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM dedicated800 MBps links between DSPs bull 3U CompactPCI with PXI support bull Suits high-end co-processing wireless broadband communications RADAR video and biometrics

RSC No 32856

QuadiaQuad-DSP bull Dual FPGA bull Dual PMC sites bull Inter-processor connectivity and access to external interfaces bull Four C6416 DSPs split in two independent clusters each hosting a PMC site bull One large FPGA for end-user code bull Central FPGA routing interprocessor communication bull End-user FPGA communication bull External port serial IO for PCIe or other p ivate link bull Global memoryand PCI interface bull 1 GHz TMS320C6416 DSP (x4) bull 64 MB SDRAM per processor bull Flexible internalexternal communication mesh bull 64-bit66 MHz CompactPCI bull Two PMC sites with Jn4 to FPGA bull External data port up to 12 Gbps bull Two 4M Gate FPGA reserved for end-user code bull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM bull Up to 512 MB Global DDR SDRAM bull Suits high-end co-processing wireless and broadband communications

RSC No 34737

Quixote 64-bit 6UAdvanced signal capture generation and co-processing bull 1 GHz TMS320C6416 DSP and2 to 6 MGATE Virtex-II FPGA bull 32 MB SDRAM 8 MB ZBT SBSRAM and AD6645 and AD9764 converters bull 6432 bit CompactPCI 66 MHz 5 V33 V and complex trigger modes with HW event logging bull PMC site with Jn4 to FPGA DIO and PICMG 217 StarFabric compliant bull Suits Software Defined Radio wireless IP and RADAR development and hardware testing bull Physical Layer field testing ultra-fast flexible data acquisition vector signal generation and electronic warfare

RSC No 32861

Innovative Integrationwwwinnovative-dspcom

IC-e6-cPCIbHigh performance 6U CompactPCI board bull Powered by one or two of Freescalersquos mostadvanced 14 GHz MPC7448 PowerPC processors bull PICMG 216 compliant bull Marvell Discovery III chipset (MV64460) bull Low power consumption bull Standard extended and rugged grades

RSC No 32982

Interface Conceptwwwinterfaceconceptcom

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PrOduCT GuIdE6U CompactPCI

CP213Single-width 6U CompactPCIPXI module with either 32 or 64 differential analog input channelsbull 32 64 or 128 channels of analog input bull 16 multifunction digital IO (TTL) channels that may beconfigured as digital in digital out or selectively attached to 2 frequency in 2 counter in andor 2 timerout channels bull 16-bit resolution bull Programmable gain per channel programmable scan rates of lt1 Ss through 100 KSs bull Precision onboard reference for end-to-end calibration

RSC No 34804

KineticSystems Company LLCwwwkscorpcom

CP6001Energy efficient embedded Intel dual core processors bull 12 GHz Intel Core Duo U2500 ULV processor bull Intel Core 2 Duo L7400 LV processor bull Based on the Intel Mobile 945GM chipset with a front side bus of up to 667 MHz and ICH7-R Southbridge bull Two independent digital video outputs to the rear IO (2x DVI - 1x DVI and 1x HDMI) bull AC97 audio capabilities bull 3 x GbE bull 4 x SATA with RAID 01510 functionality bull 6 x USB 20 2 x COM and VGA or DVI bull Can also accommodate a PMC slot or an onboard 25 inch SATA HDD bull Up to 8 GB of USB or 2 GB soldered flash bull Supports Linux Windows XP XP embedded and VxWorks 6

RSC No 34182

CP6923 GbE Switch6U CompactPCI GbE Switch PICMG 216 compliant bull Leading edge te hnology basedon BCM5650X chip bull 24x GbE ports bull Non-blocking Layer 2 and 3 switching and routingbull Copper optical rear IO version bull Hot swap IPMI bull Fully managed bull Comprehensive firmware package bull Applies to VoIP installations such as call servers media gatewaysand trunking gateways in wireline and wireless networks as well as VoIP systems inenterprise networks with high demands on performance

RSC No 32256

Kontronwwwkontroncom

TMS320C6701 Virtex-IITexas Instrumentsrsquo C6701 DSP bull Xilinx Virtex-II series FPGA up to XC2V8000 bull Multiple IO interfaces Onboard CODEC VIM expansion sites 60-pin GPIO header and JTAG bull Hardware drivers integration in SimulinkXilinx System Generator Blocksets for quick implementation of Simulink models bull DSP and FPGA-in-the-loop cosimulation of SimulinkXilinx System Generator models bull Leading edge communication interface allowing real-time datamonitoring from Simulink scopes and remote operations

RSC No 32028

VHS-DACHigh performance multichannel DA for phased array antenna systems radarsonar communications receiversup-sampling to IF stage and RFIF AGC apps bull Eight 125 MSPS output channels bull Optional add-on daughter boardprovides 8 additional output channels or 8 additional input channels bull 32-bit 25 MHz bull FPDP interface with 400 MBps transfer rate (25 MSPS per channel at 8 channels 125 MSPS at 16 channels) bull Low level hardware drivers API andGUI bull High level hardware drivers integration in Simulink Blocksets bull Leading edge communication interface fordata recording and playback tofrom the onboard SDRAM

RSC No 32029

Lyrtechwwwlyrtechcom

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PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

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PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

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PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

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PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

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PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

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SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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Page 31: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

PrOduCT GuIdE6U CompactPCI

Recent 6U CompactPCI related products are listed here For more informationenter the productrsquos RSC No at wwwcompactpci-systemscomrsc

cPCI-6910Dual-core Intel Xeon Processor LVULV Universal blade bull Supports Single Dual-Core Intel Xeon LV or ULV processorsbull Front Side Bus 667 MHz bull Up to 2 GB DDR2 400 MHz soldered SDRAM with ECC bull Four PCI Express GbEbull Up to 4 USB 20 ports bull PICMG 20 21 29 216 compliant

RSC No 35013

ADLINK Technologywwwadlinktechcom

CPCIStor Module6U CompactPCI storage blade bull Onboard ATA controller supports CDDVD HDD and solid-state flashbull Supports Hot Swap Removal (ask about RAID support) bull ATA disks available in Enhanced Dutycycle versions for NEBS Level 3 - 724 requirements bull Operating Systems supported VxWorksLinux and Windows

RSC No 34800

ACTTechnicowwwacttechnicocom

Prosody X cPCI E1T1An E1T1 digital network access card bull Suits telco developers and systems integrators bull Uses Aculabrsquos worldwide protocol coverage including Aculabrsquos SS7 stack available under a cost free license bull Available with 8 or 16 E1T1 trunks and software selectable E1T1 interfaces bull Flexible mix of protocols including ISDN CAS and SS7 (ITU-T China and ANSI) bull A variety of interconnect switching and protocol conversion solutions can be readily crafted bull High availability reliability and scalability with industry standard hardw re and software interoperability bull Up to 128 SS7 signaling links bull Non-circuit related (TCAP) messagingintensive applications such as prepaid and SMS

RSC No 35408

Aculabwwwaculabcom

Adexp8021Intel Core Duo L2400 (166 GHz) w E7520 server chipset bull Dual channel PC2-3200 Registered RAM SECDED or x4 SDDC bull Two GbE two Serial ATA four USB 20 bull Onboard SXGA graphics 1280 x 24-bitbull 6U CompactPCI Bus PICMG EXP0 R10 Specification bull RoHS compliant 0 degC to +55 degC operating range

RSC No 32837

Advanet Incwwwadvanetcojpen

TC84012 channel single-stop Time-to-Digital Converter (TDC) with single-start and multi-start acquisition modes bull 50 ps timing resolution bull Wide range with upto 20 s between first and last events bull Large internal memory buffer with up to 512 hits per channel bull Low jitter (lt3 ps rms) high stability (plusmn2 ppm) internalclock source bull External 10 MHz reference input bull FPGA based Data Processing Unit (DPU) bull Fast readout with DMA mode for increased data throughputbull Overvoltage-protected inputs with 50 Ω K-Lock (LEMO) connectors bull Built-in self calibration bull Modular single-slot 6U PXICompactPCI standardbull Low power consumption (lt22 W)

RSC No 33445

Agilent-Acqiriswwwacqiriscom

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PrOduCT GuIdE6U CompactPCI

MIC-30428-slot 6U CompactPCI backplane bull AC or DC CompactPCI 500 W + 250 W redundant(2+1) power supplies bull PICMG 216 (CompactPCI Packet Switching Backplane) compliancebull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarmmodule (MIC-3924L-AE)

RSC No 32851

MIC-30436-slot 6U CompactPCI backplane bull Supports two hot-swappable SCSISATA or removableIDE HDD bays bull Built-in IDE slim-type DVD-ROM bull AC or DC CompactPCI 250 W + 250 Wredundant (1+1) power supplies bull Supports hot-swappable fan modules bull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarm module (MIC-3924L-AE)

RSC No 32850

Advantech Corporationwwwadvantechcom

Dual-Core Xeon CompactPCI SBCModel PP 42123x bull Dual CPU 6U CompactPCI SBC supporting two dual-core Xeon CPUs bull Up to 8 GB DDR2 ECC SDRAM in a single system or peripheralslot bull Dual processor SBC in a single 6U CompactPCI slot bull Supports two 166 GHz Dual-Core Intel Xeon ULV processors using Intel E7520 server chipsetbull Up to 8 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull PMCXMC site support 66 MHz PCI-X and x8 PCI Express bull Front and rear IO bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade bull Four GbE ports with option for PICMG 216

RSC No 34761

6U CompactPCI Core 2 Duo SBCModel PP 41203x bull 6U CompactPCI Core 2 Duo SBC supporting two PMC sites includingone XMC site bull Up to 4 GB DDR2 ECC SDRAM bull All in a single system or peripheral slot bull TwoPMC sites supporting up to 100 MHz PCI-X bull One XMC x8 PCI Express bull Front and rear IObull Supports 216 GHz or 15 GHz Intel Core 2 Duo processors bull Intel E7520 server chipsetbull Up to 4 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade

RSC No 34763

PP 30202xTwo processor versions available bull 18 GHz Intel Pentium M processor 745 uses mFC-PGA 478 (micro Flip-Chip Pin Grid Array) package bull 14 GHz Intel Pentium M processor Low Voltage 738uses mFC-BGA 479 (micro Flip-Chip Ball Grid Array) package bull 64 KB primary (L1) on-die cache2 MB of secondary (L2) on-die cache bull 400 MHz Front Side Bus (FSB) bull No CPU fan bull 16 GHz processor version (1 MB L2 cache) available see PP 30002x datasheet bull Utilizes 64-bitIntel 855GME chipset bull Supports 400 MHz bus frequency bull Uses Intel 6300ESB IO Controller Hub

RSC No 32659

Concurrent Technologies Incwwwgocctcom

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PrOduCT GuIdE6U CompactPCI

cCIBPMC6U-ETA 6U bridged dual PMC carrier that bridges extended temperature CompactPCI boards and PMCs bull Features a rugged CompactPCI form factor providing increased flexibility to military communications systems designers bull Provides additional design choices to users through its differing bus speeds maximizing the numberof PMCs that can be used CompactPCI andPMC buses can both run at 66 or 33 MHzbull Operating temperature range of -40 degC to+85 degC bull Signal conditioning bull DMA supportbull Low-power design +5 V +33 V +12 V -12 V bull User-selectable VIO of 33 V or 5 V to the PMC

RSC No 32891

Dynamic Engineeringwwwdynengcom

cPCI4IP-MMMinimized PCI address footprint IndustryPack carrier for CompactPCI applications bull 6U 4HP4 IP positions 832 clock selection for each slot fused filtered power IO options bull ID INT IO and Mem spaces are decoded for each IP slotbull Single and double wide IPrsquos bull 16- and 32- bit IPs bull 32-bit access to 16-bit IPs bull Full or mini-mized Memory Space decoding for 18 the PCI address requirement bull With the cPCI4IP-MM option 8 CompactPCI 4IP cards take the same PCI address space as 1 full Mem Space card

RSC No 34905

ACQ132CPCI32 channel MHz class simultaneous sampling intelligent digitizer bull 32 simultaneous analoginput channels 2-32 MSpschannel 14-bit resolution bull Differential inputs bull Intelligent cardwith 1 gigabyte memory and GbE on board bull Large distributed FPGA resource on boardbull Range of DSP functions including FIR filtering and Digital Downconverter

RSC No 35482

D-TACQ Solutions Ltdwwwd-tacqcouk

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PrOduCT GuIdE6U CompactPCI

CR11Based on the Intel Core Duo Processor the platform is designed to support processor speeds from 106 GHz up to 20 GHz bull Intel Core 2 Duo runs at 15 GHz up to 20 GHz bull Conduction cooled bull Two PMC slots bull PCI Express bull 2x GbE

RSC No 33156

ICS-72532-channel 6U CompactPCI DAC board bull 6U CompactPCI data acquisition card bull 32 differential output channels bull 16 or 24-bit sample size bull 288 kHzch data rate bull Simultaneous sampling across all channels on single or multiple boards bull 32 separate delta-sigma DACs bull 64-bit 66 MHz CompactPCI PICMG 20 Rev30 hot-swappable bull FPDP II 400 MBps interface

RSC No 33576

ICS-71032-channel 6U CompactPCI ADC board bull 6U CompactPCI data acquisition card bull 32 differential input channels bull 216 KHzch 24-bit resolution bull Software selectable full scale input bull FPDP II 400 MBpsinterface bull 64-bit 66 MHz CompactPCI PICMG 20 Rev 30 hot swappable bull 32 synchronous boards for simultaneous sampling bull Sonar acoustics and test and measurement applications

RSC No 33578

Tsumani 6U CPCI Development KitFPGA processor solution targeted at high performance software defined radio applications bull Dual Stratix EP1S80 FPGAs are tightly coupled to provide apower platform for signal processing bull Two PMC module sites provide IO connectivity to either front panel or back panel connections bull A direct highbandwidth 1 GBps path from the PMC P4 connector directly to the FPGAs bull Model 919 Dual DAC Mezzanine provides broadband analog signal generationin a compact form bull The board features two independent DAC channels each with its own 12-bit LVDS input capable of running at rates up to 160 MHz

RSC No 32026

CP11Rugged 6U SBC bull Up to 4 GB of DDR2 SDRAM (200 MHz) with enhanced ECC four independent onboard PCI buses system host and peripheral modesupport for the CompactPCI backplane two PMC interfaces (64-bit133 MHz and 32-bit33 MHz) bull Instead of the PMC1 a PCI Express based XMC interface is available on request bull Two GbE one Fast Ethernet two serial interfaces (RS-232 or RS-422485) USB 20 integrated HDD or flash drive bull High performance 2D3D ATI video controller capable of driving two displays in parallel supports VGADVI interface bull Intel Core 2 Duo at 216 GHz Intel Core Duo at 20 GHz2x PMC expansion site bull One XMC optional bull Up to 4 GB DDR2 SDRAM wECC 2x GbE

RSC No 33447

GE Fanuc Intelligent Platforms Incwwwgefanucembeddedcom

Single Board ComputersGD Canada designs and manufactures conduction-cooled Single Board Computers (SBCs)using Intel processors bull 6U and 3U form factors for CompactPCI backplanes bull Fully backward compatible with earlier models bull Upgradeable via the change-out of processor memory andIO modules bull Used within GD Canada computer systems and sold as individual products

RSC No 35281

General Dynamicswwwgdcanadacom

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PrOduCT GuIdE6U CompactPCI

cPCI6U-24DSI32R32-channel 24-bit delta-sigma CompactPCI 6U analog input board with rear IO bull Low noise 24-bit resolution low phase distortion andmulti-board synchronization bull Suits state-of-the-art sonar and noise monitoring applications bull 32-channel cPCI6U-24DSI32 analog input boardprovides a high-density 24-bit analog input resources on a standard 6U CompactPCI expansion board bull Applications from precision voltagemeasurements to complex audio signal and waveform analysis

RSC No 34985

General Standards Corporationwwwgeneralstandardscom

Duet 3U 64-bit 1 GHz TMS320C6416 DSP (x2) 64 MB SDRAM per processor bull Flexible internalexternalcommunication mesh bull 64-bit66 MHz CompactPCI bull PMCXMC site with Jn4 to FPGA and4 RocketIO per VITA 42 bull External data port up to 12 Gbps bull 4M or 5M Virtex-II Pro FPGAbull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM dedicated800 MBps links between DSPs bull 3U CompactPCI with PXI support bull Suits high-end co-processing wireless broadband communications RADAR video and biometrics

RSC No 32856

QuadiaQuad-DSP bull Dual FPGA bull Dual PMC sites bull Inter-processor connectivity and access to external interfaces bull Four C6416 DSPs split in two independent clusters each hosting a PMC site bull One large FPGA for end-user code bull Central FPGA routing interprocessor communication bull End-user FPGA communication bull External port serial IO for PCIe or other p ivate link bull Global memoryand PCI interface bull 1 GHz TMS320C6416 DSP (x4) bull 64 MB SDRAM per processor bull Flexible internalexternal communication mesh bull 64-bit66 MHz CompactPCI bull Two PMC sites with Jn4 to FPGA bull External data port up to 12 Gbps bull Two 4M Gate FPGA reserved for end-user code bull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM bull Up to 512 MB Global DDR SDRAM bull Suits high-end co-processing wireless and broadband communications

RSC No 34737

Quixote 64-bit 6UAdvanced signal capture generation and co-processing bull 1 GHz TMS320C6416 DSP and2 to 6 MGATE Virtex-II FPGA bull 32 MB SDRAM 8 MB ZBT SBSRAM and AD6645 and AD9764 converters bull 6432 bit CompactPCI 66 MHz 5 V33 V and complex trigger modes with HW event logging bull PMC site with Jn4 to FPGA DIO and PICMG 217 StarFabric compliant bull Suits Software Defined Radio wireless IP and RADAR development and hardware testing bull Physical Layer field testing ultra-fast flexible data acquisition vector signal generation and electronic warfare

RSC No 32861

Innovative Integrationwwwinnovative-dspcom

IC-e6-cPCIbHigh performance 6U CompactPCI board bull Powered by one or two of Freescalersquos mostadvanced 14 GHz MPC7448 PowerPC processors bull PICMG 216 compliant bull Marvell Discovery III chipset (MV64460) bull Low power consumption bull Standard extended and rugged grades

RSC No 32982

Interface Conceptwwwinterfaceconceptcom

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PrOduCT GuIdE6U CompactPCI

CP213Single-width 6U CompactPCIPXI module with either 32 or 64 differential analog input channelsbull 32 64 or 128 channels of analog input bull 16 multifunction digital IO (TTL) channels that may beconfigured as digital in digital out or selectively attached to 2 frequency in 2 counter in andor 2 timerout channels bull 16-bit resolution bull Programmable gain per channel programmable scan rates of lt1 Ss through 100 KSs bull Precision onboard reference for end-to-end calibration

RSC No 34804

KineticSystems Company LLCwwwkscorpcom

CP6001Energy efficient embedded Intel dual core processors bull 12 GHz Intel Core Duo U2500 ULV processor bull Intel Core 2 Duo L7400 LV processor bull Based on the Intel Mobile 945GM chipset with a front side bus of up to 667 MHz and ICH7-R Southbridge bull Two independent digital video outputs to the rear IO (2x DVI - 1x DVI and 1x HDMI) bull AC97 audio capabilities bull 3 x GbE bull 4 x SATA with RAID 01510 functionality bull 6 x USB 20 2 x COM and VGA or DVI bull Can also accommodate a PMC slot or an onboard 25 inch SATA HDD bull Up to 8 GB of USB or 2 GB soldered flash bull Supports Linux Windows XP XP embedded and VxWorks 6

RSC No 34182

CP6923 GbE Switch6U CompactPCI GbE Switch PICMG 216 compliant bull Leading edge te hnology basedon BCM5650X chip bull 24x GbE ports bull Non-blocking Layer 2 and 3 switching and routingbull Copper optical rear IO version bull Hot swap IPMI bull Fully managed bull Comprehensive firmware package bull Applies to VoIP installations such as call servers media gatewaysand trunking gateways in wireline and wireless networks as well as VoIP systems inenterprise networks with high demands on performance

RSC No 32256

Kontronwwwkontroncom

TMS320C6701 Virtex-IITexas Instrumentsrsquo C6701 DSP bull Xilinx Virtex-II series FPGA up to XC2V8000 bull Multiple IO interfaces Onboard CODEC VIM expansion sites 60-pin GPIO header and JTAG bull Hardware drivers integration in SimulinkXilinx System Generator Blocksets for quick implementation of Simulink models bull DSP and FPGA-in-the-loop cosimulation of SimulinkXilinx System Generator models bull Leading edge communication interface allowing real-time datamonitoring from Simulink scopes and remote operations

RSC No 32028

VHS-DACHigh performance multichannel DA for phased array antenna systems radarsonar communications receiversup-sampling to IF stage and RFIF AGC apps bull Eight 125 MSPS output channels bull Optional add-on daughter boardprovides 8 additional output channels or 8 additional input channels bull 32-bit 25 MHz bull FPDP interface with 400 MBps transfer rate (25 MSPS per channel at 8 channels 125 MSPS at 16 channels) bull Low level hardware drivers API andGUI bull High level hardware drivers integration in Simulink Blocksets bull Leading edge communication interface fordata recording and playback tofrom the onboard SDRAM

RSC No 32029

Lyrtechwwwlyrtechcom

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PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

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PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

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PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

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PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

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PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

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SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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Page 32: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

PrOduCT GuIdE6U CompactPCI

MIC-30428-slot 6U CompactPCI backplane bull AC or DC CompactPCI 500 W + 250 W redundant(2+1) power supplies bull PICMG 216 (CompactPCI Packet Switching Backplane) compliancebull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarmmodule (MIC-3924L-AE)

RSC No 32851

MIC-30436-slot 6U CompactPCI backplane bull Supports two hot-swappable SCSISATA or removableIDE HDD bays bull Built-in IDE slim-type DVD-ROM bull AC or DC CompactPCI 250 W + 250 Wredundant (1+1) power supplies bull Supports hot-swappable fan modules bull PICMG 25 (CompactPCI Computer Telephony) compliance bull Built-in alarm module (MIC-3924L-AE)

RSC No 32850

Advantech Corporationwwwadvantechcom

Dual-Core Xeon CompactPCI SBCModel PP 42123x bull Dual CPU 6U CompactPCI SBC supporting two dual-core Xeon CPUs bull Up to 8 GB DDR2 ECC SDRAM in a single system or peripheralslot bull Dual processor SBC in a single 6U CompactPCI slot bull Supports two 166 GHz Dual-Core Intel Xeon ULV processors using Intel E7520 server chipsetbull Up to 8 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull PMCXMC site support 66 MHz PCI-X and x8 PCI Express bull Front and rear IO bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade bull Four GbE ports with option for PICMG 216

RSC No 34761

6U CompactPCI Core 2 Duo SBCModel PP 41203x bull 6U CompactPCI Core 2 Duo SBC supporting two PMC sites includingone XMC site bull Up to 4 GB DDR2 ECC SDRAM bull All in a single system or peripheral slot bull TwoPMC sites supporting up to 100 MHz PCI-X bull One XMC x8 PCI Express bull Front and rear IObull Supports 216 GHz or 15 GHz Intel Core 2 Duo processors bull Intel E7520 server chipsetbull Up to 4 GB dual-channel DDR2-400 ECC SDRAM in a single slot bull 3366 MHz CompactPCI operation in system or peripheral slot bull Can operate as a blade

RSC No 34763

PP 30202xTwo processor versions available bull 18 GHz Intel Pentium M processor 745 uses mFC-PGA 478 (micro Flip-Chip Pin Grid Array) package bull 14 GHz Intel Pentium M processor Low Voltage 738uses mFC-BGA 479 (micro Flip-Chip Ball Grid Array) package bull 64 KB primary (L1) on-die cache2 MB of secondary (L2) on-die cache bull 400 MHz Front Side Bus (FSB) bull No CPU fan bull 16 GHz processor version (1 MB L2 cache) available see PP 30002x datasheet bull Utilizes 64-bitIntel 855GME chipset bull Supports 400 MHz bus frequency bull Uses Intel 6300ESB IO Controller Hub

RSC No 32659

Concurrent Technologies Incwwwgocctcom

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PrOduCT GuIdE6U CompactPCI

cCIBPMC6U-ETA 6U bridged dual PMC carrier that bridges extended temperature CompactPCI boards and PMCs bull Features a rugged CompactPCI form factor providing increased flexibility to military communications systems designers bull Provides additional design choices to users through its differing bus speeds maximizing the numberof PMCs that can be used CompactPCI andPMC buses can both run at 66 or 33 MHzbull Operating temperature range of -40 degC to+85 degC bull Signal conditioning bull DMA supportbull Low-power design +5 V +33 V +12 V -12 V bull User-selectable VIO of 33 V or 5 V to the PMC

RSC No 32891

Dynamic Engineeringwwwdynengcom

cPCI4IP-MMMinimized PCI address footprint IndustryPack carrier for CompactPCI applications bull 6U 4HP4 IP positions 832 clock selection for each slot fused filtered power IO options bull ID INT IO and Mem spaces are decoded for each IP slotbull Single and double wide IPrsquos bull 16- and 32- bit IPs bull 32-bit access to 16-bit IPs bull Full or mini-mized Memory Space decoding for 18 the PCI address requirement bull With the cPCI4IP-MM option 8 CompactPCI 4IP cards take the same PCI address space as 1 full Mem Space card

RSC No 34905

ACQ132CPCI32 channel MHz class simultaneous sampling intelligent digitizer bull 32 simultaneous analoginput channels 2-32 MSpschannel 14-bit resolution bull Differential inputs bull Intelligent cardwith 1 gigabyte memory and GbE on board bull Large distributed FPGA resource on boardbull Range of DSP functions including FIR filtering and Digital Downconverter

RSC No 35482

D-TACQ Solutions Ltdwwwd-tacqcouk

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PrOduCT GuIdE6U CompactPCI

CR11Based on the Intel Core Duo Processor the platform is designed to support processor speeds from 106 GHz up to 20 GHz bull Intel Core 2 Duo runs at 15 GHz up to 20 GHz bull Conduction cooled bull Two PMC slots bull PCI Express bull 2x GbE

RSC No 33156

ICS-72532-channel 6U CompactPCI DAC board bull 6U CompactPCI data acquisition card bull 32 differential output channels bull 16 or 24-bit sample size bull 288 kHzch data rate bull Simultaneous sampling across all channels on single or multiple boards bull 32 separate delta-sigma DACs bull 64-bit 66 MHz CompactPCI PICMG 20 Rev30 hot-swappable bull FPDP II 400 MBps interface

RSC No 33576

ICS-71032-channel 6U CompactPCI ADC board bull 6U CompactPCI data acquisition card bull 32 differential input channels bull 216 KHzch 24-bit resolution bull Software selectable full scale input bull FPDP II 400 MBpsinterface bull 64-bit 66 MHz CompactPCI PICMG 20 Rev 30 hot swappable bull 32 synchronous boards for simultaneous sampling bull Sonar acoustics and test and measurement applications

RSC No 33578

Tsumani 6U CPCI Development KitFPGA processor solution targeted at high performance software defined radio applications bull Dual Stratix EP1S80 FPGAs are tightly coupled to provide apower platform for signal processing bull Two PMC module sites provide IO connectivity to either front panel or back panel connections bull A direct highbandwidth 1 GBps path from the PMC P4 connector directly to the FPGAs bull Model 919 Dual DAC Mezzanine provides broadband analog signal generationin a compact form bull The board features two independent DAC channels each with its own 12-bit LVDS input capable of running at rates up to 160 MHz

RSC No 32026

CP11Rugged 6U SBC bull Up to 4 GB of DDR2 SDRAM (200 MHz) with enhanced ECC four independent onboard PCI buses system host and peripheral modesupport for the CompactPCI backplane two PMC interfaces (64-bit133 MHz and 32-bit33 MHz) bull Instead of the PMC1 a PCI Express based XMC interface is available on request bull Two GbE one Fast Ethernet two serial interfaces (RS-232 or RS-422485) USB 20 integrated HDD or flash drive bull High performance 2D3D ATI video controller capable of driving two displays in parallel supports VGADVI interface bull Intel Core 2 Duo at 216 GHz Intel Core Duo at 20 GHz2x PMC expansion site bull One XMC optional bull Up to 4 GB DDR2 SDRAM wECC 2x GbE

RSC No 33447

GE Fanuc Intelligent Platforms Incwwwgefanucembeddedcom

Single Board ComputersGD Canada designs and manufactures conduction-cooled Single Board Computers (SBCs)using Intel processors bull 6U and 3U form factors for CompactPCI backplanes bull Fully backward compatible with earlier models bull Upgradeable via the change-out of processor memory andIO modules bull Used within GD Canada computer systems and sold as individual products

RSC No 35281

General Dynamicswwwgdcanadacom

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PrOduCT GuIdE6U CompactPCI

cPCI6U-24DSI32R32-channel 24-bit delta-sigma CompactPCI 6U analog input board with rear IO bull Low noise 24-bit resolution low phase distortion andmulti-board synchronization bull Suits state-of-the-art sonar and noise monitoring applications bull 32-channel cPCI6U-24DSI32 analog input boardprovides a high-density 24-bit analog input resources on a standard 6U CompactPCI expansion board bull Applications from precision voltagemeasurements to complex audio signal and waveform analysis

RSC No 34985

General Standards Corporationwwwgeneralstandardscom

Duet 3U 64-bit 1 GHz TMS320C6416 DSP (x2) 64 MB SDRAM per processor bull Flexible internalexternalcommunication mesh bull 64-bit66 MHz CompactPCI bull PMCXMC site with Jn4 to FPGA and4 RocketIO per VITA 42 bull External data port up to 12 Gbps bull 4M or 5M Virtex-II Pro FPGAbull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM dedicated800 MBps links between DSPs bull 3U CompactPCI with PXI support bull Suits high-end co-processing wireless broadband communications RADAR video and biometrics

RSC No 32856

QuadiaQuad-DSP bull Dual FPGA bull Dual PMC sites bull Inter-processor connectivity and access to external interfaces bull Four C6416 DSPs split in two independent clusters each hosting a PMC site bull One large FPGA for end-user code bull Central FPGA routing interprocessor communication bull End-user FPGA communication bull External port serial IO for PCIe or other p ivate link bull Global memoryand PCI interface bull 1 GHz TMS320C6416 DSP (x4) bull 64 MB SDRAM per processor bull Flexible internalexternal communication mesh bull 64-bit66 MHz CompactPCI bull Two PMC sites with Jn4 to FPGA bull External data port up to 12 Gbps bull Two 4M Gate FPGA reserved for end-user code bull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM bull Up to 512 MB Global DDR SDRAM bull Suits high-end co-processing wireless and broadband communications

RSC No 34737

Quixote 64-bit 6UAdvanced signal capture generation and co-processing bull 1 GHz TMS320C6416 DSP and2 to 6 MGATE Virtex-II FPGA bull 32 MB SDRAM 8 MB ZBT SBSRAM and AD6645 and AD9764 converters bull 6432 bit CompactPCI 66 MHz 5 V33 V and complex trigger modes with HW event logging bull PMC site with Jn4 to FPGA DIO and PICMG 217 StarFabric compliant bull Suits Software Defined Radio wireless IP and RADAR development and hardware testing bull Physical Layer field testing ultra-fast flexible data acquisition vector signal generation and electronic warfare

RSC No 32861

Innovative Integrationwwwinnovative-dspcom

IC-e6-cPCIbHigh performance 6U CompactPCI board bull Powered by one or two of Freescalersquos mostadvanced 14 GHz MPC7448 PowerPC processors bull PICMG 216 compliant bull Marvell Discovery III chipset (MV64460) bull Low power consumption bull Standard extended and rugged grades

RSC No 32982

Interface Conceptwwwinterfaceconceptcom

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PrOduCT GuIdE6U CompactPCI

CP213Single-width 6U CompactPCIPXI module with either 32 or 64 differential analog input channelsbull 32 64 or 128 channels of analog input bull 16 multifunction digital IO (TTL) channels that may beconfigured as digital in digital out or selectively attached to 2 frequency in 2 counter in andor 2 timerout channels bull 16-bit resolution bull Programmable gain per channel programmable scan rates of lt1 Ss through 100 KSs bull Precision onboard reference for end-to-end calibration

RSC No 34804

KineticSystems Company LLCwwwkscorpcom

CP6001Energy efficient embedded Intel dual core processors bull 12 GHz Intel Core Duo U2500 ULV processor bull Intel Core 2 Duo L7400 LV processor bull Based on the Intel Mobile 945GM chipset with a front side bus of up to 667 MHz and ICH7-R Southbridge bull Two independent digital video outputs to the rear IO (2x DVI - 1x DVI and 1x HDMI) bull AC97 audio capabilities bull 3 x GbE bull 4 x SATA with RAID 01510 functionality bull 6 x USB 20 2 x COM and VGA or DVI bull Can also accommodate a PMC slot or an onboard 25 inch SATA HDD bull Up to 8 GB of USB or 2 GB soldered flash bull Supports Linux Windows XP XP embedded and VxWorks 6

RSC No 34182

CP6923 GbE Switch6U CompactPCI GbE Switch PICMG 216 compliant bull Leading edge te hnology basedon BCM5650X chip bull 24x GbE ports bull Non-blocking Layer 2 and 3 switching and routingbull Copper optical rear IO version bull Hot swap IPMI bull Fully managed bull Comprehensive firmware package bull Applies to VoIP installations such as call servers media gatewaysand trunking gateways in wireline and wireless networks as well as VoIP systems inenterprise networks with high demands on performance

RSC No 32256

Kontronwwwkontroncom

TMS320C6701 Virtex-IITexas Instrumentsrsquo C6701 DSP bull Xilinx Virtex-II series FPGA up to XC2V8000 bull Multiple IO interfaces Onboard CODEC VIM expansion sites 60-pin GPIO header and JTAG bull Hardware drivers integration in SimulinkXilinx System Generator Blocksets for quick implementation of Simulink models bull DSP and FPGA-in-the-loop cosimulation of SimulinkXilinx System Generator models bull Leading edge communication interface allowing real-time datamonitoring from Simulink scopes and remote operations

RSC No 32028

VHS-DACHigh performance multichannel DA for phased array antenna systems radarsonar communications receiversup-sampling to IF stage and RFIF AGC apps bull Eight 125 MSPS output channels bull Optional add-on daughter boardprovides 8 additional output channels or 8 additional input channels bull 32-bit 25 MHz bull FPDP interface with 400 MBps transfer rate (25 MSPS per channel at 8 channels 125 MSPS at 16 channels) bull Low level hardware drivers API andGUI bull High level hardware drivers integration in Simulink Blocksets bull Leading edge communication interface fordata recording and playback tofrom the onboard SDRAM

RSC No 32029

Lyrtechwwwlyrtechcom

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PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

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PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

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PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

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PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

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PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

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SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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Page 33: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

PrOduCT GuIdE6U CompactPCI

cCIBPMC6U-ETA 6U bridged dual PMC carrier that bridges extended temperature CompactPCI boards and PMCs bull Features a rugged CompactPCI form factor providing increased flexibility to military communications systems designers bull Provides additional design choices to users through its differing bus speeds maximizing the numberof PMCs that can be used CompactPCI andPMC buses can both run at 66 or 33 MHzbull Operating temperature range of -40 degC to+85 degC bull Signal conditioning bull DMA supportbull Low-power design +5 V +33 V +12 V -12 V bull User-selectable VIO of 33 V or 5 V to the PMC

RSC No 32891

Dynamic Engineeringwwwdynengcom

cPCI4IP-MMMinimized PCI address footprint IndustryPack carrier for CompactPCI applications bull 6U 4HP4 IP positions 832 clock selection for each slot fused filtered power IO options bull ID INT IO and Mem spaces are decoded for each IP slotbull Single and double wide IPrsquos bull 16- and 32- bit IPs bull 32-bit access to 16-bit IPs bull Full or mini-mized Memory Space decoding for 18 the PCI address requirement bull With the cPCI4IP-MM option 8 CompactPCI 4IP cards take the same PCI address space as 1 full Mem Space card

RSC No 34905

ACQ132CPCI32 channel MHz class simultaneous sampling intelligent digitizer bull 32 simultaneous analoginput channels 2-32 MSpschannel 14-bit resolution bull Differential inputs bull Intelligent cardwith 1 gigabyte memory and GbE on board bull Large distributed FPGA resource on boardbull Range of DSP functions including FIR filtering and Digital Downconverter

RSC No 35482

D-TACQ Solutions Ltdwwwd-tacqcouk

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PrOduCT GuIdE6U CompactPCI

CR11Based on the Intel Core Duo Processor the platform is designed to support processor speeds from 106 GHz up to 20 GHz bull Intel Core 2 Duo runs at 15 GHz up to 20 GHz bull Conduction cooled bull Two PMC slots bull PCI Express bull 2x GbE

RSC No 33156

ICS-72532-channel 6U CompactPCI DAC board bull 6U CompactPCI data acquisition card bull 32 differential output channels bull 16 or 24-bit sample size bull 288 kHzch data rate bull Simultaneous sampling across all channels on single or multiple boards bull 32 separate delta-sigma DACs bull 64-bit 66 MHz CompactPCI PICMG 20 Rev30 hot-swappable bull FPDP II 400 MBps interface

RSC No 33576

ICS-71032-channel 6U CompactPCI ADC board bull 6U CompactPCI data acquisition card bull 32 differential input channels bull 216 KHzch 24-bit resolution bull Software selectable full scale input bull FPDP II 400 MBpsinterface bull 64-bit 66 MHz CompactPCI PICMG 20 Rev 30 hot swappable bull 32 synchronous boards for simultaneous sampling bull Sonar acoustics and test and measurement applications

RSC No 33578

Tsumani 6U CPCI Development KitFPGA processor solution targeted at high performance software defined radio applications bull Dual Stratix EP1S80 FPGAs are tightly coupled to provide apower platform for signal processing bull Two PMC module sites provide IO connectivity to either front panel or back panel connections bull A direct highbandwidth 1 GBps path from the PMC P4 connector directly to the FPGAs bull Model 919 Dual DAC Mezzanine provides broadband analog signal generationin a compact form bull The board features two independent DAC channels each with its own 12-bit LVDS input capable of running at rates up to 160 MHz

RSC No 32026

CP11Rugged 6U SBC bull Up to 4 GB of DDR2 SDRAM (200 MHz) with enhanced ECC four independent onboard PCI buses system host and peripheral modesupport for the CompactPCI backplane two PMC interfaces (64-bit133 MHz and 32-bit33 MHz) bull Instead of the PMC1 a PCI Express based XMC interface is available on request bull Two GbE one Fast Ethernet two serial interfaces (RS-232 or RS-422485) USB 20 integrated HDD or flash drive bull High performance 2D3D ATI video controller capable of driving two displays in parallel supports VGADVI interface bull Intel Core 2 Duo at 216 GHz Intel Core Duo at 20 GHz2x PMC expansion site bull One XMC optional bull Up to 4 GB DDR2 SDRAM wECC 2x GbE

RSC No 33447

GE Fanuc Intelligent Platforms Incwwwgefanucembeddedcom

Single Board ComputersGD Canada designs and manufactures conduction-cooled Single Board Computers (SBCs)using Intel processors bull 6U and 3U form factors for CompactPCI backplanes bull Fully backward compatible with earlier models bull Upgradeable via the change-out of processor memory andIO modules bull Used within GD Canada computer systems and sold as individual products

RSC No 35281

General Dynamicswwwgdcanadacom

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PrOduCT GuIdE6U CompactPCI

cPCI6U-24DSI32R32-channel 24-bit delta-sigma CompactPCI 6U analog input board with rear IO bull Low noise 24-bit resolution low phase distortion andmulti-board synchronization bull Suits state-of-the-art sonar and noise monitoring applications bull 32-channel cPCI6U-24DSI32 analog input boardprovides a high-density 24-bit analog input resources on a standard 6U CompactPCI expansion board bull Applications from precision voltagemeasurements to complex audio signal and waveform analysis

RSC No 34985

General Standards Corporationwwwgeneralstandardscom

Duet 3U 64-bit 1 GHz TMS320C6416 DSP (x2) 64 MB SDRAM per processor bull Flexible internalexternalcommunication mesh bull 64-bit66 MHz CompactPCI bull PMCXMC site with Jn4 to FPGA and4 RocketIO per VITA 42 bull External data port up to 12 Gbps bull 4M or 5M Virtex-II Pro FPGAbull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM dedicated800 MBps links between DSPs bull 3U CompactPCI with PXI support bull Suits high-end co-processing wireless broadband communications RADAR video and biometrics

RSC No 32856

QuadiaQuad-DSP bull Dual FPGA bull Dual PMC sites bull Inter-processor connectivity and access to external interfaces bull Four C6416 DSPs split in two independent clusters each hosting a PMC site bull One large FPGA for end-user code bull Central FPGA routing interprocessor communication bull End-user FPGA communication bull External port serial IO for PCIe or other p ivate link bull Global memoryand PCI interface bull 1 GHz TMS320C6416 DSP (x4) bull 64 MB SDRAM per processor bull Flexible internalexternal communication mesh bull 64-bit66 MHz CompactPCI bull Two PMC sites with Jn4 to FPGA bull External data port up to 12 Gbps bull Two 4M Gate FPGA reserved for end-user code bull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM bull Up to 512 MB Global DDR SDRAM bull Suits high-end co-processing wireless and broadband communications

RSC No 34737

Quixote 64-bit 6UAdvanced signal capture generation and co-processing bull 1 GHz TMS320C6416 DSP and2 to 6 MGATE Virtex-II FPGA bull 32 MB SDRAM 8 MB ZBT SBSRAM and AD6645 and AD9764 converters bull 6432 bit CompactPCI 66 MHz 5 V33 V and complex trigger modes with HW event logging bull PMC site with Jn4 to FPGA DIO and PICMG 217 StarFabric compliant bull Suits Software Defined Radio wireless IP and RADAR development and hardware testing bull Physical Layer field testing ultra-fast flexible data acquisition vector signal generation and electronic warfare

RSC No 32861

Innovative Integrationwwwinnovative-dspcom

IC-e6-cPCIbHigh performance 6U CompactPCI board bull Powered by one or two of Freescalersquos mostadvanced 14 GHz MPC7448 PowerPC processors bull PICMG 216 compliant bull Marvell Discovery III chipset (MV64460) bull Low power consumption bull Standard extended and rugged grades

RSC No 32982

Interface Conceptwwwinterfaceconceptcom

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PrOduCT GuIdE6U CompactPCI

CP213Single-width 6U CompactPCIPXI module with either 32 or 64 differential analog input channelsbull 32 64 or 128 channels of analog input bull 16 multifunction digital IO (TTL) channels that may beconfigured as digital in digital out or selectively attached to 2 frequency in 2 counter in andor 2 timerout channels bull 16-bit resolution bull Programmable gain per channel programmable scan rates of lt1 Ss through 100 KSs bull Precision onboard reference for end-to-end calibration

RSC No 34804

KineticSystems Company LLCwwwkscorpcom

CP6001Energy efficient embedded Intel dual core processors bull 12 GHz Intel Core Duo U2500 ULV processor bull Intel Core 2 Duo L7400 LV processor bull Based on the Intel Mobile 945GM chipset with a front side bus of up to 667 MHz and ICH7-R Southbridge bull Two independent digital video outputs to the rear IO (2x DVI - 1x DVI and 1x HDMI) bull AC97 audio capabilities bull 3 x GbE bull 4 x SATA with RAID 01510 functionality bull 6 x USB 20 2 x COM and VGA or DVI bull Can also accommodate a PMC slot or an onboard 25 inch SATA HDD bull Up to 8 GB of USB or 2 GB soldered flash bull Supports Linux Windows XP XP embedded and VxWorks 6

RSC No 34182

CP6923 GbE Switch6U CompactPCI GbE Switch PICMG 216 compliant bull Leading edge te hnology basedon BCM5650X chip bull 24x GbE ports bull Non-blocking Layer 2 and 3 switching and routingbull Copper optical rear IO version bull Hot swap IPMI bull Fully managed bull Comprehensive firmware package bull Applies to VoIP installations such as call servers media gatewaysand trunking gateways in wireline and wireless networks as well as VoIP systems inenterprise networks with high demands on performance

RSC No 32256

Kontronwwwkontroncom

TMS320C6701 Virtex-IITexas Instrumentsrsquo C6701 DSP bull Xilinx Virtex-II series FPGA up to XC2V8000 bull Multiple IO interfaces Onboard CODEC VIM expansion sites 60-pin GPIO header and JTAG bull Hardware drivers integration in SimulinkXilinx System Generator Blocksets for quick implementation of Simulink models bull DSP and FPGA-in-the-loop cosimulation of SimulinkXilinx System Generator models bull Leading edge communication interface allowing real-time datamonitoring from Simulink scopes and remote operations

RSC No 32028

VHS-DACHigh performance multichannel DA for phased array antenna systems radarsonar communications receiversup-sampling to IF stage and RFIF AGC apps bull Eight 125 MSPS output channels bull Optional add-on daughter boardprovides 8 additional output channels or 8 additional input channels bull 32-bit 25 MHz bull FPDP interface with 400 MBps transfer rate (25 MSPS per channel at 8 channels 125 MSPS at 16 channels) bull Low level hardware drivers API andGUI bull High level hardware drivers integration in Simulink Blocksets bull Leading edge communication interface fordata recording and playback tofrom the onboard SDRAM

RSC No 32029

Lyrtechwwwlyrtechcom

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PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

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PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

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PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

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PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

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PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

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SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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Page 34: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

PrOduCT GuIdE6U CompactPCI

CR11Based on the Intel Core Duo Processor the platform is designed to support processor speeds from 106 GHz up to 20 GHz bull Intel Core 2 Duo runs at 15 GHz up to 20 GHz bull Conduction cooled bull Two PMC slots bull PCI Express bull 2x GbE

RSC No 33156

ICS-72532-channel 6U CompactPCI DAC board bull 6U CompactPCI data acquisition card bull 32 differential output channels bull 16 or 24-bit sample size bull 288 kHzch data rate bull Simultaneous sampling across all channels on single or multiple boards bull 32 separate delta-sigma DACs bull 64-bit 66 MHz CompactPCI PICMG 20 Rev30 hot-swappable bull FPDP II 400 MBps interface

RSC No 33576

ICS-71032-channel 6U CompactPCI ADC board bull 6U CompactPCI data acquisition card bull 32 differential input channels bull 216 KHzch 24-bit resolution bull Software selectable full scale input bull FPDP II 400 MBpsinterface bull 64-bit 66 MHz CompactPCI PICMG 20 Rev 30 hot swappable bull 32 synchronous boards for simultaneous sampling bull Sonar acoustics and test and measurement applications

RSC No 33578

Tsumani 6U CPCI Development KitFPGA processor solution targeted at high performance software defined radio applications bull Dual Stratix EP1S80 FPGAs are tightly coupled to provide apower platform for signal processing bull Two PMC module sites provide IO connectivity to either front panel or back panel connections bull A direct highbandwidth 1 GBps path from the PMC P4 connector directly to the FPGAs bull Model 919 Dual DAC Mezzanine provides broadband analog signal generationin a compact form bull The board features two independent DAC channels each with its own 12-bit LVDS input capable of running at rates up to 160 MHz

RSC No 32026

CP11Rugged 6U SBC bull Up to 4 GB of DDR2 SDRAM (200 MHz) with enhanced ECC four independent onboard PCI buses system host and peripheral modesupport for the CompactPCI backplane two PMC interfaces (64-bit133 MHz and 32-bit33 MHz) bull Instead of the PMC1 a PCI Express based XMC interface is available on request bull Two GbE one Fast Ethernet two serial interfaces (RS-232 or RS-422485) USB 20 integrated HDD or flash drive bull High performance 2D3D ATI video controller capable of driving two displays in parallel supports VGADVI interface bull Intel Core 2 Duo at 216 GHz Intel Core Duo at 20 GHz2x PMC expansion site bull One XMC optional bull Up to 4 GB DDR2 SDRAM wECC 2x GbE

RSC No 33447

GE Fanuc Intelligent Platforms Incwwwgefanucembeddedcom

Single Board ComputersGD Canada designs and manufactures conduction-cooled Single Board Computers (SBCs)using Intel processors bull 6U and 3U form factors for CompactPCI backplanes bull Fully backward compatible with earlier models bull Upgradeable via the change-out of processor memory andIO modules bull Used within GD Canada computer systems and sold as individual products

RSC No 35281

General Dynamicswwwgdcanadacom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cPCI6U-24DSI32R32-channel 24-bit delta-sigma CompactPCI 6U analog input board with rear IO bull Low noise 24-bit resolution low phase distortion andmulti-board synchronization bull Suits state-of-the-art sonar and noise monitoring applications bull 32-channel cPCI6U-24DSI32 analog input boardprovides a high-density 24-bit analog input resources on a standard 6U CompactPCI expansion board bull Applications from precision voltagemeasurements to complex audio signal and waveform analysis

RSC No 34985

General Standards Corporationwwwgeneralstandardscom

Duet 3U 64-bit 1 GHz TMS320C6416 DSP (x2) 64 MB SDRAM per processor bull Flexible internalexternalcommunication mesh bull 64-bit66 MHz CompactPCI bull PMCXMC site with Jn4 to FPGA and4 RocketIO per VITA 42 bull External data port up to 12 Gbps bull 4M or 5M Virtex-II Pro FPGAbull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM dedicated800 MBps links between DSPs bull 3U CompactPCI with PXI support bull Suits high-end co-processing wireless broadband communications RADAR video and biometrics

RSC No 32856

QuadiaQuad-DSP bull Dual FPGA bull Dual PMC sites bull Inter-processor connectivity and access to external interfaces bull Four C6416 DSPs split in two independent clusters each hosting a PMC site bull One large FPGA for end-user code bull Central FPGA routing interprocessor communication bull End-user FPGA communication bull External port serial IO for PCIe or other p ivate link bull Global memoryand PCI interface bull 1 GHz TMS320C6416 DSP (x4) bull 64 MB SDRAM per processor bull Flexible internalexternal communication mesh bull 64-bit66 MHz CompactPCI bull Two PMC sites with Jn4 to FPGA bull External data port up to 12 Gbps bull Two 4M Gate FPGA reserved for end-user code bull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM bull Up to 512 MB Global DDR SDRAM bull Suits high-end co-processing wireless and broadband communications

RSC No 34737

Quixote 64-bit 6UAdvanced signal capture generation and co-processing bull 1 GHz TMS320C6416 DSP and2 to 6 MGATE Virtex-II FPGA bull 32 MB SDRAM 8 MB ZBT SBSRAM and AD6645 and AD9764 converters bull 6432 bit CompactPCI 66 MHz 5 V33 V and complex trigger modes with HW event logging bull PMC site with Jn4 to FPGA DIO and PICMG 217 StarFabric compliant bull Suits Software Defined Radio wireless IP and RADAR development and hardware testing bull Physical Layer field testing ultra-fast flexible data acquisition vector signal generation and electronic warfare

RSC No 32861

Innovative Integrationwwwinnovative-dspcom

IC-e6-cPCIbHigh performance 6U CompactPCI board bull Powered by one or two of Freescalersquos mostadvanced 14 GHz MPC7448 PowerPC processors bull PICMG 216 compliant bull Marvell Discovery III chipset (MV64460) bull Low power consumption bull Standard extended and rugged grades

RSC No 32982

Interface Conceptwwwinterfaceconceptcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CP213Single-width 6U CompactPCIPXI module with either 32 or 64 differential analog input channelsbull 32 64 or 128 channels of analog input bull 16 multifunction digital IO (TTL) channels that may beconfigured as digital in digital out or selectively attached to 2 frequency in 2 counter in andor 2 timerout channels bull 16-bit resolution bull Programmable gain per channel programmable scan rates of lt1 Ss through 100 KSs bull Precision onboard reference for end-to-end calibration

RSC No 34804

KineticSystems Company LLCwwwkscorpcom

CP6001Energy efficient embedded Intel dual core processors bull 12 GHz Intel Core Duo U2500 ULV processor bull Intel Core 2 Duo L7400 LV processor bull Based on the Intel Mobile 945GM chipset with a front side bus of up to 667 MHz and ICH7-R Southbridge bull Two independent digital video outputs to the rear IO (2x DVI - 1x DVI and 1x HDMI) bull AC97 audio capabilities bull 3 x GbE bull 4 x SATA with RAID 01510 functionality bull 6 x USB 20 2 x COM and VGA or DVI bull Can also accommodate a PMC slot or an onboard 25 inch SATA HDD bull Up to 8 GB of USB or 2 GB soldered flash bull Supports Linux Windows XP XP embedded and VxWorks 6

RSC No 34182

CP6923 GbE Switch6U CompactPCI GbE Switch PICMG 216 compliant bull Leading edge te hnology basedon BCM5650X chip bull 24x GbE ports bull Non-blocking Layer 2 and 3 switching and routingbull Copper optical rear IO version bull Hot swap IPMI bull Fully managed bull Comprehensive firmware package bull Applies to VoIP installations such as call servers media gatewaysand trunking gateways in wireline and wireless networks as well as VoIP systems inenterprise networks with high demands on performance

RSC No 32256

Kontronwwwkontroncom

TMS320C6701 Virtex-IITexas Instrumentsrsquo C6701 DSP bull Xilinx Virtex-II series FPGA up to XC2V8000 bull Multiple IO interfaces Onboard CODEC VIM expansion sites 60-pin GPIO header and JTAG bull Hardware drivers integration in SimulinkXilinx System Generator Blocksets for quick implementation of Simulink models bull DSP and FPGA-in-the-loop cosimulation of SimulinkXilinx System Generator models bull Leading edge communication interface allowing real-time datamonitoring from Simulink scopes and remote operations

RSC No 32028

VHS-DACHigh performance multichannel DA for phased array antenna systems radarsonar communications receiversup-sampling to IF stage and RFIF AGC apps bull Eight 125 MSPS output channels bull Optional add-on daughter boardprovides 8 additional output channels or 8 additional input channels bull 32-bit 25 MHz bull FPDP interface with 400 MBps transfer rate (25 MSPS per channel at 8 channels 125 MSPS at 16 channels) bull Low level hardware drivers API andGUI bull High level hardware drivers integration in Simulink Blocksets bull Leading edge communication interface fordata recording and playback tofrom the onboard SDRAM

RSC No 32029

Lyrtechwwwlyrtechcom

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PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

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PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

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PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

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PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

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PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

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SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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Page 35: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

PrOduCT GuIdE6U CompactPCI

cPCI6U-24DSI32R32-channel 24-bit delta-sigma CompactPCI 6U analog input board with rear IO bull Low noise 24-bit resolution low phase distortion andmulti-board synchronization bull Suits state-of-the-art sonar and noise monitoring applications bull 32-channel cPCI6U-24DSI32 analog input boardprovides a high-density 24-bit analog input resources on a standard 6U CompactPCI expansion board bull Applications from precision voltagemeasurements to complex audio signal and waveform analysis

RSC No 34985

General Standards Corporationwwwgeneralstandardscom

Duet 3U 64-bit 1 GHz TMS320C6416 DSP (x2) 64 MB SDRAM per processor bull Flexible internalexternalcommunication mesh bull 64-bit66 MHz CompactPCI bull PMCXMC site with Jn4 to FPGA and4 RocketIO per VITA 42 bull External data port up to 12 Gbps bull 4M or 5M Virtex-II Pro FPGAbull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM dedicated800 MBps links between DSPs bull 3U CompactPCI with PXI support bull Suits high-end co-processing wireless broadband communications RADAR video and biometrics

RSC No 32856

QuadiaQuad-DSP bull Dual FPGA bull Dual PMC sites bull Inter-processor connectivity and access to external interfaces bull Four C6416 DSPs split in two independent clusters each hosting a PMC site bull One large FPGA for end-user code bull Central FPGA routing interprocessor communication bull End-user FPGA communication bull External port serial IO for PCIe or other p ivate link bull Global memoryand PCI interface bull 1 GHz TMS320C6416 DSP (x4) bull 64 MB SDRAM per processor bull Flexible internalexternal communication mesh bull 64-bit66 MHz CompactPCI bull Two PMC sites with Jn4 to FPGA bull External data port up to 12 Gbps bull Two 4M Gate FPGA reserved for end-user code bull Up to two 2 MB private DDR SBSRAM bull Up to two 128 MB private DDR SDRAM bull Up to 512 MB Global DDR SDRAM bull Suits high-end co-processing wireless and broadband communications

RSC No 34737

Quixote 64-bit 6UAdvanced signal capture generation and co-processing bull 1 GHz TMS320C6416 DSP and2 to 6 MGATE Virtex-II FPGA bull 32 MB SDRAM 8 MB ZBT SBSRAM and AD6645 and AD9764 converters bull 6432 bit CompactPCI 66 MHz 5 V33 V and complex trigger modes with HW event logging bull PMC site with Jn4 to FPGA DIO and PICMG 217 StarFabric compliant bull Suits Software Defined Radio wireless IP and RADAR development and hardware testing bull Physical Layer field testing ultra-fast flexible data acquisition vector signal generation and electronic warfare

RSC No 32861

Innovative Integrationwwwinnovative-dspcom

IC-e6-cPCIbHigh performance 6U CompactPCI board bull Powered by one or two of Freescalersquos mostadvanced 14 GHz MPC7448 PowerPC processors bull PICMG 216 compliant bull Marvell Discovery III chipset (MV64460) bull Low power consumption bull Standard extended and rugged grades

RSC No 32982

Interface Conceptwwwinterfaceconceptcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

CP213Single-width 6U CompactPCIPXI module with either 32 or 64 differential analog input channelsbull 32 64 or 128 channels of analog input bull 16 multifunction digital IO (TTL) channels that may beconfigured as digital in digital out or selectively attached to 2 frequency in 2 counter in andor 2 timerout channels bull 16-bit resolution bull Programmable gain per channel programmable scan rates of lt1 Ss through 100 KSs bull Precision onboard reference for end-to-end calibration

RSC No 34804

KineticSystems Company LLCwwwkscorpcom

CP6001Energy efficient embedded Intel dual core processors bull 12 GHz Intel Core Duo U2500 ULV processor bull Intel Core 2 Duo L7400 LV processor bull Based on the Intel Mobile 945GM chipset with a front side bus of up to 667 MHz and ICH7-R Southbridge bull Two independent digital video outputs to the rear IO (2x DVI - 1x DVI and 1x HDMI) bull AC97 audio capabilities bull 3 x GbE bull 4 x SATA with RAID 01510 functionality bull 6 x USB 20 2 x COM and VGA or DVI bull Can also accommodate a PMC slot or an onboard 25 inch SATA HDD bull Up to 8 GB of USB or 2 GB soldered flash bull Supports Linux Windows XP XP embedded and VxWorks 6

RSC No 34182

CP6923 GbE Switch6U CompactPCI GbE Switch PICMG 216 compliant bull Leading edge te hnology basedon BCM5650X chip bull 24x GbE ports bull Non-blocking Layer 2 and 3 switching and routingbull Copper optical rear IO version bull Hot swap IPMI bull Fully managed bull Comprehensive firmware package bull Applies to VoIP installations such as call servers media gatewaysand trunking gateways in wireline and wireless networks as well as VoIP systems inenterprise networks with high demands on performance

RSC No 32256

Kontronwwwkontroncom

TMS320C6701 Virtex-IITexas Instrumentsrsquo C6701 DSP bull Xilinx Virtex-II series FPGA up to XC2V8000 bull Multiple IO interfaces Onboard CODEC VIM expansion sites 60-pin GPIO header and JTAG bull Hardware drivers integration in SimulinkXilinx System Generator Blocksets for quick implementation of Simulink models bull DSP and FPGA-in-the-loop cosimulation of SimulinkXilinx System Generator models bull Leading edge communication interface allowing real-time datamonitoring from Simulink scopes and remote operations

RSC No 32028

VHS-DACHigh performance multichannel DA for phased array antenna systems radarsonar communications receiversup-sampling to IF stage and RFIF AGC apps bull Eight 125 MSPS output channels bull Optional add-on daughter boardprovides 8 additional output channels or 8 additional input channels bull 32-bit 25 MHz bull FPDP interface with 400 MBps transfer rate (25 MSPS per channel at 8 channels 125 MSPS at 16 channels) bull Low level hardware drivers API andGUI bull High level hardware drivers integration in Simulink Blocksets bull Leading edge communication interface fordata recording and playback tofrom the onboard SDRAM

RSC No 32029

Lyrtechwwwlyrtechcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

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PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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Page 36: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

PrOduCT GuIdE6U CompactPCI

CP213Single-width 6U CompactPCIPXI module with either 32 or 64 differential analog input channelsbull 32 64 or 128 channels of analog input bull 16 multifunction digital IO (TTL) channels that may beconfigured as digital in digital out or selectively attached to 2 frequency in 2 counter in andor 2 timerout channels bull 16-bit resolution bull Programmable gain per channel programmable scan rates of lt1 Ss through 100 KSs bull Precision onboard reference for end-to-end calibration

RSC No 34804

KineticSystems Company LLCwwwkscorpcom

CP6001Energy efficient embedded Intel dual core processors bull 12 GHz Intel Core Duo U2500 ULV processor bull Intel Core 2 Duo L7400 LV processor bull Based on the Intel Mobile 945GM chipset with a front side bus of up to 667 MHz and ICH7-R Southbridge bull Two independent digital video outputs to the rear IO (2x DVI - 1x DVI and 1x HDMI) bull AC97 audio capabilities bull 3 x GbE bull 4 x SATA with RAID 01510 functionality bull 6 x USB 20 2 x COM and VGA or DVI bull Can also accommodate a PMC slot or an onboard 25 inch SATA HDD bull Up to 8 GB of USB or 2 GB soldered flash bull Supports Linux Windows XP XP embedded and VxWorks 6

RSC No 34182

CP6923 GbE Switch6U CompactPCI GbE Switch PICMG 216 compliant bull Leading edge te hnology basedon BCM5650X chip bull 24x GbE ports bull Non-blocking Layer 2 and 3 switching and routingbull Copper optical rear IO version bull Hot swap IPMI bull Fully managed bull Comprehensive firmware package bull Applies to VoIP installations such as call servers media gatewaysand trunking gateways in wireline and wireless networks as well as VoIP systems inenterprise networks with high demands on performance

RSC No 32256

Kontronwwwkontroncom

TMS320C6701 Virtex-IITexas Instrumentsrsquo C6701 DSP bull Xilinx Virtex-II series FPGA up to XC2V8000 bull Multiple IO interfaces Onboard CODEC VIM expansion sites 60-pin GPIO header and JTAG bull Hardware drivers integration in SimulinkXilinx System Generator Blocksets for quick implementation of Simulink models bull DSP and FPGA-in-the-loop cosimulation of SimulinkXilinx System Generator models bull Leading edge communication interface allowing real-time datamonitoring from Simulink scopes and remote operations

RSC No 32028

VHS-DACHigh performance multichannel DA for phased array antenna systems radarsonar communications receiversup-sampling to IF stage and RFIF AGC apps bull Eight 125 MSPS output channels bull Optional add-on daughter boardprovides 8 additional output channels or 8 additional input channels bull 32-bit 25 MHz bull FPDP interface with 400 MBps transfer rate (25 MSPS per channel at 8 channels 125 MSPS at 16 channels) bull Low level hardware drivers API andGUI bull High level hardware drivers integration in Simulink Blocksets bull Leading edge communication interface fordata recording and playback tofrom the onboard SDRAM

RSC No 32029

Lyrtechwwwlyrtechcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

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PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

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PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

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SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

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Page 37: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

PrOduCT GuIdE6U CompactPCI

SM QUAD VIRTEX-4Xilinx hybrid architecture ndash high-performance logic bull Four TI TMS320C6416 DSPs for processing powerbull Dual LYRIO+ very-high-speed expansion sites can connect to Lyrtech add-on IO expansion modulesyielding minimum sustained full-duplex raw data exchanges of 12 Gbps 128 MB external SDRAM per DSPand FPGA bull Six 8-Gbps RapidCHANNEL links for full-duplex communications between FPGAs and externalIO interfaces bull 6U CompactPCI form factor bull Stackable to build seamless DSPndashFPGA for very large-scaleprocessing farms bull Supports model-based design flow for the most powerful integrated developmentenvironments on the market

RSC No 33923

Lyrtechwwwlyrtechcom

D7 Server BladeSBC equipped with one or two Intel Xeon dual core processors providing up to four CPUcores with a frequency of 166 GHz and the Intel E7520 server chipset bull Intel dual coreXeon 166 GHz bull 2 or 4 CPU cores on board bull 48HP CompactPCI system or peripheral slot bull PCI 64-bit66 MHz or PCI-X 64-bit133 MHz bull Hot swap PICMG 216 support bull Up to 4 GB DDR2 ECC SDRAM bull Nonvolatile SRAM FRAM bull Up to 1 GB flash-on-disk (NAND) hard diskbull 2 SATA 2 PATA interfaces bull Graphics up to 1280 x 1024 bull 4 GbE (PCIe)

RSC No 33290

MEN Micro Elektronik GmbHwwwmenmicrocom

CCR-100 SBCSingle-slot Pentium M SBC bull 11 14 16 18 or 20 GHz bull Intel 855GME memory controller which supports a 400 MHz processor bus and single-channel unbuffered DDR333 SDRAM with ECC bull An Intel 6300ESB IO controller hub handles the extensive IO capability bull GbE via PICMG 216 bull Intel 855GMEmemory controller hub with built-in 3D graphics engine bull Hot swappable

RSC No 32022

CCR-200 SBCSingle-slot 6U PICMG 216 SBC bull 4-Ch AD 1-Ch DA wVirtex-4 FPGAs 6U CompactPCIbull Complete software radio interface solution bull Eight 125 MHz 14-bit ADs bull Two digitalupconverters bull Two 500 MHz 16-bit DA bull 1536 MB of DDR2 SDRAM bull Xilinx Virtex-4FPGAs bull Up to 20 seconds of delay or data capture at 125 MHz bull Dual timing buses forindependent input and output clock rates bull LVDS clocksync bus for multi-modulesynchronization bull Custom FPGA IO through CompactPCI J3 and J5 connectors

RSC No 32023

Momentum Series CLA-100Single-slot SBC bull UltraSPARC IIi+ processor bull Hot swappable bull Power-on self-test (POST)bull Open Boot firmware bull Solaris operating environment

RSC No 32467

Mercury Computer Systems Incwwwmccom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

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PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

Fo Sin Pnt

wwwcompactpci-systemscomproductsNEw PrOduCTs g

MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

Fo Sin Pnt

wwwcompactpci-systemscomproductsNEw PrOduCTs g

SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

Fo Sin Pnt

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Page 38: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

PrOduCT GuIdE6U CompactPCI

Momentum Series CX6-200Single board computer bull Two Dual-Core Intel Xeon processors ULV at 166 GHz bull 4-way SMP bull Three PCI Expressx8 links with 2 GBps bandwidth each bull Numerous IO interfaces bull 667 MHz front side bus bull Dual DDR2-400 memory interfaces to access up to 4 GB of memory bull Intel E7520 Memory Controller Hub bull Intel 6300ESB IO Controller Hubbull Serial USB and mass storage interfaces bull SVGA video with onboard ATI Rage Mobility M graphics chip

RSC No 31520

Mercury Computer Systems Incwwwmccom

78C2 6U CompactPCI Multifunction CardSingle-slot 6-module multifunction card bull Universal card eliminates the complexity andsize constraints of using multiple independent single-function cards bull Extends the capabilityof the earlier 78C1 bull Can include the functions of SynchroResolver Measurement (4-channels) LVDT Measurement (4-channels) AD(10-channels) DA (10-channels) Function Generator (4-channels) Discrete IO(16-channels) TTL IO (16-channels) Transceiver IO (11-channels) and RTD (6-channels) bull Incorporates an Ethernet interface that can be used to transfer data to and from the boardwithout using the backplane bus

RSC No 33382

North Atlantic Industrieswwwnaiicom

Pentium M CPUPentium M 20 GHz 18 GHz or 16 GHzsystemperipheral CPU board up to 2 GB DRAM 4HP 6U bull Intel E7501 chipset bull PICMG 216 Packet Switching Backplane support bull Optional PICMG 29 (IPMI) and PICMG 21 (Hot Swap) support bull Ability to turn off the CompactPCI bus bull Optional plug-in CompactFlash or Microdrive storage bull Dual Gigabit Ethernet bull Supports up to 2 GB of DDR200266 plug-in memory modules

RSC No 32654

One Stop Systems Incwwwonestopsystemscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

Fo Sin Pnt

wwwcompactpci-systemscomproductsNEw PrOduCTs g

MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

Fo Sin Pnt

wwwcompactpci-systemscomproductsNEw PrOduCTs g

SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

Fo Sin Pnt

Fo Sin Pnt

Fo Sin Pnt

Page 39: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

PrOduCT GuIdE6U CompactPCI

Pentium III CPUPentium III 10 GHz System CPU board bull 6U bull Part number OSS-613-1 bull SDRAM memory up to 1 GB bull Dual 10100BASE-T Ethernet bull 4 MB SVGA video bull Single-slot 4HP form factor bull Supports CompactFlash

RSC No 32655

One Stop Systems Incwwwonestopsystemscom

CPC7510PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX bull CompactPCI host or peripheral controller bull Marvell Discovery II System Controller bull Two 64-bit 66 MHz PMC slots bull Two10100 Ethernet ports bull Hot swaphigh availability

RSC No 33014

CPC7520PowerPC 6U Single Board Computer bull IBM750FX or IBM750GX up to 1 GHz bull CompactPCIhost or peripheral controller bull Marvell Discovery III System Controller bull Two 64-bit 66 MHzPCI-X PMC slots bull Hot swaphigh availability bull Two Front-Panel GbE (101001000) bull TwoPCI-X 66 MHz64-bit PMC slots (PrPMC) bull Standard CompactFlash socket bull Onboard flash

RSC No 33015

Orion Technologies Incwwwotisolutionscom

7142 Multichannel Transceiver Multichannel transceiver PMCXMC module with FPGA bull VITA 420 XMC compatible with switched fabric interfaces bull Four 125 MHz 14-bit ADsbull Optional factory installed IP Core DDC bull One digital upconverter with500 MHz 16-bit DA bull 768 MB of DDR SDRAM bull Dual timingbuses for independent input and output clock ratesbull LVDS clocksync bus for multipleboard synchronization bull 32 pairsof LVDS connections to the Virtex-IIPro FPGA for custom IO on P4bull Ruggedized and conduction-cooled versions availablebull Also available in 3U CompactPCI (Model 7342)6U CompactPCI (Models 7242and 7242D) andPCI (Model 7642)

RSC No 32556

Pentek Incwwwpentekcom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

Fo Sin Pnt

wwwcompactpci-systemscomproductsNEw PrOduCTs g

MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

Fo Sin Pnt

wwwcompactpci-systemscomproductsNEw PrOduCTs g

SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

Fo Sin Pnt

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Fo Sin Pnt

Page 40: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

PrOduCT GuIdE6U CompactPCI

7342 7242DMultichannel Software Radio Transceiver with Virtex-4 FPGAs - 3U6U CompactPCI bull Completesoftware radio interface solutionbull Four or eight 125 MHz 14-bit ADsbull One or two digital upconvertersbull One or two 500 MHz DAsbull 768 or 1536 MB of DDR2 SDRAM bull Two or four Xilinx Virtex-4 FPGAs bull Dual timing buses for independent input and output clock rates bull LVDS clocksync bus for multiboardsynchronization bull Custom FPGA IObull Factory-installed downconverterIP cores available

RSC No 34440

Pentek Incwwwpentekcom

PI-2005Digital pattern generator for serial or parallel data streamsbull Generate clocks addresses data or triggers for semiconductor test and characterization and system integration bull 225 MHz bitrate (NRZ) with precision master clock synthesis external clock input external startstop inputs and I2C bull 16-64 channels in 16-channel increments with TTL LVTTL or 5 V CMOS outputlevels bull (PI-PAT) with simple instruction bull Fast pattern generation with nearly limitless looping depth bull Optional programmabledelay per channel bull Local or remote (GPIB) controlbull ASCII command set bull Complete instrument or as6U CompactPCI cards

RSC No 32191

Pulse Instrumentswwwpulseinstrumentscom

Fo Sin Pnt

PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

Fo Sin Pnt

wwwcompactpci-systemscomproductsNEw PrOduCTs g

MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

Fo Sin Pnt

wwwcompactpci-systemscomproductsNEw PrOduCTs g

SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

Fo Sin Pnt

Fo Sin Pnt

Fo Sin Pnt

Page 41: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

PrOduCT GuIdE6U CompactPCI

cPCI-CAN4 CAN bus channels for 6U CompactPCI systems featuring Philipsrsquo SJA1000 widely used CAN controller on each channel bull Each CAN interface hasa MC68332 microcontroller providing powerful and safe communication on CAN networks bull Host CPU relieved from the stack protocol burdenbull Up to 4 intelligent CAN channels bull 33 V and 5 V PCI interface

RSC No 34464

Saelig Co Incwwwsaeligcom

cPENTXM2Blade SBC bull Intel 167 GHz dual core Xeon with 667 MHz FSB and E7520 server-classmemory controller hub bull Can be equipped with up to 4 GB ECC DDR2-400 SDRAM bull DualGbE ports routed to the backplane compliant with PICMG 216VITA 31 (switched Ethernet)bull Supports PICMG 29VITA 38 IPMI management software bull Two additional GbE ports plustwo USB 20 ports can be routed to the front panel bull Serial ATA SXGA graphics two serialports PS2 and a PMC mezzanine connector

RSC No 32712

Thales Computerswwwthalescomputerscom

2000-6U-EXTM-LFCompactPCI 6U extender card bull Designed for both hardware development andtestmeasurement applications bull Test points for signals bull Power and ground planesbull Fuses protect voltages bull RoHS compliant

RSC No 34765

Twin Industries Incwwwtwinhuntercom

VRM-CD3 VRM-CRBIntel i915 (Sonoma) chipset bull Dual 200-pin SODIMM socket DDR2 533 SDRAM 2 x 1 GB max symmetric dual channel capable bull Ethernet IO Triple 101001000Mbps GbE controller 1 port software switchable (BIOS) between front panel and rear IO access bull Proprietary Expansion Interface Onboard LPCUSBAC97 Super IO USB and audio interface connector suitablemezzanine companion boards bull Quad channel Serial ATA interface bull ICH6 integrated 32-bitPCI bridge 133 MBps CompactPCI master bull Phoenix BIOS bull Drivers Intel Graphics andnetworking bull Typical power requirements +33 V at 017 V-01 V +5 V at 025 V-015 Vbull Operating temperature 0 degC to +60 degC bull Storage temperature -40 degC to +85 degC

RSC No 32719

V Rose Microsystems Incwwwvrosemicrosystemscom

XCPC-9100 CompactPCI Carrier BoardMezzanine carrier board bull Sites for two PMC modules bull PMC sites support PrPMC modesbull 64-bit 3366 MHz up to 512 MBps operation bull Two 101001000Mbps Ethernet portson the front panel using RJ-45s bull Onboard 8-port 101001000Mbps Ethernet switchbull Rear Ethernet ports from PMC modules is routed to on-board switch and provides PICMG 216bull Full hot swap PICMG 21 compliant bull Onboard IPMI controller bull Status LEDs for Power andHot Swap bull PLX Technology PCI-X to PCI-X bridge bull Supports standard (IEEE13861) PMC modules bull PICMG 20 version 30 compliant bull Front or back panel IO supports on both PMC sitesbull 128 IO lines with 16 differential pairs via rear panel J3 J5 CompactPCI connectorsbull 33 V or 5 V PCI signaling for the PMC sites

RSC No 33477

Xembedded IncwwwXembeddedcom

Fo Sin Pnt

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wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

Fo Sin Pnt

wwwcompactpci-systemscomproductsNEw PrOduCTs g

MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

Fo Sin Pnt

wwwcompactpci-systemscomproductsNEw PrOduCTs g

SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

Fo Sin Pnt

Fo Sin Pnt

Fo Sin Pnt

Page 42: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

Fo Sin Pnt

wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

Fo Sin Pnt

wwwcompactpci-systemscomproductsNEw PrOduCTs g

MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

Fo Sin Pnt

wwwcompactpci-systemscomproductsNEw PrOduCTs g

SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

Fo Sin Pnt

Fo Sin Pnt

Fo Sin Pnt

Page 43: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

wwwcompactpci-systemscomproductsNEw PrOduCTs g

AdvancedMCsEmerson Network PowerEmbedded Computingwwwemersonembeddedcomputingcom

g KSI8560 RSC No 35494Advanced Mezzanine Card for telecom infrastructure applications bull Up to eight channelized E1T1 spans bull Carrier-class high-speed protocol and packet processing signaling and WAN access for MicroTCA systems AdvancedTCA blades and custom carrier blades equipped with AdvancedMC sites bull Freescale PowerQUICC III MPC8560 bull Utilizing a PowerPC Book E core running at speeds of up to 1 GHz bull 333 MHz Communications Processor Module (CPM) that integrates an Ethernet controller TDM ports for up to eight T1E1 spans ATM support an I2C controller and a PCIe interconnect bull Up to 256 MB of SDRAM bull 16 MB of persistent memory (PSRAM) bull Eight MB of NOR boot flash (for redundant 4 MB devices) 1 GB of NAND flash for nonvolatile RAM and True Flash File System storage bull Additional 512 KB of socketed flash bull Compact mid-height and full-size AdvancedMC form factors

Extreme Engineering Solutionswwwxes-inccom

g XPedite5140 RSC No 35372Freescale Dual-Core MPC8641D Processor-based AMC Module (AdvancedTCAMicroTCA) with Dual-Bank DDR2 and Quad Gigabit Ethernet bull Freescale MPC8641D processor with dual e600 cores at 10 to 15 GHz each bull Dual-bank DDR2-400533600 SDRAM up to 4 GB (2 GB per bank) bull AMC1 x1x2x4x8 PCI Express at 25 GBauds per lane bull Quad Gigabit Ethernet in-terfaces bull 32-256 MB soldered NOR flash bull 1-4 GB NAND flash bull 1 MB SSRAM bull Dual SATA II over AdvancedMC bull VxWorks BSP bull INTEGRITY BSP bull QNX BSP bull Linux LSP

BlAdeSAstute Networkswwwastutenetworkscom

g Caspian Storage Blade RSC No 3549510 Gigabit iSCSI AdvancedTCA bull Scalable networked storage performance bull 400 MBps bull 40K IOPS per blade bull Single blade high performance RAID solution with four hot swappable drives and RTM for two additional drives bull Carrier class reliability and performance bull Enterprise-class disk drives with RAID functionality for improved system availability bull Hot replacement at the drive level bull Chance for a single point of failure is greatly reduced bull System MTTR is not impacted since the failed drive can be quickly replaced bull True SAN performance bull 200 Wblade bull Additional features via field upgradable SWFW bull Highest storage capacity per blade with 4 enterprise 25 inch small

form factor disk drives bull Multiple blades can be used within an AdvancedTCA shelf bull Multiple configurations RAID 0 1 10 5 50 bull Designed for PICMG 31 NEBS level 3 and ETSI compliance

ChASSiS And enClOSureSCM Computerwwwcmcomputercom

g CM-ATR-253545 RSC No 35283A range of new generation chassis introducing the concept of universal military ATR enclosures capable of accommodating and freely intermixing all standard conduction-cooled and air-cooled Eurocard for-mats bull Suited to critical defense and aerospace systems bull CM-ATR-25 12 ATR - Long5-slot 6U VME64x or CompactPCI 400 or 575 W power supply plusmn 12 VDC 12 A each bull CM-ATR-35 34 ATR ndash Long 7-slot 6U VME 64x or CompactPCI 500 or 775 W power supply plusmn12 VDC 12 A each bull CM-ATR-45 1 ATR long12-slot 6U VME64x or CompactPCI 1050 or 1450 W plusmn12 VDC 20 A each bull All models feature slot-by-slot user con-figured card cage to enable intermixing conduction-cooled IEEE-11012 ANSI-VITA 301 and air-cooled IEC-297IEEE 11011 boards

Vox Technologieswwwvoxtechnologiescom

g VTC529913 RSC No 354916U CompactPCI enclosure bull High quality ruggedized construction CompactPCI backplane bull NEBS compliant bull AC and DC line inputs available bull Supports up to 11 slots total including power IEEE 110110 11 compliant card cage bull Wired for (1) 6U 8HP or (2) 3U 8HP front-access CompactPCI style hot swap power supplies bull Advanced cooling design with option for fan monitoring and LED

develOPMent PlAtfOrMSIXIAwwwixiacomcom

g Optixia XM12 RSC No 35534An ultra-high density highly flexible platform on which an Ixia test system can be built bull Modular chassis bull Common platform a single solution for executing a wide array of data signaling voice video and application testing from Layers 2-7 bull Hot swappable modules interface cards can be actively swapped in and out of the test bed without disrupting ongoing testing bull Extensive interface support 101001000 Ethernet 10 Gigabit Ethernet OC-3c12c ATM OC-3c12c48c192c Packet over SONET (POS) Power over Ethernet (PoE) bull Integrated PC controller running Windows XP Pro for management and control of port configuration and statistics bull High perfor-mance high speed backplane and system controller to support the high bandwidth requirements of large-scale application tests bull Daisy-chaining of up to 256 Ixia chassis in a single test (Optixia X16 Optixia XL10 Optixia XM12 IXIA 1600T IXIA 400T) with syn-chronization accuracy to within 10 nanoseconds

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

Fo Sin Pnt

wwwcompactpci-systemscomproductsNEw PrOduCTs g

MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

Fo Sin Pnt

wwwcompactpci-systemscomproductsNEw PrOduCTs g

SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

Fo Sin Pnt

Fo Sin Pnt

Fo Sin Pnt

Page 44: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

wwwcompactpci-systemscomproductsNEw PrOduCTs g

MicrotCAKontronwwwkontroncom

g OM6040 RSC No 35503Compact and modular MicroTCA platform bull Configured for the design of small compact and highly integrated multiprocessor systems based on either PCIe or GbE packet switching backplane technologies bull Pre-validated solution equipped with either the Kontron AM4010 AdvancedMC processor module or with the optional Kontron AM4100 bull The Kontron AM4010 AdvancedMC processor module is available in an array of LV and ULV Intel Core Duo and Intel Core2 Duo processor options that represent substantial processing power and maximum MIPS per W for both AdvancedTCA and MicroTCA redundant system designs bull Based on the 15 GHz Dual Core Freescale PowerPC MPC8641D the optional Kontron AM4100 deliv-ers up to 23 MIPSMHz computing performance and maximum Ethernet bandwidth bull AM4100 version also supports Serial RapidIO as option to PCI Express bull Chassis 3U high 250 mm deep and 156 mm wide bull AC power supply and

fans with airflow from below the AdvancedMC slots bull Supports one slot for one full-size MicroTCA Controller Hub and 4 slots for full-size AdvancedMCs

PACkAgingELMA Electronicwwwelmacom

g 2nd Generation AdvancedTCA handle RSC No 35526Does not require assembly bull The one-piece handle simply has two screws to attach it to the panelPCB bull Engageddisengaged with a unique slide-motion solution bull Prevents the handle from being accidentally tripped or bumped into and broken bull Slide-motion switch pops the handles open about 30 degrees and activates the micro-switch allowing the user to grab the handle easily and maximize lever-age bull Elma AdvancedTCA handles are one piece greatly reducing assembly time which can be a hidden cost bull The handlersquos alignment pin is also part of the handle mold which makes it much more sturdy increasing drop-test survivability

Fo Sin Pnt

wwwcompactpci-systemscomproductsNEw PrOduCTs g

SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

Fo Sin Pnt

Fo Sin Pnt

Fo Sin Pnt

Page 45: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

wwwcompactpci-systemscomproductsNEw PrOduCTs g

SOftwAre-defined rAdiOSpectrum Signal Processingwwwspectrumsignalcom

g SDR-4000 SWM RSC No 35347Deployable black-side ldquoIF-to-Ethernetrdquo wireless modem for wideband satel-lite communications waveforms bull Designed to support the DVB-SDVB-S2 DVB-RCS and Mobile User Objective System (MUOS) waveforms bull Supports INTELSAT Business Services Waveforms (IESS-309 and IESS-315) and

INMARSAT BGAN bull The SATCOM wireless modem transceiver uses 3U CompactPCI form factor bull IO has dual input 12-bit AD converters and a single output 14-bit DA converter each running at up to 21333 MSPS bull Capturing standard IF frequencies such as 70 MHz 140 MHz and 160 MHz IF with up to 100 MHz of analog IF bandwidth is supported bull Provides high-speed low latency deterministic data paths between the various processing elements bull Comes with data flow examples source code hands-on training and your choice of support packages bull Supports the CRC SCARI implemen-tation of the Software Communications Architecture (SCA) Core Framework bull Forms a key element of a network-centric IP-based satellite communica- tions system providing modem link and network layer processing

Single BOArd COMPuterSOrion Technologies Incwwwotisolutionscom

g CPC7525 RSC No 355291 GHz IBM 750GX or 600 MHz IBM 750FX PowerPC bull 200 MHz 60X Processor Bus (133 MHz Extended temperature models) bull Conduction or air-cooled versions bull Extended Temperature (85 degC measured at the rail) bull Rugged design bull Up to 1 GB of Double Data Rate (DDR) SDRAM with ECC bull 15 W typical power bull Personality Module for flexible J2 IO signaling options bull Three Gigabit Ethernet (101001000) ports bull PCI-X 133 MHz64-bit PMC slot (Processor PMC compliant) bull Optional 128 MB of

onboard user flash bull Two serial ports bull Six GPIO bull Universal 66 MHz CompactPCI bus (PCI-X)

bull Marvell Discovery III System Controller bull Automatically detects whether it is a

System Host or peripheral controller bull Single slot 3U bull Onboard temper-

ature monitoring bull Non-volatile RTC 16 KB user-defined

EEPROM bull U-Boot ROM monitor bull VxWorks

LynxOS and Linux software support

StOrAgeConduant Corporationwwwconduantcom

g Big River DM-425-3U RSC No 35518Provides up to one terabyte of disk storage capacity in a very small enclosure bull Designed for high-speed storage applications bull Configurations are available for both legacy PXI and CompactPCI as well as the new PCI Express based versions bull When ordered with the onboard PCI Express SATA controller the DM-425-3U integrates with major operating systems to provide additional storage capacity in JBOD or software RAID configurations bull When ordered with the external multilane SATA connector the DM-425-3U can be used with the Conduant StreamStor PXI-808 Disk Controller Card for high-speed recording without requiring an external chassis to hold the disk drives bull The storage unit is also available with solid-state disk drives in capacities up to 512 GB bull Requires only 3 open slots (12HP) and is available in 3 different configurations

For more information enter the productrsquos RSC No at wwwcompactpci-systemscomproducts

Fo Sin Pnt

Fo Sin Pnt

Fo Sin Pnt

Page 46: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

Fo Sin Pnt

Fo Sin Pnt

Page 47: CompactPCI and AdvancedTCA Systems - Volume 12 …pdf.cloud.opensystemsmedia.com/emag/CPCI.2008.02.pdf · By. J. o e. P. av l at. CompactPCI and AdvancedTCA Systems CompactPCI and

Fo Sin Pnt