BGA Reball stations and their process

BGA reballing requires a peculiar set of guidelines and careful working. Most people in the business do not know what exactly they need for the process. The tools and auxiliary required is largely a mystery to people.

First of all the requirement is for BGA reballing. Every BGA chip ahs its own BGA reballing stencil. For the ones looking to do laptop reballing, you will not require anything other than a laptop reballing stencil. But it’s another matter if you want the reballing station for everything from laptops, game consoles like PS3, XBOX, WII, PSP or cell phones like iPhones. A full set BGA reballing stencil kit will be required for that. The stencil kit is a very handy tool. It gives you the ability of reballing all kinds of different BGA reballing, and you can save a lot of money on it as well, because the kits are much cheaper generally.

There are mainly three types of BGA reball stations. The first one being 90*90mm bga reballing station, the second an 80*80mm bga reballing station and the last one heat direct BGA reballing station. The non-technical people may need should definitely be considering buying a BGA reballling station. The BGA reballing station is not a consumable tool like BGA reballing stencils. It will last you well over a period of three to five years if used carefully.

Then we have BGA solder balls or soldering wire. Every BGA chip comes with a different solder pads, they are from 0.2 to 0.76 sizes, and before you do BGA reballing, you should be absolutely sure about the sizes of your BGA chips, then choose the right BGA solder balls or soldering wire.

Solder ball also has two types, one leaded and other completely lead free. The leaded one is Balls Alloy: Sn 63 / Pb 37-SGS. And the lead free type is Balls Alloy: Sn 96.5 / Ag 3 / Cu 0.5.

Next there is the soldering flux: It can make help in soldering the solder balls much quicker.

Fifth, hot air gun or reflow oven or what some people call a special BGA reballing soldering station. After reballing the BGA chips, the solder balls need to be put through high temperature. The hot air soldering station may be used to blow high temperature air, or put the reballed chips to reflow oven or special BGA reballing soldering stations.

Like SMT rework stations, this BGA reballing station and its process is also a very complicated process. Some much smaller and cheaper accessories such as ESD tweezers, scraper,antistatic gloves andUSB digital microscopes are also useful.