Automatic Die Bonder - AB · PDF fileAutomatic Die Bonder. Bonding System High speed - 320ms...
Transcript of Automatic Die Bonder - AB · PDF fileAutomatic Die Bonder. Bonding System High speed - 320ms...
A New Definition forHigh Speed and Accuracy
AD898Automatic Die Bonder
A New Definition forHigh Speed and Accuracy
Bonding System
◆ High speed - 320ms system cycle time
◆ XYZ bondhead with decoupled YZ motion
◆ Capable of handling die sizesbetween 10 x 10 - 1000 x 1000 mil(0.25 x 0.25 - 25.4 x 25.4 mm)
◆ Capable of handling multi-placement/matrix leadframes and leadframeswith downset
Wafer Handling System◆ Automatic wafer handling system with
wafer cassette elevator for up to 8"(200 mm) wafer
◆ Motorized wafer expander withprogrammable expansion
◆ Ejector system with programmableejector height
Workholder System◆ Universal workholder with block
design concept
◆ Linear motor indexer with flexibleindexing clamp
◆ Motorized downset adjustment onworkholder
Epoxy Writer System◆ Real time position alignment
◆ 2-in-1 epoxy writing system withsyringe dispensing capability
◆ Standard epoxy patterns providedwith flexibility to generate customizedpattern
Material Handling System◆ Stack loader with interleaf paper
separator
◆ Leadframe box handling capability
Vision System◆ Multi-grey levels PR system
◆ CCD targeting systems with zoomlenses
◆ Automatic bad unit, pre-bond & post-bond inspection
◆ Advanced defect detection at waferstage
Control System◆ PC based control system
◆ Interactive menu driven control anddata logging capability
◆ Process recipe storage on hard diskand/or floppy disk
◆ SECS I & II Communication
◆ Bar code reader for wafer mapping
Options◆ Small die kit (10 x 10 mil - 200 x 200 mil)
◆ Stacked die kit including heaterassembly
◆ BGA handling kit
◆ Boat handling kit (for SBGA)
◆ Waffle pack handling kit
◆ Rotary collet bond arm
◆ Wafer mapping protocol
◆ Strip marker with characters
◆ Air ionizer system
◆ Intelligent epoxy dispensing controller
◆ Multiple die attach process for MCMusing cascade linkage concept
◆ In-line capability
◆ Multiple magazine input system
AD898 Features
Advanced Wafer Inspection
Standard 2 in 1 Epoxy Writer
Wafer Handling System
Bond Arm
Bonding SystemBonding System
Bad UnitRejection
EpoxyAlignment
Stacked DieAlignment
Advanced Wafer Inspection◆ Detect all possible defects/features at wafer stage
Standard 2 in 1 Epoxy Writer◆ Real time PRS
◆ Dispensing area
• Maximum 3" for Y
Wafer Handling System◆ Programmable wafer expander
◆ 5 minutes conversion
◆ Optional wafer ring and waffle pack holders
Bond Arm◆ Decoupled YZ axis
◆ Large vertical clearance for premoldedpackage
Y motor
Z motor
Light weightbond arm
Wafer Expanders
Edge Die Scratched Die
Broken DieRotated Die Broken DieRotated Die Die withWashed Ink
Edge Die Scratched Die
Die withWashed Ink
Device withMinimal Pattern
Device withMinimal Pattern
Waffle PackHolder
For 6" and 8"Film Frame
For 6" ODWafer Ring
Configuration forSubstrate Sensitive to Scratche.g. FlexBGA, Pre-molded LF
Configuration forAdhesive Tape Bonding e.g.
Modular Track Design
Workholder System wWorkholder System w
Configuration forSubstrate Sensitive to Scratche.g. FlexBGA, Pre-molded LF
Configuration forAdhesive Tape Bonding e.g.
Modular Track Design
◆ Block by block conversion concept for universalconfigurations
• anvil blocks
• window clamps
• press rollers
• heater blocks
Press Rollers
Stacked CSPFlexBGA Leadframe Premolded Leadframe
Motorized TopClamp
Workholderwithout CentralSupportingBlocks
PremoldedLeadframe
Tape
Rear Track
Front Track
Stacked CSPConfiguration forSingulated Unit e.g. CLCC
Flexible Anvil Block Assembly
with Built-in Flexibilitywith Built-in Flexibility
Stacked CSPConfiguration forSingulated Unit e.g. CLCC
Flexible Anvil Block Assembly
◆ Optional pre-installed heater plate assembly
• Good heat distribution control
• Anvil block conversion only
• Quick plug-in design
Anvil Blockfor ElevatedTemperature
Bonding
NormalSubstrate
Anvil Block
Heater plateassembly fixedon track
Carrier for CLCCCLCC Device
Motorized Up/DownAnvil Block
Workholderwithout CentralSupportingBlocks
MotorizedTop Clamp
Anvil Blockwith HeatingPlate
Bonded Sample
Requirement :High UPH
Die HandlingRequirements
Thick
ThinLong
SmallLarge
Die Handling Capabilities
Flexible Package ApplicationsRequirement :Control of die tilt
Requirement :Control of placementaccuracy
Requirement :Control of epoxybleeding
Die Handling Capabilities
Flexible Package ApplicationsRequirement :Control of die tilt
Requirement :Control of placementaccuracy
Requirement :Control of epoxybleeding
358 mil x 21 mil (1:17)
Die thickness:44 mil
Die thickness: 3 mil
800 mil x 800 mil 10 mil x 10 mil
Die HandlingRequirements
Thick
ThinLong
SmallLarge
Requirement :High UPH
Manufacturing AutomationManufacturing Automation
Wafer Map Strip Map
Post Bond Inspectionwith Real Time Data One Pass Multi-die
Application
TCP / IP and / or RS232
CELL CONTROL MODULES* Connection Management* Job (or Lot) Management* Auto WIP Tracking* Strip Map Management* Equipment Management* Statistical Data Collection* Recipe & Wafer Management* Alarm Management
Cell ControllerCell Controller
GUI Design
Database
Equipment Drivers
TCP / IP
○ ○ ○ ○ ○ ○ ○ ○ ○ ○
MESMES
Customer CIM System
For further information, please contact our regional offices
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CC2
* Technical details are subject to change without prior notice
Die size 10 x 10 mil - 1000 x 1000 mil(0.25 x 0.25 mm - 25.4 x 25.4 mm)
Package handled Leadframe, BGA
Ejector height 0" - 0.2" (0 - 5 mm) linearprogrammable
Leadframe sizeLength 6.0" - 11.4" (150 - 290 mm)Width 0.6" - 3.15" (15 - 80 mm)
3" (76.2 mm) Y-axis bond areaThickness 4 - 79 mil (0.1 - 2 mm)
> 0.75mm : require conversionMagazine size
Length 6.0" - 11.4" (150 - 290 mm)Width 0.6" - 3.35" (15 - 85 mm)Height 2.7" - 6.0" (70 - 153 mm)
Speed
Cycle Time 320ms
Wafer Stage
Wafer size Max. 8" (200 mm)XY table travel 9.5" x 9.5" (237.5 x 237.5 mm)Conversion 5 mins (Device only)Conversion 15 mins (Full conversion)
Epoxy Writer
XY travel 2" x 3" (50.8 x 76.2 mm)Resolution
XY 0.02 mil (0.5 µm)Z 0.15 mil (3.81 µm)
SpecificationsBondhead
Bond force 30 - 2000 g
Pattern Recognition System
PRS model Multi-grey levels PRSCamera resolution 512 pixels x 512 pixelsGrey scale 256 grey levelsPosition accuracy ± 1/4 pixelAngle accuracy ± 0.1˚
System Accuracy
XY placement ± 1 mil (± 25.4 µm) @ 3σθ rotation ± 0.5˚ @ 3σ
Facilities Required
Voltage 110/220 VAC (pre-set at factory)Frequency 50/60 Hz (pre-set at factory)Compressed air 87 PSI
Power consumption Approx. 1800 W
Dimensions & Weight
L x W x Hw/o input mag. 50.0" x 43.3" x 68.9"
(1270 x 1100 x 1750 mm)w/ input mag. 58.7" x 43.3" x 68.9"
(1490 x 1100 x 1750 mm)
Net weight 2772 lb (1260 kg)
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