Call for Presentations IEW 2016
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10th Annual International Electrostatic Discharge Workshop May 16-19, 2016 Evangelische Akademie, Tutzing, Germany https://www.esda.org/events/iew/ 2016 International Electrostatic Discharge Workshop Located on the shores of Lake Starnberg, 30 kilometers Southwest of Munich, lies the Tutzing estate and its 18th century mansion. It has been chosen as the venue of our workshop with its modern conference rooms and facilities. The spirit of this place encourages thoughtful discussions and intensive interaction. 2016 International Electrostatic Discharge Workshop Call For Presentations The IEW will include invited seminars, technical sessions, special interest groups (SIGs), discussion groups, and invited speakers. The IEW especially invites submission of late-breaking exciting new research to stimulate discussion and interaction around new ideas, encouraging new research topics. To maintain the unique IEW experience and provide ample opportunity for informal discussions, the 2016 IEW workshop presentation format for Technical sessions will begin with each author presenting a brief summary to highlight key findings, followed by an interactive poster-based discussion session among authors and attendees. The IEW is closely aligned with the EOS/ESD Symposium for collaborative conference activities. Two special attention focus issues for IEW 2016 include: Abstract Submission Deadline Nov. 20, 2015 Setting the Global Standards for Static Control! EOS/ESD Association, Inc. 7900 Turin Rd., Bldg. 3 Rome, NY 13440-2069, USA PH +1-315-339-6937 • Email: [email protected] • www.esda.org Automotive Applications EOS/ESD/EMC The electronic content of automobiles is increasing, leading to more complex electronic modules and increasing complexity of meeting integration and reliability requirements for Integrated Circuits. The IEW invites contributions that address EOS, ESD and EMC challenges in automotive IC design, including complying with standards such as Bulk Current Injection (BCI), Direct Power Injection (DPI), IEC-61000-4-2 and ISO-10605. ESD Co-Design—Trade-offs between Requirements for IC Operation, Component-level ESD, System-level ESD, EOS Sensitivity Often, the complexity of an ESD design is increased by the trade-offs required to avoid interfering with other design requirements. The IEW invites contributions that highlight particularly challenging requirements, unique/ novel solutions to meeting those requirements or unexpected interactions between an ESD implementation and another design requirement. Anomalous/Unresolved ESD Issues Random and unrepeatable ESD failures, Case Histories, ESD tester correlation issues, or unique window failures. Unresolved issues that encourage discussion are welcomed! EDA EOS/ESD Tools Best Practices and Experiences EDA EOS/ESD verification and simulation tools; techniques, design-flows and best- practices. Experiences with Foundry rule decks, commercial tools and custom tooling are all welcomed. System-Level ESD/EOS Issues On- and off- chip IEC protection clamps, component/system ESD co-design case studies, cable discharge clamps, transient latch-up, design of system-level clamp circuits, system level ESD test issues and scan techniques, ESD-induced soft errors, and EOS field-failure case studies/ histories/ solutions. Failure Analysis Techniques Locating failure sites, in particular CDM, imaging techniques, correlating FA identified damage site with ESD stress, distinguishing EOS-like failures from ESD failures, and unusual failure modes. Technology Integration Issues ESD sensitivity with technology transfers, 3D IC ESD design issues, qualification challenges for different fabs, unusual problems of process interaction with ESD, process monitor methods, and technology scaling issues. Novel On-Chip Protection Clamps and Circuit Configurations New clamp devices and clamp configurations, methods to increase the failure threshold of protected devices, high voltage clamps for automotive and power amplifiers, out-of-the- ordinary chip protection concepts, and low- capacitance clamps for RF and SERDES. ESD Test Characterization, Methods, & Issues TLP & vfTLP debug and device characterization methods, correlation between TLP & vfTLP tests with standard qualification tests, HBM and CDM tester artifacts, issues relating test qual levels to real-world exposure, test chip methodology, cable discharge test methods, and test standards issues. Areas the IEW would also like you to consider as abstract submission topics include:
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Transcript of Call for Presentations IEW 2016
10th Annual International Electrostatic Discharge WorkshopMay 16-19, 2016
Evangelische Akademie, Tutzing, Germanyhttps://www.esda.org/events/iew/
2016 International Electrostatic Discharge WorkshopLocated on the shores of Lake Starnberg, 30 kilometers Southwest of Munich, lies the Tutzing estate and its 18th century mansion. It has been chosen as the venue of our workshop with its modern conference rooms and facilities. The spirit of this place encourages thoughtful discussions and intensive interaction.
2016 International Electrostatic Discharge WorkshopCall For Presentations
The IEW will include invited seminars, technical sessions, special interest groups (SIGs), discussion groups, and invited speakers. The IEW especially invites submission of late-breaking exciting new research to stimulate discussion and interaction around new ideas, encouraging new research topics. To maintain the unique IEW experience and provide ample
opportunity for informal discussions, the 2016 IEW workshop presentation format for Technical sessions will begin with each author presenting a brief summary to highlight key findings, followed by an interactive poster-based discussion session among authors and attendees. The IEW is closely aligned with the EOS/ESD Symposium for collaborative conference activities.
Two special attention focus issues for IEW 2016 include:
Abstract Submission Deadline Nov. 20, 2015
Setting the Global Standards for Static Control! EOS/ESD Association, Inc. 7900 Turin Rd., Bldg. 3 Rome, NY 13440-2069, USA
PH +1-315-339-6937 • Email: [email protected] • www.esda.org
Automotive Applications EOS/ESD/EMC The electronic content of automobiles is increasing, leading to more complex electronic modules and increasing complexity of meeting integration and reliability requirements for Integrated Circuits. The IEW invites contributions that address EOS, ESD and EMC challenges in automotive IC design, including complying with standards such as Bulk Current Injection (BCI), Direct Power Injection (DPI), IEC-61000-4-2 and ISO-10605.
ESD Co-Design—Trade-offs between Requirements for IC Operation, Component-level ESD, System-level ESD, EOS SensitivityOften, the complexity of an ESD design is increased by the trade-offs required to avoid interfering with other design requirements. The IEW invites contributions that highlight particularly challenging requirements, unique/novel solutions to meeting those requirements or unexpected interactions between an ESD implementation and another design requirement.
Anomalous/Unresolved ESD Issues Random and unrepeatable ESD failures, Case Histories, ESD tester correlation issues, or unique window failures. Unresolved issues that encourage discussion are welcomed!
EDA EOS/ESD Tools Best Practices and ExperiencesEDA EOS/ESD verification and simulation tools; techniques, design-flows and best-practices. Experiences with Foundry rule decks, commercial tools and custom tooling are all welcomed.
System-Level ESD/EOS Issues On- and off- chip IEC protection clamps, component/system ESD co-design case studies, cable discharge clamps, transient latch-up, design of system-level clamp circuits, system level ESD test issues and scan techniques, ESD-induced soft errors, and EOS field-failure case studies/ histories/solutions.
Failure Analysis TechniquesLocating failure sites, in particular CDM, imaging techniques, correlating FA identified damage site with ESD stress, distinguishing EOS-like failures from ESD failures, and unusual failure modes.
Technology Integration Issues ESD sensitivity with technology transfers, 3D IC ESD design issues, qualification challenges for different fabs, unusual problems of process interaction with ESD, process monitor methods, and technology scaling issues.
Novel On-Chip Protection Clamps and Circuit Configurations New clamp devices and clamp configurations, methods to increase the failure threshold of protected devices, high voltage clamps for automotive and power amplifiers, out-of-the-ordinary chip protection concepts, and low-capacitance clamps for RF and SERDES.
ESD Test Characterization, Methods, & Issues TLP & vfTLP debug and device characterization methods, correlation between TLP & vfTLP tests with standard qualification tests, HBM and CDM tester artifacts, issues relating test qual levels to real-world exposure, test chip methodology, cable discharge test methods, and test standards issues.
Areas the IEW would also like you to consider as abstract submission topics include:
Management Committee: Management Committee Chair: Souvick Mitra, GLOBALFOUNDRIESTechnical Program Chair: Hans Kunz, Texas Instruments, Inc.Seminar Chair: Mirko Scholz, imecInvited Speaker Co-Chairs: Lorenzo Cerati, STMicroelectronics Michael Mayerhofer, Infineon Technologies
Discussion Groups/Special Interest Groups Co-Chairs:Christian Russ, Intel Mobile CommunicationsPatrice Besse, FreescaleKeynote Speaker Chair:Christoph Thienel, Robert Bosch GmbHAudio/Visual Co-Chairs:Nathan Jack, IntelChen Shih-Hung, imecArrangements Chair:Harald Gossner, Intel Mobile CommunicationsPublicity Co-Chairs:Bart Keppens, Sofics Matthew Hogan, Mentor Graphics Asian Publicity:
Kitae Lee, Samsung US Publicity:
Charvaka Duvvury, ESD Consulting LLCIndustry Council Advisor: Charvaka Duvvury, ESD Consulting LLCESDA IEW Business Unit Manager:Alan Righter, Analog DevicesESDA HQ Director of Operations:Lisa Pimpinella
ESDA Education Business Unit Manager:Ginger Hansel, Dangelmayer Associates
Technical Program Committee:Efraim Aharoni, TowerJazzWarren Anderson, SynopsysFabrice Blanc, ARMFabrice Caignet, LAAS Jordan Davis, On SemiconductorJames Di Sarro, Texas InstrumentsEleonora Gevinti, STMicroelectronicsHang-Gu Kim, SamsungDimitri Linten, imecAlain Loiseau, IBM Timothy Maloney, IntelMarkus Mergens, QPX GmbHRahul Mishra, GLOBALFOUNDRIESDionyz Pogany, Vienna University of TechnologyWolfgang Reinprecht, AMSJavier Salcedo, Analog DevicesAugusto Tazzoli, Maxim Integrated ProductsJim Vinson, IntersilJoost Willemen, Infineon Technologies
Submission InstructionsIn keeping with the informal character of this workshop, please prepare your abstract in the form of a short powerpoint presentation. After the title slide, the second slide of the presentation should describe the objective and significance in a 200 word summary. The presentation should not exceed 5 additional slides; with representative data and figures that will be the foundation for the poster you plan to present at the workshop. Please save your presentation abstract in pdf format and email including title, author affiliation, and e-mail address to [email protected] no later than November 20, 2015. The submission format is a PDF® file (Adobe Acrobat®). Notification of acceptance will occur by December 16, 2015. Final, full presentations for the workshop in MS PowerPoint® format must be received by April 15, 2016. There will be no published proceedings of the workshop. For any questions please contact the Technical Program Chair, Hans Kunz ([email protected]). The IEW encourages student submissions by providing a 50% discount in registration fees for a limited number of student presenters. Proof of student status must be submitted along with the abstract for the workshop presentation.
Lodging & FacilitiesLocated on the shores of Lake Starnberg, 30 kilometers Southwest of Munich, lies the Tutzing estate and its 18th century mansion. It has been chosen as the venue of our workshop with its modern conference rooms and facilities. The on-site single and double bedrooms provide a comfortable stay within the quietness of the private park around the castle. From the balconies and the patios there is a magnificent view of Bavarian Alps. The spirit of this place encourages thoughtful discussions and intensive interaction. Lodging for Monday, Tuesday, and Wednesday nights, plus meals starting with Monday Lunch-Thursday Breakfast are included in the registration costs for the workshop. Attendees are allowed to bring guests who will be charged separate fees.Please check our web page at www.esda.org/events/iew for regular updates on the workshop. As it becomes available, we will post information on the full technical program including the seminar topics, the keynote speaker, the technical sessions, as well as the discussion group and special interest group topics. In addition to peer-reviewed presentations, attendees will also have the option to present non-peer-reviewed posters at the workshop. Please also go to the web page for information on workshop registration, as well as the Tutzing area.
Setting the Global Standards for Static Control! EOS/ESD Association, Inc. 7900 Turin Rd., Bldg. 3 Rome, NY 13440-2069, USA
PH +1-315-339-6937 • Email: [email protected] • www.esda.org
