The information contained herein is, as far as we are aware, true and accurate. However, no representations or warranties, either express or implied, whether of merchantable quality, fitness for any particular purpose or of any other nature are hereby made in respect of the information contained in this presentation or the product or products which are the subject of it. In providing this material, no license or other rights, whether express or implied, are given with respect to any existing or pending patent, patent application, trademarks, or other intellectual property right.

AZ 9260 Photoresist

Data Package at 12um FT & 24um FT

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 2

MEMS /

Ink JetFT: >30 µm

Lift-off Deep Implant /Metal Etch

Copper Plating Gold Plating Solder /

Metal PlatingFT: 2-7 µm FT: 3-10 µm FT: 5-30 µm FT: 10-30 µm FT: >30 µm

DUVTFRH/ImplantFT: 3 -

8 µm

AZ’s Thick Film Photoresist Roadmap [as of 11/2007]

<<------------------

AZAZ

EXP 100 EXP 100 ---------------->>

Materials under development

AZ LExp 500

AZ

12XT-20P

<------------------------

AZ

125nXT Series ------------------------->

Materials in sampling(all EXP products) AZ

40XT-11AZ

40XT-A1

Commercialized materials

AZ

nLOFSeries

AZ

MIR 900

<---------------P4000 (P4620)-----(Multicoat)---> AZ

33XTAZ

N4000AZ

N6000

AZ

TX 1311VS-01HJ

<------------AZ 9200------------->

AZ

PLP30/40 <------------AZ 50XT----------->AZ

10XT

AZ

5XTAZ

5nXTAZ

3nXT-HR

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 3

AZ Electronic Materials Thick Photoresist Product Summary

Platform: DNQ = Novolak, CA = Chemically Amplified, PP = Photopolymer

Wavelength: Red font indicates better performance.

Developer Compatibility: Bold font indicates most compatible developer, resulting in shorter develop times and lower exposure energies.

Thick Film Product Platform λ

FT Range (um)

Maximum Single coat

Aspect Ratio Application Developer

Compatibility

P4000 DNQ g-h 2 - 55 25 2:1 Solder, Cu, Au 400K / TMAH4500 DNQ g-h 2 - 55 25 2:1 Solder, Cu, Au 400K / TMAH9200 DNQ g-h -i 3 - 50 25 3:1 Solder, Cu 400K / TMAH10XT DNQ g-h -i 4 - 50 25 3:1 Solder, Cu, Au 400K / TMAH33XT DNQ g-h-i 5 - 25 25 5:1 Solder, Cu TMAH / 400K50XT DNQ g-h 15 - 65 65 3:1 Solder, Cu 400K

PLP-30 DNQ g-h 6 - 25 25 2:1 Au, Cu 303NPLP-40 DNQ g-h 20 - 30 30 2:1 Au, Cu 303N

EXP 12XT-20P CA g-h-i 5 - 20 20 3:1 Cu TMAHEXP 5XT CA g-h-i 3 - 5 5 2:1 Si, Implant, Etch TMAHEXP 40XT CA g-h-i 20 - 100 60 4:1 Etch, Solder, Cu TMAH / 400K

EXP 125nXT PP g-h-i 20 - 120 120 5:1 Cu, Au, Solder TMAH / 303NEXP 3nXT-HR CA g-h-i 3 - 5 5 5:1 Cu, NiFe, Si TMAH

EXP 5nXT CA g-h-i 5 - 15 15 3:1 Cu, NiFe, Si TMAHTX 1311 CA DUV 3 - 5 5 15:1 Cu, NiFe, Si TMAH

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 4

MTI Flexifab coat and bakeStatic dispense on 6” silicon 30 sec spin @ indicated rpmSB: 110°C in proximity10 sec @ 0.050”, 180 sec @ 0.002”

Spin Speed (rpm)

Film

Th i

ckne

ss ( µ

m)

AZ 9260 Photoresist on SiliconFilm Thickness vs. Spin Speed

5

6

7

8

9

10

11

12

13

14

15

1000 1500 2000 2500 3000 3500 4000 4500

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 5

AZ

9260 Table of Contents

▶

12µm FT Process & Performance Results Pages 6 – 22 Ultratech 1500 with AZ 300 MIF developer

▶

12µm FT Process & Performance Results Pages 23 – 35 Suss MA200 with AZ 400K 1:4 Developer

▶

24µm FT Process & Performance Results Pages 36 – 52 Ultratech 1500 with AZ 400K 1:4 Developer

▶

24µm FT Process & Performance Results Pages 53 – 65 Suss MA200 with AZ 300 MIF developer

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 6

AZ 9260 Photoresist

Lithographic Evaluationby Ultratech 1500 Stepper

with AZ 300 MIF Developer12µm FT Process

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 7

AZ 9260 Photoresist

Process Conditions:

Substrate: Bare SiliconCoat: Optitrac Static dispenseTarget FT: 12 µmSoftbake: 110°C hotplate/ 180 sec. full contactExposure: Ultratech 1500 gh line Stepper FEM: 1200 mJ/cm2 with increments of 75 mJ/cm2

Nominal Focus of -2µm in increments of 2µm in both directionsDevelop: AZ 300MIF (2.38% TMAH) continuous spray for 400 sec. @ 23°C

Analysis: Amray SEM

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 8

AZ 9260 Photoresist

Features (1:1)

Film

Thickness(μm)

DTP

10 μm (mJ/cm²)

Exposure Latitude 10 μm

(%)

DOF

10 μm (μm)

Linearity (μm)

Dense Lines

12

1798

106

16.0

4.0

Contact Holes

12

1539

90

>8

<10

Summary of Results:

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 9

Film Thickness: 12 µmOptitrac coat and DevelopSB: 110°C/ 180 secUltratech 1500 gh line Stepper AZ 300 MIF, 400 sec continuous spray @ 23 °C

Exposure Dose (mJ/cm²)

Mea

sure

d Li

new

idth

(µm

)

AZ 9260 Photoresist, FT=12 μm Exposure Latitude on Silicon, 10.0 μm L/S

8

8.5

9

9.5

10

10.5

11

11.5

12

1000 1200 1400 1600 1800 2000 2200 2400 2600 2800 3000 3200

1798 mJ/cm²106% Exposure Latitude

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 10

1200 mJ/cm² 1375mJ/cm² 1550 mJ/cm²

Film Thickness: 12 µmOptitrac coat and DevelopSB: 110°C/ 180 secUltratech 1500 gh line StepperAZ 300 MIF, 400 sec continuous spray @ 23 °C

2425 mJ/cm² 2250 mJ/cm² 2075 mJ/cm²

1725 mJ/cm²

2600 mJ/cm²

AZ 9260 Photoresist, FT=12 μm Exposure Latitude on Silicon, 10.0 μm L/S

1900 mJ/cm²

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 11

8.75

9.25

9.75

10.25

10.75

11.25

-12.0 -10.0 -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 6.0 8.0

Focus (µm)

Mea

sure

d Li

new

idth

(µm

)AZ

9260 Photoresist, FT=12 μm

Depth of Focus @ 1725 mJ/cm², 10.0 µm L/S

Film Thickness: 12 µmOptitrac coat and DevelopSB: 110°C/ 180 secUltratech 1500 gh line Stepper AZ 300 MIF, 400 sec continuous spray @ 23 °C

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 12

AZ 9260 Photoresist, FT=12 μm Depth of Focus @ 1725 mJ/cm², 10.0 µm L/S

-8.0 µm -6.0 µm -4.0 µm

Film Thickness: 12 µmOptitrac coat and DevelopSB: 110°C/ 180 secUltratech 1500 gh line Stepper AZ 300 MIF, 400 sec continuous spray @ 23 °C

4.0 µm 2.0 µm 0.0 µm

-2.0 µm

-10.0 µm

6.0 µm

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 13

3.0

4.0

5.0

6.0

7.0

8.0

9.0

10.0

11.0

12.0

13.0

3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 11.0 12.0 13.0

Nominal Linewidth (µm)

Mea

sure

d Li

new

idth

(µm

)AZ 9260 Photoresist, FT=12 μm

Linearity on Silicon @ 1725 mJ/cm²

Film Thickness: 12 µmOptitrac coat and DevelopSB: 110°C/ 180 secUltratech 1500 gh line StepperAZ 300 MIF, 400 sec continuous spray @ 23 °C

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 14

12 µm 10 µm 9.0 µm 8.0 µm

Film Thickness: 12 µmOptitrac coat and DevelopSB: 110°C/ 180 secUltratech 1500 gh line Stepper AZ 300 MIF, 400 sec continuous spray @ 23 °C

4.0 µm 5.0 µm 6.0 µm

7.0 µm

AZ 9260 Photoresist, FT=12 μm Linearity on Silicon @ 1725 mJ/cm²

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 15

Film Thickness: 12 µmOptitrac coat and DevelopSB: 110°C/ 180 secUltratech 1500 gh line Stepper AZ 300 MIF, 400 sec continuous spray @ 23 °C

Exposure Dose (mJ/cm²)

Mea

sure

d Li

new

idth

(µm

)

AZ 9260 Photoresist, FT=12 μm Exposure Latitude on Silicon, 10.0 µm CH, 1:1 Pitch

8

8.5

9

9.5

10

10.5

11

11.5

12

800 1000 1200 1400 1600 1800 2000 2200 2400 2600 2800

1539 mJ/cm²90% Exposure Latitude

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 16

1200 mJ/cm² 1375mJ/cm² 1550 mJ/cm²

Film Thickness: 12 µmOptitrac coat and DevelopSB: 110°C/ 180 secUltratech 1500 gh line StepperAZ 300 MIF, 400 sec continuous spray @ 23 °C

2425 mJ/cm² 2250 mJ/cm² 2075 mJ/cm²

1725 mJ/cm²

2600 mJ/cm² 1900 mJ/cm²

AZ 9260 Photoresist, FT=12 μm Exposure Latitude on Silicon, 10.0 µm CH, 1:1 Pitch

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 17

1200 mJ/cm² 1375mJ/cm² 1550 mJ/cm²

Film Thickness: 12 µmOptitrac coat and DevelopSB: 110°C/ 180 secUltratech 1500 gh line StepperAZ 300 MIF, 400 sec continuous spray @ 23 °C

2425 mJ/cm² 2250 mJ/cm² 2075 mJ/cm²

1725 mJ/cm²

2600 mJ/cm² 1900 mJ/cm²

AZ 9260 Photoresist, FT=12 μm Exposure Latitude on Silicon, 10.0 µm CH, 1:0.7 Pitch

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 18

1375mJ/cm² 1550 mJ/cm²

Film Thickness: 12 µmOptitrac coat and DevelopSB: 110°C/ 180 secUltratech 1500 gh line StepperAZ 300 MIF, 400 sec continuous spray @ 23 °C

2425 mJ/cm² 2250 mJ/cm² 2075 mJ/cm²

1725 mJ/cm²

2600 mJ/cm² 1900 mJ/cm²

AZ 9260 Photoresist, FT=12 μm Exposure Latitude on Silicon, 10.0 µm CH, 1:0.3 Pitch

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 19

8.75

9.25

9.75

10.25

10.75

11.25

-12.0 -10.0 -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 6.0 8.0

Focus (µm)

Mea

sure

d Li

new

idth

(µm

)

Film Thickness: 12 µmOptitrac coat and DevelopSB: 110°C/ 180 secUltratech 1500 gh line Stepper AZ 300 MIF, 400 sec continuous spray @ 23 °C

AZ 9260 Photoresist, FT=12 μm Depth of Focus @ 1550mJ/cm2, 10.0 µm CH, 1:1 Pitch

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 20

-4.0 µm 2.0 µm0.0 µm-2.0 µm-6.0 µm

1:1

1:0.7

1:0.3

AZ 9260 Photoresist, FT=12 μm Depth of Focus @ 1550mJ/cm2, 10.0 µm CH, Various Pitch

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 21

5.0

10.0

15.0

20.0

25.0

30.0

35.0

40.0

45.0

50.0

5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0 45.0 50.0

Nominal Linewidth (µm)

Mea

sure

d Li

new

idth

(µm

)AZ 9260 Photoresist, FT=12 μm

Linearity on Silicon @ 1550 mJ/cm²40.0 µm to 10.0 µm CH, 1:1 Pitch

Film Thickness: 12 µmOptitrac coat and DevelopSB: 110°C/ 180 secUltratech 1500 gh line StepperAZ 300 MIF, 400 sec continuous spray @ 23 °C

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 22

30 µm 10 µm20 µm40 µm

1:1

1:0.7

1:0.3

AZ 9260 Photoresist, FT=12 μm Linearity on Silicon @ 1550 mJ/cm²

40.0 µm to 10.0 µm CH, Various Pitch

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 23

AZ 9260 Photoresist

Lithographic Evaluation by Suss

MA200 Mask Aligner

with AZ 300 MIF Developer12µm FT Process

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 24

AZ 9260 Photoresist

Process Conditions:

Substrate: Bare SiliconCoat: Optitrac Static dispenseTarget FT: 12 µmSoftbake: 110°C hotplate/ 180 sec. full contact

Exposure: Suss MA200 CC Mask Aligner with 20 µm proximity gapFEM: 960 mJ/cm2 with increments of 80 mJ/cm2

Develop: AZ 300MIF (2.38% TMAH) continuous spray for 400 sec. @ 23°C

Analysis: Amray SEM

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 25

AZ

9260 Photoresist

Features (1:1)

Film

Thickness(μm)

DTP

20 μm (mJ/cm²)

Exposure Latitude 20 μm

(%)

Linearity (μm)

Dense Lines

12

984

144

10

Contact Holes

12

792

137

10

Summary of Results:

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 26

Film Thickness: 12 µmOptitrac coat and BakeSB: 110°C/ 180 secSuss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 400 sec continuous spray @ 23 °C

Exposure Dose (mj/cm²)

Mea

sure

d Li

new

idth

(µm

)

AZ 9260 Photoresist, FT=12 μm Exposure Latitude on Silicon, 20.0 μm L/S

16

17

18

19

20

21

22

23

24

450 600 750 900 1050 1200 1350 1500 1650 1800 1950 2100

984 mj/cm²144% Exposure Latitude

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 27

720 mJ/cm² 800mJ/cm² 880 mJ/cm²

Film Thickness: 12 µmOptitrac coat and BakeSB: 110°C/ 180 secSuss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 400 sec continuous spray @ 23 °C

1440 mJ/cm² 1360 mJ/cm² 1200 mJ/cm²

960 mJ/cm²

1600 mJ/cm²

AZ

9260 Photoresist, FT=12 μm Exposure Latitude on Silicon, 20.0 μm L/S

1040 mJ/cm²

640 mJ/cm²560 mJ/cm²

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 28

5.0

15.0

25.0

35.0

45.0

55.0

65.0

75.0

85.0

5.0 15.0 25.0 35.0 45.0 55.0 65.0 75.0 85.0

Nominal Linewidth (µm)

Mea

sure

d Li

new

idth

(µm

)AZ 9260 Photoresist, FT=12 μm

Linearity on Silicon @ 960 mJ/cm²

Film Thickness: 12 µmOptitrac coat and BakeSB: 110°C/ 180 secSuss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 400 sec continuous spray @ 23 °C

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 29

AZ 9260 Photoresist, FT=12 μm Linearity on Silicon

@ 960 mJ/cm²

80 µm 60 µm 50 µm

Film Thickness: 12 µmOptitrac coat and BakeSB: 110°C/ 180 secSuss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 400 sec continuous spray @ 23 °C

10 µm 20 µm 30 µm

40 µm

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 30

Film Thickness: 12 µmOptitrac coat and BakeSB: 110°C/ 180 secSuss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 400 sec continuous spray @ 23 °C

Exposure Dose (mj/cm²)

Mea

sure

d Li

new

idth

(µm

)

AZ 9260 Photoresist, FT=12 μm Exposure Latitude on Silicon, 20.0 µm CH, 1:1 Pitch

16

17

18

19

20

21

22

23

24

250 400 550 700 850 1000 1150 1300 1450 1600 1750

792 mj/cm²137% Exposure Latitude

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 31

600 mJ/cm² 720mJ/cm² 760 mJ/cm²

Film Thickness: 12 µmOptitrac coat and BakeSB: 110°C/ 180 secSuss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 400 sec continuous spray @ 23 °C

1360 mJ/cm² 1200 mJ/cm² 1040 mJ/cm²

800 mJ/cm²

1600 mJ/cm² 880 mJ/cm²

520 mJ/cm²440 mJ/cm²

AZ 9260 Photoresist, FT=12 μm Exposure Latitude on Silicon, 20.0 µm CH, 1:1 Pitch

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 32

600 mJ/cm² 720mJ/cm² 760 mJ/cm²

Film Thickness: 12 µmOptitrac coat and BakeSB: 110°C/ 180 secSuss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 400 sec continuous spray @ 23 °C

1360 mJ/cm² 1200 mJ/cm² 1040 mJ/cm²

800 mJ/cm²

1600 mJ/cm² 880 mJ/cm²

520 mJ/cm²440 mJ/cm²

AZ 9260 Photoresist, FT=12 μm Exposure Latitude on Silicon, 20.0 µm CH, 1:0.7 Pitch

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 33

5.0

15.0

25.0

35.0

45.0

55.0

65.0

75.0

85.0

5.0 15.0 25.0 35.0 45.0 55.0 65.0 75.0 85.0

Nominal Linewidth (µm)

Mea

sure

d Li

new

idth

(µm

)

Film Thickness: 12 µmOptitrac coat and BakeSB: 110°C/ 180 secSuss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 400 sec continuous spray @ 23 °C

AZ 9260 Photoresist, FT=12 μm Linearity on Silicon @ 800 mJ/cm², Contact Holes, 1:1 Pitch

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 34

80 µm 60 µm 50 µm

Film Thickness: 12 µmOptitrac coat and BakeSB: 110°C/ 180 secSuss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 400 sec continuous spray @ 23 °C

10 µm 20 µm 30 µm

40 µm

AZ 9260 Photoresist, FT=12 μm Linearity on Silicon @ 800 mJ/cm², Contact Holes, 1:1 Pitch

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 35

80 µm 60 µm 50 µm

Film Thickness: 12 µmOptitrac coat and BakeSB: 110°C/ 180 secSuss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 400 sec continuous spray @ 23 °C

10 µm 20 µm 30 µm

40 µm

AZ 9260 Photoresist, FT=12 μm Linearity on Silicon @ 800 mJ/cm², Contact Holes, 1:0.7 Pitch

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 36

AZ 9260 Photoresist Lithographic Evaluation

by Ultratech 1500 Stepper

with AZ 400K 1:4 Developer 24µm FT Process

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 37

AZ

9260 Photoresist

Process Conditions:

Substrate: Bare SiliconCoat: Optitrac Static dispenseTarget FT: 24 µmSoftbake: 1st layer 110°C hotplate/ 80 sec. full contact

2nd layer 115°C hotplate/ 180 sec. full contact Exposure: Ultratech 1500 gh line Stepper FEM: 1900 mJ/cm2 with increments of 75 mJ/cm2

Nominal Focus of -6µm in increments of 2µm in both directionsDevelop: AZ 400K 1:4, continuous spray for 600 sec. @ 27°C

Analysis: Amray SEM

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 38

AZ

9260 Photoresist

Features (1:1)

Film

Thickness(μm)

DTP

10 μm (mJ/cm²)

Exposure Latitude 10 μm

(%)

DOF

10 μm (μm)

Linearity (μm)

Dense Lines

24

1900

22

16

4

Contact Holes

24

1805

30

>8

<10

Summary of Results:

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 39

Optitrac coat and BakeSB: 1st layer 110°C/ 80 sec

2nd layer 115°C/180 sec Ultratech 1500 gh line Stepper AZ 400K 1:4, 600 sec continuous spray @ 27 °C

Exposure Dose (mj/cm²)

Mea

sure

d Li

new

idth

(µm

)AZ

9260 Photoresist, FT=24 μm

Exposure Latitude on Silicon, 10.0 μm L/S

8

8.5

9

9.5

10

10.5

11

11.5

12

1575 1650 1725 1800 1875 1950 2025 2100 2175 2250 2325

1900 mj/cm²22% Exposure Latitude

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 40

1725 mJ/cm² 1800 mJ/cm²

Optitrac coat and BakeSB: 1st layer 110°C/ 80 sec

2nd layer 115°C/180 sec Ultratech 1500 gh line Stepper AZ 400K 1:4, 600 sec continuous spray @ 27 °C

2100 mJ/cm² 2025 mJ/cm²

1875 mJ/cm²

1950 mJ/cm²2175 mJ/cm²

1650 mJ/cm²

AZ

9260 Photoresist, FT=24 μm Exposure Latitude on Silicon, 10.0 μm L/S

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 41

8.75

9.25

9.75

10.25

10.75

11.25

-16.0 -14.0 -12.0 -10.0 -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0

Focus (µm)

Mea

sure

d Li

new

idth

(µm

)AZ 9260 Photoresist, FT=24 μm Depth of Focus @ 1875 mJ/cm², 10.0 µm L/S

Optitrac coat and BakeSB: 1st layer 110°C/ 80 sec

2nd layer 115°C/180 sec Ultratech 1500 gh line Stepper AZ 400K 1:4, 600 sec continuous spray @ 27 °C

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 42

-12.0 µm -10.0 µm -8.0 µm

Optitrac coat and BakeSB: 1st layer 110°C/ 80 sec

2nd layer 115°C/180 sec Ultratech 1500 gh line Stepper AZ 400K 1:4, 600 sec continuous spray @ 27 °C

0.0 µm -2.0 µm -4.0 µm

-6.0 µm

-14.0 µm

2.0 µm

AZ 9260 Photoresist, FT=24 μm Depth of Focus @ 1875 mJ/cm², 10.0 µm L/S

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 43

2.0

4.0

6.0

8.0

10.0

12.0

14.0

16.0

18.0

20.0

22.0

2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 22.0

Nominal Linewidth (µm)

Mea

sure

d Li

new

idth

(µm

)AZ 9260 Photoresist, FT=24 μm

Linearity on Silicon @ 1875 mJ/cm²

Optitrac coat and BakeSB: 1st layer 110°C/ 80 sec

2nd layer 115°C/180 sec Ultratech 1500 gh line Stepper AZ 400K 1:4, 600 sec continuous spray @ 27 °C

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 44

15 µm 12 µm 10.0 µm 9.0 µm

Optitrac coat and BakeSB: 1st layer 110°C/ 80 sec

2nd layer 115°C/180 sec Ultratech 1500 gh line Stepper AZ 400K 1:4, 600 sec continuous spray @ 27 °C

5.0 µm 6.0 µm 7.0 µm

8.0 µm

20 µm

4.0 µm

AZ 9260 Photoresist, FT=24 μm Linearity on Silicon @ 1875 mJ/cm²

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 45

Optitrac coat and BakeSB: 1st layer 110°C/ 80 sec

2nd layer 115°C/180 sec Ultratech 1500 gh line Stepper AZ 400K 1:4, 600 sec continuous spray @ 27 °C

Exposure Dose (mj/cm²)

Mea

sure

d Li

new

idth

(µm

)AZ 9260 Photoresist, FT=24 μm

Exposure Latitude on Silicon,

10.0 µm CH, 1:1 Pitch

8

8.5

9

9.5

10

10.5

11

11.5

12

1500 1575 1650 1725 1800 1875 1950 2025 2100 2175 2250

1805 mj/cm²30% Exposure Latitude

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 46

1650 mJ/cm² 1725 mJ/cm²

Optitrac coat and BakeSB: 1st layer 110°C/ 80 sec

2nd layer 115°C/180 sec Ultratech 1500 gh line Stepper AZ 400K 1:4, 600 sec continuous spray @ 27 °C

2025 mJ/cm² 1950 mJ/cm²

1800 mJ/cm²

1875 mJ/cm²2100 mJ/cm²

1575 mJ/cm²

2175 mJ/cm²

AZ 9260 Photoresist, FT=24 μm Exposure Latitude on Silicon,

10.0 µm CH, 1:1 Pitch

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 47

1650 mJ/cm² 1725 mJ/cm²

Optitrac coat and BakeSB: 1st layer 110°C/ 80 sec

2nd layer 115°C/180 sec Ultratech 1500 gh line Stepper AZ 400K 1:4, 600 sec continuous spray @ 27 °C

2025 mJ/cm² 1950 mJ/cm²

1800 mJ/cm²

1875 mJ/cm²2100 mJ/cm²

1575 mJ/cm²

2175 mJ/cm²

AZ 9260 Photoresist, FT=24 μm Exposure Latitude on Silicon,

10.0 µm CH, 1:0.7 Pitch

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 48

1650 mJ/cm² 1725 mJ/cm²

Optitrac coat and BakeSB: 1st layer 110°C/ 80 sec

2nd layer 115°C/180 sec Ultratech 1500 gh line Stepper AZ 400K 1:4, 600 sec continuous spray @ 27 °C

2025 mJ/cm² 1950 mJ/cm²

1800 mJ/cm²

1875 mJ/cm²2100 mJ/cm²

1575 mJ/cm²

2175 mJ/cm²

AZ 9260 Photoresist, FT=24 μm Exposure Latitude on Silicon,

10.0 µm CH, 1:0.3 Pitch

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 49

8.75

9.25

9.75

10.25

10.75

11.25

-12.0 -10.0 -8.0 -6.0 -4.0 -2.0 0.0

Focus (µm)

Mea

sure

d Li

new

idth

(µm

)AZ 9260 Photoresist, FT=24 μm

Depth of Focus @ 1800 mJ/cm², 10.0 µm CH, 1:1 Pitch

Optitrac coat and BakeSB: 1st layer 110°C/ 80 sec

2nd layer 115°C/180 sec Ultratech 1500 gh line Stepper AZ 400K 1:4, 600 sec continuous spray @ 27 °C

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 50

-8.0 µm -2.0 µm-4.0 µm-6.0 µm-10.0 µm

1:1

1:0.7

1:0.3

AZ 9260 Photoresist, FT=24 μm Depth of Focus @ 1800 mJ/cm², 10.0 µm CH, Various Pitch

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 51

5.0

10.0

15.0

20.0

25.0

30.0

35.0

40.0

45.0

50.0

5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0 45.0 50.0

Nominal Linewidth (µm)

Mea

sure

d Li

new

idth

(µm

)AZ 9260 Photoresist, FT=24 μm

Linearity on Silicon @ 1800 mJ/cm²40.0 µm to 10.0 µm Contact Holes, 1:1 Pitch

Optitrac coat and BakeSB: 1st layer 110°C/ 80 sec

2nd layer 115°C/180 sec Ultratech 1500 gh line Stepper AZ 400K 1:4, 600 sec continuous spray @ 27 °C

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 52

30 µm 10 µm20 µm40 µm

1:1

1:0.7

1:0.3

AZ 9260 Photoresist, FT=24 μm Linearity on Silicon @ 1800 mJ/cm²

40.0 µm to 10.0 µm Contact Holes, Various Pitch

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 53

AZ 9260 PhotoresistLithographic Evaluation

by Suss

MA200 Mask Aligner

with AZ 300 MIF Developer24µm FT Process

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 54

AZ 9260 Photoresist

Process Conditions:

Substrate: Bare SiliconCoat: Optitrac Static dispenseTarget FT: 24 µmSoftbake: 1st layer 110°C hotplate/ 80 sec. full contact

2nd layer 115°C hotplate/ 180 sec. full contact Exposure: Suss MA200 CC Mask Aligner with 20 µm proximity gap FEM: 2200 mJ/cm2 with increments of 200 mJ/cm2

Develop: AZ 300 MIF (2.38% TMAH) continuous spray for 720 sec. @ 23°C

Analysis: Amray SEM

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 55

AZ

9260 Photoresist

Features (1:1)

Film

Thickness(μm)

DTP

40 μm (mJ/cm²)

Exposure Latitude 40 μm

(%)

Linearity (μm)

Dense Lines

24

2228

166

10

Contact Holes

24

1674

217

10

Summary of Results:

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 56

32

34

36

38

40

42

44

46

48

900 1200 1500 1800 2100 2400 2700 3000 3300 3600 3900 4200 4500 4800

Film Thickness: 24 µmOptitrac coat and BakeSB: 1st layer 110°C/ 80 sec

2nd layer 115°C/180 sec Suss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 720 sec continuous spray @ 23 °C

Exposure Dose (mj/cm²)

Mea

sure

d Li

new

idth

(µm

)

AZ 9260 Photoresist, FT=24 μm Exposure Latitude on Silicon

, 40μm L/S

2228 mj/cm²166% Exposure Latitude

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 57

1575 mJ/cm² 1785mJ/cm² 1995 mJ/cm²

Film Thickness: 24 µmOptitrac coat and BakeSB: 1st layer 110°C/ 80 sec

2nd layer 115°C/180 sec Suss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 720 sec continuous spray @ 23 °C

3400 mJ/cm² 3000 mJ/cm² 2600 mJ/cm²

2200 mJ/cm²

4000 mJ/cm²

AZ

9260 Photoresist, FT=24 μm Exposure Latitude on Silicon, 40μm L/S

2400 mJ/cm²

1365 mJ/cm²1155 mJ/cm²

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 58

5.0

15.0

25.0

35.0

45.0

55.0

65.0

75.0

85.0

5.0 15.0 25.0 35.0 45.0 55.0 65.0 75.0 85.0

Nominal Linewidth (µm)

Mea

sure

d Li

new

idth

(µm

)AZ 9260 Photoresist, FT=24 μm

Linearity on Silicon @ 2200 mJ/cm²

Film Thickness: 24 µmOptitrac coat and BakeSB: 1st layer 110°C/ 80 sec

2nd layer 115°C/180 sec Suss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 720 sec continuous spray @ 23 °C

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 59

AZ 9260 Photoresist, FT=24 μm Linearity on Silicon

@ 2200 mJ/cm²

80 µm 60 µm 50 µm

Film Thickness: 24 µmOptitrac coat and BakeSB: 1st layer 110°C/ 80 sec

2nd layer 115°C/180 sec Suss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 720 sec continuous spray @ 23 °C

10 µm 20 µm 30 µm

40 µm

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 60

Film Thickness: 24 µmOptitrac coat and BakeSB: 1st layer 110°C/ 80 sec

2nd layer 115°C/180 sec Suss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 720 sec continuous spray @ 23 °C

Exposure Dose (mj/cm²)

Mea

sure

d Li

new

idth

(µm

)

AZ 9260 Photoresist, FT=24 μm Exposure Latitude on Silicon, 40µm Contact Holes,1:1 Pitch

32

34

36

38

40

42

44

46

48

500 800 1100 1400 1700 2000 2300 2600 2900 3200 3500 3800 4100 4400 4700

1674 mj/cm²217% Exposure Latitude

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 61

1365 mJ/cm² 1470 mJ/cm² 1575 mJ/cm²

Film Thickness: 24 µmOptitrac coat and BakeSB: 1st layer 110°C/ 80 sec

2nd layer 115°C/180 sec Suss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 720 sec continuous spray @ 23 °C

3200 mJ/cm² 2600 mJ/cm² 2100 mJ/cm²

1680 mJ/cm²

3800 mJ/cm² 1785 mJ/cm²

1260 mJ/cm²1155 mJ/cm²

AZ 9260 Photoresist, FT=24 μm Exposure Latitude on Silicon, 40µm Contact Holes,1:1 Pitch

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 62

1365 mJ/cm² 1470 mJ/cm² 1575 mJ/cm²

Film Thickness: 24 µmOptitrac coat and BakeSB: 1st layer 110°C/ 80 sec

2nd layer 115°C/180 sec Suss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 720 sec continuous spray @ 23 °C

3200 mJ/cm² 2600 mJ/cm² 2100 mJ/cm²

1680 mJ/cm²

3800 mJ/cm² 1785 mJ/cm²

1260 mJ/cm²1155 mJ/cm²

AZ 9260 Photoresist, FT=24 μm Exposure Latitude on Silicon, 40µm Contact Holes,1:0.7 Pitch

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 63

5.0

15.0

25.0

35.0

45.0

55.0

65.0

75.0

85.0

5.0 15.0 25.0 35.0 45.0 55.0 65.0 75.0 85.0

Nominal Linewidth (µm)

Mea

sure

d Li

new

idth

(µm

)

Film Thickness: 24 µmOptitrac coat and BakeSB: 1st layer 110°C/ 80 sec

2nd layer 115°C/180 sec Suss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 720 sec continuous spray @ 23 °C

AZ 9260 Photoresist, FT=24 μm Linearity on Silicon @ 1680 mJ/cm²,

Contact Holes, 1:1 Pitch

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 64

80 µm 60 µm 50 µm

Film Thickness: 24 µmOptitrac coat and BakeSB: 1st layer 110°C/ 80 sec

2nd layer 115°C/180 sec Suss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 720 sec continuous spray @ 23 °C

10 µm 20 µm 30 µm

40 µm

AZ 9260 Photoresist, FT=24 μm Linearity on Silicon @ 1680 mJ/cm²,

Contact Holes, 1:1 Pitch

AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 65

80 µm 60 µm 50 µm

Film Thickness: 24 µmOptitrac coat and BakeSB: 1st layer 110°C/ 80 sec

2nd layer 115°C/180 sec Suss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 720 sec continuous spray @ 23 °C

10 µm 20 µm 30 µm

40 µm

AZ 9260 Photoresist, FT=24 μmLinearity on Silicon @ 1680 mJ/cm²,

Contact Holes, 1:0.7 Pitch