Back-End Bonding H&K 710 bonder Glue Pitch Adaptors Robot I&J2500 Glue Beetle Chip to Hybrid.

Back-End BondingH&K 710 bonder

Glue Pitch AdaptorsRobot

I&J2500Glue Beetle Chip to

Hybrid

Mike Wormald [email protected]

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Robot I&J2500

The I&J2500 has a work area of 510 x 510mm. We mount a turn plate to the work holder that allows us to hold the hybrid for accurate dispensing of the glue.


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Requirements

Glue pitch adaptors to LHCB hybrids.

• Making sure all the bond pads are supported with glue, as bonding is impossible with bounce under the pads.

• Even spread of glue for planarity. (Bonding jigs vacuum this area down)

• Ensure no overspill of glue that would hinder the position of the sensors or cover bond pads for the chips

• Correct location of the pitch adaptors.


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Process

•Dispense Glue •Place pitch adaptors


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Process

•Apply Weights •Leave to cure•In oven at 40◦c for 1hour.•Visually inspect.•Remove any excess or fill unsupported areas.•Chips can be mounted at this stage•Place back in oven for further two hours


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Glue chips to Hybrid

Requirements

• Planarity, 710 bonder only has one touchdown per reference system but chips are bonded on all three faces.

• No overspill of conductive glue that may cause shorts on the hybrid

• Accurate placement –ease of bonding front end-


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Dispense Glue


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Place Chips


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Accurate Position


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Back End Bonding


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Screen shot of bonds with overlay


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•The End

Back-End Bonding H&K 710 bonder Glue Pitch Adaptors Robot I&J2500 Glue Beetle Chip to Hybrid.

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Transcript of Back-End Bonding H&K 710 bonder Glue Pitch Adaptors Robot I&J2500 Glue Beetle Chip to Hybrid.