纳米压印技术最新进展 - iphy.ac.cnin.iphy.ac.cn/upload/1707/201707201258172526.pdf ·...

纳米压印技术最新进展

Obducat Technologies AB., SwedenGang Luo, 20170711

General company presentation - © Obducat 2017 CONFIDENTIAL

History

1989 Company is founded, aiming at replacing LBR mastering technology with EBR

1996 Development of Nano Imprint begins together with LTH

1997 Listing on the Stock Exchange and first working EBR is produced

1999 Soft Press Key Imprint technology is Patented by Obducat

2000 Both the first EBR and the first NIL system are sold

2002 First Asian orders for NIL and first NIL into Semiconductor area

2004 Completed the development of process for mass-production

2005 IPS® and STU ® introduced on the market

2006 Breakthrough order for NIL production system, Samsung launches products with “Obducat Inside”, SEM “Apollo” product range is launched

2007 Epistar place order on the newly launched of SINDRE ® HVM

2008 Sold the first SINDRE ® 400 for LED production and reached an commercial agreement concerning SINDRE ® HDD development

2013 Sold the first SINDRE ® production system for BIO applications

2013 Launched UV based NIL process for mass-production

2014 Launch and sell SINDRE ® 400 Gen2 system with UV based process

2016 Launch of SINDRE ® Large Area

2015 Acquire Solarsemi Gmbh

2015 Awarded by NNT for “Pioneering NIL into production”


One company - Two locations

Obducat AB (mother company) & Obducat Technologies AB (NIL branch)

Solarsemi Gmbh (Coating branch)

~1hr flight

• > 40 employees

• Application laboratory

• Founded 2009

• More than 35 world

wide patents

• More than 300 installed

systems

• Located in Radolfzell,

Germany

• > 30 employees

• Application laboratory

• Class 100 cleanroom

• Founded 1989

• More than 140 world

wide patents

• More than 140 installed

systems

• Located in Lund,

Sweden


Obducat – the Pioneer of NIL industrialization

2016 Obducat celebrate 20 years anniversary for its NIL products!

Obducat started developing materials, processes and machinery's 1996 and installed the first sold NIL system already year 2000.

Since then we have established a leading position in the market of NIL-production with an installation base far exceeding any competitor.

More than 140 customer installations world-wide

Obducat is the only NIL supplier that have sold NIL systems being used in commercial mass production.

Obducat has created the strongest Patent portfolio in the business.

More than 140 granted patents

Since the start of the NIL product range, Obducat has developed and delivered more NIL projects than any other NIL company.

For 20 years Obducat has built knowledge in the up & down stream processes required for successful NIL implementation in real production environment.

This competence is available to all our customers!

Recently Obducat acquired the company Solarsemi, supplying the highest quality coating equipment in the industry, with the purpose to supply complete and integrated production solutions.

Utilizing the IP developed in-house and the knowledge gained from application development projects the last 20 years, Obducat can offer the most comprehensive range of lithography solutions and application support for Nano and Micro patterning in the business

Application examples

Product overview – Nano Imprint Equipment

• Hard Disc • Academic R&D

• Optical Components• Lenses

• High density interconnects• Display

• LED• Solar cell

EITRE-Line

Manual R&D tools

Stand-alone

Nanoimprinters

- Eitre® 3”

- Eitre® 6”

- Eitre® 8” (8” x 8”)

EITRE-Line Large Substrates

Semiautomatic systems

NIL tool for Display standard sizes up

to Gen 5. Suitable for both Thermal,

UV and STU processes. Semi-

automatic Imprint process

– up to GEN 5 size

SINDRE-Line

Fully automated systems

Production systems with throughput

~60wph (LED) and cassette handling

- Imprint size 4” – 8” wafers

- Other sizes and applications upon

request including > Display Sizes Gen 5

Consumables

Master stamps

Silicon, Quartz & Nickel

IPS ® and STU ® materials

Polymer and resist materials

with various characteristics that

can be tailored for a specific

applications

High degree of customization possible!

By fully owned subsidiary Solarsemi, Obducat can offer a wide range of fully automatic and semiautomatic lithography equipment solutions for semiconductor, display and substrate processing applications.

Applications

Product overview – Coating and wet-processing

• Priming• Spin coating

(open bowl or RCCT)

• Spray coating• Baking• Developing

• Lift-off• Stripping

• Etching• Cleaning• Post CMP cleaning

EL-Line (easyline)

Manual lab spinner

module

– up to Ø8” (Ø200 mm)

QS-Line (quickstep) Large Substrates

Semiautomatic systems

Stand-alone spin-coater, spray-coater,

developer, wet-process spinner, hot-,

cool & HMDS-plates – manual or full

automatic robotic system

– up to GEN 5 size

QS-Line (quickstep)

Bench mounted & stand-alone

spin-coater, spray-coater,

developer, wet-process

spinner, hot-, cool & HMDS-

plates for low volume

production

– up to Ø12” (Ø300 mm)

MC-Line (microcluster)

Fully automatic production systems

Consisting of platforms with robot

handling and all lithography processes

from coating, baking to development

and cleaning application


All our NIL systems are based on the patented Soft Press® Technology.

Air Pressure parallelism thin and uniform residual layer!

How does Obducat NIL work?

•Independent of stamp & substrate thickness variations, bow or waviness

•Any resist thickness

•High Imprint depth uniformity

•Homogenous pressure distribution

Always full area imprint in one shot!

Possible to print on curved surfaces!


Obducat NIL technology: Imprint Technology

Stephen Y. Chou et al Nano Lett., Vol. 6, No. 11, 2006


Obducat’s patented technologies

Key words about Obducat’s NIL technology:

Soft Press® technology

– Obducat’s replication technology, using air

pressure to ensure a uniform replication with

high repeatability wafer-to-wafer.

IPS®

– The Intermadiate Polymer Stamp® is used as a

transfer step to overcome substrate unflatness.

– Extends stamp lifetime

– Reduce stamp cost per imprint

STU®

– Simultaneous Thermal and UV® imprint is

applied to the substrate in order create a

uniform resist layer and ensure a high

throughput.

Master stamp

Master stamp

Imprint Step 1:UV-transparent polymer

IPS®

STU® -polymerSubstrate

IPS®

STU® -polymer

const. working temperature

Imprint Step 2:UV-radiation

IPS®


Obducat NIL technology: Imprint Technology

Substrate

Hard Stampparticle

Traditional Hard Stamp IPSTM Benefits

• Eliminates “halo-defect”

Si-master

IPS

particle

• Self-cleaning of stamper

• No damage risk to stamp/substrate

• Increased master stamp lifetime Substrate

Hard Stamp

particle

Substrate

particle

IPSHard Stamp

particlevoid

Substrate

Substrate

particle

IPS


LED production using NIL


NIL Equipment Production

• Sindre® 400 G2 (Up to 4” substrate size)



• General lead time indication is 12-16 weeks

after purchase order

Key specifications and information

• Throughput up to 60 wph

• Edge exclusion zone is 500 µm

• Changeover time between substrate sizes is < 1 hour

• Changeover time for stamp change is < 30 min

The SINDRE tool for mass production

Nano Imprint Lithography for High Volume Manufacturing

NIL quality performance

Example Uniformity data on 4-inch substrate

Customer uniformity data shows that the Obducat NIL technology gives excellent performance;• Top diameter 1.25%• Bottom diameter 0.94%• Height 1.15%

Measurement on 4-inch PSS based on AOI


True imprinting to the edge of wafer

AOI example data

Defect count in FAB environment

Measurement after ICP process.


Increased manufacturing efficiency

• Transition to larger substrates - improves production equipment utilization

• Higher level of pattern uniformity using NIL instead of optical lithography – leads to higher amount of good dies on each wafer and thereby reduced cost

Improved device efficiency and reduced cost

• Transition from µPSS to nPSS offers opportunity to;

• Increase energy efficiency

• Increased equipment throughput

• Lower consumable costs

• With improved efficiency thermal management issues can be reduced which enables cost reduction in packaging technology

Routes for cost reduction - µPSS & nPSS


To use the verticalization effect – for higher light extraction

Use a more vertical light path obtained in the moth-eye layer to minimize the number of reflections in LED chips before light escapes and thereby to reduce absorption. Therefore Moth-eye Patterned Sapphire Substrate (MPSS) are suggested to be used instead of micron size patterned Sapphire substrates (PSS)

MPSS characteristics

• Submicron order period structure.

• Light diffraction - large front luminescence improvement effect.

• Thin GaN layer – lower production cost and less wafer bowing.

Next Generation LEDs – e.g nano based PSS

Diffraction at MPSS interface

GaN bottom layer

MPSS

n-layer

Emission layer

p-layer

High reflectance electrode

Sapphire

GaN


• The NW’s can be produce either by top-down or bottom up approach

• Irrespective of production approach, NIL is used to place the NW’s where you want them. NIL is the most suitable nano patterning method for large areas

Next Generation LEDs – e.g Nano wires

75nm Holes printed on wafer for pillar growth


Applications: Nanowires pattering for LED

The lifted sample can be used for MOCVD growth directly

Overview presentation © Obducat AB 2017 - All rights reserved


• The efficiency of nanowire based LEDs is expected to be higher compared to conventional µPSS and nPSS LEDs.

• An even bigger advantage is the expected yield improvment i.e more high performance LEDs from a wafer compared to today which will lead to higher revenues generated from a single wafer

Next Generation LEDs – e.g Nano wires


Bio / Medical


Life Science – applications

• Drug delivery

• Drug development

• Diagnostic sensors

• Electrochemical sensors

• 3D scaffold tissue engineering

• Contact lens for glucose measurement

Obducat supplied the pilot production line to Kimberly-Clark for manufacturing of the drug delivery devices in Q4 2013.

Problems with regard to maintaining the activity level of delivered agents and avoidance of foreign body and immune response can be inhibited by mimicking the cell structure.


Obducat supplied the first production line for manufacturing of Nanostructured Transdermal devices in Q4 2013.

Bio / Medical - Transdermal Drug Delivery


Bio /Medical - Bio sensor

SEM picture shows topview a Nano-Bio sensor produced by Nano-Imprint lithography supplied by Obducat

SEM picture shows topview a Nano-Bio sensor produced by Nano-Imprint lithography by Obducat

© Obducat

Bio / Medical - Nano-electrodes for Bio-chemical sensors

MATSENS : Lab-on-a-chip platforms based on microfluidic and electrochemical systems.

- NIL is used to fabricate nano-electrodes or incorporate nanostructure on the electrodes to go beyond the current level of sensor performance.


Bio / Medical – High aspect ratio

SEM picture shows side view of high aspect ratio features etched into Si after NIL patterning by Obducat

18

0,43,6

Stamper

Imprint on 6”-Silicon

14 m

3,5 m

Silicon

Polymer

NO residual layer


Displays


Displays

Three areas where NIL can create improvements

• Polarizer

• Color filters

• TFTs

The benefits are;

• Improved image quality

• Improved light tranmission

• Extended battery lifetime

• Reduced costs

• Thinner displays


Displays – various projects since many years

Al gate for organic transistor

Flexible displaysEU & Taiwan

E-paper displaysJapan

LCD displaysEU, Taiwan & China

Wire Grid PolarizersKorea, Japan, Taiwan & China


Large Area NIL Nickel stamp for Flat panel display


Industry's first large Nickel stamp for Display applications made 2008(E-paper)


Wire Grid Polarizer – function & pitch

Smaller Pitch ▶ Higher Extinction

Currently Display Industry plan for use of 100nm pitch


nWGP manufacturing for LCD

Stamp Fabrication

Metal Deposition

Residual Layer Removal- Uniform O2 RIE over large-area

Aluminum RIE & Resist Strip- Large-area nanoscale ICP RIE

NanoImprint

- Large-area stamp

- Pattern uniformity

- Residual layer uniformity

- Defect-free demolding

Resist Coating

- Thickness< 100 nm

over large area

Large-area NIL stamp

1. Step and repeat tiling2. Interference lithography


SEM picture shows top view of imprinted polarization pattern

SEM picture shows Cross section of imprinted polarization pattern

Large Area NIL - Nano Wire Grid Polarizer


Small size example from Customer project

SEM images of the final etched Al gratings, section view.

55nm linewidth, 45nm space, 248nm depth


• Typical lens aperture size: 10-1000 µm

• Typical lens height: 5-300 µm

Applications: Opto-Electronics



Optical components


Optical components – Applications

• Patterning of lenses for images sensors

• Manufacturing of DFB lasers

• Reflective and diffractive patterns

• Photonic devices

• Plasmonic devices

Applications: sub-wave length grating on InP



PhotoVoltaics


Increased manufacturing efficiency

• Transition to larger substrates - improves equipment utilization

• Transition to thinner substrates – reduce raw material costs

• Consistent manufacturing quality – reduce sorting

Improved efficiency

• Reduced reflectivity by controlled patterning

• Increase conversion efficiency by modification of PN-junction

• Increase internal reflection by controlled patterning

• Thinner conductors to reduce shadowing

Routes for improvement


The thin film silicon approach

• The thin film silicon approach enables a reduction of silicon used and thereby reducing manufacturing costs and weight

• Thin silicon will absorb less light, however, this can be compensated for by using a nanostructured surface

• In addition, the silicon can be produced directly on the module giving additional costsavings

• This approach will be developed further in a joint research effort between Obducat and IMEC as well as within EU-project PhotoNVolatics

An example of Emerging technologies cont.


Thank You for Your attention

Gang Luo

Obducat Technologies AB

[email protected]

纳米压印技术最新进展 - iphy.ac.cnin.iphy.ac.cn/upload/1707/201707201258172526.pdf ·...

Documents

Transcript of 纳米压印技术最新进展 - iphy.ac.cnin.iphy.ac.cn/upload/1707/201707201258172526.pdf ·...