CHILISIN ELECTRONICS CORP. Company Presentation 2014 1.
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Transcript of CHILISIN ELECTRONICS CORP. Company Presentation 2014 1.
CHILISIN ELECTRONICS CORP.
Company Presentation 2014
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Company Milestones
A Local Ferrite Producer
Business Expansion
Major Domestic Player
World-class Company
1972 1977 1990 1998 1999
Year
40,000
80,000
120,000
2002
Established
Developed Mn-Zn and Iron Core
Developed SMD Power Inductor
Public listingon TWSE
20012000
60,000
1997 2003
Re
ve
nu
e
K $USD
20072005 20112009 2013
100,000
Established second plant
Developed Wire-Wound and Multilayer
Developed High-Frequency Chip Inductor
Expanded ChinaDongGuan plant
EstablishedChinaSuZhouoffice
Constructed Hukou new HQ and plant
Established China Henan plant
Company established
EstablishedU.S. office
Established China DongGuan plant
EstablishedKorea office
Acquired Belkin Int’l
Formed strategic alliance with Yageo
Developed Moldingand Thin-Film Technology
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$64,375
$99,433
$115,000$120,330
$124,556
$0
$20,000
$40,000
$60,000
$80,000
$100,000
$120,000
$140,000
2009 2010 2011 2012 2013
CEC Sales Revenue
$2,580
$2,216
$2,479
$2,218
$2,408
$2,000
$2,100
$2,200
$2,300
$2,400
$2,500
$2,600
$2,700
2009 2010 2011 2012 2013
Global Value
Chilisin Growth vs. Global Market($USD ’000)
($USD Million)
Source: Paumanok Publications, Inc .
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2009~2013 Revenue Growth CAGR
Chilisin 93.49% 17.94%
2013Volume(e)
(247Bpcs)
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Chilisin Global Ranking
2013Value(e)(2,394M
USD)
Product Coverage: wire-wound, multilayer, and thin-film inductors for power and signal applications
Chilisin: #4 global position as 2013 global total estimated volume is 246,965MpcsChilisin: #6 global position as 2013 global total estimated value is JPY246,290M (USD2,394M)
Source:株式会社マーケティング・アイ (MAKETINKUAI CORP) http://www.m-eye.co.jp/
PC22%
Mobile16%
Consumer13%
Industrial 3%
NB3% Automotive
2%
Communication 41%
Sales Breakdown 2013 – By Market Segment
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Major Customers
AutomotivesAutomotives
PC / SystemsPC / Systems Consumer ElectronicsConsumer ElectronicsTelecommunicationTelecommunication
OEMs / EMSsOEMs / EMSs
*Any trademarks or logos used throughout this presentation are the property of their respective owners, Chilisin does not claim ownership or distribution rights of the above logos
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Manufacturing and Office
Suzhou PlantSuzhou Plant
Dongguan PlantDongguan Plant
Hong Kong Office
China
Henan PlantHenan Plant
TouliuPowder Plant
TouliuPowder Plant
Korea
USA
Anyang Office
San Jose Office
HeadquarterHsinchu/Hukou Plant
HeadquarterHsinchu/Hukou Plant
Chongqing Office
Wuhan Office
Taiwan
Taipei Office
FactoryDongguan, China
Est. 1997Employee: 1,199
FactoryHenan, China
Est. 2010Employee: 518
FactorySuzhou, China
Est. 2001Employee: 96
HeadquarterHukou, Taiwan
Est. 1972Employee: 751
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Factory Overview
Molding
Wire-Winding
Multi-layering
Thin-film
Through-hole
Manufacture Site Finished Products Inventory
----------------------------------- All factories are ISO 9001 and TS 16949 certified ----------------------------------
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MoldingWire-winding Multi-layering Thin-film Process
Power Inductor
• Wide range• for power solution
Magnetic-resin Power Inductor• 2016~3030 size for mobile phone• 4040~5050 size for tablet PC• 6060~8080 size for TV/audio
Chip Inductor
• Ferrite core for baseband application
• Ceramic core for RF application
Common Mode Choke
• for USB2.0/3.0/HDMI
Power Inductor
• DIP type• for motherboard
Power Inductor
• SMD type• for notebook & tablet PC
New - Power Inductor• SMD Miniature type:
3225~2012 size, t: 1.0mm• for handset & ultrabook
Ferrite Bead
• Up to GHZ band• Downsize from 0402 to 0201
Chip Inductor
• For RF application• 0201 size +/-0.1nH
Product Line and Technology
Power Inductor
• 2520~1608 size, t: 0.55mm• for handset & ultrabook
Common-mode Choke
• 0805 package• for USB2.0
Chip Inductor
• Baseband &RF application• Downsize from 0402 to 0201
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Miniaturization
High Current
Low ProfileLow Rdc
Green Compliance
RoHsREACH
40A
20A
60A
1.5mm
1.0mm
0.5mm
0402
020101005
< 1m
<5m
<10m
Product Development Trend
HF
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Best Partner Award from Coolpad (2012) Best “Cooperate To Win” Award from Lenovo (2011) Outstanding Supplier Award from SerNet (2011) Best Supplier Award from New Kinpo (2010) Best Supplier Award from Asus (2005)(2007) Best Supplier Award from Solectron (2007) Best Supplier Award from Zyxel (2006)(2007)
TS16949 Certification (2005) ISO 14001 Certification (2004) Samsung Eco-Partner Certificate (2005) Sony Green Partner Certificate (2003)
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Certification and Awards
1212
Trustworthy Supplier Competitive Products
Full Range of Magnetics Series Sufficient Capacity Support Vertical integration from powder mixing to inductor manufacturing World-class Quality Cost Competitiveness Quick Delivery & Flexible Logistic Support
Value-added Service
Total Solution Provider for EMI, power and RF Design-in Capability Professional Engineering Support Material Research & Development Concurrent Product Innovation
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Thank you!