Automotive Electronics Workshop -...
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Automotive Electronics Workshop Outcomes From Breakout Groups Grenoble; Sept 2013
Transcript of Automotive Electronics Workshop -...
Automotive Electronics Workshop
Outcomes From
Breakout Groups
Grenoble; Sept 2013
Agenda
• Introductions
• iNEMI Overview
• Automotive Workshop Objectives
• Workshop Opportunities Identified
• Next Steps
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About iNEMI
International Electronics Manufacturing Initiative (iNEMI) is an industry-led
consortium of around 112 global manufacturers, suppliers, industry
associations, government agencies and universities. A Non Profit Fully
Funded by Member Dues; All Funding is Returned to the Members in High
Value Programs and Services; In Operation Since 1994.
Visit us at www.inemi.org
5 Key Deliverables:
• Technology Roadmaps
• Collaborative Deployment
Projects
• Research Priorities Document
• Proactive Forums
• Position Papers
3 Major Focus Areas:
• Miniaturization
• Environment
• Medical Electronics
Mission: Forecast and Accelerate improvements in the Electronics
Manufacturing Industry for a Sustainable Future.
Global Operations
INEMI Headquarter Managing Director Managing Director
Asia Pacific EMEA
Herndon, Virginia, USA Office in Shanghai, China Office in Ireland
Dr. Haley Fu Grace O’Malley
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International Members
Across The Total Supply Chain
Key Observations:
• 80% Growth Overall Since 1/1/2010
• 200% Growth in University/Research Institutes Since 1/1/2010
Total Global Supply Chain Integration
The International Membership Incorporated Location; Number of Members
INEMI Member Business TypeNorth
AmericaAsia
RegionEurope Totals
OEM 14 3 2 19
ODM/EMS (inc. pkg. & test services) 5 5 1 11
Suppliers (materials, software, services) 11 19 11 41
Equipment 9 0 2 11
Universities & Research Institutes 8 3 4 15
Organizations 12 1 2 15
Totals 59 31 22 112
Areas of “Critical Mass”
Laminate/Substrate Suppliers
Samsung Electro Mechanics Doosan
Endicott Interconnect Tech. Multejk
Shengyi Sci. Tech AT&S
Elec & Eltek Nanya
Ibiden ITEQ
NGK/NTK Dyconex
Research Institutions
SUNY Binghamton CALCE
Georgia Tech IMEC
UC Berkeley NIST
Fraunhofer ASU
Griffith U ITRI
Peking U MIT
CEA/Leti Aalto U
RIT Purdue
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Equipment Firms
Micronic/Mydata Universal
Assembleon Teradyne
Hover Davis Nordson
PVI Systems Agilent
Akrometrix Corelis
Speedline Acutronic
OEMs & Semiconductors
Alcatel Lucent MSEI
Microsoft BSCI
Cochlear Intel
Juniper Dell
Lenovo IBM
Med El Blackberry
Delphi HP
Cisco TI
Infineon Emerson
Hillcrest Labs Agilent
Chemicals, Adhesives, Metals
Hitachi Chem Nippon
NAMICS Henkel
Inventec Indium
Heraeus Dow
ODM / EMS Firms
Sanmina SCI Wistron
Flextronics Plexus
Celestica IEC
Valtronic
Packaging Firms
STATS ChipPAC
ASE Group
Amkor
Unique Attributes of iNEMI
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10 year Technology | Business Roadmap
Delivered every two years like clockwork
Unique Gap Analysis
Technical/Business Evolution Details
Proven Collaborative R&D Methodology
Time tested over 19 years
20-25 active collaborative R&D projects
Strong Global Membership
Depth and Breadth of Supply Chain Leaders
Strong set of Universities & Research Institutes
Ability to Execute
Integrated supply chain approach
Solving complex manufacturing issues
Drive widespread adoption and impact
iNEMI Reputation
Track record of sustainability leadership
In demand for knowledge/science input
Results oriented workshops
iNEMI Methodology
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Technology Roadmap Process
ID key market trends
Technology evolution & disruptive technologies
Looking 10 years into the future
Critical Analysis of Roadmap
Extract key gaps and challenges
Further Refine Opportunities
Use technology working groups
Use organized workshops
To ID collaborative projects where the supply
chain is ready to engage
Organize & Direct Projects
Teams formed to clearly identify scope and
deliverables
Manage collaborative R&D process
Typically 25 Active iNEMI projects running in
parallel
Why Organizations Participate
Collaborate & Leverage Precious R&D Resources
Engage with key supplier, customer, and competitor experts
Using a proven methodology and expert project managers
Business Opportunity
Develop relationships with supplier and customer experts
• Leading to more business success down the road
Better anticipation of technology trends and inflexion points
Networking in the Industry
Learning from knowledge experts within the iNEMI membership
Access to In Depth Reports and Studies
Detailed project data and analysis for members only
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Bottom Line
• Collaborative R&D Works
– Rights Projects
– Right Players
– Right Targeted Results
• It will move the industry ahead
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The Automotive Workshop
A Call to Action
Objectives:
Create a working understanding and sharing of the key gaps that
are faced by the Automotive electronics manufacturing industry.
ID those where collaboration would be most beneficial.
Work in sub groups to further define the problems and
opportunities:
Description of current situation.
Clear problem statement.
Desirable solutions/deliverables targeted.
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Breakout Groups Formed
1. Miniaturization and Systems Integration Challenges
for Automotive
2. Materials Focus Including Thermal, EMI, Reliability,
and Environmental Regulations
Key areas of potential collaboration follow.
Note: There is NO priority assigned to the following 7
items.
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Key PCB Miniaturization Challenges
• 1.) Problem Statement: Rapid growth in automotive
electronics under hood is pushing current technology
thermal and density limits. Thus part counts are exploding
and thermal solutions are exotic and expensive
• Desired Solution: Key supply chain players to identify
detailed materials requirements and specs for high
temperature, high frequency and high density PCB
technology at acceptable cost points
• Key Deliverables:
– Requirements clearly agreed upon, solutions identified
– Reliability demonstrated
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Key Systems Integration Issue
• 2.) Problem Statement: With the rapid growth of complex
systems in packages (SIP, 2.5D, etc) in automotive, the
clarity of ownership for total system characterization and
issue ownership is lacking.
• Desired Solution: Create an agreed to methodology that
clarifies optimal model and ownership for doing systems
level definition and characterization on complex new
packages for automotive
• Key Delverables:
– Documented methodology; buy-in from key supply chain
players
– Potential auto industry standard down the road
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Key System Integration Issue
• 3.) Problem Statement: Cost of system level test and diagnostics
for complex (3000 parts) integrated modules is far too high
• Desired Solution: The development of zero DPM escape test
strategies and capabilities for high complexity automotive
modules including:
- Module level DFT requirements
- Physical/electrical access specifications
- Component level BIST
- Test equipment solutions to support
- With Fault Diagnostic Capabilities
• Key Deliverables:
• New test standards
• New test modeling tools
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Miniaturization Challenge
• 4.) Problem Statement: Industry standards such as JEDEC
and others have not kept up with rapid changes and
innovation is packages such as SIP. Result is that industry
must deal with far too many package types thus impacting
cost and time to market.
• Desired Solution: Engage all key supply chain members on
the definition of updated standards that result in optimized
package selections for automotive.
• Key Deliverables:
– Define the priorities with the scope of work on critical
standard updates needed that will thus narrow the list of
vendor specific options
– Organize and update standards as required.
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Materials group
• 5.) Problem statement: Specifications for new materials for
automotive are classically based on bulk properties which
are not useful with the latest required materials.
• Desired Solution: Necessary specifications on key
materials properties, application and system compatibility;
both detailed and comprehensive
• Key Deliverables:
– Select top “X” key materials.
– Develop specs required
– Potential automotive industry standard.
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Materials group
• 6.) Problem statement : The automotive electronics
industry lacks an aligned methodology for qualification of
challenging new materials that respond to market needs
such as high temp; lower cost; longer reliability
• Desired Outcome: Definition of an efficient qualification
method for new materials that provides key performance
attribute data required to meet application specs.
• Desired results:
– Qualification methodology for new materials for automotive.
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Key Materials Challenge
7.) Problem Statement: There are regulatory requirements
being set prior to full application assessment and testing of
new materials that meet automotive challenges in high temp,
long life reliability, cost targets severely limiting innovation
Potential Business Inpact: Reduce the time to market of
critical new materials at more compelling cost points
Desired Outcome: Qualification method for new Materials
Current Situation: Existing iNEMI project on “Develop a
stakeholder aligned methodology for Alternative Materials
Assessment” is available for sign up. Go to www.inemi.org
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Next Steps
• iNEMI to survey participants & critical industry players to
see where interest lies; complete by 11/15
– To participate in project definition
– To be chairs of project definition teams. Remember, the chair
position has MORE influence on definition outcome
• Review survey results and select top collaborative
opportunities to take forward and announce results by 12/1
• Create project formation teams for highest interest areas
within 45-60 days
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Closure
• Excellent opportunities identified
• Please respond to upcoming survey
• Get Involved
Thank You!
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www.inemi.orgEmail contacts:
Bill Bader
Bob Pfahl
Grace O’Malley - Europe
Haley Fu - Asia
