ACCEL

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ACCEL

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CAM

ALOT

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CA

MALO

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ELECTR

OVERT

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ELECTR

OVERT

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MPM

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MPM

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ACCEL®

CAMALOT®

ELECTROVERT®

MPM®

MICROELECTRONICS CLEANING SYSTEMS

DISPENSING SYSTEMS

REFLOW SOLDERING & CURING, WAVE SOLDERING & CLEANING SYSTEMS

PRINTING SYSTEMS

www.speedlinetech.com

MPM® Printing Systems

MPM® Printing Options/Features EnclosedFlow™ Chamber Printing System• Significant materials savings greater than 50%

vs. blades• Print fine features such as 01005s and 0.3mm

pitch CSPs• Quick changeover in only a few minutes - perfect

for high mix

OpenApps™• Independent software applications (Apps.)

operating in conjunction with Speedline’s Benchmark operating systems

• Perfect for interfacing to MES systems

Momentum Elite• Cycle Time : 6 seconds• Triple track conveyor system

Momentum HiE• Cycle Time : 7.5 seconds

Momentum BTB• Cycle Time : Momentum BTB HiE : 7.5 seconds Momentum BTB : 9 seconds Momentum BTB 125 : 11 seconds• Precision and Performance from an optimized footprint and flexible configuration• Back to back configuration capability

Momentum® Compact HiE• Cycle Time : 7.5 seconds• Highest throughput per square foot in the industry• Wet print deposit accuracy & repeatability ±18 microns

(±0.0007") @ 6 sigma (Cpk ≥ 2.0), as verified by CeTaQ• Back to back configuration capability

Momentum Dual Lane Series• Cycle Time : 6 seconds (Elite) Triple track• Patented dual lane transport system

Momentum® SeriesAdvanced printing solution with innovative and outstanding capability• Wet print deposit accuracy & repeatability ±20 microns (±0.0008") @ 6 sigma (Cpk ≥ 2.0), as verified by CeTaQ• Ultrafast RapidClean™ stencil wiping system decreases cycle time by 6-12 seconds• Expanded 2D inspection capabilities, with patented RapidView™ (available on Momentum HiE, Elite & Dual Lane only), BridgeVision®, and

StencilVision™ • SPI Print Optimizer™ - Monitor and improve the entire print process, not just a single parameter of the process• Speedline technology : – Squeegee force compliance routine – Closed-loop print head• Speedline Benchmark™ software with OpenApps™ and Windows® 7 Operating System

Edison SeriesInnovative new printing platform• Cycle Time : 15 seconds including print and wipe• Wet print deposit accuracy & repeatability ±15 microns (±0.0006") @ 6 sigma (Cpk ≥ 2.0), as

verified by CeTaQ• NEW MPM Intueri™ software - State-of-the-art graphical user interface portal to Industry 4.0• High Speed Vision Alignment - On-the-fly fiducial capture• High Effciency Wiping - Super size 65m roll length, contamination control design• Parallel processing - Unique patented stencil shuttle

NEW

SMT, Hybrid and Semiconductor ApplicationsSolder Paste, Surface Mount Adhesive, Conductive Adhesives, Flux Dispensing, Solder Mask, Flip Chip Underfill, Encapsulation (Dam & Fill, Globtop) and Thermal Greases

CAMALOT® High Precision Pump Technology

CAMALOT® Dispensing Systems

SmartStream®• A non-contact dispense pump

well-suited for underfill applications

• Unique Auto-Tune feature allows dynamic mapping/tuning of individual dispense shots

• Closed-loop servo drive ensures fast, repeatable performance

• Narrow stream width for access into densely packed areas

Prodigy™ Next Generation Dispensing System• Faster, Smaller, Lowest Cost of Ownership• High speed, high accuracy linear drive system

– ±35 microns (±0.0014") @ 3 sigma – 1.5g peak axis acceleration • Fully configurable for most dispense applications – “Plug and Play”architecture – All options field upgradable• Incorporates SmartStream® technology

635 SD• Ideally suited for dot

type applications• Uses footed or

unfooted needles• Precise material

delivery• Minimal maintenance

680 SD• Ideally suited for line

type applications• Uses patented no-drip

design• Carbide parts as

standard• High flow rates

Dual Mode Weight Scale• Adjustable target

weight tolerance• Averaging function• Variable pattern

weighing capability• Low cost of

ownership: utilizes disposable cups

Dual Head Synchronous Dispense Mode• Reduces dispense

time by 50%• Capable of detecting

panel rotation and auto switch to an "asynchronous" dispense mode.

NanoShot™ Next Generation Jetting Technology• 100% closed-loop software controlled• Speeds up to 600 Hz• Dot sizes < 300 microns• Single shot weights

Electra® Advanced High Performance Wave Soldering System for High Volume Manufacturing• Available with Short and Full N2 tunnel features• Capable of 24" (610mm) process width• Available with ServoJet™, ServoSpray and ServoSonic

type spray fluxer • Capable of 8' (2.4m) of bottom and 6' (1.8m) topside

IR Platen or IsoThermal Convection preheat • Recipe-driven dual wave air or nitrogen

nozzle technology: – Patented UltraFill™ with FloLift main wave* – Non-clogging Rotary™ with FloLift chip wave

technology• DwellMax Plus™ option for maximum topside hole fill• Nitrogen tunnel features can be upgraded in field• Recipe-driven solder pot height adjustment (auto

lead clearance)

VectraElite™ Advanced Medium to High Volume Wave Soldering System• Available with Short and Full N2 tunnel

features• Process width of 18" (457mm) with optional

20" (508mm)• Available with ServoJet™, ServoSpray and

ServoSonic type spray fluxer • Capable of 6' (1.8m) of bottom and 4' (1.2m)

of IR Platen or IsoThermal Convection preheat • Recipe-driven dual wave air or nitrogen

nozzle technology: – Patented UltraFill™ with FloLift main wave* – Non-clogging Rotary™ with FloLift chip wave

technology• All other features and capabilities are the

same as the Electra

ELECTROVERT® Reflow Soldering and Curing Systems

OmniMax™ Series 7, 10 & 13-zone High Performance Convection Reflow Soldering System • Dual IsoThermal Chamber Technology™ (ICT) provides maximum

thermal transfer & control for SMT & Semiconductor standards* • Efficient design delivers significant energy and N2 savings• Independent Closed-loop blower control in each heating &

cooling zone• Industry first dripless cooling technology*• Intelligent Flux Control™ (IFC) with RunMax Technology*• Windows based OS with easy to use software control• Standard features include data logging and optional barcode

for full product traceability and tracking• Multi track conveyor options provide maximum product

throughput and flexibility• CE or UL compliant

ELECTROVERT® Reflow and Wave Soldering Options/Features

* Patented** Patent Pending

OmniES™ Series 5, 7, 10 & 13-zone Forced Convection Reflow Soldering System• Innovative approach of utilizing single IsoThermal Chamber Technology

that provides high performance convection at the lowest possible cost of ownership*

• Efficient design uses less energy and N2 providing significant cost savings

• Independent Closed-loop blower control in each heating & cooling zone• Full machine accessibility to every section of the machine ensures

ease of maintenance• Windows based OS with easy to use software control• Standard features include data logging and optional barcode for full

product traceability and tracking• Multi track conveyor options provide maximum product throughput

and flexibility• CE or UL compliant

VectraES2™ Advanced Low to Medium Volume Wave Soldering System• Available with Short N2 tunnel

features• Available with Foam or Spray

type fluxing systems • Capable of 6' (1.8m) bottomside

and 4' (1.2m) topside heating (convection or IR)

• Patented UltraFill with FloLift main wave technology*

• Non-clogging Rotary with FloLift chip wave technology

• Recipe-driven solder pot height adjustment (auto lead clearance)

• Wet finger cleaning system

DwellMax Plus™ Nozzle System*• Recognized as an industry

leading solution for difficult soldering applications

• Delivers the best topside hole fill• Provides cost savings through

reduced dross generation, reduced maintenance, and higher first pass yields

ServoJet™ (Servo-Controlled Reciprocating Spray Fluxing System)• Accurate flux control reduces

bridging• Improved hole penetration• Reduced flux consumption• Precision selective fluxing• Applicable for a wide range of

fluxes

ServoSpray™ (Servo Controlled Reciprocating Spray Fluxing System)• Features air atomized

spray technology• Economical spray

fluxing solution

Intelligent Flux Control™ (IFC) with RunMax Technology*• 2-stage filtration system • Allows for full maintenance

of flux collection units during production

• Programmable self-cleaning feature

NEW

ELECTROVERT® Wave Soldering Systems

NEW

Aquastorm® 100 and 200 SeriesIn-Line Aqueous Cleaning Systems • Available with Mixed Spray Technologies that outperform

all competitive systems• Patented Hurricane Jet™ nozzle technology utilizes

a coherent sheet of unmatched high impact force to penetrate under and around fine pitch components

• JIC spray bars provide pin-point coherent streams of high impact fluid that help blast away residue layers

• Vee Jet™ cleaning provides a specially tapered overlapping spray pattern for even spray coverage across the entire conveyor width

• S-Jet™ nozzle technology creates a unique impingement pattern for enhanced cleaning• ElectroAir™ knife produces a directed flow of high-pressure air for superior drying performance• Windows®-based PC control that allows control and monitoring of important cleaning parameters along with adding product traceability to

cleaning processes (barcode)• Torrid Zone™ Drying System* (optional on AS100 and AS200)* - Forced convection drying module ideal for difficult to dry applications, PCB's exit the Torrid Zone test ready• Available with innovative misprint cleaning feature• Available with features that are designed for Industrial Cleaning applications

ELECTROVERT® Cleaning Systems

ACCEL® Cleaning Systems

MicroCel™Centrifugal Cleaning System• Pre-mixing feature recirculates wash tank to prevent chemistry separation • Completely clean, totally dry product delivery• Spin under immersion wash & rinse, spray rinse and spin dry• Featuring solvent versatility, zero-discharge, short cycle times• No visible residues underneath components at 45X+ optical inspection• Ideal for use in semiconductor, medical devices, wafers and high-reliability

cleaning applications.

ELECTROVERT® Cleaning Option/Features

Aquastorm® 200 Stainless Steel• All Stainless Steel version of the Aquastorm with Dual Wash, Dual Chem Iso and Torrid Zone drying as standard• New 12" (305 mm) throughput clearance for Industrial Cleaning applications• Available with features that are designed for Industrial Cleaning applications

ElectroAir™ Knife Technology• Most efficient air delivery of any air knife

design• Unique design maximizes impact force• Provides exceptional penetration under

low standoff area array components

Hurricane Jet™ Spray Nozzle* • Unmatched performance combining

impact force with high volume • Penetrate and flush out contaminants

from under and around fine pitch and low standoff area array components

* Patented

Aquastorm® 50 Batch Cleaner• In-line cleaning technologies in a batch footprint• Effectively cleans under low stand-off SMT components• Torrid Zone Drying is standard• Available with innovative misprint cleaning feature

Award Winning Technology

ACCEL

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ACCEL

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CAM

ALOT

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CA

MALO

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ELECTR

OVERT

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ELECTR

OVERT

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MPM

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MPM

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WORLD HEADQUARTERSSpeedline Technologies, Inc16 Forge Park, Franklin, MA 02038, USATel: +1 (508) 520-0083Fax: +1 (508) 520-2288info@speedlinetech.com

www.speedlinetech.com

MANUFACTURING AND CUSTOMER SUPPORT FACILITIESACCEL/ELECTROVERT1629 Old South 5, Camdenton, MO 65020, USATel: +1 (573) 346-3341Fax: +1 (573) 346-5554

CAMALOT/MPM16 Forge Park, Franklin, MA 02038, USA Tel: +1 (508) 520-0083Fax: +1 (508) 520-2288

ITW Speedline Equipment (Suzhou) Co., Ltd.No.3 Xiang Street, Tai Shan Road,Suzhou New District,Jiangsu, P.R. China 215159Tel: +86 (512) 6841-3378Fax: +86 (512) 6831-2375

SALES AND CUSTOMER SUPPORT OFFICESMEXICOCarretera Base Aerea #5850 Km. 5, Edificio 21 Zapopan, Jalisco, MéxicoTel: +52 (33) 33-65-6511Fax: +52 (33) 38-18-9019

EUROPEAN OFFICEIm Gefierth 14, D-63303 Dreieich, Germany Tel: +49 (0) 6103-8320Fax: +49 (0) 6103-832-299

ASIA/PACIFIC61 Ubi Avenue, #06-01 UB Point,Singapore 408941Tel: +65 6286-6635Fax: +65 6593-0175asiamarketing@speedlinetech.com

© 2015 Speedline Technologies, Inc All rights reserved. Printed in Singapore. Covered by patent rights issued and/or pending.

Speedline, MPM, Camalot, Electrovert, Accel, Protect, Prodigy, SmartStream, NanoShot, Momentum, Edison, EnclosedFlow, Electra, VectraElite, VectraES2, OmniMax, OmniES, Aquastorm, MicroCel, BridgeVision, SpeedVision, StencilVision, RapidView, SPI Print Optimizer, IsoThermal Chamber Technology, Intelligent Flux Control, UltraFill, Rotary, FloLift, Hurricane Jet, Torrid Zone, DwellMax Plus, Vee Jet, S-Jet and ElectroAir are trademarks of Speedline Technologies or its subsidiaries and affiliated companies. ServoJet, ServoSpray and FluxJet are trademarks of New Plateau Technologies. Windows is a registered trademark of Microsoft Corporation. All other brands may be trademarks of their respective holders.

Overview 2015-11

· Edison · Momentum® Series· Momentum® BTB Series· Momentum® BTB 125· Momentum® Compact HiE· Momentum® Dual Lane

· Prodigy™· MicroCel™

Cleaning Systems

CAMALOT®ACCEL® MPM®

Dispensing Systems

Printing Systems

ELECTROVERT®

Reflow Soldering and Curing Systems

· OmniMax™ Series· OmniES™ Series · OmniES™ Curing Series

Wave SolderingSystems

CleaningSystems

· Electra® · VectraElite™

· VectraES2™

· Aquastorm® 100 and 200 Series· Aquastorm® 200 Stainless Steel· Aquastorm® 50 Batch Cleaner· Aquastorm® Industrial Cleaning Series

ABOUT SPEEDLINE TECHNOLOGIESSpeedline Technologies, a division of Illinois Tools Works, Inc. (NYSE: ITW), is the global leader in process knowledge, services and manufacture of capital equipment used in the printed circuit board assembly and semiconductor industries. Based in Franklin, Massachusetts, USA, with Electrovert & Accel manufacturing based in Camdenton, Missouri, the company markets four best-in-class brands: ACCEL microelectronics cleaning equipment; CAMALOT dispensing systems; ELECTROVERT wave soldering, reflow soldering and curing, and cleaning equipment; and MPM stencil and screen printing systems. For more information about Speedline Technologies visit www.speedlinetech.com.

Speedline Technologies maintains an ongoing program of product improvement that may affect design and/or price. We reserve the right to make these changes without prior notice or liability.

Process Knowledge and SupportAt Speedline Technologies, we deliver world-class products, performance, and unparalleled service and support programs. The proficiency of our process experts allows us to solve real-world applications issues. Knowledge in Process for superior performance.

Knowledge in Process

An ITW Company