Bond Testing Technology - Olympus IMS

38

Transcript of Bond Testing Technology - Olympus IMS

Page 1: Bond Testing Technology - Olympus IMS
Page 2: Bond Testing Technology - Olympus IMS

Bond Testing Technology

Airlines for America September 26th, 2012Presented By: James BittnerSenior Sale Engineer, Eddy Current & Bond Testing – ONDT

Co-authors: Wayne Weisner, Jason Habermehl & Benoit Lepage

Page 3: Bond Testing Technology - Olympus IMS

Introduction• Adhesive-bonded and composite

components and structures havebecome an important part ofaircraft manufacturing over the last35 years.

• Quality and reliable is extremelyimportant to the integrity ofcomposite structures throughouttheir service life.

• The wide range of materials andconfigurations used in compositestructures and the need fornondestructive evaluation of bondshas resulted in many differenttypes of testing equipment andmethods being used.

Page 4: Bond Testing Technology - Olympus IMS

Introduction

• As there are many different NDTmethods used on composites, wewill look at Bond Testing usingSonic-Acoustic inspection method.

• This technology has been quitesuccessful for over the last 40years. However, no singleinspection method has been foundadequate for the wide variety ofmaterials and construction methodused today in compositestructures.

Page 5: Bond Testing Technology - Olympus IMS

Bond Testing History• Perhaps the earliest form of bond testing is the coin tap method.

• Coin tap was followed by the tap hammer method.

• Mechanical taps were replaced by early electronic instruments

Page 6: Bond Testing Technology - Olympus IMS

Overview of Composites and Bond Types

Page 7: Bond Testing Technology - Olympus IMS

Overview of Composite

50% Composites

15% Titanium

10% Steel

20% Aluminum

5% Miscellanies

52% Composites

14% Titanium

7% Steel

20% Aluminum

7% Miscellanies

1980 1985 1990 1995 2000 2005 2010 2015

A310 B757 B767

10-20%

A318-321 B777 A340 A340-500/600

A380

23%B787 A350

50+%

5-6%

We can see the increased percentage of composite materials in the commercial aircraftindustry over the last thirty-five years.

Page 8: Bond Testing Technology - Olympus IMS

Overview of CompositesWhat are Composites:

Composites are made up of two or more materials with distinct properties and combinedinto a heterogeneous mixture. The mixture benefits from mechanical properties not foundwithin the individual properties. Composites can involve ceramics, wood and/or polymers.

Composites are made up of non-metalliccomponents consisting of Fiberglass, Boron, Aramid(nylon), Kevlar or Graphite (Carbon).

Page 9: Bond Testing Technology - Olympus IMS

Overview of Composites

• Different material types can be used for the skin:• Aluminum• Fiberglass• Graphite (Carbon)• Hybrid• Kevlar (DuPont TM)

• The core that is used in composite componentstructures comes in different material type anddensities:

• Aluminum

• Fiberglass

• Nomex

• Rohacell

Material for Composite Structures

Page 10: Bond Testing Technology - Olympus IMS

Overview of Composites

• Generally four types of flaws in compositematerials:

– Disbond

– Core Damage

– Delamination

– Porosity

• These flaws can occur do to the following:

– Impact damage

– Lighting Strike (heat damage)

– Manufactures Defect

Defects found in Composite Structures

Core Damage

Page 11: Bond Testing Technology - Olympus IMS

Understanding Bond Testing Technology

• There are three test modes and fiveinspection methods available withthe BondMaster 1000e+.

• The optimum method would beselected using a test standard thatrepresents both bond and disbondconditions based on the constructionof the component.

Three generally accepted modes of Inspection

Page 12: Bond Testing Technology - Olympus IMS

BondMaster Overview

The BondMaster is a unique instrument for bond testing (BT) that can be used to test aarray of bonded and composite materials used in a variety structures. There aresimilarities and differences when comparing this flaw detector with Ultrasonic flawdetectors. As in ultrasonic flaw detectors, the BondMaster uses sound waves however,unlike ultrasonic testing (UT) it does not use reflected ultrasound energy. In UT, sound iscoupled into a material and then echoes are detected to determine if flaws are present ormaterial thickness.

BMT B1000e+

Page 13: Bond Testing Technology - Olympus IMS

BondMaster Overview

• Bond testing Pitch-Catch & MIA, uses changes in plate-waves / flexural andcompression waves that result from a good bond compared to areas that are notbonded well, or where there may be a disbond or delamination within a structure.

• Bond testing Resonance, does not use sound propagation velocity or reflectedsound, but only changes in phase and amplitude of the propagating / standing wavemeasured within a component.

Page 14: Bond Testing Technology - Olympus IMS

Resonance Mode

• Resonance method is very similar to anultrasonic A-scan pulse echo inspectionwith couplant included, it is based onchanges in phase and amplitude inprobe resonance.

• Resonance method uses special anarrow bandwidth contact Sonic probes.The test is based on the change in theimpedance of the resonant- Q -acoustically coupled to a material.

• The impedance change in the crystal areanalyzed to detect changes within thepart being tested.

Page 15: Bond Testing Technology - Olympus IMS

Resonance Mode: typical application

250KHz resonance probe used on an aircraft lap splice joint to detectcorrosion between the lap splice skins

• Resonance is generally used for detectingskin-to-skin disbonds such as aluminumlap joints. This mode also works well forinter-ply delamination in compositestructures. In many cases the depth ofdelamination's can be estimated using thesignal-phase rotation.

Page 16: Bond Testing Technology - Olympus IMS

Mechanical Impedance Analysis operates without couplant and is usually springloaded, it is based on measuring the stiffness and mass of the material undertest.

When the transmit and receive elements are nulled, they vibrate together at thesame phase and amplitude. When the probe is placed on a structure, thereceiving element is affected by the sample stiffness, which varies from bonded todisbonded conditions. This change is monitored as a comparison between thetransmit and receive phase and amplitude signals. The next figure shows adifference in phase.

MIA Mode

Transmit and receive elements arenulled and in phase.

Transmit and receive elements arein contact with a test part and are180 degrees out of phase.

Page 17: Bond Testing Technology - Olympus IMS

MIA Mode: typical application

S-MP-5 probe being used on a rear wing end plate from a Formula 1 race car, theconstruction is carbon fiber skins with Rohacell foam core and Nomex core. Thisinspection is used to detect near surface skin to core disbond.

• MIA probes have a point-contact areasuitable for use on irregular or curvedsurfaces. The MIA method works well todetect disbonds and crushed coreconditions.

Page 18: Bond Testing Technology - Olympus IMS

Pitch-Catch Test Mode• The pitch-catch mode is very easy in terms of calibration and requires no

couplant.

• One element transmits (pitches) a burst of acoustic energy into the test partand a separate element receives (catches) the plate-waves / flexuralpropagated across the test piece as shown.

• The plate-waves / flexural motion are propagated into the test piece. Disbondsand delamination's change the stiffness of the part. The return signals aredetected and a phase-amplitude display is used to show the effect of good andbad bonds on the sound path.

Cross-sectional view of a typical pitch-catch probe.

Page 19: Bond Testing Technology - Olympus IMS

Pitch-Catch ModeImpulse & RF Method

• The pitch-catch Impulse and RF methods utilizea repeated burst of a single frequency . Thefrequency is selected to provide the maximumplate / flexural motion within the componentunder test.

• A variable time gate is used to select thereceived pulse that has the greatest change inamplitude when the probe is scanned from abonded area to a disbonded area.

• The user positions a time gate at the optimumpoint to monitor the response of the receivesignal most affected by disbonds. This optimizesthe data displayed by the flying dot on the RUNdisplay.

Page 20: Bond Testing Technology - Olympus IMS

Pitch-Catch ModeSwept Method

• For the pitch-catch swept method, one element sweeps through multiplefrequencies defined by the operator. The swept frequency (5KHz – 100KHz)provides a circular display.

• The swept signals are monitored and processed by the second element. Thereturn signals are detected and a phase vs. amplitude display is used to showthe effects of good bond compared to the disbond areas along the plate wavepath.

Bond No contactDisbond

Page 21: Bond Testing Technology - Olympus IMS

Pitch-Catch Test Mode

S-PC-P14 pitch catch probe used on a carbon fiber skin / Nomex coredstructure to detect near-side and far side skin to core disbonds.

RF Method: typical application

Page 22: Bond Testing Technology - Olympus IMS

Overview of Pitch-Catch

Page 23: Bond Testing Technology - Olympus IMS

BondMaster Pitch-Catch Observation

TTU C-scan image

• Pitch-Catch is of the most commonly used testmethod for skin to core disbonds.

• Test standard CFRP honeycomb sandwich.ARP 5606 CHRS-2-6, also listed in some NTM procedures.

Page 24: Bond Testing Technology - Olympus IMS

BondMaster Pitch-Catch Observation

CHRS-2-6 Fiberglass core, test results at 14Khz looking at nearside disbonds.

Page 25: Bond Testing Technology - Olympus IMS

BondMaster Pitch-Catch Observation

CHRS-2-6 Nomex core, results at 14Khz Testing looking at nearside disbonds

Page 26: Bond Testing Technology - Olympus IMS

BondMaster Pitch-Catch ObservationCHRS-2-6 Fiberglass core; at 22KHz, best results for near and far side disbond.

Far side Disbond

Near side Disbond

Page 27: Bond Testing Technology - Olympus IMS

BondMaster Pitch-Catch ObservationCHRS-2-6 Fiberglass core good results at 22KHz Testing looking at far side disbond

Page 28: Bond Testing Technology - Olympus IMS

OmniScan BondTestingOlympus NDT now offers a “new” OmniScan BondTesting software update to theOmniScan MX. This new software update enables customers to use the OmniScanwith the Eddy Current ECA/ECT Module and BondMaster probes to create C-Scanning images while testing in Pitch-Catch method.

Page 29: Bond Testing Technology - Olympus IMS

What is required to do OmniScan BondTesting?

+

MXBSoftware

+

Standard BondMasterprobe and cable

BondMaster probeadapter for OmniScan

YX Scanner

OmniScan MX andECA/ECT Module

Appropriate yokes andprobe holder

+

+ +

Page 30: Bond Testing Technology - Olympus IMS

OmniScan in BondTesting Mode

• OmniScan Impedance planerepresentation is equivalent toBondMaster RF impedance plane(phase angle inversion). Superiorphase repeatability.

• Up to 8 simultaneous frequencies

• C-scan generated from the verticalamplitude of the impedance plane(vertical strip chart)

• Tested with probe S-PC-P13L pitch-catch probe

Page 31: Bond Testing Technology - Olympus IMS

CHRS-1-3, CHRS-1-6, CHRS-1-9 and CHRS-1-12 samples: composite, 306 mm x 280 mm.3 to 12 plies, 1 in thick honeycomb

Tests standards (honeycomb sandwich)

Page 32: Bond Testing Technology - Olympus IMS

ObservationsDefect detection in function of frequency

CHRS-1-6 at 20 kHz (disbond, delamination andpotting detected)

CHRS-1-6 at 8 kHz (only disbond is detected)

Page 33: Bond Testing Technology - Olympus IMS

ObservationsDefect detection in function of frequency

CHRS-1-6 far-side at 18 kHz (disbond)

CHRS-1-6 at 14 kHz, very poor disbonddetection

Page 34: Bond Testing Technology - Olympus IMS

Observations

Disbond Delamination Potting Disbond Delamination Potting

Variation of defect shape in function of frequency and position of the probe atfrequency smaller than 20 KHz.

Page 35: Bond Testing Technology - Olympus IMS

Observations

Disbond Delamination PottingDisbond Delamination Potting

Variation of defect shape in function of frequency and position of the probeat frequency higher than 20 KHz

Page 36: Bond Testing Technology - Olympus IMS

ObservationsVariation of defect shape in function of frequency and position of the probe

Page 37: Bond Testing Technology - Olympus IMS

Conclusions

• The use of a single instrument offeringmultiple inspection methods allowsinspection of a wide variety of compositematerials and configurations.

• The Pitch-catch, MIA, and Resonancemethods, as discussed, each haveparticular advantages in terms ofapplication solutions. These methodsare defined in aircraft NDT manuals.

• Portable BondTester C-scan imagingdevice can improve detectability,reliability

• C-scan imaging will be very helpful indamage assessment and repairrequirements.

Page 38: Bond Testing Technology - Olympus IMS

Thank you