Chipbond Analyst Meeting 21H2 - mops.twse.com.tw
14
2021H2
Transcript of Chipbond Analyst Meeting 21H2 - mops.twse.com.tw
2021H2
PACKAGING INDUSTRY
Au
Wire Bonding > 70%
Primary interconnecting method
Bumping
Most ICASE, SPIL, Amkor
Solder BumpsCPU and Graphic Intel and TSMC
Gold BumpLCD Driver IC, RFID
Chipbond, Nepes
GOLD BUMPING
Applications
Display Driver ICRF Front EndSmart CardFinger Print Sensor
Au
Bumping
Testing
Chip on FilmChip on Glass Film
PRODUCTS
GOLD BUMPING
Interconnect between IC and Substrate
Has to be gold for driver IC
PCB
PCB board
CHIP ON FILM
Glass
CHIP ON GLASS
PCB board
Glass
Bumping
Testing
Chip on FilmChip on Glass Film
PRODUCTS
TV Phone NB/PC RF
8” 12” 8” 8”
v v v v
v v
v
v
Bumping
Testing
Chip on Film
Chip on Glass
Film
2018 2019 2020 2021
APPLICATIONS
2019 2020 2021F
220 220 220
US ⬆SEA, EU ⬇
4K → 8K 8K
2019 2020 2021F
160 220 240
TDDI TDDI
2019 2020 2021F
1,350 1,270 1,385
OLED 470 450 500
TDDI 650 750 850
DDI 230 70 35
