M O R E C A PA B I L I T Y • L E S S CO S T • A D VA N C E D P R O C E S S I N G F O R T H E R E S T O F U S

W E T - P R O C E S S I N G T O O L S F O R T H E S M A L L E R - S U B S T R AT E W O R L D

n For plating, cleaning or etching

n Cassette-to-cassette automation

n Up to 75wph throughput

n 8-chamber process flexibility

n Thin or bonded substrates

n Transparent or opaque substrates

Solstice and Trident are registered trademarks of ClassOne Technology

C l a s s O n e Te c h n o l o g y • 1 0 9 Co o p e ra t i ve Way, K a l i s p e l l , MT 5 9 9 0 1 • + 1 ( 4 0 6 ) 4 0 7 - 7 8 1 4 • i n fo @ C l a s s O n e. co m

Solstice®S8Electroplating Volume ProductionUp to 8 chambersFor 75-200mm substrates

Solstice®LTElectroplating Development SystemUp to 2 ECD chambersFor 75-200mm substrates

Trident®SSTSpray SolventTools2/4/6 Tank ModelsFor 75-300mm substrates

Trident®SRDSpin-Rinse-Dryer ToolsSingle or Double-StackFor 75-300mm substrates

The S8 is the smart, affordable step up

from wet bench to high-performance

plating automation. It can dramatically

increase throughput while boosting

quality, uniformity, reliability and ROI

for a broad range of processes.

With manual wafer load and unload,

the Solstice LT provides for easy, high-

performance process development. It

features automated recipe execution

and the same chambers and controls

as the Model S8, enabling easy scaling.

Utilizing Deluge technology, these

next-generation batch-processing SSTs

deliver a continuous, uniform cascade

of solvent or rinse water without us-

ing spray nozzles, which dramatically

enhances process performance.

These easy-to-use, front-loading SRDs

efficiently and rapidly remove residual

chemicals after wet processing and dry

the substrates completely without leav-

ing water spots.

n For plating, cleaning or etching

n 2 ECD or 1 ECD & 1 prewet chamber

n 1 or 2 chemistries

n Full compatibiliy with S4 and S8

n Smallest footprint

n Cuts chemical consumption

n Shortens process time

n Reduces defects

n Increases uptime/productivity

n Reduces capital expense

n Full touch-screen control

n Single or double-stack models

n DI water recirculation

n N2 saver

n Overtemp protection

n Data logger

Advanced Wet Processing Tools For Smaller Wafers and Emerging Technologies

Solstice®S4Electroplating Production SystemUp to 4 chambersFor 75-200mm substrates

n For plating, cleaning or etching

n Cassette-to-cassette automation

n Up to 4 chambers

n Smaller footprint, lower cost

n To replace older plating systems

For some users, the S4 can provide an

even lower-cost entry point into mid-

level automated plating production.

This tool still provides many S8 capa-

bilities, but with fewer chambers, for a

smaller footprint and lower cost.