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Non-contact 3D Surface Characterization with cyberTECHNOLOGIES’ Series of Advanced Optical Metrology Systems. Cyber Technologies is the leading provider of high resolution optical surface metrology and inspection systems for industrial applications. Our suite of systems covers a large range of applications in process control and surface quality inspection of any type of Printed Products, Systems or Devices, Device Packaging, Printed circuits, MEMS, Soft and transparent materials, Solar Elements and Fuel cells. We offer a standard suite of table-top systems as well as integrated production solutions, and provide customized solutions for specific applications.

Fig 1: CyberScan Vantage 3D: For samples up to 200 mm x 200 mm, 2D or 3D scanning and easy to use automated measurements

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Fig 2a: Cyber Technologies’ CT Series with standard configurations of 100 mm x 100 mm, 200 mm x 200 mm, 300 mm x 300 mm and up to 600 mm x 600 mm stage travel and automated 2D/3D scanning of repetitive features or multiple samples. Larger stage integrations are also available. The CyberScan Vantage and CT-Series are high resolution non-contact profilometers from Cyber Technologies. The main components of the systems are a laser- or a white light sensor and an integrated automatic x/y-motion system. Especially the chromatic white light sensors combine high accuracy and high measurement speed. Most surfaces can be scanned with a true 4 KHz data rate. Using a 1 µm lateral resolution the scan speed is 4 mm / sec, using a 20 micron step size the scan speed reaches 80 mm / sec. Optionally, sensors with a data rate of 14 kHz can be employed, allowing for scan speeds of up to 400 mm/sec. The sensors are available with different working principles, resolutions and measurement ranges for various applications. The chromatic sensor heads offer z-resolutions from 3 nm to 0,8 µm and measurement range from 300 µm to 25 mm. Several sensors heads can be mounted simultaneously. An on-axis camera is available for all sensors. The visible laser spot in the camera FOV makes it easy to perform 2D-profile and 3D-raster scans. All electronic components are integrated in the stable granite base. All control functions and communication is done via a single USB connection to the external workstation PC. The Cyber Technologies proprietary Scan CT software combines system control, data collection and data analysis in a user friendly interface. Comprehensive profile and 3D analysis with DIN ISO conform roughness analyses are included.

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An outstanding feature is the AScan Software. AScan allows for easily automating measurement routines, no programming skills are required, even complex measurement programs are quickly created via our menu-based user interface. Features like fiducial correction, barcode input, Step&Repeat and integrated SPC allow production related use of the CyberScan Vantage.

Fig 2b: Cyber Technologies’ CT100 with 100 mm x 100 mm scan stage

Fig 3: CyberScan Vantage: linear scan with up to 50 mm length and with optional confocal sensor a 1.1 mm wide swath for highly repeatable 2D and 3D scanning

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Fig 4: Software architecture ScanCT and AScan Typical applications are thick-film measurements on a variety of substrates, volume measurement of paste depots, epoxy-film, dots or other printed and dispensed features. Geometry and position of highly contoured objects such a solder bumps, flatness and coplanarity analysis are popular applications for a Vantage or CT-Series system. Since the systems maintain high accuracy across the complete travel, larger parts such as wafers, gaskets, or glass lenses are inspected fast and precise. Please review some examples on the following pages:

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Fig 5: Hybrid circuit – 3D Scan

Fig 6: Screen Printed Device – 3D Scan

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Fig 7: Printed Device on Ceramic – 3D Scan

Fig 8: Screen Capture of measurement, with cursor settings, display of results and video image

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Fig 9: Quality control on a dispensed gasket, with varying, tapered target thickness (top: photo, bottom: 3D scan)

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Fig 10 a,b,c,d: (a) Quality control on a PV solar cell: (b) print quality test, (c) line quality test, laser cut, (d) 3D surface roughness analysis (with defect). The optical technology allows for very high scanning speed without touching the sample and hence not introducing any defects, unlike what is typically a problem with traditional stylus based profilometers.

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Fig 11: Integrated in-line metrology solution for automated production lines, like LED manufacturers, chip packaging manufacturing lines. The Cyber Technologies systems offer a multitude of Analysis capabilities, these are just a few commonly used examples:

Height (Max Avg) The Height (Max Avg) value is the average height of the highest data points in the (red) measurement cursor(s) relative to the baseline. The number of data points can be defined.

Length (Bottom)

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The Length (Bottom) is measured on bottom of a feature parallel to the baseline. The bottom of the feature is found using the crossings of the baseline from the reference cursors set at the bottom of the feature with 2 best fit lines from the edges. The best-fit lines of the edges are calculated using a percentage height threshold (here: 50%) and an edge width (here: 100µm).

Area Area is calculated as the region inside the perimeter defined by the profile, the (red) measurement cursor(s) and the baseline.

3D Height (Max Avg) The 3D Height (Max Avg) is the average height of highest data points in the red measurement cursor box relative to the base plane. The number of data points can be defined.

We provide many more analysis parameters that can be selected by the user during the initial measurement setup i.e. automated roughness measurements according to DIN, many selectable filters, top/bottom feature width, and advanced capabilities like profile compensation, co-planarity, center-to-center distance, feature detection, fully automated edge detection for fully the automated detection and measurement of structures on the sample (i.e. BGA, conductor lines on PV cells….), independent of number and size.

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Fig 11: Comprehensive profile and surface compensations

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Fig 12: Warpage of ceramic substrate

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Fig 13 a, b, c, d: (a) (b) (c) 3D Scan of BGA (d) 3D Scan of pin array. SanCT automatically determines the location, height, size and shape of each individual bumps, pin or cell. The distance between features can be easily extracted, allowing for alignment analysis of bumps, pores or other features.

Fig 14: Roughness measurements on Gold Layer Pads

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Fig 15: Diameter and depth of micro via With the advance of optical metrology the traditional and over 60 year old stylus profilometer has widely been replaced by non-contact optical profilometers. Their advantages with respect to non-destructive, high resolution and high speed 3D scanning, which allows for fast and comprehensive 2D/3D analysis and quantification of complex surface structures and interfaces in R&D, development and production environments make optical profilometers the most advanced and reliable surface characterization tool available today. At Cyber Technologies, we are dedicated to finding the best metrology solution for your specific requirements. Please contact us at Cyber Technologies USA, LLC 962 Terra Bella Ave San Jose, CA 95125 Tel.: 408-689-8814 Email: Karlheinz.strass@CyberTechnologies.com www.CyberTechnologies.com