Axis P1375-E Network Camera - System Plus · 2021. 1. 13. · ©2021 by System Plus Consulting |...
Transcript of Axis P1375-E Network Camera - System Plus · 2021. 1. 13. · ©2021 by System Plus Consulting |...
©2021 by System Plus Consulting | Axis P1375-E Network Camera | Sample 1
22 Bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
Axis P1375-E Network CameraDiscover Axis’s high-end product integrating its latest ARTPEC-7 in-house system-on-chip dedicated to network video and machine learning capabilities.
SP20573 - System report by Benjamin PussatCost Analysis : Benjamin Pussat, Florian Rousseau, Audrey LahrachLaboratory : Youssef El Gmili, Peggy GalloisDecember 2020 – Sample
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Table of Contents
Overview / Introduction 4
o Executive Summary
o Main Chipset
o Supply Chain
o Specifications
o Block Diagram
o Reverse Costing Methodology
Company Profile 13
o Axis Communications
Teardown Analysis 18
o Views and Dimensions of the System
o System Opening
o Electronic Boards
✓ Top Side – High Resolution photos
✓ Top Side – PCB markings
✓ Top Side – Main components markings
✓ Top Side – Main components identification
✓ Top Side – Other components markings
✓ Top Side – Other components identification
✓ Bottom Side – High Resolution photos
✓ Bottom Side – PCB markings
✓ Bottom Side – Main components markings
✓ Bottom Side – Main components identification
✓ Bottom Side – Other components markings
✓ Bottom Side – Other components identification
o Lens Module
Cost Analysis 91
o Accessing the BOM
o PCB Cost
o ICs Cost
o Mechanicals Cost
o BOM Cost – Main Electronic Board
o BOM Cost - Mechanicals
o Material Cost Breakdown by Sub-Assembly
o Material Cost Breakdown by Component Category
o Accessing the Added Value (AV) cost
o Electronic Board Manufacturing Flow
o Details of the Main Electronic Board AV Cost
o Details of the System Assembly AV Cost
o Added-Value Cost Breakdown
o Manufacturing Cost Breakdown
Estimated Manufacturer Price Analysis 130
o Estimation of the Manufacturer Price
Feedbacks 121
System Plus Consulting Services 135
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O V E R V I E WMETHODOLOGY
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Overview / Introductiono Executive Summaryo Block Diagramo Reverse Costing
Methodologyo Glossary
Company Profile & Supply Chain
Teardown Analysis
Cost Analysis
Manufacturer Price Analysis
Related Reports
About System Plus
Executive Summary
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the P1375-E V1 NetworkCamera supplied by Axis (website).
For the calculations, for each reference, we estimate the following parameters :
Manufacturing quantity : 100,000 units
Manufacturing years: 2020
Manufacturing country : Thailand
Manufacturer Reference Description
AXIS ARTPEC-7 IC, SoC for Professional HD IP Camera, FCBGA633
SONY IMX327LQRx IC, CMOS Solid-State Image Sensor for Color Cameras, BGA110
MICRON MT53E128M32D2DS-053 IT:A IC, DRAM LPDDR4 4Gb (128Mbx32), WFBGA200 (Qty : 2)
TOSHIBA TH58NVG2S3HBAI4 IC, Flash Memory 4Gb (512Mb x 8) 25ns Parallel, BGA63
BROADCOM B50212EB1IMLG IC, 10/100/1000BASE-T Gigabit Ethernet Transceiver, QFN48
ANALOG DEVICES ADAU1361BCPZ-RL IC, 96kHz 24-Bit Audio Codec with Integrated PLL, VFQFN32
ON SEMICONDUCTOR LC89091JA-AH IC, Digital Audio Interface Receiver, SSOP16
Main Chipset
The main chipset summarizes the main integrated circuit functions found in the system.
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Overview / Introductiono Executive Summaryo Block Diagramo Reverse Costing
Methodologyo Glossary
Company Profile & Supply Chain
Teardown Analysis
Cost Analysis
Manufacturer Price Analysis
Related Reports
About System Plus
System Specifications
Source : Axis.com
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Overview / Introductiono Executive Summaryo Block Diagramo Reverse Costing
Methodologyo Glossary
Company Profile & Supply Chain
Teardown Analysis
Cost Analysis
Manufacturer Price Analysis
Related Reports
About System Plus
System Specifications
Source : Axis.com
©2021 by System Plus Consulting | Axis P1375-E Network Camera | Sample 7
Overview / Introductiono Executive Summaryo Block Diagramo Reverse Costing
Methodologyo Glossary
Company Profile & Supply Chain
Teardown Analysis
Cost Analysis
Manufacturer Price Analysis
Related Reports
About System Plus
System Specifications
Source : Axis.com
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Overview / Introductiono Executive Summaryo Block Diagramo Reverse Costing
Methodologyo Glossary
Company Profile & Supply Chain
Teardown Analysis
Cost Analysis
Manufacturer Price Analysis
Related Reports
About System Plus
Block Diagram – Main Board (Board 1)The block diagram of the Network Camera is estimated in the following schematics:
P-Iris/Focus CTRL
* : ARTPEC-7 Key Specifications are assumptions
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Overview / Introductiono Executive Summaryo Block Diagramo Reverse Costing
Methodologyo Glossary
Company Profile & Supply Chain
Teardown Analysis
Cost Analysis
Manufacturer Price Analysis
Related Reports
About System Plus
The reverse costing analysis is conducted in several phases:
Reverse Costing Methodology
• The initialization of the analysis
Pictures of the elements to be studied.
Identification of the components.
• Description of the material in the “SYScost+” software
Creation of an “estimation project” of the studied board with SYScost+ software.
Construction of the Bill of Material (BOM).
• Assessing the material
Searching for the price of each reference among distributors and manufacturers.
Assessing the cost of the PCB and of the unaccounted references (unknown by distributors)
The BOM is valued with SYScost+ : price simulation according to the requested quantities.
• Assessing the assembling and test phases
Assembly and test lines are modelized with the SYScost+ software.
The assembly and tests costs are estimated.
• Manufacturing cost & manufacturer price
Estimation of the manufacturing cost & manufacturer price.
• Report
A report is edited.
SYS.cost+©, is a software tool developed by SYSTEM PLUS CONSULTING to calculate the cost of electronic boards. More information on the software can be found at www.systemplus.fr.
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Overview / Introductiono Executive Summaryo Block Diagramo Reverse Costing
Methodologyo Glossary
Company Profile & Supply Chain
Teardown Analysis
Cost Analysis
Manufacturer Price Analysis
Related Reports
About System Plus
Glossary
Acronym Definition
Al Aluminum
FPGA Field-Programmable Gate Array
ASIC Application Specific Integrated Circuit
IC Integrated Circuit
CMOS Complementary Metal–Oxide–Semiconductor
EDX Energy Dispersive X-ray spectroscopy
G&A General & Administrative
R&D Research & Development
BGA Ball Grid Array
LGA Land Grid Array
Ge Germanium
MEMS MicroElectroMechanical Systems
OEM Original Equipment Manufacturer
PCB Printed Circuit Board
ENIG Electroless Nickel Immersion Gold
HASL LF Hot Air Solder Leveling Lead-Free
Se Selenium
Si Silicon
As Arsenic
IR Infrared
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COMPANYP R O F I L E
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Overview / Introduction
Company Profile & Supply Chain
Teardown Analysis
Cost Analysis
Manufacturer Price Analysis
Related Reports
About System Plus
COMPANY PROFILE – AXIS COMMUNICATIONS
• 2019 Axis Financial Highlights (source):
o Sales revenues : 1 298 649 000 USD
o Gross margin : 630 201 000 USD (48.53%)
o Operating Profit : 176 836 000 USD (13.62%)
1 SEK = 0.11 USD
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Overview / Introduction
Company Profile & Supply Chain
Teardown Analysis
Cost Analysis
Manufacturer Price Analysis
Related Reports
About System Plus
COMPANY PROFILE – AXIS COMMUNICATIONS
Source : Axis.com
List of articles : https://www.axis.com/newsroom/press-release/axis-releases-new-network-video-chip-to-boost-security-solutionshttps://www.eit.lth.se/fileadmin/eit/courses/eitf35/slides/vlsi_lth_speakernotes_2017_for_distribution.pdf
Source : eit.lth.se
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Overview / Introduction
Company Profile & Supply Chain
Teardown Analysis
Cost Analysis
Manufacturer Price Analysis
Related Reports
About System Plus
COMPANY PROFILE – AXIS COMMUNICATIONS
Source : Axis.com
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Overview / Introduction
Company Profile & Supply Chain
Teardown Analysis
Cost Analysis
Manufacturer Price Analysis
Related Reports
About System Plus
Electronic components (ASIC/ASSP)
Supplier : AXISFoundry : TSMC (Taiwan)
PCBs
Manufacturing Country : ChinaPCBs manufacturer(s) : SUNTAK CCTC
Mechanicals (Plastics/Metal)
Manuf. country : ThailandMechanicals manufacturer: N/A
PCB assembly & tests
Assembly country : ThailandProduct assembler : N/A
Final product assembly
Assembly country : ThailandProduct assembler : N/A
Final product functional test
Assembly country : ThailandProduct tester : N/A
- In order to deliver a manufacturing price, we propose a simplified supply chain as below. For each section, assumptions about manufacturer or manufacturing country can be made if no information about manufacturing is founded (PCB, mechanicals, etc).
Supply chain
Electronic components (General)
Suppliers : Broadcom / Micron / Nexperia / Analog Devices / Texas Instruments / Hirose / Epson / Etc - Confirmed information (S+C)
- Not confirmed information (S+C)
- No information
COLOR LEGEND :
N/A - Not Applicable
M13VP288IR
Manuf. country : JapanLens Module manufacturer: TAMRON
Sensors (CIS)
Manuf. country : JapanSensor manufacturer: Sony
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TEARDOWNA N A LY S I S
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Overview / Introduction
Company Profile & Supply Chain
Teardown Analysis o Views & Dimensionso System Openingo Electronic Boardo Lenses
Cost Analysis
Manufacturer Price Analysis
Related Reports
About System Plus
Global View
Global views of the Network Camera
Total Weight: 2235 g
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Overview / Introduction
Company Profile & Supply Chain
Teardown Analysis o Views & Dimensionso System Openingo Electronic Boardo Lenses
Cost Analysis
Manufacturer Price Analysis
Related Reports
About System Plus
System Opening – Optical Part Removing
Board Cover130x105x38mm (1.5mm Av. Thick)
PC+ABS, 33.6g
IK10 Tool64x31.4x3mm (3mm Av. Thick)
ABS (estimated), 1.85g
©2021 by System Plus Consulting | Axis P1375-E Network Camera | Sample 19
Overview / Introduction
Company Profile & Supply Chain
Teardown Analysis o Views & Dimensionso System Openingo Electronic Boardo Lenses
Cost Analysis
Manufacturer Price Analysis
Related Reports
About System Plus
Electronic Board 1 – Top Side – Angled View – High Resolution Photo
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Overview / Introduction
Company Profile & Supply Chain
Teardown Analysis o Views & Dimensionso System Openingo Electronic Boardo Lenses
Cost Analysis
Manufacturer Price Analysis
Related Reports
About System Plus
Electronic Board 1 – Top Side – Main Components Identification
©2021 by System Plus Consulting | Axis P1375-E Network Camera | Sample 21
Overview / Introduction
Company Profile & Supply Chain
Teardown Analysis o Views & Dimensionso System Openingo Electronic Boardo Lenses
Cost Analysis
Manufacturer Price Analysis
Related Reports
About System Plus
Electronic Board 1 – Bottom Side – PCB Markings
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Overview / Introduction
Company Profile & Supply Chain
Teardown Analysis o Views & Dimensionso System Openingo Electronic Boardo Lenses
Cost Analysis
Manufacturer Price Analysis
Related Reports
About System Plus
Lens Module 1 - Dimensions
23.3 mm 15.3 mm
Lens material : GlassHousing Material : PC-GF30
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Overview / Introduction
Company Profile & Supply Chain
Teardown Analysis o Views & Dimensionso System Openingo Electronic Boardo Lenses
Cost Analysis
Manufacturer Price Analysis
Related Reports
About System Plus
Lens Module 1 – Cross-Section
xx mm
xx mm
xx mm
xx m
mxx
mm
xx m
m
Lens material : GlassHousing Material : PC-GF30
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C O S TANALYSIS
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Overview / Introduction
Company Profile & Supply Chain
Teardown Analysis
Cost Analysiso Assessing the BOMo PCB Costo IC Costo BOM Cost – Electronicso Material Cost Breakdowno Added-Value Cost
Manufacturer Price Analysis
Related Reports
About System Plus
Assessing the BOM
The material cost corresponds to the purchasing price of the components (either electronic or not), as well asthe mechanical parts, composing the electronic system.
The price search of each reference is realized on the basis of catalogues and web sites of electroniccomponents distributors and manufacturers. It is often necessary to ask for specific quotations for sometargeted references.
Prices found during our researches among distributors and manufacturers are associated to quantities whichmay vary from a few units to several thousands or millions of pieces.
It is therefore mandatory to have reliable simulation rules that can be used for this type of extrapolation. Thesimulation rules used in this study come from previous analyses that have been conducted by System PlusConsulting and take into account parameters such as quantities, different types of distributors andmanufacturers, average profit margin on several types of products. These simulation rules have beenintegrated in the SYScost+ software to conduct the calculations.
The report details BOM cost for 100,000 units.
Note : All the prices of components can be modified using the Excel file associated to this report to see theirinfluences on results.
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Overview / Introduction
Company Profile & Supply Chain
Teardown Analysis
Cost Analysiso Assessing the BOMo PCB Costo IC Costo BOM Cost – Electronicso Material Cost Breakdowno Added-Value Cost
Manufacturer Price Analysis
Related Reports
About System Plus
Copper foils 0.0078$ 14.6%
Prepregs 0.0090$ 16.8%
Cores 0.0340$ 63.6%
Material overheads 0.0027$ 5.0%
Total substrate cost 0.0534$ 22.7%
Lamination 0.0046$ 3.8%
Mechanical drilling 0.0212$ 17.7%
Desmear 0.0010$ 0.8%
V-Scoring 0.0004$ 0.4%
Routing 0.0046$ 3.8%
Imaging 0.0228$ 19.1%
PTH metalization 0.0151$ 12.6%
Soldermask 0.0076$ 6.4%
Finishing 0.0312$ 26.1%
Electrical tests 0.0061$ 5.1%
AVI 0.0022$ 1.8%
Visual inspections 0.0013$ 1.1%
Final Quality Control 0.0011$ 0.9%
Packing 0.0005$ 0.4%
Total Process Costs 0.1196$ 50.9%
IPC Class 3 overcosts -$ #DIV/0!
Non-recurring expenses #DIV/0!
Total Other Costs -$
Quantity factor x 1.18
Total Manufacturing Cost 0.2042$ 87.0%
Warranty -$
Indirect OH 0.0041$ 1.7%
Direct OH -$
SG&A 0.0061$ 2.6%
Profit 0.0204$ 8.7%
Estimated Price 0.2348$ per board
Cost
2020
Cost
Substrate costs
Process costs
Other manufacturing costs
Selling price
2020
Cost
2020
Cost
2020
PCB Cost – Electronic Board 2
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Overview / Introduction
Company Profile & Supply Chain
Teardown Analysis
Cost Analysiso Assessing the BOMo PCB Costo IC Costo BOM Cost – Electronicso Material Cost Breakdowno Added-Value Cost
Manufacturer Price Analysis
Related Reports
About System Plus
Note : a specific and complete analysis of the technology of the dies should confirm these hypothesis but a such analysis is not included in this report.
Die Structure :Technology : CMOS active pixel solid-stateDie dimensions : 8.23mm x 5.33mmDiagonal : 6.46mmPad number : 117Wire bonding number : 116
Pixels Structure :Pixel area : 5.74mm x 3.34mmPixel Pitch : 2.9µmTotal Number : 1979(H)x1115(V) approx. 2.20M pixels
Estimation of the cost of the SONY IMX327LQRx
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Overview / Introduction
Company Profile & Supply Chain
Teardown Analysis
Cost Analysiso Assessing the BOMo PCB Costo IC Costo BOM Cost – Electronicso Material Cost Breakdowno Added-Value Cost
Manufacturer Price Analysis
Related Reports
About System Plus
Note : a specific and complete analysis of the technology of the dies should confirm these hypothesis but a such analysis is not included in this report.
Estimation of the cost of the SONY IMX327LQRx
Cost Breakdown
CIS Die cost $1.45 43.7%
Packaging cost (WB BGA) $0.43 12.9%
Ceramic Cost $0.80 24.1%
Glass substrate $0.15 4.6%
Final test & Calibration cost $0.42 12.7%
Yield losses cost $0.07 2.0%
Component Cost $3.3 100%
Sony Gross Profit $2.72 +45%
Component price $6.03
Final Test Yield 98.00%
Gross Margin 45.0%
2020
Sony
• The component price of the xxxx xxxxxxxxxxx is estimated at $xx.xx for 100K units in 2020.
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Overview / Introduction
Company Profile & Supply Chain
Teardown Analysis
Cost Analysiso Assessing the BOMo PCB Costo IC Costo BOM Cost – Electronicso Material Cost Breakdowno Added-Value Cost
Manufacturer Price Analysis
Related Reports
About System Plus
The circuit includes 1 Silicon die assembled into the package.
Die + parts of the substrate.(X-Ray top view)
Component opening(Top view)
Die + parts of the substrate.(X-Ray side view)
Estimation of the cost of the AXIS ARTPEC-7
©2021 by System Plus Consulting | Axis P1375-E Network Camera | Sample 30
Overview / Introduction
Company Profile & Supply Chain
Teardown Analysis
Cost Analysiso Assessing the BOMo PCB Costo IC Costo BOM Cost – Electronicso Material Cost Breakdowno Added-Value Cost
Manufacturer Price Analysis
Related Reports
About System Plus
Estimation of the Main blocks: Digital, Analog, SRAM, Flash.Estimation of the Technology: CMOS 22nm, 11 Metal layers, 2 Polysilicon layers.Lithography steps : 55Wafer fab unit: TSMC Fab 15 – wafers 300mm, located in Taichung, Taiwan.
Note : a specific and complete analysis of the technology of the dies should confirm these hypothesis but a such analysis is not included in this report.
Die dimensions: 6.05mm x6.05mm = 36.6mm²Pad number : 1507
Estimation of the cost of the AXIS ARTPEC-7
©2021 by System Plus Consulting | Axis P1375-E Network Camera | Sample 31
Overview / Introduction
Company Profile & Supply Chain
Teardown Analysis
Cost Analysiso Assessing the BOMo PCB Costo IC Costo BOM Cost – Electronicso Material Cost Breakdowno Added-Value Cost
Manufacturer Price Analysis
Related Reports
About System Plus
BOM Cost – Electronic Board 1 (1/4)
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Overview / Introduction
Company Profile & Supply Chain
Teardown Analysis
Cost Analysiso Assessing the BOMo PCB Costo IC Costo BOM Cost – Electronicso Material Cost Breakdowno Added-Value Cost
Manufacturer Price Analysis
Related Reports
About System Plus
Material Cost Breakdown by Component Categories (Details)
M à J
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MANUFACTURINGPROCESS FLOW
©2021 by System Plus Consulting | Axis P1375-E Network Camera | Sample 34
Overview / Introduction
Company Profile & Supply Chain
Teardown Analysis
Cost Analysiso Assessing the BOMo PCB Costo IC Costo BOM Cost – Electronicso Material Cost Breakdowno Added-Value Cost
Manufacturer Price Analysis
Related Reports
About System Plus
Assessing the Added-Value (AV) Cost
Assessing hypothesis :
The AV Cost, or Added Value Cost, corresponds to the assembly and test costs of sub-systems as well as electronic cards, with theircomponents, by taking into account :
• The depreciation cost of the machines used in the production line,
• The cost of the operators, technicians and of the production line manager directly linked to the production line of the studiedsystem,
• The cost of consumables, energy expenses, ground occupation and of the machines maintenance.
Note : The added-value cost calculation of oneBoard and the Final are detailed in the next pages. For details about the added- value ofthe other electronic boards, please see the Excel spreadsheet associated to this report.
©2021 by System Plus Consulting | Axis P1375-E Network Camera | Sample 35
Overview / Introduction
Company Profile & Supply Chain
Teardown Analysis
Cost Analysiso Assessing the BOMo PCB Costo IC Costo BOM Cost – Electronicso Material Cost Breakdowno Added-Value Cost
Manufacturer Price Analysis
Related Reports
About System Plus
Step n° Step name Step Code Inline step? Side Auto/Manual Step Time (s) Equipment number Equip. Price (USD) Remark
1 Material preparation MP No - M 30s / reference 1 5,000
2 Storage buffer SB Yes - - 5s / board 1 20,000
3 PCB Cleaning C Yes - A 7s / panel 1 20,000
4 Stencil printing SP Yes 1 A 14.9s / panel 1 75,000
5 Solder paste inspection SPI Yes 1 A 10.25s / panel 1 110,000
6 Pick and place SMT x4 P&P Yes 1 A 45k SMT/hour 4 450,000 x4
7 Automated optical inspection AOI Yes 1 A 12s / panel 1 170,000
8 Reflow RF Yes 1 A 240s Cycle 1 125,000
9 Automated optical inspection AOI Yes 1 A 12s / panel 1 170,000
10 Storage buffer SB Yes - - 5s / board - 20,000
11 Automated X-Ray Inspection AXI No 1 A 29s / panel 1 400,000
12 Storage buffer SB Yes - - 5s / board 1 - Same machine as step n°2
13 PCB Cleaning C Yes - A 7s / panel 1 - Same machine as step n°3
14 Stencil printing SP Yes 2 A 14.9s / panel - - Same machine as step n°4
15 Solder paste inspection SPI Yes 2 A 10.25s / panel 1 - Same machine as step n°5
16 Pick and place SMT x4 P&P Yes 2 A 45k SMThour 4 - Same machines as step n°6
17 Automated optical inspection AOI Yes 2 A 12s / panel - - Same machine as step n°7
18 Reflow RF Yes 2 A 240s Cycle - - Same machine as step n°8
19 Automated optical inspection AOI Yes 2 A 12s / panel - - Same machine as step n°9
20 Storage buffer SB Yes - - 5s / board 1 - Same machine as step n°10
21 Automated X-Ray Inspection AXI No 2 A 14s / panel 1 - Same machine as step n°11
22 In-situ test ICT No 1+2 A 43.46s / panel 1 200,000
23/27 Storage buffer SB Yes - - 5s / board 1 20,000
24/28 Automatic THT Insertion ATI Yes 1+2 A 40s / panel 1 200,000
25/29 Selective Wave Soldering SWS Yes 1+2 A 240s Cycle 1 180,000
26/30 Automated optical inspection AOI Yes 1+2 A 21 / panel 1 170,000
31 Storage buffer SB Yes - - 5s / board 1 20,000
32 Depaneling DP No 1+2 A 20s / panel 1 120,000
33 Functional test FCT No 1+2 A 25s / board 1 300,000
34 Board conditioning BC No - M 5s / board 1 3,000
Panel size : 3 Boards Total equipment price : $ 4,128,000
Details of Electronic Board 1 Added-Value (AV) Cost
Details of the Electronic Board assembly process.
©2021 by System Plus Consulting | Axis P1375-E Network Camera | Sample 36
Overview / Introduction
Company Profile & Supply Chain
Teardown Analysis
Cost Analysiso Assessing the BOMo PCB Costo IC Costo BOM Cost – Electronicso Material Cost Breakdowno Added-Value Cost
Manufacturer Price Analysis
Related Reports
About System Plus
Added-Value Cost Breakdown
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MANUFACTURERP R I C E
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Overview / Introduction
Company Profile & Supply Chain
Teardown Analysis
Cost Analysis
Manufacturer Price Analysiso Manufacturer Price
Related Reports
About System Plus
Estimation of the Manufacturer Price
©2021 by System Plus Consulting | Axis P1375-E Network Camera | Sample 39
Overview / Introduction
Company Profile & Supply Chain
Teardown Analysis
Cost Analysis
Manufacturer Price Analysis
Related Reports
About System Plus
Related Reports
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COMPANYSERVICES
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Overview / Introduction
Company Profile & Supply Chain
Teardown Analysis
Cost Analysis
Manufacturer Price Analysis
Related Reports
About System Pluso Company serviceso Contact
Business Models Fields of Expertise
Custom Analyses(>130 analyses per year)
Reports(>60 reports per year)
Costing Tools
Trainings
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Overview / Introduction
Company Profile & Supply Chain
Teardown Analysis
Cost Analysis
Manufacturer Price Analysis
Related Reports
About System Pluso Company serviceso Contact
Contact
www.systemplus.fr
NANTESHeadquarter
FRANKFURT/MAINEurope Sales Office
LYONYOLE HQ
TOKYOYOLE KK
GREATER CHINAYOLE
PHOENIXYOLE Inc.
KOREAYOLE
Headquarters22 bd Benoni Goullin44200 NantesFRANCE+33 2 40 18 09 [email protected]
Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]
Asia Sales OfficeTakashi ONOZAWATokyoJAPANT : +81 804 371 [email protected]
Mavis WANGTAIWANT :+886 979 336 [email protected]
America Sales OfficeSteve LAFERRIEREPhoenix, AZWESTERN UST : +1 310 600 [email protected]
Chris YOUMANEASTERN US & CANADAT : +1 919 607 9839 [email protected]