Burn-in & Test Socket Workshop 2000 Session 2LP Goh Feb 2000 Intel Itto Penang 8 BiTS Feb 2000...

Session 2

Socket Design

Burn-in & TestSocket Workshop2000

COPYRIGHT NOTICE• The papers in this publication comprise the proceedings of the 2000BiTS Workshop. They reflect the authors’ opinions and are reproduced aspresented , without change. Their inclusion in this publication does notconstitute an endorsement by the BiTS Workshop, the sponsors, or theInstitute of Electrical and Electronic Engineers, Inc.

· There is NO copyright protection claimed by this publication. However,each presentation is the work of the authors and their respectivecompanies: as such, proper acknowledgement should be made to theappropriate source. Any questions regarding the use of any materialspresented should be directed to the author/s or their companies.

BURN-IN & TESTSOCKET WORKSHOP

“Package Tolerance Of VFQON: Effect On Socket Design”David Pfaff Marc AbelanetPlastronics Plastronics

“Aspect Of Socket Designs And Its Trends”Lin Pong GohIntel

“Interconnect Solutions For ATE”Mehdi Attaran Iraj BarbaiOztek Oztek

Presentations

Package Tolerance ofVFQON: Effect on Socket

Design

2000 Burn-in and Test Sockets WorkshopFebruary 27-29th, 2000

Marc Abelanet and David Pfaff2601 Texas Drive

Irving Texas 75062972-258-2580;

[email protected]

10/11/99BITSConference

February 28th, 2000 2Plastronics Socket Co.

Agenda

• New Package Family– JEDEC Proposal– Packaging Industry Versions

• Tolerance Study of JEDEC Proposal• Effect on Socket Design - Optimal Design?• Conclusion



New JEDEC Family

• Plastic thin fine pitchquad flat no leadpackage or VFQON

• Industry needs forpackage– Light weight– Small outline– Excellent electrical

characteristics

• Similar to crossbetween LCC and LGApackages



Packaging Industry Versions

• Amkor - MLF• ASAT - LPCC• JEDEC MO-208 (example: Fujitsu - BCC+)• JEDEC MO-209 (example: Samsung - SON)• All Similar Types of Packages

– Flat pad leads on peripheral of device– Leads on bottom side of package only (minimal on side)– Registration to the socket only on outside of package– Wide variety of sizes and pitches

• Sizes from 3 to 10 mm• Pitches of 1, .8, .65, and .5mm



JEDEC VFQON PackageTolerances

• Analysis of Outside Dimensions• Analysis of Pad Dimensions• Locational Tolerances of Pads vs. Body• Finalized Tolerance Study with all Factors

– Per JEDEC– Per Amkor MLF



Outside Dimensional Tolerances



Pad Dimensional Tolerance



Locational Tolerances of Pads



Full Tolerance Analysis Per JEDEC


February 28th, 2000 10Plastronics SocketCo.

Full Tolerance Analysis Per Amkor



Socketing Issues Topics

• Electrical Considerations of Contact Element• Size of Contact

– Ability to Mold Components– Ability to Assembly Socket

• Inexpensive Method of Providing Sockets forDifferent Variations of VFQON

• Ability (Difficulty) to Meet Tolerances of Package



Electrical Characteristics

• Package is built for highfrequency,telecommunicationsdevices

• Contact for burn-in use,but good electrical specs.

• Inductance ~3nH• Resistance <30 mOhms• Surface Compression

Mount or Through-Hole• Size - .150”x.150”x.004”



Mold and Assembly of Socket

• Size of contact .004”• Molding gate

allowance of .006” forslots

• Autoloader machinesize tolerance .001”



Different Size Packages

• Must be inexpensiveto tool

• One master socket– Lid with interchangeable

pressure plates– Base

• Two piece modularinserts– Option of surface mount

or through-hole



Meeting the Tolerance of thePackage

• Difficulty to make reliable contact with JEDEC designspecifications– Alignment to the contact pads

• Location of package in plastic guides to be within +/-.001”

• Contact size limited to .004” per force curveconsiderations

• Contact size also limited to .006” for space betweenmaximum size package terminal

• Tolerances of package critical to build functionalsocket - mainly OD variation



Conclusion

• Large variety of packages creates requirement foreasily adaptable sockets

• Electrical characteristics of new package typecreate requirement for high-performance contact

• Volume nature of connector creates requirementfor low-cost stamped or formed contact

• Tolerance is based on specific packaging house,not wide JEDEC tolerances

BiTS Feb 2000

Aspect of Socket Designs and its TrendsAspect of Socket Designs and its Trends

byLP Goh

Intel Technology Sdn. BhdIntel Test Tooling Operation (ITTO)

Malaysia

Intel Itto PenangLP Goh Feb 2000

2LP Goh Feb 2000 Intel Itto Penang

BiTS Feb 2000

Objective IntroductionComparison of various types of BIS featuresCurrent design trendCommon issues during developmentFuture trendConclusion

Agenda:


BiTS Feb 2000

Objective

Elaborate current socket trends fromassembly (BIB interface), cost, automationand performance point of view

Address common BIS development issuesFuture BIS cost and performance

requirement trends


BiTS Feb 2000

Introduction:

BI: to screen device infant mortality.BIS: interface hardware between DUT and BIBSocket’s functionality, cost, delivery, maintainability are critical items for product delivery. Failure Rate

456789

1011

1 3 5 7 9 11 13 15 17

Time

Fai

lure

Rat

e

Figure 1: Bath Tub curve


BiTS Feb 2000Comparison of various types of BISfeatures:

1. BIB-interface type of socket.Through hole SMT

Cost per unit socket Low HighMaintenance Difficult (soldered) Easy (screw mounted)BIB interface Reliable Not reliable (BIB warpage)

Open top Clamp shellAutomation Excellent Poor Manual operation Not ergonomic RecommendedDimensional tolerance Tight (automate) Loose (manual)Actuation High force Low forceCost per socketing Low High

2. Operation-mode type of socket


BiTS Feb 2000

Current Design trend

1. Design for BIB assembly processA. Through-hole type socketThrough-hole type needs to accommodate two challenges:

Pitch of device lead is getting finer (2.54mm, 1.27mm, 1mm, 0.8mm); as a result, solder bridging (shorted condition between solder tail after wave solder) worsen(b) through hole type burn-in socket is not reusable after it has been soldered

B. Surface Mount Socket

Challenges faced by surface mount socket:(a) high contact-pin-to-pad force induced high warpage on BIB. Extra components are required to minimize warpage.(b) Higher cost


BiTS Feb 2000

Impact of solder bridge

Figure 2: Impact of solder bridgePlastic material melted and stick to contact pin

Contact pin


BiTS Feb 2000

Current Design trend ctd…

2. Design for real estate management and cost

higher socket density per board (minimum X & Y)higher board density per burn-in oven (minimum Z height), trade off between power, heat sink height and BIS density requirement.increasing number of passive component required per board.Sharing mold toolre-use socket for close form factor package


BiTS Feb 2000

Current Design trend ctd…

3. Design for automation

Tight dimensional tolerance is required for precision alignment between socket and package.Open top socket for ease of package loadingLong lasting with appropriate material, PES, PEIActuated type to capture and release package easilyRobust contact pin design for repetitive processIncreasing in pin count, increasing in actuation force


BiTS Feb 2000Current Design trend ctd…

4. Design for performance

Contact pin to carry high current and low inductanceHigh performance heat sink for heat dissipation .Maintain contact pin force while pin count is increasing

Simple contact pin for spring force

Figure 3: Contact pin design for performance


BiTS Feb 2000

Common Issues during development

1. Project management/ coordinationTool modification lead time impacting project schedule.

2. Prediction tool capabilitiesThermal, mechanical and electrical simulation reduces the design modification iteration. Fine tuning on tooling is still required.Prototype socket in early discovery work is costly.


BiTS Feb 2000

3. Component DesignEfficient heat sink requires for high power product occupies invaluable space.Low inductance contact needed for high frequency testing

Common issues during development ctd…...

Figure 4: Simulation to optimize heat sink geometry


BiTS Feb 2000

Future trends

1. Cost and time to marketReplaceable/ reusable socket for next generation burn-in socket.Viability of flexible socket toolingConcept of test during burn in

2. Socket technologyDevice package is evolving --- smaller in size, more pins. Socket needs to have more pins while maintaining its minimum contact force.Socket contact pin performance in high current environment.


BiTS Feb 2000

Conclusion

Burn-in socket is a critical item to enable product to meet the competitive market needs. The socket design, cost, delivery schedule and volume capacity will come under intense scrutiny in this competitive semiconductor industry.

The total solution for future burn-in requires re-usable, long lasting, easy to produce, low cost (burn-in per device) and high performance socket. User needs to balance between cost versus performance requirement.

Interconnect Solutions for ATE

Iraj Barabi / Mehdi AttaranOZ Technologies Inc.February 26th 2000

Industry Trends

MiniaturizationReduced Pitch , Increased Pin CountIncreased Performance RequirementsMulti-site testingIntegrated solutionSpeed & flexibility

Contactor DesignConsiderations

Electrical PerformanceMechanical PerformanceDimensional VariationsDesign Reuse\ModularityManual and Automated Test CapabilityField ServiceableCost Effective

Electrical Requirements

AC< 1nH contact InductanceLow cross-talkLow capacitanceSimulation

DC<40 m Ohm contact ResistanceCurrent carrying capacity

Equivalent Circuit Diagram

Electrical Modeling

Electrical Modeling

Electrical SimulationElectrical Simulation

Current Density

Mechanical Requirements

High level of accuracySimulation & Modelinglarge window of operationModular designlong LifeReduced mechanical cross-talkControlled contact pointThermal consideration

AAss= 0.4mm-0.6mm= 0.4mm-0.6mmBBss= 0.5mm-0.7mm= 0.5mm-0.7mm

AAaa=0.46mm=0.46mm BBaa=0.6mm=0.6mm

Accuracy

Accuracy Of DesignAccuracy Of Design

Corner #1 Corner #2

Corner #3 Corner #4

Mechanical Modeling

Force

Deflection

Mechanical Modeling

Thermal SimulationThermal Simulation

Structural Simulations

Large Window Of OperationLarge Window Of Operation

Modular Design

Modularity

2 PC housing pins performance 100K (PI1566)

10

60

110

160

210

260

310

360

0 20000 40000 60000 80000 100000

Cycles

Con

tact

(moh

m)

Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 Pin 8Pin 9 Pin 10 Pin 11 Pin 12 Pin 13 Pin 14 Pin 15 Pin 16Pin 17 Pin 18 Pin 19 Pin 20 Pin 21 Pin 22 Pin 23 Pin 24Pin 25 Pin 26 Pin 27 Pin 28 Pin 29 Pin 30 Pin 31 Pin 32

Life Cycle Testing

0 50

100

150

200

250

300

0

20,000

40,000

60,000

80,000

100,000

120,000

140,000

160,000

180,000

200,000

220,000

240,000

260,000

280,000

300,000

320,000

340,000

360,000

380,000

400,000

420,000

440,000

460,000

480,000

500,000

Life cycle vs. Resistance

Num

ber of Insertions

Resistance mΩ

Mechanical Cross-Talk

Deflection=~0.010”Force= ~ 10gf

AmbientAmbient

Controlled Contact

AmbientAmbient

After

Before

Controlled Contact

Thermal Considerations

Air Intake

Thermal Considerations

Thermal Simulations

Conclusion

• Design and validation of ATE testcontactors requires a vast array ofdiscipline and technologies.

• Mechanical, Electrical, Thermal andfunctional requirements must beoptimized in a concurrent and interlinkedprocess to yield necessary performancerequirements.

Burn-in & Test Socket Workshop 2000 Session 2LP Goh Feb 2000 Intel Itto Penang 8 BiTS Feb 2000...

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