Career Paths for Materials Science and Engineering Graduates

Dr. Laura J. Turbini

Chemistry Lab Manager and

Principal Scientist

Research in Motion

Materials AdvantageUniversity of Toronto

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My Checkered CareerAB, Chemistry

MS and PhD, Inorganic Chemistry

High School Teacher

Industry Researcher and Manager

Technical Editor

University Professor

Research Centre Director

Lab Manager

Principal Scientist

Octobeer 14, 2010

Materials Advantage, University of Toronto

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Engineer

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MS/PhD

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Jobs

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Business Man/Woman

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Marketing and Sales

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Design Engineer

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Project Management

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Materials Advantage, University of Toronto

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Industry Management

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Executive

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Professor

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Materials in Microelectronics

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Head on Pillow

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April 17, 2007 SMTA Toronto Workshop 2007 15

Dendritic Growth

• Copper dendrite growing from cathode.

• Forms only when copper-complexing reagent present

April 17, 2007 SMTA Toronto Workshop 2007 16

Depletion of Anode:Open Circuit

Tin Dendrites

Octobeer 14, 2010 Materials AdvantageUniversity of Toronto

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April 17, 2007 SMTA Toronto Workshop 2007 18

Important Electrical Parameters• Electric Field

• E = V/d

• Ohms Law • V = IR

• Resistance • R = (d/A)

• Conductivity = 1/

+ -__

OH-

H+

Br-

Pb+2

Cu+2

Cl-

Sn+n

d

l

A = d x l

Anode Cathode

OH-

Br-

H+

Pb+

Cu+2

Cl-

Sn+4

March 10, 2008 TMS Annual Meeting 19

A Closer Look at CAF• Conductive Anodic Filaments are copper-containing corrosion by-

products that emanate from the anode of a circuit and “grow” subsurface toward the cathode, frequently along the fibre-epoxy interface.

CAF+ Anode - Cathode

March 10, 2008 TMS Annual Meeting 20

Conductor Configurations

Hole-to-hole Hole-to-trace

Trace-to-trace

+ _ +

Trace-to-hole

+_

March 10, 2008 TMS Annual Meeting 21

Catastrophic CAF Failure

PTH

CAF“Burn-out”

AnodeCathode

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Corrosion of Copper in Chloride Media

Formation of CuCl

Cu + Cl- CuCl + 1e-

Generation of oxygen and hydrogen

ions

2H2O O2 + 4H+ + 4e-

CAF Formation

12 CuCl + 3O2 + 6H2O 4Cu2(OH)3Cl + 4Cu2+ + 8Cl-

Pourbaix Diagram of Cu-Cl-H2O system

A. Caputo, L.J. Turbini, and D.D. Perovic, Journal of Electronic Materials, vol. 39, pp. 92-96, 2010

2323

SEM Analysis of PCB cross-section

Copper

Glass Fibres

Filled Epoxy

Core

Prepreg

Prepreg

HDI

HDI

Epoxy and fillers characterization

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Silica is used to reduce the coefficient of thermal expansion (CTE)Aluminum and magnesium hydroxides are used as flame retardants

Epoxy and fillers characterization

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P Si

O

Time to Delamination

26

Mg

H150

Delamination between epoxy/glass fibers and epoxy/epoxy

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Temperature to decomposition (Td)

Derivative wt% change/˚C vs. T Overlap curves with all materialsMaterials with Al(OH)3

Materials without Al(OH)3

The presence of Al(OH)3 causes an increase in the rate of weight loss as this compounds starts decomposing at 200˚C 27

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Questions?

Octobeer 14, 2010