CÄ%M& FK;= ª(ÅÎRÑ *OUSPEVDUJPO...2019/06/25 · Í 'ód eW9 JÖUï&¬##c lI9@dFKUï&¬" 9...
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䏄╍☖䙋㬽 LASER SCRIBING ⊪⣅⋎勑 *OUSPEVDUJPO 搌䤬㭓㦝 .BUFSJBMT 23 24 3K LASER 3K LASER 䏄╍☖䙋㬽僿☛忆ⴊ☋匡勊Ѭ䓱㍵⣑✾〒Ѭ☋⟧揃匜㉶㥸╍䋕Ѭ㧤峇劽ѭ⟳⋨⬫ "VUP$"%Ѭ$PSFM%3"8 ∮ 勜☺⬁㍦╩⠒揥屑⚤盛∔䤬㞫☺捷⋹⎂丏㊒䪈匚掙⢐⏱㤽侄⏂琳⾡㧺㩂揚⚬捰搃ѭ敗ⴊ⠼〛Ѭ$$% 䫕巍僿勣 ⟎䬣乾⠼橎僿勣ѭ Laser scribing machine with small slits, small heat affected zone,slit edge smooth, no cracks. Can be drawn in AutoCAD, CorelDRAW after importing graphics processing; dedicated control software makes editing and modification of the program easy, real-time display show the motion track. Equipped with vacuum琳CCD monitoring system and vacuum adsorption system. 搌䤬⊑❙㩹䱉Ѭⴝ㩹䱉Ѭ歨㩹䱉ⴭ樽唂䤹䁤☖䙋琳檀䣻Ѭ旛☞䯷䪈☋♶琳䱉Ѭ椡Ѭ䰻✚楝⢐❎⍖⯽䙋Ѭ❎ ⍖⩬⋹⢐櫐㘔䤹懷䪈䀫✚檀䣻⯽䙋琯ⶅ檀䣻⯽㮂琰☖䙋盛妉旛ち㸤㮂䪈僂⿉☋♶Ѭ㙗⽗琳4.5 愼䙋㬽㸤㮂䪈☋♶ѭ Applicable to Monocrystalline silicon, polycrystalline silicon, amorphous silicon solar cell dicing, ceramic, dia- mond cutting,Oxide ceramics for silicon, germanium, gallium arsenide and semiconductor substrates, semi- conductor devices and integrated circuits substrate (such as ceramic substrate) dicing; precision cutting and punching of thin metal template, SMT stickers cutting of the tablet template. ㊗䤬屑∛ "QQMJDBUJPO ㊂䃟㊗䤬⊑ⴭ樽唂䤹䁤位屑∛ѭ Widely used in solar cells and other industries. 㐫唂 ⮎⟻ 㬃掛◾⚣䞋 ▻❸㦽㌒ 䏄╍䃦榉 ☖䙋僂㊩ ☖䙋勃⿀ ⎞䤹䤹䊔 1FSGPSNBODFNPEFM .BY0VUQVU QPXFS .BYTDSCJOH TQFFE $PPMJOH 8BWFMFOHUI 4DSJCJOH BDDVSBDZ TDSJCJOH MJOF XJEUI 1PXFS TVQQMZ SK-SCF20 20W NNT 䀸▻ 8BUFS p 揨勱 $POUJOVF 7p琳)[ SK-SCF30 30W SK-SCUV3 3W SK-SCUV5 5W ON 泗▻ 'BO 㬃☖䙋搩㊩ ON 忆ⴊ䙽䒽 'FBUVSF ύ ╍㭢愰旙ⶀ琳䏄╍☖勃⿀㊩勊琳䓱㍵⣑✾〒盛䤹䁤䙋☋♶㦱歬㫷㥸獚琳揃匜㫷㉶㥸╍䋕ѭ ύ ⟳搓敗滢僂㊩ $$% 巍巐⾝⍐僿勣琳滢搩㜳楦☖䙋琳☖䙋搩㊩㏯ѭ ύ ⟳搓敗㦝䫖嗯⚬⌣掛Ѭ䤹䁤䙋嗯⚬∋㦝Ѭ嗯⚬⾝⍐Ѭ嗯⚬☖䙋Ѭ㘔⣅䙋嗯⚬峊䫖位僿勣琳嗯⚬✚丏㊩滢ѭ ύ Good beam quality, small scribing width, small heat affected zone; the cut section of the cell sheet is more neat, and the edge is smoother and smoother. ύ Optional high-precision CCD visual positioning system, high-speed galvanometer dicing, fast dicing speed. 奥 Automatic transfer of optional ingredient boxes, automatic feeding of battery sheets, automatic positioning, automatic dicing, automatic loading of finished tablets Such as the system, High degree of automation.
Transcript of CÄ%M& FK;= ª(ÅÎRÑ *OUSPEVDUJPO...2019/06/25 · Í 'ód eW9 JÖUï&¬##c lI9@dFKUï&¬" 9...
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LASER SCRIBING
23 243K LASER3K LASER
Laser scribing machine with small slits, small heat affected zone,slit edge smooth, no cracks. Can be drawn
in AutoCAD, CorelDRAW after importing graphics processing; dedicated control software makes editing and
modification of the program easy, real-time display show the motion track. Equipped with vacuum CCD
monitoring system and vacuum adsorption system.
Applicable to Monocrystalline silicon, polycrystalline silicon, amorphous silicon solar cell dicing, ceramic, dia-mond cutting,Oxide ceramics for silicon, germanium, gallium arsenide and semiconductor substrates, semi-conductor devices and integrated circuits substrate (such as ceramic substrate) dicing; precision cutting and punching of thin metal template, SMT stickers cutting of the tablet template.
Widely used in solar cells and other industries.
SK-SCF20
20W
SK-SCF30
30W
SK-SCUV3
3W
SK-SCUV5
5W
Good beam quality, small scribing width, small heat affected zone; the cut section of the cell sheet is more
neat, and the edge is smoother and smoother.
Optional high-precision CCD visual positioning system, high-speed galvanometer dicing, fast dicing speed.
Automatic transfer of optional ingredient boxes, automatic feeding of battery sheets, automatic positioning,
automatic dicing, automatic loading of finished tablets Such as the system, High degree of automation.
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