CIRTEK ELECTRONICS CORPORATION Company Presentation.

CIRTEK ELECTRONICS CORPORATION

Company Presentation

04/18/23

2

Cirtek Electronics Corporation

Final Test, Finishing and FAREL

Product Portfolio and Special Capabilities Company strengthsPlans and programsPackage Technology Roadmap

Services and CEC BOMCompany overview and organization

Outline

04/18/23

3


Outline




4

04/18/23Cirtek Electronics Corporation

Company overview

5


Cirtek Holdings Philippines Corporation

Cirtek Electronics Corporation (“CEC”)

Primary purpose is to engage as an independent subcontractor for

semiconductor assembly, test and packaging services

Cirtek Electronics International Corporation (“CEIC”)

A BVI company which provides marketing, logistical and

administrative support, including collection to CEC.

Company Structure

6

04/18/23

History Established in 1984 as independent Subcontract Assembly & Test Provider Accredited by International Quality institutions

CIRTEK has grown to provide world class turnkey solutions that include services from package design development, wafer probe, wafer back grinding, assembly packaging and final testing of semiconductor devices up to drop shipments to Customer's end users.

Competitive pricing and easily adaptable to customers needs


Company overview CIRTEK TODAY

High quality products, while providing production flexibility

Competitive pricing and adaptable to customers’ needs.

25 years experience outsourced assembly & testing solution provider

Profitable despite several economic downturns, debt free company

Growing client base composed of companies located around the world

Company overview

7


Cirtek assembles and tests semiconductor devices at its manufacturing complex located on a 20,000 square meter property in Biñan, Laguna.

Its manufacturing facility is composed of two buildings, with a total floor area of 14,100 square meters. 1800SQM of clean room environment @ Class 10K. We offer general line and captive line assembly models

A Philippine Economic Zone Authority (PEZA) registered company as an ecozone export enterprise at the Laguna Technopark for the manufacture of standard integrated circuits, discrete, hybrid and potential new packages.

Company overview

8


Business StrategiesTo develop partnership with its existing and potential customers to provide world class quality solutions through management expertise focused on specific applications to meet customers specification, high reliability and multi chips products.

Partnership with Customer to grow business together

1

To offer dedicated or captive line models for assembly and test services in order to efficiently produce the customer’s mature and stable products through shared investment

Captive Line Development

2

To continuously focus on Innovations and re-Engineering in its production and assembly techniques and capabilities, and to co-develop new technologies with customers

Technology Development

3

To actively seek strategic investments opportunities such as, alliances, joint ventures, and/or acquisitions that will be consistent with the Company’s overall business strategies

Mergers and Acquisitions

4

04/18/23

9


Organizational StructurePRESIDENT & CEO

Jerry Liu

EXECUTIVE VP/ GEN MANAGER

Jorge Aguilar

VP FOR ENG’G & PURCH, IND’L MGMT,

Raul Santiano

FINAL TEST MANAGERWalter Alegarme

ACCOUNTINGMANAGER Susan Lumba

CFOTony Buyawe

DEVELOPMENT ENG’G.Raymond Tecson

SUSTAINING ENG’GChona Morales

FINAL TEST SUPERVISORManny Olandria

PROBE TEST SUPERVISOR

Roderich Ignacio

MULTI DIE TEST SUPERVISOR

Rey Reyes

QA DIRECTOR Luz Veril

QA / FAREL SECTION MANAGER

Zeny Puedan

QC/QA SEC.MANAGER Jacqueline Blancaflor

VP- Global Business Development

Norman Chang

SENIOR DIRECTOR SALES & MKTG-CSAntonio Callueng

MULTICHIPS BUS. MANAGER MeAnn Canoza

IC BUS. MANAGERMiles Besana

DISCRETE BUS. MANAGER Medy Chua

QFN /DFN BUS. MANAGER Wilson Padre

NEW PRODUCT BUS. MANAGER

Rosendo Cerezo

HERMETICS BUS. MANAGERLaarni Arnesto

CUST SERVICE TEAM

HUMAN RESOURCEDIRECTOR

Milet Cruzada

04/18/23

10


Outline




04/18/23

11


Cirtek Services

Wafer backgrinding (8” maximum diameter / 4 mils thick capability)

Wafer mapping (8” maximum diameter / ASCII format)

Wafer probing (6” & 8” wafer diameter)

Die sales inspection (Commercial / Military / Medical level of inspection)

Full assembly (Refer to package portfolio)

Marking (ink / laser)

Final test (Refer to test capabilities)

Tape and reel (SOT, 150 / 300 mil SOIC, QFN / DFN)

Tape and Ammo (TO-92 straight / spread leads)

Drop shipment (To any point as required)

Ship to Stock Serve as your HUB/Distribution center

Sort + Assy + Test + Drop shipment

Build of Materials


Cirtek Standard Materials

Leadframe Molding Compound DA Epoxy

• Stamped LF

Copper A194 PPF -NiPdAu

• Etched LF

• Plating – Spot Ag

• Configuration:

Matrix

HDLF

Single/Dual

• Sumitomo – G600, G770• Sumitomo – G600, G770

• Hitachi 9220HF10 • Hitachi 9220HF10

• Cookson3200LS

• Toshiba KE955WY-white

Plating – 100% Tin

Gold Wire ( Mils)

• 84-1LMI/SR4

• 8900- NC

• 8600 -

• 2600AT - HT

• QMI 529HLV

• CRM 1076NS

• Eutectic DA

• Solder paste• Sn5Pb95

• Sn10Pb90

Copper Wire ( Mils)

0.80, 0.90, 1.0 mils

1.0 , 1.65, 2.0

1.2, 1.3, 1.5, 2.0 mils

Aluminum Wire ( Mils)

1.25, 5.0, 10

Plating –SnPB (85/15)

Copper Clip Attach

• Sumitomo 6710/6600

• NittoG300LC• NittoG300LC

04/18/23

13


Outline




14

04/18/23Cirtek Holdings Philippines Corporation

QFN/DFN Packages

QFN Body Size Small Body Size

• 2.00 x 2.00 / 08L• 3.00 x 3.00 / 08L• 3.00 x 3.00 / 16L• 3.50 x 3.50 / 20L• 4.00 x 4.00 / 24L• 5.00 x 5.00 / 28L• 7.00 x 7.00 / 32L• 8.00 x 8.00 / 52L

DFN Body Size

Product Portfolio

• 2.90 x 1.80 / 04L• 1.70 x 1.35 / 08L• 2.00 x 2.00 / 08L• 2.50 x 1.35 / 12L• 3.00 x 1.35 / 12L• 3.30 x 1.35 / 16L• 3.00 x 3.00 / 10L• 4.00 x 1.60 / 16L

15


SOIC Packages

150 Mils Body Packages 300 Mils Body Packages

08L- Stand

14L - Stand

18L

20L

24/28L

Exposed Pad Version

Product Portfolio

08L- 150 Mils16L – 300 Mils16L – QSOP

16L - Stand

16L Standard – Clip Attach

TSOC 6L– 150 x 150 x 55 mils

Product Portfolio


Plastic Dual In Line Package

300 Mils Body Package Single In Package 600 Mils Body Package

08L

14L

16L

18L

20L

24/28L

8L, 9L

17


SOT Packages

SOT 23 Packages TO 92 PackagesSOT Packages

03L

06L

TO 92 -Stand

05L

SOT89 TO 92 - Flat

SOT223

SOT 143

Product Portfolio

18


Hermetic Packages

Metal Can ( TO 3- TO 5) SMT/COB AssyT-Hole Oscillator

Small Metal Cans Hybrid Assembly Build of Materials

Materials Customer Specific Consignment Flexible Arrangement

Product Portfolio

04/18/23

19


Other Special Assembly Capabilities

Multi die on standard 150 mil2 die up to 32 die, Custom LF design by Cirtek (SOIC) package

Standard silicon die attach cylindrical crystal through resistance welding LF design by Cirtek 300 mil (SOIC) Pack.

Multi die embedded ceramic crystal Mounted die in PCB• NC and conductive epoxy • Transfer over mold process • 300 mil (SOIC) package

Copper Clip attach on SOIC/QFN ESD and Power DevicesDie to Die Bonding

Cylindrical Crystal

Control IC

Copper clip

Multichip on Standard Package

04/18/23

20


PCB

Passive component attached with solder

GaAs dice attached with conductive epoxy

Gold wire

Non-hermetically sealed using conductive epoxy

Metal lid

Hermetic Module Assembly

04/18/23

21


CHIP CAPACITOR1

CHIP RESISTOR2

PRESCALER DIE3

1

1

1

11

2

3

LEGEND:

Prescaler-Static divider Module Assembly

04/18/23

22


Outline




04/18/23

23


Company strengths1 Certified to the latest quality standards

2 Solid management team and expertise

3 Ability to adapt to customers’ needs

4 Full turnkey solutions

5 Growing customer base of diverse clients

6 Strong brand name and proven track record

7 A PEZA-registered entity

24


Cirtek’s manufacturing practices are designed to be compliant with industry requirements and to exceed customer’s expectation.

Manufacturing applies latest quality system standards, which include ISO 9001, ISO 14001, QS-9000/TS-16949, BABT and DSCC, as well as certified facility by UL

Company strengths1 World Class Quality standards

Sales and Marketing

Product Realization

04/18/23

25


Quality Management System map Internal Quality Auditing – MOP Customer Service - COP

ManagementReview

Cu

sto

mer

s S

atis

fact

ion

Purchasing Billing QA /IQA InspectionWarehousing

Process Design and

Dev’t

Production Planning Control

Process Control Inst /

Doc’n

AssemblyMfg

FA-REL Final Test Delivery

1 2 3 4 6 7 8

9

10

Calibration Process

EngineeringMaintenance

Facilities MIS Training HR EMS

5

Support Process

Main Process

MOPCOP

NOTE:

Support process that has no arrows meaning it will

support the whole organization.

04/18/23

26


Continual Improvement Process

Information

Input Output

Cirtek Quality Management System

04/18/23

27


Outstanding Quality SystemQUALITY MILESTONE IN SYSTEM AUDITS PERFORMED BY CUSTOMERS AND QUALITY MILESTONE IN SYSTEM AUDITS PERFORMED BY CUSTOMERS AND

INDEPENDENT AUDITORSINDEPENDENT AUDITORSACCREDITTED AS QUALIFIED SUPPLIER BY OEM’sACCREDITTED AS QUALIFIED SUPPLIER BY OEM’s

CUSTOMER/END USER SPONSOR YEAR QUALIFIED APPLICATION

HUAWEI – CHINA

PANASONIC MOBILE COMM–JAPAN

CANON INC - JAPAN

GE HEALTH CARE

MICRONAS AUTOMOTIVE

PANASONIC ELECTRONIC-JAPAN

HUAWEI – CHINA

IBM-JAPAN

INTERNATIONAL RECTIFIER

ST MICROLECTRONICS

CMD

EMERSON (ASTEC)

MEDTRONICS

GENNUM

SEMTECH INC

ANALOG DEVICES INC

SEMTECH INC

SUNPOWER

MICRONAS

SEMTECH INC

DALLAS-MAXIM

DALLAS-MAXIM

IR DIVISION

ST MICRO

CMD

SILICON LINK

MICROSEMI

GENNUM-CANADA

2009

2009

2008

2007

2007

2006

2006

2006

2006

2006

2006

2005

2003

2002

POWER SUPPLY - CE

REPEATER/BASE STATION

ELECTRONIC DEVICES

CT SCANNER

HAL SENSOR

FLAT SCREEN TV

ENTERPRISE/OFFICES

DATA NETWORKING

POWER SUPPLY / CHARGERS

MOBILE APPLICATION

MOBILE APPLICATION

POWER SUPPLY - CE

MEDICAL IMPLANTABLE

HEARING AID

Company strengths

28


Management team is composed of highly experienced individuals from various semiconductor and OSAT companies.

The Cirtek Team has over 150 years of combined management and engineering package design expertise specific to semiconductor industry.

Lean organization and prudent decision making.Focused and goal oriented.

2 Solid Management Team and Expertise

Company strengths

29


3 Ability to adapt to customer’s needs

Customer requirements

World class quality standards Excellence in manufacturingClean room (Class 10K) facility and practice 5S (Japanese) Discipline On-time Delivery Competitive pricing Flexibility / Responsiveness

Technical abilities which provide customers a full range of turnkey solutionsCustomer satisfaction as evidenced by the awards received from several customers

Company strengths

30


Provide vertically integrated manufacturing solutions to its customers.

+ +Higher productivity / efficiency Lower cost Faster time to market

Package Design & Development

Assembly & Packaging

Test, Pack & drop ship to end Customers

4 Full Turnkey Solution

Company strengths

31


5 Growing customer base of diverse clients

A growing portfolio of customers. CHPI currently has 42 customers around the world

The Company’s customers are located in various countries, with the bulk of revenues contributed by customers located in Europe and the USA

USA AsiaEurope

% Contribution to revenues per region

Company strengths

32


Continuous production growth and generating employment.

Delivering profit and dividend every year.

Financially strong.

6 25 Years Proven Track Record

04/18/23

33


Company strengths

* The Philippine Economic Zone Authority (PEZA) is an attached agency to the Department of Trade and Industry tasked to promote investments, extend assistance, register, grant incentives to and facilitate the business operations of investors in export-oriented manufacturing and service facilities located inside selected areas throughout the country

As a PEZA*-registered entity, the Company enjoys certain incentives like tax holidays, duty free importation of materials and reduced power rate vis-a-vis non-registered entities which enables it to price its products competitively.

Tax incentives Ecozone power rate+ Ability to price

products competitively

Company savings

Entitlement to 5% gross income tax (GIT) incentive. Secure new 4 year income tax holiday (ITH) for new projects

Reduction of 12.5% to 13.5% on power cost

7 A PEZA-registered entity

04/18/23

34


Outline




04/18/23

35


Plans and Programs

This will enable us to support 400 Million units of additional new business from existing and potential customers.

Sustaining cost reduction program, higher quality product and stable process through automation and re-engineering. To develop new packages through innovation to maximize yield and satisfy or exceed customer expectation.

Concluding and enabling Cirtek to realize new potential business in the pipe line worth US$11.8 Million by 2012 and to expand product portfolio.

1 Expansion of Manufacturing facility and Capacity

Innovation and Re-Engineering

Completion of current projects and programs with customers

2 3

New Potential business: Power MOSFET QFN Open cavity moisture / pressure sensor for automotiveOpto Couplers Exposed Cavity Power Amplifier – HSOP Current protection devices

04/18/23

36


Outline



Product offerings, Services and CEC BOMCompany overview and organization

04/18/23

37


Package and Technology Roadmap

HYBRID ASSY

Package Development Roadmap

2005 2007 2009 2011 2013 2014

PDIP SOIC NB SOIC WB

STD TO92

SOT23 SOT143

FLAT TO92

SOT89

METAL CAN

SMT

SMT-COB

SOIC EPAD

CERAMIC ASSY

TSOC SOT23

SOIC W/ CRYSTAL

1.2X0.76X0.76 DFN PACKAGE


COL / CLEAR PACKAGE DFN

AIR CAVITY QFN / DFN

POWER QFN USING CU CLIP

OPEN CAVITY SENSOR

PCB / LGA / SIP

JEDEC STD QFN / DFN

SOD323 SOT223

HSOP / DSO


FLIP CHIP ASSY

MSOP

16 QSOP

LED ASSY

TO272

WLCSP

04/18/23

38


Package and Technology Roadmap

2005 2007 2009 2011 2012 2013

Cost Reduction / Development Roadmap

Brass / steel leadframe (10% lower than Cu)

Soft solder / Eutectic Die attach

Ribbon bonding

Auto Clip attach

Die attach film

Copper wirebond (90% lower than Au)

AuSn Eutectic die attach

BSOB bonding AuAg wirebond

(20% lower than Au)

Chinese leadframe supplier (20% lower cost)

Korean Cu wire supplier (21% lower cost)

Low loop profile

( 3% lower Au cost)

Mold compound selection GE300LC2 (21.8% lower cost)

Ag plating thickness reduction (5% lower cost)

MGP / automold conversion (14% lower cost)

Technology

Material

Ultra High Density Leadframe

( High Volume)

High Density Leadframe

(12% productivity improvement) Matrix Leadframe

Stacked Die attach

04/18/23

39


Outline




04/18/23

40


04/18/23

41


Final Test Summary WAFER PROBE CAPABILITIES

Wafer Prober EG1034 – 4” and 5” EG2001 – 6” EG2080 – 8”

Ink/Inkless less Process ASCII format

04/18/23

42


Final Test Summary TEST CAPABILITIES

Mixed signal device CREDENCE ASL-1000, EAGLE ETS 500D, LTX

Discrete device TESEC 881-TT, FROTHINGHAM CV3000B

Linear device KEITHLEY, GENESIS

RF / IF device HP RACK & STACK, HP84000

Digital /Asic device FAIRCHILD SENTRY, SIEMENS S725

OPTO relay device TESEC, HIPOT

Protection device TESEC, KEITHLEY

MULTI BIN/POST TEST MARKING SOT 89, 223 TO92

04/18/23

43


Final Test Summary TEST / TAPE & REEL CAPABILITIES

Integrated test and TNR handlers SRM S248 – SOT SRM XD16 – SOT SRM S12 – SOT VECTOR T20 – SOT QMT 1500 – SOT SRM 248XS – TDFN ASM FT2030 FLEXIPACK – SOIC SRM 244XS – SOIC ISMECA –NX16 – DFN ( 0402)

Test handlers (SOIC/PDIP) MCT 3608/5100 MT 8305/8588/8704 AETRIUM 2020 DTS

TNR handlers (SOIC) G6 Visdynamics Systemation TO 485 with 3D vision STI 8028 / ST 60

04/18/23

44


04/18/23

45


Internal / external inspection High / low power microscope

X-RAY SOFTEX 100

Decapsulation DECAP AS2000

Autoclave NAPCO 8110-TD test chamber

Open / short test TEXTRONICS curve tracer

85% / 85oC moisture soak ENVIRO SYSTEM chamber

Temperature cycle ENVIRO SYSTEM chamber

Polisher / grinder (cross sectioning) SBT–MODEL 900

Failure Analysis Capability

04/18/23

46


Die shear MIL STD 883-2013

Bond strength MIL STD 883-2011

Mark permanency test MIL STD 883-2015

3 mins soaking time using IPA @ 30 strokes Solderability test

MIL STD 883-2003-7 / JESD22-B102D 8 hrs steam aging @ 100oC

Temperature cycle MIL STD 883E-1010.7 /JESD22-104B

10 cycles minimum @ 10 minutes / cycle Low temp @ -65oC (+0, -10oC) High temp @ 150oC (+15oC / -0oC) +150oC (+15,-0oC)

Stability bake MIL STD 883-1008.2

6 hrs @ 175oC

Reliability Test Capability

04/18/23

47


High temp storage JESD22-A103B

500 hrs min @ 150oC Auto clave

JEDEC 22A 102-C 15 PSI for 96 hrs @ 121oC

Fine leak MIL STD 750D 1071.6 / Test Condition D

30 secs soaking time @ 125oC Moisture soak

IPC / JEDEC J-STD-020C 168 hrs soaking time @ 85% RH / 85oC temp

Reliability Test Capability

04/18/23

48


WHY CIRTEK as ASSSEMBLY & TEST SUBCONTRACT PARTNER?

04/18/23

49


CIRTEK ELECTRONICS CORPORATION Company Presentation.

Documents

Transcript of CIRTEK ELECTRONICS CORPORATION Company Presentation.