Ca To Enhance The Breakthrough Of Intelligent Textile Systems
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Transcript of Ca To Enhance The Breakthrough Of Intelligent Textile Systems
Information über die Sensorik-relevanten Förderprogramme der EU
Sensor + Test 2008 Sensor + Test 2008 Nürnberg, 6 Mai 2008
Thomas REIBEMicrosystems Unit
European Commission, Brussels
Presentation outline
• Microsystems + Flexible, organic & large area
electronics + Microelectronics + Embedded Systems
• Sensors in the EU Framework Programmes
• European Technology Platforms (ETP)
• FP7 outcome of the first 2 ICT calls
• The way ahead in Work Programme 2009-2010
Micro and nanosystems technologies play a crucial role in modern knowledge-based economies
Europe has a traditional leading position in Microsystems and related advanced technologies and should capitalize on this
competitive advantage
Europe has a traditional leading position in Microsystems and related advanced technologies and should capitalize on this
competitive advantage
• Microsystems technologies is one of the most important drivers of ICT, which account for about 40% of Europe’s productivity growth
• The relevance of Microsystems comes from:
• The importance of the semiconductor and micro/nanoelectronics market
• The added value that the smart systems provide to the applications and systems where they are integrated
• R&D institutes play an important role in the early phase of the MNT development, prior to industrialization
R&D in Microsystems in the EU Framework Programmes: from MEMS to Smart Systems
FP4
MEMS Micro and NanosystemsMicro and NanotechnologiesIndustrial applications of MEMS
Smart Systems: Complex systemscombining sensing, processing and actuating
The EU Framework Programmes have always paid attention to the area of Microsystems, from a focus on MEMS in the
early 90’s to heterogeneous technologies for multifunctional systems now
The EU Framework Programmes have always paid attention to the area of Microsystems, from a focus on MEMS in the
early 90’s to heterogeneous technologies for multifunctional systems now
FP5 FP6
Smart Systems: Heterogeneous technologies for multifunctional systems
FP7
Microsystems is an enabling technology, bringing together separate technologies and sciences
Applications• Inter-disciplinarityMechanics, electronics, fluidics, biology, magnetism, optics, photonics, chemistry,
• Multiple functionalities
Sensing, processing, actuating, energy harvesting and storage, communication, memory, logic
• Convergence of heterogeneous technologies Micro/nanotechnologies, ICT, bioengineering
• Heterogeneous Materials Semiconductors, ceramic, glass, organics and polymers, metals
• Biomedical• Transport• Telecommunications• Automotive• Safety• Environment• Smart textiles, …
Flexible, Organic and Large Area Electronics (OLAE), towards heterogeneous integration
• Inorganics/organics combinations, bio & heterogeneous integration in foils, lab-on-chips, printed logic and RFIDs also addressed
• New manufacturing paradigms & very low cost applications
Enabling functions: logic, memory, RFIDs, sensing, lighting, signage, energy scavenging/storage & power management, visualisation systems and displays
Enabling functions: logic, memory, RFIDs, sensing, lighting, signage, energy scavenging/storage & power management, visualisation systems and displays
Distribution of budget by thematic cluster
35%
18%18%
11%
10%6% 2%
Nano Bio ICT (NBIC)
Sensor based Systemsand Storage
Organic/Large areaelectronics and Displays
Micro/Nanosystems forAmI
Manufacturing/processesintegration
Smart fabrics/Interactivetextiles
Support and CoordinationActions
10 projects(3 IPs, 1 NoE)
31 M€
11 projects(4 IPs)
54 M€
5 projects(3 IPs, 1 NoE) 35
M€
10+4 projects(2+1 IPs, 2 NoEs)
Sensors/Microsystems + OLAE activities in FP6
101 M€
24 projects (6 IPs)
55 M€
11 projects 6 M €
Total budget 301M€
8 projects(4 IPs)
47 M€
Micro/Nano-bio ICT
AmI
Sensor-based systems &
storage
Smart textiles Support &
Coordination
Organic electronics &
displays
Mfg/Process integr.
Wireless sensor networks
6 projects
ETPs, an industry led forum conceived to support the European Research and Innovation Area
POLICY
POLICY
RESEARCH
RESEARCH
BUSINESS
BUSINESS
A spiral model of innovation
• Capitalising on the multiple reciprocal relationships between public & private stakeholders,
• Addressing major technological challenges in specific domains
• Aiming to leverage public & private investment for R&D & innovation
• Bundling fragmented R&D efforts towards agreed goal • Boosting Europe’s competitiveness via research and innovation
ETPs are defining and implementing
the Strategic Research Agendas (SRAs): medium to
long term key objectives for the
technology
... And some figures• 34 ETPs, 9 in ICT
• More than 700 organizations involved in ETPs (large companies, SMEs, universities, research labs, ...)
• 9 SRAs in ICT field, a very important input to ICT WPs
ETPs, a key organisational innovation in the creation and exploitation of innovation-friendly markets
Some benefits from ETPs• Speed up innovation by knowledge sharing
• Pool of resources to overcome technology roadblocks
• Build partnership to share risk
• Attract higher research investment in Europe
• Optimise the return of public & private research investment
• Help turn research results into marketable products and services
• Boost industrial competitiveness and meet society´s needs
PARADES
www.roboticsplatform.com
www.nessi-europe.com
www.emobility.eu.org
EUROP
www.photonics21.de
www.nem-initiative.org
www.isi-initiative.eu.org
www.artemis-office.org
www.eniac.eu
To boost the development of robotics business & bringrobotics services to Europe’s citizens
New software & services architecturebased on open standards
To reinforce Europe’s world leadership in mobile & wireless communications & services
To explore the almost limitless applications of lightfor ICT, lighting, manufacturing and health applications
Convergence of existing and new media technologies creating advanced personalised services
An integral Satcom initiative covering all aspects ofsatellite communication
To address the needs of silicon-basedtechnologies & beyond
Ubiquitous, interoperable & cost-effective embedded systems
There are 34 ETPs successfully working, 9 in ICT
A multi-disciplinary endeavour:Combining optics, mechanics, electronics, fluidics, thermodynamics, chemistry, biology
Converging scientific disciplines: Looking at the overlapping areas between nano-, bio-, information & cognitive sciences
Multi-material integration:
Semiconductors, polymers (plastics), ceramics, glass, …
Multi-technology integration:
Monolithic, hybrid, multichip, large-area, … miniaturisation techniques
Multi-functional integration:Combining sensing, processing, actuating
EPoSS, the ETP in Smart System Integration
www.smart-systems-integration.org
Results from ICT first calls
• ICT call 1 « Next generation Nanoelectronics Components and electronics integration » related to More than Moore
• ICT call 1 « Organic & large area electronics, visualisation and display systems »
• ICT call 2 « Micro/nanosystems »• ICT call 2 « Networked Embedded and Control
Systems » related to wireless sensor networks
FP7 Projects - Nanoelectronics“More than Moore”
FP7 Call 1 in Nanoelectronics covered:
• More Moore: “to advance miniaturization in baseline CMOS technology”
• More than Moore: “to master diversification targeting non-digital applications, heterogeneous integration in Systems-on-Chip (SoC) or Systems-in-a-Package (SiP)”
• Beyond CMOS: “to prepare for the technology generation beyond the CMOS scaling”
FP7 ICT Call 1on Nanoelectronics
Total budget: 86 M€
- More than Moore: 32 M€- Beyond CMOS: 3 M€- More Moore – Miniturisation: 51 M€.
FP7 “More than Moore” Example of projects
Wadimos: “To develop a generic technology for the realization of complex electro-photonic integrated ICs using standard CMOS processing technologies.”
Rec. Fund: 2.3 M€Coordinator: Interuniversity Micro-Electronics Center, IMEC
Icestars: “Integrated Circuit/EM simulation and design technologies for advanced Radio Systems-on-chip.”
Rec. Fund: 2.8 M€ Coordinator: NXP Semiconductor B.V.
Elite: “Extended Large (3-D) Integration Technology”Rec. Fund: 3.6 M€Coordinator: Qimonda Flash GmbH
Athenis: “Automotive Tested High Voltage and Embedded Non-Volatile Integrated System on Chip”Rec. Fund: 5.15 M€Coordinator: Austriamicrosystems AG
Mocha: “MOdelling and CHAracterization for SiP Signal and Power Integrity Analysis”Rec. Fund: 1.85 M€Coordinator: STMicroelectronics S.r.l, Italy
NANOPACK IP: “Nano Packaging Technology for Interconnects and Heat Dissipation”Rec. Fund: 7.4 M€Coordinator: Thales SA
FP7 ICT Call 1on Organic and Large
Area Electronics
Total budget: 63 M€
- 20 new projects funded in Organic and Large Area Electronics
- 13 new projects in the field with a EU funding of ≈43M€
- Emergence of large area/inorganics: large area sensor and memory.
• Flexible, organic and large area electronics have a high potential market growth
• New large area electronic device processing capabilities are acting as a powerful driver
• In FP6 and FP7, the EC has funded 31 projects in this field with a contribution exceeding 140 M€
• The focus is on large area electronics and materials for low cost manufacturing and subcomponents like energy scavenging and storage, memories, sensors and OLEDs and flexible displays
Flexible, Organic and Large Area Electronics, an emerging field
POLYNET (NoE)FACESSPRODI (CSA)OLATRONICS
3PLASTPRIMEBITS
OLEDs
COMBOLEDFAST2LIGHT (IP)
OPERA (CSA)AEVIOMPOLYMAP (CSA)
(b): Display Systems & Visualisation
Real3DMAXIMUS
IMVISMEMIHELIUM3D
AMAZOLED HYPOLED
FLAME
BIND
20.5M€42.5M€
Flexible, Organic and Large Area Electronics in FP7
(a): Organic & Large Area Electronics
http://cordis.europa.eu/fp7/ict/organic-elec-visual-display/
projects_en.html
FP7 ICT Call 2“Micro and
nanosystems”
Total budget: 83 M€
Micro and nanosystems in FP7
• Next generation smart systemsSensor- & actuator-based systemsHigh density mass storage• Micro/Nano-Bio-ICT convergenceBiosensors, lab-on-a-chip, bioMEMS,autonomous implants
• Integration of smart materialsIntegration of MST and smart systems into new & traditional materials, e.g. textiles, glass, paper
• From smart systems to viable productsMicrosystems manufacturing technologies• Smart systems for communications & data managementSmart micro/nanosystems enabling wireless access & facilitating intelligent networking
• Support actionsTechnology access, education & training, coordination and dissemination at EU level
Manufacturing (1IP, 3 STPs, 16.85 m€)
MST for Energy/power
(4 STPs, 12.3 m€)
Support actions (3 CSA, 2.25 M€)
Materials, Sensors, Actuators, etc
MEMS-NEMS
and Integration
(6 STPs, 18m€)
Micro-Nano-Bio Convergence
(7 STPs, 2IPs, 33.6 m€)
Areas covered after Call 2 on Micro/nanosystems*
* Under negotiation
•Micro/nano/bio technologies, biosensors, LoC: • LabonFoil: Ultra low cost laboratories on chip • PYTHIA: Monolithically Integrated Interferometric Biochips for label-free Early Detection of Human Diseases• MicroFLUID: Micro-Fabrication of polymeric Lab-on-a-chip by Ultrafast lasers with Integrated optical Detection• ULTRA: Ultra-fast electronics for Terahertz Rapid Analysis in compact lab-on-chip applications
•Micro-robotics and integrated micro-systems for endoluminal surgery (ARAKNES)•Micro-Nano Sensors & transducer based systems
• ULTRAsponder: In vivo Ultrasonic Transponder System for Biomedical Applications• MiniSurg: Miniaturized Stereoscopic Distal Imaging Sensor for Minimally Invasive Surgery • NANOMA: Nano-Actuators and Nano-Sensors for Medical Applications
•Multichannel Electrode systems• TIME: Transverse, Intrafascicular Multichannel Electrode system for induction of sensation and treatment of phantom limb pain in amputees
Micro-Nano-Bio Convergence
• DATA STORAGE
• SUPARSS: Super-Resolution for Advanced Storage Systems• TERAMAGSTOR: Terabit Magnetic Storage technologies
• ENERGY STORAGE
• E-STARS: Efficient Smart sysTems with enhAnced eneRgy Storage • GREENBAT: GREEN and SAFE thin film Batteries for flexible cost efficient energy storage
Micro/Nanosystems for Energy/power
• MEMSPACK: Zero- and First-level packaging of RF-MEMS
• NEMSIC: Hybrid Nano-Electro-Mechanical/Integrated Circuit Systems for Sensing and Power Management Applications
• ARASCOM: MEMS and Liquid Crystal based, Agile Reflect-array antennas for Security and Communication
• TUMESA: MEMS tuneable Metamaterials for Smart Wireless Applications
• MAC-TFC: MEMS Atomic Clocks for Timing, Frequency control and Communications
• MEMFIS: Ultra-small MEMS FTIR Spectrometer
MEMS-NEMS and Integration
• MEMS4MMIC: Enabling MEMS-MMIC technology for cost-effective multifunctional RF-system integration
• SMARTHIES: Smart inspection system for high speed and multifunctional testing of MEMS and MOEMS
• TIPS: Thin Interconnected Package Stacks
• HERMES: Large area manufacturing and high density integration of electronic circuits
Manufacturing
• EuroTraining-MST: SA on Microsystems and smart systems integration training
• SYSTEX: CA to enhance the breakthrough of intelligent textile systems • CEPoSS: Coordination action on smart systems integrated technologies
Support Actions
Call 2 – Strategic Objective Wireless Sensor Networks
• Target for sub-area “wireless sensor networks”:– TWO orders of magnitude more
sensors– HALF the maintenance time and
cost– ONE order of magnitude less effort
• New services and applications tailored to specific needs
FP7 ICT Call 2“Networked
Embedded and Control Systems”
Total budget: 47 M€
EU-funded Research in FP7 Wireless Sensor Networks
Networked Embedded and Control Systems – CHOsen – Automotive and Aerospace– CONET – WSNs and Cooperating Objects– GINSENG – Energy Distribution– IPAC – Plant control; Traffic Management;
Crisis management– LocON – Localisation; large-scale
infrastructures– PECES – Automotive; Localisation– POBICOS – Home Automation and Energy-
Efficient Buildings– SM4ALL – Smart Homes and Home Care
DOTSENSEGroup III-nitride quantum dots as optical transducers for chemical sensors
MARISE Materials for avalanche receivers for ultimate sensitivity
MINIGASMiniaturised photo-acoustic gas sensor based on mid-infrared lasers
PHOSFOS Photonic skins for optical sensing
SENSHYPhotonic sensing of hydrocarbons based on mid-infrared lasers
Photonic SensorsProjects Supported by DG-INFSO Photonics Unit
The way ahead: the preparation of WP2009-2010
Orientation paper
Draft WP
Dec 07 June 08 Dec 08 June 09
Final WP
Consultations Drafting Decision Call 4 Call 5
ETPs ICTC EC
Microsystems and Smart Systems Work programme 2009-10
• Strengthen project portfolio in the area
FP6 and FP7 call 2
• Emphasis on intelligence integration
Multisensing, context awareness
• Smart systems based on innovative nanosensing principles
Nanowires, CNT-based MEMS
• Specific chapter on autonomous energy efficient smart systems
Energy scavenging, power generation, efficient communication
WP ’09-10 – Flexible, organic and large area electronics
• Objective should continue the orientation defined in the previous work programme, if no additional budget is becoming available.
• Research should focus on material-device co-developments and system integration, based on functional building blocks, measurement & inspection, quality control and automation.
• Building blocks are important: TFTs, sensors, memories, energy sources and power management, OLEDs for displays & lighting, organic photovoltaics etc.
• Emphasis on inorganic / organic material thin layer structuring• Fundamental research should be in parallel with applied research
leading to device demonstrators for short term applications, including field tests.
• Support measures should facilitate standardisation, training and education
• International collaboration might be beneficial but also difficult.• All instruments IPs, Streps, NoEs, CA & SSAs are appropriate, but
STREPs and IPs should not compete for the same budget.• Next call should be published as soon as possible.
Vision from 20.2.2008 consulation meeting:
Future calls: Nanoelectronics
FP7 WP09/10• Miniaturisation and
functionalisation • Manufacturing
technologies• Design of
semiconductor components and electronic based miniaturised systems (in a separate call)
ENIAC Call 1 (to be published on 8 May 08 at http://www.eniac.eu )
• Nanoelectronics for Transport and Mobility
• Nanoelectronics for security and safety
• Nanoelectronics for energy and environment
• Design methods and tools for nanoelectronics
• Equipment and materials for nanoelectronics
WP ’09-10 - Engineering of Large-Scale, Complex Networked Systems
Wireless Sensor Networks Facilitate the deployment, activation, operation and low-cost
maintenance of distributed systems composed of heterogeneous networked smart objects, e.g. in manufacturing, process plants, buildings and large scale infrastructures, aiming at flexibility, reliability, dependability, safety, security and energy efficiency, as well as lower cost
• Focus on:– semantics that allow object/service definition and instantiation– abstractions and support tools to facilitate (re)programming– lightweight operating systems and kernels– open wireless communication protocols for harsh (industrial)
environments– virtual sensing/actuation through aggregation of sensors/actuators– novel large-scale applications of wireless sensor networks
Photonics Work programme 2009-10
• Key applications and social needs• Lighting and light sources • Biophotonics• Communications• Cost effective high-performance imaging for
Safety & Security• Highly integrated components for high average
and high peak power lasers (ICT & industrial applications)
• Organic Photonics
• Disruptive technologies
Particularly relevant for Heterogeneous
Integration
Particularly relevant for Heterogeneous
Integration
• European research on the web:– http://cordis.europa.eu– http://cordis.europa.eu/fp7– http://ec.europa.eu/comm/research/future/
• Information Society and Media:– http://cordis.europa.eu/fp7/ict/programme/
challenge3_en.html
• Contact:– [email protected]– [email protected]
• European research on the web:– http://cordis.europa.eu– http://cordis.europa.eu/fp7– http://ec.europa.eu/comm/research/future/
• Information Society and Media:– http://cordis.europa.eu/fp7/ict/programme/
challenge3_en.html
• Contact:– [email protected]– [email protected]
Thank you! …