Brief AML Presentation
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Transcript of Brief AML Presentation
AML – Wafer Bonding Machines & Services
AML Equipment & Services overview
AML – Wafer Bonding Machines & Services
Who is who in AML(Main contacts)
Rob Santilli - Managing Director ( & Founder)
Tony Rogers - Technical Director ( & Founder)
David Adamson - Manufacturing ( & Founder)
Vince Wilson - Sales & Business Development
Manager
Nick Aitken - Applications Engineer
Sue Pepler - Administration
AML – Wafer Bonding Machines & Services
• Company founded 1992
• MEMS Design, Manufacture & Process Development background
• Founders made first in-situ aligner-wafer bonder in 1985
• AML focus on & Provide Wafer Bonding equipment & Wafer bonding
services (BONDCENTRE)
•Worldwide installed base of machines
AML- Company History
From MEMS background not Mask Aligner for IC
AML – Wafer Bonding Machines & Services
Basic features of AML bonders
AML – Wafer Bonding Machines & Services
Schematic of Unique in-situ Activation, Alignment & Bond
T <560 C
HV <2500V
•Heat + Pump + Align
•Independent platen T
•Flexible
•2 to 8 inch wafers2 to 8 inch wafers
•Fast cycles timesFast cycles times
AML – Wafer Bonding Machines & Services
AML Wafer Bonders
• Anodic Bonding Si-Glass• Direct Bonding e.g. Si-Si• Glass Frit Bonding• Eutectic Bonding• Thermo-compression• Adhesive Bonding• Aligned Embossing
In bond chamber alignment & bonding
in one machine = higher throughput
Wafer bonding capabilities:-
AML – Wafer Bonding Machines & Services
AML Advantages One System Does it ALL (Align, Activate and Bond in one bond chamber)
ALIGN / BOND• No wafer movement between alignment & bonding – guaranteed
alignment accuracy• Simultaneous alignment, heating and vac pump-down (fastest cycle
time) • In-bond chamber alignment at bond temperature (reduces expansion
misalignment effects you would see with competitors jigging) • No flags touching bond surfaces so no possibility of contamination,
damage or flag removal issues• Best system for vacuum encapsulation (Large gap between wafers
during pump-down)• Independent control of upper & Lower wafer temperatures –
(useful for getter activation)• Best system for reducing / forming gas environment - e.g. for
eutectic bonding. (reproducible wafer surface environment)• Wide range of processes possible – Including Nano-Imprint
AML – Wafer Bonding Machines & Services
ACTIVATE (enables low temperature Direct Bonding) • In-bond chamber RAD activation option – activated surfaces cannot be re-contaminated
• Less surface roughening and more uniform activation than plasma
• No exposure of wafers to energetic ions --> can be used with sensitive device wafers
• Wider process time window for activation than with plasma- process time less critical
• In-situ system provides better reproducibility and therefore better process stability
AML Advantages
AML – Wafer Bonding Machines & Services
AML AdvantagesECONOMIC• Lowest cost per bond & ownership
• No mask aligner required- free to choose best mask aligner for your ‘mask aligning’
• System is complete – no other equipment required
• Reasonably priced spares
EASY• Very high reliability – minimal servicing – fast & simple to maintain
• Standard machines as well as custom options to suit specific customer needs
• Easy to use - system up and running and in use in minimum time
SUPPORT• Excellent process support via BONDCENTRE – fast response
• More than 20 years machine & wafer bonding process experience.
• Worldwide Machine base.
AML – Wafer Bonding Machines & Services
AML tooling solutions for Direct Bonding
• Ideally Si-Si bond is self propagating- minimises
stress/bow in the resulting assembly
• The AML spring pin / edge clamp tool allows control
of self bond propagation rate and bond initiation point
AML – Wafer Bonding Machines & Services
Bonding ToolWafer bow system
• The displacement and force exerted in bowing the upper wafer is tuned with respect to the stiffness of both wafers.
• The profile and force distribution of the lower pin chuck can be tuned to give the required profile in the bonded assembly – flat or reduced stress.
Variable force and displacement
lower chuck
AML – Wafer Bonding Machines & Services
Example Bond
IR transmission image of void free Si – Si direct bond. 100mm wafers.Bond performed on AML402 direct bonder - using pin chuck system
AML – Wafer Bonding Machines & Services
New system features, now and planned
AML – Wafer Bonding Machines & Services
New Processes on AML Wafer Bonders
• Hot Embossing – Characterisation has just started
New Developments on AML Wafer Bonders• Inclusion of RAD in-situ surface activation for low temperature bonding (available for new orders) see page after next
• Addition of Pattern recognition software
• Inter-pixel measurement for sub-micron alignment accuracy
• Upgrading of manipulators from manual to stepper motor control
• Motorised Z Drive
Development pipeline:- System Automation
AML – Wafer Bonding Machines & Services
Outline Specification
Force up to 5000N Stroke up to 750 microns
T up to 500 C (cooling) up to 6” wafers
Operation in Vacuum 2 micron alignment between stamp & substrate
New Polymer Micro Hot Embossing & Nano Print tool
• Applications: e.g. Bio-sensors & Microfluidic devices
• Polymers: SU8, PDMS, PMMA..
• Tool fits AML bonder platform or stand alone machine
AML – Wafer Bonding Machines & Services
Basic Bonding Methodsoffered:
• Anodic• Direct (Fusion)• Low Temperature (activated) Direct• Thermocompression• Eutectic• Glass Frit• Adhesive
AML – Wafer Bonding Machines & Services
AML AWB04 Aligner Bonder
AML – Wafer Bonding Machines & Services
Anodic Bonding
• Graphite upper platen (reduced voids and no back surface stains)
• Current limited bonding (enables bonding to thick insulating layers and reduces stress variation across the bonded wafers, and reduces risk of electrical breakdown)
• Aligned triple stack (sequential & Simultaneous process)
AML – Wafer Bonding Machines & Services
Direct Bonding
• In-situ Radical activation enables unique “Activate, align & bond” capability
• In-situ activation provides controlled environment for process development and bond interface reproducibility
• In-situ activation also enables removal of hydrocarbon contamination
AML – Wafer Bonding Machines & Services
Schematic of Unique in-situ Activation, Alignment & Bond
T <560 C
HV <2500V
•Heat + Pump + Align
•Independent platen T
•Flexible
•2 to 8 inch wafers2 to 8 inch wafers
•Fast cycles timesFast cycles times
AML – Wafer Bonding Machines & Services
Radical Activation Tool
Experimental set-up using glass vacuum chamber – showing electrical discharge confined between the ring electrodes
AML – Wafer Bonding Machines & Services
IR transmission Image150mm RAD activated
bond
Void free in situ activated bond – annealed at 200C for 1 hr
AML – Wafer Bonding Machines & Services
Radical-Co-axial Source
Sou
rce
Sou
rce
DC source
R. pump
Gas supply
Only radicals in this region
Wafers for in-situ activation
Earthed screen
AML – Wafer Bonding Machines & Services
Radical Activation Tool
Electron Density (discharge ring) 2.5 x 10 16 m-3
Ion flux very low in the centre
Measurement show that there is no plasma
in the centre zone. All that remains that could affect
the wafers surfaces is radicals and UV radiation
Electron Density less than 5 x 10 13 m-3 in the centre (wafer activation region)
AML – Wafer Bonding Machines & Services
Radical Activation
Spectra of untreated and treated silicon
0
1000
2000
3000
4000
5000
6000
02004006008001000
Binding energy /eV
Co
un
ts p
er s
eco
nd
Centre
Spectra of untreated and treated silicon
0
1000
2000
3000
4000
5000
6000
02004006008001000
Binding energy /eV
Co
un
ts p
er s
eco
nd
Untreated
XPS spectra showing comparison of silicon wafer before and after activation by Oxygen Radicals
Shows reduced carbon peak post exposure
AML – Wafer Bonding Machines & Services
Some Radical Activation Results
0.00
0.50
1.00
1.50
2.00
2.50
3.00
0.000 5.000 10.000 15.000 20.000 25.000
Exposure Time /min
Bo
nd
str
en
gth
/J.m
-2
radicals
O2 plasma
Comparison of Radical vs Plasma Activation Bond Strength for Various Activation Exposure Times (strength measured using Razor Blade Method)
AML – Wafer Bonding Machines & Services
Some Radical Activation Benefits
Produces less roughening of the surface than plasma activation
Uniform activation (no edge effects as typically seen for plasmas)
Wider process time window for activation
In situ process eliminates variation in activation strength with time
No exposure of wafers to energetic ions
Bond can be heated / contacted at bonding temperature = significant advantage for dis-similar substrates or “hard to bond” substrates
AML – Wafer Bonding Machines & Services
Uniform Force Bonding
Platen / support structure designed to give uniform force across the platen area
Use of graphite inserts further improves the force uniformity
Uniform force is needed for the following bonding processes
Glass FritEutecticThermocompressionAdhesive
AML – Wafer Bonding Machines & Services
Improvements in Force Uniformity
The above images were obtained using pressure sensitive film. The black areas are full scale, white areas are zero load.
Old Bonders New Bonders
AML – Wafer Bonding Machines & Services
Some Customer ReferencesCustomer Details
Laboratory for Electro-Optics Systems (LEOS)Bangalore, India
Louisiana State UniversityBaton Rouge, USA
Sumitomo Precision Products Co. Ltd.Japan
Fraunhofer InstituteIZM Berlin, Germany
Korea Photonics Technology Institute (KOPTI)Guangju, Korea
CNRS-LAASFrance
Xiamen UniversityChina
Fraunhofer InstituteHalle, Germany
Semefab LtdUK
Tyndall InstituteCork, Ireland
AML – Wafer Bonding Machines & Services
BONDCENTRE
Wafer Bonding Services
AML – Wafer Bonding Machines & Services
Why BONDCENTRE?• There is a business in bonding wafers for people!• The penetration of Wafer Bonding into many new areas
outside MEMS, warrants special attention & resources to satisfy the wide range of bonding process requirements. Good opportunity!
• The more processes that are developed the more reasons there are to buy AML machines.
• Niche – no one else is doing this!
AML – Wafer Bonding Machines & Services
Strengths
• Very strong MEMS design & process background – especially with respect to Wafer Bonding
• Relevant customer base• Strong network of partners built up over many years • Equipment supplier – transfer the process onto a machine• Selected by UK government to be best to provide the
service
AML – Wafer Bonding Machines & Services
BONDCENTRE SERVICES OFFERED
• Wafer Bonding Process Development e.g. for many novel materials; silicon, glass, sapphire, strained silicon, InP, GaAs,…
• Wafer Bonding process selection & design for your application
• Commercial Wafer Bonding Service prototype to production
• Wafer Bonding Technology Transfer (inc Equipment) & Training
• Associated Processes (Pre & Post Bond)
• Applications knowledge for:
MEMS Smart cut layer transfer Advanced Substrates Wafer Level Packaging 3D integration Vacuum EncapsulationTemporary Bonding LEDs
AML – Wafer Bonding Machines & Services
Associated Pre & Post Bond Services:
• Wafer Cleaning & Activation • Wafer Characterisation e.g. Profiling & Surface
Roughness• Wafer Structuring: e.g. Channels, Holes &
Conducting Vias• Wafer Processing: e.g. Deposition, Electroplating• Wafer Preparation: Thin to required Thickness &
Surface Finish - Planarisation (CMP)• Inspection of bonded assemblies - SAM & IR
AML – Wafer Bonding Machines & Services
• WAFER ALIGNER BONDERS 4 machines in Class 10• METROLOGY; AFM, Ra, PROFILE, TTV• MEGASONIC WAFER CLEANING • NEW ‘RAD’ ACTIVATION• INSPECTION: ACOUSTIC MICROSCOPE (SAM) & IR• ELECTROPLATING • SCREEN PRINT - GLASS FRIT/ADHESIVE• POWDER BLASTING E.G. GLASS MACHINING • WAFER THINNING • CMP
• Also access via long term collaboration with CMF @ Rutherford to:• PHOTOLITHOGRAPHY DEPOSITION- PVD & CVD & FURNACES• ETCHING – DRY & WET• WAFER SAW WIRE & BUMP BONDING• METROLOGY: THIN FILM, LINE WIDTH, SEM
Equipment Set Available:Equipment Set Available:
AML – Wafer Bonding Machines & Services
4 Aligner –Bonders in class 10
AML – Wafer Bonding Machines & Services
SAM – Scanning Acoustic Microscope
AML – Wafer Bonding Machines & Services
Many thanks!